UCC2802- [TI]

Low-Power BiCMOS Current-Mode PWM; 低功耗BiCMOS电流模式PWM
UCC2802-
型号: UCC2802-
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Low-Power BiCMOS Current-Mode PWM
低功耗BiCMOS电流模式PWM

文件: 总26页 (文件大小:4199K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
5962-9451301MPA  
5962-9451302MPA  
5962-9451303MPA  
5962-9451304MPA  
5962-9451305MPA  
5962-9451305VPA  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
JG  
8
8
8
8
8
8
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
A42  
Call TI  
9451301MPA  
UCC1801  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
JG  
JG  
JG  
JG  
JG  
1
1
1
1
1
Call TI  
9451302MPA  
UCC1802  
Call TI  
9451303MPA  
UCC1803  
Call TI  
9451304MPA  
UCC1804  
Call TI  
9451305MPA  
UCC1805  
N / A for Pkg Type  
5962-9451305VP  
A
UCC1805JQMLV  
UCC1800-W  
UCC1800J  
ACTIVE WAFERSALE  
YS  
JG  
JG  
0
8
8
TBD  
TBD  
TBD  
Call TI  
A42  
Call TI  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
1
1
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1800J  
UCC1800J883B  
A42  
UCC1800J/  
883B  
UCC1800L883B  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
UCC1800L/  
883B  
UCC1801J  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
JG  
JG  
8
8
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1801J  
UCC1801J883B  
9451301MPA  
UCC1801  
UCC1802J  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
JG  
JG  
8
8
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1802J  
UCC1802J883B  
9451302MPA  
UCC1802  
UCC1803J  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
JG  
JG  
8
8
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1803J  
UCC1803J883B  
9451303MPA  
UCC1803  
UCC1804J  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
JG  
JG  
8
8
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1804J  
UCC1804J883B  
9451304MPA  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC1804  
UCC1805J  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
JG  
JG  
8
8
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
UCC1805J  
UCC1805J883B  
9451305MPA  
UCC1805  
UCC2800D  
UCC2800DG4  
UCC2800DTR  
UCC2800DTRG4  
UCC2800N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
UCC2800  
UCC2800  
UCC2800  
UCC2800  
UCC2800N  
UCC2800N  
2800  
Green (RoHS  
& no Sb/Br)  
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
P
Green (RoHS  
& no Sb/Br)  
UCC2800NG4  
UCC2800PW  
UCC2800PWG4  
UCC2801D  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PW  
PW  
D
150  
150  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
2800  
Green (RoHS  
& no Sb/Br)  
UCC2801  
UCC2801  
UCC2801  
UCC2801  
UCC2801N  
UCC2801N  
2801  
UCC2801DG4  
UCC2801DTR  
UCC2801DTRG4  
UCC2801N  
D
75  
Green (RoHS  
& no Sb/Br)  
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
P
Green (RoHS  
& no Sb/Br)  
UCC2801NG4  
UCC2801PW  
UCC2801PWG4  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
PW  
PW  
150  
150  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
2801  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC2801QDRQ1G4  
ACTIVE  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
Call TI  
Level-1-260C-UNLIM  
C2801DQ1  
UCC2802-W  
UCC2802D  
ACTIVE WAFERSALE  
YS  
D
0
8
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
UCC2802  
UCC2802  
UCC2802  
UCC2802  
UCC2802DG4  
UCC2802DTR  
D
D
D
8
8
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
UCC2802DTRG4  
Green (RoHS  
& no Sb/Br)  
UCC2802J  
UCC2802N  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
JG  
P
8
8
1
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
UCC2802J  
UCC2802N  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
UCC2802NG4  
UCC2802PW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
TSSOP  
TSSOP  
SOIC  
P
PW  
PW  
D
8
8
8
8
8
8
8
50  
150  
150  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
UCC2802N  
2802  
Green (RoHS  
& no Sb/Br)  
UCC2802PWG4  
UCC2803D  
Green (RoHS  
& no Sb/Br)  
2802  
Green (RoHS  
& no Sb/Br)  
UCC2803  
UCC2803  
UCC2803  
UCC2803  
UCC2803DG4  
UCC2803DTR  
UCC2803DTRG4  
SOIC  
D
75  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
2500  
2500  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
UCC2803J  
UCC2803N  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
JG  
P
8
8
1
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
UCC2803J  
UCC2803N  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
UCC2803NG4  
ACTIVE  
PDIP  
P
8
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
N / A for Pkg Type  
-40 to 85  
UCC2803N  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC2803PW  
UCC2803PWG4  
UCC2803PWTR  
UCC2803PWTRG4  
UCC2804D  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
8
8
8
8
8
150  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
2803  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PW  
PW  
PW  
D
150  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
2803  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
2803  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
2803  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
UCC2804  
UCC2804D/70021  
UCC2804DG4  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
TBD  
Call TI  
Call TI  
75  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
UCC2804  
UCC2804  
UCC2804  
UCC2804N  
UCC2804N  
2804  
UCC2804DTR  
UCC2804DTRG4  
UCC2804N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
8
8
8
8
8
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
PDIP  
P
Green (RoHS  
& no Sb/Br)  
UCC2804NG4  
UCC2804PW  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
150  
150  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
UCC2804PWG4  
UCC2804PWTR  
UCC2804PWTRG4  
Green (RoHS  
& no Sb/Br)  
2804  
Green (RoHS  
& no Sb/Br)  
2804  
Green (RoHS  
& no Sb/Br)  
2804  
UCC2805-W  
UCC2805D  
ACTIVE WAFERSALE  
YS  
D
0
8
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
UCC2805  
UCC2805  
UCC2805DG4  
D
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC2805DTR  
UCC2805DTRG4  
UCC2805N  
ACTIVE  
SOIC  
SOIC  
PDIP  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
UCC2805  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
P
2500  
50  
Green (RoHS  
& no Sb/Br)  
UCC2805  
UCC2805N  
UCC2805N  
2805  
Green (RoHS  
& no Sb/Br)  
UCC2805NG4  
UCC2805PW  
UCC2805PWG4  
UCC3800D  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PW  
PW  
D
150  
150  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
2805  
Green (RoHS  
& no Sb/Br)  
UCC3800  
UCC3800  
UCC3800  
UCC3800  
UCC3800N  
UCC3800N  
3800  
UCC3800DG4  
UCC3800DTR  
UCC3800DTRG4  
UCC3800N  
D
75  
Green (RoHS  
& no Sb/Br)  
0 to 70  
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
0 to 70  
D
Green (RoHS  
& no Sb/Br)  
0 to 70  
P
Green (RoHS  
& no Sb/Br)  
0 to 70  
UCC3800NG4  
UCC3800PW  
UCC3800PWG4  
UCC3801D  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
0 to 70  
TSSOP  
TSSOP  
SOIC  
SOIC  
SOIC  
SOIC  
PW  
PW  
D
150  
150  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
3800  
Green (RoHS  
& no Sb/Br)  
0 to 70  
UCC3801  
UCC3801  
UCC3801  
UCC3801  
UCC3801DG4  
UCC3801DTR  
UCC3801DTRG4  
D
75  
Green (RoHS  
& no Sb/Br)  
0 to 70  
D
2500  
2500  
Green (RoHS  
& no Sb/Br)  
0 to 70  
D
Green (RoHS  
& no Sb/Br)  
0 to 70  
Addendum-Page 5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC3801N  
UCC3801NG4  
ACTIVE  
PDIP  
PDIP  
P
8
8
8
8
8
8
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
UCC3801N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
0 to 70  
UCC3801N  
3801  
UCC3801PW  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
150  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
0 to 70  
UCC3801PWG4  
UCC3801PWTR  
UCC3801PWTRG4  
150  
Green (RoHS  
& no Sb/Br)  
0 to 70  
3801  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
0 to 70  
3801  
Green (RoHS  
& no Sb/Br)  
0 to 70  
3801  
UCC3802-W  
UCC3802D  
ACTIVE WAFERSALE  
YS  
D
0
8
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
UCC3802  
UCC3802  
UCC3802  
UCC3802  
UCC3802N  
UCC3802N  
3802  
UCC3802DG4  
UCC3802DTR  
UCC3802DTRG4  
UCC3802N  
D
D
8
8
8
8
8
8
8
8
8
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
P
Green (RoHS  
& no Sb/Br)  
UCC3802NG4  
UCC3802PW  
UCC3802PWG4  
UCC3803D  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
SOIC  
SOIC  
SOIC  
PW  
PW  
D
150  
150  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
3802  
Green (RoHS  
& no Sb/Br)  
UCC3803  
UCC3803  
UCC3803  
UCC3803DG4  
UCC3803DTR  
D
75  
Green (RoHS  
& no Sb/Br)  
D
2500  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 6  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC3803DTRG4  
UCC3803N  
ACTIVE  
SOIC  
PDIP  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
UCC3803  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
P
P
50  
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
UCC3803N  
UCC3803N  
3803  
UCC3803NG4  
UCC3803PW  
PDIP  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
PW  
PW  
D
150  
150  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
UCC3803PWG4  
UCC3803PWTR  
UCC3803PWTRG4  
UCC3804D  
Green (RoHS  
& no Sb/Br)  
3803  
Green (RoHS  
& no Sb/Br)  
3803  
Green (RoHS  
& no Sb/Br)  
3803  
Green (RoHS  
& no Sb/Br)  
UCC3804  
UCC3804  
UCC3804  
UCC3804  
UCC3804N  
UCC3804N  
3804  
UCC3804DG4  
UCC3804DTR  
UCC3804DTRG4  
UCC3804N  
SOIC  
D
75  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
PDIP  
P
Green (RoHS  
& no Sb/Br)  
UCC3804NG4  
UCC3804PW  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
PW  
PW  
D
150  
150  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
UCC3804PWG4  
UCC3804PWTR  
UCC3804PWTRG4  
UCC3805D  
Green (RoHS  
& no Sb/Br)  
3804  
Green (RoHS  
& no Sb/Br)  
3804  
Green (RoHS  
& no Sb/Br)  
3804  
Green (RoHS  
& no Sb/Br)  
UCC3805  
Addendum-Page 7  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
UCC3805DG4  
UCC3805DTR  
ACTIVE  
SOIC  
SOIC  
D
8
8
8
8
8
8
8
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
UCC3805  
ACTIVE  
PREVIEW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
2500  
Green (RoHS  
& no Sb/Br)  
0 to 70  
UCC3805  
UCC3805  
UCC3805  
UCC3805N  
UCC3805N  
3805  
UCC3805DTR/81222G4  
UCC3805DTRG4  
UCC3805N  
SOIC  
Green (RoHS  
& no Sb/Br)  
0 to 70  
SOIC  
D
2500  
50  
Green (RoHS  
& no Sb/Br)  
0 to 70  
PDIP  
P
Green (RoHS  
& no Sb/Br)  
0 to 70  
UCC3805NG4  
PDIP  
P
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
0 to 70  
UCC3805PW  
TSSOP  
TSSOP  
PW  
PW  
150  
150  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
0 to 70  
UCC3805PWG4  
Green (RoHS  
& no Sb/Br)  
0 to 70  
3805  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Addendum-Page 8  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UCC1800, UCC1801, UCC1802, UCC1803, UCC1804, UCC1805, UCC1805-SP, UCC2800, UCC2801, UCC2802, UCC2802M, UCC2803,  
UCC2803M, UCC2804, UCC2805, UCC3800, UCC3801, UCC3802, UCC3803, UCC3804, UCC3805 :  
Catalog: UCC3800, UCC3801, UCC3802, UCC3803, UCC3804, UCC3805, UCC1805, UCC2802, UCC2803  
Automotive: UCC2800-Q1, UCC2801-Q1, UCC2802-Q1, UCC2802-Q1, UCC2803-Q1, UCC2803-Q1, UCC2804-Q1, UCC2805-Q1  
Enhanced Product: UCC2800-EP, UCC2801-EP, UCC2802-EP, UCC2802-EP, UCC2803-EP, UCC2803-EP, UCC2804-EP, UCC2805-EP  
Military: UCC2802M, UCC2803M, UCC1800, UCC1801, UCC1802, UCC1803, UCC1804, UCC1805  
Space: UCC1805-SP  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
Military - QML certified for Military and Defense Applications  
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application  
Addendum-Page 9  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UCC2800DTR  
UCC2801DTR  
UCC2802DTR  
UCC2803DTR  
UCC2803PWTR  
UCC2804DTR  
UCC2804PWTR  
UCC2805DTR  
UCC3800DTR  
UCC3801DTR  
UCC3801PWTR  
UCC3802DTR  
UCC3803DTR  
UCC3803PWTR  
UCC3804DTR  
UCC3804PWTR  
UCC3805DTR  
SOIC  
SOIC  
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
2500  
2500  
2500  
2000  
2500  
2000  
2500  
2500  
2500  
2000  
2500  
2500  
2000  
2500  
2000  
2500  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
6.4  
6.4  
6.4  
6.4  
7.0  
6.4  
7.0  
6.4  
6.4  
6.4  
7.0  
6.4  
6.4  
7.0  
6.4  
7.0  
6.4  
5.2  
5.2  
5.2  
5.2  
3.6  
5.2  
3.6  
5.2  
5.2  
5.2  
3.6  
5.2  
5.2  
3.6  
5.2  
3.6  
5.2  
2.1  
2.1  
2.1  
2.1  
1.6  
2.1  
1.6  
2.1  
2.1  
2.1  
1.6  
2.1  
2.1  
1.6  
2.1  
1.6  
2.1  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
SOIC  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
TSSOP  
SOIC  
PW  
D
SOIC  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
TSSOP  
SOIC  
PW  
D
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UCC2800DTR  
UCC2801DTR  
UCC2802DTR  
UCC2803DTR  
UCC2803PWTR  
UCC2804DTR  
UCC2804PWTR  
UCC2805DTR  
UCC3800DTR  
UCC3801DTR  
UCC3801PWTR  
UCC3802DTR  
UCC3803DTR  
UCC3803PWTR  
UCC3804DTR  
UCC3804PWTR  
UCC3805DTR  
SOIC  
SOIC  
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
2500  
2500  
2500  
2000  
2500  
2000  
2500  
2500  
2500  
2000  
2500  
2500  
2000  
2500  
2000  
2500  
340.5  
340.5  
340.5  
340.5  
367.0  
340.5  
367.0  
340.5  
340.5  
340.5  
367.0  
340.5  
340.5  
367.0  
340.5  
367.0  
340.5  
338.1  
338.1  
338.1  
338.1  
367.0  
338.1  
367.0  
338.1  
338.1  
338.1  
367.0  
338.1  
338.1  
367.0  
338.1  
367.0  
338.1  
20.6  
20.6  
20.6  
20.6  
35.0  
20.6  
35.0  
20.6  
20.6  
20.6  
35.0  
20.6  
20.6  
35.0  
20.6  
35.0  
20.6  
SOIC  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
TSSOP  
SOIC  
PW  
D
SOIC  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
SOIC  
D
TSSOP  
SOIC  
PW  
D
TSSOP  
SOIC  
PW  
D
Pack Materials-Page 2  
MECHANICAL DATA  
MCER001A – JANUARY 1995 – REVISED JANUARY 1997  
JG (R-GDIP-T8)  
CERAMIC DUAL-IN-LINE  
0.400 (10,16)  
0.355 (9,00)  
8
5
0.280 (7,11)  
0.245 (6,22)  
1
4
0.065 (1,65)  
0.045 (1,14)  
0.310 (7,87)  
0.290 (7,37)  
0.063 (1,60)  
0.015 (0,38)  
0.020 (0,51) MIN  
0.200 (5,08) MAX  
0.130 (3,30) MIN  
Seating Plane  
0.023 (0,58)  
0.015 (0,38)  
0°–15°  
0.100 (2,54)  
0.014 (0,36)  
0.008 (0,20)  
4040107/C 08/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification.  
E. Falls within MIL STD 1835 GDIP1-T8  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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Communications and Telecom www.ti.com/communications  
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