TPS71550-DIE [TI]
LOW-DROPOUT LINEAR REGULATOR; 低压差线性稳压器
| 型号： | TPS71550-DIE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-DROPOUT LINEAR REGULATOR |
| 文件： | 总4页 (文件大小：62K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS71550-DIE
www.ti.com
SLVSBG8 –JULY 2012
LOW-DROPOUT LINEAR REGULATOR
Check for Samples: TPS71550-DIE
1
FEATURES
•
•
•
•
•
24-V Maximum Input Voltage
APPLICATIONS
Low Quiescent Current
•
•
•
Ultra-Low Power Microcontrollers
Low-Dropout Regulator
Cellular/Cordless Handsets
Portable/Battery-Powered Equipment
xxx
Available in 5 V
Minimum/Maximum Specified Current Limit
DESCRIPTION
The TPS71550 low-dropout (LDO) voltage regulator offers the benefits of high input voltage, low-dropout voltage,
low-power operation, and miniaturized packaging. The TPS71550, which operates over an input range of 5 V to
24 V, is stable with any capacitor (≥ 0.47 µF). The low-dropout voltage and low quiescent current allow
operations at extremely low power levels. Therefore, the TPS71550 is ideal for powering battery management
ICs. Specifically, since the TPS71550 is enabled as soon as the applied voltage reaches the minimum input
voltage, the output is quickly available to power continuously operating battery charging ICs.
The usual PNP pass transistor has been replaced by a PMOS pass element. Because the PMOS pass element
behaves as a low-value resistor, the low-dropout voltage, typically 415 mV at 50 mA of load current, is directly
proportional to the load current. The low quiescent current is stable over the entire range of output load current.
xxx
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
TPS71550TDB1
TPS71550TDB2
400
10
TPS71550
TD(2)
Bare die in waffle pack
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS71550-DIE
SLVSBG8 –JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
Aluminium Pad (TiW/AlSiCu
(0.5%))
15 mils.
Silicon with backgrind
Floating
600 nm
607.5
684.0
0
52
0
SCRIBE
SCRIBE
52
Table 1. Bond Pad Coordinates in Microns(1)
DESCRIPTION
PAD NUMBER
X MIN
6.03
Y MIN
5.40
X MAX
90.09
Y MAX
89.46
GND
1
2
3
4
507.78
465.93
15.39
15.30
583.74
583.74
591.84
591.84
141.30
99.36
OUT
VIN
667.80
667.80
(1) Substrate is to float.
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TPS71550-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
2-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS71550TDB1
TPS71550TDB2
ACTIVE
ACTIVE
0
0
400
10
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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