TWL6030B1A0CMR [TI]

Fully Integrated Power Management with Switch Mode Charger; 完全集成的电源管理开关模式充电器
TWL6030B1A0CMR
型号: TWL6030B1A0CMR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Fully Integrated Power Management with Switch Mode Charger
完全集成的电源管理开关模式充电器

电源电路 开关 电源管理电路
文件: 总9页 (文件大小:630K)
中文:  中文翻译
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TWL6030  
www.ti.com  
SWCS051B AUGUST 2010REVISED DECEMBER 2012  
Fully Integrated Power Management with Switch Mode Charger  
1
FEATURES  
Control  
Configurable power-up and power-down  
sequences (OTP memory)  
Seven highly efficient 6-MHz buck converters  
Two 0.6 to 2.1 V @ 1.5 A (up to 2.0 A with  
some limitations)  
Three output signals that can be included  
in the start-up sequence  
Two I2Cinterfaces  
All resources configurable by I2C  
Five 0.6 to 2.1 V @ 0.8 A (up to 1.0 A with  
some limitations)  
11 General-purpose LDOs  
Clock management  
32-kHz output  
Six 1.0 to 3.3 V @ 0.2 A with battery or  
preregulated supply (One can be used as a  
vibrator driver.)  
Battery charger 1.5 A  
One 1.0 to 3.3 V @ 50 mA with battery or  
preregulated supply  
Charger for single-cell Li-Ion and  
Li-Polymer battery packs  
One low noise 1.0 to 3.3 V @ 50 mA with  
battery or preregulated supply  
Switched mode charger with integrated  
power FET for up to 1.5-A current  
3.3 V @ 35 mA USB LDO  
High-accuracy voltage and current  
regulation  
One LDO for TWL6030 internal use  
One LDO for internal and external use  
Safety timer and reset control  
Thermal regulation protection  
Input/output overvoltage protection  
Charging indicator LED driver  
Boost mode operation for USB OTG  
Compliant with:  
USB OTG module  
Backup battery charger  
10-bit ADC with 17 input channels  
13-bit Coulomb counter with four  
programmable integration periods  
Low power consumption  
USB 2.0  
5 µA in backup mode  
20 µA in wait-on mode  
OTG and EH 2.0  
YD/T 1591-2006  
USB battery charging 1.2  
110 µA in deep sleep, with two DCDCs  
active  
Japanese battery charging requirements  
(JEITA)  
RTC with alarm wake-up mechanism  
SIM and MMC card detections  
Two digital PWM outputs  
Package 7 mm x 7 mm 187-pin nFBGA  
APPLICATIONS  
Thermal monitoring  
High-temperature warning  
Thermal shutdown  
Mobile phones and smart phones  
Gaming handsets  
Portable media players  
Portable navigation systems  
Handheld devices  
Tablets  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20102012, Texas Instruments Incorporated  
TWL6030  
SWCS051B AUGUST 2010REVISED DECEMBER 2012  
www.ti.com  
DESCRIPTION  
The TWL6030 device is an integrated power-management integrated circuit (IC) for applications powered by a  
rechargeable battery. The device provides seven configurable step-down converters with up to 2.0-A capability  
for memory, processor core, I/O, auxiliary, preregulation for LDOs, etc. The device also contains 11 LDO  
regulators that can be supplied from a battery or a preregulated supply. Power-up/power-down controller is  
configurable and can support any power-up/power-down sequences (programmed in OTP memory). The  
real-time clock (RTC) provides a 32-kHz output buffer, second/minute/hour/day/month/year information, and  
alarm wake up. The TWL6030 supports 32-kHz clock generation based on a crystal oscillator. The device  
integrates a switched-mode charger allowing faster battery charge, higher efficiency, and less power dissipation.  
The TWL6030 device generates power supplies for OMAP4 processors and operates together with the  
TWL6040 device, which includes all audio and related detection features. For audio IC parameters, see the  
TWL6040 datasheet. The TWL6030 is available in an nFBGA package, 7.0 mm x 7.0 mm, with a 0.4-mm ball  
pitch.  
Figure 1 shows the TWL6030 block diagram.  
2
Copyright © 20102012, Texas Instruments Incorporated  
TWL6030  
www.ti.com  
SWCS051B AUGUST 2010REVISED DECEMBER 2012  
BOOT0  
BOOT1  
BOOT2  
TESTV  
REFS  
BOOT3  
RESPWRON  
NRESWARM  
PWRON  
RPWRON  
PREQ1  
VCORE1_IN  
VCORE1_SW  
PREQ2A  
PREQ2B  
PREQ2C  
PREQ3  
INT  
SYSEN  
REGEN1  
REGEN2  
TESTEN  
VCORE1  
VCORE1_FDBK  
SR bus  
Events bus  
VCORE1_GND  
VCORE2_IN  
VCORE2_SW  
Events detect  
SRI2C_SCL  
SRI2C_SDA  
MSECURE  
VCORE2  
VCORE3  
VMEM  
V1V8  
2
I
C SmartReflex  
VCORE2_FDBK  
OCP bus  
OSC32KIN  
VCORE2_GND  
VCORE3_IN  
Xtal  
32K  
RC  
32K  
RC  
6M  
OSC32KCAP  
OSC32KOUT  
Power control  
VCORE3_SW  
CLK32KAO  
CLK32KG  
CLK32KAUDIO  
VCORE3_FDBK  
RTC  
VCORE3_GND  
VMEM_IN  
ID  
USB SRP  
VMEM_SW  
CTLI2C_SCL  
CTLI2C_SDA  
2
I
C control  
VMEM_FDBK  
2
C to OCP  
I
SIM  
VMEM_GND  
V1V8_IN  
Card detect  
and  
PWM  
MMC  
BATREMOVAL  
PWM1  
V1V8_SW  
PWM2  
GPADC_IN0  
GPADC_IN1  
GPADC_VREF1  
GPADC_IN2  
GPADC_IN3  
GPADC_IN4  
GPADC_VREF4  
GPADC_IN5  
GPADC_IN6  
V1V8_FDBK  
V1V8_GND  
V1V2_IN  
Control, data,  
and  
test logic  
10-bit  
ADC  
V2V1_SW  
V2V1  
V2V1_FDBK  
GPADC_START  
V2V1_GND  
V1V29_IN  
GGAUGE_RESN  
GGAUGE_RESP  
13-bit  
SD  
Digital  
filter  
V1V29_SW  
ADC  
V1V29  
V1V29_FDBK  
Interrupt handler  
V1V29_GND  
VANA_IN  
CHRG_EXTCHRG_ENZ  
CHRG_EXTCHRG_STATZ  
Ext  
charger  
ctl  
OSC  
3 MHz  
VAC  
VANA  
VANA  
VBUS  
CHRG_PMID  
VRTC_IN  
VRTC  
CHRG_SW  
USB  
charger  
and  
VBUS  
OTG  
CHRG_CSIN  
VRTC  
CHRG_CSOUT  
CHRG_GND  
CHRG_AUXPWR  
GND_DIG_VRTC  
VBAT  
SWCS045-001  
Figure 1. TWL6030 Block Diagram  
Copyright © 20102012, Texas Instruments Incorporated  
3
TWL6030  
SWCS051B AUGUST 2010REVISED DECEMBER 2012  
www.ti.com  
space  
For the complete TWL6030 data sheet, contact your TI sales representative. The document is internally  
available for download on ESP under the corresponding TWL6030 product folders and can be shared  
with customers.  
4
Copyright © 20102012, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Jun-2013  
PACKAGING INFORMATION  
Orderable Device  
TWL6030B107CMR  
TWL6030B107CMRR  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
FCBGA  
FCBGA  
CMR  
187  
187  
260  
Green (RoHS  
& no Sb/Br)  
Call TI  
Call TI  
Level-3-260C-168 HR  
6030B107  
ACTIVE  
CMR  
2500  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
-40 to 85  
6030B107  
TWL6030B1A0CMR  
TWL6030B1A0CMRR  
ACTIVE  
ACTIVE  
FCBGA  
FCBGA  
CMR  
CMR  
187  
187  
260  
TBD  
Call TI  
Call TI  
Call TI  
6030B1A0  
6030B1A0  
2500  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
TWL6030B1A4CMR  
TWL6030B1A4CMRR  
ACTIVE  
ACTIVE  
FCBGA  
FCBGA  
CMR  
CMR  
187  
187  
260  
Green (RoHS  
& no Sb/Br)  
Call TI  
Call TI  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 85  
-40 to 85  
6030B1A4  
6030B1A4  
2500  
Green (RoHS  
& no Sb/Br)  
TWL6030B1AACMR  
TWL6030B1AACMRR  
ACTIVE  
ACTIVE  
FCBGA  
FCBGA  
CMR  
CMR  
187  
187  
260  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
6030B1AA  
6030B1AA  
2500  
TBD  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Jun-2013  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Jun-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TWL6030B107CMRR  
TWL6030B1A0CMRR  
TWL6030B1A4CMRR  
TWL6030B1AACMRR  
FCBGA  
FCBGA  
FCBGA  
FCBGA  
CMR  
CMR  
CMR  
CMR  
187  
187  
187  
187  
2500  
2500  
2500  
2500  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
7.3  
7.3  
7.3  
7.3  
1.5  
1.5  
1.5  
1.5  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Jun-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TWL6030B107CMRR  
TWL6030B1A0CMRR  
TWL6030B1A4CMRR  
TWL6030B1AACMRR  
FCBGA  
FCBGA  
FCBGA  
FCBGA  
CMR  
CMR  
CMR  
CMR  
187  
187  
187  
187  
2500  
2500  
2500  
2500  
336.6  
336.6  
336.6  
336.6  
336.6  
336.6  
336.6  
336.6  
31.8  
31.8  
31.8  
31.8  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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Applications  
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www.ti.com/audio  
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e2e.ti.com  
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Copyright © 2013, Texas Instruments Incorporated  

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