TRF7960_12 [TI]

MULTI-STANDARD FULLY INTEGRATED 13.56-MHZ RFID ANALOG FRONT END AND DATA-FRAMING READER SYSTEM; 多标准完全集成的13.56MHz RFID模拟前端和数据成帧阅读系统
TRF7960_12
型号: TRF7960_12
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

MULTI-STANDARD FULLY INTEGRATED 13.56-MHZ RFID ANALOG FRONT END AND DATA-FRAMING READER SYSTEM
多标准完全集成的13.56MHz RFID模拟前端和数据成帧阅读系统

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TRF7960  
TRF7961  
www.ti.com  
SLOU186FAUGUST 2006REVISED AUGUST 2010  
MULTI-STANDARD FULLY INTEGRATED 13.56-MHZ RFID  
ANALOG FRONT END AND DATA-FRAMING READER SYSTEM  
Check for Samples: TRF7960, TRF7961  
1 Introduction  
1.1 Features  
12  
Completely Integrated Protocol Handling  
Parallel 8-Bit or Serial 4-Pin SPI Interface With  
MCU Using 12-Byte FIFO  
Ultra-Small 32-Pin QFN Package  
(5 mm × 5 mm)  
Separate Internal High-PSRR Power Supplies  
for Analog, Digital, and PA Sections Provide  
Noise Isolation for Superior Read Range and  
Reliability  
Available Tools  
Dual Receiver Inputs With AM and PM  
Demodulation to Minimize Communication  
Holes  
Reference Design/EVM With Development  
Software  
Source Code Available for MSP430  
Receiver AM and PM RSSI  
Reader-to-Reader Anti-Collision  
High Integration Reduces Total BOM and Board  
1.2 APPLICATIONS  
Secure Access Control  
Product Authentication  
Area  
Single External 13.56-MHz Crystal Oscillator  
Printer Ink Cartridges  
MCU-Selectable Clock-Frequency Output of  
RF, RF/2, or RF/4  
Blood Glucose Monitors  
Adjustable 20-mA, High-PSRR LDO for  
Powering External MCU  
Easy to Use With High Flexibility  
Contactless Payment Systems  
Medical Systems  
Auto-Configured Default Modes for Each  
Supported ISO Protocol  
12 User-Programmable Registers  
Selectable Receiver Gain and AGC  
Programmable Output Power  
(100 mW or 200 mW)  
Adjustable ASK Modulation Range  
(8% to 30%)  
Built-In Receiver Band-Pass Filter With  
User-Selectable Corner Frequencies  
Wide Operating Voltage Range of 2.7 V to 5.5 V  
Ultra-Low-Power Modes  
Power Down < 1 μA  
Standby 120 μA  
Active (Rx only) 10 mA  
1.3 Description  
The TRF7960/61 is an integrated analog front end and data-framing system for a 13.56-MHz RFID reader  
system. Built-in programming options make it suitable for a wide range of applications for proximity and  
vicinity RFID systems.  
The reader is configured by selecting the desired protocol in the control registers. Direct access to all  
control registers allows fine tuning of various reader parameters as needed.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Tag-it is a trademark of Texas Instruments Incorporated.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20062010, Texas Instruments Incorporated  
 
 
 
 
TRF7960  
TRF7961  
SLOU186FAUGUST 2006REVISED AUGUST 2010  
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Table 1-1. PRODUCT SELECTION TABLE  
PROTOCOLS  
ISO14443A/B  
DEVICE  
ISO15693  
ISO18000-3  
Tag-it  
106 kbps  
212 kbps  
424 kbps  
848 kbps  
TRF7960  
TRF7961  
2
Introduction  
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1
Introduction .............................................. 1  
4.4 ELECTRICAL CHARACTERISTICS ................. 8  
4.5  
Application Schematic for the TRF796x EVM  
1.1 Features .............................................. 1  
1.2 APPLICATIONS ...................................... 1  
1.3 Description ........................................... 1  
Description (continued) ................................ 4  
Physical Characteristics ............................... 5  
(Parallel Mode) ....................................... 9  
Application Schematic for the TRF796x EVM (SPI  
Mode) ............................................... 10  
4.6  
2
3
5
System Description ................................... 11  
5.1 Power Supplies ..................................... 11  
5.2 Receiver Analog Section ......................... 17  
5.3 Register Descriptions ............................... 24  
3.1 Terminal Functions ................................... 5  
3.2  
PACKAGING/ORDERING INFORMATION .......... 6  
5.4  
Direct Commands From MCU to Reader ........... 34  
4
ELECTRICAL SPECIFICATIONS ..................... 7  
4.1 ABSOLUTE MAXIMUM RATINGS .................. 7  
4.2 DISSIPATION RATINGS TABLE .................... 7  
5.5 Reader Communication Interface .................. 36  
5.6 Parallel Interface Communication .................. 38  
5.7 Serial Interface Communication .................... 40  
5.8 External Power Amplifier Application ............... 44  
4.3  
RECOMMENDED OPERATING CONDITIONS ..... 7  
Copyright © 20062010, Texas Instruments Incorporated  
Contents  
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2 Description (continued)  
SYS_CLK  
VDD_X  
VDD  
DATA_CLK  
Z – Matching  
Tx_Out  
Circuit  
TRF796x  
MSP430  
IRQ  
Rx_IN1  
Rx_IN2  
3 (SPI)  
Xtal In  
Xtal Out  
VDD_I/O  
8 (Parallel)  
Xtal  
13.56 MHz  
Figure 2-1. Typical Application  
A parallel or serial interface can be implemented for communication between the MCU and reader.  
Transmit and receive functions use internal encoders and decoders with a 12-byte FIFO register. For  
direct transmit or receive functions, the encoders / decoders can be bypassed so the MCU can process  
the data in real time. The transmitter has selectable output power levels of 100 mW (20 dBm) or 200 mW  
(23 dBm) into a 50-load (5 -V supply) and is capable of ASK or OOK modulation. Integrated voltage  
regulators ensure power-supply noise rejection for the complete reader system.  
Data transmission comprises low-level encoding for ISO15693, modified Miller for ISO14443-A,  
high-bit-rate systems for ISO14443 and Tag-it coding systems. Included with the data encoding is  
automatic generation of SOF, EOF, CRC, and / or parity bits.  
The receiver system enables AM and PM demodulation using a dual-input architecture. The receiver also  
includes an automatic gain control option and selectable gain. Also included is a selectable bandwidth to  
cover a broad range of input sub-carrier signal options. The received signal strength for AM and PM  
modulation is accessible via the RSSI register. The receiver output is a digitized sub-carrier signal among  
a selectable protocol and bit rate as outlined in Table 5-11. A selected decoder delivers bit stream and a  
data clock as outputs.  
The receiver system also includes a framing system. This system performs CRC and / or parity check,  
removes the EOF and SOF settings, and organizes the data in bytes. Framed data is then accessible to  
the MCU via a 12-byte FIFO register and MCU interface. The framing supports ISO14443 and ISO15693  
protocols.  
The TRF7960/61 supports data communication levels from 1.8 V to 5.5 V for the MCU I/O interface, while  
also providing a data synchronization clock. An auxiliary 20-mA regulator (pin 32) is available for  
additional system circuits.  
4
Description (continued)  
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3 Physical Characteristics  
3.1 Terminal Functions  
Figure 3-1. TRF796x Pin Assignments (Top View)  
Table 3-1. Terminal Functions  
TERMINAL  
NAME  
VDD_A  
VIN  
TYPE(1)  
DESCRIPTION  
NO.  
1
OUT  
SUP  
OUT  
INP  
Internal regulated supply (2.7 V 3.4 V) for analog circuitry  
External supply input to chip (2.7 V 5.5 V)  
2
VDD_RF  
VDD_PA  
TX_OUT  
VSS_RF  
VSS_RX  
RX_IN1  
RX_IN2  
VSS  
3
Internal regulated supply (2.7 V 5 V), normally connected to VDD_PA (pin 4)  
Supply for PA; normally connected externally to VDD_RF (pin 3)  
RF output (selectable output power, 100 mW at 8 or 200 mW at 4 , with VDD = 5 V)  
Negative supply for PA; normally connected to circuit ground  
Negative supply for RX inputs; normally connected to circuit ground  
RX input, used for AM reception  
4
5
OUT  
SUP  
SUP  
INP  
6
7
8
9
INP  
RX input, used for PM reception  
10  
11  
SUP  
OUT  
Chip substrate ground  
BAND_GAP  
Band-gap voltage (1.6 V); internal analog voltage reference; must be ac-bypassed to ground.  
Also can be configured to provide the received analog signal output (ANA_OUT)  
Direct mode, selection between ASK and OOK modulation (0 = ASK, 1 = OOK)  
Interrupt request  
ASK/OOK  
12  
BID  
IRQ  
13  
14  
15  
OUT  
INP  
MOD  
VSS_A  
Direct mode, external modulation input  
SUP  
Negative supply for internal analog circuits; normally connected to circuit ground  
Supply for I/O communications (1.8 V 5.5 V). Should be connected to VIN for 5-V  
communication, VDD_X for 3.3-V communication, or any other voltage from 1.8 V to 5.5 V.  
VDD_I/O  
16  
SUP  
I/O_0  
I/O_1  
I/O_2  
I/O_3  
I/O_4  
17  
18  
19  
20  
21  
BID  
BID  
BID  
BID  
BID  
I/O pin for parallel communication  
I/O pin for parallel communication  
I/O pin for parallel communication  
I/O pin for parallel communication  
I/O pin for parallel communication  
(1) SUP = Supply, INP = Input, BID = Bi-directional, OUT = Output  
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Physical Characteristics  
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Table 3-1. Terminal Functions (continued)  
TERMINAL  
NAME  
TYPE(1)  
DESCRIPTION  
NO.  
I/O pin for parallel communication  
Strobe out clock for serial communication  
Data clock output in direct mode  
I/O pin for parallel communication  
MISO for serial communication (SPI)  
I/O_5  
22  
BID  
I/O_6  
23  
BID  
Serial bit data output in direct mode 1 or sub-carrier signal in direct mode 0  
I/O pin for parallel communication.  
I/O_7  
EN2  
24  
25  
BID  
INP  
MOSI for serial communication (SPI)  
Pulse enable and selection of power down mode. If EN2 is connected to VIN, then VDD_X is  
active during power down to support the MCU. Pin can also be used for pulse wake-up from  
power-down mode.  
DATA_CLK  
SYS_CLK  
26  
27  
INP  
Clock input for MCU communication (parallel and serial)  
Clock for MCU (3.39 / 6.78 / 13.56 MHz) at EN = 1 and EN2 = don't care  
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz  
Chip enable input (If EN = 0, then chip is in power-down mode).  
Negative supply for internal digital circuits; normally connected to circuit ground  
Crystal oscillator output  
OUT  
EN  
28  
29  
30  
31  
32  
INP  
SUP  
OUT  
INP  
VSS_D  
OSC_OUT  
OSC_IN  
VDD_X  
Crystal oscillator input  
OUT  
Internally regulated supply (2.7 V 3.4 V) for external circuitry (MCU)  
Connected to circuit ground  
Thermal Pad  
3.2 PACKAGING/ORDERING INFORMATION(1)  
(2)  
PACKAGED DEVICES  
TRF7960RHBT  
PACKAGE TYPE  
TRANSPORT MEDIA  
Tape and reel  
QUANTITY  
250  
RHB-32  
TRF7960RHBR  
TRF7961RHBT  
Tape and reel  
3000  
Tape and reel  
250  
RHB-32  
TRF7961RHBR  
Tape and reel  
3000  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package .  
6
Physical Characteristics  
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4 ELECTRICAL SPECIFICATIONS  
4.1 ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)(1)  
VALUE  
6
UNIT  
V
VIN  
IO  
Supply voltage  
Output current  
150  
mA  
Continuous power dissipation  
See Dissipation Ratings Table  
Maximum junction temperature, any condition(2)  
Maximum junction temperature, continuous operation, long-term reliability(2)  
Storage temperature range  
140  
125  
°C  
°C  
°C  
°C  
kV  
TJ  
Tstg  
55 to 150  
300  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
HBM (human body model)  
2
ESDS rating  
CDM (charged device model)  
MM (machine model)  
500  
V
200  
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may  
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are  
stress ratings only and functional operation of the device at these or any other conditions beyond those specified are not implied.  
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may  
result in reduced reliability and/or lifetime of the device.  
4.2 DISSIPATION RATINGS TABLE  
POWER RATING(2)  
(1)  
θJC  
θJA  
PACKAGE  
(°C/W)  
(°C/W)  
TA 25°C  
TA = 85°C  
RHB (32)  
31  
36.4  
2.7 W  
1.1 W  
(1) This data was taken using the JEDEC standard high-K test PCB.  
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to increase substantially.  
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and  
long-term reliability.  
4.3 RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2.7  
TYP  
MAX  
5.5  
UNIT  
V
VIN  
TJ  
Supply voltage  
5
Operating virtual junction temperature range  
Operating ambient temperature range  
40  
40  
125  
110  
°C  
TA  
25  
°C  
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ELECTRICAL SPECIFICATIONS  
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4.4 ELECTRICAL CHARACTERISTICS  
over temperature range VS = 5 V (unless otherwise noted)  
TYP  
40°C  
TO  
110°C  
PARAMETER  
CONDITIONS  
MIN/  
MAX  
25°C  
UNIT  
IPD  
Supply current in power-down mode  
Supply current in power-down mode 2  
All systems disabled, including supply-voltage regulators  
1
10  
μA  
μA  
MAX  
MAX  
The reference voltage generator and the VDD_X remain  
active to support external circuitry.  
IPD2  
120  
300  
Oscillator running, supply-voltage regulators in  
low-consumption mode  
ISTBY  
ION1  
Supply current in standby mode  
1.5  
10  
4
mA  
mA  
mA  
mA  
V
MAX  
MAX  
MAX  
MAX  
Supply current without antenna driver Oscillator, regulators, Rx and AGC, are all active. Tx is  
16  
current  
off.  
Supply current with antenna driver  
current  
Oscillator, regulators, Rx, AGC, and Tx are all active.  
Pout = 100 mW.  
ION2  
70  
Supply current with antenna driver  
current  
Oscillator, regulators, Rx, AGC, and Tx are all active.  
Pout = 200 mW.  
ION3  
120  
1.6  
2
1.4  
1.7  
MIN  
MAX  
BG  
Band Gap voltage  
Internal analog reference voltage  
1.4  
2.5  
MIN  
MAX  
VPOR  
VDD_A  
VDD_RF  
VDD_X  
Power on reset voltage (POR)  
Regulated supply for analog circuitry  
Regulated supply for RF circuitry  
Regulated supply for external circuitry  
V
3.1  
3.8  
MIN  
MAX  
3.5  
4.6  
3.4  
V
4
5.2  
MIN  
MAX  
Regulator set for 5-V system with 250-mV difference.  
V
3.1  
3.8  
MIN  
MAX  
V
The difference between the external supply and the  
regulated voltage is higher than 250 mV. Measured at  
212 kHz.  
Rejection of external supply noise on  
the supply VDD_RF regulator  
PPSRR  
26  
20  
dB  
MIN  
Half-power mode  
Full- power mode  
8
4
12  
6
MAX  
MAX  
RRFOUT  
PA driver output resistance  
5
20  
MIN  
MAX  
RRFIN  
VRFIN  
RX_IN1 and RX_IN2 input resistance  
Maximum input voltage  
10  
kΩ  
At RX_IN1 and RX_IN2 inputs  
fSUB-CARRIER = 424 kHz  
3.5  
1.2  
1.2  
10  
VPP  
mVPP  
mVPP  
ms  
MAX  
MAX  
MAX  
MAX  
MAX  
2.5  
3
VSENS  
Input sensitivity  
fSUB-CARRIER = 848 kHz  
tSET_PD  
Set up time after power down  
Set up time after standby mode  
20  
100  
tSET_STBY  
30  
μs  
Recovery time after modulation  
(ISO14443)  
tREC  
Modulation signal: sine, 424-kHz, 10-mVpp  
In PD2 mode EN = 0 and EN2 = 1  
60  
μs  
MAX  
30  
120  
MIN  
MAX  
fSYS_CLK  
SYS_CLK frequency  
60  
kHz  
CLKMAX  
VIL  
Maximum CLK frequency  
Input logic low  
2
MHz  
VDD_I/O  
VDD_I/O  
TYP  
MAX  
MIN  
0.2  
0.2  
0.8  
VIH  
Input logic high  
ROUT  
Output resistance I/O_0 to I/O_7  
Output resistance SYS_CLK  
low_io = H for VDD_I/O < 2.7 V  
low_io = H for VDD_I/O < 2.7 V  
400  
200  
800  
400  
MAX  
MAX  
RSYS_CLK  
8
ELECTRICAL SPECIFICATIONS  
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4.5 Application Schematic for the TRF796x EVM (Parallel Mode)  
E N 2  
/
O
V D D _ I  
V S S _ A  
M O D  
I R Q  
A T _ C D L K A  
S Y S _ C L K  
E N  
A S K / O O K  
V S S _ D  
O S C _ O U T  
B A N D G A P  
V S S  
O S C _ I N  
V D D _ X  
P M R X 2 _  
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4.6 Application Schematic for the TRF796x EVM (SPI Mode)  
E N 2  
/
O
V D D _ I  
V S S _ A  
M O D  
I R Q  
A T _ C D L K A  
S Y S _ C L  
E N  
V S S _ D  
O S C _ O U T  
O S C _ I N  
V D D _ X  
A S K  
/
B A N D G A P  
V S S  
P M R X 2 _  
10  
ELECTRICAL SPECIFICATIONS  
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5 System Description  
5.1 Power Supplies  
The positive supply pin, VIN (pin 2) has an input voltage range of 2.7 V to 5.5 V. The positive supply input  
sources three internal regulators with output voltages VDD_RF, VDD_A and VDD_X that use external bypass  
capacitors for supply noise filtering. These regulators provide enhanced PSRR for the RFID reader  
system.  
The regulators are not independent and have common control bits for output voltage setting. The  
regulators can be configured to operate in either automatic or manual mode. The automatic regulator  
mode setting ensures an optimal compromise between regulator PSRR and highest possible supply  
voltage for RF output power. Whereas, the manual mode allows the user to manually configure the  
regulator settings.  
VDD_RF  
The regulator VDD_RF (pin 3) is used to source the RF output stage. The voltage regulator can  
be set for either 5-V or 3-V operation. When configured for the 5-V operation, the output  
voltage can be set from 4.3 V to 5 V in 100-mV steps. The current sourcing capability for 5-V  
operation is 150 mA maximum over the adjusted output voltage range.  
When configured for 3-V operation, the output can be set from 2.7 V to 3.4 V, also in 100-mV  
steps. The current sourcing capability for 3-V operation is 100 mA maximum over the adjusted  
output voltage range.  
VDD_A  
Regulator VDD_A (pin 1) supplies voltage to analog circuits within the reader chip. The voltage  
setting is divided in two ranges. When configured for 5-V operation, the output voltage is fixed  
at 3.5 V.  
When configured for 3-V operation, the output can be set from 2.7 V to 3.4 V in 100-mV steps.  
Note that when configured, both VDD_A and VDD_X regulators are configured together  
(their settings are not independent).  
VDD_X  
Regulator VDD_X (pin 32) can be used to source the digital I/O of the reader chip together with  
other external system components. When configured for 5-V operation, the output voltage is  
fixed at 3.4 V.  
When configured for 3-V operation, the output voltage can be set from 2.7 to 3.4 V in 100-mV  
steps. The total current sourcing capability of the VDD_X regulator is 20 mA maximum over the  
adjusted output range. Note that when configured, both VDD_A and VDD_X regulators are  
configured together (their settings are not independent).  
VDD_PA  
The VDD_PA pin (pin 4) is the positive supply pin for the RF output stage and is externally  
connected to the regulator output VDD_RF (pin 3).  
5.1.1 Negative Supply Connections  
The negative supply connections are all externally connected together (to GND). The substrate connection  
is VSS (pin 10), the analog negative supply is VSS_A (pin 15), the logic negative supply is VSS_D (pin 29),  
the RF output stage negative supply is VSS_TX (pin 6), and the negative supply for the RF receiver input is  
VSS_RX (pin 7).  
5.1.2 Digital I/O Interface  
To allow compatible I/O signal levels, the TRF7960/61 has a separate supply input VDD_I/O (pin 16), with  
an input voltage range of 1.8 V to 5.5 V. This pin is used to supply the I/O interface pins (I/O_0 to I/O_7),  
IRQ, SYS_CLK, and DATA_CLK pins of the reader. In typical applications, VDD_I/O is connected directly to  
VDD_X to ensure that the I/O signal levels of the MCU are the same as the internal logic levels of the  
reader.  
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System Description  
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5.1.3 Supply Regulator Configuration  
The supply regulators can be automatically or manually configured by the control bits. The available  
options are shown in Table 5-1 through Table 5-4. Table 5-1 shows a 5-V system and the manual-mode  
regulator settings. Table 5-2 shows manual mode for selection of a 3-V system. Table 5-3 and Table 5-4  
show the automatic-mode gain settings for 5-V and 3-V systems.  
The automatic mode is the default configuration. In automatic mode, the regulators are automatically set  
every time the system is activated by asserting the EN input HIGH. The internal regulators are also  
automatically reconfigured every time the automatic regulator selection bit is set HIGH (on the rising  
edge).  
The user can re-run the automatic mode setting from a state in which the automatic setting bit is already  
high by changing the automatic setting bit from high to low to high. The regulator-configuration algorithm  
adjusts the regulator outputs 250 mV below the VIN level, but not higher than 5 V for VDD_RF, 3.5 V for  
VDD_A, and 3.4 V for VDD_X. This ensures the highest possible supply voltage for the RF output stage while  
maintaining an adequate PSRR (power supply rejection ratio). As an example, the user can improve the  
PSRR if there is a noisy supply voltage from VDD_X by increasing the target voltage difference across the  
VDD_X regulator as shown for automatic regulator settings in Table 5-3 and Table 5-4.  
Table 5-1. Supply-Regulator Setting Manual 5-V System  
Byte  
Option Bits Setting in Control Register  
Action  
Address  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
00  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
1
5-V system  
0
0
0
0
0
0
0
0
0
Manual regulator setting  
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 5 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.9 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.8 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.7 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.6 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.5 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.4 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
VDD_RF = 4.3 V, VDD_A = 3.5 V, and VDD_X = 3.4 V  
Table 5-2. Supply-Regulator Setting Manual 3-V System  
Byte  
Option Bits Setting in Control Register  
Action  
Address  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
00  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0
3V system  
0
0
0
0
0
0
0
0
0
Manual regulator setting  
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 3.4 V, VDD_A, and VDD_X = 3.4 V  
VDD_RF = 3.3 V, VDD_A, and VDD_X = 3.3 V  
VDD_RF = 3.2 V, VDD_A, and VDD_X = 3.2 V  
VDD_RF = 3.1 V, VDD_A, and VDD_X = 3.1 V  
VDD_RF = 3.0 V, VDD_A, and VDD_X = 3.0 V  
VDD_RF = 2.9 V, VDD_A, and VDD_X = 2.9 V  
VDD_RF = 2.8 V, VDD_A, and VDD_X = 2.8 V  
VDD_RF = 2.7 V, VDD_A, and VDD_X = 2.7 V  
12  
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Table 5-3. Supply-Regulator Setting Automatic 5-V System  
Byte  
Option Bits Setting in Control Register  
Action  
Address  
B7  
B6  
B5  
B4  
B3  
B2(1)  
B1  
B0  
1
00  
0B  
0B  
0B  
5-V system  
1
1
1
x
x
x
1
1
0
1
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
0
0
(1) X are don't cares  
Table 5-4. Supply-Regulator Setting Automatic 3-V System  
Byte  
Option Bits Setting in Control Register  
Action  
Address  
B7  
B6  
B5  
B4  
B3  
B2(1)  
B1  
B0  
0
00  
0B  
0B  
0B  
3-V system  
1
1
1
x
x
x
1
1
0
1
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
0
0
(1) X are don't cares  
5.1.4 Power Modes  
The chip has seven power states, which are controlled by two input pins (EN and EN2) and three bits in  
the chip status control register (00h).  
The main reader enable input is EN (which has a threshold level of 1 V minimum). Any input signal level  
from 1.8 V to VIN can be used. When EN is set high, all of the reader regulators are enabled, together with  
the 13.56-MHz oscillator, while the SYS_CLK (output clock for external micro controller) is made available.  
The auxiliary-enable input EN2 has two functions. A direct connection from EN2 to VIN ensures availability  
of the regulated supply (VDD_X) and an auxiliary clock signal (60 kHz) on the SYS_CLK output (same for  
the case EN = 0). This mode is intended for systems in which the MCU controlling the reader is also being  
supplied by the reader supply regulator (VDD_X) and the MCU clock is supplied by the SYS_CLK output of  
the reader. This allows the MCU supply and clock to be available during power-down.  
A second function of the EN2 input is to enable start-up of the reader system from complete power down  
(EN = 0, EN2 = 0). In this case the EN input is being controlled by the MCU or other system device that is  
without supply voltage during complete power down (thus unable to control the EN input). A rising edge  
applied to the EN2 input (which has a 1-V threshold level) starts the reader supply system and 13.56-MHz  
oscillator (identical to condition EN = 1). This start-up mode lasts until all of the regulators have settled  
and the 13.56-MHz oscillator has stabilized. If the EN input is set high by the MCU (or other system  
device), the reader stays active. If the EN input is not set high within 100 μs after the SYS_CLK output is  
switched from auxiliary clock (60 kHz) to high-frequency clock (derived from the crystal oscillator), the  
reader system returns to complete power-down mode. This option can be used to wake the reader system  
from complete power down by using a push-button switch or by sending a single pulse.  
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After the reader EN line is high, the other power modes are selected by control bits. The power mode  
options and functions are listed in Table 5-5.  
Table 5-5. Power Modes  
Byte  
Option Bits Setting in Chip Status Control Register  
EN  
EN2 Functionality  
Current  
Address  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
STBY  
RFON  
RF PWR  
REC ON  
00  
00  
0
0
0
1
Complete power down  
<1 μA  
VDD_X available  
120 μA  
SYS_CLK auxiliary frequency 60 kHz is ON  
00  
1
x
x
x
1
x
All supply regulators active and in low power  
mode  
1.5 mA  
13.56-MHz oscillator ON  
SYS_CLK clock available  
00  
00  
0
0
0
0
x
x
0
1
1
1
x
x
All supply regulators active  
13.56-MHz oscillator ON  
SYS_CLK clock available  
3.5 mA  
10 mA  
All supply regulators active  
13.56-MHz oscillator ON  
SYS_CLK clock available  
Receiver active  
00  
00  
0
0
1
1
1
0
x
x
1
1
x
x
All supply regulators active  
13.56-MHz oscillator ON  
SYS_CLK clock available  
Receiver active  
70 mA  
(at 5 V)  
Transmitter active half-power mode  
All supply regulators active  
13.56-MHz oscillator running  
SYS_CLK clock available  
Receiver active  
120 mA  
(at 5 V)  
Transmitter active full-power mode  
During reader inactivity, the TRF7960/61 can be placed in power down-mode (EN = 0). The power down  
can be complete (EN = 0, EN2 = 0) with no function running, or partial (EN = 0, EN2 = 1) where the  
regulated supply (VDD_X) and auxiliary clock 60 kHz (SYS_CLK) are available to the MCU or other system  
device.  
When EN is set high (or on rising edge of EN2 and then confirmed by EN = 1), the supply regulators are  
activated and the 13.56-MHz oscillator started. When the supplies are settled and the oscillator frequency  
is stable, the SYS_CLK output is switched from the auxiliary frequency of 60 kHz to the selected  
frequency derived from the crystal oscillator. At this point, the reader is ready to communicate and perform  
the required tasks. The control system (MCU) can then write appropriate bits to the chip status control  
register (address 00) and select the operation mode.  
The STANDBY mode (bit 7 = 1 of register 00) is the active mode with the lowest current consumption. The  
reader is capable of recovering from this mode to full operation in 100 μs.  
The active mode with RF section disabled (bit 5 = 0 and bit 1 = 0 of register 00) is the next active mode  
with low power consumption. The reader is capable of recovering from this mode to full operation in 25 μs.  
The active mode with only the RF receiver section active (bit 1 = 1 of register 00) can be used to measure  
the external RF field (as described in RSSI measurements paragraph) if reader-to-reader anticollision is  
implemented.  
The active mode with the entire RF section active (bit 5 = 1 of register 00) is the normal mode used for  
transmit and receive operations.  
14  
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5.1.5 Timing Diagrams  
CHIP POWER UP TO CLOCK START  
C001  
Figure 5-1. Power Up [VIN (Blue) to Crystal Start (Red)]  
CHIP ENABLE TO CLOCK START  
C002  
Figure 5-2. EN2 Low and EN High (Blue) to Start of System Clock (Red)  
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CHIP ENABLE TO CLOCK START  
C003  
Figure 5-3. EN2 High and EN Low (Blue) to Start of System Clock (Red)  
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5.2 Receiver Analog Section  
The TRF7960/61 has two receiver inputs, RX_IN1 (pin 8) and RX_IN2 (pin 9). The two inputs are  
connected to an external filter to ensure that AM modulation from the tag is available on at least one of the  
two inputs. The external filter provides a 45° phase shift for the RX_IN2 input to allow further processing of  
a received PM-modulated signal (if it appears) from the tag. This architecture eliminates any possible  
communication holes that may occur from the tag to the reader.  
The two RX inputs are multiplexed to two receiver channels: the main receiver and the auxiliary receiver.  
Receiver input multiplexing is controlled by control bit B3 (pm-on) in the chip status control register  
(address 00). The main receiver is composed of an RF-detection stage, gain, filtering with AGC, and a  
digitizing stage whose output is connected to the digital processing block. The main receiver also has an  
RSSI measuring stage, which measures the strength of the demodulated signal.  
The primary function of the auxiliary receiver is to measure the RSSI of the modulation signal. It also has  
similar RF-detection, gain, filtering with AGC, and RSSI blocks.  
The default setting is RX_IN1 connected to the main receiver and RX_IN2 connected to the auxiliary  
receiver (bit pm_on = 0). When a response from the tag is detected by the RSSI, values on both inputs  
are measured and stored in the RSSI level register (address 0F). The control system reads the RSSI  
values and switches to the stronger receiver input (RX_IN1 or RX_IN2 by setting pm_on = 1).  
The receiver input stage is an RF level detector. The RF amplitude level on RX_IN1 and RX_IN2 inputs  
should be approximately 3 VPP for a VIN supply level greater than 3.3 V. If the VIN level is lower, the RF  
input peak-to-peak voltage level should not exceed the VIN level. Note: VIN is the main supply voltage to  
the device at pin 2.  
The first gain and filtering stage following the RF-envelope detector has a nominal gain of 15 dB with an  
adjustable bandpass filter. The bandpass filter has adjustable 3-dB frequency steps (100 kHz to 400 kHz  
for high pass and 600 kHz to 1500 kHz for low pass). Following the bandpass filter is another  
gain-and-filtering stage with a nominal gain of 8 dB and with frequency characteristics identical to the first  
stage.  
The internal filters are configured automatically, with internal presets for each new selection of a  
communication standard in the ISO control register (address 01). If required, additional fine tuning can be  
accomplished by writing directly to the RX special setting registers (address 0A).  
The second receiver gain stage and digitizer stage are included in the AGC loop. The AGC loop is  
activated by setting the bit B2 = 1 (agc-on) in the chip status control register (address 00). When  
activated, the AGC continuously monitors the input signal level. If the signal level is significantly higher  
than an internal threshold level, gain reduction is activated. AGC activation is by default five times the  
internal threshold level. It can be reduced to three times the internal level by setting bit B1 = 1 (agcr) in the  
RX special setting register (address 0A). The AGC action is fast, typically finishing after four sub-carrier  
pulses. By default, the AGC action is blocked after the first few pulses of the sub-carrier signal. This  
prevents the AGC from interfering with the reception of the remaining data packet. In certain situations,  
this type of blocking is not optimal, so it can be removed by setting B0 = 1 (no_lim) in the RX special  
setting register (address 0A).  
The bits of the RX special settings register (address 0A), which control the receiver analog section, are  
shown in Table 5-20.  
5.2.1 Received Signal Strength Indicator (RSSI)  
The RSSI measurement block measures the demodulated signal (except in the case of a direct command  
for RF-amplitude measurement described in the Direct Commands section). The measuring system  
latches the peak value, so the RSSI level can be read after the end of the receive packet. The RSSI  
register values reset with every transmission by the reader. This allows an updated RSSI measurement  
for each new tag response.  
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Correlation between the RF input level and RSSI designation levels on the RX_IN1 and RX_IN2 are  
shown in Table 5-6 and Table 5-7.  
Table 5-6 shows the RSSI level versus RSSI bit value. The RSSI has seven levels (3 bits each) with 4-dB  
increments. The input level is the peak-to-peak modulation level of the RF signal as measured on one side  
envelope (positive or negative).  
Table 5-6. RSSI Level Versus Register Bit Value  
RSSI  
1
2
3
4
5
6
7
Input level  
2 mVpp  
3.2 mVpp  
5 mVpp  
8 mVpp  
13 mVpp  
20 mVpp  
32 mVpp  
As an example, from Table 5-7, let B2 = 1, B1 = 1, B0 = 0; this yields an RSSI value of 6. From Table 5-6  
a Bit value of 6 would yield an RSSI level of 20 mVpp.  
Table 5-7. RSSI Bit Value and Oscillator Status Register (0F)  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Signal Name  
Unused  
osc_ok  
rssi_x2  
rssi_x1  
rssi_x1  
rssi_2  
Function  
Comments  
Crystal oscillator stable  
MSB of auxiliary receiver RSSI  
Auxiliary receiver RSSI  
LSB of auxiliary receiver RSSI  
MSB of main receiver RSSI  
Main receiver RSSI  
4 dB per step  
rssi_1  
rssi_0  
LSB of main receiver RSSI  
5.2.2 Receiver Digital Section  
The received sub-carrier is digitized to form a digital representation of the modulated RF envelope. This  
digitized signal is applied to digital decoders and framing circuits for further processing.  
The digital part of the receiver consists of two sections, which partly overlap. The first section is the bit  
decoders for the various protocols, whereas the second section consists of framing logic. The bit decoders  
convert the sub-carrier coded signal to a bit stream and also to the data clock. Thus, the sub-carrier-coded  
signal is transformed to serial data and the data clock is extracted. The decoder logic is designed for  
maximum error tolerance. This enables the decoders to successfully decode even partly corrupted (due to  
noise or interference) sub-carrier signals.  
In the framing section, the serial bit-stream data is formatted in bytes. In this process, special signals like  
the start of frame (SOF), end of frame (EOF), start of communication, and end of communication are  
automatically removed. The parity bits and CRC bytes are checked and also removed. The end result is  
clean or raw data, which is sent to the 12-byte FIFO register where it can be read by the external  
microcontroller system.  
The start of the receive operation (successfully received SOF) sets the flags in the IRQ and status  
register. The end of the receive operation is indicated to the external system (MCU) by sending an  
interrupt request (pin 13 IRQ). If the receive data packet is longer than 8 bytes, an interrupt is sent to the  
MCU when the received data occupies 75% of the FIFO capacity to signal that the data should be  
removed from the FIFO.  
Any error in data format, parity, or CRC is detected, and the external system is notified of the error by an  
interrupt-request pulse. The source condition of the interrupt-request pulse is available in the IRQ and  
status register (address 0C). The bit-coding description of this register is given in Table 5-22.  
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The main register controlling the digital part of the receiver is the ISO control register (address 01). By  
writing to this register, the user selects the protocol to be used. With each new write in this register, the  
default presets are loaded in all related registers, so no further adjustments in other registers are needed  
for proper operation.  
Table 5-10 shows the coding of the ISO control register. Note that the TRF7961 does not include the  
ISO14443 functionality; its features/commands in this area are non-functional.  
The framing section also supports the bit-collision detection as specified in ISO14443A. When a bit  
collision is detected, an interrupt request is sent and flag set in the IRQ and status register. The position of  
the bit collision is written in two registers. Register collision position, with address 0E, and in register  
collision position and interrupt mask (address 0D), in which only the bits B7 and B6 are used for collision  
position. The collision position is presented as a sequential bit number, where the count starts immediately  
after the start bit. For example, the collision in the first bit of the UID would give the value 00 0001 0000 in  
the collision-position registers. The count starts with 0, and the first 16 bits are the command code and the  
NVB byte. Note: the NVB byte is the number of valid bits.  
The receive section also has two timers. The RX-wait-time timer is controlled by the value in the RX wait  
time register (address 08). This timer defines the time after the end of the transmit operation in which the  
receive decoders are not active (held in reset state). This prevents incorrect detections resulting from  
transients following the transmit operation. The value of the RX wait time register defines this time in  
increments of 9.44 μs. This register is preset at every write to ISO control register (address 01) according  
to the minimum tag-response time defined by each standard.  
The RX no-response timer is controlled by the RX no response wait time register (address 07). This timer  
measures the time from the start of slot in the anti-collision sequence until the start of tag response. If  
there is no tag response in the defined time, an interrupt request is sent and a flag is set in IRQ status  
control register. This enables the external controller to be relieved of the task of detecting empty slots. The  
wait time is stored in the register in increments of 37.76 μs. This register is also preset, automatically, for  
every new protocol selection.  
5.2.3 Transmitter  
The transmitter section consists of the 13.56-MHz oscillator, digital protocol processing, and RF output  
stage.  
5.2.3.1 Transmitter Analog  
The 13.56-MHz crystal oscillator (connected to pins 31 and 32) directly generates the RF frequency for the  
RF output stage. Additionally, it also generates the clock signal for the digital section and clock signal  
displayed for the SYS_CLK (pin 27) which can be used by an external MCU system.  
During partial power-down mode (EN = 0, EN2 = 1), the frequency of SYS_CLK is 60 kHz. During normal  
reader operation, SYS_CLK can be programmed by bits B4 and B5 in the modulator and SYS_CLK  
control register (address 09); available clock frequencies are 13.56 MHz, 6.78 MHz, or 3.39 MHz.  
The reference crystal (HC49U) should have the following characteristics:  
Parameter  
Specification  
13.560000 MHz  
Fundamental  
Parallel  
Frequency  
Mode of operation  
Type of resonance  
Frequency tolerance  
Aging  
±20 ppm  
< 5 ppm/year  
40°C to 85°C  
50 , minimum  
Operation temperature range  
Equivalent series resistance  
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NOTE  
The crystal oscillators two external shunt capacitor values are calculated based on the  
crystals specified load capacitance. The external capacitors (connected to the OSC pins 30  
and 31), are calculated as two capacitors in series plus CS (oscillator's gate internal  
input/output capacitance plus PCB stray capacitance). The stray capacitance (CS) can be  
estimated at approximately 5 ±2 pF (typical).  
As an example, given a crystal with a required load capacitance (CL) of 18 pF,  
CL = ((C1 × C2) / (C1 + C2)) + CS  
18 pF = ((27 pF × 27 pF) / (27 pF + 27 pF)) + 4.5 pF  
Hence, from this example, a 27-pF capacitor would be placed on pins 30 and 31 to ensure  
proper crystal oscillator operation.  
The transmit power level is selectable between half power of 100 mW (20 dBm) or full power of 200 mW  
(23 dBm) when configured for 5-V automatic operation. The transmit output impedance is 8 when  
configured for half power and 4 when configured for full power. Selection of the transmit power level is  
set by bit B4 (rf_pwr) in the chip status control register (Table 5-9). When configured for 3-V automatic  
operation, the transmit power level is typically selectable between 33 mW (15 dBm) in half-power mode  
and 70 mW (18 dBm) in full-power mode (Vdd_RF at 3.3 V). Note that lower operating voltages result in  
reduced transmit power levels.  
In normal operation, the transmit modulation is configured by the selected ISO control register (address  
01). External control of the transmit modulation is possible by setting the ISO control register (address 01)  
to direct mode. While in direct mode, the transmit modulation is made possible by selecting the modulation  
type ASK or OOK at pin 12. External control of the modulation type is made possible only if enabled by  
setting B6 = 1 (en_ook_p) in the modulator and SYS_CLK control register (address 09). ASK modulation  
depth is controlled by bits B0, B1 and B2 in the Modulator and SYS_CLK Control register (address 09).  
The range of the ASK modulation is 7%30%, or 100% (OOK).  
The coding of the modulator and SYS_CLK control register is shown in Table 5-19.  
The length of the modulation pulse is defined by the protocol selected in the ISO control register. With a  
high-Q antenna, the modulation pulse is typically prolonged, and the tag detects a longer pulse than  
intended. For such cases, the modulation pulse length can be corrected by using the TX pulse length  
register. If the register contains all zeros, then the pulse length is governed by the protocol selection. If the  
register contains a value other than 00h, the pulse length is equal to the value of the register in 73.7-ns  
increments. This means the range of adjustment can be between 73.7 ns and 18.8 μs.  
5.2.3.2 Transmitter - Digital  
The digital portion of the transmitter is very similar to that of the receiver. Before beginning data  
transmission, the FIFO should be cleared with a Reset command (0F). Data transmission is initiated with a  
selected command (described in the Direct Commands section, Table 5-29). The MCU then commands  
the reader to do a continuous Write command (3Dh, see Table 5-31) starting from register 1Dh. Data  
written into register 1Dh is the TX length byte1 (upper and middle nibbles), while the following byte in  
register 1Eh is the TX length byte2 (lower nibble and broken byte length). The TX byte length determines  
when the reader sends the EOF byte. After the TX length bytes, FIFO data is loaded in register 1Fh with  
byte storage locations 0 to 11. Data transmission begins automatically after the first byte is written into the  
FIFO. The TX length bytes and FIFO can be loaded with a continuous-write command because the  
addresses are sequential.  
If the data length is longer than the allowable size of the FIFO, the external system (MCU) is warned when  
the majority of data from the FIFO has already been transmitted by sending an interrupt request with a  
flag in the IRQ register signaling FIFO low/high status. The external system should respond by loading the  
next data packet into the FIFO.  
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At the end of the transmit operation, the external system is notified by another interrupt request with a flag  
in the IRQ register that signals the end of TX.  
The TX length register also supports incomplete bytes transmitted. The high two nibbles in register 1D and  
the nibble composed of bits B4B7 in register 1E store the number of complete bytes to be transmitted.  
Bit 0 (in register 1E) is a flag that signals the presence of additional bits to be transmitted that do not form  
a complete byte. The number of bits are stored in bits B1B3 of the same register (1E).  
The protocol is selected by the ISO control register (address 01), which also selects the receiver protocol.  
As defined by the selected protocol, the reader automatically adds all the special signals, like start of  
communication, end of communication, SOF, EOF, parity bits, and CRC bytes. The data is then coded to  
the modulation pulse level and sent to the modulation control of the RF output stage. This means that the  
external system is only required to load the FIFO with data, and all the low-level coding is done  
automatically. Also, all registers used in transmission are automatically preset to the optimum value when  
a new selection is entered into the ISO control register.  
Some protocols have options; two registers are provided to select the TX-protocol options. The first such  
register is ISO14443B TX options (address 02). It controls the SOF and EOF selection and EGT (extra  
guard time) selection for the ISO14443B protocol. The bit definitions of this register are given in  
Table 5-12.  
The second register controls the ISO14443 high bit-rate options. This register enables the use of different  
bit rates for RX and TX operations in the ISO14443 high bit-rate protocol. Additionally, it also selects the  
parity system for the ISO14443A high bit-rate selection. The bit definitions of this register are given in  
Table 5-13.  
The transmit section also has a timer that can be used to start the transmit operation at a precise time  
interval from a selected event. This is necessary if the tag requires a reply in an exact window of time  
following the tag response. The TX timer uses two registers (addresses 04 and 05). In first register  
(address 04); two bits (B7 and B6) are used to define the trigger conditions. The remaining 6 bits are the  
upper bits and the 8 bits in register address 05 are lower bits, which are preset to the counter. The  
increment is 590 ns and the range of this counter is from 590 ns to 9.7 ms. The bit definitions (trigger  
conditions) are shown in Table 5-14.  
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5.2.4 Direct Mode  
Direct mode allows the user to configure the reader in one of two ways. Direct mode 0 (bit 6 = 0, as  
defined in ISO control register) allows the user to use only the front-end functions of the reader, bypassing  
the protocol implementation in the reader. For transmit functions, the user has direct access to the  
transmit modulator through the MOD pin (pin 14). On the receive side, the user has direct access to the  
sub-carrier signal (digitized RF envelope signal) on I/O_6 (pin 23).  
Direct mode1 (bit 6 = 1, as defined in ISO control register) uses the sub-carrier signal decoder of the  
selected protocol (as defined in ISO control register). This means that the receive output is not the  
sub-carrier signal but the decoded serial bit stream and bit clock signals. The serial data is available on  
I/O_6 (pin 23) and the bit clock is available on I/O_5 (pin 22). The transmit side is identical; the user has  
direct control over the RF modulation through the MOD input. This mode is provided so that the user can  
implement a protocol that has the same bit coding as one of the protocols implemented in the reader, but  
needs a different framing format.  
To select direct mode, the user must first choose which direct mode to enter by writing B6 in the ISO  
control register. This bit determines if the receive output is the direct sub-carrier signal (B6 = 0) or the  
serial data of the selected decoder. If B6 = 1, then the user must also define which protocol should be  
used for bit decoding by writing the appropriate setting in the ISO control register.  
The reader actually enters the direct mode when B6 (direct) is set to 1 in the chip status control register.  
Direct mode starts immediately. The write command should not be terminated with a stop condition (see  
communication protocol), because the stop condition terminates the direct mode and clears B6. This is  
necessary as the direct mode uses one or two I/O pins (I/O_6, I/O_5). Normal parallel communication is  
not possible in direct mode. Sending a stop condition terminates direct mode.  
Figure 5-4 shows the different configurations available in direct mode.  
In mode 0, the reader is used as an AFE only, and protocol handling is bypassed.  
In mode 1, framing is not done, but SOF and EOF are present. This allows for a user-selectable  
framing level based on an existing ISO standard.  
In mode 2, data is ISO-standard formatted. SOF, EOF, and error checking are removed, so the  
microprocessor receives only bytes of raw data via a 12-byte FIFO.  
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Analog Front End (AFE)  
ISO Encoder/Decoders  
Mode 0:  
Raw, Sub-Carrier Data  
Tag-it  
14443A 14443B  
15693  
Mode 1:  
Un-Framed Raw ISO  
Formatted Data  
Packetization/Framing  
Mode 2: Full ISO With Framing and Error Checking (Typical Mode)  
Figure 5-4. User-Configurable Modes  
5.2.5 Register Preset  
After power-up and the EN pin low-to-high transition, the reader is in the default mode. The default  
configuration is ISO15693, single sub-carrier, high data rate, 1-out-of-4 operation. The low-level option  
registers (020B) are automatically set to adapt the circuitry optimally to the appropriate protocol  
parameters.  
When entering another protocol (writing to the ISO control register 01), the low-level option registers  
(020B) are automatically configured to the new protocol parameters.  
After selecting the protocol, it is possible to change some low-level register contents if needed. However,  
changing to another protocol and then back, reloads the default settings, and the user must reload the  
custom settings.  
The Clo1 and Clo0 (register 09) bits, which define the microcontroller frequency available on the  
SYS_CLK pin, are the only two bits in the configuration registers that are not cleared during protocol  
selection.  
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5.3 Register Descriptions  
Table 5-8. Register Address Space  
Adr (hex)  
Register  
Read/Write  
Main Control Registers  
00  
Chip status control  
ISO control  
R/W  
R/W  
01  
Protocol Sub-Setting Registers  
02  
ISO14443B TX options  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
NA  
03  
ISO 14443A high bit rate options  
TX timer setting, H-byte  
TX timer setting, L-byte  
TX pulse-length control  
RX no response wait  
RX wait time  
04  
05  
06  
07  
08  
09  
Modulator and SYS_CLK control  
RX special setting  
Regulator and I/O control  
Unused  
0A  
0B  
16  
17  
Unused  
NA  
18  
Unused  
NA  
19  
Unused  
NA  
Status Registers  
0C  
IRQ status  
R
0D  
Collision position and interrupt mask register  
Collision position  
R/W  
R
0E  
0F  
RSSI levels and oscillator status  
R
FIFO Registers  
1C  
1D  
1E  
1F  
FIFO status  
R
TX length byte1  
TX length byte2  
FIFO I/O register  
R/W  
R/W  
R/W  
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5.3.1 Control Registers Main Configuration Registers  
Table 5-9. Chip Status Control (00h)  
Controls the power mode, RF on / off, AGC, AM / PM  
Register default is 0x01. It is preset at EN = L or POR = H  
Bit  
Bit Name Function  
Comments  
B7  
stby  
1 = standby mode  
0 = active mode  
Standby mode keeps regulators and oscillator running en_rec =  
L, en_tx = L  
B6  
direct  
1 = received sub-carrier signal (decoders  
bypassed)  
The modulation control is direct through MOD input. The receiver  
sub-carrier signal is on I/0_6.  
0 = received decoded signal from selected  
decoder  
B5  
B4  
B3  
B2  
B1  
B0  
rf_on  
1 = RF output active  
0 = RF output not active  
When B5 = 1, it activates the RF field.  
rf_pwr  
pm_on  
agc_on  
rec_on  
vrs5_3  
1 = half output power  
0 = full output power  
1 = RF driver at 8 Ω  
0 = RF driver at 4 Ω  
1 = RX_IN2  
0 = RX_IN1  
1 = Selects PM signal input  
0 = Selects AM signal input  
1 = AGC on  
0 = AGC off  
AGC selection  
1 = Reciever enable for external field  
measurement  
Receiver and oscillator are enabled; intended for external field  
measurement.  
1 = 5 V operation (VIN  
0 = 3 V operation (VIN  
)
)
Selects the VDD_RF range; 5 V (4.3 V 5 V), or 3 V (2.7 V 3.4  
V)  
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Table 5-10. ISO Control (01h)  
Controls the ISO selection  
Register default is 0x02, which is ISO15693 high bit rate, one sub-carrier, 1 out of 4. It is preset at EN = L or POR = H.  
Bit  
Bit Name Function  
Comments  
B7  
rx_crc_n  
Receiving without CRC  
1 = no RX CRC  
0 = RX CRC  
B6  
dir_mode  
Direct mode type  
RFID mode  
0 = output is sub-carrier data.  
1 = output is bit stream (I/O_6) and bit clock (I/O_5) from decoder selected by ISO bits  
B5  
B4  
B3  
B2  
B1  
B0  
rfid  
Should always be set to 0  
iso_4  
iso_3  
iso_2  
iso_1  
iso_0  
RFID mode  
See Table 5-11  
Table 5-11. RFID Mode Selections  
Iso_4 Iso_3 Iso_2  
Iso_1 Iso_0 Protocol  
Remarks  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
ISO15693 low bit rate  
ISO15693 low bit rate  
ISO15693 high bit rate  
ISO15693 high bit rate  
ISO15693 low bit rate  
ISO15693 low bit rate  
ISO15693 high bit rate  
ISO15693 high bit rate  
ISO14443A bit rate  
6.62 kbps  
6.62 kbps  
one sub-carrier  
one sub-carrier  
1 out of 4  
1 out of 256  
1 out of 4  
26.48 kbps one sub-carrier  
26.48 kbps one sub-carrier  
Default for reader  
1 out of 256  
6.67 kbps  
6.67 kbps  
double sub-carrier 1 out of 4  
double sub-carrier 1 out of 256  
26.69 kbps double sub-carrier 1 out of 4  
26.69 kbps double sub-carrier 1 out of 256  
106 kbps  
RX bit rate when  
TX bit rate is  
different than RX  
(reg03)  
ISO14443A high bit rate 212 kbps  
ISO14443A high bit rate 424 kbps  
ISO14443A high bit rate 848 kbps  
ISO14443B bit rate  
106 kbps  
RX bit rate when  
TX bit rate is  
different than RX  
(reg03)  
ISO14443B high bit rate 212 kbps  
ISO14443B high bit rate 424 kbps  
ISO14443B high bit rate 848 kbps  
Tag-it  
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5.3.2 Control Registers Sub Level Configuration Registers  
Table 5-12. ISO14443B TX Options (02h)  
Selects the ISO subsets for ISO14443B TX  
Register default is set to 0x00 at POR = H or EN = L  
Bit  
B7  
B6  
B5  
B4  
Bit Name  
egt2  
Function  
Comments  
TX EGT time select MSB  
TX EGT time select  
TX EGT time select LSB  
Three bit code defines the number of etu (0-7) which  
separate two characters. ISO14443B TX only  
egt1  
egt0  
eof_l0  
1 = EOF,  
0 = EOF,  
1 = SOF,  
0 = SOF,  
1 = SOF,  
0 = SOF,  
0 length 11 etu  
0 length 10 etu  
1 length 03 etu  
1 length 02 etu  
0 length 11 etu  
0 length 10 etu  
ISO14443B TX only  
B3  
B2  
B1  
B0  
sof_l1  
sof _l0  
l_egt  
1 = EGT after each byte  
0 = EGT after last byte is omitted  
Unused  
Table 5-13. ISO 14443A High-Bit-Rate Options (03h)  
Parity  
Register default is set to 0x00 at POR = H, or EN = L and at each write to ISO control register  
Bit  
B7  
B6  
B5  
Bit Name  
dif_tx_br  
tx_br1  
Function  
Comments  
TX bit rate different than RX bit rate enable  
TX bit rate  
Valid for ISO14443A/B high bit rate  
tx_br1 = 0, tx_br = 0  
tx_br1 = 0, tx_br = 1  
tx_br1 = 1, tx_br = 0  
tx_br1 = 1, tx_br = 1  
106 kbps  
212 kbps  
424 kbps  
848 kbps  
tx_br0  
B4  
B3  
B2  
B1  
B0  
parity-2tx  
parity-2rx  
Unused  
Unused  
Unused  
1 = parity odd except last byte which is even for TX  
1 = parity odd except last byte which is even for RX  
For 14443A high bit rate, coding and decoding  
Table 5-14. TX Timer H-Byte (04h)  
Register default is set to 0xC2 at POR = H or EN = L and at each write to ISO control register  
Bit  
B7  
B6  
Bit Name  
Tm_st1  
Function  
Comments  
Timer start condition  
Timer start condition  
tm_st1 = 0, tm_st0 = 0  
tm_st1 = 0, tm_st0 = 1  
tm_st1 = 1, tm_st0 = 0  
tm_st1 = 1, tm_st0 = 1  
beginning of TX SOF  
end of TX SOF  
beginning of RX SOF  
end of RX SOF  
Tm_st0  
B5  
B4  
B3  
B2  
B1  
B0  
Tm_lengthD  
Tm_lengthC  
Tm_lengthB  
Tm_lengthA  
Tm_length9  
Tm_length8  
Timer length MSB  
Timer length  
Timer length  
Timer length  
Timer length  
Timer length LSB  
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Table 5-15. TX Timer L-Byte (05h)  
Register default is set to 0x00 at POR = H or EN = L and at each write to ISO control register  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
Function  
Comments  
Tm_length7  
Tm_length6  
Tm_length5  
Tm_length4  
Tm_length3  
Tm_length2  
Tm_length1  
Tm_length0  
Timer length MSB  
Timer length  
Timer length  
Timer length  
Timer length  
Timer length  
Timer length  
Timer length LSB  
Defines the time when delayed transmission is started.  
RX wait range is 590 ns to 9.76 ms (1..16383)  
Step size 590 ns  
All bits low (00): Timer is disabled.  
Preset: 00 all other protocols  
Table 5-16. TX Pulse Length Control (06h)  
Controls the length of TX pulse  
Register default is set to 0x00 at POR = H or EN = L and at each write to ISO control register.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
Pul_p2  
Pul_p1  
Pul_p0  
Pul_c4  
Pul_c3  
Pul_c2  
Pul_c1  
Pul_c0  
Function  
Comments  
Pulse length MSB  
The pulse range is 73.7 ns to 18.8 μs (1255), step size 73.7 ns  
All bits low (00): pulse length control is disabled  
Preset: 9.44 μs ISO15693  
Preset: 11 μs Tag-It  
Preset: 2.36 μs ISO14443A  
Preset: 1.4 μs ISO14443A at 212 kbps  
Preset: 737 ns ISO14443A at 424 kbps  
Preset: 442 ns ISO14443A at 848 kbps): pulse length control is disabled  
Pulse length LSB  
Table 5-17. RX No Response Wait Time (07h)  
Defines the time when no response Interrupt is sent  
Default: default is set to 0x0E at POR = H or EN = L and at each write to ISO control register.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
NoResp7  
NoResp6  
NoResp5  
NoResp4  
NoResp3  
NoResp2  
NoResp1  
NoResp0  
Function  
Comments  
No response MSB  
Defines the time when no response interrupt is sent It starts from the end of TX EOF.  
RX no response wait range is 37.76 μs to 962 8μs (1...255),  
Step size 37.76 μs  
Preset: 755 μs ISO15693  
Preset: 1812 μs ISO15693 low data rate  
Preset: 604 μs Tag-It  
Preset: 529 μs all other protocols  
No response LSB  
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Table 5-18. RX Wait Time (08h)  
Defines the time after TX EOF when the RX input is disregarded  
Register default is set to 0x1F at POR = H or EN = L and at each write to ISO control register.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
Bit Name  
Rxw7  
Rxw6  
Rxw5  
Rxw4  
Rxw3  
Rxw2  
Rxw1  
Function  
Comments  
RX wait  
Defines the time during which the RX input is ignored.  
It starts from the end of TX EOF.  
RX wait range is 9.44 μs to 2407 μs (1...255),  
Step size 9.44 μs  
Preset: 293 μs ISO15693  
Preset: 66 μs ISO14443A and B  
Preset: 180 μs Tag-It  
Table 5-19. Modulator and SYS_CLK Control (09h)  
Controls the modulation depth, modulation input and ASK / OOK control  
Register default is set to 0x11 at POR = H or EN = L, and at each write to ISO control register, except Clo1 and Clo0.  
Bit  
B7  
B6  
Bit Name Function  
Comments  
Unused  
en_ook_p 1 = enables external selection of ASK or OOK Valid only when ISO control register (01) is configured to direct mode  
modulation  
B5  
B4  
Clo1  
Clo0  
SYS_CLK output frequency MSB  
SYS_CLK output frequency LSB  
Clo1  
Clo0  
CL_SYS Output state  
0
0
1
1
0
1
0
1
disabled  
3.3 MHz  
6.78 MHz  
13.56 MHz  
B3  
en_ana  
1 = Enables analog output on ASK/OOK pin  
(pin12)  
For test and measurement  
B2  
B1  
B0  
Pm2  
Pm1  
Pm0  
Modulation depth MSB  
Modulation depth  
Pm2  
Pm1  
Pm0  
Mod Type and %  
ASK 10%  
OOK (100%)  
ASK 7%  
ASK 8.5%  
ASK 13%  
ASK 16%  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Modulation depth LSB  
ASK 22%  
ASK 30%  
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Table 5-20. RX Special Setting Register (Address 0Ah)  
Sets the gains and filters directly  
Register default is set to 0x40 at POR = H or EN = L, and at each write to the ISO control register.  
Bit  
B7  
B6  
B5  
B4  
Bit Name  
C212  
C424  
M848  
hbt  
Function  
Comments  
Bandpass 110 kHz to 570 kHz  
Bandpass 200 kHz to 900 kHz  
Bandpass 450 kHz to 1.5 MHz  
Appropriate for 212-kHz sub-carrier system  
Appropriate for 424-kHz sub-carrier used in ISO15693 and Tag-It  
Appropriate for Manchester-coded 848-kHz sub-carrier used in ISO14443A  
Appropriate for highest bit rate (848 kbps) used in high-bit-rate ISO14443  
Bandpass 100 kHz to 1.5 MHz  
Gain reduced for 7 dB  
B3  
B2  
gd1  
gd2  
01 gain reduction for 5 dB  
10 gain reduction for 10 dB  
11 gain reduction for 15 dB  
Sets the RX gain reduction  
B1  
B0  
agcr  
AGC activation level change  
AGC activation level changed from 5 times the digitizing level to 3 times the  
digitizing level.  
no-lim  
AGC action is not limited in time  
AGC action can be done any time during receive process. It is not limited to the  
start of receive.  
Table 5-21. Regulator and I/O Control (0Bh)  
Control the three voltage regulators  
Register default is set to 0x87 at POR = H or EN = L  
Bit  
Bit Name  
Function  
Comments  
B7  
auto_reg  
0 = setting regulator by option bits Auto system sets VDD_RF to VIN 250 mV and VDD_A and VDD_X to VIN –  
(vrs3_5 and vrs2, vrs1 and vrs0)  
1 = automatic setting  
250 mV, but not higher than 3.4 V.  
B6  
B5  
en_ext_pa  
io_low  
Support for external power  
amplifier  
Receiver inputs accept externally demodulated sub-carrier, OOK pin becomes  
modulation output for external amplifier.  
1 = enable low peripheral  
communication voltage  
When HIGH, it decreases output resistance of logic outputs. Should be set  
HIGH when VDD_I/O voltage is below 2.7 V.  
B4  
B3  
B2  
B1  
B0  
Unused  
Unused  
vrs2  
Default is LOW.  
Default is LOW.  
Voltage set MSB  
Voltage set LSB  
vrs3_5 = L: VDD_RF, VDD_A, VDD_X range 2.7 V to 3.4 V  
vrs1  
vrs0  
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5.3.3 Status Registers  
Table 5-22. IRQ Status Register (0Ch)  
Displays the cause of IRQ and TX/RX status  
Register default is set to 0x00 at POR = H or EN = L, and at each write to the ISO control register. It is also automatically reset at the end  
of a read phase. The reset also removes the IRQ flag.  
Bit  
Bit Name  
Function  
Comments  
B7  
Irq_tx  
IRQ set due to end of TX  
Signals that TX is in progress. The flag is set at the start of TX but the  
interrupt request is sent when TX is finished.  
B6  
B5  
Irg_srx  
Irq_fifo  
IRQ set due to RX start  
Signals that RX SOF was received and RX is in progress. The flag is set at  
the start of RX but the interrupt request is sent when RX is finished.  
Signals the FIFO is 1/3 > FIFO >  
Signals FIFO high or low (less than 4 or more than 8)  
2/3  
B4  
B3  
B2  
B1  
B0  
Irq_err1  
Irq_err2  
Irq_err3  
Irq_col  
CRC error  
Indicates receive CRC error  
Parity error  
Indicates parity error  
Byte framing or EOF error  
Collision error  
Indicates framing error  
For ISO14443A and ISO15693 single sub-carrier  
Signal to MCU that next slot command can be sent  
Irq_noresp  
No-response interrupt  
Table 5-23. Collision Position and Interrupt Mask Register (0Dh)  
Register default is set to 3E at POR = H and EN = L. Collision bits reset automatically after read operation.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
Bit Name  
Col9  
Function  
Comments  
Bit position of collision MSB  
Bit position of collision  
Interrupt enable for FIFO  
Interrupt enable for CRC  
Interrupt enable for Parity  
Supported: ISO15693, single sub-carrier, and ISO14443A  
Col8  
En_irq_fifo  
En_irq_err1  
En_irq_err2  
En_irq_err3  
Interrupt enable for Framing  
error or EOF  
B1  
B0  
En_irq_col  
Interrupt enable for collision  
error  
En_irq_noresp  
Enables no-response interrupt  
Table 5-24. Collision Position (0Eh)  
Displays the bit position of collision or error  
Register default is set to 0x00 at POR = H and EN = L. Automatically reset after read operation.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
Col7  
Function  
Comments  
Bit position of collision MSB  
Supported is ISO15693, single sub-carrier, and ISO14443A  
Col6  
In other protocols, it shows the bit position of error, either frame, SOF-EOF,  
parity, or CRC error.  
Col5  
Col4  
Col3  
Col2  
Col1  
Col0  
Bit position of collision LSB  
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Table 5-25. RSSI Levels and Oscillator Status Register (0Fh)  
Displays the signal strength on both reception channels and RF amplitude during RF-off state  
The RSSI values are valid from reception start till start of next transmission.  
Bit  
B7  
B6  
B5  
Bit Name  
Unused  
Oscok  
Function  
Comments  
Crystal oscillator stable indicator  
rssi_x2  
RSSI value of auxiliary channel (4 dB Auxiliary channel is by default PM. It can be set to AM with B3 of chip state  
per step) MSB  
control register (00).  
B4  
B3  
rssi_x1  
rssi_x0  
RSSI value of auxiliary channel (4 dB  
per step) LSB  
B2  
rssi_2  
RSSI value of active channel (4 dB  
per step) MSB  
Active channel is default AM and can be set to PM with option bit B3 of chip  
state control register (00).  
B1  
B0  
rssi_1  
rssi_0  
RSSI value of active channel (4 dB  
per step) LSB  
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5.3.4 FIFO Control Registers  
Table 5-26. FIFO Status (1Ch)  
Low nibbles of complete bytes to be transferred through FIFO; Information about a broken byte and number of bits to be transferred from it  
Bit  
B7  
B6  
B5  
B4  
B3  
Bit Name  
RFU  
Function  
Comments  
Set to LOW  
Reserved for future use (RFU)  
Fhil  
FIFO level HIGH  
FIFO level LOW  
FIFO overflow error  
FIFO bytes fb[3]  
Indicates that 9 bytes are already in the FIFO (for RX)  
Indicates that only 3 bytes are in the FIFO (for TX)  
Too much data was written to the FIFO  
Flol  
Fove  
Fb3  
Bits B0:B3 indicate how many bytes that are loaded in FIFO were not read  
out yet (displays N 1 number of bytes). If 8 bytes are in the FIFO, this  
number is 7.  
B2  
B1  
B0  
Fb2  
Fb1  
Fb0  
FIFO bytes fb[2]  
FIFO bytes fb[1]  
FIFO bytes fb[0]  
Table 5-27. TX Length Byte1 (1Dh)  
High 2 nibbles of complete bytes to be transferred through FIFO  
Register default is set to 0x00 at POR and EN=0. It is also automatically reset at TX EOF  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
Txl11  
Txl10  
Txl9  
Function  
Comments  
Number of complete byte bn[11]  
Number of complete byte bn[10]  
Number of complete byte bn[9]  
Number of complete byte bn[8]  
Number of complete byte bn[7]  
Number of complete byte bn[6]  
Number of complete byte bn[5]  
Number of complete byte bn[4]  
High nibble of complete bytes to be transmitted  
Txl8  
Txl7  
Middle nibble of complete bytes to be transmitted  
Txl6  
Txl5  
Txl4  
Table 5-28. TX Length Byte2 (1Eh)  
Low nibbles of complete bytes to be transferred through FIFO; Information about a broken byte and number of bits to be transferred from it  
Register default is set to 0x00 at POR and EN=0. It is also automatically reset at TX EOF  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit Name  
Txl3  
Function  
Comments  
Number of complete byte bn[3]  
Number of complete byte bn[2]  
Number of complete byte bn[1]  
Number of complete byte bn[0]  
Broken byte number of bits bb[2]  
Broken byte number of bits bb[1]  
Broken byte number of bits bb[0]  
Broken byte flag  
Low nibble of complete bytes to be transmitted  
Txl2  
Txl1  
Txl0  
Bb2  
Number of bits in the last broken byte to be transmitted.  
It is taken into account only when broken byte flag is set.  
Bb1  
Bb0  
Bbf  
If 1, indicates that last byte is not complete 8 bits wide.  
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5.4 Direct Commands From MCU to Reader  
5.4.1 Command Codes  
www.ti.com  
Table 5-29. Command Codes  
Command Code (hex)  
Command  
Comments  
00  
03  
0F  
10  
11  
12  
13  
14  
16  
17  
18  
19  
1A  
Idle  
Software Initialization  
Software initialization, same as power on reset  
Reset  
Transmission without CRC  
Transmission with CRC  
Delayed transmission without CRC  
Delayed transmission with CRC  
Transmit next time slot  
ISO15693, Tag-It  
Block receiver  
Enable receiver  
Test internal RF (RSSI at RX input with TX ON)  
Test external RF (RSSI at RX input with TX OFF)  
Receiver gain adjust  
Note: The command code values from Table 5-29 are substituted in Table 5-32, bit 0 through bit 4. Also,  
the most-significant bit (MSB) in Table 5-31 must be set to 1.  
5.4.2 Reset  
The reset command clears the FIFO contents and FIFO status register (1Ch). It also clears the register  
storing the collision error location (0Eh).  
5.4.3 Transmission With CRC  
The transmission command must be sent first, followed by transmission length bytes, and FIFO data. The  
reader starts transmitting after the first byte is loaded into the FIFO. The CRC byte is included in the  
transmitted sequence.  
5.4.4 Transmission Without CRC  
Same as Section 5.4.3 with CRC excluded.  
5.4.5 Delayed Transmission With CRC  
The transmission command must be sent first, followed by the transmission length bytes, and FIFO data.  
The reader transmission is triggered by the TX timer.  
5.4.6 Delayed Transmission Without CRC  
Same as above with CRC excluded.  
5.4.7 Transmission Next Slot  
When this command is received, the reader transmits the next slot command. The next slot sign is defined  
by the protocol selection.  
5.4.8 Receiver Gain Adjust  
This command should be executed when the MCU determines that no TAG response is coming and when  
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the RF and receivers are switched ON. When this command is received, the reader observes the digitized  
receiver output. If more than two edges are observed in 100 μs, the window comparator voltage is  
increased. The procedure is repeated until the number of edges (changes of logical state) of the digitized  
reception signal is less than 2 (in 100 μs). The command can reduce the input sensitivity in 5-dB  
increments up to 15 dB. This command ensures better operation in a noisy environment.  
The gain setting is reset to maximum gain at EN = 0, POR = 1.  
5.4.9 Test External RF (RSSI at RX input with TX OFF)  
This command can be used in active mode when the RF receiver is switched ON, and the RF output is  
switched OFF (bit B1=1 in the chip status register, rec-on. See Table 5-9). The level of the RF signal  
received on the antenna is measured and displayed in the RSSI levels register. The relation between the  
3-bit code and the external RF field strength [A/m] must be determined by calculation or by experiments  
for each antenna design. The antenna Q and connection to the RF input influence the result. The nominal  
relation between the RF peak-to-peak voltage at the receiver inputs and its corresponding RSSI level is  
presented as follows.  
Receiver Input [mVPP  
]
40  
60  
80  
100  
140  
180  
300  
RSSI level  
1
2
3
4
5
6
7
If the direct command test RF internal or test RF external is used immediately after activation, it should be  
preceded with a command enable RX to activate the RX section. For proper execution of the test RF  
commands, the RX section must be enabled. This happens automatically when a data exchange between  
the reader and the tag is done, or by sending a direct command enable RX.  
5.4.10 Test Internal RF (RSSI at RX input with TX ON)  
This command measures the level of the RF carrier at the receive inputs. Its operating range is between  
300 mVp and 2.1 Vp with a step size of 300 mV. The two values are displayed in the RSSI levels register.  
The command is intended for diagnostic purposes to set the correct RX_IN levels. The optimum RX_IN  
input level is approximately 1.6 Vp, or an RSSI level of 5 or 6. The nominal relationship between the input  
RF peak level and the RSSI code is presented as follows.  
Receiver Input [mVPp  
]
300  
600  
900  
1200  
1500  
1800  
2100  
RSSI Level  
1
2
3
4
5
6
7
5.4.11 Block Receiver  
The block receiver command puts the digital part of receiver (bit decoder and framer) in reset mode. This  
is useful in an extremely noisy environment, where the noise level could otherwise cause a constant  
switching of the sub-carrier input of the digital part of the receiver. The receiver (if not in reset) would try to  
catch a SOF signal, and if the noise pattern matched the SOF pattern, an interrupt would be generated,  
falsely signaling the start of an RX operation. A constant flow of interrupt requests can be a problem for  
the external system (MCU), so the external system can stop this by putting the receive decoders in reset  
mode. The reset mode can be terminated in two ways. The external system can send the enable receiver  
command. The reset mode is also automatically terminated at the end of a TX operation. The receiver can  
stay in reset after end of TX if the RX wait time register (address 08) is set. In this case, the receiver is  
enabled at the end of the wait time following the transmit operation.  
5.4.12 Enable Receiver  
This command clears the reset mode in the digital part of the receiver if the reset mode was entered by  
the block receiver command.  
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5.5 Reader Communication Interface  
5.5.1 Introduction  
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The communication interface to the reader can be configured in two ways: a parallel 8-pin interface and a  
Data_Clk or a serial peripheral interface (SPI).  
These modes are mutually exclusive; only one mode can be used at a time in the application.  
When the SPI interface is selected, the unused I/O_2, I/O_1, and I/O_0 pins must be hard-wired according  
to Table 5-30. At power up, the reader samples the status of these three pins. If they are not the same (all  
High or all Low) it enters one of the possible SPI modes.  
The reader always behaves as the slave while the microcontroller (MCU) behaves as the master device.  
The MCU initiates all communications with the reader and is also used to communicate with the higher  
levels (application layer). The reader has an IRQ pin to prompt the MCU for attention if the reader detects  
a response from the proximity/vicinity integrated circuit card (PICC/VICC).  
Communication is initialized by  
a start condition, which is expected to be followed by an  
Address/Command word (Adr/Cmd). The Adr/Cmd word is 8 bits long, and its format is shown in  
Table 5-31.  
Table 5-30. Pin Assignment in Parallel and Serial Interface Connection or Direct Mode  
Pin  
Parallel  
Parallel-Direct  
SPI with SS  
SPI without SS  
DATA_ DATA_CLK  
CLK  
DATA_CLK  
DATA_CLK from master  
DATA_CLK from master  
I/O_7  
A/D[7]  
MOSI(1) = data-in (reader-in)  
MOSI(1) = data-in  
(reader-in)  
I/O_6  
A/D[6]  
Direct mode, data out (sub-carrier or bit stream) MISO(2) = data-out (MCU-out)  
MISO(2) = data-out  
(MCU-out)  
I/O_5(3) A/D[5]  
Direct mode, strobe bit clock out  
See Note 3  
SS slave select(4)  
See Note 3  
I/O_4  
I/O_3  
I/O_2  
I/O_1  
I/O_0  
IRQ  
A/D[4]  
A/D[3]  
A/D[2]  
at VDD  
at VDD  
at VSS  
at VSS  
IRQ interrupt  
A/D[1]  
at VDD  
A/D[0]  
at VSS  
IRQ interrupt  
IRQ interrupt  
IRQ interrupt  
(1) MOSI master out, slave in  
(2) MISO master in, slave out  
(3) IO_5 pin is used only for information when data is put out of the chip (for example, reading 1 byte from the chip). It is necessary first to  
write in the address of the register (8 clocks) and then to generate another 8 clocks for reading out the data. The IO_5 pin goes high in  
this second 8 clocks. But for normal SPI operation this pin IO_5 is not used.  
(4) Slave-select pin active-low  
Table 5-31. Address/Command Word Bit Distribution  
Bit  
Description  
Bit Function  
Address  
0
Command  
1
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Command control bit  
Read/Write  
0 = address, 1 = command  
1 = read, 0 = write  
1 = Cont. mode  
R/W  
0
Continuous address mode  
Address/Command bit 4  
Address/Command bit 3  
Address/Command bit 2  
Address/Command bit 1  
Address/Command bit 0  
R/W  
0
Adr 4  
Adr 3  
Adr 2  
Adr 1  
Adr 0  
Cmd 4  
Cmd 3  
Cmd 2  
Cmd 1  
Cmd 0  
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The MSB (bit 7) determines if the word is to be used as a command or as an address. The last two  
columns of Table 5-31 show the function of the separate bits if either address or command is written. Data  
is expected once the address word is sent. In continuous-address mode (Cont. mode = 1), the first data  
that follows the address is written (or read) to (from) the given address. For each additional data, the  
address is incremented by one. Continuous mode can be used to write to a block of control registers in a  
single stream without changing the address; for example, setup of the predefined standard control  
registers from the MCUs non-volatile memory to the reader. In non-continuous address mode (simple  
addressed mode), only one data word is expected after the address.  
Address mode is used to write or read the configuration registers or the FIFO. When writing more than 12  
bytes to the FIFO, the continuous address mode should be set to 1.  
The command mode is used to enter a command resulting in reader action (initialize transmission, enable  
reader, and turn reader On/Off...)  
An example of expected communication between MCU and reader is shown below.  
Continuous address mode  
Start Adr x  
Data(x)  
Data(x+1)  
Data(x+2)  
Data(x+3)  
Data(x+4)  
...  
Data(x+n)  
Data(z)  
StopCont  
StopSgl  
Non-continuous address mode (single address mode)  
Start  
Adr x  
Data(x)  
Adr y  
Data(y)  
...  
Adr z  
Command mode  
Start  
Cmd x  
(Optional data or command)  
Stop  
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5.6 Parallel Interface Communication  
In parallel mode, the start condition is generated on the rising edge of the I/O_7 pin while the CLK is high.  
This is used to reset the interface logic. Figure 5-5 shows the sequence of the data, with an 8-bit address  
word first, followed by data.  
Communication is ended by:  
the StopSmpl condition, where the falling edge on the I/O_7 pin is expected while CLK is high  
the StopCont condition, where the I/O_7 pin must have a successive rising and falling edge while CLK  
is low in order to reset the parallel interface and be ready for the new communication sequence  
The StopSmpl condition is also used to terminate the direct mode.  
Start  
Condition  
StopSmpl  
Condition  
CLK  
50 ns  
a1 [7]  
d1 [7]  
a2 [7]  
d2 [7]  
aN [7]  
dN [7]  
I/O_ [7]  
a1 [6:0] d1 [6:0] a2 [6:0] d2 [6:0]  
aN [6:0] dN [6:0]  
I/O_[6:0]  
Figure 5-5. Parallel Interface Communication With Simple Stop Condition StopSmpl  
Start  
Condition  
StopCont  
Continuous Mode  
CLK  
I/O_[7]  
50 ns  
a0 [7]  
d0 [7]  
d1 [7]  
d2 [7]  
d3 [7]  
dN [7]  
I/O_[6:0]  
xx  
a0 [6:0] d0 [6:0] d1 [6:0] d2 [6:0] d3 [6:0]  
dN [6:0]  
xx  
Figure 5-6. Parallel Interface Communication With Continuous Stop Condition StopCont  
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5.6.1 Receive  
At the start of a receive operation (when SOF is successfully detected), B6 is set in the IRQ status  
register. An interrupt request is sent to the MCU at the end of the receive operation if the receive data  
string was shorter than or equal to 8 bytes. The MCU receives the interrupt request, then checks to  
determine the reason for the interrupt by reading the IRQ status register (address 0Ch), after which the  
MCU reads the data from the FIFO.  
If the received packet is longer than 8 bytes, the interrupt is sent before the end of the receive operation  
when the ninth byte is loaded into the FIFO (75% full). The MCU should again read the content of the IRQ  
status register to determine the cause of the interrupt request. If the FIFO is 75% full (as marked with flag  
B5 in IRQ status register and by reading the FIFO status register), the MCU should respond by reading  
the data from FIFO to make room for new incoming receive data. When the receive operation is finished,  
the interrupt is sent and the MCU must check how many words are still present in the FIFO before it  
finishes reading.  
If the reader detects a receive error, the corresponding error flag is set (framing error, CRC error) in the  
IRQ status register, which indicates that the MCU reception was completed incorrectly.  
5.6.2 Transmit  
Before beginning data transmission, the FIFO should be cleared with a reset command (0F). Data  
transmission is initiated with a selected command (described in the Direct Commands section,  
Table 5-29). The MCU then commands the reader to do a continuous write command (3Dh, see  
Table 5-31) starting from register 1Dh. Data written into register 1Dh is the TX length byte1 (upper and  
middle nibbles), while the following byte in register 1Eh is the TX length byte 2 (lower nibble and broken  
byte length). Note that the TX byte length determines when the reader sends the EOF byte. After the TX  
length bytes are written, FIFO data is loaded in register 1Fh with byte storage locations 0 to 11. Data  
transmission begins automatically after the first byte is written into the FIFO. The loading of TX length  
bytes and the FIFO can be done with a continuous-write command, as the addresses are sequential.  
At the start of transmission, the flag B7 (Irq_tx) is set in the IRQ status register. If the transmit data is  
shorter than or equal to 4 bytes, the interrupt is sent only at the end of the transmit operation. If the  
number of bytes to be transmitted is higher or equal to 5, then the interrupt is generated. This occurs also  
when the number of bytes in the FIFO reaches 3. The MCU should check the IRQ status register and  
FIFO status register and then load additional data to the FIFO, if needed. At the end of the transmit  
operation, an interrupt is sent to inform the MCU that the task is complete.  
Start  
Condition  
StopCont  
CLK  
I/O_[7]  
50 ns  
a0 [7]  
d3 [7]  
d1 [7]  
dN [7]  
d0 [7]  
d2 [7]  
I/O_[6:0]  
xx  
xx  
d0 [6:0] d1 [6:0]  
dN [6:0]  
a0 [6:0]  
d2 [6:0] d3 [6:0]  
Internal OE  
Output Data  
Valid Ouput Data  
Figure 5-7. Data Output Only When CLK Is High  
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5.7 Serial Interface Communication  
When an SPI interface is required, parallel I/O pins, I/O_2, I/O_1, and I/O_0, must be hard wired  
according to Table 5-31. On power up, the reader looks for the status of these pins; if they are not the  
same (not all high, or not all low), the reader enters into one of two possible SPI modes.  
The serial communications work in the same manner as the parallel communications with respect to the  
FIFO, except for the following condition. On receiving an IRQ from the reader, the MCU reads the reader's  
IRQ register to determine how to service the reader. After this, the MCU must to do a dummy read to clear  
the reader's IRQ status register. The dummy read is required in SPI mode because the reader's IRQ  
status register needs an additional clock cycle to clear the register. This is not required in parallel mode  
because the additional clock cycle is included in the Stop condition.  
A procedure for a dummy read is as follows:  
A. Starting the dummy read:  
(a) When using slave select (SS): set SS bit low.  
(b) When not using SS: start condition is when SCLK is high (See Table 5-30).  
B. Send address word to IRQ status register (0Ch) with read and continuous address mode bits set to 1  
(See Table 5-31).  
C. Read 1 byte (8 bits) from IRQ status register (0Ch).  
D. Dummy-read 1 byte from register 0Dh (collision position and interrupt mask).  
E. Stopping the dummy read:  
(a) When using slave select (SS): set SS bit high.  
(b) When not using SS: stop condition when SCLK is high (See Table 5-30).  
5.7.1 SPI Interface Without SS* (Slave Select) Pin  
The serial interface without the slave select pin must use delimiters for the start and stop conditions.  
Between these delimiters, the address, data, and command words can be transferred. All words must be 8  
bits long with MSB transmitted first.  
Start  
Condition  
Stop  
Condition  
SCLK  
50 ns  
b7  
b6  
b5  
b4  
b3  
b2  
b1  
b0  
Data IN  
Data Out  
Figure 5-8. Serial SPI Interface Communication (No SS* Pin)  
In this mode, a rising edge on data-in (I/O_7, pin 24) while SCLK is high resets the serial interface and  
prepares it to receive data. Data-in can change only when SCLK is low and is taken by the reader on the  
SCLK rising edge. Communication is terminated by the stop condition when the data-in falling edge occurs  
during a high SCLK period.  
5.7.2 SPI Interface With SS* (Slave Select) Pin  
The serial interface is in reset while the SS* signal is high. Serial data-in (MOSI) changes on the falling  
edge, and is validated in the reader on the rising edge, as shown in Figure 5-9. Communication is  
terminated when the SS* signal goes high.  
All words must be 8 bits long with the MSB transmitted first.  
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Write Operation  
SCLK  
MOSI  
SS*  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Figure 5-9. SerialSPI Interface Communication (Write Mode)  
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System Description  
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The SPI read operation is shown in Figure 5-10.  
Write Mode  
Read Mode  
CKPH – 1, CKPL – 0 (MSP430)  
Data Transition – SCLK Falling Edge  
MOSI Valid – SCLK Rising Edge  
Switch  
SCLK  
Polarity  
CKPH – 0, CKPL – 0 (MSP430)  
Data Transition – SCLK Rising Edge  
MISO Valid – SCLK Falling Edge  
Single Read Operation  
Write Address Byte  
Read Data Byte  
SCLK  
No Data Transitions (All High/Low)  
MOSI  
MISO  
B7 B6 B5 B4 B3 B2 B1 B0  
Don't Care  
B7 B6 B5 B4 B3 B2 B1 B0  
SS*  
Figure 5-10. Serial SPI Interface Communication (Read Mode)  
The read command is sent out on the MOSI pin, MSB first, in the first eight clock cycles. MOSI data  
changes on the falling edge, and is validated in the reader on the rising edge, as shown in Figure 5-10.  
During the write cycle, the serial data out (MISO) is not valid. After the last read command bit (B0) is  
validated at the eighth rising edge of SCLK, after half a clock cycle, valid data can be read on the MISO  
pin at the falling edge of SCLK. It takes eight clock edges to read out the full byte (MSB first).  
Note:  
When using the hardware SPI (for example, an MSP430 hardware SPI) to implement the foregoing  
feature, care must be taken to switch the SCLK polarity after write phase for proper read operation.  
The example clock polarity for the MSP430-specific environment is shown in the write-mode and  
read-mode boxes of Figure 5-10. See the USART-SPI chapter for any specific microcontroller family  
for further information on the setting the appropriate clock polarity.  
This clock polarity switch must be done for all read (single, continuous) operations.  
The MOSI (serial data out) should not have any transitions (all high or all low) during the read cycle. Also,  
the SS* should be low during the whole write and read operation.  
The continuous read operation is illustrated in Figure 5-11  
42  
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SLOU186FAUGUST 2006REVISED AUGUST 2010  
Continuous Read Operation  
Write Address Byte  
Read Data Byte 1  
Read Data Byte n  
SCLK  
MOSI  
MISO  
No Data Transitions (All High/Low)  
B7 B6 B5 B4 B3 B2 B1 B0  
No Data Transitions (All High/Low)  
B7 B6 B5 B4 B3 B2 B1 B0  
B7 B6 B5 B4 B3 B2 B1 B0  
Don’t Care  
SS*  
Figure 5-11. SPI Interface Communication (Continuous Read Mode)  
Note:  
Special steps are needed to read the TRF796x IRQ status register (register address 0x0C) in SPI mode.  
The status of the bits in this register is cleared after a dummy read. The following steps must be followed  
when reading the IRQ status register.  
1. Write in command 0x6C: read 'IRQ status' register in continuous mode (eight clocks).  
2. Read out the data in register 0x0C (eight clocks).  
3. Generate another eight clocks (as if reading the data in register 0x0D) but ignore the MISO data line.  
This is shown in Figure 5-12.  
Special Case – IRQ Status Register Read  
Write Address  
Byte (0x6C)  
Read Data in  
IRQ Status Register  
Dummy Read  
SCLK  
MOSI  
MISO  
No Data Transitions (All High/Low)  
B7 B6 B5 B4 B3 B2 B1 B0  
No Data Transitions (All High/Low)  
B7 B6 B5 B4 B3 B2 B1 B0  
Ignore  
Don’t Care  
SS*  
Figure 5-12. SPI Interface Communication (IRQ Status Register Read)  
Copyright © 20062010, Texas Instruments Incorporated  
System Description  
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5.7.2.1 FIFO Operation  
The FIFO is a 12-byte register at address 1Fh with byte storage locations 0 to 11. FIFO data is loaded in a  
cyclical manner and can be cleared by a reset command (0F).  
Associated with the FIFO are two counters and three FIFO status flags. The first counter is a 4-bit FIFO  
byte counter (bits B0B3 in register 1Ch) that keeps track of the number of bytes loaded into the FIFO. If  
the number of bytes in the FIFO is n, the register value is n 1 (number of bytes in FIFO register). If 8  
bytes are in the FIFO, the FIFO counter (bits B0B3 in register 1Ch) has the value 7.  
A second counter (12 bits wide) indicates the number of bytes being transmitted (registers 1Dh and 1Eh)  
in a data frame. An extension to the transmission-byte counter is a 4-bit broken-byte counter also provided  
in register 1Eh (bits B0-B3). Together these counters make up the TX length value that determines when  
the reader generates the EOF byte.  
FIFO status flags are as follows:  
1. FIFO overflow (bit B4 of register 1Ch) indicates that the FIFO was loaded too soon  
2. FIFO level too low (bit B5 of register 1Ch) indicates that only three bytes are left to be transmitted  
(Can be used during transmission)  
3. FIFO level high (bit B6 of register 1Ch) indicates that nine bytes are already loaded into the FIFO  
(Can be used during reception to generate a FIFO reception IRQ. This is to notify the MCU to service  
the reader in time to ensure a continuous data stream.)  
During transmission, the FIFO is checked for an almost-empty condition, and during reception for an  
almost-full condition. The maximum number of bytes that can be loaded into the FIFO in a single  
sequence is 12 bytes. (Note: The number of bytes in a frame, transmitted or received, can be greater than  
12 bytes.)  
During transmission, the MCU loads the reader's FIFO (or during reception the MCU removes data from  
the FIFO), and the FIFO counter counts the number of bytes being loaded into the FIFO. Meanwhile, the  
byte counter keeps track of the number of bytes being transmitted. An interrupt request is generated if the  
number of bytes in the FIFO is less than 3 or greater than 9, so that MCU can send new data or remove  
the data as necessary. The MCU also checks the number of data bytes to be sent, so as to not surpass  
the value defined in TX length bytes. The MCU also signals the transmit logic when the last byte of data is  
sent or was removed from the FIFO during reception. Transmission starts automatically after the first byte  
is written into FIFO.  
5.8 External Power Amplifier Application  
Applications requiring an extended read range can use an external power amplifier together with the  
TRF7960/61. This can be implemented by adding an external power amplifier on the transmit side and  
external sub-carrier detectors on the receive side.  
To implement the external power amplification feature, certain registers must be programmed as shown  
below.  
1. Set bit B6 of the Regulator and I/O Control register to 1 (see Table 5-21).  
This setting has two functions, first to provide a modulated signal for the transmitter if needed, and  
second to configure the TRF7960/61 receiver inputs for an external demodulated sub-carrier input.  
2. Set bit B3 of the modulation and SYS_CLK control register to 1 (see Table 5-19).  
This function configures the ASK / OOK pin for either a digital or analog output (B3 = 0 enables a  
digital output, B3 = 1 enables an analog output).  
44  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
2-Apr-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TRF7960RHBR  
TRF7960RHBT  
ACTIVE  
ACTIVE  
QFN  
QFN  
RHB  
RHB  
32  
32  
3000  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
TRF7960USB  
OBSOLETE  
ACTIVE  
0
TBD  
Call TI  
Call TI  
TRF7961RHBR  
QFN  
QFN  
RHB  
RHB  
32  
3000  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
TRF7961RHBT  
ACTIVE  
32  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Dec-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TRF7960RHBR  
TRF7960RHBT  
TRF7961RHBR  
TRF7961RHBT  
QFN  
QFN  
QFN  
QFN  
RHB  
RHB  
RHB  
RHB  
32  
32  
32  
32  
3000  
250  
330.0  
180.0  
330.0  
180.0  
12.4  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
1.5  
1.5  
1.5  
1.5  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q2  
Q2  
Q2  
Q2  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Dec-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TRF7960RHBR  
TRF7960RHBT  
TRF7961RHBR  
TRF7961RHBT  
QFN  
QFN  
QFN  
QFN  
RHB  
RHB  
RHB  
RHB  
32  
32  
32  
32  
3000  
250  
346.0  
210.0  
346.0  
210.0  
346.0  
185.0  
346.0  
185.0  
29.0  
35.0  
29.0  
35.0  
3000  
250  
Pack Materials-Page 2  
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