TPS62650_11 [TI]
800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE; 800毫安， 6 MHz的高效率降压转换器，兼容I2C？
| 型号： | TPS62650_11 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE |
| 文件： | 总38页 (文件大小：826K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS62650
TPS62651
CSP-9
www.ti.com
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
800-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER
WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING
Check for Samples: TPS62650, TPS62651
1
FEATURES
DESCRIPTION
2
•
•
•
•
•
•
•
•
•
•
•
•
86% Efficiency at 6 MHz Operation
The TPS6265x device is
a
high-frequency
synchronous step-down dc-dc converter optimized for
battery-powered portable applications. Intended for
low-power applications, the TPS6265x supports up to
800mA load current and allows the use of small, low
cost inductors and capacitors.
38μA Quiescent Current
Wide VIN Range From 2.3 V to 5.5 V
6MHz Regulated Frequency Operation
Best-In-Class Load and Line Transient
±2% PWM DC Voltage Accuracy
The device is ideal for mobile phones and similar
portable applications powered by a single-cell Li-Ion
battery. With an output voltage range adjustable via
I2C interface down to 0.75V, the device supports
low-voltage DSPs and processors core power
supplies in smart-phones and handheld computers.
Automatic PFM/PWM Mode Switching
Low Ripple Light-Load PFM
I2C Compatible Interface up to 3.4 Mbps
Pin-Selectable Output Voltage (VSEL)
Internal Soft-Start, <150-μs Start-Up Time
The TPS6265x operates at
a regulated 6MHz
switching frequency and enters the efficiency
optimized power-save mode operation at light load
currents to maintain high efficiency over the entire
load current range. In the shutdown mode, the
current consumption is reduced to less than 3.5μA.
Current Overload and Thermal Shutdown
Protection
•
•
Three Surface-Mount External Components
Required (One MLCC Inductor, Two Ceramic
Capacitors)
The serial interface is compatible with Standard,
Fast/Fast Plus and High-Speed mode I2C
specification allowing transfers at up to 3.4 Mbps.
This communication interface is used for dynamic
voltage scaling with voltage steps down to 12.5mV,
for setting the output voltage or reprogramming the
mode of operation (PFM/PWM or Forced PWM) for
instance.
Complete Sub 1-mm Component Profile
Solution
Total Solution Size <13mm2
•
•
Available in a 9-Pin NanoFree™ (CSP)
Packaging
APPLICATIONS
The TPS6265x is available in an 9-pin chip-scale
package (CSP).
•
•
•
•
SmartReflex™ Compliant Power Supply
OMAP™ Application Processor Core Supply
Cell Phones, Smart-Phones
Micro DC-DC Converter Modules
spacer
100
TPS62650
VI = 2.7V
V
= 1.2V
O
PFM/PWM Operation
90
80
70
60
50
VIN
V
FB
I
V
O
C1
SW
L1
0.47mH
C2
4.7mF
2.3 V .. 5.5 V
4.7mF
GND
VI = 3.6V
PFM/PWM Operation
EN
40
30
20
10
0
V
= Roof
O
VSEL
V
= Floor
2
O
VI = 3.6V
VI = 4.2V
Forced PWM Operation
PFM/PWM Operation
SDA
SCL
I C Bus
up to 3.4 Mbips
0.1
1
10
100
1000
I
− Load Current − mA
O
Figure 1. Typical Application
Figure 2. Efficiency vs Load Control
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree, SmartReflex, OMAP are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2009–2011, Texas Instruments Incorporated
TPS62650
TPS62651
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
DEFAULT
I2C ADDRESS BITS(2)
OUTPUT VOLTAGE(2)
PART
OUTPUT VOLTAGE
RANGE(2)
PACKAGE
MARKING
PACKAGE(3)
ORDERING
NUMBER(1)
VSEL0
1.05 V
0.95 V
VSEL1
1.2 V
A2
0
A1
1
TPS62650(4)
TPS62651(4)
0.75 V to 1.4375 V
0.75 V to 1.4375 V
YFF-9
YFF-9
TPS62650YFF
TPS62651YFF
GJ
1.1 V
1
1
GK
(1) All devices are specified for operation in the commercial temperature range, –40°C to 85°C.
(2) For customized output voltage limits (within a 0.75 V to 1.5375 V range), default output voltage and I2C address, contact the factory.
Internal tap points are available to facilitate default output voltage settings in multiples of 50 mV.
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(4) The following registers bits are set by internal hardware logic and not user programmable through I2C:
(a) VSEL0[7] = 1
(b) VSEL1[7] = 1
(c) CONTROL1[3:2] = 00
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
MAX
7
at VIN, SW(2)
V
V
V
(2)
Input Voltage
at FB
3.6
(2)
at EN, VSEL, SCL, SDA
VI + 0.3
Power dissipation
Internally limited
(3)
Operating junction temperature, TA
Maximum operating junction Temperature, TJ
Storage temperature range, Tstg
Human body model
–40
85
150
150
2
°C
°C
°C
kV
kV
V
–65
ESD rating(4)
Charge device model
Machine model
1
200
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
(4) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS(1)
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
(2)
(2)
PACKAGE
RθJA
RθJB
TA ≤ 25°C
YFF
105°C/W
35°C/W
950 mW
8 mW/°C
(1) Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max) – TA] / θJA
(2) This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
.
2
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© 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS62650 TPS62651
TPS62650
TPS62651
www.ti.com
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
ELECTRICAL CHARACTERISTICS
Minimum and maximum values are at VI = 2.3V to 5.5V, VO = 1.2 V, EN = 1.8V, EN_DCDC bit = 1, AUTO mode and
TA = -40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at
VI = 3.6V, VO = 1.2 V, EN = 1.8V, EN_DCDC bit = 1, AUTO mode and TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VI
IQ
Input voltage range
2.3
5.5
58
V
μA
mA
μA
μA
V
VI = 3.6 V, IO = 0 mA, -40°C ≤ TJ≤ 85°C. Device not switching
VI = 3.6 V, IO = 0 mA. PWM mode
38
5.35
0.5
Operating quiescent current
VI = 3.6 V, EN = GND, EN_DCDC bit = X, -40°C ≤ TJ≤ 85°C
VI = 3.6 V, EN = VI, EN_DCDC bit = 0, -40°C ≤ TJ≤ 85°C
3.5
3.5
I(SD)
Shutdown current
0.5
UVLO
Undervoltage lockout threshold
2.05
2.15
ENABLE, VSEL, SDA, SCL
VIH
VIL
Ilkg
High-level input voltage
Low-level input voltage
Input leakage current
0.9
V
V
0.4
0.7
Input tied to GND or VI, -40°C ≤ TJ≤ 85°C
0.01
μA
POWER SWITCH
rDS(on) P-channel MOSFET on resistance
Ilkg
VI = V(GS) = 3.6 V
255
335
mΩ
μA
VI = V(GS) = 2.5 V
P-channel leakage current, PMOS
N-channel MOSFET on resistance
N-channel leakage current, NMOS
V(DS) = 5.5 V, -40°C ≤ TJ≤ 85°C
VI = V(GS) = 3.6 V
1
140
200
rDS(on)
mΩ
VI = V(GS) = 2.5 V
Ilkg
V(DS) = 5.5 V, -40°C ≤ TJ≤ 85°C
1
50
μA
Ω
Discharge resistor for power-down
sequence
rDIS
15
1500
11
P-MOS current limit
2.3 V ≤ VI ≤ 4.8 V. Open loop
1350
1700
mA
mA
Input current limit under short-circuit
conditions
VO = 0 V
Thermal shutdown
140
15
°C
°C
Thermal shutdown hysteresis
OSCILLATOR
fSW
Oscillator frequency
IO = 0 mA. PWM mode
5.4
6
6.6
2%
MHz
OUTPUT
2.3 V ≤ VI ≤ 5.5 V, 0 mA ≤ IO(DC) ≤ 800 mA
VO = 0.75 V, 1.05 V, 1.20 V, 1.4375 V (TPS62650)
VO = 0.75 V, 0.95 V, 1.10 V, 1.4375 V (TPS62651)
PWM operation
–2%
Regulated DC output
voltage accuracy
2.3 V ≤ VI ≤ 5.5 V, 0 mA ≤ IO(DC) ≤ 800 mA
VO = 0.75 V, 1.05 V, 1.20 V, 1.4375 V (TPS62650)
VO = 0.75 V, 0.95 V, 1.10 V, 1.4375 V (TPS62651)
PFM/PWM Operation
–2%
3%
VO
TPS62650/1
Regulated DC output
voltage temperature drift
VI = 3.6 V, VO = 1.20 V, IO(DC) = 50 mA
-40°C ≤ TJ ≤ 105°C. PWM operation
-0.5%
+0.5%
Line regulation
VI = VO + 0.5 V (min 2.3 V) to 5.5 V, IO(DC) = 200 mA
IO(DC) = 0 mA to 800 mA
0.13
–0.00046
480
%/V
%/mA
kΩ
Load regulation
Feedback input resistance
VO = 1.05 V, VSEL = GND, IO(DC) = 1 mA
PFM operation
16
16
mVPP
mVPP
ΔVO
Power-save mode ripple voltage
VO = 1.20 V, VSEL = VI, IO(DC) = 1 mA
PFM operation
DAC
TPS62650
TPS62651
Resolution
6
Bits
Differential nonlinearity
Specified monotonic by design
±0.4
LSB
© 2009–2011, Texas Instruments Incorporated
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TPS62650
TPS62651
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Minimum and maximum values are at VI = 2.3V to 5.5V, VO = 1.2 V, EN = 1.8V, EN_DCDC bit = 1, AUTO mode and
TA = -40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at
VI = 3.6V, VO = 1.2 V, EN = 1.8V, EN_DCDC bit = 1, AUTO mode and TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TIMING
Setup Time Between
Rising EN and Start of
I2C Stream
TPS62650/1
TPS62650/1
50
μs
μs
Output voltage settling
time
From min to max output voltage,
IO(DC) = 500 mA, VSEL = VI, PWM operation
VO
12
125
120
Time from active EN to VO
VO = 1.2 V, IO = 0 mA, PWM operation
Start-up time
TPS62650/1
μs
Time from active EN to VO
VO = 1.05 V, IO = 0 mA, PFM operation
I2C INTERFACE TIMING CHARACTERISTICS(1)
PARAMETER
TEST CONDITIONS
Standard mode
Fast mode
MIN
MAX
UNIT
kHz
kHz
MHz
MHz
MHz
MHz
MHz
μs
100
400
1
Fast mode plus
f(SCL)
SCL Clock Frequency
High-speed mode (write operation), CB – 100 pF max
High-speed mode (read operation), CB – 100 pF max
High-speed mode (write operation), CB – 400 pF max
High-speed mode (read operation), CB – 400 pF max
Standard mode
3.4
3.4
1.7
1.7
4.7
1.3
0.5
4
Bus Free Time Between a STOP and
START Condition
tBUF
Fast mode
μs
Fast mode plus
μs
Standard mode
μs
Fast mode
600
260
160
4.7
1.3
0.5
160
320
4
ns
Hold Time (Repeated) START
Condition
tHD, tSTA
Fast mode plus
ns
High-speed mode
ns
Standard mode
μs
Fast mode
μs
tLOW
LOW Period of the SCL Clock
HIGH Period of the SCL Clock
Fast mode plus
μs
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
ns
ns
μs
Fast mode
600
260
60
ns
tHIGH
Fast mode plus
ns
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
ns
120
4.7
600
260
160
250
100
50
ns
μs
Fast mode
ns
Setup Time for a Repeated START
Condition
tSU, tSTA
Fast mode plus
ns
High-speed mode
ns
Standard mode
ns
Fast mode
ns
tSU, tDAT Data Setup Time
Fast mode plus
ns
High-speed mode
10
ns
(1) Specified by design. Not tested in production.
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Product Folder Link(s): TPS62650 TPS62651
TPS62650
TPS62651
www.ti.com
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
I2C INTERFACE TIMING CHARACTERISTICS(1) (continued)
PARAMETER
TEST CONDITIONS
MIN
MAX
3.45
0.9
UNIT
μs
μs
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
ns
ns
ns
pF
pF
pF
pF
Standard mode
0
Fast mode
0
tHD, tDAT Data Hold Time
Fast mode plus
0
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
0
0
70
150
1000
300
120
40
20 + 0.1 CB
20 + 0.1 CB
Fast mode
tRCL
tRCL1
tFCL
tRDA
tFDA
Rise Time of SCL Signal
Fast mode plus
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
10
20
80
20 + 0.1 CB
20 + 0.1 CB
1000
300
120
80
Fast mode
Rise Time of SCL Signal After a
Repeated START Condition and After
an Acknowledge BIT
Fast mode plus
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
10
20
160
300
300
120
40
20 + 0.1 CB
20 + 0.1 CB
Fast mode
Fall Time of SCL Signal
Rise Time of SDA Signal
Fall Time of SDA Signal
Fast mode plus
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
10
20
80
20 + 0.1 CB
20 + 0.1 CB
1000
300
120
80
Fast mode
Fast mode plus
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
10
20
160
300
300
120
80
20 + 0.1 CB
20 + 0.1 CB
Fast mode
Fast mode plus
High-speed mode, CB – 100 pF max
High-speed mode, CB – 400 pF max
Standard mode
10
20
160
4
Fast mode
600
260
160
tSU, tSTO Setup Time of STOP Condition
Fast mode plus
High-Speed mode
Standard mode
400
400
550
400
Fast mode
CB
Capacitive Load for SDA and SCL
Fast mode plus
High-Speed mode
© 2009–2011, Texas Instruments Incorporated
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SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
www.ti.com
I2C TIMING DIAGRAMS
SDA
t
t
BUF
f
t
f
t
t
LOW
t
r
su;DAT
t
t
r
hd;STA
SCL
t
t
t
su;STO
hd;STA
t
su;STA
hd;DAT
HIGH
S
Sr
P
S
Figure 3. Serial Interface Timing Diagram for Standard-, Fast-, Fast-Mode Plus
Sr
Sr P
t
fDA
t
rDA
SDAH
t
hd;DAT
t
su;STO
t
t
t
su;DAT
su;STA
hd;STA
SCLH
t
fCL
t
t
rCL1
rCL1
t
rCL
t
t
t
t
HIGH
HIGH
LOW
LOW
See Note A
= MCS Current Source Pull-Up
= R Resistor Pull-Up
See Note A
(P)
Note A: First rising edge of the SCLH signal after Sr and after each acknowledge bit.
Figure 4. Serial Interface Timing Diagram for HS-Mode
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Product Folder Link(s): TPS62650 TPS62651
TPS62650
TPS62651
www.ti.com
SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
PIN ASSIGNMENTS
TPS6265x
TPS6265x
CSP−9
(BOTTOM VIEW)
CSP−9
(TOP VIEW)
A1
B1
A2
B2
A3
A3
A2
A1
B3
B3
B2
B1
C1
C2
C3
C3
C2
C1
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
VIN
A2
I
This is the input voltage pin of the device. Connect directly to the input bypass capacitor.
This is the enable pin of the device. Connect this pin to ground forces the device into
shutdown mode. Pulling this pin to VI enables the device. On the rising edge of the enable
pin, all the registers are reset with their default values. This pin must not be left floating and
must be terminated.
EN
B3
A1
I
I
VSEL signal is primarily used to scale the output voltage and to set the TPS6265x operation
between active mode (VSEL=HIGH) and sleep mode (VSEL=LOW). The mode of operation
can also be adapted by I2C settings. This pin must not be left floating and must be
terminated.
VSEL
SDA
SCL
FB
A3
B2
I/O
Serial interface address/data line.
Serial interface clock line.
I
I
C1
Output feedback sense input. Connect FB to the converter output.
Ground.
GND
C2, C3
This is the switch pin of the converter and connected to the drain of the internal power
MOSFETs.
SW
B1
I/O
FUNCTIONAL BLOCK DIAGRAM
EN
VIN
Undervoltage
Lockout
Bias Supply
VIN
Soft-Start
Negative Inductor
Current Detect
Bandgap
V
= 0.75 V
Power Save Mode
Switching Logic
REF
Current Limit
Detect
Thermal
Shutdown
Frequency
Control
FB
-
Gate Driver
SW
Anti
Shoot-Through
+
Control
Logic
Registers
SDA
SCL
6-Bit
DAC
I2C I/F
V
DAC
GND
VSEL
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TPS62650
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SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
TPS62650
VI
VIN
FB
VO
C1
SW
L1
C2
GND
GND
EN
VO = Roof
VSEL
VO = Floor
2
L = muRata LQM21PN1R0NGR
C1 = muRata GRM155R60J475M (4.7mF, 6.3V, 0402, X5R)
C2 = muRata GRM155R60J475M (4.7mF, 6.3V, 0402, X5R)
SDA
SCL
I C Bus
up to 3.4 Mbps
Note: The internal registers are set to their default values
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
5, 6, 7, 8
9
vs Output current
vs Input voltage
η
Efficiency
Peak-to-peak output ripple
voltage
vs Output Current
10, 11, 12, 13
vs Output current
14, 15, 16, 17
VO
DC output voltage
vs Ambient temperature
vs DAC target output voltage
18, 19
20
Measured output voltage
PFM/PWM Boundaries
Quiescent current
21
IQ
vs Input voltage
vs Input voltage
vs Input voltage
vs Input voltage
vs Input voltage
22
ISD
fS
Shutdown current
23
Switching frequency
24
P-channel MOSFET rDS(on)
N-channel MOSFET rDS(on)
Load transient response
25
rDS(on)
26
27 - 38
39
Line transient PWM operation
Combined line and load transient
response
40
PWM operation
41
42
Power-save mode operation
Dynamic voltage management
Output voltage ramp control
Start-up
43, 44
45
46, 47
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Product Folder Link(s): TPS62650 TPS62651
TPS62650
TPS62651
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SLVS808A –AUGUST 2009–REVISED FEBRUARY 2011
TYPICAL CHARACTERISTICS (continued)
EFFICIENCY
vs
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
20
10
V = 2.7 V
I
V
= 1.05 V
O
V
= 1.20 V
V = 2.7 V
I
O
PFM/PWM
PFM/PWM
V = 3.6 V
I
V = 3.6 V
I
PFM/PWM
PFM/PWM
V = 4.2 V
I
PFM/PWM
V = 4.2 V
I
PFM/PWM
V = 3.6 V
I
Forced PWM
10
0
0
0.1
0.1
1
10
100
1000
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 5.
Figure 6.
EFFICIENCY
vs
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
90
80
70
60
50
40
30
20
10
100
90
80
70
60
50
40
30
V
= 0.75 V
V
= 1.4375 V
O
O
V = 2.7 V
I
PFM/PWM
V = 2.7 V
I
PFM/PWM
V = 3.6 V
I
V = 3.6 V
I
PFM/PWM
PFM/PWM
V = 4.2 V
I
V = 4.2 V
I
PFM/PWM
PFM/PWM
20
10
0
0
0.1
1
10
100
1000
0.1
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 7.
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
EFFICIENCY
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs
vs
INPUT VOLTAGE
OUTPUT CURRENT
100
98
96
94
92
90
88
86
84
82
80
78
76
74
24
22
20
18
16
14
12
10
8
V
= 1.2 V
V
= 1.2 V
O
O
PFM/PWM
V = 4.8 V
I
I
= 100 mA
V = 3.6 V
O
I
I
= 300 mA
O
V = 2.5 V
I
I
= 10 mA
O
I
= 1 mA
6
O
4
2
0
72
70
0
100 200 300 400 500 600 700 800
- Load Current - mA
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
I
V - Input Voltage - V
I
O
Figure 9.
Figure 10.
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
24
22
20
18
16
14
12
10
8
24
22
20
18
16
14
12
10
8
V
= 0.75 V
V
= 1.05 V
O
O
V = 4.8 V
I
V = 4.8 V
I
V = 3.6 V
V = 3.6 V
I
I
V = 2.5 V
I
V = 2.5 V
I
6
6
4
4
2
0
2
0
0
100 200 300 400 500 600 700 800
I
0
100 200 300 400 500 600 700 800
I
- Load Current - mA
- Load Current - mA
O
O
Figure 11.
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
DC OUTPUT VOLTAGE
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
1.224
1.212
1.2
24
22
20
18
16
14
12
10
8
V
= 1.2 V
O
V
= 1.4375 V
O
V = 4.8 V
I
V = 4.8 V
I
V = 3.6 V
I
PFM/PWM
PWM Operation
V = 3.6 V
I
V = 2.5 V
I
V = 2.5 V
I
V = 3.6 V
I
PFM/PWM
PFM/PWM
6
1.188
1.176
4
2
0
0
0.1
1
10
100
1000
100 200 300 400 500 600 700 800
- Load Current - mA
I
- Output Current - mA
I
O
O
Figure 13.
Figure 14.
DC OUTPUT VOLTAGE
vs
DC OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT CURRENT
0.765
0.758
1.071
1.061
1.05
V
= 0.75 V
V
= 1.05 V
O
O
V = 4.8 V
I
V = 3.6 V
I
PFM/PWM
PFM/PWM
V = 4.8 V
I
V = 3.6 V
PFM/PWM
I
PFM/PWM
0.75
0.743
0.735
V = 2.5 V
I
PFM/PWM
V = 2.5 V
I
PFM/PWM
1.04
1.029
0.1
1
10
100
1000
0.1
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 15.
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
DC OUTPUT VOLTAGE
DC OUTPUT VOLTAGE
vs
vs
OUTPUT CURRENT
AMBIENT TEMPERATURE
1.466
1.452
1.212
1.209
1.206
1.203
1.2
V
= 1.4375 V
V
I
= 1.2 V,
O
O
= 250 mA,
O
PWM Operation
V = 4.8 V
I
V = 4.2 V
V = 3.6 V
I
I
V = 3.6 V
PFM/PWM
I
PWM Operation
1.438
1.423
1.409
V = 2.7 V
I
V = 2.5 V
I
1.197
1.194
V = 3.6 V
PFM/PWM
I
PFM/PWM
1.191
1.188
-40 -20
0
20
40
60
- Ambient Temperature - °C
80
100
0.1
1
I
10
100
1000
T
- Output Current - mA
A
O
Figure 17.
Figure 18.
DC OUTPUT VOLTAGE
vs
MEASURED OUTPUT VOLTAGE
vs
AMBIENT TEMPERATURE
DAC TARGET OUTPUT VOLTAGE
4
3
1.061
1.058
1.055
1.053
1.05
V = 3.6 V,
V
I
= 1.05 V,
T
= 85°C
I
O
A
V = 4.2 V
I
= 100 mA,
I
= 250 mA,
O
O
PWM Operation
PWM Operation
V = 3.6 V
I
T
= 25°C
2
A
V = 2.7 V
I
1
0
1.047
1.045
1.042
1.04
-1
-2
-3
T
= -40°C
A
0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45
- DAC Target Output Voltage - V
-40
-20
0
20
40
60
- Ambient Temperature - °C
80
100
V
T
O
A
Figure 19.
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
QUIESCENT CURRENT
vs
PFM/PWM BOUNDARIES
= 1.2 V
Always PWM
INPUT VOLTAGE
220
210
200
190
55
50
45
40
35
30
25
20
T
= 85oC
V
A
O
180
170
T
= 25oC
A
160
150
140
130
PFM to PWM
Mode Change
120
110
100
90
T
= -40oC
A
80
The switching mode
changes at these borders
70
60
50
40
30
20
15
10
5
PWM to PFM
Mode Change
Always PFM
10
0
0
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 21.
Figure 22.
SHUTDOWN CURRENT
vs
SWITCHING FREQUENCY
vs
INPUT VOLTAGE
INPUT VOLTAGE
2500
2250
7
6.5
6
T
= 85oC
A
I
= 50 mA
O
2000
1750
1500
1250
1000
750
I
= 150 mA
O
I
= 300 mA
= 400 mA
= 500 mA
O
5.5
5
I
O
I
O
I
= 600 mA
= 700 mA
= 800 mA
O
O
T
= 25oC
I
4.5
A
I
O
4
3.5
3
500
T
= -40oC
250
0
A
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
2.3
2.7
3.1
3.5
3.9
4.3
V - Input Voltage - V
4.7
5.1
5.5
V − Input Voltage − V
I
I
Figure 23.
Figure 24.
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TYPICAL CHARACTERISTICS (continued)
rDS(on) P-MOSFET
rDS(on) N-MOSFET
vs
vs
INPUT VOLTAGE
INPUT VOLTAGE
450
425
400
375
350
325
300
275
250
225
200
175
150
125
300
275
250
225
200
175
150
125
100
PWM Mode Operation
PWM Mode Operation
T
= 85°C
T
A
T
= 85°C
A
= 25°C
A
T
= 25°C
A
T
= -40°C
A
T = -40°C
A
75
50
2.5
2.9
3.3
3.7
4.1
4.5
4.9
5.3
2.5
2.9
3.3
3.7
4.1
4.5
4.9
5.3
V - Input Voltage - V
I
V - Input Voltage - V
I
Figure 25.
Figure 26.
LOAD TRANSIENT: 50 mA / 400 mA / 50 mA
PWM OPERATION
LOAD TRANSIENT: 50 mA / 400 mA
PWM OPERATION
V = 3.6 V
I
V
= 1.35 V
O
V = 3.6 V
I
V
= 1.20 V
O
t − Time = 5 ms/div
t − Time = 1 ms/div
Figure 27.
Figure 28.
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TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT: 400 mA / 50 mA
LOAD TRANSIENT: 50 mA / 400 mA / 50 mA
PWM OPERATION
PFM/PWM OPERATION
V = 3.6 V
I
V
= 1.20 V
O
V = 3.6 V
I
V
= 1.20 V
O
t − Time = 10 ms/div
t − Time = 1 ms/div
Figure 29.
Figure 30.
LOAD TRANSIENT: 50 mA / 400 mA
PFM/PWM OPERATION
LOAD TRANSIENT: 400 mA / 50 mA
PFM/PWM OPERATION
V = 3.6 V
V = 3.6 V
I
I
V
= 1.20 V
V
= 1.20 V
O
O
t − Time = 1 ms/div
t − Time = 1 ms/div
Figure 31.
Figure 32.
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TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT: 400 mA / 750 mA / 400 mA
LOAD TRANSIENT: 400 mA / 750 mA
PWM OPERATION
PWM OPERATION
V = 3.6 V
I
V
= 1.20 V
O
V = 3.6 V
I
V
= 1.20 V
O
t − Time = 5 ms/div
t − Time = 1 ms/div
Figure 33.
Figure 34.
LOAD TRANSIENT: 750 mA / 400 mA
PWM OPERATION
LOAD TRANSIENT: 5 mA / 100 mA / 5 mA
PFM/PWM OPERATION
V = 3.6 V
I
V = 3.6 V
I
V
= 1.05 V
O
V
= 1.20 V
O
t − Time = 1 ms/div
t − Time = 250 ms/div
Figure 35.
Figure 36.
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TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT: 5 mA / 100 mA
LOAD TRANSIENT: 100 mA / 5 mA
PFM/PWM OPERATION
PFM/PWM OPERATION
V = 3.6 V
V = 3.6 V
I
I
V
= 1.05 V
V
= 1.05 V
O
O
t − Time = 2.5 ms/div
t − Time = 2.5 ms/div
Figure 37.
Figure 38.
COMBINED LINE/LOAD TRANSIENT
(3.3 V TO 3.9 V, 400 mA TO 800 mA)
PWM OPERATION
LINE TRANSIENT
PWM OPERATION
V
= 1.20 V, I = 50mA
O
O
PWM Mode
IO
500 mA/div
VI
500 mV/div
V
= 1.20 V
O
PWM Mode
t − Time = 50 ms/div
t − Time = 25 ms/div
Figure 39.
Figure 40.
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TYPICAL CHARACTERISTICS (continued)
PWM OPERATION
POWER SAVE MODE OPERATION
V = 3.6 V, V = 1.20 V
I
O
I
= 200 mA
O
V = 3.6 V
I
V
= 1.20 V
O
I
= 30 mA
O
t − Time = 40 ns/div
t − Time = 500 ns/div
Figure 41.
Figure 42.
DYNAMIC VOLTAGE MANAGEMENT
DYNAMIC VOLTAGE MANAGEMENT
V = 3.6 V
I
V
= 1.05 V (PFM) / 1.20 V (PWM)
O
V
= 1.20 V
O
V
= 1.20 V
O
V
= 1.05 V
PFM
PWM
PWM
O
V
= 1.05 V
O
PFM
V = 3.6 V
I
R
= 270 W
R
= 5 W
L
V
= 1.05 V (PFM) / 1.20 V (PWM)
L
O
t − Time = 5 ms/div
t − Time = 25 ms/div
Figure 43.
Figure 44.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE
RAMP CONTROL
START UP
V = 3.6 V
I
V = 3.6 V
I
V
I
= 0.75 V / 1.4375 V (PWM)
O
V
= 1.05 V (PFM)
O
= 0 mA
O
I
= 0 mA
O
V
= 1.4375 V
O
Slew Rate = 4.8 mV/ms
V
= 0.75 V
O
t − Time = 50 ms/div
t − Time = 20 ms/div
Figure 45.
Figure 46.
START UP
V = 3.6 V
I
V
= 1.20 V (PWM)
O
R
= 5 W
L
t − Time = 20 ms/div
Figure 47.
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DETAILED DESCRIPTION
Operation
The TPS6265x is a synchronous step-down converter typically operates at a regulated 6-MHz frequency pulse
width modulation (PWM) at moderate to heavy load currents. At light load currents, the TPS6265x converter
operates in power-save mode with pulse frequency modulation (PFM) and automatic transition into PWM
operation when the load current increases.
The TPS6265x integrates an I2C compatible interface allowing transfers up to 3.4 Mbps. This communication
interface can be used for dynamic voltage scaling with voltage steps down to 12.5 mV, for reprogramming the
mode of operation (PFM or forced PWM) or disable/enabling the output voltage for instance. For more details,
see the I2C interface and register description section.
The converter uses a unique frequency locked ring oscillating modulator to achieve best-in-class load and line
response and allows the use of tiny inductors and small ceramic input and output capacitors. At the beginning of
each switching cycle, the P-channel MOSFET switch is turned on and the inductor current ramps up rising the
output voltage until the main comparator trips, then the control logic turns off the switch.
One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The loop response
to change in VO is essentially instantaneous, which explains its extraordinary transient response. The absence of
a traditional, high-gain compensated linear loop means that the TPS6265x is inherently stable over a range of
small L and CO.
Although this type of operation normally results in a switching frequency that varies with input voltage and load
current, an internal frequency lock loop (FLL) holds the switching frequency constant over a large range of
operating conditions.
Combined with best in class load and line transient response characteristics, the low quiescent current of the
device (ca. 38μA) allows to maintain high efficiency at light load, while preserving fast transient response for
applications requiring tight output regulation.
SWITCHING FREQUENCY
The magnitude of the internal ramp, which is generated from the duty cycle, reduces for duty cycles either set of
50%. Thus, there is less overdrive on the main comparator inputs which tends to slow the conversion down. The
intrinsic maximum operating frequency of the converter is about 10MHz to 12MHz, which is controlled to circa.
6MHz by a frequency locked loop.
When high or low duty cycles are encountered, the loop runs out of range and the conversion frequency falls
below 6MHz. The tendency is for the converter to operate more towards a "constant inductor peak current" rather
than a "constant frequency". In addition to this behavior which is observed at high duty cycles, it is also noted at
low duty cycles.
When the converter is required to operate towards the 6MHz nominal at extreme duty cycles, the application can
be assisted by decreasing the ratio of inductance (L) to the output capacitor's equivalent serial inductance (ESL).
This increases the ESL step seen at the main comparator's feed-back input thus decreasing its propagation
delay, hence increasing the switching frequency.
POWER-SAVE MODE
If the load current decreases, the converter will enter Power Save Mode operation automatically. During
power-save mode the converter operates in discontinous current (DCM) single-pulse PFM mode, which produces
low output ripple compared with other PFM architectures.
When in power-save mode, the converter resumes its operation when the output voltage trips below the nominal
voltage. It ramps up the output voltage with a minimum of one pulse and goes into power-save mode when the
inductor current has returned to a zero steady state. The PFN on-time varies inversely proportional to the input
voltage and proportional to the output voltage giving the regulated switching frequency when is steady-state.
PFM mode is left and PWM operation is entered as the output current can no longer be supported in PFM mode.
As a consequence, the DC output voltage is typically positioned ca 0.5% above the nominal output voltage and
the transition between PFM and PWM is seamless.
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PFM Mode at Light Load
PFM Ripple
Nominal DC Output Voltage
PWM Mode at Heavy Load
Figure 48. Operation in PFM Mode and Transfer to PWM Mode
MODE SELECTION
Depending on the settings of CONTROL1 register the device can be operated in either the regulated frequency
PWM mode or in the automatic PWM and power-save mode. In this mode, the converter operates in a regulated
frequency PWM mode at moderate to heavy loads and in the PFM mode during light loads, which maintains high
efficiency over a wide load current range. For more details, see the CONTROL1 register description.
The regulated frequency PWM mode has the tightest regulation and the best line/load transient performance.
Furthermore, this mode of operation allows simple filtering of the switching frequency for noise-sensitive
applications. In forced PWM mode, the efficiency is lower compared to the power-save mode during light loads.
It is possible to switch from power-save mode (PFM) to forced PWM mode during operation either via the VSEL
signal or by re-programming the CONTROL1 register. This allows adjustments to the converters operation to
match the specific system requirements leading to more efficient and flexible power management.
ENABLE
The device starts operation when EN pin is set high and starts up with the soft start. This signal is gated by the
EN_DCDC bit defined in register VSEL0 and VSEL1. On rising edge of the EN pin, all the registers are reset with
their default values. Enabling the converter's operation via the EN_DCDC bit does not affect internal register
settings. This allows the output voltage to be programmed to other values than the default voltage before starting
up the converter. For more details, see the VSEL0/1 register description.
Pulling the EN pin, VSEL0[6] bit or VSEL1[6] bit low forces the device into shutdown, with a shutdown current as
defined in the electrical characteristics table. In this mode, the P and N-channel MOSFETs are turned off, the
internal resistor feedback divider is disconnected, and the entire internal-control circuitry is switched off. For
proper operation, the EN pin must be terminated and must not be left floating.
In addition, depending on the setting of CONTROL2[6] bit, the device can actively discharge the output capacitor
when it turns off. The integrated discharge resistor has a typical resistance of 15 Ω. The required time to
discharge the output capacitor at VO depends on load current and the output capacitance value.
SOFT START
The TPS6265x has an internal soft-start circuit that limits the inrush current during start-up. This limits input
voltage drops when a battery or a high-impedance power source is connected to the input of the converter.
The soft-start system progressively increases the on-time from a minimum pulse-width of 35ns as a function of
the output voltage. This mode of operation continues for c.a. 100μs after enable. Should the output voltage not
have reached its target value by this time, such as in the case of heavy load, the soft-start transitions to a second
mode of operation.
The converter will then operate in a current limit mode, specifically the P-MOS current limit is set to half the
nominal limit and the N-channel MOSET remains on until the inductor current has reset. After a further 100 μs,
the device ramps up to full current limit operation providing that the output voltage has risen above 0.5V
(approximately). Therefore, the start-up time depends on the output capacitor and load current.
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UNDERVOLTAGE LOCKOUT
The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions. The TPS6265x device
have a UVLO threshold set to 2.05V (typical). Fully functional operation is permitted down to 2.15 V input
voltage.
SHORT-CIRCUIT PROTECTION
The TPS6265x integrates a P-channel MOSFET current limit to protect the device against heavy load or short
circuits. When the current in the P-channel MOSFET reaches its current limit, the P-channel MOSFET is turned
off and the N-channel MOSFET is turned on. The regulator continues to limit the current on a cycle-by-cycle
basis.
As soon as the output voltage falls below ca. 0.4V, the converter current limit is reduced to half of the nominal
value and the PWROK bit is reset. Because the short-circuit protection is enabled during start-up, the device
does not deliver more than half of its nominal current limit until the output voltage exceeds approximately 0.5V.
This needs to be considered when a load acting as a current sink is connected to the output of the converter.
THERMAL SHUTDOWN
As soon as the junction temperature, TJ, exceeds typically 140°C, the device goes into thermal shutdown. In this
mode, the P- and N-channel MOSFETs are turned off. The device continues its operation when the junction
temperature again falls below typically 130°C.
VOLTAGE AND MODE SELECTION
The TPS6265x features a pin-selectable output voltage. VSEL is primarily used to scale the output voltage
between active (VSEL = HIGH) and sleep mode (VSEL = LOW). For maximum flexibility, it is possible to
reprogram the operating mode of the converter (e.g. forced PWM, or auto transition PFM/PWM) associated with
VSEL signal via the I2C interface
VSEL output voltage and mode selection is defined as following:
VSEL = LOW: –– DC/DC output voltage determined by VSEL0 register value. DC/DC mode of operation is
determined by MODE0 bit in CONTROL1 register.
VSEL = HIGH: –– DC/DC output voltage determined by VSEL1 register value. DC/DC mode of operation is
determined by MODE1 bit in CONTROL1 register.
The application processor programs via I2C the output voltages associated with the two states of VSEL signal:
floor (VSEL0) and roof (VSEL1) values. The application processor also writes the DEFSLEW value in the
CONTROL2 register to control the output voltage ramp rate.
These two registers can be continuously updated via I2C to provide the appropriate output voltage according to
the VSEL input. The voltage changes with the selected ramp rate immediately after writing to the VSEL0 or
VSEL1 register.
Table 1 shows the output voltage states depending on VSEL0, VSEL1 registers, and VSEL signal.
Table 1. Dynamic Voltage Scaling Functional Overview
VSEL PIN
Low
VSEL0 REGISTER
No action
VSEL1 REGISTER
No action
OUTPUT VOLTAGE
Floor
Low
Write new value
No action
No action
Change to new value
No change stays at floor voltage
Roof
Low
Write
High
No action
No action
High
Write new value
No action
No action
No change stays at roof voltage
Change to new value
High
Write new value
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In PFM mode, when the output voltage is programmed to a lower value by toggling VSEL signal from high to low,
PWROK is defined as low, while the output capacitor is discharged by the load until the converter starts pulsing
to maintain the voltage within regulation. In multiple-step mode, PWROK is defined as low while the output
voltage is ramping up or down.
Output Voltage
Output Voltage
V
V
Change Initiated
(ROOF)
(ROOF)
Change Initiated
V
V
(FLOOR)
(FLOOR)
PWROK
PWROK
Figure 49. PWROK Functional Behavior
VOLTAGE RAMP CONTROL
The TPS6265x offers a voltage ramp rate control that can operate in two different modes:
•
•
Multiple-Step Mode
Single-Step Mode
The mode is selected via DEFSLEW control bits in the CONTROL2 register.
Single-Step Voltage Scaling Mode (default), DEFSLEW[2:0] = [111]
In single-step mode, the TPS6265x ramps the output voltage with maximum slew-rate when transitioning
between the floor and the roof voltages (switch to a higher voltage).
When switching between the roof and the floor voltages (transition to a lower voltage), the ramp rate control is
dependent on the mode selection (see CONTROL1 register) associated with the target register (Forced PWM or
auto transition PFM/PWM).
Table 2 shows the ramp rate control when transitioning to a lower voltage with DEFSLEW set to immediate
transition.
Table 2. Ramp Rate Control vs. Target Mode
Mode Associated with Target Voltage
Output Voltage Ramp Rate
Forced PWM
Immediate
DC/DC converter stops switching.
Time to ramp down depends on output capacitance and load current
PFM/PWM
For instance, when the output is programmed to transition to a lower voltage with PFM operation enabled, the
TPS6265x ramps down the output voltage without controlling the ramp rate or having intermediate micro-steps.
The required time to ramp down the voltage depends on the capacitance present at the output of the TPS6265x
and on the load current. From an overall system perspective, this is the most efficient way to perform dynamic
voltage scaling.
Multiple-Step Voltage Scaling Mode, DEFSLEW[2:0] = [000] to [110]
In multiple-step mode the TPS6265x controls the output voltage ramp rate regardless of the load current and
mode of operation (e.g. Forced PWM or PFM/PWM). The voltage ramp control is done by adjusting the time
between the voltage micro-steps.
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THEORY OF OPERATION
Serial Interface Description
I2C is a 2-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1,
January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pull-up structures. When the
bus is idle, both SDA and SCL lines are pulled high. All the I2C compatible devices connect to the I2C bus
through open drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal
processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The
master also generates specific conditions that indicate the START and STOP of data transfer. A slave device
receives and/or transmits data on the bus under control of the master device.
The TPS6265x device works as a slave and supports the following data transfer modes, as defined in the
I2C-Bus Specification: standard mode (100 kbps), fast mode (400 kbps), fast mode plus (1 Mbps) and high-speed
mode (up to 3.4 Mbps). The interface adds flexibility to the power supply solution, enabling most functions to be
programmed to new values depending on the instantaneous application requirements. Register contents remain
intact as long as supply voltage remains above 2.1 V (typical).
The data transfer protocol for standard, fast and fast plus modes is exactly the same, therefore, they are referred
to as F/S-mode in this document. The protocol for high-speed mode is different from the F/S-mode, and it is
referred to as HS-mode. The TPS6265x device supports 7-bit addressing; 10-bit addressing and general call
address are not supported.
The TPS6265x device has a 7-bit address with two bits factory programmable allowing up to four dc/dc
converters to be connected to the same bus. The 4 MSBs are 1001 and the LSB is 0.
Standard-, Fast- and Fast-Mode Plus Protocol
The master initiates data transfer by generating a start condition. The start condition is when a high-to-low
transition occurs on the SDA line while SCL is high, see Figure 50. All I2C-compatible devices should recognize a
start condition.
The master then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit R/W
on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires
the SDA line to be stable during the entire high period of the clock pulse, see Figure 51. All devices recognize
the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a
matching address generates an acknowledge, see Figure 52, by pulling the SDA line low during the entire high
period of the ninth SCL cycle. Upon detecting this acknowledge, the master knows that the communication link
with a slave has been established.
The master generates further SCL cycles to either transmit data to the slave (R/W bit 1) or receive data from the
slave (R/W bit 0). In either case, the receiver needs to acknowledge the data sent by the transmitter. An
acknowledge signal can either be generated by the master or by the slave, depending on which one is the
receiver. 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as
necessary.
To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from low to
high while the SCL line is high, see Figure 50. This releases the bus and stops the communication link with the
addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of a stop
condition, all devices know that the bus is released, and they wait for a start condition followed by a matching
address
Attempting to read data from register addresses not listed in this section results in 00h being read out.
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H/S-Mode Protocol
When the bus is idle, both SDA and SCL lines are pulled high by the pull-up devices.
The master generates a start condition followed by a valid serial byte containing HS master code 00001XXX.
This transmission is made in F/S-mode at no more than 400 Kbps. No device is allowed to acknowledge the HS
master code, but all devices must recognize it and switch their internal setting to support 3.4-Mbps operation.
The master then generates a repeated start condition (a repeated start condition has the same timing as the start
condition). After this repeated start condition, the protocol is the same as F/S-mode, except that transmission
speeds up to 3.4 Mbps are allowed. A stop condition ends the HS-mode and switches all the internal settings of
the slave devices to support the F/S-mode. Instead of using a stop condition, repeated start conditions are used
to secure the bus in HS-mode.
Attempting to read data from register addresses not listed in this section results in FFh being read out.
DATA
CLK
S
P
Start
Stop
Condition
Condition
Figure 50. START and STOP Conditions
DATA
CLK
Data Line
Change of Data Allowed
Stable;
Data Valid
Figure 51. Bit Transfer on the Serial Interface
Data Output
by Transmitter
Not Acknowledge
Data Output
by Receiver
Acknowledge
SCL From
Master
1
2
8
9
S
Clock Pulse for
START
Acknowledgement
Condition
Figure 52. Acknowledge on the I2C Bus
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Recognize START or
REPEATED START
Condition
Recognize STOP or
REPEATED START
Condition
Generate ACKNOWLEDGE
Signal
P
SDA
MSB
Acknowledgement
Signal From Slave
Sr
Address
R/W
SCL
1
2
7
8
9
1
2
3 − 8
9
S
or
Sr
Sr
or
P
ACK
ACK
Clock Line Held Low While
Interrupts are Serviced
START or
Repeated START
Condition
STOP or
Repeated START
Condition
Figure 53. Bus Protocol
TPS6265X I2C Update Sequence
The TPS6265x requires a start condition, a valid I2C address, a register address byte, and a data byte for a
single update. After the receipt of each byte, TPS6265x device acknowledges by pulling the SDA line low during
the high period of a single clock pulse. A valid I2C address selects the TPS6265x. TPS6265x performs an update
on the falling edge of the LSB byte.
When the TPS6265x is in hardware shutdown (EN pin tied to ground) the device can not be updated via the I2C
interface. Conversely, the I2C interface is fully functional during software shutdown (EN_DCDC bit = 0).
7
8
8
1
1
1
1
1
1
S
Slave Address
R/W
A
Register Address
A
Data
A
P
“0” Write
A = Acknowledge
S = START condition
P = STOP condition
From Master to TPS6265x
From TPS6265x to Master
Figure 54. "Write" Data Transfer Format in Standard, Fast- and Fast-Plus Modes
7
8
7
8
1
1
1
1
1
1
1
1
1
S
Slave Address
R/W
A
Register Address
A
Sr
Slave Address
R/W
A
Data
A
P
“0” Write
“1” Read
A
A
S
= Acknowledge
= Not Acknowledge
= START condition
From Master to TPS6265x
From TPS6265x to Master
Sr = REPEATED START condition
= STOP condition
P
Figure 55. "Read" Data Transfer Format in Standard, Fast- and Fast-Plus Modes
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F/S Mode
HS Mode
F/S Mode
HS-MASTER CODE
SLAVE ADDRESS
R/W
S
A
Sr
A
REGISTER ADDRESS
A
DATA
A/A
P
Data Transferred
HS Mode Continues
(n x Bytes + Acknowledge)
Sr Slave Address
Figure 56. Data Transfer Format in H/S-Mode
Slave Address Byte
MSB
LSB
X
1
0
0
1
A2
A1
0
The slave address byte is the first byte received following the START condition from the master device. The first
four bits (MSBs) of the address are factory preset to 1001. The next two bits (A2, A1) of the address are device
option dependent. The LSB bit (A0) is also factory preset to 0. Up to 4 TPS6265x type of devices can be
connected to the same I2C-Bus. See the ordering information table for more details.
Register Address Byte
MSB
LSB
0
0
0
0
0
0
D1
D0
Following the successful acknowledgment of the slave address, the bus master sends a byte to the TPS6265x,
which contains the address of the register to be accessed. The TPS6265x contains four 8-bit registers accessible
via a bidirectional I2C-bus interface. All internal registers have read and write access.
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REGISTER DESCRIPTION
VSEL0 REGISTER DESCRIPTION
Memory location: 0x00
Description
Bits
EN_DCDC
FREE
D6
VSM0[5:0]
D7
R/W
1
D5
R/W
X
D4
R/W
X
D3
R/W
X
D2
R/W
X
D1
R/W
X
D0
R/W
X
Memory type
Default value
R/W
0
Bit
Description
EN_DCDC
Enable/Disable DC/DC operation.
This bit gates the external EN pin control signal. This bit is mirrored in VSEL1 register.
0: Device in shutdown regardless of the EN signal.
1: Device enabled when EN is high, disabled when EN is low.
VSM0[5:0]
Output voltage selection bits (floor voltage).(1)
6-bit unsigned binary linear coding.
Output voltage = Minimum output voltage + (VSM0[5:0] x 12.5 mV)
(1) Register value is set according to the default output voltage, see ordering information table.
VSEL1 REGISTER DESCRIPTION
Memory location: 0x01
Description
Bits
EN_DCDC
FREE
D6
VSM1[5:0]
D7
R/W
1
D5
R/W
X
D4
R/W
X
D3
R/W
X
D2
R/W
X
D1
R/W
X
D0
R/W
X
Memory type
Default value
R/W
0
Bit
Description
EN_DCDC
Enable/Disable DC/DC operation.
This bit gates the external EN pin control signal. This bit is mirrored in VSEL0 register.
0: Device in shutdown regardless of the EN signal.
1: Device enabled when EN is high, disabled when EN is low.
VSM1[5:0]
Output voltage selection bits (roof voltage).(1)
6-bit unsigned binary linear coding.
Output voltage = Minimum output voltage + (VSM1[5:0] x 12.5 mV)
(1) Register value is set according to the default output voltage, see ordering information table.
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CONTROL1 REGISTER DESCRIPTION
Memory location: 0x02
Description
Bits
RESERVED RESERVED
FREE
D5
FREE
D4
MODE_CTRL[1:0]
MODE1
D1
MODE0
D0
D7
R
D6
R
D3
R/W
0
D2
R/W
0
Memory type
Default value
R/W
0
R/W
0
R/W
0
R/W
0
0
0
Bit
Description
MODE_CTRL[1:0]
Mode control bits.(1)
00: Operation follows MODE0, MODE1.
01: PFM/PWM operation independent of VSEL signal.
10: Forced PWM operation independent of VSEL signal.
11: PFM/PWM operation independent of VSEL signal.
MODE1
MODE0
VSEL high (roof voltage) operating mode selection bit.
0: Forced PWM.
1: PFM/PWM automatic transition.
VSEL low (floor voltage) operating mode selection bit.
0,1: PFM/PWM automatic transition (no effect).
(1) See the ordering information table to verify the validity of this option.
CONTROL2 REGISTER DESCRIPTION
Memory location: 0x03
Description
Bits
FREE
D7
OUTPUT_DISCHARGE
PWROK
D5
FREE
D4
FREE
DEFSLEW
D6
R/W
1
D3
R/W
0
D2
D1
R/W
1
D0
R/W
1
Memory type
Default value
R/W
0
R/W
0
R/W
0
R/W
1
Bit
Description
Output capacitor auto-discharge control bit.
0: The output capacitor is not actively discharged when the converter is disabled.
OUTPUT_
DISCHARGE
1: The output capacitor is discharged through an internal resistor when the converter is disabled.
PWROK
Power good bit.
0: The output voltage is not within its regulation limits.
1: The output voltage is in regulation.
DEFSLEW
Output voltage slew-rate control bits.
000: 0.15mV/μs
001: 0.3mV/μs
010: 0.6mV/μs
011: 1.2mV/μs
100: 2.4mV/μs
101: 4.8mV/μs
110: 9.6mV/μs
111: Immediate
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APPLICATION INFORMATION
INDUCTOR SELECTION
The TPS6265x series of step-down converters have been optimized to operate with an effective inductance
value in the range of 0.3μH to 1.3μH and with output capacitors in the range of 4.7μF to 10μF. The internal
compensation is optimized to operate with an output filter of L = 0.47μH and CO = 4.7μF. Larger or smaller
inductor values can be used to optimize the performance of the device for specific operation conditions. For more
details, refer to the section "checking loop stability".
The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its dc resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VI or VO.
V
V - V
I
DI
L
O
O
DI =
L
x
DI
L(MAX)
= I +
O(MAX)
V
L x f
2
I
sw
with: fSW = switching frequency (6 MHz typical)
L = inductor value
ΔIL = peak-to-peak inductor ripple current
IL(MAX) = maximum inductor current
(1)
In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e.
quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care
should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing
the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor
size, increased inductance usually results in an inductor with lower saturation current.
The total losses of the coil consist of both the losses in the DC resistance (R(DC)) and the following
frequency-dependent components:
•
•
•
•
The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
Additional losses in the conductor from the skin effect (current displacement at high frequencies)
Magnetic field losses of the neighboring windings (proximity effect)
Radiation losses
The following inductor series from different suppliers have been used with the TPS6265x converters.
Table 3. List of Inductors
MANUFACTURER
SERIES
DIMENSIONS
LQM21PN1R0NGR
LQM21PNR54MG0
LQM21PNR47MG0
LQM2MPN1R0NG0
MDT2012-CX1R0A
MIPS2012D1R0-X2
2.0 x 1.2 x 1.0 max. height
2.0 x 1.2 x 1.0 max. height
2.0 x 1.2 x 1.0 max. height
2.0 x 1.6 x 1.0 max. height
2.0 x 1.2 x 1.0 max. height
2.0 x 1.2 x 1.0 max. height
MURATA
TOKO
FDK
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OUTPUT CAPACITOR SELECTION
The advanced fast-response voltage mode control scheme of the TPS6265x allows the use of tiny ceramic
capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are
recommended. For best performance, the device should be operated with a minimum effective output
capacitance of 1.6μF. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric
capacitors, aside from their wide variation in capacitance over temperature, become resistive at high frequencies.
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the
voltage step caused by the output capacitor ESL and the ripple current flowing through the output capacitor
impedance.
At light loads, the output capacitor limits the output ripple voltage and provides holdup during large load
transitions. A 4.7μF capacitor typically provides sufficient bulk capacitance to stabilize the output during large
load transitions. The typical output voltage ripple is 1.5% of the nominal output voltage VO.
The output voltage ripple during PFM mode operation can be kept small. The PFM pulse is time controlled, which
allows to modify the charge transferred to the output capacitor by the value of the inductor. The resulting PFM
output voltage ripple and PFM frequency depend in first order on the size of the output capacitor and the inductor
value. The PFM frequency decreases with smaller inductor values and increases with larger once. Increasing the
output capacitor value and the effective inductance will minimize the output ripple voltage.
INPUT CAPACITOR SELECTION
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is
required to prevent large voltage transients that can cause misbehavior of the device or interferences with other
circuits in the system. For most applications, a 2.2μF or 4.7μF capacitor is sufficient. If the application exhibits a
noisy or erratic switching frequency, the remedy will probably be found by experimenting with the value of the
input capacitor.
Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the
power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce
ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or could even
damage the part. Additional "bulk" capacitance (electrolytic or tantalum) should in this circumstance be placed
between CI and the power source lead to reduce ringing than can occur between the inductance of the power
source leads and CI.
CHECKING LOOP STABILITY
The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals:
•
•
•
Switching node, SW
Inductor current, IL
Output ripple voltage, VO(AC)
These are the basic signals that need to be measured when evaluating a switching converter. When the
switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the
regulation loop may be unstable. This is often a result of board layout and/or L-C combination.
As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between
the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply
all of the current required by the load. VO immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR
is the effective series resistance of CO. ΔI(LOAD) begins to charge or discharge CO generating a feedback error
signal used by the regulator to return VO to its steady-state value. The results are most easily interpreted when
the device operates in PWM mode.
During this recovery time, VO can be monitored for settling time, overshoot or ringing that helps judge the
converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin.
Because the damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET
rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage range,
load current range, and temperature range.
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LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design. High-speed operation of the
TPS6265x devices demand careful attention to PCB layout. Care must be taken in board layout to get the
specified performance. If the layout is not carefully done, the regulator could show poor line and/or load
regulation, stability and switching frequency issues as well as EMI problems. It is critical to provide a low
inductance, impedance ground path. Therefore, use wide and short traces for the main current paths.
The input capacitor should be placed as close as possible to the IC pins as well as the inductor and output
capacitor. In order to get an optimum ESL step, the output voltage feedback point (FB) should be taken in the
output capacitor path, approximately 1mm away for it. The feed-back line should be routed away from noisy
components and traces (e.g. SW line).
GND
C2
A B
C
VIN
A: EN
B: SCL
C: SDA
Figure 57. Suggested Layout (Top)
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Thermal Information
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
•
•
•
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6265x device is 105°C. The thermal resistance
of the 9-pin CSP package (YFF) is RθJA = 105°C/W. The regulator operation is specified to a maximum ambient
temperature TA of 85°C. Therefore, the maximum power dissipation is about 200mW.
105oC - 85oC
T MAX - T
J
A
= 190 mW
=
P MAX =
105oC/W
D
R
qJA
(2)
PACKAGE SUMMARY
CHIP SCALE PACKAGE
(BOTTOM VIEW)
CHIP SCALE PACKAGE
(TOP VIEW)
A3
B3
C3
A2
A1
B1
C1
YMLLLLS
TPS6265x
D
B2
C2
E
A1
Code:
•
•
•
Y — 2 digit date code
LLLL - lot trace code
S - assembly site code
PACKAGE DIMENSIONS
The dimensions for the YFF-9 package are shown in Table 4. See the package drawing at the end of this data
sheet.
Table 4. YFF-9 Package Dimensions
Packaged Devices
D
E
TPS6265xYFF
1.296 ±0.03 mm
1.322 ±0.03 mm
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PACKAGE OPTION ADDENDUM
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14-Feb-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS62650YFFR
TPS62650YFFT
TPS62651YFFR
TPS62651YFFT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
YFF
YFF
YFF
YFF
9
9
9
9
3000
250
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Mar-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62650YFFR
TPS62651YFFR
TPS62651YFFT
DSBGA
DSBGA
DSBGA
YFF
YFF
YFF
9
9
9
3000
3000
250
180.0
180.0
180.0
8.4
8.4
8.4
1.45
1.45
1.45
1.45
1.45
1.45
0.8
0.8
0.8
4.0
4.0
4.0
8.0
8.0
8.0
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Mar-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62650YFFR
TPS62651YFFR
TPS62651YFFT
DSBGA
DSBGA
DSBGA
YFF
YFF
YFF
9
9
9
3000
3000
250
190.5
190.5
190.5
212.7
212.7
212.7
31.8
31.8
31.8
Pack Materials-Page 2
X: Max = 1372 mm, Min =1272 mm
Y: Max = 1346 mm, Min =1246 mm
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