XC6121E228MR [TOREX]

Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V); 电压检测器与看门狗功能和ON / OFF控制( VDF = 1.6V 〜 5.0V )
XC6121E228MR
型号: XC6121E228MR
厂家: Torex Semiconductor    Torex Semiconductor
描述:

Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V)
电压检测器与看门狗功能和ON / OFF控制( VDF = 1.6V 〜 5.0V )

文件: 总23页 (文件大小:426K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
XC6121/XC6122  
XC6123/XC6124Series  
ETR0209-009  
Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V)  
GENERAL DESCRIPTION  
The XC6121/XC6122/XC6123/XC6124 series are groups of high-precision, low current consumption voltage detectors with  
watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit,  
comparator, and output driver. With the built-in delay circuit, the XC6121/XC6122/XC6123/XC6124 series’ ICs do not require  
any external components to output signals with release delay time. The output type is VDFL low when detected. With the  
XC6121/XC6122/XC6123/XC6124 series’ ICs, the EN/ENB pin can control ON and OFF of the watchdog functions. By setting  
the EN/ENB pin to low or high level, the watchdog function can be OFF while the voltage detector remains operation. Since  
the EN/ENB pin of the XC6122 and XC6124 series is internally pulled up to the VIN pin or pulled down to the VSS pin, the ICs  
can be used with the EN/ENB pin left open, when the watchdog functions is used. The detect voltages are internally fixed  
1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a  
range from 50ms to 1.6s. Five release delay time settings are available in a range from 3.13ms to 400ms.  
FEATURES  
APPLICATIONS  
Microprocessor watchdog monitoring  
and reset circuits  
Detect Voltage Range  
: 1.6V ~ 5.0V, +2%  
(100mV increments)  
: VDFL x 5% (TYP.)  
Hysteresis Width  
Operating Voltage Range : 1.0V ~ 6.0V  
Memory battery backup circuits  
System power-on reset circuits  
Power failure detection  
Detect Voltage Temperature  
Characteristics  
: +100ppm/OC (TYP.)  
Output Configuration  
Watchdog Pin  
: N-channel open drain  
: Watchdog input  
If watchdog input maintains ‘H’  
or ‘L’ within the watchdog  
timeout period, a reset signal is  
output from the RESETB pin.  
: When the EN/ENB pin voltage is  
set to low or high level, the  
watchdog function is forced off.  
: 400ms, 200ms, 100ms, 50ms,  
3.13ms (TYP.)  
EN/ENB Pin  
Release Delay Time  
Watchdog Timeout Period : 1.6s, 800ms, 400ms, 200ms,  
100ms, 50ms (TYP.)  
: SOT-25, USP-6C  
Package  
TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE  
CHARACTERISTICS  
Supply Current vs. Input Voltage  
XC6121~XC6124(V =2.7V)  
DF  
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0
Ta=85℃  
Ta=25℃  
Ta=-40℃  
0
1
2
3
4
5
6
Input Voltage:ꢀVIN (V)  
1/23  
XC6121/XC6122/XC6123/XC6124 Series  
PIN CONFIGURATION  
USP-6C  
(BOTTOM VIEW)  
SOT-25  
(TOP VIEW)  
* The dissipation pad for the USP-6C package should be  
solder-plated in recommended mount pattern and metal  
masking so as to enhance mounting strength and heat  
release. If the pad needs to be connected to other pins, it  
should be connected to the VSS (No. 5) pin.  
PIN ASSIGNMENT  
PIN NUMBER  
PIN NAME  
FUNCTION  
SOT-25  
USP-6C  
RESETB  
VSS  
Reset Output  
Ground  
1
2
3
4
5
-
4
5
2
1
6
3
EN/ENB  
WD  
Watchdog ON/OFF Control  
Watchdog  
VIN  
Power Input  
NC  
No Connection  
2/23  
XC6121/XC6122/XC6123/XC6124  
Series  
PRODUCT CLASSIFICATION  
Selection Guide  
RESET OUTPUT  
SERIES  
EN/ENB PIN FUNCTION  
HYSTERESIS  
(EN/ENB INPUT LOGIC*,  
VDFL (RESETB)  
VDFH (RESET)  
PULL-UP OR DOWN RESISTOR)  
XC6121  
XC6122  
XC6123  
XC6124  
N-channel open drain  
N-channel open drain  
N-channel open drain  
N-channel open drain  
-
-
-
-
EN with No Pull-Up Resistor  
EN with Pull-Up Resistor  
Available:  
VDFL x 5% (TYP.)  
ENB with No Pull-Down Resistor  
ENB with Pull-Down Resistor  
* EN input logic: The watchdog function turns on when the EN pin becomes high level.  
* ENB input logic: The watchdog function turns on when the ENB pin becomes low level.  
Ordering Information  
XC6121①②③④⑤⑥: N-channel Open Drain Output (RESETB), EN Pin: No Pull-Up Resistor  
XC6122①②③④⑤⑥: N-channel Open Drain Output (RESETB), EN Pin: Pull-Up Resistor  
XC6123①②③④⑤⑥: N-channel Open Drain Output (RESETB), ENB Pin: No Pull-Down Resistor  
XC6124①②③④⑤⑥: N-channel Open Drain Output (RESETB), ENB Pin: Pull-Down Resistor  
DESIGNATOR  
DESCRIPTION  
SYMBOL  
DESCRIPTION  
A
C
D
E
F
2
: 3.13ms (TYP.)  
: 50ms (TYP.)  
: 100ms (TYP.)  
: 200ms (TYP.)  
: 400ms (TYP.)  
: 50ms (TYP.)  
: 100ms (TYP.)  
: 200ms (TYP.)  
: 400ms (TYP.)  
: 800ms (TYP.)  
: 1.6s (TYP.)  
Release Delay Time  
3
4
Watchdog Timeout Period  
5
7
6
: Detect voltage  
③④  
Detect Voltage  
Packages  
16 ~ 50  
ex.) 4.5V: ③⇒4, ④⇒5  
: SOT-25  
M
E
R
L
: USP-6C  
: Embossed tape, standard feed  
: Embossed tape, reverse feed  
Device Orientation  
* Please set the release delay time shorter than or equal to the watchdog timeout period.  
ex.) XC6121D327MR or XC6121D627MR  
3/23  
XC6121/XC6122/XC6123/XC6124 Series  
BLOCK DIAGRAMS  
XC6121 Series  
N-ch Open Drain Output  
XC6122 Series  
N-ch Open Drain Output  
4/23  
XC6121/XC6122/XC6123/XC6124  
Series  
BLOCK DIAGRAMS (Continued)  
XC6123 Series  
N-ch Open Drain Output  
XC6124 Series  
N-ch Open Drain Output  
5/23  
XC6121/XC6122/XC6123/XC6124 Series  
ABSOLUTE MAXIMUM RATINGS  
Ta = 25OC  
PARAMETER  
Input Voltage  
SYMBOL  
VIN  
RATINGS  
UNITS  
VSS -0.3 ~ 7.0  
VSS-0.3VIN+0.37.0  
VSS -0.3 ~ 7.0  
20  
V
V
EN/ENB  
WD  
V
Output Current  
Output Voltage  
IOUT  
mA  
V
VSS -0.3 ~ 7.0  
RESETB  
SOT-25  
USP-6C  
250  
100  
Power Dissipation  
Pd  
mW  
Operational Temperature Range  
Storage Temperature Range  
Topr  
Tstg  
-40 ~ +85  
-55 ~ +125  
OC  
OC  
6/23  
XC6121/XC6122/XC6123/XC6124  
Series  
Ta = 25 OC  
ELECTRICAL CHARACTERISTICS  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN.  
TYP.  
VDFL(T)  
VDFL  
MAX.  
UNITS CIRCUIT  
VDFL(T)  
× 0.98  
VDFL  
VDFL(T)  
× 1.02  
VDFL  
Detect Voltage  
VDFL  
V
V
EN=VSS,ENB=VIN  
Hysteresis Width  
VHYS  
× 0.02 × 0.05 × 0.08  
VIN=VDFL(T)×0.9V  
-
5
11  
the WD Pin:  
OPEN  
Supply Current (*1)  
Operating Voltage  
ISS  
μA  
VIN=VDFL(T)×1.1V  
VIN=6.0V  
-
10  
16  
-
12  
-
0.5  
18  
6.0  
-
VIN  
1.0  
0.15  
V
VIN=1.0V  
VIN=2.0V (VDFL(T)> 2.0V)  
VIN=3.0V (VDFL(T) >3.0V)  
VIN=4.0V (VDFL(T) >4.0V)  
2.0  
3.0  
3.5  
2.5  
3.5  
4.0  
-
-
-
N-ch.  
VDS = 0.5V  
Output Current  
IRBOUT  
mA  
Temperature  
Characteristics  
VDFL /  
ToprVDFL  
-40OC < Topr < 85 OC  
-
+100  
-
ppm/ OC  
2.00  
37  
3.13  
50  
5.00  
63  
Time until VIN is increased from  
1.0V to 2.0V  
Release Delay Time  
(VDFL<1.8V)  
TDR  
TDR  
ms  
ms  
75  
100  
200  
400  
3.13  
50  
125  
250  
500  
5.00  
63  
and attains to the release time level,  
and the Reset output pin releases.  
150  
300  
2.00  
37  
Time until VIN is increased from  
1.0V to (VDFL x 1.1V)  
and attains to the release time level,  
and the Reset output pin releases.  
Release Delay Time  
(VDFL>1.9V)  
75  
100  
200  
400  
125  
250  
500  
150  
300  
Time until VIN is decreased from 6.0V to  
1.0V and attains to the detect voltage  
level, and the Reset output pin detects  
while the WD pin left open.  
Detect Delay Time  
TDF  
-
5.5  
33  
μs  
VDFL  
Leak Current  
ILEAK  
VIN=6.0V, RESETB=6.0V  
-
0.01  
0.1  
μA  
37  
75  
50  
100  
200  
400  
800  
1600  
50  
63  
125  
250  
500  
1000  
2000  
63  
Time until VIN increases form  
1.0V to 2.0V and  
the Reset output pin is released to go into  
Watchdog  
Timeout Period  
(VDFL<1.8V)  
150  
300  
600  
1200  
37  
TWD  
ms  
ms  
the detection state. (WD=VSS)  
75  
100  
200  
400  
800  
1600  
125  
250  
500  
1000  
2000  
Time until VIN increases from  
1.0V to (VDFLx1.1V)  
and the Reset output pin is released to go  
Watchdog  
Timeout Period  
(VDFL>1.9V)  
150  
300  
600  
1200  
TWD  
into the detection state. (WD=VSS)  
7/23  
XC6121/XC6122/XC6123/XC6124 Series  
ELECTRICAL CHARACTERISTICS (Continued)  
Ta = 25 OC  
PARAMETER  
SYMBOL  
CONDITIONS  
VIN=6.0V,  
Apply pulse from 6.0V to 0V  
to the WD pin.  
MIN.  
TYP.  
-
MAX.  
-
UNITS CIRCUIT  
Watchdog  
Minimum Pulse Width  
TWDIN  
300  
ns  
Watchdog  
High Level Voltage  
Watchdog  
VWDH  
VWDL  
VIN=VDFL x 1.1V ~ 6.0V  
VIN x 0.7  
-
6
VIN x 0.3  
1000  
VIN  
V
V
VIN=VDFL x 1.1V ~ 6.0V  
0
300  
1.3  
0
-
Low Level Voltage  
Watchdog  
Pull-down Resistance  
EN/ENB  
RWD  
600  
kΩ  
V
VWD=6V, RWD=VWD/IWD  
VENH/VENBH  
VENL/VENBL  
REN  
VIN=VDFL x 1.1V ~ 6.0V  
-
-
High Level Voltage  
EN/ENB  
VIN=VDFL x 1.1V ~ 6.0V  
0.35  
V
Low Level Voltage  
EN Pull-up  
VIN=6.0V, EN=0V, REN=VIN / IEN  
VIN=6.0V, ENB=6V, RENB=VIN / IENB  
Resistance (*2)  
ENB Pull-down  
Resistance (*3)  
1.0  
1.6  
2.4  
MΩ  
RENB  
NOTE:  
*: In case where no EN/ENB pin’s condition written in the test condition field, EN=VIN and ENB=VSS  
**: VDFL(T)=Setting detect voltage value  
.
*1: The condition when the watchdog pin is ON.  
The EN/ENB pin is CMOS input. For the XC6122 (pull-up resistor) and XC6124 (pull-down resistor),  
supply current increases in the following values when the watchdog function is OFF.  
XC6122 SeriesVIN-VEHL/1.6MΩ(TYP)  
XC6124 SeriesVEHBH/1.6MΩ(TYP)  
*2: For the XC6122 series only.  
*3: For the XC6124 series only.  
8/23  
XC6121/XC6122/XC6123/XC6124  
Series  
OPERATIONAL EXPLANATION  
The XC6121/6122/6123/6124 series compare, using the error amplifier, the voltage of the internal voltage reference source  
with the voltage divided by R1, R2 and R3 connected to the VIN pin. The resulting output signal from the error amplifier  
activates the watchdog logic, delay circuit and the output driver. When the VIN pin voltage gradually falls and finally reaches  
the detect voltage, the RESETB pin output goes from high to low in the case of the VDFL type ICs.  
<RESETB / RESET Pin Output Signal>  
* VDFL (RESETB) type - output signal: Low when detected.  
The RESETB pin output goes from high to low whenever the VIN pin voltage falls below the detect voltage. The RESETB pin  
remains low for the release delay time (TDR) after the VIN pin voltage reaches the release voltage. If neither rising nor falling  
signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release  
delay time (TDR), and thereafter the RESET pin outputs high level signal.  
<Hysteresis>  
When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the  
hysteresis circuit. The difference between the release and detect voltages represents the hysteresis width, as shown by the  
following calculations:  
VDFL (detect voltage) = (R1+R2+R3) x Vref / (R2+R3)  
VDR (release voltage) = (R1+R2) x Vref / (R2)  
VHYS (hysteresis width) =VDR-VDFL (V)  
VDR > VDFL  
* Please refer to the block diagrams for R1, R2, R3 and Vref.  
* Hysteresis width is selectable from VDFL x 0.05V (TYP.).  
<Watchdog (WD) Pin>  
The series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals  
are applied from the microprocessor within the watchdog timeout period, the RESETB pin output maintains the detection state  
for the release delay time (TDR), and thereafter the RESETB pin outputs low to high signal. The watchdog pin is pulled down  
to the VSS internally. When the watchdog pin is not connected, A reset signal comes out after the watchdog timeout period.  
Six watchdog timeout period settings (TWD) are available in 1.6s, 800ms, 400ms, 200ms, 100ms, and 50ms.  
<EN Pin>  
In case where the watchdog function is not used, When the EN pin input driven to low level, only the watchdog function is  
forced off while the detect voltage circuit remains operation. For using the watchdog function, the EN pin should be used in  
high level. Even after the input voltage and the EN pin voltage are driven back high, the RESETB pin output maintains the  
detection state for the release delay time (TDR). (Refer to the TIMING CHART 1-.) The watchdog function recovers  
immediately when the input voltage becomes higher than the release voltage and the EN pin voltage driven from low to high  
level. (Refer to the TIMING CHART 1-.) A diode, which is an input protection element, is connected between the EN pin  
and VIN pin. Therefore, if the EN pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For  
avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the EN pin.  
<ENB Pin>  
In case where the watchdog function is not used, when the ENB pin input driven to high level, only the watchdog function is  
forced off while the detect voltage circuit remains operation. For using the watchdog function, the ENB pin should be used in  
low level. Even after the input voltage and the ENB pin voltage are driven back low, the RESETB pin output maintains the  
detection state for the release delay time (TDR). (Refer to the TIMING CHART 2-.) The watchdog function recovers  
immediately when the input voltage becomes higher than the release voltage and the ENB pin voltage driven from high to low  
level. (Refer to the TIMING CHART 2-.) A diode, which is an input protection element, is connected between the ENB pin  
and VIN pin. Therefore, if the ENB pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For  
avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the ENB pin.  
<Release Delay Time>  
Release delay time (TDR) is the time that elapses from when the VIN pin reaches the release voltage, or when the watchdog  
timeout period expires with no rising signal applied to the WD pin, until the RESETB pin output is released from the detection  
state. Five release delay time (TDR) watchdog timeout period settings are available in 400ms, 200ms, 100ms, 50ms, and  
3.13ms.  
<Detect Delay Time>  
Detect Delay Time (TDF) is the time that elapses from when the VIN pin voltage falls to the detect voltage until the RESETB pin  
output goes into the detection state.  
9/23  
XC6121/XC6122/XC6123/XC6124 Series  
TIMING CHARTS  
1. XC6121/XC6122 Series (EN products)  
N-ch Open Drain Output (Rpull=100kΩ)  
Hysteresis Width  
TDF (N-ch Open Drain Output, Rpull=100kΩ)  
10/23  
XC6121/XC6122/XC6123/XC6124  
Series  
TIMING CHARTS (Continued)  
2. XC6123/XC6124 Series (ENB products)  
N-ch Open Drain Output (Rpull=100kΩ)  
Hysteresis Width  
TDF (N-ch Open Drain Output, Rpull=100kΩ)  
11/23  
XC6121/XC6122/XC6123/XC6124 Series  
NOTES ON USE  
1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent  
damage to the device.  
2. When a resistor is connected between the VIN pin and the input, the VIN voltage drops while the IC is operating and a  
malfunction may occur as a result of the IC’s through current.  
3. In order to stabilize the IC’s operations, please ensure that the VIN pin’s input frequency’s rise and fall times are more than  
1 μ s/V.  
4. Noise at the power supply may cause a malfunction of the watchdog operation or the voltage detector. In such case,  
please strength the line between VIN and the GND pin and connect about 0.22μF of a capacitor between the VIN pin and  
the GND pin.  
5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise  
and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900μs at maximum.  
6. The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the EN pin in  
high level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be used even the EN pin  
left open. The ENB pin of the XC6123 series is not internally pulled down. When using the watchdog function, please  
drive the ENB pin in low level. The ENB pin of the XC6124 series is internally pulled up. The watchdog function can be  
used even the ENB pin left open.  
12/23  
XC6121/XC6122/XC6123/XC6124  
Series  
PIN LOGIC CONDITIONS  
PIN NAME  
LOGIC  
H
CONDITIONS  
PIN NAME LOGIC  
CONDITIONS  
The state maintaining WD>VWDH  
for more than TWD  
VIN>VDFL+VHYS  
H
L
VIN  
The state maintaining WD<VWDL  
for more than TWD  
WD  
L
VIN<VDFL  
H
L
EN/ENB>1.30V  
EN/ENB<0.35V  
LH  
HL  
VWDLVWDH, 300nsTWDINTWD  
VWDHVWDL, 300nsTWDINTWD  
EN/ENB  
NOTE:  
V
V
V
V
DFL: Detect Voltage  
HYS: Hysteresis Range  
WDH: WD High Level Voltage  
WDL: WD Low Level Voltage  
T
T
WDIN: WD Pulse Width  
WD: WD Timeout Period  
For the details of each parameter, please see the electrical characteristics.  
FUNCTION CHART  
XC6121/XC6122  
EN  
XC6123/XC6124  
ENB  
VIN  
H
WD  
RESETB (*2)  
H
L
Repeating detect and release (HLH)  
H
L
L
OPEN  
LH  
H
H
L
H
L
H
L
*1  
NOTE:  
*1: Including all logics of the WD (WD=H, L, OPEN, HL, LH).  
*2: When the RESETB is High, the circuit is in the release state.  
When the RESETB is Low, the circuit is in the detection state.  
*3: VIN=L and EN/ENB=H can not be combined because the rated input voltage of the EN/ENB pin is Vss-0.3V to VIN+0.3V.  
*4: The RESETB pin becomes indefinite operation while 0.35V<EN/ENB<1.3V.  
*5: The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the  
EN pin in high level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be  
used even the EN pin left open. The ENB pin of the XC6123 series is not internally pulled down. When using  
the watchdog function, please drive the ENB pin in low level. The ENB pin of the XC6124 series is internally  
pulled up. The watchdog function can be used even the ENB pin left open.  
13/23  
XC6121/XC6122/XC6123/XC6124 Series  
TEST CIRCUITS  
Circuit ①  
Circuit ②  
Circuit ③  
VDS=0.5V  
14/23  
XC6121/XC6122/XC6123/XC6124  
Series  
TEST CIRCUITS (Continued)  
Circuit ④  
Circuit ⑤  
Circuit ⑥  
15/23  
XC6121/XC6122/XC6123/XC6124 Series  
TEST CIRCUITS (Continued)  
Circuit ⑦  
Circuit ⑧  
Note:  
The above reference is about the EN logic  
operation.  
Circuit ⑨  
Note:  
XC6122 series has EN pin,  
XC6124 Series has ENB pin.  
16/23  
XC6121/XC6122/XC6123/XC6124  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.Supply Current vs. Input Voltage  
XC6121~XC6124(V =1.6V)  
DF  
XC6121~XC6124(V =2.7V)  
DF  
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0
Ta=85℃  
Ta=85℃  
Ta=25℃  
Ta=25℃  
Ta=-40℃  
Ta=-40℃  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage:ꢀVIN (V)  
Input Voltage:ꢀVIN (V)  
XC6121~XC6124(V =5.0V)  
DF  
14.0  
12.0  
10.0  
8.0  
6.0  
4.0  
2.0  
0
Ta=85℃  
Ta=25℃  
Ta=-40℃  
0
1
2
3
4
5
6
Input Voltage:ꢀVIN (V)  
2.Detect, Release Voltage vs. Ambient Temperature  
XC6121~XC6124(V =1.6V)  
DF  
XC6121~XC6124(V =2.7V)  
DF  
1.70  
1.65  
1.60  
1.55  
2.90  
2.80  
2.70  
2.60  
VDR  
VDR  
VDF  
VDF  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
17/23  
XC6121/XC6122/XC6123/XC6124 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
2.Detect, Release Voltage vs. Ambient Temperature (Continued)  
XC6121~XC6124(V =5.0V)  
DF  
5.30  
5.20  
5.10  
5.00  
4.90  
VDR  
VDF  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
4.Driver Output Current vs. Input Voltage  
3.Nch Driver Output Current vs. VDS  
XC6121~XC6124  
XC6121~XC6124  
6.0  
30  
Ta=-40℃  
DS  
=0.5V  
V
Ta=25℃  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
25  
Ta=25℃  
V
IN =5.0V  
20  
15  
10  
5
VIN =4.0V  
Ta=85℃  
VIN =3.0V  
VIN =2.0V  
VIN =1.0V  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
VDS (V)  
Input Voltage:ꢀVIN (V)  
5.Release Delay Time vs. Ambient Temperature  
XC6121~XC6124  
XC6121~XC6124  
300  
3000  
2500  
2000  
1500  
1000  
500  
TDR=100ms  
TDR=1600ms  
250  
200  
150  
100  
50  
0
0
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
18/23  
XC6121/XC6122/XC6123/XC6124  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
6.Watchdog Timeout Period vs. Ambient Temperature  
XC6121~XC6124  
300  
XC6121~XC6124  
TWD=1600ms  
3000  
2500  
2000  
1500  
1000  
500  
TWD=100ms  
250  
200  
150  
100  
50  
0
0
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
8.Watchdog Timeout Period vs. Input Voltage  
7.Release Delay Time vs. Input Voltage  
XC6121~XC6124  
XC6121~XC6124  
120  
4.0  
Ta=25℃  
Ta=25℃  
3.8  
3.6  
3.4  
3.2  
3.0  
2.8  
2.6  
TWD=100ms  
TDR=3.13ms  
115  
110  
105  
100  
95  
90  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Input Voltage:ꢀVIN (V)  
Input Voltage:ꢀVIN (V)  
9.Watchdog Low Level Threshould vs. Ambient Temperature  
10.  
Watchdog High Level Threshould vs. Ambient Temperature  
XC6121~XC6124  
XC6121~XC6124  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
IN  
V =6.0V  
IN  
V =6.0V  
IN  
V =3.0V  
IN  
V =3.0V  
IN  
V =1.76V  
IN  
V =1.76V  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
19/23  
XC6121/XC6122/XC6123/XC6124 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
11.Watchdog Pull-Down Resistance vs. Ambient Temperature  
XC6121~XC6124  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
13.ENB Pull-Down Resistance vs. Ambient Temperature  
12.EN Pull-Up Resistance vs. Ambient Temperature  
XC6121~XC6122  
3.0  
XC6123~XC6124  
3.0  
2.4  
1.8  
1.2  
0.6  
0.0  
2.4  
1.8  
1.2  
0.6  
0.0  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
14.EN Ligh Level Voltage vs. Ambient Temperature  
15.EN High Level Voltage vs. Ambient Temperature  
XC6121~XC6122  
1.10  
XC6121~XC6122  
1.10  
1.00  
0.90  
1.00  
0.90  
IN  
V
V
=6.0V  
=3.0V  
0.80  
0.80  
0.70  
0.60  
0.50  
IN  
V
V
=6.0V  
=3.0V  
IN  
0.70  
0.60  
0.50  
IN  
IN  
V
=1.76V  
IN  
V
=1.76V  
-50  
-25  
0
25  
50  
75 100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
20/23  
XC6121/XC6122/XC6123/XC6124  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
16.ENB Low Level Voltage vs. Ambient Temperature  
17.ENB High Level Voltage vs. Ambient Temperature  
XC6123~XC6124  
1.10  
XC6123~XC6124  
1.10  
1.00  
0.90  
1.00  
0.90  
0.80  
IN  
V =6.0V  
0.80  
IN  
V =6.0V  
IN  
V =3.0V  
0.70  
0.70  
IN  
V =3.0V  
IN  
V =1.76V  
0.60  
0.60  
0.50  
IN  
V =1.76V  
0.50  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
21/23  
XC6121/XC6122/XC6123/XC6124 Series  
PACKAGING INFORMATION  
USP-6C  
SOT-25  
USP-6C Recommended Pattern Layout  
USP-6C Recommended Metal Mask Design  
22/23  
XC6121/XC6122/XC6123/XC6124  
Series  
1. The products and product specifications contained herein are subject to change without  
notice to improve performance characteristics. Consult us, or our representatives  
before use, to confirm that the information in this catalog is up to date.  
2. We assume no responsibility for any infringement of patents, patent rights, or other  
rights arising from the use of any information and circuitry in this catalog.  
3. Please ensure suitable shipping controls (including fail-safe designs and aging  
protection) are in force for equipment employing products listed in this catalog.  
4. The products in this catalog are not developed, designed, or approved for use with such  
equipment whose failure of malfunction can be reasonably expected to directly  
endanger the life of, or cause significant injury to, the user.  
(e.g. Atomic energy; aerospace; transport; combustion and associated safety  
equipment thereof.)  
5. Please use the products listed in this catalog within the specified ranges.  
Should you wish to use the products under conditions exceeding the specifications,  
please consult us or our representatives.  
6. We assume no responsibility for damage or loss due to abnormal use.  
7. All rights reserved. No part of this catalog may be copied or reproduced without the  
prior permission of Torex Semiconductor Ltd.  
23/23  

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