TPS40007TDA3 [TI]
低输入、高效同步降压控制器，TPS40007-DIE | TD | 0 | 25 to 25;
| 型号： | TPS40007TDA3 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 低输入、高效同步降压控制器，TPS40007-DIE | TD | 0 | 25 to 25 控制器 开关 |
| 文件： | 总6页 (文件大小：345K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS40007-DIE
www.ti.com.cn
ZHCSBT1 –NOVEMBER 2013
低输入、高效同步降压控制器
查询样片: TPS40007-DIE
1
特性
2
•
低输出电压
应用范围
•
Predictive Gate Drive™ 用于实现更高效率的 N
通道金属氧化物半导体场效应晶体管 (MOSFET)
•
•
•
•
•
•
网络设备
电信设备
•
•
•
•
•
外部可调软启动和过流限制
频率电压模式控制
基站
服务器
具有 VOUT 预偏置的源出/灌入电压
热关断
数字信号处理器 (DSP) 电源
电源模块
内部引导加载二极管
描述
TPS40007-DIE 是一款用于低压、非隔离式同步降压稳压器的控制器。 这个控制器驱动一个用于主降压开关的 N
通道 MOSFET，和一个用于同步整流器开关的 N 通道 MOSFET，从而实现极高效率的功率转换。 此外，此器件
使用 TI 已获专利的 Predictive Gate Drive（可预期栅极驱动）技术控制从主开关关闭到整流器打开，以及从整流器
关闭到主开关打开的延迟，用这个方法来最大限度地减少同步整流器内二极管损耗（包括传导和恢复时的损耗）。
这些损耗的减少量是很可观的，并且增加了效率。 对于一个指定的转换器功率水平，可使用较小的 FET，或者可
减少散热片的数量，甚至无需散热。
可使用一个连接到器件上的单个电阻器来调节电流限制阀值。 TPS40007-DIE 控制器执行一个闭环软启动功能。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
TPS40007TDA3
TPS40007TDA2
200
10
TPS40007
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
Predictive Gate Drive is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SLUSBS7
TPS40007-DIE
ZHCSBT1 –NOVEMBER 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
15.5 mils.
Silicon with backgrind
Floating
PdNiCu
18200 nm
2
Copyright © 2013, Texas Instruments Incorporated
TPS40007-DIE
www.ti.com.cn
ZHCSBT1 –NOVEMBER 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
16.74
Y MIN
100.26
86.49
X MAX
117.54
614.25
776.34
933.57
Y MAX
201.06
187.29
187.29
187.29
ILIM
FB
1
2
513.45
675.54
832.77
1297.62
1344.42
1328.04
1170.63
1037.88
872.46
488.07
45.27
COMP
SS/SD
GND
GND
LDRV
VDD
3
86.49
4
86.49
5
80.37
1398.42
1445.22
1428.84
1271.43
1138.68
973.26
181.17
316.26
6
215.46
1224.54
1262.25
1302.66
1257.93
1278.63
1080.81
7
1325.34
1363.05
1403.46
1358.73
1379.43
1181.61
8
VDD
9
SW
10
11
12
HDRV
BOOT
588.87
146.07
Copyright © 2013, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS40007TDA2
TPS40007TDA3
ACTIVE
ACTIVE
0
0
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
25 to 25
25 to 25
Samples
Samples
100
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Aug-2022
Addendum-Page 2
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