ULC1001 [TI]
用于超声波镜头清洗、具有电流和电压检测及 PWM 输出的可配置 DSP;
| 型号： | ULC1001 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于超声波镜头清洗、具有电流和电压检测及 PWM 输出的可配置 DSP |
| 文件： | 总11页 (文件大小：1149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ULC1001
ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
ULC1001 具有I/V 检测放大器的可配置超声波PWM 调制器
1 特性
2 应用范围
• 集成可编程清洗模式
– 水（排出）
– 除冰（融化和排出）
– 泥点（脱水和排出）
– 自动清洗（检测和排出）
– 自定义清洗模式
• 嵌入式算法
• 热成像摄像机
• 交通监控摄像头
• 机器视觉摄像机
• 无线安防摄像头
• 无人机视觉
3 说明
ULC1001 是一款具有电流和电压检测功能的可配置
PWM 调制器，专用于基于压电效应的镜头清洗系统。
– 镜头系统校准
– 自动材料检测
– 功率调节
– 系统诊断
• 系统诊断
片上低延迟 DSP 支持德州仪器 (TI) 为镜头清洗设计的
专有算法。ULC1001 和 DRV29xx 共同创建超声波镜
头清洗系统。
– DRV290x 故障报告
– 镜头系统故障
ULC1001 器件采用 32 引脚 QFN-HR 封装，可实现紧
凑的PCB 尺寸。
– 传感器温度调节
• 宽驱动频率范围
– 高效直接驱动(25kHz - 5MHz)
– AD 调制(< 50kHz)
• I2C 用户接口
器件信息(1)
封装尺寸（标称值）
器件型号
ULC1001
封装
HRQFN
4.5 mm × 5.0 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
• 所需的时钟源
– 外部振荡器（10MHz，建议5ppm）
• 电源
– IOVDD：3.3V
• 32 引脚QFN-HR 封装
3.3 V
1
F
IOVDD
VDD
DREG
SDZ
Power Management
PWMA
IRQZ
Brown Out &
Protection
TX Path
PWMB
Driver
OUT_B
DRIVER_ERRZ
Driver Fault Detection
OUT_A
DRIVER_ERRZ2
I-sense Amp
Lens Cleaning Controller
DSP
INCLK
Isns_P
+
Isns_N
–
10MHz
RSNS
RX Path
(ADC)
V-sense Amp
Lens System
Piezo
Vsns_P
+
Vsns_N
–
I2C Port
SCL
SDA
Addr Det
AD0
GND
简化版方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLASER1
ULC1001
www.ti.com.cn
ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
Table of Contents
5 Mechanical, Packaging, and Orderable Information....3
5.1 Package Option Addendum........................................4
5.2 Tape and Reel Information..........................................5
1 特性................................................................................... 1
2 应用范围............................................................................ 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (December 2020) to Revision A (December 2022)
Page
• 将器件状态更新为量产数据.................................................................................................................................1
Copyright © 2023 Texas Instruments Incorporated
2
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Product Folder Links: ULC1001
ULC1001
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ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: ULC1001
ULC1001
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ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
5.1 Package Option Addendum
Packaging Information
Orderable
Device
Package
Drawing
Lead/Ball
Finish
MSL Peak
Temp
Device
Marking
Status
Package Type
Pins
Package Qty
Eco Plan
Op Temp (°C)
ULC1001RQTR ACTIVE
VQFN-HR
RQT
32
3000
RoHS & Green NIPDAU
Level-1-260C- -40 to 125
UNLIM
1001 , ULC
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI
has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
4
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Product Folder Links: ULC1001
ULC1001
www.ti.com.cn
ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
5.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
ULC1001RQTR
VQFN-HR
RTQ
32
330.0
12.4
4.8
5.3
1.15
8.0
12.0
Q1
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: ULC1001
ULC1001
www.ti.com.cn
ZHCSRG1A –DECEMBER 2020 –REVISED DECEMBER 2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
RTQ 32
SPQ
Length (mm) Width (mm)
367.0 367.0
Height (mm)
ULC1001RQTR
VQFN-HR
3000
35.0
Copyright © 2023 Texas Instruments Incorporated
6
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Product Folder Links: ULC1001
PACKAGE OPTION ADDENDUM
www.ti.com
24-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ULC1001RQTR
ACTIVE
VQFN-HR
RQT
32
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
ULC
1001
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
A
RQT0032A
5.1
4.9
B
4.6
4.4
PIN 1 INDEX AREA
C
1.0
0.8
SEATING PLANE
0.08 C
0.05
0.00
0.55
11X
1.3328
1.1328
0.35
0.5
2X
0.3
(0.25) TYP
(0.413) TYP
(0.1) TYP
0.5
0.3
7X
16
9
8
2X 1.637
17
1.8
1.6
3X
0.45
4X
2X 1.112
2X 0.662
0.35
0.1
C A B
0.05
C
2X 0.212
0.000
2X 0.238
PKG
0.35
0.15
0.1
1.6796
1.4796
28X
1.25
1.05
2X 0.688
C A B
0.05
C
1.05
0.85
2X 1.138
2X 1.663
(0.387) TYP
24
1
32
25
0.45
0.525
0.325
2X
2X
0.35
0.1
0.6
0.4
C
A B
0.05
C
4225647 /A 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RQT0032A
2X (0.85)
2X (0.625)
(0.7)
11X (0.65)
9X (0.6)
2X (0.4)
(0.987)
2X (0.4)
(1.15)
25
32
(2.138)
(2.1)
(1.875)
2X (1.663)
(1.957)
(1.775)
(1.56)
24
1
2X (1.138)
2X (0.688)
(1.35)
(1.7796)
2X (0.238)
(0.000)
2X (0.212)
PKG
28X (0.25)
2X (0.662)
2X (1.112)
(1.013)
(1.5)
2X (1.637)
3X (1.9)
17
8
(1.943)
(2.125)
(2.15)
9
16
2X (0.4)
(1.4328)
(R0.05)
TYP
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 14X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED METAL
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225647 /A 05/2020
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) .
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RQT0032A
2X (0.85)
METAL TYP
2X (0.625)
(0.7)
11X (0.65)
9X (0.6)
2X (0.35)
(0.987)
2X (0.35)
25
(2.212)
(2.138)
(2.1)
2X (0.475)
32
(2.162)
(2.053)
(1.957)
2X (1.663)
(1.538)
(1.638)
1
24
(1.388)
(1.068)
2X (1.138)
2X (0.575)
2X (0.688)
2X (0.785)
PKG
2X (0.238)
(0.000)
2X (0.212)
35X (0.25)
2X (0.662)
(0.975)
2X (1.112)
6X (0.85)
(1.013)
(1.612)
(1.943)
17
8
2X (1.637)
(2.025)
(2.125)
(2.15)
9
16
2X (0.4)
(1.4328)
(R0.05)
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 14X
PRINTED COVERAGE BY AREA
PAD 14,15,16: 89%
PAD 21: 85%
PAD 17& 24: 90%
PAD 25: 84%
PAD 26: 88%
PAD 28: 82%
4225647 /A 05/2020
NOTES: (continued)
5.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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