TRS3222IDWRG4 [TI]

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器,具有± 15 kV ESD保护
TRS3222IDWRG4
型号: TRS3222IDWRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION
3V至5.5V多通道RS - 232线路驱动器/接收器,具有± 15 kV ESD保护

线路驱动器或接收器 驱动程序和接口 接口集成电路 光电二极管
文件: 总17页 (文件大小:411K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
FEATURES  
DB, DW, OR PW PACKAGE  
RS-232 Bus-Pin ESD Protection Exceeds  
(TOP VIEW)  
±15 kV Using Human-Body Model (HBM)  
EN  
C1+  
1
2
3
4
5
6
7
8
9
10  
20 PWRDOWN  
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
19  
18  
17  
16  
15  
14  
13  
12  
11  
V
CC  
V+  
C1−  
C2+  
C2−  
GND  
DOUT1  
RIN1  
ROUT1  
NC  
Operates With 3-V to 5.5-V VCC Supply  
Operates up to 250 kbit/s  
Two Drivers and Two Receivers  
Low Standby Current . . . 1 μA Typical  
External Capacitors . . . 4 × 0.1 μF  
Accepts 5-V Logic Input With 3.3-V Supply  
V−  
DOUT2  
RIN2  
ROUT2  
DIN1  
DIN2  
NC  
Alternative High-Speed Pin-Compatible Device  
(1 Mbit/s)  
NC − No internal connection  
TRSF3222  
APPLICATIONS  
Battery-Powered Systems  
PDAs  
Notebooks  
Laptops  
Palmtop PCs  
Hand-Held Equipment  
DESCRIPTION/ORDERING INFORMATION  
The TRS3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD  
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of  
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the  
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to  
5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver  
output slew rate.  
The TRS3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 μA from  
the power supply. When the device is powered down, the receivers remain active while the drivers are placed in  
the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC  
,
and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting  
EN high.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TRS3222CDW  
TOP-SIDE MARKING  
Tube of 25  
SOIC – DW  
SSOP – DB  
TSSOP – PW  
SOIC – DW  
SSOP – DB  
TSSOP – PW  
TRS3222C  
Reel of 2000  
Tube of 70  
Reel of 2000  
Tube of 70  
Reel of 2000  
Tube of 25  
SSOP – DB  
Tube of 70  
Reel of 2000  
Tube of 70  
Reel of 2000  
TRS3222CDWR  
TRS3222CDB  
0°C to 70°C  
RS22C  
RS22C  
TRS3222I  
RS22I  
TRS3222CDBR  
TRS3222CPW  
TRS3222CPWR  
TRS3222IDW  
TRS3222IDWR  
TRS3222IDB  
–40°C to 85°C  
TRS3222IDBR  
TRS3222IPW  
RS22I  
TRS3222IPWR  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
FUNCTION TABLES  
Each Driver(1)  
INPUTS  
OUTPUT  
DOUT  
DIN  
X
PWRDOWN  
L
H
H
Z
H
L
L
H
(1) H = high level, L = low level, X = irrelevant,  
Z = high impedance  
Each Receiver(1)  
INPUTS  
OUTPUT  
ROUT  
RIN  
L
EN  
L
H
L
H
L
X
H
L
Z
H
Open  
(1) H = high level, L = low level, X = irrelevant,  
Z = high impedance (off), Open = input  
disconnected or connected driver off  
2
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
LOGIC DIAGRAM (POSITIVE LOGIC)  
13  
17  
8
DIN1  
DOUT1  
DOUT2  
12  
20  
DIN2  
Powerdown  
PWRDOWN  
1
EN  
15  
16  
9
ROUT1  
RIN1  
RIN2  
10  
ROUT2  
3
Submit Documentation Feedback  
TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.3  
–0.3  
0.3  
MAX  
UNIT  
VCC  
Supply voltage range(2)  
6
V
V+  
Positive output supply voltage range(2)  
Negative output supply voltage range(2)  
Supply voltage difference(2)  
7
V
V
V
V–  
–7  
V+ – V–  
13  
Drivers, EN, PWRDOWN  
Receivers  
–0.3  
–25  
6
25  
VI  
Input voltage range  
Output voltage range  
V
V
Drivers  
–13.2  
–0.3  
13.2  
VCC + 0.3  
70  
VO  
Receivers  
DB package  
DW package  
PW package  
θJA  
Package thermal impedance(3)(4)  
58  
°C/W  
83  
TJ  
Operating virtual junction temperature  
Storage temperature range  
150  
°C  
°C  
Tstg  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to network GND.  
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient  
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
See Figure 5  
MIN  
3
NOM  
3.3  
5
MAX UNIT  
VCC = 3.3 V  
VCC = 5 V  
3.6  
V
Supply voltage  
4.5  
2
5.5  
VCC = 3.3 V  
VCC = 5 V  
VIH Driver and control high-level input voltage  
VIL Driver and control low-level input voltage  
DIN, EN, PWRDOWN  
V
2.4  
DIN, EN, PWRDOWN  
DIN, EN, PWRDOWN  
0.8  
5.5  
25  
70  
85  
V
V
V
VI  
VI  
Driver and control input voltage  
Receiver input voltage  
0
–25  
0
TRS222C  
TRS222I  
TA Operating free-air temperature  
°C  
–40  
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
Input leakage current (EN, PWRDOWN)  
Supply current  
TEST CONDITIONS  
MIN TYP(2)  
MAX UNIT  
II  
±0.01  
0.3  
1
±1  
1
μA  
mA  
μA  
No load, PWRDOWN at VCC  
No load, PWRDOWN at GND  
ICC  
Supply current (powered off)  
10  
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
4
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
DRIVER SECTION  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
High-level output voltage  
Low-level output voltage  
High-level input current  
Low-level input current  
TEST CONDITIONS  
MIN  
5
TYP(2)  
5.4  
MAX UNIT  
VOH  
VOL  
IIH  
DOUT at RL = 3 kto GND,  
DIN = GND  
DIN = VCC  
V
V
DOUT at RL = 3 kto GND,  
VI = VCC  
–5  
–5.4  
±0.01  
±0.01  
±1  
±1  
μA  
μA  
IIL  
VI at GND  
VCC = 3.6 V,  
VO = 0 V  
VO = 0 V  
VO = ±2 V  
IOS  
ro  
Short-circuit output current(3)  
Output resistance  
±35  
±60  
mA  
VCC = 5.5 V,  
VCC, V+, and V– = 0 V,  
300  
10 M  
PWRDOWN = GND,  
VCC = 3 V to 3.6 V  
VO = ±12 V  
VO = ±10 V  
±25  
±25  
Ioff  
Output leakage current  
μA  
PWRDOWN = GND,  
VCC = 4.5 V to 5.5 V  
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one  
output should be shorted at a time.  
Switching Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP(2)  
MAX  
UNIT  
CL = 1000 pF,  
One DOUT switching,  
RL = 3 k,  
See Figure 1  
Maximum data rate  
150  
250  
kbit/s  
CL = 150 pF to 2500 pF, RL = 3 kto 7 k,  
See Figure 2  
tsk(p)  
Pulse skew(3)  
300  
ns  
CL = 150 pF to 1000 pF  
CL = 150 pF to 2500 pF  
6
4
30  
30  
Slew rate, transition region  
(see Figure 1)  
RL = 3 kto 7 k,  
VCC = 3.3 V  
SR(tr)  
V/μs  
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.  
5
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
RECEIVER SECTION  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
High-level output voltage  
Low-level output voltage  
TEST CONDITIONS  
IOH = –1 mA  
MIN  
TYP(2)  
MAX UNIT  
VOH  
VOL  
VCC – 0.6  
VCC – 0.1  
V
IOH = 1.6 mA  
VCC = 3.3 V  
VCC = 5 V  
0.4  
2.4  
2.4  
V
1.5  
1.8  
VIT+  
Positive-going input threshold voltage  
Negative-going input threshold voltage  
V
VCC = 3.3 V  
VCC = 5 V  
0.6  
0.8  
1.2  
VIT–  
V
1.5  
Vhys  
Ioff  
rI  
Input hysteresis (VIT+ – VIT–  
Output leakage current  
Input resistance  
)
0.3  
V
EN = VCC  
±0.05  
5
±10  
μA  
kΩ  
VI = ±3 V to ±25 V  
3
7
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
Switching Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
CL = 150 pF, See Figure 3  
CL = 150 pF, See Figure 3  
MIN  
TYP(2)  
300  
MAX UNIT  
tPLH  
tPHL  
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
ns  
ns  
300  
CL = 150 pF, RL = 3 k,  
See Figure 4  
ten  
Output enable time  
200  
ns  
CL = 150 pF, RL = 3 k,  
See Figure 4  
tdis  
Output disable time  
Pulse skew(3)  
200  
300  
ns  
ns  
tsk(p)  
See Figure 3  
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.  
6
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
PARAMETER MEASUREMENT INFORMATION  
3 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
0 V  
Generator  
(see Note B)  
50  
C
L
t
R
L
t
TLH  
THL  
(see Note A)  
3 V  
PWRDOWN  
V
V
OH  
3 V  
−3 V  
3 V  
−3 V  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
6 V  
or t  
SR(tr) +  
t
THL  
TLH  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns,  
tf 10 ns.  
Figure 1. Driver Slew Rate  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
Generator  
(see Note B)  
50  
C
L
t
t
PLH  
PHL  
R
L
(see Note A)  
V
V
OH  
3 V  
PWRDOWN  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
A. CL includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns,  
tf 10 ns.  
Figure 2. Driver Pulse Skew  
EN  
0 V  
3 V  
Input  
1.5 V  
1.5 V  
−3 V  
Output  
Generator  
(see Note B)  
50  
t
t
PLH  
PHL  
C
L
(see Note A)  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
A. CL includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
Figure 3. Receiver Propagation Delay Times  
7
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
PARAMETER MEASUREMENT INFORMATION (continued)  
3 V  
V
CC  
GND  
Input  
1.5 V  
1.5 V  
S1  
0 V  
R
L
t
t
PZH  
PHZ  
S1 at GND)  
(S1 at GND)  
3 V or 0 V  
Output  
V
OH  
C
L
Output  
50%  
(see Note A)  
EN  
0.3 V  
0.3 V  
t
PLZ  
Generator  
(see Note B)  
(S1 at V  
)
CC  
50  
Output  
50%  
V
OL  
t
PZL  
(S1 at V )  
CC  
TEST CIRCUIT  
A. CL includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
Figure 4. Receiver Enable and Disable Times  
8
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TRS3222  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
www.ti.com  
SLLS815JULY 2007  
APPLICATION INFORMATION  
1
20  
EN  
Powerdown  
PWRDOWN  
2
19  
18  
17  
V
C1+  
V+  
CC  
+
C
BYPASS  
= 0.1 µF  
+
3
4
GND  
C1  
+
C3  
DOUT1  
RIN1  
C1−  
C2+  
C2−  
V−  
16  
15  
14  
13  
12  
11  
5
+
C2  
C4  
6
ROUT1  
NC  
7
+
8
DOUT2  
RIN2  
DIN1  
DIN2  
NC  
9
10  
ROUT2  
C3 can be connected to V or GND.  
CC  
NOTES: A. Resistor values shown are nominal.  
B. NC − No internal connection  
C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be  
connected as shown.  
V
CC  
vs CAPACITOR VALUES  
V
C1  
C2, C3, and C4  
0.1 µF  
CC  
0.1 µF  
0.047 µF  
0.1 µF  
3.3 V " 0.3 V  
5 V " 0.5 V  
3 V to 5.5 V  
0.33 µF  
0.47 µF  
Figure 5. Typical Operating Circuit and Capacitor Values  
9
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PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jul-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
Purchase Samples  
Purchase Samples  
Request Free Samples  
TRS3222CDB  
TRS3222CDBG4  
TRS3222CDBR  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SSOP  
DB  
DB  
DB  
20  
20  
20  
TBD  
TBD  
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2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
TRS3222CDBRG4  
ACTIVE  
SSOP  
DB  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Request Free Samples  
TRS3222CDW  
TRS3222CDWG4  
TRS3222CDWR  
TRS3222CDWRG4  
TRS3222CPW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
DW  
DW  
PW  
PW  
PW  
PW  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
TBD  
TBD  
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SOIC  
SOIC  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SSOP  
SSOP  
SSOP  
SSOP  
SOIC  
TRS3222CPWG4  
TRS3222CPWR  
TRS3222CPWRG4  
TRS3222IDB  
TRS3222IDBG4  
TRS3222IDBR  
DB  
DB  
TRS3222IDBRG4  
TRS3222IDW  
DB  
DW  
DW  
DW  
DW  
PW  
PW  
PW  
PW  
TRS3222IDWG4  
TRS3222IDWR  
TRS3222IDWRG4  
TRS3222IPW  
SOIC  
SOIC  
SOIC  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TRS3222IPWG4  
TRS3222IPWR  
TRS3222IPWRG4  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jul-2010  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TRS3222CDBR  
SSOP  
DB  
20  
2000  
330.0  
16.4  
8.2  
7.5  
2.5  
12.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SSOP DB 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
346.0 346.0 33.0  
TRS3222CDBR  
2000  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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dataconverter.ti.com  
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