TMUX1104DGSR [TI]
3pA 导通状态泄漏电流、5V、4:1、单通道精密多路复用器 | DGS | 10 | -40 to 125;型号: | TMUX1104DGSR |
厂家: | TEXAS INSTRUMENTS |
描述: | 3pA 导通状态泄漏电流、5V、4:1、单通道精密多路复用器 | DGS | 10 | -40 to 125 光电二极管 复用器 |
文件: | 总38页 (文件大小:1777K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
TMUX1104 5V 低泄漏电流 4:1 精密多路复用器
1 特性
3 说明
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宽电源电压范围:1.08V 至 5.5V
TMUX1104 是精密互补金属氧化物半导体 (CMOS) 多
路复用器 (MUX)。TMUX1104 提供单通道 4:1 配置。
1.08V 至 5.5V 的宽电源电压工作范围 可支持 医疗设
备到工业系统的大量应用。该器件可在源极 (Sx) 和漏
极 (D) 引脚上支持从 GND 到 VDD 范围的双向模拟和
数字信号。所有逻辑输入均具有兼容 1.8V 逻辑电平的
阈值,当器件在有效电源电压范围内运行时,这些阈值
可确保 TTL 和 CMOS 逻辑兼容性。失效防护逻辑 电
路允许在电源引脚之前的控制引脚上施加电压,从而保
护器件免受潜在的损害。
低泄漏电流:3pA
低电荷注入:1.5pC
低导通电阻:2Ω
工作温度范围:-40°C 至 +125°C
兼容 1.8V 逻辑电平
失效防护逻辑
轨至轨运行
双向信号路径
先断后合开关
ESD 保护 HBM:2000V
TMUX1104 是精密开关和多路复用器器件系列的一部
分。这些器件具有非常低的导通和关断泄漏电流以及较
低的电荷注入,因此可用于高精度测量 应用。5nA 的
低电源电流和小型封装选项使其可用于便携式 应用。
2 应用
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超声波扫描仪
患者监护和诊断
血糖监测仪
器件信息(1)
器件型号
TMUX1104
封装
VSSOP (10) (DGS) 3.00mm × 3.00mm
USON (10) (DQA) 2.50mm x 1.00mm
封装尺寸(标称值)
光纤网络
光学测试设备
远程无线电单元
有线网络
(1) 如需了解所有可用封装,请参阅数据表末尾的封装选项附录。
数据采集系统
ATE 测试设备
工厂自动化和工业控制
可编程逻辑控制器 (PLC)
模拟输入模块
声纳接收器
电池监控系统
简化电路原理图
方框图
VDD
VDD
EN
TMUX1104
VREF
REF
S1
Bridge Sensor
Thermocouple
S1
S2
S3
S4
S2
D1
S3
+
Op Amp
-
D
+
Op Amp
-
S4
Precision
ADC
Current Sensing
1-of-4
Decoder
A1
A0
GND
Photo
LED
Optical Sensor
1.8V Logic
Signals
Detector
Analog Inputs
EN A1 A0
TMUX1104
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SCDS392
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
www.ti.com.cn
目录
7.10 Bandwidth ............................................................. 20
Detailed Description ............................................ 21
8.1 Functional Block Diagram ....................................... 21
8.2 Feature Description................................................. 21
8.3 Device Functional Modes........................................ 23
8.4 Truth Tables............................................................ 23
Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Application ................................................. 24
9.3 Design Requirements.............................................. 24
9.4 Detailed Design Procedure ..................................... 25
9.5 Application Curve.................................................... 25
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics (VDD = 5 V ±10 %)............ 5
6.6 Electrical Characteristics (VDD = 3.3 V ±10 %)......... 7
6.7 Electrical Characteristics (VDD = 1.8 V ±10 %)......... 9
6.8 Electrical Characteristics (VDD = 1.2 V ±10 %)....... 11
6.9 Typical Characteristics............................................ 13
Parameter Measurement Information ................ 16
7.1 On-Resistance ........................................................ 16
7.2 Off-Leakage Current ............................................... 16
7.3 On-Leakage Current ............................................... 17
7.4 Transition Time ....................................................... 17
7.5 Break-Before-Make................................................. 18
7.6 tON(EN) and tOFF(EN).................................................. 18
7.7 Charge Injection...................................................... 19
7.8 Off Isolation............................................................. 19
7.9 Crosstalk ................................................................. 20
8
9
10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 26
12 器件和文档支持 ..................................................... 27
12.1 文档支持................................................................ 27
12.2 接收文档更新通知 ................................................. 27
12.3 社区资源................................................................ 27
12.4 商标....................................................................... 27
12.5 静电放电警告......................................................... 27
12.6 Glossary................................................................ 27
13 机械、封装和可订购信息....................................... 27
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (December 2018) to Revision B
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删除了器件信息 表中 DQA 封装的产品预览 说明................................................................................................................... 1
Deleted the Product Preview note from the DQA package in the Pin Configuration and Functions section ......................... 3
Added DQA (USON) thermal values to Thermal Information ................................................................................................ 4
Changes from Original (November 2018) to Revision A
Page
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将文件状态从预告信息 更改为生产组合 数据 ......................................................................................................................... 1
2
Copyright © 2018–2019, Texas Instruments Incorporated
TMUX1104
www.ti.com.cn
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
5 Pin Configuration and Functions
DGS Package
10-Pin VSSOP
Top View
DQA Package
10-Pin USON
Top View
A0
S1
1
2
3
4
5
10
9
A1
S2
D
A0
S1
1
2
3
4
5
10
9
A1
S2
D
GND
S3
8
GND
S3
8
7
S4
VDD
7
S4
VDD
EN
6
EN
6
Not to scale
Not to scale
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
A0
DGS, DQA
1
2
3
4
I
Address line 0. Controls the switch configuration as shown in 表 1.
Source pin 1. Can be an input or output.
Ground (0 V) reference
S1
I/O
P
GND
S3
I/O
Source pin 3. Can be an input or output.
Active high logic enable. When this pin is low, all switches are turned off. When this pin is high, the
A[1:0] logic inputs determine which switch is turned on.
EN
5
6
I
Positive power supply. This pin is the most positive power-supply potential. For reliable operation,
connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VDD
P
S4
D
7
8
I/O
I/O
I/O
I
Source pin 4. Can be an input or output.
Drain pin. Can be an input or output.
S2
A1
9
Source pin 2. Can be an input or output.
10
Address line 1. Controls the switch configuration as shown in 表 1.
(1) I = input, O = output, I/O = input and output, P = power
Copyright © 2018–2019, Texas Instruments Incorporated
3
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
–0.5
–0.5
–30
–0.5
–30
–65
MAX
UNIT
V
VDD
Supply voltage
6
6
VSEL or VEN
ISEL or IEN
VS or VD
IS or ID (CONT)
Tstg
Logic control input pin voltage (EN, A0, A1)
Logic control input pin current (EN, A0, A1)
Source or drain voltage (Sx, D)
Source or drain continuous current (Sx, D)
Storage temperature
V
30
mA
V
VDD+0.5
30
mA
°C
°C
150
TJ
Junction temperature
150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.08
0
NOM
MAX
5.5
UNIT
V
VDD
Positive power supply voltage
VS or VD
Signal path input/output voltage (source or drain pin) (Sx, D)
VDD
V
VSEL or
VEN
Logic control input pin voltage
Ambient temperature
0
5.5
V
TA
–40
125
°C
6.4 Thermal Information
TMUX1104
THERMAL METRIC(1)
DGS (VSSOP)
10 PINS
193.9
DQA (USON)
10 PINS
173.0
99.7
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
83.1
116.5
73.5
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
22.0
8.9
ΨJB
114.6
73.0
RθJC(bot)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2018–2019, Texas Instruments Incorporated
TMUX1104
www.ti.com.cn
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
6.5 Electrical Characteristics (VDD = 5 V ±10 %)
at TA = 25°C, VDD = 5 V (unless otherwise noted)
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
2
4
4.5
4.9
Ω
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
On-resistance
–40°C to +85°C
–40°C to +125°C
25°C
Ω
0.13
0.85
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
0.4
0.5
Ω
Ω
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
FLAT
On-resistance flatness
–40°C to +85°C
–40°C to +125°C
25°C
1.6
1.6
Ω
Ω
VDD = 5 V
Switch Off
VD = 4.5 V / 1.5 V
VS = 1.5 V / 4.5 V
Refer to Off-Leakage Current
–0.08 ±0.005
–0.3
0.08
0.3
nA
nA
–40°C to +85°C
IS(OFF)
Source off leakage current(1)
–40°C to +125°C
–0.9
0.9
nA
VDD = 5 V
Switch Off
VD = 4.5 V / 1.5 V
VS = 1.5 V / 4.5 V
Refer to Off-Leakage Current
25°C
–0.1
±0.01
0.1
nA
nA
–40°C to +85°C
–0.75
0.75
ID(OFF) Drain off leakage current(1)
–40°C to +125°C
–3.5
3.5
nA
VDD = 5 V
Switch On
VD = VS = 2.5 V
Refer to On-Leakage Current
25°C
–0.025 ±0.003
–0.3
0.025
0.3
nA
nA
ID(ON)
–40°C to +85°C
Channel on leakage current
IS(ON)
–40°C to +125°C
–0.95
0.95
nA
VDD = 5 V
Switch On
VD = VS = 4.5 V / 1.5 V
Refer to On-Leakage Current
25°C
–0.1
±0.01
0.1
nA
nA
ID(ON)
–40°C to +85°C
–0.75
0.75
Channel on leakage current
IS(ON)
–40°C to +125°C
–3.5
3.5
nA
LOGIC INPUTS (EN, A0, A1)
VIH
VIL
Input logic high
Input logic low
–40°C to +125°C
–40°C to +125°C
1.49
0
5.5
V
V
0.87
IIH
IIL
Input leakage current
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.005
µA
µA
IDD VDD supply current
Logic inputs = 0 V or 5.5 V
–40°C to +125°C
1
(1) When VS is 4.5 V, VD is 1.5 V, and vice versa.
Copyright © 2018–2019, Texas Instruments Incorporated
5
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
www.ti.com.cn
Electrical Characteristics (VDD = 5 V ±10 %) (continued)
at TA = 25°C, VDD = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
14
ns
VS = 3 V
tTRAN
Transition time between channels RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
18
19
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Refer to Transition Time
8
12
5
VS = 3 V
tOPEN
(BBM)
Break before make time
RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Refer to Break-Before-Make
VS = 3 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
tON(EN) Enable turn-on time
tOFF(EN) Enable turn-off time
–40°C to +85°C
–40°C to +125°C
25°C
17
18
VS = 3 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
–40°C to +85°C
–40°C to +125°C
8
9
VS = 1 V
QC
Charge Injection
Off Isolation
RS = 0 Ω, CL = 1 nF
Refer to Charge Injection
25°C
25°C
25°C
25°C
1.5
–65
–45
–65
pC
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Off Isolation
OISO
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C
25°C
–45
155
dB
Refer to Crosstalk
RL = 50 Ω, CL = 5 pF
Refer to Bandwidth
BW
Bandwidth
MHz
CSOFF
CDOFF
Source off capacitance
Drain off capacitance
f = 1 MHz
f = 1 MHz
25°C
25°C
6
pF
pF
28
CSON
CDON
On capacitance
f = 1 MHz
25°C
35
pF
6
Copyright © 2018–2019, Texas Instruments Incorporated
TMUX1104
www.ti.com.cn
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
6.6 Electrical Characteristics (VDD = 3.3 V ±10 %)
at TA = 25°C, VDD = 3.3 V (unless otherwise noted)
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
3.7
8.8
9.5
9.8
Ω
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
On-resistance
–40°C to +85°C
–40°C to +125°C
25°C
Ω
0.13
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
0.4
0.5
Ω
Ω
1.9
2
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
FLAT
On-resistance flatness
–40°C to +85°C
–40°C to +125°C
25°C
Ω
2.2
Ω
VDD = 3.3 V
Switch Off
VD = 3 V / 1 V
–0.05 ±0.001
–0.1
0.05
0.1
nA
nA
–40°C to +85°C
IS(OFF)
Source off leakage current(1)
VS = 1 V / 3 V
Refer to Off-Leakage Current
–40°C to +125°C
–0.5
0.5
nA
VDD = 3.3 V
Switch Off
VD = 3 V / 1 V
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
–40°C to +85°C
ID(OFF) Drain off leakage current(1)
VS = 1 V / 3 V
Refer to Off-Leakage Current
–40°C to +125°C
–2
2
nA
VDD = 3.3 V
Switch On
VD = VS = 3 V / 1 V
Refer to On-Leakage Current
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
ID(ON)
–40°C to +85°C
Channel on leakage current
IS(ON)
–40°C to +125°C
–2
2
nA
LOGIC INPUTS (EN, A0, A1)
VIH
VIL
Input logic high
Input logic low
–40°C to +125°C
–40°C to +125°C
1.35
0
5.5
0.8
V
V
IIH
IIL
Input leakage current
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.005
µA
µA
IDD
VDD supply current
Logic inputs = 0 V or 5.5 V
–40°C to +125°C
1
(1) When VS is 3 V, VD is 1 V, and vice versa.
Copyright © 2018–2019, Texas Instruments Incorporated
7
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
www.ti.com.cn
Electrical Characteristics (VDD = 3.3 V ±10 %) (continued)
at TA = 25°C, VDD = 3.3 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
15
ns
VS = 2 V
tTRAN
Transition time between channels RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
21
22
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Refer to Transition Time
9
14
7
VS = 2 V
tOPEN
(BBM)
Break before make time
RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Refer to Break-Before-Make
VS = 2 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
tON(EN) Enable turn-on time
tOFF(EN) Enable turn-off time
–40°C to +85°C
–40°C to +125°C
25°C
21
21
VS = 2 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
–40°C to +85°C
–40°C to +125°C
9
10
VS = 1 V
QC
Charge Injection
Off Isolation
RS = 0 Ω, CL = 1 nF
Refer to Charge Injection
25°C
25°C
25°C
25°C
–1.5
–65
–45
–65
pC
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Off Isolation
OISO
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C
25°C
–45
155
dB
Refer to Crosstalk
RL = 50 Ω, CL = 5 pF
Refer to Bandwidth
BW
Bandwidth
MHz
CSOFF
CDOFF
Source off capacitance
Drain off capacitance
f = 1 MHz
f = 1 MHz
25°C
25°C
6
pF
pF
28
CSON
CDON
On capacitance
f = 1 MHz
25°C
35
pF
8
Copyright © 2018–2019, Texas Instruments Incorporated
TMUX1104
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6.7 Electrical Characteristics (VDD = 1.8 V ±10 %)
at TA = 25°C, VDD = 1.8 V (unless otherwise noted)
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
40
Ω
VS = 0 V to VDD
RON
On-resistance
ISD = 10 mA
Refer to On-Resistance
–40°C to +85°C
–40°C to +125°C
25°C
80
80
Ω
Ω
0.4
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1.5
1.5
Ω
Ω
VDD = 1.98 V
Switch Off
VD = 1.62 V / 1 V
VS = 1 V / 1.62 V
Refer to Off-Leakage Current
–0.05 ±0.003
–0.1
0.05
0.1
nA
nA
–40°C to +85°C
IS(OFF)
Source off leakage current(1)
–40°C to +125°C
–0.5
0.5
nA
VDD = 1.98 V
Switch Off
VD = 1.62 V / 1 V
VS = 1 V / 1.62 V
Refer to Off-Leakage Current
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
–40°C to +85°C
ID(OFF) Drain off leakage current(1)
–40°C to +125°C
–2
2
nA
VDD = 1.98 V
Switch On
VD = VS = 1.62 V / 1 V
Refer to On-Leakage Current
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
ID(ON)
–40°C to +85°C
Channel on leakage current
IS(ON)
–40°C to +125°C
–2
2
nA
LOGIC INPUTS (EN, A0, A1)
VIH
VIL
Input logic high
Input logic low
–40°C to +125°C
–40°C to +125°C
1.07
0
5.5
V
V
0.68
IIH
IIL
Input leakage current
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.001
µA
µA
IDD VDD supply current
Logic inputs = 0 V or 5.5 V
–40°C to +125°C
0.85
(1) When VS is 1.62 V, VD is 1 V, and vice versa.
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Electrical Characteristics (VDD = 1.8 V ±10 %) (continued)
at TA = 25°C, VDD = 1.8 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
28
ns
VS = 1 V
tTRAN
Transition time between channels RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
44
44
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Refer to Transition Time
16
25
13
VS = 1 V
tOPEN
(BBM)
Break before make time
RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Refer to Break-Before-Make
VS = 1 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
tON(EN) Enable turn-on time
tOFF(EN) Enable turn-off time
–40°C to +85°C
–40°C to +125°C
25°C
41
41
VS = 1 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
–40°C to +85°C
–40°C to +125°C
23
23
VS = 1 V
QC
Charge Injection
Off Isolation
RS = 0 Ω, CL = 1 nF
Refer to Charge Injection
25°C
25°C
25°C
25°C
–0.5
–65
–45
–65
pC
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Off Isolation
OISO
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C
25°C
–45
140
dB
Refer to Crosstalk
RL = 50 Ω, CL = 5 pF
Refer to Bandwidth
BW
Bandwidth
MHz
CSOFF
CDOFF
Source off capacitance
Drain off capacitance
f = 1 MHz
f = 1 MHz
25°C
25°C
6
pF
pF
28
CSON
CDON
On capacitance
f = 1 MHz
25°C
35
pF
10
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
6.8 Electrical Characteristics (VDD = 1.2 V ±10 %)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
ANALOG SWITCH
25°C
70
Ω
VS = 0 V to VDD
RON
On-resistance
ISD = 10 mA
Refer to On-Resistance
–40°C to +85°C
–40°C to +125°C
25°C
105
105
Ω
Ω
0.4
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1.5
1.5
Ω
Ω
VDD = 1.32 V
Switch Off
VD = 1 V / 0.8 V
VS = 0.8 V / 1 V
Refer to Off-Leakage Current
–0.05 ±0.003
–0.1
0.05
0.1
nA
nA
–40°C to +85°C
IS(OFF)
Source off leakage current(1)
–40°C to +125°C
–0.5
0.5
nA
VDD = 1.32 V
Switch Off
VD = 1 V / 0.8 V
VS = 0.8 V / 1 V
Refer to Off-Leakage Current
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
–40°C to +85°C
ID(OFF) Drain off leakage current(1)
–40°C to +125°C
–2
2
nA
VDD = 1.32 V
Switch On
VD = VS = 1 V / 0.8 V
Refer to On-Leakage Current
25°C
–0.1 ±0.005
–0.5
0.1
0.5
nA
nA
ID(ON)
–40°C to +85°C
Channel on leakage current
IS(ON)
–40°C to +125°C
–2
2
nA
LOGIC INPUTS (EN, A0, A1)
VIH
VIL
Input logic high
Input logic low
–40°C to +125°C
–40°C to +125°C
0.96
0
5.5
V
V
0.36
IIH
IIL
Input leakage current
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.001
µA
µA
IDD VDD supply current
Logic inputs = 0 V or 5.5 V
–40°C to +125°C
0.7
(1) When VS is 1 V, VD is 0.8 V, and vice versa.
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Electrical Characteristics (VDD = 1.2 V ±10 %) (continued)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
55
ns
VS = 1 V
tTRAN
Transition time between channels RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
190
190
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Refer to Transition Time
28
50
35
VS = 1 V
tOPEN
(BBM)
Break before make time
RL = 200 Ω, CL = 15 pF
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Refer to Break-Before-Make
VS = 1 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
tON(EN) Enable turn-on time
tOFF(EN) Enable turn-off time
–40°C to +85°C
–40°C to +125°C
25°C
175
175
VS = 1 V
RL = 200 Ω, CL = 15 pF
Refer to tON(EN) and tOFF(EN)
–40°C to +85°C
–40°C to +125°C
135
135
VS = 1 V
QC
Charge Injection
Off Isolation
RS = 0 Ω, CL = 1 nF
Refer to Charge Injection
25°C
25°C
25°C
25°C
–0.5
–65
–45
–65
pC
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Off Isolation
OISO
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
25°C
25°C
–45
125
dB
Refer to Crosstalk
RL = 50 Ω, CL = 5 pF
Refer to Bandwidth
BW
Bandwidth
MHz
CSOFF
CDOFF
Source off capacitance
Drain off capacitance
f = 1 MHz
f = 1 MHz
25°C
25°C
7
pF
pF
32
CSON
CDON
On capacitance
f = 1 MHz
25°C
40
pF
12
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6.9 Typical Characteristics
at TA = 25°C, VDD = 5 V (unless otherwise noted)
6
5
4.5
4
VDD = 3 V
5
VDD = 3.63 V
TA = 85èC
TA = 125èC
3.5
3
4
VDD = 4.5 V
3
2.5
2
VDD = 5.5 V
2
1
0
1.5
1
TA = 25èC
TA = -40èC
0.5
0
0
1
2
VS or VD - Source or Drain Voltage (V)
3
4
5
5.5
0
1
2
VS or VD - Source or Drain Voltage (V)
3
4
5
D001
D002
TA = 25°C
VDD = 5 V
图 1. On-Resistance vs Source or Drain Voltage
图 2. On-Resistance vs Temperature
8
80
70
60
50
40
30
20
10
0
VDD = 1.08 V
7
6
5
4
3
2
1
0
TA = 125èC
TA = 85èC
VDD = 1.32 V
VDD = 1.62 V
VDD = 1.98 V
TA = 25èC
2.5
VS or VD - Source or Drain Voltage (V)
TA = -40èC
1.5
0
0.5
1
2
3
3.5
0
0.2 0.4 0.6 0.8
1
VS or VD - Source or Drain Voltage (V)
1.2 1.4 1.6 1.8
2
D003
D004
VDD = 3.3 V
TA = 25°C
图 3. On-Resistance vs Temperature
图 4. On-Resistance vs Source or Drain Voltage
40
30
400
300
200
100
0
20
VDD = 1.32 V
VDD = 1.98 V
VDD = 3.63 V
10
0
-10
-20
-30
-40
-100
-200
-300
-400
0
0.5
1
VS or VD - Source or Drain Voltage (V)
1.5
2
2.5
3
3.5
4
0
1
VS or VD - Source or Drain Voltage (V)
2
3
4
5
D005
D006
TA = 25°C
VDD = 5 V
图 5. On-Leakage vs Source or Drain Voltage
图 6. On-Leakage vs Source or Drain Voltage
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Typical Characteristics (接下页)
3.5
2.5
1
0.75
0.5
1.5
IS(OFF)
IS(OFF)
0.25
0.5
0
-0.5
-1.5
-2.5
-3.5
-0.25
ID(OFF)
ID(OFF)
-0.5
I(ON)
I(ON)
-0.75
-1
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Temperature (èC)
Temperature (èC)
D007
D008
VDD = 3.3 V
VDD = 5 V
图 7. Leakage Current vs Temperature
图 8. Leakage Current vs Temperature
0.4
0.3
0.2
0.1
0
1400
1200
1000
800
600
400
200
0
VDD = 5 V
VDD = 3.3 V
VDD = 1.8 V
VDD = 3.3 V
VDD = 5 V
VDD = 1.2 V
-0.1
-40
-20
0
20
40
60
80
100 120 140
0
0.5
1
1.5
2
Logic Voltage (V)
2.5
3
3.5
4
4.5
5
Temperature (èC)
D009
D010
VSEL = 5.5 V
TA = 25°C
图 9. Supply Current vs Temperature
图 10. Supply Current vs Logic Voltage
20
5
3
15
10
5
VDD = 1.2 V
VDD = 5 V
1
0
-1
-3
-5
VDD = 1.8 V
-10
-15
-20
VDD = 3.3 V
-5
0
0
1
2
VS - Source Voltage (V)
3
4
5
0.5
1
VS - Source Voltage (V)
1.5
2
D011
D012
TA = -40°C to 125°C
TA = -40°C to 125°C
图 11. Charge Injection vs Source Voltage
图 12. Charge Injection vs Source Voltage
14
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Typical Characteristics (接下页)
30
27
24
21
18
15
12
9
20
16
12
8
TON(EN)
TON(EN)
TOFF(EN)
4
TOFF(EN)
6
3
0
1.5
2
2.5
3
VDD - Supply Voltage (V)
3.5
4
4.5
5
5.5
-60
-30
0
30
60
90
120
150
Temperature (èC)
D013
D014
TA = 25°C
VDD = 5 V
图 13. TON (EN) and TOFF (EN) vs Supply Voltage
图 14. TON (EN) and TOFF (EN) vs Temperature
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
30
25
20
15
10
5
RISING
FALLING
0
0.5
100k
1M
10M
Frequency (Hz)
100M
1.5
2.5 3.5
VDD - Supply Voltage (V)
4.5
5.5
D016
D015
TA = 25°C
TA = 25°C
图 16. Xtalk and Off-Isolation vs Frequency
图 15. Output TTRANSITION vs Supply Voltage
0
-1
-2
-3
-4
-5
-6
1M
10M
Frequency (Hz)
100M
D017
TA = 25°C
图 17. On Response vs Frequency
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7 Parameter Measurement Information
7.1 On-Resistance
The on-resistance of a device is the ohmic resistance between the source (Sx) and drain (D) pins of the device.
The on-resistance varies with input voltage and supply voltage. The symbol RON is used to denote on-resistance.
The measurement setup used to measure RON is shown in 图 18. Voltage (V) and current (ISD) are measured
using this setup, and RON is computed with RON = V / ISD
:
V
ISD
Sx
D
VS
图 18. On-Resistance Measurement Setup
7.2 Off-Leakage Current
There are two types of leakage currents associated with a switch during the off state:
1. Source off-leakage current
2. Drain off-leakage current
Source leakage current is defined as the leakage current flowing into or out of the source pin when the switch is
off. This current is denoted by the symbol IS(OFF)
.
Drain leakage current is defined as the leakage current flowing into or out of the drain pin when the switch is off.
This current is denoted by the symbol ID(OFF)
.
The setup used to measure both off-leakage currents is shown in 图 19.
VDD
VDD
VDD
VDD
Is (OFF)
S1
S2
S3
S4
S1
S2
A
ID (OFF)
D
D
A
S3
VS
S4
VS
VD
VD
GND
GND
图 19. Off-Leakage Measurement Setup
16
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
7.3 On-Leakage Current
Source on-leakage current is defined as the leakage current flowing into or out of the source pin when the switch
is on. This current is denoted by the symbol IS(ON)
.
Drain on-leakage current is defined as the leakage current flowing into or out of the drain pin when the switch is
on. This current is denoted by the symbol ID(ON)
.
Either the source pin or drain pin is left floating during the measurement. 图 20 shows the circuit used for
measuring the on-leakage current, denoted by IS(ON) or ID(ON)
.
VDD
VDD
VDD
VDD
IS (ON)
S1
S1
S2
A
N.C.
ID (ON)
S2
D
D
S3
S4
A
N.C.
S8
Vs
VS
VS
VD
GND
GND
图 20. On-Leakage Measurement Setup
7.4 Transition Time
Transition time is defined as the time taken by the output of the device to rise or fall 10% after the address signal
has risen or fallen past the logic threshold. The 10% transition measurement is utilized to provide the timing of
the device. System level timing can then account for the time constant added from the load resistance and load
capacitance. 图 21 shows the setup used to measure transition time, denoted by the symbol tTRANSITION
.
VDD
0.1…F
VDD
VDD
ADDRESS
DRIVE
(VSEL
S1
tf < 5ns
tr < 5ns
VS
VIH
)
VIL
S2
S3
S4
OUTPUT
0 V
D
RL
CL
tTRANSITION
tTRANSITION
A0
A1
90%
OUTPUT
VSEL
10%
GND
0 V
图 21. Transition-Time Measurement Setup
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7.5 Break-Before-Make
Break-before-make delay is a safety feature that prevents two inputs from connecting when the device is
switching. The output first breaks from the on-state switch before making the connection with the next on-state
switch. The time delay between the break and the make is known as break-before-make delay. 图 22 shows the
setup used to measure break-before-make delay, denoted by the symbol tOPEN(BBM)
.
VDD
0.1…F
VDD
VDD
VS
ADDRESS
DRIVE
S2
S3
S4
tr < 5ns
tf < 5ns
OUTPUT
D
(VSEL
)
0 V
RL
CL
90%
Output
A0
A1
tBBM
1
tBBM 2
0 V
VSEL
tOPEN (BBM) = min ( tBBM 1, tBBM 2)
GND
图 22. Break-Before-Make Delay Measurement Setup
7.6 tON(EN) and tOFF(EN)
Turn-on time is defined as the time taken by the output of the device to rise to 10% after the enable has risen
past the logic threshold. The 10% measurement is utilized to provide the timing of the device. System level
timing can then account for the time constant added from the load resistance and load capacitance. 图 23 shows
the setup used to measure turn-on time, denoted by the symbol tON(EN)
.
Turn-off time is defined as the time taken by the output of the device to fall to 90% after the enable has fallen
past the logic threshold. The 90% measurement is utilized to provide the timing of the device. System level
timing can then account for the time constant added from the load resistance and load capacitance. 图 23 shows
the setup used to measure turn-off time, denoted by the symbol tOFF(EN)
.
VDD
0.1…F
VDD
VDD
tf < 5ns
tr < 5ns
ENABLE
DRIVE
VS
VIH
(VEN
)
S2
S3
S4
VIL
OUTPUT
D
0 V
RL
CL
tOFF (EN)
tON
(EN)
EN
A0
A1
90%
OUTPUT
0 V
VEN
10%
GND
图 23. Turn-On and Turn-Off Time Measurement Setup
18
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
7.7 Charge Injection
The TMUX1104 has a transmission-gate topology. Any mismatch in capacitance between the NMOS and PMOS
transistors results in a charge injected into the drain or source during the falling or rising edge of the gate signal.
The amount of charge injected into the source or drain of the device is known as charge injection, and is denoted
by the symbol QC. 图 24 shows the setup used to measure charge injection from source (Sx) to drain (D).
VDD
0.1…F
VDD
VDD
VS
VEN
S2
S3
S4
OUTPUT
D
0 V
VOUT
CL
Output
VOUT
VS
QC = CL
×
VOUT
A0
A1
EN
VEN
GND
图 24. Charge-Injection Measurement Setup
7.8 Off Isolation
Off isolation is defined as the ratio of the signal at the drain pin (D) of the device when a signal is applied to the
source pin (Sx) of an off-channel. 图 25 shows the setup used to measure, and the equation used to calculate off
isolation.
0.1µF
NETWORK
VDD
ANALYZER
VS
50Q
S
VSIG
D
VOUT
RL
SX
50Q
GND
RL
50Q
图 25. Off Isolation Measurement Setup
≈
∆
«
’
÷
◊
VOUT
VS
Off Isolation = 20 ∂ Log
(1)
19
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7.9 Crosstalk
Crosstalk is defined as the ratio of the signal at the drain pin (D) of a different channel, when a signal is applied
at the source pin (Sx) of an on-channel. 图 26 shows the setup used to measure, and the equation used to
calculate crosstalk.
0.1µF
NETWORK
VDD
ANALYZER
S1
VOUT
RL
D
50Q
VS
RL
S2
50Q
50Q
VSIG
SX
RL
GND
50Q
图 26. Crosstalk Measurement Setup
≈
∆
«
’
÷
◊
VOUT
VS
Channel-to-Channel Crosstalk = 20 ∂ Log
(2)
7.10 Bandwidth
Bandwidth is defined as the range of frequencies that are attenuated by less than 3 dB when the input is applied
to the source pin (Sx) of an on-channel, and the output is measured at the drain pin (D) of the device. 图 27
shows the setup used to measure bandwidth.
0.1µF
NETWORK
VDD
ANALYZER
VS
S
50Q
VSIG
D
VOUT
RL
50Q
SX
GND
RL
50Q
图 27. Bandwidth Measurement Setup
20
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TMUX1104
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
8 Detailed Description
8.1 Functional Block Diagram
The TMUX1104 is an 4:1, 1-channel (single-ended) multiplexer or demultiplexer. Each input is turned on or
turned off based on the state of the address lines and enable pin.
TMUX1104
S1
S2
D1
S3
S4
1-of-4
Decoder
EN A1 A0
图 28. TMUX1104 Functional Block Diagram
8.2 Feature Description
8.2.1 Bidirectional Operation
The TMUX1104 conducts equally well from source (Sx) to drain (Dx) or from drain (Dx) to source (Sx). Each
channel has very similar characteristics in both directions and supports both analog and digital signals.
8.2.2 Rail to Rail Operation
The valid signal path input/output voltage for TMUX1104 ranges from GND to VDD
.
8.2.3 1.8 V Logic Compatible Inputs
The TMUX1104 has 1.8-V logic compatible control for all logic control inputs. The logic input thresholds scale
with supply but still provide 1.8-V logic control when operating at 5.5 V supply voltage. 1.8-V logic level inputs
allows the TMUX1104 to interface with processors that have lower logic I/O rails and eliminates the need for an
external translator, which saves both space and BOM cost. For more information on 1.8 V logic implementations
refer to Simplifying Design with 1.8 V logic Muxes and Switches
8.2.4 Fail-Safe Logic
The TMUX1104 supports Fail-Safe Logic on the control input pins (EN, A0, A1) allowing for operation up to 5.5
V, regardless of the state of the supply pin. This feature allows voltages on the control pins to be applied before
the supply pin, protecting the device from potential damage. Fail-Safe Logic minimizes system complexity by
removing the need for power supply sequencing on the logic control pins. For example, the Fail-Safe Logic
feature allows the select pins of the TMUX1104 to be ramped to 5.5 V while VDD = 0 V. Additionally, the feature
enables operation of the TMUX1104 with VDD = 1.2 V while allowing the select pins to interface with a logic level
of another device up to 5.5 V.
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TMUX1104
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www.ti.com.cn
Feature Description (接下页)
8.2.5 Ultra-low Leakage Current
The TMUX1104 provides extremely low on-leakage and off-leakage currents. The TMUX1104 is capable of
switching signals from high source-impedance inputs into a high input-impedance op amp with minimal offset
error because of the ultra-low leakage currents. 图 29 shows typical leakage currents of the TMUX1104 versus
temperature.
3.5
2.5
1.5
IS(OFF)
0.5
-0.5
ID(OFF)
-1.5
-2.5
I(ON)
-3.5
-40
-20
0
20
40
60
80
100
120
Temperature (èC)
D008
图 29. Leakage Current vs Temperature
8.2.6 Ultra-low Charge Injection
The TMUX1104 has a transmission gate topology, as shown in 图 30. Any mismatch in the stray capacitance
associated with the NMOS and PMOS causes an output level change whenever the switch is opened or closed.
OFF ON
CGDN
CGSN
D
S
CGSP
CGDP
OFF ON
图 30. Transmission Gate Topology
22
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
Feature Description (接下页)
The TMUX1104 has special charge-injection cancellation circuitry that reduces the source-to-drain charge
injection to 1.5 pC at VS = 1 V as shown in 图 31.
20
15
10
VDD = 5 V
5
0
-5
-10
VDD = 3.3 V
-15
-20
0
1
2
3
VS - Source Voltage (V)
4
5
D011
图 31. Charge Injection vs Source Voltage
8.3 Device Functional Modes
When the EN pin of the TMUX1104 is pulled high, one of the switches is closed based on the state of the
address lines. When the EN pin is pulled low, all the switches are in an open state regardless of the state of the
address lines. The control pins can be as high as 5.5 V.
8.4 Truth Tables
表 1 show the truth tables for the TMUX1104.
表 1. TMUX1104 Truth Table
EN
0
A1
X(1) X(1)
A0
Selected Input Connected To Drain (D) Pin
All channels are off
1
0
0
1
1
0
1
0
1
S1
S2
S3
S4
1
1
1
(1) X denotes don't care.
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23
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TMUX11xx family offers ulta-low input/output leakage currents and low charge injection. These devices
operate up to 5.5 V, and offer true rail-to-rail input and output of both analog and digital signals. The TMUX1104
has a low on-capacitance which allows faster settling time when multiplexing inputs in the time domain. These
features make the TMUX11xx devices a family of precision, high-performance switches and multiplexers for low-
voltage applications.
9.2 Typical Application
图 32 shows a 16-bit, 4 input, multiplexed, data-acquisition system. This example is typical in industrial
applications that require low distortion for precision measurements. The circuit uses the ADS8864, a 16-bit, 400-
kSPS successive-approximation-resistor (SAR) analog-to-digital converter (ADC), along with a precision
amplifier, and a 4 input mux.
VDD
VDD
EN
S1
Bridge Sensor
Thermocouple
3.3V
REF
+
OPA333
-
S2
S3
D
+
Gain / Filter
Network
OPA333
-
ADS8864
S4
Current
Sensing
A1
A0
GND
1.8V Logic
Signals
Photo
LED
Detector
Optical Sensor
TMUX1104
Analog Inputs
图 32. Multiplexing Signals to External ADC
9.3 Design Requirements
For this design example, use the parameters listed in 表 2.
表 2. Design Parameters
PARAMETERS
Supply (VDD
VALUES
)
3.3 V
I/O signal range
0 V to VDD (Rail to Rail)
1.8 V compatible
Control logic thresholds
24
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TMUX1104
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
9.4 Detailed Design Procedure
The TMUX1104 can be operated without any external components except for the supply decoupling capacitors. If
the desired power-up state is disabled, the enable pin should have a weak pull-down resistor and be controlled
by the MCU via GPIO. All inputs being muxed to the ADC must fall within the recommend operating conditions of
the TMUX1104, including signal range and continuous current. For this design with a supply of 3.3V the signal
range can be 0 V to 3.3 V, and the max continuous current can be 30 mA.
The design example highlights a multiplexed data-acquisition system for highest system linearity and fast settling.
The overall system block diagram is illustrated in 图 32. The circuit is a multichannel data-acquisition signal chain
consisting of an input low-pass filter, mux, mux output buffer, SAR ADC driver, and a reference buffer. The
architecture provides a cost-effective solution for fast sampling of multiple channels using a single ADC.
9.5 Application Curve
The TMUX1104 is capable of switching signals from high source-impedance inputs into a high input-impedance
op amp with minimal offset error because of the ultra-low leakage currents.
40
30
20
VDD = 1.32 V
VDD = 1.98 V
VDD = 3.63 V
10
0
-10
-20
-30
-40
0
0.5
1
1.5
2
2.5
3
VS or VD - Source or Drain Voltage (V)
3.5
4
D005
TA = 25°C
图 33. On-Leakage vs Source or Drain Voltage
10 Power Supply Recommendations
The TMUX1104 operates across a wide supply range of 1.08 V to 5.5 V. Do not exceed the absolute maximum
ratings because stresses beyond the listed ratings can cause permanent damage to the devices.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply to
other components. Good power-supply decoupling is important to achieve optimum performance. For improved
supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to ground.
Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance
connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series
resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive
systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to
the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall
inductance and is beneficial for connections to ground planes.
版权 © 2018–2019, Texas Instruments Incorporated
25
TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
www.ti.com.cn
11 Layout
11.1 Layout Guidelines
11.1.1 Layout Information
When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of
the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This
increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance
of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must
turn corners.图 34 shows progressively better techniques of rounding corners. Only the last example (BEST)
maintains constant trace width and minimizes reflections.
WORST
BETTER
BEST
1W min.
W
图 34. Trace Example
Route high-speed signals using a minimum of vias and corners which reduces signal reflections and
impedance changes. When a via must be used, increase the clearance size around it to minimize its
capacitance. Each via introduces discontinuities in the signal’s transmission line and increases the chance of
picking up interference from the other layers of the board. Be careful when designing test points, through-
hole pins are not recommended at high frequencies.
图 35 illustrates an example of a PCB layout with the TMUX1104. Some key considerations are:
•
Decouple the VDD pin with a 0.1-µF capacitor, placed as close to the pin as possible. Make sure that the
capacitor voltage rating is sufficient for the VDD supply.
•
•
•
Keep the input lines as short as possible.
Use a solid ground plane to help reduce electromagnetic interference (EMI) noise pickup.
Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when necessary.
11.2 Layout Example
A0
A1
S2
D
TMUX1104
S1
GND
S3
S4
VDD
EN
Via to
GND plane
C
Wide (low inductance)
trace for power
图 35. TMUX1104 Layout Example
26
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TMUX1104
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ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档
德州仪器 (TI),《真差分 4 x 2 多路复用器、模拟前端、同步采样 ADC 电路》。
德州仪器 (TI),《使用低 CON 多路复用器改善稳定性问题》。
德州仪器 (TI),《使用 1.8V 逻辑多路复用器和开关简化设计》。
德州仪器 (TI),《利用关断保护信号开关消除电源排序》。
德州仪器 (TI),《高电压模拟多路复用器的系统级保护》。
德州仪器 (TI),《QFN/SON PCB 连接》。
德州仪器 (TI),《四方扁平封装无引线逻辑封装》。
12.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 商标
E2E is a trademark of Texas Instruments.
12.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2018–2019, Texas Instruments Incorporated
27
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMUX1104DGSR
TMUX1104DQAR
ACTIVE
ACTIVE
VSSOP
USON
DGS
DQA
10
10
2500 RoHS & Green
3000 RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
1D7
104
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMUX1104DGSR
TMUX1104DQAR
VSSOP
USON
DGS
DQA
10
10
2500
3000
330.0
180.0
12.4
9.5
5.3
3.4
1.4
8.0
4.0
12.0
8.0
Q1
Q1
1.18
2.68
0.72
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMUX1104DGSR
TMUX1104DQAR
VSSOP
USON
DGS
DQA
10
10
2500
3000
364.0
189.0
364.0
185.0
27.0
36.0
Pack Materials-Page 2
PACKAGE OUTLINE
DGS0010A
VSSOP - 1.1 mm max height
S
C
A
L
E
3
.
2
0
0
SMALL OUTLINE PACKAGE
C
SEATING PLANE
0.1 C
5.05
4.75
TYP
PIN 1 ID
AREA
A
8X 0.5
10
1
3.1
2.9
NOTE 3
2X
2
5
6
0.27
0.17
10X
3.1
2.9
1.1 MAX
0.1
C A
B
B
NOTE 4
0.23
0.13
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.7
0.4
0 - 8
DETAIL A
TYPICAL
4221984/A 05/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
www.ti.com
EXAMPLE BOARD LAYOUT
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
(R0.05)
TYP
SYMM
10X (0.3)
1
5
10
SYMM
6
8X (0.5)
(4.4)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221984/A 05/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
SYMM
(R0.05) TYP
10X (0.3)
8X (0.5)
1
5
10
SYMM
6
(4.4)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221984/A 05/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DQA0010A
USON - 0.55 mm max height
SCALE 6.000
PLASTIC SMALL OUTLINE - NO LEAD
1.1
0.9
A
B
PIN 1 INDEX AREA
2.6
2.4
C
0.55 MAX
SEATING PLANE
(0.13) TYP
0.08 C
0.05
0.00
5
6
4X 0.5
(R0.125)
2X
2
0.45
0.35
2X
0.1
C A
B
0.05
1
10
0.25
0.15
8X
PIN 1 ID
(OPTIONAL)
0.1
0.05
C A
B
0.43
0.30
10X
C
4220328/A 12/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DQA0010A
USON - 0.55 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
10X (0.565)
8X (0.2)
1
10
SYMM
2X (0.4)
4X (0.5)
6
5
(R0.05) TYP
SYMM
(0.835)
LAND PATTERN EXAMPLE
SCALE:30X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4220328/A 12/2015
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DQA0010A
USON - 0.55 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
10X (0.565)
8X (0.2)
1
10
METAL
TYP
SYMM
2X (0.36)
8
3
4X (0.5)
6
5
(R0.05) TYP
SYMM
(0.835)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PADS 3 & 8:
90% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:40X
4220328/A 12/2015
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
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