TC75S57FE(TPL3) [TOSHIBA]
IC,VOLT COMPARATOR,SINGLE,CMOS,FP,5PIN,PLASTIC;
| 型号： | TC75S57FE(TPL3) |
| 厂家： | 
TOSHIBA |
| 描述： | IC,VOLT COMPARATOR,SINGLE,CMOS,FP,5PIN,PLASTIC 放大器 光电二极管 |
| 文件： | 总9页 (文件大小：186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC75S57F/FU/FE
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TC75S57F,TC75S57FU,TC75S57FE
Single Comparator
The TC75S57F/TC75S57FU/TC75S57FE is a CMOS general-
purpose single comparator. The device can operate off a single
TC75S57F
power supply and draws a lower supply current than a
conventional bipolar general-purpose comparator. This device’s
push-pull output stage can be directly connected to TTL or CMOS
logic ICs, among others.
Features
•
•
•
•
•
•
Low-current power supply
: I
= 100 μA (typ.)
DD
Single power supply operation
TC75S57FU
Wide common mode input voltage range : V ~V
− 0.9 V
SS DD
Push-pull output circuit
Low input bias current
Small package
TC75S57FE
Weight
SSOP5-P-0.95 : 0.014 g (typ.)
SSOP5-P-0.65A : 0.006 g (typ.)
SON5-P-0.50
: 0.003 g (typ.)
Marking (top view)
Pin Connection (top view)
V
OUT
4
DD
5
5
4
T D
1
2
3
IN (−)
IN (+)
V
SS
1
2
3
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TC75S57F/FU/FE
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Supply voltage
Symbol
Rating
Unit
V
, V
DD SS
±3.5 or 7
±7
V
V
Differential input voltage
Input voltage
DV
IN
V
V
~V
SS DD
V
IN
Output Current
I
±35
200
100
mA
OUT
TC75S57F/FU
TC75S57FE
Power dissipation
P
mW
D
Operating temperature
Storage temperature
T
−40~85
°C
°C
opr
T
−55~125
stg
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: This device’s CMOS structure makes it prone to latch-up. To prevent latch-up, please take the following
precautions:
•
Ensure that no I/O pin’s voltage level ever exceeds V
In addition, check the power-on timing.
or drops below V
.
SS
DD
•
Do not subject the device to excessive noise.
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TC75S57F/FU/FE
Electrical Characteristics (unless otherwise specified, V = 5 V, V = GND, Ta = 25°C)
DD
SS
Test
Circuit
Characteristics
Input offset voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
0
±1
1
±7
⎯
mV
pA
pA
V
IO
Input offset current
Input bias current
Common mode input voltage
Supply current
I
IO
I
1
⎯
I
CMV
⎯
4.1
220
⎯
IN
I
(Note)
⎯
⎯
13
9
110
94
25
21
0.1
4.9
⎯
μA
dB
mA
mA
DD
Voltage gain
G
V
Sink current
I
V
V
= 0.5 V
⎯
sink
OL
OH
Source current
I
= 4.5 V
⎯
source
V
I
I
= 5.0 mA
⎯
4.7
1.8
⎯
⎯
⎯
⎯
⎯
⎯
0.3
⎯
OL
OH
DD
sink
Output voltage
V
V
V
V
= 5.0 mA
source
Operating supply voltage
Propagation delay time (turn on)
⎯
7.0
⎯
t
t
t
t
Over drive = 100 mV
TTL step input
140
90
90
70
11
7
PLH (1)
PLH (2)
PHL (1)
PHL (2)
ns
⎯
Over drive = 100 mV
TTL step input
⎯
Propagation delay time (turn off)
Response time
ns
ns
⎯
t
t
Over drive = 100 mV
Over drive = 100 mV
⎯
TLH
THL
⎯
Electrical Characteristics (unless otherwise specified, V = 3 V, V = GND, Ta = 25°C)
DD
SS
Test
Circuit
Characteristics
Input offset voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
0
±1
1
±7
⎯
mV
pA
pA
V
IO
Input offset current
Input bias current
Common mode input voltage
Supply current
I
IO
I
1
⎯
I
CMV
⎯
2.1
200
⎯
IN
I
(Note)
⎯
6
100
18
15
0.15
2.85
110
90
7
μA
mA
mA
DD
Sink current
I
V
V
= 0.5 V
sink
OL
OH
Source current
I
= 2.5 V
3
⎯
source
V
I
I
= 5.0 mA
⎯
2.65
⎯
⎯
⎯
⎯
0.35
⎯
OL
sink
Output voltage
V
V
= 5.0 mA
OH
source
Propagation delay time (turn on)
Propagation delay time (turn off)
t
t
Over drive = 100 mV
Over drive = 100 mV
Over drive = 100 mV
Over drive = 100 mV
⎯
ns
ns
PLH
PHL
⎯
t
t
⎯
TLH
THL
Response time
ns
8
⎯
Note: This device’s current consumption increases as its operating frequency increases. Note that the power
dissipation should not exceed the allowable power dissipation.
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TC75S57F/FU/FE
I
– f
DD
10000
V
V
= 3 V
DD
SS
= GND
Ta = 25°C
1000
100
10
0.01
1
10
100
1000
10000
0.1
Frequency
f
(kHz)
I
– f
DD
10000
V
V
= 5 V
DD
SS
= GND
Ta = 25°C
1000
100
10
0.01
1
10
100
1000
10000
0.1
Frequency
f
(kHz)
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TC75S57F/FU/FE
V
– I
OL
sink
V
– I
OL
sink
3.0
2.5
5.0
4.5
4.0
V
V
= 3 V
V
V
= 5 V
DD
SS
DD
SS
= GND
= GND
Ta = 25°C
Ta = 25°C
3.5
2.0
1.5
1.0
0.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Sink current
I
(mA)
Sink current
I
(mA)
sink
sink
V
– I
source
OH
V
– I
source
OH
5.0
4.5
4.0
3.0
2.5
3.5
2.0
1.5
1.0
0.5
3.0
2.5
2.0
1.5
1.0
V
V
= 3 V
DD
SS
V
= 5 V
DD
SS
= GND
V
= GND
Ta = 25°C
0.5
0.0
Ta = 25°C
0.0
0
0
5
10
15
20
25
30
35
40
5
10
15
20
25
30
35
40
Source current
I
(mA)
Source current
I
(mA)
source
source
P
– Ta
D
300
200
100
0
This data was obtained from an unmounted
standalone IC. If the IC is mounted on a
PCB, its power dissipation will be greater.
Note that, depending on the PCB’s thermal
characteristics, the curves may differ
substantially from those shown.
−40
0
40
80
120
Ambient temperature Ta (°C)
5
2007-11-01
TC75S57F/FU/FE
Package Dimensions
Weight: 0.014 g (typ.)
6
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TC75S57F/FU/FE
Package Dimensions
Weight: 0.006 g (typ.)
7
2007-11-01
TC75S57F/FU/FE
Package Dimensions
Weight: 0.003 g (typ.)
8
2007-11-01
TC75S57F/FU/FE
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
9
2007-11-01
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