TC74HC221AP_07 [TOSHIBA]
Dual Monostable Multivibrator; 双单稳多谐振荡器
| 型号： | TC74HC221AP_07 |
| 厂家： | 
TOSHIBA |
| 描述： | Dual Monostable Multivibrator |
| 文件： | 总13页 (文件大小：479K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC74HC221AP/AF/AFN
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74HC221AP,TC74HC221AF,TC74HC221AFN
Dual Monostable Multivibrator
Note: xxxFN (JEDEC SOP) is not available in
Japan.
The TC74HC221A is a high speed CMOS MONOSTABLE
MULTIVIBRATOR fabricated with silicon gate C2MOS
TC74HC221AP
technology.
It achieves the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
There are two trigger inputs, A input (negative edge), and B
input (positive edge). These inputs are valid for a slow rise/fall
time signal (tr = tf = 1 s) as they are schmitt trigger inputs. This
device may also be triggered by using CLR input (positive
edge).
After triggering, the output stays in a MONOSTABLE state for
a time period determined by the external resistor and capacitor
TC74HC221AF
(Rx, Cx ). A low level at the CLR input breaks this state.
Limits for Cx and Rx are:
External capacitor, Cx: No limit
External resistor, Rx: V
V
= 2.0 V more than 5 kΩ
≥ 3.0 V more than 1 kΩ
CC
CC
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
TC74HC221AFN
Features (Note)
•
•
High speed: t = 25 ns (typ.) at V
= 5 V
CC
pd
Low power dissipation
Standy by State: I
= 4 μA (max) at Ta = 25°C
CC
Active State: I
= 700 μA (max) at Ta = 25°C
CC
•
•
•
•
•
•
High noise immunity: V
= V
= 28% V
(min)
NIH
NIL
CC
Output drive capability: 10 LSTTL loads
Symmetrical output impedance: |I | = I
= 4 mA (min)
OL
OH
Weight
∼
−
Balanced propagation delays: t
t
pHL
pLH
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
Wide operating voltage range: V
(opr) = 2 to 6 V
CC
Pin and function compatible with 74LS221
Note: In the case of using only one circuit, CLR should be
tied to GND, Rx/Cx･Cx･Q･ Q should be tied to OPEN, the other inputs should be tied to V
or GND.
CC
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2007-10-01
TC74HC221AP/AF/AFN
Pin Assignment
IEC Logic Symbol
Block Diagram (Note 1)(Note 2)
Note 1: Cx, Rx, Dx are external
capacitor, resistor, and diode, respectively.
Note 2: External clamping diode, Dx;
The external capacitor is charged to V
level in the wait state, i.e. when no trigger is applied.
CC
If the supply voltage is turned off, Cx is discharges mainly through the internal (parasitic) diode. If Cx is
sufficiently large and V drops rapidly, there will be some possibility of damaging the IC through in rush
CC
current or latch-up. If the capacitance of the supply voltage filter is large enough and V
in rush current is automatically limited and damage to the IC is avoided.
The maximum value of forward current through the parasitic diode is ±20 mA.
drops slowly, the
CC
In the case of a large Cx, the limit of fall time of the supply voltage is determined as follows:
>
t
(V
CC
− 0.7) Cx/20 mA
f
(tf is the time between the supply voltage turn off and the supply voltage reaching 0.4 V .)
CC
In the even a system does not satisfy the above condition, an external clamping diode (Dx) is needed to
protect the IC from rush current.
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2007-10-01
TC74HC221AP/AF/AFN
Truth Table
Inputs
Outputs
Function
A
B
H
L
CLR
H
Q
Q
Output Enable
Inhibit
X
H
L
H
L
L
H
H
X
H
Inhibit
H
Output Enable
Output Enable
Inhibit
L
H
X
X
L
L
H
X: Don’t care
System Diagram
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TC74HC221AP/AF/AFN
Timing Chart
Functional Description
(1) Stand-by state
The external capacitor (Cx) is fully charged to V
in the stand-by state. That means, before
CC
triggering, the Q and Q transistors which are connected to the Rx/Cx node are in the off state. Two
P
N
comparators that relate to the timing of the output pulse, and two reference voltage supplies turn off.
The total supply current is only leakage current.
(2) Trigger operation
Trigger operation is effective in any of the following three cases. First the condition where the A
input is low, and the B input has a rising signal; second, where the B input is high, and the A input
has a falling signal; and third, where the A input is low and the B input is high, and the CLR
input has a rising signal.
After a trigger becomes effective, comparators C1 and C2 start operating, and Q is turned on. The
N
external capacitor discharges through Q . The voltage level at the Rx/Cx node drops. If the Rx/Cx
N
voltage level falls to the internal reference voltage Vref L, the output of C1 becomes low. The flip-flop
is then reset and Q turns off. At that moment C1 stops but C2 continues operating.
N
After Q turns off, the voltage at the Rx/Cx node starts rising at a rate determined by the time
N
constant of external capacitor Cx and resistor Rx.
Upon the triggering, output Q becomes high, following some delay time of the internal F/F and
gates. It stays high even if the voltage of Rx/Cx changes from falling to rising. When Rx/Cx reaches
the internal reference voltage Vref H, the output of C2 becomes low, the output Q goes low and C2
stops its operation. That means, after triggering, when the voltage level of the Rx/Cx node reaches
Vref H, the IC returns to its MONOSTABLE state.
With large values of Cx and Rx, and ignoring the discharge time of the capacitor and internal
delays of the IC, the width of the output pulse, tw (OUT), is as follows:
tw (OUT) = 1.0 Cx Rx
(3) Reset operation
In normal operation, CLR input is held high. If CLR is low, a trigger has no effect because the Q
output is held low and trigger control F/F is reset. Also, Q turns on and Cx is charge rapidly to V
P
.
CC
This means if CLR input is set low, the IC goes into a wait state.
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2007-10-01
TC74HC221AP/AF/AFN
Absolute Maximum Ratings (Note 1)
Characteristics
Supply voltage range
Symbol
Rating
Unit
V
−0.5 to 7
V
V
CC
DC input voltage
V
−0.5 to V
+ 0.5
IN
CC
CC
DC output voltage
Input diode current
Output diode current
DC output current
V
−0.5 to V
+ 0.5
V
OUT
I
±20
mA
mA
mA
mA
mW
°C
IK
I
±20
±25
±50
OK
I
OUT
DC V /ground current
CC
I
CC
Power dissipation
P
500 (DIP) (Note 2)/180 (SOP)
D
Storage temperature
T
stg
−65 to 150
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or
even destruction.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be
applied until 300 mW.
Operating Ranges (Note 1)
Characteristics
Supply voltage
Symbol
Rating
2 to 6
Unit
V
V
V
CC
Input voltage
V
0 to V
0 to V
IN
CC
CC
Output voltage
V
V
OUT
Operating temperature
T
opr
−40 to 85
°C
0 to 1000 (V
= 2.0 V)
CC
CC
CC
Input rise and fall time
( CLR only)
t , t
0 to 500 (V
0 to 400 (V
= 4.5 V)
= 6.0 V)
ns
r
f
External capacitor
External resistor
Cx
Rx
No limitation
(Note 2)
= 2.0 V)
F
>
5 k (Note 5) (V
CC
Ω
>
>
3.0 V)
1 k (Note 5) (V
CC
Note 1: The operating ranges must be maintained to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
Note 2 The maximum allowable values of Cx and Rx are a function of leakage of capacitor Cx, the leakage of
TC74HC221A, and leakage due to board layout and surface resistance.
Susceptibility to externally induced noise signals may occur for Rx > 1 MΩ.
5
2007-10-01
TC74HC221AP/AF/AFN
Electrical Characteristics
DC Characteristics
Ta = 25°C
Ta = −40 to 85°C
Characteristics
Symbol
Test Condition
Unit
V
V
(V)
CC
Min
Typ.
Max
Min
Max
2.0
1.50
3.15
4.20
⎯
⎯
⎯
⎯
⎯
1.50
3.15
4.20
⎯
⎯
⎯
High-level input
voltage
V
IH
⎯
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
⎯
⎯
⎯
⎯
0.50
1.35
1.80
⎯
0.50
1.35
1.80
⎯
Low-level input
voltage
V
IL
⎯
⎯
⎯
⎯
V
V
⎯
⎯
⎯
1.9
4.4
5.9
4.18
5.68
⎯
2.0
4.5
6.0
4.31
5.80
0.0
0.0
0.0
0.17
0.18
1.9
4.4
5.9
4.13
5.63
⎯
I
= −20 μA
⎯
⎯
OH
High-level output
voltage
V
IN
= V or
V
OH
⎯
⎯
IH
V
IL
(Q, Q )
I
I
= −4 mA
⎯
⎯
OH
= −5.2 mA
⎯
⎯
OH
0.1
0.1
0.1
0.26
0.26
0.1
0.1
0.1
0.33
0.33
I
= 20 μA
⎯
⎯
OL
Low-level output
voltage
V
IN
V
OL
= V or
⎯
⎯
V
IH
V
IL
(Q, Q )
I
I
= 4 mA
⎯
⎯
OL
= 5.2 mA
⎯
⎯
OL
Input leakage
current
I
I
V
V
V
= V
= V
= V
or GND
or GND
or GND
6.0
6.0
6.0
⎯
⎯
⎯
⎯
⎯
⎯
±0.1
±0.1
4.0
⎯
⎯
⎯
±1.0
±1.0
40.0
μA
μA
μA
IN
IN
IN
IN
CC
Rx/Cx terminal
off-state current
IN
CC
CC
Quiescent supply
current
I
CC
CC
2.0
4.5
6.0
⎯
⎯
⎯
45
400
0.7
200
500
1.0
⎯
⎯
⎯
260
650
1.3
μA
μA
Active-state supply
current
V
IN
= V
or GND
CC
I
Rx/Cx = 0.5 V
CC
(Note)
mA
Note:
Per circuit
Timing Requirements (input: t = t = 6 ns)
r
f
Ta =
−40 to
85°C
Ta = 25°C
Characteristics
Minimum pulse width
Minimum clear width
Symbol
Test Condition
Unit
ns
V
CC
(V)
Typ.
⎯
Limit
75
Limit
95
2.0
t
W (L)
⎯
⎯
4.5
6.0
2.0
4.5
6.0
⎯
15
19
t
W (H)
⎯
13
16
⎯
75
95
t
⎯
15
19
ns
W (L)
⎯
13
16
6
2007-10-01
TC74HC221AP/AF/AFN
AC Characteristics (C = 15 pF, V = 5 V, Ta = 25°C, input: t = t = 6 ns)
L
CC
r
f
Characteristics
Symbol
Test Condition
Min
Typ.
4
Max
8
Unit
ns
t
t
TLH
Output transition time
⎯
⎯
⎯
⎯
⎯
THL
Propagation delay time
( A , B-Q, Q )
t
t
t
t
t
t
pLH
pHL
pLH
pHL
pLH
pHL
⎯
⎯
⎯
25
25
16
36
41
27
ns
ns
ns
Propagation delay time
( CLR TRIGGER-Q, Q )
Propagation delay time
( CLR -Q, Q )
7
2007-10-01
TC74HC221AP/AF/AFN
AC Characteristics (C = 50 pF, input: t = t = 6 ns)
L
r
f
Ta = 25°C
Ta = −40 to 85°C
Characteristics
Symbol
Test Condition
Unit
ns
V
(V)
CC
Min
Typ.
Max
Min
Max
2.0
⎯
⎯
⎯
⎯
⎯
⎯
30
8
75
15
⎯
⎯
⎯
⎯
⎯
⎯
95
19
t
t
TLH
Output transition time
⎯
4.5
6.0
2.0
4.5
6.0
THL
7
13
16
102
30
24
210
42
265
53
Propagation delay
time
t
t
pLH
⎯
⎯
⎯
ns
ns
pHL
( A , B-Q, Q )
36
45
Propagation delay
time
2.0
4.5
6.0
⎯
⎯
⎯
102
30
235
47
⎯
⎯
⎯
295
59
t
t
pLH
( CLR TRIGGER-Q,
Q )
pHL
24
40
50
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
⎯
⎯
67
20
160
32
⎯
⎯
200
40
Propagation delay
time
t
t
pLH
ns
ns
μs
pHL
( CLR -Q, Q )
⎯
16
27
⎯
34
Cx = 28 pF
⎯
700
250
210
110
105
105
1.0
1.0
1.0
2000
400
340
130
115
115
1.2
⎯
2500
500
425
130
115
115
1.2
Rx = 6 kΩ (V
= 2 V)
⎯
⎯
CC
CC
Rx = 2 kΩ (V
= 4.5 V, 6 V)
⎯
⎯
90
95
95
0.9
0.9
0.9
90
95
95
0.9
0.9
0.9
Cx = 0.01 μF
Rx = 10 kΩ
Output pulse width
tw
OUT
Cx = 0.1 μF
Rx = 10 kΩ
1.1
1.1
ms
%
1.1
1.1
Output pulse width
error between circuits
Δtw
⎯
⎯
⎯
±1
⎯
⎯
⎯
OUT
(in same package)
Input capacitance
C
⎯
⎯
⎯
⎯
5
10
⎯
⎯
10
pF
pF
IN
C
PD
Power dissipation
capacitance
174
⎯
⎯
(Note)
Note:
C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load.
Average operating current can be obtained by the equation:
I
(opr) = C ･V ･f + I ’･duty/100 + I /2 (per circuit)
PD CC IN CC CC
CC
(I ’: active supply current)
CC
(duty: %)
8
2007-10-01
TC74HC221AP/AF/AFN
Output Pulse Width Constant K – Supply Voltage (typical)
t
– Cx Characteristics (typ.)
WOUT
9
2007-10-01
TC74HC221AP/AF/AFN
Package Dimensions
Weight: 1.00 g (typ.)
10
2007-10-01
TC74HC221AP/AF/AFN
Package Dimensions
Weight: 0.18 g (typ.)
11
2007-10-01
TC74HC221AP/AF/AFN
Package Dimensions (Note)
Note: This package is not available in Japan.
Weight: 0.13 g (typ.)
12
2007-10-01
TC74HC221AP/AF/AFN
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
13
2007-10-01
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