TPS61094DSSR_技术文档

TPS61094

ZHCSN56C –JANUARY 2021 –REVISED DECEMBER 2021

具有超级电容管理功能的TPS61094 60-nA 静态电流升压转换器

1 特性

3 说明

• 宽电压范围和电流范围

TPS61094 是具有超级电容器管理的 60nA I_Q升压转

换器。该器件可为智能仪表和超级电容器备用电源应用

提供电源解决方案。

– 0.7V 至5.5V 输入电压范围

– 启动时的最小输入电压为1.8V

– 可编程升压输出电压，设置范围为2.7V 至5.4V

– 可编程降压充电终止电压，设置范围为1.7V 至

5.4V

TPS61094 具有宽输入电压范围和高达 5.5V 的输出电

压。当 TPS61094 在降压模式下为超级电容器充电

时，可通过两个外部电阻器对充电电流和终止电压进行

编程。当 TPS61094 在升压模式下工作时，可使用一

个外部电阻器对输出电压进行编程。

– 可编程降压充电输出电流，设置范围为2.5mA

至600mA

• 超低静态电流

在自动降压或升压模式下（EN = 1，MODE = 1），施

加输入电源后，该器件会将输入电压旁路到输出，同时

还能为备用超级电容器充电。当输入电源已断开或低于

输出目标电压时，TPS61094 将进入升压模式，并通过

备用超级电容器调节输出电压。TPS61094 在此模式下

消耗60nA 静态电流。

– 在升压模式或降压充电模式下为60nA

– 在强制旁路模式下为4nA

• 较高的效率和功率容量

– 典型2.0A 的电感器谷值电流限制

– 两个60mΩ(LS)/140mΩ(HS) MOSFET

– 100mΩ旁路开关电阻

– 1MHz 开关频率

TPS61094 支持真关断模式（EN = 0，MODE = 1）和

强制旁路模式（EN = 0，MODE = 0）。在真正关断模

式下，TPS61094 将负载与输入电源完全断开。在支持

强制旁路模式时，TPS61094 通过旁路开关直接将负载

连接到输入电压并且仅消耗 4nA 电流，从而延长电池

寿命。

– 轻负载下采用自动贪睡模式运行

– V_IN= 3V、V_OUT= 3.6V 且I_OUT= 10μA 时效率

高达92.3%

– V_IN= 3V、V_OUT= 3.6V 且I_OUT= 100mA 时效

率高达96.3%

• 由MODE 和EN 引脚控制的四个运行模式

• 丰富的保护特性

器件信息

封装⁽¹⁾

封装尺寸（标称值）

器件型号

– 输出短路保护

– 热关断保护

TPS61094

WSON (12)

2.0mm × 3.0mm

• 2mm × 3mm 12 引脚WSON 封装

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

2 应用

• 燃气表、水表

• 便携式医疗设备

• 能量收集

Vin:

0.7~5.5V

Vout:

2.7~5.4V

Vin:

0.7~5.5 V

Vout:

2.7~5.4 V

VIN

VOUT

OSEL

VIN

SW

VOUT

OSEL

L1

2.2uH

L1

2.2uH

C2

3*22uF

C2

C1

3*22uF

2.2uF

SW

2.2uF

R1

SUP:

1.7~5.4V

SUP

MODE

EN

ICHG

VCHG

GND

SUP

MODE

EN

ICHG

VCHG

GND

Buck/

Boost

Control

Buck/

Boost

Control

Supercap

R2

R3

典型应用电路1

典型应用电路2

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSFH6

TPS61094

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ZHCSN56C –JANUARY 2021 –REVISED DECEMBER 2021

Table of Contents

8.1 Application Information............................................. 21

8.2 Typical Application –3.6-V Output Boost

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4

6.2 ESD Ratings .............................................................. 4

6.3 Recommended Operating Conditions ........................4

6.4 Thermal Information ...................................................4

6.5 Electrical Characteristics ............................................5

6.6 Typical Characteristics................................................8

7 Detailed Description......................................................10

7.1 Overview...................................................................10

7.2 Functional Block Diagram.........................................12

7.3 Feature Description...................................................12

7.4 Device Functional Modes..........................................15

8 Application and Implementation..................................21

Converter with Bypass................................................ 21

9 Power Supply Recommendations................................29

10 Layout...........................................................................30

10.1 Layout Guidelines................................................... 30

10.2 Layout Example...................................................... 30

11 Device and Documentation Support..........................32

11.1 Device Support........................................................32

11.2 Documentation Support.......................................... 32

11.3 接收文档更新通知................................................... 32

11.4 支持资源..................................................................32

11.5 Trademarks............................................................. 32

11.6 Electrostatic Discharge Caution..............................32

11.7 术语表..................................................................... 32

12 Mechanical, Packaging, and Orderable

Information.................................................................... 33

4 Revision History

Changes from Revision B (September 2021) to Revision C (December 2021)

Page

• 更改了标题..........................................................................................................................................................1

• 更新了典型应用...................................................................................................................................................1

• 将“最小1.4A 的电感器谷值电流限制”更改为“典型2.0A 的电感器谷值电流”.............................................1

• 更新了节3 ......................................................................................................................................................... 1

• Add the description about the quiescent current at pass through mode...........................................................18

Changes from Revision A (February 2021) to Revision B (September 2021)

Page

• 将文档状态从“预告信息”更改为“量产数据”................................................................................................ 1

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ZHCSN56C –JANUARY 2021 –REVISED DECEMBER 2021

5 Pin Configuration and Functions

OSEL

VCHG

1

12

MODE

ICHG

2

11

VOUT

EN

3

10

VIN

4

9

8

7

VOUT

AGND

PGND

SW

5

SUP

6

图5-1. 12-Pin WSON DSS Package (Top View)

表5-1. Pin Functions

NAME

I/O⁽¹⁾

DESCRIPTION

NO.

Boost output voltage selection pin. Connect a resistor between this pin and ground to select one of sixteen

output voltages of Boost mode.

1

OSEL

I

Operation mode selection pin. The MODE pin and EN pin work together to set device operation mode.

See 表7-4.

2

MODE

Operation mode selection pin. The MODE pin and EN pin work together to set device operation mode.

See 表7-4.

3

4

5

EN

VIN

SW

PWR IC power supply input

The switching node pin of the converter. It is connected to the drain of the internal low-side power

MOSFET and the source of the internal high-side power MOSFET.

PWR

I

6

7

SUP

Output of buck converter to sense the voltage of the supercap

PGND

AGND

VOUT

PWR Power ground

PWR Signal ground

PWR Output of the device

8

9, 10

Charging current selection pin. Connect a resistor between this pin and ground to select one of sixteen

output currents of Buck mode.

11

12

ICHG

I

Charging voltage selection pin. Connect a resistor between this pin and ground to select one of sixteen

regulation voltages of Buck mode.

VCHG

(1) I = Input, PWR = Power

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ZHCSN56C –JANUARY 2021 –REVISED DECEMBER 2021

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

–0.7

–40

–65

MAX

6.5

8

UNIT

VIN, VOUT, SW, SUP, MODE, EN, OSEL, VCHG, ICHG

Voltage

SW spike at 10 ns

V

SW spike at 1 ns

9

T_J

Operating junction temperature

Storage temperature

125

150

°C

T_stg

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, allpins⁽¹⁾

±2000

V_(ESD)

Electrostatic discharge

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins⁽²⁾

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

0.7

1.8

2.0

–40

0.7

2.2

20

NOM

MAX

5.5

UNIT

V

V_IN

Input voltage

V_OUT

V_SUP

T_J

Boost output voltage

5.4

V

Buck output voltage

5.4

V

Junction temperature

125

2.86

°C

µH

µF

L

Effective inductance

2.2

30

C_IN

Effective input capacitance at the VIN pin

Effective output capacitance at the OUT pin

Effective output capacitance at the SUP pin

C_OUT

C_SUP

2.2

6.4 Thermal Information

TPS61094

DSS 12-PINS

Standard

58.4

TPS61094

DSS 12-PINS

EVM

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

55.3

°C/W

R_θJC(top)

R_θJB

23.0

N/A

55.6

N/A

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

1.6

1.5

Ψ_JT

Y_JB

22.9

22.3

R_θJC(bot)

10.0

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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6.5 Electrical Characteristics

T_J= –40°C to 125°C, V_IN= 2.0 V, V_OUT= 3.6 V, and VSUP = 2.0 V, with an 2.2-μH inductor. Typical values are at T_J= 25°C

(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY

V_IN

Input voltage range

0.7

5.5

1.8

V

Undervoltage lockout (UVLO)

threshold at the VIN pin

V_{IN_UVLO}

V_INrising, T_Jup to 85 °C

1.7

V_SUPrising

0.85

0.6

V

Undervoltage lockout (UVLO)

threshold at the SUP pin

V_{SUP_UVLO}

V_SUPfalling

0.7

IC enabled, no load, no switching, V_IN

Quiescent current into the VIN pin at

Boost mode

= 0.7 V to 5.5 V, V_SUP= V_IN, V_OUT

V_{OUT_REG}+ 0.1 V, T_Jup to 85°C

=

1

60

nA

I_{Q_BOOST}

Quiescent current into the VOUT pin at IC enabled, no load, no switching,

300

Boost mode

V_OUT= 1.8 V to 5.4 V, T_Jup to 85°C

IC enabled, no load, no switching, V_IN

= 1.8 V to 5.5 V, V_SUP= V_{CHG_REG}

0.1 V, T_Jup to 85°C

Quiescent current into the VIN pin at

Buck mode

+

I_{Q_BUCK}

Quiescent current into the SUP pin at IC enabled, no load, no switching,

1

2

nA

Buck mode

V_SUP= 1.7 V to 5.4 V, T_Jup to 85°C

Quiescent current into the VIN pin at

Forced bypass mode

V_EN= 0 V, V_MODE= 0 V, no load, V_IN

V_SUP= 1.8 V to 5.5 V, T_Jup to 85°C

=

50

I_{Q_BYPASS}

Quiescent current into the SUP pin at V_EN= 0 V, V_MODE= 0 V, no load, V_IN

2

Forced bypass mode

V_SUP= 1.8 V to 5.5 V, T_Jup to 85°C

IC disabled, V_IN= 1.8 V to 5.5 V, V_OUT

= 0 V, T_Jup to 85°C

Shutdown current into the VIN pin

100

1

550

250

40

I_SD

IC disabled, V_SUP= 0.7 V to 5.5 V,

V_OUT= 0 V, T_Jup to 85°C

Shutdown current into the SUP pin

V_IN= 1.8 V, V_SW= V_SUP= 1.8 V to 5.5

V, V_OUT= 0 V, no switching, T_J= 25°C

Leakage current into the SW pin (from

SW pin to VOUT)

I_{LKG_SW_VOUT}

V_IN= 1.8 V, V_SW= V_SUP= 1.8 V to 5.5

V, V_OUT= 0 V, no switching, T_Jup to

85 °C

1

250

20

nA

V_IN= 1.8 V, V_SW= V_SUP= 1.8 V to 5.5

V, V_OUT= V_SW, no switching, T_J= 25

°C

Leakage current into the SW pin (from

SW pin to GND)

I_{LKG_SW_GND}

V_IN= 1.8 V, V_SW= V_SUP= 1.8 V to 5.5

V, V_OUT= V_SW, no switching, T_Jup to

85°C

220

BOOST OUTPUT

V_OUT

Output voltage setting range

16 options

V_OUTrising

V_OUTfalling

2.7

1.6

1.5

5.4

1.8

1.7

V

1.7

1.6

Undervoltage lockout (UVLO)

threshold at the VOUT pin

V_{OUT_UVLO}

V_{OUT_PWM_AC}

V_IN= 1.8 V, PWM mode

V_IN= 1.8 V, PFM mode

0%

2%

–2%

Y

V_{OUT_PW}

V_{OUT_PFM_AC}

Output voltage accuracy in Boost

mode

+

M_ACY

Y

1%

V_{OUT_PW}

V_{OUT_SNOOZE}

V_IN= 1.8 V, Snooze mode

+

M_ACY

_ACY

1.5%

I_SHORT

Output short circuit current

190

1.7

300

500

5.4

mA

V

BUCK OUTPUT

V_SUP

Charge voltage range

16 options

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T_J= –40°C to 125°C, V_IN= 2.0 V, V_OUT= 3.6 V, and VSUP = 2.0 V, with an 2.2-μH inductor. Typical values are at T_J= 25°C

(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Charge termination voltage accuracy

in Buck mode

V_{SUP_ACY}

V_{SUP_HYS}

I_{CHG_SET}

0%

2%

–2%

Charge termination voltage hysteresis

in Buck mode

50

2.5

75

100

600

2

mV

mA

Programmable charging current

options

15 options; IC enabled, no load, V_IN=

5 V, V_SUP= 0.8 V to 4 V, T_Jup to 85°C

ICHG = 2.5 mA or 5 mA; V_IN= 5 V,

V_SUP= 0.8 V to 4 V

0

–2

ICHG setting charging current

accuracy

I_{CHG_ACY}

ICHG ≥10 mA; V_IN= 5 V, V_SUP= 0.8

V to 4 V

0%

20%

–20%

IC enabled, no load, V_IN= 1.8 V to 5.5

V, ICHG ≥10 mA, V_SUP> VCHG –

50 mV, T_Jup to 85°C

Terminate charging current at ICHG ≥

10 mA

10

mA

I_{CHG_TERM}

IC enabled, no load, V_IN= 1.8 V to 5.5

Terminate charging current at ICHG <

10 mA

V, ICHG = 2.5 mA or 5 mA, V_SUP

>

2.5

VCHG –50 mV, T_Jup to 85°C

POWER SWITCH

V_OUT= 5.0 V

V_OUT= 3.6 V

V_OUT= 5.0 V

V_OUT= 3.6 V

V_OUT= 5.0 V

V_OUT= 3.6 V

150

180

60

mΩ

R_{DS(on)_HS}

R_{DS(on)_LS}

R_{DS(on)_BYP}

High-side FET on resistance

Low-side FET on resistance

Bypass FET on resistance

70

120

150

CURRENT LIMIT

High side switch valley current limit in

1.7

2

2.6

A

Boost mode

I_{SW_LIM}

High side switch peak current limit in

Buck mode

2.5

250

500

300

A

ICHG = 2.5 mA or 5 mA, V_SUP> 0.8 V

mA

I_PEAK

Inductor peak current at PFM

10 mA ≤ICHG ≤250 mA, V_SUP> 0.8

V

V_IN= 1.8 V to 5.5 V, V_OUT< 0.4 V

V_IN= 3.6 V, V_OUT= 1.8 V

mA

I_SS

Pre-charge current at soft start

500

SWITCHING FREQUENCY

V_IN= V_SUP= 3.6 V, V_OUT= 5.0 V,

PWM mode

1

0.5

80

1

MHz

ns

f_{SW_BOOST}

Switching frequency at Boost mode

V_IN= V_SUP= 1 V, V_OUT= 5.0 V, PWM

mode

t_{OFF_MIN_BOO}

Minimum off time at Boost mode

Switching frequency at Buck mode

V_OUT= 5.0 V

140

150

ST

V_SUP= 3.6 V, V_IN= V_OUT= 5.0 V,

PWM mode

f_{SW_BUCK}

MHz

VOLTAGE MONITORING

Enter Bypass mode when V_IN

≥

V_BYPASS

50

100

50

mV

V_{OUT_TARGET}+ V_{BY_PASS}

V_{BYPASS_HYS}Hysteresis of V_BYPASS

Enter Pass-through mode when

_SUP≥V_OUT+ V_{PASS_THROUGH}

–30

V

V_{PASS_THROU}

GH

Exit Pass-through mode when V_SUP

V_{OUT_TARGET}+ V_{PASS_THROUGH}

<

mV

–100

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T_J= –40°C to 125°C, V_IN= 2.0 V, V_OUT= 3.6 V, and VSUP = 2.0 V, with an 2.2-μH inductor. Typical values are at T_J= 25°C

(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

LOGIC INTERFACE

V_OUT> 1.8 V

0.58

1.0

V

V_{EN_H}

EN logic high threshold

EN logic low threshold

V_OUT< 1.8 V

V_OUT> 1.8 V

0.2

V

V_{EN_L}

V_OUT< 1.8 V

0.45

V

I_{EN_LKG}

R_EN

Leakage current into the EN pin

EN pin pulldown resistor

V_EN= 1.2 V, T_Jup to 85°C

V_EN= 0 V, T_Jup to 85°C

V_OUT> 1.8 V

1

nA

kΩ

V

800

0.58

1.0

V_{MODE_H}

MODE logic high threshold

MODE logic low threshold

V_OUT< 1.8 V

V

V_OUT> 1.8 V

0.2

V

V_{MODE_L}

V_OUT< 1.8 V

0.45

V

I_{MODE_LKG}

R_MODE

Leakage current into MODE pin

MODE pin pulldown resistor

V_MODE= 1.2 V, T_Jup to 85°C

V_MODE= 0 V, T_Jup to 85°C

1

nA

kΩ

800

PROTECTION

T_SD

Thermal shutdown

Junction temperature rising

150

20

°C

T_{SD_HYS}

Thermal shutdown hysteresis

Junction temperature falling below T_SD

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6.6 Typical Characteristics

100

95

90

85

80

75

70

100

95

90

85

80

75

70

65

60

55

V_IN= 0.7 V

V_IN= 1.5 V

V_IN= 3.0 V

V_IN= 3.6 V

V_IN= 4.2 V

V_IN= 1.0 V

V_IN= 1.5 V

V_IN= 2.0 V

V_IN= 2.5 V

65

60

55

1E-6

1E-5

0.0001

0.001

Output Current (A)

0.01

0.1

0.5

1E-6

1E-5

0.0001

0.001

Output Current (A)

0.01

0.1

0.5

effi

V_IN= 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V

V_OUT= 5.0 V

V_IN= 1.0 V, 1.5 V, 2.0 V, 2.5 V

V_OUT= 3.3 V

图6-1. 5.0-V V_OUTEfficiency with Different Inputs

图6-2. 3.3-V V_OUTEfficiency with Different Inputs

in Boost Operation

5.15

5.1

3.4

3.35

3.3

5.05

V_IN= 0.7V

5

V_IN= 1.5V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 1.0V

V_IN= 1.5V

V_IN= 2.0V

V_IN= 2.5V

4.95

3.25

1E-6

1E-5

0.0001

0.001

0.01

0.1

0.5

1E-6

1E-5

0.0001

0.001

0.01

0.1

0.5

Output Current (A)

V_IN= 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2

V_OUT= 5.0 V

V_IN=1.0 V, 1.5 V, 2.0 V, 2.5 V

V_OUT= 3.3 V

图6-3. 5.0-V Load Regulation in Boost Operation

图6-4. 3.3-V Load Regulation in Boost Operation

96

100

95

90

85

80

75

70

65

60

55

50

93

90

87

84

45

40

I_CHG= 2.5 mA

I_CHG= 5.0 mA

I_CHG= 10 mA

I_CHG= 100 mA

I_CHG= 500 mA

Vout=3.0V

35

30

25

20

Vout=3.6V

Vout=4.5V

Vout=5.0V

81

78

1E-6

1E-5

0.0001

0.001

Output Current (A)

0.01

0.1

0.5

0

0.5

1

1.5

2

2.5

V_CHG(V)

3

3.5

4

4.5

5

effi

V_OUT= 3.0 V, 3.6 V, 4.5 V, 5.0 V

V_IN= 2.7 V

I_CHG= 2.5 mA, 5.0 mA, 10 mA, 100 mA,

500 mA

V_IN= 5 V

图6-5. Efficiency with Different Outputs in Boost

Operation

图6-6. 5-V Input Efficiency with Different Charging

current in Buck Operation

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100

90

80

70

60

50

40

I_CHG= 2.5 mA

I_CHG= 5.0 mA

I_CHG= 10 mA

I_CHG= 100 mA

I_CHG= 500 mA

0

0.5

1

1.5

2

2.5

3

3.5

V_CHG(V)

effi

I_CHG= 2.5 mA, 5.0 mA, 10 mA, 100 mA, 500 mA

V_IN= 3.6 V

图6-7. 3.6V Input Efficiency with Different Charging current in Buck Operation

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7 Detailed Description

7.1 Overview

The TPS61094 is a 60-nA quiescent current synchronous bi-directional buck/boost converter with a bypass

switch between the input and output. The TPS61094 can operate with a wide input voltage from 0.7 V to 5.5 V

and output voltage from 2.7 V to 5.4 V. The device provides a ultra-low power solution optimized for applications

that require ultra-low quiescent current, use a supercap or battery as a backup power supply, or both.

The TPS61094 has four operation modes by the EN pin and MODE pin selection:

• Auto buck or boost mode (EN = 1; MODE = 1)

• Forced buck mode (EN = 1; MODE = 0)

• Forced bypass mode (EN = 0; MODE = 0)

• True shutdown mode (EN = 0; MODE = 1)

In Auto buck or Boost mode, the TPS61094 can automatically transform between Buck charging mode and

Boost mode based on the input voltage. When the input voltage is lower than the setting boost regulation

voltage, the TPS61094 generates a regulation voltage from the low input voltage of a supercap or a battery.

When the input voltage is 0.1 V higher than the setting boost regulation voltage, the output voltage of the

TPS61094 equals the input voltage. Meanwhile, the TPS61094 charges the backup supercap by Buck mode.

When the TPS61094 works in Forced buck mode, the TPS61094 connects the output of the device directly to

the input while the buck converter outputs a setting constant current charging a backup supercap. When the

supercap is charged to a pre-set termination voltage, the buck converter stops charging. When the supercap

voltage drops 75 mV below the setting voltage, the buck converter starts charging the supercap again.

In Forced bypass mode, the TPS61094 turns on the bypass MOSFET, thus the output voltage equals to input

voltage. The TPS61094 has approximately 4-nA I_Qin this mode.

In True shutdown mode, the TPS61094 can disconnect the load from the input and SUP pin.

7.1.1 The Configuration of VCHG Pin, ICHG Pin, and OSEL Pin

The TPS61094 supports sixteen internal setting options for charging termination voltage (VCHG), charging

current (ICHG), and output voltage (OSEL) by connecting a resistor between the VCHG, ICHG, or OSEL pin and

ground.

During start-up, when output voltage reaches close to input voltage, the device starts to detect the configuration

conditions of the VCHG, ICHG, and OSEL pins (in that order). The TPS61094 checks the VCHG, ICHG, and

OSEL pins by lowering setting options to higher setting options until the user finds the setting configuration by a

10-μs clock. After detecting the configuration, the TPS61094 latches the charging current in Buck mode, the

charging termination voltage in Buck mode, and the setting output regulation voltage in Boost mode. To save

detection time, TI suggests shorting the VCHG and ICHG pins to ground when Buck mode is not used.

The TPS61094 does not detect the VCHG, ICHG, and OSEL pins during operation, so changing the resistor

during operation does not change the VCHG, ICHG, and OSEL settings. Toggling the EN pin during operation is

one way to refresh the VCHG, ICHG, and OSEL settings.

For proper operation, TI suggests that the setting resistance accuracy must be 1% and the parasitic capacity of

the VCHG, ICHG, and OSEL pins should be less than 10 pF.

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7.1.1.1 OSEL: Output Voltage Selection

In Boost mode operation, the device supports sixteen internally set output voltages by connecting a resistor

between the OSEL pin and ground. 表7-1 lists the output voltage options with respect to resistance.

表7-1. Output Voltage Options

RESISTANCE

V_{OUT_REG}(V)

(KΩ)

0

2.7

3.0

3.3

3.4

9.53

13.0

17.4

22.1

3.45

3.5

3.6

3.7

28.7

49.9

75.0

107

3.8

4.0

4.2

4.5

150

205

4.8

5.0

5.2

5.4

3.09

4.75

6.65

274

open

7.1.1.2 VCHG: Charging Termination Voltage Selection

In Buck mode operation, the device supports sixteen internally set charging termination voltages by connecting a

resistor between the VCHG pin and ground. 表 7-2 lists the termination voltage options with respect to

resistance.

表7-2. Charging Termination Voltage Options

RESISTANCE

V_{CHG_REG}(V)

(KΩ)

0

1.7

2.0

2.2

2.5

9.53

13.0

17.4

22.1

2.6

2.7

28.7

49.9

75.0

107

3.7

4.1

150

205

4.9

5.0

5.1

5.4

3.09

4.75

6.65

3.6

4.15

4.2

274

3.65

open

7.1.1.3 ICHG: Charging Output Current Selection

In Buck mode operation, the device supports sixteen internally-set charging currents by connecting a resistor

between the ICHG pin and ground. 表7-3 lists the charging current options with respect to resistance.

表7-3. Charging Current Options

RESISTANCE

I_CHG(MA)

(KΩ)

0

0 (disabled)

9.53

13.0

17.4

22.1

25

50

28.7

49.9

75.0

107

150

200

250

300

150

205

350

400

500

600

3.09

4.75

6.65

2.5

5

75

274

10

100

open

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7.2 Functional Block Diagram

SW

5

VIN

4

VOUT

9

VSUP VOUT

Undervoltage

Lockout

SUP

6

VOUT

10

VOUT

Gate Driver

Current Sense

PGND

7

PWM Control

Soft Startup

EA

VREF

AGND

MODE

EN

8

2

3

VOUT

OSEL

VCHG

ICHG

1

Logic

ADC

12

11

Thermal

Shutdown

7.3 Feature Description

7.3.1 Undervoltage Lockout

The TPS61094 has a built-in undervoltage lockout (UVLO) circuit to make sure the device works properly. When

the voltage at the VIN pin is above the undervoltage lockout (UVLO) rising threshold (typically 1.7 V), the

TPS61094 can be enabled. After the TPS61094 starts up and the output voltage is above 1.7 V typically, the

TPS61094 can work with SUP pin voltage as low as 0.6 V and input voltage down to 0 V. When the voltage at

the VIN pin is down to 0 V and the voltage at the SUP pin are below the undervoltage lockout falling threshold

(typically 0.6 V), the TPS61094 goes into Shutdown mode to avoid malfunction. In this condition and in Auto

boost mode, the TPS61094 disconnects the bypass switch and high-side switch to prevent the reverse current

from the VOUT pin to the VIN pin and SW pin when the V_OUTvoltage is above 1.6 V.

When the voltages at the VIN pin and SUP pin are below 1.7 V (typical) and the voltage at V_OUTis below 1.6 V

(typical), the TPS61094 goes into Shutdown mode.

7.3.2 Enable and Soft Start

When the voltage at the VIN pin is above the undervoltage lockout (UVLO) rising threshold (typically 1.7 V) and

the EN pin is pulled to logic high voltage, the TPS61094 is enabled and starts ramping up the output voltage.

At Auto boost mode, the TPS61094 starts charging the output capacitor with a 300-mA constant current through

the bypass switch when the output voltage is below 0.5 V. When the output voltages is charged above 0.5 V, the

output current is changed to have output current capability to drive the 3.6-Ω resistance load until the output

voltage reaches close to input voltage. After the output voltage reaches close to the input voltage, the TPS61094

starts to detect the configuration conditions of the VCHG, ICHG, and OSEL pins, then latches the configuration.

According to the configurations and setup, the TPS61094 enters Boost mode or Buck mode. When input voltage

is less than the output voltage setting, the TPS61094 enters Boost mode soft start. The TPS61094 starts

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switching and output ramps up further. The soft-start time in Boost mode varies with the different output

capacitance, load condition, and configuration conditions. When input voltage is higher than the output voltage

setting adding 100 mV, the TPS61094 enters Buck mode soft start. The charging current can increase slowly.

The start-up of Forced buck mode is similar to Buck mode in Auto boost mode except the TPS61094 enters

Buck mode after the output voltage is close to the input voltage and does not need to have the input voltage

higher than the output voltage setting adding 100 mV.

At Forced bypass mode, there is no soft start. The bypass switch is always on and the output is connected to the

input directly.

When the voltage at the EN pin is below 0.2 V and MODE is higher than 0.58 V at output voltage higher than 1.8

V, the internal enable comparator turns the device into True shutdown mode. In True shutdown mode, the device

is entirely turned off. The output is disconnected from the VIN and SUP pin power supply.

7.3.3 Active Pulldown for the EN and MODE Pins

The EN and MODE pins have an active 800-kΩ pulldown resistor to ground. When the EN and MODE pins are

logic high, there is high impedance to make sure there is no high leakage current in these pins. When the EN

and MODE pins are logic low or floating, there is a 800-kΩ pulldown resistor to make sure the EN and MODE

pins cannot be coupled to the logic high by the noise. TI suggests the pulling high capability be stronger than the

800-kΩpulldown resistor when enabling the TPS61094.

7.3.4 Current Limit Operation

The TPS61094 has the peak current limit in Buck mode and valley current limit in Boost mode. Current limit

detection occurs when the high-side MOSFET turns on.

In Buck mode, the TPS61094 has average output current control, so the current limit in Buck mode is hard to

reach.

In Boost mode, when the load current is increased such that the inductor current is above the current limit within

the whole switching cycle time, the off time is increased to allow the inductor current to decrease to this

threshold before the next on time begins (called the frequency foldback mechanism). When the current limit is

reached, the output voltage decreases during further load increase.

The maximum continuous output current (I_OUT(LC)), before entering current limit (CL) operation, can be defined

by 方程式1.

1

≈

’

I_OUT(CL)= 1-D ì I

+

DI_{L P-P}

(

)

LIM

∆

÷

◊

(

)

2

«

(1)

where

• D is the duty cycle.

• ΔI_L(P-P)is the inductor ripple current.

The duty cycle can be estimated by 方程式2.

V

_INì h

D = 1-

V_OUT

(2)

where

• V_OUTis the output voltage of the boost converter.

• V_INis the input voltage of the boost converter.

• ηis the efficiency of the converter; use 90% for most applications.

The peak-to-peak inductor ripple current is calculated by 方程式3.

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V ìD

L ì f_SW

IN

DI_{L P-P}

=

(

)

(3)

where

• L is the inductance value of the inductor.

• f_SWis the switching frequency.

• D is the duty cycle.

• V_INis the input voltage of the boost converter.

7.3.5 Output Short-to-Ground Protection

The TPS61094 starts to limit the output current when the output voltage is below the minimum value (V_IN,

V_{OUT_REG}). The lower the output voltage reaches, the smaller the output current is. When the output voltage is

below 0.5 V, the output current is limited to approximately 200 mA. Once the short circuit is released, the

TPS61094 goes through the soft start-up again to output the regulated voltage.

7.3.6 Thermal Shutdown

The TPS61094 goes into thermal shutdown once the junction temperature exceeds 150°C. When the junction

temperature drops below the thermal shutdown temperature threshold less the hysteresis, typically 130°C, the

device starts operating again.

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7.4 Device Functional Modes

7.4.1 Operation Mode Setting

The TPS61094 has four operation modes by the EN pin and MODE pin selection. 表 7-4 lists the operation

modes of the device with respect to the status of the EN and MODE pin.

表7-4. Operation Modes

MODES

EN

0

MODE

BYPASS

BOOST

BUCK

FUNCTION

Forced bypass

True shutdown

Forced buck

0

1

0

×

Turn on bypass MOSFET, turn off boost/buck, V_OUT= V_IN

Bypass disconnect, turn off boost/buck, V_OUT= 0 V

√

0

×

1

Buck enabled, turn on bypass MOSFET, V_OUT= V_INwhile charging the supercap or

backup battery

√

×

√

Auto buck or

boost

1

×

Buck enable, when V_IN> target V_OUT+100 mV and V_OUT> target V_OUT, supercap is

charged by buck

√

×

Boost and bypass enabled; when V_OUT+ 100 mV > V_IN> target V_OUTand V_OUT= target

V_OUT, V_OUTis from both V_INthrough bypass and supercap by boost.

√

×

Boost enable; when V_IN< target V_OUT, V_OUTis powered from supercap by boost.

7.4.2 Forced Bypass Mode Operation

The TPS61094 works in Forced bypass mode when the voltage at the MODE and EN pins are logic low level

(EN = low, MODE = low). In Forced bypass mode, the bypass switch is turned on, thus the voltage at the VOUT

pin equals the input voltage. The TPS61094 has approximately 4-nA I_Qin Forced bypass mode. The TPS61094

does not detect input voltage and output voltage, so it cannot to protect the reverse current from output to input

in Forced bypass mode.

7.4.3 True Shutdown Mode Operation

The TPS61094 works in True shutdown mode when the voltage at the MODE pin is logic high level and the

voltage at the EN pin is logic low level (EN = low, MODE = high). In True shutdown mode, the TPS61094 is

entirely turned off, the bypass MOSFET and high-side MOSFET are true shutdown, and the output is

disconnected from the VIN pin and SUP pin power supply.

7.4.4 Forced Buck Mode Operation

When the TPS61094 is enabled working in Buck mode (EN = high, MODE = low), the TPS61094 works in

constant output current control scheme with the bypass switch always turned on. The TPS61094 supports

sixteen internally set options for the charging termination voltage (VCHG) and charging current (ICHG) by

connecting a resistor between the VCHG pin, ICHG pin, and ground.

When V_OUTvoltage is above the 1.7-V UVLO rising threshold, the buck function starts working to charge the

supercap at the SUP pin. The typical charging operation (VCHG < VIN-800 mV) works as shown in 图 7-1. At t₀,

the TPS61094 starts to charge the SUP pin by constant current. From t₀to t₁, when the SUP pin voltage is lower

than VSUP_UVLO, typically 0.85 V, the TPS61094 charges the SUP pin by the constant current (ICHG_PRE),

which is smaller than or equal to 250 mA. From t₁to t₂, when the SUP pin voltage reaches VSUP_UVLO, the

TPS61094 charges the SUP pin by constant current (ICHG), which is set by the ICHG pin. At t₂, the SUP pin

voltage reaches VCHG (charging termination voltage) and the TPS61094 reduces the charging current to

ICHG_TERM, the device stops switching until the SUP voltage reaches VCHG without the supercap ESR

voltage drop. This can be avoided if the supercap is not fully charged when the SUP pin reaches VCHG in high

charging current because of supercap ESR voltage drop. The TPS61094 starts switching when the SUP voltage

drops 75 mV below the target value (VCHG).

If VCHG > VIN-500 mV, the TPS61094 will decrease the charging current when the SUP pin voltage is close to

VIN.

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V_SUP

V_CHG

V_{SUP_UVLO}

I_CHG

I_{CHG_TERM}

t₀

t₁

t₂

t₃

图7-1. Typical Charging Operation

1. ICHG_PRE is 250 mA when ICHG is equal or larger than 250 mA; ICHG_PRE is ICHG when ICHG is lower

than 250 mA.

2. ICHG_TERM is 10 mA when ICHG is equal or larger than 10 mA; ICHG_TERM is 2.5 mA when ICHG is

lower than 10 mA.

7.4.5 Auto Buck or Boost Mode Operation

The TPS61094 is enabled working in Auto buck or Boost mode at EN = high and MODE = high.

7.4.5.1 Three States (Boost_on, Buck_on, and Supplement) Transition

In Auto buck or Boost mode operation, there are three states: boost_on, buck_on, and supplement, as shown in

图 7-2 to 图 7-4. The boost_on state occurs when the bypass switch is turned off and the TPS61094 works in

Boost mode to regulate output voltage to the OSEL setting. The buck_on state occurs when the bypass switch is

turned on and the TPS61094 works in Buck mode, charging the SUP pin by an input source according to the

charging current and termination voltage settings at the ICHG and VCHG pin in this situation, which is similar to

the Forced buck mode operation. Supplement mode is the intermediate state when the TPS61094 transfers

between boost_on and buck_on opetation. In Supplement mode, Boost mode is active and the bypass MOSFET

operates as an LDO, the VIN and SUP power source supply the output load together.

Vin

Vout

VIN

SW

VOUT

OSEL

L1

2.2uH

C2

3*22uF

C1

2.2uF

R1

SUP

MODE

EN

ICHG

VCHG

GND

Buck/

Boost

Control

Supercap

R2

R3

图7-2. Typical Boost_on State Circuit

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Vin

Vout

VIN

SW

VOUT

L1

2.2uH

C2

OSEL

C1

3*22uF

2.2uF

R1

SUP

MODE

EN

ICHG

Buck/

Boost

Control

Supercap

R2

VCHG

R3

GND

图7-3. Typical Buck_on State Circuit

Vin

Vout

VIN

VOUT

L1

2.2uH

C2

3*22uF

OSEL

C1

2.2uF

SW

R1

SUP

MODE

EN

ICHG

VCHG

GND

Buck/

Boost

Control

Supercap

R2

R3

图7-4. Typical Supplement State Circuit

The TPS61094 can automatically transfer in these three states based on input voltage and output voltage, as

shown in 图7-5.

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Supplement

4

2

1

3

Boost_on

Buck_on

5

V_IN< V_{OUT_TARGET}+ 50 mV & V_OUT> V_{OUT_TARGET}

图7-5. Three States(Boost_on, Buck_on, and Supplement) Transition

Path 1: The TPS61094 works at buck_on state first. There is a heavy load transient in the output load and the

input source cannot hold it, which makes the output voltage lower than the output target voltage (OSEL pin

setting). The TPS61094 transfers from buck_on to supplement state. Input and SUP power source can supply

the heavy load together.

Path 2: In supplement state, if the input voltage is higher than the output target voltage + 100 mV and the output

voltage is higher than the output target voltage, meaning the input power source can support the output load, the

TPS61094 transfers from supplement to buck_on state.

Path 3: In supplement operation, if the output load is light, the output voltage is higher than the output target

voltage. The TPS61094 transfers from supplement to boost_on state. The TPS61094 has approximately 60-nA

I_Qin Boost mode, which can help the system has higher efficiency at light load.

Path 4: In boost_on state, when the input power source is higher than the output target voltage + 100 mV, the

TPS61094 transfers from boost_on to supplement state.

Path 5: A quick way to transfer from buck_on to boost_on state. At buck_on state, if the load is light and input

voltage is lower than the output target voltage + 100 mV, the TPS61094 can enter boost_on state.

In boost_on mode, when the SUP pin voltage is higher than output target voltage, the TPS61094 enters Pass-

through mode. The TPS61094 stops switching and fully turns on high-side MOSFET. The devices stays in

boost_on (Pass-through mode) until the SUP pin voltage is lower than the output target voltage.

7.4.5.2 Boost, Bypass, and Pass-Through

When the voltage at the VIN pin is below the boost regulation voltage, the bypass switch is turned off. The

TPS61094 works in Boost mode to regulate the output voltage. When the voltage at the VIN pin is 0.1 V above

the boost regulation voltage, the boost operation stops and the bypass switch is turned on. To make the transfer

between Boost mode and Bypass mode smooth, there is a Pass-through mode when the input voltage is close

to thetarget output voltage, as shown in 图7-6. The quiescent current at pass through mode is much higher than

boost mode and bypass mode because the TPS61094 can detect the high-side MOS current.

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Vin & SUP

V_{OUT_TARGET}+ 100mV

V_{OUT_TARGET}+ 50mV

V_{OUT_TARGET}

V_{OUT_TARGET}- 30mV

V_{OUT_TARGET}- 100mV

Boost

Pass-through

Bypass

Pass-through

图7-6. Typical Supplement Operation Circuit

7.4.5.3 PWM, PFM, and Snooze Modes in Boost Operation

The TPS61094 has three switching operation modes in boost operation: PWM mode in moderate-to-heavy load

conditions, pulse frequency modulation (PFM) in light load conditions, and Snooze mode in ultra-low load.

7.4.5.3.1 PWM Mode

The TPS61094 uses a quasi-constant 1.0-MHz frequency pulse width modulation (PWM) at moderate-to-heavy

load current. Based on the input-to-output voltage ratio, a circuit predicts the required on time. At the beginning

of the switching cycle, the low-side FET turns on. The input voltage is applied across the inductor and the

inductor current ramps up. In this phase, the output capacitor is discharged by the load current. When the on

time expires, the low-side FET is turned off and the high-side FET is turned on. The inductor transfers its stored

energy to replenish the output capacitor and supply the load. The inductor current declines because the output

voltage is higher than the input voltage. When the inductor current hits the valley current threshold determined

by the output of the error amplifier, the next switching cycle starts again.

The TPS61094 has a built-in compensation circuit that can accommodate a wide range of input voltage, output

voltage, inductor value, and output capacitor value for stable operation.

7.4.5.3.2 PFM Mode

The TPS61094 integrates the one-pulse PFM to improve efficiency and decrease output ripple at light load.

When the load current decreases, the inductor valley current setting by the output of the error amplifier no longer

regulates the output voltage. When the inductor valley current hits the low limit, the output voltage exceeds the

setting voltage as the load current decreases further. The TPS61094 goes into PFM mode. In PFM mode, the off

time is extended by decreasing load and the TPS61094 regulates output voltage to the PFM reference voltage

(typically 101% × VOUT_REG). The PFM operation reduces the switching losses and improves efficiency at light

load condition by reducing the average switching frequency.

7.4.5.3.3 Snooze Mode

The TPS61094 integrates Snooze mode to decrease quiescent current. If the load current is reduced further, the

boost converter enters into Snooze mode. In Snooze mode, the boost converter ramps up the output voltage

with several switching cycles. Once the output voltage exceeds a setting threshold, the device stops switching

and goes into a sleep status. In sleep status, the device consumes less quiescent current. It resumes switching

when the output voltage is below the setting threshold. It exits Burst mode when the output current can no longer

be supported in this mode. Refer to 图7-7 for Burst mode operation details.

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1.02*V_{OUT_REG}

1.01*V_{OUT_REG}

V_{OUT_REG}

PFM

Snooze mode

PWM

图7-7. Boost Mode Operation

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8 Application and Implementation

备注

以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客户应负责确定

器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。

8.1 Application Information

The TPS61094 is a 60-nA quiescent current synchronous bi-directional buck/boost converter with a bypass

switch between the input and output. The TPS61094 can operate with a wide input voltage from 0.7 V to 5.5 V

and output voltage from 1.8 V to 5.5 V. The device provides an ultra-low power solution optimized for

applications that require ultra-low quiescent current, use a supercap or battery as backup power supply, or both.

The TPS61094 has two typical application circuits. One is the pure boost with bypass function, as shown in 图

8-1, which connects the SUP pin and VIN pin together. The other is the supercap backup application, which

separates the SUP pin and VIN pin, as shown in 图 8-14, which can charge supercap or boost supercap to

power the output.

8.2 Typical Application –3.6-V Output Boost Converter with Bypass

V_IN: 2.7~4.3 V

V_OUT: 3.6 V

VIN

SW

VOUT

OSEL

L1

2.2uH

C2

3*22uF

C1

2.2uF

R1

SUP

MODE

EN

ICHG

VCHG

GND

Buck/

Boost

Control

图8-1. Li-ion Battery to 3.6-V Boost Converter with Bypass

8.2.1 Design Requirements

The design parameters are listed in 表8-1.

表8-1. Design Requirements

PARAMETERS

Input Voltage

VALUES

2.7 V ~ 4.3 V

3.6 V

Output Voltage

Output Current

500 mA

Output Voltage Ripple

± 50 mV

8.2.2 Detailed Design Procedure

8.2.2.1 Programming the Output Voltage

The output voltage is set by the resistor between the OSEL pin and ground. Take 表 7-1 as reference, R₁= 17.4

kΩ for V_OUT= 3.6 V. For proper operation, the resistance accuracy must be 1%. TI suggests to short the VCHG

pin and ICHG pin to ground at the pure boost with bypass application.

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8.2.2.2 Maximum Output Current

The maximum output capability of the TPS61094 is determined by the input-to-output ratio and the current limit

of the boost converter. It can be estimated by 方程式4.

I

V_IN∂(I_LIM

-

^LH)∂ h

2

I_OUT(max)

=

V_OUT

(4)

where

• ηis the conversion efficiency, use 85% for estimation.

• I_LHis the current ripple value.

• I_LIMis the switch current limit.

Minimum input voltage, maximum boost output voltage, and minimum current limit I_LIMshould be used as the

worst case condition for the estimation.

8.2.2.3 Inductor Selection

Because the selection of the inductor affects steady-state operation, transient behavior, and loop stability, the

inductor is the most important component in power regulator design. There are three important inductor

specifications: inductor value, saturation current, and DC resistance (DCR).

The TPS61094 is designed to work with 1-µH or 2.2-µH inductor values. Follow 方程式5 to 方程式7 to calculate

the inductor peak current for the application. To calculate the current in the worst case, use the minimum input

voltage, maximum output voltage, and maximum load current of the application. To have enough design

margins, choose the inductor value with –30% tolerances and low power-conversion efficiency for the

calculation.

In a boost regulator, the inductor DC current can be calculated by 方程式5.

V_OUTìI_OUT

I_{L DC}

=

(

)

V ì h

IN

(5)

where

• V_OUTis the output voltage of the boost converter.

• I_OUTis the output current of the boost converter.

• V_INis the input voltage of the boost converter.

• ηis the power conversion efficiency, use 90% for most applications.

The inductor ripple current is calculated by 方程式6.

V ìD

L ì f_SW

IN

DI_{L P-P}

=

(

)

(6)

where

• D is the duty cycle, which can be calculated by 方程式2.

• L is the inductance value of the inductor.

• f_SWis the switching frequency.

• V_INis the input voltage of the boost converter.

Therefore, the inductor peak current is calculated by 方程式7.

DI_{L P-P}

(

)

I_{L P}= I_{L DC}

+

(

)

(

)

2

(7)

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Normally, it is advisable to work with an inductor peak-to-peak current of less than 40% of the average inductor

current for maximum output current. A smaller ripple from a larger-valued inductor reduces the magnetic

hysteresis losses in the inductor and EMI, but in the same way, load transient response time is increased. The

saturation current of the inductor must be higher than the calculated peak inductor current. 表 8-2 lists the

recommended inductors for the TPS61094.

表8-2. Recommended Inductors for the TPS61094

PART NUMBER

XGL4020-222ME

VCHA042A-2R2MS6

744383560 22

L (µH)

2.2

SATURATION CURRENT (A)

SIZE (LxWxH)

4.0 × 4.0 × 2.1

4.3 x 4.3 x 2.1

4.1 x 4.1 x 2.1

VENDOR⁽¹⁾

Coilcraft

DCR MAX (mΩ)

21.5

23.0

35.0

4.4

4.5

6.2

2.2

Cyntec

2.2

Wurth Elecktronik

(1) See the Third-Party Products disclaimer

8.2.2.4 Output Capacitor Selection

The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. The ripple

voltage is related to capacitor capacitance and its equivalent series resistance (ESR). Assuming a ceramic

capacitor with zero ESR, the minimum capacitance needed for a given ripple voltage can be calculated by 方程

式8.

I_OUTìD_MAX

f_SWì V_RIPPLE

C_OUT

=

(8)

where

• D_MAXis the maximum switching duty cycle.

• V_RIPPLEis the peak-to-peak output ripple voltage.

• I_OUTis the maximum output current.

• f_SWis the switching frequency.

The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are

used. The output peak-to-peak ripple voltage caused by the ESR of the output capacitors can be calculated by

方程式9.

V_RIPPLE(ESR)= I_L(P)ìR_ESR

(9)

Take care when evaluating the derating of a ceramic capacitor under DC bias voltage, aging, and AC signal. For

example, the DC bias voltage can significantly reduce capacitance. A ceramic capacitor can lose more than 50%

of its capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to make sure there is

adequate capacitance at the required output voltage. Increasing the output capacitor makes the output ripple

voltage smaller in PWM mode.

TI recommends using the X5R or X7R ceramic output capacitor in the range of 4-μF to 1000-μF effective

capacitance. The output capacitor affects the small signal control loop stability of the boost regulator. If the

output capacitor is below the range, the boost regulator can potentially become unstable. Increasing the output

capacitor makes the output ripple voltage smaller in PWM mode.

8.2.2.5 Input Capacitor Selection

Multilayer X5R or X7R ceramic capacitors are excellent choices for the input decoupling of the step-up converter

as they have extremely low ESR and are available in small footprints. Input capacitors must be located as close

as possible to the device. While a 10-μF input capacitor is sufficient for most applications, larger values can be

used to reduce input current ripple without limitations. Take care when using only ceramic input capacitors.

When a ceramic capacitor is used at the input and the power is being supplied through long wires, a load step at

the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop

instability or can even damage the part. In this circumstance, place additional bulk capacitance (tantalum or

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aluminum electrolytic capacitor) between ceramic input capacitor and the power source to reduce ringing that

can occur between the inductance of the power source leads and ceramic input capacitor.

8.2.3 Application Curves

Vout (3.6V offset)

20mV/div

Vout (3.6V offset)

20mV/div

SW

2.0V/div

Inductor Current

200mA/div

Inductor Current

500mA/div

Time Scale: 500ns/div

Time Scale: 1.0…s/div

V_IN= 3 V, V_OUT= 3.6 V

I_OUT= 500 mA

V_IN= 3 V, V_OUT= 3.6 V

I_OUT= 50 mA

图8-2. Switching Waveform at Heavy Load

图8-3. Switching Waveform at Medium Load

Vout (3.6V offset)

20mV/div

Vout (3.6V offset)

20mV/div

SW

2.0V/div

SW

2.0V/div

Inductor Current

200mA/div

Inductor Current

200mA/div

Time Scale: 500ms/div

Time Scale: 100…s/div

V_IN= 3 V, V_OUT= 3.6 V

I_OUT= 1 mA

V_IN= 3 V

V_OUT= 3.6 V

Open load

图8-4. Switching Waveform at Light Load

图8-5. Switching Waveform at Open Load

EN

2.0V/div

EN

2.0V/div

Vout

2.0V/div

Vout

2.0V/div

SW

2.0V/div

SW

2.0V/div

Inductor Current

500mA/div

Inductor Current

500mA/div

Time Scale: 20…s/div

Time Scale: 200…s/div

V_IN= 3 V

V_OUT= 3.6 V

V_IN= 3 V

V_OUT= 3.6 V

10-Ωresistance load

图8-6. Start-Up Waveform

图8-7. Shutdown Waveform

24

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Vout (3.6V offset)

50mV/div

Vin

1.0V/div

Inductor Current

500mA/div

Vout (3.6V offset)

50mV/div

Iout

200mA/div

Inductor Current

500mA/div

Time Scale: 50…s/div

V_IN= 3 V

V_OUT= 3.6 V

I_OUT= 500 mA

I_OUT= 10 mA to 400 mA with 20-μs slew rate

V_IN= 2.5 V to 3.5 V with 20-μs slew rate

图8-8. Load Transient at Boost Mode

图8-9. Line Transient

Vout (3.6V offset)

50mV/div

Vin

500mV/div

Inductor Current

500mA/div

Vout (3.6V offset)

20mV/div

Iout

200mA/div

Inductor Current

500mA/div

Time Scale: 1.0ms/div

Time Scale: 200…s/div

V_IN= 3 V

V_OUT= 3.6 V

10-Ωresistance load

I_OUT= 0-A to 500-mA Sweep

V_IN= 2.0-V to 3.5-V Sweep

图8-10. Load Sweep

图8-11. Line Sweep

Vout

1.0V/div

Vout

2.0V/div

SW

2.0V/div

Iin

500mA/div

SW

2.0V/div

Inductor Current

500mA/div

Inductor Current

500mA/div

Time Scale: 200…s/div

Time Scale: 5.0…s/div

V_IN= 3 V

V_OUT= 3.6 V

10-Ωresistance load

V_IN= 3 V

V_OUT= 3.6 V

10-Ωresistance load

图8-12. Output Short Protection (Entry)

图8-13. Output Short Protection (Recover)

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8.2.4 Typical Application –3.3-V Output Boost Converter with Automatic Buck or Boost Function

3.3 V

V_IN: 5 V ± 0.5 V

VIN

SW

VOUT

OSEL

L1

2.2uH

C2

3*22uF

C1

2.2uF

R1

2.6V

SUP

MODE

EN

ICHG

VCHG

GND

Buck/

Boost

Control

Supercap

R2

R3

VIN

图8-14. 5-V Input Source to 3.3-V Boost Converter with Automatic Buck or Boost Function

8.2.4.1 Design Requirements

The design parameters are listed in 表8-3.

表8-3. Design Requirements

PARAMETERS

VALUES

5 V ± 0.5 V

3.3 V

Input Voltage

Output Voltage

Output Current

250 mA

± 50 mV

2.6 V

Output Voltage Ripple

Supercap Charging Termination Voltage

Supercap Charging Current

100 mA

8.2.4.2 Detailed Design Procedure

8.2.4.2.1 Programming the Voltage and Current

The output voltage is set by the resistor between the OSEL pin and ground. Take as reference R₁= 4.75 kΩ for

V_OUT= 3.3 V. The charging termination voltage is set by the resistor between the VCHG pin and ground. Take as

reference R₁= 9.53 kΩ for V_{CHG_REG}= 2.6 V. The charging current is set by the resistor between the ICHG pin

and ground. Take as reference R₁= 22.1 kΩ for I_{CHG_REG}= 100 mA. For proper operation, the resistance

accuracy must be 1%.

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8.2.4.3 Application Curves

Vin

2.0V/div

Vin

2.0V/div

Vsup

1.0V/div

Vsup

1.0V/div

SW

2.0V/div

SW

2.0V/div

Inductor Current

200mA/div

Inductor Current

500mA/div

Time Scale: 1.0…s/div

Time Scale: 10…s/div

V_IN= 5 V

V_SUP= 2 V

V_IN= 5 V

V_SUP= 2 V

图8-15. Switching Waveform at Buck Mode with

图8-16. Switching Waveform at Buck Mode with

ICHG = 2.5 mA

ICHG = 100 mA

Vin

2.0V/div

EN

1.0V/div

Vsup

1.0V/div

Vout

2.0V/div

Iin

500mA/div

SW

2.0V/div

Inductor Current

500mA/div

Inductor Current

500mA/div

Time Scale: 500ns/div

Time Scale: 500…s/div

V_IN= 5 V

V_SUP= 2 V

V_IN= 5 V

V_SUP= 0 V

R_load= 15 Ω

图8-17. Switching Waveform at Buck Mode with

图8-18. Start-Up by EN

ICHG = 500mA

Vin

2.0V/div

EN

1.0V/div

Vout

2.0V/div

Iin

Vout

2.0V/div

500mA/div

Inductor Current

500mA/div

Inductor Current

500mA/div

Time Scale: 500…s/div

Time Scale: 5.0ms/div

V_IN= 5 V

V_SUP= 2 V

I_out= 250 mA

V_IN= 5 V

V_SUP= 0 V

R_load= 15 Ω

图8-20. V_INPower Down and Backup

图8-19. Shutdown by EN

Automatically

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Vout

2.0V/div

Vin

2.0V/div

SW

2.0V/div

Vout

2.0V/div

Iin

1.0A/div

Inductor Current

500mA/div

Inductor Current

500mA/div

Time Scale: 10…s/div

Time Scale: 2.0ms/div

V_IN= 5 V

V_SUP= 2 V

I_out= 250 mA

V_IN= 5 V

V_SUP= 2 V

Open load

图8-21. V_INPower On and Charging Automatically

图8-22. Output Short Protection (Entry)

Vout

2.0V/div

SW

2.0V/div

Iin

500mA/div

Inductor Current

500mA/div

Time Scale: 200…s/div

V_IN= 5 V

V_SUP= 2 V

Open load

图8-23. Output Short Protection (Recover)

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9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 0.7 V to 5.5 V. This input supply

must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk

capacitance can be required in addition to the ceramic bypass capacitors. A typical choice is a tantalum or

aluminum electrolytic capacitor with a value of 100 µF. Output current of the input power supply must be rated

according to the supply voltage, output voltage, and output current of the TPS61094.

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10 Layout

10.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents

and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as

well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground

paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.

10.2 Layout Example

The bottom layer is a large GND plane connected by vias.

AGND

GND

OSEL

VCHG

ICHG

VOUT

1

2

3

4

5

6

12

11

10

9

MODE

EN

VOUT

VIN

VOUT

AGND

PGND

SW

8

SUP

7

GND

VIN

图10-1. Layout: Boost Converter with Bypass Mode

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AGND

GND

OSEL

VCHG

ICHG

VOUT

1

2

3

4

5

6

12

11

10

9

MODE

EN

VOUT

VIN

VOUT

AGND

PGND

SW

8

GND

SUP

7

SUP

GND

SUP

图10-2. Layout: Boost Converter with Automatic Bypass and Buck function

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11 Device and Documentation Support

11.1 Device Support

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此

类产品或服务单独或与任何TI 产品或服务一起的表示或认可。

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, Performing Accurate PFM Mode Efficiency Measurements Application Report

• Texas Instruments, Accurately Measuring Efficiency of Ultra-low-IQ Devices Technical Brief

• Texas Instruments, IQ: What it is, What it isn’t, and How to Use it Techanical Brief

11.3 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

11.4 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

11.5 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.7 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

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12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE MATERIALS INFORMATION

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30-Oct-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS61094DSSR

WSON

DSS

12

3000

180.0

8.4

2.25

3.25

1.05

4.0

8.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

30-Oct-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

WSON DSS 12

SPQ

Length (mm) Width (mm) Height (mm)

210.0 185.0 35.0

TPS61094DSSR

3000

Pack Materials-Page 2

PACKAGE OUTLINE

DSS0012B

WSON - 0.8 mm max height

SCALE 4.500

PLASTIC SMALL OUTLINE - NO LEAD

2.1

1.9

A

B

0.35

0.25

PIN 1 INDEX AREA

0.3

0.2

3.1

2.9

DETAIL

OPTIONAL TERMINAL

TYPICAL

C

0.8 MAX

SEATING PLANE

0.08 C

1

0.1

(0.2) TYP

SYMM

0.05

0.00

EXPOSED

THERMAL PAD

6

7

SEE TERMINAL

DETAIL

2X

13

SYMM

2.5

2.65 0.1

1

12

10X 0.5

0.3

12X

0.2

0.1

0.05

0.35

0.25

12X

PIN 1 ID

(OPTIONAL)

C A B

C

4218908/A 01/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

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EXAMPLE BOARD LAYOUT

DSS0012B

WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

(1)

12X (0.5)

SYMM

1

12

12X (0.25)

13

SYMM

(2.65)

10X (0.5)

(R0.05) TYP

(1.075)

(

0.2) VIA

TYP

7

6

(1.9)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:25X

0.05 MIN

ALL AROUND

EXPOSDE METAL

EXPOSED METAL

0.05 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4218908/A 01/2017

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGN

DSS0012B

WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

EXPOSED METAL

TYP

12X (0.5)

SYMM

1

13

12

12X (0.25)

(0.685)

SYMM

10X (0.5)

2X (1.17)

(R0.05) TYP

7

6

2X (0.95)

(1.9)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 13:

83% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:25X

4218908/A 01/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

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重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

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型号：	TPS61094DSSR
厂家：	TEXAS INSTRUMENTS
描述：	具有旁路模式的 60nA 静态电流双向降压/升压转换器 \| DSS \| 12 \| -40 to 125 升压转换器
文件：	总41页 (文件大小：5625K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS61094DSSR [TI]

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