TRS3223IDBG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器【 15 kV ESD保护
| 型号： | TRS3223IDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION |
| 文件： | 总18页 (文件大小：417K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
FEATURES
DB, DW, OR PW PACKAGE
•
RS-232 Bus-Pin ESD Protection Exceeds
(TOP VIEW)
±15 kV Using Human-Body Model (HBM)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
EN
C1+
FORCEOFF
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
V
CC
V+
C1−
C2+
C2−
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typical
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
V−
DOUT2
RIN2
ROUT2
DIN2
INVALID
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s)
–
TRSF3223
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRS3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver
output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 μA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 μs. Refer to Figure 4 for receiver input levels.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
xxx
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS3223CDW
TOP-SIDE MARKING
Tube of 25
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – DW
SSOP – DB
TSSOP – PW
TRS3223C
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
Tube of 25
SSOP – DB
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
TRS3223CDWR
TRS3223CDB
–0°C to 70°C
RS23C
RS23C
TRS3223I
RS23I
TRS3223CDBR
TRS3223CPW
TRS3223CPWR
TRS3223IDW
TRS3223IDWR
TRS3223IDB
–40°C to 85°C
TRS3223IDBR
TRS3223IPW
RS23I
TRS3223IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
atwww.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
Each Driver(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
L
X
X
Z
Powered off
H
H
Normal operation with
auto-powerdown
disabled
H
L
H
L
L
L
L
H
H
H
H
H
X
L
H
L
Yes
Yes
No
Normal operation with
auto-powerdown
enabled
H
L
Z
Z
Powered off by
auto-powerdown
feature
H
No
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver(1)
INPUTS
OUTPUT
ROUT
VALID RIN
RS-232 LEVEL
RIN
EN
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
(1) H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = input
disconnected or connected driver off
2
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
17
13
DIN1
DIN2
DOUT1
DOUT2
12
8
20
14
FORCEOFF
FORCEON
11
Auto-Powerdown
INVALID
1
EN
15
16
9
ROUT1
RIN1
RIN2
10
ROUT2
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range(2)
–0.3
–0.3
0.3
6
V
V
V
V
V+
Positive output supply voltage range(2)
Negative output supply voltage range(2)
Supply voltage difference(2)
7
V–
–7
V+ – V–
13
Driver, FORCEOFF, FORCEON, EN
Receiver
–0.3
–25
6
25
VI
Input voltage range
Output voltage range
V
V
Driver
–13.2
–0.3
13.2
VCC + 0.3
70
VO
Receiver, INVALID
DB package
θJA
Package thermal impedance(3)(4)
DW package
58
°C/W
PW package
83
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
3
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
Recommended Operating Conditions(1)
See Figure 6
MIN
3
NOM
3.3
5
MAX UNIT
VCC = 3.3 V
3.6
V
Supply voltage
VCC = 5 V
4.5
2
5.5
VCC = 3.3 V
VCC = 5 V
DIN, EN, PWRDOWN,
FORCEON
VIH Driver and control high-level input voltage
VIL Driver and control low-level input voltage
V
2.4
DIN, EN, PWRDOWN, FORCEON
DIN, EN, PWRDOWN, FORCEON
0.8
5.5
25
70
85
V
V
V
Driver and control input voltage
0
–25
0
VI
Receiver input voltage
TRS223C
TRS223I
TA Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX
UNIT
Input leakage
current
EN, FORCEOFF,
FORCEON
II
±0.01
±1
μA
No load,
FORCEOFF and
FORCEON at VCC
Auto-powerdown
disabled
0.3
1
1
mA
No load, FORCEOFF at
GND
Powered off
10
VCC = 3.3 V or 5 V,
TA = 25°C
ICC
Supply current
No load, FORCEOFF at
μA
VCC
,
Auto-powerdown
enabled
FORCEON at GND,
All RIN are open or
grounded
1
10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
4
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
High-level output voltage DOUT at RL = 3 kΩ to GND,
5
5.4
–5.4
±0.01
±0.01
±35
V
V
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
±1
±1
μA
μA
IIL
VI at GND
VCC = 3.6 V,
VO = 0 V
±60
±60
Short-circuit output
current(3)
IOS
ro
mA
Ω
VCC = 5.5 V,
VO = 0 V
±35
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
VO = ±12 V,
VO = ±10 V,
300
10 M
VCC = 3 V to 3.6 V
±25
±25
Ioff
Output leakage current
FORCEOFF = GND
μA
VCC = 4.5 V to 5.5 V
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
Maximum data rate
250
kbit/s
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
tsk(p)
Pulse skew(3)
100
ns
VCC = 3.3 V
RL = 3 kΩ to 7 kΩ
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
30
Slew rate, transition region
(see Figure 1)
SR(tr)
V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6
VCC – 0.1
V
IOH = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
VIT–
V
1.4
Vhys
Ioff
rI
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.5
V
EN = VCC
±0.05
5
±10
μA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
tPLH
tPHL
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
CL = 150 pF,
See Figure 3
See Figure 3
RL = 3 kΩ,
150
150
ns
ns
CL = 150 pF,
CL = 150 pF,
See Figure 4
ten
Output enable time
200
ns
CL = 150 pF,
See Figure 4
RL = 3 kΩ,
tdis
Output disable time
Pulse skew(3)
200
50
ns
ns
tsk(p)
See Figure 3
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
Receiver input threshold for
INVALID high-level output voltage
VT+(valid)
VT–(valid)
VT(invalid)
VOH
FORCEON = GND,
FORCEOFF = VCC
FORCEOFF = VCC
2.7
V
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
–2.7
–0.3
V
V
V
V
Receiver input threshold for
INVALID low-level output voltage
FORCEOFF = VCC
FORCEON = GND,
0.3
0.4
IOH = –1 mA,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOH = 1.6 mA,
FORCEOFF = VCC
FORCEON = GND,
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
TYP(1)
1
UNIT
μs
tvalid
tinvalid
ten
30
μs
100
μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
7
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
t
L
t
THL
TLH
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
−3 V
3 V
FORCEOFF
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
PHL
PLH
L
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
0 V
FORCEOFF
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
Input
1.5 V
1.5 V
t
V
CC
GND
FORCEON
3 V or 0 V
S1
0 V
t
PHZ
PHZ
(S1 at GND)
R
L
(S1 at GND)
3 V or 0 V
Output
V
OH
Output
50%
C
L
(see Note A)
0.3 V
0.3 V
EN
t
PLZ
(S1 at V
)
CC
Generator
50 Ω
(see Note B)
Output
50%
V
OL
t
PZL
(S1 at V )
CC
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
9
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
2.7 V
2.7 V
0 V
0 V
Receiver
Input
−2.7 V
−2.7 V
ROUT
−3 V
Generator
(see Note B)
50 Ω
t
t
invalid
valid
V
CC
INVALID
50% V
50% V
CC
CC
Output
V+
0 V
t
en
Auto-
Powerdown
INVALID
≈V+
C = 30 pF
L
(see Note A)
0.3 V
V
Supply
CC
0 V
0.3 V
FORCEOFF
FORCEON
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
0.3 V
Indeterminate
If Signal Remains Within This Region
for More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdowndisables drivers and reduces supply
current to 1 µA.
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
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TRS3223
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS816–JULY 2007
APPLICATION INFORMATION
20
Auto-
Powerdown
1
EN
FORCEOFF
2
19
18
V
C1+
V+
CC
+
−
C
BYPASS
= 0.1µF
+
−
3
4
GND
C1
+
−
†
C3
17
16
DOUT1
C1−
C2+
C2−
V−
5
RIN1
+
−
C2
C4
6
15
ROUT1
5 kΩ
7
14
13
FORCEON
DIN1
−
+
8
DOUT2
9
12
11
RIN2
DIN2
10
ROUT2
INVALID
5 kΩ
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected
as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, C4
0.1 µF
0.33 µF
0.47 µF
0.1 µF
0.047 µF
0.1 µF
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
Figure 6. Typical Operating Circuit and Capacitor Values
11
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS3223CDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223CDBG4
TRS3223CDBR
TRS3223CDBRG4
TRS3223CDW
SSOP
SSOP
SSOP
SOIC
DB
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223CDWG4
TRS3223CDWR
TRS3223CDWRG4
TRS3223CPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223CPWG4
TRS3223CPWR
TRS3223CPWRG4
TRS3223IDB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223IDBG4
TRS3223IDBR
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223IDBRG4
TRS3223IDW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223IDWG4
TRS3223IDWR
TRS3223IDWRG4
TRS3223IPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3223IPWG4
TRS3223IPWR
TRS3223IPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS3223CDBR
TRS3223CDWR
TRS3223CPWR
TRS3223IDBR
TRS3223IDWR
TRS3223IPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
24.4
16.4
16.4
24.4
16.4
8.2
10.8
6.95
8.2
7.5
13.0
7.1
2.5
2.7
1.6
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
16.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
SSOP
SOIC
7.5
12.0
12.0
8.0
DW
PW
10.8
6.95
13.0
7.1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS3223CDBR
TRS3223CDWR
TRS3223CPWR
TRS3223IDBR
TRS3223IDWR
TRS3223IPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
33.0
33.0
41.0
33.0
TSSOP
SSOP
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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