UC17131J [TI]

Smart Power Switch; 智能功率开关
UC17131J
型号: UC17131J
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Smart Power Switch
智能功率开关

外围驱动器 驱动程序和接口 开关 接口集成电路
文件: 总13页 (文件大小:121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
Smart Power Switch  
FEATURES  
DESCRIPTION  
300mA Continuous Output Current  
The UC37131, UC37132 and UC37133 are a family of smart power  
switches which can drive resistive or inductive loads from the high side or  
low side.  
Low Side or High Side Switch  
Configuration  
The UC37132 is available in 14 pin (DIP), 16 pin (SOIC), or 20 pin (CLCC)  
packages and can accommodate both low side (load to VCC) or high side  
(load to GND) configurations. The UC37131 and UC37133 are exclusively  
for a low side or a high side configuration respectively and both are avail-  
able in an 8 pin package. Both high side and low side configurations provide  
high current switching with low saturation voltages which can drive resistive  
or inductive loads.  
8V to 65V Operation  
Overload and Short Circuit Protection  
Power Interruption Protection  
+6V Regulated Voltage  
2mA Quiescent Current  
The input to the switch is driven by a low voltage signal, typically 5V. Addi-  
tionally, UC37132 features adjustable hysteresis. The output of the device  
can switch a load between 8V and 65V. Output current capability is 300mA  
continuous or 700mA peak.  
Programmable Overcurrent and  
Power Interruption Protection  
1% to 30% Programmable Input  
Comparator Hysteresis (on UC37132)  
The device also has inherent smart features that allow for programmable  
turn-on delay in enabling the output following startup. The same capacitor  
that specifies the turn-on delay is also used to program a VCC power inter-  
ruption time. If VCC drops below a threshold for a time specified by this ca-  
pacitor, the output is turned off and a new turn-on delay will be re-triggered.  
Similarly, if high current persists longer than the response delay, the output  
driver will operate in a very low duty cycle mode to protect the IC.  
Low and High Side Internal High  
Current Clamps When Driving  
Inductive Loads  
UC37132 BLOCK DIAGRAM  
6V  
VREF 11  
6V/8mA  
7
6
5
VCC  
CSH  
LS  
PRE-REGULATOR  
INPUT  
COMPARATOR  
IN 13  
72V  
QOUT  
TURN-ON/OFF  
AND  
SHORT CIRCUIT  
PROTECTION  
4
3
2
HS  
1/2  
VREF  
CSL  
GND  
12  
9
10  
HYST  
LED  
CDEL  
UDG-98026  
SLUS340 - APRIL 1999  
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
UC37131 BLOCK DIAGRAM  
6V  
VREF  
3
8
7
VCC  
LS  
PRE-REGULATOR  
6V/8mA  
INPUT  
COMPARATOR  
IN  
4
72V  
HYST (FIXED) =  
30%  
QOUT  
TURN-ON/OFF  
AND  
SHORT CIRCUIT  
PROTECTION  
1/2  
VREF  
6
5
CSL  
GND  
1
2
LED  
CDEL  
UDG-98059  
UC37133 BLOCK DIAGRAM  
6V  
VREF  
3
4
8
7
VCC  
PRE-REGULATOR  
6V/8mA  
CSH  
INPUT  
COMPARATOR  
IN  
HYST (FIXED) =  
30%  
72V  
QOUT  
TURN-ON/OFF  
AND  
SHORT CIRCUIT  
PROTECTION  
6
5
HS  
1/2  
VREF  
GND  
1
2
LED  
CDEL  
UDG-98060  
2
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
CONNECTION DIAGRAMS  
ABSOLUTE MAXIMUM RATINGS  
VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65V  
LS – HS (Clamped by internal circuitry) . . . . . . . . . . . . . . . 78V  
CSH, LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65V  
Output Current  
SOIC-16 (Top View)  
(for UCX7132)  
D Package  
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400mA  
Peak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 900mA  
Remaining Pin Voltages . . . . . . . . . . . . . . . . . . . . . –0.3V to 9V  
Storage Temperature . . . . . . . . . . . . . . . . . . . 65°C to +150°C  
Junction Temperature. . . . . . . . . . . . . . . . . . . 55°C to +150°C  
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C  
N/C  
1
16  
15  
14  
13  
12  
11  
10  
9
N/C  
GND  
CSL  
HS  
2
3
4
5
6
7
8
IN  
HYST  
VREF  
CDEL  
LED  
N/C  
Currents are positive into, negative out of the specified termi-  
nal. Consult Packaging Section of Databook for thermal limita-  
tions and considerations of packages.  
LS  
CSH  
N/C  
VCC  
PLCC-20 (Top View)  
(for UCX7132)  
N/C  
L Packages  
N/C  
LS  
HS  
CSH  
CSL  
DIL-8, SOIC-8 (Top View)  
(for UCX7131)  
J, N, or D Packages  
3
2
1
20 19  
18  
N/C  
VCC  
N/C  
N/C  
N/C  
4
5
6
7
8
N/C  
GND  
N/C  
N/C  
IN  
17  
16  
15  
14  
LED  
CDEL  
VREF  
IN  
8
VCC  
1
2
3
4
7
6
5
LS  
9
10 11 12 13  
N/C  
HYST  
VREF  
CDEL  
CSL  
GND  
LED  
DIL-14 (Top View)  
(for UCX7132)  
J, or N Packages  
DIL-8, SOIC-8 (Top View)  
(for UCX7133)  
J, N, or D Packages  
N/C  
GND  
CSL  
HS  
14  
13  
12  
11  
10  
9
N/C  
1
2
3
4
5
6
7
IN  
LED  
CDEL  
VREF  
IN  
8
VCC  
CSH  
HS  
HYST  
VREF  
CDEL  
LED  
N/C  
1
2
3
4
7
6
5
LS  
CSH  
VCC  
GND  
8
PRODUCT SELECTION TABLES  
PART  
PACKAGE  
PART  
TEMPERATURE  
RANGE  
AVAILABLE  
PACKAGES  
NUMBER  
UCX7131  
UCX7132  
UCX7133  
CONFIGURATIONS  
Low Side Only  
PIN COUNT  
NUMBER  
8
14, 16, 20  
8
UC1713X  
UC2713X  
UC3713X  
–55°C to +125°C  
–40°C to +85°C  
0°C to +70°C  
J, L  
D, N  
D, N  
Low Side or High Side  
High Side Only  
3
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
ELECTRICAL CHARACTERISTICS Unless otherwise specified, CDEL = 10nF, VCC = 25V, CSL = GND, CSH = LS;  
RCSH = 0.5(Note 1); IN=0V (for OFF condition) and IN=5V (for ON condition); TA = TJ.  
PARAMETER TEST CONDITIONS MAX UNITS  
MIN  
TYP  
Reference  
VREF  
25°C  
5.8  
5.6  
6
6.2  
6.4  
35  
50  
35  
V
–55°C to 125°C  
VCC = 8V to 64V  
0 < IREF < 8mA  
REF = 0V  
6
V
Line Regulation  
Load Regulation  
10  
10  
20  
mV  
mV  
mA  
Short Circuit Current  
Input Comparator  
Turn-On Threshold Voltage  
Input Bias Current  
Hysteresis  
2.7  
3
3.3  
5
V
µA  
V
VIN = 3.5V  
RHYST = GND (Internally for X31, X33)  
RHYST = 96.67k for (X32)  
0.775  
0.9  
30  
1.025  
mV  
Output: High Side (UCX7133: CSH = LS and CSL = GND Internally; See Fig. 2a)  
Rise Time (Off to On)  
Fall Time (On to Off)  
Output Short Circuit  
Voltage Clamp  
RLOAD = 250to GND  
RLOAD = 250to GND  
HS = 0.25to GND  
30  
30  
80  
80  
V/µs  
V/µs  
mA  
V
500  
67  
900  
77  
LS–HS  
72  
Saturation Voltage  
25°C, RLOAD = 100to GND  
–40°C, RLOAD = 100to GND  
–55°C, RLOAD = 100to GND  
1.2  
1.3  
1.4  
5
V
V
V
Leakage Current  
µA  
Output: Low Side (UCX7131; CSH = VCC and CSL = HS Internally; See Fig. 2b)  
Rise Time (On to Off)  
Fall Time (Off to On)  
Output Short Circuit  
Voltage Clamp  
RLOAD = 250to VCC, RCSL = 0.5Ω  
RLOAD = 250to VCC, RCSL = 0.5Ω  
LS = 0.25to VCC  
15  
25  
50  
60  
V/µs  
V/µs  
mA  
V
500  
67  
700  
72  
900  
77  
LS–HS  
Saturation Voltage  
25°C, RLOAD = 100to VCC, RCSL = 0.5Ω  
–40°C, RLOAD = 100to VCC, RCSL = 0.5Ω  
–55°C, RLOAD = 100to VCC, RCSL = 0.5Ω  
1.2  
1.3  
1.4  
5
V
V
V
Leakage Current  
µA  
VCC Fault Section  
Output Turn-On Delay, tD(ON)  
Output Turn-Off Delay, tD(OFF)  
Step VCC from 0V to 8V (See Fig. 3a)  
9.5  
11  
13.5  
700  
ms  
Pulse VCC from 25V to VCC Turn-Off  
Threshold  
300  
500  
µs  
VCC Turn-Off Threshold  
CDEL Section  
Pulse VCC Low  
6.5  
7
7.5  
V
VCDEL_MAX  
5.8  
4.9  
1.0  
V
V
V
VFAULT_H  
VFAULT_L  
Overcurrent Fault Section (See Fig. 3c)  
Short Circuit Turn-Off Delay, tSC  
Short Circuit Recovery Time, tROFF  
High Side Current Threshold, ITH-H  
Low Side Current Threshold, ITH-L  
Overcurrent Duty Cycle  
Step ILOAD: 0mA to 400mA  
ILOAD = 400mA, 100µs  
RCSH = 0.5Ω  
75  
10  
µs  
ms  
mA  
mA  
%
250  
250  
0.6  
325  
325  
0.8  
400  
400  
1.0  
RCSL = 0.5Ω  
RLOAD = 0.25to GND  
4
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
ELECTRICAL CHARACTERISTICS Unless otherwise specified, CDEL = 10nF, VCC = 25V, CSL = GND, CSH = LS;  
RCSH = 0.5(Note 1); IN=0V (for OFF condition) and IN=5V (for ON condition); TA = TJ.  
PARAMETER TEST CONDITIONS MAX UNITS  
MIN  
TYP  
LED Output  
SINK, tDOFF, tROFF  
ILEAKAGE  
Overall  
I
VLED = 7V  
5.0  
8.0  
1
11.0  
5
mA  
µA  
Delay to Output  
ICC  
3
6
2.8  
3
µs  
Output Off  
2.0  
2.3  
2.5  
mA  
mA  
mA  
IL = 1mA, 250mA (High Side)  
IL = 1mA, 250mA (Low Side)  
4
Note 1: All test conditions are for a high side configuration as in Fig. 2a, unless otherwise specified.  
PIN DESCRIPTIONS  
CDEL: A capacitor connected to this pin is used to pro- HS: (For UC37132 and UC37133) The output of the  
gram both VCC pulse interruption time and power switching transistor in the high side configuration. The  
turn-on delay. The capacitor discharge time corresponds emitter of the output transistor is the HS pin which is con-  
to VCC interruption and the charge time to VCC turn-on nected to the load. For the UC37132, the HS pin must be  
delay. The ratio between turn-on delay and turn-off delay tied to the CSL pin in a low side application.  
will be fixed based on internal charge and discharge cur-  
rents and voltage thresholds.  
HYST: (For UC37132) The pin used to program the in-  
put comparator hysteresis by connecting a resistor to  
The same fault circuitry and capacitor is used for short  
circuit and overload protection. If an overcurrent or short  
circuit is detected, the capacitor starts charging and  
turns off the output if the condition persists at the end of  
its charge time. The output will then operate in a low-duty  
cycle mode to protect the IC. After short circuit recovery,  
the output will be reactivated in order to check if the short  
circuit was removed. If the overcurrent persists the chip  
will continue in this pulsing mode.  
ground. The hysteresis defaults to 30% with HYST  
grounded (internally for UC37131 and UC37133).  
3000  
VHYST  
=
(3330 + RHYST  
)
IN: The input to the comparator that detects when the  
output transistor should be turned on. The input thresh-  
old is 3.0V (1/2 VREF) and the input voltage range is 0V  
to VREF.  
CSH: (For UC37132 and UC37133) This high side cur-  
rent sense pin is used to program the current limit for  
high side applications by connecting a resistor between  
VCC and CSH. An over load current is detected when  
the voltage drop between VCC and CSH exceeds  
150mV. For the UC37132, in a high side application, the  
CSH pin must be tied to the LS pin; in a low side applica-  
tion, the CSH pin must be tied to VCC  
LED: Open collector output intended to drive an LED.  
This pin is driven low whenever the output is turned off  
and is externally pulled high when the output is turned on  
(see Fig. 3b and 3c).  
LS: (For UC37131 and UC37132) The output of the  
switching transistor in the low side configuration. The col-  
lector of the output transistor is the LS pin which is con-  
nected to the load. For the UC37132, the LS pin must be  
tied to the CSH pin in a high side application.  
CSL: (For UC37131 and UC37132) This low side cur-  
rent sense pin is used to program the current limit for low  
side applications by connecting a resistor between CSL  
and GND. An over load current is detected when the volt-  
age drop between CSL and GND exceeds 150mV. For  
the UC37132, in a high side application, the CSL pin  
must be tied to GND; in a low side application, the CSL  
pin must be tied to the HS pin.  
VREF: The 6V regulated reference capable of supplying  
up to 8mA. The recommended decoupling capacitor is  
1nF.  
VCC: The supply voltage for the chip. Decouple this pin  
with a good quality ceramic capacitor to ground.  
GND: The reference point for the internal reference, all  
thresholds, and the return for the remainder of the de-  
vice.  
5
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
DESCRIPTION OF OPERATION  
Reference  
current of approximately 4µA. If the power stays off lon-  
ger than this time, then a power up delay will be initial-  
ized once power is resumed. This delay is the time it  
The UC37131/2/3 family of devices features a 6V  
bandgap reference that is used to bias on-chip logic. Al-  
though the 6V reference is not trimmed, this bandgap ref-  
erence provides less than 200ppm/°C. It is also used to  
generate the on-chip 3V input comparator threshold and  
is needed for the programmable hysteresis. The on-chip  
reference has 8mA maximum current sourcing capacity  
that is designed to power up external circuitry.  
takes for CDEL to charge from 0V to V  
of 4.9V.  
FAULT_H  
The overcurrent fault normal operation consists of the  
chip staying off until CDEL fully recharges to V of  
FAULT_H  
4.9V. This is t . Once CDEL reaches 4.9V, the driver  
R(OFF)  
will turn back on. If the overcurrent fault is still present,  
the chip will operate in a very low duty cycle (approxi-  
mately 0.7%) based on the discharge (driver on) and  
charge time (driver off) of the CDEL capacitor. This  
overcurrent timing makes the chip act "smart" by allowing  
very high currents needed to drive large capacitive loads  
without setting off an overcurrent fault.  
Input Comparator  
The input comparator is a high gain comparator with hys-  
teresis that fully switches with either a small signal  
(30mV, minimum for 1% hysteresis) or a logic signal (0 to  
6V max). Only a 5mV overdrive of the 3V threshold is  
needed to switch the driver.  
The overcurrent and current limit thresholds are pro-  
grammed with the resistor R  
from CSH to VCC (high  
CSH  
The hysteresis is set to 30% on the UC37131 and  
UC37133. (This is 30% of 3V equating to 0.9V of hyster-  
esis.) On the UC37132 it is programmable from 1% to  
30%.  
side) or R  
a 150mV (I  
from CSL to GND (low side). For example,  
CSL  
R ) threshold will set the high side  
CSH  
LOAD  
overcurrent fault threshold. An overall short circuit protec-  
tion threshold is set at 300mV. Therefore, the recom-  
mended R  
of 0.5will result in the 600mA short  
Fault Logic  
CSH  
circuit. By changing the R  
mally set the overcurrent and short circuit current limits.  
value the user can opti-  
CSH  
The output of the comparator is logic ANDed with the  
output of the fault logic. If a fault, either a power interrupt  
or an overcurrent condition, persists longer than it takes  
Output Driver  
for the CDEL to discharge from its V  
level of  
CDEL_MAX  
Once the turn-on signal is gated through from the input  
comparator, the output transistor is turned on. The output  
drive transistor is a composite PNP, NPN structure. This  
is a specially designed structure that keeps all the drive  
current needed for the load to be sourced through the LS  
pin. This keeps the overall power dissipation to less than  
4mA independent of the load.  
5.8V to its V  
of 1.3V, the fault protection block will  
FAULT_L  
output a logic 0 to the NAND gate and turn off the output  
driver. If the fault goes away prior to CDEL being dis-  
charged to 1.3V, the chip will resume normal operation  
without going through a turn-on delay.  
The power interrupt normal operation consists of the chip  
turning the driver immediately back on if the interrupt  
goes away prior to CDEL reaching its lower threshold as  
described above. The CDEL capacitor is chosen based  
upon the maximum power interrupt time (t ) allowed  
without the output experiencing a turn-on delay. This in-  
The output driver also has a 72V zener diode wired be-  
tween its base and collector. This allows the output to  
swing and clamp to 72V above ground when discharging  
an inductive load in a low side application. The inductive  
zener clamp can discharge the 250mA to 400mA full  
load current. This consequently allows the LS pin to  
safely swing above VCC. Similarly, the 72V zener diode  
will allow the HS pin to safely swing and clamp 72V be-  
low LS/VCC when discharging an inductive load in a high  
side application. This 72V zener diode simplifies the user  
application by eliminating the need for external clamp di-  
odes.  
INT  
terrupt time must be less than t  
where t  
is  
D(OFF)  
D(OFF)  
equal to the time it takes the CDEL capacitor to dis-  
charge from V (5.8V) to V (1.3V) with a  
CDEL_MAX  
FAULT_L  
discharge current of approximately 94µA. If the power  
stays off only as long as t , the minimum power up  
D(OFF)  
delay will be equal to the time it takes to charge CDEL  
from V (1.3V) to V (4.9V) with a charge  
FAULT_L  
FAULT_H  
6
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
APPLICATION INFORMATION  
Choosing The CDEL Capacitor  
ence an indeterminate state during this interruption, but  
resume normal operation when VCC power returns to  
normal.  
The maximum amount of time that VCC power can be in-  
terrupted and not require the outputs to go through a  
turn-on delay cycle is user programmable by the CDEL  
capacitor value. While VCC is interrupted, the outputs  
will be in an indeterminate state and they may turn off  
If the VCC power is interrupted for a time equal to or lon-  
ger than t  
then the following relationships apply.  
D(OFF)  
As the CDEL capacitor discharges past the V  
FAULT_L  
threshold, the output is fully disabled and must cycle  
through a power up delay equal to t . The charge  
current for the CDEL capacitor is equal to 4µA. The out-  
during this interval, t . However, as long as the pro-  
grammed interruption time is not exceeded, the outputs  
will immediately turn back on with the return of VCC.  
INT  
D(ON)  
puts will turn on when the CDEL capacitor charges up to  
For example:  
the V  
threshold of 4.9V. The minimum turn-on  
FAULT_H  
tINT 500µs (User specified)  
delay the outputs will experience will occur if t  
is ex-  
INT  
actly equal to the t  
has only discharged to V . This would be the mini-  
FAULT_L  
time and the CDEL capacitor  
CDEL is selected such that the time it takes for this ca-  
D(OFF)  
pacitor to discharge from V  
(5.8V) to V  
CDEL_MAX  
FAULT_L  
mum turn-on delay time and is calculated with the follow-  
ing equation:  
(1.3V) with a discharge current of 94µA is just greater  
than this t . This time is referred to as t  
in Fig.  
INT  
D(OFF)  
3b.  
CDEL VFAULT _L VFAULT _H  
tD ON  
=
(
)
min  
IDISCHARGE tD  
ICHARGE  
OFF  
(
)
CDEL =  
VCDEL_MAX VFAULT _L  
Using the 10nF CDEL capacitor, for example, the mini-  
mum turn-on delay calculates to 9ms. If the CDEL ca-  
pacitor discharges completely to zero, then the 10nF  
CDEL capacitor would cause a turn-on delay of 12.25ms.  
The outputs would be off for this amount of time after  
VCC power is restored. The total amount of time the out-  
If t  
is set equal to t , which the user has selected  
D(OFF)  
INT  
to be 500µs, the minimum CDEL capacitor is calculated:  
94µA 500µs  
CDEL =  
5.8V 1.3V  
puts could be disabled is equal to the t  
may include the indeterminate time of t  
time, which  
INT  
For this application, the CDEL capacitor value calculates  
to 10.4nF. By using a 10nF capacitor on CDEL, VCC can  
be interrupted for up to 478µs and the outputs will experi-  
, and the  
D(OFF)  
t
time, as shown in Fig. 3b.  
D(ON)  
VREF  
VCC  
7
6V  
11  
+ L  
PRE-REGULATOR  
ICC  
RCSH  
CREF  
CSH  
6
POWER  
SUPPLY  
LS  
5
INPUT  
COMPARATOR  
IN 13  
VREF  
GND  
72V  
CCC  
QOUT  
HS  
4
OUT  
1/2  
TURN-ON/OFF  
AND SHORT  
CIRCUIT  
VREF  
LOAD  
CSL  
3
PROTECTION  
GND  
2
– L  
IGND  
12  
9
LED  
10  
HYST  
CDEL  
CCDEL  
R HYST  
UDG-98027  
Figure 2a. High side application.  
7
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
APPLICATION INFORMATION (cont.)  
VREF  
VCC  
ICC  
6V  
11  
7
+ L  
PRE-REGULATOR  
CREF  
CSH  
LS  
LOAD  
CCC  
6
5
OUT  
INPUT  
COMPARATOR  
IN 13  
72V  
POWER  
SUPPLY  
VREF  
GND  
QOUT  
HS  
4
3
TURN-ON/OFF  
AND SHORT  
CIRCUIT  
CSL  
1/2  
VREF  
PROTECTION  
RCSL  
GND  
2
– L  
IGND  
12  
9
10  
CDEL  
HYST  
LED  
CCDEL  
RHYST  
UDG-98028  
Figure 2b. Low side application.  
tINT  
VCC  
t
t
VCDEL_MAX = 5.8V  
VFAULT_H = 4.9V  
VCDEL  
VFAULT_H  
tD(ON)  
OUTPUT  
DRIVER  
DISABLED  
ENABLED  
ENABLED  
t
INDETERMINATE  
STATE  
UDG-98029  
Figure 3a. Power interrupt ignore operation, high side configuration, V = 5VDC.  
IN  
8
UC17131/2/3  
UC27131/2/3  
UC37131/2/3  
APPLICATION INFORMATION (cont.)  
tINT  
VCC  
t
t
VCDEL_MAX = 5.8V  
VFAULT_H = 4.9V  
VFAULT_L = 1.0V  
VCDEL  
VFAULT_H  
tD(OFF)  
tD(ON)  
tD(ON)  
OUTPUT  
DRIVER  
DISABLED  
DISABLED  
ENABLED  
ENABLED  
t
LED  
t
INDETERMINATE  
STATE  
UDG-98030  
Figure 3b. Power interrupt fault operation, high side configuration, V = 5VDC.  
IN  
I
LOAD  
t
4.9V  
V
CDEL  
t
t
tSC  
OUTPUT  
DRIVER  
tR(OFF)  
LED  
t
UDG-98031  
Figure 3c. Overcurrent fault operation.  
UNITRODE CORPORATION  
7 CONTINENTAL BOULEVARD MERRIMACK, NH 03054  
TEL (603) 424-2410 FAX (603) 424-3460  
9
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
UC17131J  
UC17132J  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
LCCC  
CDIP  
SOIC  
JG  
8
8
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-55 to 125  
-55 to 125  
0 to 70  
JG  
UC17132L883B  
UC17133J  
FK  
20  
8
Call TI  
Call TI  
JG  
Call TI  
Call TI  
-55 to 125  
-40 to 85  
UC27131D  
D
8
75  
75  
50  
50  
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
UC27131  
UC27131DG4  
UC27131N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
D
P
P
D
D
8
8
8
8
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
UC27131  
UC27131N  
UC27131N  
UC27133  
UC27133  
UC37131  
Green (RoHS  
& no Sb/Br)  
UC27131NG4  
UC27133D  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
UC27133DG4  
Green (RoHS  
& no Sb/Br)  
UC37131D  
UC37131DG4  
UC37132D  
OBSOLETE  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
16  
40  
40  
25  
25  
75  
75  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
UC37132  
UC37132  
UC37132N  
UC37132N  
UC37133  
UC37133  
UC37133N  
UC37132DG4  
UC37132N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
PDIP  
D
N
N
D
D
P
16  
14  
14  
8
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
Green (RoHS  
& no Sb/Br)  
UC37132NG4  
UC37133D  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
UC37133DG4  
UC37133N  
8
Green (RoHS  
& no Sb/Br)  
8
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
UC37133NG4  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
PDIP  
P
8
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
N / A for Pkg Type  
0 to 70  
UC37133N  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UC17131, UC17132, UC17133, UC37131, UC37132, UC37133 :  
Catalog: UC37131, UC37132, UC37133  
Military: UC17131, UC17132, UC17133  
NOTE: Qualified Version Definitions:  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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