TMP461-SP [TI]
耐辐射加固保障 (RHA)、高精度远程和本地温度传感器;
| 型号： | TMP461-SP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 耐辐射加固保障 (RHA)、高精度远程和本地温度传感器 温度传感 传感器 温度传感器 |
| 文件： | 总36页 (文件大小：1016K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
TMP461-SP 耐辐射 (RHA)、高精度远程和本地温度传感器
1 特性
3 说明
1
•
符合 QMLV 标准：5962R-1721801VXC
TMP461-SP 器件是一款高精度、低功耗的耐辐射远程
温度传感器监控器，内置有一个本地温度传感器。这类
远程温度传感器通常采用低成本分立式 NPN 或 PNP
晶体管，或者基板热晶体管/二极管，这些器件都是微
处理器、模数转换器 (ADC)、数模转换器 (DAC)、微
控制器或现场可编程门阵列 (FPGA) 中不可或缺的部
件。本地和远程传感器均用 12 位数字编码表示温度，
分辨率为 0.0625°C。此两线制串口接受 SMBus 通信
协议，以及多达 9 个不同的引脚可编程地址。
–
–
热增强型 HKU 封装
耐辐射 (RHA)：在 10mrad/s 的低剂量率 (LDR)
下，可抵抗高达 100krad(Si) 的电离辐射总剂量
(TID)
–
–
单粒子闩锁 (SEL) 在 125°C 下的抗扰度可达
76MeV·cm2/mg
10 引脚 HKU 陶瓷封装
•
•
•
远程二极管温度传感器精度：±1.5°C（在 [–55°C
至 125°C] 工作温度范围内）
该 器件 将诸如串联电阻抵消、可编程非理想性因子
（η 因子）、可编程偏移、可编程温度限制和可编程数
字滤波器等高级特性完美结合，提供了一套准确度和抗
扰度更高且稳健耐用的温度监控解决方案。
本地温度传感器精度：±2°C（在 [–55°C 至 125°C]
工作温度范围内）
支持在 –64°C 到 191°C 的温度范围内测量远程二
极管温度
•
•
•
本地和远程通道的分辨率：0.0625°C
电源和逻辑电压范围：1.7V 至 3.6V
TMP461-SP 是在各种分布式遥测应用中进行多位置高
精度温度测量的 理想选择。这类集成式本地和远程温
度传感器可提供一种简单的方法来测量温度梯度，进而
简化了航天器维护活动。该器件的额定电源电压范围为
1.7V 至 3.6V，额定工作温度范围为 -55°C 至 125°C。
35µA 工作电流 (1SPS)，
3µA 关断电流
•
•
•
•
•
串联电阻抵消
η 因子和偏移校正
可编程数字滤波器
二极管故障检测
器件信息(1)
器件型号
等级
封装
两线制和 SMBus™串行接口与引脚可编程的地址
兼容
10 引线 CFP [HKU]
7.02mm × 6.86mm
5962-1721801VXC QMLV
10 引线 CFP [HKU]
7.02mm × 6.86mm
工程样片(2)
•
TMP461HKU/EM
2 应用
TMP461EVM-CVAL 陶瓷评估板
•
•
航天器 FPGA、ADC、DAC 和 ASIC 温度监控
10 引线 CFP [HKU]
7.02mm × 6.86mm
5962R1721801VXC RHA - 100krad(Si)
航天器维护和遥测
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
简化框图
Vbatt
Vbatt
(2) 这些器件仅适用于工程评估。器件按照不合规的流程进行加工
处理。这些部件不适用于质检、生产、辐射测试或飞行。无法
保证器件在整个军用额定温度范围（-55°C 至 125°C）内或其
使用寿命内性能无恙。
TL1431-SP
or
LM4050QML-SP
TL1431-SP
or
LM4050QML-SP
1.7 V to 3.6 V
1.7 V to 3.6 V
1
2
10
9
FPGA, ADC,
DAC, or ASIC
GND
V+
D+
A1
SMBus
Controller
SCL
Built-in
Thermal
Transistor
or Diode
TMP461-SP
3
4
8
7
Dœ
SDA
ALERT/
THERM2
Host Processor
THERM
5
6
A0
GND
GND
GND
Overtemperature
Shutdown
Copyright © 2017, Texas Instruments Incorporated
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBOS876
TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
目录
7.5 Programming........................................................... 14
7.6 Register Map........................................................... 18
Application and Implementation ........................ 24
8.1 Application Information............................................ 24
8.2 Typical Application .................................................. 24
8.3 Radiation Environments.......................................... 27
Power Supply Recommendations...................... 27
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Two-Wire Timing Requirements ............................... 6
6.7 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 13
8
9
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Layout Example .................................................... 29
11 器件和文档支持 ..................................................... 30
11.1 接收文档更新通知 ................................................. 30
11.2 社区资源................................................................ 30
11.3 商标....................................................................... 30
11.4 静电放电警告......................................................... 30
11.5 Glossary................................................................ 30
12 机械、封装和可订购信息....................................... 30
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (December 2017) to Revision B
Page
•
将数据表标题从“TMP461-SP 耐辐射远程和本地数字温度传感器”更改为“TMP461-SP 耐辐射 (RHA)、高精度远程和本
地温度传感器”......................................................................................................................................................................... 1
•
•
•
•
删除了 50krad(Si) HDR 表述（位于特性 部分）切换到 RHA 滤波器..................................................................................... 1
向器件信息 表添加了 5962R1721801VXC RHA 可订购信息.................................................................................................. 1
Added tablenote to thermal pad description in the Pin Functions table ................................................................................. 3
Updated layout example for CFP package .......................................................................................................................... 29
Changes from Original (September 2017) to Revision A
Page
•
已更改 将器件状态从预告信息 更改为生产数据...................................................................................................................... 1
2
Copyright © 2017–2020, Texas Instruments Incorporated
TMP461-SP
www.ti.com.cn
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
5 Pin Configuration and Functions
HKU Package
10-Pin CFP
Top View
V+
D+
1
2
3
4
5
10
9
A1
SCL
Thermal
8
Dœ
SDA
Pad
THERM
A0
7
ALERT/THERM2
GND
6
Not to scale
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
A0
NO.
5
Digital input
Digital input
Address select. Connect to GND, V+, or leave floating.
Address select. Connect to GND, V+, or leave floating.
A1
10
Interrupt or SMBus alert output. Can be configured as a second THERM output.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
ALERT/THERM2
7
Digital output
D–
3
2
6
Analog input
Analog input
Ground
Negative connection to remote temperature sensor.
Positive connection to remote temperature sensor.
Supply ground connection.
D+
GND
Serial clock line for SMBus.
Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V if driven by an open-drain output.
SCL
SDA
9
8
Digital input
Bidirectional digital
input-output
Serial data line for SMBus. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
Thermal shutdown or fan-control pin.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
THERM
V+
4
1
Digital output
Power supply
--
Positive supply voltage, 1.7 V to 3.6 V.
The exposed thermal pad of the HKU package should be connected to a wide ground plane for effective
thermal conduction.
Thermal Pad(1)
--
(1) Thermal pad and package lid are internally connected to ground.
Copyright © 2017–2020, Texas Instruments Incorporated
3
TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
UNIT
Power supply, V+
6
6
V
THERM, ALERT/THERM2, SDA and SCL only
Input voltage
Input current
D+, A0, A1
D– only
(V+) + 0.3
0.3
V
10
mA
°C
°C
°C
Operating temperature
–55
–60
150
Junction temperature, TJ max
Storage temperature, Tstg
150
150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
1.7
NOM
MAX
3.6
UNIT
V
V+
TA
Supply voltage
3.3
Operating temperature
–55
125
°C
6.4 Thermal Information
TMP461-SP
THERMAL METRIC(1)
HKU (CFP)
10 PINS
39.2
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
20.7
20.9
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
11.7
ψJB
21.0
RθJC(bot)
8.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2017–2020, Texas Instruments Incorporated
TMP461-SP
www.ti.com.cn
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
6.5 Electrical Characteristics
The specifications shown below correspond to the respectively identified subgroup temperature (see 表 1). V+ = 1.7 V to 3.6
V, unless otherwise noted.
PARAMETER
CONDITIONS
SUBGROUP(1)
MIN
TYP
MAX UNIT
TEMPERATURE MEASUREMENT
Local temperature sensor
accuracy
TALOCAL
V+ = 1.7 V to 3.6 V
V+ = 1.7 V to 3.6 V
V+ = 1.7 V to 3.6 V
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
–2
±0.5
2
1.5
0.3
°C
°C
Remote temperature sensor
TAREMOTE
accuracy
–1.5 ±0.125
Temperature sensor error versus
supply (local or remote)
–0.3
±0.1
°C/V
°C
Temperature resolution
(local and remote)
0.0625
ADC conversion time
ADC resolution
One-shot mode, per channel (local or remote)
[9, 10, 11]
[4, 5, 6]
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
15
12
17
ms
Bits
High
88
33
120
45
152
57
Remote sensor
Medium Series resistance 1 kΩ (max)
Low
Remote transistor ideality factor
SERIAL INTERFACE
µA
source current
5.5
7.5
9.5
η
TMP461-SP optimized ideality factor
1.008
VIH
VIL
High-level input voltage
[1, 2, 3]
[1, 2, 3]
1.4
V
V
Low-level input voltage
Hysteresis
0.45
200
mV
mA
V
SDA output-low sink current
Low-level output voltage
Serial bus input leakage current
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
6
VOL
IO = –6 mA
0 V ≤ VIN ≤ 3.6 V
SCL
0.15
0.4
1
–1
μA
pF
pF
MHz
ms
3
Serial bus input capacitance
SDA
4.6
Serial bus clock frequency
Serial bus timeout
[9, 10, 11]
[9, 10, 11]
2.17
30
20
25
DIGITAL INPUTS (A0, A1)
VIH
VIL
High-level input voltage
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
0.9(V+)
–0.3
–1
(V+) + 0.3
0.1(V+)
1
V
V
Low-level input voltage
Input leakage current
Input capacitance
0 V ≤ VIN ≤ 3.6 V
μA
pF
2.5
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
Output-low sink current
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
6
mA
V
VOL
IOH
Low-level output voltage
IO = –6 mA
0.15
0.4
1
High-level output leakage current VO = V+
μA
POWER SUPPLY
V+
Specified supply voltage range
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
[1, 2, 3]
1.7
3.6
375
600
35
V
µA
V
Active conversion, local sensor
240
400
15
Active conversion, remote sensor
Standby mode (between conversions)
Shutdown mode, serial bus inactive
Shutdown mode, serial bus active, fS = 400 kHz
Shutdown mode, serial bus active, fS = 2.17 MHz
Rising edge
IQ
Quiescent current
3
8
90
350
1.2
POR
Power-on reset threshold
[1, 2, 3]
1.55
(1) For subgroup definitions, please see 表 1.
版权 © 2017–2020, Texas Instruments Incorporated
5
TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
6.6 Two-Wire Timing Requirements
At –55°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
FAST MODE
MIN
HIGH-SPEED MODE
UNIT
MAX
MIN
0.001
160
MAX
f(SCL)
t(BUF)
SCL operating frequency
0.001
0.4
2.17
MHz
ns
Bus free time between stop and start condition
1300
Hold time after repeated start condition.
After this period, the first clock is generated.
t(HDSTA)
600
160
ns
t(SUSTA)
t(SUSTO)
t(HDDAT)
t(SUDAT)
t(LOW)
Repeated start condition setup time
Stop condition setup time
Data hold time
600
600
0
160
160
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
900
150
Data setup time
100
1300
600
40
SCL clock low period
SCL clock high period
Data fall time
320
60
t(HIGH)
tF – SDA
tF, tR – SCL
tR
300
300
130
40
Clock fall and rise time
Rise time for SCL ≤ 100 kHz
1000
表 1. Quality Conformance Inspection(1)
SUBGROUP
DESCRIPTION
Static tests at
TEMPERATURE (°C)
1
2
25
125
–55
25
Static tests at
3
Static tests at
4
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
5
125
–55
25
6
7
8A
8B
9
125
–55
25
10
11
125
–55
(1) MIL-STD-883, Method 5005 - Group A
t(LOW)
tR
tF
t(HDSTA)
SCL
SDA
t(SUSTO)
t(HDSTA)
t(HIGH)
t(SUSTA)
t(SUDAT)
t(HDDAT)
t(BUF)
P
S
S
P
图 1. Two-Wire Timing Diagram
6
版权 © 2017–2020, Texas Instruments Incorporated
TMP461-SP
www.ti.com.cn
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
6.7 Typical Characteristics
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
1.50
1.50
1.25
1.00
0.75
0.50
0.25
0.00
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
Mean - 6s
Mean + 6s
1.25
1.00
0.75
0.50
0.25
0.00
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
Mean - 6s
Mean + 6s
-55
-35
-15
5
25
45
65
85
105 125
-55
-35
-15
5
25
45
65
85
105 125
Ambient Temperature (èC)
Ambient Temperature (èC)
D001
D002
Typical behavior of 25 devices over temperature
Typical behavior of 25 devices over temperature
图 2. Local Temperature Error vs
图 3. Remote Temperature Error vs
Ambient Temperature
Ambient Temperature
20
0
1
0.8
0.6
0.4
0.2
0
D+ to GND
D+ to V+
-20
-40
-60
-0.2
-0.4
-0.6
-0.8
-1
1
2
3
4
5 6 7 8 10
20 30 40 50 70 100
0
500
1000
1500
2000
2500
3000
Leakage Resistance (MW)
Series Resistance (W)
D004
No physical capacitance during measurement
图 4. Remote Temperature Error vs
图 5. Remote Temperature Error vs
Leakage Resistance
Series Resistance
400
350
300
250
200
150
100
50
0
-5
-10
-15
-20
-25
-30
0
0.01
0
5
10 15
Differential Capacitance (nF)
20
25
0.1
1
Conversion Rate (Hz)
10
100
D005
D007
No physical series resistance on D+, D– pins during measurement
图 6. Remote Temperature Error vs
图 7. Quiescent Current vs Conversion Rate
Differential Capacitance
版权 © 2017–2020, Texas Instruments Incorporated
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TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
Typical Characteristics (接下页)
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
250
180
175
170
165
160
155
150
200
150
100
50
0
1k
10k
100k
Clock Frequency (Hz)
1M
10M
1.5
2
2.5 3
Supply Voltage (V)
3.5
4
D008
D009
16 samples per second (default mode)
图 8. Shutdown Quiescent Current
图 9. Quiescent Current vs Supply Voltage
(At Default Conversion Rate of 16 Conversions per Second)
vs SCL Clock Frequency
3
2.5
2
1.5
1
0.5
1.5
2
2.5 3
Supply Voltage (V)
3.5
4
D010
图 10. Shutdown Quiescent Current
vs Supply Voltage
8
版权 © 2017–2020, Texas Instruments Incorporated
TMP461-SP
www.ti.com.cn
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
7 Detailed Description
7.1 Overview
The TMP461-SP device is a digital temperature sensor that combines a local temperature measurement channel
and a remote-junction temperature measurement channel in a single CFP HKU-10 package. The device is two-
wire- and SMBus-interface-compatible with nine pin-programmable bus address options, and is specified over a
temperature range of –55°C to 125°C. The TMP461-SP device also contains multiple registers for programming
and holding configuration settings, temperature limits, and temperature measurement results.
7.2 Functional Block Diagram
V+
TMP461-SP
A0
Register Bank
Oscillator
A1
SCL
SDA
Serial Interface
Control Logic
16 x I 6 x I
I
ALERT/THERM2
D+
ADC
Dœ
THERM
Internal
BJT
GND
Copyright © 2017, Texas Instruments Incorporated
版权 © 2017–2020, Texas Instruments Incorporated
9
TMP461-SP
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
7.3 Feature Description
7.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 12 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of 表 2. Any temperatures above 127°C result in a value that rails to 127.9375 (7FFh).
The device can be set to measure over an extended temperature range by changing bit 2 (RANGE) of the
configuration register from low to high. The change in measurement range and data format from standard binary
to extended binary occurs at the next temperature conversion. For data captured in the extended temperature
range configuration, an offset of 64 (40h) is added to the standard binary value, as shown in the Extended Binary
column of 表 2. This configuration allows measurement of temperatures as low as –64°C, and as high as 191°C;
however, most temperature-sensing diodes only operate within the range of –55°C to 150°C. Additionally, the
TMP461-SP is specified only for ambient temperatures ranging from –55°C to 125°C; parameters in the Absolute
Maximum Ratings table must be observed.
表 2. Temperature Data Format (Local and Remote Temperature High Bytes)
LOCAL AND REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE
(1°C Resolution)
TEMPERATURE
(°C)
STANDARD BINARY(1)
EXTENDED BINARY(2)
BINARY
BINARY
HEX
C0
CE
E7
00
HEX
00
–64
–50
–25
0
1100 0000
1100 1110
1110 0111
0000 0000
0000 0001
0000 0101
0000 1010
0001 1001
0011 0010
0100 1011
0110 0100
0111 1101
0111 1111
0111 1111
0111 1111
0111 1111
0000 0000
0000 1110
0010 0111
0100 0000
0100 0001
0100 0101
0100 1010
0101 1001
0111 0010
1000 1011
1010 0100
1011 1101
1011 1111
1101 0110
1110 1111
1111 1111
0E
27
40
1
01
41
5
05
45
10
0A
19
4A
59
25
50
32
72
75
4B
64
8B
A4
BD
BF
D6
EF
FF
100
125
127
150
175
191
7D
7F
7F
7F
7F
(1) Resolution is 1°C per count. Negative numbers are represented in twos complement format.
(2) Resolution is 1°C per count. All values are unsigned with a –64°C offset.
10
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Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature
with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as shown in 表 3. The measurement resolution for both the local and the remote
channels is 0.0625°C.
表 3. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C Resolution)(1)
TEMPERATURE
(°C)
STANDARD AND EXTENDED BINARY
0000 0000
HEX
00
10
20
30
40
50
60
70
80
90
A0
B0
C0
D0
E0
F0
0
0.0625
0.1250
0.1875
0.2500
0.3125
0.3750
0.4375
0.5000
0.5625
0.6250
0.6875
0.7500
0.8125
0.8750
0.9375
0001 0000
0010 0000
0011 0000
0100 0000
0101 0000
0110 0000
0111 0000
1000 0000
1001 0000
1010 0000
1011 0000
1100 0000
1101 0000
1110 0000
1111 0000
(1) Resolution is 0.0625°C per count. All possible values are shown.
7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
High-byte conversion (for example, 0111 0011):
Convert the right-justified binary high byte to hexadecimal.
From hexadecimal, multiply the first number by 160 = 1 and the second number by 161 = 16.
The sum equals the decimal equivalent.
0111 0011b → 73h → (3 × 160) + (7 × 161) = 115.
Low-byte conversion (for example, 0111 0000):
To convert the left-justified binary low-byte to decimal, use bits 7 through 4 and ignore bits 3 through 0
because they do not affect the value of the number.
0111b → (0 × 1 / 2)1 + (1 × 1 / 2)2 + (1 × 1 / 2)3 + (1 × 1 / 2)4 = 0.4375.
7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
For positive temperatures (for example, 20°C):
(20°C) / (1°C per count) = 20 → 14h → 0001 0100.
Convert the number to binary code with 8-bit, right-justified format, and MSB = 0 to denote a positive sign.
20°C is stored as 0001 0100 → 14h.
For negative temperatures (for example, –20°C):
(|–20|) / (1°C per count) = 20 → 14h → 0001 0100.
Generate the twos complement of a negative number by complementing the absolute value binary number
and adding 1.
–20°C is stored as 1110 1100 → ECh.
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7.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total of up to 1 kΩ of
series resistance can be cancelled by the TMP461-SP device, thus eliminating the need for additional
characterization and temperature offset correction. See 图 5 (Remote Temperature Error vs Series Resistance)
for details on the effects of series resistance on sensed remote temperature error.
7.3.3 Differential Input Capacitance
The TMP461-SP device tolerates differential input capacitance of up to 1000 pF with minimal change in
temperature error. The effect of capacitance on the sensed remote temperature error is illustrated in 图 6
(Remote Temperature Error vs Differential Capacitance).
7.3.4 Filtering
Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often
created by fast digital signals that can corrupt measurements. The TMP461-SP device has a built-in, 65-kHz filter
on the D+ and D– inputs to minimize the effects of noise. However, a bypass capacitor placed differentially
across the inputs of the remote temperature sensor is recommended to make the application more robust against
unwanted coupled signals. For this capacitor, select a value between 100 pF differential and 1 nF. Some
applications attain better overall accuracy with additional series resistance. However, this increased accuracy is
application-specific. When series resistance is added, the total value must not be greater than 1 kΩ. If filtering is
required, suggested component values are 100 pF differential and 50 Ω on each input; exact values are
application-specific.
Additionally, a digital filter is available for the remote temperature measurements to further reduce the effect of
noise. This filter is programmable and has two levels when enabled. Level 1 performs a moving average of four
consecutive samples. Level 1 filtering can be achieved by setting the digital filter control register (read address
24h, write address 24h) to 01h. Level 2 performs a moving average of eight consecutive samples. Level 2
filtering can be achieved by setting the digital filter control register (read address 24h, write address 24h) to 02h.
The value stored in the remote temperature result register is the output of the digital filter, and is the value that
the ALERT and THERM limits are compared to. The digital filter provides additional immunity to noise and spikes
on the ALERT and THERM outputs. The filter responses to impulse and step inputs are shown in 图 11 and 图
12, respectively. The filter can be enabled or disabled by programming the desired levels in the digital filter
register; see 表 5. The digital filter is disabled by default and on POR.
100
90
100
90
80
70
80
70
Disabled
Disabled
60
50
60
50
Level 1
Level 2
40
30
40
30
Level1
Level 2
20
10
20
10
0
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
Samples
Samples
图 11. Filter Response to Impulse Inputs
图 12. Filter Response to Step Inputs
12
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7.3.5 Sensor Fault
The TMP461-SP device can sense a fault at the D+ input resulting from an incorrect diode connection. The
TMP461-SP device can also sense an open circuit. Short-circuit conditions return a value of –64°C. The
detection circuitry consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V
(typical). The comparator output is continuously checked during a conversion. If a fault is detected, then OPEN
(bit 2) in the status register is set to 1.
When not using the remote sensor with the TMP461-SP device, D+ must be connected to D– or GND to prevent
meaningless fault warnings.
7.3.6 ALERT and THERM Functions
Operation of the ALERT (pin 7) and THERM (pin 4) interrupts is shown in 图 13. Operation of the THERM (pin 4)
and THERM2 (pin 7) interrupts is shown in 图 14. The ALERT and THERM pin setting is determined by bit 5 of
the configuration register.
The hysteresis value is stored in the THERM hysteresis register and applies to both the THERM and THERM2
interrupts. The value of the CONAL[2:0] bits in the consecutive ALERT register (see 表 5) determines the number
of limit violations before the ALERT pin is tripped. The default value is 000b and corresponds to one violation,
001b programs two consecutive violations, 011b programs three consecutive violations, and 111b programs four
consecutive violations. The CONAL[2:0] bits provide additional filtering for the ALERT pin state.
Temperature Conversion Complete
Temperature Conversion Complete
150
140
150
140
130
120
130
120
THERM Limit
110
100
THERM Limit
110
100
THERM Limit - Hysteresis
THERM Limit - Hysteresis
90
90
THERM2 Limit
High Temperature Limit
80
70
80
70
THERM2 Limit - Hysteresis
Measured
Temperature
Measured
Temperature
60
50
60
50
Time
Time
ALERT output
serviced by master
THERM2
THERM
ALERT
THERM
图 14. THERM and THERM2 Interrupt Operation
图 13. ALERT and THERM Interrupt Operation
7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The TMP461-SP shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 3 μA; see 图 10
(Shutdown Quiescent Current vs Supply Voltage). Shutdown mode is enabled when the SD bit (bit 6) of the
configuration register is high; the device shuts down after the current conversion is finished. When the SD bit is
low, the device maintains a continuous-conversion state.
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7.5 Programming
7.5.1 Serial Interface
The TMP461-SP device operates only as a slave device on either the two-wire bus or the SMBus. Connections
to either bus are made using the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP461-
SP device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.17 MHz)
modes. All data bytes are transmitted MSB first.
7.5.1.1 Bus Overview
The TMP461-SP device is SMBus-interface-compatible. In SMBus protocol, the device that initiates the transfer
is called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls the bus access, and generates the start and stop
conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being
addressed responds to the master by generating an acknowledge bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
7.5.1.2 Bus Definitions
The TMP461-SP device is two-wire- and SMBus-compatible. 图 15 and 图 16 illustrate the timing for various
operations on the TMP461-SP device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
14
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Programming (接下页)
1
9
1
9
SCL
SDA
¼
1
0
0
1
1
0
0(1) R/W
P7 P6 P5 P4 P3
P2 P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
1
9
SCL
(Continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
ACK By
Device
Stop By
Master
Frame 3 Data Byte 1
(1) Slave address 1001100 is shown.
图 15. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
¼
SCL
SDA
1
0
0
1
1
0
0(1)
R/W
P7
P6
P5
P4
P3
P2
P1
P0
¼
Start By
Master
ACK By
ACK By
Device
Device
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
SCL
¼
(Continued)
SDA
0(1)
¼
1
0
1
0
0
1
R/W
D7
D6
D5
D4 D3
D2
D1
D0
(Continued)
Start By
Master
ACK By
From
Device
NACK By
Master(2)
Device
Frame 3 Two-Wire Slave Address Byte
Frame 4 Data Byte 1 Read Register
(1) Slave address 1001100 is shown.
(2) The master must leave SDA high to terminate a single-byte read operation.
图 16. Two-Wire Timing Diagram for Single-Byte Read Format
7.5.1.3 Serial Bus Address
To communicate with the TMP461-SP device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP461-SP allows up to nine devices to be connected to the SMBus, depending on
the A0, A1 pin connections as described in 表 4. The A0 and A1 address pins must be isolated from noisy or
high-frequency signals traces in order to avoid false address settings when these pins are set to a float state.
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Programming (接下页)
表 4. TMP461-SP Slave Address Options
SLAVE ADDRESS
A1 CONNECTION
A0 CONNECTION
BINARY
1001 000
1001 001
1001 010
1001 011
1001 100
1001 101
1001 110
1001 111
1010 000
HEX
48
GND
GND
GND
Float
Float
Float
V+
GND
Float
V+
49
4A
4B
4C
4D
4E
4F
50
GND
Float
V+
GND
Float
V+
V+
V+
7.5.1.4 Read and Write Operations
Accessing a particular register on the TMP461-SP device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP461-SP device requires a value for the pointer register (see 图 15).
When reading from the TMP461-SP device, the last value stored in the pointer register by a write operation is
used to determine which register is read by a read operation. To change which register is read for a read
operation, a new value must be written to the pointer register. This transaction is accomplished by issuing a
slave address byte with the R/W bit low, followed by the pointer register byte; no additional data are required.
The master can then generate a start condition and send the slave address byte with the R/W bit high to initiate
the read command; see 图 16 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP461-SP retains the pointer register value until it is changed by the next write
operation. The register bytes are sent MSB first, followed by the LSB. However, to mitigate effects of single-event
upsets and single-event functional interrupts, it is recommended that appropriate value be written to the pointer
register each time a read operation is performed. Relying on the last value stored in the pointer register may
increase the probability of a failed read due to a single event upset.
Terminate read operations by issuing a not-acknowledge command at the end of the last byte to be read. For a
single-byte operation, the master must leave the SDA line high during the acknowledge time of the first byte that
is read from the slave.
7.5.1.5 Timeout Function
The TMP461-SP device resets the serial interface if either SCL or SDA are held low for 25 ms (typical) between
a start and stop condition. If the TMP461-SP device is holding the bus low, the device releases the bus and waits
for a start condition. To avoid activating the timeout function, maintaining a communication speed of at least 1
kHz for the SCL operating frequency is necessary.
7.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP461-SP device does not acknowledge this byte, but switches the input filters on SDA and
SCL and the output filter on SDA to operate in HS-mode, thus allowing transfers at up to 2.17 MHz. After the HS-
mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer operation.
The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the stop
condition, the TMP461-SP device switches the input and output filters back to fast mode operation.
16
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7.5.2 General-Call Reset
The TMP461-SP device supports reset using the two-wire general-call address 00h (0000 0000b). The TMP461-
SP device acknowledges the general-call address and responds to the second byte. If the second byte is 06h
(0000 0110b), the TMP461-SP device executes a software reset. This software reset restores the power-on reset
state to all TMP461-SP registers and aborts any conversion in progress. The TMP461-SP device takes no action
in response to other values in the second byte.
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7.6 Register Map
表 5. Register Map
BIT DESCRIPTION
POINTER READ POINTER WRITE
(HEX)
00
01
02
03
04
05
06
07
08
N/A
10
11
12
13
14
15
16
19
20
21
22
23
24
FE
(HEX)
N/A
N/A
N/A
09
POR (HEX)
00
7
LT11
RT11
BUSY
MASK1
0
6
LT10
RT10
LHIGH
SD
5
LT9
4
LT8
3
LT7
RT7
RLOW
0
2
LT6
1
LT5
0
LT4
RT4
LTHRM
0
REGISTER DESCRIPTION
Local Temperature Register (high byte)
Remote Temperature Register (high byte)
Status Register
00
RT9
RT8
RHIGH
0
RT6
OPEN
RANGE
CR2
LTHL6
LTLL6
RTHL6
RTLL6
X
RT5
RTHRM
0
N/A
00
LLOW
ALERT/THERM2
0
Configuration Register
0A
0B
0C
0D
0E
0F
08
0
0
CR3
LTHL7
LTLL7
RTHL7
RTLL7
X
CR1
LTHL5
LTLL5
RTHL5
RTLL5
X
CR0
LTHL4
LTLL4
RTHL4
RTLL4
X
Conversion Rate Register
7F
LTHL11
LTLL11
RTHL11
RTLL11
X
LTHL10
LTLL10
RTHL10
RTLL10
X
LTHL9
LTLL9
RTHL9
RTLL9
X
LTHL8
LTLL8
RTHL8
RTLL8
X
Local Temperature High Limit Register
Local Temperature Low Limit Register
80
7F
Remote Temperature High Limit Register (high byte)
Remote Temperature Low Limit Register (high byte)
One-Shot Start Register(1)
80
N/A
00
N/A
11
RT3
RT2
RT1
RT0
RTOS8
RTOS0
RTHL0
RTLL0
LT0
0
0
0
0
Remote Temperature Register (low byte)
Remote Temperature Offset Register (high byte)
Remote Temperature Offset Register (low byte)
Remote Temperature High Limit Register (low byte)
Remote Temperature Low Limit Register (low byte)
Local Temperature Register (low byte)
Channel Enable Register
00
RTOS11
RTOS3
RTHL3
RTLL3
LT3
RTOS10
RTOS2
RTHL2
RTLL2
LT2
RTOS9
RTOS1
RTHL1
RTLL1
LT1
RTOS7
0
RTOS6
0
RTOS5
0
RTOS4
0
12
00
13
F0
0
0
0
0
14
00
0
0
0
0
N/A
16
00
0
0
0
0
03
0
0
0
0
0
0
REN
RTH5
LTH5
HYS5
CONAL0
NC1
DF1
0
LEN
RTH4
LTH4
HYS4
1
19
7F
RTH11
LTH11
HYS11
0
RTH10
LTH10
HYS10
0
RTH9
LTH9
HYS9
0
RTH8
LTH8
HYS8
0
RTH7
LTH7
HYS7
CONAL2
NC3
0
RTH6
LTH6
HYS6
CONAL1
NC2
0
Remote Temperature THERM Limit Register
Local Temperature THERM Limit Register
THERM Hysteresis Register
20
7F
21
0A
01
22
Consecutive ALERT Register
23
00
NC7
NC6
NC5
NC4
0
NC0
DF0
1
η-Factor Correction Register
24
00
0
0
0
Digital Filter Control Register
N/A
55
0
1
0
1
0
1
Manufacturer Identification Register
(1) X = undefined. Writing any value to this register initiates a one-shot start; see the One-Shot Conversion section.
18
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ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
7.6.1 Register Information
The TMP461-SP device contains multiple registers for holding configuration information, temperature
measurement results, and status information. These registers are described in 图 17 and 表 5.
7.6.1.1 Pointer Register
图 17 shows the internal register structure of the TMP461-SP device. The 8-bit pointer register is used to
address a given data register. The pointer register identifies which of the data registers must respond to a read
or write command on the two-wire bus. This register is set with every write command. A write command must be
issued to set the proper value in the pointer register before executing a read command. 表 5 describes the
pointer register and the internal structure of the TMP461-SP registers. The power-on reset (POR) value of the
pointer register is 00h (0000 0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
Configuration Register
Conversion Rate Register
SDA
Local and Remote Temperature Limit Registers
One-Shot Start Register
I/O
Control
Interface
Remote Temperature Offset Registers
Local and Remote THERM Limit Registers
THERM Hysteresis Register
Consecutive ALERT Register
N-factor Correction Register
SCL
Digital Filter Register
Manufacturer ID Register
图 17. Internal Register Structure
7.6.1.2 Local and Remote Temperature Registers
The TMP461-SP device has multiple 8-bit registers that hold temperature measurement results. The eight most
significant bits (MSBs) of the local temperature sensor result are stored in register 00h, and the four least
significant bits (LSBs) are stored in register 15h (the four MSBs of register 15h). The eight MSBs of the remote
temperature sensor result are stored in register 01h, and the four LSBs are stored in register 10h (the four MSBs
of register 10h). The four LSBs of both the local and remote sensor indicate the temperature value after the
decimal point (for example, if the temperature result is 10.0625°C, then the high byte is 0000 1010 and the low
byte is 0001 0000). These registers are read-only and are updated by the ADC each time a temperature
measurement is completed.
When the full temperature value is needed, reading the MSB value first causes the LSB value to be locked (the
ADC does not write to it) until the LSB value is read. The same thing happens upon reading the LSB value first
(the MSB value is locked until it is read). This mechanism assures that both bytes of the read operation are from
the same ADC conversion. This assurance remains valid only until another register is read. For proper operation,
read the high byte of the temperature result first. Read the low byte register in the next read command; if the
LSBs are not needed, the register can be left unread. The power-on reset value of all temperature registers is
00h.
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7.6.1.3 Status Register
The status register reports the state of the temperature ADC, the temperature limit comparators, and the
connection to the remote sensor. 表 6 lists the status register bits. The status register is read-only and is read by
accessing pointer address 02h.
表 6. Status Register Format
STATUS REGISTER (Read = 02h, Write = N/A)
BIT NUMBER
BIT NAME
FUNCTION
7
6
5
4
3
2
1
0
BUSY
= 1 when the ADC is converting
LHIGH(1)
LLOW(1)
RHIGH(1)
RLOW(1)
OPEN(1)
RTHRM
LTHRM
= 1 when the local high temperature limit is tripped
= 1 when the local low temperature limit is tripped
= 1 when the remote high temperature limit is tripped
= 1 when the remote low temperature limit is tripped
= 1 when the remote sensor is an open circuit
= 1 when the remote THERM limit is tripped
= 1 when the local THERM limit is tripped
(1) These flags stay high until the status register is read or are reset by a POR when pin 7 is configured as ALERT. Only bit 2 (OPEN) stays
high until the status register is read or is reset by a POR when pin 7 is configured as THERM2.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
The LHIGH and LLOW bits indicate a local sensor overtemperature or undertemperature event, respectively. The
RHIGH and RLOW bits indicate a remote sensor overtemperature or undertemperature event, respectively. The
HIGH bit is set when the temperature exceeds the high limit in alert mode and therm mode and the low bit is set
when the temperature goes below the low limit in alert mode. The OPEN bit indicates an open-circuit condition
on the remote sensor. When pin 7 is configured as the ALERT output, the five flags are NORed together. If any
of the five flags are high, the ALERT interrupt latch is set and the ALERT output goes low. Reading the status
register clears the five flags, provided that the condition that caused the setting of the flags is not present
anymore (that is, the value of the corresponding result register is within the limits, or the remote sensor is
connected properly and functional). The ALERT interrupt latch (and the ALERT pin correspondingly) is not reset
by reading the status register. The reset is done by the master reading the temperature sensor device address to
service the interrupt, and only if the flags are reset and the condition that caused them to be set is no longer
present.
The RTHRM and LTHRM flags are set when the corresponding temperature exceeds the programmed THERM
limit. These flags are reset automatically when the temperature returns to within the limits. The THERM output
goes low in the case of overtemperature on either the local or remote channel, and goes high as soon as the
measurements are within the limits again. The THERM hysteresis register (21h) allows hysteresis to be added so
that the flag resets and the output goes high when the temperature returns to or goes below the limit value minus
the hysteresis value.
When pin 7 is configured as THERM2, only the high limits matter. The LHIGH and RHIGH flags are set if the
respective temperatures exceed the limit values, and the pin goes low to indicate the event. The LLOW and
RLOW flags have no effect on THERM2 and the output behaves the same way when configured as THERM.
20
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TMP461-SP
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ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
7.6.1.4 Configuration Register
The configuration register sets the temperature range, the ALERT/THERM modes, and controls the shutdown
mode. The configuration register is set by writing to pointer address 09h, and is read by reading from pointer
address 03h. 表 7 summarizes the bits of the configuration register.
表 7. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (Read = 03h, Write = 09h, POR = 00h)
BIT NUMBER
NAME
FUNCTION
POWER-ON RESET VALUE
0 = ALERT enabled
1 = ALERT masked
7
MASK1
0
0 = Run
1 = Shut down
6
SD
0
0 = ALERT
1 = THERM2
5
ALERT/THERM2
Reserved
0
0
0
0
4:3
2
—
0 = –40°C to +127°C
1 = –64°C to +191°C
RANGE
1:0
Reserved
—
MASK1 (bit 7) of the configuration register masks the ALERT output. If MASK1 is 0 (default), the ALERT output
is enabled. If MASK1 is set to 1, the ALERT output is disabled. This configuration applies only if the value of
ALERT/THERM2 (bit 5) is 0 (that is, pin 7 is configured as the ALERT output). If pin 7 is configured as the
THERM2 output, the value of the MASK1 bit has no effect.
The shutdown bit (SD, bit 6) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP461-SP device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP461-SP device stops converting when the current conversion sequence is complete and enters a shutdown
mode. When SD is set to 0 again, the TMP461-SP resumes continuous conversions. When SD = 1, a single
conversion can be started by writing to the one-shot start register; see the One-Shot Start Register section for
more information.
ALERT/THERM2 (bit 5) sets the configuration of pin 7. If the ALERT/THERM2 bit is 0 (default), then pin 7 is
configured as the ALERT output; if this bit is set to 1, then pin 7 is configured as the THERM2 output.
The temperature range is set by configuring RANGE (bit 2) of the configuration register. Setting this bit low
(default) configures the TMP461-SP device for the standard measurement range (–40°C to +127°C); temperature
conversions are stored in the standard binary format. Setting bit 2 high configures the TMP461-SP device for the
extended measurement range (–64°C to +191°C); temperature conversions are stored in the extended binary
format (see 表 2).
The remaining bits of the configuration register are reserved and must always be set to 0. The power-on reset
value for this register is 00h.
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21
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www.ti.com.cn
7.6.1.5 Conversion Rate Register
The conversion rate register (read address 04h, write address 0Ah) controls the rate at which temperature
conversions are performed. This register adjusts the idle time between conversions but not the conversion time
itself, thereby allowing the TMP461-SP power dissipation to be balanced with the temperature register update
rate. 表 8 lists the conversion rate options and corresponding time between conversions. The default value of the
register is 08h, which gives a default rate of 16 conversions per second.
表 8. Conversion Rate
VALUE
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
CONVERSIONS PER SECOND
TIME (Seconds)
0.0625
16
0.125
8
0.25
4
0.5
2
1
1
0.5
2
4
0.25
8
16 (default)
32
0.125
0.0625 (default)
0.03125
7.6.1.6 One-Shot Start Register
When the TMP461-SP device is in shutdown mode (SD = 1 in the configuration register), a single conversion is
started by writing any value to the one-shot start register, pointer address 0Fh. This write operation starts one
conversion and comparison cycle on either both the local and remote sensors or on only one or the other sensor,
depending on the LEN and REN values configured in the channel enable register (read address 16h, write
address 16h). The TMP461-SP device returns to shutdown mode when the cycle completes. The value of the
data sent in the write command is irrelevant and is not stored by the TMP461-SP device.
7.6.1.7 Channel Enable Register
The channel enable register (read address 16h, write address 16h) enables or disables the temperature
conversion of remote and local temperature sensors. LEN (bit 0) of the channel enable register enables/disables
the conversion of local temperature. REN (bit 1) of the channel enable register enables/disables the conversion
of remote temperature. Both LEN and REN are set to 1 (default), this enables the ADC to convert both local and
remote temperatures. If LEN is set to 0, the local temperature conversion is disabled and similarly if REN is set
to 0, the remote temperature conversion is disabled.
Both local and remote temperatures are converted by the internal ADC as a default mode. Channel Enable
register can be configured to achieve power savings by reducing the total ADC conversion time to half for
applications that do not require both remote and local temperature information.
7.6.1.8 Consecutive ALERT Register
The Consecutive ALERT register (read address 22h, write address 22h) controls the number of out-of-limit
temperature measurements required for ALERT to be asserted. 表 9 summarizes the values of the consecutive
ALERT register. The number programmed in the consecutive ALERT applies to both the remote and local
temperature results. When the number of times that the temperature result consecutively exceeds the high limit
register value is equal to the value programmed in the consecutive ALERT register, ALERT is asserted. Similarly,
the consecutive ALERT register setting is also applicable to the low-limit register.
表 9. Consecutive ALERT
REGISTER VALUE
NUMBER OF OUT-OF-LIMIT MEASUREMENTS REQUIRED TO ASSERT ALERT
01h
03h
07h
0Fh
1 (default)
2
3
4
22
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7.6.1.9 η-Factor Correction Register
The TMP461-SP device allows for a different η-factor value to be used for converting remote channel
measurements to temperature. The remote channel uses sequential current excitation to extract a differential VBE
voltage measurement to determine the temperature of the remote transistor. 公式 1 shows this voltage and
temperature.
hkT
I2
I1
VBE2 - VBE1
=
ln
q
(1)
The value η in 公式 1 is a characteristic of the particular transistor used for the remote channel. The power-on
reset value for the TMP461-SP device is η = 1.008. The value in the η-factor correction register can be used to
adjust the effective η-factor according to 公式 2 and 公式 3.
≈
∆
«
’
÷
◊
1.008 ì 2088
2088 + NADJUST
ꢀeff
=
(2)
≈
∆
«
’
÷
◊
1.008 ì 2088
NADJUST
=
- 2088
ꢀeff
(3)
The η-factor correction value must be stored in twos complement format, yielding an effective data range from
–128 to 127. The η-factor correction value is written to and read from pointer address 23h. The register power-on
reset value is 00h, thus having no effect unless a different value is written to it. The resolution of the η-factor
register is 0.000483.
表 10. η-Factor Range
NADJUST
BINARY
HEX
7F
0A
08
DECIMAL
η
0111 1111
0000 1010
0000 1000
0000 0110
0000 0100
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1111 1100
1111 1010
1111 1000
1111 0110
1000 0000
127
10
8
0.950205
1.003195
1.004153
1.005112
1.006073
1.007035
1.007517
1.008
06
6
04
4
02
2
01
1
00
0
FF
FE
FC
FA
F8
F6
80
–1
–2
–4
–6
–8
–10
–128
1.008483
1.008966
1.009935
1.010905
1.011877
1.012851
1.073829
7.6.1.10 Remote Temperature Offset Register
The offset register allows the TMP461-SP device to store any system offset compensation value that may result
from precision calibration. The value in the register is stored in the same format as the temperature result, and is
added to the remote temperature result upon every conversion. Combined with the η-factor correction, this
function allows for very accurate system calibration over the entire temperature range.
7.6.1.11 Manufacturer Identification Register
The TMP461-SP device allows for the two-wire bus controller to query the device for manufacturer and device
IDs to enable software identification of the device at the particular two-wire bus address. The manufacturer ID is
obtained by reading from pointer address FEh. The TMP461-SP device reads 55h for the manufacturer code.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP461-SP device requires only a transistor connected between the D+ and D– pins for remote
temperature measurement. Tie the D+ pin to D– or GND if the remote channel is not used and only the local
temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output)
require pullup resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is
recommended for local bypassing. 图 18 illustrates the typical configurations for the TMP461-SP device.
8.2 Typical Application
Vbatt
Vbatt
TL1431-SP
or
LM4050QML-SP
TL1431-SP
or
LM4050QML-SP
1.7 V to 3.6 V
1.7 V to 3.6 V
1
2
10
9
FPGA, ADC,
DAC, or ASIC
GND
V+
D+
A1
SMBus
Controller
SCL
Built-in
Thermal
Transistor
or Diode
TMP461-SP
3
4
8
7
Dœ
SDA
ALERT/
THERM2
Host Processor
THERM
5
6
A0
GND
GND
GND
Overtemperature
Shutdown
Copyright © 2017, Texas Instruments Incorporated
图 18. TMP461-SP Basic Connections Using a Processor Built-In Remote Transistor
8.2.1 Design Requirements
The TMP461-SP device is designed to be used with either discrete transistors or substrate transistors built into
processor chips and application-specific integrated circuits (ASICs). Either NPN or PNP transistors can be used,
as long as the base-emitter junction is used as the remote temperature sense. NPN transistors must be diode-
connected. PNP transistors can either be transistor- or diode-connected (see 图 18).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor and current
excitation used by the TMP461-SP device versus the manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate
transistors. The TMP461-SP device uses 7.5 μA for ILOW and 120 μA for IHIGH
.
The ideality factor (η) is a measured characteristic of a remote temperature sensor diode as compared to an
ideal diode. The TMP461-SP allows for different η-factor values; see the η-Factor Correction Register section.
24
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TMP461-SP
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ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
Typical Application (接下页)
The ideality factor for the TMP461-SP device is trimmed to be 1.008. For transistors that have an ideality factor
that does not match the TMP461-SP, 公式 4 can be used to calculate the temperature error.
注
For 公式 4 to be used correctly, the actual temperature (°C) must be converted to Kelvin
(K).
h - 1.008
TERR
=
´ (273.15 + T(°C))
1.008
where
•
•
•
TERR = error in the TMP461-SP device because η ≠ 1.008,
η = ideality factor of the remote temperature sensor,
T(°C) = actual temperature, and
(4)
(5)
In 公式 4, the degree of delta is the same for °C and K.
For η = 1.004 and T(°C) = 100°C:
1.004 - 1.008
1.008
≈
’
TERR
=
ì 273.15 + 100èC
(
)
∆
÷
◊
«
TERR = -1.48èC
If a discrete transistor is used as the remote temperature sensor with the TMP461-SP, the best accuracy can be
achieved by selecting the transistor according to the following criteria:
1. Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
2. Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
3. Base resistance is < 100 Ω.
4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).
Based on this criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP).
8.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP461-SP device monitors the ambient air around the device. The
thermal time constant for the TMP461-SP device is approximately two seconds. This constant implies that if the
ambient air changes quickly by 100°C, then the TMP461-SP device takes approximately 10 seconds (that is, five
thermal time constants) to settle to within 1°C of the final value. In most applications, the TMP461-SP package is
in electrical, and therefore thermal, contact with the printed circuit board (PCB), as well as subjected to forced
airflow. The accuracy of the measured temperature directly depends on how accurately the PCB and forced
airflow temperatures represent the temperature that the TMP461-SP is measuring. Additionally, the internal
power dissipation of the TMP461-SP can cause the temperature to rise above the ambient or PCB temperature.
The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the
small currents used. 公式 6 can be used to calculate the average conversion current for power dissipation and
self-heating based on the number of conversions per second and temperature sensor channel enabled. 公式 7
shows an example with local and remote sensor channels enabled and 16 conversions per second; see the
Electrical Characteristics table for typical values required for these calculations. For a 3.3-V supply and a
conversion rate of 16 conversions per second, the TMP461-SP device dissipates 0.531 mW (PDIQ = 3.3 V × 161
μA) when both the remote and local channels are enabled.
Average Conversion Current = Local ADC Conversion Time ì Conversions per Second ì Local Active I
(
)
(
)
(
)
Q
+ Remote ADC Conversion Time ì Conversions per Second ì Remote Active I
(
)
(
)
(
)
Q
»
ÿ
+ Standby Mode I ì 1- Local ADC Conversion Time + Remote ADC Conversion Time ì Conversions per Second
Q
⁄
(6)
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25
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ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
www.ti.com.cn
Typical Application (接下页)
16
s
≈
’
Average Conversion Current = 15 ms
ì 240 ꢀA
(
)
(
)
)
∆
«
÷
◊
16
s
≈
’
+ 15 ms ì
400 ꢀA
(
)
(
∆
÷
◊
«
»
ÿ
16
s
≈
’
+ 15 ꢀA ì 1- 15 ms + 15 ms ì
(
)
(
)
…
Ÿ
⁄
∆
«
÷
◊
= 161 ꢀA
(7)
The temperature measurement accuracy of the TMP461-SP device depends on the remote and local
temperature sensor being at the same temperature as the system point being monitored. If the temperature
sensor is not in good thermal contact with the part of the system being monitored, then there is a delay between
the sensor response and the system changing temperature. This delay is usually not a concern for remote
temperature-sensing applications that use a substrate transistor (or a small, SOT23 transistor) placed close to
the device being monitored.
26
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Typical Application (接下页)
8.2.3 Application Curve
图 19 shows the typical step response to submerging a sensor in an oil bath with a temperature of 100°C.
125
DUT1
DUT2
DUT3
100
75
50
25
0
-1
0
1
2
3
4
5
6
7
8
9
Time (s)
10
11
12
13
14
15
16
17
18
19
D011
图 19. Temperature Step Response
8.3 Radiation Environments
Careful consideration should be given to environmental conditions when using a product in a radiation
environment.
8.3.1 Single Event Latch-Up
One-time single event latch-up (SEL) testing was preformed according to EIA/JEDEC Standard, EIA/JEDEC57.
The linear energy transfer threshold (LETth) shown in Features is the maximum LET tested. A test report is
available upon request.
8.3.2 Single Event Functional Interrupt
To mitigate effects of single-event upsets and single-event functional interrupts, it is recommended that
appropriate value be written to the pointer register each time a read operation is performed. Relying on the last
value stored in the pointer register may increase the probability of a failed read due to a single event upset.
If other functions are being used, such as the temperature limit register, it may be necessary to rewrite these
registers on occasion.
8.3.3 Single Event Upset
A report on single event upset (SEU) is available upon request.
9 Power Supply Recommendations
The TMP461-SP device operates with a power-supply range of 1.7 V to 3.6 V. The device is optimized for
operation at a 3.3-V supply but can measure temperature accurately in the full supply range.
A power-supply bypass capacitor is recommended. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
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27
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www.ti.com.cn
10 Layout
10.1 Layout Guidelines
Remote temperature sensing on the TMP461-SP device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP461-SP have high
digital content, with several clocks and logic-level transitions that create a noisy environment. Layout must
adhere to the following guidelines:
1. Place the TMP461-SP device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in 图 20. If a multilayer PCB is used, bury these traces between the ground
or V+ planes to shield them from extrinsic noise sources. 5-mil (0.127 mm) PCB traces are recommended.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP461-SP device. For
optimum measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP461-SP
device.
5. If the connection between the remote temperature sensor and the TMP461-SP device is less than 8-in (20.32
cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded pair with
the shield grounded as close to the TMP461-SP device as possible. Leave the remote sensor connection
end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP461-SP device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
图 20. Suggested PCB Layer Cross-Section
28
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TMP461-SP
www.ti.com.cn
ZHCSH87B –SEPTEMBER 2017–REVISED FEBRUARY 2020
10.2 Layout Example
Via to Power or Ground Plane
Via to Internal Layer
Pullup Resistors
Supply Voltage
Ground Plane
Supply Bypass
Capacitor
V+
D+
A1
RS
RS
SCL
Thermal
Pad
CDIFF
D-
SDA
THERM
A0
ALERT/THERM2
GND
Thermal
Shutdown
Serial Bus Traces
图 21. TMP461-SP Layout Example
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TMP461-SP
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www.ti.com.cn
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 商标
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
30
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
5962-1721801VXC
5962R1721801VXC
TMP461HKU/EM
ACTIVE
CFP
CFP
CFP
HKU
10
10
10
1
RoHS-Exempt
& Green
AU
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
25 to 25
5962-1721801VXC
TMP461-SP
Samples
Samples
Samples
ACTIVE
ACTIVE
HKU
1
RoHS-Exempt
& Green
AU
AU
5962R1721801VXC
TMP461-SP
HKU
1
RoHS-Exempt
& Green
TMP461HKU/EM
EVAL ONLY
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2022
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP461-SP :
Catalog : TMP461
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
5962-1721801VXC
5962R1721801VXC
TMP461HKU/EM
HKU
HKU
HKU
CFP
CFP
CFP
10
10
10
1
1
1
506.98
506.98
506.98
26.16
26.16
26.16
6220
6220
6220
NA
NA
NA
Pack Materials-Page 1
PACKAGE OUTLINE
HKU0010A
CFP - 2.63mm max height
CERAMIC DUAL FLATPACK
7.06
6.66
B
METAL LID
A
PIN 1 ID
8X 1.27
10
1
7.27
(6.248)
6.77
2X 5.08
5
6
0.48
10X
0.38
(6.248)
0.2
C A
B
0.16
0.10
C
2.62 MAX
(4.7)
0.85
0.67
22.7 MAX
(4.3)
6
5
(6.62) (7.02)
1
10
PIN 1 ID
BACK SIDE PAD
METALIZATION
(THERMAL PAD)
4226200/A 09/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermetically sealed with a metal lid.
4. The terminals are gold plated.
5. This drawing does not comply with MIL STD 1835. Do not use this package for compliant product.
6. Metal lid is connected to back side pad metalization.
www.ti.com
EXAMPLE BOARD LAYOUT
HKU0010A
CFP - 2.63mm max height
CERAMIC DUAL FLATPACK
(4.3)
(1.2) TYP
(0.6)
PKG
(6.62)
(0.6)
(1.2) TYP
(
0.2) TYP
PKG
HEATSINK LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SCALE
SIZE
REV
PAGE
OF
4226200
3X
A
3
4
A
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