TMS320C6202GLS-150 [TI]
32-BIT, 150MHz, OTHER DSP, PBGA384, PLASTIC, BGA-384;型号: | TMS320C6202GLS-150 |
厂家: | TEXAS INSTRUMENTS |
描述: | 32-BIT, 150MHz, OTHER DSP, PBGA384, PLASTIC, BGA-384 |
文件: | 总83页 (文件大小:1175K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Highest Performance Fixed-Point Digital
Flexible Phase-Locked-Loop (PLL) Clock
Generator
Signal Processors (DSPs) TMS320C62x
– 5-, 4-, 3.33-ns Instruction Cycle Time
– 200-, 250-, 300-MHz Clock Rate
– Eight 32-Bit Instructions/Cycle
– 1600, 2000, 2400 MIPS
32-Bit Expansion Bus
– Glueless/Low-Glue Interface to Popular
PCI Bridge Chips
– Glueless/Low-Glue Interface to Popular
Synchronous or Asynchronous
Microprocessor Buses
– Master/Slave Functionality
– Glueless Interface to Synchronous FIFOs
and Asynchronous Peripherals
VelociTI Advanced Very Long Instruction
Word (VLIW) ’C62x CPU Core
– Eight Highly Independent Functional
Units:
– Six ALUs (32-/40-Bit)
– Two 16-Bit Multipliers (32-Bit Result)
– Load-Store Architecture With 32 32-Bit
General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
Multichannel Buffered Serial Ports
(McBSPs)
– Direct Interface to T1/E1, MVIP, SCSA
Framers
– ST-Bus-Switching Compatible
– Up to 256 Channels Each
– AC97-Compatible
– Serial-Peripheral Interface (SPI)
Compatible (Motorola )
Instruction Set Features
– Byte-Addressable (8-, 16-, 32-Bit Data)
– 32-Bit Address Range
– 8-Bit Overflow Protection
– Saturation
– Bit-Field Extract, Set, Clear
– Bit-Counting
– Normalization
Two 32-Bit General-Purpose Timers
†
IEEE-1149.1 (JTAG )
Boundary-Scan-Compatible
352-Pin BGA Package (GJL) (’02/02B/03)
384-Pin BGA Package (GLS) (’02/02B/03)
On-Chip SRAM
– 1M-Bit (’C6204)
– 3M-Bit (’C6202/’C6202B)
– 7M-Bit (’C6203)
340-Pin BGA Package (GLW) (’C6204 only)
– Pin-Compatible With the GLS Package
Except Inner Row of Balls (Additional
32-Bit External Memory Interface (EMIF)
– Glueless Interface to Synchronous
Memories: SDRAM or SBSRAM
– Glueless Interface to Asynchronous
Memories: SRAM and EPROM
‡
Power and Ground Pins) are Removed
0.18-µm/5-Level Metal Process (’6202 only)
0.15-µm/5-Level Metal Process (’02B/03/04)
– CMOS Technology
Four-Channel Bootloading
Direct-Memory-Access (DMA) Controller
With an Auxiliary Channel
3.3-V I/Os, 1.8-V Internal (’C6202 only)
3.3-V I/Os, 1.5-V Internal (’C6202B/03/04)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VelociTI is a trademark of Texas Instruments Incorporated.
Motorola is a trademark of Motorola, Inc.
†
‡
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
For more details, see the GLS/GLW BGA package bottom view.
Copyright 1999, Texas Instruments Incorporated
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
GJL 352-PIN BALL GRID ARRAY (BGA) PACKAGE (’C6202/02B/03 ONLY)
(BOTTOM VIEW)
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
5
7
9
11 13 15 17 19 21 23 25
10 12 14 16 18 20 22 24 26
2
4
6
8
GLS 384-PIN BGA PACKAGE (’C6202/02B/03 ONLY)
GLW 340-PIN BGA PACKAGE (’C6204 ONLY)
(BOTTOM VIEW)
AB
Y
AA
W
U
R
N
L
V
T
P
M
K
J
H
F
G
E
C
A
D
B
1
3
5
7
9
11 13 15 17 19 21
2
4
6
8
10 12 14 16 18 20 22
These balls are NOT applicable for the ’C6204 devices GLW 340-pin BGA package.
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
selection guide
Table 1 provides an overview of the TMS320C6202/02B/03/04 pin-compatible DSPs. The table shows
significant features of each device, including the capacity of on-chip RAM, the peripherals, the execution time,
and the package type with pin count, etc.
Table 1. TMS320C6202/02B/03/04 DSP Selection Guide
HARDWARE FEATURES
’C6202
’C6202B
’C6203
’C6204
EMIF
√
√
√
√
4-Channel With
Throughput
4-Channel With
Throughput
4-Channel With
Throughput
DMA
4-Channel
Enhancements
Enhancements
Enhancements
Peripherals
Expansion Bus
McBSPs
√
3
√
3
√
3
√
2
32-Bit Timers
Size (Bytes)
2
2
2
2
256K
256K
384K
64K
Block 0:
Block 0:
Block 0:
128K Bytes
Mapped Program
Block 1:
128K Bytes
Cache/Mapped
Program
128K Bytes
Mapped Program
Block 1:
128K Bytes
Cache/Mapped
Program
256K Bytes Mapped
Program
Block 1:
128K Bytes
Cache/Mapped
Program
1 Block:
Internal Program
Memory
64K Bytes
Cache/Mapped
Program
Organization
Size (Bytes)
Organization
128K
128K
512K
64K
2 Blocks:
Four 16-Bit Banks
per Block
2 Blocks:
Four 16-Bit Banks
per Block
2 Blocks:
Four 16-Bit Banks
per Block
2 Blocks:
Four 16-Bit Banks
per Block
Internal Data
Memory
50/50 Split
50/50 Split
50/50 Split
50/50 Split
Frequency
Cycle Time
MHz
ns
200, 250
250
250, 300
200
4 ns (’6202-250)
5 ns (’6202-200)
3.33 ns (’6203-300)
4 ns (’6203-250)
4 ns (’6202B-250)
5 ns (’6204-200)
Core (V)
1.8
1.5
1.5
1.5
Voltage
I/O (V)
3.3
3.3
3.3
3.3
Bypass (x1)
√
√
√
√
x4
√
√
√
√
PLL Options:
In Both Packages
x8
–
√
√
–
x10
–
√
√
–
Additional
x6
–
√
√
–
PLL Options:
18 x 18 mm
Packages
x7
–
√
√
–
x9
–
√
√
–
(GLS/GLW only)
x11
–
√
√
–
27 x 27 mm
18 x 18 mm
352-pin GJL
384-pin GLS
352-pin GJL
384-pin GLS
352-pin GJL
384-pin GLS
–
BGA Package
340-pin GLW
Process
Technology
µm
0.18 µm (18C05)
0.15 µm (15C05)
0.15 µm (15C05)
0.15 µm (15C05)
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
Product Status
AI
PP
PP
PP
3
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
description
The TMS320C6202, TMS320C6202B, TMS320C6203, and TMS320C6204 devices are part of the
TMS320C62x fixed-point DSP family in the TMS320C6000 platform. The ’C62x devices are based on the
high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture developed by Texas
Instruments (TI ), making these DSPs an excellent choice for multichannel and multifunction applications.
The TMS320C62x DSP offers cost-effective solutions to high-performance DSP programming challenges. The
TMS320C6202B/’03 has a performance of up to 2400 million instructions per second (MIPS) at 300 MHz, while
the TMS320C6202 has a performance of up to 2000 MIPS at 250 MHz, and the TMS320C6204 has a
performance of up to 1600 MIPS at 200 MHz. The ’C6202/’02B/’03/’04 DSP possesses the operational flexibility
of high-speed controllers and the numerical capability of array processors. These processors have
32 general-purpose registers of 32-bit word length and eight highly independent functional units. The eight
functionalunitsprovidesixarithmeticlogicunits(ALUs)forahighdegreeofparallelismandtwo16-bitmultipliers
for a 32-bit result. The ’C6202/’02B/’03/’04 can produce two multiply-accumulates (MACs) per cycle. This gives
a total of 600 million MACs per second (MMACS) for the ’C6202B/’03 device, a total of 500 MMACS for the
’C6202 device, and a total of 400 MMACS for the ’C6204 device. The ’C6202/’02B/’03/’04 DSP also has
application-specific hardware logic, on-chip memory, and additional on-chip peripherals.
The TMS320C62x DSPs include an on-chip memory, with the ’C6203 device offering the most memory at
7 Mbits. Forthe’C6202/’02Bdevice, programmemoryconsistsoftwoblocks, witha128K-byteblockconfigured
as memory-mapped program space, and the other 128K-byte block user-configurable as cache or
memory-mapped program space. Data memory consists of two 64K-byte blocks of RAM. Similarly, the ’C6203
deviceprogrammemoryconsistsoftwoblocks, witha256K-byteblockconfiguredasmemory-mappedprogram
space, and the other 128K-byte block user-configurable as cache or memory-mapped program space. Data
memory consists of two 256K-byte blocks of RAM. For the ’C6204 device, program memory consists of a single
64K-byte block that is user-configured as cache or memory-mapped program space. Data memory consists of
two 32K-byte blocks of RAM.
The ’C6202/’02B/’03/’04 device has a powerful and diverse set of peripherals. The peripheral set includes
multichannel buffered serial ports (McBSPs), general-purpose timers, a 32-bit expansion bus (XB) that offers
ease of interface to synchronous or asynchronous industry-standard host bus protocols, and a glueless 32-bit
externalmemoryinterface(EMIF)capableofinterfacingtoSDRAMorSBSRAMandasynchronousperipherals.
The ’C62x devices have a complete set of development tools which includes: a new C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source
code execution.
TI is a trademark of Texas Instruments Incorporated
Windows is a registered trademark of the Microsoft Corporation.
4
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
’C62x device compatibility
The TMS320C6202, ’C6202B, ’C6203, and ’C6204 devices are pin-compatible; thus, making new system
designseasierandprovidingfastertimetomarket. Thefollowinglistsummarizesthe’C62xdevicecharacteristic
differences:
Core Supply Voltage (1.8 V versus 1.5 V)
PLL Options Availability
Table 1 identifies the available PLL multiply factors [e.g., CLKIN x1 (PLL bypassed), x4] for each of the
’C62x devices. For additional details on the PLL clock module, see the Clock PLL section of this data sheet.
On-Chip Memory Size
The ’C6202/’02B, ’C6203, and ’C6204 devices have different on-chip program memory and data memory
sizes (see Table 1).
McBSPs
The ’C6204 device has two McBSPs while the ’C6202/’02B/’03 devices have three McBSPs on-chip.
For a more detailed discussion on migration concerns, and similarities/differences between the ’C6202,
’C6202B, ’C6203, and ’C6204 devices, see the How to Begin Development and Migrate Across the
TMS320C6202/6202B/6203/6204 DSPs application report (literature number SPRA603) document.
5
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
functional and CPU block diagram (’C62x devices)
’C6202/’02B/’03/’04 Digital Signal Processors
SDRAM or
SBSRAM
Program
Access/Cache
Controller
32
Internal Program Memory
(see Table 1)
SRAM
External Memory
Interface (EMIF)
ROM/FLASH
I/O Devices
’C62x CPU
Timer 0
Timer 1
Instruction Fetch
Control
Registers
Instruction Dispatch
Instruction Decode
Control
Logic
Multichannel
Buffered Serial
Port 0
Data Path A
Data Path B
Test
Framing Chips:
H.100, MVIP,
SCSA, T1, E1
AC97 Devices,
SPI Devices
Codecs
A Register File
B Register File
In-Circuit
Emulation
Multichannel
Buffered Serial
Port 1
Interrupt
Control
.L1 .S1 .M1 .D1
.D2 .M2 .S2 .L2
Multichannel
Buffered Serial
†
Port 2
Direct Memory
Access Controller
(DMA)
Synchronous
FIFOs
Internal Data
Memory
Data
Access
Controller
32
Expansion
Bus
Power-
Down
Logic
(see Table 1)
I/O Devices
(see Table 1)
HOST CONNECTION
Master /Slave
TI PCI2040
Power PC
683xx
PLL
(see Table 1)
960
†
McBSP2 is not applicable for the ’C6204 device.
6
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
CPU description
The CPU fetches VelociTI axdvanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight
32-bit instructions to the eight functional units during every clock cycle. The VelociTI VLIW architecture features
controls by which all eight units do not have to be supplied with instructions if they are not ready to execute. The
first bit of every 32-bit instruction determines if the next instruction belongs to the same execute packet as the
previous instruction, or whether it should be executed in the following clock as a part of the next execute packet.
Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The variable-length
executepacketsareakeymemory-savingfeature, distinguishingthe’C62xCPUfromotherVLIWarchitectures.
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register files
eachcontain1632-bitregistersforatotalof32general-purposeregisters. Thetwosetsoffunctionalunits, along
with two register files, compose sides A and B of the CPU (see the Functional and CPU Block Diagram and
Figure 1). The four functional units on each side of the CPU can freely share the 16 registers belonging to that
side. Additionally, each side features a single data bus connected to all the registers on the other side, by which
the two sets of functional units can access data from the register files on the opposite side. While register access
by functional units on the same side of the CPU as the register file can service all the units in a single clock cycle,
register access using the register file across the CPU supports one read and one write per cycle.
Another key feature of the ’C62x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file. The
’C62x CPU supports a variety of indirect addressing modes using either linear- or circular-addressing modes
with 5- or 15-bit offsets. All instructions are conditional, and most can access any one of the 32 registers. Some
registers, however, are singled out to support specific addressing or to hold the condition for conditional
instructions (if the condition is not automatically “true”). The two .M functional units are dedicated for multiplies.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. If an execute packet crosses the
fetch-packet boundary (256 bits wide), the assembler places it in the next fetch packet, while the remainder of
the current fetch packet is padded with NOP instructions. The number of execute packets within a fetch packet
can vary from one to eight. Execute packets are dispatched to their respective functional units at the rate of one
per clock cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch
packet have been dispatched. After decoding, the instructions simultaneously drive all active functional units
for a maximum execution rate of eight instructions every clock cycle. While most results are stored in 32-bit
registers, they can be subsequently moved to memory as bytes or half-words as well. All load and store
instructions are byte-, half-word, or word-addressable.
7
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
CPU description (continued)
src1
src2
dst
long dst
long src
.L1
8
8
32
ST1
8
long src
long dst
dst
Register
File A
Data Path A
.S1
src1
(A0–A15)
src2
dst
src1
.M1
.D1
src2
LD1
dst
src1
src2
DA1
2X
1X
src2
src1
dst
DA2
.D2
LD2
src2
.M2
.S2
src1
dst
src2
Register
File B
(B0–B15)
Data Path B
src1
dst
long dst
long src
8
32
8
ST2
8
long src
long dst
dst
.L2
src2
src1
Control
Register
File
Figure 1. TMS320C62x CPU Data Paths
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
signal groups description
CLKIN
CLKOUT2
CLKOUT1
RESET
CLKMODE0
†
NMI
CLKMODE1
Clock/PLL
†
EXT_INT7
EXT_INT6
EXT_INT5
CLKMODE2
PLLV
PLLG
PLLF
Reset and
EXT_INT4
Interrupts
IACK
INUM3
INUM2
INUM1
TMS
TDO
TDI
IEEE Standard
1149.1
(JTAG)
Emulation
INUM0
TCK
TRST
EMU1
EMU0
DMAC3
DMAC2
DMAC1
DMAC0
DMA Status
RSV11
RSV10
RSV9
RSV8
’C6204
Only
Power-Down
Status
PD
RSV7
RSV6
RSV5
‡
Reserved
RSV4
RSV3
RSV2
RSV1
RSV0
Control/Status
†
‡
CLKMODE1 is NOT available on the ’C6202 device GJL package.
CLKMODE2 is NOT available on the GJL packages for the ’C6202/’02B/’03 devices.
RSV5 through RSV11 pins are used on the ’C6204 device only.
Figure 2. CPU Signals
9
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
signal groups description (continued)
ARE
Asynchronous
Memory
32
AOE
AWE
ARDY
ED[31:0]
Data
Control
CE3
CE2
CE1
CE0
Memory Map
Space Select
SDA10
Synchronous
Memory
SDRAS/SSOE
SDCAS/SSADS
SDWE/SSWE
Control
20
EA[21:2]
Word Address
Byte Enables
BE3
BE2
BE1
BE0
HOLD
HOLD/
HOLDA
HOLDA
EMIF
(External Memory Interface)
TOUT1
TINP1
TOUT0
TINP0
Timer 1
Timer 0
Timers
McBSP1
Transmit
McBSP0
Transmit
CLKX1
FSX1
DX1
CLKX0
FSX0
DX0
CLKR1
FSR1
DR1
CLKR0
FSR0
DR0
Receive
Clock
Receive
Clock
CLKS1
CLKS0
N/A For ’C6204 Devices
McBSP2
Transmit
CLKX2
FSX2
DX2
CLKR2
FSR2
DR2
Receive
Clock
CLKS2
McBSPs
(Multichannel Buffered Serial Ports)
Figure 3. Peripheral Signals
10
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
signal groups description (continued)
32
XCLKIN
XFCLK
XD[31:0]
Data
Clocks
XBE3/XA5
XBE2/XA4
XBE1/XA3
XBE0/XA2
Byte-Enable
Control/
Address
XOE
XRE
XWE/XWAIT
XCE3
XCE2
I/O Port
Control
XRDY
Control
XCE1
XCE0
XHOLD
Arbitration
XHOLDA
XCS
XAS
XCNTL
XW/R
XBLAST
XBOFF
Host
Interface
Control
Expansion Bus
Figure 3. Peripheral Signals (Continued)
11
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GLW
GJL
CLOCK/PLL
Clock Input
Clock output at full device speed
Clock output at half of device speed
Used for synchronous memory interface
Clock mode selects
CLKIN
C12
B10
Y18
B10
Y18
I
CLKOUT1
AD20
O
CLKOUT2
AC19
B15
AB19
B12
AB19
B12
O
•
CLKMODE0
CLKMODE1
CLKMODE2
I
I
I
•
Selects what multiply factors of the input clock frequency the CPU frequency
equals.
§
C11
¶
A9
¶
A9
For more detail on CLKMODE pins and the PLL multiply factors, see the Clock
PLL section of this data sheet.
¶
A14
¶
A14
–
#
||
A
||
A
||
A
PLLV
D13
D14
C13
C11
C12
A11
C11
C12
A11
PLL analog V connection for the low-pass filter
CC
#
PLLG
PLLF
PLL analog GND connection for the low-pass filter
PLL low-pass filter connection to external components and a bypass capacitor
JTAG EMULATION
TMS
TDO
TDI
AD7
AE6
AF5
AE5
AC7
AF6
AC8
Y5
Y5
I
JTAG test-port mode select (features an internal pullup)
JTAG test-port data out
AA4
Y4
AA4
Y4
O/Z
I
I
I
JTAG test-port data in (features an internal pullup)
JTAG test-port clock
TCK
AB2
AA3
AA5
AB4
AB2
AA3
AA5
AB4
TRST
EMU1
EMU0
JTAG test-port reset (features an internal pulldown)
Emulation pin 1, pullup with a dedicated 20-kΩ resistor
Emulation pin 0, pullup with a dedicated 20-kΩ resistor
RESET AND INTERRUPTS
I/O/Z
I/O/Z
RESET
NMI
K2
L2
J3
J3
I
I
Device reset
Nonmaskable interrupt
K2
K2
•
Edge-driven (rising edge)
EXT_INT7
EXT_INT6
EXT_INT5
EXT_INT4
IACK
V4
Y2
U2
U3
W1
V2
V1
R3
T1
T2
T3
U2
U3
W1
V2
V1
R3
T1
T2
T3
External interrupts
Edge-driven (rising edge)
I
•
AA1
W4
Y1
O
O
Interrupt acknowledge for all active interrupts serviced by the CPU
Active interrupt identification number
INUM3
V2
INUM2
U4
V3
•
•
Valid during IACK for all active interrupts (not just external)
Encoding order follows the interrupt-service fetch-packet ordering
INUM1
INUM0
W2
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
§
¶
#
||
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
For the ’C6202 GJL package, the C11 pin is ground (V ).
SS
For the ’C6202 GLS and ’C6204 GLW packages, the CLKMODE2 (A14) and CLKMODE1 (A9) pins are internally unconnected.
PLLV and PLLG are not part of external voltage supply or ground. See the clock PLL section for information on how to connect these pins.
A = Analog Signal (PLL Filter)
For emulation and normal operation, pull up EMU1 and EMU0 with a dedicated 20-kΩ resistor. For boundary scan, pull down EMU1 and EMU0
with a dedicated 20-kΩ resistor.
12
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GJL
GLW
POWER-DOWN STATUS
PD
AB2
Y2
Y2
O
Power-down modes 2 or 3 (active if high)
EXPANSION BUS
XCLKIN
XFCLK
XD31
XD30
XD29
XD28
XD27
XD26
XD25
XD24
XD23
XD22
XD21
XD20
XD19
XD18
XD17
XD16
XD15
XD14
XD13
XD12
XD11
XD10
XD9
A9
C8
C8
I
Expansion bus synchronous host interface clock input
Expansion bus FIFO interface clock output
B9
A8
A8
O
D15
B16
A17
B17
D16
A18
B18
D17
C18
A20
D18
C19
A21
D19
C20
B21
A22
D20
B22
E25
F24
E26
F25
G24
H23
F26
G25
J23
G26
H25
J24
K23
C13
A13
C14
B14
B15
C15
A15
B16
C16
A17
B17
C17
B18
A19
C18
B19
C19
B20
A21
C21
D20
B22
D21
E20
E21
D22
F20
F21
E22
G20
G21
G22
C13
A13
C14
B14
B15
C15
A15
B16
C16
A17
B17
C17
B18
A19
C18
B19
C19
B20
A21
C21
D20
B22
D21
E20
E21
D22
F20
F21
E22
Expansion bus data
•
•
Used for transfer of data, address, and control
Also controls initialization of DSP modes and expansion bus at reset via pullup/
pulldown resistors
(Note: Reserved boot configuration fields should be pulled down.)
– XCE[3:0] memory type
– XBLAST polarity
– XW/R polarity
– Asynchronous or synchronous host operation
– Arbitration mode (internal or external)
– FIFO mode
– Little endian/big endian
– Boot mode
I/O/Z
XD8
XD7
XD6
XD5
XD4
XD3
XD2
G20
G21
G22
XD1
XD0
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
13
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
EXPANSION BUS (CONTINUED)
Expansion bus I/O port memory space enables
†
GJL
GLW
XCE3
F2
E1
D2
B1
D3
C2
C5
A4
B5
C6
A6
C7
B7
C9
B6
D2
B1
D3
C2
C5
A4
B5
C6
A6
C7
B7
C9
B6
XCE2
O/Z
•
•
Enabled by bits 28, 29, and 30 of the word address
Only one asserted during any I/O port data access
XCE1
F3
XCE0
E2
XBE3/XA5
XBE2/XA4
XBE1/XA3
XBE0/XA2
XOE
C7
D8
A6
Expansion bus multiplexed byte-enable control/address signals
I/O/Z
•
•
Act as byte enable for host port operation
Act as address for I/O port operation
C8
A7
O/Z
O/Z
O/Z
I
Expansion bus I/O port output enable
XRE
C9
D10
A10
D9
Expansion bus I/O port read enable
XWE/XWAIT
XCS
Expansion bus I/O port write enable and host port wait signals
Expansion bus host port chip-select input
Expansion bus host port address strobe
XAS
I/O/Z
Expansion bus host control. XCNTL selects between expansion bus address or data
register
XCNTL
B10
B9
B9
I
XW/R
D11
A5
B8
C4
B4
B8
C4
B4
I/O/Z
I/O/Z
I/O/Z
I
Expansion bus host port write/read enable. XW/R polarity selected at reset
Expansion bus host port ready (active low) and I/O port ready (active high)
Expansion bus host port burst last–polarity selected at reset
Expansion bus back off
XRDY
XBLAST
XBOFF
XHOLD
XHOLDA
B6
B11
B5
A10
A2
A10
A2
I/O/Z
I/O/Z
Expansion bus hold request
D7
B3
B3
Expansion bus hold acknowledge
EMIF – CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
CE3
CE2
CE1
CE0
BE3
BE2
BE1
BE0
AB25
AA24
AB26
AA25
Y24
Y21
W20
AA22
W21
V20
Y21
Memory space enables
W20
O/Z
•
•
Enabled by bits 24 and 25 of the word address
Only one asserted during any external data access
AA22
W21
V20
Byte-enable control
W23
AA26
Y25
V21
V21
•
•
•
Decoded from the two lowest bits of the internal address
Byte-write enables for most types of memory
Can be directly connected to SDRAM read and write mask signal (SDQM)
O/Z
W22
U20
W22
U20
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
14
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GLW
GJL
EMIF – ADDRESS
EA21
J25
J26
H20
H21
H22
J20
H20
H21
H22
J20
EA20
EA19
EA18
EA17
EA16
EA15
EA14
EA13
EA12
EA11
EA10
EA9
L23
K25
L24
L25
M23
M24
M25
N23
P24
P23
R25
R24
R23
T25
T24
U25
T23
V26
J21
J21
K21
K20
K22
L21
L20
L22
M20
M21
N22
N20
N21
P21
P20
R22
R21
K21
K20
K22
L21
L20
L22
M20
M21
N22
N20
N21
P21
P20
R22
R21
O/Z
External address (word address)
EA8
EA7
EA6
EA5
EA4
EA3
EA2
EMIF – DATA
ED31
ED30
ED29
ED28
ED27
ED26
ED25
ED24
ED23
ED22
ED21
ED20
ED19
ED18
ED17
ED16
ED15
ED14
AD8
AC9
Y6
AA6
AB6
Y7
Y6
AA6
AB6
Y7
AF7
AD9
AC10
AE9
AA7
AB8
Y8
AA7
AB8
Y8
AF9
AC11
AE10
AD11
AE11
AC12
AD12
AE12
AC13
AD14
AC14
AE15
AA8
AA9
Y9
AA8
AA9
Y9
I/O/Z
External data
AB10
Y10
AA10
AA11
Y11
AB10
Y10
AA10
AA11
Y11
AB12
Y12
AA12
AB12
Y12
AA12
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
15
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
EMIF – DATA (CONTINUED)
†
GLW
GJL
ED13
AD15
AC15
AE16
AD16
AE17
AC16
AF18
AE18
AC17
AD18
AF20
AC18
AD19
AF21
AA13
Y13
AA13
Y13
ED12
ED11
ED10
ED9
ED8
ED7
ED6
ED5
ED4
ED3
ED2
ED1
ED0
AB13
Y14
AB13
Y14
AA14
AA15
Y15
AA14
AA15
Y15
I/O/Z
External data
AB15
AA16
Y16
AB15
AA16
Y16
AB17
AA17
Y17
AB17
AA17
Y17
AA18
AA18
EMIF – ASYNCHRONOUS MEMORY CONTROL
ARE
V24
V25
U23
W25
T21
R20
T22
T20
T21
R20
T22
T20
O/Z
O/Z
O/Z
I
Asynchronous memory read enable
Asynchronous memory output enable
Asynchronous memory write enable
Asynchronous memory ready input
AOE
AWE
ARDY
EMIF – SYNCHRONOUS DRAM (SDRAM)/SYNCHRONOUS BURST SRAM (SBSRAM) CONTROL
SDA10
AE21
AE22
AF22
AC20
AA19
AB21
Y19
AA19
AB21
Y19
O/Z
O/Z
O/Z
O/Z
SDRAM address 10 (separate for deactivate command)
SDRAM column-address strobe/SBSRAM address strobe
SDRAM row-address strobe/SBSRAM output enable
SDRAM write enable/SBSRAM write enable
SDCAS/SSADS
SDRAS/SSOE
SDWE/SSWE
AA20
AA20
EMIF – BUS ARBITRATION
HOLD
Y26
V23
V22
U21
V22
U21
I
Hold request from the host
HOLDA
O
Hold-request-acknowledge to the host
TIMERS
TOUT1
TINP1
TOUT0
TINP0
J4
G2
F1
H4
F2
F3
D1
E2
F2
F3
D1
E2
O
I
Timer 1 or general-purpose output
Timer 1 or general-purpose input
Timer 0 or general-purpose output
Timer 0 or general-purpose input
O
I
DMA ACTION COMPLETE STATUS
DMAC3
DMAC2
DMAC1
DMAC0
Y3
V3
W2
AA1
W3
V3
W2
AA1
W3
AA2
AB1
AA3
O
DMA action complete
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
16
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GJL
GLW
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
CLKS0
M4
M2
M3
R2
P4
N3
N4
K3
L2
K3
L2
I
External clock source (as opposed to internal)
Receive clock
CLKR0
CLKX0
DR0
I/O/Z
I/O/Z
I
K1
M2
M3
M1
L3
K1
M2
M3
M1
L3
Transmit clock
Receive data
DX0
O/Z
I/O/Z
I/O/Z
Transmit data
FSR0
FSX0
Receive frame sync
Transmit frame sync
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
CLKS1
CLKR1
CLKX1
DR1
G1
J3
H2
L4
J1
J2
K4
E1
G2
G3
H1
H2
H3
G1
E1
G2
G3
H1
H2
H3
G1
I
External clock source (as opposed to internal)
Receive clock
I/O/Z
I/O/Z
I
Transmit clock
Receive data
DX1
O/Z
I/O/Z
I/O/Z
Transmit data
FSR1
FSX1
Receive frame sync
Transmit frame sync
MULTICHANNEL BUFFERED SERIAL PORT 2 (McBSP2) (’C6202/’C6202B/’C6203 ONLY)
CLKS2
CLKR2
CLKX2
DR2
R3
T2
R4
V1
T4
U2
T3
N1
N2
N3
R2
R1
P3
P2
–
–
–
–
–
–
–
I
External clock source (as opposed to internal)
Receive clock
I/O/Z
I/O/Z
I
Transmit clock
Receive data
DX2
O/Z
I/O/Z
I/O/Z
Transmit data
FSR2
FSX2
Receive frame sync
Transmit frame sync
RESERVED FOR TEST
RSV0
RSV1
RSV2
RSV3
RSV4
L3
J2
J2
I
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
Reserved for testing, pullup with a dedicated 20-kΩ resistor
Reserved for testing, pullup with a dedicated 20-kΩ resistor
Reserved (leave unconnected, do not connect to power or ground)
Reserved (leave unconnected, do not connect to power or ground)
G3
E3
E3
A12
C15
D12
B11
B13
C10
B11
B13
C10
I
O
O
ADDITIONAL RESERVED FOR TEST (’C6204 ONLY)
RSV5
RSV6
RSV7
RSV8
RSV9
RSV10
RSV11
–
–
–
–
–
–
–
–
–
–
–
–
–
–
N1
N2
N3
R2
R1
P3
P2
I
Reserved (leave unconnected)
Reserved (leave unconnected)
Reserved (leave unconnected)
Reserved (leave unconnected)
Reserved (leave unconnected)
Reserved (leave unconnected)
Reserved (leave unconnected)
I/O
I/O
I
O
I/O
I/O
†
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
‡
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
17
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GJL
GLW
SUPPLY VOLTAGE PINS
A11
A16
B7
A3
A7
A3
A7
A16
A20
D4
A16
A20
D4
B8
B19
B20
C6
D6
D6
D7
D7
C10
C14
C17
C21
G4
D9
D9
D10
D13
D14
D16
D17
D19
F1
D10
D13
D14
D16
D17
D19
F1
G23
H3
H24
K3
F4
F4
K24
L1
F19
F22
G4
F19
F22
G4
L26
N24
P3
DV
G19
J4
G19
J4
S
3.3-V supply voltage (I/O)
DD
T1
J19
K4
J19
K4
T26
U3
K19
L1
K19
L1
U24
W3
M22
N4
M22
N4
W24
Y4
N19
P4
N19
P4
Y23
AD6
AD10
AD13
AD17
AD21
AE7
AE8
AE19
AE20
AF11
P19
T4
P19
T4
T19
U1
T19
U1
U4
U4
U19
U22
W4
W6
W7
U19
U22
W4
W6
W7
†
‡
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
18
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
SUPPLY VOLTAGE PINS (CONTINUED)
†
GJL
GLW
AF16
–
W9
W10
W13
W14
W16
W17
W19
AB5
AB9
AB14
AB18
E7
W9
W10
W13
W14
W16
W17
W19
AB5
AB9
AB14
AB18
E7
–
–
–
DV
–
S
3.3-V supply voltage (I/O)
DD
–
–
–
–
–
A1
A2
A3
A24
A25
A26
B1
B2
B3
B24
B25
B26
C1
C2
C3
C4
C23
C24
C25
C26
D3
D4
D5
D22
D23
D24
E4
E23
AB4
E8
E8
E10
E11
E12
E13
E15
E16
F7
E10
E11
E12
E13
E15
E16
–
F8
–
F9
–
F11
F12
F14
F15
F16
G5
–
–
–
1.5-V supply voltage (core) (’C6202B, ’C6203, and ’C6204 only)
1.8-V supply voltage (core) (’C6202 only)
CV
–
S
DD
–
G5
–
G6
G17
G18
H5
–
G18
H5
–
H6
H17
H18
J6
–
H18
–
J17
K5
–
K5
K18
L5
K18
L5
†
‡
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
19
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
SUPPLY VOLTAGE PINS (CONTINUED)
†
GJL
GLW
AB23
AC3
AC4
AC5
AC22
AC23
AC24
AD1
AD2
AD3
AD4
AD23
AD24
AD25
AD26
AE1
AE2
AE3
AE24
AE25
AE26
AF1
AF2
AF3
AF24
AF25
AF26
–
L6
L17
L18
M5
–
–
L18
M5
–
M6
M17
M18
N5
–
M18
N5
N18
–
N18
P6
P17
R5
–
R5
–
R6
R17
R18
T5
–
R18
T5
–
T6
1.5-V supply voltage (core) (’C6202B, ’C6203, and ’C6204 only)
1.8-V supply voltage (core) (’C6202 only)
CV
T17
T18
U7
–
S
DD
T18
–
U8
–
U9
–
U11
U12
U14
U15
U16
V7
–
–
–
–
–
V7
V8
V10
V11
V12
V13
V15
V16
–
V8
–
V10
V11
V12
V13
V15
V16
–
–
–
–
–
GROUND PINS
A4
A8
A1
A5
A1
A5
V
SS
GND
Ground pins
A13
A14
A12
A18
A12
A18
†
‡
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
20
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GLW
GJL
GROUND PINS (CONTINUED)
A15
A19
A23
B4
A22
B2
A22
B2
B21
C1
B21
C1
C3
C20
C22
D5
D8
D11
D12
D15
D18
E4
B12
B13
B14
B23
C5
C3
C20
C22
D5
D8
C11
C16
C22
D1
D11
D12
D15
D18
E4
D2
D6
E5
E5
D21
D25
D26
E3
E6
E6
E9
E9
E14
E17
E18
E19
F5
E14
E17
E18
E19
F5
E24
F4
V
SS
GND
Ground pins
F23
H1
F6
–
H26
K1
F10
F13
F17
F18
H4
–
–
K26
M1
–
F18
H4
H19
J1
M26
N1
H19
J1
N2
N25
N26
P1
J5
J5
J18
J22
K6
J18
J22
–
P2
P25
P26
R1
K17
L4
–
L4
L19
M4
M19
N6
L19
M4
M19
–
R26
U1
U26
†
‡
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
For the ’C6202 GJL package, the C11 pin is ground (V ). See CLKMODE1 (C11) description for all other ’C62x devices GJL packages.
SS
21
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
Signal Descriptions (Continued)
PIN NO.
GLS
SIGNAL
NAME
‡
DESCRIPTION
TYPE
†
GJL
GLW
GROUND PINS (CONTINUED)
W1
W26
AA4
AA23
AB3
AB24
AC1
AC2
AC6
AC21
AC25
AC26
AD5
AD22
AE4
AE13
AE14
AE23
AF4
AF8
AF10
AF12
AF13
AF14
AF15
AF17
AF19
AF23
–
N17
P1
–
P1
P5
P5
P18
P22
R4
P18
P22
R4
R19
U5
R19
U5
U6
–
U10
U13
U17
U18
V4
–
–
–
U18
V4
V5
V5
V6
V6
V9
V9
V14
V17
V18
V19
W5
V14
V17
V18
V19
W5
V
SS
GND
Ground pins
W8
W8
W11
W12
W15
W18
Y1
W11
W12
W15
W18
Y1
Y3
Y3
–
Y20
Y22
AA2
AA21
AB1
AB3
AB7
AB11
AB16
AB20
AB22
Y20
Y22
AA2
AA21
AB1
AB3
AB7
AB11
AB16
AB20
AB22
–
–
–
–
–
–
–
–
–
–
†
‡
The GLW BGA package (’C6204 only) is a subset of the GLS package (’C6202/02B/03), with the inner row of core supply voltage (CV ) and
DD
ground (V ) pins removed (see the GLS/GLW BGA package bottom view).
SS
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
22
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
development support
TI offers an extensive line of development tools for the ’C6000 generation of DSPs, including tools to evaluate
the performance of the processors, generate code, develop algorithm implementations, and fully integrate and
debug software and hardware modules.
The following products support development of ’C6000-based applications:
Software Development Tools:
Assembly optimizer
Assembler/Linker
Simulator
Optimizing ANSI C compiler
Application algorithms
C/Assembly debugger and code profiler
Hardware Development Tools:
Extended development system (XDS ) emulator (supports ’C6000 multiprocessor system debug)
EVM (Evaluation Module)
The TMS320 DSP Development Support Reference Guide (SPRU011) contains information about
development-support products for all TMS320 family member devices, including documentation. See this
document for further information on TMS320 documentation or any TMS320 support products from Texas
Instruments. An additional document, the TMS320 Third-Party Support Reference Guide (SPRU052), contains
informationaboutTMS320-relatedproductsfromothercompaniesintheindustry. ToreceiveTMS320literature,
contact the Literature Response Center at 800/477-8924.
See Table 2 for a complete listing of development-support tools for the ’C6000. For information on pricing and
availability, contact the nearest TI field sales office or authorized distributor.
Table 2. TMS320C6000 Development-Support Tools
DEVELOPMENT TOOL
PLATFORM
Software
PART NUMBER
C Compiler/Assembler/Linker/Assembly Optimizer
C Compiler/Assembler/Linker/Assembly Optimizer
Simulator
Win32
TMDX3246855-07
SPARC Solaris
Win32
TMDX3246555-07
TMDS3246851-07
TMDS3246551-07
TMDX324016X-07
Simulator
SPARC Solaris
Win32, Windows NT
Hardware
XDS510 Debugger/Emulation Software
†
XDS510 Emulator
PC
TMDS00510
‡
XDS510WS Emulator
SCSI
TMDS00510WS
Software/Hardware
PC/Win95/Windows NT
PC/Win95/Windows NT
EVM Evaluation Kit
TMDX3260A6201
TMDX326006201
EVM Evaluation Kit (including TMDX3246855–07)
†
‡
Includes XDS510 board and JTAG emulation cable. TMDX324016X-07 C-source Debugger/Emulation software is not included.
Includes XDS510WS box, SCSI cable, power supply, and JTAG emulation cable.
XDS, XDS510, and XDS510WS are trademarks of Texas Instruments Incorporated.
Win32 and Windows NT are trademarks of Microsoft Corporation.
SPARC is a trademark of SPARC International, Inc.
Solaris is a trademark of Sun Microsystems, Inc.
23
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TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320
devices and support tools. Each TMS320 member has one of three prefixes: TMX, TMP, or TMS. Texas
Instruments recommends two of three possible prefix designators for support tools: TMDX and TMDS. These
prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX)
through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
TMP
TMS
Experimental device that is not necessarily representative of the final device’s electrical
specifications
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. TexasInstrumentsrecommendsthatthesedevicesnotbeusedinanyproductionsystembecausetheir
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, GJL), the temperature range (for example, blank is the default commercial temperature range),
and the device speed range in megahertz (for example, -300 is 300 MHz). Figure 4 provides a legend for
reading the complete device name for any TMS320 family member.
24
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
device and development-support tool nomenclature (continued)
(A)
TMS 320
C
6203 GJL
–300
PREFIX
DEVICE SPEED RANGE
–100 MHz
TMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SMJ = MIL-STD-883C
–150 MHz
–167 MHz
–200 MHz
–233 MHz
SM = High Rel (non-883C)
–250 MHz
–300 MHz
DEVICE FAMILY
320 = TMS320 family
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= –40°C to 105°C, extended temperature
†
PACKAGE TYPE
N
=
=
=
=
=
=
=
=
=
=
Plastic DIP
J
Ceramic DIP
TECHNOLOGY
JD
GB
FZ
FN
FD
PJ
PQ
PZ
Ceramic DIP side-brazed
Ceramic PGA
Ceramic CC
Plastic leaded CC
Ceramic leadless CC
100-pin plastic EIAJ QFP
132-pin plastic bumpered QFP
100-pin plastic TQFP
C = CMOS
E
F
=
=
CMOS EPROM
CMOS Flash EEPROM
PBK = 128-pin plastic TQFP
PGE = 144-pin plastic TQFP
GFN = 256-pin plastic BGA
GGU = 144-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
DEVICE
’1x DSP:
10
14
15
16
17
’2x DSP:
’2xx DSP:
’3x DSP:
25
26
203
204
206
209
240
30
31
32
’4x DSP:
’5x DSP:
40
44
50
51
52
53
56
57
†
DIP
PGA
CC
=
Dual-In-Line Package
Pin Grid Array
Chip Carrier
’54x DSP:
’6x DSP:
541
542
543
545
546
548
=
=
=
QFP
Quad Flat Package
TQFP = Thin Quad Flat Package
BGA Ball Grid Array
6201
6204
6205
6211
6701
6711
6201B
6202
=
6202B
6203
Figure 4. TMS320 Device Nomenclature (Including TMS320C6202, ’C6202B, ’C6203, and ’C6204)
25
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
documentation support
Extensive documentation supports all TMS320 family generations of devices from product announcement
through applications development. The types of documentation available include: data sheets, such as this
document, with design specifications; complete user’s reference guides for all devices; technical briefs;
development-support tools; and hardware and software applications. The following is a brief, descriptive list of
support documentation specific to the ’C6x devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
’C6000 CPU architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 Peripherals Reference Guide (literature number SPRU190) describes the functionality of
the peripherals available on ’C6x devices, such as the external memory interface (EMIF), host-port interface
(HPI), multichannel buffered serial ports (McBSPs), direct-memory-access (DMA), enhanced
direct-memory-access (EDMA) controller, expansion bus (XB), clocking and phase-locked loop (PLL); and
power-down modes. This guide also includes information on internal data and program memories.
The TMS320C6000 Programmer’s Guide (literature number SPRU198) describes ways to optimize C and
assembly code for ’C6x devices and includes application program examples.
The TMS320C6x C Source Debugger User’s Guide (literature number SPRU188) describes how to invoke the
’C6x simulator and emulator versions of the C source debugger interface and discusses various aspects of the
debugger, including: command entry, code execution, data management, breakpoints, profiling, and analysis.
The TMS320C6x Peripheral Support Library Programmer’s Reference (literature number SPRU273) describes
the contents of the ’C6x peripheral support library of functions and macros. It lists functions and macros both
by header file and alphabetically, provides a complete description of each, and gives code examples to show
how they are used.
TMS320C6000 Assembly Language Tools User’s Guide (literature number SPRU186) describes the assembly
language tools (assembler, linker, and other tools used to develop assembly language code), assembler
directives, macros, common object file format, and symbolic debugging directives for the ’C6000 generation of
devices.
The TMS320C6x Evaluation Module Reference Guide (literature number SPRU269) provides instructions for
installing and operating the ’C6x evaluation module. It also includes support software documentation,
application programming interfaces, and technical reference material.
TMS320C62x Multichannel Evaluation Module User’s Guide (literature number SPRU285) provides
instructions for installing and operating the ’C62x multichannel evaluation module. It also includes support
software documentation, application programming interfaces, and technical reference material.
TMS320C62x Multichannel Evaluation Module Technical Reference (SPRU308) provides provides technical
reference information for the ’C62x multichannel evaluation module (McEVM). It includes support software
documentation, application programming interface references, and hardware descriptions for the ’C62x
McEVM.
TMS320C6000 DSP/BIOS User’s Guide (literature number SPRU303) describes how to use DSP/BIOS tools
and APIs to analyze embedded real-time DSP applications.
Code Composer User’s Guide (literature number SPRU296) explains how to use the Code Composer
development environment to build and debug embedded real-time DSP applications.
Code Composer Studio Tutorial(literaturenumberSPRU301)introducestheCodeComposerStudiointegrated
development environment and software tools.
26
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
documentation support (continued)
The TMS320C6000 Technical Brief (literature number SPRU197) gives an introduction to the ’C62x/C67x
devices, associated development tools, and third-party support.
The How to Begin Development and Migrate Across the TMS320C6202/6202B/6203/6204 DSPs application
report (literature number SPRA603) describes the migration concerns and identifies the similarites and
differences between the ’C6202, ’C6202B, ’C6203, and ’C6204 ’C6000 DSP devices.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support DSP research and
education. The TMS320 newsletter, Details on Signal Processing, is published quarterly and distributed to
update TMS320 customers on product information. The TMS320 DSP bulletin board service (BBS) provides
access to information pertaining to the TMS320 family, including documentation, source code, and object code
for many DSP algorithms and utilities. The BBS can be reached at 281/274-2323.
Information regarding TI DSP products is also available on the Worldwide Web at http://www.ti.com uniform
resource locator (URL).
27
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TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
clock PLL
All of the internal ’C62x clocks are generated from a single source through the CLKIN pin. This source clock
either drives the PLL, which generates the internal CPU clock, or bypasses the PLL to become the CPU clock.
To use the PLL to generate the CPU clock, the filter circuit shown in Figure 5 must be properly designed.
Toconfigurethe’C6202/’C6202B/’C6203/’C6204PLLclockforproper operation, see Figure 5, Table 3, Table 4,
Table 5, Table 6, Table 7, and Table 8. To minimize the clock jitter, a single clean power supply should power
both the ’C62x device and the external clock oscillator circuit. The minimum CLKIN rise and fall times should
also be observed. See the input and output clocks electrical section for input clock timing requirements.
3.3 V
3 OUT
’320C6202/’02B/’03/’04
PLLV
PLLF
÷ 1
÷ 2
CLKOUT1
CLKOUT2
R1
CPU Clock
1 IN
GND
2
PLLG
10 µF
0.1 µF C1 C2
(Bypass)
CLKIN
(For PLL Options, See Table 3 and Table 4)
NOTES: A. The ’C6202/’C6202B/’C6203/’C6204 PLL can generate CPU clock frequencies in the range of 130 MHz to the device’s maximum
clock rate (for example, the ’C6203 range is 130 MHz to 300 MHz). For frequencies below 130 MHz, the PLL should be configured
to operate in bypass mode.
B. For CLKMODE x1, the PLL is bypassed and all six external PLL components can be removed. For this case, the PLLV terminal
has to be connected to a clean 3.3-V supply and the PLLG and PLLF terminals should be tied together.
C. The 3.3-V supply for the EMI filter (and PLLV) must be from the same 3.3-V power plane supplying the I/O voltage, DV
D. EMI filter manufacturer TDK part number ACF451832-153-T
.
DD
Figure 5. ’C6202/’C6202B/’C6203/’C6204 PLL Block Diagram
28
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
clock PLL (continued)
†
Table 3. TMS320C6202/’02B/’03/’04 GLS/GLW Packages PLL Multiply and Bypass (x1) Options
GLS PACKAGE – 18 x 18 mm BGA (’C6202/’02B/’03 only)
GLW PACKAGE – 18 x 18 mm BGA (’C6204 only)
DEVICES AND PLL CLOCK OPTIONS
BIT (PIN NO.)
CLKMODE2 (A14)
CLKMODE1 (A9)
CLKMODE0 (B12)
‡
’C6202, ’C6204
Bypass (x1)
x4
’C6202B, ’C6203
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Bypass (x1)
x4
x8
Bypass (x1)
x4
x10
x6
Value
Bypass (x1)
x4
x9
Bypass (x1)
x4
x7
x11
†
‡
f(CPU Clock) = f(CLKIN) x (PLL mode)
For the ’C6202 GLS and ’C6204 GLW packages, the CLKMODE2 (A14) and CLKMODE1 (A9) pins are internally unconnected.
†§
Table 4. TMS320C6202/’02B/’03 GJL Package PLL Multiply and Bypass (x1) Options
GJL PACKAGE 27 x 27 mm BGA
DEVICES AND PLL CLOCK OPTIONS
¶#
CLKMODE2 (N/A)
§¶
BIT (PIN NO.)
CLKMODE1 (C11)
CLKMODE0 (B15)
¶
¶
’C6202
’C6202B, ’C6203
Bypass (x1)
x4
0
0
0
1
Bypass (x1)
x4
#
N/A
N/A
Value
1
1
0
1
x8
CLKMODE1 pin
(C11) Must Be
Grounded
x10
§#
†
§
f(CPU Clock) = f(CLKIN) x (PLL mode)
Note:TheC11pinisCLKMODE1onthe’C6202B/’03GJLpackageandagroundpin(V ) for the ’C6202 GJL package. If a ’C6202 GJL package
SS
is placed in a ’C6202B/’03 GJL board with the CLKMODE1 pin pulled to the non-default state (default is GND), current is drawn through the pullup
(3.3 V/ 20 kΩ or 165 µA). If a ’C6202 GJL package is placed in a ’C6202B/’03 board with the C11 pin directly connected to the V
plane
CC
for the PLL mode, a ground/power is shorted through the package. For more detailed information on device compatibility, see the How to
Begin Development and Migrate Across the TMS320C6202/6202B/6203/6204 DSPs application report (literature number SPRA603).
CLKMODE2 and CLKMODE1 pins are not available on the ’C6202 GJL package.
The CLKMODE2 pin is not available on the ’C6202B/’C6203 GJL package.
N/A = Not Applicable
¶
#
||
Table 5. TMS320C6202 PLL Component Selection Table
CPU CLOCK
FREQUENCY
(CLKOUT1)
CLKIN
RANGE
(MHz)
CLKOUT2
RANGE
(MHz)
TYPICAL
LOCK TIME
(µs)
R1
(Ω)
C1
(nF)
C2
(pF)
CLKMODE
RANGE (MHz)
x4
32.5–62.5
130–250
65–125
60.4
27
560
75
||
Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
29
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
clock PLL (continued)
†
Table 6. TMS320C6202B PLL Component Selection Table
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
TYPICAL
LOCK TIME
(µs)
R1
(Ω)
C1
(nF)
C2
(pF)
‡
CLKMODE
x4
x6
32.5–62.5
21.7–41.7
18.6–35.7
16.3–31.3
14.4–27.8
13–25
x7
x8
130–250
65–125
60.4
27
560
75
x9
x10
x11
11.8–22.7
†
‡
Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
CLKMODE x1, x4, x6, x7, x8, x9, x10, and x11 apply to the GLS device. The GJL device is restricted to x1, x4, x8, and x10 multiply factors.
†
Table 7. TMS320C6203 PLL Component Selection Table
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
TYPICAL
LOCK TIME
(µs)
R1
(Ω)
C1
(nF)
C2
(pF)
‡
CLKMODE
x4
x6
32.5–75
21.7–50
x7
18.6–42.9
16.3–37.5
14.4–33.3
13–30
x8
130–300
65–150
60.4
27
560
75
x9
x10
x11
11.8–27.3
†
‡
Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
CLKMODE x1, x4, x6, x7, x8, x9, x10, and x11 apply to the GLS device. The GJL device is restricted to x1, x4, x8, and x10 multiply factors.
†
Table 8. TMS320C6204 PLL Component Selection Table
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
TYPICAL
LOCK TIME
(µs)
R1
(Ω)
C1
(nF)
C2
(pF)
CLKMODE
x4
32.5–50
130–200
65–100
60.4
27
560
75
†
Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
power-supply sequencing
For ’C6202B, ’C6203, and ’C6204 devices only, the 1.5-V supply powers the core and the 3.3-V supply powers
the I/O buffers. For the ’C6202 device only, the 1.8-V supply powers the core and the 3.3-V supply powers the
I/O buffers. For internal device reliability, there are no specific sequencing requirements between the core
supply and the I/O supply. The only constraint is that neither supply should be powered on for extended periods
of time if the other supply is below the valid operating voltage.
System-level issues, such as bus contention, may require supply sequencing to be implemented. In this case,
the core supply should be powered up first, or at the same time as the I/O buffers. This is to ensure that the I/O
buffers have valid inputs from the core before the output buffers are powered up, thus preventing bus contention
with other chips on the board.
30
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
†
absolute maximum ratings over operating case temperature range (unless otherwise noted)
Supply voltage range, CV
Supply voltage range, DV
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 2.3 V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4 V
DD
DD
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4 V
Operating case temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 90 C
C
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 C to 150 C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to V
SS
.
recommended operating conditions
MIN NOM
1.425 1.5 1.575
1.71
MAX UNIT
’C6202B, ’C6203, and ’C6204 only
’C6202 only
CV
DV
Supply voltage (CORE)
V
DD
DD
1.8
3.30
0
1.89
3.46
0
Supply voltage (I/O)
3.14
0
V
V
V
V
V
Supply ground
SS
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
Operating case temperature
2.0
V
IH
IL
0.8
–8
8
V
I
I
mA
mA
C
OH
OL
T
C
0
90
31
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
electrical characteristics over recommended ranges of supply voltage and operating case
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
DV
DV
= MIN,
= MIN,
I
I
= MAX
= MAX
2.4
OH
DD
DD
OH
OL
0.6
±10
±10
V
OL
†
I
I
Input current
V = V
I
to DV
uA
SS
= DV
DD
or 0 V
I
Off-state output current
V
O
uA
OZ
DD
’C6202, CV
= NOM,
= NOM,
CPU clock = 200 MHz
520
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
pF
DD
’C6202B, CV
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
CPU clock = 200 MHz
TBD
Supply current, CPU + CPU
DD
I
I
I
DD2V
‡
memory access
’C6203, CV
’C6204, CV
’C6202, CV
= NOM,
= NOM,
= NOM,
DD
DD
DD
TBD
390
’C6202B, CV
DD
= NOM,
TBD
TBD
TBD
70
‡
Supply current, peripherals
DD2V
DD3V
’C6203, CV
’C6204, CV
’C6202, DV
= NOM,
= NOM,
= NOM,
DD
DD
DD
’C6202B, DV
DD
= NOM,
TBD
TBD
TBD
‡
Supply current, I/O pins
’C6203, DV
’C6204, DV
= NOM,
= NOM,
DD
DD
C
C
Input capacitance
Output capacitance
10
10
i
pF
o
†
‡
TMS and TDI are not included due to internal pullups. TRST is not included due to internal pulldown.
Measuredwithaverageactivity(50%high/50%lowpower). FormoredetailedinformationonCPU/peripheral/I/Oactivity, seetheTMS320C6000
Power Consumption Summary application report (literature number SPRA486).
32
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
PARAMETER MEASUREMENT INFORMATION
I
OL
Tester Pin
Electronics
Output
Under
Test
50 Ω
V
ref
†
= 30 pF
C
T
I
OH
†
Typical distributed load circuit capacitance
Figure 6. Test Load Circuit
signal transition levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
V
ref
= 1.5 V
Figure 7. Input and Output Voltage Reference Levels for ac Timing Measurements
33
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
INPUT AND OUTPUT CLOCKS
†‡§
timing requirements for CLKIN (PLL used)
(see Figure 8)
-200
-250
MIN
-300
MIN
NO.
UNIT
MIN
5 * M
0.4C
0.4C
MAX
MAX
MAX
1
2
3
4
t
t
t
t
Cycle time, CLKIN
4 * M
0.4C
0.4C
3.33 * M
0.4C
ns
ns
ns
ns
c(CLKIN)
w(CLKINH)
w(CLKINL)
t(CLKIN)
Pulse duration, CLKIN high
Pulse duration, CLKIN low
Transition time, CLKIN
0.4C
5
5
5
†
‡
§
The reference points for the rise and fall transitions are measured at 20% and 80%, respectively, of V
IH
M = the PLL multiplier factor (x4, x6, x7, x8, x9, x10, or x11) For more detail, see the clock PLL section.
C = CLKIN cycle time in ns. For example, when CLKIN frequency is 10 MHz, use C = 100 ns.
.
†§
timing requirements for CLKIN [PLL bypassed (x1)] (see Figure 8)
-200
MIN
-250
MIN
-300
NO.
UNIT
MAX
MAX
MIN
3.33
MAX
1
2
3
4
t
t
t
t
Cycle time, CLKIN
5
0.45C
0.45C
4
0.45C
0.45C
ns
ns
ns
ns
c(CLKIN)
w(CLKINH)
w(CLKINL)
t(CLKIN)
Pulse duration, CLKIN high
Pulse duration, CLKIN low
Transition time, CLKIN
0.45C
0.45C
0.6
0.6
0.6
†
§
The reference points for the rise and fall transitions are measured at 20% and 80%, respectively, of V
C = CLKIN cycle time in ns. For example, when CLKIN frequency is 10 MHz, use C = 100 ns.
.
IH
1
4
2
CLKIN
3
4
Figure 8. CLKIN Timings
34
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TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
INPUT AND OUTPUT CLOCKS (CONTINUED)
†
timing requirements for XCLKIN (see Figure 9)
-200
-250
-300
NO.
UNIT
MIN MAX
4P
1
2
3
t
t
t
Cycle time, XCLKIN
ns
ns
ns
c(XCLKIN)
Pulse duration, XCLKIN high
Pulse duration, XCLKIN low
1.8P
w(XCLKINH)
1.8P
w(XCLKINL)
†
P = 1/CPU clock frequency in ns.
1
2
XCLKIN
3
Figure 9. XCLKIN Timings
35
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
INPUT AND OUTPUT CLOCKS (CONTINUED)
†
switching characteristics for CLKOUT2 (see Figure 10)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
2P + 0.7
P + 0.7
P + 0.7
1
2
3
t
t
t
Cycle time, CLKOUT2
2P – 0.7
P – 0.7
P – 0.7
ns
ns
ns
c(CKO2)
Pulse duration, CLKOUT2 high
Pulse duration, CLKOUT2 low
w(CKO2H)
w(CKO2L)
†
P = 1/CPU clock frequency in ns.
1
2
CLKOUT2
3
Figure 10. CLKOUT2 Timings
†‡
switching characteristics for XFCLK (see Figure 11)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
D * P – 0.7
MAX
1
2
3
t
t
t
Cycle time, XFCLK
D * P + 0.7
ns
ns
ns
c(XFCK)
Pulse duration, XFCLK high
Pulse duration, XFCLK low
(D/2) * P – 0.7 (D/2) * P + 0.7
(D/2) * P – 0.7 (D/2) * P + 0.7
w(XFCKH)
w(XFCKL)
†
‡
P = 1/CPU clock frequency in ns.
D = 8, 6, 4, or 2; FIFO clock divide ratio, user-programmable
1
2
XFCLK
3
Figure 11. XFCLK Timings
36
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
ASYNCHRONOUS MEMORY TIMING
†‡§¶
timing requirements for asynchronous memory cycles
(see Figure 12 – Figure 15)
-200
-250
-300
NO.
UNIT
MIN
MAX
3
4
t
t
t
t
t
t
t
t
t
t
t
Setup time, EDx valid before ARE high
Hold time, EDx valid after ARE high
Setup time, ARDY high before ARE low
Hold time, ARDY high after ARE low
Setup time, ARDY low before ARE low
Hold time, ARDY low after ARE low
Pulse width, ARDY high
0.5
3.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
su(EDV-AREH)
h(AREH-EDV)
6
–[(RST – 3) * P – 5]
(RST – 3) * P + 3
–[(RST – 3) * P – 5]
(RST – 3) * P + 3
2P
su(ARDYH-AREL)
h(AREL-ARDYH)
su(ARDYL-AREL)
h(AREL-ARDYL)
w(ARDYH)
7
9
10
11
15
16
18
19
Setup time, ARDY high before AWE low
Hold time, ARDY high after AWE low
Setup time, ARDY low before AWE low
Hold time, ARDY low after AWE low
–[(WST – 3) * P – 5]
(WST – 3) * P + 3
–[(WST – 3) * P – 5]
(WST – 3) * P + 3
su(ARDYH-AWEL)
h(AWEL-ARDYH)
su(ARDYL-AWEL)
h(AWEL-ARDYL)
†
‡
To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. If ARDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, ARDY can be an asynchronous input.
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the EMIF CE space control registers.
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use ARDY input to extend strobe width.
§
¶
द#
switching characteristics for asynchronous memory cycles
(see Figure 12 – Figure 15)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
RS * P – 1
RH * P – 1
TYP
MAX
4P + 5
4P + 5
1
2
t
t
t
t
t
t
t
t
Output setup time, select signals valid to ARE low
Output hold time, ARE high to select signals invalid
Pulse width, ARE low
ns
ns
ns
ns
ns
ns
ns
ns
osu(SELV-AREL)
oh(AREH-SELIV)
w(AREL)
5
RST * P
8
Delay time, ARDY high to ARE high
3P
WS * P – 1
WH * P – 1
d(ARDYH-AREH)
osu(SELV-AWEL)
oh(AWEH-SELIV)
w(AWEL)
12
13
14
17
Output setup time, select signals valid to AWE low
Output hold time, AWE high to select signals invalid
Pulse width, AWE low
WST * P
Delay time, ARDY high to AWE high
3P
d(ARDYH-AWEH)
‡
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the EMIF CE space control registers.
§
¶
#
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use ARDY input to extend strobe width.
Selectsignals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0], with the exception that CEx can stay active for anadditional
7P ns following the end of the cycle.
37
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2 Strobe = 3
Hold = 2
CLKOUT1
CEx
1
2
1
1
2
2
BE[3:0]
EA[21:2]
3
4
ED[31:0]
AOE
1
2
5
6
7
ARE
AWE
ARDY
Figure 12. Asynchronous Memory Read Timing (ARDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
CEx
1
1
1
2
2
2
BE[3:0]
EA[21:2]
3
4
ED[31:0]
AOE
1
9
2
8
10
ARE
AWE
11
ARDY
Figure 13. Asynchronous Memory Read Timing (ARDY Used)
38
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TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2 Strobe = 3
Hold = 2
CLKOUT1
CEx
12
12
12
12
13
13
13
13
BE[3:0]
EA[21:2]
ED[31:0]
AOE
15
16
ARE
14
AWE
ARDY
Figure 14. Asynchronous Memory Write Timing (ARDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
12
12
12
12
13
13
13
13
CEx
BE[3:0]
EA[21:2]
ED[31:0]
AOE
ARE
17
18
19
AWE
11
ARDY
Figure 15. Asynchronous Memory Write Timing (ARDY Used)
39
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS-BURST MEMORY TIMING
timing requirements for synchronous-burst SRAM cycles (see Figure 16)
-200
MIN
-250
MIN
-300
MIN MAX
NO.
UNIT
MAX
MAX
Setup time, read EDx valid before CLKOUT2
high
7
8
t
t
2.5
1.5
2
1.7
1.5
ns
ns
su(EDV-CKO2H)
Hold time, read EDx valid after CLKOUT2 high
1.5
h(CKO2H-EDV)
†‡
switching characteristics for synchronous-burst SRAM cycles (see Figure 16 and Figure 17)
-200
MIN
-250
MIN
-300
MIN
NO.
PARAMETER
UNIT
MAX
MAX
MAX
Output setup time, CEx valid
before CLKOUT2 high
1
2
3
4
5
6
t
t
t
t
t
t
P – 0.5
P – 4
P + 0.2
P – 3
P + 0.1
P – 2.3
P + 0.1
P – 2.3
P + 0.1
P – 2.3
ns
ns
ns
ns
ns
ns
osu(CEV-CKO2H)
oh(CKO2H-CEV)
osu(BEV-CKO2H)
oh(CKO2H-BEIV)
osu(EAV-CKO2H)
oh(CKO2H-EAIV)
Output hold time, CEx valid after
CLKOUT2 high
Output setup time, BEx valid
before CLKOUT2 high
P – 0.5
P – 4
P + 0.2
P – 3
Output hold time, BEx invalid after
CLKOUT2 high
Output setup time, EAx valid
before CLKOUT2 high
P – 0.5
P – 4
P + 0.2
P – 3
Output hold time, EAx invalid after
CLKOUT2 high
Output setup time,
9
t
SDCAS/SSADS valid before
CLKOUT2 high
P – 0.5
P + 0.2
P + 0.1
ns
osu(ADSV-CKO2H)
Output hold time, SDCAS/SSADS
valid after CLKOUT2 high
10
11
12
13
14
15
16
t
t
t
t
t
t
t
P – 4
P – 0.5
P – 4
P – 3
P + 0.2
P – 3
P – 2.3
P + 0.1
P – 2.3
P + 0.1
P – 2.3
P + 0.1
P – 2.3
ns
ns
ns
ns
ns
ns
ns
oh(CKO2H-ADSV)
osu(OEV-CKO2H)
oh(CKO2H-OEV)
osu(EDV-CKO2H)
oh(CKO2H-EDIV)
osu(WEV-CKO2H)
oh(CKO2H-WEV)
Output setup time, SDRAS/SSOE
valid before CLKOUT2 high
Output hold time, SDRAS/SSOE
valid after CLKOUT2 high
Output setup time, EDx valid
P – 0.5
P – 4
P + 0.2
P – 3
§
before CLKOUT2 high
Output hold time, EDx invalid after
CLKOUT2 high
Output setup time, SDWE/SSWE
valid before CLKOUT2 high
P – 0.5
P – 4
P + 0.2
P – 3
Output hold time, SDWE/SSWE
valid after CLKOUT2 high
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
For the first write in a series of one or more consecutive adjacent writes, the write data is generated one CLKOUT2 cycle early to accommodate
the ED enable time.
40
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
CLKOUT2
1
2
CEx
3
4
6
BE[3:0]
BE1
BE2
A2
BE3
A3
BE4
5
A1
A4
8
EA[21:2]
ED[31:0]
7
Q1
Q2
Q3
10
Q4
9
†
SDCAS/SSADS
11
12
†
†
SDRAS/SSOE
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 16. SBSRAM Read Timing
CLKOUT2
1
2
CEx
BE[3:0]
3
4
6
BE1
BE2
A2
BE3
A3
BE4
A4
5
EA[21:2]
A1
13
14
10
Q1
Q2
Q3
Q4
ED[31:0]
9
†
SDCAS/SSADS
†
SDRAS/SSOE
SDWE/SSWE
15
16
†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 17. SBSRAM Write Timing
41
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS DRAM TIMING
timing requirements for synchronous DRAM cycles (see Figure 18)
-200
-250
-300
NO.
UNIT
MIN MAX
MIN MAX
MIN MAX
7
8
t
t
Setup time, read EDx valid before CLKOUT2 high
Hold time, read EDx valid after CLKOUT2 high
1
3
0.5
3
0.5
2
ns
ns
su(EDV-CKO2H)
h(CKO2H-EDV)
†‡
switching characteristics for synchronous DRAM cycles (see Figure 18–Figure 23)
-200
MIN
-250
MIN
-300
MIN MAX
NO.
PARAMETER
UNIT
MAX
MAX
Output setup time, CEx valid
before CLKOUT2 high
1
2
3
4
5
6
t
t
t
t
t
t
P – 1
P
P – 2.5
P
P + 0.6
P – 1.8
P + 0.6
P – 1.8
P + 0.6
P – 1.8
ns
ns
ns
ns
ns
ns
osu(CEV-CKO2H)
oh(CKO2H-CEV)
osu(BEV-CKO2H)
oh(CKO2H-BEIV)
osu(EAV-CKO2H)
oh(CKO2H-EAIV)
Output hold time, CEx valid after
CLKOUT2 high
P – 3.5
P – 1
Output setup time, BEx valid
before CLKOUT2 high
Output hold time, BEx invalid after
CLKOUT2 high
P – 3.5
P – 1
P – 2.5
P
Output setup time, EAx valid
before CLKOUT2 high
Output hold time, EAx invalid after
CLKOUT2 high
P – 3.5
P – 2.5
Output setup time,
9
t
SDCAS/SSADS valid before
CLKOUT2 high
P – 1
P
P + 0.6
ns
osu(CASV-CKO2H)
Output hold time, SDCAS/SSADS
valid after CLKOUT2 high
10
11
12
13
14
15
16
17
18
t
t
t
t
t
t
t
t
t
P – 3.5
P – 1
P – 2.5
P
P – 1.8
P + 0.6
P – 1.8
P + 0.6
P – 1.8
P + 0.6
P – 1.8
P + 0.6
P – 1.8
ns
ns
ns
ns
ns
ns
ns
ns
ns
oh(CKO2H-CASV)
osu(EDV-CKO2H)
oh(CKO2H-EDIV)
osu(WEV-CKO2H)
oh(CKO2H-WEV)
osu(SDA10V-CKO2H)
oh(CKO2H-SDA10IV)
osu(RASV-CKO2H)
oh(CKO2H-RASV)
Output setup time, EDx valid
§
before CLKOUT2 high
Output hold time, EDx invalid after
CLKOUT2 high
P – 3.5
P – 1
P – 2.5
P
Output setup time, SDWE/SSWE
valid before CLKOUT2 high
Output hold time, SDWE/SSWE
valid after CLKOUT2 high
P – 3.5
P – 1
P – 2.5
P
Output setup time, SDA10 valid
before CLKOUT2 high
Output hold time, SDA10 invalid
after CLKOUT2 high
P – 3.5
P – 1
P – 2.5
P
Output setup time, SDRAS/SSOE
valid before CLKOUT2 high
Output hold time, SDRAS/SSOE
valid after CLKOUT2 high
P – 3.5
P – 2.5
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
For the first write in a series of one or more consecutive adjacent writes, the write data is generated one CLKOUT2 cycle early to accommodate
the ED enable time.
42
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS DRAM TIMING (CONTINUED)
READ
READ
READ
CLKOUT2
CEx
1
5
2
3
4
BE[3:0]
EA[15:2]
BE1
BE2
CA3
BE3
7
6
CA1
CA2
8
D1
D2
D3
ED[31:0]
SDA10
15
9
16
10
†
SDRAS/SSOE
†
†
SDCAS/SSADS
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 18. Three SDRAM READ Commands
WRITE
WRITE
WRITE
CLKOUT2
CEx
1
3
5
2
4
6
BE[3:0]
BE1
CA1
BE2
CA2
D2
BE3
CA3
D3
EA[15:2]
11
12
D1
ED[31:0]
SDA10
15
16
†
SDRAS/SSOE
9
10
14
†
SDCAS/SSADS
13
†
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 19. Three SDRAM WRT Commands
43
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS DRAM TIMING (CONTINUED)
ACTV
CLKOUT2
1
2
CEx
BE[3:0]
5
Bank Activate/Row Address
EA[15:2]
ED[31:0]
15
Row Address
SDA10
17
18
†
†
†
SDRAS/SSOE
SDCAS/SSADS
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 20. SDRAM ACTV Command
DCAB
CLKOUT2
1
2
CEx
BE[3:0]
EA[15:2]
ED[31:0]
15
16
SDA10
17
18
†
†
SDRAS/SSOE
SDCAS/SSADS
13
14
†
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 21. SDRAM DCAB Command
44
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
SYNCHRONOUS DRAM TIMING (CONTINUED)
REFR
CLKOUT2
CEx
1
2
BE[3:0]
EA[15:2]
ED[31:0]
SDA10
17
18
†
SDRAS/SSOE
9
10
†
SDCAS/SSADS
†
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 22. SDRAM REFR Command
MRS
CLKOUT2
1
2
6
CEx
BE[3:0]
5
EA[15:2]
ED[31:0]
SDA10
MRS Value
17
18
10
14
†
SDRAS/SSOE
9
†
†
SDCAS/SSADS
13
SDWE/SSWE
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 23. SDRAM MRS Command
45
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
HOLD/HOLDA TIMING
†
timing requirements for the HOLD/HOLDA cycles (see Figure 24)
-200
-250
-300
NO.
UNIT
MIN MAX
3
t Hold time, HOLD low after HOLDA low
oh(HOLDAL-HOLD
P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
†‡
switching characteristics for the HOLD/HOLDA cycles (see Figure 24)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
4P
0
MAX
§
1
2
4
5
t
t
t
t
Response time, HOLD low to EMIF Bus high impedance
Delay time, EMIF Bus high impedance to HOLDA low
Response time, HOLD high to EMIF Bus low impedance
Delay time, EMIF Bus low impedance to HOLDA high
ns
ns
ns
ns
R(HOLDL-EMHZ)
d(EMHZ-HOLDAL)
R(HOLDH-EMLZ)
d(EMLZ-HOLDAH)
2P
7P
2P
3P
0
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE, and SDA10.
All pending EMIF transactions are allowed to complete before HOLDA is asserted. The worst case for this is an asynchronous read or write with
external ARDY used or a minimum of eight consecutive SDRAM reads or writes when RBTR8 = 1. If no bus transactions are occurring, then the
minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
External Requestor
DSP Owns Bus
DSP Owns Bus
Owns Bus
3
HOLD
2
5
HOLDA
1
4
†
EMIF Bus
’C62x
’C62x
†
EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE, and SDA10.
Figure 24. HOLD/HOLDA Timing
46
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
RESET TIMING
†
timing requirements for reset (see Figure 25)
-200
-250
-300
NO.
UNIT
MIN
MAX
‡
Width of the RESET pulse (PLL stable)
10P
250
5P
ns
µs
ns
ns
1
t
w(RST)
§
Width of the RESET pulse (PLL needs to sync up)
¶
Setup time, XD configuration bits valid before RESET high
10
11
t
t
su(XD)
¶
Hold time, XD configuration bits valid after RESET high
5P
h(XD)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x4, x6, x7, x8, x9, x10, and x11 when CLKIN and PLL
are stable.
§
¶
ThisparameterappliestoCLKMODEx4, x6, x7, x8, x9, x10, andx11only(ItdoesnotapplytoCLKMODEx1). TheRESETsignalisnotconnected
internally to the clock PLL circuit. The PLL, however, may need up to 250 µs to stabilize following device power up or after PLL configuration
has been changed. During that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock times.
XD[31:0] are the boot configuration pins during device reset.
†#
switching characteristics during reset (see Figure 25)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
4P
2
3
4
5
6
7
8
9
t
t
t
t
t
t
t
t
Delay time, RESET low to CLKOUT2 invalid
Delay time, RESET high to CLKOUT2 valid
Delay time, RESET low to high group invalid
Delay time, RESET high to high group valid
Delay time, RESET low to low group invalid
Delay time, RESET high to low group valid
Delay time, RESET low to Z group high impedance
Delay time, RESET high to Z group valid
P
P
P
P
ns
ns
ns
ns
ns
ns
ns
ns
d(RSTL-CKO2IV)
d(RSTH-CKO2V)
d(RSTL-HIGHIV)
d(RSTH-HIGHV)
d(RSTL-LOWIV)
d(RSTH-LOWV)
d(RSTL-ZHZ)
4P
4P
4P
d(RSTH-ZV)
†
#
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
High group consists of:
Low group consists of:
Z group consists of:
XFCLK, HOLDA
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE,
SDA10, CLKX0, CLKX1, CLKX2, FSX0, FSX1, FSX2, DX0, DX1, DX2, CLKR0, CLKR1, CLKR2, FSR0, FSR1,
FSR2, XCE[3:0], XBE[3:0]/XA[5:2], XOE, XRE, XWE/XWAIT, XAS, XW/R, XRDY, XBLAST, XHOLD,
and XHOLDA
47
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
RESET TIMING (CONTINUED)
CLKOUT1
1
10
11
RESET
2
3
5
7
9
CLKOUT2
4
†
HIGH GROUP
LOW GROUP
6
8
†
†
Z GROUP
Boot Configuration
‡
XD[31:0]
†
‡
High group consists of:
Low group consists of:
Z group consists of:
XFCLK, HOLDA
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1.
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE,
SDA10, CLKX0, CLKX1, CLKX2, FSX0, FSX1, FSX2, DX0, DX1, DX2, CLKR0, CLKR1, CLKR2, FSR0, FSR1,
FSR2, XCE[3:0], XBE[3:0]/XA[5:2], XOE, XRE, XWE/XWAIT, XAS, XW/R, XRDY, XBLAST, XHOLD,
and XHOLDA.
XD[31:0] are the boot configuration pins during device reset.
Figure 25. Reset Timing
48
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXTERNAL INTERRUPT TIMING
†
timing requirements for interrupt response cycles (see Figure 26)
-200
-250
-300
NO.
UNIT
MIN
MAX
2
3
t
t
Width of the interrupt pulse low
Width of the interrupt pulse high
2P
2P
ns
ns
w(ILOW)
w(IHIGH)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
†
switching characteristics during interrupt response cycles (see Figure 26)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
1
4
5
6
t
t
t
t
Response time, EXT_INTx high to IACK high
Delay time, CLKOUT2 low to IACK valid
Delay time, CLKOUT2 low to INUMx valid
Delay time, CLKOUT2 low to INUMx invalid
9P
0
ns
ns
ns
ns
R(EINTH – IACKH)
d(CKO2L-IACKV)
d(CKO2L-INUMV)
d(CKO2L-INUMIV)
10
10
10
0
0
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
1
CLKOUT2
3
2
EXT_INTx, NMI
Intr Flag
4
4
IACK
6
5
INUMx
Interrupt Number
Figure 26. Interrupt Timing
49
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS FIFO TIMING
timing requirements for synchronous FIFO interface (see Figure 27, Figure 28, and Figure 29)
-200
-250
-300
MIN MAX
2.5
NO.
UNIT
5
6
t
t
Setup time, read XDx valid before XFCLK high
Hold time, read XDx valid after XFCLK high
ns
ns
su(XDV-XFCKH)
2
h(XFCKH-XDV)
switching characteristics for synchronous FIFO interface (see Figure 27, Figure 28, and Figure 29)
’C6202B-250
’C6202B-300
’C6203-250
’C6203-300
’C6204-200
’C6202-200,
’C6202-250
NO.
PARAMETER
UNIT
MIN
MAX
MIN
1.5
MAX
4.5
4.5
4.5
4.5
4.5
4.5
1
2
3
4
7
8
9
t
t
t
t
t
t
t
Delay time, XFCLK high to XCEx valid
Delay time, XFCLK high to XBE[3:0]/XA[5:2] valid
Delay time, XFCLK high to XOE valid
Delay time, XFCLK high to XRE valid
1.5
1.5
1.5
1.5
1.5
5.2
5.2
5.2
5.2
5.2
5.2
ns
ns
ns
ns
ns
ns
ns
d(XFCKH-XCEV)
d(XFCKH-XAV)
d(XFCKH-XOEV)
d(XFCKH-XREV)
d(XFCKH-XWEV)
d(XFCKH-XDV)
d(XFCKH-XDIV)
†
1.5
1.5
1.5
1.5
‡
Delay time, XFCLK high to XWE/XWAIT valid
Delay time, XFCLK high to XDx valid
Delay time, XFCLK high to XDx invalid
1.5
1.5
†
‡
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write enable signal XWE during synchronous FIFO accesses.
XFCLK
1
1
†
XCE3
2
3
4
2
3
‡
XA1
XA2
XA3
XA4
XBE[3:0]/XA[5:2]
XOE
XRE
4
§
XWE/XWAIT
6
5
XD[31:0]
FIFO read (glueless) mode only available in XCE3.
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write enable signal XWE during synchronous FIFO accesses.
D1
D2
D3
D4
†
‡
§
Figure 27. FIFO Read Timing (Glueless Read Mode)
50
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS FIFO TIMING (CONTINUED)
XFCLK
XCEx
1
2
3
4
1
2
3
†
XBE[3:0]/XA[5:2]
XA1
XA2
XA3
XA4
XOE
XRE
4
‡
XWE/XWAIT
6
5
XD[31:0]
D1
D2
D3
D4
†
‡
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write enable signal XWE during synchronous FIFO accesses.
Figure 28. FIFO Read Timing
XFCLK
1
1
XCEx
2
2
†
XBE[3:0]/XA[5:2]
XA1
XA2
XA3
XA4
XOE
XRE
7
8
7
‡
XWE/XWAIT
9
XD[31:0]
D1
D2
D3
D4
†
‡
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write enable signal XWE during synchronous FIFO accesses.
Figure 29. FIFO Write Timing
51
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING
†‡§¶
timing requirements for asynchronous peripheral cycles
(see Figure 30–Figure 33)
-200
-250
-300
NO.
UNIT
MIN
MAX
3
4
t
t
t
t
t
t
t
t
t
t
t
Setup time, XDx valid before XRE high
Hold time, XDx valid after XRE high
Setup time, XRDY high before XRE low
Hold time, XRDY high after XRE low
Setup time, XRDY low before XRE low
Hold time, XRDY low after XRE low
Pulse width, XRDY high
4
1
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
su(XDV-XREH)
h(XREH-XDV)
6
–[(RST – 3) * P – 5]
(RST – 3) * P + 3
–[(RST – 3) * P – 5]
(RST – 3) * P + 3
2P
su(XRDYH-XREL)
h(XREL-XRDYH)
su(XRDYL-XREL)
h(XREL-XRDYL)
w(XRDYH)
7
9
10
11
15
16
18
19
Setup time, XRDY high before XWE low
Hold time, XRDY high after XWE low
Setup time, XRDY low before XWE low
Hold time, XRDY low after XWE low
–[(WST – 3) * P – 5]
(WST – 3) * P + 3
–[(WST – 3) * P – 5]
(WST – 3) * P + 3
su(XRDYH-XWEL)
h(XWEL-XRDYH)
su(XRDYL-XWEL)
h(XWEL-XRDYL)
†
‡
To ensure data setup time, simply program the strobe width wide enough. XRDY is internally synchronized. If XRDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, XRDY can be an asynchronous input.
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the XBUS XCE space control registers.
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use XRDY input to extend strobe width.
§
¶
द#
switching characteristics for asynchronous peripheral cycles
(see Figure 30–Figure 33)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
RS * P – 1
RH * P – 1
TYP
MAX
4P + 5
4P + 5
1
2
t
t
t
t
t
t
t
t
Output setup time, select signals valid to XRE low
Output hold time, XRE low to select signals invalid
Pulse width, XRE low
ns
ns
ns
ns
ns
ns
ns
ns
osu(SELV-XREL)
oh(XREH-SELIV)
w(XREL)
5
RST * P
WST * P
8
Delay time, XRDY high to XRE high
3P
WS * P – 1
WH * P – 1
d(XRDYH-XREH)
osu(SELV-XWEL)
oh(XWEH-SELIV)
w(XWEL)
12
13
14
17
Output setup time, select signals valid to XWE low
Output hold time, XWE low to select signals invalid
Pulse width, XWE low
Delay time, XRDY high to XWE high
3P
d(XRDYH-XWEH)
‡
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the XBUS XCE space control registers.
§
¶
#
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use XRDY input to extend strobe width.
Select signals include: XCEx, XBE[3:0], XA[5:2], XOE; and for writes, include XD[31:0], with the exception that XCEx can stay active for an
additional 7P ns following the end of the cycle.
52
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING (CONTINUED)
Setup = 2 Strobe = 3
Hold = 2
CLKOUT1
1
1
2
2
XCEx
XBE[3:0]/
†
XA[5:2]
3
4
XD[31:0]
XOE
1
2
5
6
7
XRE
‡
XWE/XWAIT
§
XRDY
†
‡
§
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write enable signal XWE during expansion bus asynchronous peripheral accesses.
XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
Figure 30. Expansion Bus Asynchronous Peripheral Read Timing (XRDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
1
1
2
2
XCEx
XBE[3:0]/
†
XA[5:2]
3
4
XD[31:0]
XOE
1
9
2
8
10
XRE
‡
XWE/XWAIT
11
§
XRDY
†
‡
§
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write enable signal XWE during expansion bus asynchronous peripheral accesses.
XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
Figure 31. Expansion Bus Asynchronous Peripheral Read Timing (XRDY Used)
53
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING (CONTINUED)
Setup = 2 Strobe = 3
Hold = 2
CLKOUT1
XCEx
12
12
13
13
XBE[3:0]/
†
XA[5:2]
12
13
XD[31:0]
XOE
XRE
15
16
14
‡
§
XWE/XWAIT
XRDY
†
‡
§
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write enable signal XWE during expansion bus asynchronous peripheral accesses.
XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
Figure 32. Expansion Bus Asynchronous Peripheral Write Timing (XRDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
12
12
13
13
XCEx
XBE[3:0]/
†
XA[5:2]
12
13
XD[31:0]
XOE
XRE
17
18
19
‡
XWE/XWAIT
11
§
XRDY
†
‡
§
XBE[3:0]/XA[5:2] operates as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write enable signal XWE during expansion bus asynchronous peripheral accesses.
XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
Figure 33. Expansion Bus Asynchronous Peripheral Write Timing (XRDY Used)
54
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING
timing requirements with external device as bus master (see Figure 34 and Figure 35)
-200
-250
-300
NO.
UNIT
MIN MAX
1
2
3
4
t
t
t
t
Setup time, XCS valid before XCLKIN high
Hold time, XCS valid after XCLKIN high
Setup time, XAS valid before XCLKIN high
Hold time, XAS valid after XCLKIN high
4
ns
ns
ns
ns
su(XCSV-XCKIH)
h(XCKIH-XCS)
su(XAS-XCKIH)
h(XCKIH-XAS)
2.3
4
2.3
5
6
t
t
t
t
t
t
Setup time, XCNTL valid before XCLKIN high
Hold time, XCNTL valid after XCLKIN high
4
2.3
4
ns
ns
ns
ns
ns
ns
su(XCTL-XCKIH)
h(XCKIH-XCTL)
su(XWR-XCKIH)
h(XCKIH-XWR)
su(XBLTV-XCKIH)
h(XCKIH-XBLTV)
†
Setup time, XW/R valid before XCLKIN high
7
†
8
Hold time, XW/R valid after XCLKIN high
Setup time, XBLAST valid before XCLKIN high
2.3
4
‡
9
‡
10
Hold time, XBLAST valid after XCLKIN high
Setup time, XBE[3:0]/XA[5:2] valid before XCLKIN high
2.3
§
16
17
18
19
t
t
t
t
4
2.3
4
ns
ns
ns
ns
su(XBEV-XCKIH)
h(XCKIH-XBEV)
su(XD-XCKIH)
h(XCKIH-XD)
§
Hold time, XBE[3:0]/XA[5:2] valid after XCLKIN high
Setup time, XDx valid before XCLKIN high
Hold time, XDx valid after XCLKIN high
2.3
†
‡
§
XW/R input/output polarity selected at boot.
XBLAST input polarity selected at boot.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
¶
switching characteristics with external device as bus master (see Figure 34 and Figure 35)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
11
12
13
14
15
20
21
t
t
t
t
t
t
t
Delay time, XCLKIN high to XDx low impedance
Delay time, XCLKIN high to XDx valid
5
5
ns
ns
ns
ns
ns
ns
ns
d(XCKIH-XDLZ)
d(XCKIH-XDV)
d(XCKIH-XDIV)
d(XCKIH-XDHZ)
d(XCKIH-XRY)
d(XCKIH-XRYLZ)
d(XCKIH-XRYHZ)
15.5
Delay time, XCLKIN high to XDx invalid
Delay time, XCLKIN high to XDx high impedance
18
15.5
15.5
#
Delay time, XCLKIN high to XRDY valid
5
5
Delay time, XCLKIN high to XRDY low impedance
Delay time, XCLKIN high to XRDY high impedance
#
2P + 5 3P + 15.5
¶
#
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
XRDY operates as active-low ready input/output during host-port accesses.
55
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING (CONTINUED)
XCLKIN
2
1
XCS
4
3
XAS
6
5
XCNTL
8
7
†
XW/R
8
7
†
‡
XW/R
XBE[3:0]/XA[5:2]
10
10
9
9
§
XBLAST
XBLAST
§
13
14
12
11
D1
15
D2
D3
D4
XD[31:0]
21
20
15
¶
XRDY
†
‡
§
¶
XW/R input/output polarity selected at boot
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XBLAST input polarity selected at boot
XRDY operates as active-low ready input/output during host-port accesses.
Figure 34. External Host as Bus Master—Read
56
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING (CONTINUED)
XCLKIN
2
1
XCS
4
3
XAS
6
5
XCNTL
8
7
†
†
XW/R
XW/R
8
7
17
16
‡
XBE[3:0]/XA[5:2]
XBLAST
XBE1
XBE2
XBE3
9
XBE4
10
10
§
9
§
XBLAST
19
18
D1
15
D2
D3
D4
XD[31:0]
21
20
15
¶
XRDY
†
‡
§
¶
XW/R input/output polarity selected at boot
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XBLAST input polarity selected at boot
XRDY operates as active-low ready input/output during host-port accesses.
Figure 35. External Host as Bus Master—Write
57
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING (CONTINUED)
timing requirements with ’C62x as bus master (see Figure 36, Figure 37, and Figure 38)
-200
-250
-300
NO.
UNIT
MIN
MAX
9
t
t
t
t
Setup time, XDx valid before XCLKIN high
Hold time, XDx valid after XCLKIN high
Setup time, XRDY valid before XCLKIN high
4
ns
ns
ns
ns
su(XDV-XCKIH)
h(XCKIH-XDV)
su(XRY-XCKIH)
h(XCKIH-XRY)
10
11
12
2.3
4
†
†
Hold time, XRDY valid after XCLKIN high
2.3
14
15
t
Setup time, XBOFF valid before XCLKIN high
Hold time, XBOFF valid after XCLKIN high
4
ns
ns
su(XBFF-XCKIH)
h(XCKIH-XBFF)
t
2.3
†
XRDY operates as active-low ready input/output during host-port accesses.
switching characteristics with ’C62x as bus master (see Figure 36, Figure 37, and Figure 38)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN MAX
1
2
3
4
5
6
7
8
t
t
t
t
t
t
t
t
Delay time, XCLKIN high to XAS valid
Delay time, XCLKIN high to XW/R valid
5
15.5
15.5
15.5
15.5
ns
ns
ns
ns
ns
ns
ns
ns
d(XCKIH-XASV)
d(XCKIH-XWRV)
d(XCKIH-XBLTV)
d(XCKIH-XBEV)
d(XCKIH-XDLZ)
d(XCKIH-XDV)
d(XCKIH-XDIV)
d(XCKIH-XDHZ)
‡
5
5
5
5
§
Delay time, XCLKIN high to XBLAST valid
¶
Delay time, XCLKIN high to XBE[3:0]/XA[5:2] valid
Delay time, XCLKIN high to XDx low impedance
Delay time, XCLKIN high to XDx valid
15.5
Delay time, XCLKIN high to XDx invalid
5
5
Delay time, XCLKIN high to XDx high impedance
18
#
13
t
Delay time, XCLKIN high to XWE/XWAIT valid
15.5
ns
d(XCKIH-XWTV)
‡
§
¶
#
XW/R input/output polarity selected at boot.
XBLAST output polarity is always active low.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XWE/XWAIT operates as XWAIT output signal during host-port accesses.
58
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING (CONTINUED)
XCLKIN
1
1
XAS
2
4
2
3
†
†
XW/R
XW/R
3
‡
§
XBLAST
4
XBE[3:0]/XA[5:2]
BE
5
9
7
6
8
10
D2
AD
D1
D3
D4
XD[31:0]
XRDY
11
12
13
13
¶
XWE/XWAIT
†
‡
§
¶
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XWE/XWAIT operates as XWAIT output signal during host-port accesses.
Figure 36. ’C62x as Bus Master—Read
XCLKIN
XAS
1
1
†
XW/R
XW/R
2
2
3
4
7
†
3
‡
XBLAST
4
§
XBE[3:0]/XA[5:2]
6
Addr
5
8
D1
D2
11
D3
D4
XD[31:0]
XRDY
12
13
13
¶
XWE/XWAIT
†
‡
§
¶
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XWE/XWAIT operates as XWAIT output signal during host-port accesses.
Figure 37. ’C62x as Bus Master—Write
59
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS SYNCHRONOUS HOST PORT TIMING (CONTINUED)
XCLKIN
1
1
XAS
†
XW/R
2
2
†
‡
XW/R
XBLAST
4
4
7
§
XBE[3:0]/XA[5:2]
6
5
8
Addr
D1
11
D2
XD[31:0]
XRDY
12
15
14
XBOFF
¶
¶
#
XHOLD
XHOLDA
XHOLD
#
XHOLDA
†
‡
§
¶
#
||
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
Internal arbiter enabled
External arbiter enabled
This diagram illustrates XBOFF timing. Bus arbitration timing is shown in Figure 41 and Figure 42.
||
Figure 38. ’C62x as Bus Master—BOFF Operation
60
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS ASYNCHRONOUS HOST PORT TIMING
†
timing requirements with external device as asynchronous bus master (see Figure 39 and
Figure 40)
-200
-250
-300
MIN MAX
4P
NO.
UNIT
1
t
Pulse duration, XCS low
Pulse duration, XCS high
ns
w(XCSL)
2
t
t
t
t
t
t
t
t
4P
2
ns
ns
ns
ns
ns
ns
ns
ns
w(XCSH)
‡
Setup time, expansion bus select signals valid before XCS low
3
su(XSEL-XCSL)
h(XCSL-XSEL)
h(XRYL-XCSL)
su(XBEV-XCSH)
h(XCSH-XBEV)
su(XDV-XCSH)
h(XCSH-XDV)
‡
4
Hold time, expansion bus select signals valid after XCS low
2
10
11
12
13
14
Hold time, XCS low after XRDY low
P
2
§
Setup time, XBE[3:0]/XA[5:2] valid before XCS high
§
Hold time, XBE[3:0]/XA[5:2] valid after XCS high
Setup time, XDx valid before XCS high
Hold time, XDx valid after XCS high
2
2
2
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
Expansion bus select signals include XCNTL and XR/W.
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
switching characteristics with external device as asynchronous bus master (see Figure 39 and
Figure 40)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN MAX
5
6
7
8
9
t
t
t
t
t
Delay time, XCS low to XDx low impedance
Delay time, XCS high to XDx invalid
Delay time, XCS high to XDx high impedance
Delay time, XRDY low to XDx valid
0
ns
ns
ns
ns
ns
d(XCSL-XDLZ)
d(XCSH-XDIV)
d(XCSH-XDHZ)
d(XRYL-XDV)
d(XCSH-XRYH)
0
12
12
4
0
0
Delay time, XCS high to XRDY high
12
61
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
EXPANSION BUS ASYNCHRONOUS HOST PORT TIMING (CONTINUED)
1
1
2
10
10
XCS
3
3
4
4
XCNTL
†
XBE[3:0]/XA[5:2]
3
3
3
3
4
4
4
4
‡
XR/W
XR/W
‡
7
6
7
6
5
8
5
8
Word
XD[31:0]
XRDY
9
9
†
‡
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XW/R input/output polarity selected at boot
Figure 39. External Device as Asynchronous Master—Read
1
10
2
10
1
XCS
3
3
4
4
XCNTL
11
11
12
12
†
‡
‡
XBE[3:0]/XA[5:2]
XR/W
3
3
3
3
4
4
4
4
XR/W
13
13
14
9
14
9
Word
XD[31:0]
XRDY
†
‡
XBE[3:0]/XA[5:2] operates as byte enables XBE[3:0] during host-port accesses.
XW/R input/output polarity selected at boot
Figure 40. External Device as Asynchronous Master—Write
62
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
XHOLD/XHOLDA TIMING
†
timing requirements for expansion bus arbitration (internal arbiter enabled) (see Figure 41)
-200
-250
-300
NO.
UNIT
MIN MAX
3
t
Output hold time, XHOLD high after XHOLDA high
P
ns
oh(XHDAH-XHDH)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
†‡
switching characteristics for expansion bus arbitration (internal arbiter enabled) (see Figure 41)
-200
-250
-300
MIN MAX
3P
NO.
PARAMETER
UNIT
§
1
2
4
5
t
t
t
t
Response time, XHOLD high to XBus high impedance
Delay time, XBus high impedance to XHOLDA high
Response time, XHOLD low to XHOLDA low
ns
ns
ns
ns
R(XHDH-XBHZ)
d(XBHZ-XHDAH)
R(XHDL-XHDAL)
d(XHDAL-XBLZ)
0
2P
3P
0
Delay time, XHOLDA low to XBus low impedance
2P
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
All pending XBus transactions are allowed to complete before XHOLDA is asserted.
External Requestor
DSP Owns Bus
Owns Bus
DSP Owns Bus
3
XHOLD (input)
2
4
XHOLDA (output)
1
5
†
’C62x
’C62x
XBus
†
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
Figure 41. Expansion Bus Arbitration—Internal Arbiter Enabled
63
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
XHOLD/XHOLDA TIMING (CONTINUED)
†
switching characteristics for expansion bus arbitration (internal arbiter disabled) (see Figure 42)
-200
-250
NO.
PARAMETER
UNIT
-300
MAX
2P 2P + 10
2P
MIN
‡
1
2
t
t
Delay time, XHOLDA high to XBus low impedance
ns
ns
d(XHDAH-XBLZ)
‡
Delay time, XBus high impedance to XHOLD low
0
d(XBHZ-XHDL)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
2
XHOLD (output)
XHOLDA (input)
1
†
XBus
’C62x
†
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
Figure 42. Expansion Bus Arbitration—Internal Arbiter Disabled
64
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING
†‡
timing requirements for McBSP (see Figure 43)
-200
-250
-300
NO.
UNIT
MIN
MAX
§
2
3
t
t
Cycle time, CLKR/X
CLKR/X ext
CLKR/X ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKX int
CLKX ext
CLKX int
CLKX ext
2P
ns
ns
c(CKRX)
¶
P–1
Pulse duration, CLKR/X high or CLKR/X low
w(CKRX)
9
1
6
3
8
0
3
3
9
1
6
3
5
6
t
t
t
t
t
t
Setup time, external FSR high before CLKR low
Hold time, external FSR high after CLKR low
Setup time, DR valid before CLKR low
ns
ns
ns
ns
ns
ns
su(FRH-CKRL)
h(CKRL-FRH)
su(DRV-CKRL)
h(CKRL-DRV)
su(FXH-CKXL)
h(CKXL-FXH)
7
8
Hold time, DR valid after CLKR low
10
11
Setup time, external FSX high before CLKX low
Hold time, external FSX high after CLKX low
†
‡
§
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
P = 1/CPU clock frequency in ns.
ThemaximumMcBSPbitrateis100MHz;therefore, theminimumCLKR/XclockcycleiseithertwicetheCPUcycletime(2P), or10ns(100MHz),
whichever value is larger. For example, when running parts at 250 MHz (P = 4 ns), use 10 ns as the minimum CLKR/X clock cycle (by setting
the appropriate CLKGDV ratio or external clock source). When running parts at 100 MHz (P = 10 ns), use 2P = 20 ns (50 MHz) as the minimum
CLKR/X clock cycle.
The minimum CLKR/X pulse duration is either (P–1) or 4 ns, whichever is larger. For example, when running parts at 250 MHz (P = 4 ns), use
4 ns as the minimum CLKR/X pulse duration. When running parts at 100 MHz (P = 10 ns), use (P–1) = 9 ns as the minimum CLKR/X pulse
duration.
¶
65
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
†‡
switching characteristics for McBSP (see Figure 43)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
Delay time, CLKS high to CLKR/X high for internal
CLKR/X generated from CLKS input
1
t
4
10
ns
d(CKSH-CKRXH)
§¶
2
3
4
t
t
t
Cycle time, CLKR/X
CLKR/X int
CLKR/X int
CLKR int
CLKX int
CLKX ext
CLKX int
CLKX ext
CLKX int
CLKX ext
2P
ns
ns
ns
c(CKRX)
#
#
Pulse duration, CLKR/X high or CLKR/X low
Delay time, CLKR high to internal FSR valid
C – 1
C + 1
w(CKRX)
–2
–2
3
3
3
9
4
9
4
9
d(CKRH-FRV)
9
t
t
t
Delay time, CLKX high to internal FSX valid
ns
ns
ns
d(CKXH-FXV)
dis(CKXH-DXHZ)
d(CKXH-DXV)
–1
3
Disable time, DX high impedance following last data bit from
CLKX high
12
13
–1
3
Delay time, CLKX high to DX valid
Delay time, FSX high to DX valid
FSX int
FSX ext
–1
3
3
9
14
t
ns
d(FXH-DXV)
ONLY applies when in data delay 0 (XDATDLY = 00b) mode.
†
‡
§
¶
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
Minimum delay times also represent minimum output hold times.
P = 1/CPU clock frequency in ns.
ThemaximumMcBSPbitrateis100MHz;therefore, theminimumCLKR/XclockcycleiseithertwicetheCPUcycletime(2P), or10ns(100MHz),
whichever value is larger. For example, when running parts at 250 MHz (P = 4 ns), use 10 ns as the minimum CLKR/X clock cycle (by setting
the appropriate CLKGDV ratio or external clock source). When running parts at 100 MHz (P = 10 ns), use 2P = 20 ns (50 MHz) as the minimum
CLKR/X clock cycle.
#
C = H or L
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
=
sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100 MHz limit.
66
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
8
DR
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
13
(n-2)
14
13
12
DX
Bit 0
Bit(n-1)
(n-3)
Figure 43. McBSP Timings
67
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for FSR when GSYNC = 1 (see Figure 44)
-200
-250
-300
NO.
UNIT
MIN
MAX
1
2
t
t
Setup time, FSR high before CLKS high
Hold time, FSR high after CLKS high
4
4
ns
ns
su(FRH-CKSH)
h(CKSH-FRH)
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X(needs resync)
Figure 44. FSR Timing When GSYNC = 1
68
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
†‡
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0 (see Figure 45)
-200
-250
-300
NO.
UNIT
MASTER
SLAVE
MIN
12
4
MAX
MIN
2 – 3P
5 + 6P
MAX
4
5
t
t
Setup time, DR valid before CLKX low
Hold time, DR valid after CLKX low
ns
ns
su(DRV-CKXL)
h(CKXL-DRV)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
†‡
switching characteristics for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0
(see Figure 45)
-200
-250
-300
NO.
PARAMETER
UNIT
§
MASTER
SLAVE
MIN
MIN MAX
MAX
¶
1
2
3
t
t
t
Hold time, FSX low after CLKX low
T – 2 T + 3
L – 2 L + 3
ns
ns
ns
h(CKXL-FXL)
d(FXL-CKXH)
d(CKXH-DXV)
#
Delay time, FSX low to CLKX high
Delay time, CLKX high to DX valid
–2
4
3P + 4 5P + 17
Disable time, DX high impedance following last data bit from
CLKX low
6
t
L – 2 L + 3
ns
dis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
7
8
t
t
P + 3 3P + 17
2P + 2 4P + 17
ns
ns
dis(FXH-DXHZ)
Delay time, FSX low to DX valid
d(FXL-DXV)
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
=
sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100 MHz limit.
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶
#
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
69
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
8
FSX
7
6
3
DX
DR
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-4)
4
5
Bit 0
(n-2)
(n-3)
(n-4)
Figure 45. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
70
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
†‡
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0 (see Figure 46)
-200
-250
-300
NO.
UNIT
MASTER
SLAVE
MIN
12
4
MAX
MIN
2 – 3P
5 + 6P
MAX
4
5
t
t
Setup time, DR valid before CLKX high
Hold time, DR valid after CLKX high
ns
ns
su(DRV-CKXH)
h(CKXH-DRV)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
†‡
switching characteristics for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0
(see Figure 46)
-200
-250
-300
NO.
PARAMETER
UNIT
§
MASTER
SLAVE
MIN
MIN MAX
MAX
¶
1
2
3
t
t
t
Hold time, FSX low after CLKX low
L – 2 L + 3
T – 2 T + 3
ns
ns
ns
h(CKXL-FXL)
d(FXL-CKXH)
d(CKXL-DXV)
#
Delay time, FSX low to CLKX high
Delay time, CLKX low to DX valid
–2
4
3P + 4 5P + 17
3P + 3 5P + 17
Disable time, DX high impedance following last data bit from
CLKX low
6
t
–2
4
ns
ns
dis(CKXL-DXHZ)
7
t
Delay time, FSX low to DX valid
H – 2 H + 4
2P + 2 4P + 17
d(FXL-DXV)
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
=
sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100 MHz limit.
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶
#
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
71
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
7
FSX
DX
6
3
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-3)
(n-4)
4
5
DR
Bit 0
(n-2)
(n-4)
Figure 46. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
72
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
†‡
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1 (see Figure 47)
-200
-250
-300
NO.
UNIT
MASTER
SLAVE
MIN
12
4
MAX
MIN
2 – 3P
5 + 6P
MAX
4
5
t
t
Setup time, DR valid before CLKX high
Hold time, DR valid after CLKX high
ns
ns
su(DRV-CKXH)
h(CKXH-DRV)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
†‡
switching characteristics for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1
(see Figure 47)
-200
-250
-300
NO.
PARAMETER
UNIT
§
MASTER
SLAVE
MIN
MIN MAX
MAX
¶
1
2
3
t
t
t
Hold time, FSX low after CLKX high
T – 2 T + 3
H – 2 H + 3
ns
ns
ns
h(CKXH-FXL)
d(FXL-CKXL)
d(CKXL-DXV)
#
Delay time, FSX low to CLKX low
Delay time, CLKX low to DX valid
–2
4
3P + 4 5P + 17
Disable time, DX high impedance following last data bit from
CLKX high
6
t
H – 2 H + 3
ns
dis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
7
8
t
t
P + 3 3P + 17
2P + 2 4P + 17
ns
ns
dis(FXH-DXHZ)
Delay time, FSX low to DX valid
d(FXL-DXV)
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
=
sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100 MHz limit.
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶
#
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
73
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
8
FSX
7
6
3
DX
DR
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-4)
4
5
Bit 0
(n-2)
(n-3)
(n-4)
Figure 47. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
74
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
†‡
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1 (see Figure 48)
-200
-250
-300
NO.
UNIT
MASTER
SLAVE
MIN
12
4
MAX
MIN
2 – 3P
5 + 6P
MAX
4
5
t
t
Setup time, DR valid before CLKX low
Hold time, DR valid after CLKX low
ns
ns
su(DRV-CKXL)
h(CKXL-DRV)
†
‡
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
†‡
switching characteristics for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1
(see Figure 48)
-200
-250
-300
NO.
PARAMETER
UNIT
§
MASTER
SLAVE
MIN
MIN MAX
MAX
¶
1
2
3
t
t
t
Hold time, FSX low after CLKX high
H – 2 H + 3
T – 2 T + 1
ns
ns
ns
h(CKXH-FXL)
d(FXL-CKXL)
d(CKXH-DXV)
#
Delay time, FSX low to CLKX low
Delay time, CLKX high to DX valid
–2
4
3P + 4 5P + 17
3P + 3 5P + 17
Disable time, DX high impedance following last data bit from
CLKX high
6
t
–2
4
ns
ns
dis(CKXH-DXHZ)
7
t
Delay time, FSX low to DX valid
L – 2 L + 4
2P + 2 4P + 17
d(FXL-DXV)
†
‡
§
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
=
sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100 MHz limit.
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
¶
#
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
75
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
DX
7
6
3
Bit 0
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-4)
4
5
DR
(n-2)
(n-3)
(n-4)
Figure 48. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
76
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
DMAC, TIMER, POWER-DOWN TIMING
†
switching characteristics for DMAC outputs (see Figure 49)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
2P–3
MAX
1
t
Pulse duration, DMAC high
ns
w(DMACH)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
1
DMAC[3:0]
Figure 49. DMAC Timing
†
timing requirements for timer inputs (see Figure 50)
-200
-250
-300
NO.
UNIT
MIN
MAX
1
2
t
t
Pulse duration, TINP high
Pulse duration, TINP low
2P
2P
ns
ns
w(TINPH)
w(TINPL)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
†
switching characteristics for timer outputs (see Figure 50)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
3
4
t
t
Pulse duration, TOUT high
Pulse duration, TOUT low
2P–3
2P–3
ns
ns
w(TOUTH)
w(TOUTL)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
2
1
TINPx
4
3
TOUTx
Figure 50. Timer Timing
77
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
DMAC, TIMER, POWER-DOWN TIMING (CONTINUED)
†
switching characteristics for power-down outputs (see Figure 51)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
2P
MAX
1
t
Pulse duration, PD high
ns
w(PDH)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 250 MHz, use P = 4 ns.
1
PD
Figure 51. Power-Down Timing
78
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
JTAG TEST-PORT TIMING
timing requirements for JTAG test port (see Figure 52)
-200
-250
-300
NO.
UNIT
MIN
MAX
1
3
4
t
t
t
Cycle time, TCK
50
10
9
ns
ns
ns
c(TCK)
Setup time, TDI/TMS/TRST valid before TCK high
Hold time, TDI/TMS/TRST valid after TCK high
su(TDIV-TCKH)
h(TCKH-TDIV)
switching characteristics for JTAG test port (see Figure 52)
-200
-250
-300
NO.
PARAMETER
UNIT
MIN
MAX
2
t
Delay time, TCK low to TDO valid
0
15
ns
d(TCKL-TDOV)
1
TCK
TDO
2
2
4
3
TDI/TMS/TRST
Figure 52. JTAG Test-Port Timing
79
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MECHANICAL DATA
GJL (S-PBGA-N352)
PLASTIC BALL GRID ARRAY
27,20
SQ
26,80
25,20
SQ
25,00 TYP
24,80
1,00
16,30 NOM
0,50
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
5
7
9
11 13 15 17 19 21 23 25
2
4
6
8
10 12 14 16 18 20 22 24 26
Heat Slug
See Note E
3,50 MAX
1,00 NOM
Seating Plane
0,15
0,70
0,50
M
0,10
0,60
0,40
4173516-2/C 07/99
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Thermally enhanced plastic package with heat slug (HSL).
D. Flip chip application only
E. Possible protrusion in this area, but within 3,50 max package height specification
F. Falls within JEDEC MO-151/AAL-1
thermal resistance characteristics (S-PBGA package)
†
NO
°C/W
0.47
14.2
12.3
10.2
8.6
Air Flow LFPM
1
2
3
4
5
RΘ
RΘ
RΘ
RΘ
RΘ
Junction-to-case
N/A
0
JC
JA
JA
JA
JA
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
100
250
500
†
LFPM = Linear Feet Per Minute
80
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MECHANICAL DATA
GLS (S-PBGA-N384)
PLASTIC BALL GRID ARRAY
18,10
17,90
SQ
16,80 TYP
0,80
0,40
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
5
7
9
11 13 15 17 19 21
2
4
6
8
10 12 14 16 18 20 22
Heat Slug
2,80 MAX
1,00 NOM
Seating Plane
0,15
0,55
0,45
M
0,10
0,45
0,35
4188959/B 12/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Thermally enhanced plastic package with heat slug (HSL)
D. Flip chip application only
thermal resistance characteristics (S-PBGA package)
†
NO
°C/W
0.85
21.6
17.9
14.2
11.8
Air Flow LFPM
1
2
3
4
5
RΘ
RΘ
RΘ
RΘ
RΘ
Junction-to-case
N/A
0
JC
JA
JA
JA
JA
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
100
250
500
†
LFPM = Linear Feet Per Minute
81
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS320C6202, TMS320C6202B, TMS320C6203, TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS104 – OCTOBER 1999
MECHANICAL DATA
GLW (S-PBGA-N340)
PLASTIC BALL GRID ARRAY (CAVITY DOWN)
18,10
17,90
SQ
16,80 TYP
0,80
0,40
AB
Y
AA
W
U
R
N
L
V
T
P
M
K
H
F
J
G
E
D
B
C
A
1
3
5
7
8
9
11 13 15 17 19 21
10 12 14 16 18 20 22
2
4
6
Heat Slug
2,00 NOM
2,80 MAX
Seating Plane
0,15
0,55
0,45
M
0,10
0,45
0,35
4200619/A 00/99
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Thermally enhanced plastic package with heat slug (HSL).
82
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
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