KSG60ZME512G [TOSHIBA]
CLIENT SSD(Non-SED Model);型号: | KSG60ZME512G |
厂家: | TOSHIBA |
描述: | CLIENT SSD(Non-SED Model) |
文件: | 总21页 (文件大小:1828K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SSD
SG6 SERIES (Non-SED Model)
CLIENT SSD
SG6 Series is a Client SATA SSD lineup using 64-layer, 3-bit-per-cell(TLC) BiCS
FLASHTM
.
The SG6 series SSDs with up to 1024GB capacity, delivers performance of up to
550MB/s sequential read and 535MB/s sequential write. Furthermore, active power
consumption was decreased by up to 40% compared to previous SG5 series,
enabling increased battery life for mobile computing.
Offered in both traditional 2.5-type(7mm height) and compact M.2 2280 form factors,
SG6 series is engineered for mainstream desktop PCs and notebook PCs as well as
consumer upgrades.
Product image may represent a design model
KEY FEATURES
APPLICATIONS
64-layer, 3-bit-per-cell (TLC) BiCS FLASH™
Desktop PCs
Notebook PCs
Capacities up to 1024GB
SATA Revision 3.3, 6.0 Gbit/s interface
2.5-type and M.2 2280 form factor options
SPECIFICATIONS
2.5-type
(7.0 mm height)
M.2 2280-S2
Single-sided
M.2 2280-D2
Double-sided
Standard Models
Model Number
KSG60ZSE256G
KSG60ZSE512G
KSG60ZSE1T02
KSG60ZMV256G
KSG60ZMV512G
KSG60ZM81T02
Memory
TLC (BiCS FLASHTM
)
Interface
SATA Rev. 3.3
6.0 Gbit/s
ACS-4
Maximum Speed
Command
Connector Type
Formatted Capacity1)
Standard SATA
512 GB
M.2 B-M
512 GB
256 GB
1024 GB
256 GB
1024 GB
Sequential
Read
550 MB/s {524 MiB/s}
550 MB/s {524 MiB/s}
Perfor-
mance2)
Sequential
Write
340 MB/s {324
MiB/s}
535 MB/s
{510 MiB/s}
340 MB/s
{324 MiB/s}
535 MB/s
{510 MiB/s}
5.0 V ±5 %
3.3 V ±5 %
Supply Voltage
3.5 W typ.
2.3 W typ.
3.1 W typ.
60 mW typ.
5 mW max.
3.5 W typ.
Active
2.3 W typ.
3.1 W typ.
65 mW typ.
6 mW max.
Power
Comsump-
tion
60 mW typ.
70 mW typ.
55 mW typ.
65 mW typ.
Idle
DevSleep
100.0 mm x
69.85 mm x
7.0 mm
80.0 mm x
22.0 mm x
2.23 mm
80.0 mm x
22.0 mm x
3.58 mm
Size
41 g typ.
42 g typ.
43 g typ.
6.9 g typ.
8.3 g typ.
Weight
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
1 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
2.5-type
(7.0 mm Height)
M.2 2280-S2
Single-sided
M.2 2280-D2
Double-sided
Standard Models
0 to 70 °C
(Case Temperature)
0 to 80 °C
(Components Temperature)
Operating
Tempera-
ture
Non-
operating
-40 to 85 °C
Mean Time to Failure (MTTF): 1,500,000 hours
Product Life: Approximately 5 years
Reliability3)
Strong & highly-efficient ECC named QSBCTM is supported.
Firmware security feature (only digitally signed firmware can be installed) is supported.
UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI
More Features
Compliance
Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as
1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports
storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less
storage capacity. Available storage capacity (including examples of various media files) will vary based on file size,
formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software
applications, or media content. Actual formatted capacity may vary.
2) 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.
3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean
failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the
product may be different from the MTTF.
* Product image may represent a design model.
* Read and write speed may vary depending on the host device, read and write conditions, and file size.
* Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
2 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
and comply with the latest versions of the product specifications.
ORDERING INFORMATION
K
1
XX
2
X
3
X
4
X
5
X
6
X
7
XXXX
8
1. Product Name
2. Prodct Category
K: SSD product
SG: SG Series
3. Development Generation
4. Option Code 1
6: Generation 6
0: Non-SED
5. Option Code 2
Z: No-option
6. Connector Type
S: Standard SATA
M: M.2 B-M
7. Form Factor
E: 2.5-type 7 mm H
V: M.2 2280 Single Sided
8: M.2 2280 Double Sided
256G / 512G /1T02
8. Capacity
256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB
(1 GB = 1,000,000,000 bytes)
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
3 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
PRODUCT LINE UP
Function
Note
Formatted
Capacity
Model Number
Form Factor/Connect Type
KSG60ZSE256G
KSG60ZSE512G
KSG60ZSE1T02
KSG60ZMV256G
KSG60ZMV512G
KSG60ZM81T02
256 GB
512 GB
2.5-type1) Standard SATA
Non-SED
Non-SED
1,024 GB
256 GB
M.2 2280-S22) -B-M
M.2 2280-D23) -B-M
512 GB
1,024 GB
Note: 1) 7mm Height
2) Single Sided
3) Double Sided
CAPACITY
Total Number of User Addressable Sectors in LBA Mode
512 bytes sector
Capacity
256 GB
512 GB
500,118,192
1,000,215,216
2,000,409,264
1,024 GB
Note: 1 GB (Gigabyte) = 1,000,000,000 bytes
PERFORMANCE
KSG60ZSE256G
Standard Models
KSG60ZSE512G
KSG60ZMV512G
KSG60ZSE1T02
KSG60ZM81T02
KSG60ZMV256G
Interface Speed
6.0 Gbit/s max.
550 MB/s
{524 MiB/s}
Sequential Read1)
340 MB/s
Sequential Write1)
535 MB/s
{510 MiB/s}
535 MB/s
{510 MiB/s}
{324 MiB/s}
Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align and queue depth is 32.
(1KiB=1024 bytes.)
Products and specifications discussed herein are for reference purposes
4 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
SUPPLY VOLTAGE
Standard Models
2.5-type
M.2 2280 Module
Allowable voltage
5.0 V ±5 %
3.3 V ±5 %
Allowable noise/ripple
Allowable supply rise time
100 mV p-p or less
2 –100 ms
Note: The drive has over current protection circuit. (Rated current: 3.15A)
POWER CONSUMPTION
2.5-type
Operation
(Ta1)=25°C)
KSG60ZSE256G
2.0 W typ.
KSG60ZSE512G
KSG60ZSE1T02
2.2 W typ.
Read2)
2.1 W typ.
3.1 W typ.
65 mW typ.
65 mW typ.
65 mW typ.
6 mW max.
Write2)
2.3 W typ.
3.5 W typ.
Idle 33)4)
Standby3)4)
Sleep3)
60 mW typ.
60 mW typ.
60 mW typ.
70 mW typ.
70 mW typ.
70 mW typ.
DevSleep
M.2 2280 Module
KSG60ZMV512G
Operation
(Ta 1)=25°C)
Read2)
KSG60ZMV256G
KSG60ZM81T02
2.0 W typ.
2.3 W typ.
55 mW typ.
55 mW typ.
55 mW typ.
2.1 W typ.
3.1 W typ.
60 mW typ.
60 mW typ.
60 mW typ.
5 mW max.
2.2 W typ.
3.5 W typ.
65 mW typ.
65 mW typ.
65 mW typ.
Write2)
Idle 33)4)
Standby3)4)
Sleep3)
DevSleep
Note: 1) Ambient Temperature
2) The values are specified at the condition causing maximum power consumption, i.e., maximum workload, default
maximum parallel number of flash memory operation and no thermal control effect.
3) The values are based on using SATA power management features. The Slumber mode is used for the power
consumption measurements.
4) The drive may internally write to flash memory. Therefore, drive power consumption may temporally change up to
write power.
Products and specifications discussed herein are for reference purposes
5 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
ENVIRONMENTAL CONDITIONS
TEMPERATURE
Range
Condition
2.5-type
Gradient
M.2 2280 Module
0 °C (Tc) – 70 °C (Tc)
(Case Temperature)
0 °C (Tc) – 80 °C (Tc)
(Components Temperature)
Operating1)
30 °C (Ta) / h maximum
Non-operating
-40 °C – 85 °C
-40 °C – 85 °C
30 °C / h maximum
30 °C / h maximum
Under Shipment2)
Note: 1) Ta: Ambient Temperature, Tc: Case or Components Temperature
2) Packaged in Toshiba Memory Corporation’s original shipping package
HUMIDITY
Condition
Operating
Range
8 % – 90 % R.H. (No condensation)
Non-operating
8 % – 95 % R.H. (No condensation)
5 % – 95 % R.H.
Under Shipment1)
32.5 °C (Operating)
40.0 °C (Non-operating / Shipping)
Max. wet bulb
Note: 1) Packaged in Toshiba Memory Corporation’s original shipping package
SHOCK
Condition
Operating
Range
14.709 km/s2 {1,500 G}, 0.5 ms half sine wave
Non-operating
Under Shipment1)
100 cm free drop
Note: 1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packaged in Toshiba Memory Corporation’s original shipping package
VIBRATION
Condition
Operating
Range
196 m/s2 {20 G} Peak, 10 - 2,000 Hz
(20 minutes per axis) x 3 axis
Non-operating
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
6 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
COMPLIANCE
SAFETY / EMI STANDARDS
Title
Description
Region
UL
UL 60950-1
USA1)
(Underwriters Laboratories)
cUL
CSA-C22.2 No.60950-1-07
Canada
(Underwriters Laboratories of Canada)
TÜV
EN 60950-1
EURO
(Technischer Überwachungs Verein)
KC
KN32, KN35
Korea
USA
FCC
FCC part 15 Subpart B
BSMI
CNS13438 (CISPR Pub. 22)
Taiwan
(Bureau of Standards, Metrology and Inspection)
CE
EN 55032, EN 55024
AS/NZS CISPR 32
EURO
Australia, New Zealand
Canada
RCM
ISED
ICES-003
Class B
VCCI
Japan
Note: 1) UL certification is basically on a voluntary basis.
RELIABILITY
Parameter
Mean Time to Failure
Product Life
Value
1,500,000 hours
Approximately 5 years
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
7 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
MECHANICAL SPECIFICATIONS
2.5 TYPE
Model Number
KSG60ZSE256G
KSG60ZSE512G
KSG60ZSE1T02
Weight
Width
Height
Length
41 g typ.
42 g typ.
43 g typ.
69.85 mm
7.0 mm
100.0 mm
Figure 1: Dimensions of KSG60ZSExxxx (2.5-type)
Products and specifications discussed herein are for reference purposes
8 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
DIMENSIONS OF KSG60ZSExxxx
SFF-8200 Rev3.21)
SG6 Series SSD
(Differences only)
SFF-8201 Rev3.3
Dimension
SFF-8223 Rev2.5
Millimeters
7.00
Inches
Millimeters
Inches
A1
A2
0.276
0.008
0.020
2.750
0.010
3.955*
0.138
0.370
-
0.20
0.00
0.000
A3
0.50
A4
69.85
0.25
A5
A62)
100.45*
3.5
100.00 ± 0.41
3.937 ± 0.016
A7
A8
9.40
-
9.40 ± 0.51
0.370 ± 0.020
1.186 ± 0.011
A103)
A12
A23
A26
A28
A29
A32
A38
A41
A502)
30.125 ± 0.28
0.38
3.00
M3
0.015
0.118
N/A
3.00 ± 0.20
0.118 ± 0.007
4.07
61.72
M3
3#
2.5#
0.160
2.430
N/A
3#
2.5#
4.07 + 0.295/-0.305
61.72 ± 0.25
0.060 +0.011/-0.012
2.430 ± 0.010
14.00
0.551
14.00 ± 0.25
90.60 ± 0.30
14.00 ± 0.25
90.60 ± 0.30
0.551 ± 0.010
3.567 ± 0.012
0.551 ± 0.010
3.567 ± 0.012
A512)
A522)
A532)
90.60
14.00
90.60
3.567
0.551
3.567
* = maximum
# = minimum number of threads
Note:1) SFF-8200: Small Form Factor Standard
2) PCA, Connector not included
3) Connector center defined the same as SFF-8223 All
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
9 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
M.2 2280 MODULE
Model Number
Weight
6.9 g typ.
6.9 g typ.
8.3 g typ.
Width
Height
2.23 mm
3.58 mm
Length
KSG60ZMV256G
KSG60ZMV512G
KSG60ZM81T02
22.00 mm
80.00 mm
Unit:mm
Figure 2: Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module)
Products and specifications discussed herein are for reference purposes
10 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Unit:mm
Figure 3: Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)
Products and specifications discussed herein are for reference purposes
11 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
INTERFACE CONNECTOR
2.5 TYPE
Unit:mm
Figure 4: 2.5-type Serial ATA Interface Connector
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
12 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
2.5 TYPE DRIVE CONNECTER PIN ASSIGNMENT1)
Pin
Position
Segment
Name
Description
S1
GND
A+
2nd Mate
S2
Differential Signal Pair A (Device Rx), 3rd Mate
S3
A-
Signal
Segment
S4
GND
B-
2nd Mate
S5
Differential Signal Pair B (Device Tx), 3rd Mate
S6
B+
S7
GND
2nd Mate
Signal segment “L”
Central connector polarizer
Power segment “L”
P1
Retired2)
Retired2)
P2
P3
DEVSLP2) Enter/Exit DevSleep
P4
GND
GND
GND
V5
1st Mate
2nd Mate
2nd Mate
5 V power, pre-charge3), 2nd Mate
5 V power, 3rd Mate
P5
P6
P7
Power
P8
V5
Segment
P9
V5
5 V power, 3rd Mate
P10
P11
P12
P13
P14
P15
GND
DAS/DSS
GND
V12
2nd Mate
Drive Activity Signal / Disable Staggered Spin-up, 3rd Mate
1st Mate
12 V power, pre-charge, 2nd Mate (Unused)
12 V power (Unused), 3rd Mate
12 V power (Unused), 3rd Mate
V12
V12
Power segment key
Note: 1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using with a
backplane connector.
2) Previously, 3.3 V was assigned to pins P1, P2 and P3 by Serial ATA International Organization.
3) Direct connect to non pre-charge pins.
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
13 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
and comply with the latest versions of the product specifications.
M.2 2280 MODULE
Unit:mm
Figure 5: Interface Dimensions of KSG60ZMVxxxx (M.2 2280-S2 Module)
Products and specifications discussed herein are for reference purposes
14 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Unit:mm
Figure 6: Interface Dimensions of KSG60ZM81T02 (M.2 2280-D2 Module)
Products and specifications discussed herein are for reference purposes
15 / 21
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
M.2 2280 MODULE CONNECTOR PIN ASSIGNMENT
Pin
Pin
#
Name
Description
Name
Description
3.3 V Source
#
1
3
5
7
CONFIG_3 Defines module type(GND)
2
4
6
8
+3.3V
+3.3V
GND
GND
NC
3.3 V Source
Reserved
Reserved
Reserved
Reserved
NC
NC
NC
Drive Activity Signal /
Disable Staggered Spin-up
9
Reserved
Reserved
NC
NC
10
DAS/DSS
11
Notch
Notch
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
DEVSLP
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
MFG1
NC
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
CONFIG_0 Defines module type(GND)
NC
Reserved
Reserved
GND
NC
NC
NC
NC
GND
NC
NC
Reserved
Reserved
GND
NC
NC
NC
GND
NC
NC
Reserved
Reserved
GND
NC
NC
DEVSLP signal
GND
NC
NC
NC
NC
NC
NC
NC
NC
B+
Host Receiver Differential
Signal Pair
B-
GND
GND
A-
Host Transmitter
Differential Signal Pair
A+
GND
GND
NC
Reserved
Reserved
GND
NC
Manufacturing pin. Must be a
no-connect on the host board.
GND
MFG2
Notch
Notch
67
69
71
73
Reserved
NC
68
70
72
74
Reserved
+3.3V
NC
CONFIG_1 Defines module type(GND)
3.3 V Source
3.3 V Source
3.3 V Source
GND
GND
GND
GND
+3.3V
+3.3V
75
CONFIG_2 Defines module type(GND)
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
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Client SSD SG6 Series Brochure Rev.1.00
COMMAND TABLE
Op-Code
Command Name
00h
06h
10h
20h
21h
24h
25h
27h
29h
2Fh
30h
31h
34h
35h
37h
39h
3Dh
3Fh
40h
41h
42h
45h
45h
45h
47h
57h
5Bh
5Ch
5Dh
5Eh
5Fh
60h
61h
70h
90h
91h
NOP
DATA SET MANAGEMENT
RECALIBRATE
READ SECTOR(S)
READ SECTOR(S) without retries
READ SECTOR(S) EXT
READ DMA EXT
READ NATIVE MAX ADDRESS EXT
READ MULTIPLE EXT
READ LOG EXT
WRITE SECTOR(S)
WRITE SECTOR(S) without retries
WRITE SECTOR(S) EXT
WRITE DMA EXT
SET MAX ADDRESS EXT
WRITE MULTIPLE EXT
WRITE DMA FUA EXT
WRITE LOG EXT
READ VERIFY SECTOR(S)
READ VERIFY SECTOR(S) without retries
READ VERIFY SECTOR(S) EXT
WRITE UNCORRECTABLE EXT
Create a pseudo-uncorrectable error with logging
Create a flagged error without logging
READ LOG DMA EXT
55h
AAh
WRITE LOG DMA EXT
TRUSTED NON-DATA
TRUSTED RECEIVE
TRUSTED RECEIVE DMA
TRUSTED SEND
TRUSTED SEND DMA
READ FPDMA QUEUED
WRITE FPDMA QUEUED
SEEK
EXECUTE DEVICE DIAGNOSTIC
INITIALIZE DEVICE PARAMETERS
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
17 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Op-Code
Feature Name
92h
DOWNLOAD MICROCODE
92h
92h
92h
92h
03h
07h
0Eb
0Fb
Download with offsets and save microcode for immediate and future use
Download and save microcode for immediate and future use
Download with offsets and save microcode for future use
Activate downloaded microcode
93h
B0h
DOWNLOAD MICROCODE DMA
93h
93h
93h
93h
03h
07h
0Eb
0Fb
Download with offsets and save microcode for immediate and future use
Download and save microcode for immediate and future use
Download with offsets and save microcode for future use
Activate downloaded microcode
SMART
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
D0h
D1h
D2h
D3h
D4h
D5h
D6h
D8h
D9h
DAh
DBh
SMART READ DATA
SMART READ ATTRIBUTE THRESHOLDS
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
SMART SAVE ATTRIBUTE VALUES
SMART EXECUTE OFF-LINE IMMEDIATE
SMART READ LOG
SMART WRITE LOG
SMART ENABLE OPERATIONS
SMART DISABLE OPERATIONS
SMART RETURN STATUS
SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
DEVICE CONFIGURATION OVERLAY
DEVICE CONFIGURATION RESTORE
DEVICE CONFIGURATION FREEZE LOCK
DEVICE CONFIGURATION IDENTIFY
DEVICE CONFIGURATION SET
B1h
B1h
B1h
B1h
B1h
B1h
B1h
C0h
C1h
C2h
C3h
C4h
C5h
DEVICE CONFIGURATION IDENTIFY DMA
DEVICE CONFIGURATION SET DMA
SANITIZE DEVICE
B4h
B4h
B4h
B4h
B4h
00h
11h
12h
20h
SANITIZE STATUS EXT
CRYPTO SCRAMBLE EXT
BLOCK ERASE EXT
SANITIZE FREEZE LOCK EXT
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
18 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Op-Code
Feature Name
C4h
C5h
C6h
C8h
C9h
CAh
CBh
CEh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
EBh
ECh
EFh
READ MULTIPLE
WRITE MULTIPLE
SET MULTIPLE MODE
READ DMA
READ DMA without retries
WRITE DMA
WRITE DMA without retries
WRITE MULTIPLE FUA EXT
STANDBY IMMEDIATE
IDLE IMMEDIATE
STANDBY
IDLE
READ BUFFER
CHECK POWER MODE
SLEEP
FLUSH CACHE
WRITE BUFFER
READ BUFFER DMA
FLUSH CACHE EXT
WRITE BUFFER DMA
IDENTIFY DEVICE
SET FEATURES
EFh
EFh
EFh
EFh
EFh
EFh
EFh
EFh
EFh
EFh
EFh
02h
03h
05h
10h
55h
66h
82h
85h
90h
AAh
CCh
Enable volatile write cache
Set transfer mode
Enable the APM feature set
Enable use of SATA feature set
Disable read look-ahead
Disable reverting to power-on defaults
Disable volatile write cache
Disable the APM feature set
Disable use of SATA feature set
Enable read look-ahead
Enable reverting to power-on defaults
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
19 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Op-Code
Feature Name
SECURITY SET PASSWORD
F1h
F2h
F3h
F4h
F5h
F6h
F8h
F9h
SECURITY UNLOCK
SECURITY ERASE PREPARE
SECURITY ERASE UNIT
SECURITY FREEZE LOCK
SECURITY DISABLE PASSWORD
READ NATIVE MAX ADDRESS
SET MAX ADDRESS
F9h
F9h
F9h
F9h
F9h
F9h
01h
02h
03h
04h
05h
06h
SET MAX SET PASSWORD
SET MAX LOCK
SET MAX UNLOCK
SET MAX FREEZE LOCK
SET MAX SET PASSWORD DMA
SET MAX UNLOCK DMA
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
20 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written
permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including
data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own
applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the
"TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.
Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT
DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN
LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific
applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment
used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR
PRODUCT. For details, please contact your TOSHIBA sales representative.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement
of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property
right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING
WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS
ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION,
INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF
INFORMATION, OR NONINFRINGEMENT.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the
design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass
destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations
including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and
re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Product may include products subject to foreign exchange and foreign trade control laws.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please
use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without
limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
21 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
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