XDL602B10382-Q [TOREX]
HiSAT-COT ® Control, 1.5A Inductor Built-in Step-Down âmicro DC/DCâ Converters;型号: | XDL602B10382-Q |
厂家: | Torex Semiconductor |
描述: | HiSAT-COT ® Control, 1.5A Inductor Built-in Step-Down âmicro DC/DCâ Converters |
文件: | 总21页 (文件大小:1235K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XDL601/XDL602 Series
ETR44001-002
HiSAT-COT ® Control, 1.5A Inductor Built-in Step-Down “micro DC/DC” Converters
☆AEC-Q100 Grade2
☆Green Operation Compatible
■GENERAL DESCRIPTION
The XDL601/XDL602 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control
IC in one tiny package. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble
due to the circuit wiring.
The XDL601/XDL602 series uses synchronous rectification at an operating frequency of 3.0MHz. The XDL601/XDL602
series uses HiSAT-COT (*) synchronous rectification. HiSAT-COT+PWM control (XDL601) or HiSAT-COT+automatic
PWM/PFM switching control (XDL602) can be selected.
XDL601/XD602 series employ the wettable flank plated packaging. This provides a visual indicator of solderability and lowers
the inspection time.
(*) HiSAT-COT is a proprietary high-speed transient response technology for DC/DC converter which was developed by Torex.
It is Ideal for the LSI's that require high precision and high stability power supply voltage.
■FEATURES
■APPLICATIONS
●Car Navigation System
●Drive Recorder
●Car Audio
●Car-mounted camera
●ETC / Other automotive accessories
Input Voltage
:
:
2.5V ~ 5.5V
0.8V,1.0V,1.1V,1.2V,1.25V,1.3V,1.35V,
1.5V,1.8V,2.5V,3.0V,3.3V
3.0MHz
Output Voltage
Oscillation Frequency
Output Current
Efficiency
:
:
:
:
1.5A
93% (VIN=5.0V,VOUT=3.3V/500mA)
HiSAT-COT
Control Methods
100% Duty Cycle
HiSAT-COT+PWM (XDL601)
HiSAT-COT+PWM/PFM (XDL602)
Thermal Shut Down
Circuit Protection
Functions
:
:
Current Limit Circuit (Drop)
Short Circuit Protection (Latch)
Soft-start Circuit Built-in
UVLO
CL Discharge
Output Capacitor
OperatingAmbient Temperature
Package
:
:
:
:
Low ESR Ceramic Capacitor
-40℃ ~ 105℃
DFN3625-11B (with Wettable Flanks)
EU RoHS Compliant, Pb Free
Environmental Friendly
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XDL601/XDL602 (VOUT=3.3V)
■TYPICALAPPLICATION CIRCUIT
L1
Lx
VIN
CIN
VOUT
CL
VIN
L2
CE
VOUT
PGND
AGND
1/21
XDL601/XDL602 Series
■BLOCK DIAGRAM
1) XDL601/XDL602 Series Type A
Inductor
L1
L2
VOUT
FB
C
R1
R2
High Side
Current Limit
Phase
VIN
Compensation
Error
Comparator
Amp.
S
R
AGND
CE
Synch
Buffer
Drive
Q
Logic
Lx
Vref with
Soft Start
CE Control Logic,
UVLO
Thermal Shutdown
Minimum On
Time
Generator
IN
V
PGND
VOUT
/
PWM PFM
Selector
* The XDL601 offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.
The XDL602 control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM
automatic switching” internally.
Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2) XDL601/XDL602 Series Type B
Inductor
L1
L2
Short
Protection
VOUT
FB
C
R1
R2
High Side
Current Limit
Phase
V
IN
Compensation
Error
Comparator
Amp
.
S
Synch
Buffer
Drive
AGND
CE
Logic
Q
Lx
R
Vref with
Soft Start
CE Control Logic
,
Minimum On
UVLO
Time
V
IN
Thermal Shutdown
Generator
PGND
VOUT
/
PWM PFM
Selector
* The XDL601 offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.
The XDL602 control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM
automatic switching” internally.
Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/21
XDL601/XDL602
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XDL601①②③④⑤⑥-⑦ PWM
XDL602①②③④⑤⑥-⑦ PWM/PFM Automatic switching control
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
①
Type
Refer to Selection Guide
Output Voltage options
e.g.)1.2V → ②=1, ③=2
1.25V → ②=1, ③=C
08,10,11,12,1C
13,1D,15,18
25,30,33(*1)
②③
④
Output Voltage
0.05V Increments:
0.25=C,0.35=D
Oscillation Frequency
Package
3
3.0MHz
(*2)
⑤⑥-⑦
82-Q
DFN3625-11B (2,000pcs/Reel) (*3)
(Order Unit)
(*1) Contact Torex sales representatives for other voltages. Product selections from 0.8V to 3.6V are available.
(*2)
The “-Q” suffix denotes “AEC-Q100” compliant.
(*3) “Halogen and Antimony free” as well as being fully EU RoHS compliant. The products are shipped in a moisture-proof
packing.
●Selection Guide
LATCH or
SHORT
PROTECTION
OUTPUT
VOLTAGE DISCHARGE
CL AUTO-
CHIP
ENABLE
CURRENT SOFT-
THERMAL
TYPE
UVLO
LIMIT
START SHUTDOWN
A
B
Fixed
Fixed
No
No
Yes
Yes
Yes
Yes
Yes
Yes
Fixed
Fixed
Yes
Yes
Yes
Yes
3/21
XDL601/XDL602 Series
■PIN CONFIGURATION
PGND
9
9
8
7
6
5
1
2
3
4
CE
AGND
VOUT
VIN
NC
LX
PGND
PGND
10
L1
L2 11
12
L2
13
L1
DFN3625-11B
(BOTTOM VIEW)
* The dissipation pad, No.9 pin of the DFN3625-11B package, should be soldered in recommended
mount pattern and metal masking so as to enhance mounting strength and heat release.
The mount pattern for the dissipation pad should be connected to the GND pin (No.4, 5 and 7).
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
Power Input
1
VIN
2
NC
No Connection
3
Lx
Switching Output
Power Ground
4
PGND
PGND
VOUT
AGND
CE
5
Power Ground
6
7
Fixed Output Voltage PIN
Analog Ground
Chip Enable
8
9
PGND
L1
Power Ground
10,13
11,12
Inductor Electrodes
Inductor Electrodes
L2
* This 2-pin NC terminal is not connected to an IC chip.
■FUNCTION TABLE
PIN NAME
SIGNAL
STATUS
Stand-by
Active
Low
CE
High
* Please do not leave the CE pin open.
4/21
XDL601/XDL602
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
LX Pin Voltage
VOUT Pin Voltage
CE Pin Voltage
SYMBOL
RATINGS
-0.3 ~ 6.2
UNITS
VIN
VLx
Vout
VCE
V
V
V
V
-0.3 ~ VIN + 0.3 or 6.2(*1)
-0.3 ~ VIN + 0.3 or 4.0 (*2)
-0.3 ~ 6.2
Power Dissipation
(Ta=25℃)
DFN3625-11B
Pd
2100 (JESD51-7 board) (*3)
mW
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40 ~ 105
-55 ~ 125
℃
℃
All voltages are described based on the GND (AGND and PGND) pin.
(*1) The maximum value should be either VIN+0.3V or 6.2V in the lowest voltage
(*2) The maximum value should be either VIN+0.3V or 4.0V in the lowest voltage
(*3) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
5/21
XDL601/XDL602 Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
●XDL601/XDL602
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS CIRCUIT
When connected to external components,
Output Voltage
VOUT
VIN
<E-1>
2.5
<E-2>
<E-3>
V
V
①
①
①
IOUT=30mA
-
-40℃≦Ta
-40℃≦Ta
≦
≦
105
105
℃
℃
Operating Voltage Range
Maximum Output Current
-
-
5.5
-
When connected to external components (*1)
,
IOUTMAX
1500
mA
VIN=<C -1>
VOUT=0.6V,Voltage which Lx pin
holding “L” level (*6)
UVLO Voltage(*2)
VUVLO
-40℃≦Ta
≦
105
℃
1.35
2.00
2.68
V
③
②
-
-
-
-
-
25.0
-
40.0
50.0
825
900
1.0
Quiescent Current
(XDL602)
Iq
VOUT =VOUT(T) × 1.1
μA
-40℃≦Ta
≦
105
℃
400
-
Quiescent Current
(XDL601)
Iq
VOUT =VOUT(T) × 1.1
VCE=0V
μA
μA
ns
②
②
①
-40℃≦Ta
≦
105
℃
Stand-by Current
ISTB
0.0
When connected to external components,
VIN=<C-1>, IOUT=1mA
Minimum ON time
tONmin
<E-5>
<E-6>
<E-7>
Thermal shutdown
Thermal shutdown hysteresis
Lx SW ”H” ON Resistance
Lx SW ”L” ON Resistance (*4)
Lx SW ”H” Leakage Current
Lx SW ”L” Leakage Current
Current Limit (*5)
TTSD
THYS
RLXH
RLXL
ILeakH
IleakL
ILIMH
-
-
150
30
-
℃
℃
Ω
①
①
④
④
⑤
⑤
⑥
-
-
-
VOUT=0.6V, ILX=100mA (*3)
VOUT=VOUT(T) V × 1.1, ILX=100mA (*3)
VIN=5.5V, VCE=0V, VOUT=0V, VLX=0V
VIN=5.5V, VCE=0V, VOUT=0V, VLX=5.5V
VOUT=0.6V, ILx until Lx pin oscillates
-
0.14
0.10
0.0
0.28
0.20
1.0
30.0
4.5
-
-
Ω
μA
μA
A
-
0.0
2.5
3.0
VOUT=0.6V, Applied voltage to VCE
Voltage changes Lx to “H” level (*6)
,
CE ”H” Voltage
CE ”L” Voltage
VCEH
-40℃≦Ta
-40℃≦Ta
≦
≦
105
105
℃
℃
1.4
-
-
5.5
V
V
③
③
VOUT=0.6V, Applied voltage to VCE
Voltage changes Lx to “L” level (*6)
VIN=5.5V, VCE=5.5V, VOUT=0V
VIN=5.5V, VCE=0V, VOUT=0V
,
VCEL
AGND
0.30
CE ”H” Current
CE ”L” Current
ICEH
ICEL
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
VCE=0V
After "H" is fed to CE,
the time by when clocks are generated at Lx pin.
Sweeping VOUT
→ 5.0V, VOUT=VOUT(T)× 0.9
Soft-start Time
tSS
0.10
0.30
0.50
ms
③
Short Protection Threshold
Voltage (Type B)
,
VSHORT
0.17
0.27
0.37
V
③
VOUT voltage which Lx becomes “L” level(*6)
CL Discharge (Type B)
Inductance
RDCHG
L
VCE=0V, VOUT=4.0V
50
-
210
0.5
1.8
300
Ω
μH
A
⑦
-
Test Freq.=1MHz
-
-
Inductor Rated Current
IDC
ΔT=+40deg
-
-
Unless otherwise stated, VIN=5V, VCE=5V, VOUT(T)=Nominal Value,
The ambient temperature range (-40℃≦Ta≦105℃) is design Value.
NOTE:
(*1) When the difference between the input and the output is small, 100% duty might come up and internal control circuits keep P-ch driver
turning on even though the output current is not so large.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*2) Including UVLO detect voltage, hysteresis operating voltage range for UVLO release voltage.
(*3)
R = (VIN - Lx pin measurement voltage) / 100mA, RLXL= Lx pin measurement voltage / 100mA
LXH
(*4) Design value for the XDL602 series.
(*5) Current limit denotes the level of detection at peak of coil current.
(*6) "H"=VIN ~ VIN - 1.2V, "L"=- 0.1V ~ 0.1V
6/21
XDL601/XDL602
Series
■ELECTRICAL CHARACTERISTICS
●SPEC Table (VOUT, tONmin
)
VOUT
(Ta=25℃)
VOUT
tONmin
(Ta=25℃)
NOMINAL
OUTPUT
(-40℃≦Ta≦105℃)
VOLTAGE
<C-1>
<E-1>
MIN.
<E-2>
<E-3>
MAX.
<E-1>
<E-2>
<E-3>
<E-5>
<E-6>
TYP.
<E-7>
MAX.
VIN,
VCE
VOUT(T)
TYP.
MIN.
TYP.
MAX.
MIN.
0.80
1.00
1.10
1.20
1.25
1.30
1.35
1.50
1.80
2.50
3.00
3.30
0.784
0.980
1.078
1.176
1.225
1.274
1.323
1.470
1.764
2.450
2.940
3.234
0.800
1.000
1.100
1.200
1.250
1.300
1.350
1.500
1.800
2.500
3.000
3.300
0.816
1.020
1.122
1.224
1.275
1.326
1.377
1.530
1.836
2.550
3.060
3.366
0.768
0.960
1.056
1.152
1.200
1.248
1.296
1.440
1.728
2.400
2.880
3.168
0.800
1.000
1.100
1.200
1.250
1.300
1.350
1.500
1.800
2.500
3.000
3.300
0.824
1.030
1.133
1.236
1.288
1.339
1.391
1.545
1.854
2.575
3.090
3.399
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
3.00
4.17
5.00
5.50
71
119
123
136
148
154
160
167
185
200
200
200
200
166
160
177
193
201
209
217
241
260
260
260
260
86
95
104
108
112
117
130
140
140
140
140
7/21
XDL601/XDL602 Series
■TEST CIRCUITS
①
< Circuit No.
>
< Circuit No. ②>
Wave Form Measure Point
L
L2
L1
Lx
L2
L1
Lx
VOUT
AGND
CE
VOUT
AGND
CE
A
A
VIN
V
IN
CL
V
RL
1μF
CIN
PGND
PGND
※External Components
L:0.5μH(Selected goods)
C
C
10μF(Ceramic)
:
:
IN
μF(Ceramic)
10
L
< Circuit No. ③>
< Circuit No. ④>
Wave Form Measure Point
L2
L1
L2
L1
VOUT
Lx
VOUT
Lx
VIN
AGND
VIN
AGND
V
1μF
RPulldown
200Ω
I
LX
1μF
PGND
CE
PGND
CE
RLXH=(VIN-VL)/ILX
RLXL=VLX/ILX
< Circuit No. ⑤>
< Circuit No. ⑥>
Wave Form Measure Point
L2
L1
L2
L1
LeakH
I
A
VOUT
Lx
VOUT
Lx
ILeakL
1μF
VIN
AGND
AGND
VIN
ILIMH
1μF
CEH
I
V
A
PGND
CE
CE
PGND
ICEL
< Circuit No. ⑦>
L2
L1
A
VOUT
Lx
VIN
AGND
1μF
CE
PGND
8/21
XDL601/XDL602
Series
■TYPICAL CIRCUIT
L1
Lx
VIN
CIN
VOUT
CL
VIN
L2
CE
VOUT
PGND
AGND
NOTE:
The integrated Inductor can be used only for this DC/DC
converter. Please do not use this inductor for other reasons.
VALUE
PRODUCT NUMBER
CGA4J3X7S1A106K125AE (TDK)
GCM21BR71A106KE22L (murata)
CIN
CL
10V/10μF
9/21
XDL601/XDL602 Series
■OPERATIONAL EXPLANATION
The XDL601/XDL602 series consists of a reference voltage source, error amplifier, comparator, phase compensation,
minimum on time generation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS
switching transistor for the synchronous switch, current limiter circuit, UVLO circuit, thermal shutdown circuit, short protection
circuit, PWM/PFM selection circuit and others. (See the BLOCK DIAGRAM below.)
Inductor
L1
L2
Short
Protection
VOUT
R1
R2
CFB
High Side
Current Limit
VIN
Phase
Compensation
Error
Amp.
Comparator
AGND
CE
S
Synch
Buffer
Drive
Q
Logic
Lx
R
Vref with
Soft Start
CE Control Logic,
UVLO
Thermal Shutdown
Minimum On
Time
Generator
VIN
PGND
VOUT
PWM/PFM
Selector
BLOCK DIAGRAM (XDL601/602 Series)
The method is HiSAT-COT (High Speed circuit Architecture for Transient with Constant On Time) control, which features on time
control method and a fast transient response that also achieves low output voltage ripple.
The on time is determined by the input voltage and output voltage, and turns on the Pch MOS driver Tr. for a fixed time. During
the off time, the voltage that is fed back through R1 and R2 is compared to the reference voltage by the error amp, and the error
amp output is phase compensated and sent to the comparator. The comparator compares this signal to the reference voltage,
and if the signal is lower than the reference voltage, sets the SR latch. On time then resumes. By doing this, PWM operation takes
place with the off time controlled to the optimum duty ratio and the output voltage is stabilized. The phase compensation circuit
optimizes the frequency characteristics of the error amp, and generates a ramp wave similar to the ripple voltage that occurs in
the output to modulate the output signal of the error amp. This enables a stable feedback system to be obtained even when a low
ESR capacitor such as a ceramic capacitor is used, and a fast transient response and stabilization of the output voltage are
achieved.
<Minimum on time generation circuit>
Generates an on time that depends on the input voltage and output voltage. The on time is set as given by the equations below.
tONmin=VOUT/VIN×333 ns
<Switching frequency>
The switching frequency can be obtained from the on time which is determined by the input voltage and output voltage, and the
PWM controlled off time as given by the equation below.
fOSC = (VOUT / VIN) x (1 / tONmin
)
<100% duty cycle mode>
When the load current is heavy and the voltage difference between input voltage and output voltage is small, 100% duty cycle
mode is activated and it keeps the Pch MOS driver Tr. keep on. 100% duty cycle mode attains a high output voltage stability and
a high-speed response under all load conditions, from light to heavy, even in conditions where the dropout voltage is low.
<Error amp>
The error amp monitors the output voltage. The voltage divided by the internal R1 and R2 resistors is a feedback voltage for
Error Amp. and compared to the reference voltage. The output voltage of the error amp becomes higher when the feedback
voltage is higher than the reference voltage. The frequency characteristics of the error amp are optimized internally.
10/21
XDL601/XDL602
Series
■OPERATIONAL EXPLANATION (Continued)
<Reference voltage source, soft start function>
The reference voltage forms a reference that is used to stabilize the output voltage of the IC.
After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval.
This allows the voltage divided by the internal R1 and R2 resistors and the reference voltage to be controlled in a balanced manner,
and the output voltage rises in proportion to the rise in the reference voltage. This operation prevents rush input current and
enables the output voltage to rise smoothly.
If the output voltage does not reach the set output voltage within the soft start time, such as when the load is heavy or a large
capacity output capacitor is connected, the balancing of the voltage divided by the internal resistors R1 and R2 and the reference
voltage is lost, however, the current restriction function activates to prevent an excessive increase of input current, enabling a
smooth rise of the output voltage.
<PWM/PFM selection circuit>
Regarding XDL601 which has PWM control method, it works with a continuous conduction mode, and operates at a stable
switching frequency by means of an on time that is determined by the input voltage and output voltage regardless of the load.
Regarding XDL602 which has PWM/PFM auto switching control method, it works with a discontinuous conduction mode at light
loads, and lowers the switching frequency to reduce switching loss and improve efficiency.
<CE function>
Operation starts when “H” voltage is input into the CE pin. The IC can be put in the shutdown state by inputting “L” voltage into
the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.), and the Pch MOS driver Tr. and Nch MOS switch
Tr. for synchronous rectification turn off. The CE pin is a CMOS input and the sink current is 0μA.
<UVLO Circuit>
When the VIN voltage becomes 2.00V (TYP.) or lower, the P-ch MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.10V (TYP.)
or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output
startup operation. The UVLO circuit does not cause a complete shutdown of the IC,but causes pulse output to be suspended;
therefore, the internal circuitry remains in operation.
<Thermal Shutdown>
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown
circuit starts operating and the P-ch MOS driver and N-ch MOS driver transistor will be turned off when the chip’s temperature
reaches 150℃. When the temperature drops to 120℃ or less after shutting of the current flow, the IC performs the soft-start
function to initiate output startup operation.
<Short-circuit protection function>
The B type short-circuit protection circuit protects the device that is connected to this product and to the input/output in situations
such as when the output is accidentally shorted to GND. The short-circuit protection circuit monitors the output voltage, and when
the output voltage falls below the short-circuit protection threshold voltage, it turns off the Pch MOS driver Tr and latches it. Once
in the latched state, operation is resumed by turning off the IC from the CE pin and then restarting, or by re-input into the VIN pin.
<CL High Speed Discharge>
The B type can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which enables
a whole IC circuit put into OFF state, is inputted via the N-ch MOS switch transistor located between the VOUT pin and the GND
pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application
malfunction.
Output Voltage Dischage characteristics
RDCHG = 210Ω (TYP) CL=10μ F
τ
– t /
V=VOUT(T)×e
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
t=τln (VOUT(T) / V)
VOUT = 1.2V
V: Output voltage after discharge
VOUT(T): Output voltage
VOUT = 1.8V
VOUT = 3.3V
---
t: Discharge time
τ: CL×RDCHG
CL: Capacitance of Output capacitor
RDCHG: CL auto-discharge resistance,
but it depends on supply voltage.
0
2
4
6
8
10 12 14 16 18 20
Discharge Time: t(ms)
11/21
XDL601/XDL602 Series
■OPERATIONAL EXPLANATION (Continued)
<Current Limit>
The current limiter circuit of the XDL601/XDL602 series monitors the current flowing through the P-channel MOS driver
transistor connected to the Lx pin. When the driver current is greater than a specific level, the current limit function operates to
turn off the pulses from the Lx pin at any given timing. When the over current state is eliminated, the IC resumes its normal
operation.
■NOTE ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated
if IC is used beyond the absolute MAX. specifications.
2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external
component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the
design has been completed, verification with actual components should be done.
3. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics
of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which
components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R,
X5R (EIA standard) ceramic capacitors.
4. Make sure that the PCB GND traces are as thick and wide as possible. The VSS pin or PGND pin and AGND pin fluctuation
caused by high ground current at the time of switching may result in instability of the IC. Therefore, the GND traces close to
the VSS pin, PGND pin and AGND pin are important.
5. Mount external components as close as possible to the IC. Keep the wiring short and thick to lower the wiring impedance.
6. A feature of HiSAT-COT control is that it controls the off time in order to control the duty, which varies due to the effects of power
loss. In addition, changes in the on time due to 100% duty cycle mode are allowed. For this reason, caution must be exercised
as the characteristics of the switching frequency will vary depending on the external component characteristics, board layout,
input voltage, output voltage, load current and other parameters.
7. Due to propagation delay inside the product, the on time generated by the minimum on time generation circuit is not the same
as the on time that is the ratio of the input voltage to the output voltage.
8. With regard to the current limiting value, the actual coil current may at times exceed the electrical characteristics due to
propagation delay inside the product.
9. The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the input or ground, use the resistor not more
than 1MΩ or less. To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting
between pins, it is recommended that a resistor be connected.
10. In the B type, if the output voltage drops below the short circuit protection threshold voltage at the end of the soft start interval,
operation will stop.
11. Regarding XDL602 which has PWM/PFM auto switching control method, it works with a discontinuous conduction mode at
light loads, and in this case where the voltage difference between input voltage and output voltage is low or the coil inductance
is higher than the value indicated in the standard circuit example, the coil current may reverse when the load is light, and thus
pulse skipping will not be possible and light load efficiency will worsen.
12. When the voltage difference between input voltage and output voltage is low, the load stability feature may deteriorate.
13. Torex places an importance on improving our products and their reliability.We request that users incorporate fail-safe designs
and post-aging protection treatment when using Torex products in their systems.
12/21
XDL601/XDL602
Series
■NOTE ON USE (Continued)
14. Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high.
Please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN pin, PGND pin and AGND pin.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents
at the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-
channel MOS driver transistors. Please consider the countermeasures against heat if necessary.
< Reference Pattern Layout >
Layer 1
Layer 2
Layer 4
Layer 3
13/21
XDL601/XDL602 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XDL601A083 / XDL602A083 Vout=0.8V
XDL601A183 / XDL602A183 Vout=1.8V
C
= 10μF(C2012X7R1A106M)
C
= 10μF(C2012X7R1A106M)
IN
IN
CL = 10μF(C2012X7R1A106M)
CL = 10μF(C2012X7R1A106M)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.5V
VIN = 5.5V
XDL601
XDL602
XDL601
VIN = 2.5V
VIN = 5.5V
XDL602
VIN = 2.5V
VIN = 5.5V
VIN = 2.5V
VIN = 5.5V
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
XDL601A333 / XDL602A333 Vout=3.3V
C
= 10μF(C2012X7R1A106M)
IN
CL = 10μF(C2012X7R1A106M)
100
90
80
70
60
50
40
30
20
10
0
XDL601
XDL602
VIN = 5.5V
0.1
1
10
100
1000
10000
Output Current: IOUT (mA)
(2) Output Voltage vs. Output Current
XDL601A333 Vout=3.3V
XDL601A183 Vout=0.8V
C
= 10μF(C2012X7R1A106M)
IN
C
= 10μF(C2012X7R1A106M)
IN
CL = 10μF(C2012X7R1A106M)
CL = 10μF(C2012X7R1A106M)
3.60
2.00
1.90
1.80
1.70
1.60
3.50
3.40
3.30
3.20
3.10
3.00
VIN = 5.5V
VIN = 2.5V
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
14/21
XDL601/XDL602
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Ripple Voltage vs. Output Current
XDL601A333 / XDL602A333 Vout=3.3V
= 10μF(C2012X7R1A106M)
XDL601A183 / XDL602A183 Vout=1.8V
= 10μF(C2012X7R1A106M)
C
IN
C
IN
CL = 10μF(C2012X7R1A106M)
CL = 10μF(C2012X7R1A106M)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XDL601
XDL602
XDL601
XDL602
VIN = 3.3V
VIN = 5.0V
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
(4) Output Voltage vs. Ambient Temperature
XDL601A183 Vout=1.8V
(5) UVLO Voltage vs. Ambient Temperature
XDL601A083 Vout=0.8V
VCE = VIN
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
2.00
1.95
1.90
VIN = 3.7V
1.85
1.80
1.75
1.70
1.65
1.60
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(6) Quiescent Current vs. Ambient Temperature
XDL602A083 Vout=0.8V
XDL601A083 Vout=0.8V
1000
900
800
700
600
500
400
300
200
100
0
100
90
VIN = 2.7V
VIN = 3.7V
VIN = 5.0V
80
70
VIN =5.0V, 3.7V, 2.7V
60
50
40
30
20
10
0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
15/21
XDL601/XDL602 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) Stand-by Current vs. Ambient Temperature
(8) Oscillation Frequency vs. Ambient Temperature
XDL601A083 Vout=0.8V
XDL601A083 Vout=0.8V
5.0
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
4.0
3.0
2.0
VIN =5.0V
VIN =5.0V
VIN = 3.6V
VIN = 3.0V
1.0
VIN = 3.7V, 2.7V
0.0
-50
-25
0
25
50
75
100 125
0
250
500
750
1000 1250 1500
Ambient Temperature: Ta (℃)
Output Current: IOUT (mA)
XDL601A333 Vout=3.3V
XDL601A183 Vout=1.8V
6.0
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
VIN = 5.0V, 5.5V
VIN =5.0V, 3.6V
VIN = 3.0V
VIN = 4.2V
0
250
500
750
1000 1250 1500
0
250
500
750
1000 1250 1500
Output Current: IOUT (mA)
Output Current: IOUT (mA)
(9) Pch Driver ON Resistance vs. Ambient Temperature
XDL601A083 Vout=0.8V
(10) Nch Driver ON Resistance vs. Ambient Temperature
XDL601A083 Vout=0.8V
VOUT = 0.6V , ILX = 100mA
VOUT = VOUT(T)×1.1 , I = 100mA
LX
300
250
200
150
100
50
300
VIN =5.0V
VIN = 3.7V
VIN = 2.7V
250
200
150
100
50
VIN =5.0V
VIN = 3.7V
VIN = 2.7V
0
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100 125
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
16/21
XDL601/XDL602
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Lx SW ”H” Leakage Current vs. Ambient Temperature
(12) Lx SW ”L” Leakage Current vs. Ambient Temperature
XDL601A083 Vout=0.8V
XDL601A083 Vout=0.8V
VIN =5.5V , VCE = 0V , VOUT = 0V , VLX = 5.5V
VIN =5.5V , VCE = 0V , VOUT = 0V , VLX = 0V
10.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta (℃)
Ambient Temperature : Ta (℃)
(13) CE ”H” Voltage vs. Ambient Temperature
(14) CE ”L” Voltage vs. Ambient Temperature
XDL601A083 Vout=0.8V
XDL601A083 Vout=0.8V
1.4
1.2
1.0
0.8
0.6
1.4
1.2
1.0
0.8
0.6
VIN =5.0V
VIN =5.0V
VIN = 3.7V
VIN = 2.7V
0.4
0.4
0.2
0.0
VIN = 3.7V
VIN = 2.7V
0.2
0.0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(15) Soft-Start Time vs. Ambient Temperature
XDL601A083 Vout=0.8V
(16) Current Limit vs. Ambient Temperature
XDL601A083 Vout=0.8V
VOUT = 0.6V
500
450
400
4000
3800
3600
3400
3200
3000
VIN =5.0V
350
300
250
200
150
100
50
2800
VIN =5.0V
2600
VIN = 3.7V
VIN = 2.7V
2400
2200
2000
0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature: Ta (℃)
Ambient Temperature : Ta (℃)
17/21
XDL601/XDL602 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) CL Discharge Resistance vs. Ambient Temperature
(18) Short Protection Threshold vs. Ambient
XDL601B083 Vout=0.8V
XDL601B083 Vout=0.8V
500
VIN = 5.0V , VCE =0V , VOUT = 4.0V
300
250
200
150
100
50
400
300
200
100
VIN =5.0V, 3.7V, 2.7V
0
0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
Ambient Temperature: Ta (℃)
(19) Load Transient Response
50
75
100
125
Ambient Temperature: Ta (℃)
VIN = 5.0V , VOUT = 1.8V , fOSC = 3.0MHz , IOUT = 10mA ⇒ 1.0A
CIN = 10μF(C2012X7R1A106M) , CL = 10μF(C2012X7R1A106M)
VIN = 5.0V , VOUT = 1.8V , fOSC = 3.0MHz , IOUT = 10mA ⇒ 1.0A
CIN = 10μF(C2012X7R1A106M) , CL = 10μF(C2012X7R1A106M)
V
OUT:50mV/div , IOUT:1A/div , Time:50μs/div
V
OUT:50mV/div , IOUT:1A/div , Time:50μs/div
I
OUT:1.0A
IOUT:1.0A
I
OUT:10mA
I
OUT:10mA
V
OUT:50mV/div
VOUT:50mV/div
VIN = 5.0V , VOUT = 3.3V , fOSC = 3.0MHz , IOUT = 10mA ⇒ 1.0A
CIN = 10μF(C2012X7R1A106) , CL = 10μF(C2012X7R1A106M)
VIN = 5.0V , VOUT = 3.3V , fOSC = 3.0MHz , IOUT = 10mA ⇒ 1.0A
CIN = 10μF(C2012X7R1A106) , CL = 10μF(C2012X7R1A106M)
V
OUT:50mV/div ,
I
OUT:1A/div , Time:50μs/div
V
OUT:50mV/div , IOUT:1A/div , Time:50μs/div
I
OUT:1.0A
I
OUT:1.0A
I
OUT:10mA
I
OUT:10mA
V
OUT:50mV/div
V
OUT:50mV/div
18/21
XDL601/XDL602
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLIN / LAND PATTERN
DFN3625-11B PKG
THERMAL CHARACTERISTICS
DFN3625-11B Power Dissipation
DFN3625-11B
19/21
XDL601/XDL602 Series
■MARKING RULE
DFN3625-11B
●DFN3625-11B
8
7
5
11
6
TOREX
9
9
① ② ③ ④ ⑤
1
2
3
4
10
(図中”TOREX”は固定)
① represents product series
MARK
PRODUCT SERIES
Package
C
D
XDL601****8*-Q
XDL602****8*-Q
DFN3625-11B
DFN3625-11B
② represents integer of the reference voltage and product type
Product
MARK
VOUT(V)
PRODUCT SERIES
Type
A
A
B
C
D
E
F
0.x
1.x
2.x
3.x
0.x
1.x
2.x
3.x
XDL60*A0****-Q
XDL60*A1****-Q
XDL60*A2****-Q
XDL60*A3****-Q
XDL60*B0****-Q
XDL60*B1****-Q
XDL60*B2****-Q
XDL60*B3****-Q
A
A
A
B
B
H
K
B
B
③ represents decimal number of the output voltage
MARK
VOUT(V)
x.0
PRODUCT SERIES
XDL60***0***-Q
XDL60***1***-Q
XDL60***2***-Q
XDL60***3***-Q
XDL60***4***-Q
XDL60***5***-Q
XDL60***6***-Q
XDL60***7***-Q
XDL60***8***-Q
XDL60***9***-Q
MARK
VOUT(V)
x.05
x.15
x.25
x.35
x.45
x.55
x.65
x.75
x.85
x.95
PRODUCT SERIES
XDL60***A***-Q
XDL60***B***-Q
XDL60***C***-Q
XDL60***D***-Q
XDL60***E***-Q
XDL60***F***-Q
XDL60***H***-Q
XDL60***K***-Q
XDL60***L***-Q
XDL60***M***-Q
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
x.1
x.2
x.3
x.4
x.5
x.6
H
K
L
x.7
x.8
x.9
M
④,⑤ represents production lot number
01~09、0A~0Z、11~9Z、A1~A9、AA~AZ、B1~ZZ in order
(G, I, J, O, Q, W excluded*)No Character inversion used.
20/21
XDL601/XDL602
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions, excluding when specified for in-vehicle use or other uses.
Do not use the product for in-vehicle use or other uses unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
21/21
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