XIO1100ZWS [TI]
X1 PCI Express Serial Link;型号: | XIO1100ZWS |
厂家: | TEXAS INSTRUMENTS |
描述: | X1 PCI Express Serial Link PC |
文件: | 总41页 (文件大小:1058K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XIO1100
Data Manual
Literature Number: SLLS690C
April 2006 Revised August 2011
Contents
Page
Contents
Section
1
2
XIO1100 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
2.1
2.2
2.3
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
2
2
2.3.1
2.3.2
2.3.3
P0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
P0s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
P1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
2.4
2.5
2.6
2.7
2.8
Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Clock Tolerance Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
4
4
4
2.8.1
2.8.2
2.8.3
2.8.4
8B/10B Decode Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Elastic Buffer Overflow Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Elastic Buffer Underflow Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disparity Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5
5
5
2.9
Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Idle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Polarity Inversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Setting Negative Parity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5
5
5
6
8
2.10
2.11
2.12
2.13
2.14
3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
12
12
13
15
18
19
19
20
24
24
25
25
27
28
29
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Absolute Maximum Ratings† . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCI Express Differential Transmitter Output Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCI Express Differential Receiver Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Express Differential Reference Clock Input Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics Over Recommended Operating Conditions (VDD_IO) . . . . . . . . . . .
Implementation−Specific Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
5
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1
5.2
5.3
5.4
5.5
Component Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XIO1100 Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Filtering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCIe Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PIPE Interface Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
i
List of Figures
Figure
Page
2
Figure 2−1. XIO1100 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4−1. TI−PIPE Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4−2. TI−PIPE Data Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4−3. TI−PIPE Output Functional Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4−4. TI−PIPE Input Functional Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 5−1. External Component Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 5−2. Filter Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
21
22
23
24
26
ii
List of Tables
Table
Page
Table 2−1. Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2−2. RX_STATUS Loopback Detection Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2−3. 100-pin GGB Signal Name Sorted by Terminal Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2−4. 100-pin GGB Signal Name Sorted Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2−5. XIO1100 Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
4
6
7
8
iii
Features
1
XIO1100 Features
D X1 PCI Expresst Serial Link
− PCI Express 1.1 Compliant
− Selectable Reference Clock (100 MHz,
125 MHz)
D TI-PIPE MAC Interface
− Source-Synchronous TX and RX Ports
− 125 MHz TX/RX Clocks
− Selectable 16-Bit SDR or 8-Bit DDR Mode
− Low-Power Capability
D 100-Pin MicroStart BGA Package
D Selectable 1.5−V or 1.8−V LVCMOS Buffers.
TI and MicroStar BGA are trademarks of Texas Instruments Incorporated
PCI Express is a trademark of PCI−SIG
2
Description
The XIO1100 is a PCI Expresst PHY that is compliant with PCI Express Base Specification Revision 1.1 and
that interfaces the PCI Express Media Access Layer (MAC) to a PCI Express serial link by using a modified
version of the interface described in PHY Interface for the PCI Expresst Architecture (also known as PIPE
interface) by Intel Corporation. This modified version of the PIPE interface is referred to as a TI-PIPE interface
throughout this data manual.
The TI-PIPE interface is a pin-configurable interface that can be configured as either a 16-bit or an 8-bit
interface.
•
The 16-bit TI-PIPE interface is a 125 MHz 16-bit parallel interface with a 16-bit output bus (RXDATA) that
is clocked by the RXCLK output clock and a 16-bit input bus (TXDATA) that is clocked by the TXCLK input
clock. Both buses are clocked using Single Data Rate (SDR) clocking in which the data transitions are
on the rising edge of the associated clock.
•
The 8-bit TI-PIPE interface is a 250 MHz 8-bit parallel interface with an 8-bit output bus (RXDATA) that
is clocked by the RXCLK output clock and an 8-bit input bus (TXDATA) that is clocked by the TXCLK input
clock. Both buses are clocked using Double Data Rate (DDR) clocking in which the data transitions are
on both the rising edge and the falling edge of the clock.
The XIO1100 PHY interfaces to a 2.5 Gbps PCI Express serial link with a transmit differential pair (TXP and
TXN) and a receive differential pair (RXP and RXN). Incoming data at the XIO1100 PHY receive differential
pair (RXP and RXN) is forwarded to the MAC on the RXDATA output bus. Data received from the MAC on
the TXDATA input bus is forwarded to the XIO1100 PHY transfer differential pair (TXP and TXN).
The XIO1100 is also responsible for handling the 8B/10B encoding/decoding and scrambling/unscrambling
of the outgoing data. In addition, XIO1100 can recover/interpolate the clock on the receiver side based on the
transitions guaranteed by the use of the 8B/10B mechanism and supply this to the receive side of the data
link layer logic.
In addition to the TI-PIPE interface, the XIO1100 has some TI-proprietary side-band signals that some
customers may wish to use to take advantage of additional XIO1100 low-power state features (for example,
disabling the PLL during the L1 power state).
2.1 Ordering Information
ORDERING NUMBER
VOLTAGE
TEMPERATURE
PACKAGE
XIO1100
3.3/1.8/1.5
0°C to 70°C
100-terminal GGB
1
June 2006 Revised August 2011
SLLS690C
Description
2.2 Functional Description
The XIO1100 meets all of the requirements for a PCI−Express PHY as defined by Section 4, Physical Layer
Specifications, of the PCI−SIG document PCI Express Base Specification. The XIO1100 conforms to the
functional behavior described in PHY Interface for the PCI Expresst Architecture by Intel Corporation. There
are only two differences between the XIO1100 TI−PIPE interface and the Intel PIPE interface.
The PIPE interface uses a single SDR clock source to clock both the RXDATA and the TXDATA. The TI−PIPE
interface uses two source synchronous clocks, RX_CLK and TX_CLK, to clock the RXDATA and TXDATA.
RXDATA uses RX_CLK and TXDATA uses TX_CLK.
In the 8-bit mode, the TI−PIPE interface is a DDR (Double Data Rate) interface. In the 16-bit mode, it is an
SDR (Single Data Rate) interface. The PIPE interface is always an SDR interface.
Figure 2−1 shows a functional block diagram of the XIO1100.
REFCLK/REFCLK−
PLL
TX_DATA 16/8
TXP/TXN
TX_CLK
TX BLOCK
TX_DATAK[1:0]
STATUS
COMMAND
RX_DATA 16/8
RX_CLK
RXP/RXN
RX BLOCK
RX_DATAK[1:0]
Figure 2−1. XIO1100 Functional Block Diagram
2.3 Power Management
The three power states are:
•
•
•
P0
P0s
P1
2
SLLS690C
June 2006 Revised August 2011
Description
2.3.1 P0
P0 is the normal operation state for the XIO1100. The POWERDOWN[1:0] input signals define which of the
three power states that an XIO110 is in at any given time. In states P0, P0s, and P1, the XIO1100 is required
to keep P_CLK operational. For all state transitions between these three states, the XIO1100 indicates
successful transition into the designated power state by a single cycle assertion of PHY_STATUS. For all
power state transitions, the MAC must not begin any operational sequence or more power state transitions
until the XIO1100 has indicated that the initial state transition is finished. P2 state and beacon are not
supported.
In the P0 state, all internal clocks in the XIO1100 are operational. P0 is the only state where the XIO1100
transmits and receives PCI Express signaling. P0 is the appropriate PHY power management state for most
states in the Link Training and Status State Machine (LTSSM). Exceptions are listed as follows for each lower
power XIO1100 state.
2.3.2 P0s
In the P0s state, RX_CLK output stays operational. The MAC moves the XIO1100 to this state only when the
transmit channel is idle. P0s state is used when the transmitter is in state Tx_L0s.Idle. If the receiver detects
an electrical idle while the XIO1100 is in either P0 or P0s power states, the receiver portion of the XIO1100
takes appropriate power saving measures.
2.3.3 P1
In the P1 state, selected internal clocks in the XIO1100 will be turned off. RX_CLK output will stay operational.
The MAC moves the XIO1100 to this state only when both transmit and receive channels are idle. The
XIO1100 does not indicate successful entry into P1 (by asserting PhyStatus) until RX_CLK is stable and the
operating dc common mode voltage is stable and within specification (in accordance with PCI Express Base
Specification). P1 is used for the Disabled state, all Detect states, and L1.Idle state of the Link Training and
Status State Machine (LTSSM). While in P1 state, the optional P1_SLEEP input signal can be used to reduce
even more power consumption by disabling the RX_CLK signal. However, the P1_SLEEP input must not be
asserted when the XIO1100 is in any state other than P1 state, and the XIO1100 must not be transitioned out
of the P1 state as long as P1_SLEEP is asserted.
2.4 Clock
The RX_CLK of XIO1100 is derived from the REFCLK input. A 100 MHz differential clock or a 125 MHz single
ended clock can be used as the source clock. The frequency selection is determined by CLK_SEL. If
CLK_SEL is low during /RESET transitioning from a low state to a high state, the source clock at
REFCLK+/REFCLK− is a 100 MHz differential clock. If CLK_SEL is high during /RESET transitioning from a
low state to a high state, the source clock at REFCLK+ is a 125 MHz single ended clock. In this case, REFCLK−
needs to be tied to VSS.
Table 2−1. Clock Selection
RX_CLK
CLK_SEL = 0
CLK_SEL = 1
100 MHz differential clock
125 MHz single ended clock
2.5 Reset
When the MAC resets the XIO1100 (initial power on), the MAC must hold the XIO1100 in reset until power
and REFCLK to the XIO1100 are stable. The XIO1100 signals that RX_CLK is valid (RX_CLK has been
running at its operational frequency for at least one clock), and the XIO1100 is in the specified power state
by the de−assertion of PhyStatus. While Reset# is asserted, the MAC must have TxDetectRx/Loopback
de−asserted, TxElecIdle asserted, TxCompliance de−asserted, RxPolarity de−asserted, and PowerDown =
P1.
3
June 2006 Revised August 2011
SLLS690C
Description
2.6 Receiver Detection
While in the P1 power state, XIO1100 can be instructed to perform a receiver detection operation to determine
if there is a receiver at the other end of the link. The MAC requests XIO1100 to do a receiver detect sequence
by asserting TXDETECTRX/LOOPBACK high. Upon completion of the receiver detection operation, the
XIO1100 asserts PHY_STATUS high for one RX_CLK cycle. While PHY_STATUS is high, XIO1100 drives the
proper receiver status code onto the RX_STATUS[2:0] signals according to Table 2−2. After the receiver
detection has completed (as signaled by the assertion of PhyStatus), the MAC must de−assert
TxDetectRx/Loopback before initiating another receiver detection or a power state transition.
Table 2−2. RX_STATUS Loopback Detection Code
RX_STATUS[2:0]
RECEIVER STATUS
Receiver not present
Receiver present
000
011
NOTE: TX_DET_LOOPBACK must remain asserted until XIO1100 asserts the PHY_STATUS.
2.7 Receiver Clock Tolerance Compensation
The XIO1100 receiver contains an elastic buffer that compensates for differences in frequencies between bit
rates at the two ends of a link. The elastic buffer is capable of holding at least seven symbols to tolerate
worst-case differences (600ppm) in frequency and worst-case intervals between SKP ordered-sets, where
an SKP order-set is a set of symbols transmitted as a group. The first symbol of a SKP ordered-set is a COM
(0xBC) and is followed by three SKP (0x1C) symbols. The purpose of SKP ordered-sets is to allow the
receiving device (in this case, XIO1100) to adjust the data stream that is being received to prevent the elastic
buffer from either overflowing or underflowing due to any differences between the clocking frequencies of the
transmitting device and the receiving device. The XIO1100 monitors the data stream received at the RXP/RXN
differential pair for SKP ordered-sets.
When the XIO1100 detects that an SKP ordered-set is being received, it either adds or removes SKP symbols
from the data stream, depending on the current state of the elastic buffer. If the elastic buffer is in danger of
underflowing, SKP symbols are added to the ordered-set before it is loaded into the buffer. If the elastic buffer
is in danger of overflowing, SKP symbols are removed from the ordered-set before it is loaded into the buffer.
When the XIO1100 detects a SKP ordered-set, the XIO1100 asserts an Add SKP code (001b) on the
RX_STATUS[2:0] bus in the same RX_CLK cycle that it asserts the COM (0xBC) symbol on the
RX_DATA[15:0] bus, if it is adding a SKP symbol to the data stream. In the case of removing an SKP symbol,
the XIO1100 asserts the Remove SKP code (010b) to the RX_STATUS[2:0] when the COM symbol is
asserted.
2.8 Error Detection
If a detectable receive error occurs, the appropriate error code is asserted on the RX_STATUS[2:0] pins for
one RX_CLK cycle as close as possible to the point in the data stream where the error occurred. There are
four error conditions that can be encoded on the RXSTATUS signals. If more than one error happens to occur
on a received byte (or set of bytes transferred across a 16-bit interface), the errors are signaled with the
following priority:
•
•
•
•
8B/10B decode error
Elastic buffer overflow
Elastic buffer underflow
Disparity error
If an error occurs during a SKP ordered-set, such that the error code and the SKP code occur concurrently,
the error code has priority over the SKP code.
4
SLLS690C
June 2006 Revised August 2011
Description
2.8.1 8B/10B Decode Error
When XIO1100 detects an 8B/10B decode error, it asserts an EDB (0xFE) symbol in the data on the
RX_DATA[15:0] where the bad byte occurred (only the erroneous byte is replaced with the EDB symbol; the
other byte is still valid data). In the same RX_CLK clock cycle that the EDB symbol is asserted on the
RX_DATA[15:0] bus, the 8B/10B decode error code (100b) is asserted on the RX_STATUS[2:0] bus. Since
the 8B/10B decoding error has priority over all other receive error codes, it could mask out a disparity error
occurring on the other byte of data being clocked onto the RX_DATA[15:0] with the EDB symbol.
2.8.2 Elastic Buffer Overflow Error
When the elastic buffer overflows, data is lost during reception. XIO1100 generates an elastic buffer overflow
error when this occurs. The elastic buffer overflow error code (101b) is asserted on the RX_STATUS[2:0] on
the RX_CLK clock cycle that the omitted data would have been asserted. The remaining data asserted on the
RX_DATA[15:0]] bus is still valid data, but the elastic buffer overflow error code on the RX_STATUS[2:0] just
marks a discontinuity point in the data stream being received.
2.8.3 Elastic Buffer Underflow Error
When the elastic buffer underflows, EDB (0xFE) symbols are inserted into the data stream on the
RX_DATA[15:0] bus to fill the holes created by the gaps between valid data. For every RX_CLK clock cycle,
an EDB symbol is asserted on the RX_DATA[15:0] bus, and an elastic buffer underflow error code (111b) is
asserted on the RX_STATUS[2:0] bus.
2.8.4 Disparity Error
When the XIO1100 detects a disparity error, it asserts a disparity error code (111b) on the RX_STATUS[2:0]
bus in the same RX_CLK clock cycle that it asserts the erroneous data on the RX_DATA[15:0] bus. However,
it is not possible to discern which byte had the disparity error.
2.9 Loopback
The XIO1100 begins a loopback operation when the MAC asserts TX_DET_LOOPBACK while holding
TX_ELECIDLE de−asserted. The XIO1100 stops transmitting data to the TXP/TXN signaling pair from the
TI−PIPE interface and begins transmitting the data received at the RXP/RXN signaling pair on the TXP/TXN
signaling pair. This data is not routed through the 8B/10B coding/encoding paths. While in the loopback
operation, the received data is still sent to the RXDATA[15:0] bus of the TI−PIPE interface. The data sent to
the RXDATA[15:0] bus is routed through the 10B/8B decoder. The XIO1100 terminates the loopback operation
and returns to transmitting TXDATA[15:0] over the TXP/TXN signaling pair when the TX_DET_LOOPBACK
signal is de−asserted.
2.10 Electrical Idle
The XIO1100 expects the MAC to issue the required COM (K28.5) symbol and the required number of IDL
symbols (K28.3) on TXDATA[7:0] before asserting the TX_ELECTRICAL signal. The XIO1100 meets the
requirements of the Electrical Requirements of a PCI Express PHY (for these requirements, see Section
4.3.1.9, Electrical Idle, and Table B−2 in Appendix B of PCI Express Base Specification Revision 1.1).
2.11 Polarity Inversion
Polarity inversion can happen in many places in the receive chain, including somewhere in the serial path,
as symbols are placed into the elastic buffer or as symbols are removed from the elastic buffer. The XIO1100
inverts the data received on the RXP/RXN signaling pair when RxPolarity is asserted. The inverted data will
begin showing up on the RXDATA within 20 RX_CLKS of when RxPolarity is asserted.
2.12 Setting Negative Parity
To set the running disparity to negative, TxCompliance is asserted for one clock cycle that matches with the
data that is to be transmitted with negative disparity.
5
June 2006 Revised August 2011
SLLS690C
Description
2.13 Terminal Assignments
The XIO1100 is packaged in a 100-pin GGB BGA package. See Section 6 for GGB-package terminal diagram.
Table 2−3 lists the terminal assignments in terminal-number order with corresponding signal names for the
GGB package.
Table 2−4 lists the terminal assignments arranged in alphanumerical order by signal name with corresponding
terminal numbers for the GGB package.
Table 2−3. 100-pin GGB Signal Name Sorted by Terminal Number
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
SIGNAL
NAME
GGB
NUMBER
SIGNAL NAME
GGB
NUMBER
SIGNAL NAME
A3
A4
A5
A6
A7
A8
A9
A10
A11
B3
B4
B5
B6
B7
B8
B9
B10
B11
C1
C2
C4
C5
C6
C7
C8
RX_DATA8
RX_DATA9
RX_DATA11
RX_DATA13
RX_DATA15
RX_DATAK0
RESERVED
RESERVED
REFCLK−
C9
C10
C12
C13
D1
RESERVED
VSSA
G11
G12
G13
H1
VSSA
L6
L7
CLK_SEL
TXP
VDD_IO
RXN
TXN
L8
VSS
RXP
TX_DATA13
TX_DATA14
RX_VALID
VDD_33_COMB
VDDA_15
VDDA_15
TX_DATA11
TX_DATA12
VSS
L9
POWERDOWN1
DDR_EN
RX_DATA4
RX_DATA5
VSS
H2
L10
L12
L13
M3
M4
M5
M6
M7
M8
M9
M10
M11
N3
D2
H3
VDD_15_COMB
VDD_33_COM_IO
TX_DATA6
TX_DATA5
TX_DATA3
TX_DATA1
TX_DATAK1
TX_CLK
D3
H11
H12
H13
J1
D11
D12
D13
E1
VDDA_33
VSSA
RX_ELECIDLE
RX_DATA10
RX_DATA12
RX_DATA14
RX_DATAK1
RX_CLK
VSSA
RX_DATA2
RX_DATA3
RX_STATUS0
VDDA_15
VSSA
J2
E2
J3
E3
J11
J12
J13
K1
VSS
E11
E12
E13
F1
VDDA_33
VDDA_33
TX_DATA9
TX_DATA10
VDD_IO
VSSA
POWERDOWN0
P1_SLEEP
VREG_PD
RESERVED
RESERVED
REFCLK+
VDD_15
RX_DATA0
RX_DATA1
VDD_IO
VDD_15
VSS
K2
TX_DATA7
TX_DATA4
TX_DATA2
TX_DATA0
TX_DATAK0
TXCOMPLIANCE
TXELECIDLE
PHY_STATUS
RESETN
F2
K3
N4
RX_DATA7
RX_DATA6
VSS
F3
K11
K12
K13
L1
N5
F11
F12
F13
G1
R0
N6
R1
N7
VDD_IO
VSSA
TX_DATA8
VSS
N8
RX_POLARITY
VDD_15_CORE
VSS
RX_STATUS1
TX_DATA15
RX_STATUS2
L2
N9
G2
L4
VDD_15_CORE
N10
N11
G3
L5
TXDETECTRX/L
OOPBACK
6
SLLS690C
June 2006 Revised August 2011
Description
Table 2−4. 100-pin GGB Signal Name Sorted Alphabetically
SIGNAL NAME
GGB
SIGNAL NAME
GGB
SIGNAL NAME
GGB
SIGNAL NAME
GGB
NUMBER
NUMBER
NUMBER
NUMBER
CLK_SEL
L6
M10
L10
N10
M9
RX_DATA8
A3
A4
B4
A5
B5
A6
B6
A7
A8
B7
B3
C6
E3
G1
TX_DATA6
M3
N3
L1
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VDDA_15
VDDA_15
VDDA_15
VDDA_33
VDDA_33
VREG_PD
VSS
F3
K3
P1_SLEEP
DDR_EN
RX_DATA9
TX_DATA7
RX_DATA10
RX_DATA11
RX_DATA12
RX_DATA13
RX_DATA14
RX_DATA15
RX_DATAK0
RX_DATAK1
RX_ELECIDLE
RX_POLARITY
RX_STATUS0
RX_STATUS1
TX_DATA8
L7
PHY_STATUS
POWERDOWN0
POWERDOWN1
R0
TX_DATA9
K1
K2
J1
C5
TX_DATA10
TX_DATA11
TX_DATA12
TX_DATA13
TX_DATA14
TX_DATA15
TX_DATAK0
TX_DATAK1
TXCOMPLIANCE
H12
E11
H13
J13
D11
M11
D3
L9
K12
K13
A11
B11
B9
J2
R1
H1
H2
G2
N7
M7
N8
L5
REFCLK−
REFCLK+
RESERVED
RESERVED
RESERVED
RESERVED
A10
B10
A9
VSS
J3
VSS
L2
TXDETECTRX/
LOOPBACK
VSS
L8
RESERVED
/RESET
C9
N11
B8
F1
RX_STATUS2
RX_VALID
RXN
G3
H3
TXELECIDLE
TXN
N9
G13
G12
F11
E13
L12
L4
VSS
J11
F12
C8
VSS
RX_CLK
C12
C13
M8
N6
TXP
VSS
RX_DATA0
RX_DATA1
RX_DATA2
RX_DATA3
RX_DATA4
RX_DATA5
RX_DATA6
RX_DATA7
RXP
VDD_15
VSS
C4
F2
TX_CLK
VDD_15
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
K11
G11
F13
E12
D13
D12
C10
E1
E2
D1
D2
C2
C1
TX_DATA0
TX_DATA1
TX_DATA2
TX_DATA3
TX_DATA4
TX_DATA5
VDD_15_COMB
VDD_15_CORE
VDD_15_CORE
VDDA_33
M6
N5
C7
M5
N4
J12
L13
H11
VDD_33_COM_IO
VDD_33_COMB
M4
7
June 2006 Revised August 2011
SLLS690C
Description
2.14 Terminal Descriptions
Table 2−5 describes the XIO1100 terminals. The terminals are grouped by functionality.
Table 2−5. XIO1100 Terminals
TERMINAL
I/O
DESCRIPTION
NAME
NO.
PIPE INTERFACE
/RESET
N11
I
I
Reset the device. This signal is active low and asynchronous.
POWERDOWN[1:0]
L9, M9
Power State Control:
Value: Description
00: P0, normal operation (used for all Polling, Configuration, Recovery, Loop−back,
and Hot-Reset states, and the L0 state of the LTSSM)
01: P0s, low recovery time latency, power−saving state (used for the TX_L0s.idle
state of the LTSSM)
10: P1, longer recovery time (64μs max) latency, lower power state (used for the
disabled state, all detect states, and the L1.idle state of the LTSSM)
PHY_STATUS
TX_CLK
N10
M8
O
I
Used to communicate completion of several PHY functions, including power
management state transitions and receiver detection
Synchronous input clock for TX_DATA[15:0] and TX_DATAK[1:0] inputs
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_CLK is a SDR clock and TX_DATA[15:0] and TX_DATAK[1:0] are latched
on the rising edge of TX_CLK.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, TX_CLK is a DDR clock and TX_DATA[7:0] and TX_DATAK[0] are latched on
both the rising and the falling edge of TX_CLK.TX_DATA[15:8] and TX_DATAK[1]
are not used.
TX_DATA[15:0]
G2, H2, H1, J2,
J1, K2, K1, L1,
N3, M3, M4,
N4, M5, N5,
M6, N6
I
Parallel Data Transmit Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_DATA[15:0] is latched off the bus on the rising edge of TX_CLK.
TX_DATA[7:0] represents the first symbol and TX_DATA[15:8] represents the
second symbol to be transmitted over the TXN and TXP differential signal pair.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, TX_DATA[7:0] is latched off the bus on both edges of the TX_CLK.
TX_DATA[15:8] is not used and should be grounded. The data on TX_DATA[7:0]
during the rising edge of the clock represents the first symbol and data on
TX_DATA[7:0] during the falling edge of the clock represents the second symbol to
be transmitted over the TXN and TXP differential signal pair.
TX_DATAK[1:0]
M7, N7
I
Data/Control for the Parallel Data Transmit Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, TX_DATAK[0] corresponds to the TX_DATA[7:0] and TX_DATAK[1] to
TX_DATA[15:8].
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, the state of TX_DATAK[0] corresponds to the data on the TX_DATA[7:0] bus
during the same phase of the clock. TX_DATAK[1] is not used and should be
grounded.
A value of zero indicates that the corresponding TXDATA bits contain data
information; a value of one indicates that the corresponding TXDATA bits contain a
control byte.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of V
. If V
is 1.5 V, the TI−PIPE
DD_IO
DD_IO
interface operates at 1.5 V level. If V
is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
DD_IO
8
SLLS690C
June 2006 Revised August 2011
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
I/O
DESCRIPTION
Forces TXN/TXP outputs to electrical idle.
TX_ELECIDLE
N9
I
When de−asserting low while in P0 state (POWERDOWN[1:0] = 00), indicates that
valid data is on the TXDATA bus and that this data should be transmitted.
When asserted high while in P0s state (POWERDOWN[1:0] = 01), always asserted
for P0s state.
When asserted high while in P1 state (POWERDOWN[1:0] = 10), always asserted
for P1 state.
TX_COMPLIANCE
N8
I
Transmit Compliance Pattern
When asserted high, the XIO1100 sets the running disparity to negativity. Used
when transmitting the compliance pattern.
TX_DET_LOOPBACK
RX_CLK
L5
B8
I
Begin Receive Detect/Begin Loop−Back
Input to device to either begin a receive detect operation or enter loop−back mode.
O
Synchronous Output Clock for RX_DATA[15:0] and RX_DATAK[1:0] outputs
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, RX_CLK is a SDR clock, and RX_DATA[15:0] and RX_DATAK[1:0] are
latched on the rising edge of RX_CLK.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, RX_CLK is a DDR clock and RX_DATA[7:0] and RX_DATAK[0] are latched
on both the rising and falling edge of the RX_CLK. RX_DATA[15:8] and
RX_DATAK[1] are not used.
RX_CLK is also used as the internal PCLK for the XIO1100.
RX_DATA[15:0]
A7, B6, A6, B5,
A5, B4, A4, A3,
C1, C2, D2, D1,
E2, E1, F2, F1
O
Parallel Data Receive Bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, RX_DATA[15:0] is latched on the rising edge of the RX_CLK. RX_DATA[7:0]
represents the first symbol received, and RX_DATA[15:8] represents the second
symbol received from the RXN and RXP differential signal pair.
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, RX_DATA[7:0] is latched on both the rising edge and falling edge of the
RX_CLK. The data on RX_DATA[7:0] during the rising edge of the RX_CLK
represents the first symbol received, and the data on RX_DATA[7:0] during the
falling edge of the RX_CLK represents the second symbol received from the RXN
and RXP differential signal pair.
RX_DATA[15:8] is not used.
RX_DATAK[1:0]
B7, A8
O
Data/Control for the parallel data receive bus
If the DDR_EN signal is low during /RESET transitioning from a low state to a high
state, the state of RX_DATAK[0] corresponds to RX_DATA[7:0], and RX_DATAK[1]
corresponds to RX_DATA[15:8].
If the DDR_EN signal is high during /RESET transitioning from a low state to a high
state, the state of RX_DATA[0] corresponds to the data on RX_DATA[7:0] during the
same phase of the clock. RX_DATAK[1] is not used.
A value of zero indicates that the corresponding RXDATA bits contain data
information. A value of one indicates that the corresponding RXDATA bits contain a
control byte.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of V
. If V
is 1.5 V, the TI−PIPE
DD_IO
DD_IO
interface operates at 1.5 V level. If V
is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
DD_IO
9
June 2006 Revised August 2011
SLLS690C
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
I/O
DESCRIPTION
RX_STATUS[2:0]
G3, G1, E3
O
Encodes receiver status and error codes for the received data stream and receive
detection, as follows:
Value: Description
000: Received data ok
001: 1 SKP added
010: 1 SKP removed
011: Receiver detected
100: 8B/10B decode error
101: Elastic buffer overflow
110: Elastic buffer underflow
111: Receive disparity error
RX_VALID
H3
C6
O
I
Indicates symbol lock and valid data on RX_DATA[15:0] and RX_DATAK[1:0]
RX_POLARITY
Instructs the XIO1100 to perform polarity inversion on the RXN and RXP differential
signal pair. Asserting a high on this signal instructs the XIO1100 to perform the
polarity inversion.
RX_ELECIDLE
B3
O
I
Indicates receiver detection of an electrical idle of the RXP and RXN signal pair.
This is an asynchronous signal.
REFERENCE CLOCK PIN
REFCLK+
REFCLK−
B11
A11
The positive and negative terminals for the input reference clock. If CLK_SEL is low
during /RESET transitioning from low to high, a 100 MHz clock source has to be
applied to REFCLK+ and REFCLK−. If CLK_SEL is high during /RESET
transitioning from low to high, a 125 MHz clock source has to be applied to
REFCLK+. REFCLK− is not used and should be grounded.
R0
R1
K12
K13
I
Terminals for a 14.56KÙ 1% resistors (recommended 5.90K and 8.66K resistors in
series)
TRANSMIT AND RECEIVE PIN
TXP
TXN
RXP
G12
G13
C13
O
O
I
PCI express link differential pair TX positive terminal
PCI express link differential pair TX negative terminal
PCI express link differential pair RX positive terminal. The XIO1100 has integrated
50-Ω termination resistor to VSS on the RXP terminal, eliminating the need for
external components.
RXN
C12
M10
I
I
PCI express link differential pair RX negative terminal. The XIO1100 has integrated
50-Ω termination resistor to VSS on the RXN terminal, eliminating the need for
external components.
MISC
P1_SLEEP
P1 low-power enable.
This input, when asserted high, enables a low−power mode when the XIO1100
enters the P1 state. If the input is asserted when the power−down state is P1
(POWERDOWN[1:0] = 10), the device enters a low−power mode. In this mode, the
PLL is disabled and the RX_CLK is unavailable. The P1_SLEEP input must not be
asserted when the XIO1100 is in any state other than P1 state and the XIO1100
must not be transitioned out of the P1 state as long as P1_SLEEP is asserted.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of V
. If V
is 1.5 V, the TI−PIPE
DD_IO
DD_IO
interface operates at 1.5 V level. If V
is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
DD_IO
10
SLLS690C
June 2006 Revised August 2011
Description
Table 2−5. XIO1100 Terminals (Continued)
TERMINAL
L6
I/O
DESCRIPTION
CLK_SEL
I
Clock Select
This input, when asserted low during /RESET transitioning from low to high, selects
the 100 MHz differential clock source. A 100MHz clock source has to be applied to
REFCLK+ and REFCLK−.
This input, when asserted high during /RESET transitioning to high, selects the
125 MHz single ended clock source. A 125 MHz clock source has to be applied to
REFCLK+. REFCLK− has to be connected to VSS.
VREG_PD
DDR_EN
M11
L10
I
I
This pin must be pulled to GND during normal operation.
DDR_EN
This input, when asserted high during /RESET transitioning to low state to high
state, defines the TI−PIPE interface to be a 8−bit DDR interface; otherwise, it is an
16-bit SDR interface.
Value: Description
1: DDR_EN is an 8−bit DDR interface
0: DDR_EN is a 16−bit SDR interface
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
B9
RESERVED
A10
B10
A9
RESERVED
RESERVED
RESERVED
C9
RESERVED. This pin needs to be pulled to GND during normal operation.
POWER SUPPLY TERMINALS
VDD_15
E13, F11
PWR
PWR
PWR
PWR
1.5−V digital power supply.
1.5−V core voltage.
VDD_15_CORE
VDDA_15
C7, L4
E11, H12, H13
L12
1.5−V analog power supply.
VDD_15_COMB
1.5−V main power output. It should be connected to a filter network of 0.01μF, 1μF,
and 1000pF capacitors.
VDDA_33
D11, J12, J13
H11
PWR
PWR
3.3−V analog power supply.
VDD_33_COMB
3.3−V main output. It should be connected to a filter network of 0.01μF, 1μF, and
1000pF capacitors.
VDD_33_COMB_IO
VDD_IO
L13
PWR
PWR
GND
3.3−V I/O output. It should be connected to a filter network of 0.01μF, 1μF, and
1000pF capacitors.
C5, F3, K3, L7
Power supply for digital I/O. Can be either 1.5 V or 1.8 V depending on desired
signaling level.
VSS
D3, J3, L2, L8,
J11, F12, C4,
C8
Digital ground.
VSSA
K11, G11, F13,
E12, D13, D12,
C10
GND
Analog ground.
NOTE: The TI−PIPE interface can operate at either 1.5 V or 1.8 V, depending on the voltage level of V
. If V
is 1.5 V, the TI−PIPE
DD_IO
DD_IO
interface operates at 1.5 V level. If V
is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
DD_IO
11
June 2006 Revised August 2011
SLLS690C
Electrical Characteristics
3
Electrical Characteristics
3.1 Absolute Maximum Ratings†
Supply voltage range: 3.3 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V
1.8 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 1.95 V
1.5 V Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 1.65 V
Input voltage range,
V : PCI Express (RX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.6 V to 0.6 V
I
V : PCI Express REFCLK (single-ended) . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
DD_15
I
DDA_33
V : PCI Express REFCLK (differential) . . . . . . . . . . . . . . . –0.5 V toV
I
Input clamp current, (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
I
I
DD
Output clamp current, (V < 0 or V > V ) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
O
O
DD
Human body model (HBM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1500 V
Charged device model (CDM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
†
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Applies for external input and bidirectional buffers. V < 0 or V > V
.
I
I
DD
2. Applies to external output and bidirectional buffers. V < 0 or V > V
.
O
O
DD
3.1.1 Current Consumption
MODE
TX
on
RX
on
VDDIO
89
VDD15
102
81
VDD33
5.4
UNITS
mA
L0
idle
on
89
1.3
mA
on
idle
idle
idle
idle
66
93
4.3
mA
L0s
L1
idle
66
72
1.3
mA
on
66
94
4.3
mA
idle
65
72
1.3
mA
L1_sleep
75
10
1.3
mA
3.2 Recommended Operating Conditions
OPERATION
MIN
NOM
MAX
UNIT
V
V
V
V
V
V
DD_15
Supply voltage
1.5 V
1.35
1.5
1.65
V
DDA_15
DD_15_CORE
DDA_33
Supply voltage
3.3 V
1.5V
1.8V
3
1.35
1.65
0
3.3
1.5
1.8
25
3.6
1.65
1.95
70
V
V
(1.5 V)
(1.8 V)
Supply voltage (I/O)
DD_IO
DD_IO
Supply voltage (I/O)
V
T
A
Operating ambient temperature range
Virtual junction temperature (Note 3)
°C
°C
T
0
25
115
J
NOTES: 3. The junction temperature reflects simulated conditions. The customer is responsible for verifying junction temperature.
NOTE: The TI−PIPE interface can operate either at 1.5 V or 1.8 V, depending on the voltage level of V . If V is 1.5 V, the TI−PIPE
DD_IO
DD_IO
interface operates at 1.5 V level. If V
is 1.8 V, the TI−PIPE interface operates at 1.8 V level.
DD_IO
12
SLLS690C
June 2006 Revised August 2011
Electrical Characteristics
3.3 PCI Express Differential Transmitter Output Ranges
PARAMETER
TERMINALS
MIN
NOM
MAX
UNIT
COMMENTS
UI
Unit interval
TXP, TXN
399.88
400 400.12
ps
Each UI is 400 ps 300 ppm. UI does not account for
SSC−dictated variations.
See Note 4.
V
TXP, TXN
TXP, TXN
0.8
1.2
V
V
= 2*|V
− V
|
TX–DIFFp–p
TX–DIFFp–p
TXP
TXN
Differential peak–to–
peak output voltage
See Note 5.
V
De–em-
−3.0
−3.5
−4.0
dB
This is the ratio of the V
of the second and
TX–DIFFp–p
TX–DE–RATIO
phasized differential
output voltage (ratio)
following bits after a transition divided by the
of the first bit after a transition.
V
TX–DIFFp–p
See Note 5.
T
TXP, TXN
TXP, TXN
0.75
UI
UI
The maximum transmitter jitter can be derived as
TX–EYE
Minimum TX eye width
T
= 1 − T = 0.3 UI
TXMAX– JITTER
TX–EYE
See Notes 5 and 6.
T
0.15
Jitter is defined as the measurement variation of the
crossing points (V = 0 V) in relation to recov-
TX–EYE–MEDIAN–to–
MAX–JITTER
TX–DIFFp–p
Maximum time between
ered TX UI. A recovered TX UI is calculated over 3500
consecutive UIs of sample data. Jitter is measured us-
ing all edges of the 250 consecutive UIs in the center of
the 3500 UIs used for calculating the TX UI.
the jitter median and
maximum deviation
from the median
See Notes 5 and 6.
T
T
,
TXP, TXN
0.125
UI
See Notes 5 and 8.
TX–RISE
TX–FALL
P/N TX output rise/fall
time
V
TXP, TXN
TXP, TXN
20
mV
mV
V
V
= RMS(|V
+ V
|/2 – V
)
TX–CM–ACp
TX–CM–ACp
TXP
TXN
TX–CM–DC
RMS ac peak common
mode output voltage
= DC
of |V
+ V |/2
TXN
TX–CM–DC
(avg)
TXP
See Note 5.
V
0
0
100
|V
– V
| ≤ 100 mV
TX–CM–Idle–DC
TX–CM–DC–ACTIVE–
TX–CM–DC
IDLE–DELTA
V
V
= DC
of |V
+ V |/2 [during L0]
TXN
TX–CM–DC
(avg)
TXP
Absolute delta of dc
common mode voltage
during L0 and electrical
idle.
= DC
of |V
+ V
|/2 [during
TX–CM–Idle–DC
(avg)
TXP
TXN
electrical idle]
See Note 5.
V
TXP, TXN
25
mV
|V
– V
| ≤ 25 mV when
TXN–CM–DC
TX–CM–DC–LINE–DELTA
TXP–CM–DC
Absolute delta of dc
common mode voltage
between P and N
V
V
= DC
= DC
of |V
of |V
|
TXP
TXP–CM–DC
TXN–CM–DC
(avg)
(avg)
|
TXN
See Note 5.
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A T
= 0.75 UI provides for a total sum of deterministic and random jitter budget of T
= 0.25 UI for the
TX–EYE
TX–JITTER–MAX
transmitter collected over any 250 consecutive TX UIs. The T
specification ensures a jitter
TX–EYE–MEDIAN–to–MAX–JITTER
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors C is optional for the return loss measurement.
TX
8. Measured between 20% and 80% at transmitter package terminals into a test load for both V
and V
TXN
TXP
13
June 2006 Revised August 2011
SLLS690C
Electrical Characteristics
PARAMETER
TERMINALS
MIN
NOM
MAX
UNIT
COMMENTS
− V
V
TXP, TXN
0
20
mV
V
= |V
| ≤ 20 mV
TXN–Idle
TX–IDLE–DIFFp
TX–IDLE–DIFFp
TXP–Idle
Electrical idle differen-
tial peak output voltage
See Note 5.
V
TXP, TXN
600
mV
The total amount of voltage change that a transmitter
can apply to sense whether a low impedance receiver is
present.
TX–RCV–DETECT
The amount of voltage
change allowed during
receiver detection
V
TXP, TXN
TXP, TXN
TXP, TXN
0
3.6
90
V
mA
UI
The allowed dc common mode voltage under any con-
dition.
TX–DC–CM
The TX dc common
mode voltage
I
Total current the transmitter can provide when shorted
to its ground
TX–SHORT
TX short circuit current
limit
T
50
Minimum time a transmitter must be in electrical Idle.
Utilized by the receiver to start looking for an electrical
idle exit after successfully receiving an electrical idle
ordered set.
TX–IDLE–MIN
Minimum time spent in
electrical idle
T
TXP, TXN
TXP, TXN
20
20
UI
UI
After sending an electrical idle ordered set, the transmit-
ter must meet all electrical idle specifications within this
time. This is considered a debounce time for the trans-
mitter to meet electrical idle after transitioning from L0.
TX–IDLE–SET–to–IDLE
Maximum time to
transition to a valid
electrical idle after
sending an electrical
idle ordered set
T
Maximum time to meet all TX specifications when tran-
sitioning from electrical idle to sending differential data.
This is considered a debounce time for the TX to meet
all TX specifications after leaving electrical idle.
TX–IDLE–to–DIFF–DATA
Maximum time to
transition to valid TX
specifications after
leaving an electrical idle
condition
RL
TXP, TXN
TXP, TXN
10
6
dB
dB
Measured over 50 MHz to 1.25 GHz. See Note 7.
Measured over 50 MHz to 1.25 GHz. See Note 7.
TX–DIFF
Differential return loss
RL
TX–CM
Common mode return
loss
Z
TXP, TXN
80
100
120
Ω
TX dc differential mode low impedance
TX–DIFF–DC
DC differential TX
impedance
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A T
= 0.75 UI provides for a total sum of deterministic and random jitter budget of T
= 0.25 UI for the
TX–EYE
TX–JITTER–MAX
transmitter collected over any 250 consecutive TX UIs. The T
specification ensures a jitter
TX–EYE–MEDIAN–to–MAX–JITTER
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors C is optional for the return loss measurement.
TX
8. Measured between 20% and 80% at transmitter package terminals into a test load for both V
and V
TXN
TXP
14
SLLS690C
June 2006 Revised August 2011
Electrical Characteristics
PARAMETER
TERMINALS
MIN
NOM
MAX
UNIT
COMMENTS
Z
TXP, TXN
40
Ω
Required TXP as well as TXN dc impedance during all
states
TX–DC
Transmitter dc imped-
ance
C
TXP, TXN
75
200
nF
All transmitters are ac–coupled and are required on the
PWB.
TX
AC coupling capacitor
NOTES: 4. No test load is necessarily associated with this value.
5. Specified at the measurement point into a timing and voltage compliance test load and measured over any 250 consecutive TX
UIs.
6. A T
= 0.75 UI provides for a total sum of deterministic and random jitter budget of T
= 0.25 UI for the
TX–EYE
TX–JITTER–MAX
transmitter collected over any 250 consecutive TX UIs. The T
specification ensures a jitter
TX–EYE–MEDIAN–to–MAX–JITTER
distribution in which the median and the maximum deviation from the median is less than half of the total TX jitter budget collected
over any 250 consecutive TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the
point in time where the number of jitter points on either side is approximately equal, as opposed to the averaged time value.
7. The transmitter input impedance results in a differential return loss greater than or equal to 12 dB and a common mode return
loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to
all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the P and N lines. Note
that the use of the series capacitors C is optional for the return loss measurement.
TX
8. Measured between 20% and 80% at transmitter package terminals into a test load for both V
and V
TXN
TXP
3.4 PCI Express Differential Receiver Input Ranges
PARAMETER
TERMINALS
MIN
NOM
MAX UNIT
COMMENTS
UI
Unit interval
RXP, RXN
399.88
400 400.12
ps
V
Each UI is 400 ps 300 ppm. UI does not account
for SSC−dictated variations.
See Note 9.
V
RXP, RXN
RXP, RXN
0.175
0.4
1.200
V
= 2*|V
− V
|
RX–DIFFp–p
RX–DIFFp–p
RXP
RXN
Differential input peak–to–peak
voltage
See Note 10.
T
UI
The maximum interconnect media and transmitter
RX–EYE
jitter that can be tolerated by the receiver is derived
as
Minimum receiver eye width
T
= 1 − T
= 0.6 UI.
RX–MAX–JITTER
RX–EYE
See Notes 10 and 11.
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A T
= 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
RX–EYE
collected any 250 consecutive UIs. The T
specification ensures a jitter distribution in which the
RX–EYE–MEDIAN–to–MAX–JITTER
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors C is optional for the return loss measurement.
TX
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
15
June 2006 Revised August 2011
SLLS690C
Electrical Characteristics
PARAMETER
TERMINALS
MIN
NOM
MAX UNIT
COMMENTS
T
RXP, RXN
0.3
UI
Jitter is defined as the measurement variation of the
RX–EYE–MEDIAN–to–MAX–JITTER
crossing points (V
= 0 V) in relation to
RX–DIFFp–p
Maximum time between the
jitter median and maximum
deviation from the median
recovered TX UI. A recovered TX UI is calculated
over 3500 consecutive UIs of sample data. Jitter is
measured using all edges of the 250 consecutive
UIs in the center of the 3500 UIs used for calculating
the TX UI.
See Notes 10 and 11.
V
RXP, RXN
RXP, RXN
150
mV
dB
V
V
= RMS(|V
+ V
|/2 – V
)
RX–CM–ACp
RX–CM–ACp
RXP
RXN
RX–CM–DC
AC peak common mode input
voltage
= DC
of |V
+ V |/2
RXN
RX–CM–DC
(avg)
RXP
See Note 10.
RL
10
6
Measured over 50 MHz to 1.25 GHz with the P and
N lines biased at +300 mV and −300 mV, respective-
ly.
RX–DIFF
Differential return loss
See Note 12.
RL
RXP, RXN
dB
Measured over 50 MHz to 1.25 GHz with the P and
RX–CM
N lines biased at +300 mV and −300 mV, respective-
ly.
Common mode return loss
See Note 12.
Z
RXP, RXN
RXP, RXN
80
40
100
50
120
60
Ω
Ω
RX dc differential mode impedance.
See Note 13.
RX–DIFF–DC
DC differential input impedance
Z
Required RXP as well as RXN dc impedance (50 Ω
20% tolerance).
RX–DC
DC input impedance
See Notes 10 and 13.
Z
RXP, RXN
200k
Ω
Required RXP as well as RXN dc impedance when
the receiver terminations do not have power.
RX–HIGH–IMP–DC
Powered−down dc input
impedance
See Note 14.
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A T
= 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
RX–EYE
collected any 250 consecutive UIs. The T
specification ensures a jitter distribution in which the
RX–EYE–MEDIAN–to–MAX–JITTER
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors C is optional for the return loss measurement.
TX
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
16
SLLS690C
June 2006 Revised August 2011
Electrical Characteristics
PARAMETER
TERMINALS
MIN
NOM
MAX UNIT
COMMENTS
= 2*|V
V
RXP, RXN
65
175
mV
V
− V | measured
RXN
RX–IDLE–DET–DIFFp–p
RX–IDLE–DET–DIFFp–p
RXP
at the receiver package terminals
Electrical idle detect threshold
T
RXP, RXN
10
ms
An unexpected electrical idle (V
<
RX–DIFFp–p
RX–IDLE–DET–DIFF–ENTER–TIME
V
) must be recognized no lon-
RX–IDLE–DET–DIFFp–p
Unexpected electrical idle enter
detect threshold integration
time
ger than T
unexpected idle condition.
to signal an
RX–IDLE–DET–DIFF–ENTER–TIME
NOTES: 9. No test load is necessarily associated with this value.
10. Specified at the measurement point and measured over any 250 consecutive UIs. A test load must be used as the RX device when
taking measurements. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from
3500 consecutive UI is used as a reference for the eye diagram.
11. A T
= 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect
RX–EYE
collected any 250 consecutive UIs. The T
specification ensures a jitter distribution in which the
RX–EYE–MEDIAN–to–MAX–JITTER
median and the maximum deviation from the median is less than half of the total UI jitter budget collected over any 250 consecutive
TX UIs. It must be noted that the median is not the same as the mean. The jitter median describes the point in time where the
number of jitter points on either side is approximately equal, as opposed to the averaged time value. If the clocks to the RX and
TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UIs must be used as the reference
for the eye diagram.
12. The receiver input impedance results in a differential return loss greater than or equal to 15 dB with the P line biased to 300 mV
and the N line biased to −300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency
range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for
return loss measurements is 50 Ω to ground for both the P and N line (i.e., as measured by a Vector Network Analyzer with 50–Ω
probes). The use of the series capacitors C is optional for the return loss measurement.
TX
13. Impedance during all link training status state machine (LTSSM) states. When transitioning from a PCI Express reset to the detect
state (the initial state of the LTSSM), there is a 5–ms transition time before receiver termination values must be met on the
unconfigured lane of a port.
14. The RX dc common mode impedance that exists when no power is present or PCI Express reset is asserted. This helps ensure
that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be measured at
300 mV above the RX ground.
17
June 2006 Revised August 2011
SLLS690C
Electrical Characteristics
3.5 Express Differential Reference Clock Input Ranges
PARAMETER
TERMINALS
MIN
NOM
100
MAX
UNIT
COMMENTS
f
REFCLK+
MHz
The input frequency is 100 MHz + 300 ppm and
IN–DIFF
− 2800 ppm including SSC–dictated variations.
Differential input fre-
quency
REFCLK−
f
REFCLK+
125
MHz
V
The input frequency is 125 MHz + 300 ppm and
− 300 ppm.
IN–SE
Single–ended input
frequency
V
REFCLK+
0.175
1.200
V
= 2*|V
− V
|
RX–DIFFp–p
RX–DIFFp–p
REFCLK+
REFCLK−
Differential input
peak–to–peak voltage
REFCLK−
V
V
V
REFCLK+
REFCLK+
0.7 V
V
V
V
Single–ended, reference clock mode high-level
input voltage
IH–SE
DD_33
DD_33
0
0.3 V
Single–ended, reference clock mode low-level
input voltage
IL–SE
DD_33
REFCLK+
140
mV
V
V
= RMS(|V
+ V |/2 –
REFCLK−
RX–CM–ACp
RX–CM–ACp
REFCLK+
)
RX–CM–DC
AC peak common
mode input voltage
REFCLK−
V
= DC
of |V
+ V
|/2
RX–CM–DC
(avg)
REFCLK+
REFCLK−
Duty cycle
REFCLK+
40%
60%
Differential and single–ended waveform input duty
cycle
REFCLK−
Z
REFCLK+
20
20
kΩ
kΩ
REFCLK+/− dc differential mode impedance
RX–DIFF–DC
DC differential input
impedance
REFCLK−
Z
REFCLK+
REFCLK+ dc single–ended mode impedance
RX–DC
DC input impedance
REFCLK−
NOTE 15: The XIO1100 is compliant with the defined system jitter models for a PCI–Express reference clock and associated TX/RX link. These
system jitter models are described in the PCI–Express Jitter Modeling, Revision 1.0RD document. Any usage of the XIO1100 in a system
configuration that does not conform to the defined system jitter models requires the system designer to validate the system jitter budgets.
18
SLLS690C
June 2006 Revised August 2011
Electrical Characteristics
3.6 Electrical Characteristics Over Recommended Operating Conditions (VDD_IO
)
TEST
PARAMETER
OPERATION
MIN
TYP
MAX
UNIT
CONDITIONS
V
V
V
V
High-level input voltage (Note 16)
Low-level input voltage (Note 16)
Input voltage
V
V
0.7 V
V
0.3 V
V
V
V
IH
IL
I
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
0
0
0
0
V
Output voltage (Note 17)
V
V
O
DD_IO
t
Input transition time (t
and t )
fall
25
ns
V
T
rise
V
V
High-level output voltage
Low-level output voltage
High−level output current
Low−level output current
V
V
I
I
= −8 mA
0.8 V
OH
OL
DD_IO
DD_IO
OH
OL
DD_IO
= 8 mA
0.22 V
V
DD_IO
I
I
I
−8
mA
mA
μA
OH
8
OL
OZ
High-impedance, output current
(Note 17)
V
V
V = 0 to V
20
1
DD_IO
DD_IO
I
DD_IO
I
Input current (Note 18)
V = 0 to V
μA
I
I
DD_IO
NOTES: 16. Applies to external inputs and bidirectional buffers.
17. Applies to external outputs and bidirectional buffers.
18. Applies to external input buffers.
3.7 Implementation−Specific Timing
TIMING
Transmit
DESCRIPTION
NORM
MAX
Time for data moving between the parallel interface and the PCI Express serial lines. Timing is
measured from when the data is transferred across the parallel interface (i.e., the rising edge of
TX_CLK) and when the first bit of the equivalent 10−bit symbol is transmitted on the Tx+/Tx−
serial lines.
29.2 ns
77.2 ns
25.2 ns
33.2 ns
93.2 ns
29.2 ns
Latency
Receive
Latency
Time for data moving between the parallel interface and the PCI Express serial lines. Timing is
measured from when the first bit of a 10−bit symbol is available on the Rx+/Rx− serial lines to
when the corresponding 8−bit data is transferred across the parallel interface (i.e., the rising
edge of RX_CLK).
Loopback
Amount of time that the XIO1100 requires to begin looping back receive data. Duration is from
Enable Latency
when TxDetectRx/Loopback is asserted until the receive data is being transmitted on the serial
pins.
N_FTS with
Common Clock
Number of FTS ordered sets required by the receiver to obtain reliable bit and symbol lock when
operating with a common clock.
23
23
N_FTS without
Common Clock
Number of FTS ordered sets required by the receiver to obtain reliable bit and symbol lock when
operating without a common clock.
255
255
XIO1100 Lock
Time
Amount of time required for the XIO1100 receiver to obtain reliable bit and symbol lock after
valid TSx ordered−sets are present at the receiver.
2.0 μs
28.0 ns
4.0 μs
32.0 ns
P0s to P0
Transitioning
Time
Amount of time required for the XIO1100 to return to the P0 state after having been in the P0s
state. Time is measured from when the MAC sets the PowerDown signals to P0 until the
XIO1100 asserts PhyStatus. The XIO1100 asserts PhyStatus when it is ready to begin data
transmission and reception.
P1 to P0
Transitioning
Time
Amount of time required for the XIO1100 to return to the P0 state after having been in the P1
state. Time is measured from when the MAC sets the PowerDown signals to P0 until the
XIO1100 asserts PhyStatus. The XIO1100 asserts PhyStatus when it is ready to begin data
transmission and reception.
28.0 ns
10.0 ns
32.0 ns
11.0 ns
Reset to Ready
Time
Timed from when Reset# is de−asserted until the XIO1100 de−asserts PHY_STATUS.
19
June 2006 Revised August 2011
SLLS690C
Timing Diagrams
4
Timing Diagrams
TI−PIPE Input Timing
tcyc
TX_CLK
TxData[7:0] (DDR mode)
TxDataK[0] (DDR mode)
tfsu
trsu
tfh
tfh
TxData[15:0] (SDR mode)
TxDataK[1:0] (SDR mode)
TxDetectRx/Loopback
TxElecIdle
TxCompliance
RxPolarity
PowerDown[1:0]
trsu
tfh
Figure 4−1. TI−PIPE Input Timing
PARAMETER
DESCRIPTION
VALUE
tcyc
trsu
trh
Period, TX_CLK
8 ns (TYP)
Input Setup to TX_CLK rising
Input Hold from TX_CLK rising
Input Setup to TX_CLK falling
Input Hold from TX_CLK falling
1.3 ns (MAX)
0.1 ns (MIN)
1.3 ns (MAX)
0.1 ns (MIN)
tfsu
tfh
20
SLLS690C
June 2006 Revised August 2011
Timing Diagrams
TI−PIPE Data Output Timing
tcyc
RX_CLK
RxData[7:0] (DDR mode)
RxDataK[0] (DDR mode)
trco
tfh
tfh
tfco
RxData[15:0] (SDR mode)
RxDataK[1:0] (SDR mode)
RxValid
PhyStatus
RxElecIdle
RxStatus[2:0]
trco
tfh
Figure 4−2. TI−PIPE Data Output Timing
PARAMETER
DESCRIPTION
VALUE
tcyc
trco
trh
Period, RX_CLK
8.0 ns (TYP)
2.0 ns (MAX)
0.7 ns (MIN)
2.0 ns (MAX)
0.7 ns (MIN)
Clock to output, RX_CLK rising
Output hold, RX_CLK rising
Clock to output, RX_CLK falling
Output hold, RX_CLK falling
tfco
tfh
21
June 2006 Revised August 2011
SLLS690C
Timing Diagrams
TI−PIPE Output Functional Timing
RX_CLK
RxData[7:0] (DDR mode)
RxDataK[0] (DDR mode)
SYMBOL (N)
SYMBOL (N+1)
RxData[15:0] (SDR mode)
RxDataK[1:0] (SDR mode)
RxData[7:0] − SYMBOL (N)
RxData[15:8] − SYMBOL (N+1)
RxValid
PhyStatus
RxElecIdle
RxStatus[2:0]
Figure 4−3. TI−PIPE Output Functional Timing
22
SLLS690C
June 2006 Revised August 2011
Timing Diagrams
TI−PIPE Input Functional Timing
TX_CLK
TxData[7:0] (DDR mode)
TxDataK[0] (DDR mode)
SYMBOL (N)
SYMBOL (N+1)
TxData[15:0] (SDR mode)
TxDataK[1:0] (SDR mode)
TxData[7:0] − SYMBOL (N)
TxData[15:8] − SYMBOL (N+1)
TxDetectRx/Loopback
TxElecIdle
TxCompliance
RxPolarity
PowerDown[1:0]
Figure 4−4. TI−PIPE Input Functional Timing
23
June 2006 Revised August 2011
SLLS690C
Application Information
5
Application Information
5.1 Component Connection
Details regarding connection of components to the various terminals of the XIO1100 are discussed primarily
in entries for each terminal in the terminal functions table.
3.3VA
1.5VA
1.5VD
1.5V_1.8VD
C1
C2
C3
1uF
0.01uF
1000pF
TXN
TXP
U1
G13
G12
TXN
TXP
H11
L13
L12
VDD_33_COMB
VDD_33_COM_IO
VDD_15_COMB
C4
1uF
C5
0.01uF
C6
1000pF
C12
C13
RXN
RXP
RXN
RXP
A11
B11
REFCLKN
REFCLKP
REFCLKN
REFCLKP
C7
C8
C9
L6
5.90K (1%) K12
8.66K (1%) K13
1uF
0.01uF
1000pF
CLK_SEL
CLK_SEL (0=100MHz Diff 1=125MHz Single)
R1
R2
R0
R1
B8
RX_CLK
RX_CLK
F1
F2
E1
E2
D1
D2
C2
C1
A3
A4
B4
A5
B5
A6
B6
A7
RX_DATA0
RX_DATA1
RX_DATA2
RX_DATA3
RX_DATA4
RX_DATA5
RX_DATA6
RX_DATA7
RX_DATA8
RX_DATA9
RX_DATA10
RX_DATA11
RX_DATA12
RX_DATA13
RX_DATA14
RX_DATA15
RX_DATA0
RX_DATA1
RX_DATA2
RX_DATA3
RX_DATA4
RX_DATA5
RX_DATA6
RX_DATA7
RX_DATA8
RX_DATA9
RX_DATA10
RX_DATA11
RX_DATA12
RX_DATA13
RX_DATA14
RX_DATA15
N11
M10
M9
L9
L10
RESETN
P1_SLEEP
POWERDOWN0
POWERDOWN1
DDR_EN
RESETN
P1_SLEEP
POWERDOWN0
POWERDOWN1
DDR_EN (1=8bit 0=16bit)
M8
TX_CLK
TX_CLK
N6
M6
N5
M5
N4
M4
M3
N3
L1
TX_DATA0
TX_DATA1
TX_DATA2
TX_DATA3
TX_DATA4
TX_DATA5
TX_DATA6
TX_DATA7
TX_DATA8
TX_DATA9
TX_DATA10
TX_DATA11
TX_DATA12
TX_DATA13
TX_DATA14
TX_DATA15
TX_DATA0
TX_DATA1
TX_DATA2
TX_DATA3
TX_DATA4
TX_DATA5
TX_DATA6
TX_DATA7
TX_DATA8
TX_DATA9
TX_DATA10
TX_DATA11
TX_DATA12
TX_DATA13
TX_DATA14
TX_DATA15
A8
B7
RX_DATAK0
RX_DATAK1
RX_DATAK0
RX_DATAK1
K1
K2
J1
E3
G1
G3
RX_STATUS0
RX_STATUS1
RX_STATUS2
RX_STATUS0
RX_STATUS1
RX_STATUS2
J2
H1
H2
G2
H3
RX_VALID
RX_ELECIDLE
PHYSTATUS
RX_VALID
RX_ELECIDLE
PHYSTATUS
B3
N7
M7
N10
TX_DATAK0
TX_DATAK1
TX_DATAK0
TX_DATAK1
A9
RSVD
RSVD
RSVD
RSVD
RSVD
N8
L5
N9
C6
B10
A10
B9
TXCOMPLIANCE
TXDETECTRX
TXELECIDLE
TXCOMPLIANCE
TXDETECTRX / LOOPBACK
TXELECIDLE
C9
RX_POLARITY
RX_POLARITY
XIO1100GGB
Figure 5−1. External Component Connections
Figure 5−1 does not show the decoupling capacitors for the power supplies. Texas Instruments recommends
using at least one 0.1 μF capacitor for each power supply pin. In addition to the 0.1 μF capacitor, Texas
Instruments recommends adding 0.01 μF and 0.001 μF capacitors for each analog power supply pin. Texas
Instruments also recommends isolating the analog power from the digital power.
24
SLLS690C
June 2006 Revised August 2011
Application Information
5.2 XIO1100 Component Placement
The filter network on VDD_33_COMB, VDD_33_COMB_IO, and VDD_15_COMB needs to be placed as
close as possible to each pin (specifically H11, L13, and L12). It is recommended that the trace width for these
three pins be at least 10 mils.
The R0 and R1 terminals connect to an external resistor to set the drive current for the PCI Express TX driver.
The recommended resistor value is 14,560-Ω with 1% tolerance. A 14,560-Ω resistor is a custom value. To
eliminate the need for a custom resistor, two series resistors are recommended: a 5,900-Ω 1% resistor and
an 8,660-Ω 1% resistor. Trace lengths must be kept short to minimize noise coupling into the reference resistor
terminals.
5.3 Power Supply Filtering Recommendations
To meet the PCI Express jitter specifications, low-noise power supplies are required on several of the XIO1100
voltage terminals. The power terminals that require low-noise power include VDDA_15 and VDDA_33. This
section provides guidelines for the filter design to create low-noise power sources.
The least expensive solution for low-noise power sources is to filter existing 3.3 V and 1.5 V power supplies.
This solution requires analysis of the noise frequencies present on the power supplies. The XIO1100 has
external interfaces operating at clock rates of 100 MHz, 125 MHz, 250 MHz, and 2.5 GHz. Other devices
located near the XIO1100 may produce switching noise at different frequencies. Also, the power supplies that
generate the 3.3 V and 1.5 V power rails may add low frequency ripple noise. Linear regulators have feedback
loops that typically operate in the 100 kHz range. Switching power supplies typically have operating
frequencies in the 500 kHz range. When analyzing power supply noise frequencies, the first, third, and fifth
harmonic of every clock source should be considered.
Critical analog circuits within the XIO1100 must be shielded from this power-supply noise. The fundamental
requirement for a filter design is to reduce power-supply noise to a peak-to-peak amplitude of less than 25 mV.
This maximum noise amplitude should apply to all frequencies from 0 Hz to 12.5 GHz.
The following information should be considered when designing a power supply filter:
1. Ideally, the series resonance frequency for each filter component should be greater than the fifth harmonic
of the maximum clock frequency. With a maximum clock frequency of 1.25 GHz, the third harmonic is
3.75 GHz and the fifth harmonic is 6.25 GHz. Finding inductors and capacitors with a series resonance
frequency above 6.25 GHz is both difficult and expensive. Components with a series resonance frequency
in the 4 to 6 GHz range are a good compromise.
2. The inductor(s) associated with the filter must have a dc resistance low enough to pass the required
current for the connected power terminals. The voltage drop across the inductor must be low enough to
meet the minus 10% voltage margin requirement associated with each XIO1100 power terminal. Power
supply output voltage variation must be considered, as well as voltage drops associated with any
connector pins and circuit board power distribution geometries.
3. The Q versus frequency curve associated with the inductor must be appropriate to reduce power terminal
noise to less than the maximum peak−to−peak amplitude requirement for the XIO1100. Recommending
a specific inductor is difficult, because every system design is different and therefore the noise frequencies
and noise amplitudes are different. Many factors influence the inductor selection for the filter design.
Power supplies must have adequate input and output filtering. A sufficient number of bulk and bypass
capacitors is required to minimize switching noise. Assuming that board level power is properly filtered
and minimal low frequency noise is present, frequencies less than 10 MHz, an inductor with a Q greater
than 20 from approximately 10 MHz to 3 GHz should be adequate for most system applications.
4. The series component(s) in the filter may either be an inductor or a ferrite bead. Testing has been
performed on both component types. When measuring PCI Express link jitter, the inductor or ferrite bead
solutions produce equal results. When measuring circuit board EMI, the ferrite bead is a superior solution.
25
June 2006 Revised August 2011
SLLS690C
Application Information
5. When designing filters associated with power distribution, the power supply is a low-impedance source,
and the device power terminals are a low-impedance load. The best filter for this application is a T filter.
See Figure 5−2 for a T filter circuit. Some systems may require this type of filter design if the power
supplies or nearby components are exceptionally noisy. This type of filter design is recommended if a
significant amount of low frequency noise (frequencies less than 10 MHz) is present in a system.
6. For most applications a Pi filter is adequate. See Figure 5−2 for a Pi filter circuit. When implementing a
Pi filter, the two capacitors and the inductor must be located next to each other on the circuit board and
must be connected together with wide, low impedance traces. Capacitor ground connections must be
short and low-impedance.
7. If a significant amount of high frequency noise (frequencies greater than 300 MHz) is present in a system,
creating an internal circuit board capacitor helps reduce this noise. This capacitor is accomplished by
locating power and ground planes next to each other in the circuit board stack-up. A gap of 0.003 mils
between the power and ground planes significantly reduces this high frequency noise.
8. Another option for filtering high-frequency logic noise is to create an internal board capacitor using signal
layer copper plates. When a component requires a low-noise power supply, usually the Pi filter is located
near the component. A plate capacitor may be created directly under the Pi filter. In the circuit board
stack-up, select a signal layer that is physically located next to a ground plane. Then, generate an internal
0.25 inch by 0.25 inch plate on that signal layer. Assuming a 0.006 mil gap between the signal layer plate
and the internal ground plane, this arrangement generates a 12 pF capacitor. By connecting this plate
capacitor to the trace between the Pi filter and the component’s power terminals, an internal circuit board
high frequency bypass capacitor is created. This solution is extremely effective for switching frequencies
above 300 MHz.
Figure 5−2 illustrates two different filter designs that may be used with the XIO1100 to provide low-noise power
to critical power terminals.
POWER SUPPLY
SIDE
COMPONENT
SIDE
Pi FILTER DESIGN
POWER SUPPLY
SIDE
COMPONENT
SIDE
T FILTER DESIGN
Figure 5−2. Filter Designs
26
SLLS690C
June 2006 Revised August 2011
Application Information
5.4 PCIe Layout Guidelines
The XIO1100 TXP and TXN terminals comprise a low-voltage, 100-Ω differentially driven signal pair. The RXP
and RXN terminals for the XIO1100 receive a low-voltage, 100-Ω differentially driven signal pair. The XIO1100
has integrated 50-Ω termination resistors to VSS on both the RXP and RXN terminals, eliminating the need
for external components.
Each lane of the differential signal pair must be ac-coupled. The recommended value for the series capacitor
is 0.1 μF. To minimize stray capacitance associated with the series capacitor circuit board solder pads,
0402-sized capacitors are recommended.
When routing a 2.5-Gb/s low-voltage, 100-Ω differentially driven signal pair, the following circuit board design
guidelines must be considered:
1. The PCI Express drivers and receivers are designed to operate with adequate bit error rate margins over
a 20” maximum length signal pair routed through FR4 circuit board material.
2. Each differential signal pair must be 100-Ω differential impedance with each single-ended lane measuring
in the range of 50-Ω to 55-Ω impedance to ground.
3. The differential signal trace lengths associated with a PCI Express high-speed link must be length
matched to minimize signal jitter. This length-matching requirement applies only to the P and N signals
within a differential pair. The transmitter differential pair does not need to be length matched to the receiver
differential pair. The absolute maximum trace length difference between the TXP signal and TXN signal
must be less than 5 mils. This value also applies to the RXP and RXN signal pair.
4. If a differential signal pair is broken into segments by vias, series capacitors, or connectors, the length
of the positive signal trace must be length matched to the negative signal trace for each segment. Trace
length differences over all segments are additive and must be less than 5 mils.
5. The location of the series capacitors is critical. For add-in cards, the series capacitors are located between
the TXP/TXN terminals and the PCI Express connector. In addition, the capacitors are placed near the
PCI Express connector. This translates to two capacitors on the motherboard for the downstream link,
and two capacitors on the add-in card for the upstream link. If both the upstream device and the
downstream device reside on the same circuit board, the capacitors are located near the TXP/TXN
terminals for each link.
6. The number of vias must be minimized. Each signal trace via reduces the maximum trace length by
approximately 2 inches. For example: if 6 vias are needed, the maximum trace length is 8 inches.
7. When routing a differential signal pair, 45-degree angles are preferred over 90-degree angles. Signal
trace length matching is easier with 45-degree angles, and overall signal trace length is reduced.
8. The differential signal pairs must not be routed over gaps in the power planes or ground planes. This
causes impedance mismatches.
9. If vias are used to change from one signal layer to another signal layer, it is important to maintain the same
50-Ω impedance reference to the ground plane. Changing reference planes causes signal trace
impedance mismatches. If changing reference planes cannot be prevented, bypass capacitors
connecting the two reference planes next to the signal trace vias help reduce the impedance mismatch.
If possible, the differential signal pairs must be routed on the top and bottom layers of a circuit board. Signal
propagation speeds are faster on external signal layers.
The XIO1100 supports two options for the PCI Express reference clock: a 100-MHz common differential
reference clock or a 125-MHz asynchronous single-ended reference clock. Both implementations are
described.
The first option is a system-wide 100-MHz differential reference clock. A single clock source with multiple
differential clock outputs is connected to all PCI Express devices in the system. The differential connection
between the clock source and each PCI Express device is point−to−point. This system implementation is
referred to as a common clock design.
27
June 2006 Revised August 2011
SLLS690C
Application Information
The XIO1100 is optimized for this type of system clock design. The REFCLK+ and REFCLK− terminals provide
differential reference clock inputs to the XIO1100. The circuit board routing rules associated with the 100-MHz
differential reference clock are the same as the 2.5-Gb/s TX and RX link routing rules already described. The
only difference is that the differential reference clock does not require series capacitors. The requirement is
a dc connection from the clock driver output to the XIO1100 receiver input.
Terminating the differential clock signal is circuit−board−design specific. However, the XIO1100 design has
no internal 50-Ω−to−ground termination resistors. Both REFCLK inputs, which are at approximately 20 kΩ to
ground, are high−impedance inputs.
The second option is a 125-MHz asynchronous single-ended reference clock. For this case, the devices at
each end of the PCI Express link have different clock sources. The XIO1100 has a 125-MHz single-ended
reference clock option for asynchronous clocking designs. When the CLK_SEL input terminal is tied to VSS,
this clocking mode is enabled.
The single-ended reference clock is attached to the REFCLK+ terminal. The REFCLK+ input, which is at
approximately 20 kΩ, is a high-impedance input. Any clock termination design must account for a
high-impedance input. The REFCLK− terminal needs to be attached to VSS.
5.5 PIPE Interface Layout Guidelines
The XIO1100 PIPE interface can operate at either 125 MHz or 250 MHz, depending on the state of the
DDR_EN pin. Due to the high frequencies, high-speed design techniques should be employed. When routing
the PIPE interface, the following circuit board design guidelines must be considered:
1. Due to the synchronous clock design of the XIO1100, the TX_DATA path and the RX_DATA path do not
require a matched length with respect to each other.
2. The TX_DATA path signals should be length matched to each other. The tolerance is dependent on the
setup/hold times for both the FPGA or ASIC and the XIO1100.
3. The RX_DATA path signals should be length matched to each other. The tolerance is dependent on the
setup/hold times for both the FPGA or ASIC and the XIO1100.
4. Because of the edge rates of the PIPE interface (0.9 ns rise and fall time at a 10 pF load), it is important
to keep the traces as short as possible. It is recommended to keep the trace length below 2.5 inches
(assuming FR4 and a velocity of 172 ps per inch) to reduce the effect of crosstalk. Obviously, increasing
the edge-to-edge spacing of the traces also reduces the effect of crosstalk.
5. In cases where the trace length is long and/or goes through a connector, it is recommended to use series
termination resistors on each PIPE signal. These resistors need to be placed as close as possible to the
source (resistors for the RX_DATA path next to the XIO1100 and resistors for the TX_DATA path next to
the FPGA or ASIC). The value of the series termination resistor depends on the impedance (Z ) of the
o
trace. Normally, the value of this resistor is Z minus the output impedance of the driver. For the XIO1100,
o
the output impedance of the RX_DATA path is 25-Ω (typ).
It is recommended to model your design before going to fabrication. An I/O Buffer Information Specification
(IBIS) model of the XIO1100 is available upon request.
28
SLLS690C
June 2006 Revised August 2011
Mechanical Data
6
Mechanical Data
29
June 2006 Revised August 2011
SLLS690C
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
XIO1100ZGB
LIFEBUY
BGA
MICROSTAR
ZGB
100
100
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
0 to 70
0 to 70
XIO1100
XIO1100ZGBR
LIFEBUY
BGA
MICROSTAR
ZGB
1000 RoHS & Green
160 RoHS & Green
1000 RoHS & Green
SNAGCU
XIO1100
XIO1100ZWS
ACTIVE
ACTIVE
NFBGA
ZWS
ZWS
100
100
SNAGCU
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
0 to 70
0 to 70
XIO1100
XIO1100
XIO1100ZWSR
NFBGA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Dec-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
XIO1100ZWSR
NFBGA
ZWS
100
1000
330.0
24.4
12.35 12.35
2.3
16.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Dec-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
NFBGA ZWS 100
SPQ
Length (mm) Width (mm) Height (mm)
336.6 336.6 41.3
XIO1100ZWSR
1000
Pack Materials-Page 2
PACKAGE OUTLINE
NFBGA - 1.4 mm max height
PLASTIC BALL GRID ARRAY
ZWS0100A
12.1
11.9
A
B
BALL A1 CORNER
12.1
11.9
1.4 MAX
C
SEATING PLANE
0.45
0.35
0.12 C
(1.2) TYP
9.6 TYP
N
M
L
(1.2) TYP
K
J
H
G
F
SYMM
9.6
TYP
E
D
C
B
A
0.55
100X Ø
0.45
0.15
0.05
C A B
C
0.8 TYP
1
2
3
4
5
6
7
8
9
10 11 12 13
0.8 TYP
SYMM
4225039/A 08/2019
NanoFree is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
NFBGA - 1.4 mm max height
PLASTIC BALL GRID ARRAY
ZWS0100A
SYMM
(0.8) TYP
A
B
(0.8) TYP
C
D
E
F
SYMM
G
H
J
K
L
100X (Ø 0.4)
M
N
1
2
3
4
5
6
7
8
9
10 11 12 13
LAND PATTERN EXAMPLE
SCALE: 8X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
EXPOSED
METAL UNDER
SOLDER MASK
METAL
(Ø 0.40)
SOLDER MASK
OPENING
(Ø 0.40)
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225039/A 08/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments
Literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
NFBGA - 1.4 mm max height
PLASTIC BALL GRID ARRAY
ZWS0100A
SYMM
(0.8) TYP
A
B
(0.8) TYP
C
D
E
F
SYMM
G
H
J
K
L
100X (Ø 0.4)
M
N
1
2
3
4
5
6
7
8
9
10 11 12 13
SOLDER PASTE EXAMPLE
BASED ON 0.150 mm THICK STENCIL
SCALE: 8X
4225039/A 08/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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