TMAG5273B3QDBVR [TI]
TMAG5273 3-Axis Linear Hall Effect Sensor With I2C Interface;型号: | TMAG5273B3QDBVR |
厂家: | TEXAS INSTRUMENTS |
描述: | TMAG5273 3-Axis Linear Hall Effect Sensor With I2C Interface |
文件: | 总59页 (文件大小:2331K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TMAG5273
SLYS045 – JUNE 2021
TMAG5273 3-Axis Linear Hall Effect Sensor With I2C Interface
1 Features
3 Description
•
•
•
5% (Typical) Sensitivity Drift Across Operating
Temperature
Integrated Temperature Compensation for Multiple
Magnet Types
Selectable Linear Magnetic Sensitivity Range at X,
Y, or Z Axis:
– TMAG5273A1: ±40 mT, ±80 mT
– TMAG5273A2: ±133 mT, ±266 mT
Maximum 1-MHz I2C Clock Speed
Cyclic Redundancy Check (CRC) with I2C Read
Maximum 20-Ksps Sensing Bandwidth per Axis
Interrupt Pin for Conversion Trigger and Status
Update
Integrated Angle CORDIC calculation with Gain
and Offset Adjustment
1.7-V to 3.6-V Supply Voltage VCC Range
The TMAG5273 is
a
3-Axis (3D) linear Hall
effect sensor designed for wide range of industrial
and personal electronics applications. This device
integrates 3 independent Hall sensors in X, Y,
and Z axes. A precision analog signal-chain along
with integrated 12-bit AD converter digitizes the
measured analog magnetic field values. The I2C
interface, while supporting multiple operating VCC
ranges, ensures seamless data communications with
low-voltage microcontrollers. The device integrated
temperature sensor data is available for multiple
system functions, such as thermal budget check or
temperature compensation calculation for a given
magnetic field.
•
•
•
•
•
•
The TMAG5273 can be configured to enable any
magnetic fields and temperature measurements at
any order required for a particular application. The
device supports user defined interrupt and conversion
trigger functions either through a dedicated INT pin, or
through I2C line. Threshold detection features, along
with wake up from sleep mode, enable flexible system
design to optimize speed versus power consumption.
Multiple diagnostics features enhance system design
robustness and data integrity.
2 Applications
•
•
•
•
•
•
•
•
•
Electricity Meters
Electronic Smart Lock
Smart Thermostat
Joystick & Gaming Controllers
Drone Payload Control
Door & Window Sensor
Magnetic Proximity Sensor
Mobile Robot Motor Control
E-Bike
The device is offered in two different orderables
for separate magnetic field ranges. Each orderable
part can be configured further to select one of two
magnetic field ranges that suits the magnet strength
and component placements during system calibration.
The high level of integration provides flexibility and
cost effectiveness in a wide array of sensing system
implementations.
1.7V to 3.6V
1.2V to 5.5V
VCC
INT
The device performs consistently across a wide
ambient temperature range of –40°C to +125°C.
TEST
SCL
SDA
Device Information(1)
GND
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TMAG5273
DBV (6)
2.9 mm × 1.6 mm
(1) For all available packages, see the package option
addendum at the end of the data sheet.
Application Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
TMAG5273
SLYS045 – JUNE 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Temperature Sensor .................................................. 5
6.7 Magnetic Characteristics For A1 ................................6
6.8 Magnetic Characteristics For A2 ................................7
6.9 Magnetic Temp Compensation Characteristics ..........7
6.10 I2C Interface Timing ................................................. 8
6.11 Power up & Conversion Time ...................................8
6.12 Typical Characteristics..............................................9
7 Detailed Description......................................................10
7.1 Overview...................................................................10
7.2 Functional Block Diagram.........................................10
7.3 Feature Description...................................................10
7.4 Programming............................................................ 19
7.5 Register Map.............................................................27
8 Application and Implementation..................................38
8.1 Application Information............................................. 38
8.2 Typical Application.................................................... 41
8.3 What to Do and What Not to Do............................... 43
9 Power Supply Recommendations................................43
10 Layout...........................................................................44
10.1 Layout Guidelines................................................... 44
10.2 Layout Example...................................................... 44
11 Device and Documentation Support..........................45
11.1 Documentation Support.......................................... 45
11.2 Receiving Notification of Documentation Updates..45
11.3 Support Resources................................................. 45
11.4 Trademarks............................................................. 45
11.5 Electrostatic Discharge Caution..............................45
11.6 Glossary..................................................................45
12 Mechanical, Packaging, and Orderable
Information.................................................................... 45
12.1 Package Option Addendum....................................49
12.2 Tape and Reel Information......................................52
4 Revision History
DATE
REVISION
NOTES
June 2021
*
Initial release.
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5 Pin Configuration and Functions
SCL
1
2
3
6
5
4
SDA
INT
GND
GND (TEST)
VCC
Not to scale
Figure 5-1. DBV Package 6-Pin SOT-23) Top View
Table 5-1. Pin Functions
PIN
TYPE
DESCRIPTION
NAME
SCL
NO.
1
IO
Ground
Serial clock.
GND
2
Ground reference.
GND (TEST)
VCC
3
Input
TI Test Pin. Connect to ground in application.
Power supply.
4
Power supply
Interrupt input/ output. If not used and connected to ground, set
MASK_INTB = 1b.
INT
5
6
IO
IO
SDA
Serial data.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
0
MAX
UNIT
V
VCC
IOUT
VOUT
VIN
Main supply voltage
4
Output current, SDA, INT
Output voltage, SDA, INT
Input voltage, SCL, SDA, INT
Magnetic flux density
10
mA
V
–0.3
–0.3
7
7
V
BMAX
TJ
Unlimited
150
T
Junction temperature
Storage temperature
–40
–65
°C
°C
Tstg
170
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JS-002, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
MIN
1.7
0
NOM
MAX
3.6
5.5
2
UNIT
V
VCC
VOUT
IOUT
VIH
Main supply voltage
Output voltage, SDA, INT
V
Output current, SDA, INT
mA
VCC
VCC
C
Input HIGH voltage, SCL, SDA, INT
Input LOW voltage, SCL, SDA, INT
Operating free air temperature
0.7
VIL
0.3
TA
–40
125
6.4 Thermal Information
TMAG5273
THERMAL METRIC(1)
DBV (SOT-23)
6 PINS
162
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
81.6
50.1
Junction-to-top characterization parameter
Junction-to-board characterization parameter
30.7
ΨJB
49.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SDA, INT
VOL
Output LOW voltage, SDA, INT pin
IOUT = 2mA
0
0
0.4
V
IOZ
Output leakage current, SDA, INT pin Output disabled, VOZ = 5.5V
100
nA
RPU =10KΩ, CL =20pF, VPU =1.65V to
5.5V
tFALL_INT
INT output fall time
6
ns
INT Interrupt time duration during
pulse mode
tINT (INT)
tINT (SCL)
INT_MODE =001b or 010b
INT_MODE =011b or 100b
10
10
µs
µs
SCL Interrupt time duration
DC POWER SECTION
(1)
VCCUV
IACTIVE
Under voltage threshold at VCC
VCC = 2.3V to 3.6V
1.9
2.0
2.3
2.2
V
X, Y, Z, or thermal sensor active
conversion, LP_LN =0b
Active mode current
Active mode current
mA
X, Y, Z, or thermal sensor active
conversion, LP_LN =1b
IACTIVE
2.7
mA
Device in trigger mode, no conversion
started
ISTANDBY
ISLEEP
Stand-by mode current
Sleep mode current
0.45
5
mA
nA
AVERAGE POWER DURING DUTY-CYCLE MODE
Wake-up interval 1-ms, magnetic 1-ch
conversion, LP_LN =0b, VCC =3.3V
ICC_DCM_1000_1
ICC_DCM_1000_1
ICC_DCM_1000_4
ICC_DCM_1000_4
Duty-cycle mode current consumption
Duty-cycle mode current consumption
Duty-cycle mode current consumption
Duty-cycle mode current consumption
153
152
227
227
µA
µA
µA
µA
Wake-up interval 1-ms, magnetic 1-ch
conversion, LP_LN =0b, VCC =1.8V
Wake-up interval 1-ms, 4-ch
conversion, LP_LN =0b, VCC =3.3V
Wake-up interval 1-ms, 4-ch
conversion, LP_LN =0b, VCC =1.8V
Wake-up interval 1000-ms,
ICC_DCM_0p2_1
Duty-cycle mode current consumption magnetic 1-ch conversion, LP_LN =0b,
VCC =3.3V
1.23
0.88
µA
µA
Wake-up interval 1000-ms,
Duty-cycle mode current consumption magnetic 1-ch conversion, LP_LN =0b,
VCC =1.8V
ICC_DCM_0p2_1
Wake-up interval 1000-ms, 4-ch
Duty-cycle mode current consumption
ICC_DCM_0p2_4
ICC_DCM_0p2_4
1.25
0.9
µA
µA
conversion, LP_LN =0b, VCC =3.3V
Wake-up interval 1000-ms, 4-ch
Duty-cycle mode current consumption
conversion, LP_LN =0b, VCC =1.8V
(1) The DIAG_STATUS and VCC_UV_ER bits are not valid for VCC < 2.3V
6.6 Temperature Sensor
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TSENS_RANGE
TADC_T0
Temperature sensing range
–40
170(1)
C
Temperature result in decimal value
(from 16-bit format) for TSENS_T0
17508
25
TSENS_T0
TADC_RES
NRMS_T
Reference temperature for TADC_T0
C
LSB/C
C
Temp sensing resolution (in 16-bit
format)
60.1
0.4
RMS (1 Sigma) temperature noise
CONV_AVG = 000b
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over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
NRMS_T
RMS (1 Sigma) temperature noise
CONV_AVG = 101b
0.2
C
(1) TI recommends not to exceed the specified operating free air temperature per the Recommended Operating Conditions table
6.7 Magnetic Characteristics For A1
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
X_Y_RANGE =0b
X_Y_RANGE =1b
Z_RANGE =0b
Z_RANGE =1b
±40 mT range
MIN
TYP
±40
±80
±40
±80
820
410
MAX UNIT
mT
BIN_A1_X_Y
Linear magnetic range
BIN_A1_X_Y
Linear magnetic range
mT
BIN_A1_Z
Linear magnetic range
mT
BIN_A1_Z
Linear magnetic range
mT
SENS40_A1
Sensitivity, X, Y, or Z axis
Sensitivity, X, Y, or Z axis
Sensitivity error, X, Y, Z axis
Sensitivity drift from 25C, X, Y, Z axis
Sensitivity Linearity Error, X, Y-axis
Sensitivity Linearity Error, Z axis
LSB/mT
LSB/mT
SENS80_A1
±80 mT range
SENSER_PC_25C_A1
SENSER_PC_TEMP_A1
SENSLER_XY_A1
SENSLER_Z_A1
SENSMS_XY_A1
TA =25C
±5.0% ±20.0%
±5.0%
TA =25C
TA =25C
±0.10%
±0.10%
Sensitivity mismatch among X-Y axes TA =25C
±0.50%
Sensitivity mismatch among Y-Z, or X-
Z axes
SENSMS_Z_A1
TA =25C
±1.0%
SENSMS_DR_XY_A1
SENSMS_DR_Z_A1
Sensitivity mismatch drift X-Y axes
±5%
Sensitivity mismatch drift Y-Z, or X-Z
axes
±15%
Boff_A1
Offset
TA =25C
±300
±3.0
±1000
µT
Boff_TC_A1
Offset drift
±10.0 µT/°C
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
NRMS_XY_00_000_A1
NRMS_XY_01_000_A1
NRMS_XY_00_101_A1
NRMS_XY_01_101_A1
NRMS_Z_00_000_A1
NRMS_Z_01_000_A1
NRMS_Z_00_101_A1
NRMS_Z_01_101_A1
AERR_Y_Z_101_A1_25
AERR_X_Z_101_A1_25
AERR_X_Y_101_A1_25
±125
±110
±31
±28
±45
±41
±11
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
µT
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
±9
µT
Y-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
CONV_AVG = 101, TA =25C
CONV_AVG = 101, TA =25C
±1.0
±1.0
±0.5
Degree
Degree
Degree
X-Z Angle error in full 360 degree
rotation
X-Y Angle error in full 360 degree
rotation
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6.8 Magnetic Characteristics For A2
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
±133
±266
±133
±266
250
MAX UNIT
mT
BIN_A2_X_Y
Linear magnetic range
X_Y_RANGE =0b
X_Y_RANGE =1b
Z_RANGE =0b
Z_RANGE =1b
±133 mT range
±266 mT range
TA = 25C
BIN_A2_X_Y
Linear magnetic range
mT
BIN_A2_Z
Linear magnetic range
mT
BIN_A2_Z
Linear magnetic range
mT
SENS133_A2
Sensitivity, X, Y, or Z axis
Sensitivity, X, Y, or Z axis
Sensitivity error, X, Y, Z axis
Sensitivity drift from 25C, X, Y, Z axis
Sensitivity Linearity Error, X, Y-axis
Sensitivity Linearity Error, Z axis
LSB/mT
LSB/mT
SENS266_A2
125
SENSER_PC_25C_A2
SENSER_PC_TEMP_A2
SENSLER_XY_A2
SENSLER_Z_A2
SENSMS_XY_A2
±5.0% ±20.0%
±5.0%
TA =25C
TA =25C
±0.10%
±0.10%
Sensitivity mismatch among X-Y axes TA =25C
±0.50%
Sensitivity mismatch among Y-Z, or X-
Z axes
SENSMS_Z_A2
TA =25C
±1.0%
±5%
SENSMS_DR_XY_A2
SENSMS_DR_Z_A2
Sensitivity mismatch drift X-Y axes
Sensitivity mismatch drift Y-Z, or X-Z
axes
±15%
Boff_A2
Offset
TA =25C
±300
±3.0
±1000
µT
Boff_TC_A2
Offset drift
±10 µT/°C
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
NRMS_XY_00_000_A2
NRMS_XY_01_000_A2
NRMS_XY_01_101_A2
NRMS_XY_10_101_A2
NRMS_Z_00_000_A2
NRMS_Z_10_000_A2
NRMS_Z_00_101_A2
NRMS_Z_10_101_A2
AERR_Y_Z_101_A2
AERR_X_Z_101_A2
AERR_X_Y_101_A2
±150
±145
±37
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
µT
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
±34
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
±75
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
±71
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
±19
µT
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
±16
µT
Y-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
CONV_AVG = 101, TA =25C
CONV_AVG = 101, TA =25C
±1.0
±1.0
±0.50
Degree
Degree
Degree
X-Z Angle error in full 360 degree
rotation
X-Y Angle error in full 360 degree
rotation
6.9 Magnetic Temp Compensation Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MAG_TEMPCO =00b
MIN
TYP
MAX UNIT
%/°C
TC_00
TC_12
TC_20
Temperature compensation (X, Y, Z-axes)
Temperature compensation (X, Y, Z-axes)
Temperature compensation (X, Y, Z-axes)
0
0.12
0.2
MAG_TEMPCO =01b
MAG_TEMPCO =11b
%/°C
%/°C
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6.10 I2C Interface Timing
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
I2C Interface Fast Mode Plus (VCC =2.3V to 3.6V)
LOAD = 50 pF, VCC
=2.3V to 3.6V
fI2C_fmp
I2C clock (SCL) frequency
1000 KHz
twhigh_fmp
twlo_wfmp
tsu_cs_fmp
th_cs_fmp
ticr_fmp
High time: SCL logic high time duration
Low time: SCL logic low time duration
SDA data setup time
350
500
50
ns
ns
ns
ns
SDA data hold time
120
SDA, SCL input rise time
120
55
ns
ns
µs
µs
µs
µs
ticf_fmp
SDA, SCL input fall time
th_ST_fmp
tsu_SR_fmp
tsu_SP_fmp
tw_SP_SR_fmp
Start condition hold time
0.1
0.1
0.1
0.2
Repeated start condition setup time
Stop condition setup time
Bus free time between stop and start condition
I2C Interface Fast Mode (VCC =1.7V to 3.6V)
LOAD = 50 pF, VCC
=1.7V to 3.6V
fI2C
I2C clock (SCL) frequency
400 KHz
twhigh
twlow
tsu_cs
th_cs
High time: SCL logic high time duration
Low time: SCL logic low time duration
SDA data setup time
600
1300
100
0
ns
ns
ns
ns
SDA data hold time
ticr
SDA, SCL input rise time
300
300
ns
ns
µs
µs
µs
µs
ticf
SDA, SCL input fall time
th_ST
tsu_SR
tsu_SP
tw_SP_SR
Start condition hold time
0.3
0.3
0.3
0.6
Repeated start condition setup time
Stop condition setup time
Bus free time between stop and start condition
6.11 Power up & Conversion Time
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Time to go to stand-by mode after VCC supply
tstart_power_up
270
50
µs
µs
µs
voltage crossing VCC_MIN
tstart_sleep
Time to go to stand-by mode from sleep mode(1)
Time to go into continuous measure mode from
stand-by mode
tstart_measure
80
CONV_AVG = 000b,
OPERATING_MODE =10b, only one
channel enabled
tmeasure
Conversion time(2)
50
µs
CONV_AVG = 101b,
OPERATING_MODE =10b, only one
channel enabled
tmeasure
tgo_sleep
Conversion time(3)
825
20
µs
µs
Time to go into sleep mode after SCL goes high
(1) The device will recognize the I2C communication from a primary only during stand-by or continuous measure modes. While the device
is in sleep mode, a valid secondary address will wake up the device but no acknowledge will be sent to the primary. Start up time need
to be considered before addressing the device after wake up.
(2) Add 25µs for each additional magnetic channel enabled for conversion with CONV_AVG = 000b. When CONV_AVG = 000b, the
conversion time doesn't change with the T_CH_EN bit setting.
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(3) For conversion with CONV_AVG =101b, each channel data is collected 32 times. If an additional channel is enabled with CONV_AVG
=101b, add 32×25µs = 800µs to the tmeasure to calculate the conversion time for two channels.
6.12 Typical Characteristics
at TA = 25°C typical (unless otherwise noted)
Figure 6-1. Standby Mode ICC vs. Temperature
Figure 6-2. Active Mode ICC vs. Temperature
Figure 6-3. Sleep Mode ICC vs. Temperature
Figure 6-4. Average ICC vs. DCM Mode Sleep Time
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7 Detailed Description
7.1 Overview
The TMAG5273 IC is based on the Hall-effect technology and precision mixed signal circuitry from Texas
Instruments. The output signals (raw X, Y, Z magnetic data and temperature data) are accessible through the I2C
interface.
The IC consists of the following functional and building blocks:
• The power mode control system supports two different power rail, the VCC, containing a low-power oscillator,
basic biasing, accurate reset, undervoltage detection, and a fast oscillator.
• The sensing and measurement block contains the hall biasing, hall probes with multiplexers, noise filters,
temperature sensor, and a 12-bit AD converter. The hall sensor data and temperature data are multiplexed
through the same ADC.
• The I2C interface, containing the register files and I/O pads. The TMAG5273 supports clock speed up to 1MHz
at VCC range from 2.3V to 3.6V, and up to 400KHz at VCC range below 2.3V.
7.2 Functional Block Diagram
VCC
Power Management & Oscillator
SCL
Result Registers
Z
X
+
Gain &
ADC
MUX
Filtering
Interface
SDA
INT
-
TEST
Y
Config Registers
Temp sensor
Digital Core
7.3 Feature Description
7.3.1 Magnetic Flux Direction
As shown in Figure 7-1, the TMAG5273 will generate positive ADC codes in response to a magnetic north pole
in the proximity. Similarly, the TMAG5273 will generate negative ADC codes if magnetic south poles approach
from the same directions.
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S
N
1
2
3
Figure 7-1. Direction of Sensitivity
7.3.2 Sensor Location
Figure 7-2 shows the location of X, Y, Z hall elements inside the TMAG5273.
1.85-mm
Y
X
Z
0.68-mm
Figure 7-2. Location of X, Y, Z Hall Elements
7.3.3 Interrupt Function
The TMAG5273 supports flexible and configurable interrupt functions through either the INT or the SCL pin.
Table 7-1 shows different conversion completion events where result registers and SET_COUNT bits update,
and where they do not.
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Table 7-1. Result Register & SET_COUNT Update After Conversion Completion
I2C Bus Busy, not Talking to
Device
I2C Bus Busy & Talking to
Device
I2C Bus not Busy
Mode
Description
INT_MODE
Result
SET_COUNT Result
SET_COUNT
Update?
Result
SET_COUNT
Update?
Update?
Update?
Update?
Update?
000b
001b
No Interrupt
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
Interrupt
Yes
No
Yes
through INT
010b
Interrupt
through
Yes
Yes
No
No
Yes
Yes
INTExcept
when I2C Busy
011b
100b
Interrupt
through SCL
Yes
No
Yes
No
No
No
No
No
Yes
Yes
Yes
Yes
Interrupt
through SCL
Except when
I2C Busy
Note
It is not recommended to share the same I2C bus with multiple secondary devices when using
the SCL pin for interrupt function. The SCL interrupt may corrupt transactions with other secondary
devices if present in the same I2C bus.
Interrupt Through SCL
Figure 7-3 shows an example for interrupt function through the SCL pin with the device programmed to wake
up and measure for threshold cross at a predefined intervals. The wake-up intervals can be set through the
SLEEPTIME bits. Once the magnetic threshold cross is detected, the device asserts a fixed width interrupt signal
through the SCL pin, and goes back to stand-by mode.
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Stand-by Mode
Wake-up & Sleep Mode
Opera ng Mode
X Ch Threshold
X Magne c Field
Interrupt via SCL
Time
Figure 7-3. Interrupt Through SCL
Fixed Width Interrupt Through INT
Figure 7-4 shows an example for fixed-width interrupt function through the INT pin. The device is programmed
to be in wake-up & sleep mode to detect a magnetic threshold. The INT_STATE register bit is set 1b. Once the
magnetic threshold cross is detected, the device asserts a fixed width interrupt signal through the INT pin, and
goes back to stand-by mode.
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Stand-by Mode
Wake-up & Sleep Mode
Opera ng Mode
X Ch Threshold
X Magne c Field
Interrupt via INT
(Fixed Width)
SCL Line
Time
Figure 7-4. Fixed Width Interrupt Through INT
Latched Interrupt Through INT
Figure 7-5 shows an example for latched interrupt function through the INT pin. The device is programmed to
be in wake-up & sleep mode to detect a magnetic threshold. The INT_STATE register bit is set 0b. Once the
magnetic threshold cross is detected, the device asserts a latched interrupt signal through the INT pin, and goes
back to stand-by mode. The interrupt latch is cleared only after the device receives a valid address through the
SCL line.
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Stand-by Mode
Wake-up & Sleep Mode
Opera ng Mode
X Ch Threshold
X Magne c Field
Interrupt via INT
(Latched)
SCL Line
Time
Figure 7-5. Latched Interrupt Through INT
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7.3.4 Device I2C Address
Table 7-2 shows the default factory programmed I2C addresses of the TMAG5273. The device needs to be
addressed with the factory default I2C address after power up. If required, a primary can assign a new I2C
address through the I2C_ADDRESS register bits after power up.
Table 7-2. I2C Default Address
Device Version
TMAG5273A1
TMAG5273B1
TMAG5273C1
TMAG5273D1
TMAG5273A2
TMAG5273B2
TMAG5273C2
TMAG5273D2
Magnetic Range I2C Address (7 MSB Bits)
I2C Write Address (8-Bit)
I2C Read Address (8-Bit)
35h
6Ah
44h
F0h
88h
6Ah
44h
F0h
88h
6Bh
45h
F1h
89h
6Bh
45h
F1h
89h
22h
±40 mT, ±80 mT
78h
44h
35h
22h
±133 mT, ±266 mT
78h
44h
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7.3.5 Magnetic Range Selection
Table 7-3 shows the magnetic range selection for the TMAG5273 device. The X, Y, and Z axes range can be
selected with the X_Y_RANGE and Z_RANGE register bits.
Table 7-3. Magnetic Range Selection
RANGE REGISTER SETTING
X_Y_RANGE = 0b
X_Y_RANGE = 1b
Z_RANGE = 0b
TMAG5273A1-Q1
TMAG5273A2-Q1
Comment
±40 mT
±133 mT
X, Y Axis Field
Z Axis Field
±80 mT
±266 mT
Better SNR performance
Better SNR performance
±40 mT
±133 mT
Z_RANGE = 1b
±80 mT
±266 mT
7.3.6 Update Rate Settings
The TMAG5273 offers multiple update rates to offer design flexibility to system designers. The different update
rates can be selected with the CONV_AVG register bits. Table 7-4 shows different update rate settings for the
TMAG5273.
Table 7-4. Update Rate Settings
UPDATE RATE
TWO AXES
13.3 Ksps
8.0 Ksps
OPERATING
MODE
REGISTER SETTING
Comment
SINGLE AXIS
20.0 Ksps
13.3 Ksps
8.0 Ksps
THREE AXES
10.0 Ksps
5.7 Ksps
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
CONV_AVG = 000b
CONV_AVG = 001b
CONV_AVG = 010b
CONV_AVG = 011b
CONV_AVG = 100b
CONV_AVG = 101b
Fastest update rate
4.4 Ksps
3.1 Ksps
4.4 Ksps
2.4 Ksps
1.6 Ksps
2.4 Ksps
1.2 Ksps
0.8 Ksps
1.2 Ksps
0.6 Ksps
0.4 Ksps
Best SNR case
7.3.7 Power Saving Modes
The TMAG5273 supports multiple operating modes for wide array of applications as explained in Figure 7-6.
A specific operating mode is selected by setting the corresponding value in the OPERATING_MODE register
bits. The device starts powering up after VCC supply crosses the minimum threshold as specified in the
Recommended Operating Condition (ROC) table.
7.3.7.1 Standby (Trigger) Mode
The TMAG5273 goes to standby mode after first time powering up. At this mode the digital circuitry and
oscillators are on, and the device is ready to accept commands from the primary device. Based off the
commands the device can start a sensor data conversion, goes to power saving mode, or start data transfer
through I2C interface. A new conversion can be triggered through I2C command or through INT pin. In this mode
the device retains the immediate past conversion result data in the corresponding result registers. The time it
takes for the device to go to standby mode from power up is denoted by Tstart_power_up
.
7.3.7.2 Sleep Mode
The TMAG5273 supports an ultra-low power sleep mode where it retains the critical user configuration settings.
In this mode the device doesn't retain the conversion result data. A primary can wake up the device from sleep
mode through I2C communications or the INT pin. The time it takes for the device to go to stand-by mode from
sleep mode is denoted by Tstart_sleep
.
7.3.7.3 Wake-up & Sleep (W&S) Mode
In this mode the TMAG5273 can be configured to go to sleep and wake up at a certain interval, and measure
sensor data based off the SLEEPTIME register bits setting. The device can be set to generate an interrupt
through the INT_CONFIG_1 register. Once the conversion is complete and the interrupt condition is met, the
TMAG5273 will exit the W&S mode and go to the stand-by mode. The last measured data will be stored in the
corresponding result registers before the device goes to the stand-by mode. If the interrupt condition isn't met,
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the device will continue to be in the W&S mode to wake up and measure data at the specified interval. A primary
can wake up the TMAG5273 anytime during the W&S mode through I2C bus or INT pin. The time it takes for the
device to go to stand by mode from W&S mode is denoted by Tstart_sleep
.
7.3.7.4 Continuous Measure Mode
In this mode the TMAG5273 continuously measures the sensor data per SENSOR_CONFIG &
DEVICE_CONFIG register settings. In this mode the result registers can be accessed through the I2C lines. The
time it takes for the device to go from stand-by mode to continuous measure mode is denoted by Tstart_measure
.
7.3.7.5
Device Startup: (VCC crossing MIN threshold specified in the ROC
table)
Sleep Mode
Wake-up & Sleep Mode
Tstart_power_up
Tstart_sleep
Tgo_sleep
Stand-by (Trigger) Mode
Tstart_measure
Continuous Measure Mode
Figure 7-6. TMAG5273 Power-Up Sequence
Table 7-5 shows different device operational modes of the TMAG5273.
Table 7-5. Operating Modes
Access to
User
Registers
Operating
Mode
Retain User
Configuration
Device Function
Comment
Continuous Continuously measuring x, y, z axis,
Yes
Yes
Yes
Yes
Measure Mode
or temperature data
Device is ready to accept
I2C commands and start active
conversion
Stand-by
Mode
Wakes up at a certain interval
to measure the x, y, z axis, or
temperature data
Wake-up &
Sleep Mode
1, 5, 10, 15, 20, 30, 50, 100, 500, 1000, 2000, 5000,
& 20000-ms intervals supported.
No
No
Yes
Yes
Device retains key configuration
settings, but doesn't retain the
measurement data
Sleep mode can be utilized by a primary device
to implement other power saving intervals not
supported by wake-up & sleep mode.
Sleep Mode
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7.4 Programming
7.4.1 I2C Interface
The TMAG5273 offers I2C interface, a two-wire interface to connect low-speed devices like microcontrollers, A/D
and D/A converters, I/O interfaces and other similar peripherals in embedded systems.
7.4.1.1 SCL
SCL is the clock line. It is used to synchronize all data transfers over the I2C bus.
7.4.1.2 SDA
SDA is the bidirectional data line for the I2C interface.
7.4.1.3 I2C Read/Write
The TMAG5273 supports multiple I2C read and write frames targeting different applications. I2C_RD and
CRC_EN bits offers multiple read frames to optimize the read time, data resolution and data integrity for a
select application.
7.4.1.3.1 Standard I2C Write
Figure 7-7 shows an example of standard I2C two byte write command supported by TMAG5273. The starting
byte contains 7-bit secondary device address and a '0' at the R/W command bit. The MSB of the second byte
contains the conversion trigger bit. Writing '1' at this trigger bit will start a new conversion after the register
address decoding is completed. The 7 LSB bits of the second byte contains the starting register address for
the write command. After the two command bytes, the primary device starts to send the data to be written at
the corresponding register address. Each successive write byte will send the data for the successive register
address in the secondary device.
Primary Data
ACK from Secondary
No ACK from Primary
Trigger Command
Secondary Data
Start/ Stop from Primary
ACK from Primary
0
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+n]
Register address
Secondary address
Figure 7-7. Standard I2C Write
7.4.1.3.2 General Call Write
Figure 7-8 shows an example of the general call I2C write command supported by the TMAG5273. This
command is useful to configure multiple I2C devices in a I2C bus simultaneously. The starting byte contains
8-bit '0's. The MSB of the second byte contains the conversion trigger bit. Writing '1' at this trigger bit will start a
new conversion after the register address decoding is completed. The 7 LSB bits of the second byte contains the
starting register address for the write command. After the two command bytes, the primary device starts to send
the data to be written at the corresponding register address of all the secondary devices in the I2C bus. Each
successive write byte will send the data for the successive register address in the secondary devices.
Primary Data
ACK from Secondary
No ACK from Primary
Trigger Command
Secondary Data
Start/ Stop from Primary
ACK from Primary
0
0 0 0 0 0 0 0
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+N]
Register address
General call address
Figure 7-8. General Call I2C Write
7.4.1.3.3 Standard 3-Byte I2C Read
Figure 7-9 and Figure 7-10 show examples of standard I2C three byte read command supported by the
TMAG5273. The starting byte contains 7-bit secondary device address and the R/W command bit '0'. The
MSB of the second byte contains the conversion trigger command bit. Writing '1' at this trigger bit will start a
new conversion after the register address decoding is completed. The 7 LSB bits of the second byte contains
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the starting register address for the write command. After receiving ACK signal from secondary, the primary send
the secondary address once again with R/W command bit as '1'. The secondary starts to send the corresponding
register data. It will send successive register data with each successive ACK from primary. If CRC is enabled,
the secondary will send the fifth CRC byte based off the CRC calculation of immediate past 4 register bytes.
Note
In the standard 3-byte read command the TMAG5273 doesn't support CRC if the data length is more
than 4 byte. Initiate successive read commands for larger data stream requiring CRC.
Primary Data
ACK from Secondary
ACK from Primary
No ACK from Primary
Trigger Command
Secondary Data
Start/ Stop from Primary
0
1
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+n]
Register address
Secondary address
Secondary address
Figure 7-9. Standard 3-Byte I2C Read With CRC Disabled, CRC_EN = 0b
Primary Data
ACK from Secondary
Trigger Command
No ACK from Primary
ACK from Primary
Start/ Stop from Primary
Secondary Data
0
1
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+2]
Register address
Secondary address
Secondary address
Data[Reg_Add+3]
CRC
Figure 7-10. Standard 3-Byte I2C Read With CRC Enabled, CRC_EN = 1b
7.4.1.3.4 1-Byte I2C Read Command for 16-Bit Data
Figure 7-11 and Figure 7-12 show examples of 1-byte I2C read command supported by the TMAG5273. Select
I2C_RD =01b to enable this mode. The command byte contains 7-bit secondary device address and a '1' at
the R/W bit. In this mode, per MAG_CH_EN and T_CH_EN bits setting, the device will send 16-bit data of
the enabled channels and the CONV_STATUS register data byte. If CRC is enabled, the device will send an
additional CRC byte based off the CRC calculation of the command byte and the data sent in the current packet.
When multiple channels are enabled, the sent data follows the T, X, Y, and Z sequence in the successive data
bytes.
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Primary Data
Secondary Data
ACK from Secondary
ACK from Primary
No ACK from Primary
Start/ Stop from Primary
1
Secondary address
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[CONV_STATUS]
Data[Axis2_MSB]
Data[Y_MSB]
Single Axis Measurement Example,. X or Y or Z
1
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[Axis2_LSB]
Data[CONV_STATUS]
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
1
Data[X_MSB]
Data[X_LSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Secondary address
Data[CONV_STATUS]
Three Axes Measurement Example, XYZ
1
Data[T_MSB]
Data[T_LSB]
Data[X_MSB]
Data[X_LSB]
Data[Y_MSB]
Data[Y_LSB]
Secondary address
Data[Z_MSB]
Data[Z_LSB]
Data[CONV_STATUS]
All Sensors Measurement Example, TXYZ
Figure 7-11. 1-Byte I2C Read Command for 16-Bit Data With CRC Disabled, CRC_EN = 0b
Primary Data
ACK from Secondary
ACK from Primary
No ACK from Primary
Secondary Data
Start/ Stop from Primary
1
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[CONV_STATUS]
Data[Axis2_MSB]
Data[Y_MSB]
CRC
Secondary address
Single Axis Measurement Example,. X or Y or Z
1
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[Axis2_LSB]
Data[CONV_STATUS]
CRC
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
1
Data[X_MSB]
Data[X_LSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Secondary address
Data[CONV_STATUS]
CRC
Three Axes Measurement Example, XYZ
1
Data[T_MSB]
Data[T_LSB]
Data[Y_MSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Secondary address
Data[CONV_STATUS]
CRC
Three Axes Measurement Example, TYZ
Figure 7-12. 1-Byte I2C Read Command for 16-Bit Data With CRC Enabled, CRC_EN = 1b
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Note
In the 1-byte read command for 16-bit data only up to 3 channels data can be sent when CRC is
enabled. This restriction doesn't apply if CRC is disabled.
7.4.1.3.5 1-Byte I2C Read Command for 8-Bit Data
Figure 7-13 and Figure 7-14 show examples of 1-byte I2C read command supported by the TMAG5273. Select
I2C_RD =10b to enable this mode. The command byte contains 7-bit secondary device address and a '1' at
the R/W bit. In this mode, per MAG_CH_EN and T_CH_EN bits setting, the device will send 8-bit data of
the enabled channels and the CONV_STATUS register data byte. If CRC is enabled, the device will send an
additional CRC byte based off the CRC calculation of the command byte and the data sent in the current packet.
When multiple channels are enabled, the sent data follows the T, X, Y, and Z sequence in the successive data
bytes.
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
Start/ Stop from Primary
ACK from Primary
1
Data[Axis1_MSB]
Data[CONV_STATUS]
Secondary address
Single Axis Measurement Example,. X or Y or Z
1
Data[Axis1_MSB]
Data[Axis2_MSB]
Data[CONV_STATUS]
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
1
Data[Y_MSB]
Data[X_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
Secondary address
Three Axes Measurement Example, XYZ
1
Data[Y_MSB]
Data[X_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
Data[T_MSB]
Secondary address
All Sensors Measurement Example, TXYZ
Figure 7-13. 1-Byte I2C Read Command for 8-Bit Data With CRC Disabled, CRC_EN = 0b
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Primary Data
Secondary Data
ACK from Secondary
ACK from Primary
No ACK from Primary
Start/ Stop from Primary
1
Data[Axis1_MSB]
Data[CONV_STATUS]
CRC
Secondary address
Single Axis Measurement Example, X or Y or Z
1
Data[Axis1_MSB]
Data[Axis2_MSB]
Data[CONV_STATUS]
CRC
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
1
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
CRC
Secondary address
Three Axes Measurement Example, XYZ
1
Data[T_MSB]
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
CRC
Secondary address
Three Axes & Temperature Measurement Example, TXYZ
Figure 7-14. 1-Byte I2C Read Command for 8-Bit Data With CRC Enabled, CRC_EN = 1b
Note
In the 1-byte read command for 8-bit data any combinations of channels can be sent without
restrictions.
7.4.1.3.6 I2C Read CRC
The TMAG5273 supports optional CRC during I2C read. The CRC can be enabled through the CRC_EN register
bit. The CRC is performed on a data string that is determined by the I2C read type. The CRC information is sent
as a single byte after the data bytes. The code is generated by the polynomial x8 + x2 + x + 1. Initial CRC bits are
FFh.
The following equations can be employed to calculate CRC:
d = Data Input, c = Initial CRC (FFh)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
newcrc[0] = d[7] ^ d[6] ^ d[0] ^ c[0] ^ c[6] ^ c[7]
newcrc[1] = d[6] ^ d[1] ^ d[0] ^ c[0] ^ c[1] ^ c[6]
newcrc[2] = d[6] ^ d[2] ^ d[1] ^ d[0] ^ c[0] ^ c[1] ^ c[2] ^ c[6]
newcrc[3] = d[7] ^ d[3] ^ d[2] ^ d[1] ^ c[1] ^ c[2] ^ c[3] ^ c[7]
newcrc[4] = d[4] ^ d[3] ^ d[2] ^ c[2] ^ c[3] ^ c[4]
newcrc[5] = d[5] ^ d[4] ^ d[3] ^ c[3] ^ c[4] ^ c[5]
newcrc[6] = d[6] ^ d[5] ^ d[4] ^ c[4] ^ c[5] ^ c[6]
newcrc[7] = d[7] ^ d[6] ^ d[5] ^ c[5] ^ c[6] ^ c[7]
The following examples show calculated CRC byte based off various input data:
I2C Data 00h : CRC = F3h
I2C Data FFh : CRC = 00h
I2C Data 80h : CRC = 7Ah
I2C Data 4Ch : CRC = 10h
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I2C Data E0h : CRC = 5Dh
I2C Data 00000000h : CRC = D1h
I2C Data FFFFFFFFh : CRC = 0Fh
7.4.2 Data Definition
7.4.2.1 Magnetic Sensor Data
The X, Y, and Z magnetic sensor data are stored in x_MSB_RESULT and x_LSB_RESULT registers. Each
sensor output is stored in 16-bit 2's complement format in two 8-bit registers as shown in Figure 7-15. The data
can be retrieved as 16-bit format combining both MSB and LSB registers, or as 8-bit format through the MSB
register.
x_MSB_RESULT
x_LSB_RESULT
Figure 7-15. Magnetic Sensor Data Definition
The measured magnetic field can be calculated using Equation 10 for 16-bit data, and using Equation 11 for 8-bit
data.
Ã14
+
E=0 &E × 2E
F &15 × 215
:
;
16
ꢀ ꢀ
× 2 $4
$ =
(10)
where
•
•
•
B is magnetic field in mT.
Di is the data bit as shown in Figure 7-15.
BR is the magnetic range in mT for the corresponding channel.
(11)
7.4.2.2 Temperature Sensor Data
The TMAG5273 will measure temperature from –40 °C to 170 °C. The temperature sensor data are stored in
T_MSB_RESULT and T_LSB_RESULT registers. The sensor output is stored in 16-bit 2's complement format in
two 8-bit registers as shown in Figure 7-16. The data can be retrieved as 16-bit format combining both MSB and
LSB registers, or as 8-bit format through the MSB register.
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T_MSB_RESULT
T_LSB_RESULT
Figure 7-16. Temperature Sensor Data Definition
The measured temperature in degree Celsius can be calculated using Equation 12 for 16-bit data, and using
Equation 13 for 8-bit data.
(12)
where
•
•
•
•
•
T is the measured temperature in degree Celsius.
TSENS_T0 as listed in the Electrical Characteristics table.
TADC_RES is the change in ADC code per degree Celsius.
TADC_T0 as listed in the Electrical Characteristics table.
TADC_T is the measured ADC code for temperature T.
(13)
7.4.2.3 Angle and Magnitude Data Definition
The TMAG5273 calculates the angle from a pair of magnetic axes based off the ANGLE_EN register bits
setting. The ANGLE_RESULT_MSB and ANGLE_RESULT_LSB registers store the angle information as shown
in Figure 7-17. Bits D04-D12 store angle integer value from 0 to 360 degree. Bits D00-D03 store fractional angle
value. The 3-MSB bits are always populated as b000. The angle can be calculated using Equation 14.
(14)
where
•
•
A is the angle measured in degree.
Di is the data bit as shown in Figure 7-17.
For example: a 354.50 degree is populated as 0001 0110 0010 1000b and a 17.25 degree is populated as 000
0001 0001 0100b.
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Reserved bits
9-bit Angle integer value
4-bit Angle fraction value
0
0 0
Figure 7-17. Angle Data Definition
During the angle calculation, use Equation 15 to calculate the resultant vector magnitude.
2
/ = /#&%%D12 + /#&%%D2
§
(15)
where
•
MADCCh1, MADCCh2 are the ADC codes of the two magnetic channels selected for the angle calculation.
The magnitude value is stored in the MAGNITUDE_RESULT register as shown in Magnitude Result Data
Definition. For on-axis angular measurement the magnitude value should remain constant across the full 360°
measurement.
MAGNITUDE_RESULT
Figure 7-18. Magnitude Result Data Definition
7.4.2.4 Magnetic Sensor Offset Correction
The TMAG5273 enables offset correction of a pair of magnetic axes as shown in Figure 7-19. The
MAG_OFFSET_CONFIG_1 and MAG_OFFSET_CONFIG_2 registers store the offset values to be corrected
in 2's complement data format. The selection and order of the sensors are defined in the ANGLE_EN register
bits setting. The default value of these offset correction registers are set as zero.
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Δ
ffset
0mT Reference Axis
Figure 7-19. Magnetic Sensor Data Offset Correction
The amount of offset for each axis can be calculated using Equation 16. As an example, with a ±40mT range,
MAG_OFFSET_CONFIG_1 set at 10000000b, and MAG_OFFSET_CONFIG_2 set at 0001000b, the offset
correction for the first axis is −2.5mT and second axis is 0.312mT.
(16)
where
•
•
•
ΔOffset is the amount of offset correction to be applied in mT.
Di is the data bit in the offset MAG_OFFSET_CONFIG_x register.
BR is the magnetic range in mT for the corresponding channel.
7.5 Register Map
7.5.1 TMAG5273 Registers
Table 7-6 lists the TMAG5273 registers. All register offset addresses not listed in Table 7-6 should be considered
as reserved locations and the register contents should not be modified.
User Configuration Registers
Table 7-6. TMAG5273 Registers
Offset
0h
Acronym
Register Name
Section
Go
DEVICE_CONFIG_1
DEVICE_CONFIG_2
SENSOR_CONFIG_1
SENSOR_CONFIG_2
X_THR_CONFIG
Y_THR_CONFIG
Z_THR_CONFIG
Configure Device Operation Modes
Configure Device Operation Modes
Sensor Device Operation Modes
Sensor Device Operation Modes
X Threshold Configuration
Y Threshold Configuration
Z Threshold Configuration
1h
Go
2h
Go
3h
Go
4h
Go
5h
Go
6h
Go
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Table 7-6. TMAG5273 Registers (continued)
Offset
7h
Acronym
Register Name
Section
T_CONFIG
Temp Sensor Configuration
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
Go
8h
INT_CONFIG_1
MAG_GAIN_CONFIG
Configure Device Operation Modes
Configure Device Operation Modes
9h
Ah
MAG_OFFSET_CONFIG_1
MAG_OFFSET_CONFIG_2
I2C_ADDRESS
Configure Device Operation Modes
Configure Device Operation Modes
I2C Address Register
Bh
Ch
Dh
DEVICE_ID
ID for the device die
Eh
MANUFACTURER_ID_LSB
MANUFACTURER_ID_MSB
T_MSB_RESULT
Manufacturer ID lower byte
Manufacturer ID upper byte
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Status Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Device_Diag Status Register
Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
T_LSB_RESULT
X_MSB_RESULT
X_LSB_RESULT
Y_MSB_RESULT
Y_LSB_RESULT
Z_MSB_RESULT
Z_LSB_RESULT
CONV_STATUS
ANGLE_RESULT_MSB
ANGLE_RESULT_LSB
MAGNITUDE_RESULT
DEVICE_STATUS
Complex bit access types are encoded to fit into small table cells. Table 7-7 shows the codes that are used for
access types in this section.
Table 7-7. TMAG5273 Access Type Codes
Access Type
Read Type
R
Code
R
Description
Read
Write Type
W
W
Write
W1CP
W
1C
P
Write
1 to clear
Requires privileged access
Reset or Default Value
- n
Value after reset or the default value
7.5.1.1 DEVICE_CONFIG_1 Register (Offset = 0h) [Reset = 0h]
DEVICE_CONFIG_1 is shown in Table 7-8.
Return to the Summary Table.
Table 7-8. DEVICE_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
CRC_EN
R/W
0h
Enables I2C CRC byte to be sent
0h = CRC disabled
1h = CRC enabled
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Table 7-8. DEVICE_CONFIG_1 Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6-5
MAG_TEMPCO
R/W
0h
Temperature coefficient of the magnet
0h = 0% (No temperature compensation)
1h = 0.12%/ deg C (NdBFe)
2h = Reserved
3h = 0.2%/deg C (Ceramic)
4-2
CONV_AVG
R/W
0h
Enables additional sampling of the sensor data to reduce the noise
effect (or to increase resolution)
0h = 1x - 10.0Ksps (3-axes) or 20Ksps (1 axis)
1h = 2x - 5.7Ksps (3-axes) or 13.3Ksps (1 axis)
2h = 4x - 3.1Ksps (3-axes) or 8.0Ksps (1 axis)
3h = 8x - 1.6Ksps (3-axes) or 4.4Ksps (1 axis)
4h = 16x - 0.8Ksps (3-axes) or 2.4Ksps (1 axis)
5h = 32x - 0.4Ksps (3-axes) or 1.2Ksps (1 axis)
1-0
I2C_RD
R/W
0h
Defines the I2C read mode
0h = Standard I2C 3-byte read command
1h = 1-byte I2C read command for 16-bit sensor data and conversion
status
2h = 1-byte I2C read command for 8-bit sensor MSB data and
conversion status
3h = Reserved
7.5.1.2 DEVICE_CONFIG_2 Register (Offset = 1h) [Reset = 0h]
DEVICE_CONFIG_2 is shown in Table 7-9.
Return to the Summary Table.
Table 7-9. DEVICE_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
THR_HYST
R/W
0h
Select thresholds for the interrupt function
0h = Takes the 2's complement value of each x_THR_CONFIG
register to create a magnetic threshold of the corresponding axis
1h = Takes the 7 LSB bits of the x_THR_CONFIG register to create
two opposite magnetic thresholds (one north, and another south) of
equal magnitude.
2h = Reserved
3h = Reserved
4h = Reserved
5h = Reserved
6h = Reserved
7h = Reserved
4
3
2
LP_LN
R/W
R/W
R/W
0h
0h
0h
Selects the modes between low active current or low-noise modes
0h = Low active current mode
1h = Low noise mode
I2C_GLITCH_FILTER
TRIGGER_MODE
I2C glitch filter
0h = Glitch filter on
1h = Glitch filter off
Selects a condition which initiates a single conversion based
off already configured registers. A running conversion completes
before executing a trigger. Redundant triggers are ignored.
TRIGGER_MODE is available only during the modes explicitly
mentioned in OPERATING_MODE.
0h = Conversion Start at I2C Command Bits, DEFAULT
1h = Conversion starts through trigger signal at INT pin
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Table 7-9. DEVICE_CONFIG_2 Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
1-0
OPERATING_MODE
R/W
0h
Selects Operating Mode and updates value based on operating
mode if device transitions from Wake-up and sleep mode to Standby
mode.
0h = Standby Mode (starts new conversion at trigger event)
1h = Sleep mode
2h = Continuous mode
3h = Wake-up and Sleep mode (duty-cycled mode)
7.5.1.3 SENSOR_CONFIG_1 Register (Offset = 2h) [Reset = 0h]
SENSOR_CONFIG_1 is shown in Table 7-10.
Return to the Summary Table.
Table 7-10. SENSOR_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
MAG_CH_EN
R/W
0h
Enables data acquisition of the magnetic axis channel(s)
0h = All magnetic channels of off, DEFAULT
1h = X channel enabled
2h = Y channel enabled
3h = X, Y channel enabled
4h = Z channel enabled
5h = Z, X channel enabled
6h = Y, Z channel enabled
7h = X, Y, Z channel enabled
8h = XYX channel enabled
9h = YXY channel enabled
Ah = YZY channel enabled
Bh = XZX channel enabled
Ch = Reserved
Dh = Reserved
Eh = Reserved
Fh = Reserved
3-0
SLEEPTIME
R/W
0h
Selects the time spent in low power mode between conversions
when OPERATING_MODE =11b
0h = 1ms
1h = 5ms
2h = 10ms
3h = 15ms
4h = 20ms
5h = 30ms
6h = 50ms
7h = 100ms
8h = 500ms
9h = 1000ms
Ah = 2000ms
Bh = 5000ms
Ch = 20000ms
7.5.1.4 SENSOR_CONFIG_2 Register (Offset = 3h) [Reset = 0h]
SENSOR_CONFIG_2 is shown in Table 7-11.
Return to the Summary Table.
Table 7-11. SENSOR_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0h
Reserved
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Table 7-11. SENSOR_CONFIG_2 Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6
THRX_COUNT
R/W
0h
Number of threshold crossings before the interrupt is assereted
0h = 1 threshold crossing
1h = 4 threshold crossing
5
4
MAG_THR_DIR
MAG_GAIN_CH
ANGLE_EN
R/W
R/W
R/W
0h
0h
0h
Selects the direction of threshold check. This bit is ignored when
THR_HYST > 001b
0h = sets interrupt for field above the threshold
1h = sets interrupt for field below the threshold
Selects the axis for magnitude gain correction value entered in
MAG_GAIN_CONFIG register
0h = 1st channel is selected for gain adjustment
1h = 2nd channel is selected for gain adjustment
3-2
Enables angle calculation, magnetic gain, and offset corrections
between two selected magnetic channels
0h = No angle calculation, magnitude gain, and offset correction
enabled
1h = X 1st, Y 2nd
2h = Y 1st, Z 2nd
3h = X 1st, Z 2nd
1
0
X_Y_RANGE
Z_RANGE
R/W
R/W
0h
0h
Select the X and Y axes magnetic range from 2 different options.
0h = ±40mT (TMAG5273A1) or ±133mT (TMAG5273A2), DEFAULT
1h = ±80mT (TMAG5273A1) or ±266mT (TMAG5273A2)
Select the Z axis magnetic range from 2 different options.
0h = ±40mT (TMAG5273A1) or ±133mT (TMAG5273A2), DEFAULT
1h = ±80mT (TMAG5273A1) or ±266mT (TMAG5273A2)
7.5.1.5 X_THR_CONFIG Register (Offset = 4h) [Reset = 0h]
X_THR_CONFIG is shown in Table 7-12.
Return to the Summary Table.
Table 7-12. X_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_THR_CONFIG
R/W
0h
8-bit, 2' complement X axis threshold code for limit
check. The range of possible threshold entrees can be
+/-128. The threshold value in mT is calculated for
A1 as (40(1+X_Y_RANGE)/128)*X_THR_CONFIG, for A2 as
(133(1+X_Y_RANGE)/128)*X_THR_CONFIG. Default 0h means no
threshold comparison.
7.5.1.6 Y_THR_CONFIG Register (Offset = 5h) [Reset = 0h]
Y_THR_CONFIG is shown in Table 7-13.
Return to the Summary Table.
Table 7-13. Y_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_THR_CONFIG
R/W
0h
8-bit, 2' complement Y axis threshold code for limit
check. The range of possible threshold entrees can be
+/-128. The threshold value in mT is calculated for
A1 as (40(1+X_Y_RANGE)/128)*X_THR_CONFIG, for A2 as
(133(1+X_Y_RANGE)/128)*X_THR_CONFIG. Default 0h means no
threshold comparison.
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7.5.1.7 Z_THR_CONFIG Register (Offset = 6h) [Reset = 0h]
Z_THR_CONFIG is shown in Table 7-14.
Return to the Summary Table.
Table 7-14. Z_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_THR_CONFIG
R/W
0h
8-bit, 2' complement Z axis threshold code for limit check. The range
of possible threshold entrees can be +/-128. The threshold value in
mT is calculated for A1 as (40(1+Z_RANGE)/128)*Z_THR_CONFIG,
for A2 as (133(1+Z_RANGE)/128)*Z_THR_CONFIG. Default 0h
means no threshold comparison.
7.5.1.8 T_CONFIG Register (Offset = 7h) [Reset = 0h]
T_CONFIG is shown in Table 7-15.
Return to the Summary Table.
Table 7-15. T_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
T_THR_CONFIG
R/W
0h
Temperature threshold code entered by user. The valid temperature
threshold ranges are -41C to 170C with the threshold codes for -41C
= 1Ah, and 170C = 34h. Resolution is 8 degree C/ LSB. Default 0h
means no threshold comparison.
0
T_CH_EN
R/W
0h
Enables data acquisition of the temperature channel
0h = Temp channel disabled
1h = Temp channel enabled
7.5.1.9 INT_CONFIG_1 Register (Offset = 8h) [Reset = 0h]
INT_CONFIG_1 is shown in Table 7-16.
Return to the Summary Table.
Table 7-16. INT_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RSLT_INT
R/W
0h
Enable interrupt response on conversion complete.
0h = Interrupt is not asserted when the configured set of conversions
are complete
1h = Interrupt is asserted when the configured set of conversions are
complete
6
5
THRSLD_INT
INT_STATE
R/W
R/W
0h
0h
Enable interrupt response on a predefined threshold cross.
0h = Interrupt is not asserted when a threshold is crossed
1h = Interrupt is asserted when a threshold is crossed
INT interrupt latched or pulsed.
0h = INT interrupt latched until clear by a primary addressing the
device
1h = INT interrupt pulse for 10us
4-2
INT_MODE
R/W
0h
Interrupt mode select.
0h = No interrupt
1h = Interrupt through INT
2h = Interrupt through INT except when I2C bus is busy.
3h = Interrupt through SCL
4h = Interrupt through SCL except when I2C bus is busy.
5h = Reserved
6h = Reserved
7h = Reserved
1
RESERVED
R
0h
Reserved
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Table 7-16. INT_CONFIG_1 Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
0
MASK_INTB
R/W
0h
Mask INT pin when INT connected to GND
0h = INT pin is enabled
1h = INT pin is disabled (for wake-up and trigger functions)
7.5.1.10 MAG_GAIN_CONFIG Register (Offset = 9h) [Reset = 0h]
MAG_GAIN_CONFIG is shown in Table 7-17.
Return to the Summary Table.
Table 7-17. MAG_GAIN_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
GAIN_VALUE
R/W
0h
8-bit gain value determined by a primary to adjust a Hall axis
gain. The particular axis is selected based off the settings of
MAG_GAIN_CH and ANGLE_EN register bits. The binary 8-bit input
is interpreted as a fractional value in between 0 and 1 based off
the formula, 'user entered value in decimal/256'. Gain value of 0 is
interpreted by the device as 1.
7.5.1.11 MAG_OFFSET_CONFIG_1 Register (Offset = Ah) [Reset = 0h]
MAG_OFFSET_CONFIG_1 is shown in Table 7-18.
Return to the Summary Table.
Table 7-18. MAG_OFFSET_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OFFSET_VALUE_1ST
R/W
0h
8-bit, 2s complement offset value determined by a primary to adjust
first axis offset value. The range of possible offset valid entrees can
be +/-128. The offset value is calculated by multiplying bit resolution
with the entered value.
7.5.1.12 MAG_OFFSET_CONFIG_2 Register (Offset = Bh) [Reset = 0h]
MAG_OFFSET_CONFIG_2 is shown in Table 7-19.
Return to the Summary Table.
Table 7-19. MAG_OFFSET_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OFFSET_VALUE_2ND
R/W
0h
8-bit, 2s complement offset value determined by a primary to adjust
second axis offset value. The range of possible offset valid entrees
can be +/-128. The offset value is calculated by multiplying bit
resolution with the entered value.
7.5.1.13 I2C_ADDRESS Register (Offset = Ch) [Reset = 6Ah]
I2C_ADDRESS is shown in Table 7-20.
Return to the Summary Table.
Table 7-20. I2C_ADDRESS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
I2C_ADDRESS
R/W
35h
7-bit default factory I2C address is loaded from OTP during first
power up. Change these bits to a new setting if a new I2C address is
required (at each power cycle these bits need to be written again to
avoid going back to default factory address).
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Table 7-20. I2C_ADDRESS Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
0
I2C_ADDRESS_UPDATE R/W
_EN
0h
Enable a new user defined I2C address.
0h = Disable update of I2C address
1h = Enable update of I2C address with bits (7:1)
7.5.1.14 DEVICE_ID Register (Offset = Dh) [Reset = 12h]
DEVICE_ID is shown in Table 7-21.
Return to the Summary Table.
Table 7-21. DEVICE_ID Register Field Descriptions
Bit
7-2
1-0
Field
Type
Reset
Description
RESERVED
VER
R
4h
Reserved
R
2h
Device version indicator.
0h = Reserved
1h = TMAG5273 A1 unit
2h = TMAG5273 A2 unit
3h = Reserved
7.5.1.15 MANUFACTURER_ID_LSB Register (Offset = Eh) [Reset = 49h]
MANUFACTURER_ID_LSB is shown in Table 7-22.
Return to the Summary Table.
Table 7-22. MANUFACTURER_ID_LSB Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MANUFACTURER_ID_[7:
0]
R
49h
8-bit unique manufacturer ID
7.5.1.16 MANUFACTURER_ID_MSB Register (Offset = Fh) [Reset = 54h]
MANUFACTURER_ID_MSB is shown in Table 7-23.
Return to the Summary Table.
Table 7-23. MANUFACTURER_ID_MSB Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MANUFACTURER_ID_[15 R
:8]
54h
8-bit unique manufacturer ID
7.5.1.17 T_MSB_RESULT Register (Offset = 10h) [Reset = 0h]
T_MSB_RESULT is shown in Table 7-24.
Return to the Summary Table.
Table 7-24. T_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
T_CH_RESULT [15:8]
R
0h
T-channel data conversion results, MSB 8 bits.
7.5.1.18 T_LSB_RESULT Register (Offset = 11h) [Reset = 0h]
T_LSB_RESULT is shown in Table 7-25.
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Return to the Summary Table.
Table 7-25. T_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
T_CH_RESULT [7:0]
R
0h
T-channel data conversion results, LSB 8 bits.
7.5.1.19 X_MSB_RESULT Register (Offset = 12h) [Reset = 0h]
X_MSB_RESULT is shown in Table 7-26.
Return to the Summary Table.
Table 7-26. X_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_CH_RESULT [15:8]
R
0h
X-channel data conversion results, MSB 8 bits.
7.5.1.20 X_LSB_RESULT Register (Offset = 13h) [Reset = 0h]
X_LSB_RESULT is shown in Table 7-27.
Return to the Summary Table.
Table 7-27. X_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_CH_RESULT [7:0]
R
0h
X-channel data conversion results, LSB 8 bits.
7.5.1.21 Y_MSB_RESULT Register (Offset = 14h) [Reset = 0h]
Y_MSB_RESULT is shown in Table 7-28.
Return to the Summary Table.
Table 7-28. Y_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_CH_RESULT [15:8]
R
0h
Y-channel data conversion results, MSB 8 bits.
7.5.1.22 Y_LSB_RESULT Register (Offset = 15h) [Reset = 0h]
Y_LSB_RESULT is shown in Table 7-29.
Return to the Summary Table.
Table 7-29. Y_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_CH_RESULT [7:0]
R
0h
Y-channel data conversion results, LSB 8 bits.
7.5.1.23 Z_MSB_RESULT Register (Offset = 16h) [Reset = 0h]
Z_MSB_RESULT is shown in Table 7-30.
Return to the Summary Table.
Table 7-30. Z_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_CH_RESULT [15:8]
R
0h
Z-channel data conversion results, MSB 8 bits.
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7.5.1.24 Z_LSB_RESULT Register (Offset = 17h) [Reset = 0h]
Z_LSB_RESULT is shown in Table 7-31.
Return to the Summary Table.
Table 7-31. Z_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_CH_RESULT [7:0]
R
0h
Z-channel data conversion results, LSB 8 bits.
7.5.1.25 CONV_STATUS Register (Offset = 18h) [Reset = 0h]
CONV_STATUS is shown in Table 7-32.
Return to the Summary Table.
Table 7-32. CONV_STATUS Register Field Descriptions
Bit
7-5
4
Field
Type
Reset
Description
SET_COUNT
POR
R
0h
Rolling Count of Conversion Data Sets
R/W1CP
0h
Device powered up, or experienced power-on-reset. Bit is clear when
host writes back '1'.
0h = No POR
1h = POR occurred
3-2
1
RESERVED
R
R
0h
0h
Reserved
DIAG_STATUS
Detect any internal diagnostics fail which include VCC UV, internal
memory CRC error, INT pin error and internal clock error. Ignore this
bit status if VCC < 2.3V.
0h = No diag fail
1h = Diag fail detected
0
RESULT_STATUS
R
0h
Conversion data buffer is ready to be read.
0h = Conversion data not complete
1h = Conversion data complete
7.5.1.26 ANGLE_RESULT_MSB Register (Offset = 19h) [Reset = 0h]
ANGLE_RESULT_MSB is shown in Table 7-33.
Return to the Summary Table.
Table 7-33. ANGLE_RESULT_MSB Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
ANGLE_RESULT_MSB
R
0h
Angle measurement result in degree. The data is displayed
from 0 to 360 degree in 13 LSB bits after combining the
ANGLE_RESULT_MSB and _LSB bits. The 4 LSB bits allocated for
fraction of an angle in the format (xxxx/16).
7.5.1.27 ANGLE_RESULT_LSB Register (Offset = 1Ah) [Reset = 0h]
ANGLE_RESULT_LSB is shown in Table 7-34.
Return to the Summary Table.
Table 7-34. ANGLE_RESULT_LSB Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
ANGLE_RESULT_LSB
R
0h
Angle measurement result in degree. The data is displayed
from 0 to 360 degree in 13 LSB bits after combining the
ANGLE_RESULT_MSB and _LSB bits. The 4 LSB bits allocated for
fraction of an angle in the format (xxxx/16).
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7.5.1.28 MAGNITUDE_RESULT Register (Offset = 1Bh) [Reset = 0h]
MAGNITUDE_RESULT is shown in Table 7-35.
Return to the Summary Table.
Table 7-35. MAGNITUDE_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MAGNITUDE_RESULT
R
0h
Resultant vector magnitude (during angle measurement) result. This
value should be constant during 360 degree measurements
7.5.1.29 DEVICE_STATUS Register (Offset = 1Ch) [Reset = 0h]
DEVICE_STATUS is shown in Table 7-36.
Return to the Summary Table.
Table 7-36. DEVICE_STATUS Register Field Descriptions
Bit
7-5
4
Field
Type
Reset
Description
RESERVED
INTB_RB
R
0h
Reserved
R
0h
0h
Indicates the level that the device is reading back from INT pin.
0h = INT pin driven low
1h = INT pin status high
3
2
1
0
OSC_ER
R/W1CP
Indicates if Oscillator error is detected. Bit is clear when host writes
back '1'.
0h = No Oscillator error detected
1h = Oscillator error detected
INT_ER
R/W1CP
R/W1CP
R/W1CP
0h
0h
0h
Indicates if INT pin error is detected. Bit is clear when host writes
back '1'.
0h = No INT error detected
1h = INT error detected
OTP_CRC_ER
VCC_UV_ER
Indicates if OTP CRC error is detected. Bit is clear when host writes
back '1'.
0h = No OTP CRC error detected
1h = OTP CRC error detected
Indicates if VCC undervoltage was detected. Bit is clear when host
writes back '1'. Ignore this bit status if VCC < 2.3V.
0h = No VCC UV detected
1h = VCC UV detected
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Select the Sensitivity Option
Select the highest TMAG5273 sensitivity option that can measure the required range of magnetic flux density so
that the ADC output range is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet. TI created an online tool to help with simple magnet calculations under the DRV5055 product folder on
ti.com.
8.1.2 Temperature Compensation for Magnets
The TMAG5273 temperature compensation is designed to directly compensate the average temperature drift
of several magnets as specified in the MAG_TEMPCO register bits. The residual induction (Br) of a magnet
typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite magnets as the temperature increases. Set
the MAG_TEMPCO bit to default 00b if the device temperature compensation is not needed.
8.1.3 Sensor Conversion
Multiple conversion schemes can be adopted based off the MAG_CH_EN and CONV_AVG register bits setting.
8.1.3.1 Continuous Conversion
The TMAG5273 can be set in continuous conversion mode when OPERATING_MODE is set to 10b. Figure 8-1
shows few examples of continuous conversion. The input magnetic field is processed in two steps. In the first
step the device spins the hall sensor elements, and integrates the sampled data. In the second step the ADC
block coverts the analog signal into digital bits and stores in the corresponding result register. While the ADC
starts processing the first magnetic sample, the spin block can start processing another magnetic sample. In this
mode the temperature data is taken at the beginning of each new conversion. This temperature data is used to
compensate for the thermal drift.
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tstart_measur
e
HALL Spin &
Integra on
X-Axis
Temp
X-Axis
Temp
X-Axis
X-Axis
ADC
Start
Conv me
Start next
Ini ate
Time
OPERATING_MODE = 10b, MAG_CH_EN = 0001b, CONV_AVG = 000b
tstart_measur
e
HALL Spin &
Integra on
X-Axis
Temp
X-Axis
X-Axis
X-Axis
Temp
X-Axis
X-Axis
X-Axis
X-Axis
ADC
Start next
Start
Conv me
Ini ate
Time
OPERATING_MODE = 10b, MAG_CH_EN = 0001b, CONV_AVG = 001b
tstart_measur
e
HALL Spin &
Integra on
X-Axis
Temp
Y-Axis
X-Axis
X-Axis
Temp
Y-Axis
Z-Axis
Y-Axis
Z-Axis
Y-Axis
X-Axis
Z-Axis
Z-Axis
ADC
Start next
Start
Conversion me
Ini ate
Time
OPERATING_MODE = 10b, MAG_CH_EN = 1100b, CONV_AVG = 000b
Figure 8-1. Continuous Conversion Examples
8.1.3.2 Trigger Conversion
The TMAG5273 supports trigger conversion with OPERATING_MODE set to 00b. The trigger event can
be initiated through I2C command or INT signal. Figure 8-2 shows an example of trigger conversion with
temperature, X, Y, and Z sensors activated.
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tstart_measur
e
HALL Spin &
Integra on
X-Axis
Y-Axis
Z-Axis
Temp
X-Axis
Y-Axis
Z-Axis
ADC
Start
Conversion me
Trigger
Time
Figure 8-2. Trigger Conversion for Temperature, X, Y, & Z Sensors
8.1.3.3 Pseudo-Simultaneous Sampling
In absolute angle measurement, application sensor data from multiple axes are required to calculate an accurate
angle. The magnetic field data collected at different times through the same signal chain introduces error in
angle calculation. The TMAG5273 offers pseudo-simultaneous sampling data collection modes to eliminate this
error. Figure 8-3 shows an example where MAG_CH_EN is set at 1011b to collect XZX data. The time stamps
for X and Z sensor data are the same as shown in Equation 17.
P:1 + P:2
P< =
2
(17)
where
•
tX1, tZ, tX2 are time stamps for X, Z, X sensor data completion as defined in Figure 8-3.
HALL Spin &
Integra on
X-Axis
Temp
Z-Axis
X-Axis
Z-Axis
X-Axis
X-Axis
ADC
tX1
tZ
tX1
Time
Figure 8-3. XZX Magnetic Field Conversion
The vertical X, Y sensors of the TMAG5273 exhibit more noise than the horizontal Z sensor. The pseudo-
simultaneous sampling can be used to equalize the noise floor when two set of vertical sensor data are collected
against one set of horizontal sensor data, as in examples of XZX or YZY modes.
8.1.4 Magnetic Limit Check
The TMAG5273 enables magnetic limit checks for single or multiple axes at the same time. Figure 8-4
to Figure 8-7 show examples of magnetic limit cross detection events while the field going above, below,
exiting a magnetic band, and entering a magnetic band. The device will keep generating interrupt with each
new conversion if the magnetic fields remain in the shaded regions in the figures. The MAG_THR_DIR and
THR_HYST register bits help select different limit cross modes.
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X Ch Threshold
X Ch Threshold
0 mT
0 mT
X Magne c Field
X Magne c Field
Interrupt
Interrupt
Time
Time
Figure 8-5. Magnetic Lower Limit Cross Check
With MAG_THR_DIR =1b, THR_HYST = 000b
Figure 8-4. Magnetic Upper Limit Cross Check
With MAG_THR_DIR =0b, THR_HYST = 000b
X Ch Threshold
X Ch Threshold
0 mT
0 mT
X Magne c Field
- X Ch Threshold
X Magne c Field
- X Ch Threshold
Interrupt
Interrupt
Time
Figure 8-6. Magnetic Field Going Out of Band
Check With MAG_THR_DIR =0b, THR_HYST = 001b
Time
Figure 8-7. Magnetic Field Entering a Band Check
With MAG_THR_DIR =1b, THR_HYST = 001b
8.2 Typical Application
Magnetic angle sensors are very popular due to contactless and reliable measurements, especially in
applications requiring long-term measurements in rugged environments. The TMAG5273 offers an on-chip angle
calculator providing angular measurement based off any two of the magnetic axes. The two axes of interest can
be selected in the ANGLE_EN register bits. The device offers angle output in complete 360 degree scale. Take
several error sources into account for angle calculation, including sensitivity error, offset error, linearity error,
noise, mechanical vibration, temperature drift, and so forth.
1.7V to 3.6V
1.2V to 5.5V
VCC
INT
TEST
SCL
SDA
GND
Figure 8-8. TMAG5273 Application Diagram
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8.2.1 Design Requirements
Use the parameters listed in Table 8-1 for this design example
Table 8-1. Design Parameters
DESIGN PARAMETERS
ON-AXIS MEASUREMENT
OFF-AXIS MEASUREMENT
Device
VCC
TMAG5273-A1
3.3 V
TMAG5273-A1
3.3 V
Cylinder: 4.7625-mm diameter, 12.7-mm
thick, neodymium N52, Br = 1480
Cylinder: 4.7625-mm diameter, 12.7-mm
thick, neodymium N52, Br = 1480
Magnet
Select the same range for both axes based
off the highest possible magnetic field seen
by the sensor
Select the same range for both axes based
off the highest possible magnetic field seen
by the sensor
Magnetic Range Selection
RPM
<600
<600
Desired Accuracy
<2° for 360° rotation
<2° for 360° rotation
8.2.2 Detailed Design Procedure
For accurate angle measurement, the two axes amplitudes must be normalized by selecting the proper gain
adjustment value in the MAG_GAIN_CONFIG register. The gain adjustment value is a fractional decimal number
between 0 and 1. The following steps must be followed to calculate this fractional value:
•
•
•
Set the device at 32x average mode and rotate the shaft full 360 degree.
Record the two axes sensor ADC codes for the full 360 degree rotation.
Measure the maximum peak-peak ADC code delta for each axis, Ax and Ay as shown in Figure 8-10 or
Figure 8-11.
#
;
): =
#
:
•
If AX>AY, set the MAG_GAIN_CH register bit to 0h. Calculate the gain adjustment value for X axis:
1
); =
)
:
•
•
If AX<AY, set the MAG_GAIN_CH register bit to 1h. Calculate the gain adjustment value for Y axis:
The target binary gain setting at the GAIN_VALUE register bits are calculated from the equation, GX or GY =
GAIN_VALUEdecimal/ 1024.
Example 1: If AX = AY = 60,000, the GAIN_VALUE register bits are set at default 0h.
Example 2: If AX= 60,000, AY = 45,000, the GX = 45,000/60,000 =0.75.
Example 3: If AX= 45,000, AY = 60,000, the GX = (60,000/45,000) =1.33. Since GX >1, the gain adjustment
needs to be applied to Y axis with GY =1/GX
8.2.2.1 Gain Adjustment for Angle Measurement
Common measurement topology include angular position measurements in on-axis or off-axis angular
measurements shown in Figure 8-9. Select the on-axis measurement topology whenever possible as this offers
the best optimization of magnetic field and the device measurement ranges. The TMAG5273 offers on-chip gain
adjustment option to account for mechanical position misalignments.
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On-axis
Off-axis
S
S
N
N
Figure 8-9. On-Axis vs. Off-Axis Angle Measurements
8.2.3 Application Curves
Ay
Ax = Ay
Figure 8-11. X and Y Sensor Data for Full 360
Degree Rotation for Off-Axis Measurement
Figure 8-10. X and Y Sensor Data for Full 360
Degree Rotation for On-Axis Measurement
8.3 What to Do and What Not to Do
The TMAG5273 updates the result registers at the end of a conversion. I2C read of the result register needs to
be synchronized with the conversion update time to avoid reading a result data while the result register is being
updated. For applications with tight timing budget use the INT signal to notify the primary when a conversion is
complete.
9 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.01 µF. Connect the TEST pin to ground.
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10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards (PCBs), which makes placing the magnet on
the opposite side of the PCB possible.
10.2 Layout Example
SCL
SDA
GND
INT
GND (TEST)
VCC
Figure 10-1. Layout Example With TMAG5273
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
•
•
•
Texas Instruments, HALL-ADAPTER-EVM User's Guide (SLYU043)
Texas Instruments, TMAG5273 Evaluation Manual user's guide (SLYU058)
Texas Instruments, Angle Measurement With Multi-Axis Linear Hall-Effect Sensors application report
(SBAA463)
•
•
Texas Instruments, Absolute Angle Measurements for Rotational Motion Using Hall-Effect Sensors
application brief (SBAA503)
Texas Instruments, Limit Detection for Tamper and End-of-Travel Detection Using Hall-Effect Sensors
application brief (SBOA514)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
B
1.45 MAX
A
PIN 1
INDEX AREA
1
6
5
2X 0.95
3.05
2.75
1.9
2
4
3
0.50
6X
0.25
0.15
0.00
0.2
C A B
(1.1)
TYP
0.25
GAGE PLANE
0.22
0.08
TYP
8
TYP
0
0.6
0.3
TYP
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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Figure 12-1. DBV Package Outline
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EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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Figure 12-2. DBV Package Board Layout
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EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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Figure 12-3. DBV Package Stencil Outline
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12.1 Package Option Addendum
Packaging Information
Package
Drawing
Lead/Ball
Finish(6)
MSL Peak
Temp(3)
Device
Orderable
Status(1)
Package Type
Pins
Package Qty
Eco Plan(2)
Op Temp (°C)
Marking(4) (5)
TMAG5273A1Q ACTIVE
DBVR
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
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TMAG5273A1Q ACTIVE
DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
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TMAG5273A2Q ACTIVE
DBVR
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TMAG5273A2Q ACTIVE
DBVT
Non-RoHS &
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TMAG5273A3Q ACTIVE
DBVR
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DBVT
TMAG5273A4Q ACTIVE
DBVR
TMAG5273A4Q ACTIVE
DBVT
TMAG5273B1Q ACTIVE
DBVR
Non-RoHS &
Non-Green
TMAG5273B1Q ACTIVE
DBVT
Non-RoHS &
Non-Green
TMAG5273B2Q ACTIVE
DBVR
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DBVT
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DBVR
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DBVT
TMAG5273B4Q ACTIVE
DBVR
TMAG5273B4Q ACTIVE
DBVT
TMAG5273C1 ACTIVE
QDBVR
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Package
Drawing
Lead/Ball
Finish(6)
MSL Peak
Temp(3)
Device
Orderable
Status(1)
Package Type
Pins
Package Qty
Eco Plan(2)
Op Temp (°C)
Marking(4) (5)
TMAG5273C1 ACTIVE
QDBVT
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
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TMAG5273C2 ACTIVE
QDBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
6
6
6
6
6
6
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TMAG5273C2 ACTIVE
QDBVT
TMAG5273D1 ACTIVE
QDBVR
TMAG5273D1 ACTIVE
QDBVT
TMAG5273D2 ACTIVE
QDBVR
TMAG5273D2 ACTIVE
QDBVT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Copyright © 2021 Texas Instruments Incorporated
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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12.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
P1 Pitch between successive cavity centers
W
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TMAG5273A1QDBVR
TMAG5273A1QDBVT
TMAG5273A2QDBVR
TMAG5273A2QDBVT
TMAG5273A3QDBVR
TMAG5273A3QDBVT
TMAG5273A4QDBVR
TMAG5273A4QDBVT
TMAG5273B1QDBVR
TMAG5273B1QDBVT
TMAG5273B2QDBVR
TMAG5273B2QDBVT
TMAG5273B3QDBVR
TMAG5273B3QDBVT
TMAG5273B4QDBVR
TMAG5273B4QDBVT
TMAG5273C1QDBVR
TMAG5273C1QDBVT
TMAG5273C2QDBVR
TMAG5273C2QDBVT
TMAG5273D1QDBVR
TMAG5273D1QDBVT
TMAG5273D2QDBVR
TMAG5273D2QDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
Package Drawing Pins
SPQ
3000
250
Length (mm) Width (mm)
Height (mm)
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TMAG5273A1QDBVR
TMAG5273A1QDBVT
TMAG5273A2QDBVR
TMAG5273A2QDBVT
TMAG5273A3QDBVR
TMAG5273A3QDBVT
TMAG5273A4QDBVR
TMAG5273A4QDBVT
TMAG5273B1QDBVR
TMAG5273B1QDBVT
TMAG5273B2QDBVR
TMAG5273B2QDBVT
TMAG5273B3QDBVR
TMAG5273B3QDBVT
TMAG5273B4QDBVR
TMAG5273B4QDBVT
TMAG5273C1QDBVR
TMAG5273C1QDBVT
TMAG5273C2QDBVR
TMAG5273C2QDBVT
TMAG5273D1QDBVR
TMAG5273D1QDBVT
TMAG5273D2QDBVR
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
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3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
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Device
Package Type
Package Drawing Pins
DBV
SPQ
Length (mm) Width (mm)
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Height (mm)
TMAG5273D2QDBVT
SOT-23
6
250
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jun-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTMAG5273A2QDBVR
ACTIVE
SOT-23
DBV
6
3000
Non-RoHS &
Non-Green
Call TI
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-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
B
1.45 MAX
A
PIN 1
INDEX AREA
1
2
6
5
2X 0.95
1.9
3.05
2.75
4
3
0.50
6X
0.25
C A B
0.15
0.00
0.2
(1.1)
TYP
0.25
GAGE PLANE
0.22
0.08
TYP
8
TYP
0
0.6
0.3
TYP
SEATING PLANE
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214840/C 06/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
5
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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