TPS563200DDCT [TI]
采用 SOT-23 封装、具有高级 Eco-Mode™ 的 17V 输入、3A 同步降压稳压器 | DDC | 6 | -40 to 125;
| 型号： | TPS563200DDCT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 SOT-23 封装、具有高级 Eco-Mode™ 的 17V 输入、3A 同步降压稳压器 | DDC | 6 | -40 to 125 开关 控制器 开关式稳压器 开关式控制器 光电二极管 输出元件 电源电路 开关式稳压器或控制器 |
| 文件： | 总29页 (文件大小：1390K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
TPS56x200 采用 SOT-23 封装的 4.5V 至 17V 输入，2A/3A 同步降压稳压
器
1 特性
3 说明
1
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•
•
•
D-CAP2™ 模式控制，具有 650kHz 开关频率
TPS562200 和 TPS563200 是简单且易于使用的
2A/3A 同步降压转换器，它们均采用 SOT-23 封装。
输入电压范围：4.5V 至 17V
输出电压范围：0.76V 至 7V
此器件被优化为使用尽可能少的外部组件即可运行，并
且可以实现低待机电流。
集成 122mΩ 和 72mΩ 场效应晶体管 (FET)
('562200)
这些开关模式电源 (SMPS) 器件采用 D-CAP2 模式控
制，从而提供快速瞬态响应，并且在无需外部补偿组件
的情况下支持诸如高分子聚合物等低等效串联电阻
(ESR) 输出电容器以及超低 ESR 陶瓷电容器。
•
•
•
•
•
•
•
集成 68mΩ 和 39mΩ FET ('563200)
高级 Eco-mode™ 脉冲跳跃
的低关断电流（低于 10µA）
1% 反馈电压精度 (25°C)
从预偏置输出电压中启动
逐周期断续过流限制
TPS562200 和 TPS563200 可在高级 Eco-mode 下运
行，从而能在轻载运行期间保持高效率。 此类器件采
用 6 引脚 1.6mm x 2.9mm SOT (DDC) 封装，工作环
境温度范围为 –40°C 到 85°C。
非锁存过压保护 (OVP)，欠压闭锁 (UVLO) 和热关
断 (TSD) 保护
•
固定软启动时间：1ms
器件信息(1)
2 应用
部件号
封装
封装尺寸（标称值）
TPS562200
TPS563200(2)
•
•
•
•
数字电视电源
SOT (6)
1.60mm x 2.90mm
高清 Blu-ray Disc™ 播放器
网络家庭终端设备
(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。
(2) 产品预览
数字机顶盒 (STB)
4 简化电路原理图
TPS562200 效率
100
90
80
TPS562200
TPS563200
LO
70
VOUT = 1.8 V
3
2
6
1
VIN
VOUT
CO
VIN
SW
VBST
GND
60
50
40
30
20
10
0
VOUT = 3.3 V
5
4
EN
EN
CIN
VOUT
CBST
VFB
VOUT = 5 V
RFB1
RFB2
0.001
0.01
0.1
1
10
C007
IOUT - Output Current (A)
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLVSCB0
TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
www.ti.com.cn
目录
8.2 Functional Block Diagrams ..................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 12
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ................................................ 13
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
简化电路原理图........................................................ 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ..................................... 4
7.2 Handling Ratings ...................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 5
7.7 Typical Characteristics TPS562200.......................... 6
7.8 Typical Characteristics TPS563200.......................... 8
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
9
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 器件和文档支持 ..................................................... 22
12.1 相关链接................................................................ 22
12.2 商标....................................................................... 22
12.3 静电放电警告......................................................... 22
12.4 术语表 ................................................................... 22
13 机械封装和可订购信息 .......................................... 22
8
5 修订历史记录
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2014) to Revision B
Page
•
•
•
•
•
•
•
•
•
数据表标题从：4.5V 至 17V 输入，2A 同步降压.. 更改为：4.5V 至 17V 输入，2A/3A 同步降压.. ....................................... 1
更改了数据表以符合最新的 Ti 格式 ........................................................................................................................................ 1
器件编号从 TPS563209 更改为 TPS563200 ......................................................................................................................... 1
已添加特性：集成 68mΩ 和 39mΩ FET ('563200)................................................................................................................. 1
已将特性从：2% 反馈电压精度 (25°C) 更改为：1% 反馈电压精度 (25°C)............................................................................ 1
Added the Timing Requirements table .................................................................................................................................. 5
Added Table 1 ..................................................................................................................................................................... 13
Changed Table 2 ................................................................................................................................................................. 13
Deleted sentence following Table 2 "For higher output voltages, additional phase boost can be achieved by adding
a feed forward capacitor (C7) in parallel with R2."............................................................................................................... 14
•
•
Added Application Information for the TPS563200 device .................................................................................................. 17
Added Table 3 ..................................................................................................................................................................... 17
Changes from Original (January 2014) to Revision A
Page
•
器件状态从：产品预览更改为：生产 ...................................................................................................................................... 1
2
Copyright © 2014, Texas Instruments Incorporated
TPS562200, TPS563200
www.ti.com.cn
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
6 Pin Configuration and Functions
TPS562200, TPS563200
DDC Package
Top View
GND
1
VBST
6
SW
EN
2
5
VFB
3
VIN
4
Pin Functions
PIN
NUMBER
DESCRIPTION
NAME
GND
Ground pin Source terminal of low-side power NFET as well as the ground terminal for controller circuit.
Connect sensitive VFB to this GND at a single point.
1
SW
2
3
4
5
6
Switch node connection between high-side NFET and low-side NFET.
VIN
Input voltage supply pin. The drain terminal of high-side power NFET.
VFB
EN
Converter feedback input. Connect to output voltage with feedback resistor divider.
Enable input control. Active high and must be pulled up to enable the device.
Supply input for the high-side NFET gate drive circuit. Connect a 0.1µF capacitor between VBST and SW pins.
VBST
Copyright © 2014, Texas Instruments Incorporated
3
TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–2
UNIT
MAX
VIN, EN
19
25
V
V
VBST
VBST (10 ns transient)
27
V
Input voltage range
VBST (vs SW)
6.5
6.5
19
V
VFB
V
SW
V
SW (10 ns transient)
–3.5
–40
21
V
Operating junction temperature, TJ
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–55
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
–2
2
kV
V
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins(2)
–500
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN
Supply input voltage range
VBST
4.5
–0.1
–0.1
–0.1
–0.1
–0.1
–1.8
–3.5
–40
17
23
26
6
V
VBST (10 ns transient)
VBST(vs SW)
VI
Input voltage range
EN
17
5.5
17
20
85
V
VFB
SW
SW (10 ns transient)
TA
Operating free-air temperature
°C
UNITS
°C/W
7.4 Thermal Information
TPS562200
DDC (6 PINS)
109.2
TPS563200
DDC (6 PINS)
87.9
(1)
THERMAL METRIC
RθJA
RθJCtop
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
44.5
42.2
57.3
13.6
Junction-to-top characterization parameter
Junction-to-board characterization parameter
2.3
1.9
ψJB
60.4
13.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2014, Texas Instruments Incorporated
TPS562200, TPS563200
www.ti.com.cn
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
7.5 Electrical Characteristics
over operating free-air temperature range, VIN = 12V (unless otherwise noted)
PARAMETER
SUPPLY CURRENT
TEST CONDITIONS
MIN
TYP
MAX UNIT
TPS562200
TPS563200
230
190
3
330
µA
Operating – non-switching
supply current
VIN current, TA = 25°C, EN = 5V,
VFB = 0.8 V
I(VIN)
290
I(VINSDN) Shutdown supply current
VIN current, TA = 25°C, EN = 0 V
10
µA
LOGIC THRESHOLD
VEN(H)
VEN(L)
REN
EN high-level input voltage
EN low-level input voltage
EN pin resistance to GND
EN
1.6
V
V
EN
0.6
VEN = 12 V
225
450
772
900
kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
TA = 25°C, VO = 1.05 V, IO = 10mA,
Eco-mode™ operation
mV
VFB(TH)
VFB threshold voltage
TA = 25°C, VO = 1.05 V, continuous mode operation
VFB = 0.8V, TA = 25°C
758
765
0
772
mV
µA
I(VFB)
VFB input current
±0.1
MOSFET
TPS562200
122
68
mΩ
mΩ
mΩ
mΩ
RDS(on)h
High side switch resistance
Low side switch resistance
TA = 25°C, VBST – SW = 5.5 V
TA = 25°C
TPS563200
TPS562200
TPS563200
72
RDS(on)l
39
CURRENT LIMIT
Iocl Current limit
TPS562200
TPS563200
2.5
3.5
3.2
4.2
4.3
5.3
A
A
(1)
DC current, VOUT = 1.05 V, LOUT = 2.2 µF
THERMAL SHUTDOWN
Thermal shutdown
Shutdown temperature
Hysteresis
155
35
TSDN
°C
threshold(1)
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP
Output OVP threshold
OVP Detect (L > H)
125%
65%
x1.7
VUVP
Output Hiccup threshold
Output Hiccup enable delay
Hiccup detect (H > L)
Relative to soft-start time
tUVPEN
UVLO
Wake up VIN voltage
Hysteresis VIN voltage
3.45
0.13
3.75
0.32
4.05
0.55
UVLO
UVLO threshold
V
(1) Not production tested
7.6 Timing Requirements
MIN
TYP
MAX
UNIT
ON-TIME TIMER CONTROL
tON
On time
VIN = 12 V, VO = 1.05 V
150
260
ns
ns
tOFF(MIN)
SOFT START
tss
Minimum off time
TA = 25°C, VFB = 0.5 V
310
1.3
Soft-start time
Internal soft-start time
0.7
1
ms
Copyright © 2014, Texas Instruments Incorporated
5
TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
www.ti.com.cn
7.7 Typical Characteristics TPS562200
VIN = 12 V (unless otherwise noted).
400
350
300
250
200
150
100
50
6
5
4
3
2
1
0
0
±50
0
50
100
150
±50
0
50
100
150
C001
C002
TJ - Junction Temperature (C)
TJ - Junction Temperature (C)
EN = 0 V
Figure 1. Supply Current vs Junction Temperature
Figure 2. VIN Shutdown Current vs
Junction Temperature
0.780
60
50
40
30
20
10
0
0.775
0.770
0.765
0.760
0.755
0.750
±10
±50
0
50
100
150
0
3
6
9
12
15
18
C003
C004
TJ - Junction Temperature (C)
EN Input Voltage (V)
IO = 1 A
Figure 3. VFB Voltage vs Junction Temperature
Figure 4. EN Current vs EN Voltage
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
VOUT = 1.8 V
VOUT = 1.8 V
VOUT = 3.3 V
VOUT = 3.3 V
VOUT = 5 V
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
C007
C008
IOUT - Output Current (A)
IOUT - Output Current (A)
Figure 5. Efficiency vs Output Current
Figure 6. Efficiency vs Output Current (VIN = 5 V)
6
Copyright © 2014, Texas Instruments Incorporated
TPS562200, TPS563200
www.ti.com.cn
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
Typical Characteristics TPS562200 (continued)
VIN = 12 V (unless otherwise noted).
3
800
750
700
650
600
550
500
VOUT = 1.8 V
VOUT = 5 V
2
VOUT = 3.3 V
VOUT = 0.76 V to 3.3 V
2
VOUT = 5 V
1
VOUT = 1.2 V
VOUT = 7 V
VOUT = 1.05 V
1
0
0
25
50
75
100
4
6
8
10
12
14
16
18
C009
C010
TA - Ambient Temperature (C)
VIN - Input Voltage (V)
IOUT = 500 mA
Figure 8. Switching Frequency vs Input Voltage
Figure 7. Output Current vs Ambient Temperature
800
700
600
500
400
300
200
100
0
VOUT = 3.3 V
VOUT = 1.8 V
VOUT = 1.05 V
0.01
0.10
1.00
10.00
C011
IO - Output Current (A)
Figure 9. Switching Frequency vs Output Current
Copyright © 2014, Texas Instruments Incorporated
7
TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
www.ti.com.cn
7.8 Typical Characteristics TPS563200
VIN = 12 V (unless otherwise noted).
400
350
300
250
200
150
100
50
6
5
4
3
2
1
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Junction Temperature (qC)
Junction Temperature (qC)
D037
D038
EN = 0 V
Figure 10. Supply Current vs Junction Temperature
Figure 11. VIN Shutdown Current vs
Junction Temperature
60
0.780
50
40
30
20
10
0
0.775
0.770
0.765
0.760
0.755
0.750
±10
0
3
6
9
12
15
18
-50
-25
0
25
50
75
100
C019
EN Input Voltage (V)
Junction Temperature (qC)
D039
IO = 1 A
Figure 13. EN Current vs EN Voltage
Figure 12. VFB Voltage vs Junction Temperature
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VOUT = 5V
VOUT = 3.3V
VOUT = 1.8V
VOUT = 5V
VOUT = 3.3V
0.001
0.01 0.02 0.05 0.1 0.2
Output Current (A)
0.5
1
2
3 45
0.001
0.01 0.02 0.05 0.1 0.2
Output Current (A)
0.5
1
2 3 45
D040
D041
Figure 14. Efficiency vs Output Current
Figure 15. Efficiency vs Output Current (VIN = 5 V)
8
Copyright © 2014, Texas Instruments Incorporated
TPS562200, TPS563200
www.ti.com.cn
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
Typical Characteristics TPS563200 (continued)
VIN = 12 V (unless otherwise noted).
4
800
750
700
650
600
550
500
3
2
1
VO = 0.76 V to 3.3 V
VO = 5 V
VO = 7 V
VO = 1.05 V
VO = 7 V
0
0
25
50
75
100
4
6
8
10
12
14
16
18
Junction Temperature (qC)
Input Voltage (V)
D042
D043
IOUT = 1 A
Figure 16. Output Current vs Ambient Temperature
Figure 17. Switching Frequency vs Input Voltage
900
VO = 1.05 V
VO = 7 V
750
600
450
300
150
0
0.001
0.01 0.02 0.05 0.1 0.2
IO - Output Current (A)
0.5
1
2 3 45
D044
Figure 18. Switching Frequency vs Output Current
Copyright © 2014, Texas Instruments Incorporated
9
TPS562200, TPS563200
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
www.ti.com.cn
8 Detailed Description
8.1 Overview
The TPS562200 and TPS563200 are 2-A and 3-A synchronous step-down converters. The proprietary D-
CAP2™mode control supports low ESR output capacitors such as specialty polymer capacitors and multi-layer
ceramic capacitors without complex external compensation circuits. The fast transient response of D-CAP2™
mode control can reduce the output capacitance required to meet a specific level of performance.
8.2 Functional Block Diagrams
EN
5
3
VIN
+
UVP
VUVP
Hiccup
VREG5
Control Logic
Regulator
UVLO
+
OVP
VOVP
4
VFB
VBST
6
2
PWM
Voltage
Reference
Ref
SS
+
+
HS
Soft Start
SW
Ton
One-Shot
XCON
VREG5
LS
TSD
OCL
threshold
OCL
+
1
GND
+
ZC
Figure 19. Functional Block Diagram: TPS562200 and TPS563200
10
Copyright © 2014, Texas Instruments Incorporated
TPS562200, TPS563200
www.ti.com.cn
ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
8.3 Feature Description
8.3.1 The Adaptive On-Time Control and PWM Operation
The main control loop of the TPS562200 and TPS563200 are adaptive on-time pulse width modulation (PWM)
controller that supports a proprietary D-CAP2™ mode control. The D-CAP2™ mode control combines adaptive
on-time control with an internal compensation circuit for pseudo-fixed frequency and low external component
count configuration with both low ESR and ceramic output capacitors. It is stable even with virtually no ripple at
the output.
At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is turned off after internal one
shot timer expires. This one shot duration is set proportional to the converter input voltage, VIN, and inversely
proportional to the output voltage, VO, to maintain a pseudo-fixed frequency over the input voltage range, hence
it is called adaptive on-time control. The one-shot timer is reset and the high-side MOSFET is turned on again
when the feedback voltage falls below the reference voltage. An internal ramp is added to reference voltage to
simulate output ripple, eliminating the need for ESR induced output ripple from D-CAP2™ mode control.
8.3.2 Advanced Eco-Mode™ Control
The TPS562200 and TPS563200 are designed with Advanced Eco-mode™ to maintain high light load efficiency.
As the output current decreases from heavy load condition, the inductor current is also reduced and eventually
comes to point that its rippled valley touches zero level, which is the boundary between continuous conduction
and discontinuous conduction modes. The rectifying MOSFET is turned off when the zero inductor current is
detected. As the load current further decreases, the converter runs into discontinuous conduction mode. The on-
time is kept almost the same as it was in the continuous conduction mode so that it takes longer time to
discharge the output capacitor with smaller load current to the level of the reference voltage. This makes the
switching frequency lower, proportional to the load current, and keeps the light load efficiency high. The transition
point to the light load operation IOUT(LL) current can be calculated in Equation 1.
V
IN - VOUT ´ V
)
(
1
OUT
IOUT(LL)
=
´
2´L ´ ƒSW
V
IN
(1)
8.3.3 Soft Start and Pre-Biased Soft Start
The TPS562200 and TPS563200 have an internal 1 ms soft-start. When the EN pin becomes high, the internal
soft-start function begins ramping up the reference voltage to the PWM comparator. If the output capacitor is pre-
biased at startup, the devices initiate switching and start ramping up only after the internal reference voltage
becomes greater than the feedback voltage VFB. This scheme ensures that the converters ramp up smoothly
into regulation point.
8.3.4 Current Protection
The output overcurrent limit (OCL) is implemented using a cycle-by-cycle valley detect control circuit. The switch
current is monitored during the OFF state by measuring the low-side FET drain to source voltage. This voltage is
proportional to the switch current. To improve accuracy, the voltage sensing is temperature compensated.
During the on time of the high-side FET switch, the switch current increases at a linear rate determined by VIN,
VOUT, the on-time and the output inductor value. During the on time of the low-side FET switch, this current
decreases linearly. The average value of the switch current is the load current IOUT. If the monitored current is
above the OCL level, the converter maintains low-side FET on and delays the creation of a new set pulse, even
the voltage feedback loop requires one, until the current level becomes OCL level or lower. In subsequent
switching cycles, the on-time is set to a fixed value and the current is monitored in the same manner. If the over
current condition exists consecutive switching cycles, the internal OCL threshold is set to a lower level, reducing
the available output current. When a switching cycle occurs where the switch current is not above the lower OCL
threshold, the counter is reset and the OCL threshold is returned to the higher value.
There are some important considerations for this type of over-current protection. The load current is higher than
the over-current threshold by one half of the peak-to-peak inductor ripple current. Also, when the current is being
limited, the output voltage tends to fall as the demanded load current may be higher than the current available
from the converter. This may cause the output voltage to fall. When the VFB voltage falls below the UVP
threshold voltage, the UVP comparator detects it. Then, the device shuts down after the UVP delay time
(typically 14 µs) and re-start after the hiccup time (typically 12 ms).
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Feature Description (continued)
When the overcurrent condition is removed, the output voltage returns to the regulated value.
8.3.5 Over Voltage Protection
TPS562200 and TPS563200 detect overvoltage condition by monitoring the feedback voltage (VFB). When the
feedback voltage becomes higher than 125% of the target voltage, the OVP comparator output goes high and
both the high-side MOSFET driver and the low-side MOSFET driver turn off. This function is non-latch operation.
8.3.6 UVLO Protection
Undervoltage lock out protection (UVLO) monitors the internal regulator voltage. When the voltage is lower than
UVLO threshold voltage, the device is shut off. This protection is non-latching.
8.3.7 Thermal Shutdown
The device monitors the temperature of itself. If the temperature exceeds the threshold value (typically 155°C),
the device is shut off. This is a non-latch protection
8.4 Device Functional Modes
8.4.1 Normal Operation
When the input voltage is above the UVLO threshold and the EN voltage is above the enable threshold, the
TPS562200 and TPS563200 can operate in their normal switching modes. Normal continuous conduction mode
(CCM) occurs when the minimum switch current is above 0 A. In CCM, the TPS562200 and TPS563200 operate
at a quasi-fixed frequency of 650 kHz.
8.4.2 Eco-mode Operation
When the TPS562200 and TPS563200 are in the normal CCM operating mode and the switch current falls to 0
A, the TPS562200 and TPS563200 begin operating in pulse skipping eco-mode. Each switching cycle is followed
by a period of energy saving sleep time. The sleep time ends when the VFB voltage falls below the eco-mode
threshold voltage. As the output current decreases the perceived time between switching pulses increases.
8.4.3 Standby Operation
When the TPS562200 and TPS563200 are operating in either normal CCM or eco-mode, they may be placed in
standby by asserting the EN pin low.
12
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9 Application and Implementation
9.1 Application Information
The TPS562200 and TPS563200 are typically used as step down converters, which convert a voltage from 4.5V
- 17V to a lower voltage. Webench software is available to aid in the design and analysis of circuits
9.2 Typical Applications
9.2.1 TPS562200 4.5-V to 17-V Input, 1.05-V Output Converter
U1
L1 2.2 uH
TPS562200
VOUT = 1.05 V, 2 A
VIN = 4.5 V to 17 V
3
5
4
2
6
1
VIN
VIN
EN
SW
VBST
GND
VOUT
C4
R1 10.0k
R2
3.74k
EN
C1
10µF
C2
10µF
C3
C5
22µF
C6
22µF
0.1µF
VFB
R3
10.0k
Not Installed
Figure 20. TPS562200 1.05V/2A Reference Design
9.2.1.1 Design Requirements
To begin the design process, the user must know a few application parameters:
Table 1. Design Parameters
PARAMETER
Input voltage range
Output voltage
VALUE
4.5 V to 17V
1.05V
Output current
2A
Output voltage ripple
20mVpp
9.2.1.2 Detailed Design Procedures
9.2.1.2.1 Output Voltage Resistors Selection
The output voltage is set with a resistor divider from the output node to the VFB pin. It is recommended to use
1% tolerance or better divider resistors. Start by using Equation 2 to calculate VOUT
.
To improve efficiency at light loads consider using larger value resistors, too high of resistance will be more
susceptible to noise and voltage errors from the VFB input current will be more noticeable.
R2
æ
ö
VOUT = 0.765 ´ 1+
ç
÷
R3
è
ø
(2)
9.2.1.2.2 Output Filter Selection
The LC filter used as the output filter has double pole at:
1
F =
P
2p LOUT ´ COUT
(3)
At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal
gain of the device. The low frequency phase is 180 degrees. At the output filter pole frequency, the gain rolls off
at a –40 dB per decade rate and the phase drops rapidly. D-CAP2™ introduces a high frequency zero that
reduces the gain roll off to –20 dB per decade and increases the phase to 90 degrees one decade above the
zero frequency. The inductor and capacitor selected for the output filter must be selected so that the double pole
of Equation 3 is located below the high frequency zero but close enough that the phase boost provided be the
high frequency zero provides adequate phase margin for a stable circuit. To meet this requirement use the
values recommended in Table 1.
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Table 2. TPS562200 Recommended Component Values
L1 (µH) TPS562200
Output Voltage (V)
R2 (kΩ)
R3 (kΩ)
C8 + C9 (µF)
MIN
1.5
1.5
1.5
1.5
1.5
2.2
2.2
3.3
3.3
TYP
2.2
2.2
2.2
2.2
2.2
3.3
3.3
4.7
4.4
MAX
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
1
1.05
1.2
1.5
1.8
2.5
3.3
5
3.09
3.74
5.76
9.53
13.7
22.6
33.2
54.9
75
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
6.5
The inductor peak-to-peak ripple current, peak current and RMS current are calculated using Equation 4,
Equation 5 and Equation 6. The inductor saturation current rating must be greater than the calculated peak
current and the RMS or heating current rating must be greater than the calculated RMS current. Use 650 kHz for
ƒSW
.
Use 650 kHz for ƒSW. Make sure the chosen inductor is rated for the peak current of Equation 5 and the RMS
current of Equation 6.
V
- VOUT
VOUT
´
IN(MAX)
IlP-P
=
V
LO ´ ƒSW
IN(MAX)
(4)
(5)
IlP-P
IlPEAK = IO +
2
1
2
2
ILO(RMS)
=
IO
+
IlP-P
12
(6)
For this design example, the calculated peak current is 2.34 A and the calculated RMS current is 2.01 A. The
inductor used is a TDK CLF7045T-2R2N with a peak current rating of 5.5-A and an RMS current rating of 4.3-A
The capacitor value and ESR determines the amount of output voltage ripple. The device is intended for use with
ceramic or other low ESR capacitors. Recommended values range from 20 µF to 68 µF. Use Equation 7 to
determine the required RMS current rating for the output capacitor.
VOUT ´ VIN - VOUT
(
12 ´ V ´LO ´ ƒSW
)
ICO(RMS)
=
IN
(7)
For this design two TDK C3216X5R0J226M 22 µF output capacitors are used. The typical ESR is 2 mΩ each.
The calculated RMS current is 0.286 A and each output capacitor is rated for 4 A.
9.2.1.2.3 Input Capacitor Selection
The device requires an input decoupling capacitor and a bulk capacitor is needed depending on the application.
A ceramic capacitor over 10 µF is recommended for the decoupling capacitor. An additional 0.1 µF capacitor(C3)
from pin 3 to ground is optional to provide additional high frequency filtering. The capacitor voltage rating needs
to be greater than the maximum input voltage.
9.2.1.2.4 Bootstrap Capacitor Selection
A 0.1 µF ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is
recommended to use a ceramic capacitor.
14
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9.2.1.3 Application Curves
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 5V
VIN = 12V
VIN = 5V
VIN = 12V
0
0
4
0.5
1
1.5
2
0.001
0.01 0.02 0.05 0.1 0.2
Output Current (A)
0.5
1
2 3 45
Output Current (A)
D032
D033
Figure 21. TPS562200 Efficiency
Figure 22. TPS562200 Light Load Efficiency
1
0.8
0.6
0.4
0.2
0
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-0.2
-0.4
-0.6
-0.8
-1
0.5
1
1.5
2
0
0.5
1
1.5
2
Output Current (A)
Output Current (A)
D034
D034
Figure 23. TPS562200 Load Regulation, VI = 5 V
Figure 24. TPS562200 Load Regulation, VI = 12 V
0.5
0.4
0.3
0.2
0.1
0
IO = 2 A
VI = 100 mV / div (ac coupled)
SW = 5 V / div
-0.1
-0.2
-0.3
-0.4
-0.5
6
8
10
12
14
16
18
Time = 1 µsec / div
Input Voltage (V)
D036
Figure 26. TPS562200 Input Voltage Ripple
Figure 25. TPS562200 Line Regulation
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IO = 10 mA
IO = 250 mA
VO = 20 mV / div (ac coupled)
VO = 20 mV / div (ac coupled)
SW = 5 V / div
SW = 5 V / div
Time = 1 µsec / div
Time = 20 µsec / div
Figure 28. TPS562200 Output Voltage Ripple
Figure 27. TPS562200 Output Voltage Ripple
IO = 2 A
VO = 20 mV / div (ac coupled)
VO = 20 mV / div (ac coupled)
IO = 500 mA / div
SW = 5 V / div
Load step = 0.5 A - 1.5 A
Slew rate = 500 mA / µsec
Time = 1 µsec / div
Time = 200 µsec / div
Figure 29. TPS562200 Output Voltage Ripple
Figure 30. TPS562200 Transient Response
VI = 10 V / div
VI = 10 V / div
EN = 10 V / div
EN = 10 V / div
VO = 500 mV / div
VO = 500 mV / div
Time = 2 msec / div
Time = 2 msec / div
Figure 32. TPS562200 Start Up Relative to EN
Figure 31. TPS562200 Start Up Relative to VI
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VI = 10 V / div
VI = 10 V / div
EN = 10 V / div
EN = 10 V / div
VO = 500 mV / div
VO = 500 mV / div
Time = 2 msec / div
Time = 2 msec / div
Figure 33. TPS562200 Shut Down Relative to VI
Figure 34. TPS562200 Shut Down Relative to EN
9.2.2 TPS563200 4.5-V to 17-V Input, 1.05-V Output Converter
U1
L1 1.5 uH
VOUT = 1.05 V, 3 A
VOUT
TPS563200
VIN = 4.5 V to 17 V
3
5
4
2
6
1
VIN
VIN
EN
SW
VBST
GND
C4
R1 10.0k
R2
3.74k
EN
C1
10µF
C2
10µF
C3
0.1µF
C5
22µF
C6
22µF
C7
22µF
0.1µF
VFB
R3
10.0k
Figure 35. TPS563200 1.05V/3A Reference Design
9.2.2.1 Design Requirements
To begin the design process, the user must know a few application parameters:
Table 3. Design Parameters
PARAMETER
Input voltage range
Output voltage
VALUE
4.5 V to 17V
1.05V
Output current
3A
Output voltage ripple
20mVpp
9.2.2.2 Detailed Design Procedures
The detailed design procedure for TPS563200 is the same as for TPS562200 except for inductor selection.
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9.2.2.2.1 Output Filter Selection
Table 4. TPS563200 Recommended Component Values
L1 (µH) TPS563200
Output Voltage (V)
R2 (kΩ)
R3 (kΩ)
C8 + C9 (µF)
MIN
1.0
1.0
1.0
1.0
1.5
1.5
1.5
2.2
2.2
TYP
1.5
1.5
1.5
1.5
2.2
2.2
2.2
3.3
3.3
MAX
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
1
1.05
1.2
1.5
1.8
2.5
3.3
5
3.09
3.74
5.76
9.53
13.7
22.6
33.2
54.9
75
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
20 - 68
6.5
The inductor peak-to-peak ripple current, peak current and RMS current are calculated using Equation 8,
Equation 9 and Equation 10. The inductor saturation current rating must be greater than the calculated peak
current and the RMS or heating current rating must be greater than the calculated RMS current. Use 650 kHz for
ƒSW
.
Use 650 kHz for ƒSW. Make sure the chosen inductor is rated for the peak current of Equation 9 and the RMS
current of Equation 10.
V
- VOUT
VOUT
´
IN(MAX)
IlP-P
=
V
LO ´ ƒSW
IN(MAX)
(8)
(9)
IlP-P
IlPEAK = IO +
2
1
2
2
ILO(RMS)
=
IO
+
IlP-P
12
(10)
For this design example, the calculated peak current is 3.505 A and the calculated RMS current is 3.014 A. The
inductor used is a TDK CLF7045T-1R5N with a peak current rating of 7.3-A and an RMS current rating of 4.9-A
9.2.2.3 Application Curves
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 5V
VIN = 12V
VIN = 5V
VIN = 12V
0
0.5
1
1.5
2
2.5
3
0.001
0.01 0.02 0.05 0.1 0.2
Output Current (A)
0.5
1
2 3 45
Output Current (A)
D027
D028
Figure 36. TPS563200 Efficiency
Figure 37. TPS563200 Light Load Efficiency
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1
0.8
0.6
0.4
0.2
0
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-0.2
-0.4
-0.6
-0.8
-1
-1
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
Output Current (A)
Output Current (A)
D029
D030
Figure 38. TPS563200 Load Regulation, VI = 5 V
Figure 39. TPS563200 Load Regulation, VI = 12 V
0.5
0.4
0.3
0.2
0.1
0
IO = 3 A
VI = 50 mV / div (ac coupled)
SW = 5 V / div
-0.1
-0.2
-0.3
-0.4
-0.5
4
6
8
10
12
14
16
18
Time = 1 µsec / div
Input Voltage (V)
D031
Figure 41. TPS563200 Input Voltage Ripple
Figure 40. TPS563200 Line Regulation
IO = 300 mA
IO = 0 mA
VO = 20 mV / div (ac coupled)
VO = 20 mV / div (ac coupled)
SW = 5 V / div
SW = 5 V / div
Time = 1 µsec / div
Time = 5 msec / div
Figure 42. TPS563200 Output Voltage Ripple
Figure 43. TPS563200 Output Voltage Ripple
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IO = 3 A
VO = 50 mV / div (ac coupled)
VO = 20 mV / div (ac coupled)
SW = 5 V / div
IO = 1 A / div
Load step = 0.75 A - 2.25 A
Slew rate = 500 mA / µsec
Time = 1 µsec / div
Time = 200 µsec / div
Figure 44. TPS563200 Output Voltage Ripple
Figure 45. TPS563200 Transient Response
VI = 10 V / div
VI = 10 V / div
EN = 10 V / div
EN = 10 V / div
VO = 500 mV / div
VO = 500 mV / div
Time = 1 msec / div
Figure 46. TPS563200 Start Up Relative to VI
Time = 1 msec / div
Figure 47. TPS563200 Start Up Relative to EN
VI = 10 V / div
VI = 10 V / div
EN = 10 V / div
EN = 10 V / div
VO = 500 mV / div
VO = 500 mV / div
Time = 1 msec / div
Time = 1 msec / div
Figure 49. TPS563200 Shut Down Relative to EN
Figure 48. TPS563200 Shut Down Relative to VI
10 Power Supply Recommendations
The TPS562200 and TPS563200 are designed to operate from input supply voltage in the range of 4.5V to 17V.
Buck converters require the input voltage to be higher than the output voltage for proper operation. The
maximum recommended operating duty cycle is 65%. Using that criteria, the minimum recommended input
voltage is VO / 0.65.
20
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ZHCSC24B –JANUARY 2014–REVISED AUGUST 2014
11 Layout
11.1 Layout Guidelines
1. VIN and GND traces should be as wide as possible to reduce trace impedance. The wide areas are also of
advantage from the view point of heat dissipation.
2. The input capacitor and output capacitor should be placed as close to the device as possible to minimize
trace impedance.
3. Provide sufficient vias for the input capacitor and output capacitor.
4. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
5. Do not allow switching current to flow under the device.
6. A separate VOUT path should be connected to the upper feedback resistor
7. Make a Kelvin connection to the GND pin for the feedback path.
8. Voltage feedback loop should be placed away from the high-voltage switching trace, and preferably has
ground shield.
9. The trace of the VFB node should be as small as possible to avoid noise coupling.
10. The GND trace between the output capacitor and the GND pin should be as wide as possible to minimize its
trace impedance.
11.2 Layout Example
GND
VOUT
Additional
Vias to the
GND plane
OUTPUT
CAPACITOR
Vias to the
internal SW
node copper
BOOST
CAPACITOR
OUTPUT
INDUCTOR
FEEDBACK
RESISTORS
GND
SW
VBST
EN
TO ENABLE
CONTROL
VFB
VIN
Vias to the
internal SW
node copper
HIGH FREQUENCY
INPUT BYPASS
CAPACITOR
SW node copper
pour area on internal
or bottom layer
INPUT BYPASS
CAPACITOR
VIN
Figure 50. Typical Layout
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12 器件和文档支持
12.1 相关链接
以下表格列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件，并且可以快速访问样片或购买
链接。
表 5. 相关链接
部件
产品文件夹
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
支持与社区
请单击此处
请单击此处
TPS562200
TPS563200
12.2 商标
D-CAP2, Eco-mode are trademarks of Texas Instruments.
Blu-ray Disc is a trademark of Blu-ray Disc Association.
12.3 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
12.4 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
13 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
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对于 TI 的产品手册或数据表中 TI 信息的重要部分，仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况 下才允许进行
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在转售 TI 组件或服务时，如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分，则会失去相关 TI 组件 或服务的所有明
示或暗示授权，且这是不正当的、欺诈性商业行为。TI 对任何此类虚假陈述均不承担任何责任或义务。
客户认可并同意，尽管任何应用相关信息或支持仍可能由 TI 提供，但他们将独力负责满足与其产品及在其应用中使用 TI 产品 相关的所有法
律、法规和安全相关要求。客户声明并同意，他们具备制定与实施安全措施所需的全部专业技术和知识，可预见 故障的危险后果、监测故障
及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而
对 TI 及其代理造成的任何损失。
在某些场合中，为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特 有的可满足适用
的功能安全性标准和要求的终端产品解决方案。尽管如此，此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III（或类似的生命攸关医疗设备）的授权许可，除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意，对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用，其风险由客户单独承担，并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品，这些产品主要用于汽车。在任何情况下，因使用非指定产品而无法达到 ISO/TS16949 要
求，TI不承担任何责任。
产品
应用
www.ti.com.cn/telecom
数字音频
www.ti.com.cn/audio
www.ti.com.cn/amplifiers
www.ti.com.cn/dataconverters
www.dlp.com
通信与电信
计算机及周边
消费电子
能源
放大器和线性器件
数据转换器
DLP® 产品
DSP - 数字信号处理器
时钟和计时器
接口
www.ti.com.cn/computer
www.ti.com/consumer-apps
www.ti.com/energy
www.ti.com.cn/dsp
工业应用
医疗电子
安防应用
汽车电子
视频和影像
www.ti.com.cn/industrial
www.ti.com.cn/medical
www.ti.com.cn/security
www.ti.com.cn/automotive
www.ti.com.cn/video
www.ti.com.cn/clockandtimers
www.ti.com.cn/interface
www.ti.com.cn/logic
逻辑
电源管理
www.ti.com.cn/power
www.ti.com.cn/microcontrollers
www.ti.com.cn/rfidsys
www.ti.com/omap
微控制器 (MCU)
RFID 系统
OMAP应用处理器
无线连通性
www.ti.com.cn/wirelessconnectivity
德州仪器在线技术支持社区
www.deyisupport.com
IMPORTANT NOTICE
邮寄地址： 上海市浦东新区世纪大道1568 号，中建大厦32 楼邮政编码： 200122
Copyright © 2014, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2016
PACKAGING INFORMATION
Orderable Device
TPS562200DDCR
TPS562200DDCT
TPS563200DDCR
TPS563200DDCT
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOT
SOT
SOT
SOT
DDC
6
6
6
6
3000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
200
200
320
320
ACTIVE
ACTIVE
ACTIVE
DDC
DDC
DDC
250
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Dec-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS562200DDCR
TPS562200DDCT
TPS563200DDCR
TPS563200DDCT
SOT
SOT
SOT
SOT
DDC
DDC
DDC
DDC
6
6
6
6
3000
250
180.0
180.0
180.0
180.0
9.5
9.5
9.5
9.5
3.17
3.17
3.17
3.17
3.1
3.1
3.1
3.1
1.1
1.1
1.1
1.1
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Dec-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS562200DDCR
TPS562200DDCT
TPS563200DDCR
TPS563200DDCT
SOT
SOT
SOT
SOT
DDC
DDC
DDC
DDC
6
6
6
6
3000
250
184.0
184.0
184.0
184.0
184.0
184.0
184.0
184.0
19.0
19.0
19.0
19.0
3000
250
Pack Materials-Page 2
重要声明
德州仪器(TI) 及其下属子公司有权根据 JESD46 最新标准, 对所提供的产品和服务进行更正、修改、增强、改进或其它更改， 并有权根据
JESD48 最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息, 并验证这些信息是否完整且是最新的。所有产品的销售
都遵循在订单确认时所提供的TI 销售条款与条件。
TI 保证其所销售的组件的性能符合产品销售时 TI 半导体产品销售条件与条款的适用规范。仅在 TI 保证的范围内，且 TI 认为 有必要时才会使
用测试或其它质量控制技术。除非适用法律做出了硬性规定，否则没有必要对每种组件的所有参数进行测试。
TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用 TI 组件的产品和应用自行负责。为尽量减小与客户产品和应 用相关的风险，
客户应提供充分的设计与操作安全措施。
TI 不对任何 TI 专利权、版权、屏蔽作品权或其它与使用了 TI 组件或服务的组合设备、机器或流程相关的 TI 知识产权中授予 的直接或隐含权
限作出任何保证或解释。TI 所发布的与第三方产品或服务有关的信息，不能构成从 TI 获得使用这些产品或服 务的许可、授权、或认可。使用
此类信息可能需要获得第三方的专利权或其它知识产权方面的许可，或是 TI 的专利权或其它 知识产权方面的许可。
对于 TI 的产品手册或数据表中 TI 信息的重要部分，仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况 下才允许进行
复制。TI 对此类篡改过的文件不承担任何责任或义务。复制第三方的信息可能需要服从额外的限制条件。
在转售 TI 组件或服务时，如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分，则会失去相关 TI 组件 或服务的所有明
示或暗示授权，且这是不正当的、欺诈性商业行为。TI 对任何此类虚假陈述均不承担任何责任或义务。
客户认可并同意，尽管任何应用相关信息或支持仍可能由 TI 提供，但他们将独力负责满足与其产品及在其应用中使用 TI 产品 相关的所有法
律、法规和安全相关要求。客户声明并同意，他们具备制定与实施安全措施所需的全部专业技术和知识，可预见 故障的危险后果、监测故障
及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而
对 TI 及其代理造成的任何损失。
在某些场合中，为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特 有的可满足适用
的功能安全性标准和要求的终端产品解决方案。尽管如此，此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III（或类似的生命攸关医疗设备）的授权许可，除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意，对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用，其风险由客户单独承担，并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品，这些产品主要用于汽车。在任何情况下，因使用非指定产品而无法达到 ISO/TS16949 要
求，TI不承担任何责任。
产品
应用
www.ti.com.cn/telecom
数字音频
www.ti.com.cn/audio
www.ti.com.cn/amplifiers
www.ti.com.cn/dataconverters
www.dlp.com
通信与电信
计算机及周边
消费电子
能源
放大器和线性器件
数据转换器
DLP® 产品
DSP - 数字信号处理器
时钟和计时器
接口
www.ti.com.cn/computer
www.ti.com/consumer-apps
www.ti.com/energy
www.ti.com.cn/dsp
工业应用
医疗电子
安防应用
汽车电子
视频和影像
www.ti.com.cn/industrial
www.ti.com.cn/medical
www.ti.com.cn/security
www.ti.com.cn/automotive
www.ti.com.cn/video
www.ti.com.cn/clockandtimers
www.ti.com.cn/interface
www.ti.com.cn/logic
逻辑
电源管理
www.ti.com.cn/power
www.ti.com.cn/microcontrollers
www.ti.com.cn/rfidsys
www.ti.com/omap
微控制器 (MCU)
RFID 系统
OMAP应用处理器
无线连通性
www.ti.com.cn/wirelessconnectivity
德州仪器在线技术支持社区
www.deyisupport.com
IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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