CMS08(TE12R) [TOSHIBA]
DIODE 1 A, 30 V, SILICON, SIGNAL DIODE, M-FLAT-2, Signal Diode;
| 型号： | CMS08(TE12R) |
| 厂家： | 
TOSHIBA |
| 描述： | DIODE 1 A, 30 V, SILICON, SIGNAL DIODE, M-FLAT-2, Signal Diode 光电二极管 |
| 文件： | 总5页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMS08
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS08
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
•
•
•
•
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for compact assembly due to small surface-mount package
= 0.37 V (max)
FM
= 1.0 A
F (AV)
= 30 V
RRM
“M−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
30
Unit
V
Repetitive peak reverse voltage
V
RRM
1.0
(Ta = 51°C)
I
F (AV)
(Note 1)
A
Average forward current
1.0
(Tℓ = 106°C)
I
A
A
F (AV)
Peak one cycle surge forward current
(non-repetitive)
I
25 (50 Hz)
FSM
JEDEC
JEITA
―
―
Junction temperature
Storage temperature
T
j
−40~125
−40~150
°C
°C
T
stg
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
Note 1: Device mounted on a ceramic board
(board size: 50 mm × 50 mm, soldering land: 2 mm × 2 mm)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
V
I
I
I
= 0.1 A
= 0.5 A
= 1.0 A
⎯
⎯
⎯
⎯
⎯
⎯
0.23
0.29
0.32
0.04
0.38
70
⎯
⎯
FM (1)
FM (2)
FM (3)
FM
FM
FM
Peak forward voltage
0.37
⎯
I
V
V
V
= 5 V
RRM
RRM
RRM
RRM
Repetitive peak reverse current
Junction capacitance
mA
pF
I
= 30 V
1.5
⎯
C
= 10 V, f = 1.0 MHz
R
j
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
⎯
⎯
60
Thermal resistance
Thermal resistance
R
°C/W
°C/W
th (j-a)
Device mounted on a glass-epoxy
board
⎯
⎯
⎯
⎯
135
16
(soldering land: 6 mm × 6 mm)
R
⎯
th (j-ℓ)
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CMS08
Marking
Abbreviation Code
S8
Part No.
CMS08
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
Schottky barrier diodes have reverse current characteristic compared to the other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
This device is V -I trade-off type, lower V higher I ; therefore, thermal runaway might occur when
F
RRM
F
RRM
voltage is applied. Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V
RRM
:
Use this rating with reference to the above. V
has a temperature coefficient of 0.1%/°C. Take
RRM
this temperature coefficient into account designing a device at low temperature.
I
:
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
F(AV)
of I
and T be below 100°C. When using this device, take the margin into consideration by
j
F(AV)
using an allowable Tamax-I
curve.
F(AV)
I
:
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
FSM
T :
j
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T of below 100°C.
j
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance
value.
Please refer to the Rectifiers databook for further information.
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CMS08
i
– v
P
– I
F (AV) F (AV)
F
F
10
0.5
0.4
0.3
0.2
0.1
0
Rectangular
waveform
DC
0°
α 360°
α = 180°
125°C
75°C
Conduction angle: α
α = 120°
1
α = 60°
25°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Instantaneous forward voltage
v
F
(V)
Average forward current
I
(A)
F (AV)
Ta max – I
F (AV)
Device mounted on a ceramic board
Tℓ max – I
F (AV)
(board size: 50 mm × 50 mm)
140
120
100
80
140
120
100
80
DC
DC
α = 180°
α = 120°
α = 60°
Rectangular
waveform
Rectangular
waveform
α = 180°
60
60
α = 120°
α = 60°
40
40
0°
α
360°
I
0°
α
360°
I
F (AV)
F (AV)
Conduction angle: α
Conduction angle: α
20
20
V
= 15 V
V
= 15 V
R
R
0
0
0
0
0.2
0.4
0.6
0.8
1.0
I
1.2
1.4
1.6
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Average forward current
(A)
Average forward current
I
(A)
F (AV)
F (AV)
r
– t
th (j-a)
500
100
Device mounted on a glass-epoxy board
Soldering land: 2.1 mm × 1.4 mm
Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm
10
Device mounted on a ceramic board
Soldering land: 2.0 mm × 2.0 mm
1
0.5
0.001
0.01
0.1
1
10
100
1000
Time
t (s)
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CMS08
Surge forward current (non-repetitive)
C – V
j
(typ.)
R
28
24
20
16
12
8
1000
100
10
Ta = 25°C
f = 50 Hz
f = 1 MHz
Ta = 25°C
4
0
1
10
100
Number of cycles
1
10
100
Reverse voltage
V
(V)
R
I
– T
(typ.)
P – V
R (AV)
(typ.)
R
j
R
1000
100
10
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
Pulse test
Rectangular waveform
360°
0°
DC
V
= 30 V
R
300°
V
R
α
Conduction angle: α
T = 125°C
240°
j
V
= 20 V
R
180°
V
= 15 V
R
1
V
= 10 V
120°
R
V
= 5 V
R
60°
V
= 3 V
R
0.1
0.01
0
20
40
60
80
100
120
140
0
10
20
30
Junction temperature
T
j
(°C)
Reverse voltage
V
(V)
R
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CMS08
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
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equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2006-11-13
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