TPS71519DCKRG4 [TI]
50 mA, 24 V, 3.2 mA Supply Current Low-Dropout Linear Regulator in SC70 Package; 50毫安， 24 V ，320 mA电源电流，低压差线性稳压器， SC70封装
| 型号： | TPS71519DCKRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 50 mA, 24 V, 3.2 mA Supply Current Low-Dropout Linear Regulator in SC70 Package |
| 文件： | 总14页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS715xx
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SLVS338O–MAY 2001–REVISED JUNE 2007
50 mA, 24 V, 3.2 µA Supply Current
Low-Dropout Linear Regulator in SC70 Package
FEATURES
DESCRIPTION
•
•
•
•
•
24-V Maximum Input Voltage
The TPS715xx low-dropout (LDO) voltage regulators
offer the benefits of high input voltage, low-dropout
voltage, low-power operation, and miniaturized
packaging. The devices, which operate over an input
range of 2.5 V to 24 V, are stable with any capacitor
(≥ 0.47 µF). The low dropout voltage and low
quiescent current allow operations at extremely low
power levels. Therefore, the devices are ideal for
powering battery management ICs. Specifically,
since the devices are enabled as soon as the applied
voltage reaches the minimum input voltage, the
output is quickly available to power continuously
operating battery charging ICs.
Low 3.2-µA Quiescent Current at 50 mA
Stable With Any Capacitor (≥ 0.47 µF)
50-mA Low-Dropout Regulator
Available in 1.8 V, 1.9 V, 2.3 V, 2.5 V, 3.0 V, 3.3
V, 3.45 V, 5.0 V, and Adjustable (1.2 V to 15 V)
•
Designed to Support MSP430 Families:
–
–
–
–
1.9 V version ensured to be higher than
minimum VIN of 1.8 V
2.3 V version ensured to meet 2.2 V
minimum VIN for FLASH on MSP430F2xx
3.45 V version ensured to be lower than
maximum VIN of 3.6 V
The usual PNP pass transistor has been replaced by
a PMOS pass element. Because the PMOS pass
element behaves as a low-value resistor, the low
dropout voltage, typically 415 mV at 50 mA of load
current, is directly proportional to the load current.
The low quiescent current (3.2 µA typically) is stable
over the entire range of output load current (0 mA to
50 mA).
Wide variety of fixed output voltage
options to match VIN to the minimum
required for desired MSP430 speed
•
•
•
Minimum/Maximum Specified Current Limit
5-Pin SC70/SOT-323 (DCK) Package
–40°C to +125°C Specified Junction
Temperature Range
•
For 80 mA Rated Current and Higher Power
Package, see TPS715Axx
APPLICATIONS
•
•
•
Ultra Low Power Microcontrollers
Cellular/Cordless Handsets
Portable/Battery-Powered Equipment
DCK PACKAGE
(TOP VIEW)
TPS715xx
OUT
IN
MSP430
GND
FB/NC
GND
NC
1
2
5
OUT
IN
Solar
Cell
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated
TPS715xx
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SLVS338O–MAY 2001–REVISED JUNE 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS715xxyyyz
XX is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Output voltages from 1.25 V to 5.4 V in 50 mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted)(1)(2)
UNIT
VIN range
–0.3 V to +24 V
–0.3 V to +16.5 V
Internally limited
2 kV
VOUT range
Peak output current
ESD rating, HBM
ESD rating, CDM
500 V
Continuous total power dissipation
Junction temperature range, TJ
Storage temperature range, Tstg
See Dissipation Rating Table
–40°C to +150°C
–65°C to +150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATING TABLE
DERATING FACTOR
ABOVE TA = +25°C
TA≤ 25°C
TA = +70°C
TA = +85°C
BOARD
PACKAGE
RθJC°C/W
RθJA°C/W
POWER RATING POWER RATING POWER RATING
Low-K(1)
High-K(2)
DCK
DCK
165
165
395
315
2.52 mW/°C
3.18 mW/°C
250 mW
320 mW
140 mW
175 mW
100 mW
130 mW
(1) The JEDEC Low-K (1s) board design used to derive this data was a 3 inch × 3 inch, two-layer board with 2 ounce copper traces on top
of the board.
(2) The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch × 3 inch, multilayer board with 1 ounce internal power and
ground planes and 2 ounce copper traces on top and bottom of the board.
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ELECTRICAL CHARACTERISTICS
Over operating junction temperature range (TJ = –40°C to +125°C), VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, and COUT = 1 µF,
unless otherwise noted. Typical values are at TJ = +25°C.
PARAMETER
TEST CONDITIONS
IO = 10 mA
MIN
2.5
3
TYP
MAX UNIT
24
V
Input voltage(1)
VIN
IO = 50 mA
24
VOUT voltage range (TPS71501)
1.2
15
V
VIN + 1.0 V ≤ VIN ≤ 24 V
VOUT accuracy(1) Over VIN, IOUT, and T
–4.0
+4.0
%
100 µA ≤ IOUT ≤ 50 mA
0 ≤ IOUT ≤ 50 mA, TJ = –40°C to +85°C
0 mA ≤ IOUT ≤ 50 mA
3.2
3.2
4.2
4.8
5.8
Ground pin current(2)
IGND
µA
0 mA ≤ IOUT ≤ 50 mA, VIN = 24 V
IOUT = 100 µA to 50 mA
Load regulation
Output voltage
∆VOUT/∆IOUT
∆VOUT/∆VIN
22
20
mV
mV
VOUT + 1 V < VIN ≤ 24 V
60
(1)
line regulation
BW = 200 Hz to 100 kHz, COUT = 10 µF,
IOUT = 50 mA
Output noise voltage
Vn
575
µVrms
VOUT = 0 V, VIN ≥ 3.5 V
VOUT = 0 V, VIN < 3.5 V
f = 100 kHz, COUT = 10 µF
125
90
750
750
mA
mA
dB
Output current limit
ICL
Power-supply ripple rejection
PSRR
VDO
60
Dropout voltage
VIN = VOUT(NOM)– 1 V
IOUT = 50 mA
415
750
mV
(1) Minimum VIN = VOUT + VDO or the value shown for Input voltage in this table, whichever is greater.
(2) See Figure 1. The TPS715xx family employs a leakage null control circuit. This circuit is active only if output current is less than pass
FET leakage current. The circuit is typically active when output load is less than 5 µA, VIN is greater than 18 V, and die temperature is
greater than 100°C.
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FUNCTIONAL BLOCK DIAGRAMS
V(OUT)
V(IN)
Current
Sense
Leakage Null
Control Circuit
ILIM
R1
R2
_
+
GND
FB
Vref = 1.205 V
Bandgap
Reference
Figure 1. Functional Block Diagram—Adjustable Version
V(OUT)
V(IN)
Current
Sense
Leakage Null
Control Circuit
ILIM
R1
_
+
GND
R2
Vref = 1.205 V
Bandgap
Reference
Figure 2. Functional Block Diagram—Fixed Version
Table 1. Terminal Functions
TERMINAL
NO.
DESCRIPTION
NAME
FIXED
ADJ.
FB
NC
1
Adjustable version. This terminal is used to set the output voltage.
1
2
3
4
5
No connection
Ground
GND
NC
2
3
4
5
No connection
Input supply.
IN
OUT
Output of the regulator, any output capacitor ≥ 0.47 µF can be used for stability.
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TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
QUIESCENT CURRENT
vs
JUNCTION TEMPERATURE
3.320
3.315
3.32
3.31
4.5
V
V
= 4.3 V
= 3.3 V
IN
OUT
= 1 µF
V
C
= 4.3 V
IN
= 1 µF
I
= 1 mA
OUT
OUT
4
I
OUT
T
J
= 25°C
3.30
3.29
3.28
3.27
3.26
3.25
3.310
3.305
3.300
3.5
3
I
= 50 mA
OUT
2.5
2
V
C
= 4.3 V
3.295
3.290
IN
= 1 µF
OUT
0
10
20
30
40
50
−40−25 −10 5 20 35 50 65 80 95 110 125
−40 −25 −10 5 20 35 50 65 80 95 110 125
I
− Output Current − mA
T
J
− Junction Temperature − °C
O
T
J
− Junction Temperature − °C
Figure 3.
Figure 4.
Figure 5.
OUTPUT SPECTRAL
NOISE DENSITY
vs
OUTPUT IMPEDANCE
vs
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
FREQUENCY
FREQUENCY
8
7
6
5
4
3
2
1
0
600
18
16
14
V
V
C
= 4.3 V
V
V
C
= 4.3 V
= 3.3 V
= 1 µF
OUT
= 25°C
IN
IN
V
= 3.2 V
IN
= 3.3 V
OUT
OUT
I
= 1 mA
C
OUT
= 1 µF
OUT
500
= 1 µF
OUT
T
J
T
J
= 125°C
12
10
8
400
300
I
= 50 mA
OUT
T
J
= 25°C
6
4
2
0
I
= 1 mA
OUT
200
100
0
T
J
= −40°C
I
= 50 mA
1k
OUT
100
1 k
10 k
100 k
10
100
10k 100k
1 M 10 M
0
10
20
30
40
50
f − Frequency − Hz
f − Frequency − Hz
I
− Output Current − mA
OUT
Figure 6.
Figure 7.
Figure 8.
TPS71501
POWER-SUPPLY
DROPOUT VOLTAGE
vs
DROPOUT VOLTAGE
vs
JUNCTION TEMPERATURE
RIPPLE REJECTION
vs
INPUT VOLTAGE
FREQUENCY
1
600
500
400
300
200
100
0
100
I
= 50 mA
OUT
V
V
= 4.3 V
IN
V
= 3.2 V
IN
0.9
0.8
90
80
= 3.3 V
OUT
C
OUT
= 10 µF
T
= 125°C
J
I
= 50 mA
T = 25°C
J
OUT
0.7
0.6
70
60
50
T
J
= 25°C
I
= 1 mA
OUT
0.5
0.4
0.3
0.2
40
30
20
T
J
= −40°C
I
= 10 mA
OUT
I
= 50 mA
OUT
0.1
0
10
0
0
3
6
9
12
15
10
100
1k
10k 100k
1 M 10 M
−40 −25 −10
5
20 35 50 65 80
110 125
95
V
− Input Voltage − V
IN
f − Frequency − Hz
T
J
− Junction Temperature − °C
Figure 9.
Figure 10.
Figure 11.
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TYPICAL CHARACTERISTICS (continued)
POWER-UP / POWER-DOWN
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
8
VIN = 4.3 V
V
R
C
= 3.3 V
= 66 Ω
= 10 µF
V
I
C
= 3.3 V
= 50 mA
= 10 µF
OUT
OUT
400
200
0
VOUT = 3.3 V
COUT = 10 mF
7
100
50
L
OUT
OUT
OUT
6
5
4
0
-200
60
40
20
0
−50
3
V
IN
5.3
4.3
2
1
0
V
6
OUT
0
100 200 300 400 500 600 700 800 900 1000
ms
0
50 100 150 200 250 300 350 400 450 500
0
2
4
8
10 12 14 16 18 20
t − Time −
t − Time − µs
t − Time − ms
Figure 12.
Figure 13.
Figure 14.
6
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SLVS338O–MAY 2001–REVISED JUNE 2007
APPLICATION INFORMATION
The TPS715xx family of LDO regulators has been optimized for ultra-low power applications such as the
MSP430 microcontroller. Its ultra-low supply current maximizes efficiency at light loads, and its high input
voltage range makes it suitable for supplies such as unconditioned solar panels.
TPS71533
VIN
VOUT
IN
OUT
GND
C1
µ
0.47
F
µ
0.1
F
Figure 15. Typical Application Circuit (Fixed Voltage Version)
External Capacitor Requirements
Although not required, a 0.047-µF or larger input bypass capacitor, connected between IN and GND and located
close to the device, is recommended to improve transient response and noise rejection of the power supply as a
whole. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated
and the device is located several inches from the power source.
The TPS715xx requires an output capacitor connected between OUT and GND to stabilize the internal control
loop. Any capacitor (including ceramic and tantalum) ≥ 0.47 µF properly stabilizes this loop. X7R type capacitors
are recommended but X5R and others may be used.
Power Dissipation and Junction Temperature
To ensure reliable operation, worst-case junction temperature should not exceed +125°C. This restriction limits
the power dissipation the regulator can handle in any given application. To ensure the junction temperature is
within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD,
which must be less than or equal to PD(max)
.
The maximum-power-dissipation limit is determined using the following equation:
T max * T
J
+
A
P
D(max)
R
qJA
(1)
where:
•
•
•
TJmax is the maximum allowable junction temperature.
θJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings table).
TA is the ambient temperature.
R
The regulator dissipation is calculated using:
ǒ
Ǔ
PD + VIN*VOUT IOUT
(2)
For a higher power package version of the TPS715xx, see the TPS715Axx.
Regulator Protection
The TPS715xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (e.g., during power-down). Current is conducted from the output to the
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be
appropriate.
The TPS715xx features internal current limiting. During normal operation, the TPS715xx limits output current to
approximately 500 mA. When current limiting engages, the output voltage scales back linearly until the
overcurrent condition ends. Take care not to exceed the power dissipation ratings of the package.
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APPLICATION INFORMATION (continued)
Programming the TPS71501 Adjustable LDO Regulator
The output voltage of the TPS71501 adjustable regulator is programmed using an external resistor divider as
shown in Figure 16. The output voltage operating range is 1.2 V to 15 V, and is calculated using:
R1
R2
ǒ Ǔ
VOUT + VREF 1 )
(3)
where:
VREF = 1.205 V typ (the internal reference voltage)
•
Resistors R1 and R2 should be chosen for approximately 1.5-µA divider current. Lower value resistors can be
used for improved noise performance, but the solution consumes more power. Higher resistor values should be
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially
increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended
design procedure is to choose R2 = 1 MΩ to set the divider current at 1.5 µA, and then calculate R1 using
Equation 4:
R1 + ǒVOUT Ǔ
VREF
* 1 R2
(4)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
VIN
VOUT
IN
OUT
FB
OUTPUT
VOLTAGE
TPS71501
R1
R2
R1
R2
CFB
0.1µF
0.47µF
GND
0.499 MΩ 1 MΩ
1.33 MΩ 1 MΩ
3.16 MΩ 1 MΩ
1.8 V
2.8 V
5.0 V
R1
ǒ1 )
Ǔ
V
+ V
REF
OUT
R2
Figure 16. TPS71501 Adjustable LDO Regulator Programming
Power the MSP430 Microcontroller
Several versions of the TPS715xx are ideal for powering the MSP430 microcontroller. Table 2 shows potential
applications of some voltage versions.
Table 2. Typical MSP430 Applications
DEVICE
TPS71519
TPS71523
TPS71530
TPS715345
VOUT (TYP)
1.9 V
APPLICATION
VOUT, MIN > 1.800 V required by many MSP430s. Allows lowest power consumption operation.
VOUT, MIN > 2.200 V required by some MSP430s FLASH operation.
VOUT, MIN > 2.700 V required by some MSP430s FLASH operation.
VOUT, MIN < 3.600 V required by some MSP430s. Allows highest speed operation.
2.3 V
3.0 V
3.45 V
The TPS715xx family offers many output voltage versions to allow designers to minimize the supply voltage for
the processing speed required of the MSP430. This minimizes the supply current consumed by the MSP430.
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PACKAGE OPTION ADDENDUM
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30-May-2007
PACKAGING INFORMATION
Orderable Device
BQ71525DCKR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SC70
DCK
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BQ71525DCKRG4
BQ71533DCKR
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BQ71533DCKRG4
TPS71501DCKR
TPS71501DCKRG4
TPS71518DCKR
TPS71518DCKRG4
TPS71519DCKR
TPS71519DCKRG4
TPS71523DCKR
TPS71523DCKRG4
TPS71525DCKR
TPS71525DCKRG4
TPS71530DCKR
TPS71530DCKRG4
TPS71533DCKR
TPS71533DCKRG4
TPS715345DCKR
TPS715345DCKRG4
TPS71550DCKR
TPS71550DCKRG4
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2007
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
180
180
180
180
180
180
180
180
180
180
180
(mm)
BQ71525DCKR
BQ71533DCKR
TPS71501DCKR
TPS71518DCKR
TPS71519DCKR
TPS71523DCKR
TPS71525DCKR
TPS71530DCKR
TPS71533DCKR
TPS715345DCKR
TPS71550DCKR
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
5
5
5
5
5
5
5
5
5
5
5
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
9
9
9
9
9
9
9
9
9
9
9
2.24
2.24
2.24
2.24
2.24
2.24
2.24
2.24
2.24
2.24
2.24
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
2.34
2.34
2.34
2.34
2.34
2.34
2.34
2.34
2.34
2.34
2.34
4
4
4
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
8
8
8
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
BQ71525DCKR
BQ71533DCKR
TPS71501DCKR
TPS71518DCKR
TPS71519DCKR
TPS71523DCKR
TPS71525DCKR
TPS71530DCKR
TPS71533DCKR
TPS715345DCKR
TPS71550DCKR
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
5
5
5
5
5
5
5
5
5
5
5
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
SITE 35
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
85.0
85.0
85.0
85.0
85.0
85.0
85.0
85.0
85.0
85.0
85.0
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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