TMS320C5532AZHHA10 [TI]
Fixed-Point Digital Signal Processors; 定点数字信号处理器型号: | TMS320C5532AZHHA10 |
厂家: | TEXAS INSTRUMENTS |
描述: | Fixed-Point Digital Signal Processors |
文件: | 总155页 (文件大小:1509K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TMS320C5535
TMS320C5534, TMS320C5533, TMS320C5532
www.ti.com
SPRS737–AUGUST 2011
TMS320C5535, 'C5534, 'C5533, 'C5532 Fixed-Point Digital Signal Processors
Check for Samples: TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532
1 Fixed-Point Digital Signal Processor
1.1 Features
1
– Four Inter-IC Sound (I2S Bus™) for Data
Transport
– Device USB Port With Integrated 2.0
• CORE:
– High-Performance, Low-Power, TMS320C55x
Fixed-Point Digital Signal Processor
High-Speed PHY that Supports:
•
•
•
20-, 10-ns Instruction Cycle Time
50-, 100-MHz Clock Rate
One/Two Instruction(s) Executed per
Cycle
•
USB 2.0 Full- and High-Speed Device
– LCD Bridge With Asynchronous Interface
– 10-Bit 4-Input Successive Approximation
(SAR) ADC
– IEEE-1149.1 (JTAG™)
•
Dual Multipliers [Up to 200 Million
Multiply-Accumulates per Second
(MMACS)]
Boundary-Scan-Compatible
– Up to 20 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions)
• POWER:
•
•
Two Arithmetic/Logic Units (ALUs)
Three Internal Data/Operand Read Buses
and Two Internal Data/Operand Write
Buses
– Four Core Isolated Power Supply Domains:
Analog, RTC, CPU and Peripherals, and USB
– Three I/O Isolated Power Supply Domains:
•
•
Software-Compatible With C55x Devices
Industrial Temperature Devices Available
RTC I/O, USB PHY, and DVDDIO
– 320K Bytes Zero-Wait State On-Chip RAM,
– Three integrated LDOs (DSP_LDO,
ANA_LDO, and USB_LDO) to power the
isolated domains: DSP Core, Analog, and
USB Core, respectively
Composed of:
•
•
64K Bytes of Dual-Access RAM (DARAM),
8 Blocks of 4K x 16-Bit
256K Bytes of Single-Access RAM
(SARAM), 32 Blocks of 4K x 16-Bit
– 1.05-V Core (50 MHz), 1.8-V, 2.5-V, 2.75-V, or
3.3-V I/Os
– 128K Bytes of Zero Wait-State On-Chip ROM
– 1.3-V Core (100 MHz), 1.8-V, 2.5-V, 2.75-V, or
3.3-V I/Os
• CLOCK:
(4 Blocks of 16K x 16-Bit)
– Tightly-Coupled FFT Hardware Accelerator
• PERIPHERAL:
– Real-Time Clock (RTC) With Crystal Input,
With Separate Clock Domain, Separate
Power Supply
– Direct Memory Access (DMA) Controller
•
Four DMA With 4 Channels Each
(16-Channels Total)
– Low-Power S/W Programmable
– Three 32-Bit General-Purpose Timers
One Selectable as a Watchdog and/or GP
Phase-Locked Loop (PLL) Clock Generator
• BOOTLOADER:
•
– Two Embedded Multimedia Card/Secure
Digital (eMMC/SD) Interfaces
– Universal Asynchronous
Receiver/Transmitter (UART)
– Serial-Port Interface (SPI) With Four
Chip-Selects
– Master/Slave Inter-Integrated Circuit (I2C
Bus™)
– On-Chip ROM Bootloader (RBL) to Boot
From SPI EEPROM, SPI Serial Flash or I2C
EEPROM eMMC/SD/SDHC, UART, and USB
• PACKAGE:
– 144-Terminal Pb-Free Plastic BGA (Ball Grid
Array) (ZHH Suffix)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TMS320C5535
TMS320C5534, TMS320C5533, TMS320C5532
SPRS737–AUGUST 2011
www.ti.com
1.2 Applications
•
•
•
•
•
•
•
Wireless Audio Devices (e.g., Headsets, Microphones, Speakerphones)
Echo Cancellation Headphones
Portable Medical Devices
Voice Applications
Industrial Controls
Fingerprint Biometrics
Software-defined Radio
1.3 Description
These devices are members of TI's TMS320C5000™ fixed-point Digital Signal Processor (DSP) product
family and are designed for low-power applications.
The fixed-point DSP is based on the TMS320C55x DSP generation CPU processor core. The C55x DSP
architecture achieves high performance and low power through increased parallelism and total focus on
power savings. The CPU supports an internal bus structure that is composed of one program bus, one
32-bit data read bus and two 16-bit data read buses, two 16-bit data write buses, and additional buses
dedicated to peripheral and DMA activity. These buses provide the ability to perform up to four 16-bit data
reads and two 16-bit data writes in a single cycle. The device also includes four DMA controllers, each
with 4 channels, providing data movement for 16-independent channel contexts without CPU intervention.
Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and independent of the
CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit
multiplication and a 32-bit add in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by
an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize
parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data
Unit (DU) of the C55x CPU.
The C55x CPU supports a variable byte width instruction set for improved code density. The Instruction
Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the
Program Unit (PU). The Program Unit decodes the instructions, directs tasks to the Address Unit (AU) and
Data Unit (DU) resources, and manages the fully protected pipeline. Predictive branching capability avoids
pipeline flushes on execution of conditional instructions.
The general-purpose input and output functions, along with the 10-bit SAR ADC on the TMS320C5535,
provide sufficient pins for status, interrupts, and bit I/O for LCD displays, keyboards, and media interfaces.
Serial media is supported through two Secure Digital (SD) peripherals, four Inter-IC Sound (I2S Bus™)
modules, one Serial-Port Interface (SPI) with up to 4 chip selects, one I2C multi-master and slave
interface, and a Universal Asynchronous Receiver/Transmitter (UART) interface.
Additional peripherals include: a high-speed Universal Serial Bus (USB 2.0) device mode only (not
available on TMS320C5532), a real-time clock (RTC), three general-purpose timers with one configurable
as a watchdog timer, and an analog phase-locked loop (APLL) clock generator.
In addition, the TMS320C5535 includes a tightly-coupled FFT Hardware Accelerator. The tightly-coupled
FFT Hardware Accelerator supports 8 to 1024-point (in power of 2) real and complex-valued FFTs.
Furthermore, the device includes three integrated LDOs to power different sections of the device:
•
ANA_LDO (All devices)—Provides 1.3 V to the DSP PLL (VDDA_PLL), SAR, and power management
circuits (VDDA_ANA).
2
Fixed-Point Digital Signal Processor
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•
DSP_LDO (TMS320C5535 and 'C5534)—Provides 1.3 V or 1.05 V to the DSP core (CVDD), selectable
on-the-fly by software as long as operating frequency ranges are observed. For lowest power
operation, the programmer can shut down the internal DSP_LDO, cutting power to the DSP core
(CVDD) while an external supply provides power to the RTC (CVDDRTC and DVDDRTC). The RTC alarm
interrupt or the WAKEUP pin can re-enable the internal DSP_LDO and re-apply power to the DSP
core.
When DSP_LDO comes out of reset, it is enabled to 1.3 V for the bootloader to operate. For the
50-MHz devices, DSP_LDO must be programmed to 1.05 V to match the core voltage, CVDD, for
proper operation after reset.
•
USB_LDO (TMS320C5535, 'C5534, and 'C5533)—Provides 1.3 V to the USB core digital
(USB_VDD1P3) and PHY circuits (USB_VDDA1P3).
These devices are supported by the industry’s award-winning eXpressDSP™, Code Composer Studio™
Integrated Development Environment (IDE), DSP/BIOS™, Texas Instruments’ algorithm standard, and the
industry’s largest third-party network. Code Composer Studio IDE features code generation tools including
a C Compiler and Linker, RTDX™, XDS100™, XDS510™, XDS560™ emulation device drivers, and
evaluation modules. The devices are also supported by the C55x DSP Library which features more than
50 foundational software kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip
support libraries.
Copyright © 2011, Texas Instruments Incorporated
Fixed-Point Digital Signal Processor
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1.4 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the devices.
Figure 1-1. Functional Block Diagram
DSP System
JTAG Interface
C55x DSP CPU
Input
Clock(s)
Power
Management
PLL/Clock
Generator
64 KB DARAM
128 KB ROM
Pin
Multiplexing
TMS320C5532
TMS320C5533
TMS320C5534
No SARAM
64 KB SARAM
192 KB SARAM
256 KB SARAM
TMS320C5535
FFT Hardware
Accelerator
Switched Central Resource (SCR)
Peripherals
TMS320C5535
TMS320C5534
TMS320C5533
Connectivity
Program/Data
Storage
Application
Specific
Interconnect
Display
USB 2.0
PHY (HS)
[DEVICE]
Not Applicable
TMS320C5532
eMMC/SD
SDHC
(x2)
DMA
(x4)
10-Bit
SAR
ADC
LCD
Bridge
System
Serial Interfaces
I2S
I2C
(x4)
GP Timer
(x2)
GP Timer
or WD
RTC
ANA_LDO
USB_LDO
DSP_LDO
TMS320C5532
TMS320C5533
SPI
UART
TMS320C5535/C5534
4
Fixed-Point Digital Signal Processor
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1
Fixed-Point Digital Signal Processor ............... 1
6.1 Parameter Information .............................. 83
6.2
Recommended Clock and Control Signal Transition
1.1 Features .............................................. 1
1.2 Applications .......................................... 2
1.3 Description ........................................... 2
Behavior ............................................ 83
6.3 Power Supplies ..................................... 84
6.4
External Clock Input From RTC_XI, CLKIN, and
USB_MXI Pins ...................................... 87
1.4 Functional Block Diagram ............................ 4
6.5 Clock PLLs ......................................... 91
2
Device Overview ........................................ 6
6.6
Direct Memory Access (DMA) Controller ........... 93
2.1 Device Differences ................................... 6
2.2 Device Characteristics ............................... 6
2.3 C55x CPU .......................................... 13
2.4 Memory Map Summary ............................. 20
Device Pins ............................................. 24
3.1 Pin Assignments .................................... 24
6.7 Reset ............................................... 94
6.8 Wake-up Events, Interrupts, and XF ............... 98
6.9 Secure Digital (SD) ................................ 100
6.10 Real-Time Clock (RTC) ........................... 105
3
4
6.11 Inter-Integrated Circuit (I2C) ...................... 108
6.12 Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 112
3.2 Terminal Functions ................................. 28
Device Configuration ................................. 55
6.13 Inter-IC Sound (I2S) ............................... 114
6.14 Liquid Crystal Display Controller (LCDC) — C5535
Only ............................................... 121
4.1 System Registers ................................... 55
4.2 Power Considerations .............................. 56
4.3 Clock Considerations ............................... 64
4.4 Boot Sequence ..................................... 66
4.5 Configurations at Reset ............................ 69
4.6 Configurations After Reset ......................... 70
4.7 Multiplexed Pin Configurations ..................... 72
4.8 Debugging Considerations ......................... 76
Device Operating Conditions ....................... 78
6.15 10-Bit SAR ADC — C5535 Only .................. 130
6.16 Serial Port Interface (SPI) ......................... 131
6.17 Universal Serial Bus (USB) 2.0 Controller — Does
Not Apply to C5532 ............................... 134
6.18 General-Purpose Timers .......................... 141
6.19 General-Purpose Input/Output .................... 143
6.20 IEEE 1149.1 JTAG ................................ 147
Device and Documentation Support ............. 149
7.1 Device Support .................................... 149
5
6
7
8
5.1
Absolute Maximum Ratings Over Operating Case
Temperature Range (Unless Otherwise Noted) .... 78
7.2 Community Resources ............................ 150
Mechanical Packaging and Orderable
Information ............................................ 151
8.1 Thermal Data for ZHH ............................. 151
8.2 Packaging Information ............................ 151
5.2 Recommended Operating Conditions .............. 79
5.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) ............ 80
Peripheral Information and Electrical
Specifications .......................................... 83
Copyright © 2011, Texas Instruments Incorporated
Contents
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2 Device Overview
2.1 Device Differences
Table 2-1 lists the important differences between all four devices, including on-chip RAM, peripheral
support, and LDOs.
Table 2-1. Device Differences
Device
Digital Core Supply
Voltage (CVDD
On-chip
DARAM
On-chip
SARAM
USB
LCD
Interface
Tightly-
Coupled
FFT
SAR
ADC
LDO
)
1.05 V 1.3 V
Maximum CPU Speed
TMS320C5535A05
TMS320C5535A10
50 MHz
50 MHz
-
ANA, DSP,
and USB
64 KB
64 KB
64 KB
64 KB
256 KB
192 KB
64 KB
0 KB
x(1)
x
x
-
x
-
100 MHz
TMS320C5534A05
TMS320C5534A10
50 MHz
50 MHz
-
ANA, DSP,
and USB
(2)
x
x
-
-
100 MHz
TMS320C5533A05
TMS320C5533A10
50 MHz
50 MHz
-
ANA and
USB
-
-
-
-
100 MHz
TMS320C5532A05
TMS320C5532A10
50 MHz
50 MHz
-
-
-
ANA only
100 MHz
(1) x — Supported
(2) - — Not supported
2.2 Device Characteristics
Table 2-2 through Table 2-5 provide an overview of all four devices. The tables show significant features
of each device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the
package type with pin count. For more detailed information on the actual device part number and
maximum device operating frequency, see Section 7.1.2, Device and Development-Support Tool
Nomenclature.
Table 2-2. Characteristics of the 'C5535 Processor
HARDWARE FEATURES
TMS320C5535A05, 'C5535A10
Peripherals
Not all peripheral pins are
available at the same time
(for more detail, see the
Device Configurations
section).
Four DMA controllers each with four channels,
for a total of 16 channels
DMA
2 32-Bit General-Purpose (GP) Timers
1 Additional Timer Configurable as a 32-Bit GP Timer and/or a
Watchdog
Timers
UART
1 (with RTS/CTS flow control)
1 with 4 chip selects
SPI
I2C
1 (Master/Slave)
I2S
4 (Two Channel, Full Duplex Communication)
High- and Full-Speed Device
USB 2.0 (Device only)
2 SD, 256-byte read/write buffer, max 50-MHz clock and
signaling for DMA transfers
SD
LCD Bridge
1 (8-bit or 16-bit asynchronous parallel bus)
1 (10-bit, 4-input, 16-μs conversion time)
ADC (Successive Approximation [SAR])
Real-Time Clock (RTC)
FFT Hardware Accelerator
1 (Crystal Input, Separate Clock Domain and Power Supply)
1 (Supports 8 to 1024-point 16-bit real and complex FFT)
6
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Table 2-2. Characteristics of the 'C5535 Processor (continued)
HARDWARE FEATURES
General-Purpose Input/Output Port (GPIO)
Size (Bytes)
TMS320C5535A05, 'C5535A10
Up to 20 pins (with 1 Additional General-Purpose Output (XF)
and 4 Special-Purpose Outputs for Use With SAR)
320 KB RAM, 128KB ROM
•
•
•
64 KB On-Chip Dual-Access RAM (DARAM)
256 KB On-Chip Single-Access RAM (SARAM)
128 KB On-Chip Single-Access ROM (SAROM)
On-Chip Memory
Organization
JTAGID Register
(Value is: 0x1B8F E02F)
JTAG BSDL_ID
CPU Frequency
see Figure 6-38
1.05-V Core
50 MHz
100 MHz (TMS320C5535A10 only)
20 ns
MHz
1.3-V Core
1.05-V Core
Cycle Time
ns
1.3-V Core
10 ns (TMS320C5535A10 only)
1.05 V – 50 MHz
Core (V)
Voltage
LDOs
1.3 V – 100 MHz (TMS320C5535A10 only)
1.8 V, 2.5 V, 2.75 V, 3.3 V
I/O (V)
DSP_LDO
1.3 V or 1.05 V, 250 mA max current for DSP CPU (CVDD
1.3 V, 4 mA max current to supply power to PLL (VDDA_PLL),
SAR, and power management circuits (VDDA_ANA
1.3 V, 25 mA max current to supply power to USB core digital
)
ANA_LDO
USB_LDO
)
(USB_VDD1P3) and PHY circuits (USB_VDDA1P3
)
Active @ Room Temp 25°C, 75% DMAC +
25% ADD
0.15 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Power Characterization
Active @ Room Temp 25°C, 75% DMAC +
25% NOP
0.14 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM and SARAM in Active
Mode)
0.26 mW @ 1.05 V
0.44 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Retention and
SARAM in Active Mode)
0.23 mW @ 1.05 V
0.40 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Active Mode and
SARAM in Retention)
0.15 mW @ 1.05 V
0.28 mW @ 1.3 V
PLL Options
Software Programmable Multiplier
12 x 12 mm
x4 to x4099 multiplier
144-Pin BGA (ZHH)
BGA Package
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Product Status(1)
PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
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Table 2-3. Characteristics of the 'C5534 Processor
HARDWARE FEATURES
TMS320C5534A05, 'C5534A10
Peripherals
Not all peripheral pins are
available at the same time
(for more detail, see the
Device Configurations
section).
Four DMA controllers each with four channels, for a total of 16
channels
DMA
2 32-Bit General-Purpose (GP) Timers
1 Additional Timer Configurable as a 32-Bit GP Timer and/or a
Watchdog
Timers
UART
1 (with RTS/CTS flow control)
1 with 4 chip selects
SPI
I2C
1 (Master/Slave)
I2S
4 (Two Channel, Full Duplex Communication)
High- and Full-Speed Device
USB 2.0 (Device only)
2 SD, 256-byte read/write buffer, max 50-MHz clock and
signaling for DMA transfers
SD
Real-Time Clock (RTC)
1 (Crystal Input, Separate Clock Domain and Power Supply)
Up to 20 pins (with 1 Additional General-Purpose Output (XF))
256 KB RAM, 128KB ROM
General-Purpose Input/Output Port (GPIO)
Size (Bytes)
•
64 KB On-Chip Dual-Access RAM (DARAM)
192 KB On-Chip Single-Access RAM (SARAM)
128 KB On-Chip Single-Access ROM (SAROM)
On-Chip Memory
Organization
•
•
JTAGID Register
(Value is: 0x1B8F E02F)
JTAG BSDL_ID
CPU Frequency
see Figure 6-38
1.05-V Core
50 MHz
100 MHz (TMS320C5534A10 only)
20 ns
MHz
1.3-V Core
1.05-V Core
Cycle Time
ns
1.3-V Core
10 ns (TMS320C5534A10 only)
1.05 V – 50 MHz
Core (V)
Voltage
LDOs
1.3 V – 100 MHz (TMS320C5534A10 only)
1.8 V, 2.5 V, 2.75 V, 3.3 V
I/O (V)
DSP_LDO
1.3 V or 1.05 V, 250 mA max current for DSP CPU (CVDD)
1.3 V, 4 mA max current to supply power to PLL (VDDA_PLL
and power management circuits (VDDA_ANA
)
ANA_LDO
USB_LDO
)
1.3 V, 25 mA max current to supply power to USB core digital
(USB_VDD1P3) and PHY circuits (USB_VDDA1P3
)
Active @ Room Temp 25°C, 75% DMAC +
25% ADD
0.15 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Power Characterization
Active @ Room Temp 25°C, 75% DMAC +
25% NOP
0.14 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM and SARAM in Active
Mode)
0.26 mW @ 1.05 V
0.44 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Retention and
SARAM in Active Mode)
0.23 mW @ 1.05 V
0.40 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Active Mode and
SARAM in Retention)
0.15 mW @ 1.05 V
0.28 mW @ 1.3 V
PLL Options
Software Programmable Multiplier
12 x 12 mm
x4 to x4099 multiplier
144-Pin BGA (ZHH)
BGA Package
8
Device Overview
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Table 2-3. Characteristics of the 'C5534 Processor (continued)
HARDWARE FEATURES
TMS320C5534A05, 'C5534A10
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Product Status(1)
PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
Device Overview
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Table 2-4. Characteristics of the 'C5533 Processor
HARDWARE FEATURES
TMS320C5533A05, 'C5533A10
Peripherals
Not all peripheral pins are
available at the same time
(for more detail, see the
Device Configurations
section).
Four DMA controllers each with four channels,
for a total of 16 channels
DMA
2 32-Bit General-Purpose (GP) Timers
1 Additional Timer Configurable as a 32-Bit GP Timer and/or a
Watchdog
Timers
UART
1 (with RTS/CTS flow control)
1 with 4 chip selects
SPI
I2C
1 (Master/Slave)
I2S
4 (Two Channel, Full Duplex Communication)
High- and Full-Speed Device
USB 2.0 (Device only)
2 SD, 256-byte read/write buffer, max 50-MHz clock and
signaling for DMA transfers
SD
Real-Time Clock (RTC)
1 (Crystal Input, Separate Clock Domain and Power Supply)
Up to 20 pins (with 1 Additional General-Purpose Output (XF))
128 KB RAM, 128KB ROM
General-Purpose Input/Output Port (GPIO)
Size (Bytes)
•
64 KB On-Chip Dual-Access RAM (DARAM)
64 KB On-Chip Single-Access RAM (SARAM)
128 KB On-Chip Single-Access ROM (SAROM)
On-Chip Memory
Organization
•
•
JTAGID Register
(Value is: 0x1B8F E02F)
JTAG BSDL_ID
CPU Frequency
see Figure 6-38
1.05-V Core
50 MHz
100 MHz (TMS320C5533A10 only)
20 ns
MHz
1.3-V Core
1.05-V Core
Cycle Time
ns
1.3-V Core
10 ns (TMS320C5533A10 only)
1.05 V – 50 MHz
Core (V)
Voltage
LDOs
1.3 V – 100 MHz (TMS320C5533A10 only)
1.8 V, 2.5 V, 2.75 V, 3.3 V
I/O (V)
1.3 V, 4 mA max current to supply power to PLL (VDDA_PLL
)
ANA_LDO
and power management circuits (VDDA_ANA
)
1.3 V, 25 mA max current to supply power to USB core digital
USB_LDO
(USB_VDD1P3) and PHY circuits (USB_VDDA1P3
)
Active @ Room Temp 25°C, 75% DMAC +
25% ADD
0.15 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Power Characterization
Active @ Room Temp 25°C, 75% DMAC +
25% NOP
0.14 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM and SARAM in Active
Mode)
0.26 mW @ 1.05 V
0.44 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Retention and
SARAM in Active Mode)
0.23 mW @ 1.05 V
0.40 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Active Mode and
SARAM in Retention)
0.15 mW @ 1.05 V
0.28 mW @ 1.3 V
PLL Options
Software Programmable Multiplier
12 x 12 mm
x4 to x4099 multiplier
144-Pin BGA (ZHH)
BGA Package
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Table 2-4. Characteristics of the 'C5533 Processor (continued)
HARDWARE FEATURES
TMS320C5533A05, 'C5533A10
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Product Status(1)
PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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Table 2-5. Characteristics of the C5532 Processor
HARDWARE FEATURES
TMS320C5532A05, 'C5532A10
Peripherals
Not all peripheral pins are
available at the same time
(for more detail, see the
Device Configurations
section).
Four DMA controllers each with four channels,
for a total of 16 channels
DMA
2 32-Bit General-Purpose (GP) Timers
1 Additional Timer Configurable as a 32-Bit GP Timer and/or a
Watchdog
Timers
UART
SPI
1 (with RTS/CTS flow control)
1 with 4 chip selects
I2C
1 (Master/Slave)
I2S
4 (Two Channel, Full Duplex Communication)
2 SD, 256-byte read/write buffer, max 50-MHz clock and
signaling for DMA transfers
SD
Real-Time Clock (RTC)
1 (Crystal Input, Separate Clock Domain and Power Supply)
Up to 20 pins (with 1 Additional General-Purpose Output (XF))
64 KB RAM, 128KB ROM
General-Purpose Input/Output Port (GPIO)
Size (Bytes)
On-Chip Memory
•
64 KB On-Chip Dual-Access RAM (DARAM)
128 KB On-Chip Single-Access ROM (SAROM)
Organization
•
JTAGID Register
(Value is: 0x1B8F E02F)
JTAG BSDL_ID
CPU Frequency
see Figure 6-38
1.05-V Core
50 MHz
100 MHz (TMS320C5532A10 only)
20 ns
MHz
1.3-V Core
1.05-V Core
Cycle Time
Voltage
ns
1.3-V Core
10 ns (TMS320C5532A10 only)
1.05 V – 50 MHz
Core (V)
1.3 V – 100 MHz (TMS320C5532A10 only)
1.8 V, 2.5 V, 2.75 V, 3.3 V
I/O (V)
1.3 V, 4 mA max current for PLL (VDDA_PLL) power
LDO
ANA_LDO
management circuits (VDDA_ANA
)
Active @ Room Temp 25°C, 75% DMAC +
25% ADD
0.15 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Power Characterization
Active @ Room Temp 25°C, 75% DMAC +
25% NOP
0.14 mW/MHz @ 1.05 V, 50 MHz
0.22 mW/MHz @ 1.3 V, 100 MHz
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM and SARAM in Active
Mode)
0.26 mW @ 1.05 V
0.44 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Retention and
SARAM in Active Mode)
0.23 mW @ 1.05 V
0.40 mW @ 1.3 V
Standby (Master Clock Disabled) @ Room
Temp 25°C (DARAM in Active Mode and
SARAM in Retention)
0.15 mW @ 1.05 V
0.28 mW @ 1.3 V
PLL Options
Software Programmable Multiplier
12 x 12 mm
x4 to x4099 multiplier
144-Pin BGA (ZHH)
BGA Package
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Product Status(1)
PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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2.3 C55x CPU
The TMS320C5535, 'C5534, 'C5533, and 'C5532 fixed-point digital signal processors (DSP) are based on
the C55x CPU 3.3 generation processor core. The C55x DSP architecture achieves high performance and
low power through increased parallelism and total focus on power savings. The CPU supports an internal
bus structure that is composed of one program bus, three data read buses (one 32-bit data read bus and
two 16-bit data read buses), two 16-bit data write buses, and additional buses dedicated to peripheral and
DMA activity. These buses provide the ability to perform up to four data reads and two data writes in a
single cycle. Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and
independent of the CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit
multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional
16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel
activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit
(DU) of the C55x CPU.
The C55x DSP generation supports a variable byte width instruction set for improved code density. The
Instruction Unit (IU) performs 32-bit program fetches from internal or external memory, stores them in a
128-byte Instruction Buffer Queue, and queues instructions for the Program Unit (PU). The Program Unit
decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline.
Predictive branching capability avoids pipeline flushes on execution of conditional instruction calls.
For more detailed information on the CPU, see the TMS320C55x CPU 3.0 CPU Reference Guide
(literature number SWPU073).
2.3.1 On-Chip Dual-Access RAM (DARAM)
The DARAM is located in the byte address range 000000h − 00FFFFh and is composed of eight blocks of
4K words each (see Table 2-6). Each DARAM block can perform two accesses per cycle (two reads, two
writes, or a read and a write). The DARAM can be accessed by the internal program, data, or DMA buses.
Table 2-6. DARAM Blocks
CPU
DMA CONTROLLER
BYTE ADDRESS RANGE
MEMORY BLOCK
BYTE ADDRESS RANGE
000000h – 001FFFh
002000h – 003FFFh
004000h – 005FFFh
006000h – 007FFFh
008000h – 009FFFh
00A000h – 00BFFFh
00C000h – 00DFFFh
00E000h – 00FFFFh
0001 0000h – 0001 1FFFh
0001 2000h – 0001 3FFFh
0001 4000h – 0001 5FFFh
0001 6000h – 0001 7FFFh
0001 8000h – 0001 9FFFh
0001 A000h – 0001 BFFFh
0001 C000h – 0001 DFFFh
0001 E000h – 0001 FFFFh
DARAM 0(1)
DARAM 1
DARAM 2
DARAM 3
DARAM 4
DARAM 5
DARAM 6
DARAM 7
(1) The first 192 bytes are reserved for memory-mapped registers (MMRs). See Figure 2-1, Memory Map
Summary.
2.3.2 On-Chip Read-Only Memory (ROM)
The zero-wait-state ROM is located at the byte address range FE0000h – FFFFFFh. The ROM is
composed of four 16K-word blocks, for a total of 128K bytes of ROM. The ROM address space can be
mapped by software to the internal ROM.
The standard device includes a Bootloader program resident in the ROM.
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When the MPNMC bit field of the ST3 status register is cleared (by default), the byte address range
FE0000h – FFFFFFh is reserved for the on-chip ROM. When the MPNMC bit field of the ST3 status
register is set through software, the on-chip ROM is disabled and not present in the memory map, and
byte address range FE0000h – FFFFFFh is unmapped. A hardware reset always clears the MPNMC bit,
so it is not possible to disable the ROM at reset. However, the software reset instruction does not affect
the MPNMC bit. The ROM can be accessed by the program and data buses. Each on-chip ROM block is
a one cycle per word access memory.
2.3.3 On-Chip Single-Access RAM (SARAM)
Section 2.3.3.1 explains the SARAM blocks for the C5535. Section 2.3.3.2 explains the SARAM blocks for
the C5534. Section 2.3.3.3 explains the SARAM blocks for the C5533. The C5532 has no SARAM blocks.
2.3.3.1 SARAM for C5535
The SARAM is located at the byte address range 010000h – 04FFFFh and is composed of 32 blocks of
4K words each (see Table 2-7). Each SARAM block can perform one access per cycle (one read or one
write). SARAM can be accessed by the internal program, data, or DMA buses. SARAM is also accessed
by the USB and LCD DMA buses.
Table 2-7. SARAM Blocks for C5535
CPU
DMA/USB CONTROLLER
BYTE ADDRESS RANGE
MEMORY BLOCK
BYTE ADDRESS RANGE
010000h − 011FFFh
012000h − 013FFFh
014000h − 015FFFh
016000h − 017FFFh
018000h − 019FFFh
01A000h − 01BFFFh
01C000h − 01DFFFh
01E000h − 01FFFFh
020000h − 021FFFh
022000h − 023FFFh
024000h − 025FFFh
026000h − 027FFFh
028000h − 029FFFh
02A000h − 02BFFFh
02C000h − 02DFFFh
02E000h − 02FFFFh
030000h − 031FFFh
032000h − 033FFFh
034000h − 035FFFh
036000h − 037FFFh
038000h − 039FFFh
03A000h − 03BFFFh
03C000h − 03DFFFh
03E000h − 03FFFFh
040000h – 041FFFh
042000h – 043FFFh
044000h – 045FFFh
046000h – 047FFFh
0009 0000h – 0009 1FFFh
0009 2000h – 0009 3FFFh
0009 4000h – 0009 5FFFh
0009 6000h – 0009 7FFFh
0009 8000h – 0009 9FFFh
0009 A000h – 0009 BFFFh
0009 C000h – 0009 DFFFh
0009 E000h – 0009 FFFFh
000A 0000h – 000A 1FFFh
000A 2000h – 000A 3FFFh
000A 4000h – 000A 5FFFh
000A 6000h – 000A 7FFFh
000A 8000h – 000A 9FFFh
000A A000h – 000A BFFFh
000A C000h – 000A DFFFh
000A E000h – 000A FFFFh
000B 0000h – 000B 1FFFh
000B 2000h – 000B 3FFFh
000B 4000h – 000B 5FFFh
000B 6000h – 000B 7FFFh
000B 8000h – 000B 9FFFh
000B A000h – 000B BFFFh
000B C000h – 000B DFFFh
000B E000h – 000B FFFFh
000C 0000h – 000C 1FFFh
000C 2000h – 000C 3FFFh
000C 4000h – 000C 5FFFh
000C 6000h – 000C 7FFFh
SARAM 0
SARAM 1
SARAM 2
SARAM 3
SARAM 4
SARAM 5
SARAM 6
SARAM 7
SARAM 8
SARAM 9
SARAM 10
SARAM 11
SARAM 12
SARAM 13
SARAM 14
SARAM 15
SARAM 16
SARAM 17
SARAM 18
SARAM 19
SARAM 20
SARAM 21
SARAM 22
SARAM 23
SARAM 24
SARAM 25
SARAM 26
SARAM 27
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Table 2-7. SARAM Blocks for C5535 (continued)
CPU
DMA/USB CONTROLLER
BYTE ADDRESS RANGE
MEMORY BLOCK
BYTE ADDRESS RANGE
048000h – 049FFFh
04A000h – 04BFFFh
04C000h – 04DFFFh
04E000h – 04FFFFh
000C 8000h – 000C 9FFFh
000C A000h – 000C BFFFh
000C C000h – 000C DFFFh
000C E000h – 000C FFFFh
SARAM 28
SARAM 29
SARAM 30
SARAM 31(1)
(1) SARAM31 (byte address range: 0x4E000 – 0x4EFFF) is reserved for the bootloader. After the boot
process is complete, this memory space can be used.
2.3.3.2 SARAM for C5534
The SARAM is located at the byte address range 010000h – 03FFFFh and is composed of 24 blocks of
4K words each (see Table 2-8). Each SARAM block can perform one access per cycle (one read or one
write). SARAM can be accessed by the internal program, data, or DMA buses. SARAM is also accessed
by the USB bus.
Table 2-8. SARAM Blocks for C5534
CPU
DMA/USB CONTROLLER
BYTE ADDRESS RANGE
MEMORY BLOCK
BYTE ADDRESS RANGE
010000h − 011FFFh
012000h − 013FFFh
014000h − 015FFFh
016000h − 017FFFh
018000h − 019FFFh
01A000h − 01BFFFh
01C000h − 01DFFFh
01E000h − 01FFFFh
020000h − 021FFFh
022000h − 023FFFh
024000h − 025FFFh
026000h − 027FFFh
028000h − 029FFFh
02A000h − 02BFFFh
02C000h − 02DFFFh
02E000h − 02FFFFh
030000h − 031FFFh
032000h − 033FFFh
034000h − 035FFFh
036000h − 037FFFh
038000h − 039FFFh
03A000h − 03BFFFh
03C000h − 03DFFFh
03E000h − 03FFFFh
0009 0000h – 0009 1FFFh
0009 2000h – 0009 3FFFh
0009 4000h – 0009 5FFFh
0009 6000h – 0009 7FFFh
0009 8000h – 0009 9FFFh
0009 A000h – 0009 BFFFh
0009 C000h – 0009 DFFFh
0009 E000h – 0009 FFFFh
000A 0000h – 000A 1FFFh
000A 2000h – 000A 3FFFh
000A 4000h – 000A 5FFFh
000A 6000h – 000A 7FFFh
000A 8000h – 000A 9FFFh
000A A000h – 000A BFFFh
000A C000h – 000A DFFFh
000A E000h – 000A FFFFh
000B 0000h – 000B 1FFFh
000B 2000h – 000B 3FFFh
000B 4000h – 000B 5FFFh
000B 6000h – 000B 7FFFh
000B 8000h – 000B 9FFFh
000B A000h – 000B BFFFh
000B C000h – 000B DFFFh
000B E000h – 000B FFFFh
SARAM 0
SARAM 1
SARAM 2
SARAM 3
SARAM 4
SARAM 5
SARAM 6
SARAM 7
SARAM 8
SARAM 9
SARAM 10
SARAM 11
SARAM 12
SARAM 13
SARAM 14
SARAM 15
SARAM 16
SARAM 17
SARAM 18
SARAM 19
SARAM 20
SARAM 21
SARAM 22
SARAM 23
2.3.3.3 SARAM for C5533
The SARAM is located at the byte address range 010000h – 01FFFFh and is composed of 8 blocks of 4K
words each (see Table 2-9). Each SARAM block can perform one access per cycle (one read or one
write). SARAM can be accessed by the internal program, data, or DMA buses. SARAM is also accessed
by the USB bus.
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Table 2-9. SARAM Blocks for C5533
CPU
DMA/USB CONTROLLER
BYTE ADDRESS RANGE
MEMORY BLOCK
BYTE ADDRESS RANGE
010000h − 011FFFh
012000h − 013FFFh
014000h − 015FFFh
016000h − 017FFFh
018000h − 019FFFh
01A000h − 01BFFFh
01C000h − 01DFFFh
01E000h − 01FFFFh
0009 0000h – 0009 1FFFh
0009 2000h – 0009 3FFFh
0009 4000h – 0009 5FFFh
0009 6000h – 0009 7FFFh
0009 8000h – 0009 9FFFh
0009 A000h – 0009 BFFFh
0009 C000h – 0009 DFFFh
0009 E000h – 0009 FFFFh
SARAM 0
SARAM 1
SARAM 2
SARAM 3
SARAM 4
SARAM 5
SARAM 6
SARAM 7
2.3.4 I/O Memory
Each device DSP includes a 64K byte I/O space for the memory-mapped registers of the DSP peripherals
and system registers used for idle control, status monitoring and system configuration. I/O space is
separate from program/memory space and is accessed with separate instruction opcodes or via the
DMA's.
Table 2-10, Table 2-11, and Table 2-12 list the memory-mapped registers of each device. Note that not all
addresses in the 64K byte I/O space are used; these addresses should be treated as RESERVED and not
accessed by the CPU nor DMA. For the expanded tables of each peripheral, see Section 6, Peripheral
Information and Electrical Specifications of this document.
Some DMA controllers have access to the I/O-Space memory-mapped registers of the following
peripherals registers: I2C, UART, I2S, SD, USB, and SAR ADC.
Before accessing any peripheral memory-mapped register, make sure the peripheral being accessed is
not held in reset via the Peripheral Reset Control Register (PRCR) and its internal clock is enabled via the
Peripheral Clock Gating Control Registers (PCGCR1 and PCGCR2).
Table 2-10. Peripheral I/O-Space Control Registers for C5535
WORD ADDRESS
0x0000 – 0x0004
PERIPHERAL
Idle Control
Reserved
DMA0
0x0005 – 0x000D through 0x0803 – 0x0BFF
0x0C00 – 0x0C7F
0x0C80 – 0x0CFF
0x0D00 – 0x0D7F
0x0D80 – 0x0DFF
0x0E00 – 0x0E7F
Reserved
DMA1
Reserved
DMA2
0x0E80 – 0x0EFF
0x0F00 – 0x0F7F
Reserved
DMA3
0x0F80 – 0x17FF
Reserved
Timer0
0x1800 – 0x181F
0x1820 – 0x183F
Reserved
Timer1
0x1840 – 0x185F
0x1860 – 0x187F
Reserved
Timer2
0x1880 – 0x189F
0x1900 – 0x197F
RTC
0x1980 – 0x19FF
Reserved
I2C
0x1A00 – 0x1A6C
0x1A6D – 0x1AFF
Reserved
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Table 2-10. Peripheral I/O-Space Control Registers for C5535 (continued)
WORD ADDRESS
0x1B00 – 0x1B1F
PERIPHERAL
UART
0x1B80 – 0x1BFF
0x1C00 – 0x1CFF
0x1D00 – 0x1FFF through 0x2600 – 0x27FF
0x2800 – 0x2840
Reserved
System Control
Reserved
I2S0
0x2900 – 0x2940
I2S1
0x2A00 – 0x2A40
I2S2
0x2B00 – 0x2B40
I2S3
0x2C41 – 0x2DFF
0x2E00 – 0x2E40
Reserved
LCD
0x2E41 – 0x2FFF
Reserved
0x3000 – 0x300F
SPI
0x3010 – 0x39FF
Reserved
0x3A00 – 0x3A1F
SD0
0x3A20 – 0x3AFF
0x3B00 – 0x3B1F
Reserved
SD1
0x3B2F – 0x6FFF
0x7000 – 0x70FF
Reserved
SAR and Analog Control Registers
0x7100 – 0x7FFF
Reserved
USB
0x8000 – 0xFFFF
Table 2-11. Peripheral I/O-Space Control Registers for C5534 and C5533
WORD ADDRESS
0x0000 – 0x0004
PERIPHERAL
Idle Control
Reserved
DMA0
0x0005 – 0x000D through 0x0803 – 0x0BFF
0x0C00 – 0x0C7F
0x0C80 – 0x0CFF
Reserved
DMA1
0x0D00 – 0x0D7F
0x0D80 – 0x0DFF
Reserved
DMA2
0x0E00 – 0x0E7F
0x0E80 – 0x0EFF
Reserved
DMA3
0x0F00 – 0x0F7F
0x0F80 – 0x0FFF
Reserved
Reserved
Reserved
Timer0
0x1000 – 0x10DD
0x10EE – 0x10FF through 0x1300 – 0x17FF
0x1800 – 0x181F
0x1820 – 0x183F
Reserved
Timer1
0x1840 – 0x185F
0x1860 – 0x187F
Reserved
Timer2
0x1880 – 0x189F
0x1900 – 0x197F
RTC
0x1980 – 0x19FF
Reserved
I2C
0x1A00 – 0x1A6C
0x1A6D – 0x1AFF
Reserved
UART
0x1B00 – 0x1B1F
0x1B80 – 0x1BFF
Reserved
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Table 2-11. Peripheral I/O-Space Control Registers for C5534 and
C5533 (continued)
WORD ADDRESS
PERIPHERAL
System Control
Reserved
I2S0
0x1C00 – 0x1CFF
0x1D00 – 0x1FFF through 0x2600 – 0x27FF
0x2800 – 0x2840
0x2900 – 0x2940
I2S1
0x2A00 – 0x2A40
I2S2
0x2B00 – 0x2B40
I2S3
0x2C41 – 0x2FFF
0x3000 – 0x300F
Reserved
SPI
0x3010 – 0x39FF
Reserved
SD0
0x3A00 – 0x3A1F
0x3A20 – 0x3AFF
0x3B00 – 0x3B1F
Reserved
SD1
0x3B2F – 0x7FFF
0x8000 – 0xFFFF
Reserved
USB
Table 2-12. Peripheral I/O-Space Control Registers for C5532
WORD ADDRESS
0x0000 – 0x0004
PERIPHERAL
Idle Control
Reserved
DMA0
0x0005 – 0x000D through 0x0803 – 0x0BFF
0x0C00 – 0x0C7F
0x0C80 – 0x0CFF
Reserved
DMA1
0x0D00 – 0x0D7F
0x0D80 – 0x0DFF
Reserved
DMA2
0x0E00 – 0x0E7F
0x0E80 – 0x0EFF
Reserved
DMA3
0x0F00 – 0x0F7F
0x0F80 – 0x0FFF
Reserved
Reserved
Reserved
Timer0
0x1000 – 0x10DD
0x10EE – 0x10FF through 0x1300 – 0x17FF
0x1800 – 0x181F
0x1820 – 0x183F
Reserved
Timer1
0x1840 – 0x185F
0x1860 – 0x187F
Reserved
Timer2
0x1880 – 0x189F
0x1900 – 0x197F
RTC
0x1980 – 0x19FF
Reserved
I2C
0x1A00 – 0x1A6C
0x1A6D – 0x1AFF
Reserved
UART
0x1B00 – 0x1B1F
0x1B80 – 0x1BFF
Reserved
System Control
Reserved
I2S0
0x1C00 – 0x1CFF
0x1D00 – 0x1FFF through 0x2600 – 0x27FF
0x2800 – 0x2840
0x2900 – 0x2940
I2S1
0x2A00 – 0x2A40
I2S2
18
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Table 2-12. Peripheral I/O-Space Control Registers for C5532 (continued)
WORD ADDRESS
0x2B00 – 0x2B40
PERIPHERAL
I2S3
0x2C41 – 0x2DFF through 0x2E41 - 0x2FFF
0x3000 – 0x300F
Reserved
SPI
0x3010 – 0x39FF
Reserved
SD0
0x3A00 – 0x3A1F
0x3A20 – 0x3AFF
Reserved
SD1
0x3B00 – 0x3B1F
0x3B2F – 0xFFFF
Reserved
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Device Overview
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2.4 Memory Map Summary
The on-chip, dual-access RAM allows two accesses to a given block during the same cycle. There are 8
blocks of 8K bytes of dual-access RAM. The on-chip, single-access RAM allows one access to a given
block per cycle. In addition, there are 32 blocks of 8K bytes of single-access RAM.
The DSP memory is accessible by different master modules within the DSP, including the C55x CPU, the
four DMA controllers, LCD, and USB's CDMA (see Figure 2-1).
CPU BYTE
DMA/USB/LCD
ADDRESS(A) BYTE ADDRESS(A)
MEMORY BLOCKS
MMR (Reserved)(B)
BLOCK SIZE
000000h
0000C0h
0001 0000h
0001 00C0h
DARAM(C)
SARAM
64K Minus 192 Bytes
256K Bytes
010000h
050000h
0009 0000h
0100 0000h
Reserved
FE0000h
FFFFFFh
050E 0000h
050F FFFFh
Unmapped (if MPNMC=1)
128K Bytes ROM (if MPNMC=0)
ROM
(if MPNMC=0)
Reserved
(if MPNMC=1)
A. Address shown represents the first byte address in each block.
B. The first 192 bytes are reserved for memory-mapped registers (MMRs).
C. The USB and LCD controllers do not have access to DARAM.
Figure 2-1. C5535 Memory Map Summary
20
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CPU BYTE
DMA/USB
ADDRESS(A) BYTE ADDRESS(A)
MEMORY BLOCKS
BLOCK SIZE
000000h
0000C0h
0001 0000h
0001 00C0h
MMR (Reserved)(B)
DARAM(C)
64K Minus 192 Bytes
192K Bytes
010000h
040000h
0009 0000h
000C 0000h
SARAM
Reserved
050E 0000h
050F FFFFh
FE0000h
FFFFFFh
Unmapped (if MPNMC=1)
128K Bytes ROM (if MPNMC=0)
ROM
(if MPNMC=0)
Reserved
(if MPNMC=1)
A. Address shown represents the first byte address in each block.
B. The first 192 bytes are reserved for memory-mapped registers (MMRs).
C. The USB controller does not have access to DARAM.
Figure 2-2. C5534 Memory Map Summary
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CPU BYTE
DMA/USB
ADDRESS(A) BYTE ADDRESS(A)
MEMORY BLOCKS
MMR (Reserved)(B)
BLOCK SIZE
000000h
0000C0h
0001 0000h
0001 00C0h
DARAM(C)
SARAM
64K Minus 192 Bytes
64K Bytes
010000h
020000h
0009 0000h
000A 0000h
Reserved
FE0000h
FFFFFFh
050E 0000h
050F FFFFh
Unmapped (if MPNMC=1)
128K Bytes ROM (if MPNMC=0)
ROM
(if MPNMC=0)
Reserved
(if MPNMC=1)
A. Address shown represents the first byte address in each block.
B. The first 192 bytes are reserved for memory-mapped registers (MMRs).
C. The USB controller does not have access to DARAM.
Figure 2-3. C5533 Memory Map Summary
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CPU BYTE
DMA
ADDRESS(A) BYTE ADDRESS(A)
MEMORY BLOCKS
BLOCK SIZE
000000h
0000C0h
0001 0000h
0001 00C0h
MMR (Reserved)(B)
64K Minus 192 Bytes
DARAM
010000h
0009 0000h
Reserved
FE0000h
FFFFFFh
050E 0000h
050F FFFFh
Unmapped (if MPNMC=1)
128K Bytes ROM (if MPNMC=0)
ROM
(if MPNMC=0)
Reserved
(if MPNMC=1)
A. Address shown represents the first byte address in each block.
B. The first 192 bytes are reserved for memory-mapped registers (MMRs).
Figure 2-4. C5532 Memory Map Summary
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3 Device Pins
3.1 Pin Assignments
Extensive pin multiplexing is used to accommodate the largest number of peripheral functions in the
smallest possible package. Pin multiplexing is controlled using software programmable register settings.
For more information on pin muxing, see Section 4.7, Multiplexed Pin Configurations of this document.
3.1.1 Pin Map (Bottom View)
Figure 3-1 shows the bottom view of the package pin assignments.
SD0_D1/
I2S0_RX/
GP[3]
SD0_D3/
GP[5]
SD1_D1/
I2S1_RX/
GP[9]
SD0_D2/
GP[4]
SD0_CMD/
I2S0_FS/
GP[1]
SD1_D3/
GP[11]
SD1_D0/
I2S1_DX/
GP[8]
SD1_CLK/
I2S1_CLK/
GP[6]
SD0_CLK/
I2S0_CLK/
GP[0]
SD1_CMD/
I2S1_FS/
GP[7]
SD1_D2/
GP[10]
SD0_D0/
I2S0_DX/
GP[2]
USB_MXI
USB_MXO
DSP_LDO_
EN
INT0
DV
DDRTC
LDOI
INT1
LDOI
DSP_LDOO
Figure 3-1. C5535 Pin Map
24
Device Pins
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I2S2_CLK/
GP[18]/
SPI_CLK
SD0_D1/
I2S0_RX/
GP[3]
SD0_D3/
GP[5]
I2S2_RX/
GP[20]/
SPI_RX
SD1_D1/
I2S1_RX/
GP[9]
I2S2_DX/
GP[27]/
SPI_TX
UART_CTS/ UART_RXD/
GP[30]/
I2S3_RX
V
TRST
SS
GP[14]
GP[16]
TCK
V
P
N
M
L
GP[17]
SS
GP[29]/
I2S3_FS
I2S2_FS/
GP[19]/
SPI_CS0
UART_RTS/
GP[28]/
I2S3_CLK
SD0_D2/
GP[4]
SPI_CS2
GP[13]
TMS
GP[15]
DV
CV
DD
SPI_RX
TDO
DV
DV
DDIO
DDIO
DDIO
SD0_CMD/
I2S0_FS/
GP[1]
UART_TXD/
GP[31]/
I2S3_DX
SD1_D3/
GP[11]
SD1_D0/
I2S1_DX/
GP[8]
SD1_CLK/
I2S1_CLK/
GP[6]
SD0_CLK/
I2S0_CLK/
GP[0]
DV
DV
EMU1
SPI_CS0
SPI_TX
SPI_CS1
EMU0
TDI
SPI_CS3
CV
DD
V
CV
DD
DDIO
DDIO
SS
SD1_CMD/
I2S1_FS/
GP[7]
SD1_D2/
GP[10]
RSV2
USB_VBUS
V
SS
SPI_CLK
DV
V
SS
DDIO
USB_V
SS1P3
V
V
CV
DD
RSV1
USB_V
DD1P3
K
J
SS
SS
SD0_D0/
I2S0_DX/
GP[2]
USB_V
SSA1P3
V
USB_DM
USB_DP
USB_R1
GP[12]
XF
SS
USB_
RSV10
RSV9
RSV8
USB_V
SSA3P3
CV
DD
V
H
G
F
SS
V
DDA1P3
CV
DD
RSV12
USB_V
USB_V
USB_V
DDA3P3
DDPLL
USB_V
USB_V
DD1P3
V
CV
DD
SSREF
SSPLL
SS
V
V
V
USB_V
USB_V
USB_V
USB_MXI
RSV11
RESET
E
D
C
B
A
RSV7
SS
SS
SS
DD1P3
DDOSC
SSOSC
V
SS
V
USB_LDOO
USB_MXO
CLK_SEL
CV
DD
V
CV
DD
SS
SS
DSP_LDO_
EN
V
BG_CAP
V
INT0
V
CV
DD
V
LDOI
LDOI
CLKIN
INT1
DV
SCL
V
DV
SSA_ANA
SS
SSRTC
DDRTC
DDIO
DDA_PLL
SS
LDOI
V
CV
RSV3
V
V
ANA_LDOO
RSV5
RSV6
CV
V
NC
SS
DDRTC
SS
SSA_ANA
DDRTC
DDA_ANA
V
SDA
NC
NC
10
RSV0
NC
RSV4
11
CLKOUT
RTC_CLKOUT
WAKEUP
RTC_XO
RTC_XI
SSA_PLL
DSP_LDOO
V
SS
1
2
3
4
5
6
7
8
9
12
13
14
Figure 3-2. C5534 Pin Map
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Device Pins
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I2S2_CLK/
GP[18]/
SPI_CLK
SD0_D1/
I2S0_RX/
GP[3]
SD0_D3/
GP[5]
I2S2_RX/
GP[20]/
SPI_RX
SD1_D1/
I2S1_RX/
GP[9]
I2S2_DX/
GP[27]/
SPI_TX
UART_CTS/ UART_RXD/
GP[30]/
I2S3_RX
V
TRST
SS
GP[14]
GP[16]
TCK
V
P
N
M
L
GP[17]
SS
GP[29]/
I2S3_FS
I2S2_FS/
GP[19]/
SPI_CS0
UART_RTS/
GP[28]/
I2S3_CLK
SD0_D2/
GP[4]
SPI_CS2
GP[13]
TMS
GP[15]
DV
CV
DD
SPI_RX
TDO
DV
DV
DDIO
DDIO
DDIO
SD0_CMD/
I2S0_FS/
GP[1]
UART_TXD/
GP[31]/
I2S3_DX
SD1_D3/
GP[11]
SD1_D0/
I2S1_DX/
GP[8]
SD1_CLK/
I2S1_CLK/
GP[6]
SD0_CLK/
I2S0_CLK/
GP[0]
DV
DV
EMU1
SPI_CS0
SPI_TX
SPI_CS1
EMU0
TDI
SPI_CS3
CV
DD
V
CV
DD
DDIO
DDIO
SS
SD1_CMD/
I2S1_FS/
GP[7]
SD1_D2/
GP[10]
RSV2
USB_VBUS
V
SS
SPI_CLK
DV
V
SS
DDIO
USB_V
SS1P3
V
V
CV
DD
RSV1
USB_V
DD1P3
K
J
SS
SS
SD0_D0/
I2S0_DX/
GP[2]
USB_V
SSA1P3
V
USB_DM
USB_DP
USB_R1
GP[12]
XF
SS
USB_
RSV10
RSV9
RSV8
USB_V
SSA3P3
CV
DD
V
H
G
F
SS
V
DDA1P3
CV
DD
RSV12
USB_V
USB_V
USB_V
DDA3P3
DDPLL
USB_V
USB_V
DD1P3
V
CV
DD
SSREF
SSPLL
SS
V
V
V
USB_V
USB_V
USB_V
USB_MXI
RSV11
RESET
E
D
C
B
A
RSV7
SS
SS
SS
DD1P3
DDOSC
SSOSC
V
SS
V
USB_LDOO
USB_MXO
CLK_SEL
CV
DD
V
CV
DD
SS
SS
DSP_LDO_
(1)
EN
V
BG_CAP
V
INT0
V
CV
DD
V
LDOI
LDOI
CLKIN
INT1
DV
SCL
V
DV
SSA_ANA
SS
SSRTC
DDRTC
DDIO
DDA_PLL
SS
LDOI
V
CV
RSV3
V
V
ANA_LDOO
RSV5
RSV6
CV
V
NC
SS
DDRTC
SS
SSA_ANA
DDRTC
DDA_ANA
V
SDA
NC
NC
10
RSV0
RSV4
11
CLKOUT
RTC_CLKOUT
WAKEUP
RTC_XO
RTC_XI
NC
8
SSA_PLL
DSP_LDOO
V
SS
1
2
3
4
5
6
7
9
12
13
14
(1) Pin is not supported on this device. To ensure proper device operation, this pin must be hooked up properly. See Table 3-15,
Regulators and Power Management Terminal Functions.
(2) Shaded pins are not supported on this device. To ensure proper device operation, these pins must be hooked up properly. See
Table 3-9, Unsupported USB 2.0 Terminal Functions.
Figure 3-3. C5533 Pin Map
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I2S2_CLK/
GP[18]/
SPI_CLK
SD0_D1/
I2S0_RX/
GP[3]
SD0_D3/
GP[5]
I2S2_RX/
GP[20]/
SPI_RX
SD1_D1/
I2S1_RX/
GP[9]
I2S2_DX/
GP[27]/
SPI_TX
UART_CTS/ UART_RXD/
GP[30]/
I2S3_RX
V
TRST
SS
GP[14]
GP[16]
TCK
V
P
N
M
L
GP[17]
SS
GP[29]/
I2S3_FS
I2S2_FS/
GP[19]/
SPI_CS0
UART_RTS/
GP[28]/
I2S3_CLK
SD0_D2/
GP[4]
SPI_CS2
GP[13]
TMS
GP[15]
DV
CV
DD
SPI_RX
TDO
DV
DV
DDIO
DDIO
DDIO
SD0_CMD/
I2S0_FS/
GP[1]
UART_TXD/
GP[31]/
I2S3_DX
SD1_D3/
GP[11]
SD1_D0/
I2S1_DX/
GP[8]
SD1_CLK/
I2S1_CLK/
GP[6]
SD0_CLK/
I2S0_CLK/
GP[0]
DV
DV
EMU1
SPI_CS0
SPI_TX
SPI_CS1
EMU0
TDI
SPI_CS3
CV
DD
V
CV
DD
DDIO
DDIO
SS
SD1_CMD/
I2S1_FS/
GP[7]
SD1_D2/
GP[10]
RSV2
USB_V
BUS
V
SS
SPI_CLK
DV
V
SS
DDIO
USB_V
SS1P3
V
V
CV
DD
RSV1
USB_V
DD1P3
K
J
SS
SS
SD0_D0/
I2S0_DX/
GP[2]
USB_V
SSA1P3
V
USB_DM
USB_DP
USB_R1
GP[12]
XF
SS
USB_
RSV10
RSV9
RSV8
USB_V
SSA3P3
CV
DD
V
H
G
F
SS
V
DDA1P3
CV
DD
RSV12
USB_V
USB_V
USB_V
DDA3P3
DDPLL
USB_V
USB_V
DD1P3
V
CV
DD
SSREF
SSPLL
SS
V
V
V
USB_V
USB_V
USB_V
USB_MXI
RSV11
RESET
E
D
C
B
A
RSV7
SS
SS
SS
DD1P3
DDOSC
SSOSC
V
SS
V
USB_
(1)
LDOO
USB_MXO
CLK_SEL
CV
DD
V
CV
DD
SS
SS
DSP_LDO_
(1)
EN
V
BG_CAP
V
INT0
V
CV
DD
V
LDOI
LDOI
CLKIN
INT1
DV
SCL
V
DV
SSA_ANA
SS
SSRTC
DDRTC
DDIO
DDA_PLL
SS
LDOI
V
CV
RSV3
V
V
ANA_LDOO
RSV5
RSV6
CV
V
NC
SS
DDRTC
SS
SSA_ANA
DDRTC
DDA_ANA
DSP_
(1)
LDOO
V
SDA
NC
NC
10
RSV0
RSV4
11
CLKOUT
RTC_CLKOUT
WAKEUP
RTC_XO
RTC_XI
NC
8
SSA_PLL
V
SS
1
2
3
4
5
6
7
9
12
13
14
(1) Pin is not supported on this device. To ensure proper device operation, this pin must be hooked up properly. See Table 3-15,
Regulators and Power Management Terminal Functions.
(2) Shaded pins are not supported on this device. To ensure proper device operation, these pins must be hooked up properly. See
Table 3-9, Unsupported USB 2.0 Terminal Functions.
Figure 3-4. C5532 Pin Map
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Device Pins
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3.2 Terminal Functions
The terminal functions tables (Table 3-1 through Table 3-18) identify the external signal names, the
associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin
has any internal pullup or pulldown resistors or bus-holders, and a functional pin description. For more
detailed information on device configuration, peripheral selection, multiplexed/shared pins, and debugging
considerations, see the Device Configuration section of this data manual.
For proper device operation, external pullup/pulldown resistors may be required on some pins.
Section 4.8.1, Pullup/Pulldown Resistors discusses situations where external pullup/pulldown resistors are
required.
28
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Table 3-1. Oscillator/PLL Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
DSP clock output signal. For debug purposes, the CLKOUT pin can be used to tap
different clocks within the system clock generator. The SRC bits in the CLKOUT
Control Source Register (CCSSR) can be used to specify the CLKOUT pin source.
Additionally, the slew rate of the CLKOUT pin can be controlled by the Output
Slew Rate Control Register (OSRCR) [0x1C16].
–
The CLKOUT pin is enabled/disabled through the CLKOFF bit in the CPU ST3_55
register. When disabled, the CLKOUT pin is placed in high-impedance (Hi-Z). At
reset the CLKOUT pin is enabled until the beginning of the boot sequence, when
the on-chip Bootloader sets CLKOFF = 1 and the CLKOUT pin is disabled (Hi-Z).
For more information on the ST3_55 register, see the TMS320C55x 3.0 CPU
Reference Guide (literature number: SWPU073).
CLKOUT
A2
O/Z
DVDDIO
BH
Note: This pin may consume static power if configured as Hi-Z and not externally
pulled low or high. Prevent current drain by externally terminating the pin.
Input clock. This signal is used to input an external clock when the 32-KHz on-chip
oscillator is not used as the DSP clock (pin CLK_SEL = 1). For boot purposes, the
CLKIN frequency is assumed to be either 11.2896, 12, or 12.288 MHz.
The CLK_SEL pin (D1) selects between the 32-KHz crystal clock or CLKIN.
–
When the CLK_SEL pin is low, this pin should be tied to ground (VSS). When
CLK_SEL is high, this pin should be driven by an external clock source.
CLKIN
C1
I
DVDDIO
BH
If CLK_SEL is high, this pin is used as the reference clock for the clock generator
and during bootup the bootloader bypasses the PLL and assumes the CLKIN
frequency is one of the following frequencies: 11.2896-, 12-, or 12.288-MHz. With
these frequencies in mind, the bootloader sets the SPI clock rates at 500 KHz and
the I2C clock rate at 400 KHz.
Clock input select. This pin selects between the 32-KHz crystal clock or CLKIN.
0 = 32-KHz on-chip oscillator drives the RTC timer and the system clock generator
while CLKIN is ignored.
–
CLK_SEL
D1
I
DVDDIO
BH
1 = CLKIN drives the system clock generator and the 32-KHz on-chip oscillator
drives only the RTC timer.
This pin is not allowed to change during device operation; it must be tied high or
low at the board.
1.3-V Analog PLL power supply for the system clock generator (PLLOUT ≤ 120
MHz).
see Section 5.2,
ROC
VDDA_PLL
C7
A1
PWR
GND
This signal can be powered from the ANA_LDOO pin.
Analog PLL ground for the system clock generator.
see Section 5.2,
ROC
VSSA_PLL
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-2. Real-Time Clock (RTC) Terminal Functions
TYPE(1)
SIGNAL
NAME
OTHER(3) (4)
DESCRIPTION
(2)
NO.
Real-time clock oscillator output. This pin operates at the RTC core voltage,
CVDDRTC, and supports a 32.768-kHz crystal.
If the RTC oscillator is not used, it can be disabled by connecting RTC_XI to
CVDDRTC and RTC_XO to floating or grounded. A voltage must still be applied to
CVDDRTC (see Section 5.2, Recommended Operating Conditions).
–
RTC_XO
RTC_XI
A6
I/O/Z
CVDDRTC
Note: When RTC oscillator is disabled, the RTC registers (I/O address range
1900h – 197Fh) are not accessible.
Real-time clock oscillator input.
If the RTC oscillator is not used, it can be disabled by connecting RTC_XI to
CVDDRTC and RTC_XO to ground (VSS). A voltage must still be applied to CVDDRTC
(see Section 5.2, Recommended Operating Conditions).
–
A7
I
CVDDRTC
Note: When RTC oscillator is disabled, the RTC registers (I/O address range
1900h – 197Fh) are not accessible.
Real-time clock output pin. This pin operates at DVDDRTC voltage. The
RTC_CLKOUT pin is enabled/disabled through the RTCCLKOUTEN bit in the RTC
Power Management Register (RTCPMGT). At reset, the RTC_CLKOUT pin is
disabled (high-impedance [Hi-Z]).
–
RTC_CLKOUT
WAKEUP
A3
A5
O/Z
DVDDRTC
The pin is used to WAKEUP the core from idle condition. This pin defaults to an
input at CVDDRTC powerup, but can also be configured as an active-low open-drain
output signal to wakeup an external device from an RTC alarm.
–
I/O/Z
DVDDRTC
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-3. RESET, Interrupts, and JTAG Terminal Functions
SIGNAL
NAME
TYPE(1) (2) OTHER(3) (4)
DESCRIPTION
NO.
RESET
External Flag Output. XF is used for signaling other processors in
multiprocessor configurations or XF can be used as a fast
general-purpose output pin.
XF is set high by the BSET XF instruction and XF is set low by the
BCLR XF instruction or by writing to bit 13 of the ST1_55 register. For
more information on the ST1_55 register, see the TMS320C55x 3.0
CPU Reference Guide (literature number: SWPU073).
–
XF
J3
O/Z
DVDDIO
BH
For XF pin behavior at reset, see Section 6.7.2, Pin Behavior at Reset.
Note: This pin may consume static power if configured as Hi-Z and not
externally pulled low or high. Prevent current drain by externally
terminating the pin. XF pin is ONLY in the Hi-Z state when doing
boundary scan. Therefore, external termination is probably not required
for most applications.
Device reset. RESET causes the DSP to terminate execution and loads
the program counter with the contents of the reset vector. When
RESET is brought to a high level, the reset vector in ROM at FFFF00h
forces the program execution to branch to the location of the on-chip
ROM bootloader.
IPU
DVDDIO
BH
RESET
D2
I
RESET affects the various registers and status bits.
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register but will be forced ON when RESET is asserted.
JTAG
[For more detailed information on emulation header design guidelines, see the XDS560 Emulator Technical Reference (literature number:
SPRU589).]
IEEE standard 1149.1 test mode select. This serial control input is
clocked into the TAP controller on the rising edge of TCK.
If the emulation header is located greater than 6 inches from the
device, TMS must be buffered. In this case, the input buffer for TMS
IPU
DVDDIO
BH
needs a pullup resistor connected to DVDDIO to hold the signal at a
known value when the emulator is not connected. A resistor value of
4.7 kΩ or greater is suggested. For board design guidelines related to
the emulation header, see the XDS560 Emulator Technical Reference
(literature number: SPRU589).
TMS
N6
I
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register.
IEEE standard 1149.1 test data output. The contents of the selected
register (instruction or data) are shifted out of TDO on the falling edge
of TCK. TDO is in the high-impedance (Hi-Z) state except when the
scanning of data is in progress.
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
–
TDO
N1
O/Z
DVDDIO
BH
If the emulation header is located greater than 6 inches from the
device, TDO must be buffered.
Note: This pin may consume static power if configured as Hi-Z and not
externally pulled low or high. Prevent current drain by externally
terminating the pin. TDO pin will be in Hi-Z whenever not doing
emulation/boundary scan, so an external pullup is highly recommended.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-3. RESET, Interrupts, and JTAG Terminal Functions (continued)
SIGNAL
NAME
TYPE(1) (2) OTHER(3) (4)
DESCRIPTION
NO.
IEEE standard 1149.1 test data input. TDI is clocked into the selected
register (instruction or data) on a rising edge of TCK.
If the emulation header is located greater than 6 inches from the
device, TDI must be buffered. In this case, the input buffer for TDI
needs a pullup resistor connected to DVDDIO to hold this signal at a
known value when the emulator is not connected. A resistor value of
4.7 kΩ or greater is suggested.
IPU
DVDDIO
BH
TDI
K2
I
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register.
IEEE standard 1149.1 test clock. TCK is normally a free-running clock
signal with a 50% duty cycle. The changes on input signals TMS and
TDI are clocked into the TAP controller, instruction register, or selected
test data register on the rising edge of TCK. Changes at the TAP output
signal (TDO) occur on the falling edge of TCK.
IPU
DVDDIO
BH
If the emulation header is located greater than 6 inches from the
device, TCK must be buffered.
TCK
N3
I
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register.
IEEE standard 1149.1 reset signal for test and emulation logic. TRST,
when high, allows the IEEE standard 1149.1 scan and emulation logic
to take control of the operations of the device. If TRST is not connected
or is driven low, the device operates in its functional mode, and the
IEEE standard 1149.1 signals are ignored. The device will not operate
properly if this reset pin is never asserted low.
IPD
DVDDIO
BH
TRST
P4
I
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
It is recommended that an external pulldown resistor be used in
addition to the IPD -- especially if there is a long trace to an emulation
header.
Emulator 1 pin. EMU1 is used as an interrupt to or from the emulator
system and is defined as input/output by way of the emulation logic.
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
IPU
DVDDIO
BH
An external pullup to DVDDIO is required to provide a signal rise time of
less than 10 μsec. A 4.7-kΩ resistor is suggested for most applications.
EMU1
M1
I/O/Z
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register.
Emulator 0 pin. When TRST is driven low and then high, the state of
the EMU0 pin is latched and used to connect the JTAG pins (TCK,
TMS, TDI, TDO) to either the IEEE1149.1 Boundary-Scan TAP (when
the latched value of EMU0 = 0) or to the DSP Emulation TAP (when the
latched value of EMU0 = 1). Once TRST is high, EMU0 is used as an
interrupt to or from the emulator system and is defined as input/output
by way of the emulation logic.
IPU
DVDDIO
BH
EMU0
L2
I/O/Z
An external pullup to DVDDIO is required to provide a signal rise time of
less than 10 μsec. A 4.7-kΩ resistor is suggested for most applications.
For board design guidelines related to the emulation header, see the
XDS560 Emulator Technical Reference (literature number: SPRU589).
The IPU resistor on this pin can be enabled or disabled via the
PDINHIBR2 register.
EXTERNAL INTERRUPTS
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Table 3-3. RESET, Interrupts, and JTAG Terminal Functions (continued)
SIGNAL
NAME
TYPE(1) (2) OTHER(3) (4)
DESCRIPTION
NO.
IPU
DVDDIO
BH
External interrupt inputs (INT1 and INT0). These pins are maskable via
their specific Interrupt Mask Register (IMR1, IMR0) and the interrupt
mode bit. The pins can be polled and reset by their specific Interrupt
Flag Register (IFR1, IFR0).
INT1
INT0
B1
I
I
IPU
DVDDIO
BH
C2
The IPU resistor on these pins can be enabled or disabled via the
PDINHIBR2 register.
Table 3-4. Inter-Integrated Circuit (I2C) Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
I2C
DVDDIO
BH
This pin is the I2C clock output. Per the I2C standard, an external pullup is required
on this pin.
SCL
SDA
C4
A4
I/O/Z
I/O/Z
DVDDIO
BH
This pin is the I2C bidirectional data signal. Per the I2C standard, an external pullup
is required on this pin.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-5. Inter-IC Sound (I2S0 – I2S3) Terminal Functions
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
Interface 0 (I2S0)
This pin is multiplexed between SD0, I2S0, and GPIO.
For I2S, it is I2S0 transmit data output I2S0_DX.
SD0_D0/
I2S0_DX/
GP[2]
IPD
DVDDIO
BH
J1
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For I2S, it is I2S0 clock input/output I2S0_CLK.
SD0_CLK/
I2S0_CLK/
GP[0]
IPD
DVDDIO
BH
M8
P6
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For I2S, it is I2S0 receive data input I2S0_RX.
SD0_D1/
I2S0_RX/
GP[3]
IPD
DVDDIO
BH
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
SD0_CMD/
I2S0_FS/
GP[1]
IPD
DVDDIO
BH
For I2S, it is I2S0 frame synchronization input/output I2S0_FS.
M10
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
Interface 1 (I2S1)
This pin is multiplexed between SD1, I2S1, and GPIO.
SD1_D0/
2S1_DX/
GP[8]
IPD
DVDDIO
BH
For I2S, it is I2S1 transmit data output I2S1_DX.
M13
M14
P10
L11
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S1, and GPIO.
For I2S, it is I2S1 clock input/output I2S1_CLK.
SD1_CLK/
I2S1_CLK/
GP[6]
IPD
DVDDIO
BH
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S1, and GPIO.
For I2S, it is I2S1 receive data input I2S1_RX.
SD1_D1/
I2S1_RX/
GP[9]
IPD
DVDDIO
BH
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S2, and GPIO.
SD1_CMD/
I2S1_FS/
GP[7]
IPD
DVDDIO
BH
For I2S, it is I2S1 frame synchronization input/output I2S1_FS.
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) LCD Bridge applies only to TMS320C5535.
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Table 3-5. Inter-IC Sound (I2S0 – I2S3) Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
Interface 2 (I2S2)
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For I2S, it is I2S2 transmit data output I2S2_DX.
LCD_D[11]/
I2S2_DX/
GP[27]/
IPD
DVDDIO
BH
P11
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_TX
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For I2S, it is I2S2 clock input/output I2S2_CLK.
LCD_D8]/
I2S2_CLK/
GP[18]/
IPD
DVDDIO
BH
P5
P9
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CLK
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For I2S, it is I2S2 receive data input I2S2_RX.
LCD_D[10]/
I2S2_RX/
GP[20]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_RX
This pin is multiplexed between LCD Bridge, I2S2, and GPIO.
For I2S, it is I2S2 frame synchronization input/output I2S2_FS.
LCD_D[9]/
I2S2_FS/
GP[19]/
IPD
DVDDIO
BH
N10
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CS0
Interface 3 (I2S3)
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
LCD_D[15]/
UART_TXD/
GP[31]/
IPD
DVDDIO
BH
For I2S, it is I2S3 transmit data output I2S3_DX.
M11
N12
P13
P12
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_DX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For I2S, it is I2S3 clock input/output I2S3_CLK.
LCD_D[12]/
UART_RTS/
GP[28]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_CLK
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For I2S, it is I2S3 receive data input I2S3_RX.
LCD_D[14]/
UART_RXD/
GP[30]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_RX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For I2S, it is I2S3 frame synchronization input/output I2S3_FS.
LCD_D[13]/
UART_CTS/
GP[29]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_FS
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Table 3-6. Serial Peripheral Interface (SPI) Terminal Functions
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
Serial Port Interface (SPI)
This pin is multiplexed between LCD Bridge and SPI.
Mux control via the PPMODE bits in the EBSR.
LCD_CS0_E0/
SPI_CS0
DVDDIO
BH
L1
I/O/Z
I/O/Z
I/O/Z
For SPI, this pin is SPI chip select SPI_CS0.
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
LCD_D[9]/
I2S2_FS/
GP[19]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is SPI chip select SPI_CS0.
N10
M2
SPI_CS0
The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and SPI.
LCD_CS1_E1/
SPI_CS1
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is SPI chip select SPI_CS1.
This pin is multiplexed between LCD Bridge and SPI.
LCD_RW_WRB/
SPI_CS2
DVDDIO
BH
N2
M5
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is SPI chip select SPI_CS2.
This pin is multiplexed between LCD Bridge and SPI.
LCD_RS/
SPI_CS3
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is SPI chip select SPI_CS3.
This pin is multiplexed between LCD Bridge and SPI.
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is clock output SPI_CLK.
LCD_EN_RDB/
SPI_CLK
DVDDIO
BH
L3
O/Z
Note: This pin may consume static power if configured as Hi-Z and not externally
pulled low or high. Prevent current drain by externally terminating the pin.
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is clock output SPI_CLK.
LCD_D8]/
I2S2_CLK/
GP[18]/
IPD
DVDDIO
BH
P5
K1
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
SPI_CLK
The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and SPI.
LCD_D[1]/
SPI_TX
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR.
For SPI, this pin is SPI transmit data output.
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
Mux control via the PPMODE bits in the EBSR.
LCD_D[11]/
I2S2_DX/
GP[27]/
IPD
DVDDIO
BH
P11
N4
P9
For SPI, this pin is SPI transmit data output.
SPI_TX
The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and SPI.
LCD_D[0]/
SPI_RX
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR.
For SPI this pin is SPI receive data input.
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
Mux control via the PPMODE bits in the EBSR.
LCD_D[10]/
I2S2_RX/
GP[20]/
IPD
DVDDIO
BH
For SPI this pin is SPI receive data input.
SPI_RX
The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) LCD Bridge applies only to TMS320C5535.
36
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Table 3-7. UART Terminal Functions
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
UART
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
When used by UART, it is the receive data input UART_RXD.
LCD_D[14]/
UART_RXD/
GP[30]/
IPD
DVDDIO
BH
P13
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_RX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
In UART mode, it is the transmit data output UART_TXD.
LCD_D[15]/
UART_TXD/
GP[31]/
IPD
DVDDIO
BH
M11
P12
N12
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_DX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
In UART mode, it is the clear to send input UART_CTS.
LCD_D[13]/
UART_CTS/
GP[29]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_FS
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
In UART mode, it is the ready to send output UART_RTS.
LCD_D[12]/
UART_RTS/
GP[28]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_CLK
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) LCD Bridge applies only to TMS320C5535.
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Table 3-8. USB2.0 Terminal Functions — Does Not Apply to C5532
TYPE(1)
SIGNAL
NAME
OTHER(3) (4)
DESCRIPTION
(2)
NO.
USB 2.0
12-MHz crystal oscillator input.
When the USB peripheral is not used, USB_MXI should be connected to ground
(VSS).
USB_MXI
E14
I
USB_VDDOSC
When using an external 12-MHz oscillator, the external oscillator clock signal should
be connected to the USB_MXI pin and the amplitude of the oscillator clock signal
must meet the VIH requirement (see Section 5.2, Recommended Operating
Conditions). The USB_MXO is left unconnected and the USB_VSSOSC signal is
connected to board ground (VSS).
12-MHz crystal oscillator output.
When the USB peripheral is not used, USB_MXO should be left unconnected.
When using an external 12-MHz oscillator, the external oscillator clock signal should
be connected to the USB_MXI pin and the amplitude of the oscillator clock signal
must meet the VIH requirement (see Section 5.2, Recommended Operating
Conditions). The USB_MXO is left unconnected and the USB_VSSOSC signal is
connected to board ground (VSS).
USB_MXO
D14
O/Z
USB_VDDOSC
3.3-V power supply for USB oscillator.
see
Section 5.2,
ROC
USB_VDDOSC
USB_VSSOSC
USB_VBUS
E13
D12
L14
S
S
When the USB peripheral is not used, USB_VDDOSC should be connected to ground
(VSS).
Ground for USB oscillator. When using a 12-MHz crystal, this pin is a local ground
for the crystal and must not be connected to the board ground (See Figure 6-7).
see
Section 5.2,
ROC
When using an external 12-MHz oscillator, the external oscillator clock signal should
be connected to the USB_MXI pin and the amplitude of the oscillator clock signal
must meet the VIH requirement (see Section 5.2, Recommended Operating
Conditions). The USB_MXO is left unconnected and the USB_VSSOSC signal is
connected to board ground (VSS).
USB power detect. 5-V input that signifies that VBUS is connected.
see
Section 5.2,
ROC
A I/O
When the USB peripheral is not used, the USB_VBUS signal should be connected
to ground (VSS).
USB_DP
USB_DM
H14
J14
A I/O
A I/O
USB_VDDA3P3 USB bi-directional Data Differential signal pair [positive/negative].
When the USB peripheral is not used, the USB_DP and USB_DM signals should
USB_VDDA3P3
both be tied to ground (VSS).
External resistor connect. Reference current output. This must be connected via a
10-kΩ ±1% resistor to USB_VSSREF and be placed as close to the device as
possible.
USB_R1
G14
F12
A I/O
GND
USB_VDDA3P3
When the USB peripheral is not used, the USB_R1 signal should be connected via
a 10-kΩ resistor to USB_VSSREF
.
Ground for reference current. This must be connected via a 10-kΩ ±1% resistor to
USB_R1.
see
Section 5.2,
ROC
USB_VSSREF
When the USB peripheral is not used, the USB_VSSREF signal should be connected
directly to ground (Vss).
Analog 3.3 V power supply for USB PHY.
see
Section 5.2,
ROC
USB_VDDA3P3
USB_VSSA3P3
G12
H13
S
When the USB peripheral is not used, the USB_VDDA3P3 signal should be
connected to ground (VSS).
see
Section 5.2,
ROC
GND
Analog ground for USB PHY.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
38
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Table 3-8. USB2.0 Terminal Functions — Does Not Apply to C5532 (continued)
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
Analog 1.3 V power supply for USB PHY. [For high-speed sensitive analog circuits]
see
Section 5.2,
ROC
USB_VDDA1P3
H12
S
GND
S
When the USB peripheral is not used, the USB_VDDA1P3 signal should be
connected to ground (VSS).
see
Section 5.2,
ROC
USB_VSSA1P3
USB_VDD1P3
USB_VSS1P3
USB_VDDPLL
USB_VSSPLL
J12
Analog ground for USB PHY [For high speed sensitive analog circuits].
1.3-V digital core power supply for USB PHY.
K13,
E12,
F14
see
Section 5.2,
ROC
When the USB peripheral is not used, the USB_VDD1P3 signal should be connected
to ground (VSS).
see
Section 5.2,
ROC
K14
G13
F13
GND
S
Digital core ground for USB phy.
3.3 V USB Analog PLL power supply.
see
Section 5.2,
ROC
When the USB peripheral is not used, the USB_VDDPLL signal should be connected
to ground (VSS).
see
Section 5.2,
ROC
GND
USB Analog PLL ground.
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Table 3-9. Unsupported USB2.0 Terminal Functions — C5532 Only
TYPE(1)
SIGNAL
NAME
OTHER(3) (4)
DESCRIPTION
(2)
NO.
USB 2.0
When the USB peripheral is not used, USB_MXI should be connected to ground
(VSS).
USB_MXI
USB_MXO
USB_VDDOSC
E14
D14
E13
I
-
-
-
O/Z
S
When the USB peripheral is not used, USB_MXO should be left unconnected.
When the USB peripheral is not used, USB_VDDOSC should be connected to ground
(VSS).
The USB_MXO is left unconnected and the USB_VSSOSC signal is connected to
board ground (VSS).
USB_VSSOSC
USB_VBUS
D12
L14
S
-
-
When the USB peripheral is not used, the USB_VBUS signal should be connected
to ground (VSS).
A I/O
USB_DP
USB_DM
H14
J14
A I/O
A I/O
-
-
When the USB peripheral is not used, the USB_DP and USB_DM signals should
both be tied to ground (VSS).
When the USB peripheral is not used, the USB_R1 signal should be connected via
a 10-kΩ resistor to ground (Vss).
USB_R1
G14
F12
A I/O
GND
-
-
When the USB peripheral is not used, the USB_VSSREF signal should be connected
directly to ground (Vss).
USB_VSSREF
When the USB peripheral is not used, the USB_VDDA3P3 signal should be
connected to ground (VSS).
USB_VDDA3P3
USB_VSSA3P3
USB_VDDA1P3
USB_VSSA1P3
G12
H13
H12
J12
S
-
-
-
-
When the USB peripheral is not used, USB_VSSA3P3 should be conntected to
ground (VSS).
GND
S
When the USB peripheral is not used, the USB_VDDA1P3 signal should be
connected to ground (VSS).
When the USB peripheral is not used, USBVSSA1P3 should be connected to ground
(VSS).
GND
K13,
E12,
F14
When the USB peripheral is not used, the USB_VDD1P3 signal should be connected
to ground (VSS).
USB_VDD1P3
S
-
When the USB peripheral is not used, USB_VSS1P3 should be connected to ground
(VSS).
USB_VSS1P3
USB_VDDPLL
USB_VSSPLL
K14
G13
F13
GND
S
-
-
-
When the USB peripheral is not used, the USB_VDDPLL signal should be connected
to ground (VSS).
When the USB peripheral is not used, USB_VSSPLL should be connected to ground
(VSS).
GND
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
40
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Table 3-10. LCD Bridge Terminal Functions — C5535 Only
TYPE(1)
SIGNAL
OTHER(3) (4) DESCRIPTION
This pin is multiplexed between LCD Bridge and SPI.
(2)
NAME
NO.
For LCD Bridge, this pin is either LCD Bridge read/write enable (MPU68 mode) or
read strobe (MPU80 mode).
LCD_EN_RDB/
SPI_CLK
DVDDIO
BH
L3
O/Z
Mux control via the PPMODE bits in the EBSR.
Note: This pin may consume static power if configured as Hi-Z and not externally
pulled low or high. Prevent current drain by externally terminating the pin.
This pin is multiplexed between LCD Bridge and SPI.
LCD_CS0_E0/
SPI_CS0
DVDDIO
BH
For LCD Bridge, this pin is either LCD Bridge chip select 0 (MPU68 and MPU80
modes) or enable 0 (HD44780 mode).
L1
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR.
This pin is multiplexed between LCD Bridge and SPI.
LCD_CS1_E1/
SPI_CS1
DVDDIO
BH
For LCD Bridge, this pin is either LCD Bridge chip select 1 (MPU68 and MPU80
modes) or enable 1 (HD44780 mode).
M2
Mux control via the PPMODE bits in the EBSR.
This pin is multiplexed between LCD Bridge and SPI.
LCD_RW_WRB/
SPI_CS2
DVDDIO
BH
For LCD, this pin is either LCD Bridge read/write select (HD44780 and MPU68
modes) or write strobe (MPU80 mode).
N2
M5
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR.
This pin is multiplexed between LCD Bridge and SPI.
LCD_RS/
SPI_CS3
DVDDIO
BH
For LCD, this pin is the LCD Bridge address set-up.
Mux control via the PPMODE bits in the EBSR.
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
LCD_D[15]/
UART_TXD/
GP[31]/
IPD
DVDDIO
BH
For LCD Bridge, it is LCD data pin 15.
M11
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_DX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For LCD Bridge, it is LCD data pin 14.
LCD_D[14]/
UART_RXD/
GP[30]/
IPD
DVDDIO
BH
P13
P12
N12
P11
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_RX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For LCD Bridge, it is LCD data pin 13.
LCD_D[13]/
UART_CTS/
GP[29]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_FS
This pin is multiplexed between LCD Bridge, I2S2, and GPIO.
For LCD Bridge, it is LCD data pin 12.
LCD_D[12]/
UART_RTS/
GP[28]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_CLK
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For LCD Bridge, it is LCD data pin 11.
LCD_D[11]/
I2S2_DX/
GP[27]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_TX
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-10. LCD Bridge Terminal Functions — C5535 Only (continued)
TYPE(1)
SIGNAL
NAME
OTHER(3) (4) DESCRIPTION
(2)
NO.
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For LCD Bridge, it is LCD data pin 10.
LCD_D[10]/
I2S2_RX/
GP[20]/
IPD
DVDDIO
BH
P9
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_RX
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For LCD Bridge, it is LCD data pin 9.
LCD_D[9]/
I2S2_FS/
GP[19]/
IPD
DVDDIO
BH
N10
P5
P8
P3
N7
P2
N5
J2
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CS0
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For LCD Bridge, it is LCD data pin 8.
LCD_D[8]/
I2S2_CLK
GP[18]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CLK
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 7.
IPD
DVDDIO
BH
LCD_D[7]/
GP[17]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 6.
IPD
DVDDIO
BH
LCD_D[6]/
GP[16]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 5.
IPD
DVDDIO
BH
LCD_D[5]/
GP[15]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 4.
IPD
DVDDIO
BH
LCD_D[4]/
GP[14]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 3.
IPD
DVDDIO
BH
LCD_D[3]/
GP[13]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For LCD Bridge, it is LCD data pin 2.
IPD
DVDDIO
BH
LCD_D[2]/
GP[12]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and SPI.
For LCD Bridge, it is LCD data pin 1.
LCD_D[1]/
SPI_TX
DVDDIO
BH
K1
N4
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR.
This pin is multiplexed between LCD Bridge and SPI.
LCD_D[0]/
SPI_RX
DVDDIO
BH
For LCD Bridge, it is LCD data pin 0.
Mux control via the PPMODE bits in the EBSR.
42
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Table 3-11. SD1 Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
SD
This pin is multiplexed between SD1, I2S1, and GPIO.
For SD, this is the SD1 data clock output SD1_CLK.
SD1_CLK/
I2S1_CLK/
GP[6]
IPD
DVDDIO
BH
M14
I/O/Z
I/O/Z
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S1, and GPIO.
For SD, this is the SD1 command I/O output SD1_CMD.
SD1_CMD/
I2S1_FS/
GP[7]
IPD
DVDDIO
BH
L11
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
IPD
DVDDIO
BH
SD1_D3/
GP[11]
M12
L12
P10
M13
I/O/Z
I/O/Z
I/O/Z
I/O/Z
The SD1_D3 and SD1_D2 pins are multiplexed between SD1 and GPIO.
The SD1_D1 and SD1_D0 pins are multiplexed between SD1, I2S1, and GPIO.
In SD mode, all these pins are the SD1 nibble wide bi-directional data bus.
Mux control via the SP1MODE bits in the EBSR.
IPD
DVDDIO
BH
SD1_D2/
GP[10]
SD1_D1/
I2S1_RX/
GP[9]
IPD
DVDDIO
BH
The IPD resistor on these pins can be enabled or disabled via the PDINHIBR1
register.
SD1_D0/
I2S1_DX/
GP[8]
IPD
DVDDIO
BH
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-12. SD0 Terminal Functions
TYPE(1)
SIGNAL
NAME
OTHER(3) (4)
DESCRIPTION
(2)
NO.
SD
This pin is multiplexed between SD0, I2S0, and GPIO.
For SD, this is the SD0 data clock output SD0_CLK.
SD0_CLK/
I2S0_CLK/
GP[0]
IPD
DVDDIO
BH
M8
I/O/Z
I/O/Z
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For SD, this is the SD0 command I/O output SD0_CMD.
SD0_CMD/
I2S0_FS/
GP[1]
IPD
DVDDIO
BH
M10
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
IPD
DVDDIO
BH
SD0_D3/
GP[5]
P7
N13
P6
I/O/Z
I/O/Z
I/O/Z
I/O/Z
The SD0_D3 and SD0_D2 pins are multiplexed between SD0 and GPIO.
The SD0_D1 and SD0_D0 pins are multiplexed between SD0, I2S0, and GPIO.
In SD mode, these pins are the SD0 nibble wide bi-directional data bus.
Mux control via the SP0MODE bits in the EBSR.
IPD
DVDDIO
BH
SD0_D2/
GP[4]
SD0_D1/
I2S0_RX/
GP[3]
IPD
DVDDIO
BH
The IPD resistor on these pins can be enabled or disabled via the PDINHIBR1
register.
SD0_D0/
I2S0_DX/
GP[2]
IPD
DVDDIO
BH
J1
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-13. 10-Bit SAR ADC Terminal Functions — C5535 Only
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
SAR ADC
GPAIN0: General -Purpose Output and Analog Input pin 0. This pin is demuxed
internally into ADC Channels 0, 1, & 2. GPAIN0 can also be used as a
general-purpose open-drain output. This pin is unique among the GPAIN pins in that
it is the only pin that is 3.6 V-tolerant to support measuring a battery voltage.
GPAIN0 can accommodate input voltages from 0 V to 3.6 V; although, the ADC is
unable to accept signals greater than VDDA_ANA without clamping. ADC Channel 1 is
capable of switching in an internal resistor divider that has a divide ratio of
approximately 1/8.
GPAIN0
A8
I/O
VDDA_ANA
GPAIN1: General -Purpose Output and Analog Input pin 1. This pin is connected to
ADC Channel 3. GPAIN1 can be used as a general-purpose output if certain
requirements are met (see the following note). GPAIN1 can accommodate input
voltages from 0 V to VDDA_ANA
.
Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be
used as a general-purpose output (driving high) since the max current capability
(see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be
exceeded. Doing so may result in the on-chip power-on reset (POR) resetting the
chip.
GPAIN1
B8
I/O
VDDA_ANA
GPAIN2: General -Purpose Output and Analog Input pin 2. This pin is connected to
ADC Channel 4. GPAIN2 can be used as a general-purpose output if certain
requirements are met (see the following note). GPAIN2 can accommodate input
voltages from 0 V to VDDA_ANA
.
GPAIN2
A9
I/O
VDDA_ANA
Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be
used as a general-purpose output (driving high) since the max current capability
(see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be
exceeded. Doing so may result in the on-chip POR resetting the chip.
GPAIN3: General -Purpose Output and Analog Input pin 3. This pin is connected to
ADC Channel 5. GPAIN3 can be used as a general-purpose output if certain
requirements are met (see the following note). GPAIN3 can accommodate input
voltages from 0 V to VDDA_ANA
.
GPAIN3
A10
I/O
VDDA_ANA
Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be
used as a general-purpose output (driving high) since the max current capability
(see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be
exceeded. Doing so may result in the on-chip POR resetting the chip.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
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Table 3-14. GPIO Terminal Functions
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
General-Purpose Input/Output
External Flag Output. XF is used for signaling other processors in multiprocessor
configurations or XF can be used as a fast general-purpose output pin.
XF is set high by the BSET XF instruction and XF is set low by the BCLR XF
instruction or by writing to bit 13 of the ST1_55 register. For more information on the
ST1_55 register, see the TMS320C55x 3.0 CPU Reference Guide (literature
number: SWPU073).
–
XF
J3
O/Z
DVDDIO
BH
For XF pin behavior at reset, see Section 6.7.2, Pin Behavior at Reset.
Note: This pin may consume static power if configured as Hi-Z and not externally
pulled low or high. Prevent current drain by externally terminating the pin. XF pin is
ONLY in the Hi-Z state when doing boundary scan. Therefore, external termination
is probably not required for most applications.
This pin is multiplexed between SD0, I2S0, and GPIO.
For GPIO, it is general-purpose input/output pin 0 (GP[0]).
SD0_CLK/
I2S0_CLK/
GP[0]
IPD
DVDDIO
BH
M8
M10
J1
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For GPIO, it is general-purpose input/output pin 1 (GP[1]).
SD0_CMD/
I2S0_FS/
GP[1]
IPD
DVDDIO
BH
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For GPIO, it is general-purpose input/output pin 2 (GP[2]).
SD0_D0/
I2S0_DX/
GP[2]
IPD
DVDDIO
BH
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0, I2S0, and GPIO.
For GPIO, it is general-purpose input/output pin 3 (GP[3]).
SD0_D1/
I2S0_RX/
GP[3]
IPD
DVDDIO
BH
P6
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0 and GPIO.
IPD
DVDDIO
BH
SD0_D2/
GP[4]
For GPIO, it is general-purpose input/output pin 4 (GP[4]).
N13
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD0 and GPIO.
IPD
DVDDIO
BH
SD0_D3/
GP[5]
For GPIO, it is general-purpose input/output pin 5 (GP[5]).
P7
M14
L11
I/O/Z
I/O/Z
I/O/Z
Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S1, and GPIO.
For GPIO, it is general-purpose input/output pin 6 (GP[6]).
SD1_CLK/
I2S1_CLK/
GP[6]
IPD
DVDDIO
BH
Mux control via the SP1MODE bits in the EBSR.
This pin is multiplexed between SD1, I2S1, and GPIO.
SD1_CMD/
I2S1_FS/
GP[7]
IPD
DVDDIO
BH
For GPIO, it is general-purpose input/output pin 7 (GP[7]).
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) LCD Bridge applies only to TMS320C5535.
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Table 3-14. GPIO Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
This pin is multiplexed between SD1, I2S1, and GPIO.
For GPIO, it is general-purpose input/output pin 8 (GP[8]).
SD1_D0/
I2S1_DX/
GP[8]
IPD
DVDDIO
BH
M13
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1, I2S1, and GPIO.
For GPIO, it is general-purpose input/output pin 9 (GP[9]).
SD1_D1/
I2S1_RX/
GP[9]
IPD
DVDDIO
BH
P10
L12
M12
J2
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1 and GPIO.
IPD
DVDDIO
BH
SD1_D2/
GP[10]
For GPIO, it is general-purpose input/output pin 10 (GP[10]).
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between SD1 and GPIO.
IPD
DVDDIO
BH
SD1_D3/
GP[11]
For GPIO, it is general-purpose input/output pin 11 (GP[11]).
Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR1 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 12 (GP[12]).
IPD
DVDDIO
BH
LCD_D[2]/
GP[12]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 13 (GP[13]).
IPD
DVDDIO
BH
LCD_D[3]/
GP[13]
N5
P2
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 14 (GP[14]).
IPD
DVDDIO
BH
LCD_D[4]/
GP[14]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 15 (GP[15]).
IPD
DVDDIO
BH
LCD_D[5]/
GP[15]
N7
P3
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 16 (GP[16]).
IPD
DVDDIO
BH
LCD_D[6]/
GP[16]
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 17 (GP[17]).
IPD
DVDDIO
BH
LCD_D[7]/
GP[17]
P8
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
This pin is multiplexed between LCD Bridge and GPIO.
For GPIO, it is general-purpose input/output pin 18 (GP[18]).
LCD_D8]/
I2S2_CLK/
GP[18]/
IPD
DVDDIO
BH
P5
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CLK
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Table 3-14. GPIO Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
This pin is multiplexed between LCD Bridge, I2S2, and GPIO.
For GPIO, it is general-purpose input/output pin 19 (GP[19]).
LCD_D[9]/
I2S2_FS/
GP[19]/
IPD
DVDDIO
BH
N10
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_CS0
This pin is multiplexed between LCD Bridge, I2S2, GPIO and SPI.
For GPIO, it is general-purpose input/output pin 20 (GP[20]).
LCD_D[10]/
I2S2_RX/
GP[20]/
IPD
DVDDIO
BH
P9
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_RX
This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI.
For GPIO, it is general-purpose input/output pin 27 (GP[27]).
LCD_D[11]/
I2S2_DX/
GP[27]/
IPD
DVDDIO
BH
P11
N12
P12
P13
M11
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
SPI_TX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For GPIO, it is general-purpose input/output pin 28 (GP[28]).
LCD_D[12]/
UART_RTS/
GP[28]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_CLK
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For GPIO, it is general-purpose input/output pin 29 (GP[29]).
LCD_D[13]/
UART_CTS/
GP[29]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_FS
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For GPIO, it is general-purpose input/output pin 30 (GP[30]).
LCD_D[14]/
UART_RXD/
GP[30]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_RX
This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3.
For GPIO, it is general-purpose input/output pin 31 (GP[31]).
LCD_D[15]/
UART_TXD/
GP[31]/
IPD
DVDDIO
BH
Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be
enabled or disabled via the PDINHIBR3 register.
I2S3_DX
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Table 3-15. Regulators and Power Management Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
Regulators
DSP_LDO output. When enabled, this output provides a regulated 1.3 V or 1.05 V
output and up to 250 mA of current (see the ISD parameter in Section 5.3, Electrical
Characteristics Over Recommended Ranges of Supply Voltage and Operating
Temperature). The DSP_LDO is intended to supply current to the digital core circuits
only (CVDD) and not external devices. For proper device operation, the external
decoupling capacitor of this pin should be 5µF
~ 10µF. For more detailed
information, see Section 6.3.4, Power-Supply Decoupling.
When disabled, this pin is in the high-impedance (Hi-Z) state.
DSP_LDOO(5)
A13
S
Note: DSP_LDO is not supported on TMS320C5533 and C5532, so the
DSP_LDOO pin must be left unconnected. DSP_LDO can be enabled to provide a
regulated 1.3 V or 1.05 V output to only the internal POR to support the RTC only
mode (see Section 6.10.1, RTC Only Mode, for details). DSP_LDOO must never be
used to provide power to the CPU Core (CVDD) on these devices.
When DSP_LDO comes out of reset, it is enabled to 1.3 V for the bootloader to
operate. For the 50-MHz devices, DSP_LDO must be programmed to 1.05 V to
match the core voltage, CVDD, for proper operation after reset.
LDO inputs. For proper device operation, LDOI must always be powered. The LDOI
pins must be connected to the same power supply source with a voltage range of
1.8 V to 3.6 V. These pins supply power to the internal LDOs, the bandgap
reference generator circuits, and serve as the I/O supply for some input pins.
B14,
C14,
B10
LDOI
S
DSP_LDO enable input. This signal is not intended to be dynamically switched.
0 = DSP_LDO is enabled. The internal POR monitors the DSP_LDOO pin voltage
and generates the internal POWERGOOD signal.
1 = DSP_LDO is disabled. The internal POR voltage monitoring is also disabled.
The internal POWERGOOD signal is forced high and the external reset signal on
the RESET pin (D6) is the only source of the device reset. Note, the device's
internal reset signal is generated as the logical AND of the RESET pin and the
internal POWERGOOD signal.
–
DSP_LDO_EN(5)
C13
I
LDOI
Note: DSP_LDO is not supported on TMS320C5533 and C5532, so the
DSP_LDOO pin must be left unconnected. DSP_LDO can be enabled to provide a
regulated 1.3V or 1.05V output to only the internal POR to support the RTC only
mode (see Section 6.10.1, RTC Only Mode, for details). DSP_LDOO must never be
used to provide power to the CPU Core (CVDD) on these devices.
USB_LDO output. This output provides a regulated 1.3 V output and up to 25 mA of
current (see the ISD parameter in Section 5.3, Electrical Characteristics Over
Recommended Ranges of Supply Voltage and Operating Temperature). For proper
device operation, this pin must be connected to a 1 μF ~ 2 μF decoupling capacitor
to VSS. For more detailed information, see Section 6.3.4, Power-Supply Decoupling.
This LDO is intended to supply power to the USB_ VDD1P3, USB_VDDA1P3 pins and
not external devices.
USB_LDOO
D13
S
Note: USB_LDO is not supported on TMS320C5532. For proper device operation,
this pin must be left unconnected on these devices.
ANA_LDO output. This output provides a regulated 1.3 V output and up to 4 mA of
current (see the ISD parameter in Section 5.3, Electrical Characteristics Over
Recommended Ranges of Supply Voltage and Operating Temperature).
ANA_LDOO
B9
S
For proper device operation, this pin must be connected to an ~ 1.0 μF decoupling
capacitor to VSS. For more detailed information, see Section 6.3.4, Power-Supply
Decoupling. This LDO is intended to supply power to the VDDA_ANA and VDDA_PLL
pins and not external devices.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) Applies only to TMS320C5535 and TMS320C5534.
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Table 3-15. Regulators and Power Management Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME
OTHER(3) (4)
DESCRIPTION
(2)
NO.
Bandgap reference filter signal. For proper device operation, this pin needs to be
bypassed with a 0.1 μF capacitor to analog ground (VSSA_ANA).
BG_CAP
C10
A I/O
This external capacitor provides filtering for stable reference voltages & currents
generated by the bandgap circuit. The bandgap produces the references for use by
the System PLL, SAR, and POR circuits.
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Table 3-16. Reserved and No Connects Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION
(2)
NAME
NO.
Reserved
Reserved. For proper device operation, this pin must be tied directly to VSS.
–
RSV0
A12
I
LDOI
RSV1
RSV2
K12
L13
PWR
PWR
Reserved. For proper device operation, this pin must be tied directly to CVDD
.
.
Reserved. For proper device operation, this pin must be tied directly to CVDD
–
RSV3
RSV4
RSV5
RSV6
B12
A11
B11
B13
I
I
I
I
Reserved. For proper device operation, this pin must be tied directly to VSS
Reserved. For proper device operation, this pin must be tied directly to VSS
Reserved. For proper device operation, this pin must be tied directly to VSS
.
.
.
LDOI
–
LDOI
–
LDOI
–
Reserved. For proper device operation, this pin must be directly tied to either VSS or
LDOI, or tied via a 10-kΩ resistor to either VSS or LDOI.
LDOI
RSV7
RSV8
E1
F1
G1
H1
E2
G2
I
I
I
I
I
I
Reserved. (Leave unconnected, do not connect to power or ground).
Reserved. (Leave unconnected, do not connect to power or ground).
Reserved. (Leave unconnected, do not connect to power or ground).
Reserved. (Leave unconnected, do not connect to power or ground).
Reserved. (Leave unconnected, do not connect to power or ground).
Reserved. (Leave unconnected, do not connect to power or ground).
RSV9
RSV10
RSV11
RSV12
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
Table 3-17. Supply Voltage Terminal Functions
TYPE(1)
SIGNAL
OTHER(3) (4)
DESCRIPTION(5)
(2)
NAME(5)
NO.
SUPPLY VOLTAGES
F2
H2
D3
G3
1.05-V Digital Core supply voltage (50 MHz)
1.3-V Digital Core supply voltage (100 MHz)
M6
M9
N9
CVDD
PWR
C11
D11
K11
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) USB signal does not apply to TMS320C5532.
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Table 3-17. Supply Voltage Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
M3
L4
M4
C6
DVDDIO
PWR
1.8-V, 2.5-V, 2.75-V, or 3.3-V I/O power supply for non-RTC I/Os
1.05-V thru 1.3-V RTC digital core and RTC oscillator power supply.
N8
N11
N14
B5
CVDDRTC
DVDDRTC
PWR
PWR
Note: The CVDDRTC must always be powered even though RTC is not used.
B4
1.8-V, 2.5-V, 2.75-V, or 3.3-V I/O power supply for RTC_CLOCKOUT and WAKEUP
pins.
C3
1.3-V Analog PLL power supply for the system clock generator (PLLOUT ≤ 120
MHz).
see
Section 5.2,
ROC
VDDA_PLL
C7
PWR
This signal can be powered from the ANA_LDOO pin.
3.3 V USB Analog PLL power supply.
see
Section 5.2,
ROC
USB_VDDPLL
USB_VDD1P3
USB_VDDA1P3
USB_VDDA3P3
G13
E12
H12
G12
S
S
S
S
When the USB peripheral is not used, the USB_VDDPLL signal should be connected
to ground (VSS).
1.3-V digital core power supply for USB PHY.
see
Section 5.2,
ROC
When the USB peripheral is not used, the USB_VDD1P3 signal should be connected
to ground (VSS).
Analog 1.3 V power supply for USB PHY. [For high-speed sensitive analog circuits]
see
Section 5.2,
ROC
When the USB peripheral is not used, the USB_VDDA1P3 signal should be
connected to ground (VSS).
Analog 3.3 V power supply for USB PHY.
see
Section 5.2,
ROC
When the USB peripheral is not used, the USB_VDDA3P3 signal should be
connected to ground (VSS).
3.3-V power supply for USB oscillator.
see
Section 5.2,
ROC
USB_VDDOSC
E13
B7
S
When the USB peripheral is not used, USB_VDDOSC should be connected to
ground (VSS).
1.3-V supply for power management and 10-bit SAR ADC
This signal can be powered from the ANA_LDOO pin.
VDDA_ANA
PWR
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Table 3-18. Ground Terminal Functions
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
P1
B2
B3
E3
F3
H3
K3
D4
E4
K4
VSS
D5
GND
Ground pins
L5
M7
C8
D10
L10
E11
C12
J13
A14
P14
Ground for RTC oscillator. When using a 32.768-KHz crystal, this pin is a local
ground for the crystal and must not be connected to the board ground (See Figure
Figure 6-4 and Figure 6-5). When not using RTC and the crystal is not populated on
the board, this pin is connected to the board ground.
see
Section 5.2,
ROC
VSSRTC
C5
GND
see
Section 5.2,
ROC
VSSA_PLL
A1
GND
GND
GND
GND
GND
S
Analog PLL ground for the system clock generator.
USB Analog PLL ground.
see
Section 5.2,
ROC
USB_VSSPLL
USB_VSS1P3
USB_VSSA1P3
USB_VSSA3P3
USB_VSSOSC
F13
K14
J12
H13
D12
see
Section 5.2,
ROC
Digital core ground for USB phy.
see
Section 5.2,
ROC
Analog ground for USB PHY [For high speed sensitive analog circuits].
Analog ground for USB PHY.
see
Section 5.2,
ROC
see
Section 5.2,
ROC
Ground for USB oscillator.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder
(2) Input pins of type I, I/O, and I/O/Z are required to be driven at all times. To achieve the lowest power, these pins must not be allowed to
float. When configured as input or high-impedance state, and not driven to a known state, they may cause an excessive IO-supply
current. If this is the case, enable IPD/IPU, if applicable, or externally terminate the pins.
(3) IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors.
(4) Specifies the operating I/O supply voltage for each signal
(5) USB signal does not apply to TMS320C5532.
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Table 3-18. Ground Terminal Functions (continued)
TYPE(1)
SIGNAL
NAME(5)
OTHER(3) (4)
DESCRIPTION(5)
(2)
NO.
Ground for reference current. This must be connected via a 10-kΩ ±1% resistor to
USB_R1.
see
Section 5.2,
ROC
USB_VSSREF
F12
GND
GND
When the USB peripheral is not used, the USB_VSSREF signal should be connected
directly to ground (Vss).
B6
C9
VSSA_ANA
Ground pins for power management (POR & Bandgap circuits) and 10-bit SAR ADC
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4 Device Configuration
4.1 System Registers
The system registers are used to configure the device and monitor its status. Brief descriptions of the
various system registers are shown in Table 4-1.
Table 4-1. Idle Control, Status, and System Registers
CPU WORD
ADDRESS
ACRONYM
COMMENTS
Register Description
Idle Control Register
0001h
0002h
1C00h
ICR
ISTR
EBSR
Idle Status Register
See Section 4.6.1 of this
document.
External Bus Selection Register
1C02h
1C03h
1C04h
1C05h
1C14h
1C16h
1C17h
1C18h
1C19h
1C1Ah
1C1Bh
1C1Ch
1C1Dh
1C28h
1C2A
PCGCR1
PCGCR2
Peripheral Clock Gating Control Register 1
Peripheral Clock Gating Control Register 2
Peripheral Software Reset Counter Register
Peripheral Reset Control Register
PSRCR
PRCR
TIAFR
Timer Interrupt Aggregation Flag Register
Output Drive Strength Control Register
Pull-Down Inhibit Register 1
ODSCR
PDINHIBR1
PDINHIBR2
Pull-Down Inhibit Register 2
PDINHIBR3
Pull-Down Inhibit Register 3
DMA0CESR1
DMA0CESR2
DMA1CESR1
DMA1CESR2
RAMSLPMDCNTLR1
RAMSLPMDCNTLR2
RAMSLPMDCNTLR3
RAMSLPMDCNTLR4
RAMSLPMDCNTLR5
DMAIFR
DMA0 Channel Event Source Register 1
DMA0 Channel Event Source Register 2
DMA1 Channel Event Source Register 1
DMA1 Channel Event Source Register 2
RAM Sleep Mode Control Register 1
RAM Sleep Mode Control Register 2
RAM Sleep Mode Control Register 3
RAM Sleep Mode Control Register 4
RAM Sleep Mode Control Register 5
DMA Interrupt Flag Aggregation Register
DMA Interrupt Enable Register
1C2B
1C2C
1C2D
1C30h
1C31h
1C32h
DMAIER
USBSCR
Does not apply to
TMS320C5532.
USB System Control Register
1C36h
1C37h
1C38h
1C39h
1C3Ah
1C40h
1C41h
1C42h
1C43h
1C44h
1C45h
1C46h
1C47h
7004h
DMA2CESR1
DMA2CESR2
DMA3CESR1
DMA3CESR2
CLKSTOP
DIEIDR0
DMA2 Channel Event Source Register 1
DMA2 Channel Event Source Register 2
DMA3 Channel Event Source Register 1
DMA3 Channel Event Source Register 2
Peripheral Clock Stop Request/Acknowledge Register
Die ID Register 0
DIEIDR1
Die ID Register 1
DIEIDR2
Die ID Register 2
DIEIDR3
Die ID Register 3
DIEIDR4
Die ID Register 4
DIEIDR5
Die ID Register 5
DIEIDR6
Die ID Register 6
DIEIDR7
Die ID Register 7
LDOCNTL
see Section 4.2.1.1.3 of this
document.
LDO Control Register
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4.2 Power Considerations
4.2.1 Power Considerations for C5535 and C5534
The device provides several means of managing power consumption.
To minimize power consumption, the device divides its circuits into nine main isolated supply domains:
•
•
•
•
•
•
•
•
LDOI (LDOs and Bandgap Power Supply)
(1)
Analog POR, SAR, and PLL (VDDA_ANA and VDDA_PLL
)
RTC Core (CVDDRTC
Digital Core (CVDD
USB Core (USB_ VDD1P3 and USB_VDDA1P3
USB PHY and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL
RTC I/O (DVDDRTC
Rest of the I/O (DVDDIO
)
)
)
)
)
)
4.2.1.1 LDO Configuration
The device includes three Low-Dropout Regulators (LDOs) which can be used to regulate the power
supplies of the analog PLL and SAR ADC/Power Management (ANA_LDO), Digital Core (DSP_LDO), and
USB Core (USB_LDO).
These LDOs are controlled by a combination of pin configuration and register settings. For more detailed
information see the following sections.
4.2.1.1.1 LDO Inputs
The LDOI pins (B10, B14, C14) provide power to the internal Analog LDO, DSP LDO, USB LDO, the
bandgap reference generator, and some I/O input pins, and can range from 1.8 V to 3.6 V. The bandgap
provides accurate voltage and current references to the POR, LDOs, PLL, and SAR; therefore, for proper
device operation, power must always be applied to the LDOI pins even if the LDO outputs are not used.
4.2.1.1.2 LDO Outputs
The ANA_LDOO pin (B9) is the output of the internal ANA_LDO and can provide regulated 1.3 V power of
up to 4 mA. The ANA_LDOO pin is intended to be connected, on the board, to the VDDA_ANA and VDDA_PLL
pins to provide a regulated 1.3 V to the 10-bit SAR ADC, Power Management Circuits, and System PLL.
VDDA_ANA and VDDA_PLL may be powered by this LDO output, which is recommended, to take advantage of
the device's power management techniques, or by an external power supply. The ANA_LDO cannot be
disabled individually (see Section 4.2.1.1.3, LDO Control).
The DSP_LDOO pin (A13) is the output of the internal DSP_LDO and provides software-selectable
regulated 1.3 V or regulated 1.05 V power of up to 250 mA. The DSP_LDOO pin is intended to be
connected, on the board, to the CVDD pins. In this configuration, the DSP_LDO_EN pin should be tied to
the board VSS, thus enabling the DSP_LDO. Optionally, the CVDD pins may be powered by an external
power supply; in this configuration the DSP_LDO_EN pin should be tied (high) to LDOI, disabling
DSP_LDO. The DSP_LDO_EN also affects how reset is generated to the chip (for more details, see the
DSP_LDO_EN pin description in Table 3-15, Regulators and Power Management Terminal Functions).
When the DSP_LDO is disabled, its output pin is in a high-impedance state. Note: DSP_LDO_EN is not
intended to be changed dynamically.
When DSP_LDO comes out of reset, it is enabled to 1.3 V for the bootloader to operate. For the 50-MHz
devices, DSP_LDO must be programmed to 1.05 V to match the core voltage, CVDD, for proper operation
after reset.
(1) SAR applies to only TMS320C5535.
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The USB_LDOO pin (D13) is the output of the internal USB_LDO and provides regulated 1.3 V,
software-switchable (on/off) power of up to 25 mA. The USB_LDOO pin is intended to be connected, on
the board, to the USB_VDD1P3 and USB_VDDA1P3 pins to provide power to portions of the USB. Optionally,
the USB_VDD1P3 and USB_VDDA1P3 may be powered by an external power supply and the USB_LDO can
be left disabled. When the USB_LDO is disabled, its output pin is in a high-impedance state.
4.2.1.1.3 LDO Control
All three LDOs can be simultaneously disabled via software by writing to either the BG_PD bit or the
LDO_PD bit in the RTCPMGT register (see Figure 4-1). When the LDOs are disabled via this mechanism,
the only way to re-enable them is by asserting the WAKEUP signal pin (which must also have been
previously enabled to allow wakeup), or by a previously enabled and configured RTC alarm, or by cycling
power to the CVDDRTC pin.
ANA_LDO: The ANA_LDO is only disabled by the BG_PD and the LDO_PD mechanism described above.
Otherwise, it is always enabled.
DSP_LDO: The DSP_LDO can be statically disabled by the DSP_LDO_EN pin as described in
Section 4.2.1.1.2, LDO Outputs. It can be also dynamically disabled via the BG_PD and the LDO_PD
mechanism described above. The DSP_LDO can change its output voltage dynamically by software via
the DSP_LDO_V bit in the LDOCNTL register (see Figure 4-2). The DSP_LDO output voltage is set to 1.3
V at reset.
For the 50-MHz devices, DSP_LDO must be programmed to 1.05 V to match the core voltage, CVDD, for
proper operation after reset.
USB_LDO: The USB_LDO can be independently and dynamically enabled or disabled by software via the
USB_LDO_EN bit in the LDOCNTL register (see Figure 4-2). The USB _LDO is disabled at reset.
Table 4-4 shows the ON/OFF control of each LDO and its register control bit configurations.
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15
8
Reserved
R-0
7
5
4
3
2
1
0
Reserved
WU_DOUT
WU_DIR
BG_PD
LDO_PD
RTCCLKOUTEN
R-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-1. RTC Power Management Register (RTCPMGT) [1930h]
Table 4-2. RTCPMGT Register Bit Descriptions
BIT
NAME
DESCRIPTION
Reserved. Read-only, writes have no effect.
15:5
RESERVED
Wakeup output, active low/open-drain.
0 = WAKEUP pin driven low.
4
WU_DOUT
1 = WAKEUP pin is in high-impedance (Hi-Z).
Wakeup pin direction control.
0 = WAKEUP pin configured as a input.
1 = WAKEUP pin configured as a output.
3
WU_DIR
Note: When the WAKEUP pin is configured as an input, it is active high. When the WAKEUP pin is
configured as an output, is an open-drain that is active low and should be externally pulled-up via a
10-kΩ resistor to DVDDRTC. WU_DIR must be configured as an input to allow the WAKEUP pin to
wake the device up from idle modes.
Bandgap, on-chip LDOs, and the analog POR power down bit.
This bit shuts down the on-chip LDOs (ANA_LDO, DSP_LDO, and USB_LDO), the Analog POR,
and Bandgap reference. BG_PD and LDO_PD are only intended to be used when the internal
LDOs supply power to the chip. If the internal LDOs are bypassed and not used then the BG_PD
and LDO_PD power down mechanisms should not be used since POR gets powered down and the
POWERGOOD signal is not generated properly.
2
BG_PD
After this bit is asserted, the on-chip LDOs, Analog POR, and the Bandgap reference can be
re-enabled by the WAKEUP pin (high) or the RTC alarm interrupt. The Bandgap circuit will take
about 100 msec to charge the external 0.1 uF capacitor via the internal 326-kΩ resistor.
0 = On-chip LDOs, Analog POR, and Bandgap reference are enabled.
1 = On-chip LDOs, Analog POR, and Bandgap reference are disabled (shutdown).
On-chip LDOs and Analog POR power down bit.
This bit shuts down the on-chip LDOs (ANA_LDO, DSP_LDO, and USB_LDO) and the Analog
POR. BG_PD and LDO_PD are only intended to be used when the internal LDOs supply power to
the chip. If the internal LDOs are bypassed and not used then the BG_PD and LDO_PD power
down mechanisms should not be used since POR gets powered down and the POWERGOOD
signal is not generated properly.
1
0
LDO_PD
After this bit is asserted, the on-chip LDOs and Analog POR can be re-enabled by the WAKEUP
pin (high) or the RTC alarm interrupt. This bit keeps the Bandgap reference turned on to allow a
faster wake-up time with the expense power consumption of the Bandgap reference.
0 = On-chip LDOs and Analog POR are enabled.
1 = On-chip LDOs and Analog POR are disabled (shutdown).
Clockout output enable bit.
RTCCLKOUTEN 0 = Clock output disabled.
1 = Clock output enabled.
58
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15
8
Reserved
R-0
7
2
1
0
Reserved
DSP_LDO_V
USB_LDO_EN
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
R/W-0
R/W-0
Figure 4-2. LDO Control Register (LDOCNTL) [7004h]
Table 4-3. LDOCNTL Register Bit Descriptions
BIT
NAME
DESCRIPTION
15:2
RESERVED
Reserved. Read-only, writes have no effect.
DSP_LDO voltage select bit.
0 = DSP_LDOO is regulated to 1.3 V.
1 = DSP_LDOO is regulated to 1.05 V
1
0
DSP_LDO_V
Note: For the 50-MHz devices, DSP_LDO must be programmed to 1.05 V to match the core
voltage, CVDD, for proper operation after reset.
USB_LDO enable bit.
USB_LDO_EN
0 = USB_LDO output is disabled. USB_LDOO pin is placed in high-impedance (Hi-Z) state.
1 = USB_LDO output is enabled. USB_LDOO is regulated to 1.3 V.
Table 4-4. LDO Controls Matrix
RTCPMGT Register
(0x1930)
LDOCNTL Register
DSP_LDO_EN
(0x7004)
ANA_LDO
DSP_LDO
USB_LDO
(Pin C13)
BG_PD Bit
LDO_PD Bit
USB_LDO_EN Bit
1
Don't Care
Don't Care
Don't Care
Don't Care
Low
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
Don't Care
1
0
0
0
Don't Care
0
0
0
0
0
1
High
ON
OFF
ON
Low
ON
4.2.2 Power Considerations for C5533
The device provides several means of managing power consumption.
To minimize power consumption, the device divides its circuits into nine main isolated supply domains:
•
•
•
•
•
•
•
•
LDOI (LDOs and Bandgap Power Supply)
Analog POR and PLL (VDDA_ANA and VDDA_PLL
)
RTC Core (CVDDRTC
Digital Core (CVDD
USB Core (USB_ VDD1P3 and USB_VDDA1P3
USB PHY and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL
RTC I/O (DVDDRTC
Rest of the I/O (DVDDIO
)
)
)
)
)
)
4.2.2.1 LDO Configuration
The device includes two Low-Dropout Regulators (LDOs) which can be used to regulate the power
supplies of the analog PLL and Power Management (ANA_LDO) and USB Core (USB_LDO).
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These LDOs are controlled by a combination of pin configuration and register settings. For more detailed
information see the following sections.
4.2.2.1.1 LDO Inputs
The LDOI pins (B10, B14, C14) provide power to the internal Analog and USB LDOs, the bandgap
reference generator, and some I/O input pins, and can range from 1.8 V to 3.6 V. The bandgap provides
accurate voltage and current references to the POR, LDOs, and PLL; therefore, for proper device
operation, power must always be applied to the LDOI pins even if the LDO outputs are not used.
4.2.2.1.2 LDO Outputs
The ANA_LDOO pin (B9) is the output of the internal ANA_LDO and can provide regulated 1.3 V power of
up to 4 mA. The ANA_LDOO pin is intended to be connected, on the board, to the VDDA_ANA and VDDA_PLL
pins to provide a regulated 1.3 V to the Power Management Circuits and System PLL. VDDA_ANA and
VDDA_PLL may be powered by this LDO output, which is recommended, to take advantage of the device's
power management techniques, or by an external power supply. The ANA_LDO cannot be disabled
individually (see Section 4.2.1.1.3, LDO Control).
The USB_LDOO pin (D13) is the output of the internal USB_LDO and provides regulated 1.3 V,
software-switchable (on/off) power of up to 25 mA. The USB_LDOO pin is intended to be connected, on
the board, to the USB_VDD1P3 and USB_VDDA1P3 pins to provide power to portions of the USB. Optionally,
the USB_VDD1P3 and USB_VDDA1P3 may be powered by an external power supply and the USB_LDO can
be left disabled. When the USB_LDO is disabled, its output pin is in a high-impedance state.
4.2.2.1.3 LDO Control
Both LDOs can be simultaneously disabled via software by writing to either the BG_PD bit or the LDO_PD
bit in the RTCPMGT register (see Figure 4-1). When the LDOs are disabled via this mechanism, the only
way to re-enable them is by asserting the WAKEUP signal pin (which must also have been previously
enabled to allow wakeup), or by a previously enabled and configured RTC alarm, or by cycling power to
the CVDDRTC pin.
ANA_LDO: The ANA_LDO is only disabled by the BG_PD and the LDO_PD mechanism described above.
Otherwise, it is always enabled.
USB_LDO: The USB_LDO can be independently and dynamically enabled or disabled by software via the
USB_LDO_EN bit in the LDOCNTL register (see Figure 4-2). The USB _LDO is disabled at reset.
Table 4-4 shows the ON/OFF control of each LDO and its register control bit configurations.
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15
8
Reserved
R-0
7
5
4
3
2
1
0
Reserved
WU_DOUT
WU_DIR
BG_PD
LDO_PD
RTCCLKOUTEN
R-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-3. RTC Power Management Register (RTCPMGT) [1930h]
Table 4-5. RTCPMGT Register Bit Descriptions
BIT
NAME
DESCRIPTION
Reserved. Read-only, writes have no effect.
15:5
RESERVED
Wakeup output, active low/open-drain.
0 = WAKEUP pin driven low.
4
WU_DOUT
1 = WAKEUP pin is in high-impedance (Hi-Z).
Wakeup pin direction control.
0 = WAKEUP pin configured as a input.
1 = WAKEUP pin configured as a output.
3
WU_DIR
Note: When the WAKEUP pin is configured as an input, it is active high. When the WAKEUP pin is
configured as an output, is an open-drain that is active low and should be externally pulled-up via a
10-kΩ resistor to DVDDRTC. WU_DIR must be configured as an input to allow the WAKEUP pin to
wake the device up from idle modes.
Bandgap, on-chip LDOs, and the analog POR power down bit.
This bit shuts down the on-chip LDOs (ANA_LDO and USB_LDO), the Analog POR, and Bandgap
reference. BG_PD and LDO_PD are only intended to be used when the internal LDOs supply
power to the chip. If the internal LDOs are bypassed and not used then the BG_PD and LDO_PD
power down mechanisms should not be used since POR gets powered down and the
POWERGOOD signal is not generated properly.
2
BG_PD
After this bit is asserted, the on-chip LDOs, Analog POR, and the Bandgap reference can be
re-enabled by the WAKEUP pin (high) or the RTC alarm interrupt. The Bandgap circuit will take
about 100 msec to charge the external 0.1 uF capacitor via the internal 326-kΩ resistor.
0 = On-chip LDOs, Analog POR, and Bandgap reference are enabled.
1 = On-chip LDOs, Analog POR, and Bandgap reference are disabled (shutdown).
On-chip LDOs and Analog POR power down bit.
This bit shuts down the on-chip LDOs (ANA_LDO and USB_LDO) and the Analog POR. BG_PD
and LDO_PD are only intended to be used when the internal LDOs supply power to the chip. If the
internal LDOs are bypassed and not used then the BG_PD and LDO_PD power down mechanisms
should not be used since POR gets powered down and the POWERGOOD signal is not generated
properly.
1
0
LDO_PD
After this bit is asserted, the on-chip LDOs and Analog POR can be re-enabled by the WAKEUP
pin (high) or the RTC alarm interrupt. This bit keeps the Bandgap reference turned on to allow a
faster wake-up time with the expense power consumption of the Bandgap reference.
0 = On-chip LDOs and Analog POR are enabled.
1 = On-chip LDOs and Analog POR are disabled (shutdown).
Clockout output enable bit.
RTCCLKOUTEN 0 = Clock output disabled.
1 = Clock output enabled.
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15
8
Reserved
R-0
7
1
0
Reserved
USB_LDO_EN
R-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-4. LDO Control Register (LDOCNTL) [7004h]
Table 4-6. LDOCNTL Register Bit Descriptions
BIT
NAME
DESCRIPTION
Reserved. Read-only. Writes have no effect.
USB_LDO enable bit.
15:1
RESERVED
0
USB_LDO_EN
0 = USB_LDO output is disabled. USB_LDOO pin is placed in high-impedance (Hi-Z) state.
1 = USB_LDO output is enabled. USB_LDOO is regulated to 1.3 V.
Table 4-7. LDO Controls Matrix
RTCPMGT Register
(0x1930)
LDOCNTL Register
DSP_LDO_EN
(0x7004)
ANA_LDO
USB_LDO
(Pin C13)
BG_PD Bit
LDO_PD Bit
USB_LDO_EN Bit
1
Don't Care
Don't Care
High
High
High
High
High
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
Don't Care
1
0
0
0
Don't Care
0
0
0
0
0
1
ON
ON
4.2.3 Power Considerations for C5532
The device provides several means of managing power consumption.
To minimize power consumption, the device divides its circuits into nine main isolated supply domains:
•
•
•
•
•
•
•
•
LDOI (ANA_LDO and Bandgap Power Supply)
Analog POR and PLL (VDDA_ANA and VDDA_PLL
RTC Core (CVDDRTC
Digital Core (CVDD
)
)
)
USB Core (USB_VDD1P3 and USB_VDDA1P3) — C5533 Only
USB PHY and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) — C5533 Only
RTC I/O (DVDDRTC
)
Rest of the I/O (DVDDIO
)
4.2.3.1 LDO Configuration
The device includes one Low-Dropout Regulators (LDO) which can be used to regulate the power
supplies of the analog PLL.
4.2.3.2 LDO Inputs
The LDOI pins (B10, B14, C14) provide power to the internal Analog LDO, the bandgap reference
generator, and some I/O input pins, and can range from 1.8 V to 3.6 V. The bandgap provides accurate
voltage and current references to the LDO PLL; therefore, for proper device operation, power must always
be applied to the LDOI pins even if the LDO output is not used.
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4.2.3.3 LDO Outputs
The ANA_LDOO pin (B9) is the output of the internal ANA_LDO and can provide regulated 1.3 V power of
up to 4 mA. The ANA_LDOO pin is intended to be connected, on the board, to the VDDA_ANA and
VDDA_PLL pins to provide a regulated 1.3 V to the System PLL. VDDA_ANA and VDDA_PLL may be
powered by this LDO output. However, when VDDA_PLL requires 1.4 V, VDDA_PLL must be powered
externally and ANA_LDO output can provide a regulated 1.3 V, but only to VDDA_ANA, not both.
NOTE
The DSP_LDOO is not supported on TMS320C5532. However, DSP_LDO can be enabled to
support the RTC-only mode (see Section 6.10.1, RTC Only Mode, for details). Otherwise,
DSP_LDO should be disabled on this device and the DSP_LDO output pin must be always
left unconnected. The USB_LDOO is not supported on this device, so the USB_LDO must
be left disabled. USB_LDO is disabled at reset, so it does not require any action to disable
the USB_LDO. When the USB_LDO is disabled, the USB_LDOO pin is in a high-impedance
(Hi-Z) state and should be left unconnected.
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4.3 Clock Considerations
The system clock, which is used by the CPU and most of the DSP peripherals, is controlled by the system
clock generator. The system clock generator features a software-programmable PLL multiplier and several
dividers. The clock generator accepts an input reference clock from the CLKIN pin or the output clock of
the 32.768-KHz real-time clock (RTC) oscillator. The selection of the input reference clock is based on the
state of the CLK_SEL pin. The CLK_SEL pin is required to be statically tied high or low and cannot
change dynamically after reset.
In addition, the DSP requires a reference clock for USB applications. The USB reference clock is
generated using a dedicated on-chip oscillator with a 12-MHz external crystal connected to the USB_MXI
and USB_MXO pins.
The USB reference clock is not required if the USB peripheral is not being used. To completely disable the
USB oscillator, connect the USB_MXI pin to ground (VSS) and leave the USB_MXO pin unconnected. The
USB oscillator power pins (USB_VDDOSC and USB_VSSOSC) should also be connected to ground.
The RTC oscillator generates a clock when a 32.768-KHz crystal is connected to the RTC_XI and
RTC_XO pins. The 32.768-KHz crystal can be disabled if CLKIN is used as the clock source for the DSP.
However, when the RTC oscillator is disabled, the RTC peripheral will not operate and the RTC registers
(I/O address range 1900h – 197Fh) will not be accessible. This includes the RTC power management
register (RTCPMGT) which controls the RTCLKOUT and WAKEUP pins. To disable the RTC oscillator,
connect the RTC_XI pin to CVDDRTC and the RTC_XO pin to ground.
For more information on crystal specifications for the RTC oscillator and the USB oscillator, see
Section 6.4, External Clock Input From RTC_XI, CLKIN, and USB_MXI Pins.
4.3.1 Clock Configurations After Device Reset
After reset, the on-chip Bootloader programs the system clock generator based on the input clock selected
via the CLK_SEL pin. If CLK_SEL = 0, the Bootloader programs the system clock generator and sets the
system clock to 12.288 MHz (multiply the 32.768-kHz RTC oscillator clock by 375). If CLK_SEL = 1, the
Bootloader bypasses the system clock generator altogether and the system clock is driven by the CLKIN
pin. In this case, the CLKIN frequency is expected to be 11.2896 MHz, 12.0 MHz, or 12.288 MHz. While
the bootloader tries to boot from the USB, the clock generator will be programmed to output approximately
36 MHz.
4.3.1.1 Device Clock Frequency
After the boot process is complete, the user is allowed to re-program the system clock generator to bring
the device up to the desired clock frequency and the desired peripheral clock state (clock gating or not).
The user must adhere to various clock requirements when programming the system clock generator. For
more information, see Section 6.5, Clock PLLs.
Note: The on-chip Bootloader allows for DSP registers to be configured during the boot process.
However, this feature must not be used to change the output frequency of the system clock generator
during the boot process. Timer0 is also used by the bootloader to allow for 200 ms of BG_CAP settling
time. The bootloader register modification feature must not modify the Timer0 registers.
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4.3.1.2 Peripheral Clock State
The clock and reset state of each of peripheral is controlled through a set of system registers. The
peripheral clock gating control registers (PCGCR1 and PCGCR2) are used to enable and disable
peripheral clocks. The peripheral software reset counter register (PSRCR) and the peripheral reset control
register (PRCR) are used to assert and de-assert peripheral reset signals.
At hardware reset, all of the peripheral clocks are off to conserve power. After hardware reset, the DSP
boots via the bootloader code in ROM. During the boot process, the bootloader queries each peripheral to
determine if it can boot from that peripheral. In other words, it reads each peripheral looking for a valid
boot image file. At that time, the individual peripheral clocks will be enabled for the query and then
disabled again when the bootloader is finished with the peripheral. By the time the bootloader releases
control to the user code, all peripheral clocks will be off and all domains in the ICR, except the CPU
domain, will be idled.
4.3.1.3 USB Oscillator Control
The USB oscillator is controlled through the USB system control register (USBSCR). To enable the
oscillator, the USBOSCDIS and USBOSCBIASDIS bits must be cleared to 0. The user must wait until the
USB oscillator stabilizes before proceeding with the USB configuration. The USB oscillator stabilization
time is typically 100 μs, with a 10 ms maximum (Note: the startup time is highly dependent on the ESR
and capacitive load on the crystal).
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4.4 Boot Sequence
The boot sequence is a process by which the device's on-chip memory is loaded with program and data
sections from an external image file (in flash memory, for example). The boot sequence also allows,
optionally, for some of the device's internal registers to be programmed with predetermined values. The
boot sequence is started automatically after each device reset. For more details on device reset, see
Section 6.7, Reset.
There are several methods by which the memory and register initialization can take place. Each of these
methods is referred to as a boot mode. At reset, the device cycles through different boot modes until an
image is found with a valid boot signature. The on-chip Bootloader allows the DSP registers to be
configured during the boot process, if the optional register configuration section is present in the boot
image (see Figure 4-5). For more information on the boot modes supported, see Section 4.4.1, Boot
Modes.
The device Bootloader follows the following steps as shown in Figure 4-5
1. Immediately after reset, the CPU fetches the reset vector from 0xFFFF00. MP/MC is 0 by default, so
0xFFFF00 is mapped to internal ROM. The PLL is in bypass mode.
2. Set CLKOUT slew rate control to slow slew rate.
3. Idle all peripherals, MPORT and HWA.
4. If CLK_SEL = 0, the Bootloader powers up the PLL and sets its output frequency to 12.288 MHz (with
a 375x multiplier using VP = 749, VS = 0, input divider disabled, output divide-by-8 enabled, and output
divider enabled with VO = 0). If CLK_SEL = 1, the Bootloader keeps the PLL bypassed. Enable
TIMER0 to start counting 200 ms.
5. Apply manufacturing trim to the bandgap references.
6. Disable CLKOUT.
7. Test for 16-bit and 24-bit SPI EEPROM boot on SPI_CS[0] with a 500-KHz clock rate and set to
Parallel Port Mode on the External Bus Selection Register to 5, then set to 6:
(a) Check the first 2 bytes read from boot table for a boot signature match using 16-bit address mode.
(b) If the boot signature is not valid, read the first 2 bytes again using 24-bit address mode.
(c) If the boot signature is not valid from either case (16-bit and 24-bit address modes), go to step 8.
(d) Set Register Configuration, if present in boot image.
(e) Attempt SPI Serial Memory boot, go to step 13.
8. Test for I2C EEPROM boot with a 7-bit slave address 0x50 and 400-kHz clock rate.
(a) Check the first 2 bytes read from boot table for a boot signature match.
(b) If the boot signature is not valid, go to step 9.
(c) Set Register Configuration, if present in boot image.
(d) Attempt I2C EEPROM boot, go to step 13.
9. Test for eMMC partitions/eMMC/SD0 boot:
–
For an eMMC/SD/SDHC card, the card must be formatted to FAT16 or FAT32. The boot image file
must be renamed to "bootimg.bin" and copied to the foot directory of the formatted card.
If an eMMC boot partition is desired (for only eMMC 4.3 and up), then the boot image file must be
programmed to one of the two boot partitions (1 or 2) on the eMMC card. PARTITION_CONFIG in
the EXT_CSD must be set accordingly.
–
–
If the boot signature is found, attempt eMMC/SD/SDHC boot and go to step 13.
If boot signature is not found, go to step 10.
10. Set the PLL output to approximately 36 MHz. If CLK_SEL = 1, CLKIN multiplied by 3x. If CLK_SEL =
0, CLKIN is multiplied by 1125x. Re-enable TIMER0 to start counting 200 ms due to the PLL change.
11. Test for UART/USB boot:
–
The USB internal LDO will be enabled and the device is configured to accept a boot image on EP1
OUT.
–
UART will be set to 57600 baud, 8 bit, 1 stop bit, CTS/RTS auto flow control, and odd parity will be
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enabled to accept a boot image from the UART transmitter.
–
The device will poll UART and USB in turns. If a valid boot signature is detected on either device, a
boot image will attempt to download on that device. Go to step 13.
If a valid signature is not detected, return to step 11.
12. Ensure a minimum of 200 ms has elapsed since step 15 before proceeding to execute the bootloaded
code.
13. Jump to the entry point specified in the boot image.
No
CLK SEL = 1
?
Setup PLL to
x375
Yes
Internal Configuration
Yes
Yes
SPI Boot
?
No
I2C Boot
?
No
eMMC/SD0
Boot
?
Yes
Set Register
Configuration
Yes
UART/USB(1) Boot
?
Copy Boot
Image Sections
to System
No
Memory
Start Timer0 to Count
200 ms
Has Timer0
Counter Expired
?
No
Yes
Jump to Stored
Execution Point
(1)
Figure 4-5. Bootloader Software Architecture
(1) USB is not supported on TMS320C5532.
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4.4.1 Boot Modes
The device DSP supports the following boot modes in the following device order: SPI 16-bit EEPROM,
SPI 24-bit Flash, I2C EEPROM, and eMMC boot partition/eMMC/SD/SDHC card. The boot mode is
determined by checking for a valid boot signature on each supported boot device. The first boot device
with a valid boot signature will be used to load and execute the user code. If none of the supported boot
devices have a valid boot signature, the Bootloader goes into an endless loop checking the UART/USB
boot mode and the device must be reset to look for another valid boot image in the supported boot modes.
Note: For detailed information on eMMC boot partition/eMMC/SD/SDHC and UART/USB boot modes,
contact your local sales representative.
4.4.2 Boot Configuration
After reset, the on-chip Bootloader programs the system clock generator based on the input clock selected
via the CLK_SEL pin. If CLK_SEL = 0, the Bootloader programs the system clock generator and sets the
system clock to 12.288 MHz (multiply the 32.768-KHz RTC oscillator clock by 375). If CLK_SEL = 1, the
Bootloader bypasses the system clock generator altogether and the system clock is driven by the CLKIN
pin.
Note:
•
•
When CLK_SEL =1, the CLKIN frequency is expected to be 11.2896 MHz, 12.0 MHz, or 12.288 MHz.
The on-chip Bootloader allows for DSP registers to be configured during the boot process. However,
this feature must not be used to change the output frequency of the system clock generator during the
boot process. Timer0 is also used by the bootloader to allow for 200 ms of BG_CAP settling time. The
bootloader register modification feature must not modify the PLL or Timer0 registers.
After hardware reset, the DSP boots via the bootloader code in ROM. During the boot process, the
bootloader queries each peripheral to determine if it can boot from that peripheral. At that time, the
individual peripheral clocks will be enabled for the query and then disabled when the bootloader is finished
with the peripheral. By the time the bootloader releases control to the user code, all peripheral clocks will
be "off" and all domains in the ICR, except the CPU domain, will be idled.
4.4.3 DSP Resources Used By the Bootloader
The Bootloader uses SARAM block 31 for the storing of temporary data. This block of memory is reserved
during the boot process. However, after the boot process is complete, it can be used by the user
application.
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4.5 Configurations at Reset
Some device configurations are determined at reset. The following subsections give more details.
4.5.1 Device and Peripheral Configurations at Device Reset
Table 4-8 summarizes the device boot and configuration pins that are required to be statically tied high,
tied low, or left unconnected during device operation. For proper device operation, a device reset should
be initiated after changing any of these pin functions.
Table 4-8. Default Functions Affected by Device Configuration Pins
CONFIGURATION PINS
SIGNAL NO.
IPU/IPD
FUNCTIONAL DESCRIPTION
DSP_LDO enable input.
DSP_LDO_EN
C13
–
This signal is not intended to be dynamically
switched.
0 = DSP_LDO is enabled. The internal DSP LDO
is enabled to regulate power on the DSP_LDOO
pin at either 1.3 V or 1.05 V according to the
LDO_DSP_V bit in the LDOCNTL register, see
Figure 4-2). At power-on-reset, the internal POR
monitors the DSP_LDOO pin voltage and
generates the internal POWERGOOD signal
when the DSP_LDO voltage is above a minimum
threshold voltage. The internal device reset is
generated by the AND of POWERGOOD and the
RESET pin.
Note: For the 50-MHz devices, DSP_LDO must
be programmed to 1.05 V to match the core
voltage, CVDD, for proper operation after reset.
1 = DSP_LDO is disabled and the DSP_LDOO
pin is in a high-impedance (Hi-Z) state. The
internal voltage monitoring on the DSP_LDOO is
bypassed and the internal POWERGOOD signal
is immediately set high. The RESET pin (D6) will
act as the sole reset source for the device. If an
external power supply is used to provide power to
CVDD, then DSP_LDO_EN should be tied to
LDOI, DSP_LDOO should be left unconnected,
and the RESET pin must be asserted
appropriately for device initialization after
powerup.
Note: to pullup this pin, connect it to the same
supply as LDOI pins.
CLK_SEL
D1
–
Clock input select.
0 = 32-KHz on-chip oscillator drives the RTC
timer and the system clock generator. CLKIN is
ignored.
1 = CLKIN drives the system clock generator and
the 32-KHz on-chip oscillator drives only the RTC
timer.
This pin is not allowed to change during device
operation; it must be tied to DVDDIO or GND at
the board.
For proper device operation, external pullup/pulldown resistors may be required on these device
configuration pins. For discussion on situations where external pullup/pulldown resistors are required, see
Section 4.8.1, Pullup/Pulldown Resistors.
This device also has RESERVED pins that need to be configured correctly for proper device operation
(statically tied high, tied low, or left unconnected at all times). For more details on these pins, see
Table 3-16, Reserved and No Connects Terminal Functions.
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4.6 Configurations After Reset
The following sections provide details on configuring the device after reset. Multiplexed pin functions are
selected by software after reset. For more details on multiplexed pin function control, see Section 4.7,
Multiplexed Pin Configurations.
4.6.1 External Bus Selection Register (EBSR)
The External Bus Selection Register (EBSR) determines the mapping of the LCD controller, I2S2, I2S3,
UART, SPI, and GPIO signals to 21 signals of the external parallel port pins. It also determines the
mapping of the I2S or SD ports to serial port 1 pins and serial port 2 pins. The EBSR register is located at
port address 0x1C00. Once the bit fields of this register are changed, the routing of the signals takes
place on the next CPU clock cycle.
Before modifying the values of the external bus selection register, you must clock gate all affected
peripherals through the Peripheral Clock Gating Control Register. After the external bus selection register
has been modified, you must reset the peripherals before using them through the Peripheral Software
Reset Counter Register.
15
14
12
11
10
9
8
Reserved
Reserved
PPMODE
SP1MODE
SP0MODE
R/W-00
R-0
7
R/W-000
R/W-00
6
5
4
3
2
1
0
Reserved
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-6. External Bus Selection Register (EBSR) [1C00h]
Table 4-9. EBSR Register Bit Descriptions
BIT
NAME
RESERVED
DESCRIPTION
15
Reserved. Read-only, writes have no effect.
Parallel Port Mode Control Bits. These bits control the pin multiplexing of the LCD Controller, SPI,
UART, I2S2, I2S3, and GP[31:27, 20:18] pins on the parallel port.
For more details, see Table 4-10, LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin
Multiplexing.
000 = Mode 0 (16-bit LCD Controller). All 21 signals of the LCD Bridge module are routed to the 21
external signals of the parallel port.
001 = Mode 1 (SPI, GPIO, UART, and I2S2). 7 signals of the SPI module, 6 GPIO signals, 4
signals of the UART module and 4 signals of the I2S2 module are routed to the 21 external signals
of the parallel port.
010 = Mode 2 (8-bit LCD Controller and GPIO). 8 bits of pixel data of the LCD Controller module
and 8 GPIO are routed to the 21 external signals of the parallel port.
011 = Mode 3 (8-bit LCD Controller, SPI, and I2S3). 8 bits of pixel data of the LCD Controller
module, 4 signals of the SPI module, and 4 signals of the I2S3 module are routed to the 21 external
signals of the parallel port.
14:12
PPMODE
100 = Mode 4 (8-bit LCD Controller, I2S2, and UART). 8 bits of pixel data of the LCD Controller
module, 4 signals of the I2S2 module, and 4 signals of the UART module are routed to the 21
external signals of the parallel port.
101 = Mode 5 (8-bit LCD Controller,SPI, and UART). 8 bits of pixel data of the LCD Controller
module, 4 signals of the SPI module, and 4 signals of the UART module are routed to the 21
external signals of the parallel port.
110 = Mode 6 (SPI, I2S2, I2S3, and GPIO). 7 signals of the SPI module, 4 signals of the I2S2
module, 4 signals of the I2S3 module, and 6 GPIO are routed to the 21 external signals of the
parallel port.
111 = Reserved.
70
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BIT
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Table 4-9. EBSR Register Bit Descriptions (continued)
NAME
DESCRIPTION
Serial Port 1 Mode Control Bits. The bits control the pin multiplexing of the SD1, I2S1, and GPIO
pins on serial port 1.
For more details, see Table 4-11, SD1, I2S1, and GP[11:6] Pin Multiplexing.
00 = Mode 0 (SD1). All 6 signals of the SD1 module are routed to the 6 external signals of the
serial port 1.
11:10
SP1MODE
01 = Mode 1 (I2S1 and GP[11:10]). 4 signals of the I2S1 module and 2 GP[11:10] signals are
routed to the 6 external signals of the serial port 1.
10 = Mode 2 (GP[11:6]). 6 GPIO signals (GP[11:6]) are routed to the 6 external signals of the serial
port 1.
11 = Reserved.
Serial Port 0 Mode Control Bits. The bits control the pin multiplexing of the SD0, I2S0, and GPIO
pins on serial port 0.
For more details, see Section 4.7.1.3, SD0, I2S0, and GP[5:0] Pin Multiplexing.
00 = Mode 0 (SD0). All 6 signals of the SD0 module are routed to the 6 external signals of the
serial port 0.
9:8
SP0MODE
01 = Mode 1 (I2S0 and GP[5:0]). 4 signals of the I2S0 module and 2 GP[5:4] signals are routed to
the 6 external signals of the serial port 0.
10 = Mode 2 (GP[5:0]). 6 GPIO signals (GP[5:0]) are routed to the 6 external signals of the serial
port 0.
11 = Reserved.
7
6
5
4
3
2
1
0
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Reserved. Read-only, writes have no effect.
Reserved. Read-only, writes have no effect.
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
4.6.2 LDO Control Register [7004h]
When the DSP_LDO is enabled by the DSP_LDO_EN pin [C13], by default, the DSP_LDOO voltage is set
to 1.3 V. The DSP_LDOO voltage can be programmed to be either 1.05 V or 1.3 V via the DSP_LDO_V
bit (bit 1) in the LDO Control Register (LDOCNTL).
For the 50-MHz devices, DSP_LDO must be programmed to 1.05 V to match the core voltage, CVDD, for
proper operation after reset.
At reset, the USB_LDO is turned off. The USB_LDO can be enabled via the USBLDOEN bit (bit 0) in the
LDOCNTL register.
For more detailed information on the LDOs, see Section 4.2.1.1 LDO Configuration.
4.6.3 USB System Control Registers (USBSCR) [1C32h]
After reset, by default, the CPU performs 16-bit accesses to the USB register and data space. To perform
8-bit accesses to the USB data space, the user must set the BYTEMODE bits to 01b for the "high byte" or
10b for the "low byte" in the USB System Control Register (USBSCR).
4.6.4 Peripheral Clock Gating Control Registers (PCGCR1 and PCGCR2) [1C02h and 1C03h]
After hardware reset, the DSP executes the on-chip bootloader from ROM. As the bootloader executes, it
selectively enables the clock of the peripheral being queried for a valid boot. If a valid boot source is not
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found, the bootloader disables the clock to that peripheral and moves on to the next peripheral in the boot
order. After the boot process is complete, all of the peripheral clocks will be off and all domains in the ICR,
except for the CPU domain, will be idled (this includes the MPORT and HWA). The user must enable the
clocks to the peripherals and CPU ports that are going to be used. The peripheral clock gating control
registers (PCGCR1 and PCGCR2) are used to enable and disable the peripheral clocks.
4.6.5 Pullup/Pulldown Inhibit Registers (PDINHIBR1/2/3) [1C17h, 1C18h, and 1C19h,
respectively]
Each internal pullup and pulldown (IPU/IPD) resistor on the device DSP, except for the IPD on TRST, can
be individually controlled through the IPU/IPD registers (PDINHIBR1 [1C17h] , PDINHIBR2 [1C18h], and
PDINHIBR3 [1C19h]). To minimize power consumption, internal pullup or pulldown resistors should be
disabled in the presence of an external pullup or pulldown resistor or external driver. Section 4.8.1,
Pullup/Pulldown Resistors, describes other situations in which an pullup and pulldown resistors are
required.
When CVDD is powered down, pullup and pulldown resistors will be forced disabled and an internal
bus-holder will be enabled. For more detailed information, see Section 6.3.2, Digital I/O Behavior When
Core Power (CVDD) is Down.
4.6.6 Output Slew Rate Control Register (OSRCR) [1C16h]
To provide the lowest power consumption setting, the DSP has configurable slew rate control on the
CLKOUT output pin. The output slew rate control register (OSRCR) is used to set a subset of the device
I/O pins, namely the CLKOUT pin, to either fast or slow slew rate. The slew rate feature is implemented by
staging/delaying turn-on times of the parallel p-channel drive transistors and parallel n-channel drive
transistors of the output buffer. In the slow slew rate configuration, the delay is longer, but ultimately the
same number of parallel transistors are used to drive the output high or low. Thus, the drive strength is
ultimately the same. The slower slew rate control can be used for power savings and has the greatest
effect at lower DVDDIO voltages.
4.7 Multiplexed Pin Configurations
The device DSP uses pin multiplexing to accommodate a larger number of peripheral functions in the
smallest possible package, providing the ultimate flexibility for end applications. The external bus selection
register (EBSR) controls all the pin multiplexing functions on the device.
4.7.1 Pin Multiplexing Details
This section discusses how to program the external bus selection register (EBSR) to select the desired
peripheral functions and pin muxing. See the individual pin mux sections for pin muxing details for a
specific muxed pin. After changing any of the pin mux control registers, it will be necessary to reset the
peripherals that are affected.
4.7.1.1 LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin Multiplexing [EBSR.PPMODE
Bits] — C5535 Only
The LCD Controller, SPI, UART, I2S2, I2S3, and GPIO signal muxing is determined by the value of the
PPMODE bit fields in the External Bus Selection Register (EBSR) register. For more details on the actual
pin functions, see Table 4-10.
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Table 4-10. LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin Multiplexing(1)
PDINHIBR3
REGISTER
BIT
EBSR PPMODE BITS
MODE 3
MODE 0
000
MODE 1
001
MODE 2
010
MODE 4
100
MODE 5
101
MODE 6
110
PIN NAME
FIELDS(2)
011
LCD_EN_RDB/SPI_CLK
LCD_EN_RDB
LCD_D[0]
LCD_D[1]
LCD_D[2]
LCD_D[3]
LCD_D[4]
LCD_D[5]
LCD_D[6]
LCD_D[7]
LCD_D[8]
LCD_D[9]
LCD_D[10]
LCD_D[11]
LCD_D[12]
LCD_D[13]
LCD_D[14]
LCD_D[15]
LCD_CS0_E0
LCD_CS1_E1
LCD_RW_WRB
LCD_RS
SPI_CLK
SPI_RX
LCD_EN_RDB
LCD_D[0]
LCD_D[1]
LCD_D[2]
LCD_D[3]
LCD_D[4]
LCD_D[5]
LCD_D[6]
LCD_D[7]
GP[18]
LCD_EN_RDB
LCD_D[0]
LCD_D[1]
LCD_D[2]
LCD_D[3]
LCD_D[4]
LCD_D[5]
LCD_D[6]
LCD_D[7]
SPI_CLK
LCD_EN_RDB
LCD_D[0]
LCD_D[1]
LCD_D[2]
LCD_D[3]
LCD_D[4]
LCD_D[5]
LCD_D[6]
LCD_D[7]
I2S2_CLK
I2S2_FS
LCD_EN_RDB
LCD_D[0]
LCD_D[1]
LCD_D[2]
LCD_D[3]
LCD_D[4]
LCD_D[5]
LCD_D[6]
LCD_D[7]
SPI_CLK
SPI_CLK
SPI_RX
SPI_TX
GP[12]
LCD_D[0]/SPI_RX
LCD_D[1]/SPI_TX
SPI_TX
P2PD
P3PD
P4PD
P5PD
P6PD
P7PD
P8PD
P9PD
P10PD
P11PD
P12PD
P13PD
P14PD
P15PD
LCD_D[2]/GP[12]
GP[12]
LCD_D[3]/GP[13]
GP[13]
GP[13]
LCD_D[4]/GP[14]
GP[14]
GP[14]
LCD_D[5]/GP[15]
GP[15]
GP[15]
LCD_D[6]/GP[16]
GP[16]
GP[16]
LCD_D[7]/GP[17]
GP[17]
GP[17]
LCD_D[8]/I2S2_CLK/GP[18]/SPI_CLK
LCD_D[9]/I2S2_FS/GP[19]/SPI_CS0
LCD_D[10]/I2S2_RX/GP[20]/SPI_RX
LCD_D[11]/I2S2_DX/GP[27]/SPI_TX
LCD_D[12]/UART_RTS/GP[28]/I2S3_CLK
LCD_D[13]/UART_CTS/GP[29]/I2S3_FS
LCD_D[14]/UART_RXD/GP[30]/I2S3_RX
LCD_D[15]/UART_TXD/GP[31]/I2S3_DX
LCD_CS0_E0/SPI_CS0
I2S2_CLK
I2S2_FS
I2S2_RX
I2S2_DX
UART_RTS
UART_CTS
UART_RXD
UART_TXD
SPI_CS0
SPI_CS1
SPI_CS2
SPI_CS3
I2S2_CLK
I2S2_FS
I2S2_RX
I2S2_DX
I2S3_CLK
I2S3_FS
I2S3_RX
I2S3_DX
SPI_CS0
SPI_CS1
SPI_CS2
SPI_CS3
GP[19]
SPI_CS0
SPI_CS0
GP[20]
SPI_RX
I2S2_RX
SPI_RX
GP[27]
SPI_TX
I2S2_DX
SPI_TX
GP[28]
I2S3_CLK
I2S3_FS
UART_RTS
UART_CTS
UART_RXD
UART_TXD
LCD_CS0_E0
LCD_CS1_E1
UART_RTS
UART_CTS
UART_RXD
UART_TXD
LCD_CS0_E0
LCD_CS1_E1
GP[29]
GP[30]
I2S3_RX
GP[31]
I2S3_DX
LCD_CS0_E0
LCD_CS1_E1
LCD_CS0_E0
LCD_CS1_E1
LCD_CS1_E1/SPI_CS1
LCD_RW_WRB/SPI_CS2
LCD_RS/SPI_CS3
LCD_RW_WRB LCD_RW_WRB LCD_RW_WRB LCD_RW_WRB
LCD_RS LCD_RS LCD_RS LCD_RS
(1) Not supported on TMS320C5534, C5533, or C5532.
(2) The pin names with PDINHIBR3 register bit field references can have the pulldown resistor enabled or disabled via this register.
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4.7.1.2 SD1, I2S1, and GP[11:6] Pin Multiplexing [EBSR.SP1MODE Bits]
The SD1, I2S1, and GPIO signal muxing is determined by the value of the SP1MODE bit fields in the External Bus Selection Register (EBSR)
register. For more details on the actual pin functions, see Table 4-11.
Table 4-11. SD1, I2S1, and GP[11:6] Pin Multiplexing
EBSR SP1MODE BITS
PDINHIBR1
REGISTER
PIN NAME
MODE 0
00
MODE 1
01
MODE 2
10
BIT FIELDS(1)
S10PD
S11PD
S12PD
S13PD
S14PD
S15PD
SD1_CLK/I2S1_CLK/GP[6]
SD1_CLK
SD1_CMD
SD1_D0
SD1_D1
SD1_D2
SD1_D3
I2S1_CLK
I2S1_FS
I2S1_DX
I2S1_RX
GP[10]
GP[6]
GP[7]
GP[8]
GP[9]
GP[10]
GP[11]
SD1_CMD/I2S1_FS/GP[7]
SD1_D0/I2S1_DX/GP[8]
SD1_D1/I2S1_RX/GP[9]
SD1_D2/GP[10]
SD1_D3/GP[11]
GP[11]
(1) The pin names with PDINHIBR1 register bit field references can have the pulldown register enabled or disabled via this register.
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4.7.1.3 SD0, I2S0, and GP[5:0] Pin Multiplexing [EBSR.SP0MODE Bits]
The SD0, I2S0, and GPIO signal muxing is determined by the value of the SP0MODE bit fields in the
External Bus Selection Register (EBSR) register. For more details on the actual pin functions, see
Table 4-12.
Table 4-12. SD0, I2S0, and GP[5:0] Pin Multiplexing
EBSR SP0MODE BITS
PDINHIBR1
REGISTER
PIN NAME
MODE 0
MODE 1
MODE 2
10
BIT FIELDS(1)
00
01
S00PD
S01PD
S02PD
S03PD
S04PD
S05PD
SD0_CLK/I2S0_CLK/GP[0]
SD0_CMD/I2S0_FS/GP[1]
SD0_D0/I2S0_DX/GP[2]
SD0_D1/I2S0_RX/GP[3]
SD0_D2/GP[4]
SD0_CLK
SD0_CMD
SD0_D0
SD0_D1
SD0_D2
SD0_D3
I2S0_CLK
I2S0_FS
I2S0_DX
I2S0_RX
GP[4]
GP[0]
GP[1]
GP[2]
GP[3]
GP[4]
GP[5]
SD0_D3/GP[5]
GP[5]
(1) The pin names with PDINHIBR1 register bit field references can have the pulldown register enabled or disabled via this register.
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4.8 Debugging Considerations
4.8.1 Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the device DSP always be at a valid logic level and
not floating. This may be achieved via pullup/pulldown resistors. The DSP features internal pullup (IPU)
and internal pulldown (IPD) resistors on many pins, including all GPIO pins, to eliminate the need, unless
otherwise noted, for external pullup/pulldown resistors.
An external pullup/pulldown resistor may need to be used in the following situations:
•
Configuration Pins: An external pullup/pulldown resistor is recommended to set the desired value/state
(see the configuration pins listed in Table 4-8, Default Functions Affected by Device Configuration
Pins). Note that some configuration pins must be connected directly to ground or to a specific supply
voltage.
•
Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the configuration pins (listed in Table 4-8, Default Functions Affected by Device Configuration Pins), if
they are both routed out and high-impedance state (not driven), it is strongly recommended that an
external pullup/pulldown resistor be implemented. In addition, applying external pullup/pulldown resistors
on the configuration pins adds convenience to the user in debugging and flexibility in switching operating
modes.
When an external pullup or pulldown resistor is used on a pin, the pin’s internal pullup or pulldown resistor
should be disabled through the Pullup/Pulldown Inhibit Registers (PDINHIBR1/2/3) [1C17h, 1C18h, and
1C19h, respectively] to minimize power consumption.
Tips for choosing an external pullup/pulldown resistor:
•
Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown (IPU/IPD) resistors.
•
Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
•
•
Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
•
•
Remember to include tolerances when selecting the resistor value.
For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the configuration pins
while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for
the device DSP, see Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply
Voltage and Operating Temperature.
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For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions table in this document.
4.8.2 Bus Holders
The device has special I/O bus-holder structures to ensure pins are not left floating when CVDD power is
removed while I/O power is applied. When CVDD is "ON", the bus-holders are disabled and the internal
pullups or pulldowns, if applicable, function normally. But when CVDD is "OFF" and the I/O supply is "ON",
the bus-holders become enabled and any applicable internal pullups and pulldowns are disabled.
The bus-holders are weak drivers on the pin and, for as long as CVDD is "OFF" and I/O power is "ON",
they hold the last state on the pin. If an external device is strongly driving the device I/O pin to the
opposite state then the bus-holder will flip state to match the external driver and DC current will stop.
This bus-holder feature prevents unnecessary power consumption when CVDD is "OFF"and I/O supply is
"ON". For example, current caused by undriven pins (input buffer oscillation) and/or DC current flowing
through pullups or pulldowns.
If external pullup or pulldown resistors are implemented, then care should be taken that those
pullup/pulldown resistors can exceed the internal bus-holder's max current and thereby cause the
bus-holder to flip state to match the state of the external pullup or pulldown. Otherwise, DC current will
flow unnecessarily. When CVDD power is applied, the bus holders are disabled (for further details on bus
holders, see Section 6.3.2, Digital I/O Behavior When Core Power (CVDD) is Down).
4.8.3 CLKOUT Pin
For debug purposes, the DSP includes a CLKOUT pin which can be used to tap different clocks within the
clock generator. The SRC bits of the CLKOUT Control Source Register (CCSSR) can be used to specify
the source for the CLKOUT pin.
Note: The bootloader disables the CLKOUT pin via CLKOFF bit in the ST3_55 CPU register.
For more information on the ST3_55 CPU register, see the TMS320C55x 3.0 CPU Reference Guide
(literature number: SWPU073).
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5 Device Operating Conditions
For the device maximum operating frequency, see Section 7.1.2, Device and Development-Support Tool
Nomenclature.
5.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless
Otherwise Noted)(1)
(2)
Supply voltage ranges:
Digital Core (CVDD, CVDDRTC, USB_VDD1P3
)
–0.5 V to 1.7 V
–0.5 V to 4.2 V
I/O, 1.8 V, 2.5 V, 2.75 V, 3.3 V (DVDDIO, DVDDRTC) 3.3V
USB supplies USB PHY (USB_VDDOSC, USB_VDDPLL
,
(2)
USB_VDDA3P3
)
LDOI
–0.5 V to 4.2 V
–0.5 V to 1.7 V
–0.5 V to 4.2 V
(2)
Analog, 1.3 V (VDDA_PLL, USB_VDDA1P3, VDDA_ANA
)
Input and Output voltage ranges:
VI I/O, All pins with DVDDIO or USB_VDDOSC or USB_VDDPLL
or USB_VDDA3P3 as supply source
VO I/O, All pins with DVDDIO or USB_VDDOSC or
USB_VDDPLLor USB_VDDA3P3 as supply source
–0.5 V to 4.2 V
RTC_XI and RTC_XO
VI and VO, GPAIN[0]
–0.5 V to 1.7 V
–0.5 V to 4.2 V
–0.5 V to 1.7 V
–0.5 V to 1.7 V
-0.5 V to 5.5 V
–0.5 V to 1.7 V
-10°C to 70°C
-40°C to 85°C
–65°C to 150°C
100,000 POH
100,000 POH
> 300 V
VI and VO, GPAIN[3:1]
VO, BG_CAP
USB_VBUS Input
ANA_LDOO, DSP_LDOO, and USB_LDOO(3)
Commercial Temperature (default)
Industrial Temperature
(default)
Operating case temperature ranges, Tc:
Storage temperature range, Tstg
Device Operating Life
DSP Operating Frequency
(SYSCLK ) ≤100 MHz
<70 °C
(4)
Power-On Hours (POH)
≥70 °C - ≤85 °C
JTAG
ESD Stress Voltage(5)
Human Body Model (HBM)(6)
GPIO
> 500 V
Other
> 1000 V
Charged Device Model (CDM)(7)
> 250 V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS.
(3) DSP_LDOO on TMS320C5533 and C5532 and USB_LDOO on C5532 are not supported and should be left unconnected.
(4) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI’s standard terms
and conditions for TI semiconductor products.
(5) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
(6) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 500 V HBM is possible if necessary precautions
are taken. Pins listed as 1000 V may actually have higher performance.
(7) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process. Pins listed as 250 V may actually have higher performance.
78
Device Operating Conditions
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5.2 Recommended Operating Conditions
MIN
0.998
1.24
0.998
1.24
1.24
1.24
1.24
2.97
2.97
2.48
2.25
1.65
2.97
2.97
1.8
NOM
1.05
1.3
MAX UNIT
50 MHz
1.15
1.43
1.43
1.43
1.43
1.43
1.43
3.63
3.63
3.02
2.75
1.98
3.63
3.63
3.6
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
CVDD
Supply voltage, Digital Core
100 MHz
32.768 KHz
CVDDRTC
Supply voltage, RTC and RTC OSC
Supply voltage, Digital USB
USB_VDD1P3
USB_VDDA1P3
VDDA_ANA
1.3
1.3
1.3
1.3
3.3
3.3
2.75
2.5
1.8
3.3
3.3
Core Supplies
Supply voltage, 1.3 V Analog USB
Supply voltage, 1.3 V SAR and Pwr Mgmt
Supply voltage, System PLL
Supply voltage, 3.3 V USB PLL
Supply voltage, I/O, 3.3 V
VDDA_PLL
USB_VDDPLL
Supply voltage, I/O, 2.75 V
DVDDIO
DVDDRTC
Supply voltage, I/O, 2.5 V
I/O Supplies
Supply voltage, I/O, 1.8 V
USB_VDDOSC
USB_VDDA3P3
LDOI
Supply voltage, I/O, 3.3 V USB OSC
Supply voltage, I/O, 3.3 V Analog USB PHY
Supply voltage, Analog Pwr Mgmt and LDO Inputs
Supply ground, Digital I/O
VSS
VSSRTC
Supply ground, RTC
USB_VSSOSC
USB_VSSPLL
USB_VSSA3P3
USB_VSSA1P3
USB_VSSREF
VSSA_PLL
Supply ground, USB OSC
Supply ground, USB PLL
Supply ground, 3.3 V Analog USB PHY
Supply ground, USB 1.3 V Analog USB PHY
Supply ground, USB Reference Current
Supply ground, System PLL
GND
0
0
0
V
USB_VSS1P3
VSSA_ANA
Supply ground, 1.3 V Digital USB PHY
Supply ground, SAR and Pwr Mgmt
High-level input voltage, 3.3, 2.75, 2.5, 1.8 V I/O (except
(1)
VIH
0.7 * DVDD
-0.3
DVDD + 0.3
0.3 * DVDD
V
V
(2)
GPAIN[3:0] pins)
Low-level input voltage, 3.3, 2.75, 2.5, 1.8 V I/O (except
GPAIN[3:0] pins)
(1)
VIL
(2)
Input voltage, GPAIN0 pin(3)
Input voltage, GPAIN[3:1] pins
Default
-0.3
-0.3
3.6
V
V
VIN
VDDA_ANA + 0.3
-10
70
°C
(Commercial)
Tc
Operating case temperature
(Industrial)
-40
0
85
60
°C
1.05 V
DSP Operating Frequency (SYSCLK)
1.3 V
MHz
MHz
FSYSCLK
0
100
(1) DVDD refers to the pin I/O supply voltage. To determine the I/O supply voltage for each pin, see Section 3.2, Terminal Functions.
(2) The I2C pin SDA and SCL do not feature fail-safe I/O buffers. These pin could potentially draw current when the DVDDIO is powered
down. Due to the fact that different voltage devices can be connected to I2C bus and the I2C inputs are LVCMOS, the level of logic 0
(low) and logic 1 (high) are not fixed and depend on DVDDIO
.
(3) The GNDON bit in the SARPINCTRL register should be set to "1" before SAR channels 0, 1, or 2 are enabled via the CHSEL bit in the
SARCTRL register, when VIN greater than VDDA_ANA
.
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Device Operating Conditions
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5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Temperature (Unless Otherwise Noted)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Full speed: USB_DN and
USB_DP(2)
2.8
USB_VDDA3P3
V
High speed: USB_DN and
USB_DP(2)
360
440
mV
V
VOH
High-level output voltage, 3.3,
2.75, 2.5, 1.8 V I/O (except
GPAIN[3:0] pins)
IO = IOH
IO = IOH
0.8 * DVDD
High-level output voltage,
GPAIN[3:1] pins
0.8 * VDDA_ANA
V
V
Full speed: USB_DN and
USB_DP(2)
0.0
0.3
10
High speed: USB_DN and
USB_DP(2)
–10
mV
Low-level output voltage, 3.3,
2.75, 2.5, 1.8V I/O (except I2C
and GPAIN[3:0] pins)
VOL
IO = IOL
0.2 * DVDD
V
Low-level output voltage, I2C
pins(3)
V
DD > 2 V, IOL = 3 mA
0
0.4
V
V
Low-level output voltage,
GPAIN[3:0] pins
IO = IOL
0.2 * VDDA_ANA
DVDD = 3.3 V
DVDD = 2.5 V
DVDD = 1.8 V
162
141
122
1.3
mV
mV
mV
V
VHYS
VLDO
ISD
Input hysteresis(4)
USB_LDOO voltage
ANA_LDOO voltage
1.24
1.24
1.24
0.998
250
4
1.43
1.43
1.43
1.15
1.3
V
DSP_LDO_V bit in the LDOCNTL register = 1
DSP_LDO_V bit in the LDOCNTL register = 0
LDOI = VMIN
1.3
V
DSP_LDOO voltage
1.05
V
DSP_LDO shutdown current(5)
ANA_LDO shutdown current(5)
USB_LDO shutdown current(5)
mA
mA
mA
μA
LDOI = VMIN
LDOI = VMIN
25
Input only pin, internal pulldown or pullup disabled
-5
+5
-59 to
-161
DVDD = 3.3 V with internal pullup enabled(8)
μA
Input current [DC] (except
WAKEUP, I2C, and GPAIN[3:0]
pins)
(6)(7)
IILPU
DVDD = 2.5 V with internal pullup enabled(8)
DVDD = 1.8 V with internal pullup enabled(8)
Input only pin, internal pulldown or pullup disabled
DVDD = 3.3 V with internal pulldown enabled(8)
DVDD = 2.5 V with internal pulldown enabled(8)
DVDD = 1.8 V with internal pulldown enabled(8)
-31 to -93
-14 to -44
μA
μA
μA
μA
μA
μA
-5
-5
+5
+5
Input current [DC] (except
WAKEUP, I2C, and GPAIN[3:0]
pins)
52 to 158
27 to 83
11 to 35
(6)(7)
IIHPD
IIH
/
VI = VSS to DVDD with internal pullups and
pulldowns disabled.
Input current [DC], ALL pins
μA
(7)
IIL
(1) For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
(2) The USB I/Os adhere to the Universal Bus Specification Revision 2.0 (USB2.0 spec).
(3) VDD is the voltage to which the I2C bus pullup resistors are connected.
(4) Applies to all input pins except WAKEUP, I2C pins, GPAIN[3:0], RTC_XI, and USB_MXI.
(5) ISD is the amount of current the LDO is ensured to deliver before shutting down to protect itself.
(6) II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II
indicates the input leakage current and off-state (Hi-Z) output leakage current.
(7) When CVDD power is "ON", the pin bus-holders are disabled. For more detailed information, see Section 6.3.2, Digital I/O Behavior
When Core Power (CVDD) is Down.
(8) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
80
Device Operating Conditions
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature
(Unless Otherwise Noted) (continued)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
All Pins (except USB, CLKOUT, and GPAIN[3:0]
pins)
-4
mA
DVDD = 3.3 V
CLKOUT pin
-6
-4
mA
mA
DVDD = 1.8 V
(7)
IOH
High-level output current [DC]
DVDD = VDDA_ANA = 1.3
V,
-4
mA
GPAIN[3:1] pins
External Regulator(9)
(GPAIN0 is open-drain
and cannot drive high)
V,
DVDD = VDDA_ANA = 1.3
-100
μA
Internal Regulator(9)
All Pins (except USB, CLKOUT, and GPAIN[3:0]
pins)
+4
mA
DVDD = 3.3 V
CLKOUT pin
+6
+4
mA
mA
DVDD = 1.8 V
(7)
IOL
Low-level output current [DC]
I/O Off-state output current
DVDD = VDDA_ANA = 1.3
+4
+4
mA
mA
V, external regulator
GPAIN[3:0]
DVDD = VDDA_ANA = 1.3
V, internal regulator(9)
All Pins (except USB and GPAIN[3:0])
GPAIN[3:0] pins
-10
-10
+10
+10
2.2
μA
μA
(10)
IOZ
Supply voltage, I/O, 3.3 V
Supply voltage, I/O, 2.75 V
Supply voltage, I/O, 2.5 V
Supply voltage, I/O, 1.8 V
Supply voltage, I/O, 3.3 V
Supply voltage, I/O, 2.75 V
Supply voltage, I/O, 2.5 V
Supply voltage, I/O, 1.8 V
mA
mA
mA
mA
mA
mA
mA
mA
1.6
Bus Holder pull low current when
CVDD is powered "OFF"
(11)
IOLBH
1.4
0.72
-1.3
-0.97
-0.83
-0.46
Bus Holder pull high current
when CVDD is powered "OFF"
(11)
IOHBH
(9) When the ANA_LDO supplies VDDA_ANA, it is not recommended to use the GPAIN[3:1] signals for general-purpose outputs (driving high).
The ISD parameter of the ANA_LDO is too low to drive any realistic load on the GPAIN[3:1] pins while also supplying the PLL through
VDDA_PLL and the SAR through VDDA_ANA
.
(10) IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
(11) This parameter specifies the maximum strength of the Bus Holder and is needed to calculate the minimum strength of external pull-ups
and pull-downs.
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Device Operating Conditions
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature
(Unless Otherwise Noted) (continued)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Active, CVDD = 1.3 V, DSP clock = 100 MHz,
Clock source = RTC on-chip Oscillator
0.22
mW/MHz
Room Temp (25 °C), 75% DMAC + 25% ADD
(typical sine wave data switching)
Active, CVDD = 1.05 V, DSP clock = 50 MHz,
Clock source = RTC on-chip Oscillator
0.15
0.22
0.14
0.44
0.26
0.40
0.23
0.28
mW/MHz
mW/MHz
mW/MHz
mW
Room Temp (25 °C), 75% DMAC + 25% ADD
(typical data switching)
Active, CVDD = 1.3 V, DSP clock = 100MHz, Clock
source = RTC on-chip Oscillator
Room Temp (25 °C), 75% DMAC + 25% NOP
(typical sine wave data switching)
Active, CVDD = 1.05 V, DSP clock = 50 MHz,
Clock source = RTC on-chip Oscillator
Room Temp (25 °C), 75% DMAC + 25% NOP
(typical data switching)
Standby, CVDD = 1.3 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
Room Temp (25 °C), DARAM and SARAM in
active mode
Core (CVDD) supply current
Standby, CVDD = 1.05 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
mW
Room Temp (25 °C), DARAM and SARAM in
active mode
ICDD
Standby, CVDD = 1.3 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
mW
Room Temp (25 °C), DARAM in retention and
SARAM in active mode
Standby, CVDD = 1.05 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
mW
Room Temp (25 °C), DARAM in retention and
SARAM in active mode
Standby, CVDD = 1.3 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
mW
Room Temp (25 °C), DARAM in active mode and
SARAM in retention
Standby, CVDD = 1.05 V, Master clock disabled,
Clock source = RTC on-chip Oscillator
0.15
0.7
mW
Room Temp (25 °C), DARAM in active mode and
SARAM in retention
VDDA_PLL = 1.3 V
Analog PLL (VDDA_PLL) supply
current
mA
mA
Room Temp (25 °C), Phase detector = 170 kHz,
VCO = 100 MHz
VDDA_ANA = 1.3 V, SAR clock = 2 MHz, Temp
SAR Analog (VDDA_ANA) supply
current
1
(70 °C)
CI
Input capacitance
Output capacitance
4
4
pF
pF
Co
82
Device Operating Conditions
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6 Peripheral Information and Electrical Specifications
6.1 Parameter Information
Tester Pin Electronics
Data Sheet Timing Reference Point
42 Ω
3.5 nH
Output
Under
Test
Transmission Line
Z0 = 50 Ω
(see Note)
Device Pin
(see Note)
4.0 pF
1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be
taken into account.Atransmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission line is
intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 6-1. 3.3-V Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1.1 1.8-V, 2.5-V, 2.75-V, and 3.3-V Signal Transition Levels
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL
MAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 6-2. Rise and Fall Transition Time Voltage Reference Levels
6.1.2 3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
6.1.3 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays by board routing. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
6.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
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6.3 Power Supplies
The device includes four core voltage-level supplies (CVDD, CVDDRTC, USB_VDD1P3, USB_VDDA1P3), and
several I/O supplies (DVDDIO, DVDDRTC, USB_VDDOSC, and USB_VDDA3P3), as well as several analog
supplies (LDOI, VDDA_PLL, VDDA_ANA, and USB_VDDPLL). Some TI power-supply devices include features
that facilitate power sequencing—for example, Auto-Track and Slow-Start/Enable features. For more
information regarding TI's power management products and suggested devices to power TI DSPs, visit
www.ti.com/processorpower.
6.3.1 Power-Supply Sequencing
The device includes four core voltage-level supplies (CVDD, CVDDRTC, USB_VDD1P3, USB_VDDA1P3), and
several I/O supplies, DVDDIO, DVDDRTC, USB_VDDOSC, and USB_VDDA3P3
.
The device does not require a specific power-up sequence. However, if the DSP_LDO is disabled
(DSP_LDO_EN = high) and an external regulator supplies power to the CPU Core (CVDD), the external
reset signal (RESET) must be held asserted until all of the supply voltages reach their valid operating
ranges.
Note: the external reset signal on the RESET pin must be held low until all of the power supplies reach
their operating voltage conditions.
The I/O design allows either the core supplies (CVDD, CVDDRTC, USB_VDD1P3, USB_VDDA1P3) or the I/O
supplies (DVDDIO, DVDDRTC, USB_VDDOSC, and USB_VDDA3P3) to be powered up for an indefinite period of
time while the other supply is not powered if the following constraints are met:
1. All maximum ratings and recommended operating conditions are satisfied.
2. All warnings about exposure to maximum rated and recommended conditions, particularly junction
temperature are satisfied. These apply to power transitions as well as normal operation.
3. Bus contention while core supplies are powered must be limited to 100 hours over the projected
lifetime of the device.
4. Bus contention while core supplies are powered down does not violate the absolute maximum ratings.
If the USB subsystem is not used, the USB Core (USB_VDD1P3, USB_VDDA1P3) and USB PHY and I/O level
supplies (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) can be powered off.
Note: If the device is powered up with the USB cable connected to an active USB host and the USB PHY
(USB_VDDA3P3) is powered up before the USB Core (USB_VDD1P3, USB_VDDA1P3), the USB Core must be
powered within 100 ms after the USB host detects the device has been attached.
A supply bus is powered up when the voltage is within the recommended operating range. It is powered
down when the voltage is below that range, either stable or while in transition.
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6.3.2 Digital I/O Behavior When Core Power (CVDD) is Down
With some exceptions (listed below), all digital I/O pins on the device have special features to allow
powering down of the Digital Core Domain (CVDD) without causing I/O contentions or floating inputs at the
pins (see Figure 6-3). The device asserts the internal signal called HHV high when power has been
removed from the Digital Core Domain (CVDD). Asserting the internal HHV signal causes the following
conditions to occur in any order:
•
•
•
All output pin strong drivers to go to the high-impedance (Hi-Z) state
Weak bus holders to be enabled to hold the pin at a valid high or low
The internal pullups or pulldowns (IPUs/IPDs) on the I/O pins will be disabled
The exception pins that do not have this special feature are:
•
Pins driven by the CVDDRTC Power Domain [This power domain is "Always On"; therefore, the pins
driven by CVDDRTC do not need these special features]:
–
RTC_XI, RTC_XO, RTC_CLKOUT, and WAKEUP
•
•
USB Pins:
–
USB_DP, USB_DM, USB_R1, USB_VBUS, USB_MXI, and USB_MXO
Pins for the Analog Block:
–
GPAIN[3:0], DSP_LDO_EN, and BG_CAP
DVDD
Y
A
PAD
hhvgz
HHV
GZ
OR
HHV
PI
hhvpi
OR
HHV
Figure 6-3. Bus Holder I/O Circuit
NOTE
Figure 6-3 shows both a pullup and pulldown but pins have only one, not both.
PI = Pullup/pulldown Inhibit
GZ = Output Enable (active low)
HHV = Described in Section 6.3.2
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6.3.3 Power-Supply Design Considerations
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the device, the PC board should include separate power planes for core, I/O,
VDDA_ANA and VDDA_PLL (which can share the same PCB power plane), and ground; all bypassed with
high–quality low–ESL/ESR capacitors.
6.3.4 Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place capacitors (caps) as close as
possible to the device. These caps need to be no more than 1.25 cm maximum distance from the device
power pins to be effective. Physically smaller caps, such as 0402, are better but need to be evaluated
from a yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling
capacitors, therefore physically smaller capacitors should be used while maintaining the largest available
capacitance value.
Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order
of 10 μF) should be furthest away, but still as close as possible. Large caps for each supply should be
placed outside of the BGA footprint.
As with the selection of any component, verification of capacitor availability over the product's production
lifetime should be considered.
The recommended decoupling capacitance for the DSP core supplies should be 1 μF in parallel with
0.01-μF capacitor per supply pin.
6.3.5 LDO Input Decoupling
The LDO inputs should follow the same decoupling guidelines as other power-supply pins above.
6.3.6 LDO Output Decoupling
The LDO circuits implement a voltage feedback control system which has been designed to optimize gain
and stability tradeoffs. As such, there are design assumptions for the amount of capacitance on the LDO
outputs. For proper device operation, the following external decoupling capacitors should be used when
the on-chip LDOs are enabled:
•
•
•
ANA_LDOO– 1μF
DSP_LDOO – 5μF ~ 10μF
USB_LDOO – 1μF ~ 2μF
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6.4 External Clock Input From RTC_XI, CLKIN, and USB_MXI Pins
The device DSP includes two options to provide an external clock input to the system clock generator:
•
Use the on-chip real-time clock (RTC) oscillator with an external 32.768-kHz crystal connected to the
RTC_XI and RTC_XO pins.
•
Use an external 11.2896-, 12.0-, or 12.288-MHz LVCMOS clock input fed into the CLKIN pin that
operates at the same voltage as the DVDDIO supply (1.8-, 2.5-, 2.75-, or 3.3-V).
The CLK_SEL pin determines which input is used as the clock source for the system clock generator. For
more details, see Section 4.5.1, Device and Peripheral Configurations at Device Reset. The crystal for the
RTC oscillator is not required if CLKIN is used as the system reference clock; however, the RTC must still
be powered. The RTC registers starting at I/O address 1900h will not be accessible without an RTC clock.
This includes the RTC Power Management Register which provides control to the on-chip LDOs and
WAKEUP and RTC_CLKOUT pins. Section 6.4.1, Real-Time Clock (RTC) On-Chip Oscillator With
External Crystal provides more details on using the RTC on-chip oscillator with an external crystal.
Section 6.4.2, CLKIN Pin With LVCMOS-Compatible Clock Input provides details on using an external
LVCMOS-compatible clock input fed into the CLKIN pin.
Additionally, the USB requires a reference clock generated using a dedicated on-chip oscillator with a
12-MHz external crystal connected to the USB_MXI and USB_MXO pins. The USB reference clock is not
required if the USB peripheral is not being used. Section 6.4.3, USB On-Chip Oscillator With External
Crystal provides details on using the USB on-chip oscillator with an external crystal.
6.4.1 Real-Time Clock (RTC) On-Chip Oscillator With External Crystal
The on-chip oscillator requires an external 32.768-kHz crystal connected across the RTC_XI and RTC_XO
pins, along with two load capacitors, as shown in Figure 6-4. The external crystal load capacitors must be
connected only to the RTC oscillator ground pin (VSSRTC). Do not connect to board ground (VSS). Position
the VSS lead on the board between RTC_XI and RTC_XO as a shield to reduce direct capacitance
between RTC_XI and RTC_XO leads on the board. The CVDDRTC pin can be connected to the same
power supply as CVDD , or may be connected to a different supply that meets the recommended operating
conditions (see Section 5.2, Recommended Operating Conditions), if desired.
RTC_XI
RTC_XO
VSSRTC
CVDDRTC
VSS
CVDD
Crystal
32.768 kHz
C1
C2
0.998-1.43 V
1.05/1.3 V
Figure 6-4. 32.768-kHz RTC Oscillator
The crystal should be in fundamental-mode function, and parallel resonant, with a maximum effective
series resistance (ESR) specified in Table 6-1. The load capacitors, C1 and C2, are the total capacitance
of the circuit board and components, excluding the IC and crystal. The load capacitors values are usually
approximately twice the value of the crystal's load capacitance, CL, which is specified in the crystal
manufacturer's datasheet and should be chosen such that the equation is satisfied. All discrete
components used to implement the oscillator circuit should be placed as close as possible to the
associated oscillator pins (RTC_XI and RTC_XO) and to the VSSRTC pin.
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C C
1
2
C
=
L
C
+ C
2
(
)
1
Table 6-1. Input Requirements for Crystal on the 32.768-kHz RTC Oscillator
PARAMETER
MIN
NOM
MAX
UNIT
sec
kHz
kΩ
Start-up time (from power up until oscillating at stable frequency of 32.768-kHz)(1)
0.2
2
Oscillation frequency
ESR
32.768
100
1.6
1.0
Maximum shunt capacitance
Maximum crystal drive
pF
μW
(1) The startup time is highly dependent on the ESR and the capacitive load of the crystal.
6.4.2 CLKIN Pin With LVCMOS-Compatible Clock Input (Optional)
Note: If CLKIN is not used, the pin must be tied low.
A LVCMOS-compatible clock input of a frequency less than 24 MHz can be fed into the CLKIN pin for use
by the DSP system clock generator. The external connections are shown in Figure 6-5 and Figure 6-6.
The bootloader assumes that the CLKIN pin is connected to the LVCMOS-compatible clock source with a
frequency of 11.2896-, 12.0-, or 12.288-MHz. These frequencies were selected to support boot mode
peripheral speeds of 500 KHz for SPI and 400 KHz for I2C and UART. These clock frequencies are
achieved by dividing the CLKIN value by 25 for SPI and by 32 for I2C and UART. If a faster external clock
is input, then these boot modes will run at faster clock speeds. If the system design utilizes faster
peripherals or these boot modes are not used, CLKIN values higher than 12.288 MHz can be used. Note:
The CLKIN pin operates at the same voltage as the DVDDIO supply (1.8-, 2.5-, 2.75-, or 3.3-V).
In this configuration the RTC oscillator can be optionally disabled by connecting RTC_XI to CVDDRTC and
RTC_XO to ground (VSS). However, when the RTC oscillator is disabled the RTC registers starting at I/O
address 1900h will not be accessible. This includes the RTC Power Management Register which provides
control to the on-chip LDOs and WAKEUP and RTC_CLKOUT pins. Note: the RTC must still be powered
even if the RTC oscillator is disabled.
For more details on the RTC on-chip oscillator, see Section 6.4.1, Real-Time Clock (RTC) On-Chip
Oscillator With External Crystal.
RTC_XI
RTC_XO
VSSRTC
CVDDRTC
VSS
CVDD
CLKIN
Crystal
32.768 kHz
C1
C2
0.998-1.43 V
1.05/1.3 V
Figure 6-5. LVCMOS-Compatible Clock Input With RTC Oscillator Enabled
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RTC_XI
CVDDRTC RTC_XO
VSS
VSSRTC
CVDD
CLKIN
0.998-1.43 V
1.05/1.3 V
Figure 6-6. LVCMOS-Compatible Clock Input With RTC Oscillator Disabled
6.4.3 USB On-Chip Oscillator With External Crystal (Optional)
When using the USB, the USB on-chip oscillator requires an external 12-MHz crystal connected across
the USB_MXI and USB_MXO pins, along with two load capacitors, as shown in Figure 6-7. The external
crystal load capacitors must be connected only to the USB oscillator ground pin (USB_VSSOSC). Do not
connect to board ground (VSS). The USB_VDDOSC pin can be connected to the same power supply as
USB_VDDA3P3
.
The USB on-chip oscillator can be permanently disabled, via tie-offs, if the USB peripheral is not being
used. To permanently disable the USB oscillator, connect the USB_MXI pin to ground (VSS) and leave the
USB_MXO pin unconnected. The USB oscillator power pins (USB_VDDOSC and USB_VSSOSC) should also
be connected to ground, as shown in Figure 6-8.
When using an external 12-MHz oscillator, the external oscillator clock signal should be connected to the
USB_MXI pin and the amplitude of the oscillator clock signal must meet the VIH requirement (see
Section 5.2, Recommended Operating Conditions). The USB_MXO is left unconnected and the
USB_VSSOSC signal is connected to board ground (VSS).
USB_MXI
USB_MXO
USB_VSSOSC USB_VDDOSC
VSS
USB_VDDA3P3
Crystal
12 MHz
C1
C2
3.3 V
3.3 V
Figure 6-7. 12-MHz USB Oscillator
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USB_MXI
USB_MXO
USB_VSSOSC USB_VDDOSC
VSS
USB_VDDA3P3
Figure 6-8. Connections when USB Oscillator is Permanently Disabled
The crystal should be in fundamental-mode operation, and parallel resonant, with a maximum effective
series resistance (ESR) specified in Table 6-2. The load capacitors, C1 and C2 are the total capacitance
of the circuit board and components, excluding the IC and crystal. The load capacitor value is usually
approximately twice the value of the crystal's load capacitance, CL, which is specified in the crystal
manufacturer's datasheet and should be chosen such that the equation below is satisfied. All discrete
components used to implement the oscillator circuit should be placed as close as possible to the
associated oscillator pins (USB_MXI and USB_MXO) and to the USB_VSSOSC pin.
C C
1
2
C
=
L
C
+ C
2
(
)
1
Table 6-2. Input Requirements for Crystal on the 12-MHz USB Oscillator
PARAMETER
MIN
NOM
0.100
12
MAX
UNIT
ms
Start-up time (from power up until oscillating at stable frequency of 12 MHz)(1)
10
Oscillation frequency
ESR
MHz
Ω
100
±100
5
(2)
Frequency stability
ppm
pF
Maximum shunt capacitance
Maximum crystal drive
330
μW
(1) The startup time is highly dependent on the ESR and the capacitive load of the crystal.
(2) If the USB is used, a 12-MHz, ±100-ppm crystal is recommended.
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6.5 Clock PLLs
The device DSP uses a software-programmable PLL to generate frequencies required by the CPU, DMA,
and peripherals. The reference clock for the PLL is taken from either the CLKIN pin or the RTC on-chip
oscillator (as specified through the CLK_SEL pin).
6.5.1 PLL Device-Specific Information
There is a minimum and maximum operating frequency for CLKIN, PLLOUT, and the system clock
(SYSCLK). The system clock generator must be configured not to exceed any of these constraints
documented in this section (certain combinations of external clock inputs, internal dividers, and PLL
multiply ratios are not supported).
Table 6-3. PLLC1 Clock Frequency Ranges
CVDD = 1.05 V
CVDD = 1.3 V
VDDA_PLL = 1.3 V
VDDA_PLL = 1.3 V
CLOCK SIGNAL NAME
UNIT
MIN
MAX
MIN
MAX
11.2896
12
11.2896
12
CLKIN(1)
MHz
12.288
12.288
RTC Clock
PLLIN
32.768
170
60
32.768
170
KHz
KHz
MHz
MHz
ms
32.768
32.768
PLLOUT
100
SYSCLK
0.032768
4
60
0.032768
4
100
PLL_LOCKTIME
(1) These CLKIN values are used when the CLK_SEL pin = 1.
The PLL has lock time requirements that must be followed. The PLL lock time is the amount of time
needed for the PLL to complete its phase-locking sequence.
6.5.2 Clock PLL Considerations With External Clock Sources
If the CLKIN pin is used to provide the reference clock to the PLL, to minimize the clock jitter a single
clean power supply should power both the device and the external clock oscillator circuit. The minimum
CLKIN rise and fall times should also be observed. For the input clock timing requirements, see
Section 6.5.3, Clock PLL Electrical Data/Timing (Input and Output Clocks).
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock
source must meet the device requirements in this data manual (see Section 5.3, Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Temperature, and Section 6.5.3, Clock
PLL Electrical Data/Timing (Input and Output Clocks).
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6.5.3 Clock PLL Electrical Data/Timing (Input and Output Clocks)
Table 6-4. Timing Requirements for CLKIN(1) (2) (see Figure 6-9)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
88.577,
83.333,
or
88.577,
83.333,
or
Cycle time, external clock driven on
CLKIN
1
2
tc(CLKIN)
ns
ns
81.380
81.380
0.466 *
tc(CLKIN)
0.466 *
tc(CLKIN)
tw(CLKINH) Pulse width, CLKIN high
tw(CLKINL) Pulse width, CLKIN low
0.466 *
tc(CLKIN)
0.466 *
tc(CLKIN)
3
4
ns
ns
tt(CLKIN)
Transition time, CLKIN
4
4
(1) The CLKIN frequency and PLL multiply factor should be chosen such that the resulting clock frequency is within the specific range for
CPU operating frequency.
(2) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
1
4
1
2
CLKIN
3
4
Figure 6-9. CLKIN Timing
Table 6-5. Switching Characteristics Over Recommended Operating Conditions for CLKOUT(1) (2)
(see Figure 6-10)
CVDD = 1.05 V
CVDD = 1.3 V
VDDA_PLL = 1.3 V
VDDA_PLL = 1.3 V
NO.
PARAMETER
UNIT
MIN
MAX
MIN
MAX
1
2
tc(CLKOUT)
Cycle time, CLKOUT
P
20
P
10
ns
ns
0.466 *
tc(CLKOUT)
0.466 *
tc(CLKOUT)
tw(CLKOUTH)
Pulse duration, CLKOUT high
0.466 *
tc(CLKOUT)
0.466 *
tc(CLKOUT)
3
tw(CLKOUTL)
Pulse duration, CLKOUT low
ns
4
5
tt(CLKOUTR)
tt(CLKOUTF)
Transition time (rise), CLKOUT(3)
Transition time (fall), CLKOUT(3)
5
5
5
5
ns
ns
(1) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(2) P = 1/SYSCLK clock frequency in nanoseconds (ns). For example, when SYSCLK frequency is 100 MHz, use P = 10 ns.
(3) Transition time is measured with the slew rate set to FAST and DVDDIO = 1.65 V. (For more detailed information, see the Section 4.6.6,
Output Slew Rate Control Register (OSRCR) [1C16h].).
2
5
1
CLKOUT
3
4
Figure 6-10. CLKOUT Timing
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6.6 Direct Memory Access (DMA) Controller
The DMA controller is used to move data among internal memory, external memory, and peripherals
without intervention from the CPU and in the background of CPU operation.
The DSP includes a total of four DMA controllers. Aside from the DSP resources they can access, all four
DMA controllers are identical.
The DMA controller has the following features:
•
•
Operation that is independent of the CPU.
Four channels, which allow the DMA controller to keep track of the context of four independent block
transfers.
•
•
•
•
Event synchronization. DMA transfers in each channel can be made dependent on the occurrence of
selected events.
An interrupt for each channel. Each channel can send an interrupt to the CPU on completion of the
programmed transfer.
Ping-Pong mode allows the DMA controller to keep track of double buffering context without CPU
intervention.
A dedicated clock idle domain. The four device DMA controllers can be put into a low-power state by
independently turning off their input clocks.
6.6.1 DMA Channel Synchronization Events
The DMA controllers allow activity in their channels to be synchronized to selected events. The DSP
supports 20 separate synchronization events and each channel can be tied to separate sync events
independent of the other channels. Synchronization events are selected by programming the CHnEVT
field in the DMAn channel event source registers (DMAnCESR1 and DMAnCESR2).
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6.7 Reset
The device has two main types of reset: hardware reset and software reset.
Hardware reset is responsible for initializing all key states of the device. It occurs whenever the RESET
pin is asserted or when the internal power-on-reset (POR) circuit deasserts an internal signal called
POWERGOOD. The device's internal POR is a voltage comparator that monitors the DSP_LDOO pin
voltage and generates the internal POWERGOOD signal when the DSP_LDO is enabled externally by the
DSP_LDO_EN pin. POWERGOOD is asserted when the DSP_LDOO voltage is above a minimum
threshold voltage provided by the bandgap. When the DSP_LDO is disabled (DSP_LDO_EN is high), the
internal voltage comparator becomes inactive, and the POWERGOOD signal logic level is immediately set
high. The RESET pin and the POWERGOOD signal are internally combined with a logical AND gate to
produce an (active low) hardware reset (see Figure 6-11, Power-On Reset Timing Requirements and
Figure 6-12, Reset Timing Requirements).
There are two types of software reset: the CPU's software reset instruction and the software control of the
peripheral reset signals. For more information on the CPU's software reset instruction, see the
TMS320C55x CPU 3.0 CPU Reference Guide (literature number: SWPU073). In all the device
documentation, all references to "reset" refer to hardware reset. Any references to software reset will
explicitly state software reset.
The device RTC has one additional type of reset, a power-on-reset (POR) for the registers in the RTC
core. This POR monitors the voltage of CVDDRTC and resets the RTC registers when power is first applied
to the RTC core.
6.7.1 Power-On Reset (POR) Circuits
The device includes two power-on reset (POR) circuits, one for the RTC (RTC POR) and another for the
rest of the chip (MAIN POR).
6.7.1.1 RTC Power-On Reset (POR)
The RTC POR ensures that the flip-flops in the CVDDRTC power domain have an initial state upon
powerup. In particular, the RTCNOPWR register is reset by this POR and is used to indicate that the RTC
time registers need to be initialized with the current time and date when power is first applied.
6.7.1.2 Main Power-On Reset (POR)
The device includes an analog power-on reset (POR) circuit that keeps the DSP in reset until specific
voltages have reached predetermined levels. When the DSP_LDO is enabled externally by the
DSP_LDO_EN pin, the output of the POR circuit, POWERGOOD, is held low until the following conditions
are satisfied:
•
•
•
LDOI is powered and the bandgap is active for at least approximately 8 ms
VDD_ANA is powered for at least approximately 4 ms
DSP_LDOO is above a threshold of approximately 950 mV (see Note:)
Once these conditions are met, the internal POWERGOOD signal is set high. The POWERGOOD signal
is internally combined with the RESET pin signal, via an AND-gate, to produce the DSP subsystem's
global reset. This global reset is the hardware reset for the whole chip, except the RTC. When the global
reset is deasserted (high), the boot sequence starts. For more detailed information on the boot sequence,
see Section 4.4, Boot Sequence.
When the DSP_LDO is disabled (DSP_LDO_EN pin = 1), the voltage monitoring on the DSP_LDOO pin is
de-activated and the POWERGOOD signal is immediately set high. The RESET pin will be the sole
source of hardware reset.
Note: The POR comparator has hysteresis, so the threshold voltage becomes approximately 850 mV after
POWERGOOD signal is set high.
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6.7.1.3 Reset Pin (RESET)
The device can receive an external reset signal on the RESET pin. As specified above in Section 6.7.1.2,
Main Power-On Reset, the RESET pin is combined with the internal POWERGOOD signal, that is
generated by the MAIN POR, via an AND-gate. The output of the AND gate provides the hardware reset
to the chip. The RESET pin may be tied high and the MAIN POR can provide the hardware reset in case
DSP_LDO is enabled (DSP_LDO_EN = 0), but an external hardware reset must be provided via the
RESET pin when the DSP_LDO is disabled (DSP_LDO_EN = 1).
Once the hardware reset is applied, the system clock generator is enabled and the DSP starts the boot
sequence. For more information on the boot sequence, see Section 4.4, Boot Sequence.
6.7.2 Pin Behavior at Reset
During normal operation, pins are controlled by the respective peripheral selected in the External Bus
Selection Register (EBSR) register. During power-on reset and reset, the behavior of the output pins
changes and is categorized as follows:
High Group: LCD_RS/SPI_CS3, EM_SDCAS, EM_SDRAS
•
•
•
Low Group: LCD_EN_RDB/SPI_CLK, SD0_CLK/I2S0_CLK/GP[0], SD1_CLK/I2S1_CLK/GP[6]
Z Group: EMU[1:0], SCL, SDA, LCD_D[0]/SPI_RX, LCD_D[1]/SPI_TX,
LCD_D[10]/I2S2_RX/GP[20]/SPI_RX, LCD_D[11]/I2S2_DX/GP[27]/SPI_TX,
LCD_D[12]/I2S2_RTS/GP[28]/I2S3_CLK, LCD_D[13]/I2S2_CTS/GP[29]/I2S3_RS,
LCD_D[14]/I2S2_RXD/GP[30]/I2S3_RX, LCD_D[15]/I2S2_TXD/GP[31]/I2S3_DX, LCD_D[2]/GP[12],
LCD_D[3]/GP[13], LCD_D[4]/GP[14], LCD_D[5]/GP[15], LCD_D[6]/GP[16], LCD_D[7]/GP[17],
LCD_D[8]/I2S2_CLK/GP[18]/SPI_CLK,LCD_D[9]/I2S2_FS/GP[19]/SPI_CS0, RTC_CLKOUT,
SD0_CMD/I2S0_FS/GP[1], SD0_D0/I2S0_DX/GP[2], SD0_D1/I2S0_RX/GP[3], SD0_D2/GP[4],
SD0_D3/GP[5], SD1_CMD/I2S1_FS/GP[7], SD1_D0/2S1_DX/GP[8], SD1_D1/I2S1_RX/GP[9],
SD1_D2/GP[10], SD1_D3/GP[11], TDO, WAKEUP
CLKOUT Group: CLKOUT, LCD_CS1_E1/SPI_CS1
SYNCH 0→1 Group: LCD_CS0_E0/SPI_CS0, LCD_RW_WRB/SPI_CS2, EM_SDCKE
SYNCH 0→1 Group: EM_CS0, EM_CS1
•
•
•
•
SYNCH x→1 Group: XF
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6.7.3 Reset Electrical Data/Timing
Table 6-6. Timing Requirements for Reset(1) (see Figure 6-11 and Figure 6-12)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
MAX
MIN
MAX
1
tw(RSTL)
Pulse duration, RESET low
3P
3P
ns
(1) P = 1/SYSCLK clock frequency in ns. For example, if SYSCLK = 12 MHz, use P = 83.3 ns. In IDLE3 mode the system clock generator is
bypassed and the SYSCLK frequency is equal to either CLKIN or the RTC clock frequency depending on CLK_SEL.
POWERGOOD
(Internal)
RESET
POWERGOOD and RESET
(Internal)
LOW Group
HIGH Group
Z Group
SYNCH X® 0
Group
SYNCH X® 1
Group
SYNCH 0® 1
Group
SYNCH 1® 0
Group
Valid Clock
CLKOUT
65526 + 38 clocks if CLK_SEL = 1,
32 + 38 clocks if CLK_SEL = 0
Figure 6-11. Power-On Reset Timing Requirements
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POWERGOOD
(Internal)
tw(RSTL)
RESET
POWERGOOD and RESET
(Internal)
LOW Group
HIGH Group
Z Group
SYNCH X ® 0
Group
SYNCH X ® 1
Group
SYNCH 0 ® 1
Group
SYNCH 1 ® 0
Group
Valid Clock
CLKOUT
65526 + 38 clocks if CLK_SEL = 1,
32 + 38 clocks if CLK_SEL = 0
Figure 6-12. Reset Timing Requirements
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6.8 Wake-up Events, Interrupts, and XF
The device has a number of interrupts to service the needs of its peripherals. The interrupts can be
selectively enabled or disabled.
6.8.1 Interrupts Electrical Data/Timing
Table 6-7. Timing Requirements for Interrupts(1) (see Figure 6-13)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
2P
MAX
1
2
tw(INTH)
tw(INTL)
Pulse duration, interrupt high CPU active
Pulse duration, interrupt low CPU active
ns
ns
2P
(1) P = 1/SYSCLK clock frequency in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns. For example, when the
CPU core is clocked att 120 MHz, use P = 8.3 ns.
1
INTx
2
Figure 6-13. External Interrupt Timings
6.8.2 Wake-Up From IDLE Electrical Data/Timing
Table 6-8. Timing Requirements for Wake-Up From IDLE (see Figure 6-14)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
MAX
1
tw(WKPL)
Pulse duration, WAKEUP or INTx low, SYSCLKDIS = 1
10
ns
Table 6-9. Switching Characteristics Over Recommended Operating Conditions For Wake-Up From
IDLE(1)(2)(3)(4) (see Figure 6-14)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
UNIT
MIN TYP
MAX
IDLE3 Mode with SYSCLKDIS = 1,
WAKEUP or INTx event, CLK_SEL =
1
D
ns
td(WKEVTH-C
KLGEN)
Delay time, wake-up event high to CPU
active
2
IDLE3 Mode with SYSCLKDIS = 1,
WAKEUP or INTx event, CLK_SEL =
0
C
ns
ns
IDLE2 Mode; INTx event
3P
(1) D = 1/ External Clock Frequency (CLKIN).
(2) C = 1/RTCCLK= 30.5 μs. RTCCLK is the clock output of the 32.768-kHz RTC oscillator.
(3) P = 1/SYSCLK clock frequency in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(4) Assumes the internal LDOs are used with a 0.1uF bandgap capacitor.
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2
CLKOUT
WAKEUP
INTx
1
A. INT[1:0] can only be used as a wake-up event for IDLE3 and IDLE2 modes.
B. RTC interrupt (internal signal) can be used as wake-up event for IDLE3 and IDLE2 modes.
C. Any unmasked interrupt can be used to exit the IDLE2 mode.
D. CLKOUT reflects either the CPU clock, SAR, USB PHY, or PLL clock dependent on the setting of the CLOCKOUT
Clock Source Register. For this diagram, CLKOUT refers to the CPU clock.
Figure 6-14. Wake-Up From IDLE Timings
6.8.3 XF Electrical Data/Timing
Table 6-10. Switching Characteristics Over Recommended Operating Conditions For XF(1) (2)
(see Figure 6-15)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
Delay time, CLKOUT high to XF high
UNIT
MIN
MAX
10.2 ns
1
td(XF)
0
(1) P = 1/SYSCLK clock frequency in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) C = 1/RTCCLK= 30.5 μs. RTCCLK is the clock output of the 32.768-kHz RTC oscillator.
CLKOUT(A)
1
XF
A. CLKOUT reflects either the CPU clock, SAR,USB PHY, or PLL clock dependent on the setting of the CLOCKOUT
Clock Source Register. For this diagram, CLKOUT refers to the CPU clock.
Figure 6-15. XF Timings
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6.9 Secure Digital (SD)
The device includes two SD controllers which are compliant with Secure Digital Part 1 Physical Layer
Specification V2.0 and Secure Digital Input Output (SDIO) V2.0 specifications. The SD card controller
supports these industry standards and assumes the reader is familiar with these standards.
Each SD controller in the device has the following features:
•
•
•
•
Embedded Multimedia Card/Secure Digital (eMMC/SD/HCSD/HCSD/HSSD) protocol support
Programmable clock frequency
512 bit Read/Write FIFO to lower system overhead
Slave DMA transfer capability
The SD card controller transfers data between the CPU and DMA controller on one side and the SD card
on the other side. The CPU and DMA controller can read/write the data in the card by accessing the
registers in the SD controller.
The SD controller on this device, does not support the SPI mode of operation.
6.9.1 SD Peripheral Register Description(s)
Table 6-11 and Table 6-12 shows the SD registers. The SD0 registers start at address 0x3A00 and the
SD1 registers start at address 0x3B00.
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Table 6-11. SD0 Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
3A00h
3A04h
3A08h
3A0Ch
3A10h
3A14h
3A18h
3A1Ch
3A20h
3A24h
3A28h
3A29h
3A2Ch
3A2Dh
3A30h
3A34h
3A38h
3A39h
3A3Ch
3A3Dh
3A40h
3A41h
3A44h
3A45h
3A48h
3A50h
3A64h – 3A70h
3A74h
SDCTL
SDCLK
SD Control Register
SD Memory Clock Control Register
SD Status Register 0
SDST0
SDST1
SD Status Register 1
SDIM
SD Interrupt Mask Register
SD Response Time-Out Register
SD Data Read Time-Out Register
SD Block Length Register
SD Number of Blocks Register
SD Number of Blocks Counter Register
SD Data Receive 1 Register
SD Data Receive 2 Register
SD Data Transmit 1 Register
SD Data Transmit 2 Register
SD Command Register
SDTOR
SDTOD
SDBLEN
SDNBLK
SDNBLC
SDDRR1
SDDRR2
SDDXR1
SDDXR2
SDCMD
SDARGHL
SDRSP0
SDRSP1
SDRSP2
SDRSP3
SDRSP4
SDRSP5
SDRSP6
SDRSP7
SDDRSP
SDCIDX
–
SD Argument Register
SD Response Register 0
SD Response Register 1
SD Response Register 2
SD Response Register 3
SD Response Register 4
SD Response Register 5
SD Response Register 6
SD Response Register 7
SD Data Response Register
SD Command Index Register
Reserved
SDFIFOCTL
SD FIFO Control Register
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Table 6-12. SD1 Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
3B00h
3B04h
3B08h
3B0Ch
3B10h
3B14h
3B18h
3B1Ch
3B20h
3B24h
3B28h
3B29h
3B2Ch
3B2Dh
3B30h
3B34h
3B38h
3B39h
3B3Ch
3B3Dh
3B40h
3B41h
3B44h
3B45h
3B48h
3B50h
3B74h
SDCTL
SDCLK
SD Control Register
SD Memory Clock Control Register
SD Status Register 0
SDST0
SDST1
SD Status Register 1
SDIM
SD Interrupt Mask Register
SD Response Time-Out Register
SD Data Read Time-Out Register
SD Block Length Register
SD Number of Blocks Register
SD Number of Blocks Counter Register
SD Data Receive 1 Register
SD Data Receive 2 Register
SD Data Transmit 1 Register
SD Data Transmit 2 Register
SD Command Register
SDTOR
SDTOD
SDBLEN
SDNBLK
SDNBLC
SDDRR1
SDDRR2
SDDXR1
SDDXR2
SDCMD
SDARGHL
SDRSP0
SDRSP1
SDRSP2
SDRSP3
SDRSP4
SDRSP5
SDRSP6
SDRSP7
SDDRSP
SDCIDX
SDFIFOCTL
SD Argument Register
SD Response Register 0
SD Response Register 1
SD Response Register 2
SD Response Register 3
SD Response Register 4
SD Response Register 5
SD Response Register 6
SD Response Register 7
SD Data Response Register
SD Command Index Register
SD FIFO Control Register
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6.9.2 SD Electrical Data/Timing
Table 6-13. Timing Requirements for SD (see Figure 6-16 and Figure 6-19)
CVDD = 1.3 V
FAST MODE
CVDD = 1.05 V
STD MODE
NO
.
UNIT
MIN
3
MAX
MIN
3
MAX
1
2
3
4
tsu(CMDV-CLKH)
th(CLKH-CMDV)
tsu(DATV-CLKH)
th(CLKH-DATV)
Setup time, SDx_CMD data input valid before SDx_CLK high
Hold time, SDx_CMD data input valid after SDx_CLK high
Setup time, SD_Dx data input valid before SDx_CLK high
Hold time, SD_Dx data input valid after SDx_CLK high
ns
ns
ns
ns
3
3
3
3
3
3
Table 6-14. Switching Characteristics Over Recommended Operating Conditions for SD Output(1) (see
Figure 6-16 and Figure 6-19)
CVDD = 1.3 V
FAST MODE
CVDD = 1.05 V
STD MODE
NO
.
PARAMETER
UNIT
MIN
0
MAX
50(2)
MIN
0
MAX
25(2) MHz
7
8
9
f(CLK)
Operating frequency, SDx_CLK
Identification mode frequency, SDx_CLK
Pulse width, SDx_CLK low
Pulse width, SDx_CLK high
Rise time, SDx_CLK
f(CLK_ID)
tw(CLKL)
0
400
0
400 kHz
7
10
10
ns
ns
10 tw(CLKH)
11 tr(CLK)
12 tf(CLK)
7
3
3
3
3
ns
ns
ns
ns
ns
ns
Fall time, SDx_CLK
13 td(MDCLKL-CMDIV) Delay time, SDx_CLK low to SD_CMD data output invalid
14 td(MDCLKL-CMDV) Delay time, SDx_CLK low to SD_CMD data output valid
15 td(MDCLKL-DATIV) Delay time, SDx_CLK low to SD_Dx data output invalid
-4
-4
-4.1
-4.1
4
4
5.1
5.1
16 td(MDCLKL-DATV)
Delay time, SDx_CLK low to SD_Dx data output valid
(1) For SD, the parametric values are measured at DVDDIO = 3.3 V and 2.75 V.
(2) Use this value or SYS_CLK/2 whichever is smaller.
7
9
10
SDx_CLK
13
14
VALID
SDx_CMD
Figure 6-16. SD Host Command Write Timing
9
10
7
SDx_CLK
SDx_Dx
4
4
3
Start
3
D0
D1
Dx
End
Figure 6-17. SD Card Response Timing
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9
10
7
SDx_CLK
1
2
START
XMIT
SDx_CMD
Valid
Valid
Valid
END
Figure 6-18. SD Host Write Timing
7
9
10
SDx_CLK
SDx_DAT
16
15
VALID
Figure 6-19. SD Data Write Timing
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6.10 Real-Time Clock (RTC)
The device includes a Real-Time Clock (RTC) with its own separated power supply and isolation circuits.
The separate supply and isolation circuits allow the RTC to run with the least possible power consumption,
called RTC only mode. The RTC only mode requires CVDDRTC, LDOI, and DVDDRTC power domains to be
powered, but other power domains can be shut off. See Section 6.10.1, RTC Only Mode for details. All
RTC registers are preserved (except for RTC Control and RTC Update Registers) and the counter
continues to operate when the device is powered off. The RTC also has the capability to wakeup the
device from idle states via alarms, periodic interrupts, or an external WAKEUP input. Additionally, the RTC
is able to output an alarm or periodic interrupt on the WAKEUP pin to cause external power management
to re-enable power to the DSP Core and I/O. Note: The RTC Core (CVDDRTC) must be powered properly
even though RTC is not used.
The device RTC provides the following features:
•
•
•
•
•
•
•
•
•
•
100-year calendar up to year 2099.
Counts seconds, minutes, hours, day of the week, date, month, and year with leap year compensation
Millisecond time correction
Binary-coded-decimal (BCD) representation of time, calendar, and alarm
24-hour clock mode
Second, minute, hour, day, or week alarm interrupt
Periodic interrupt: every millisecond, second, minute, hour, or day
Alarm interrupt: precise time of day
Single interrupt to the DSP CPU
32.768-kHz crystal oscillator with frequency calibration
Control of the RTC is maintained through a set of I/O memory mapped registers (see Table 6-15). Note
that any write to these registers will be synchronized to the RTC 32.768-KHz clock; thus, the CPU must
run at least 3X faster than the RTC. Writes to these registers will not be evident until the next two
32.768-KHz clock cycles later. Furthermore, if the RTC Oscillator is disabled, no RTC register can be
written to.
The RTC has its own power-on-reset (POR) circuit which resets the registers in the RTC core domain
when power is first applied to the CVDDRTC power pin. The RTC flops are not reset by the device's RESET
pin nor the digital core's POR (powergood signal).
The scratch registers in the RTC can be used to take advantage of this unique reset domain to keep track
of when the DSP boots and whether the RTC time registers have already been initialized to the current
clock time or whether the software needs to go into a routine to prompt the user to set the time/date.
6.10.1 RTC Only Mode
The maximum power saving can be achieved by using the RTC only mode. There are hardware and
software requirements to use the RTC only mode.
Hardware Requirements:
•
•
•
The DSP_LDO_EN pin must be tied to GND or pulled down to GND.
The RTC Core (CVDDRTC), RTC I/O (DVDDRTC), and LDO inputs (LDOI) must be always powered.
VDDA_ANA is recommended to be powered from the ANA_LDOO pin. (In case VDDA_ANA has to be
powered externally, then VDDA_ANA must be always powered, too.)
•
•
All other power domains can be totally shut down during the RTC only mode.
A high pulse for a minimum of one RTC clock period (30.5 µs) to the WAKEUP pin is required to wake
up the device from the RTC only mode.
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Power Down Sequence:
1. CPU must set the LDO_PD bit or the BG_PD bit in the RTCPMGT register (See Figure 4-1). Once the
LDO_PD bit or the BG_PD bit is set to 1, the DSP_LDOO will be internally shut off and it will cause the
internal POR holds the internal POWERGOOD signal low, which creates isolation for RTC.
2. All of the device power domains can be shut down except RTC Core (CVDDRTC), RTC I/O (DVDDRTC),
and LDO inputs (LDOI).
Wake-Up Sequence:
1. When waking up the device, all power domains must be turned back on before or upon applying a
pulse to WAKEUP.
2. A pulse (≥ 30.5 µs) must be applied to the WAKEUP pin (active high). When the WAKEUP pin is
asserted, the voltage on the DSP_LDOO pin will start ramping up and it is monitored by the internal
POR. Until the voltage reaches to the threshold level, the internal POR will hold the internal
POWERGOOD signal low, which provides isolation to RTC during transition period. Once the voltage
reaches to the threshold level, the internal POR asserts the internal POWERGOOD signal (logic level
high) and it resets reset of the system and disables RTC isolation and enables CPU to communicate
with RTC.
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6.10.2 RTC Peripheral Register Description(s)
Table 6-15 shows the RTC registers.
Table 6-15. Real-Time Clock (RTC) Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
1900h
1901h
1904h
1905h
1908h
1909h
190Ch
190Dh
1910h
1911h
1914h
1915h
1918h
1919h
191Ch
191Dh
1920h
1921h
1924h
1928h
192Ch
1930h
1960h
1961h
1964h
1965h
RTCINTEN
RTCUPDATE
RTCMIL
RTC Interrupt Enable Register
RTC Update Register
Milliseconds Register
RTCMILA
Milliseconds Alarm Register
Seconds Register
RTCSEC
RTCSECA
RTCMIN
Seconds Alarm Register
Minutes Register
RTCMINA
RTCHOUR
RTCHOURA
RTCDAY
Minutes Alarm Register
Hours Register
Hours Alarm Register
Days Register
RTCDAYA
RTCMONTH
RTCMONTHA
RTCYEAR
RTCYEARA
RTCINTFL
RTCNOPWR
RTCINTREG
RTCDRIFT
RTCOSC
Days Alarm Register
Months Register
Months Alarm Register
Years Register
Years Alarm Register
RTC Interrupt Flag Register
RTC Lost Power Status Register
RTC Interrupt Register
RTC Compensation Register
RTC Oscillator Register
RTC Power Management Register
RTC LSW Scratch Register 1
RTC MSW Scratch Register 2
RTC LSW Scratch Register 3
RTC MSW Scratch Register 4
RTCPMGT
RTCSCR1
RTCSCR2
RTCSCR3
RTCSCR4
6.10.2.1 RTC Electrical Data/Timing
For more detailed information on RTC electrical timings, specifically WAKEUP, see the Section 6.7.3,
Reset Electrical Data/Timing.
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6.11 Inter-Integrated Circuit (I2C)
The inter-integrated circuit (I2C) module provides an interface between the device and other devices
compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1. External
components attached to this 2-wire serial bus can transmit/receive 2 to 8-bit data to/from the DSP through
the I2C module. The I2C port does not support CBUS compatible devices.
The I2C port supports the following features:
•
•
•
•
•
•
•
•
Compatible with Philips I2C Specification Revision 2.1 (January 2000)
Data Transfer Rate from 10 kbps to 400 kbps (Philips Fast-Mode Rate)
Noise Filter to Remove Noise 50 ns or Less
Seven- and Ten-Bit Device Addressing Modes
Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
One Read DMA Event and One Write DMA Event, which can be used by the DMA Controller
One Interrupt that can be used by the CPU
Slew-Rate Limited Open-Drain Output Buffers
The I2C module clock must be in the range from 6.7 MHz to 13.3 MHz. This is necessary for proper
operation of the I2C module. With the I2C module clock in this range, the noise filters on the SDA and
SCL pins suppress noise that has a duration of 50 ns or shorter. The I2C module clock is derived from the
DSP clock divided by a programmable prescaler.
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6.11.1 I2C Peripheral Register Description(s)
Table 6-16 shows the Inter-Integrated Circuit (I2C) registers.
Table 6-16. Inter-Integrated Circuit (I2C) Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
1A00h
1A04h
1A08h
1A0Ch
1A10h
1A14h
1A18h
1A1Ch
1A20h
1A24h
1A28h
1A2Ch
1A30h
1A34h
1A38h
ICOAR
ICIMR
I2C Own Address Register
I2C Interrupt Mask Register
I2C Interrupt Status Register
ICSTR
ICCLKL
ICCLKH
ICCNT
ICDRR
ICSAR
ICDXR
ICMDR
ICIVR
I2C Clock Low-Time Divider Register
I2C Clock High-Time Divider Register
I2C Data Count Register
I2C Data Receive Register
I2C Slave Address Register
I2C Data Transmit Register
I2C Mode Register
I2C Interrupt Vector Register
I2C Extended Mode Register
I2C Prescaler Register
ICEMDR
ICPSC
ICPID1
ICPID2
I2C Peripheral Identification Register 1
I2C Peripheral Identification Register 2
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6.11.2 I2C Electrical Data/Timing
Table 6-17. Timing Requirements for I2C Timings(1) (see Figure 6-20)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
STANDARD
MODE
UNIT
FAST MODE
MIN
MAX
MIN
MAX
1
2
tc(SCL)
Cycle time, SCL
10
2.5
µs
µs
Setup time, SCL high before SDA low (for a repeated START
condition)
tsu(SCLH-SDAL)
4.7
4
0.6
0.6
Hold time, SCL low after SDA low (for a START and a
repeated START condition)
3
th(SCLL-SDAL)
µs
4
5
6
7
tw(SCLL)
tw(SCLH)
Pulse duration, SCL low
Pulse duration, SCL high
4.7
4
1.3
0.6
100(2)
µs
µs
ns
µs
tsu(SDAV-SCLH) Setup time, SDA valid before SCL high
250
0(3)
th(SDA-SCLL)
Hold time, SDA valid after SCL low
0(3) 0.9(4)
Pulse duration, SDA high between STOP and START
conditions
8
tw(SDAH)
4.7
1.3
µs
(6)
(6)
(6)
(6)
9
tr(SDA)
tr(SCL)
tf(SDA)
tf(SCL)
Rise time, SDA(5)
Rise time, SCL(5)
Fall time, SDA(5)
Fall time, SCL(5)
1000 20 + 0.1Cb
1000 20 + 0.1Cb
300 20 + 0.1Cb
300 20 + 0.1Cb
300
300
300
300
ns
ns
ns
ns
µs
ns
pF
10
11
12
13
14
15
tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition)
4
0.6
0
tw(SP)
Pulse duration, spike (must be suppressed)
Capacitive load for each bus line
50
(6)
Cb
400
400
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down. Also these pins are not 3.6 V-tolerant (their VIH cannot go above DVDDIO + 0.3 V).
(2) A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be
met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH)= 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
(3) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
(4) The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
(5) The rise/fall times are measured at 30% and 70% of DVDDIO. The fall time is only slightly influenced by the external bus load (Cb) and
external pullup resistor. However, the rise time (tr) is mainly determined by the bus load capacitance and the value of the pullup resistor.
The pullup resistor must be selected to meet the I2C rise and fall time values specified.
(6) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
11
9
SDA
SCL
6
8
14
4
13
5
10
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 6-20. I2C Receive Timings
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Table 6-18. Switching Characteristics for I2C Timings(1) (see Figure 6-21)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
STANDARD
MODE
UNIT
FAST MODE
MIN
MAX
MIN
MAX
16
17
tc(SCL)
td(SCLH-SDAL)
td(SDAL-SCLL)
Cycle time, SCL
10
2.5
µs
µs
Delay time, SCL high to SDA low (for a repeated START
condition)
4.7
4
0.6
0.6
Delay time, SDA low to SCL low (for a START and a
repeated START condition)
18
µs
19
20
21
22
tw(SCLL)
tw(SCLH)
Pulse duration, SCL low
Pulse duration, SCL high
4.7
4
1.3
0.6
100
0
µs
µs
ns
µs
td(SDAV-SCLH) Delay time, SDA valid to SCL high
250
0
tv(SCLL-SDAV)
Valid time, SDA valid after SCL low
0.9
Pulse duration, SDA high between STOP and START
conditions
23
tw(SDAH)
4.7
1.3
µs
Rise time, SDA(2)
Rise time, SCL(2)
Fall time, SDA(2)
Fall time, SCL(2)
1000 20 + 0.1Cb
1000 20 + 0.1Cb
300 20 + 0.1Cb
300 20 + 0.1Cb
300
300
300
300
ns
ns
ns
ns
µs
pF
(1)
(1)
(1)
(1)
24
25
26
27
28
29
tr(SDA)
tr(SCL)
tf(SDA)
tf(SCL)
td(SCLH-SDAH) Delay time, SCL high to SDA high (for STOP condition)
Cp Capacitance for each I2C pin
4
0.6
10
10
(1) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
(2) The rise/fall times are measured at 30% and 70% of DVDDIO. The fall time is only slightly influenced by the external bus load (Cb) and
external pullup resistor. However, the rise time (tr) is mainly determined by the bus load capacitance and the value of the pullup resistor.
The pullup resistor must be selected to meet the I2C rise and fall time values specified.
26
24
SDA
SCL
21
23
19
28
20
25
16
18
27
18
17
22
Stop
Start
Repeated
Start
Stop
Figure 6-21. I2C Transmit Timings
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6.12 Universal Asynchronous Receiver/Transmitter (UART)
The UART performs serial-to-parallel conversions on data received from an external peripheral device and
parallel-to-serial conversions on data transmitted to an external peripheral device via a serial bus.
The device has one UART peripheral with the following features:
•
•
Programmable baud rates (frequency pre-scale values from 1 to 65535)
Fully programmable serial interface characteristics:
–
–
–
5, 6, 7, or 8-bit characters
Even, odd, or no PARITY bit generation and detection
1, 1.5, or 2 STOP bit generation
•
16-byte depth transmitter and receiver FIFOs:
–
–
The UART can be operated with or without the FIFOs
1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA
•
•
•
•
•
DMA signaling capability for both received and transmitted data
CPU interrupt capability for both received and transmitted data
False START bit detection
Line break generation and detection
Internal diagnostic capabilities:
–
–
Loopback controls for communications link fault isolation
Break, parity, overrun, and framing error simulation
•
Programmable autoflow control using CTS and RTS signals
6.12.1 UART Peripheral Register Description(s)
Table 6-19 shows the UART registers.
Table 6-19. UART Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
1B00h
1B00h
1B02h
1B04h
1B04h
1B06h
1B08h
1B0Ah
1B0Ch
1B0Eh
1B10h
1B12h
1B18h
RBR
Receiver Buffer Register (read only)
Transmitter Holding Register (write only)
Interrupt Enable Register
THR
IER
IIR
Interrupt Identification Register (read only)
FIFO Control Register (write only)
Line Control Register
FCR
LCR
MCR
Modem Control Register
LSR
Line Status Register
MSR
SCR
Modem Status Register
Scratch Register
DLL
Divisor LSB Latch
DLH
Divisor MSB Latch
PWREMU_MGMT
Power and Emulation Management Register
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6.12.2 UART Electrical Data/Timing [Receive/Transmit]
Table 6-20. Timing Requirements for UART Receive(1)(2) (see Figure 6-22)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
U - 3.5
U - 3.5
MAX
MIN
U - 3.5
U - 3.5
MAX
4
5
tw(URXDB)
tw(URXSB)
Pulse duration, receive data bit (UART_RXD) [15/30/100 pF]
Pulse duration, receive start bit [15/30/100 pF]
U + 3
U + 3
U + 3
U + 3
ns
ns
(1) U = UART baud time = 1/programmed baud rate.
(2) These parametric values are measured at DVDDIO = 3.3 V, 2.75 V, and 2.5 V
Table 6-21. Switching Characteristics Over Recommended Operating Conditions for UART Transmit(1) (2)
(see Figure 6-22)
CVDD = 1.05 V
CVDD = 1.3V
MIN MAX
6.25 MHz
NO.
PARAMETER
UNIT
MIN
MAX
3.75
1
2
3
f(baud)
Maximum programmable bit rate
tw(UTXDB)
tw(UTXSB)
Pulse duration, transmit data bit (UART_TXD) [15/30/100 pF]
Pulse duration, transmit start bit [15/30/100 pF]
U - 3.5
U - 3.5
U + 4
U + 4
U - 3.5
U - 3.5
U + 4
U + 4
ns
ns
(1) U = UART baud time = 1/programmed baud rate.
(2) These parametric values are measured at DVDDIO = 3.3 V, 2.75 V, and 2.5 V
3
2
Start
Bit
UART_TXD
Data Bits
5
4
Start
Bit
UART_RXD
Data Bits
Figure 6-22. UART Transmit/Receive Timing
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6.13 Inter-IC Sound (I2S)
The device I2S peripherals allow serial transfer of full-duplex streaming data, usually audio data, between
the device and an external I2S peripheral device such as an audio codec.
The device supports 4 independent dual-channel I2S peripherals, each with the following features:
•
•
•
•
•
•
•
•
Full-duplex (transmit and receive) dual-channel communication
Double buffered data registers that allow for continuous data streaming
I2S/Left-justified and DSP data format with a data delay of 1 or 2 bits
Data word-lengths of 8, 10, 12, 14, 16, 18, 20, 24, or 32 bits
Ability to sign-extend received data samples for easy use in signal processing algorithms
Programmable polarity for both frame synchronization and bit clocks
Stereo (in I2S/Left-justified or DSP data formats) or mono (in DSP data format) mode
Detection of over-run, under-run, and frame-sync error conditions
6.13.1 I2S Peripheral Register Description(s)
Table 6-22 through Table 6-25 show the I2S0 through I2S3 registers.
Table 6-22. I2S0 Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
RANGE
2800h
2804h
2808h
2809h
280Ch
280Dh
2810h
2814h
2828h
2829h
282Ch
282Dh
I2S0SCTRL
I2S0SRATE
I2S0TXLT0
I2S0TXLT1
I2S0TXRT0
I2S0TXRT1
I2S0INTFL
I2S0 Serializer Control Register
I2S0 Sample Rate Generator Register
I2S0 Transmit Left Data 0 Register
I2S0 Transmit Left Data 1 Register
I2S0 Transmit Right Data 0 Register
I2S0 Transmit Right Data 1 Register
I2S0 Interrupt Flag Register
I2S0INTMASK
I2S0RXLT0
I2S0RXLT1
I2S0RXRT0
I2S0RXRT1
I2S0 Interrupt Mask Register
I2S0 Receive Left Data 0 Register
I2S0 Receive Left Data 1 Register
I2S0 Receive Right Data 0 Register
I2S0 Receive Right Data 1 Register
Table 6-23. I2S1 Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
2900h
2904h
2908h
2909h
290Ch
290Dh
2910h
2914h
2928h
2929h
292Ch
292Dh
I2S1SCTRL
I2S1SRATE
I2S1TXLT0
I2S1TXLT1
I2S1TXRT0
I2S1TXRT1
I2S1INTFL
I2S1 Serializer Control Register
I2S1 Sample Rate Generator Register
I2S1 Transmit Left Data 0 Register
I2S1 Transmit Left Data 1 Register
I2S1 Transmit Right Data 0 Register
I2S1 Transmit Right Data 1 Register
I2S1 Interrupt Flag Register
I2S1INTMASK
I2S1RXLT0
I2S1RXLT1
I2S1RXRT0
I2S1RXRT1
I2S1 Interrupt Mask Register
I2S1 Receive Left Data 0 Register
I2S1 Receive Left Data 1 Register
I2S1 Receive Right Data 0 Register
I2S1 Receive Right Data 1 Register
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Table 6-24. I2S2 Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
2A00h
2A04h
2A08h
2A09h
2A0Ch
2A0Dh
2A10h
2A14h
2A28h
2A29h
2A2Ch
2A2Dh
I2S2SCTRL
I2S2SRATE
I2S2TXLT0
I2S2TXLT1
I2S2TXRT0
I2S2TXRT1
I2S2INTFL
I2S2 Serializer Control Register
I2S2 Sample Rate Generator Register
I2S2 Transmit Left Data 0 Register
I2S2 Transmit Left Data 1 Register
I2S2 Transmit Right Data 0 Register
I2S2 Transmit Right Data 1 Register
I2S2 Interrupt Flag Register
I2S2INTMASK
I2S2RXLT0
I2S2RXLT1
I2S2RXRT0
I2S2RXRT1
I2S2 Interrupt Mask Register
I2S2 Receive Left Data 0 Register
I2S2 Receive Left Data 1 Register
I2S2 Receive Right Data 0 Register
I2S2 Receive Right Data 1 Register
Table 6-25. I2S3 Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
2B00h
2B04h
2B08h
2B09h
2B0Ch
2B0Dh
2B10h
2B14h
2B28h
2B29h
2B2Ch
2B2Dh
I2S3SCTRL
I2S3SRATE
I2S3TXLT0
I2S3TXLT1
I2S3TXRT0
I2S3TXRT1
I2S3INTFL
I2S3 Serializer Control Register
I2S3 Sample Rate Generator Register
I2S3 Transmit Left Data 0 Register
I2S3 Transmit Left Data 1 Register
I2S3 Transmit Right Data 0 Register
I2S3 Transmit Right Data 1 Register
I2S3 Interrupt Flag Register
I2S3INTMASK
I2S3RXLT0
I2S3RXLT1
I2S3RXRT0
I2S3RXRT1
I2S3 Interrupt Mask Register
I2S3 Receive Left Data 0 Register
I2S3 Receive Left Data 1 Register
I2S3 Receive Right Data 0 Register
I2S3 Receive Right Data 1 Register
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6.13.2 I2S Electrical Data/Timing
Table 6-26. Timing Requirements for I2S [I/O = 3.3 V, 2.75 V, and 2.5 V](1) (see Figure 6-23)
MASTER
CVDD = 1.05 V CVDD = 1.3 V
MIN MAX
SLAVE
NO.
CVDD = 1.05 V
MIN MAX
CVDD = 1.3 V
MIN MAX
UNIT
MIN MAX
40 or
40 or
1
tc(CLK)
Cycle time, I2S_CLK
40 or 2P(1)(2)
40 or 2P(1)(2)
ns
2P(1)(2)
2P(1)(2)
2
3
tw(CLKH)
tw(CLKL)
Pulse duration, I2S_CLK high
Pulse duration, I2S_CLK low
20
20
20
20
20
20
20
20
ns
ns
Setup time, I2S_RX valid before I2S CLK high
(CLKPOL = 0)
tsu(RXV-CLKH)
tsu(RXV-CLKL)
th(CLKH-RXV)
th(CLKL-RXV)
tsu(FSV-CLKH)
tsu(FSV-CLKL)
th(CLKH-FSV)
th(CLKL-FSV)
5
5
3
3
–
–
–
–
5
5
3
3
–
–
–
–
5
5
5
ns
ns
ns
ns
ns
ns
ns
ns
7
8
Setup time, I2S_RX valid before I2S_CLK low
(CLKPOL = 1)
5
Hold time, I2S_RX valid after I2S_CLK high
(CLKPOL = 0)
3
3
Hold time, I2S_RX valid after I2S_CLK low
(CLKPOL = 1)
3
15
3
Setup time, I2S_FS valid before I2S_CLK high
(CLKPOL = 0)
15
15
9
Setup time, I2S_FS valid before I2S_CLK low
(CLKPOL = 1)
15
Hold time, I2S_FS valid after I2S_CLK high
(CLKPOL = 0)
tw(CLKH) + 0.6(3)
tw(CLKL) + 0.6(3)
tw(CLKH) + 0.6(3)
tw(CLKL) + 0.6(3)
10
Hold time, I2S_FS valid after I2S_CLK low
(CLKPOL = 1)
(1) P = SYSCLK period in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) Use whichever value is greater.
(3) In Slave Mode, I2S_FS is required to be latched on both edges of I2S input clock (I2S_CLK).
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Table 6-27. Timing Requirements for I2S [I/O = 1.8 V](1) (see Figure 6-23)
MASTER
SLAVE
NO.
CVDD = 1.05 V
CVDD = 1.3 V
CVDD = 1.05 V
MIN
CVDD = 1.3 V
MIN MAX
UNIT
MIN
MAX
MIN
MAX
MAX
50 or 2P(1)
40 or 2P(1)
1
tc(CLK)
Cycle time, I2S_CLK
50 or 2P(1) (2)
40 or 2P(1) (2)
ns
(2)
(2)
2
3
tw(CLKH)
tw(CLKL)
Pulse duration, I2S_CLK high
Pulse duration, I2S_CLK low
25
25
20
20
25
25
20
20
ns
ns
Setup time, I2S_RX valid before I2S CLK
high (CLKPOL = 0)
tsu(RXV-CLKH)
tsu(RXV-CLKL)
th(CLKH-RXV)
th(CLKL-RXV)
tsu(FSV-CLKH)
tsu(FSV-CLKL)
th(CLKH-FSV)
th(CLKL-FSV)
5
5
3
3
–
–
–
–
5
5
3
3
–
–
–
–
5
5
5
5
ns
ns
ns
ns
ns
ns
ns
ns
7
8
Setup time, I2S_RX valid before I2S_CLK
low (CLKPOL = 1)
Hold time, I2S_RX valid after I2S_CLK high
(CLKPOL = 0)
3
3
Hold time, I2S_RX valid after I2S_CLK low
(CLKPOL = 1)
3
3
Setup time, I2S_FS valid before I2S_CLK
high (CLKPOL = 0)
15
15
15
15
9
Setup time, I2S_FS valid before I2S_CLK
low (CLKPOL = 1)
Hold time, I2S_FS valid after I2S_CLK high
(CLKPOL = 0)
tw(CLKH)
+
tw(CLKH)
+
0.6(3)
0.6(3)
10
Hold time, I2S_FS valid after I2S_CLK low
(CLKPOL = 1)
tw(CLKL)
+
tw(CLKL)
+
0.6(3)
0.6(3)
(1) P = SYSCLK period in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) Use whichever value is greater.
(3) In Slave Mode, I2S_FS is required to be latched on both edges of I2S input clock (I2S_CLK).
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Table 6-28. Switching Characteristics Over Recommended Operating Conditions for I2S Output
[I/O = 3.3 V, 2.75 V, or 2.5 V] (see Figure 6-23)
MASTER
SLAVE
CVDD = 1.05 V
MIN MAX
NO.
PARAMETER
CVDD = 1.05 V
MIN MAX
CVDD = 1.3 V
MIN MAX
CVDD = 1.3 V
MIN MAX
UNIT
40 or
40 or
40 or
40 or
1
2
tc(CLK)
Cycle time, I2S_CLK
ns
2P(1) (2)
20
2P(1) (2)
20
2P(1) (2)
2P(1) (2)
tw(CLKH)
Pulse duration, I2S_CLK high (CLKPOL = 0)
20
20
20
20
0
20
20
20
20
0
ns
ns
ns
ns
tw(CLKL)
Pulse duration, I2S_CLK low (CLKPOL = 1)
20
20
tw(CLKL)
Pulse duration, I2S_CLK low (CLKPOL = 0)
20
20
3
4
5
tw(CLKH)
Pulse duration, I2S_CLK high (CLKPOL = 1)
20
20
tdmax(CLKL-DXV)
tdmax(CLKH-DXV)
tdmax(CLKL-FSV)
tdmax(CLKH-FSV)
Output Delay time, I2S_CLK low to I2S_DX valid (CLKPOL = 0)
Output Delay time, I2S_CLK high to I2S_DX valid (CLKPOL = 1)
Delay time, I2S_CLK low to I2S_FS valid (CLKPOL = 0)
Delay time, I2S_CLK high to I2S_FS valid (CLKPOL = 1)
0
15
0
14
15
15
ns
ns
ns
ns
0
15
14
14
0
14
14
14
0
15
–
0
15
–
-1.1
-1.1
-1.1
-1.1
–
–
(1) P = SYSCLK period in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) Use whichever value is greater.
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Table 6-29. Switching Characteristics Over Recommended Operating Conditions for I2S Output
[I/O = 1.8 V] (see Figure 6-23)
MASTER
CVDD = 1.05 V CVDD = 1.3 V
MIN MAX MIN MAX
SLAVE
CVDD = 1.05 V
MIN MAX
NO.
PARAMETER
CVDD = 1.3 V
MIN MAX
UNIT
50 or
40 or
50 or
40 or
1
2
tc(CLK)
Cycle time, I2S_CLK
ns
2P(1) (2)
25
2P(1) (2)
20
2P(1) (2)
2P(1) (2)
tw(CLKH)
Pulse duration, I2S_CLK high (CLKPOL = 0)
25
25
25
25
0
20
20
20
20
0
ns
ns
ns
ns
ns
ns
ns
ns
tw(CLKL)
Pulse duration, I2S_CLK low (CLKPOL = 1)
25
20
tw(CLKL)
Pulse duration, I2S_CLK low (CLKPOL = 0)
25
20
3
4
5
tw(CLKH)
Pulse duration, I2S_CLK high (CLKPOL = 1)
25
20
tdmax(CLKL-DXV)
tdmax(CLKH-DXV)
tdmax(CLKL-FSV)
tdmax(CLKH-FSV)
Output Delay time, I2S_CLK low to I2S_DX valid (CLKPOL = 0)
Output Delay time, I2S_CLK high to I2S_DX valid (CLKPOL = 1)
Delay time, I2S_CLK low to I2S_FS valid (CLKPOL = 0)
Delay time, I2S_CLK high to I2S_FS valid (CLKPOL = 1)
0
19
0
14
14
14
14
19
16.5
16.5
–
0
19
14
14
0
0
19
–
0
-1.1
-1.1
-1.1
-1.1
–
–
(1) P = SYSCLK period in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) Use whichever value is greater.
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1
3
2
I2S_CLK
(CLKPOL = 0)
I2S_CLK
(CLKPOL = 1)
5
I2S_FS
(Output, MODE = 1)
9
10
I2S_FS
(Input, MODE = 0)
4
I2S_DX
7
8
I2S_RX
Figure 6-23. I2S Input and Output Timings
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6.14 Liquid Crystal Display Controller (LCDC) — C5535 Only
The device includes a LCD Interface Display Driver (LIDD) controller.
The LIDD Controller supports the asynchronous LCD interface and has the following features:
•
Provides full-timing programmability of control signals and output data
Note: Raster mode is not supported on this device.
The LCD controller is responsible for generating the correct external timing. The DMA engine provides a
constant flow of data from the frame buffer(s) to the external LCD panel via the LIDD controller. In
addition, CPU access is provided to read and write registers.
6.14.1 LCDC Peripheral Register Description(s)
Table 6-30 shows the LCDC peripheral registers.
Table 6-30. LCD Controller Registers
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
2E00h
2E01h
LCDREVMIN
LCDREVMAJ
LCD Minor Revision Register
LCD Major Revision Register
LCD Control Register
2E04h
LCDCR
2E08h
LCDSR
LCD Status Register
2E0Ch
2E10h
LCDLIDDCR
LCD LIDD Control Register
LCDLIDDCS0CONFIG0
LCDLIDDCS0CONFIG1
LCDLIDDCS0ADDR
LCDLIDDCS0DATA
LCDLIDDCS1CONFIG0
LCDLIDDCS1CONFIG1
LCDLIDDCS1ADDR
LCDLIDDCS1DATA
—
LCD LIDD CS0 Configuration Register 0
LCD LIDD CS0 Configuration Register 1
LCD LIDD CS0 Address Read/Write Register
LCD LIDD CS0 Data Read/Write Register
LCD LIDD CS1 Configuration Register 0
LCD LIDD CS1 Configuration Register 1
LCD LIDD CS1 Address Read/Write Register
LCD LIDD CS1 Data Read/Write Register
Reserved
2E11h
2E14h
2E18h
2E1Ch
2E1Dh
2E20h
2E24h
2E28h – 2E3Ah
2E40h
LCDDMACR
LCD DMA Control Register
2E44h
LCDDMAFB0BAR0
LCDDMAFB0BAR1
LCDDMAFB0CAR0
LCDDMAFB0CAR1
LCDDMAFB1BAR0
LCDDMAFB1BAR1
LCDDMAFB1CAR0
LCDDMAFB1CAR1
LCD DMA Frame Buffer 0 Base Address Register 0
LCD DMA Frame Buffer 0 Base Address Register 1
LCD DMA Frame Buffer 0 Ceiling Address Register 0
LCD DMA Frame Buffer 0 Ceiling Address Register 1
LCD DMA Frame Buffer 1 Base Address Register 0
LCD DMA Frame Buffer 1 Base Address Register 1
LCD DMA Frame Buffer 1 Ceiling Address Register 0
LCD DMA Frame Buffer 1 Ceiling Address Register 1
2E45h
2E48h
2E49h
2E4Ch
2E4Dh
2E50h
2E51h
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6.14.2 LCDC Electrical Data/Timing
Table 6-31. Timing Requirements for LCD LIDD Mode(1) (see Figure 6-24 through Figure 6-31)
CVDD = 1.05 V
MIN MAX
CVDD = 1.3 V
MAX
NO.
UNIT
MIN
Setup time, LCD_D[15:0] valid
before LCD_CLK rising edge
16 tsu(LCD_D-CLK)
17 th(CLK-LCD_D)
27
0
42
ns
ns
Hold time, LCD_D[15:0] valid after
LCD_CLK rising edge
0
(1) Over operating free-air temperature range (unless otherwise noted)
Table 6-32. Switching Characteristics Over Recommended Operating Conditions for LCD LIDD Mode (see
Figure 6-24 through Figure 6-31)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
UNIT
MIN
MAX
MIN
MAX
Delay time, LCD_CLK rising edge
to LCD_D[15:0] valid (write)
4
5
6
7
8
9
td(LCD_D_V)
td(LCD_D_I)
td(LCD_E_A)
td(LCD_E_I)
td(LCD_A_A)
td(LCD_A_I)
5
5
5
5
5
5
7
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Delay time, LCD_CLK rising edge
to LCD_D[15:0] invalid (write)
-6
-6
Delay time, LCD_CLK rising edge
to LCD_CSx_Ex low
7
7
7
7
7
Delay time, LCD_CLKrising edge
to LCD_CSx_Ex high
-6
-6
-6
-6
-6
-6
-6
-6
-6
-6
Delay time, LCD_CLKrising edge
to LCD_RS low
Delay time, LCD_CLK rising edge
to LCD_RS high
Delay time, LCD_CLK rising edge
to LCD_RW_WRB low
10 td(LCD_W_A)
11 td(LCD_W_I)
12 td(LCD_STRB_A)
13 td(LCD_STRB_I)
14 td(LCD_D_Z)
15 td(Z_LCD_D)
Delay time, LCD_CLK rising edge
to LCD_RW_WRB high
Delay time, LCD_CLK rising edge
to LCD_EN_RDB high
Delay time, LCD_CLK rising edge
to LCD_EN_RDB low
Delay time, LCD_CLK rising edge
to LCD_D[15:0] in 3-state
Delay time, LCD_CLK rising edge
to LCD_D[15:0] valid from 3-state
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CS_DELAY
(0 to 3)
R_SU
(0 to 31)
R_HOLD
(1 to 15)
W_SU
(0 to 31)
W_STROBE
(1 to 63)
CS_DELAY
(0 to 3)
R_STROBE
(1 to 63)
W_HOLD
(1 to 15)
LCD_CLK
[Internal]
4
5
14
17
16
15
LCD_D[15:0]
Write Data
Data[7:0]
Read Status
8
9
LCD_RS
RS
10
11
LCD_RW_WRB
R/W
12
12
13
13
E0
E1
LCD_CSx_Ex
Figure 6-24. Character Display HD44780 Write
W_HOLD
(1–15)
R_SU
(0–31)
R_STROBE R_HOLD CS_DELAY
(1–63) (1–5) (0-3)
W_SU
(0–31)
W_STROBE
(1–63)
CS_DELAY
(0 - 3)
LCD_CLK
[Internal]
4
17
15
5
14
16
LCD_D[7:0]
Data[7:0]
Write Instruction
Read
Data
8
9
RS
LCD_RS
10
11
LCD_RW_WRB
R/W
12
13
13
12
E0
E1
LCD_CSx_Ex
Figure 6-25. Character Display HD44780 Read
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W_HOLD
(1-15)
W_HOLD
(1-15)
W_SU
(0-31)
W_STROBE
(1-63)
CS_DELAY
(0-3)
W_SU
(0-31)
W_STROBE
(1-63)
CS_DELAY
(0-3)
LCD_CLK
[Internal]
4
6
5
7
5
4
LCD_D[15:0]
Write Address
Write Data
Data[15:0]
6
7
LCD_CSx_Ex
(async mode)
CS0
CS1
9
8
RS
R/W
EN
LCD_RS
10
11
10
11
LCD_RW_WRB
LCD_EN_RDB
12
13
12
13
Figure 6-26. Micro-Interface Graphic Display 6800 Write
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W_HOLD
(1-15)
R_SU
(0-31)
W_SU
(0-31)
W_STROBE
(1-63)
CS_DELAY
(0-3)
R_STROBE R_HOLD CS_DELAY
(1-63
(0-3)
(1-15)
LCD_CLK
[Internal]
14
4
5
16
15
Data[15:0]
17
LCD_D[15:0]
Write Address
Read
Data
6
6
7
7
LCD_CSx_Ex
(Async Mode)
CS0
CS1
8
9
11
LCD_RS
LCD_RW_WRB
LCD_EN_RDB
RS
R/W
EN
10
12
13
12
13
Figure 6-27. Micro-Interface Graphic Display 6800 Read
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R_SU
(0-31)
R_SU
(0-31)
R_STROBE R_HOLD CS_DELAY
R_HOLD CS_DELAY
R_STROBE
(1-63)
(1-63)
(1-15)
(0-3)
(1-15)
(0-3)
LCD_CLK
[Internal]
14
16
17
15
7
14
16
17
15
LCD_D[15:0]
Data[15:0]
Read
Status
Read
Data
6
8
6
7
LCD_CSx_Ex
(Async Mode)
CS0
CS1
9
LCD_RS
RS
R/W
EN
LCD_RW_WRB
13
12
12
13
LCD_EN_RDB
Figure 6-28. Micro-Interface Graphic Display 6800 Status
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W_HOLD
(1-15)
W_HOLD
(1-15)
W_SU
(0-31)
W_STROBE
CS_DELAY
(0-3)
W_SU
(0-31)
W_STROBE
(1-63)
CS_DELAY
(0 - 3)
(1-63)
LCD_CLK
[Internal]
4
5
4
5
LCD_D[15:0]
Write Address
Write Data
7
6
6
8
7
LCD_CSx_Ex
(Async Mode)
CS0
CS1
9
LCD_RS
LCD_RW_WRB
LCD_EN_RDB
RS
WRB
RDB
11
10
10
11
Figure 6-29. Micro-Interface Graphic Display 8080 Write
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W_HOLD
(1-15)
R_SU
(0-31)
W_SU
(0-31)
W_STROBE
(1-63)
CS_DELAY
(0-3)
R_STROBE
(1-63)
R_HOLD CS_DELAY
(1-15) (0-3)
LCD_CLK
[Internal]
4
5
16
17
15
Data[15:0]
14
6
LCD_D[15:0]
Write Address
Read
Data
7
6
7
LCD_CSx_Ex
(async mode)
CS0
CS1
9
8
LCD_RS
LCD_RW_WRB
LCD_EN_RDB
RS
11
10
WRB
12
13
RDB
Figure 6-30. Micro-Interface Graphic Display 8080 Read
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R_SU
(0-31)
R_SU
(0-31)
R_STROBE R_HOLD CS_DELAY
R_STROBE R_HOLD
CS_DELAY
(0-3)
(1-15)
(1-63)
(1-63)
(1-15)
(0-3)
LCD_CLK
[Internal]
17
16
17
15
14
6
16
15
14
Data[15:0]
LCD_D[15:0]
Read Data
Read Status
7
6
7
9
LCD_CSx_Ex
CS0
CS1
8
RS
LCD_RS
WRB
RDB
LCD_RW_WRB
12
13
13
12
LCD_PCLK
Figure 6-31. Micro-Interface Graphic Display 8080 Status
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6.15 10-Bit SAR ADC — C5535 Only
The device includes a 10-bit SAR ADC using a switched capacitor architecture which converts an analog
input signal to a digital value at a maximum rate of 62.5-k samples per second (ksps) for use by the DSP.
This SAR module supports six channels that are connected to four general purpose analog pins (GPAIN
[3:0]) which can be used as general purpose outputs.
The device SAR supports the following features:
•
•
•
•
•
Up to 62.5 ksps (2-MHz clock with 32 cycles per conversion)
Single conversion and continuous back-to-back conversion modes
Interrupt driven or polling conversion or DMA event generation
Internal configurable bandgap reference voltages of 1 V or 0.8 V; or external Vref of VDDA_ANA
One 3.6-V Tolerant analog input (GPAIN0) with internal voltage division for conversion of battery
voltage
•
•
Software controlled power down
Individually configurable general-purpose digital outputs
6.15.1 SAR ADC Peripheral Register Description(s)
Table 6-33 shows the SAR ADC peripheral registers.
Table 6-33. SAR Analog Control Registers
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
7012h
7014h
7016h
7018h
701Ah
SARCTRL
SARDATA
SAR A/D Control Register
SAR A/D Data Register
SARCLKCTRL
SARPINCTRL
SARGPOCTRL
SAR A/D Clock Control Register
SAR A/D Reference and Pin Control Register
SAR A/D GPO Control Register
6.15.2 SAR ADC Electrical Data/Timing
Table 6-34. Switching Characteristics Over Recommended Operating Conditions for ADC Characteristics
CVDD = 1.3 V
CVDD = 1.05 V
NO.
PARAMETER
UNIT
MIN
TYP
MAX
2
1
3
4
5
6
7
8
9
tC(SCLC)
td(CONV)
SDNL
SINL
Cycle time, ADC internal conversion clock
Delay time, ADC conversion time
Static differential non-linearity error (DNL measured for 9 bits)
Static integral non-linearity error
MHz
ns
32tC(SCLC)
±0.6
±1
LSB
LSB
LSB
LSB
MΩ
dB
Zset
Zero-scale offset error (INL measured for 9 bits)
Full-scale offset error
2
2
Fset
Analog input impedance
1
Signal-to-noise ratio
54
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6.16 Serial Port Interface (SPI)
The device serial port interface (SPI) is a high-speed synchronous serial input/output port that allows a
serial bit stream of programmed length (1 to 32 bits) to be shifted into and out of the device at a
programmed bit-transfer rate. The SPI supports multi-chip operation of up to four SPI slave devices. The
SPI can operate as a master device only, slave mode is not supported. Note: The SPI is not supported by
the device DMA controller, so DMA cannot be used in transferring data between the SPI and the on-chip
RAM.
The SPI is normally used for communication between the DSP and external peripherals. Typical
applications include an interface to external I/O or peripheral expansion via devices such as shift registers,
display drivers, SPI EEPROMs, and analog-to-digital converters.
The SPI has the following features:
•
•
•
•
•
•
•
•
•
•
Programmable divider for serial data clock generation
Four pin interface (SPI_CLK, SPI_CSn, SPI_RX, and SPI_TX)
Programmable data length (1 to 32 bits)
4 external chip select signals
Programmable transfer or frame size (1 to 4096 characters)
Optional interrupt generation on character completion
Programmable SPI_CSn to SPI_TX delay from 0 to 3 SPI_CLK cycles
Programmable signal polarities
Programmable active clock edge
Internal loopback mode for testing
6.16.1 SPI Peripheral Register Description(s)
Table 6-35 shows the SPI registers.
Table 6-35. SPI Module Registers
CPU
WORD
ACRONYM
REGISTER NAME
ADDRESS
3000h
3001h
3002h
3003h
3004h
3005h
3006h
3007h
3008h
3009h
SPICDR
SPICCR
Clock Divider Register
Clock Control Register
SPIDCR1
SPIDCR2
SPICMD1
SPICMD2
SPISTAT1
SPISTAT2
SPIDAT1
SPIDAT2
Device Configuration Register 1
Device Configuration Register 2
Command Register 1
Command Register 2
Status Register 1
Status Register 2
Data Register 1
Data Register 2
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6.16.2 SPI Electrical Data/Timing
Table 6-36. Timing Requirements for SPI Inputs (see Figure 6-32 through Figure 6-35)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
MAX
MIN
MAX
66.4 or
4P(1)(2)
40 or
4
tC(SCLK)
Cycle time, SPI_CLK
ns
4P(1)(2)
5
6
tw(SCLKH)
tw(SCLKL)
Pulse duration, SPI_CLK high
30
30
19
19
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Pulse duration, SPI_CLK low
Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 0
Setup time, SPI_RX valid before SPI_CLK low, SPI Mode 1
Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 2
Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 3
Hold time, SPI_RX valid after SPI_CLK high, SPI Mode 0
Hold time, SPI_RX valid after SPI_CLK low, SPI Mode 1
Hold time, SPI_RX valid after SPI_CLK low, SPI Mode 2
Hold time, SPI_RX valid after SPI_CLK high, SPI Mode 3
16.1
16.1
16.1
16.1
0
13.9
13.9
13.9
13.9
0
7
8
tsu(SRXV-SCLK)
0
0
th(SCLK-SRXV)
0
0
0
0
(1) P = SYSCLK period in ns. For example, when the CPU core is clocked at 100 MHz, use P = 10 ns.
(2) Use whichever value is greater.
Table 6-37. Switching Characteristics Over Recommended Operating Conditions for SPI Outputs
(see Figure 6-32 through Figure 6-35)
CVDD = 1.05 V
MIN
CVDD = 1.3 V
MIN
NO.
PARAMETER
UNIT
MAX
MAX
Delay time, SPI_CLK low to SPI_TX valid, SPI
Mode 0
-4.2
-4.2
-4.2
-4.2
8.9
-4.9
-4.9
-4.9
-4.9
5.3 ns
Delay time, SPI_CLK high to SPI_TX valid, SPI
Mode 1
8.9
8.9
8.9
5.3 ns
5.3 ns
5.3 ns
1
td(SCLK-STXV)
Delay time, SPI_CLK high to SPI_TX valid, SPI
Mode 2
Delay time, SPI_CLK low to SPI_TX valid, SPI
Mode 3
2
3
td(SPICS-SCLK)
Delay time, SPI_CS active to SPI_CLK active
tC - 8 + D(1)
tC - 8 + D(1) ns
0.5tC - 2.2 ns
Output hold time, SPI_CS inactive to SPI_CLK
inactive
toh(SCLKI-SPICSI)
0.5tC - 2.2
(1) D is the programable data delay in ns. Data delay can be programmed to 0, 1, 2, or 3 SPICLK clock cycles.
4
5
6
SPI_CLK
SPI_TX
1
Bn-2
Bn-2
Bn-1
Bn-1
B0
B0
B1
B1
SPI_RX
SPI_CS
7
8
2
3
A. Character length is programmable between 1 and 32 bits; 8-bit character length shown.
B. Polarity of SPI_CSn is configurable, active-low polarity is shown.
Figure 6-32. SPI Mode 0 Transfer (CKPn = 0, CKPHn = 0)
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4
5
6
SPI_CLK
1
2
Bn-2
Bn-2
Bn-1
Bn-1
B0
B1
B1
B1
SPI_TX
SPI_RX
7
8
3
SPI_CS
A. Character length is programmable between 1 and 32 bits; 8-bit character length shown.
B. Polarity of SPI_CSn is configurable, active-low polarity is shown.
Figure 6-33. SPI Mode 1 Transfer (CKPn = 0, CKPHn = 1)
4
5
6
SPI_CLK
SPI_TX
SPI_RX
1
B0
B0
B1
B1
Bn-2
Bn-2
Bn-1
Bn-1
3
7
8
2
SPI_CS
A. Character length is programmable between 1 and 32 bits; 8-bit character length shown.
B. Polarity of SPI_CSn is configurable, active-low polarity is shown.
Figure 6-34. SPI Mode 2 Transfer (CKPn = 1, CKPHn = 0)
4
6
5
SPI_CLK
SPI_TX
SPI_RX
SPI_CS
1
2
Bn-2
Bn-2
Bn-1
Bn-1
B0
B0
B1
B1
7
8
3
A. Character length is programmable between 1 and 32 bits; 8-bit character length shown.
B. Polarity of SPI_CSn is configurable, active-low polarity is shown.
Figure 6-35. SPI Mode 3 Transfer (CKPn = 1, CKPHn = 1)
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6.17 Universal Serial Bus (USB) 2.0 Controller — Does Not Apply to C5532
The device USB2.0 peripheral supports the following features:
•
•
•
•
USB2.0 peripheral at speeds high-speed (480 Mb/s) and full-speed (12 Mb/s)
All transfer modes (control, bulk, interrupt, and isochronous asynchronous mode)
4 Transmit (TX) and 4 Receive (RX) Endpoints in addition to Control Endpoint 0
FIFO RAM
–
–
4K endpoint
Programmable size
•
•
Integrated USB2.0 High Speed PHY
RNDIS mode for accelerating RNDIS type protocols using short packet termination over USB
The USB2.0 peripheral on this device, does not support:
•
•
•
Host Mode (Peripheral/Device Modes supported only)
On-Chip Charge Pump
On-the-Go (OTG) Mode
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6.17.1 USB2.0 Peripheral Register Description(s)
Table 6-38 lists of the USB2.0 peripheral registers.
Table 6-38. Universal Serial Bus (USB) Registers(1)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
Revision Identification Register 1
8000h
8001h
8004h
8008h
800Ch
8010h
8011h
8014h
8018h
8019h
801Ch
801Dh
8020h
8021h
8024h
8025h
8028h
8029h
802Ch
802Dh
8030h
8031h
8034h
8035h
8038h
8039h
803Ch
8040h
8041h
8050h
8051h
8054h
8055h
8058h
8059h
805Ch
805Dh
REVID1
REVID2
Revision Identification Register 2
Control Register
CTRLR
STATR
Status Register
EMUR
Emulation Register
MODER1
Mode Register 1
MODER2
Mode Register 2
AUTOREQ
SRPFIXTIME1
SRPFIXTIME2
TEARDOWN1
TEARDOWN2
INTSRCR1
INTSRCR2
INTSETR1
Auto Request Register
SRP Fix Time Register 1
SRP Fix Time Register 2
Teardown Register 1
Teardown Register 2
USB Interrupt Source Register 1
USB Interrupt Source Register 2
USB Interrupt Source Set Register 1
USB Interrupt Source Set Register 2
USB Interrupt Source Clear Register 1
USB Interrupt Source Clear Register 2
USB Interrupt Mask Register 1
USB Interrupt Mask Register 2
USB Interrupt Mask Set Register 1
USB Interrupt Mask Set Register 2
USB Interrupt Mask Clear Register 1
USB Interrupt Mask Clear Register 2
USB Interrupt Source Masked Register 1
USB Interrupt Source Masked Register 2
USB End of Interrupt Register
USB Interrupt Vector Register 1
USB Interrupt Vector Register 2
Generic RNDIS EP1Size Register 1
Generic RNDIS EP1Size Register 2
Generic RNDIS EP2 Size Register 1
Generic RNDIS EP2 Size Register 2
Generic RNDIS EP3 Size Register 1
Generic RNDIS EP3 Size Register 2
Generic RNDIS EP4 Size Register 1
Generic RNDIS EP4 Size Register 2
Common USB Registers
INTSETR2
INTCLRR1
INTCLRR2
INTMSKR1
INTMSKR2
INTMSKSETR1
INTMSKSETR2
INTMSKCLRR1
INTMSKCLRR2
INTMASKEDR1
INTMASKEDR2
EOIR
INTVECTR1
INTVECTR2
GREP1SZR1
GREP1SZR2
GREP2SZR1
GREP2SZR2
GREP3SZR1
GREP3SZR2
GREP4SZR1
GREP4SZR2
8401h
8402h
8405h
8406h
FADDR_POWER
INTRTX
Function Address Register, Power Management Register
Interrupt Register for Endpoint 0 plus Transmit Endpoints 1 to 4
Interrupt Register for Receive Endpoints 1 to 4
Interrupt enable register for INTRTX
INTRRX
INTRTXE
(1) Before reading or writing to the USB registers, be sure to set the BYTEMODE bits to "00b" in the USB system control register to enable
word accesses to the USB registers .
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Table 6-38. Universal Serial Bus (USB) Registers(1) (continued)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
8409h
840Ah
840Dh
840Eh
INTRRXE
INTRUSB_INTRUSBE
FRAME
Interrupt Enable Register for INTRRX
Interrupt Register for Common USB Interrupts, Interrupt Enable Register
Frame Number Register
Index Register for Selecting the Endpoint Status and Control Registers, Register to
Enable the USB 2.0 Test Modes
INDEX_TESTMODE
USB Indexed Registers
8411h
8412h
Maximum Packet Size for Peripheral/Host Transmit Endpoint. (Index register set to
select Endpoints 1-4)
TXMAXP_INDX
PERI_CSR0_INDX
PERI_TXCSR_INDX
RXMAXP_INDX
Control Status Register for Endpoint 0 in Peripheral Mode. (Index register set to
select Endpoint 0)
Control Status Register for Peripheral Transmit Endpoint. (Index register set to select
Endpoints 1-4)
8415h
8416h
8419h
Maximum Packet Size for Peripheral/Host Receive Endpoint. (Index register set to
select Endpoints 1-4)
Control Status Register for Peripheral Receive Endpoint. (Index register set to select
Endpoints 1-4)
PERI_RXCSR_INDX
COUNT0_INDX
Number of Received Bytes in Endpoint 0 FIFO. (Index register set to select Endpoint
0)
Number of Bytes in Host Receive Endpoint FIFO. (Index register set to select
Endpoints 1- 4)
RXCOUNT_INDX
841Ah
841Dh
841Eh
-
-
Reserved
Reserved
CONFIGDATA_INDC
(Upper byte of 841Eh)
Returns details of core configuration. (index register set to select Endpoint 0)
USB FIFO Registers
8421h
8422h
8425h
8426h
8429h
842Ah
842Dh
842Eh
8431h
8432h
FIFO0R1
FIFO0R2
FIFO1R1
FIFO1R2
FIFO2R1
FIFO2R2
FIFO3R1
FIFO3R2
FIFO4R1
FIFO4R2
Transmit and Receive FIFO Register 1 for Endpoint 0
Transmit and Receive FIFO Register 2 for Endpoint 0
Transmit and Receive FIFO Register 1 for Endpoint 1
Transmit and Receive FIFO Register 2 for Endpoint 1
Transmit and Receive FIFO Register 1 for Endpoint 2
Transmit and Receive FIFO Register 2 for Endpoint 2
Transmit and Receive FIFO Register 1 for Endpoint 3
Transmit and Receive FIFO Register 2 for Endpoint 3
Transmit and Receive FIFO Register 1 for Endpoint 4
Transmit and Receive FIFO Register 2 for Endpoint 4
Dynamic FIFO Control Registers
8461h
8462h
-
Reserved
Transmit Endpoint FIFO Size, Receive Endpoint FIFO Size (Index register set to
select Endpoints 1-4)
TXFIFOSZ_RXFIFOSZ
8465h
8466h
846Dh
TXFIFOADDR
Transmit Endpoint FIFO Address (Index register set to select Endpoints 1-4)
Receive Endpoint FIFO Address (Index register set to select Endpoints 1-4)
Reserved
RXFIFOADDR
-
Control and Status Register for Endpoint 0
8501h
8502h
8505h
8506h
8509h
850Ah
850Dh
-
Reserved
PERI_CSR0
Control Status Register for Peripheral Endpoint 0
-
Reserved
-
Reserved
COUNT0
Number of Received Bytes in Endpoint 0 FIFO
-
-
Reserved
Reserved
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Table 6-38. Universal Serial Bus (USB) Registers(1) (continued)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
Returns details of core configuration.
CONFIGDATA
(Upper byte of 850Eh)
850Eh
Control and Status Register for Endpoint 1
Maximum Packet Size for Peripheral/Host Transmit Endpoint
Control Status Register for Peripheral Transmit Endpoint (peripheral mode)
Maximum Packet Size for Peripheral/Host Receive Endpoint
Control Status Register for Peripheral Receive Endpoint (peripheral mode)
Number of Bytes in the Receiving Endpoint's FIFO
Reserved
8511h
8512h
8515h
8516h
8519h
851Ah
851Dh
851Eh
TXMAXP
PERI_TXCSR
RXMAXP
PERI_RXCSR
RXCOUNT
-
-
-
Reserved
Reserved
Control and Status Register for Endpoint 2
Maximum Packet Size for Peripheral/Host Transmit Endpoint
Control Status Register for Peripheral Transmit Endpoint (peripheral mode)
Maximum Packet Size for Peripheral/Host Receive Endpoint
Control Status Register for Peripheral Receive Endpoint (peripheral mode)
Number of Bytes in Host Receive endpoint FIFO
Reserved
8521h
8522h
8525h
8526h
8529h
852Ah
852Dh
852Eh
TXMAXP
PERI_TXCSR
RXMAXP
PERI_RXCSR
RXCOUNT
-
-
-
Reserved
Reserved
Control and Status Register for Endpoint 3
Maximum Packet Size for Peripheral/Host Transmit Endpoint
Control Status Register for Peripheral Transmit Endpoint (peripheral mode)
Maximum Packet Size for Peripheral/Host Receive Endpoint
Control Status Register for Peripheral Receive Endpoint (peripheral mode)
Number of Bytes in Host Receive endpoint FIFO
Reserved
8531h
8532h
8535h
8536h
8539h
853Ah
853Dh
853Eh
TXMAXP
PERI_TXCSR
RXMAXP
PERI_RXCSR
RXCOUNT
-
-
-
Reserved
Reserved
Control and Status Register for Endpoint 4
Maximum Packet Size for Peripheral/Host Transmit Endpoint
Control Status Register for Peripheral Transmit Endpoint (peripheral mode)
Maximum Packet Size for Peripheral/Host Receive Endpoint
Control Status Register for Peripheral Receive Endpoint (peripheral mode)
Number of Bytes in Host Receive endpoint FIFO
Reserved
8541h
8542h
8545h
8546h
8549h
854Ah
854Dh
854Eh
TXMAXP
PERI_TXCSR
RXMAXP
PERI_RXCSR
RXCOUNT
-
-
-
Reserved
Reserved
CPPI DMA (CMDA) Registers
9000h
9001h
9004h
9008h
9800h
9801h
9808h
9809h
-
Reserved
-
Reserved
TDFDQ
CDMA Teardown Free Descriptor Queue Control Register
CDMA Emulation Control Register
DMAEMU
TXGCR1[0]
TXGCR2[0]
RXGCR1[0]
RXGCR2[0]
Transmit Channel 0 Global Configuration Register 1
Transmit Channel 0 Global Configuration Register 2
Receive Channel 0 Global Configuration Register 1
Receive Channel 0 Global Configuration Register 2
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Table 6-38. Universal Serial Bus (USB) Registers(1) (continued)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
980Ch
980Dh
9810h
RXHPCR1A[0]
RXHPCR2A[0]
RXHPCR1B[0]
RXHPCR2B[0]
TXGCR1[1]
Receive Channel 0 Host Packet Configuration Register 1 A
Receive Channel 0 Host Packet Configuration Register 2 A
Receive Channel 0 Host Packet Configuration Register 1 B
Receive Channel 0 Host Packet Configuration Register 2 B
Transmit Channel 1 Global Configuration Register 1
Transmit Channel 1 Global Configuration Register 2
Receive Channel 1 Global Configuration Register 1
Receive Channel 1 Global Configuration Register 2
Receive Channel 1 Host Packet Configuration Register 1 A
Receive Channel 1 Host Packet Configuration Register 2 A
Receive Channel 1 Host Packet Configuration Register 1 B
Receive Channel 1 Host Packet Configuration Register 2 B
Transmit Channel 2 Global Configuration Register 1
Transmit Channel 2 Global Configuration Register 2
Receive Channel 2 Global Configuration Register 1
Receive Channel 2 Global Configuration Register 2
Receive Channel 2 Host Packet Configuration Register 1 A
Receive Channel 2 Host Packet Configuration Register 2 A
Receive Channel 2 Host Packet Configuration Register 1 B
Receive Channel 2 Host Packet Configuration Register 2 B
Transmit Channel 3 Global Configuration Register 1
Transmit Channel 3 Global Configuration Register 2
Receive Channel 3 Global Configuration Register 1
Receive Channel 3 Global Configuration Register 2
Receive Channel 3 Host Packet Configuration Register 1 A
Receive Channel 3 Host Packet Configuration Register 2 A
Receive Channel 3 Host Packet Configuration Register 1 B
Receive Channel 3 Host Packet Configuration Register 2 B
CDMA Scheduler Control Register 1
9811h
9820h
9821h
TXGCR2[1]
9828h
RXGCR1[1]
9829h
RXGCR2[1]
982Ch
982Dh
9830h
RXHPCR1A[1]
RXHPCR2A[1]
RXHPCR1B[1]
RXHPCR2B[1]
TXGCR1[2]
9831h
9840h
9841h
TXGCR2[2]
9848h
RXGCR1[2]
9849h
RXGCR2[2]
984Ch
984Dh
9850h
RXHPCR1A[2]
RXHPCR2A[2]
RXHPCR1B[2]
RXHPCR2B[2]
TXGCR1[3]
9851h
9860h
9861h
TXGCR2[3]
9868h
RXGCR1[3]
9869h
RXGCR2[3]
986Ch
986Dh
9870h
RXHPCR1A[3]
RXHPCR2A[3]
RXHPCR1B[3]
RXHPCR2B[3]
DMA_SCHED_CTRL1
DMA_SCHED_CTRL2
ENTRYLSW[N]
ENTRYMSW[N]
9871h
A000h
A001h
A800h + 4 × N
A801h + 4 × N
CDMA Scheduler Control Register 1
CDMA Scheduler Table Word N Registers LSW (N = 0 to 63)
CDMA Scheduler Table Word N Registers MSW (N = 0 to 63)
Queue Manager (QMGR) Registers
C000h
C001h
C008h
C009h
C020h
C021h
C024h
C025h
C028h
C029h
C02Ch
C02Dh
C080h
C081h
-
Reserved
-
Reserved
DIVERSION1
DIVERSION2
FDBSC0
FDBSC1
FDBSC2
FDBSC3
FDBSC4
FDBSC5
FDBSC6
FDBSC7
LRAM0BASE1
LRAM0BASE2
Queue Manager Queue Diversion Register 1
Queue Manager Queue Diversion Register 2
Queue Manager Free Descriptor/Buffer Starvation Count Register 0
Queue Manager Free Descriptor/Buffer Starvation Count Register 1
Queue Manager Free Descriptor/Buffer Starvation Count Register 2
Queue Manager Free Descriptor/Buffer Starvation Count Register 3
Queue Manager Free Descriptor/Buffer Starvation Count Register 4
Queue Manager Free Descriptor/Buffer Starvation Count Register 5
Queue Manager Free Descriptor/Buffer Starvation Count Register 6
Queue Manager Free Descriptor/Buffer Starvation Count Register 7
Queue Manager Linking RAM Region 0 Base Address Register 1
Queue Manager Linking RAM Region 0 Base Address Register 2
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Table 6-38. Universal Serial Bus (USB) Registers(1) (continued)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
C084h
LRAM0SIZE
-
Queue Manager Linking RAM Region 0 Size Register
Reserved
C085h
C088h
LRAM1BASE1
LRAM1BASE2
PEND0
Queue Manager Linking RAM Region 1 Base Address Register 1
Queue Manager Linking RAM Region 1 Base Address Register 2
Queue Manager Queue Pending 0
C089h
C090h
C091h
PEND1
Queue Manager Queue Pending 1
C094h
PEND2
Queue Manager Queue Pending 2
C095h
PEND3
Queue Manager Queue Pending 3
C098h
PEND4
Queue Manager Queue Pending 4
C099h
PEND5
Queue Manager Queue Pending 5
D000h + 16 × R
D001h + 16 × R
D004h + 16 × R
D005h + 16 × R
E000h + 16 × N
E001h + 16 × N
E004h + 16 × N
E005h + 16 × N
E008h + 16 × N
E009h + 16 × N
E00Ch + 16 × N
E00Dh + 16 × N
E800h + 16 × N
E801h + 16 × N
E804h + 16 × N
E805h + 16 × N
E808h + 16 × N
E809h + 16 × N
QMEMRBASE1[R]
QMEMRBASE2[R]
QMEMRCTRL1[R]
QMEMRCTRL2[R]
CTRL1A
Queue Manager Memory Region R Base Address Register 1 (R = 0 to 15)
Queue Manager Memory Region R Base Address Register 2 (R = 0 to 15)
Queue Manager Memory Region R Control Register (R = 0 to 15)
Queue Manager Memory Region R Control Register (R = 0 to 15)
Queue Manager Queue N Control Register 1A (N = 0 to 63)
Queue Manager Queue N Control Register 2A (N = 0 to 63)
Queue Manager Queue N Control Register 1B (N = 0 to 63)
Queue Manager Queue N Control Register 2B (N = 0 to 63)
Queue Manager Queue N Control Register 1C (N = 0 to 63)
Queue Manager Queue N Control Register 2C (N = 0 to 63)
Queue Manager Queue N Control Register 1D (N = 0 to 63)
Queue Manager Queue N Control Register 2D (N = 0 to 63)
Queue Manager Queue N Status Register 1A (N = 0 to 63)
Queue Manager Queue N Status Register 2A (N = 0 to 63)
Queue Manager Queue N Status Register 1B (N = 0 to 63)
Queue Manager Queue N Status Register 2B (N = 0 to 63)
Queue Manager Queue N Status Register 1C (N = 0 to 63)
Queue Manager Queue N Status Register 2C (N = 0 to 63)
CTRL2A
CTRL1B
CTRL2B
CTRL1C
CTRL2C
CTRL1D
CTRL2D
QSTAT1A
QSTAT2A
QSTAT1B
QSTAT2B
QSTAT1C
QSTAT1C
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6.17.2 USB 2.0 Electrical Data/Timing
Table 6-39. Switching Characteristics Over Recommended Operating Conditions for USB 2.0 (see
Figure 6-36)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
FULL SPEED
12 Mbps
HIGH SPEED
480 Mbps(1)
UNIT
MIN
4
MAX
MIN
0.5
0.5
–
MAX
1
2
tr(D)
Rise time, USB_DP and USB_DM signals(2)
Fall time, USB_DP and USB_DM signals(2)
Rise/Fall time, matching(3)
Output signal cross-over voltage(2)
Pulse duration, EOP transmitter(4)
Pulse duration, EOP receiver(4)
Data Rate
20
20
ns
ns
%
V
tf(D)
4
3
trfM
90
1.3
160
82
111
2
–
–
–
4
VCRS
tw(EOPT)
tw(EOPR)
t(DRATE)
ZDRV
ZINP
–
7
175
–
ns
ns
8
–
9
12
480 Mb/s
10
11
Driver Output Resistance
40.5
49.5
40.5
-
49.5
-
Ω
Ω
Receiver Input Impedance
100k
(1) For more detailed information, see the Universal Serial Bus Specification, Revision 2.0, Chapter 7.
(2) Full Speed and High Speed CL = 50 pF
(3) tRFM = (tr/tf) x 100. [Excluding the first transaction from the Idle state.]
(4) Must accept as valid EOP
t t
per - jr
USB_DM
V
90% V
OH
CRS
10% V
OL
USB_DP
t
f
t
r
Figure 6-36. USB2.0 Integrated Transceiver Interface Timing
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6.18 General-Purpose Timers
The device has three 32-bit software programmable Timers. Each timer can be used as a
general- purpose (GP) timer. Timer2 can be configured as either a GP or a Watchdog (WD) or both.
General-purpose timers are typically used to provide interrupts to the CPU to schedule periodic tasks or a
delayed task. A watchdog timer is used to reset the CPU in case it gets into an infinite loop. The GP
timers are 32-bit timers with a 13-bit prescaler that can divide the CPU clock and uses this scaled value as
a reference clock. These timers can be used to generate periodic interrupts. The Watchdog Timer is a
16-bit counter with a 16-bit prescaler used to provide a recovery mechanism for the device in the event of
a fault condition, such as a non-exiting code loop.
The device Timers support the following:
•
•
•
32-bit Programmable Countdown Timer
13-bit Prescaler Divider
Timer Modes:
–
–
32-bit General-Purpose Timer
32-bit Watchdog Timer (Timer2 only)
•
•
Auto Reload Option
Generates Single Interrupt to CPU (The interrupt is individually latched to determine which timer
triggered the interrupt.)
•
•
Generates Active Low Pulse to the Hardware Reset (Watchdog only)
Interrupt can be used for DMA Event
6.18.1 Timers Peripheral Register Description(s)
Table 6-40 through Table 6-43 show the Timer and Watchdog registers.
Table 6-40. Watchdog Timer Registers (Timer2 only)
CPU WORD
ACRONYM
REGISTER DESCRIPTION
ADDRESS
1880h
1882h
1884h
1886h
1888h
188Ah
188Ch
188Eh
WDKCKLK
WDKICK
WDSVLR
WDSVR
WDENLOK
WDEN
Watchdog Kick Lock Register
Watchdog Kick Register
Watchdog Start Value Lock Register
Watchdog Start Value Register
Watchdog Enable Lock Register
Watchdog Enable Register
WDPSLR
WDPS
Watchdog Prescale Lock Register
Watchdog Prescale Register
Table 6-41. General-Purpose Timer 0 Registers
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
1810h
1812h
1813h
1814h
1815h
TCR
Timer 0 Control Register
Timer 0 Period Register 1
Timer 0 Period Register 2
Timer 0 Counter Register 1
Timer 0 Counter Register 2
TIMPRD1
TIMPRD2
TIMCNT1
TIMCNT2
Table 6-42. General-Purpose Timer 1 Registers
CPU WORD
ADDRESS
ACRONYM
TCR
REGISTER DESCRIPTION
1850h
Timer 1 Control Register
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Table 6-42. General-Purpose Timer 1 Registers (continued)
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
1852h
1853h
1854h
1855h
TIMPRD1
TIMPRD2
TIMCNT1
TIMCNT2
Timer 1 Period Register 1
Timer 1 Period Register 2
Timer 1 Counter Register 1
Timer 1 Counter Register 2
Table 6-43. General-Purpose Timer 2 Registers
CPU WORD
ADDRESS
ACRONYM
REGISTER DESCRIPTION
1890h
1892h
1893h
1894h
1895h
TCR
Timer 2 Control Register
Timer 2 Period Register 1
Timer 2 Period Register 2
Timer 2 Counter Register 1
Timer 2 Counter Register 2
TIMPRD1
TIMPRD2
TIMCNT1
TIMCNT2
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6.19 General-Purpose Input/Output
The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs.
When configured as an output, you can write to an internal register to control the state driven on the
output pin. When configured as an input, you can detect the state of the input by reading the state of the
internal register. The GPIO can also be used to send interrupts to the CPU.
The GPIO peripheral supports the following:
•
Up to 20 GPIOs plus 1 general-purpose output (XF) and 4 Special-Purpose Outputs for Use With SAR
(C5535 only)
•
•
The 20 GPIO pins have internal pulldowns (IPDs) which can be individually disabled
The 20 GPIOs can be configured to generate edge detected interrupts to the CPU on either the rising
or falling edge
The device GPIO pin functions are multiplexed with various other signals. For more detailed information
on what signals are multiplexed with the GPIO and how to configure them, see Section 3.2, Terminal
Functions and Section 4, Device Configuration of this document.
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6.19.1 General-Purpose Input/Output Peripheral Register Description(s)
The external parallel port interface includes a 16-bit general purpose I/O that can be individually
programmed as input or output with interrupt capability. Control of the general purpose I/O is maintained
through a set of I/O memory-mapped registers shown in Table 6-44.
Table 6-44. GPIO Registers
HEX ADDRESS
RANGE
ACRONYM
REGISTER NAME
1C06h
1C07h
1C08h
1C09h
1C0Ah
1C0Bh
1C0Ch
1C0Dh
1C0Eh
1C0Fh
1C10h
1C11h
IODIR1
IODIR2
GPIO Direction Register 1
GPIO Direction Register 2
GPIO Data In Register 1
GPIO Data In Register 2
GPIO Data Out Register 1
GPIO Data Out Register 2
IOINDATA1
IOINDATA2
IODATAOUT1
IODATAOUT2
IOINTEDG1
IOINTEDG2
IOINTEN1
GPIO Interrupt Edge Trigger Enable Register 1
GPIO Interrupt Edge Trigger Enable Register 2
GPIO Interrupt Enable Register 1
IOINTEN2
GPIO Interrupt Enable Register 2
IOINTFLG1
IOINTFLG2
GPIO Interrupt Flag Register 1
GPIO Interrupt Flag Register 2
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6.19.2 GPIO Peripheral Input/Output Electrical Data/Timing
Table 6-45. Timing Requirements for GPIO Inputs(1) (see Figure 6-37)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
MAX
1
2
tw(ACTIVE)
Pulse duration, GPIO input/external interrupt pulse active
Pulse duration, GPIO input/external interrupt pulse inactive
2C(1)(2)
ns
ns
(1)(2)
tw(INACTIVE)
C
(1) The pulse width given is sufficient to get latched into the GPIO_IFR register and to generate an interrupt. However, if a user wants to
have the device recognize the GPIO changes through software polling of the GPIO Data In (GPIO_DIN) register, the GPIO duration
must be extended to allow the device enough time to access the GPIO register through the internal bus.
(2) C = SYSCLK period in ns. For example, when running parts at 100 MHz, use C = 10 ns.
Table 6-46. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs
(see Figure 6-37)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
UNIT
MIN
3C(1)(2)
3C(1)(2)
MAX
3
4
tw(GPOH)
tw(GPOL)
Pulse duration, GP[x] output high
Pulse duration, GP[x] output low
ns
ns
(1) This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity.
(2) C = SYSCLK period in ns. For example, when running parts at 100 MHz, use C = 10 ns.
2
1
GP[x] Input
(With IOINTEDGy = 0)
2
1
GP[x] Input
(With IOINTEDGy = 1)
4
3
GP[x] Output
Figure 6-37. GPIO Port Timing
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6.19.3 GPIO Peripheral Input Latency Electrical Data/Timing
Table 6-47. Timing Requirements for GPIO Input Latency(1)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
5
MAX
Polling GPIO_DIN register
Polling GPIO_IFR register
Interrupt Detection
cyc
cyc
cyc
1
tL(GPI) Latency, GP[x] input
7
8
(1) The pulse width given is sufficient to generate a CPU interrupt. However, if a user wants to have the device recognize the GP[x] input
changes through software polling of the GPIO register, the GP[x] input duration must be extended to allow device enough time to access
the GPIO register through the internal bus.
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6.20 IEEE 1149.1 JTAG
The JTAG interface is used for Boundary-Scan testing and emulation of the device.
TRST should only to be deasserted when it is necessary to use a JTAG controller to debug the device or
exercise the device's boundary scan functionality.
The device includes an internal pulldown (IPD) on the TRST pin to ensure that TRST will always be
asserted upon power up and the device's internal emulation logic will always be properly initialized. It is
also recommended that an external pulldown be added to ensure proper device operation when an
emulation or boundary scan JTAG controller is not connected to the JTAG pins. JTAG controllers from
Texas Instruments actively drive TRST high. However, some third-party JTAG controllers may not drive
TRST high but expect the use of a pullup resistor on TRST. When using this type of JTAG controller,
assert TRST to initialize the device after powerup and externally drive TRST high before attempting any
emulation or boundary scan operations. The device will not operate properly if TRST is not asserted low
during powerup.
6.20.1 JTAG ID (JTAGID) Register Description(s)
Table 6-48. JTAG ID Register
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
JTAG Identification Register
COMMENTS
Read-only. Provides 32-bit
JTAG ID of the device.
N/A
JTAGID
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. The
register hex value for the device is: 0x01B8F E02F. For the actual register bit names and their associated
bit field descriptions, see Figure 6-38 and Table 6-49.
31-28
VARIANT (4-Bit)
R-0001
27-12
11-1
0
PART NUMBER (16-Bit)
R-1011 1000 1111 1110
MANUFACTURER (11-Bit)
R-0000 0010 111
LSB
R-1
LEGEND: R = Read, W = Write, n = value at reset
Figure 6-38. JTAG ID Register Description - 'C5535, 'C5534, 'C5533, and 'C5532 Register Value -
0x01B8F E02F
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Table 6-49. JTAG ID Register Selection Bit Descriptions
BIT
31:28
27:12
11:1
0
NAME
VARIANT
DESCRIPTION
Variant (4-Bit) value: 0001.
Part Number (16-Bit) value: 1011 1000 1111 1110.
PART NUMBER
MANUFACTURER Manufacturer (11-Bit) value: 0000 0010 111.
LSB LSB. This bit is read as a "1".
6.20.2 JTAG Test_port Electrical Data/Timing
Table 6-50. Timing Requirements for JTAG Test Port (see Figure 6-39)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
UNIT
MIN
60
24
24
10
6
MAX
2
3
4
5
6
7
8
tc(TCK)
Cycle time, TCK
ns
ns
ns
ns
ns
ns
ns
tw(TCKH)
Pulse duration, TCK high
tw(TCKL)
Pulse duration, TCK low
tsu(TDIV-TCKH)
tsu(TMSV-TCKH)
th(TCKH-TDIV)
th(TCKH-TDIV)
Setup time, TDI valid before TCK high
Setup time, TMS valid before TCK high
Hold time, TDI valid after TCK high
Hold time, TMS valid after TCK high
5
4
Table 6-51. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 6-39)
CVDD = 1.05 V
CVDD = 1.3 V
NO.
PARAMETER
UNIT
MIN
MAX
1
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
30.5
ns
2
3
4
TCK
TDO
1
1
7
8
5
6
TDI
TMS
Figure 6-39. JTAG Test-Port Timing
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7 Device and Documentation Support
7.1 Device Support
7.1.1 Development Support
TI offers an extensive line of development tools for the TMS320C55x DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules. The tool's support documentation is electronically
available within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of TMS320C55x fixed-point DSP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): Version 4.2.4 or later
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™ Version 5.33 or later), which provides the
basic run-time target software needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator
For a complete listing of development-support tools for the TMS320C55x DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com. For information on pricing and
availability, contact the nearest TI field sales office or authorized distributor.
7.1.2 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320C5535AZHHA10). Texas Instruments recommends two of three possible
prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
TMP
TMS
Experimental device that is not necessarily representative of the final device's electrical
specifications.
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
Fully-qualified production device.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
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Device and Documentation Support
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Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZHH), and the temperature range (for example, "Blank" is the commercial
temperature range).
Figure 7-1 provides a legend for reading the complete device name for any DSP platform member.
TMS 320
C
5535
A
ZHH
A
10
PREFIX
DEVICE MAXIMUM OPERATING FREQUENCY
TMX = Experimental device
TMS = Qualified device
10 = 50 MHz at 1.05 V, 100 MHz at 1.3 V
DEVICE FAMILY
TEMPERATURE RANGE
320 = TMS320™ DSP family
Blank = –10° C to 70° C, Commercial Temperature
A = –40° C to 85° C, Industrial Temperature
TECHNOLOGY
C = Dual-supply CMOS
PACKAGE TYPE
ZHH = 144-pin plastic BGA, with Pb-Free
soldered balls [Green]
DEVICE
C55x™ DSP: 5535A10, 5535A05
5534A10, 5534A05
5533A10, 5533A05
SILICON REVISION
5532A10, 5532A05
Revision 2.2
A. For actual device part numbers (P/Ns) and ordering information, see the TI website (http://www.ti.com)
Figure 7-1. Device Nomenclature
7.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
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8 Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance characteristics for the PBGA–ZHH mechanical
package.
8.1 Thermal Data for ZHH
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZHH]
°C/W(1)
12.53
38
AIR FLOW (m/s)(2)
RΘJC
RΘJB
RΘJA
PsiJT
PsiJB
Junction-to-case
1S0P
2S2P
2S2P
2S2P
2S2P
N/A
N/A
Junction-to-board
Junction-to-free air
Junction-to-package top
Junction-to-board
50
0.00
0.00
0.00
0.49
37.4
(1) These measurements were conducted in a JEDEC-defined 1S0P/2S2P system and will change based on environment as well as
application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method
Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded
Surface Mount Packages.
(2) m/s = meters per second
8.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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PACKAGE OPTION ADDENDUM
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3-Dec-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TMS320C5532AZHH05
TMS320C5532AZHH10
TMS320C5532AZHHA05
TMS320C5532AZHHA10
TMS320C5533AZHH05
TMS320C5533AZHH10
TMS320C5533AZHHA05
TMS320C5533AZHHA10
TMS320C5534AZHH05
TMS320C5534AZHH10
TMS320C5534AZHHA05
TMS320C5534AZHHA10
TMS320C5535AZHH05
TMS320C5535AZHH10
TMS320C5535AZHHA05
TMS320C5535AZHHA10
TMX320C5535AZHH10
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
BGA
MICROSTAR
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
ZHH
144
144
144
144
144
144
144
144
144
144
144
144
144
144
144
144
144
160
160
160
160
160
160
160
160
160
160
160
160
160
160
160
160
Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
Green (RoHS
& no Sb/Br)
BGA
TBD
Call TI
Call TI
MICROSTAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2011
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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