UC3709J [TI]
1A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8, CERAMIC, DIP-8;
| 型号： | UC3709J |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8, CERAMIC, DIP-8 驱动 CD 接口集成电路 驱动器 |
| 文件： | 总14页 (文件大小：548K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
D
D
D
D
D
D
1.5 Amp Source/Sink Drive
Pin Compatible with 0026 Products
40 ns Rise and Fall into 1000pF
Low Quiescent Current
simplified schematic (only one driver shown)
V
CC
5 V to 40 V Operation
Thermal Protection
5 VOLT
REGULATOR
THERMAL
SENSE
description
The UC3709 family of power drivers is an
effective low-cost solution to the problem of
providing fast turn-on and off for the
capacitive gates of power MOSFETs. Made
with a high-speed Schottky process, these
devices will provide up to 1.5 A of either
source or sink current from a totem--pole
output stage configured for minimal
cross-conduction current spike.
INPUT
A OR B
6 k
INPUT
A OR B
5.6 V
The UC3709 is pin compatible with the
MMH0026 or DS0026, and while the delay
times are longer, the supply current is much
less than these older devices.
GND
UDG--00068
With inverting logic, these units feature complete TTL compatibility at the inputs with an output stage that can
swing over 30 V. This design also includes thermal shutdown protection.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†}
Parameter
DW PACKAGE
J PACKAGE
L PACKAGE
N PACKAGE
UNIT
Supply Voltage, V
40
40
40
40
V
CC
Output Current (Source or Sink)
. . . . . . . . Steady--State
±500
±500
±500
±500
mA
A
. . . . . . . . Peak Transient
. . . . . . . . Capacitive Discharge Energy
Digital Inputs}
±1.5
±1.0
±1.0
±1.5
20
15
15
20
mJ
V
5.5
5.5
5.5
5.5
Power Dissipation at T = 25°C
1
3
1
2
1
2
1
3
W
A
Power Dissipation at T = 25°C
W
C
Operating Junction Temperature Range (T )
--55 to 125
--65 to 150
300
--55 to 125
--65 to 150
300
--55 to 125
--65 to 150
300
--55 to 125
--65 to 150
300
°C
°C
°C
J
Storage Temperature Range
Lead Temperature (Soldering, 10 Seconds)
†
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All currents are positive into and negative out of the specified terminals. Digital drive can exceed 5.5V if input is limited to 10mA. Consult the
Packaging Section of the Databook for thermal limitations and considerations of the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2004 -- 2008, Texas Instruments Incorporated
1
www.ti.com
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
THERMAL RESISTANCE TABLE
PACKAGE
SOIC--16 (DW)
DIL--16 (J)
θjc(°C/W)
θja(°C/W)
(1)
(3)
20
35 to 58
(2)
28
125 to 160
70 to 80
(2)
LCC--16 (L)
DIL--16 (N)
20
(3)
45
90
NOTES: (1) Specified thermal resistance is θjl (junction to lead)where noted.
(2) θjc data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states, “The baseline values
shownareworst case(mean+2s)fora60x60mil microcircuit devicesilicondie and applicable fordevices
with die sizes up to 14400 square mils. For device die sizes greater than 14400 square mils use the
following values; dual-in-line, 11°C/W; flat pack, .10°C/W; pin grid array, 10°C/W”.
2
(3) Specified θja (junction to ambient)is fordevices mounted to 5-inch FR4 PCboard withone ouncecopper
2
where noted. When resistance range is given, lower values are for 5 inch aluminum PC board. Test PWB
was 0.062 inch thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace
widths for non-power packages with a 100-mil x 100-mil probe land area at the end of each trace.
LCC--20 (TOP VIEW)
L PACKAGES
8 PIN DIL N OR J PACKAGE
(TOP VIEW)
SOIC--16 (TOP VIEW)
DW PACKAGE
N/C
INPUT A
GROUND
INPUT B
N/C
1
2
3
4
8
7
6
5
N/C
N/C
16
V
1
2
3
4
5
6
7
8
CC
OUTPUT
15 N/C
V
CC
N/C
14 N/C
OUTPUT
3
2
1
20 19
OUTPUT A
N/C
13 OUTPUT B
12 N/C
N/C
N/C
4
5
6
7
8
18 N/C
17 N/C
N/C -- No internal connection
INPUT A
N/C
11 INPUT B
10 N/C
GROUND
N/C
16
VCC
15 N/C
14 N/C
N/C
GROUND
9 N/C
9
10 11 12 13
2
www.ti.com
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
electrical characteristics over recommended operating free-air temperature range, TA = 55°C to
125°C for the UC1709, --40°C to 85°C for the UC2709, and 0°C to 70°C for the UC3709;
VCC = 20 V, TA = TJ.
PARAMETER
TEST CONDITIONS
Both outputs low
Both outputs high
MIN
TYP
10
MAX
12
UNIT
mA
mA
V
Supply current
7
10
Logic 0 input voltage
Logic 1 input voltage
Input current
0.8
2.2
V
V = 0
-- 0 . 6
0.05
1.5
-- 1 . 0
0.1
2.0
2.5
0.4
2.5
mA
mA
V
I
Input leakage
V = 5 V
I
I
I
I
I
= --50 mA
= --500 mA
= 50 mA
O
O
O
O
Output high saturation V -- V
CC
O
2.0
V
0.1
V
Output low saturation V
Thermal shutdown
O
= 500 mA
2.0
V
155
mA
typical switching characteristics, VCC = 20 V, TA = 25°C, delays measured to 10% output change
OUTPUT C
=
L
PARAMETER
TEST CONDITIONS
UNITS
0 nF
2.2 nF
80
Rise time delay
10% to 90% rise
Fall time delay
10% to 90% fall
80
20
60
20
25
0
ns
ns
ns
ns
ns
ns
40
80
40
Output rise
Output fall
VCC cross-- conduction
curent spike duration
NOTE: Refer to UC1705 specifications for further information.
3
www.ti.com
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
APPLICATION INFORMATION
D1, D2: UC3611 Schottky Diodes
Figure 1. Power bipolar drive circuit.
D1, D2: UC3611 Schottky Diodes
Figure 2. Power MOSFET drive circuit.
Figure 3. Charge pump circuits.
4
www.ti.com
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
D1, D2: UC3611 Schottky Diodes
Figure 4. Transformer coupled push--pull MOSFET drive circuit.
D1, D2: UC3611 Schottky Diodes
Figure 5. Power MOSFET drive circuit using negative bias voltage
and level shifting to ground referenced PWM
5
www.ti.com
UC1709, UC2709, UC3709
DUAL HIGH-SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
D1, D2: UC3611 Schottky Diodes
Figure 6. Transformer coupled MOSFET drive circuit.
6
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
LCCC
LCCC
SOIC
Drawing
5962-0151201VPA
UC1709J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
JG
8
8
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JG
UC1709J883B
UC1709L
JG
8
FK
20
20
16
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
UC1709L883B
UC2709DW
FK
DW
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2709DWG4
UC2709N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
PDIP
PDIP
SOIC
SOIC
PDIP
PDIP
DW
P
16
8
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC2709NG4
UC3709DW
UC3709DWG4
UC3709N
P
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
DW
DW
P
16
16
8
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC3709NG4
P
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2009
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
RFID
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明