2SK3444 [TOSHIBA]

Switching Regulator, DC-DC Converter Applications Motor Drive Applications; 开关稳压器, DC- DC转换器应用电机驱动应用
2SK3444
型号: 2SK3444
厂家: TOSHIBA    TOSHIBA
描述:

Switching Regulator, DC-DC Converter Applications Motor Drive Applications
开关稳压器, DC- DC转换器应用电机驱动应用

转换器 稳压器 开关 电机 驱动
文件: 总6页 (文件大小:203K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SK3444  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSV)  
2SK3444  
Switching Regulator, DC-DC Converter Applications  
Unit: mm  
Motor Drive Applications  
Low drain-source ON resistance: R  
= 65 m(typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 10 S (typ.)  
fs  
= 100 µA (V  
Low leakage current: I  
= 200 V)  
DS  
DSS  
Enhancement mode: V = 3.0 to 5.0 V (V  
= 10 V, I = 1 mA)  
th DS  
D
Maximum Ratings  
=
(Ta 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
200  
200  
±30  
25  
V
V
V
DSS  
Drain-gate voltage (R  
= 20 k)  
V
DGR  
GS  
Gate-source voltage  
V
GSS  
DC (Note 1)  
Pulse (Note 1)  
I
D
Drain current  
A
I
100  
125  
DP  
Drain power dissipation (Tc = 25°C)  
P
W
D
AS  
AR  
JEDEC  
JEITA  
Single pulse avalanche energy  
E
488  
mJ  
(Note 2)  
SC-97  
2-9F1B  
Avalanche current  
I
25  
12.5  
A
TOSHIBA  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
Weight: 0.74 g (typ.)  
T
ch  
150  
Storage temperature range  
T
stg  
55 to 150  
Thermal Characteristics  
Notice:  
Characteristics  
Symbol  
Max  
1.00  
Unit  
Please use the S1 pin for gate input  
signal return. Make sure that the  
main current flows into the S2 pin.  
Thermal resistance, channel to case  
R
°C/W  
th (ch-c)  
Note 1: Ensure that the channel temperature does not exceed 150°C.  
Note 2: = 50 V, T = 25°C (initial), L = 1.26 mH, I = 25 A, R = 25 Ω  
4
V
DD  
ch  
AR  
G
Note 3: Repetitive rating: pulse width limited by maximum channel temperature  
This transistor is an electrostatic-sensitive device. Please handle with caution.  
1
2
Marking  
3
Part No. (or abbreviation code)  
Lot No.  
K3444  
A line indicates  
lead (Pb)-free package or  
lead (Pb)-free finish.  
1
2004-07-06  
2SK3444  
Electrical Characteristics (Note 4) (Ta = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
= ±25 V, V = 0 V  
Min  
Typ.  
Max  
Unit  
I
V
V
±10  
100  
µA  
µA  
V
GSS  
GS  
DS  
DS  
Drain cut-off current  
I
= 200 V, V  
= 0 V  
DSS  
(BR) DSS  
GS  
Drain-source breakdown voltage  
Gate threshold voltage  
Drain-source ON resistance  
Forward transfer admittance  
Input capacitance  
V
I
= 10 mA, V  
= 0 V  
200  
3.0  
D
GS  
V
V
V
V
= 10 V, I = 1 mA  
5.0  
82  
V
th  
DS  
GS  
DS  
D
R
= 10 V, I = 12.5 A  
65  
mΩ  
S
DS (ON)  
D
|Y |  
fs  
= 10 V, I = 12.5 A  
5
10  
D
C
C
2080  
280  
1060  
iss  
V
= 10 V, V  
= 0 V, f = 1 MHz  
pF  
ns  
Reverse transfer capacitance  
Output capacitance  
DS  
GS  
rss  
C
oss  
Rise time  
t
20  
40  
10  
40  
44  
r
I
= 12.5 A  
D
10 V  
V
GS  
V
OUT  
0 V  
Turn-on time  
Switching time  
t
on  
Fall time  
t
f
V
100 V  
DD  
<
Turn-off time  
t
Duty 1%, t = 10 µs  
off  
=
w
Total gate charge  
(gate-source plus gate-drain)  
Q
g
V
I
160 V, V  
= 25 A  
= 10 V,  
GS  
DD  
nC  
Gate-source charge  
Q
21  
23  
D
gs  
Gate-drain (“miller”) charge  
Q
gd  
Note 4: Connect the S1 pin and S2 pin together, and ground them except during switching time measurement.  
Source-Drain Diode Ratings and Characteristics (Note 5) (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
25  
100  
1
Unit  
A
Continuous drain reverse current  
I
1
DR  
(Note 1, Note 5)  
Pulse drain reverse current  
I
1
A
DRP  
(Note 1, Note 5)  
Continuous drain reverse current  
I
2
A
DR  
(Note 1, Note 5)  
Pulse drain reverse current  
I
2
4
A
DRP  
(Note 1, Note 5)  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
V
I
I
= 25 A, V = 0 V  
GS  
290  
2.2  
1.5  
V
DS2F  
DR1  
t
ns  
µC  
rr  
= 25 A, V  
= 0 V,  
GS  
DR  
DR  
dI /dt = 100 A/µs  
Q
rr  
Note 5: IDR1, IDRP1: Current flowing between the drain and the S2 pin. Ensure that the S1 pin is left open.  
DR2, IDRP2: Current flowing between the drain and the S1 pin. Ensure that the S2 pin is left open.  
I
Unless otherwise specified, connect the S1 and S2 pins together, and ground them.  
2
2004-07-06  
2SK3444  
I
– V  
I – V  
D DS  
D
DS  
50  
40  
30  
20  
10  
0
100  
80  
60  
40  
20  
0
Common source  
Tc = 25°C  
Pulse test  
Common  
source  
15  
10  
9.5  
15  
12  
11  
Tc = 25°C  
Pulse test  
9
8.5  
10  
8
9
8
7.5  
7
V
= 6.5 V  
V
= 7 V  
GS  
GS  
0
2
4
6
8
10  
0
4
8
12  
16  
20  
Drain-source voltage  
V
DS  
(V)  
Drain-source voltage  
V
DS  
(V)  
I
– V  
V – V  
DS GS  
D
GS  
50  
40  
30  
20  
10  
0
4
3
2
1
0
Common source  
Common source  
Tc = 25°C  
V
DS  
= 10 V  
Pulse test  
Pulse test  
Tc = −55°C  
I
D
= 25 A  
100  
12  
6
25  
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
Gate-source voltage  
V
(V)  
Gate-source voltage  
V
(V)  
GS  
GS  
Y – I  
R
– I  
DS (ON)  
fs  
D
D
100  
10  
1
1000  
100  
10  
Common source  
Common source  
Tc = 25°C  
V
DS  
= 10 V  
Pulse test  
Pulse test  
Tc = −55°C  
25  
V
GS  
= 10 V  
100  
15  
1
10  
Drain current  
100  
1
10  
100  
I
D
(A)  
Drain current  
I
D
(A)  
3
2004-07-06  
2SK3444  
R
Tc  
I
– V  
DR DS  
DS (ON)  
160  
120  
80  
40  
0
100  
10  
1
Common source  
Tc = 25°C  
Common source  
= 10 V  
12  
V
GS  
6
Pulse test  
Pulse test  
I
D
= 25 A  
10  
5
3
1
V
GS  
= 0 V  
0.1  
0
80  
40  
0
40  
80  
120  
160  
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
Drain-source voltage (V)  
Case temperature Tc (°C)  
V
DS  
Capacitance – V  
V
Tc  
th  
DS  
10000  
1000  
100  
6
5
4
3
2
1
0
C
iss  
C
oss  
C
rss  
Common source  
= 10 V  
V
DS  
= 1 mA  
Common source  
= 0 V  
I
D
V
GS  
Pulse test  
f = 1 MHz  
Tc = 25°C  
80  
40  
0
40  
80  
120  
160  
10  
0.1  
Case temperature Tc (°C)  
1
10  
100  
Drain-source voltage  
V
DS  
(V)  
P
D
Tc  
Dynamic input/output characteristics  
200  
160  
120  
80  
200  
20  
Common source  
I
D
= 25 A  
V
DS  
Tc = 25°C  
Pulse test  
16  
12  
8
160  
120  
80  
V
= 40 V  
DS  
80  
160  
V
GS  
40  
40  
4
10  
0
0
0
100  
40  
80  
120  
160  
200  
0
20  
40  
60  
Q
80  
Case temperature Tc (°C)  
Total gate charge  
(nC)  
g
4
2004-07-06  
2SK3444  
r
– t  
w
th  
10  
1
Duty = 0.5  
0.2  
0.1  
P
DM  
0.1  
t
0.05  
0.02  
T
Duty = t/T  
0.01  
R
= 1.0°C/W  
th (ch-c)  
Single pulse  
100 µ  
0.01  
10 µ  
1 m  
10 m  
100 m  
1
10  
Pulse width  
t
w
(S)  
Safe operating area  
E – T  
AS ch  
1000  
100  
10  
500  
400  
300  
200  
100  
I
max (pulsed) *  
D
100 µs*  
1 ms*  
I
max (continuous)  
D
DC operation  
Tc = 25°C  
0
25  
50  
75  
100  
125  
(°C)  
150  
1
Channel temperature (initial)  
T
ch  
*
Single nonrepetitive pulse  
Tc = 25°C  
Curves must be derated linearly  
with increase in temperature.  
B
VDSS  
V
DSS  
max  
15 V  
0.1  
1
10  
100  
1000  
I
AR  
15 V  
Drain-source voltage  
V
DS  
(V)  
V
V
DS  
DD  
Test circuit  
Waveform  
1
2
B
R
V
= 25 Ω  
2
VDSS  
G
=
LI ⋅  
Ε
AS  
V
DD  
= 50 V, L = 1.26 mH  
B
VDSS  
DD  
5
2004-07-06  
2SK3444  
RESTRICTIONS ON PRODUCT USE  
030619EAA  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
6
2004-07-06  

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