UCC2817APWR [TI]

BiCMOS POWER FACTOR PREREGULATOR; BiCMOS功率因数前置稳压器
UCC2817APWR
型号: UCC2817APWR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

BiCMOS POWER FACTOR PREREGULATOR
BiCMOS功率因数前置稳压器

稳压器
文件: 总33页 (文件大小:639K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
ꢊꢋ ꢁ ꢌꢍꢎ ꢏ ꢍ ꢐꢑ ꢒ ꢓꢆꢁꢔꢍ ꢒ ꢏꢒ ꢑꢒꢑꢕ ꢀꢖ ꢆꢔꢍ ꢒ  
FEATURES  
DESCRIPTION  
D
Controls Boost Preregulator to Near-Unity  
Power Factor  
The UCC3817A and the UCC3818A family  
provides all the functions necessary for active  
power factor corrected preregulators. The  
controller achieves near unity power factor by  
shaping the ac input line current waveform to  
correspond to that of the ac input line voltage.  
Average current mode control maintains stable,  
low distortion sinusoidal line current.  
D
D
D
D
D
D
D
D
D
D
D
Limits Line Distortion  
World Wide Line Operation  
Over-Voltage Protection  
Accurate Power Limiting  
Average Current Mode Control  
Improved Noise Immunity  
Improved Feed-Forward Line Regulation  
Leading Edge Modulation  
150-µA Typical Start-Up Current  
Low-Power BiCMOS Operation  
12-V to 17-V Operation  
Designed in Texas Instrument’s BiCMOS process,  
the UCC3817A/UCC3818A offers new features  
such as lower start-up current, lower power  
dissipation, overvoltage protection, a shunt UVLO  
detect circuitry, a leading-edge modulation  
technique to reduce ripple current in the bulk  
capacitor and an improved, low-offset ( 2 mV)  
current amplifier to reduce distortion at light load  
conditions.  
BLOCK DIAGRAM  
VCC  
15  
OVP/EN 10  
SS 13  
16 V (FOR UCC3817A ONLY)  
7.5 V  
REFERENCE  
9
VREF  
UVLO  
16 V/10 V (UCC3817A)  
1.9 V  
ENABLE  
+
VAOUT  
7
10.5 V/10 V (UCC3818A)  
ZERO POWER  
0.33 V  
VCC  
+
VOLTAGE  
ERROR AMP  
VSENSE 11  
7.5 V  
+
CURRENT  
AMP  
8.0 V  
PWM  
OVP  
Q
+
X
÷
MULT  
+
16 DRVOUT  
+
X
S
2
VFF  
8
X
PWM  
LATCH  
OSC  
CLK  
R
R
MIRROR  
2:1  
1
2
GND  
CLK  
OSCILLATOR  
IAC  
6
5
PKLMT  
+
MOUT  
4
3
12  
14  
CAI  
CAOUT RT  
CT  
UDG-03122  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢔꢤ  
Copyright 2006, Texas Instruments Incorporated  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
DESCRIPTION (CONTINUED)  
The UCC3817A/18A family of PFC Controllers is directly pin for pin compatible with the UCC3817/18 family of  
devices. Only the output stage of UCC3817A family has been modified to allow use of a smaller external gate  
drive resistor values. For some power supply designs where an adequately high enough gate drive resistor can  
not be used, the UCC3817A/18A family offers a more robust output stage at the cost of increasing the internal  
gate resistances. The gate drive of the UC3817A/18A family however remains strong at 1.2 A of peak current  
capability.  
UCC3817A offers an on-chip shunt regulator with low start-up current, suitable for applications utilizing a  
bootstrap supply. UCC3818A is intended for applications with a fixed supply (VCC). Both devices are available  
in the 16-pin D, N and PW packages.  
PIN CONNECTION DIAGRAM  
D, N, AND PW PACKAGES  
(TOP VIEW)  
GND  
PKLMT  
CAOUT  
CAI  
DRVOUT  
VCC  
CT  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
SS  
MOUT  
IAC  
RT  
11 VSENSE  
10 OVP/EN  
VAOUT  
VFF  
9
VREF  
AVAILABLE OPTIONS TABLE  
PACKAGE DEVICES  
(1)  
(1)  
TSSOP (PW) PACKAGE  
SOIC (D) PACKAGE  
PDIP (N) PACKAGE  
T
A
= T  
J
Turn-on  
Threshold  
16 V  
Turn-on  
Threshold  
10.2 V  
Turn-on  
Threshold  
16 V  
Turn-on  
Threshold  
10.2 V  
Turn-on  
Threshold  
16 V  
Turn-on  
Threshold  
10.2 V  
−40°C to 85°C  
0°C to 70°C  
UCC2817AD  
UCC3817AD  
UCC2818AD  
UCC3818AD  
UCC2817AN  
UCC3817AN  
UCC2818AN  
UCC3818AN  
UCC2817APW  
UCC3817APW  
UCC2818APW  
UCC3818APW  
NOTES: (1) The D and PW packages are available taped and reeled. Add R suffix to the device type (e.g. UCC3817ADR) to order quantities  
of 2,500 devices per reel (D package) and 2,000 devices per reel (for PW package). Bulk quantities are 40 units (D package) and  
90 units (PW package) per tube.  
THERMAL RESISTANCE TABLE  
PACKAGE  
SOIC−16 (D)  
PDIP−16 (N)  
θjc(°C/W)  
θja(°C/W)  
(1)  
22  
12  
40 to 70  
25 to 50  
(1)  
(2)  
(2)  
TSSOP−16 (PW)  
14  
123 to 147  
2
NOTES: (1) Specifiedθja (junction to ambient) is for devices mounted to 5-inch FR4 PC board with one ounce copper  
2
where noted. When resistance range is given, lower values are for 5 inch aluminum PC board. Test PWB  
was 0.062 inch thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace  
widths for non-power packages with a 100-mil x 100-mil probe land area at the end of each trace.  
(2) Modeled data. If value range given for θja, lower value is for 3x3 inch. 1 oz internal copper ground plane,  
higher value is for 1x1-inch. ground plane. All model data assumes only one trace for each non-fused  
lead.  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature (unless otherwise noted)  
UCCx81xA  
UNIT  
V
Supply voltage VCC  
18  
Supply current ICC  
20  
mA  
Gate drive current, continuous  
Gate drive current  
0.2  
A
1.2  
Input voltage, CAI, MOUT, SS  
Input voltage, PKLMT  
8
5
V
Input voltage, VSENSE, OVP/EN  
Input current, RT, IAC, PKLMT  
Input current, VCC (no switching)  
Maximum negative voltage, DRVOUT, PKLMT, MOUT  
Power dissipation  
10  
10  
mA  
20  
−0.5  
V
1
−55 to 150  
−65 to 150  
300  
W
Junction temperature, T  
Storage temperature, T  
J
°C  
stg  
Lead temperature, T (soldering, 10 seconds)  
sol  
Power dissipation  
1
W
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
T = 0°C to 70°C for the UCC3817A and T = −40°C to 85°C for the UCC2817A, T = T VCC = 12 V, R = 22 k,  
A
A
A
J,  
T
C = 270 pF, (unless otherwise noted)  
T
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Supply Current Section  
Supply current, off  
VCC = (VCC turn-on threshold −0.3 V)  
VCC = 12 V, No load on DRVOUT  
150  
4
300  
6
µA  
Supply current, on  
2
mA  
UVLO Section  
VCC turn-on threshold (UCCx817)  
VCC turn-off threshold (UCCx817)  
UVLO hysteresis (UCCx817)  
Maximum shunt voltage (UCCx817)  
VCC turn-on threshold (UCCx818)  
VCC turn-off threshold (UCCx818)  
UVLO hysteresis (UCCx818)  
Voltage Amplifier Section  
15.4  
9.4  
16  
9.7  
6.3  
17  
16.6  
5.8  
I
= 10 mA  
15.4  
9.7  
17.5  
10.8  
V
VCC  
10.2  
9.7  
0.5  
9.4  
0.3  
T
= 0°C to 70°C  
7.387  
7.369  
7.5 7.613  
7.5 7.631  
A
Input voltage  
V
T
A
= −40°C to 85°C  
V
bias current  
V
= V  
,
VAOUT = 2.5 V  
50  
90  
200  
nA  
dB  
V
SENSE  
SENSE  
VAOUT = 2 V to 5 V  
REF  
Open loop gain  
50  
5.3  
0
High-level output voltage  
Low-level output voltage  
I
I
= −150 µA  
= 150 µA  
5.5  
50  
5.6  
L
150  
mV  
L
3
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
ELECTRICAL CHARACTERISTICS  
T = 0°C to 70°C for the UCC3817A and T = −40°C to 85°C for the UCC2817A, T = T VCC = 12 V, R = 22 k,  
A
A
A
J,  
T
C = 270 pF, (unless otherwise noted)  
T
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Over Voltage Protection and Enable Section  
VREF VREF VREF  
+0.48 +0.50 +0.52  
Over voltage reference  
V
Hysteresis  
300  
1.7  
0.1  
500  
1.9  
0.2  
600  
2.1  
0.3  
mV  
Enable threshold  
Enable hysteresis  
Current Amplifier Section  
V
Input offset voltage  
V
V
V
V
V
= 0 V,  
V
V
V
V
V
= 3 V  
−3.5  
0
2.5  
mV  
nA  
CM  
CM  
CM  
CM  
CM  
CAOUT  
CAOUT  
CAOUT  
CAOUT  
CAOUT  
Input bias current  
= 0 V,  
= 3 V  
−50 −100  
Input offset current  
= 0 V,  
= 3 V  
25  
100  
Open loop gain  
= 0 V,  
= 2 V to 5 V  
= 3 V  
90  
60  
dB  
Common-mode rejection ratio  
High-level output voltage  
Low-level output voltage  
Gain bandwidth product  
Voltage Reference Section  
= 0 V to 1.5 V,  
80  
6.5  
0.2  
2.5  
I
I
= −120 µA  
5.6  
0.1  
6.8  
0.5  
L
V
= 1 mA  
L
(1)  
MHz  
T
= 0°C to 70°C  
7.387  
7.369  
0
7.5 7.613  
7.5 7.631  
10  
A
Input voltage  
V
T
A
= −40°C to 85°C  
Load regulation  
Line regulation  
I
= 1 mA to 2 mA  
REF  
VCC = 10.8 V to 15 V  
= 0 V  
mV  
mA  
(2)  
0
10  
Short-circuit current  
Oscillator Section  
Initial accuracy  
V
−20  
−25  
100  
−50  
REF  
T
A
= 25°C  
85  
−1  
115  
1
kHz  
%
Voltage stability  
Total variation  
VCC = 10.8 V to 15 V  
Line, temp  
80  
120  
5.5  
kHz  
Ramp peak voltage  
4.5  
5
4
V
Ramp amplitude voltage  
(peak to peak)  
3.5  
4.5  
Peak Current Limit Section  
PKLMT reference voltage  
PKLMT propagation delay  
−15  
150  
15  
mV  
ns  
350  
500  
NOTES: 1. Ensured by design, not production tested.  
2. Reference variation for V < 10.8 V is shown in Figure 8.  
CC  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
ELECTRICAL CHARACTERISTICS  
T = 0°C to 70°C for the UCC3817A and T = −40°C to 85°C for the UCC2817A, T = T VCC = 12 V, R = 22 k,  
A
A
A
J,  
T
C = 270 pF, (unless otherwise noted)  
T
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Multiplier Section  
I
, high line, low power output  
MOUT  
I
I
I
I
I
= 500 µA,  
= 500 µA,  
= 500 µA,  
= 150 µA,  
= 150 µA,  
V
V
V
V
V
= 4.7 V,  
= 4.7 V,  
= 4.7 V,  
= 1.4 V,  
= 1.4 V,  
VAOUT = 1.25 V  
VAOUT = 1.25 V  
VAOUT = 5 V  
0
0
−6  
−6  
−20  
−23  
AC  
AC  
AC  
AC  
AC  
FF  
FF  
FF  
FF  
FF  
current, (0°C to 85°C)  
I
, high line, low power output  
MOUT  
current, (−40°C to 85°C)  
I
, high line, high power output  
, low line, low power output  
, low line, high power output  
, IAC limited output current  
MOUT  
current  
−70  
−10  
−90 −105  
−19 −50  
µA  
I
MOUT  
current  
VAOUT = 1.25 V  
VAOUT = 5 V  
I
MOUT  
current  
−268 −300 −345  
−250 −300 −400  
I
I
I
I
I
I
I
I
= 150 µA,  
= 300 µA,  
= 150 µA,  
= 500 µA,  
= 500 µA,  
= 500 µA,  
= 150 µA,  
V
FF  
V
FF  
V
FF  
V
FF  
V
FF  
V
FF  
V
FF  
= 1.3 V,  
= 3 V,  
VAOUT = 5 V  
MOUT  
Gain constant (K)  
AC  
AC  
AC  
AC  
AC  
AC  
AC  
VAOUT = 2.5 V  
VAOUT = 0.25 V  
VAOUT = 0.25 V  
VAOUT = 0.5 V  
VAOUT = 0.5 V  
VAOUT = 5 V  
0.5  
1
0
0
0
0
1.5  
−2  
1/V  
= 1.4 V,  
= 4.7 V,  
= 4.7 V,  
= 4.7 V,  
= 1.4 V,  
I
, zero current  
MOUT  
−2  
µA  
I
I
, zero current, (0°C to 85°C)  
, zero current, (−40°C to 85°C)  
−3  
MOUT  
−3.5  
MOUT  
Power limit (I  
MOUT  
x V )  
FF  
−375 −420 −485  
−140 −150 −160  
µW  
µA  
µA  
Feed-Forward Section  
VFF output current  
Soft Start Section  
SS charge current  
Gate Driver Section  
Pullup resistance  
I
= 300 µA  
AC  
−6  
−10  
−16  
I
I
= –100 mA to −200 mA  
= 100 mA  
9
4
12  
10  
O
Pulldown resistance  
Output rise time  
O
C
C
= 1 nF,  
= 1 nF,  
R
R
= 10 Ω,  
= 10 Ω,  
V
V
= 0.7 V to 9.0 V  
= 9.0 V to 0.7 V  
25  
50  
L
L
L
L
DRVOUT  
ns  
Output fall time  
10  
50  
DRVOUT  
Maximum duty cycle  
93%  
0.20  
95%  
99%  
2%  
Minimum controlled duty cycle  
Zero Power Section  
At 100 kHz  
Zero power comparator threshold  
Measured on VAOUT  
0.33  
0.50  
V
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
PIN ASSIGNMENTS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
CAI  
NO.  
4
I
O
I
Current amplifier noninverting input  
Current amplifier output  
Oscillator timing capacitor  
Gate drive  
CAOUT  
CT  
3
14  
16  
1
DRVOUT  
GND  
O
I
Ground  
IAC  
6
Current proportional to input voltage  
MOUT  
OVP/EN  
PKLMT  
RT  
5
I/O Multiplier output and current amplifier inverting input  
10  
2
I
I
Over-voltage/enable  
PFC peak current limit  
Oscillator charging current  
Soft-start  
12  
13  
7
I
SS  
I
VAOUT  
VCC  
O
I
Voltage amplifier output  
Positive supply voltage  
Feed-forward voltage  
Voltage amplifier inverting input  
Voltage reference output  
15  
8
VFF  
I
VSENSE  
VREF  
11  
9
I
O
Pin Descriptions  
CAI: Place a resistor between this pin and the GND side of current sense resistor. This input and the inverting  
input (MOUT) remain functional down to and below GND.  
CAOUT: This is the output of a wide bandwidth operational amplifier that senses line current and commands  
the PFC pulse-width modulator (PWM) to force the correct duty cycle. Compensation components are placed  
between CAOUT and MOUT.  
CT: A capacitor from CT to GND sets the PWM oscillator frequency according to:  
0.6  
RT   CT  
f [ ǒ  
Ǔ
The lead from the oscillator timing capacitor to GND should be as short and direct as possible.  
DRVOUT: The output drive for the boost switch is a totem-pole MOSFET gate driver on DRVOUT. To avoid the  
excessive overshoot of the DRVOUT while driving a capacitive load, a series gate current-limiting/damping  
resistor is recommended to prevent interaction between the gate impedance and the output driver. The value  
of the series gate resistor is based on the pulldown resistance (R  
VCC voltage (VCC), and the required maximum gate drive current (I  
which is 4 typical), the maximum  
pulldown  
). Using the equation below, a series  
MAX  
gate resistance of resistance 11 would be required for a maximum VCC voltage of 18 V and for 1.2 A of  
maximum sink current. The source current will be limited to approximately 900 mA (based on the R  
typical).  
of 9-Ω  
pullup  
VCC * ǒI  
pulldownǓ  
  R  
MAX  
R
+
GATE  
I
MAX  
GND: All voltages measured with respect to ground. VCC and REF should be bypassed directly to GND with  
a 0.1-µF or larger ceramic capacitor.  
6
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
Pin Descriptions (cont.)  
IAC: This input to the analog multiplier is a current proportional to instantaneous line voltage. The multiplier  
is tailored for very low distortion from this current input (I ) to multiplier output. The recommended maximum  
IAC  
I
is 500 µA.  
IAC  
MOUT: The output of the analog multiplier and the inverting input of the current amplifier are connected together  
at MOUT. As the multiplier output is a current, this is a high-impedance input so the amplifier can be configured  
as a differential amplifier. This configuration improves noise immunity and allows for the leading-edge  
modulation operation. The multiplier output current is limited to ǒ2   I Ǔ. The multiplier output current is given  
IAC  
by the equation:  
I
  (V  
* 1)  
VAOUT  
IAC  
I
+
MOUT  
2
V
  K  
VFF  
1
V
where K + is the multiplier gain constant.  
OVP/EN: A window comparator input that disables the output driver if the boost output voltage is a programmed  
level above the nominal or disables both the PFC output driver and resets SS if pulled below 1.9 V (typ).  
PKLMT: The threshold for peak limit is 0 V. Use a resistor divider from the negative side of the current sense  
resistor to VREF to level shift this signal to a voltage level defined by the value of the sense resistor and the  
peak current limit. Peak current limit is reached when PKLMT voltage falls below 0 V.  
RT: A resistor from RT to GND is used to program oscillator charging current. A resistor between 10 kand  
100 kis recommended. Nominal voltage on this pin is 3 V.  
SS: V is discharged for V  
source. This voltage is used as the voltage error signal during start-up, enabling the PWM duty cycle to increase  
low conditions. When enabled, SS charges an external capacitor with a current  
SS  
VCC  
slowly. In the event of a V  
the PWM.  
dropout, the OVP/EN is forced below 1.9 V (typ), SS quickly discharges to disable  
VCC  
Note: In an open-loop test circuit, grounding the SS pin does not ensure 0% duty cycle. Please see the  
application section for details.  
VAOUT: This is the output of the operational amplifier that regulates output voltage. The voltage amplifier output  
is internally limited to approximately 5.5 V to prevent overshoot.  
VCC: Connect to a stable source of at least 20 mA between 10 V and 17 V for normal operation. Bypass VCC  
directly to GND to absorb supply current spikes required to charge external MOSFET gate capacitances. To  
prevent inadequate gate drive signals, the output devices are inhibited unless V  
under-voltage lockout voltage threshold and remains above the lower threshold.  
exceeds the upper  
VCC  
VFF: The RMS voltage signal generated at this pin by mirroring 1/2 of the I  
At low line, the VFF voltage should be 1.4 V.  
into a single pole external filter.  
IAC  
VSENSE: This is normally connected to a compensation network and to the boost converter output through a  
divider network.  
VREF: VREF is the output of an accurate 7.5-V voltage reference. This output is capable of delivering 20 mA  
to peripheral circuitry and is internally short-circuit current limited. VREF is disabled and remains at 0 V when  
V
is below the UVLO threshold. Bypass VREF to GND with a 0.1-µF or larger ceramic capacitor for best  
VCC  
stability. Please refer to Figures 8 and 9 for VREF line and load regulation characteristics.  
7
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
The UCC3817A is a BiCMOS average current mode boost controller for high power factor, high efficiency  
preregulator power supplies. Figure 1 shows the UCC3817A in a 250-W PFC preregulator circuit. Off-line  
switching power converters normally have an input current that is not sinusoidal. The input current waveform  
has a high harmonic content because current is drawn in pulses at the peaks of the input voltage waveform.  
An active power factor correction circuit programs the input current to follow the line voltage, forcing the  
converter to look like a resistive load to the line. A resistive load has 0° phase displacement between the current  
and voltage waveforms. Power factor can be defined in terms of the phase angle between two sinusoidal  
waveforms of the same frequency:  
PF + cosQ  
(1)  
Therefore, a purely resistive load would have a power factor of 1. In practice, power factors of 0.999 with THD  
(total harmonic distortion) of less than 3% are possible with a well-designed circuit. Following guidelines are  
provided to design PFC boost converters using the UCC3817A.  
NOTE: Schottky diodes, D5 and D6, are required to protect the PFC controller from electrical over stress during  
system power up.  
C10  
1 µ F  
C11  
1 µF  
R16  
100  
VCC  
R15  
24k  
D7  
D8  
R21  
R13  
383k 383k  
L1  
IAC  
1mH  
R18  
24k  
V
D1  
8A, 600V  
O
F1  
AC2  
+
D2  
6A, 600V  
C14  
1.5µ  
400V  
C13  
0.47µ  
600V  
V
F
F
LINE  
85−270 V  
AC  
V
Q1  
IRFP450  
OUT  
D3  
C12  
385V−DC  
AC1  
R14  
0.25  
µ
220  
F
450V  
3W  
6A 600V  
R17  
20Ω  
UCC3817A  
R9  
4.02k  
R10  
4.02k  
R12  
2k  
1
2
GND  
DRVOUT 16  
D4  
VCC  
C3  
PKLIMIT  
1µF CER  
D5  
VCC 15  
R11  
10k  
3
4
5
CAOUT  
CAI  
C2  
100  
µ F AI EI  
C1  
560pF  
V
REF  
MOUT  
CT 14  
SS 13  
C9 1.2nF  
R8 12k  
C4 0.01µF  
6
IAC  
C8 270pF  
R1 12k  
RT 12  
C7 150nF  
D6  
R7 100k C15 2.2µ F  
VSENSE 11  
V
R2  
499k  
R19  
499k  
O
R3 20k  
7
8
VAOUT  
VFF  
C6 2.2µF  
R4  
249k  
R20 274k  
OVP/EN 10  
R5  
10k  
R6 30k  
µF  
C5 1  
VREF  
9
V
REF  
UDG-98183  
Figure 1. Typical Application Circuit  
8
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Power Stage  
L
: The boost inductor value is determined by:  
BOOST  
ǒV  
  DǓ  
IN(min)  
L
+
BOOST  
(
)
DI   fs  
(2)  
where D is the duty cycle, I is the inductor ripple current and f is the switching frequency. For the example  
S
circuit a switching frequency of 100 kHz, a ripple current of 875 mA, a maximum duty cycle of 0.688 and a  
minimum input voltage of 85 V  
equation are at the peak of low line, where the inductor current and its ripple are at a maximum.  
gives us a boost inductor value of about 1 mH. The values used in this  
RMS  
C
: Two main criteria, the capacitance and the voltage rating, dictate the selection of the output capacitor.  
OUT  
The value of capacitance is determined by the holdup time required for supporting the load after input ac voltage  
is removed. Holdup is the amount of time that the output stays in regulation after the input has been removed.  
For this circuit, the desired holdup time is approximately 16 ms. Expressing the capacitor value in terms of output  
power, output voltage, and holdup time gives the equation:  
ǒ2   P   DtǓ  
OUT  
C
+ ǒV  
OUT(min) Ǔ  
OUT  
2
2
* V  
OUT  
(3)  
In practice, the calculated minimum capacitor value may be inadequate because output ripple voltage  
specifications limit the amount of allowable output capacitor ESR. Attaining a sufficiently low value of ESR often  
necessitates the use of a much larger capacitor value than calculated. The amount of output capacitor ESR  
allowed can be determined by dividing the maximum specified output ripple voltage by the inductor ripple  
current. In this design holdup time was the dominant determining factor and a 220-µF, 450-V capacitor was  
chosen for the output voltage level of 385 VDC at 250 W.  
9
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Power switch selection: As in any power supply design, tradeoffs between performance, cost and size have  
to be made. When selecting a power switch, it can be useful to calculate the total power dissipation in the switch  
for several different devices at the switching frequencies being considered for the converter. Total power  
dissipation in the switch is the sum of switching loss and conduction loss. Switching losses are the combination  
of the gate charge loss, C  
loss and turnon and turnoff losses:  
OSS  
GATE  
2
P
+ Q  
  V  
  f  
GATE  
COSS  
GATE  
S
(4)  
(5)  
1
2
P
+
  C  
  V  
  f  
S
OSS  
OFF  
1
2
  I   ǒt  
Ǔ
  f  
P
) P  
+
  V  
) t  
ON  
OFF  
OFF  
L
ON  
OFF  
S
(6)  
where Q  
is the total gate charge, V  
is the gate drive voltage, f is the clock frequency, C is the drain  
OSS  
GATE  
GATE  
L
S
source capacitance of the MOSFET, I is the peak inductor current, t  
(estimated using device parameters R  
off time, in this case V  
and t  
are the switching times  
ON  
OFF  
, Q  
and V ) and V  
is the voltage across the switch during the  
GATE GD  
TH  
OFF  
= V  
.
OFF  
OUT  
Conduction loss is calculated as the product of the R  
and the square of RMS current:  
of the switch (at the worst case junction temperature)  
DS(on)  
2
P
+ R  
  K   I  
COND  
DS(on)  
RMS  
(7)  
where K is the temperature factor found in the manufacturer’s R  
vs. junction temperature curves.  
DS(on)  
Calculating these losses and plotting against frequency gives a curve that enables the designer to determine  
either which manufacturer’s device has the best performance at the desired switching frequency, or which  
switching frequency has the least total loss for a particular power switch. For this design example an IRFP450  
HEXFET from International Rectifier was chosen because of its low R  
and its V  
rating. The IRFP450’s  
DS(on)  
DSS  
R
of 0.4 and the maximum V  
of 500 V made it an ideal choice. An excellent review of this procedure  
DS(on)  
DSS  
can be found in the Unitrode Power Supply Design Seminar SEM1200, Topic 6, Design Review: 140 W, [Multiple  
Output High Density DC/DC Converter].  
Softstart  
The softstart circuitry is used to prevent overshoot of the output voltage during start up. This is accomplished  
by bringing up the voltage amplifier’s output (V ) slowly which allows for the PWM duty cycle to increase  
VAOUT  
slowly. Please use the following equation to select a capacitor for the softstart pin.  
In this example t is equal to 7.5 ms, which  
DELAY  
would yield a C of 10 nF.  
SS  
10 mA   t  
DELAY  
C
+
SS  
7.5 V  
(8)  
In an open-loop test circuit, shorting the softstart pin to ground does not ensure 0% duty cycle. This is due to  
the current amplifiers input offset voltage, which could force the current amplifier output high or low depending  
on the polarity of the offset voltage. However, in the typical application there is sufficient amount of inrush and  
bias current to overcome the current amplifier’s offset voltage.  
10  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Multiplier  
The output of the multiplier of the UCC3817A is a signal representing the desired input line current. It is an input  
to the current amplifier, which programs the current loop to control the input current to give high power factor  
operation. As such, the proper functioning of the multiplier is key to the success of the design. The inputs to the  
multiplier are VAOUT, the voltage amplifier error signal, I  
, a representation of the input rectified ac line  
IAC  
voltage, and an input voltage feedforward signal, V  
as:  
. The output of the multiplier, I  
, can be expressed  
VFF  
MOUT  
ǒV  
* 1Ǔ  
VAOUT  
I
+ I  
 
IAC  
MOUT  
2
K   V  
(9)  
VFF  
1
V
where K is a constant typically equal to  
.
The electrical characteristics table covers all the required operating conditions for designing with the  
multiplier. Additionally, curves in Figures 10, 11, and 12 provide typical multiplier characteristics over its entire  
operating range.  
The I  
signal is obtained through a high-value resistor connected between the rectified ac line and the IAC  
IAC  
pin of the UCC3817A/18A. This resistor (R ) is sized to give the maximum I  
UCC3817A/18A the maximum I  
current at high line. For the  
IAC  
IAC  
current is about 500 µA. A higher current than this can drive the multiplier  
IAC  
out of its linear range. A smaller current level is functional, but noise can become an issue, especially at low  
input line. Assuming a universal line operation of 85 V to 265 V gives a R value of 750 k. Because  
RMS  
RMS  
IAC  
of voltage rating constraints of standard 1/4-W resistor, use a combination of lower value resistors connected  
in series to give the required resistance and distribute the high voltage amongst the resistors. For this design  
example two 383-kresistors were used in series.  
The current into the IAC pin is mirrored internally to the VFF pin where it is filtered to produce a voltage feed  
forward signal proportional to line voltage. The VFF voltage is used to keep the power stage gain constant; and  
to provid input power limiting. Please refer to Texas Instruments application note SLUA196 for detailed  
explanation on how the VFF pin provides power limiting. The following equation can be used to size the VFF  
resistor (R  
) to provide power limiting where V  
is the minimum RMS input voltage and R  
is the total  
VFF  
IN(min)  
IAC  
resistance connected between the IAC pin and the rectified line voltage.  
1.4 V  
R
+
[ 30 kW  
VFF  
V
 0.9  
IN(min)  
2 R  
IAC  
(10)  
11  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Because the VFF voltage is generated from line voltage it needs to be adequately filtered to reduce total  
harmonic distortion caused by the 120 Hz rectified line voltage. Refer to Unitrode Power Supply Design  
Seminar, SEM−700 Topic 7, [Optimizing the Design of a High Power Factor Preregulator.] A single pole filter  
was adequate for this design. Assuming that an allocation of 1.5% total harmonic distortion from this input is  
allowed, and that the second harmonic ripple is 66% of the input ac line voltage, the amount of attenuation  
required by this filter is:  
1.5 %  
66 %  
+ 0.022  
(11)  
With a ripple frequency (f ) of 120 Hz and an attenuation of 0.022 requires that the pole of the filter (f ) be placed  
R
P
at:  
f + 120 Hz   0.022 [ 2.6 Hz  
(12)  
P
The following equation can be used to select the filter capacitor (C  
filter.  
) required to produce the desired low pass  
VFF  
1
C
+
[ 2.2 mF  
VFF  
2   p   R  
  f  
P
VFF  
(13)  
The R  
resistor is sized to match the maximum current through the sense resistor to the maximum multiplier  
MOUT  
current. The maximum multiplier current, or I  
, can be determined by the equation:  
MOUT(max)  
  ǒV  
* 1 VǓ  
I
@V  
IN(min)  
IAC  
VAOUT(max)  
I
+
MOUT(max)  
2
K   V  
VFF  
(min)  
(14)  
(15)  
I
for this design is approximately 315 µA. The R  
resistor can then be determined by:  
MOUT(max)  
MOUT  
V
RSENSE  
R
+
MOUT  
I
MOUT(max)  
In this example V  
was selected to give a dynamic operating range of 1.25 V, which gives an R  
of  
RSENSE  
MOUT  
roughly 3.91 k.  
12  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Voltage Loop  
The second major source of harmonic distortion is the ripple on the output capacitor at the second harmonic  
of the line frequency. This ripple is fed back through the error amplifier and appears as a 3rd harmonic ripple  
at the input to the multiplier. The voltage loop must be compensated not just for stability but also to attenuate  
the contribution of this ripple to the total harmonic distortion of the system. (refer to Figure 2).  
C
f
V
OUT  
C
R
Z
f
R
IN  
+
R
D
V
REF  
Figure 2. Voltage Amplifier Configuration  
The gain of the voltage amplifier, G , can be determined by first calculating the amount of ripple present on  
VA  
the output capacitor. The peak value of the second harmonic voltage is given by the equation:  
P
IN  
V
+ ǒ2 p   f   C  
OUTǓ  
OPK  
  V  
OUT  
R
(16)  
In this example V  
is equal to 3.91 V. Assuming an allowable contribution of 0.75% (1.5% peak to peak) from  
OPK  
the voltage loop to the total harmonic distortion budget we set the gain equal to:  
ǒDV  
Ǔ (  
0.015  
)
VAOUT  
G
+
VA  
2   V  
OPK  
(17)  
where V  
is the effective output voltage range of the error amplifier (5 V for the UCC3817A). The network  
VAOUT  
needed to realize this filter is comprised of an input resistor, R , and feedback components C , C , and R . The  
IN  
f
Z
f
value of R is already determined because of its function as one half of a resistor divider from V  
feeding  
IN  
OUT  
back to the voltage amplifier for output voltage regulation. In this case the value was chosen to be 1 M. This  
high value was chosen to reduce power dissipation in the resistor. In practice, the resistor value would be  
realized by the use of two 500-kresistors in series because of the voltage rating constraints of most standard  
1/4-W resistors. The value of C is determined by the equation:  
f
1
C +  
f
ǒ
INǓ  
2 p   f   G   R  
R
VA  
(18)  
13  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
In this example C equals 150 nF. Resistor R sets the dc gain of the error amplifier and thus determines the  
f
f
frequency of the pole of the error amplifier. The location of the pole can be found by setting the gain of the loop  
equation to one and solving for the crossover frequency. The frequency, expressed in terms of input power, can  
be calculated by the equation:  
P
2
IN  
f
+ ǒ(  
  CfǓ  
VI  
2
)
2 p   DV  
  V  
  R   C  
OUT OUT  
IN  
VAOUT  
(19)  
f
for this converter is 10 Hz. A derivation of this equation can be found in the Unitrode Power Supply Design  
VI  
Seminar SEM1000, Topic 1, [A 250-kHz, 500-W Power Factor Correction Circuit Employing Zero Voltage  
Transitions].  
Solving for R becomes:  
f
1
R +  
f
ǒ
  CfǓ  
2 p   f  
VI  
(20)  
or R equals 100 k.  
f
Due to the low output impedance of the voltage amplifier, capacitor C was added in series with R to reduce  
Z
F
loading on the voltage divider. To ensure the voltage loop crossed over at f , C was selected to add a zero  
VI  
Z
at a 10th of f . For this design a 2.2-µF capacitor was chosen for C . The following equation can be used to  
VI  
Z
calculate C .  
Z
1
C +  
Z
f
VI  
2   p   
  R  
f
10  
(21)  
Current Loop  
The gain of the power stage is:  
ǒV  
SENSEǓ  
  R  
OUT  
G (s) +  
ID  
ǒ
PǓ  
  V  
s   L  
BOOST  
(22)  
R
has been chosen to give the desired differential voltage for the current sense amplifier at the desired  
SENSE  
current limit point. In this example, a current limit of 4 A and a reasonable differential voltage to the current amp  
of 1 V gives a R value of 0.25 . V in this equation is the voltage swing of the oscillator ramp, 4 V for  
SENSE  
P
the UCC3817A. Setting the crossover frequency of the system to 1/10th of the switching frequency, or 10 kHz,  
requires a power stage gain at that frequency of 0.383. In order for the system to have a gain of 1 at the crossover  
frequency, the current amplifier needs to have a gain of 1/G at that frequency. G , the current amplifier gain  
ID  
EA  
is then:  
1
1
G
+
+
+ 2.611  
EA  
0.383  
G
ID  
(23)  
14  
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SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
R is the R  
resistor, previously calculated to be 3.9 k. (refer to Figure 3). The gain of the current amplifier  
I
MOUT  
is R /R , so multiplying R by G gives the value of R , in this case approximately 12 k. Setting a zero at the  
f
I
I
EA  
f
crossover frequency and a pole at half the switching frequency completes the current loop compensation.  
1
C +  
Z
2   p   R   f  
f
C
s
(24)  
(25)  
1
C +  
P
f
2   p   R   
f
2
C
P
C
R
Z
f
R
I
+
CAOUT  
Figure 3. Current Loop Compensation  
The UCC3817A current amplifier has the input from the multiplier applied to the inverting input. This change  
in architecture from previous Texas Instruments PFC controllers improves noise immunity in the current  
amplifier. It also adds a phase inversion into the control loop. The UCC3817A takes advantage of this phase  
inversion to implement leading-edge duty cycle modulation. Synchronizing a boost PFC controller to a  
downstream dc-to-dc controller reduces the ripple current seen by the bulk capacitor between stages, reducing  
capacitor size and cost and reducing EMI. This is explained in greater detail in a following section. The  
UCC3817A current amplifier configuration is shown in Figure 4.  
L
BOOST  
V
OUT  
Q
+
BOOST  
R
SENSE  
Z
f
PWM  
MULT  
CA  
COMPARATOR  
+
+
Figure 4. UCC3817A Current Amplifier Configuration  
15  
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APPLICATION INFORMATION  
Start Up  
The UCC3818A version of the device is intended to have VCC connected to a 12-V supply voltage. The  
UCC3817A has an internal shunt regulator enabling the device to be powered from bootstrap circuitry as shown  
in the typical application circuit of Figure 1. The current drawn by the UCC3817A during undervoltage lockout,  
or start-up current, is typically 150 µA. Once VCC is above the UVLO threshold, the device is enabled and draws  
4 mA typically. A resistor connected between the rectified ac line voltage and the VCC pin provides current to  
the shunt regulator during power up. Once the circuit is operational, the bootstrap winding of the inductor  
provides the VCC voltage. Sizing of the start-up resistor is determined by the start-up time requirement of the  
system design.  
DV  
Dt  
I
+ C  
C
(26)  
( )  
  0.9  
V
RMS  
R +  
I
C
(27)  
Where I is the charge current, C is the total capacitance at the VCC pin, V is the UVLO threshold and t is  
C
the allowed start-up time.  
Assuming a 1 second allowed start-up time, a 16-V UVLO threshold, and a total VCC capacitance of 100 µF,  
a resistor value of 51 kis required at a low line input voltage of 85 V  
small as to be ignored in sizing the start-up resistor.  
. The IC start-up current is sufficiently  
RMS  
Capacitor Ripple Reduction  
For a power system where the PFC boost converter is followed by a dc-to-dc converter stage, there are benefits  
to synchronizing the two converters. In addition to the usual advantages such as noise reduction and stability,  
proper synchronization can significantly reduce the ripple currents in the boost circuit’s output capacitor.  
Figure 5 helps illustrate the impact of proper synchronization by showing a PFC boost converter together with  
the simplified input stage of a forward converter. The capacitor current during a single switching cycle depends  
on the status of the switches Q1 and Q2 and is shown in Figure 6. It can be seen that with a synchronization  
scheme that maintains conventional trailing-edge modulation on both converters, the capacitor current ripple  
is highest. The greatest ripple current cancellation is attained when the overlap of Q1 offtime and Q2 ontime  
is maximized. One method of achieving this is to synchronize the turnon of the boost diode (D1) with the turnon  
of Q2. This approach implies that the boost converter’s leading edge is pulse width modulated while the forward  
converter is modulated with traditional trailing edge PWM. The UCC3817A is designed as a leading edge  
modulator with easy synchronization to the downstream converter to facilitate this advantage. Table 1 compares  
the I  
for D1/Q2 synchronization as offered by UCC3817A vs. the I  
for the other extreme of  
of 385 V.  
CB(rms)  
CB(rms)  
synchronizing the turnon of Q1 and Q2 for a 200-W power system with a V  
BST  
16  
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ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢁꢂ ꢃꢄ ꢃꢆ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢁ ꢈꢃ ꢄꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
UDG-97130-1  
Figure 5. Simplified Representation of a 2-Stage PFC Power Supply  
UDG-97131  
Figure 6. Timing Waveforms for Synchronization Scheme  
17  
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ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢂ ꢃꢄ ꢃ ꢆ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
Table 1 illustrates that the boost capacitor ripple current can be reduced by about 50% at nominal line and about  
30% at high line with the synchronization scheme facilitated by the UCC3817A. Figure 7 shows the suggested  
technique for synchronizing the UCC3817A to the downstream converter. With this technique, maximum ripple  
reduction as shown in Figure 6 is achievable. The output capacitance value can be significantly reduced if its  
choice is dictated by ripple current or the capacitor life can be increased as a result. In cost sensitive designs  
where holdup time is not critical, this is a significant advantage.  
Table 1. Effects of Synchronization on Boost Capacitor Current  
V
IN  
= 85 V  
V
IN  
= 120 V  
V
IN  
= 240 V  
D(Q2)  
0.35  
Q1/Q2  
D1/Q2  
Q1/Q2  
D1/Q2  
Q1/Q2  
D1/Q2  
1.491 A  
1.432 A  
0.835 A  
0.93 A  
1.341 A  
1.276 A  
0.663 A  
0.664 A  
1.024 A  
0.897 A  
0.731 A  
0.614 A  
0.45  
An alternative method of synchronization to achieve the same ripple reduction is possible. In this method, the  
turnon of Q1 is synchronized to the turnoff of Q2. While this method yields almost identical ripple reduction and  
maintains trailing edge modulation on both converters, the synchronization is much more difficult to achieve and  
the circuit can become susceptible to noise as the synchronizing edge itself is being modulated.  
Gate Drive  
From Down  
Stream PWM  
C1  
UCC3817A  
D2  
CT  
C
D1  
T
R
T
RT  
Figure 7. Synchronizing the UCC3817A to a Down-Stream Converter  
18  
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ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢁꢂ ꢃꢄ ꢃꢆ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢁ ꢈꢃ ꢄꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
REFERENCE VOLTAGE  
vs  
REFERENCE CURRENT  
REFERENCE VOLTAGE  
vs  
SUPPLY VOLTAGE  
7.60  
7.55  
7.50  
7.45  
7.40  
7.510  
7.505  
7.500  
7.495  
7.490  
0
5
I
10  
15  
20  
25  
9
10  
11  
12  
13  
14  
− Reference Current − mA  
VCC − Supply Voltage − V  
VREF  
Figure 8  
Figure 9  
MULTIPLIER OUTPUT CURRENT  
vs  
MULTIPLIER GAIN  
vs  
VOLTAGE ERROR AMPLIFIER OUTPUT  
VOLTAGE ERROR AMPLIFIER OUTPUT  
1.5  
1.3  
1.1  
350  
300  
250  
IAC = 150  
A
µ
IAC = 150  
A
µ
200  
150  
IAC = 300  
A
µ
0.9  
0.7  
IAC = 300  
A
µ
IAC = 500  
A
µ
100  
50  
0
A
µ
IAC = 500  
4.0  
0.5  
1.0  
2.0  
3.0  
4.0  
5.0  
0.0  
1.0  
2.0  
3.0  
5.0  
VAOUT − Voltage Error Amplifier Output − V  
VAOUT − Voltage Error Amplifier Output − V  
Figure 10  
Figure 11  
19  
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ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢂ ꢃꢄ ꢃ ꢆ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
APPLICATION INFORMATION  
MULTIPLIER CONSTANT POWER PERFORMANCE  
500  
400  
VAOUT = 5 V  
300  
VAOUT = 4 V  
200  
VAOUT = 3 V  
100  
VAOUT = 2 V  
0
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
VFF − Feedforward Voltage − V  
Figure 12  
References and Resources:  
Application Note, Differences Between UCC3817A/18A/19A and UCC3817/18/19, Texas Instruments  
Literature Number SLUA294  
Evaluation Module, UCC3817EVM, 385V, 250W PFC Boost Converter  
User’s Guide, UCC3817 BiCMOS Power Factor Preregulator Evaluation Board, Texas Instruments Literature  
Number SLUU077  
Application Note, Synchronizing a PFC Controller from a Down Stream Controller Gate Drive, Texas  
Instruments Literature Number SLUA245  
Seminar topic, High Power Factor Switching Preregulator Design Optimization, L.H. Dixon, SEM−700,1990.  
Seminar topic, High Power Factor Preregulator for Off−line Supplies, L.H. Dixon, SEM−600, 1988.  
Related Products  
DEVICE  
DESCRIPTION  
CONTROL METHOD  
TYPICAL POWER LEVEL  
200 W to 2 kW+  
200 W to 2 kW+  
400 W to 2 kW+  
50 W to 400 W  
(2)  
(2)  
(2)  
(1)  
(2)  
(2)  
(2)  
UC3854  
PFC controller  
ACM  
ACM  
ACM  
CRM  
ACM  
ACM  
ACM  
UC3854A/B  
Improved PFC controller  
UC3855A/B  
High performance soft switching PFC controller  
Transition mode PFC controller  
UCC38050/1  
UCC3819  
Tracking boost PFC controller  
75 W to 2 kW+  
UCC28510/11/12/13  
UCC28514/15/16/17  
Advanced PFC+PWM combo controller  
Advanced PFC+PWM combo controller  
75 W to 1kW+  
75 W to 1kW+  
NOTES: (1). Critical conduction mode  
(2). Average current mode  
20  
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ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢁꢂ ꢃꢄ ꢃꢆ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢁ ꢈꢃ ꢄꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
MECHANICAL DATA  
D (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
8 PINS SHOWN  
0.020 (0,51)  
0.050 (1,27)  
8
0.010 (0,25)  
0.014 (0,35)  
5
0.244 (6,20)  
0.228 (5,80)  
0.008 (0,20) NOM  
0.157 (4,00)  
0.150 (3,81)  
Gage Plane  
1
4
0.010 (0,25)  
0°− 8°  
A
0.044 (1,12)  
0.016 (0,40)  
Seating Plane  
0.004 (0,10)  
0.010 (0,25)  
0.069 (1,75) MAX  
0.004 (0,10)  
PINS **  
8
14  
16  
DIM  
A MAX  
0.197  
(5,00)  
0.344  
(8,75)  
0.394  
(10,00)  
0.189  
(4,80)  
0.337  
(8,55)  
0.386  
(9,80)  
A MIN  
4040047/E 09/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).  
21  
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ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢂ ꢃꢄ ꢃ ꢆ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢆꢇ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
MECHANICAL DATA  
N (R-PDIP-T**)  
PLASTIC DUAL-IN-LINE PACKAGE  
16 PINS SHOWN  
PINS **  
14  
16  
18  
20  
DIM  
0.775  
0.775  
0.920  
1.060  
A MAX  
A
(19,69) (19,69) (23,37) (26,92)  
16  
9
0.745  
0.745  
0.850  
0.940  
A MIN  
(18,92) (18,92) (21,59) (23,88)  
MS-100  
VARIATION  
0.260 (6,60)  
0.240 (6,10)  
AA  
BB  
AC  
AD  
C
1
8
0.070 (1,78)  
0.045 (1,14)  
D
0.045 (1,14)  
0.030 (0,76)  
0.325 (8,26)  
0.300 (7,62)  
0.020 (0,51) MIN  
D
0.015 (0,38)  
Gauge Plane  
0.200 (5,08) MAX  
Seating Plane  
0.010 (0,25) NOM  
0.125 (3,18) MIN  
0.100 (2,54)  
0.430 (10,92) MAX  
0.021 (0,53)  
0.015 (0,38)  
0.010 (0,25)  
M
14/18 PIN ONLY  
20 pin vendor option  
D
4040049/E 12/2002  
NOTES: D. All linear dimensions are in inches (millimeters).  
E. This drawing is subject to change without notice.  
F. Falls within JEDEC MS-001, except 18 and 20 pin  
minimum body lrngth (Dim A).  
G. The 20 pin end lead shoulder width is a vendor option,  
either half or full width.  
22  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇ ꢀꢁ ꢁꢂ ꢃꢄ ꢃꢆ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢆ ꢇ ꢀ ꢁꢁ ꢈꢃ ꢄꢃ ꢆ  
SLUS577B − SEPTEMBER, 2003 − REVISED FEBRUARY 2006  
MECHANICAL DATA  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°ā8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
7,70  
9,80  
9,60  
A MAX  
A MIN  
4040064/F 01/97  
NOTES: H. All linear dimensions are in millimeters.  
I. This drawing is subject to change without notice.  
J. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
23  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
UCC2817AD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
UCC2817ADG4  
UCC2817ADR  
UCC2817ADRG4  
UCC2817AN  
SOIC  
SOIC  
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
UCC2817ANG4  
UCC2817APW  
UCC2817APWG4  
UCC2817APWR  
UCC2817APWRG4  
UCC2818AD  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
PW  
PW  
D
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
UCC2818ADG4  
UCC2818ADR  
UCC2818ADR/1  
UCC2818ADRG4  
UCC2818AN  
SOIC  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
UCC2818ANG4  
UCC2818APW  
UCC2818APWG4  
UCC2818APWR  
UCC2818APWRG4  
UCC3817AD  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
PW  
PW  
D
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
UCC3817ADG4  
UCC3817ADR  
UCC3817ADRG4  
SOIC  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Mar-2007  
Orderable Device  
UCC3817AN  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
N
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
UCC3817ANG4  
UCC3817APW  
UCC3817APWG4  
UCC3817APWR  
UCC3817APWRG4  
UCC3818AD  
PDIP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
N
PW  
PW  
PW  
PW  
D
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
UCC3818ADR  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
UCC3818ADRG4  
UCC3818AN  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
UCC3818ANG4  
UCC3818APW  
UCC3818APWG4  
UCC3818APWR  
UCC3818APWRG4  
PDIP  
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Mar-2007  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
Device  
Package Pins  
Site  
MLA  
MLA  
MLA  
MLA  
Reel  
Diameter Width  
(mm)  
Reel  
A0 (mm)  
7.0  
B0 (mm)  
5.6  
K0 (mm)  
1.6  
P1  
W
Pin1  
(mm) (mm) Quadrant  
(mm)  
UCC2817APWR  
UCC2818APWR  
UCC3817APWR  
UCC3818APWR  
PW  
PW  
PW  
PW  
16  
16  
16  
16  
330  
12  
8
8
8
8
12 PKGORN  
T1TR-MS  
P
330  
330  
330  
12  
12  
12  
7.0  
5.6  
1.6  
12 PKGORN  
T1TR-MS  
P
7.0  
5.6  
1.6  
12 PKGORN  
T1TR-MS  
P
7.0  
5.6  
1.6  
12 PKGORN  
T1TR-MS  
P
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
UCC2817APWR  
UCC2818APWR  
UCC3817APWR  
UCC3818APWR  
PW  
PW  
PW  
PW  
16  
16  
16  
16  
MLA  
MLA  
MLA  
MLA  
342.9  
342.9  
342.9  
342.9  
336.6  
336.6  
336.6  
336.6  
28.58  
28.58  
28.58  
28.58  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
Pack Materials-Page 3  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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