CMH02A [TOSHIBA]
Switching Mode Power Supply Applications; 开关电源的应用
| 型号： | CMH02A |
| 厂家： | 
TOSHIBA |
| 描述： | Switching Mode Power Supply Applications |
| 文件： | 总5页 (文件大小：174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMH02A
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CMH02A
Switching Mode Power Supply Applications
Unit: mm
•
•
•
•
•
Repetitive peak reverse voltage: V
= 400 V
RRM
Average forward current: I
= 3.0 A
F (AV)
Low forward voltage: V =1.8 V (Max.)
FM
Very fast reverse recovery time: trr =35ns (Max.)
Suitable for compact assembly due to small surface-mount package
TM
“M−FLAT ” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
V
400
V
A
RRM
I
3.0 (Note 1)
F (AV)
Peak one cycle surge forward current
(non-repetitive)
I
30 (50 Hz)
A
FSM
Junction temperature
T
−40~150
−40~150
°C
°C
j
Storage temperature range
T
stg
Note 1: Tℓ＝77°C Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness:0.64t
JEDEC
JEITA
―
―
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (pulse test)
Min
Typ.
Max
Unit
V
V
V
V
I
I
I
⎯
⎯
⎯
⎯
⎯
⎯
0.78
1.1
1.4
⎯
⎯
⎯
FM (1)
FM (2)
FM (3)
FM
FM
FM
Peak forward voltage
= 1.0 A (pulse test)
= 3.0 A (pulse test)
1.8
10
Peak repetitive reverse current
Reverse recovery time
I
V
= 400 V (pulse test)
RRM
μA
ns
ns
RRM
t
I
I
= 1 A, di/dt = −30 A/μs
= 1.0 A
⎯
35
rr
F
F
Forward recovery time
t
fr
⎯
100
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
⎯
⎯
⎯
⎯
60
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Thermal resistance
(junction to ambient)
R
th (j-a)
°C/W
135
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
⎯
⎯
⎯
210
16
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
°C/W
1
2006-11-08
CMH02A
Marking
Abbreviation code
H2
Part No.
CMH02A
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when you
design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using
an allowable Tamax-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2
2006-11-08
CMH02A
i
– v
F
P
– I
F
F (AV) F (AV)
100
10
1
4.0
3.6
Rectangular
Waveform
Pulse test
3.2
2.8
2.4
2.0
1.6
1.2
0°
180°
360°
150°C
75°C
T = 25°C
j
0.1
0.8
0.4
0
0.01
0.5
1.0
1.5
2.0
2.5
3.0
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2 3.6
Instantaneous forward voltage
v
F
(V)
Average forward current
I
(A)
F (AV)
Tℓ max – I
Ta max – I
F (AV)
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
Rectangular
Waveform
Rectangular
Waveform
60
60
40
40
0°
0°
180°
360°
0.4
180°
20
20
360°
0
0
0
0
0.8
1.2
1.6
2.0
2.4
2.8
3.2
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Average forward current
I
(A)
F (AV)
Average forward current
I
(A)
F (AV)
r
– t
th (j-a)
1000
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 t
500
300
100
50
30
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
10
5
3
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
1
0.001 0.003
0.01
0.03
0.1
0.3
1
3
10
30
100
300
1000
Time
t (s)
3
2006-11-08
CMH02A
Surge forward current
(non-repetitive)
C – V
j
(Typ.)
R
100
50
40
30
20
10
0
Ta = 25°C
f = 50 Hz
Ta = 25°C
f = 1 MHz
50
30
10
5
3
1
1
10
100
1
10
100
Reverse voltage
V
(V)
Number of cycles
R
4
2006-11-08
CMH02A
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-08
相关型号：
©2020 ICPDF网 联系我们和版权申明