TPS653851A-Q1 [TI]
符合功能安全标准的多轨电源,适用于 Q100 0 级应用的安全 MCU;型号: | TPS653851A-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 符合功能安全标准的多轨电源,适用于 Q100 0 级应用的安全 MCU |
文件: | 总13页 (文件大小:2017K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS653851A-Q1
ZHCSNA0A –JANUARY 2020 –REVISED FEBRUARY 2021
适用于安全相关应用中微控制器的TPS653851A-Q1 多轨电源
– 独立监控所有稳压器输出、电池电压和内部电源
的欠压和过压情况
1 特性
– 电压监视电路(包括独立的带隙基准)由单独的
电池电压输入引脚供电
– 针对所有电压监控进行自检(上电期间以及在上
电之后由外部MCU 触发)
– 所有电源均具有电流限制和过热预警及关断保护
• 具有符合AEC-Q100 的下列结果:
– 器件温度等级0:–40°C 至+150°C 环境工作
温度范围
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 符合功能安全标准
• 微控制器接口
– 打开和关闭窗口或问答看门狗功能
– 功能安全MCU 故障输出(PWM 或电平)监控
器、MCU 错误信号监控器
– 专为功能安全应用开发
– 可帮助使ISO 26262 系统设计符合ASIL D 的文
档
– DIAGNOSTIC 状态,用于辅助执行器件自检和
系统诊断
– 可满足ASIL D 要求的系统功能和硬件完整性
• 输入电压范围
– SAFE 状态,用于检测到错误事件时的器件和系
统保护
– 针对内部振荡器的时钟监视器
– 模拟与逻辑内置自检
– 支持对非易失性存储器、器件和系统配置寄存器
以及SPI 通信进行循环冗余校验(CRC)
– 针对MCU 的复位电路
– 电池初始加电电压为7V 至36V
– 电池初始加电后正常运行电压为4V 至36V
– 唤醒后的最低运行电压为2.3V
• 电源轨(具有内部FET)
– 6V 同步降压/升压前置稳压器
– 5V、285mA LDO(CAN、外设或ADC 基准
1% 精度,带20 至120mA 负载、TJ ≤
150°C,1.25% TJ > 150°C)
– 诊断输出引脚
• SPI 支持对命令和数据进行CRC
• 通过SPI 寄存器报告系统级和器件级错误
• 使能驱动输出,可在检测到任意系统故障时禁用外
部功率级
– 3.3V 或5V、350mA LDO (MCU) TPS653851A-
Q1。
– 用于传感器电源或外设的2 个受保护的LDO
• 传感器电源1 (VSOUT1) 为120mA,传感器
电源2 (VSOUT2) 为100mA
• 可配置跟踪模式(跟踪输入引脚)或
3.3V/5V 固定输出电压
• 通过IGN 引脚(点火)或CAN_WU 引脚(收发器
或其他功能)唤醒
• 48 引脚HTSSOP PowerPAD™ IC 封装
2 应用
• 接地短路和电池保护
– 电荷泵:最小值6V,最大值11V(高于电池电
压)
• 监视和保护
• 汽车安全相关应用
• 工业安全相关应用
3 说明
TPS653851A-Q1 器件是一款多轨电源,旨在为安全相关应用中的微控制器供电,例如汽车行业中的应用。该器
件支持采用双核锁步(LS) 和其他多核架构的功能安全微控制器。
TPS653851A-Q1 器件集成了多个为 MCU、CAN 或 FlexRay 以及外部传感器供电的电源轨。并且配有一个具有
内部 FET 的降压-升压转换器,可将 2.3V 至36V 的输入电池电压转换为6V 前置稳压器输出,从而为其他稳压器
供电。集成电荷泵可为内部稳压器提供过驱电压,而且还可用于驱动外部 NMOS FET 以提供电池反向保护。该器
件支持通过点火信号(IGN 引脚)或者通过CAN 收发器或其他信号(CAN_WU 引脚)唤醒。
该器件内部有一个独立的电压监测单元,可监测所有内部电源轨以及电池电源稳压器输出的欠压和过压情况。此
外,该器件还实现了稳压器电流限制和过热保护。TPS653851A-Q1 器件具有问答看门狗、MCU 误差信号监控、
针对内部振荡器的时钟监控、针对时钟监控器的自检、针对非易失性存储器和 SPI 通信的循环冗余校验 (CRC)、
支持MCU 监测器件内部模拟和数字信号的诊断输出引脚、针对MCU 的复位电路(NRES 引脚)以及可在检测到
任何系统故障时禁用外部功率级的保险输出(ENDRV 引脚)。该器件在启动时自动运行内置自检 (BIST),如果
需要,MCU 可以在系统运行期间通过软件控制重新运行BIST。专用的DIAGNOSTIC 状态可供 MCU 使用以检查
TPS653851A-Q1 功能性。
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSF97
TPS653851A-Q1
ZHCSNA0A –JANUARY 2020 –REVISED FEBRUARY 2021
www.ti.com.cn
TPS653851A-Q1 器件还可通过 SPI 寄存器报告错误。此器件在 SPI 寄存器中有单独的状态位,用于指示每个特
定的系统级或器件级错误。当器件检测到特定错误条件时,可将相应状态位置 1 并保持到 MCU 读取完该状态位
所在SPI 寄存器为止。根据置1 的状态位,MCU 可以决定是否必须使系统保持安全状态或者是否可使系统恢复运
行。
TPS653851A-Q1 器件采用48 引脚HTSSOP PowerPAD™ IC 封装。
器件信息(1)
器件型号
封装
封装尺寸
TPS65851A-Q1
HTSSOP (48)
12.50mm x 6.10mm
(1) 如需更多信息,请参阅节6。
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ZHCSNA0A –JANUARY 2020 –REVISED FEBRUARY 2021
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3.1 Typical Application Diagram
Battery Voltage
(2.3 V to 36 V)
5 V
TPS65385xx-Q1
CAN Interface
CAN wakeup
Multirail Power Supply
Ignition
EN
FETs
3.3 V / 5 V
DRVOFF
6 × PWM
Voltage Monitor
ENDRV
RESET
NRES
3 × HS
3 × LS
M
Motor-Driver
(DRV320x)
ERROR
Error Signal
Monitor
Dual-Core Lock-Step
Microcontroller
SPI
Watchdog
SPI
SPI
TPS653850A-Q1 TPS653851A-Q1 TPS653852A-Q1 TPS653853A-Q1 TPS653854A-Q1
TPS65385xx TPS653853 Func onal safety ASIL-D ASIL
boost 2MHz low power mode synchronous AEC-Q100 grade-1 grade-0 grade
sensor supply tracking ciency pre-regulator, state machine window Q&A watchdog safe
D
ISO26262 26262 buck boost buck-
1
grade 0 SBC
e
state controller Build in self test BIST ABIST LBIST power management
DIAG_OUT
In neon www.in neon.com
IFX TLF35584 TLS35585 TLF11251
AURIX AURIXTM Tricore
TC3xx TC39x TC399 TC397 TC277 TC297 TC299 TC35 TC36 TC37 TC38 TC39 TC3E
TLF35584 TLF35584QVVS2 TLF35584QVVS2 TLF35584QKVS1 TLF35584QKVS2 TLF35584QV
VS1/VS2 TLF35584QK VS1/VS2 PRO-SIL
DIAG_OUT
NXP nxp.com
FS26 FS2600 FS45 FS4500 FS65 FS6500 FS66 FS6600 FS84 FS8400 FS85 FS8500 Qorivva
MPC57xx MPMC57 MPC574 MPC577 MPC56 MPC56xx
S32 S32S S32S24 S32K S32K1 S32K2 S32G S32P S32D SafeAssure
Kine
s KEA
STM st.com SPC5 SPC5 SPC56 SPC56L SPC57 SPC57K SPC572L SPC58 SPC58E SPC58N
Chorus Line Chorus Series Chorus MCU
Allegro MicroSystems A²-SIL A4412 ARG81400 ARG82800 ARG82801
3.3 V, 5 V
3.3 V / 5 V
Renesas RAA27000 R270000 R270005
RH850 RH850/F1L RH850/F1K RH850/P1H-C RH850/F1H RH850/D1M RH850/F1H
RH850/C1M RH850/U2A16
Sensor 1
Sensor 2
Safety Microcontroller MCU uC
AUTOSAR
FMEA safety case Automo ve motor control body chassis BMS Ba!ery Management system
EPS Electric Power Steering Belt Starter Generator xSG Tracꢀon Inverter Braking Electric Park
Brake EPB DSG transmission gear shi"er transfer case engine management ADAS fusion
body control module ADAS domain controller, suspension, DC/DC, charger, gateway HEV/EV
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TPS653851A-Q1
ZHCSNA0A –JANUARY 2020 –REVISED FEBRUARY 2021
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Table of Contents
5.2 Receiving Notification of Documentation Updates......5
5.3 支持资源......................................................................5
5.4 Trademarks.................................................................5
5.5 静电放电警告.............................................................. 5
5.6 术语表......................................................................... 5
6 Mechanical, Packaging, and Orderable Information....5
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
3.1 Typical Application Diagram........................................3
4 修订历史记录.....................................................................4
5 Device and Documentation Support..............................5
5.1 Documentation Support.............................................. 5
4 修订历史记录
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision * (January 2020) to Revision A (February 2021)
Page
• 向特性部分添加了“符合功能安全标准”状态...................................................................................................1
• 更新了整个文档中的表、图和交叉参考的编号格式.............................................................................................1
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TPS653851A-Q1
ZHCSNA0A –JANUARY 2020 –REVISED FEBRUARY 2021
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5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
• Texas instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Packages
application report
• Texas instruments, PowerPAD™ Made Easy application report
• Texas instruments, PowerPad™ Thermally Enhanced Package application report
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
5.4 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
O3851AEDCARQ1
ACTIVE
HTSSOP
DCA
48
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 150
O3851A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
O3851AEDCARQ1
HTSSOP DCA
48
2000
330.0
24.4
8.6
13.0
1.8
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP DCA 48
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
O3851AEDCARQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DCA 48
12.5 x 6.1, 0.5 mm pitch
HTSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
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