TUSB8043ARGCT [TI]

具有 HID 转 I2C 的四端口 USB 3.2 Gen 1x1 集线器 | RGC | 64 | 0 to 70;
TUSB8043ARGCT
型号: TUSB8043ARGCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 HID 转 I2C 的四端口 USB 3.2 Gen 1x1 集线器 | RGC | 64 | 0 to 70

文件: 总63页 (文件大小:3226K)
中文:  中文翻译
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TUSB8043A  
ZHCSJZ1 JUNE 2019  
带有 USB 告示板 的 TUSB8043A  
1 特性  
2 应用  
计算机系统、扩展坞、监视器和机顶盒  
1
四端口 USB 3.2 x1 Gen1 (5Gbps) 集线器  
USB 2.0 集线器 特性  
3 说明  
多个转发器 (MTT) 集线器:四个转发器  
TUSB8043A 是一款四端口 USB 3.2 1 代  
每个转发器具有两个异步端点缓冲器  
5Gbps)集线器。该器件在上行端口上可提供同步超  
快速和高速/全速 USB 连接,在下行端口上可提供超快  
速、高速、全速或者低速 USB 连接。当上行端口连接  
到一个仅支持高速或全速/低速连接的电气环境中时,  
下行端口上的超快速 USB 连接将会禁用。  
支持电池充电:  
在未连接或未配置上行端口的情况下,可支持  
D+/D- 分频器充电端口(ACP1ACP2 和  
ACP3)  
在未连接上行端口的情况下,可支持自动模式以  
DCP ACP 模式之间进行切换  
器件信息(1)  
支持 galaxy 充电  
器件型号  
TUSB8043A  
TUSB8043AI  
封装  
VQFN (64)  
VQFN (64)  
封装尺寸(标称值)  
9.00mm x 9.00mm  
9.00mm x 9.00mm  
CDP 模式(上行端口已连接)  
DCP 模式(上行端口未连接)  
DCP 模式符合中国电信行业标准 YD/T 1591-  
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。  
2009  
支持作为一个 USB 3.2 1 代或者 USB 2.0 复合  
设备运行  
支持每端口或成组电源开关以及过流通知输入  
USB 3.1 System Implementation  
支持四个外部下行端口且内部仅支持 USB 2.0 端  
口,适用于 USB HID I2C 功能  
USB 3.x Host Controller  
适用于通过 USB HID 以实现 I2C 控制的内部下行  
端口支持高速、全速运行。其运行速度与上行端口  
速度匹配。  
USB 2.0  
HID to I2C  
支持读取和写入 I2C 的供应商请求,并且在 100k  
USB 2.0  
Device  
TUSB8043A  
USB 3.x  
Device  
400k(默认)条件下支持 EEPROM 读取  
I2C 主机支持时钟扩展  
OTP ROM、串行 EEPROM I2C/SMBus 从机接  
口可实现定制配置:  
USB 2.0  
Device  
USB 3.x Hub  
USB 2.0 Hub  
USB 3.x  
Device  
USB 2.0  
Device  
VID PID  
USB 3.x  
Device  
USB 1.1  
Device  
端口定制  
USB 1.1  
Device  
制造商和产品字符串(非通过 OTP ROM)  
序列号(非通过 OTP ROM)  
可使用引脚选择、EEPROM I2C/SMBus 从设备  
USB 1.x Connection  
USB 2.0 Connection  
USB 2.0/3.x Device  
USB 3.x Device  
USB 2.0 Device  
USB 1.x Device  
接口选择应用特性  
USB 3.x Connection  
提供 128 位通用唯一标识符 (UUID)  
支持通过 USB 2.0 上行端口进行板载和系统内  
EEPROM 编程  
单个时钟输入、24MHz 晶体或晶振  
仅可对 USB2.0 下行端口进行配置  
64 引脚 QFN 封装 (RGC)  
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确  
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。  
English Data Sheet: SLLSF94  
 
 
 
TUSB8043A  
ZHCSJZ1 JUNE 2019  
www.ti.com.cn  
目录  
8.5 Register Maps......................................................... 25  
Application and Implementation ........................ 40  
9.1 Application Information............................................ 40  
9.2 Typical Application .................................................. 40  
1
2
3
4
5
6
7
特性.......................................................................... 1  
9
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
说明 (续.............................................................. 3  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 9  
7.1 Absolute Maximum Ratings ...................................... 9  
7.2 ESD Ratings.............................................................. 9  
7.3 Recommended Operating Conditions....................... 9  
7.4 Thermal Information.................................................. 9  
7.5 Electrical Characteristics......................................... 10  
7.6 Timing Requirements.............................................. 12  
Detailed Description ............................................ 14  
8.1 Overview ................................................................. 14  
8.2 Functional Block Diagram ....................................... 14  
8.3 Feature Description................................................. 15  
8.4 Device Functional Modes........................................ 22  
10 Power Supply Recommendations ..................... 49  
10.1 TUSB8043A Power Supply................................... 49  
10.2 Downstream Port Power ....................................... 49  
10.3 Ground .................................................................. 49  
11 Layout................................................................... 50  
11.1 Layout Guidelines ................................................. 50  
11.2 Layout Examples................................................... 51  
12 器件和文档支持 ..................................................... 53  
12.1 接收文档更新通知 ................................................. 53  
12.2 社区资源................................................................ 53  
12.3 ....................................................................... 53  
12.4 静电放电警告......................................................... 53  
12.5 Glossary................................................................ 53  
13 机械、封装和可订购信息....................................... 53  
8
4 修订历史记录  
日期  
修订版本  
说明  
2019 6 月  
*
初始版本。  
2
版权 © 2019, Texas Instruments Incorporated  
 
TUSB8043A  
www.ti.com.cn  
ZHCSJZ1 JUNE 2019  
5 说明 (续)  
当上行端口连接到一个仅支持全速/低速连接的电气环境中时,下行端口上的超快速 USB 和高速连接将会禁用。  
TUSB8043A 支持每端口或成组电源开关和过流保护,并且还支持电池充电 应用中节省电路板空间。  
按照 USB 主机的要求,通过端口电源单独控制集线器开关为每个下行端口上电或者断电。另外,当端口电源单独  
控制集线器检测到过流事件时,仅关闭受影响下行端口的电源。  
当需要为任一端口供电时,一个成组集线器开关打开到其所有下行端口的电源。只有当所有端口处于电源可被移除  
的状态时,到下行端口的电源才可被关闭。另外,当端口电源单独控制集线器检测到过流事件时,会关闭所有下行  
端口的电源。  
TUSB8043A 下行端口可提供电池充电下行端口 (CDP) 握手支持,以此为电池充电 应用 提供支持。在未连接上行  
端口的情况下,该器件还支持专用充电端口 (DCP) 模式。DCP 模式适用于支持 USB 电池充电、Galaxy 充电和符  
合中国电信行业标准 YD/T 1591-2009 USB 器件。 此外,在未连接上行端口的情况下,TUSB8043A 支持分频  
器充电端口模式(ACPx 模式),并且可在所有模式之间进行自动切换,切换顺序从 ACP3 模式开始,到 DCP 模  
式结束。  
TUSB8043A 能够为包括电池充电支持在内的部分 特性 提供引脚搭接配置,还能够通过 OTP ROMI2C  
EEPROM I2C/SMBus 从机接口为 PIDVID、自定义端口和物理层配置提供定制支持。使用 I2C EEPROM 或  
I2C/SMBus 从机接口时,还可以提供定制字串支持。  
TUSB8043A 通过内部 USB HID I2C 接口支持连接的 EEPROM 编程。  
该器件采用 64 引脚 RGC 封装,商用版 (TUSB8043A) 的工作温度范围为 0°C 70°C,工业版 (TUSB8043AI) 的  
工作温度范围为 –40°C 85°C。  
Copyright © 2019, Texas Instruments Incorporated  
3
TUSB8043A  
ZHCSJZ1 JUNE 2019  
www.ti.com.cn  
6 Pin Configuration and Functions  
RGC Package  
64 Pin (VQFN)  
(Top View)  
USB_DP_DN1  
USB_DM_DN1  
USB_SSTXP_DN1  
USB_SSTXM_DN1  
VDD  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
USB_VBUS  
OVERCUR2z  
OVERCUR1z  
2
3
4
AUTOENz/HS_SUSPEND  
OVERCUR3z  
5
USB_SSRXP_DN1  
USB_SSRXM_DN1  
VDD  
6
OVERCUR4z  
7
GANGED/SMBA2/HS_UP  
PWRCTL_POL  
8
Thermal  
Pad  
USB_DP_DN2  
USB_DM_DN2  
USB_SSTXP_DN2  
USB_SSTXM_DN2  
VDD  
9
FULLPWRMGMTz/SMBA1/SS_UP  
SMBUSz/SS_SUSPEND  
SCL/SMBCLK  
10  
11  
12  
13  
14  
15  
16  
SDA/SMBDAT  
PWRCTL1/BATEN1  
PWRCTL2/BATEN2  
VDD33  
USB_SSRXP_DN2  
USB_SSRXM_DN2  
VDD33  
PWRCTL3/BATEN3  
Not to scale  
Pin Functions  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
Clock and Reset Signals  
Global power reset. This reset brings all of the TUSB8043A internal registers to their default  
states. When GRSTz is asserted, the device is completely nonfunctional.  
GRSTz  
50  
62  
I, PU  
I
Crystal input. This pin is the crystal input for the internal oscillator. The input may alternately  
be driven by the output of an external oscillator. When using a crystal a 1-Mfeedback  
resistor is required between XI and XO.  
XI  
4
Copyright © 2019, Texas Instruments Incorporated  
TUSB8043A  
www.ti.com.cn  
ZHCSJZ1 JUNE 2019  
Pin Functions (continued)  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
Crystal output. This pin is the crystal output for the internal oscillator. If XI is driven by an  
external oscillator this pin may be left unconnected. When using a crystal a 1-Mfeedback  
resistor is required between XI and XO.  
XO  
61  
O
USB Upstream Signals  
USB_SSTXP_UP  
USB_SSTXM_UP  
USB_SSRXP_UP  
USB_SSRXM_UP  
USB_DP_UP  
55  
56  
58  
59  
53  
54  
O
O
I
USB SuperSpeed transmitter differential pair (positive)  
USB SuperSpeed transmitter differential pair (negative)  
USB SuperSpeed receiver differential pair (positive)  
USB SuperSpeed receiver differential pair (negative)  
USB High-speed differential transceiver (positive)  
USB High-speed differential transceiver (negative)  
I
I/O  
I/O  
I
USB_DM_UP  
Precision resistor reference. A 9.53-k±1% resistor should be connected between USB_R1  
and GND.  
USB_R1  
64  
I
USB upstream port power monitor. The VBUS detection requires a voltage divider. The signal  
USB_VBUS must be connected to VBUS through a 90.9-K±1% resistor, and to ground  
through a 10-k±1% resistor from the signal to ground.  
USB_VBUS  
48  
USB Downstream Signals  
USB_SSTXP_DN1  
USB_SSTXM_DN1  
USB_SSRXP_DN1  
USB_SSRXM_DN1  
USB_DP_DN1  
3
4
6
7
1
2
O
O
I
USB SuperSpeed transmitter differential pair (positive)  
USB SuperSpeed transmitter differential pair (negative)  
USB SuperSpeed receiver differential pair (positive)  
USB SuperSpeed receiver differential pair (negative)  
USB High-speed differential transceiver (positive)  
USB High-speed differential transceiver (negative)  
I
I/O  
I/O  
USB_DM_DN1  
USB Port 1 Power On Control for Downstream Power/Battery Charging Enable. The pin is  
used for control of the downstream power switch for Port 1. This pin be left unconnected if  
power management is not implemented.  
In addition, the value of the pin is sampled at the de-assertion of reset to determine the value  
of the battery charging support for Port 1 as indicated in the Battery Charging Support  
register:  
PWRCTL1/BATEN1  
36  
I/O, PD  
0 = Battery charging not supported  
1 = Battery charging supported  
USB Port 1 Over-Current Detection. This pin is typically connected to the over current output  
of the downstream port power switch for Port 1.  
0 = An over current event has occurred  
1 = An over current event has not occurred  
OVERCUR1z  
46  
I, PU  
When GANGED power management is enabled, this pin or one of the other OVERCURz pins  
must be connected to the over current output of the power switch or circuit which detects the  
over current conditions. For the case when another OVERCURz pin is used, this pin can be  
left unconnected.  
USB_SSTXP_DN2  
USB_SSTXM_DN2  
USB_SSRXP_DN2  
USB_SSRXM_DN2  
USB_DP_DN2  
11  
12  
14  
15  
9
O
O
I
USB SuperSpeed transmitter differential pair (positive)  
USB SuperSpeed transmitter differential pair (negative)  
USB SuperSpeed receiver differential pair (positive)  
USB SuperSpeed receiver differential pair (negative)  
USB High-speed differential transceiver (positive)  
USB High-speed differential transceiver (negative)  
I
I/O  
I/O  
USB_DM_DN2  
10  
USB Port 2 Power On Control for Downstream Power/Battery Charging Enable. The pin is  
used for control of the downstream power switch for Port 2. This pin be left unconnected if  
power management is not implemented.  
In addition, the value of the pin is sampled at the de-assertion of reset to determine the value  
of the battery charging support for Port 2 as indicated in the Battery Charging Support  
register:  
PWRCTL2/BATEN2  
35  
I/O, PD  
0 = Battery charging not supported  
1 = Battery charging supported  
Copyright © 2019, Texas Instruments Incorporated  
5
TUSB8043A  
ZHCSJZ1 JUNE 2019  
www.ti.com.cn  
Pin Functions (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
USB Port 2 Over-Current Detection. This pin is typically connected to the over current output  
of the downstream port power switch for Port 2.  
0 = An over current event has occurred  
1 = An over current event has not occurred  
OVERCUR2z  
47  
I, PU  
When GANGED power management is enabled, this pin or one of the other OVERCURz pins  
must be connected to the over current output of the power switch or circuit which detects the  
over current conditions. For the case when another OVERCURz pin is used, this pin can be  
left unconnected.  
USB_SSTXP_DN3  
USB_SSTXM_DN3  
USB_SSRXP_DN3  
USB_SSRXM_DN3  
USB_DP_DN3  
19  
20  
22  
23  
17  
18  
O
O
I
USB SuperSpeed transmitter differential pair (positive)  
USB SuperSpeed transmitter differential pair (negative)  
USB SuperSpeed receiver differential pair (positive)  
USB SuperSpeed receiver differential pair (negative)  
USB High-speed differential transceiver (positive)  
USB High-speed differential transceiver (negative)  
I
I/O  
I/O  
USB_DM_DN3  
USB Port 3 Power On Control for Downstream Power/Battery Charging Enable. The pin is  
used for control of the downstream power switch for Port 3. This pin be left unconnected if  
power management is not implemented.  
In addition, the value of the pin is sampled at the de-assertion of reset to determine the value  
of the battery charging support for Port 3 as indicated in the Battery Charging Support  
register:  
PWRCTL3/BATEN3  
33  
I/O, PD  
0 = Battery charging not supported  
1 = Battery charging supported  
USB Port 3 Over-Current Detection. This pin is typically connected to the over current output  
of the downstream port power switch for Port 3.  
0 = An over current event has occurred  
1 = An over current event has not occurred  
OVERCUR3z  
44  
I, PU  
When GANGED power management is enabled, this pin or one of the other OVERCURz pins  
must be connected to the over current output of the power switch or circuit which detects the  
over current conditions. For the case when another OVERCURz pin is used, this pin can be  
left unconnected.  
USB_SSTXP_DN4  
USB_SSTXM_DN4  
USB_SSRXP_DN4  
USB_SSRXM_DN4  
USB_DP_DN4  
26  
27  
29  
30  
24  
25  
O
O
I
USB SuperSpeed transmitter differential pair (positive)  
USB SuperSpeed transmitter differential pair (negative)  
USB SuperSpeed receiver differential pair (positive)  
USB SuperSpeed receiver differential pair (negative)  
USB High-speed differential transceiver (positive)  
USB High-speed differential transceiver (negative)  
I
I/O  
I/O  
USB_DM_DN4  
USB Port 4 Power On Control for Downstream Power/Battery Charging Enable. The pin is  
used for control of the downstream power switch for Port 4. This pin be left unconnected if  
power management is not implemented.  
In addition, the value of the pin is sampled at the de-assertion of reset to determine the value  
of the battery charging support for Port 4 as indicated in the Battery Charging Support  
register:  
PWRCTL4/BATEN4  
32  
I/O, PD  
0 = Battery charging not supported  
1 = Battery charging supported  
USB Port 4 Over-Current Detection. This pin is typically connected to the over current output  
of the downstream port power switch for Port 4.  
0 = An over current event has occurred  
1 = An over current event has not occurred  
OVERCUR4z  
43  
I, PU  
When GANGED power management is enabled, this pin or one of the other OVERCURz pins  
must be connected to the over current output of the power switch or circuit which detects the  
over current conditions. For the case when another OVERCURz pin is used, this pin can be  
left unconnected.  
I2C/SMBUS I2C Signals  
6
Copyright © 2019, Texas Instruments Incorporated  
TUSB8043A  
www.ti.com.cn  
ZHCSJZ1 JUNE 2019  
Pin Functions (continued)  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
I2C clock/SMBus clock. Function of pin depends on the setting of the SMBUSz input.  
When SMBUSz = 1, this pin acts as the serial clock interface for an I2C EEPROM.  
When SMBUSz = 0, this pin acts as the serial clock interface for an SMBus host.  
Can be left unconnected if external interface not implemented.  
I2C data/SMBus data. Function of pin depends on the setting of the SMBUSz input.  
When SMBUSz = 1, this pin acts as the serial data interface for an I2C EEPROM.  
When SMBUSz = 0, this pin acts as the serial data interface for an SMBus host.  
Can be left unconnected if external interface not implemented.  
SCL/SMBCLK  
SDA/SMBDAT  
38  
I/O, PD  
37  
39  
I/O, PD  
I2C/SMBus mode select/SuperSpeed USB Suspend Status. The value of the pin is sampled  
at the de-assertion of reset set I2C or SMBus mode as follows:  
1 = I2C Mode Selected  
0 = SMBus Mode Selected  
SMBUSz/SS_SUSPEND  
I/O, PU  
Can be left unconnected if external interface not implemented.  
After reset, this signal indicates the SuperSpeed USB Suspend status of the upstream port if  
enabled through the stsOutputEn bit in the Additional Feature Configuration register. When  
enabled, a value of 1 indicates the connection is suspended.  
Test and Miscellaneous Signals  
Full power management enable/SMBus address bit 1/SuperSpeed USB Connection Status  
Upstream port.  
The value of the pin is sampled at the de-assertion of reset to set the power switch control  
follows:  
0 = Power switching and over current inputs supported  
1 = Power switching and over current inputs not supported  
Full power management is the ability to control power to the downstream ports of the  
TUSB8043A using PWRCTL[4:1]/BATEN[4:1].  
If BATENx = 1 on any port, full power management must be enabled so the value of the  
terminal is sampled at the de-assertion to initialize the value of the FULLAUTOz bit.  
FULLPWRMGMTz/FULL  
40  
I/O, PD  
AUTOz/SMBA1/SS_UP  
When AUTOENz = 0 and FULLAUTOz = 0: all ACP modes are supported.  
When AUTOENz = 0 and FULLAUTOz = 1:only highest current ACP mode is used in auto  
mode.  
When SMBus mode is enabled, this pin sets the value of the SMBus slave address bit 1.  
Can be left unconnected if full power management and SMBus are not implemented.  
After reset, this signal indicates the SuperSpeed USB connection status of the upstream port  
if enabled through the stsOutputEn bit in the Additional Feature Configuration register. When  
enabled a value of 1 indicates the upstream port is connected to a SuperSpeed USB capable  
port.  
Note: Power switching must be supported for battery charging applications.  
Power Control Polarity.  
The value of the pin is sampled at the de-assertion of reset to set the polarity of  
PWRCTL[4:1].  
I/O, PU  
PWRCTL_POL  
41  
0 = PWRCTL polarity is active low  
1 = PWRCTL polarity is active high  
Copyright © 2019, Texas Instruments Incorporated  
7
TUSB8043A  
ZHCSJZ1 JUNE 2019  
www.ti.com.cn  
Pin Functions (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
Ganged operation enable/SMBus Address bit 2/HS Connection Status Upstream Port.  
The value of the pin is sampled at the de-assertion of reset to set the power switch and over  
current detection mode as follows:  
0 = Individual power control supported when power switching is enabled  
1 = Power control gangs supported when power switching is enabled  
GANGED/SMBA2/HS_U  
P
When SMBus mode is enabled using SMBUSz, this pin sets the value of the SMBus slave  
address bit 2.  
42  
I/O, PD  
After reset, this signal indicates the High-speed USB connection status of the upstream port if  
enabled through the stsOutputEn bit in Additional Feature Configuration register. When  
enabled, a value of 1 indicates the upstream port is connected to a High-speed USB capable  
port.  
Note: Individual power control must be enabled for battery charging applications.  
Automatic Charge Mode Enable/HS Suspend Status.  
The value of the pin is sampled at the de-assertion of reset to determine if automatic mode is  
enabled as follows:  
0 = Automatic Mode is enabled on ports that are enabled for battery charging when the  
hub is unconnected. Please note that CDP is not supported on Port 1 when operating in  
Automatic mode.  
AUTOENz/HS_SUSPEN  
D
45  
49  
I/O, PU  
1 = Automatic Mode is disabled  
This value is also used to set the autoEnz bit in the Battery Charging Support Register.  
After reset, this signal indicates the High-speed USB Suspend status of the upstream port if  
enabled through the stsOutputEn bit in Additional Feature Configuration register. When  
enabled, a value of 1 indicates the connection is suspended.  
This pin is reserved for factory test. For normal operation, this pin requires an external pull  
down resistor to ground on PCB. Recommend 10k or stronger resistor.  
TEST  
I
Power and Ground Signals  
5, 8,  
13, 21,  
28, 31,  
51, 57  
VDD  
PWR 1.1-V power rail  
16, 34,  
52, 63  
VDD33  
PWR 3.3-V power rail  
VSS (Thermal Pad)  
NC  
PWR Ground. Thermal pad must be connected to ground.  
60  
No connect, leave floating  
8
Copyright © 2019, Texas Instruments Incorporated  
TUSB8043A  
www.ti.com.cn  
ZHCSJZ1 JUNE 2019  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
-0.3  
-0.3  
MAX  
UNIT  
V
VDD Supply voltage range  
VDD33 Supply voltage range  
1.4  
3.8  
Supply Voltage  
Range  
V
USB_SSRXP_UP, USB_SSRXN_UP, SSRXP_DN[4:1],  
USB_RXN_DP[4:1] and USB_VBUS terminals  
-0.3  
1,4  
V
Voltager Range  
Tstg  
XI terminal  
-0.3  
-0.3  
-65  
2.45  
3.8  
V
V
All other terminals  
Storage temperature  
150  
°C  
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per  
±2000  
ANSI/ESDA/JEDEC JS-001, all pins(1)  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per JEDEC  
specification JESD22-C101, all pins(2)  
±500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
0.99  
3.0  
NOM  
1.1  
MAX  
1.26  
3.6  
UNIT  
V
VDD  
1.1V Supply voltage  
3.3V Supply voltage  
VDD33  
3.3  
V
USB_VBU  
S
Voltage at USB_VBUS terminal.  
0
1.155  
V
TA  
TA  
TJ  
TUSB8043A Ambient temperature  
TUSB8043AI Ambient temperature  
Junction temperature  
0
-40  
-40  
70  
85  
°C  
°C  
°C  
105  
7.4 Thermal Information  
TUSB8043A  
THERMAL METRIC(1)  
RGC  
64 PINS  
26  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
11.5  
5.3  
ΨJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.2  
ΨJB  
5.2  
RθJC(bot)  
1.0  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
Copyright © 2019, Texas Instruments Incorporated  
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TUSB8043A  
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7.5 Electrical Characteristics  
over operating free-air temperature and voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Low Power Modes  
IDD_PWRO  
N
VDD current after Power On (after reset) VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
18  
2
mA  
mA  
mA  
mA  
mA  
mA  
IDD33_PW VDD33 current after Power On (after  
RON  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
reset)  
IDD_UPDIS VDD current when upstream port is  
C
23  
2
disconnected  
IDD33_UP VDD33 current when upstream port is  
DISC  
disconnected  
IDD_SUSP  
END  
VDD current in Suspend  
23  
2
IDD33_SUS  
PEND  
VDD33 current in Suspend  
Active Power Modes (US State / DS State)  
IDD_SMBU  
S
VDD current during SMbus programming. VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
290  
75  
mA  
mA  
IDD33_SM VDD33 current during SMbus  
BUS  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
programming  
VDD current upstream port connected to  
IDD_3H_1S USB 3.0 Host, downstream port(s)  
S_0HS_U12  
220  
45  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
connected to 1 SS device, and 0 HS  
device. Links in U1/U2.  
VDD33 current upstream port connected  
IDD33_3H_  
1SS_0HS_  
to USB 3.0 Host, downstream port(s)  
connected to 1 SS device, and 0 HS  
device. Links in U1/U2.  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
U12  
VDD current upstream port connected to  
IDD_3H_1S USB 3.0 Host, downstream port(s)  
S_0HS_U0  
330  
45  
connected to 1 SS device, and 0 HS  
device. Links in U0.  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 1 SS device, and 0 HS  
device. Links in U0.  
IDD33_3H_  
1SS_0HS_  
U0  
VDD current upstream port connected to  
IDD_3H_2S USB 3.0 Host, downstream port(s)  
S_0HS_U12  
301  
45  
connected to 2 SS devices, and 0 HS  
device. Links in U1/U2  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 2 SS devices, and 0 HS  
device. Links in U1/U2  
IDD33_3H_  
2SS_0HS_  
U12  
VDD current upstream port connected to  
IDD_3H_2S USB 3.0 Host, downstream port(s)  
S_0HS_U0  
460  
45  
connected to 2 SS devices, and 0 HS  
device. Links in U0.  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 2 SS devices, and 0 HS  
device. Links in U0.  
IDD33_3H_  
2SS_0HS_  
U0  
VDD current upstream port connected to  
IDD_3H_3S USB 3.0 Host, downstream port(s)  
S_0HS_U12  
372  
45  
connected to 3 SS devices, and 0 HS  
device. Links in U1/U2  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 3 SS devices, and 0 HS  
IDD33_3H_  
3SS_0HS_  
U12  
device. Links in U1/U2  
10  
Copyright © 2019, Texas Instruments Incorporated  
TUSB8043A  
www.ti.com.cn  
ZHCSJZ1 JUNE 2019  
Electrical Characteristics (continued)  
over operating free-air temperature and voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VDD current upstream port connected to  
IDD_3H_3S USB 3.0 Host, downstream port(s)  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
560  
mA  
connected to 3 SS devices, and 0 HS  
S_0HS_U0  
device. Links in U0.  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 3 SS devices, and 0 HS  
device. Links in U0.  
IDD33_3H_  
3SS_0HS_  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
VDD = 1.1V; VDD33 = 3.3V; TA = 25 °C;  
45  
467  
45  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
V
U0  
VDD current upstream port connected to  
IDD_3H_4S USB 3.0 Host, downstream port(s)  
connected to 4 SS devices, and 0 HS  
device. Links in U1/U2  
S_0HS_U12  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 4 SS devices, and 0 HS  
device. Links in U1/U2  
IDD33_3H_  
4SS_0HS_  
U12  
VDD current upstream port connected to  
IDD_3H_4S USB 3.0 Host, downstream port(s)  
672  
45  
connected to 4 SS devices, and 0 HS  
device. Links in U0.  
S_0HS_U0  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 4 SS devices, and 0 HS  
device. Links in U0.  
IDD33_3H_  
4SS_0HS_  
U0  
VDD current upstream port connected to  
IDD_3H_1S USB 3.0 Host, downstream port(s)  
372  
84  
connected to 1 SS device, and 1 HS  
device. Links in U0.  
S_1HS_U0  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 1 SS devices, and 1 HS  
device. Links in U0.  
IDD33_3H_  
1SS_1HS_  
U0  
VDD current upstream port connected to  
IDD_3H_1S USB 3.0 Host, downstream port(s)  
480  
95  
connected to 2 SS device, and 2 HS  
device. Links in U0.  
S_2HS_U0  
VDD33 current upstream port connected  
to USB 3.0 Host, downstream port(s)  
connected to 2 SS devices, and 2 HS  
device. Links in U0.  
IDD33_3H_  
1SS_2HS_  
U0  
VDD current upstream port connected to  
IDD_2H_0S USB 2.0 Host, downstream port(s)  
45  
connected to 0 SS device, and 1 HS  
device.  
S_1HS  
VDD33 current upstream port connected  
IDD33_2H_ to USB 2.0 Host, downstream port(s)  
45  
connected to 0 SS devices, and 1 HS  
device.  
0SS_1HS  
VDD current upstream port connected to  
IDD_2H_0S USB 2.0 Host, downstream port(s)  
74  
connected to 0 SS device, and 4 HS  
device.  
S_4HS  
VDD33 current upstream port connected  
IDD33_2H_ to USB 2.0 Host, downstream port(s)  
76  
connected to 0 SS devices, and 4 HS  
device.  
0SS_4HS  
3.3V I/O  
VIH  
High-level input voltage(1)  
2
3.6  
(1) Applies to external inputs and bi-directional buffers  
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TUSB8043A  
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Electrical Characteristics (continued)  
over operating free-air temperature and voltage range (unless otherwise noted)  
PARAMETER  
Low-level input voltage(1)  
Input voltage  
TEST CONDITIONS  
MIN  
0
TYP  
MAX  
UNIT  
V
VIL  
VI  
0.8  
3.6  
3.6  
25  
0
V
VO  
tt  
Output voltage(2)  
0
V
Input transition time (tRISE and tFALL  
)
ns  
1.3 x  
VDD33  
VHYS  
Input hysteresis(3)  
V
VOH  
VOL  
High-level output voltage  
Low-level output voltage  
IOH = -4 mA  
2.4  
V
V
IOH = 4 mA  
0.4  
High-impedance output current with  
internal pullup or pulldown resistor.(4)  
Input current(5)  
IOZP  
VI = 0 to VDD33  
VI = 0 to VDD33  
;
;
-250  
250  
µA  
II  
-15  
13.5  
14.5  
15  
27.5  
25  
µA  
kΩ  
kΩ  
RPD  
RPU  
Internal pull-down resistance  
Internal pull-up resistance  
19  
19  
(2) Applies to external outputs and bi-directional buffers  
(3) Applies to GRSTZ  
(4) Applies to pins with internal pullups/pulldowns.  
(5) Applies to external input buffers  
7.6 Timing Requirements  
MIN  
NOM  
MAX  
UNIT  
Power-on timings. Refer to 1  
(1) (2)  
td1  
VDD stable before VDD33 stable.  
0
3
ms  
ms  
µs  
td2  
VDD and VDD33 before de-assertion of GRSTz.  
(3)  
tsu_io  
thd_io  
Setup for MISC inputs.  
0.1  
0.1  
(3)  
Hold for MISC inputs.  
µs  
tVDD33_RAM  
P
VDD33 supply ramp requirement.  
0.2  
0.2  
100  
100  
ms  
ms  
tVDD_RAMP VDD supply ramp requirement.  
(1) As long as GRSTz is de-asserted after both supplies are stable, there is no power-on relationship between VDD33 and VDD. If GRSTz is  
only connected to a capacitor to GND, then VDD must be stable minimum of 10 µs before VDD33  
.
(2) An active reset is required if the VDD33 supply is stable before VDD supply. This active reset shall meet the 3 ms power-up delay  
counting from both power supplies stable to de-assertion of GRSTz.  
(3) MISC pins sampled at de-assertion of GRSTz: BATEN[4:1], AUTOENz, FULLPWRMGMTz, GANGED, SMBUSz, and PWRCTL_POL.  
12  
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TUSB8043A  
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ZHCSJZ1 JUNE 2019  
ttd2  
GRSTz  
VDD33  
VDD  
td1  
tSU_IO  
tHD_IO  
MISC_IO  
1. Power-Up Timing Requirements  
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TUSB8043A  
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8 Detailed Description  
8.1 Overview  
The TUSB8043A is a four-port USB 3.2 x1 Gen1 compliant hub. It provides simultaneous SuperSpeed USB and  
high-speed/full-speed connections on the upstream port and provides SuperSpeed USB, high-speed, full-speed,  
or low-speed connections on the downstream ports. When the upstream port is connected to an electrical  
environment that only supports high-speed or full-speed/low-speed connections, SuperSpeed USB connectivity is  
disabled on the downstream ports. When the upstream port is connected to an electrical environment that only  
supports full-speed/low-speed connections, SuperSpeed USB and high-speed connectivity are disabled on the  
downstream ports.  
8.2 Functional Block Diagram  
VDD33  
Power  
Distribution  
VBUS  
Detect  
VDD  
VSS  
USB 2.0 Hub  
SuperSpeed Hub  
XI  
Oscilator  
XO  
Clock  
and  
Reset  
GRSTz  
Distribution  
TEST  
GANGED/SMBA2/HS_UP  
HID  
to  
I2C  
FULLPWRMGMTz/SMBA1/SS_UP  
PWRCTL_POL  
SMBUSz/SS_SUSPEND  
AUTOENz/HS_SUSPEND  
SCL/SMBCLK  
OTP  
ROM  
Control  
Registers  
SDA/SMBDAT  
GPIO  
I2C  
OVERCUR1z  
PWRCTL1/BATEN1  
SMBUS  
OVERCUR2z  
PWRCTL2/BATEN2  
OVERCUR3z  
PWRCTL3/BATEN3  
OVERCUR4z  
PWRCTL4/BATEN4  
14  
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TUSB8043A  
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8.3 Feature Description  
8.3.1 Battery Charging Features  
The TUSB8043A provides support for USB Battery Charging (BC1.2) and custom charging. Battery charging  
support may be enabled on a per port basis through the REG_6h(batEn[3:0]) or the BATEN[4:1] pins.  
USB Battery charging support includes both Charging Downstream Port (CDP) and Dedicated Charging Port  
(DCP) modes. The DCP mode is compliant with the Chinese Telecommunications Industry Standard YD/T 1591-  
2009. CDP is enabled when the upstream port has detected valid VBUS, configured, and host sets port power.  
When the upstream port is not connected and battery charging support is enabled, the TUSB8043A enables  
DCP mode once all other battery modes such as ACPx have failed or are disabled.  
In addition to USB Battery charging (BC1.2), the TUSB8043A supports custom charging indications: Divider  
Charging (ACP3, ACP2, ACP1 modes), and Galaxy compatible charging. These custom charging modes are  
only supported when upstream port is unconnected and AUTOMODE is enabled. AUTOMODE can be enabled  
either thru AUTOENz pin or from Reg_0Ah bit 1 (autoModeEnz) . When in AUTOMODE and upstream port is  
disconnected, the port automatically transitions from ACP mode to the DCP mode depending on the portable  
device connected. The divided mode places a fixed DC voltage on the ports DP and DM signals which allows  
some devices to identify the capabilities of the charger. The default divider mode indicates support for up to 10W  
(ACP3). The divider mode can be configured to report a lower-current setting (up to 5 W) through REG_0Ah  
(HiCurAcpModeEn).  
When the upstream port is not connected and battery charging support is enabled for a port, the TUSB8043A  
drives the port power enable active. If AUTOMODE is disabled, then DCP mode is used. If AUTOMODE is  
enabled and fully automatic mode is disabled (FullAutoEn bit is cleared (Reg_25h Bit 0) or FULLAUTOz pin = 0),  
then TUSB8043A starts with highest enabled divider current mode (ACPx). The TUSB8043A remains in highest  
current mode as long as a pull-up is not detected on DP pin. If an pull-up is detected on DP pin, then  
TUSB8043A drives the port power enable inactive and switch to Galaxy mode, if enabled, or to DCP mode if  
Galaxy mode is disabled. The TUSB8043A again drives the port power enable active. The TUSB8043A remains  
in Galaxy mode as long as no pull-up is detected on DP pin. If an pull-up is detected on DP pin, then  
TUSB8043A drives the port power enable inactive and transition to DCP mode. The TUSB8043A again drives  
the port power enable active. In DCP mode, the TUSB8043A looks for a pull-up detected on DP pin or RxVdat. If  
a pull-up or RxVdat is detected on DP, the TUSB8043A remains in DCP mode. If no pull-up or RxVdat is  
detected on DP pin after 2 seconds, the TUSB8043A drives the port power enable inactive and transition back to  
ACPx mode. This sequence repeats until upstream port is connected.  
When Automatic mode is enabled and full automatic mode is enabled (FullAutoEn Reg_25h bit 0 is set or  
FULLAUTOz pin = 1), TUSB8043A performs same sequence described in previous paragraph with the addition  
of attempting all supported ACPx modes before sequencing to Galaxy Mode (if enabled) or DCP mode.  
The supported battery charging modes when TUSB8043A configured for SMBus or external EEPROM is detailed  
in Battery Charging Modes with SMBus/EEPROM Table.  
The supported battery charging modes when TUSB8043A configured for I2C but without an external EEPROM is  
determined by the sampled state of the pins. These modes are detailed in Battery Charging Modes without  
EEPROM Table.  
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TUSB8043A  
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Feature Description (接下页)  
1. TUSB8043A Battery Charging Modes with SMBus or I2C EEPROM  
Battery Charging Mode Port x  
(x = n + 1)  
0
1
1
Don’t Care  
> 4V  
Don't Care  
Don't Care  
Don't Care  
Don’t Care  
Don't Care  
1
Don't Care  
Don't Care  
Don't Care  
Don't Care  
Don't Care  
Don't Care  
No Charging support  
CDP  
DCP  
< 4V  
AUTOMODE enabled. Sequences through all ACPx modes and DCP  
Alternate ACP3, ACP2, ACP1, DCP  
1
1
1
1
1
1
< 4V  
< 4 V  
< 4V  
< 4V  
< 4V  
< 4V  
Don't Care  
0
0
0
0
0
0
1
0
0
1
0
0
1
1
1
0
0
0
AUTOMODE enabled. Sequences between ACP2 and DCP.  
Alternate ACP2, DCP  
0
AUTOMODE enabled. Sequences between ACP3 and DCP.  
Alternate ACP3, DCP  
1
AUTOMODE enabled with Galaxy compatible charging support.  
Alternate ACP3, ACP2, ACP1, Galaxy, DCP  
Don't Care  
AUTOMODE enabled with Galaxy compatible charging support.  
Alternate ACP2, Galaxy, DCP  
0
1
AUTOMODE enabled with Galaxy compatible charging support.  
Alternate ACP3, Galaxy, DCP  
2. TUSB8043A Battery Charging Modes without EEPROM  
Battery Charging Mode Port x  
(x = n + 1)  
0
1
1
Don’t Care Don’t Care  
Don't Care  
Don't Care  
0
No Charging support  
> 4V  
< 4V  
Don't Care  
1
CDP  
DCP  
AUTOMODE enabled with Galaxy compatible charging support. Sequences  
through all ACPx modes.  
1
< 4V  
0
0
Alternate ACP3, ACP2, ACP1, Galaxy, DCP.  
AUTOMODE enabled with Galaxy compatible charging support.  
Alternate ACP3, Galaxy, DCP  
1
1
< 4V  
< 4V  
0
1
1
1
AUTOMODE enabled. Sequences through all ACPx modes.  
Alternate ACP3, ACP2, ACP1, DCP.  
16  
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8.3.2 USB Power Management  
The TUSB8043A can be configured for power switched applications using either per-port (Full power managed)  
or ganged power-enable controls and over-current status inputs. When battery charge is enabled, the  
TUSB8043A always functions in full power managed.  
Power switch support is enabled by REG_5h (fullPwrMgmtz) and the per-port or ganged mode is configured by  
REG_5h(ganged).  
The TUSB8043A supports both active high and active low power-enable controls. The PWRCTL[4:1] polarity is  
configured by REG_Ah(pwrctlPol). The power control polarity can also be selected by the PWRCTL_POL pin.  
8.3.3 I2C Programming Support Using Internal HID to I2C Interface  
The TUSB8043A I2C programming mode is supported using class-specific requests through the HID interface.  
The HID embedded port is numbered 1 greater than the highest numbered exposed port. The internal HID to I2C  
function of the TUSB8043A does not have an interrupt OUT endpoint. The TUSB8043A supports GET REPORT  
(Input) through the HID interrupt and control endpoints. The GET REPORT (Feature) and SET REPORT (Output)  
occurs through the control endpoint.  
3. HID Requests I2C Programming Support  
COMMAND  
bmRequestType  
bRequest  
wValue  
wIndex  
wLength  
DATA  
Setup field Offset  
Offset = 0  
Offset = 1  
Offset = 2  
Offset = 4  
Offset = 6  
N/A  
0100H – input  
0300H - feature  
GET REPORT  
SET REPORT  
A1H  
21H  
01H  
09H  
0000H  
0000H  
Report Length  
Report Length  
Report  
Report  
0200H – output  
Other HID class specific requests are optional and not supported (SET IDLE, SET PROTOCOL, GET IDLE, GET  
PROTOCOL) . Also report IDs are not required since all requests are not interleaved.  
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8.3.3.1 SET REPORT (Output)  
Report length includes overhead bytes (1 byte of opcode, 1 byte of device address and 2 bytes of data length)  
and must match the number of bytes sent in the data stage or the request is stalled.  
1-byte opcode  
8'b0000xy01 read I2C  
8'b0000xy10 write I2C with stop  
8'b0000xy11 write I2C without stop (use to set sub-address prior to read)  
Bit 2 (y) when set forces 100 kHz I2C.  
Bit 3 (x) when set disables EP1. When EP1 is disabled, EP1 will always NAK and EP0 should be used for  
Get Report.  
1-byte I2C slave (7-bit) address  
2-byte I2C transaction data length  
"length" bytes of Data for a write, but none for a read.  
Set Report status stage reports only the status of the receipt and validity of the request, not the status of the I2C  
transaction. As long as the fields construct a valid request, the status stage is Acked by a null packet. Otherwise,  
it is STALLed. For example, if the report_length does not match the amount of data sent before the status stage  
or the wLength does not match the number of bytes of data sent in the data stage, the status stage is STALLed.  
Software shall ensure properly formatted commands and data responses. The sum of the start address and  
wLength shall be less than the total size of the address range of the target device in a properly formatted  
command. Hardware shall wrap any data addresses above FFFFh and shall discard any data transmitted greater  
than wLength and return STALL. A STALL is returned if opcode is 00h.  
The I2C master that performs the I2C reads and writes initiated through USB HID interface supports clock  
stretching. It operates at 400 kHz by default, but can be configured for 100 kHz through eFuse or register or by  
opcode.  
If the TUSB8043A is suspended (L2) by the USB host, the USB HID interface must enter suspend, but the I2C  
master shall remain active while attempting to complete an active I2C write request. An active I2C read request  
may be aborted if the TUSB8043A enters USB suspend state. Per the USB specification, the USB host should  
not suspend the HID interface while an I2C read or write is still in progress. The USB HID interface shall refuse  
requests to enter USB 2.0 sleep mode (L1) while an I2C read or write is in progress.  
8.3.3.2 GET REPORT (Feature)  
This HID Report is return a 2-byte constant (0x82FF) which can be used to identify compatible HID devices even  
if the customer changes the VID/PID.  
8.3.3.3 GET REPORT (Input)  
A report length of one reports the status byte only. To receive a report with data, the report length must be the  
length of the data, plus one byte for status and two bytes for the length field.  
1-byte Status  
0 Success  
1 Fail — timeout (35 ms)  
2 Fail — Address nak  
3 Fail — data nak  
2-byte length  
"length" bytes of Data for a read, but not for a write.  
A Get Report (input) request is required for both read and write. The interrupt and control endpoint will NAK until  
the I2C transaction is complete, so that it can report length, data for a read, and final status.  
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8.3.4 One Time Programmable (OTP) Configuration  
The TUSB8043A allows device configuration through one time programmable non-volatile memory (OTP). The  
programming of the OTP is supported using vendor-defined USB device requests. For details using the OTP  
features please contact your TI representative.  
4 provides a list features which may be configured using the OTP.  
4. OTP Configurable Features  
CONFIGURATION REGISTER  
BIT FIELD  
DESCRIPTION  
OFFSET  
REG_01h  
REG_02h  
REG_03h  
REG_04h  
[7:0]  
[7:0]  
[7:0]  
[7:0]  
Vendor ID LSB  
Vendor ID MSB  
Product ID LSB  
Product ID MSB  
Port removable configuration for downstream ports 1. OTP  
configuration is inverse of rmbl[3:0], i.e. 1 = not removable, 0 =  
removable.  
REG_07h  
REG_07h  
REG_07h  
REG_07h  
[0]  
[1]  
[2]  
[3]  
Port removable configuration for downstream ports 2. OTP  
configuration is inverse of rmbl[3:0], i.e. 1 = not removable, 0 =  
removable.  
Port removable configuration for downstream ports 3. OTP  
configuration is inverse of rmbl[3:0], i.e. 1 = not removable, 0 =  
removable.  
Port removable configuration for downstream ports 4. OTP  
configuration is inverse of rmbl[3:0], i.e. 1 = not removable, 0 =  
removable.  
REG_08h  
REG_0Ah  
REG_0Ah  
REG_0Bh  
REG_0Bh  
REG_0Bh  
REG_0Bh  
REG_0Bh  
REG_25h  
REG_26h  
REG_F0h  
[3:0]  
[1]  
Port used Configured register.  
Battery Charger Automatic Mode enable.  
[4]  
High-current divider mode enable.  
[0]  
USB 2.0 port polarity configuration for upstream port.  
USB 2.0 port polarity configuration for downstream ports 1.  
USB 2.0 port polarity configuration for downstream ports 2.  
USB 2.0 port polarity configuration for downstream ports 3.  
USB 2.0 port polarity configuration for downstream ports 4.  
Device Configuration Register 3  
[1]  
[2]  
[3]  
[4]  
[4:0]  
[3:0]  
[3:1]  
USB2.0 Only Port Register  
USB BC power switch power off duration during automode.  
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8.3.5 Clock Generation  
The TUSB8043A accepts a crystal input to drive an internal oscillator or an external clock source. If a clock is  
provided to XI instead of a crystal, XO is left open. Otherwise, if a crystal is used, the connection needs to follow  
the guidelines below. Since XI and XO are coupled to other leads and supplies on the PCB, it is important to  
keep them as short as possible and away from any switching leads. It is also recommended to minimize the  
capacitance between XI and XO. This can be accomplished by shielding C1 and C2 with the clean ground lines.  
R1  
1M  
Y1  
XI  
24 MHz  
CLOCK  
XO  
CL1  
CL2  
2. TUSB8043A Clock  
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8.3.6 Crystal Requirements  
The crystal must be fundamental mode with load capacitance of 12 pF - 24 pF and frequency stability rating of  
±100 PPM or better. To ensure proper startup oscillation condition, a maximum crystal equivalent series  
resistance (ESR) of 50 Ω is recommended. A parallel load capacitor should be used if a crystal source is used.  
The exact load capacitance value used depends on the crystal vendor. Refer to application note Selection and  
Specification for Crystals for Texas Instruments USB2.0 devices (SLLA122) for details on how to determine the  
load capacitance value.  
8.3.7 Input Clock Requirements  
When using an external clock source such as an oscillator, the reference clock should have a ±100 PPM or  
better frequency stability and have less than 50-ps absolute peak to peak jitter or less than 25-ps peak to peak  
jitter after applying the USB 3.2 Gen1 jitter transfer function. XI should be tied to the 1.8-V clock source and XO  
should be left floating.  
8.3.8 Power-Up and Reset  
The TUSB8043A does not have specific power sequencing requirements with respect to the core power (VDD)  
or I/O and analog power (VDD33) as long as GRSTz is held in an asserted state while supplies ramp. The core  
power (VDD) or I/O power (VDD33) may be powered up for an indefinite period of time while the other is not  
powered up if all of these constraints are met:  
All maximum ratings and recommended operating conditions are observed.  
All warnings about exposure to maximum rated and recommended conditions are observed, particularly  
junction temperature. These apply to power transitions as well as normal operation.  
Bus contention while VDD33 is powered up must be limited to 100 hours over the projected life-time of the  
device.  
Bus contention while VDD33 is powered down may violate the absolute maximum ratings.  
A supply bus is powered up when the voltage is within the recommended operating range. It is powered down  
when it is below that range, either stable or in transition.  
A minimum reset duration of 3 ms is required. This is defined as the time when the power supplies are in the  
recommended operating range to the de-assertion of GRSTz. This can be generated using programmable-delay  
supervisory device or using an RC circuit. When a RC circuit is used, the external capacitor size chosen must be  
large enough to meet the 3ms minimum duration requirement. The R of the RC circuit is the internal RPU  
.
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8.4 Device Functional Modes  
8.4.1 External Configuration Interface  
The TUSB8043A supports a serial interface for configuration register access. The device may be configured by  
an attached I2C EEPROM or accessed as a slave by an external SMBus master. The external interface is  
enabled when both the SCL/SMBCLK and SDA/SMBDAT pins are pulled up to 3.3 V at the de-assertion of reset.  
The mode, I2C master or SMBus slave, is determined by the state of SMBUSz/SS_SUSPEND pin at reset. With  
the integrated USB HID to I2C master, the I2C interface can also be used to program an external EEPROM or  
perform updates of an external MCU's firmware.  
8.4.2 I2C EEPROM Operation  
The TUSB8043A supports a single-master, standard mode (100 KHz) or fast mode (400KHz) connection to a  
dedicated I2C EEPROM when the I2C interface mode is enabled. In I2C mode, the TUSB8043A reads the  
contents of the EEPROM at bus address 1010000b using 7-bit addressing starting at address 0. The  
TUSB8043A reads the entire EEPROM contents using a single burst read transaction. The burst read transaction  
ends when the address reaches FFh.  
If the value of the EEPROM contents at address byte 00h equals 55h, the TUSB8043A loads the configuration  
registers according to the EEPROM map. If the first byte is not 55h, the TUSB8043A exits the I2C mode and  
continues execution with the default values in the configuration registers. The hub is not connect on the upstream  
port until the configuration is completed.  
The bytes located above offset Ah are optional. The requirement for data in those  
addresses is dependent on the options configured in the Device Configuration, and Device  
Configuration 2 registers.  
The minimum size I2C EEPROM required is 2Kbit.  
For details on I2C operation refer to the UM10204 I2C-bus Specification and User Manual.  
8.4.3 Port Configuration  
The TUSB8043A port configurations can be selected by registers or efuse. The Port Used Configuration register  
(USED[3:0]) define how many ports can possibly be reported by the hub. The device removable configuration  
register (RMBL[3:0]) define if the ports that USB 3.2 are reported as used have permanently connected devices  
or not. The USB 2.0 Only Port register (USB2_ONLY[3:0]) define whether or not a used port is reported as part  
of the USB 2.0 hub or both the USB2.0 and SS hubs. The USB2_ONLY field enables the USB2.0 port even if the  
corresponding USED bit is low. The internal HID port will always be the highest number USB2.0 port. 5 shows  
examples of the possible combinations.  
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Device Functional Modes (接下页)  
5. TUSB8043A Downstream Port Configuration Examples  
USB2_ONLY  
[3:0]  
USED[3:0]  
RMBL[3:0]  
Reported Port Configuration  
Physical to Logical Port mapping  
Physical1 => Logical Port1 for USB 3.2 and USB2.0.  
Physical2 => Logical Port2 for USB 3.2 and USB2.0.  
Physical3 => Logical Port3 for USB 3.2 and USB2.0.  
Physical4 => Logical Port4 for USB 3.2 and USB2.0.  
Physical5 => Logical Port5 for USB2.0.  
4 Port USB 3.2 Hub  
5 Port USB2.0 Hub  
Port 5 is permanently attached HID  
1111  
1111  
0000  
0000  
0000  
0010  
0010  
1110  
Physical1 Not used.  
Physical2 => Logical Port1 for USB 3.2 and USB2.0.  
Physical3 => Logical Port2 for USB 3.2 and USB2.0.  
Physical4 => Logical Port3 for USB 3.2 and USB2.0.  
Physical5 => Logical Port4 for USB 2.0.  
3 Port USB 3.2 Hub  
4 Port USB2.0 Hub  
Port 4 is permanently attached HID  
1110  
1100  
0011  
1000  
1111  
1111  
0111  
1111  
1111  
1111  
Physical1 Not used.  
2 Port USB 3.2 Hub  
3 Port USB2.0 hub with permanently attached  
device on Port 2  
Physical2 Not used.  
Physical3 => Logical Port1 for USB 3.2 and USB2.0.  
Physical4 => Logical Port2 for USB 3.2 and USB2.0.  
Physical5 => Logical Port3 for USB2.0.  
Port 3 is a permanently attached HID  
Physical1 => Logical Port1 for USB 3.2 and USB2.0.  
Physical2 => Logical Port2 for USB2.0.  
Physical3 Not Used.  
1 Port USB 3.2 Hub  
3 Port USB 2.0 Hub  
Port 3 is a permanently attached HID  
Physical4 Not used.  
Physical5 => Logical Port3 for USB2.0.  
Physical1 Not used.  
Physical2 => Logical Port2 for USB2.0.  
Physical3 Not used  
1 Port USB 3.2 Hub  
3 Port USB 2.0 Hub  
Port 3 is a permanently attached HID  
Physical4 => Logical Port1 for USB 3.2 and USB2.0.  
Physical5 => Logical Port3 for USB2.0.  
Physical1 => Logical Port1 for USB 3.2 and USB2.0.  
Physical2 => Logical Port2 for USB2.0.  
Physical3 => Logical Port3 for USB2.0.  
Physical4 => Logical Port4 for USB2.0.  
Physical5 => Logical Port5 for USB2.0.  
1 Port USB 3.2 Hub  
5 Port USB 2.0 Hub  
Port 5 is a permanently attached HID  
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8.4.4 SMBus Slave Operation  
When the SMBus interface mode is enabled, the TUSB8043A supports read block and write block protocols as a  
slave-only SMBus device.  
The TUSB8043A slave address is 1000 1xyz, where:  
x is the state of GANGED/SMBA2/HS_UP pin at reset,  
y is the state of FULLPWRMGMTz/SMBA1/SS_UP pin at reset, and  
z is the read/write bit; 1 = read access, 0 = write access.  
For details on SMBus requirements, refer to the System Management Bus Specification.  
If the TUSB8043A is addressed by a host using an unsupported protocol it does not  
respond. The TUSB8043A waits indefinitely for configuration by the SMBus host and  
doesnot connect on the upstream port until the SMBus host indicates configuration is  
complete by clearing the CFG_ACTIVE bit.  
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8.5 Register Maps  
8.5.1 Configuration Registers  
The internal configuration registers are accessed on byte boundaries. The configuration register values are  
loaded with defaults but can be over-written when the TUSB8043A is in I2C or SMBus mode. Refer to 4 for  
registers configurable from OTP.  
6. TUSB8043A Register Map  
BYTE  
ADDRESS  
CONTENTS  
EEPROM CONFIGURABLE  
00h  
ROM Signature Register  
Vendor ID LSB  
Yes  
01h  
Yes  
02h  
Vendor ID MSB  
Yes  
03h  
Product ID LSB  
Yes  
04h  
Product ID MSB  
Yes  
05h  
Device Configuration Register  
Battery Charging Support Register  
Device Removable Configuration Register  
Port Used Configuration Register  
Reserved. Must default to 00h.  
Device Configuration Register 2  
USB 2.0 Port Polarity Control Register  
Reserved  
Yes  
06h  
Yes  
07h  
Yes  
08h  
Yes  
09h  
Yes  
0Ah  
Yes  
0Bh  
Yes  
0Ch-0Fh  
10h-1Fh  
20h-21h  
22h  
No  
UUID Byte [15:0]  
No  
LangID Byte [1:0]  
Yes  
Serial Number Length  
Manufacturer String Length  
Product String Length  
Device Configuration Register 3  
USB 2.0 Only Port Register  
Reserved  
Yes  
23h  
Yes  
24h  
Yes  
25h  
Yes  
26h  
Yes  
27h-2Eh  
2Fh  
Yes  
Reserved  
No  
30h-4Fh  
50h-8Fh  
90h-CFh  
D0h-D4h  
D5h-D7h  
D8h-DCh  
DDh-EFh  
F0h  
Serial Number String Byte [31:0]  
Manufacturer String Byte [63:0]  
Product String Byte [63:0]  
Reserved  
Yes  
Yes  
Yes  
Yes, but do not change default.  
Reserved  
No  
Reserved  
Yes, but do not change default.  
Reserved  
No  
Yes  
No  
Additional Features Configuration Register  
Reserved  
F1h-F7h  
F8h  
SMBus Device Status and Command Register  
Reserved  
No  
F9h - FFh  
No  
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8.5.2 ROM Signature Register  
3. Register Offset 0h  
Bit No.  
7
0
6
0
5
4
0
3
2
0
1
0
0
0
Reset State  
0
0
7. Bit Descriptions – ROM Signature Register  
Bit  
Field  
Type  
Description  
ROM Signature Register. This register is used by the TUSB8043A in  
I2C mode to validate the attached EEPROM has been programmed.  
The first byte of the EEPROM is compared to the mask 55h and if not  
a match, the TUSB8043A aborts the EEPROM load and executes with  
the register defaults.  
7:0  
romSignature  
RW  
8.5.3 Vendor ID LSB Register  
4. Register Offset 1h  
Bit No.  
7
0
6
1
5
4
1
3
2
0
1
0
0
1
Reset State  
0
0
8. Bit Descriptions – Vendor ID LSB Register  
Bit  
Field  
Type  
Description  
Vendor ID LSB. Least significant byte of the unique vendor ID  
assigned by the USB-IF; the default value of this register is 51h  
representing the LSB of the TI Vendor ID 0451h. The value may be  
over-written to indicate a customer Vendor ID.  
7:0  
vendorIdLsb  
RO/RW  
Value used for this field is the non-zero value written by  
EEPROM/SMBus to both PID and VID. If a zero value is written by  
EEPROM/SMbus to both PID and VID, then value used for this field is  
the non-zero value from OTP. If a zero value is written by OTP, then  
value used for this field is 51h.  
8.5.4 Vendor ID MSB Register  
5. Register Offset 2h  
Bit No.  
7
0
6
0
5
4
0
3
2
1
1
0
0
0
Reset State  
0
0
9. Bit Descriptions – Vendor ID MSB Register  
Bit  
Field  
Type  
Description  
Vendor ID MSB. Most significant byte of the unique vendor ID  
assigned by the USB-IF; the default value of this register is 04h  
representing the MSB of the TI Vendor ID 0451h. The value may be  
over-written to indicate a customer Vendor ID.  
7:0  
vendorIdMsb  
RO/RW  
Value used for this field is the non-zero value written by  
EEPROM/SMBus to both PID and VID. If a zero value is written by  
EEPROM/SMbus to both PID and VID, then value used for this field is  
the non-zero value from OTP. If a zero value is written by OTP, then  
value used for this field is 04h.  
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8.5.5 Product ID LSB Register  
6. Register Offset 3h  
Bit No.  
7
0
6
1
5
4
0
3
2
0
1
0
0
0
Reset State  
0
0
10. Bit Descriptions – Product ID LSB Register  
Bit  
Field  
Type  
Description  
Product ID LSB. Least significant byte of the product ID assigned by  
Texas Instruments and reported in the SuperSpeed Device descriptor.  
the default value of this register is 40h representing the LSB of the  
SuperSpeed product ID assigned by Texas Instruments The value  
reported in the USB 2.0 Device descriptor is the value of this register  
bit wise XORed with 00000010b. The value may be over-written to  
indicate a customer product ID.  
7:0  
productIdLsb  
RO/RW  
Value used for this field is the non-zero value written by  
EEPROM/SMBus to both PID and VID. If a zero value is written by  
EEPROM/SMbus to both PID and VID, then value used for this field is  
the non-zero value from OTP. If a zero value is written by OTP, then  
value used for this field is 40h .  
8.5.6 Product ID MSB Register  
7. Register Offset 4h  
Bit No.  
7
1
6
0
5
4
0
3
2
0
1
1
0
1
Reset State  
0
0
11. Bit Descriptions – Product ID MSB Register  
Bit  
Field  
Type  
Description  
Product ID MSB. Most significant byte of the product ID assigned by  
Texas Instruments; the default value of this register is 83h representing  
the MSB of the product ID assigned by Texas Instruments. The value  
may be over-written to indicate a customer product ID.  
7:0  
productIdMsb  
RO/RW  
Value used for this field is the non-zero value written by  
EEPROM/SMBus to both PID and VID. If a zero value is written by  
EEPROM/SMbus to both PID and VID, then value used for this field is  
the non-zero value from OTP. If a zero value is written by OTP, then  
value used for this field is 83h.  
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8.5.7 Device Configuration Register  
8. Register Offset 5h  
Bit No.  
7
0
6
0
5
4
1
3
2
1
0
0
0
Reset State  
0
X
X
12. Bit Descriptions – Device Configuration Register  
Bit  
Field  
Type  
Description  
Custom strings enable. This bit controls the ability to write to the  
Manufacturer String Length, Manufacturer String, Product String  
Length, Product String, and Language ID registers  
0 = The Manufacturer String Length, Manufacturer String, Product  
String Length, Product String, and Language ID registers are read only  
1 = The Manufacturer String Length, Manufacturer String, Product  
String Length, Product String, and Language ID registers may be  
loaded by EEPROM or written by SMBus  
7
customStrings  
customSernum  
RW  
The default value of this bit is 0.  
Custom serial number enable. This bit controls the ability to write to the  
serial number registers.  
0 = The Serial Number String Length and Serial Number String  
registers are read only  
6
RW  
1 = Serial Number String Length and Serial Number String registers  
may be loaded by EEPROM or written by SMBus  
The default value of this bit is 0.  
U1 U2 Disable. This bit controls the U1/U2 support.  
0 = U1/U2 support is enabled  
1 = U1/U2 support is disabled, the TUSB8043A will not initiate or  
accept any U1 or U2 requests on any port, upstream or downstream,  
unless it receives or sends a Force_LinkPM_Accept LMP. After  
receiving or sending an FLPMA LMP, it continues to enable U1 and U2  
according to USB 3.2 protocol until it gets a power-on reset or is  
disconnected on its upstream port.  
5
u1u2Disable  
RW  
When the TUSB8043A is in I2C mode, the TUSB8043A loads this bit  
from the contents of the EEPROM.  
When the TUSB8043A is in SMBUS mode, the value may be over-  
written by an SMBus host.  
4
3
RSVD  
RO  
Reserved. This bit is reserved and returns 1 when read.  
Ganged. This bit is loaded at the de-assertion of reset with the value of  
the GANGED/SMBA2/HS_UP pin.  
0 = When fullPwrMgmtz = 0, each port is individually power switched  
and enabled by the PWRCTL[4:1]/BATEN[4:1] pins  
1 = When fullPwrMgmtz = 0, the power switch control for all ports is  
ganged and enabled by the PWRCTL[4:1]/BATEN1 pin  
When the TUSB8043A is in I2C mode, the TUSB8043A loads this bit  
from the contents of the EEPROM.  
ganged  
RW  
When the TUSB8043A is in SMBUS mode, the value may be over-  
written by an SMBus host.  
Full Power Management. This bit is loaded at the de-assertion of reset  
with the value of the FULLPWRMGMTz/SMBA1/SS_UP pin.  
0 = Port power switching status reporting is enabled  
1 = Port power switching status reporting is disabled  
When the TUSB8043A is in I2C mode, the TUSB8043A loads this bit  
from the contents of the EEPROM.  
2
fullPwrMgmtz  
RW  
When the TUSB8043A is in SMBUS mode, the value may be over-  
written by an SMBus host.  
U1 U2 Timer Override. When this field is set, the TUSB8043A  
overrides the downstream ports U1/U2 timeout values set by USB 3.2  
Host software. If software sets value in the range of 1h - FFh, the  
TUSB8043A uses the value of FFh. If software sets value to 0, then  
TUSB8043A uses value of 0. REG_09h [6] must be set to enable this  
feature.  
1
0
u1u2TimerOvr  
RSVD  
RW  
RO  
Reserved. This field is reserved and returns 0 when read.  
28  
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8.5.8 Battery Charging Support Register  
9. Register Offset 6h  
Bit No.  
7
0
6
0
5
4
0
3
2
1
0
Reset State  
0
X
X
X
X
13. Bit Descriptions – Battery Charging Support Register  
Bit  
Field  
Type  
Description  
7:4  
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
Battery Charger Support. The bits in this field indicate whether the  
downstream port implements the charging port features.  
0 = The port is not enabled for battery charging support features  
1 = The port is enabled for battery charging support features  
Each bit corresponds directly to a downstream port, i.e. batEn0  
corresponds to downstream port 1, and batEN1 corresponds to  
downstream port 2.  
3:0  
batEn[3:0]  
RW  
The default value for these bits are loaded at the de-assertion of reset  
with the value of PWRCTL/BATEN[3:0].  
When in I2C/SMBus mode the bits in this field may be over-written by  
EEPROM contents or by an SMBus host.  
8.5.9 Device Removable Configuration Register  
10. Register Offset 7h  
Bit No.  
7
0
6
0
5
4
3
2
1
0
Reset State  
0
0
X
X
X
X
14. Bit Descriptions – Device Removable Configuration Register  
Bit  
7
Field  
Type  
Description  
Custom Removable. This bit controls selection of port removable bits,  
port used bits, and USB2_ONLY bits.  
0 = rmbl[3:0], used[3:0], and USB2_ONLY[3:0] are read only and the  
values are loaded from the OTP ROM  
1 = rmbl[3:0], used[3:0], and USB2_ONLY[3:0] are read/write and can  
be loaded by EEPROM or written by SMBus  
This bit may be written simultaneously with rmbl[3:0].  
customRmbl  
RSVD  
RW  
6:4  
RO  
Reserved. Read only, returns 0 when read.  
Removable. The bits in this field indicate whether a device attached to  
downstream ports 4 through 1 are removable or permanently attached.  
0 = The device attached to the port is not removable  
1 = The device attached to the port is removable  
Each bit corresponds directly to a downstream port n + 1, i.e. rmbl0  
corresponds to downstream port 1, rmbl1 corresponds to downstream  
port 2, etc.  
3:0  
rmbl[3:0]  
RO/RW  
This field is read only unless the customRmbl bit is set to 1. Otherwise  
the value of this filed reflects the inverted values of the OTP ROM  
non_rmb[3:0] field.  
8.5.10 Port Used Configuration Register  
11. Register Offset 8h  
Bit No.  
7
0
6
0
5
0
4
0
3
1
2
1
1
1
0
1
Reset State  
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15. Bit Descriptions – Port Used Configuration Register  
Bit  
Field  
Type  
Description  
7:4  
RSVD  
RO  
Reserved. Read only.  
Used. The bits in this field indicate whether a port is enabled.  
0 = The port is not used or disabled  
1 = The port is used or enabled  
Each bit corresponds directly to a downstream port, i.e. used0  
corresponds to downstream port 1, used1 corresponds to downstream  
port 2, etc. This field is read only unless the customRmbl bit is set to 1.  
When the corresponding USB2_ONLY bit is set, the USB2 port is used  
and enabled regardless of the bit programmed into this field.  
3:0  
used[3:0]  
RO/RW  
30  
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8.5.11 Device Configuration Register 2  
12. Register Offset Ah  
Bit No.  
7
0
6
0
5
4
0
3
0
2
0
1
0
0
0
Reset State  
X
16. Bit Descriptions – Device Configuration Register 2  
Bit  
Field  
Type  
Description  
7
Reserved  
RO  
Reserved. Read-only, returns 0 when read.  
Custom Battery Charging Feature Enable. This bit controls the ability  
to write to the battery charging feature configuration controls.  
0 = The HiCurAcpModeEn is read only and the values are loaded from  
the OTP ROM.  
1 = The HiCurAcpModeEn bit is read/write and can be loaded by  
EEPROM or written by SMBus.  
6
5
customBCfeatures  
RW  
RW  
This bit may be written simultaneously with HiCurAcpModeEn.  
Power enable polarity. This bit is loaded at the de-assertion of reset  
with the value of the PWRCTL_POL pin.  
0 = PWRCTL polarity is active low  
1 = PWRCTL polarity is active high  
pwrctlPol  
When the TUSB8043A is in I2C mode, the TUSB8043A loads this bit  
from the contents of the EEPROM.  
When the TUSB8043A is in SMBUS mode, the value may be over-  
written by an SMBus host.  
High-current ACP mode enable. This bit enables the high-current tablet  
charging mode when the automatic battery charging mode is enabled  
for downstream ports.  
0 = High current divider mode disabled . High current is ACP2(default)  
1 = High current divider mode enabled. High current mode is ACP3  
This bit is read only unless the customBCfeatures bit is set to 1. If  
customBCfeatures is 0, the value of this bit reflects the value of the  
OTP ROM HiCurAcpModeEn bit.  
4
HiCurAcpModeEn  
Reserved  
RO/RW  
RW  
Reserved. These registers are unused and returns whatever value was  
written.  
3:2  
Automatic Mode Enable. This bit is loaded at the de-assertion of reset  
with the value of the AUTOENz/HS_SUSPEND pin.  
The automatic mode only applies to downstream ports with battery  
charging enabled when the upstream port is not connected. Under  
these conditions:  
1
0
autoModeEnz  
RW  
RO  
0 = Automatic mode battery charging features are enabled.  
1 = Automatic mode is disabled; only Battery Charging DCP and CDP  
mode is supported.  
NOTE: When the upstream port is connected, Battery Charging CDP  
mode is supported on all ports that are enabled for battery charging  
support regardless of the value of this bit.  
RSVD  
Reserved. Read only, returns 0 when read.  
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8.5.12 USB 2.0 Port Polarity Control Register  
13. Register Offset Bh  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
17. Bit Descriptions – USB 2.0 Port Polarity Control Register  
Bit  
7
Field  
Type  
Description  
Custom USB 2.0 Polarity. This bit controls the ability to write the  
p[4:0]_usb2pol bits.  
0 = The p[4:0]_usb2pol bits are read only and the values are loaded  
from the OTP ROM.  
1 = The p[4:0]_usb2pol bits are read/write and can be loaded by  
EEPROM or written by SMBus.  
This bit may be written simultaneously with the p[4:0]_usb2pol bits  
customPolarity  
RSVD  
RW  
6:5  
RO  
Reserved. Read only, returns 0 when read.  
Downstream Port 4 DM/DP Polarity. This controls the polarity of the  
port.  
0 = USB 2.0 port polarity is as documented by the pin out  
1 = USB 2.0 port polarity is swapped from that documented in the pin  
out, i.e. DM becomes DP, and DP becomes DM.  
This bit is read only unless the customPolarity bit is set to 1. If  
customPolarity is 0 the value of this bit reflects the value of the OTP  
ROM p4_usb2pol bit.  
4
3
2
p4_usb2pol  
p3_usb2pol  
p2_usb2pol  
RO/RW  
RO/RW  
RO/RW  
Downstream Port 3 DM/DP Polarity. This controls the polarity of the  
port.  
0 = USB 2.0 port polarity is as documented by the pin out  
1 = USB 2.0 port polarity is swapped from that documented in the pin  
out, i.e. DM becomes DP, and DP becomes DM.  
This bit is read only unless the customPolarity bit is set to 1. If  
customPolarity is 0 the value of this bit reflects the value of the OTP  
ROM p3_usb2pol bit.  
Downstream Port 2 DM/DP Polarity. This controls the polarity of the  
port.  
0 = USB 2.0 port polarity is as documented by the pin out  
1 = USB 2.0 port polarity is swapped from that documented in the pin  
out, i.e. DM becomes DP, and DP becomes DM.  
This bit is read only unless the customPolarity bit is set to 1. If  
customPolarity is 0 the value of this bit reflects the value of the OTP  
ROM p2_usb2pol bit.  
Downstream Port 1 DM/DP Polarity. This controls the polarity of the  
port.  
0 = USB 2.0 port polarity is as documented by the pin out  
1 = USB 2.0 port polarity is swapped from that documented in the pin  
out, i.e. DM becomes DP, and DP becomes DM.  
This bit is read only unless the customPolarity bit is set to 1. If  
customPolarity is 0 the value of this bit reflects the value of the OTP  
ROM p1_usb2pol bit.  
1
0
p1_usb2pol  
p0_usb2pol  
RORW  
RO/RW  
Upstream Port DM/DP Polarity. This controls the polarity of the port.  
0 = USB 2.0 port polarity is as documented by the pin out  
1 = USB 2.0 port polarity is swapped from that documented in the pin  
out, i.e. DM becomes DP, and DP becomes DM.  
This bit is read only unless the customPolarity bit is set to 1. If  
customPolarity is 0 the value of this bit reflects the value of the OTP  
ROM p0_usb2pol bit.  
32  
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8.5.13 UUID Registers  
14. Register Offset 10h-1Fh  
Bit No.  
7
6
5
4
3
2
1
0
Reset State  
X
X
X
X
X
X
X
X
18. Bit Descriptions – UUID Byte N Register  
Bit  
Field  
Type  
Description  
UUID byte N. The UUID returned in the Container ID descriptor. The  
value of this register is provided by the device and is meets the UUID  
requirements of Internet Engineering Task Force (IETF) RFC 4122 A  
UUID URN Namespace.  
7:0  
uuidByte[n]  
RO  
8.5.14 Language ID LSB Register  
15. Register Offset 20h  
Bit No.  
7
0
6
0
5
0
4
0
3
1
2
0
1
0
0
1
Reset State  
19. Bit Descriptions – Language ID LSB Register  
Bit  
Field  
Type  
Description  
Language ID least significant byte. This register contains the value  
returned in the LSB of the LANGID code in string index 0. The  
TUSB8043A only supports one language ID. The default value of this  
register is 09h representing the LSB of the LangID 0409h indicating  
English United States.  
7:0  
langIdLsb  
RO/RW  
When customStrings is 1, this field may be over-written by the contents  
of an attached EEPROM or by an SMBus host.  
8.5.15 Language ID MSB Register  
16. Register Offset 21h  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
20. Bit Descriptions – Language ID MSB Register  
Bit  
Field  
Type  
Description  
Language ID most significant byte. This register contains the value  
returned in the MSB of the LANGID code in string index 0. The  
TUSB8043A only supports one language ID. The default value of this  
register is 04h representing the MSB of the LangID 0409h indicating  
English United States.  
7:0  
langIdMsb  
RO/RW  
When customStrings is 1, this field may be over-written by the contents  
of an attached EEPROM or by an SMBus host.  
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8.5.16 Serial Number String Length Register  
17. Register Offset 22h  
Bit No.  
7
0
6
0
5
0
4
1
3
1
2
0
1
0
0
0
Reset State  
21. Bit Descriptions – Serial Number String Length Register  
Bit  
Field  
Type  
Description  
7:6  
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
Serial number string length. The string length in bytes for the serial  
number string. The default value is 18h indicating that a 24 byte serial  
number string is supported. The maximum string length is 32 bytes.  
When customSernum is 1, this field may be over-written by the  
contents of an attached EEPROM or by an SMBus host.  
When the field is non-zero, a serial number string of  
5:0  
serNumStringLen  
RO/RW  
serNumbStringLen bytes is returned at string index 1 from the data  
contained in the Serial Number String registers.  
8.5.17 Manufacturer String Length Register  
18. Register Offset 23h  
Bit No.  
7
0
6
0
5
4
3
2
0
1
0
0
0
Reset State  
0
0
0
22. Bit Descriptions – Manufacturer String Length Register  
Bit  
Field  
Type  
Description  
7
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
Manufacturer string length. The string length in bytes for the  
manufacturer string. The default value is 0, indicating that a  
manufacturer string is not provided. The maximum string length is 64  
bytes.  
6:0  
mfgStringLen  
RO/RW  
When customStrings is 1, this field may be over-written by the contents  
of an attached EEPROM or by an SMBus host.  
When the field is non-zero, a manufacturer string of mfgStringLen  
bytes is returned at string index 3 from the data contained in the  
Manufacturer String registers.  
8.5.18 Product String Length Register  
19. Register Offset 24h  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
23. Bit Descriptions – Product String Length Register  
Bit  
Field  
Type  
Description  
7
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
Product string length. The string length in bytes for the product string.  
The default value is 0, indicating that a product string is not provided.  
The maximum string length is 64 bytes.  
When customStrings is 1, this field may be over-written by the contents  
of an attached EEPROM or by an SMBus host.  
6:0  
prodStringLen  
RO/RW  
When the field is non-zero, a product string of prodStringLen bytes is  
returned at string index 3 from the data contained in the Product String  
registers.  
34  
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8.5.19 Device Configuration Register 3  
20. Register Offset 25h  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
24. Bit Descriptions – Device Configuration Register 3  
Bit  
Field  
Type  
Description  
7:6  
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
This field when set forces SS hub to report bcdUSB = 3.0 instead of  
3.2.  
5
bcdUSB30  
RW  
RW  
USB 2.0 hub reports as 2.0 only. This bit disables the USB 2.0 hub  
from reporting 5Gbps support in the wSpeedsSupported field of the  
USB SS BOS SS device capability descriptor. This bit also disables  
the USB3.0 hub.  
4
USB2.0_only  
This bit is read/write but the read value returned is the Boolean OR of  
this bit and the corresponding eFuse bit. If either bit is set, this feature  
is enabled.  
This field when set enables USB 2.0-defined Unconfigured state on  
DFPs.  
3
2
USB2_DFP_UNCONF  
I2C_100k  
RW  
I2C 100kHz. This bit controls the clock rate of the I2C master for both  
USB to I2C requests . The EEPROM reads occurs at 400K unless  
eFuse is used to set the rate to 100k.  
This bit is read/write but the read value returned is the Boolean OR of  
this bit and the corresponding eFuse bit. If either bit is set, this feature  
is enabled.  
R/W  
Disable Galaxy compatible modes. When this field is high, Galaxy  
charging compatible mode does not included in AUTOMODE charger  
sequence.  
This bit is read/write but the read value returned is the Boolean OR of  
this bit and the corresponding eFuse bit. If either bit is set, this feature  
is disabled.  
1
0
Galaxy_Enz  
FullAutoEn  
R/W  
R/W  
Enable all divider battery charging modes. When automode is enabled  
and this bit is set, any DS port enabled for battery charging attempts  
all divider battery charging modes before DCP, starting with the  
highest current option.  
The bit is writable, but the value read back is the Boolean OR of this  
bit and the corresponding eFuse control.  
If either bit is set, eFuse or this register, this feature is enabled.  
8.5.20 USB 2.0 Only Port Register  
21. Register Offset 26h  
Bit No.  
7
0
6
0
5
0
4
1
3
0
2
0
1
0
0
0
Reset State  
25. Bit Descriptions – USB 2.0 Only Port Register  
Bit  
Field  
Type  
Description  
7:4  
RSVD  
RO  
Reserved. Read only.  
USB 2.0 Only Ports. The bits in this field primarily indicate whether a  
port is enabled only for USB 2.0 operation. This field is read-only  
unless customRmbl bit is set. Also, these bits overrides the  
corresponding USED bit.  
A value of 0 indicates the hub port is enabled for both USB 3.2 and  
USB 2.0.  
3:0  
USB2_ONLY[3:0]  
RO/RW  
A value of 1 indicates the hub port is enabled only for USB 2.0  
operation.  
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8.5.21 Serial Number String Registers  
22. Register Offset 30h-4Fh  
Bit No.  
7
6
5
x
4
x
3
x
2
x
1
x
0
x
Reset State  
X
X
26. Bit Descriptions – Serial Number Registers  
Bit  
Field  
Type  
Description  
Serial Number byte N. The serial number returned in the Serial  
Number string descriptor at string index 1. The default value of these  
registers is assigned by TI. When customSernum is 1, these registers  
may be over-written by EEPROM contents or by an SMBus host.  
7:0  
serialNumber[n]  
RO/RW  
36  
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8.5.22 Manufacturer String Registers  
23. Register Offset 50h-8Fh  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
27. Bit Descriptions – Manufacturer String Registers  
Bit  
Field  
Type  
Description  
Manufacturer string byte N. These registers provide the string values  
returned for string index 3 when mfgStringLen is greater than 0. The  
number of bytes returned in the string is equal to mfgStringLen.  
The programmed data should be in UNICODE UTF-16LE encodings  
as defined by The Unicode Standard, Worldwide Character Encoding,  
Version 5.0.  
7:0  
mfgStringByte[n]  
RW  
8.5.23 Product String Registers  
24. Register Offset 90h-CFh  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
28. Bit Descriptions – Product String Byte N Register  
Bit  
Field  
Type  
Description  
Product string byte N. These registers provide the string values  
returned for string index 2 when prodStringLen is greater than 0. The  
number of bytes returned in the string is equal to prodStringLen.  
The programmed data should be in UNICODE UTF-16LE encodings  
as defined by The Unicode Standard, Worldwide Character Encoding,  
Version 5.0.  
7:0  
prodStringByte[n]  
RO/RW  
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8.5.24 Additional Feature Configuration Register  
25. Register Offset F0h  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
29. Bit Descriptions – Additional Feature Configuration Register  
Bit  
Field  
Type  
Description  
7:5  
Reserved  
RW  
Reserved. This field defaults to 3'b000 and must not be changed.  
Status output enable. This field when set enables of the Status output  
signals, HS_UP, HS_SUSPEND, SS_UP, SS_SUSPEND.  
0 = STS outputs are disabled.  
1 = STS outputs are enabled.  
This bit may be loaded by EEPROM or over-written by a SMBUS host.  
4
3:1  
0
stsOutputEn  
RW  
RW  
RW  
Power On Delay Time. When the efuse_pwronTime field is all 0s, this  
field sets the delay time from the removal disable of PWRCTL to the  
enable of PWRCTL when transitioning battery charging modes. For  
example, when disabling the power on a transition from ACP to DCP  
Mode. The nominal timing is defined as follows:  
pwronTime  
TPWRON_EN = (pwronTime x 1) x 200 ms  
(1)  
This field may be over-written by EEPROM contents or by an SMBus  
host.  
USB3 Spread Spectrum Disable. This bit allows firmware to disable the  
spread spectrum function of the USB3 phy PLL.  
0 = Spread spectrum function is enabled  
usb3spreadDis  
1= Spread spectrum function is disabled  
This bit may be loaded by EEPROM or over-written by a SMBUS host.  
38  
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8.5.25 SMBus Device Status and Command Register  
26. Register Offset F8h  
Bit No.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Reset State  
30. Bit Descriptions – SMBus Device Status and Command Register  
Bit  
Field  
Type  
Description  
7:2  
RSVD  
RO  
Reserved. Read only, returns 0 when read.  
SMBus interface reset. This bit loads the registers back to their GRSTz  
values. Note, that since this bit can only be set when in SMBus mode  
the cfgActive bit is also reset to 1. When software sets this bit it must  
reconfigure the registers as necessary.  
This bit is set by writing a 1 and is cleared by hardware on completion  
of the reset. A write of 0 has no effect.  
1
smbusRst  
cfgActive  
RSU  
RCU  
Configuration active. This bit indicates that configuration of the  
TUSB8043A is currently active. The bit is set by hardware when the  
device enters the I2C or SMBus mode. The TUSB8043A shall not  
connect on the upstream port while this bit is 1.  
When in I2C mode, the bit is cleared by hardware when the  
TUSB8043A exits the I2C mode.  
0
When in the SMBus mode, this bit must be cleared by the SMBus host  
in order to exit the configuration mode and allow the upstream port to  
connect.  
The bit is cleared by a writing 1. A write of 0 has no effect.  
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9 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The TUSB8043A is a four-port USB 3.2 x1 Gen1 compliant hub. It provides simultaneous SuperSpeed USB and  
high-speed/full-speed connections on the upstream port and provides SuperSpeed USB, high-speed, full-speed,  
or low speed connections on the downstream port. The TUSB8043A can be used in any application that needs  
additional USB compliant ports. For example, a specific notebook may only have two downstream USB ports. By  
using the TUSB8043A, the notebook can increase the downstream port count to five.  
9.2 Typical Application  
9.2.1 Discrete USB Hub Product  
A common application for the TUSB8043A is as a self powered standalone USB hub product. The product is  
powered by an external 5V DC Power adapter. In this application, using a USB cable TUSB8043A upstream port  
is plugged into a USB Host controller. The downstream ports of the TUSB8043A are exposed to users for  
connecting USB hard drives, cameras, flash drives, and so forth.  
USB  
Type B  
DC  
PWR  
Connector  
US Port  
TUSB8043A  
USB  
PWR  
USB  
PWR  
SWITCH  
SWITCH  
DS Port 1  
DS Port 2 DS Port 3 DS Port 4  
USB Type A  
Connector  
USB Type A  
Connector  
USB Type A  
Connector  
USB Type A  
Connector  
27. Discrete USB Hub Product  
40  
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TUSB8043A  
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Typical Application (接下页)  
9.2.1.1 Design Requirements  
31. Design Parameters  
DESIGN PARAMETER  
VDD Supply  
EXAMPLE VALUE  
1.1 V  
VDD33 Supply  
3.3 V  
Upstream Port USB Support (SS, HS, FS)  
SS, HS, FS  
Downstream Port 1 USB Support (SS, HS, FS, LS)  
Downstream Port 2 USB Support (SS, HS, FS, LS)  
Downstream Port 3 USB Support (SS, HS, FS, LS)  
Downstream Port 4 USB Support (SS, HS, FS, LS)  
Number of Removable external exposed Downstream Ports  
Number of Non-Removable external exposed Downstream Ports  
Full Power Management of Downstream Ports  
Individual Control of Downstream Port Power Switch  
Power Switch Enable Polarity  
SS, HS, FS, LS  
SS, HS, FS, LS  
SS, HS, FS, LS  
SS, HS, FS, LS  
4
0
Yes. (FULLPWRMGMTZ = 0)  
Yes. (GANGED = 0)  
Active High. (PWRCTL_POL = 1)  
Battery Charge Support for Downstream Port 1  
Battery Charge Support for Downstream Port 2  
Battery Charge Support for Downstream Port 3  
Battery Charge Support for Downstream Port 4  
I2C EEPROM Support  
Yes  
Yes  
Yes  
Yes  
No  
24MHz Clock Source  
Crystal  
9.2.1.2 Detailed Design Procedure  
9.2.1.2.1 Upstream Port Implementation  
The upstream of the TUSB8043A is connected to a USB3 Type B connector. This particular example has  
GANGED pin and FULLPWRMGMTZ pin pulled low which results in individual power support each downstream  
port. The VBUS signal from the USB3 Type B connector is feed through a voltage divider. The purpose of the  
voltage divider is to make sure the level meets USB_VBUS input requirements  
R1  
90.9K  
0402  
1%  
R2  
C1  
10uF  
10K 1%  
0402  
1%  
U1A  
J1  
48  
42  
40  
USB_VBUS  
GANGED/SMBA2/HS_UP  
1
2
3
4
5
6
7
8
VBUS  
VBUS  
DM  
DP  
USB_DM_UP  
USB_DP_UP  
54  
53  
USB_DM_UP  
USB_DP_UP  
FULLPWRMGMTZ/SMBA1/SS_UP  
GND  
CAP_UP_TXM  
CAP_UP_TXP  
USB_SSTXM_UP  
56  
55  
C2  
C3  
0.1uF 0201  
0.1uF 0201  
SSTXN  
SSTXP  
GND  
SSRXN  
SSRXP  
SHIELD0  
SHIELD1  
USB_SSTXM_UP  
USB_SSTXP_UP  
R3  
R4  
USB_SSTXP_UP  
USB_SSRXM_UP  
USB_SSRXP_UP  
4.7K  
0402  
5%  
4.7K  
0402  
5%  
59  
58  
USB_SSRXM_UP  
USB_SSRXP_UP  
9
10  
11  
TUSB8043A  
USB3_TYPEB_CONNECTOR  
C4  
0.1uF  
C5  
0.001uF  
R5  
1M  
0402  
5%  
28. Upstream Port Implementation  
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9.2.1.2.2 Downstream Port 1 Implementation  
The downstream port 1 of the TUSB8043A is connected to a USB3 Type A connector. With BATEN1 pin pulled  
up, Battery Charge support is enabled for Port 1. If Battery Charge support is not needed, then pull-up resistor on  
BATEN1 should be uninstalled.  
BOARD_3P3V  
FB1  
R6  
POPULATE  
DN1_VBUS  
VBUS_DS1  
4.7K  
0402  
5%  
DN1_VBUS  
FOR BC SUPPORT  
220 at 100MHZ C6  
0.1uF  
J2  
1
2
3
4
5
6
7
8
9
U1B  
VBUS  
DM  
DP  
2
1
USB_DM_DN1  
USB_DP_DN1  
USB_DM_DN1  
USB_DP_DN1  
GND  
7
6
USB_SSRXM_DN1  
USB_SSRXP_DN1  
USB_SSRXM_DN1  
USB_SSRXP_DN1  
SSRXN  
SSRXP  
GND  
SSTXN  
SSTXP  
0.1uF 0201  
0.1uF 0201  
C7  
C8  
4
3
USB_SSTXM_DN1  
USB_SSTXP_DN1  
CAP_DN_TXM1  
CAP_DN_TXP1  
USB_SSTXM_DN1  
USB_SSTXP_DN1  
10  
11  
SHIELD0  
SHIELD1  
36  
46  
PWRCTRL1_BATEN1  
OVERCUR1Z  
PWRCTL1/BATEN1  
OVERCUR1  
USB3_TYPEA_CONNECTOR  
R7  
1M  
C9  
0.001uF  
C10  
0.1uF  
TUSB8043A  
0402  
5%  
29. Downstream Port 1 Implementation  
9.2.1.2.3 Downstream Port 2 Implementation  
The downstream port 2 of the TUSB8043A is connected to a USB3 Type A connector. With BATEN2 pin pulled  
up, Battery Charge support is enabled for Port 2. If Battery Charge support is not needed, then pull-up resistor on  
BATEN2 should be uninstalled. For ferrite bead used on the VBUS connection, a lower resistance is  
recommended due to noticeable IR drop during high current charging modes. The isolation between the Type-A  
connectors shield ground and signal ground pins is not required. Some applications may have better ESD/EMI  
performance when the grounds are shorted together.  
BOARD_3P3V  
FB2  
DN2_VBUS  
VBUS_DS2  
R8  
DN2_VBUS  
POPULATE  
4.7K  
0402  
5%  
FOR BC SUPPORT  
220 at 100MHZ  
C11  
0.1uF  
J3  
1
2
3
4
5
6
7
8
9
U1C  
VBUS  
DM  
DP  
10  
USB_DM_DN2  
USB_DP_DN2  
USB_DM_DN2  
9
USB_DP_DN2  
GND  
15  
14  
USB_SSRXM_DN2  
USB_SSRXP_DN2  
USB_SSRXM_DN2  
USB_SSRXP_DN2  
SSRXN  
SSRXP  
GND  
SSTXN  
SSTXP  
12  
11  
USB_SSTXM_DN2  
USB_SSTXP_DN2  
CAP_DN2_TXM  
CAP_DN2_TXP  
C12  
0.1uF 0201  
0.1uF 0201  
USB_SSTXM_DN2  
USB_SSTXP_DN2  
C13  
10  
11  
SHIELD0  
SHIELD1  
35  
47  
PWRCTRL2_BATEN2  
OVERCUR2Z  
PWRCTL2/BATEN2  
OVERCUR2  
R9  
1M  
C15  
0.001uF  
USB3_TYPEA_CONNECTOR  
C14  
0.1uF  
0402  
5%  
TUSB8043A  
30. Downstream Port 2 Implementation  
42  
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9.2.1.2.4 Downstream Port 3 Implementation  
The downstream port3 of the TUSB8043A is connected to a USB3 Type A connector. With BATEN3 pin pulled  
up, Battery Charge support is enabled for Port 3. If Battery Charge support is not needed, then pull-up resistor on  
BATEN3 should be uninstalled. For ferrite bead used on the VBUS connection, a lower resistance is  
recommended due to noticeable IR drop during high current charging modes. The isolation between the Type-A  
connectors shield ground and signal ground pins is not required. Some applications may have better ESD/EMI  
performance when the grounds are shorted together.  
BOARD_3P3V  
FB3  
VBUS_DS3  
R10  
4.7K  
0402  
5%  
DN3_VBUS  
POPULATE  
FOR BC SUPPORT  
220 at 100MHZ  
C16  
0.1uF  
J4  
1
2
3
4
5
6
7
8
9
U1D  
VBUS  
DM  
DP  
18  
USB_DM_DN3  
USB_DP_DN3  
USB_DM_DN3  
17  
USB_DP_DN3  
GND  
23  
22  
USB_SSRXM_DN3  
USB_SSRXP_DN3  
USB_SSRXM_DN3  
USB_SSRXP_DN3  
SSRXN  
SSRXP  
GND  
SSTXN  
SSTXP  
20  
19  
USB_SSTXM_DN3  
USB_SSTXP_DN3  
CAP_DN3_TXM  
CAP_DN3_TXP  
C17  
0.1uF 0201  
0.1uF 0201  
USB_SSTXM_DN3  
USB_SSTXP_DN3  
C18  
10  
11  
SHIELD0  
SHIELD1  
33  
44  
PWRCTRL3_BATEN3  
OVERCUR3Z  
PWRCTL3/BATEN3  
OVERCUR3  
R11  
C19  
0.001uF  
USB3_TYPEA_CONNECTOR  
C20  
0.1uF  
1M  
0402  
5%  
TUSB8043A  
31. Downstream Port 3 Implementation  
9.2.1.2.5 Downstream Port 4 Implementation  
The downstream port 4 of the TUSB8043A is connected to a USB3 Type A connector. With BATEN4 pin pulled  
up, Battery Charge support is enabled for Port 4. If Battery Charge support is not needed, then pull-up resistor on  
BATEN4 should be uninstalled. For ferrite bead used on the VBUS connection, a lower resistance is  
recommended due to noticeable IR drop during high current charging modes. The isolation between the Type-A  
connectors shield ground and signal ground pins is not required. Some applications may have better ESD/EMI  
performance when the grounds are shorted together.  
BOARD_3P3V  
FB4  
VBUS_DS4  
R12  
4.7K  
0402  
5%  
DN4_VBUS  
POPULATE  
FOR BC SUPPORT  
220 at 100MHZ  
C21  
0.1uF  
J5  
1
2
3
4
5
6
7
8
9
U1E  
VBUS  
DM  
DP  
25  
USB_DM_DN4  
USB_DP_DN4  
USB_DM_DN4  
24  
USB_DP_DN4  
GND  
30  
29  
USB_SSRXM_DN4  
USB_SSRXP_DN4  
USB_SSRXM_DN4  
USB_SSRXP_DN4  
SSRXN  
SSRXP  
GND  
SSTXN  
SSTXP  
27  
26  
USB_SSTXM_DN4  
USB_SSTXP_DN4  
CAP_DN4_TXM  
CAP_DN4_TXP  
C22  
0.1uF 0201  
0.1uF 0201  
USB_SSTXM_DN4  
USB_SSTXP_DN4  
C23  
10  
11  
SHIELD0  
SHIELD1  
32  
43  
PWRCTRL4_BATEN4  
OVERCUR4Z  
PWRCTL4/BATEN4  
OVERCUR4  
R13  
C25  
0.001uF  
USB3_TYPEA_CONNECTOR  
C24  
0.1uF  
1M  
0402  
5%  
TUSB8043A  
32. Downstream Port 4 Implementation  
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9.2.1.2.6 VBUS Power Switch Implementation  
This particular example uses the Texas Instruments TPS2561 Dual Channel Precision Adjustable Current-  
Limited power switch. For details on this power switch or other power switches available from Texas Instruments,  
refer to the Texas Instruments website.  
BOARD_3P3V  
BOARD_3P3V  
BOARD_5V  
R19  
10K  
0402  
5%  
R20  
10K  
0402  
5%  
C42  
0.1uF  
U2  
2
3
9
DN1_VBUS  
DN2_VBUS  
ILIM1  
DN1_VBUS  
OVERCUR1Z  
DN2_VBUS  
OVERCUR2Z  
IN  
IN  
OUT1  
FAULT1Z  
OUT2  
10  
8
PWRCTRL1_BATEN1  
PWRCTRL2_BATEN2  
4
5
PWRCTRL1_BATEN1  
PWRCTRL2_BATEN2  
EN1  
EN2  
6
FAULT2Z  
ILIM  
1
11  
GND  
PAD  
7
C43  
C45  
0.1uF  
+
C44  
150uF  
0.1uF  
+
C46  
150uF  
TPS2561  
R21  
25.5K  
0402  
5%  
Limiting DS Port VBUS current to 2.2A per port.  
BOARD_3P3V  
BOARD_3P3V  
BOARD_5V  
R22  
10K  
0402  
5%  
R23  
10K  
0402  
5%  
C47  
0.1uF  
U3  
2
9
DN3_VBUS  
DN4_VBUS  
ILIM2  
DN3_VBUS  
IN  
IN  
OUT1  
FAULT1Z  
OUT2  
3
4
5
10  
8
OVERCUR3Z  
DN4_VBUS  
PWRCTRL3_BATEN3  
EN1  
EN2  
PWRCTRL4_BATEN4  
6
OVERCUR4Z  
FAULT2Z  
ILIM  
1
11  
GND  
PAD  
7
C48  
0.1uF  
C50  
+
C49  
150uF  
0.1uF  
+
C51  
150uF  
TPS2561  
R24  
25.5K  
0402  
5%  
Limiting DS Port VBUS current to 2.2A per port.  
33. VBUS Power Switch Implementation  
9.2.1.2.7 Clock, Reset, and Misc  
The PWRCTL_POL is left unconnected which results in active high power enable (PWRCTL1, PWRCTL2,  
PWRCTL3, and PWRCTL4) for a USB VBUS power switch. SMBUSz pin is also left unconnected which selects  
I2C mode. Both PWRCTL_POL and SMBUSz pins have internal pull-ups. The 1 µF capacitor on the GRSTN pin  
can only be used if the VDD11 supply is stable before the VDD33 supply. The depending on the supply ramp of  
the two supplies the capacitor size may have to be adjusted.  
44  
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TUSB8043A  
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ZHCSJZ1 JUNE 2019  
U1F  
C39  
1uF  
50  
38  
37  
GRSTN  
SCL/SMBCLK  
SDA/SMBDAT  
39  
45  
SMBUSZ/SS_SUSPEND  
AUTOENZ/HS_SUSPEND  
PWRCTL_POL  
TEST  
62  
61  
XI  
41  
49  
64  
R14  
1M  
XO  
Y1  
USB_R1  
R15  
TUSB8043A  
R16  
4.7K  
R18  
4.7K  
0402  
5%  
9.53K  
0402  
1%  
24MHz  
C40  
C41  
18pF  
18pF  
34. Clock, Reset, and Misc  
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9.2.1.2.8 TUSB8043A Power Implementation  
BOARD_1P1V  
VDD11  
FB5  
C26  
0.1uF  
C27  
C28  
C29  
C30  
C31  
C32  
C33  
10uF  
220 at 100MHZ  
0.1uF  
0.1uF  
0.1uF  
0.1uF  
0.1uF  
0.1uF  
U1G  
16  
VDD33  
34  
VDD33  
VDD33  
VDD33  
60  
52  
63  
VDD33  
BOARD_3P3V  
NC  
FB6  
C34  
C35  
0.1uF  
C36  
0.1uF  
C37  
0.1uF  
C38  
10uF  
220 at 100MHZ  
0.1uF  
TUSB8043A  
35. TUSB8043A Power Implementation  
46  
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9.2.1.3 Application Curves  
36. Upstream Port  
37. Downstream Port 1  
38. Downstream Port 2  
39. Downstream Port 3  
40. Downstream Port 4  
41. High-Speed Upstream Port  
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42. High-Speed Downstream Port 1  
43. High-Speed Downstream Port 2  
44. High-Speed Downstream Port 3  
45. High-Speed Downstream Port 4  
48  
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TUSB8043A  
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10 Power Supply Recommendations  
10.1 TUSB8043A Power Supply  
VDD should be implemented as a single power plane, as should VDD33  
.
The VDD pins of the TUSB8043A supply 1.1 V (nominal) power to the core of the TUSB8043A. This power rail  
can be isolated from all other power rails by a ferrite bead to reduce noise.  
The DC resistance of the ferrite bead on the core power rail can affect the voltage provided to the device due  
to the high current draw on the power rail. The output of the core voltage regulator may need to be adjusted  
to account for this or a ferrite bead with low DC resistance (less than 0.05 Ω) can be selected.  
The VDD33 pins of the TUSB8043A supply 3.3 V power rail to the I/O of the TUSB8043A. This power rail can  
be isolated from all other power rails by a ferrite bead to reduce noise.  
All power rails require a 10 µF capacitor or 1 µF capacitors for stability and noise immunity. These bulk  
capacitors can be placed anywhere on the power rail. The smaller decoupling capacitors should be placed as  
close to the TUSB8043A power pins as possible with an optimal grouping of two of differing values per pin.  
10.2 Downstream Port Power  
The downstream port power, VBUS, must be supplied by a source capable of supplying 5V and up to 900 mA  
per port. Downstream port power switches can be controlled by the TUSB8043A signals. It is also possible to  
leave the downstream port power always enabled.  
A large bulk low-ESR capacitor of 22 µF or larger is required on each downstream port’s VBUS to limit in-rush  
current.  
The ferrite beads on the VBUS pins of the downstream USB port connections are recommended for both  
ESD and EMI reasons. A 0.1µF capacitor on the USB connector side of the ferrite provides a low impedance  
path to ground for fast rise time ESD current that might have coupled onto the VBUS trace from the cable.  
10.3 Ground  
It is recommended that only one board ground plane be used in the design. This provides the best image plane  
for signal traces running above the plane. The thermal pad of the TUSB8043A and any of the voltage regulators  
should be connected to this plane with vias. An earth or chassis ground is implemented only near the USB port  
connectors on a different plane for EMI and ESD purposes.  
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11 Layout  
11.1 Layout Guidelines  
11.1.1 Placement  
1. 9.53K +/-1% resistor connected to pin USB_R1 should be placed as close as possible to the TUSB8043A.  
2. A 0.1 µF should be placed as close as possible on each VDD and VDD33 power pin.  
3. The 100 nF capacitors on the SSTXP and SSTXM nets should be placed close to the USB connector (Type  
A, Type B, and so forth).  
4. The ESD and EMI protection devices (if used) should also be placed as close as possible to the USB  
connector.  
5. If a crystal is used, it must be placed as close as possible to the TUSB8043A XI and XO pins.  
6. Place voltage regulators as far away as possible from the TUSB8043A, the crystal, and the differential pairs.  
7. In general, the large bulk capacitors associated with each power rail should be placed as close as possible to  
the voltage regulators.  
11.1.2 Package Specific  
1. The TUSB8043A package has a 0.5-mm pin pitch.  
2. The TUSB8043A package has a 6.0-mm x 6.0-mm thermal pad. This thermal pad must be connected to  
ground through a system of vias.  
3. All vias under device, except for those connected to thermal pad, should be solder masked to avoid any  
potential issues with thermal pad layouts.  
11.1.3 Differential Pairs  
This section describes the layout recommendations for all the TUSB8043A differential pairs: USB_DP_XX,  
USB_DM_XX, USB_SSTXP_XX, USB_SSTXM_XX, USB_SSRXP_XX, and USB_SSRXM_XX.  
1. Must be designed with a differential impedance of 90 Ω ±10%.  
2. In order to minimize cross talk, it is recommended to keep high speed signals away from each other. Each  
pair should be separated by at least 5 times the signal trace width. Separating with ground as depicted in the  
layout example also helps minimize cross talk.  
3. Route all differential pairs on the same layer adjacent to a solid ground plane.  
4. Do not route differential pairs over any plane split.  
5. Adding test points causes impedance discontinuity; and therefore, negative impacts signal performance. If  
test points are used, they should be placed in series and symmetrically. They must not be placed in a  
manner that causes stub on the differential pair.  
6. Avoid 90 degree turns in trace. The use of bends in differential traces should be kept to a minimum. When  
bends are used, the number of left and right bends should be as equal as possible and the angle of the bend  
should be 135 degrees. This minimizes any length mismatch causes by the bends and therefore minimize  
the impact bends have on EMI.  
7. Minimize the trace lengths of the differential pair traces. The maximum recommended trace length for SS  
differential pair signals and USB 2.0 differential pair signals is eight inches. Longer trace lengths require very  
careful routing to assure proper signal integrity.  
8. Match the etch lengths of the differential pair traces (i.e. DP and DM or SSRXP and SSRXM or SSTXP and  
SSTXM). There should be less than 5 mils difference between a SS differential pair signal and its  
complement. The USB 2.0 differential pairs should not exceed 50 mils relative trace length difference.  
9. The etch lengths of the differential pair groups do not need to match (i.e. the length of the SSRX pair to that  
of the SSTX pair), but all trace lengths should be minimized.  
10. Minimize the use of vias in the differential pair paths as much as possible. If this is not practical, make sure  
that the same via type and placement are used for both signals in a pair. Any vias used should be placed as  
close as possible to the TUSB8043A device.  
11. To ease routing, the polarity of the SS differential pairs can be swapped. This means that SSTXP can be  
routed to SSTXM or SSRXM can be routed to SSRXP.  
50  
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Layout Guidelines (接下页)  
12. To ease routing of the USB2 DP and DM pair, the polarity of these pins can be swapped. If this is done, the  
appropriate Px_usb2pol register, where x = 0, 1, 2, 3, or 4, must be set.  
13. Do not place power fuses across the differential pair traces.  
11.2 Layout Examples  
11.2.1 Upstream Port  
46. Example Routing of Upstream Port  
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Layout Examples (接下页)  
11.2.2 Downstream Port  
47. Example Routing of Downstream Port  
The remaining three downstream ports routing can be similar to the example provided.  
52  
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12 器件和文档支持  
12.1 接收文档更新通知  
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
12.2 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
12.3 商标  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.4 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
12.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且  
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2019, Texas Instruments Incorporated  
53  
重要声明和免责声明  
TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资  
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示  
担保。  
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、  
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用  
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权  
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。  
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约  
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE  
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122  
Copyright © 2020 德州仪器半导体技术(上海)有限公司  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TUSB8043AIRGCR  
TUSB8043AIRGCT  
TUSB8043ARGCR  
TUSB8043ARGCT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
VQFN  
VQFN  
RGC  
RGC  
RGC  
RGC  
64  
64  
64  
64  
2000 RoHS & Green  
250 RoHS & Green  
2000 RoHS & Green  
250 RoHS & Green  
NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 85  
-40 to 85  
0 to 70  
TUSB8043A  
NIPDAU  
NIPDAU  
NIPDAU  
TUSB8043A  
TUSB8043A  
TUSB8043A  
0 to 70  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Apr-2020  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TUSB8043AIRGCR  
TUSB8043AIRGCT  
TUSB8043ARGCR  
TUSB8043ARGCT  
VQFN  
VQFN  
VQFN  
VQFN  
RGC  
RGC  
RGC  
RGC  
64  
64  
64  
64  
2000  
250  
330.0  
180.0  
330.0  
180.0  
16.4  
16.4  
16.4  
16.4  
9.3  
9.3  
9.3  
9.3  
9.3  
9.3  
9.3  
9.3  
1.1  
1.1  
1.1  
1.1  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
Q2  
Q2  
Q2  
Q2  
2000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Apr-2020  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TUSB8043AIRGCR  
TUSB8043AIRGCT  
TUSB8043ARGCR  
TUSB8043ARGCT  
VQFN  
VQFN  
VQFN  
VQFN  
RGC  
RGC  
RGC  
RGC  
64  
64  
64  
64  
2000  
250  
367.0  
210.0  
367.0  
210.0  
367.0  
185.0  
367.0  
185.0  
38.0  
35.0  
38.0  
35.0  
2000  
250  
Pack Materials-Page 2  
GENERIC PACKAGE VIEW  
RGC 64  
9 x 9, 0.5 mm pitch  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
Images above are just a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4224597/A  
www.ti.com  
PACKAGE OUTLINE  
RGC0064G  
VQFN - 1 mm max height  
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD  
9.1  
8.9  
B
A
PIN 1 INDEX AREA  
9.1  
8.9  
(0.1) TYP  
LEADFRAME PROFILE  
S
C
A
L
E
8
.
0
0
0
OPTION  
1 MAX  
C
SEATING PLANE  
0.08  
0.05  
0.00  
2X 7.5  
(0.2) TYP  
6
0.05  
17  
32  
60X 0.5  
16  
33  
SEE DETAIL  
2X  
EXPOSED  
THERMAL PAD  
7.5  
1
48  
0.30  
64X  
64  
49  
0.18  
PIN 1 ID  
(OPTIONAL)  
0.5  
0.3  
0.1  
C A  
B
64X  
0.05  
4222053/B 06/2015  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RGC0064G  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(
6)  
SYMM  
64  
49  
64X (0.6)  
1
48  
64X (0.24)  
8X (1.01)  
60X (0.5)  
SYMM  
18X (1.16)  
(8.8)  
(0.58)  
TYP  
(
0.2) TYP  
VIA  
(0.58) TYP  
33  
16  
17  
32  
18X (1.16)  
(8.8)  
8X (1.01)  
(R0.05)  
ALL PAD CORNERS  
LAND PATTERN EXAMPLE  
SCALE:10X  
0.07 MIN  
ALL SIDES  
0.07 MAX  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4222053/B 06/2015  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RGC0064G  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
25X ( 0.96)  
64  
(1.16) TYP  
(R0.05) TYP  
49  
64X (0.6)  
1
48  
64X (0.24)  
60X (0.5)  
(1.16)  
TYP  
SYMM  
(8.8)  
(R0.05) TYP  
33  
16  
METAL  
TYP  
17  
32  
SYMM  
(8.8)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
EXPOSED PAD  
64% PRINTED SOLDER COVERAGE BY AREA  
SCALE:12X  
4222053/B 06/2015  
NOTES: (continued)  
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资  
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示  
担保。  
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、  
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用  
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权  
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。  
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约  
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE  
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122  
Copyright © 2020 德州仪器半导体技术(上海)有限公司  

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