TMAG5328A1DQDBVR [TI]
电阻器可调节的低功耗霍尔效应开关 | DBV | 6 | -40 to 125;
| 型号： | TMAG5328A1DQDBVR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 电阻器可调节的低功耗霍尔效应开关 | DBV | 6 | -40 to 125 开关 电阻器 |
| 文件： | 总29页 (文件大小：1448K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5328
ZHCSLQ8A –DECEMBER 2021 –REVISED JUNE 2022
TMAG5328 电阻器和电压可调节的低功耗霍尔效应开关
1 特性
3 说明
• 电源电压范围1.65V 至5.5V
• BOP 可在2mT 至15mT 之间调节
TMAG5328 器件是一款高精度、低功耗、电阻器可调
的低压霍尔效应开关传感器。
– 使用2kΩ 至15kΩ 电阻器
– 或160mV 至1200mV 电压源
• 全极霍尔开关
• 推挽输出
• 低功耗
外部电阻器设置器件工作的 BOP 值。根据一个简单的
公式，很容易计算出设置正确的 BOP 值所需的阻值。
迟滞值是固定的，因此BRP 值被定义为BOP 迟滞值。
TMAG5328 具有这一可调阈值功能，可快速轻松地进
行原型设计，让设计快速上市，实现跨不同平台重用，
并支持发生意外变化时在最后一刻进行简单修改。
– 20Hz 采样率：1.4µA（3.3 V 时）
• 业界通用的封装和引脚
– SOT-23 封装
当施加的磁通密度超过 BOP 阈值时，器件会输出低电
压。输出会保持低电平，直到磁通密度低于BRP，随后
输出将驱动高电压。通过集成内部振荡器，该器件可对
磁场进行采样，并以 20Hz 的速率更新输出，以便实现
超低的电流消耗。TMAG5328 具有全极磁响应。
• –40°C 至125°C 工作温度范围
2 应用
• 电池关键型位置感应
• 电表篡改检测
此器件可在 1.65V 至 5.5V 的 VCC 范围内工作，并采
用标准SOT-23-6 封装。
• 手机、笔记本电脑或平板电脑保护壳感应
• 电子锁、烟雾探测器、电器
• 医疗设备、物联网系统
• 阀门或螺线管位置检测
• 非接触式诊断或激活
器件信息
封装(1)
封装尺寸（标称值）
器件型号
TMAG5328
SOT-23 (6)
2.92mm × 1.30mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
VCC
Low-Power
Oscillator
LDO
VCC
OUT
Device
control
ADJ
Thresholds
Output
control
Amp
Z
+
–
GND
GND
典型电路原理图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLYS044
TMAG5328
ZHCSLQ8A –DECEMBER 2021 –REVISED JUNE 2022
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Table of Contents
7.3 Feature Description...................................................10
7.4 Device Functional Modes..........................................13
8 Application and Implementation..................................14
8.1 Application Information............................................. 14
8.2 Typical Applications.................................................. 19
9 Power Supply Recommendations................................21
10 Layout...........................................................................21
10.1 Layout Guidelines................................................... 21
10.2 Layout Examples.................................................... 21
11 Device and Documentation Support..........................22
11.1 接收文档更新通知................................................... 22
11.2 支持资源..................................................................22
11.3 Trademarks............................................................. 22
11.4 Electrostatic Discharge Caution..............................22
11.5 术语表..................................................................... 22
12 机械、封装和可订购信息...............................................22
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................5
6.6 Magnetic Characteristics.............................................6
6.7 Typical Characteristics................................................7
7 Detailed Description........................................................9
7.1 Overview.....................................................................9
7.2 Functional Block Diagram...........................................9
4 Revision History
Changes from Revision * (December 2021) to Revision A (June 2022)
Page
• 将数据表状态从预告信息更改为量产数据.........................................................................................................1
• 添加了FA 和FD 器件版本..................................................................................................................................1
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5 Pin Configuration and Functions
TEST1
GND
ADJ
1
2
3
6
5
4
OUT
TEST2
VCC
Not to scale
图5-1. DBV Package 6-Pin SOT-23 Top View
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
GND
OUT
SOT-23
2
6
Ground reference
—
O
Omnipolar output that responds to north and south magnetic poles
1.65-V to 5.5-V power supply. TI recommends connecting this pin
to a ceramic capacitor to ground with a value of at least 0.1 µF
VCC
ADJ
4
3
—
This pin is used to set the thresholds up. Can either be connected
to a resistor or voltage source.
I
TEST1
TEST2
1
5
TI recommends to leave this pin floating
TI recommends connecting this pin to GND
—
—
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
-5
MAX
UNIT
Power Supply Voltage
Pin Voltage
VCC
5.5
V
OUT, TEST1
TEST2
VCC + 0.3
0.3
5.5
5
V
ADJ
Pin current
OUT, TEST1
mA
T
Magnetic Flux Density,BMAX
Junction temperature, TJ
Storage temperature, Tstg
Unlimited
Junction temperature, TJ
150
150
°C
°C
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per ANSI/ESDA/
JEDEC JS-002, all pins(2)
± 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
VCC
0
UNIT
VCC
Power supply voltage
Pin Voltage. OUT, TEST1
Pin Voltage. TEST2
Pin Voltage, ADJ
1.65
0
V
VIO
0
V
0
5
Io
Pin current. OUT, TEST1
Ambient temperature
5
mA
°C
–5
–40
TA
125
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6.4 Thermal Information
TMAG5328
THERMAL METRIC(1)
SOT-23 (DBV)
6 PINS
167.6
84.1
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
52.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
32
ΨJT
51.9
ΨJB
RθJC(bot)
–
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ADJ pin
ADJ_ICC
ADJ_C
Current output source
80
µA
pF
Maximum external capacitance
50
PUSH-PULL OUTPUT DRIVER
Vcc –
0.35
Vcc –
VOH
High-level output voltage
V
V
IOUT = –0.5 mA
0.1
VOL
Low-level output voltage
IOUT = 0.5 mA
0.1
0.3
TMAG5328A1D
fs
ts
Frequency of magnetic sampling
Period of magnetic sampling
20
50
Hz
ms
VCC = 3.3 V
TA = 25°C
1.4
1.6
2.3
µA
ICC(AVG)
Average current consumption
VCC = 1.65 V to 5.5 V
ALL VERSIONS
ICC(PK)
Peak current consumption
Sleep current consumption
Power-on time
1.8
300
125
3
mA
nA
µs
ICC(SLP)
600
tON
Power-on state without external magnetic
field
POS
VCC > VCCMIN
High
65
tACTIVE
Active time period
µs
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6.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TMAG5328A1D
BOP(Range A)
Adjustable Operate Point
Adjustable Release Point
Voltage range
±2
±1
±15
±14
mT
mT
mV
BRP(Range A)
VADJ (Range A)
160
1200
Resistor range
RADJ (Range A)
2
15 kOhm
mT/
kOhm
BOP(RADJ
)
BOP/R
±1
0.85
2 mT ≤BOPSET < 6 mT
6 mT ≤BOPSET ≤15 mT
2 mT ≤BOPSET < 6 mT
6 mT ≤BOPSET ≤15 mT
–0.85
–1.75
–1
BOP Accuracy
BOPSET ± BOP(MAX/MIN))/BOPSET
BOP_ACC(RADJ
)
1.75
1
mT
BRP Accuracy
BRPSET ± BRP(MAX/MIN)
BRP_ACC(RADJ
BHYSA(RADJ
)
-2.1
2.1
1.6
)
Magnetic hysteresis
|BOP - BRP
|
0.25
1
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6.7 Typical Characteristics
4
4
3
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
3
2
2
1
1
0
0
-1
-2
-3
-4
-1
-2
-3
-4
1.65
2.65
3.65
4.65
5.5
-40
-15
10
35
60
85
110
135 150
Supply Voltage (V)
Temperature (C)
TA = 25°C
VCC = 3.3 V
图6-2. 2-mT Magnetic Threshold vs Supply
图6-1. 2-mT Magnetic Threshold vs Temperature
12
12
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
8
4
8
4
0
0
-4
-8
-12
-4
-8
-12
1.65
2.65
3.65
4.65
5.5
-40
-15
10
35
60
85
110
135 150
Supply Voltage (V)
Temperature (C)
TA = 25°C
VCC = 3.3 V
图6-4. 7.5-mT Magnetic Threshold vs Supply
图6-3. 7.5-mT Magnetic Threshold vs Temperature
25
25
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
20
15
10
5
20
15
10
5
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
1.65
2.65
3.65
4.65
5.5
-40
-15
10
35
60
85
110
135 150
Supply Voltage (V)
Temperature (C)
TA = 25°C
VCC = 3.3 V
图6-6. 15-mT Magnetic Threshold vs Supply
图6-5. 15-mT Magnetic Threshold vs Temperature
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2
1.75
1.5
1.65 V
3.3 V
5.5 V
1.25
1
0.75
0.5
0.25
0
-40
-15
10
35
60
85
110
135 150
Temperature (C)
Sampling Rate = 20 Hz
图6-7. Average ICC vs Temperature
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7 Detailed Description
7.1 Overview
The TMAG5328 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a low-
frequency oscillator that enables ultra-low average power consumption.
While most of the Hall effect sensor have fixed threshold, the TMAG5328 offers an extra pin that allows the user
to set up a specific threshold of operation. This pin can either be connected to a resistor or a voltage source.
While the value can be set at production, it is also possible to allow dynamic change of either the resistor value
or the voltage value to dynamically change the threshold value.
Operating from a 1.65-V to 5.5-V supply, the device periodically measures magnetic flux density, updates the
output, and enters into a low-power sleep state.
7.2 Functional Block Diagram
VCC
Low-Power
Oscillator
LDO
VCC
OUT
Device
control
ADJ
Thresholds
Output
control
Amp
Z
+
–
GND
GND
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7.3 Feature Description
7.3.1 Magnetic Flux Direction
Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This
condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the
top to the bottom of the package results in negative millitesla values.
positive B
negative B
N
S
S
N
PCB
PCB
图7-1. Flux Direction Polarity
7.3.2 Magnetic Response
The TMAG5328A1D has omnipolar functionality, so the device responds to both positive and negative magnetic
flux densities, as shown in 图7-2.
OUT
BHYS
BHYS
VCC
0V
0 mT
B
BOP BRP
BRP BOP
north
south
图7-2. Omnipolar Functionality
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7.3.3 Output Type
. The TMAG5328A1D also has a push-pull CMOS output.
VCC
Output
Output
Control
图7-3. Push-Pull Output (Simplified)
7.3.4 Sampling Rate
When the TMAG5328 device powers up, the device measures the first magnetic sample and sets the output
within the tON time. The output is latched, and the device enters an ultra-low-power sleep state. After each tActive
time has passed, the device measures a new sample and updates the output if necessary. If the magnetic field
does not change between periods, the output also does not change.
While in active mode, the part will go through different steps. The content of the OTP (One-Time-Programmable
Memory) is loaded first, and this steps takes about 35 µs and consumes around 350 µA. For the next 5 µs, the
current source will be started and settled. The part now consumes around 650 µA in this step. Finally, the part
conducts the Hall sensor conversion for about 25 µs and consumes the peak current of around 2 mA.
Supply (V)
VCC
VCC(min)
0V
t (s)
tACTIVE
tACTIVE
tON
ICC(mA)
ICC(PK)
ICC(SLP)
t (s)
t (s)
Output (V)
High
2nd sample
Invalid
1st sample
Low
图7-4. Timing Diagram
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7.3.5 Adjustable Threshold
While most Hall Effect switch sensors have fixed magnetic characteristics, the TMAG5328 offers a wide range of
adjustable thresholds. The user can use the "ADJ" pin to set the value of BOP threshold. This pin can be used in
two different ways. A resistor or a voltage source can be applied on "ADJ". In both scenarios, the resistor or
voltage value will define the position of the BOP. While the BOP can be adjusted, the hysteresis has a fixed value.
BRP is therefore defined as BOP-Hysteresis.
An 80-µA current is generated on pin "ADJ" when the part goes into active mode. The device then reads the
"ADJ" pin and defines the value of BOP. The TMAG5328 supports adjusting the BOP dynamically. If the "ADJ" pin
value is adjusted while the sensor is in sleep mode, the BOP will update at the next active period of the device.
Consequently, the maximum time it could take for the BOP to update is equal to the period of magnetic sampling,
ts.
7.3.5.1 Adjustable Resistor
One way to setup the BOP is to connect a resistor to the "ADJ" pin. The device generates a fixed current that is
injected in the external resistor. This will generate a voltage that represents the BOP value. The relationship
between BOP and resistance is defined as BOP(mT) = RADJ(kΩ). Please note that the generated current on the
"ADJ" pin is only present when the device is in active mode and it is turned OFF when in sleep mode. As a
result, the voltage on the "ADJ" pin is only present when the device is in active mode, which is a small duration
compared to the time the device is in sleep mode.
The device BOP must be set to any value between 2 mT and 15 mT. This means RADJ must be set between 2 kΩ
and 15 kΩ. Operating above and beyond those limits is not recommended and could result in either getting the
wrong threshold set or locking up the device into a specific state without the possibility of exiting.
图7-5 shows the relationship between BOP and RADJ
.
BOP
15mT
8.5mT
2mT
RADJ
Short pin
8.5kOhm
15kOhm
2kOhm
Open pin
图7-5. BOP vs RADJ
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7.3.5.2 Adjustable Voltage
One other way to setup the BOP is to apply a voltage to the "ADJ" pin. This voltage is directly proportional to the
BOP value. The relationship between BOP and voltage is defined as BOP(mT)= VADJ(mV) × 0.0125. To apply a
voltage on the "ADJ" pin, the voltage source must be able to settle within 4 us after being exposed to a 80 uA
current on the ADJ pin.
The device BOP must be set to any value between 2 mT and 15 mT. This means VADJ must be set between 160
mV and 1200 mV. Operating above and beyond those limits is not recommended and could result in either
getting the wrong threshold set or locking up the device into a specific state without the possibility of exiting.
图7-6 shows the relationship between BOP and VADJ
.
BOP
15mT
8.5mT
2mT
VADJ
Short pin
680mV
1200mV
160mV
Open pin
图7-6. BOP vs RADJ
7.3.6 Hall Element Location
图7-7 shows the sensing element location inside the device.
6
5
4
Sensor location:
X1: 1.468 mm
X2: 1.458
Y1
Y2
X2
X1
Y1: 0.9925 mm
Y2: 0.6335 mm
Z1: 0.665 mm
Z2: 0.475 mm
1
2
3
Z1
Z2
图7-7. Hall Element Location
7.4 Device Functional Modes
The TMAG5328 device has one mode of operation that applies when the Recommended Operating Conditions
are met.
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8 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
8.1 Application Information
The TMAG5328 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
8.1.1 Output Type Tradeoffs
The push-pull output allows for the lowest system power consumption, because there is no current leakage path
when the output drives high or low. The open-drain output involves a leakage path when the output drives low,
through the external pullup resistor.
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of
sensors.
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8.1.2 Valid TMAG5328 Configurations
The TMAG5328 BOP is set by connecting a resistor or a voltage source to the “ADJ”pin. 图8-1 shows how to
use resistor R1 to set the BOP. 图 8-2 shows hows to use a DAC as a voltage source for setting the BOP. Using
the DAC allows the user to dynamically change the BOP with software. To use a DAC, the output of the DAC
must settle within 4 µs after the 80-µA current source of the “ADJ”pin is turned ON.
V+
V+
C2
C1
VCC
VCC
GND
GND
ADJ
TMAG5328
GND
Microcontroller
GPIO
OUT
TEST1
TEST2
R1
GND
GND
GND
图8-1. Setting BOP of One TMAG5328 Device Using a Resistor
V+
V+
C1
VDD
VCC
C3
GND
R1
GND
SCL
SCL
R2
CAP
DAC43701
Microcontroller
SDA
SDA
GPI
V+
GPIO1
C2
R3
GND
FB
VCC
TMAG5328
GND
GND
OUT
GND
AGND
ADJ
OUT
GND
TEST1
TEST2
GND
GND
图8-2. Setting BOP of One TMAG5328 Device Using a DAC
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As a DAC alternative, 图 8-3 shows how a voltage divider may be used as a voltage source. In 图 8-3, an
operational amplifier is placed between the voltage divider and the “ADJ” pin so that the voltage fed to the
“ADJ” pin is not impacted by the internal current source of the TMAG5328 when the current source is turned
ON. To use an op amp, the output of the op amp must settle within 4 µs after the 80-µA current source of the
“ADJ”pin is turned ON.
V+
V+
V+
C1
VCC
VCC
C3
C2
V+
GND
–
GND
GND
R1
ADJ
TLV9001
+
TMAG5328
GND
Microcontroller
GPIO
OUT
TEST1
TEST2
GND
R2
GND
GND
GND
GND
图8-3. Setting BOP of One TMAG5328 Device Using a Voltage Divider
A potentiometer or rheostat may be integrated into a voltage divider, and the user can adjust this potentiometer
to dynamically update the BOP. 图 8-4 shows how to use a potentiometer in a voltage divider to set the BOP of
the TMAG5328. The maximum output voltage, which determines the maximum BOP, is set based on the values
of resistors R1 and R3. The minimum output voltage, which determines the minimum BOP, is set based on the
values of the maximum potentiometer resistance, R1’s resistance, and R3’s resistance. The user should
select a minimum output voltage greater than 0.16 V and a maximum output voltage less than 1.2 V.
V+
V+
V+
C1
VCC
VCC
C3
C2
V+
GND
–
R1
R2
ADJ
TLV9001
+
TMAG5328
GND
Microcontroller
GPIO
OUT
TEST1
TEST2
GND
R3
GND
GND
GND
GND
图8-4. Setting BOP of One TMAG5328 Device Using a Voltage Divider and Potentiometer
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图 8-5 shows how the TMAG5328’s internal current source can drive a apotentiometer or rheostat instead of a
voltage divider. In this implementation, resistor R2 should be at least 2 kΩ to ensure that the “ADJ”resistance
is always above its minimum 2 kΩ. The sum of the maximum potentiometer resistance and the resistance of R1
must also be less than 15 kΩ.
V+
V+
VCC
VCC
C2
C1
GND
GND
ADJ
TMAG5328
GND
Microcontroller
GPIO
OUT
R1
TEST1
TEST2
GND
GND
R2
GND
图8-5. Setting BOP of One TMAG5328 Device Using a Potentiometer and the TMAG5328’s Internal
Current Source
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Multiple TMAG5328 devices may be used in the same system. When setting the BOP using a resistor, TI
recommends that each TMAG5328 has its own “ADJ” resistor, even if multiple TMAG5328 devices have the
same “ADJ” resistor value. 图 8-6 shows an example implementation that has three TMAG5328 devices. If
each device is set to the same BOP, then the resistances of R1, R2, and R3 are equal.
V+
VCC
C5
V+
GPIO1
GPIO2
GPIO3
C1
GND
GND
VCC
TMAG5328
GND
R1
Microcontroller
ADJ
OUT
GND
TEST1
TEST2
GND
GND
V+
C2
GND
GND
VCC
TMAG5328
GND
R2
ADJ
OUT
GND
TEST1
TEST2
GND
V+
C3
GND
VCC
TMAG5328
GND
R3
ADJ
OUT
GND
TEST1
TEST2
GND
图8-6. Setting BOP of Three TMAG5328 Devices Using Three Resistors
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When setting the BOP using a DAC, one DAC can be used to set the “ADJ” pin voltage of multiple devices
only if the DAC’s output could sink the current from all of the TMAG5328 devices. 图 8-7 shows an example of
a DAC driving the “ADJ” pin of three TMAG5328 devices. A DAC can only work reliably in this specific
scenario if the DAC’s output can settle within 4 µs after being exposed to the three “ADJ” current sources.
Each current source is 80 µA, therefore the DAC can only reliably work if the DAC's output can settle within 4 µs
after being exposed to 80 x 3 = 240 µA of current.
V+
V+
C1
VDD
VCC
C5
GND
R1
GND
SCL
SCL
R2
CAP
DAC43701
Microcontroller
SDA
SDA
GPI
V+
GPIO1
C2
R3
GND
FB
VCC
TMAG5328
GND
GND
OUT
GND
AGND
ADJ
OUT
GND
TEST1
TEST2
GND
GND
V+
C3
GND
VCC
TMAG5328
GND
ADJ
OUT
TEST1
TEST2
GND
V+
C4
GND
VCC
TMAG5328
GND
ADJ
OUT
TEST1
TEST2
GND
图8-7. Setting BOP of Three TMAG5328 Devices Using a DAC
8.2 Typical Applications
The TMAG5328 can be used in a large variety of industrial applications. For almost all these applications, the
sensor is fixed and the magnet is attached to a movable component in the system.
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8.2.1 Refrigerator Door Open/Close Detection
This application section describes how to use the same device for two identical applications with different
mechanical characteristic.
2°
2°
Refrigerator door 1
D1
D2
Refrigerator door 2
F1
F2
图8-8. Refrigerator 1 and Refrigerator 2 Principal Diagram
8.2.1.1 Design Requirements
For this design example, use the parameters listed in 表8-1.
表8-1. Design Parameters for Fridge 1
DESIGN PARAMETER
EXAMPLE VALUE
TMAG5328A1D
5 V
Hall effect device
VCC
Magnet
10 mm cubic N35
7.025 mm
500 mm
D1
F1
Door opening angle
Calculated threshold needed (BOP
RADJ
2°
)
7.87 mT
7.87 kΩ
表8-2. Design Parameters for Fridge 2
DESIGN PARAMETER
EXAMPLE VALUE
Hall effect device
TMAG5328A1D
5 V
VCC
Magnet
10 mm cubic N35
16.08 mm
500 mm
D2
F2
Door opening angle
Calculated threshold needed (BOP
RADJ
2°
)
3.49 mT
3.48 kΩ
8.2.1.2 Detailed Design Procedure
For both applications, the Hall sensor is used to detect if the refrigerator door is open or closed. Both refrigerator
doors are different from each other and therefore have different mechanical design. This means the Hall sensor
and the magnet are positioned differently from each other. In other terms, if the user wants to detect a specific
distance for both refrigerator doors, they must use either a different magnet or a different sensor. For the
purpose of this application, there is no flexibility in the choice of magnet. The electronic board will also be reused
across platforms and therefore will use the same sensor.
The TMAG5328 is a resistor adjustable Hall effect switch that allows the user to set up whatever threshold is
needed between 2 mT and 15 mT.
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For this application, the refrigerator door manufacturer can use the same printed circuit board (PCB) with the
same semiconductor content and only has to change the resistor value depending on which refrigerator version
is manufactured.
For both refrigerator doors, the opening angle is the same. Now refrigerator door 1 is a thinner model than
refrigerator door 2. This means the PCB is located further away for refrigerator door 2 and therefore the
sensitivity required to detect the position of the door will be impacted.
Knowing the door dimensions, the door opening angle required, and the distance from the magnet to the PCB, it
is possible to use a simulation tool that will calculate the magnet strength at the desired position. For refrigerator
door 1, the sensitivity calculated is 7.87 mT at a distance of 7.025 mm. For Refrigerator 2, the sensitivity is 3.49
mT at a distance of 16.08 mm. Based on those values, a resistor value can be selected from the E48 series. A
resistor of 7.87 kΩ can be used for refrigerator door 1 and resistor of 3.48 kΩ can be used for refrigerator door 2.
9 Power Supply Recommendations
The TMAG5328 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards, which makes placing the magnet on the
opposite side possible.
10.2 Layout Examples
TEST1
GND
ADJ
OUT
TEST2
VCC
GND
GND
VCC
SOT-23
图10-1. Layout Examples
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11 Device and Documentation Support
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，
且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMAG5328A1DQDBVR
ACTIVE
SOT-23
DBV
6
3000 RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
PA1
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5328A1DQDBVR SOT-23
DBV
6
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
190.0 190.0 30.0
TMAG5328A1DQDBVR
6
3000
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
B
1.45 MAX
A
PIN 1
INDEX AREA
1
2
6
5
2X 0.95
1.9
3.05
2.75
4
3
0.50
6X
0.25
C A B
0.15
0.00
0.2
(1.1)
TYP
0.25
GAGE PLANE
0.22
0.08
TYP
8
TYP
0
0.6
0.3
TYP
SEATING PLANE
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214840/C 06/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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