TLV3811CYBGT [TI]
具有低压差分信号 (LVDS) 输出的 225ps 高速比较器 | YBG | 6 | -40 to 125;型号: | TLV3811CYBGT |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有低压差分信号 (LVDS) 输出的 225ps 高速比较器 | YBG | 6 | -40 to 125 比较器 |
文件: | 总35页 (文件大小:2809K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLV3801, TLV3811
ZHCSNF6B –DECEMBER 2021 –REVISED MARCH 2023
TLV3801、TLV3811(C) 具有LVDS 输出的225ps 高速比较器
2.7V 至5.25V 的单电源工作电压范围和2.7V 至5.25V
的双电源工作电压范围,采用业界通用的小型封装承载
所有特性,是激光雷达、差分线路接收器应用以及测试
和测量系统的理想选择。
1 特性
• 低传播延迟:225 ps
• 低过驱动分散:5 ps
• 静态电流:20mA
TLV3801/TLV3811(C) 具有5ps 的强大输入过驱性能,
并且能够检测仅 240ps 的窄脉冲宽度。这些器件具有
输入过驱可实现较小传播延迟变化,并且能够检测窄脉
冲,是飞行时间 (ToF) 应用(例如工厂自动化和无人机
视觉)的理想选择。
• 高切换频率:3GHz/6Gbps
• 窄脉宽检测功能:240ps
• LVDS 输出
• 分离输入和输出接地基准
• 单电源电压:2.7V 至5.25V
• 低输入失调电压:±0.5mV
• 内部2mV 迟滞:TLV3801
• 内部1.1mV 迟滞:TLV3811
• 内部0mV 迟滞:TLV3811C
• 封装:TLV3801(8 引脚WSON)、TLV3811(C)
(6 引脚WCSP)、TLV3802(12 引脚WF-
DFN)
TLV3801/TLV3811(C) 的低压差分信号 (LVDS) 输出有
助于提高数据吞吐量并优化功耗。同样,互补输出有助
于通过抑制每个输出上的共模噪声来降低 EMI。LVDS
输出旨在驱动和直接连接可接受标准 LVDS 输入(例
如大多数FPGA 和CPU)的其他应用下游器件。
TLV3801 采用 8 引脚 WSON 封装,TLV3811(C) 采用
微型 6 引脚 WCSP 封装,均非常适合空间敏感型应
用,例如光学传感器模块。
2 应用
• 激光雷达中的距离感测
• 飞行时间传感器
• 示波器和逻辑分析仪中的高速触发器功能
• 高速差分线路接收器
• 无人机视觉
器件信息
封装(1)
封装尺寸(标称值)
2.00mm × 2.00mm
1.218 mm × 0.818 mm
3.00mm × 2.00mm
器件型号
TLV3801
WSON (8)
TLV3811(C)
WCSP (6)
WF-DFN (12)
TLV3802(预发布)
3 说明
1.如需了解所有可订购封装,请参阅数据表末尾的可订
购产品附录。
TLV3801/TLV3811(C) 是具有宽电源电压范围和 3GHz
超高切换频率的 225ps 高速比较器。这些器件具有
VCC
VCC
VCC
OUT+
OUT-
OUT+
OUT-
IN+
IN-
+
IN+
IN-
+
–
LVDS
LVDS
OPA858
–
TLV3801
+
TLV3801
VEE
TLV3811
+
GND
GND
功能方框图
VBIAS
VREF
TLV3801 光学接收器电路
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNOSDD7
TLV3801, TLV3811
ZHCSNF6B –DECEMBER 2021 –REVISED MARCH 2023
www.ti.com.cn
Table of Contents
7.3 Feature Description...................................................14
7.4 Device Functional Modes..........................................14
8 Application and Implementation..................................16
8.1 Application Information............................................. 16
8.2 Typical Application.................................................... 16
8.3 Power Supply Recommendations.............................21
8.4 Layout....................................................................... 21
9 Device and Documentation Support............................23
9.1 Device Support......................................................... 23
9.2 接收文档更新通知..................................................... 23
9.3 支持资源....................................................................23
9.4 Trademarks...............................................................23
9.5 静电放电警告............................................................ 23
9.6 术语表....................................................................... 23
10 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Thermal Information....................................................5
6.4 Recommended Operating Conditions.........................5
6.5 Electrical Characteristics.............................................7
6.6 Timing Diagrams ........................................................9
6.7 Typical Characteristics..............................................10
7 Detailed Description......................................................14
7.1 Overview...................................................................14
7.2 Functional Block Diagram.........................................14
Information.................................................................... 23
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision A (October 2022) to Revision B (March 2023)
Page
• 在整个数据表中添加了TLV3811(C) 和TLV3802(初始)。..............................................................................1
Changes from Revision * (December 2021) to Revision A (October 2022)
Page
• 将TLV3811 的预发布状态更改为RTM...............................................................................................................1
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English Data Sheet: SNOSDD7
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5 Pin Configuration and Functions
1
8
7
OUT-
Out+
2
3
4
VCC
VCC
IN+
GND
VEE
IN-
Thermal
Pad
6
5
图5-1. WSON Package
8-Pin DSG
Top View
Top View
+
A
B
OUT+
IN+
VCC
IN-
GND
OUT-
1
2
3
图5-2. WCSP Package
6-Pin BGA
Top View
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
IN+
TLV3801
TLV3811(C)
5
4
A1
B1
I
I
Non-inverting input
Inverting input
IN–
OUT+
8
1
A3
B3
O
Non-inverting output
O
I
Inverting output
OUT–
Negative power supply
VEE
3
-
(If using single supply, connect to GND)
Positive power supply
Ground
VCC
6, 7
2
A2
B2
I
I
GND
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English Data Sheet: SNOSDD7
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ZHCSNF6B –DECEMBER 2021 –REVISED MARCH 2023
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1
2
3
4
5
6
12
11
GND
OUT1+
OUT1-
VCC
IN1+
IN1-
VEE
10
9
TLV3802
OUT2+
OUT2-
VCC
8
7
IN2+
IN2-
图5-3. WF-DFN Package
12-Pin DSS
Top View
表5-2. Pin Functions
PIN
I/O
DESCRIPTION
NAME
GND
TLV3802
1
2
3
I
I
I
Ground
IN1+
Channel 1 Non-inverting input
Channel 1 Inverting input
Negative power supply
IN1–
VEE
4
I
(If using single supply, connect to GND)
IN2+
5
6
I
I
Channel 2 Non-inverting input
Channel 2 Inverting input
Positive power supply
IN2–
VCC
7
I
8
O
O
I
Channel 2 Inverting output
Channel 2 Non-inverting output
Positive power supply
OUT2–
OUT2+
VCC
9
10
11
12
O
O
Channel 1 Inverting output
Channel 1 Non-inverting output
OUT1–
OUT1+
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
MAX
5.5
UNIT
V
Supply voltage: (VCC –VEE) and (VCC –GND) ((2))
Input pins (IN+, IN–) from VEE (WSON) (3)
Input pins (IN+, IN–) from GND (WCSP) (4)
Current into input pins (IN+, IN–)
Output (OUT+, OUT–)
VCC + 0.3
VCC + 0.3
10
V
V
V
EE –0.3
EE –0.3
–10
V
mA
V
GND
VCC
10
mA
°C
°C
Current into output pins (OUT+, OUT–)
Junction temperature, TJ
150
Storage temperature, Tstg
150
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) VEE less than or equal to GND
(3) Input terminals are diode-clamped to VEE and VCC
(4) Input terminals are diode-clamped to GND and VCC
6.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
6.3 Thermal Information
TLV3801
TLV3811(C)
THERMAL METRIC (1)
DSG (WSON) WCSP (BGA)
UNIT
8-pin
6-pin
132.1
RqJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
69.4
95.7
36.2
3.5
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RqJC(top)
RqJB
1.4
41
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
41
yJB
36.0
9.4
RqJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
MAX
5.25
UNIT
V
Single supply operation: VCC –VEE with VEE = GND
Split supply operation: VCC –VEE with VEE < GND (WSON)
Split supply operation: VCC –GND with VEE < GND (WSON)
Input voltage range (WSON)
2.7
5.25
V
2.4
5.25
V
VEE + 1.5
GND + 1.5
–1.5
VCC + 0.1
VCC + 0.1
+1.5
V
Input voltage range (WCSP)
V
Differential Input voltage range
V
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over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Ambient temperature, TA
125
°C
–40
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6.5 Electrical Characteristics
For VCC = 3.3 V, VEE = GND = 0, VCM = 2.5 V at TA = 25°C (Unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC Input Characteristics
Input offset
voltage
+5(1)
mV
mV
mV
mV
TA = –40°C to +125°C
–5(1)
VOS
±0.5
2
Input hysteresis
voltage
VHYS (WSON)
VHYS (WCSP)
TLV3801
TLV3811
TLV3811C
Input hysteresis
voltage
1.1
0
Input hysteresis
voltage
Single Supply: VEE = GND
VCC –VEE = 2.7 V to 5.25 V
TA = –40 °C to +125°C
Common-mode
voltage range
VCM-Range
VEE + 1.5
VEE + 1.5
VCC
V
V
Split Supply: VEE < GND
VCC –VEE = 2.7 V to 5.25 V and VCC –GND
= 2.4 V to 5.25 V
VCM-Range
(WSON)
Common-mode
voltage range
VCC
TA = –40 °C to +125°C
CMRR
(WSON)
Common mode
rejection ratio
VCM = VEE + 1.5V to VCC
VCM = GND + 1.5V to VCC
80
80
80
dB
dB
dB
CMRR
(WCSP)
Common mode
rejection ratio
Single Supply: VEE = GND
VCC –VEE = 2.7 V to 5.25 V
Power supply
rejection ratio
PSRR
Split Supply: VEE < GND
VCC –VEE = 2.7 V to 5.25 V and VCC –GND
= 2.4 V to 5.25 V
Power supply
rejection ratio
PSRR (WSON)
80
dB
IB
Input bias current
±1
10
4
µA
µA
TA = –40 °C to +125 °C
TA = –40 °C to +125 °C
–10
–4
Input offset
current
IOS
±0.1
Input capacitance,
common mode
CIC
1
pF
DC Output Characteristics
Output common
mode voltage
VCC - GND ≥2.6 V
TA = –40℃to +125℃
1.125
0.92
1.25
1.2
1.375
1.29
V
V
VOCM
VCC - GND < 2.6 V
TA = –40℃to +125℃
Output common
mode voltage
Output common
mode voltage
mismatch
30
mV
ΔVOCM
TA = –40℃to +125℃
–30
Peak-to-Peak
output common
mode voltage
VOCM_PP
50
mVpp
Differential output
voltage (WSON)
VOD
VOD
250
240
350
350
450
450
30
mV
mV
mV
TA = –40℃to +125℃
TA = –40℃to +125℃
TA = –40℃to +125℃
Differential output
voltage (WCSP)
Differential output
voltage mismatch
ΔVOD
Power Supply
IQ (WSON)
Quiescent current
per comparator
20
26.6
mA
TA = –40°C to +125°C
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6.5 Electrical Characteristics (continued)
For VCC = 3.3 V, VEE = GND = 0, VCM = 2.5 V at TA = 25°C (Unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Quiescent current
IQ (WCSP)
17
23
mA
TA = –40°C to +125°C
per comparator
AC Characteristics
VOVERDRIVE = 50 mV, VUNDERDRIVE = 50 mV, 50
MHz Squarewave
tPD
Propagation delay
225
ps
Temperature
Tempco of tPD Coefficient of
propagation delay
±0.2
ps/℃
Propagation delay VOVERDRIVE = 50mV, VUNDERDRIVE = 50 mV, 50
tPD_SKEW
±2.5
2
ps
ps
ps
ps
ps
ps
skew
MHz Squarewave
Common mode
dispersion
tCM_DISPERSION
tOD_DISPERSION
tOD_DISPERSION
tUD_DISPERSION
tUD_DISPERSION
VCM varied from VCM (min) to VCM (max)
Overdrive
dispersion
Overdrive varied from 20 mV to 100 mV
Overdrive varied from 10 mV to 1 V
Overdrive varied from 20 mV to 100 mV
Overdrive varied from 10 mV to 1 V
5
Overdrive
dispersion
15
7
Underdrive
dispersion
Underdrive
dispersion
10
tR
tF
Rise time
Fall time
20% to 80%
80% to 20%
135
135
ps
ps
Input toggle
frequency
fTOGGLE
fTOGGLE
VIN = 200 mVPP Sine Wave, VOD = 550 mV
VIN = 200 mVPP Sine Wave, 50% Output swing
2.3
3
GHz
GHz
Input toggle
frequency
TR
TR
Toggle Rate
Toggle Rate
VIN = 200 mVPP Sine Wave, VOD = 550 mV
VIN = 200 mVPP Sine Wave, 50% Output swing
4.6
6
Gbps
Gbps
Minimum allowed VOVERDRIVE = VUNDERDRIVE = 50mV
input pulse width PWOUT = 90% of PWIN
PulseWidth
240
ps
(1) Ensured by charaterization
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6.6 Timing Diagrams
VOVERDRIVE
VUNDERDRIVE
IN-
VUNDERDRIVE
VOVERDRIVE
IN+
tPLH
tPHL
tR
tF
80%
20%
1.25V
VOUT+
VOUT-
1.25V
tPHL
tPLH
0V
tPLHD
tPHLD
VOD
图6-1. General Timing Diagram
V
OD = 100mV
V
OD = 20mV
IN-
IN+
DISPERSION
0V
VOD
图6-2. Overdrive Dispersion
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6.7 Typical Characteristics
At TA = 25°C, VCC - VEE = 3.3 V to 5 V while VEE = GND = 0, VCM = 2.5 V, and input overdrive/underdrive = 50 mV, unless
otherwise noted.
1.5
1
2.4
2.3
2.2
2.1
2
0.5
0
1.9
1.8
1.7
1.6
-0.5
-1
For 33 units
For 33 units
-1.5
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature (C)
图6-3. Offset vs. Temperature
图6-4. TLV3801 Hysteresis vs. Temperature
1.8
1.4
1
2.4
2.3
2.2
2.1
2
0.6
0.2
-0.2
-0.6
-1
1.9
1.8
1.7
1.6
-40C
25C
85C
125C
-1.4
-1.8
For 33 units
3 3.3
1.5
1.8
2.1
2.4
2.7
3
3.3
1.5
1.8
2.1
2.4
2.7
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
图6-6. TLV3801 Hysteresis vs. Common-Mode, 3.3 V
图6-5. Offset vs. Common-Mode, 3.3 V
1.8
1.4
1
2.4
2.3
2.2
2.1
2
0.6
0.2
-0.2
-0.6
-1
1.9
1.8
-40C
25C
85C
125C
1.7
1.6
-1.4
-1.8
For 33 units
4.5 5
1.5
2
2.5
3
3.5
4
4.5
5
1.5
2
2.5
3
3.5
4
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
图6-8. TLV3801 Hysteresis vs. Common-Mode, 5 V
图6-7. Offset vs. Common-Mode, 5 V
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6.7 Typical Characteristics (continued)
At TA = 25°C, VCC - VEE = 3.3 V to 5 V while VEE = GND = 0, VCM = 2.5 V, and input overdrive/underdrive = 50 mV, unless
otherwise noted.
22
21.6
21.2
20.8
20.4
20
18
17.6
17.2
16.8
16.4
16
19.6
19.2
18.8
18.4
18
15.6
15.2
14.8
14.4
14
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature (C)
图6-9. TLV3801 Supply Current vs. Temperature
图6-10. TLV3811(C) Supply Current vs. Temperature
5
4
5
4
3
2
1
0
3
2
1
0
-1
-2
-3
-4
-5
-1
-2
-3
-4
-5
-40C
-40C
25C
85C
125C
25C
85C
125C
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.3
1.5 1.8 2.1 2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
图6-11. Bias Current vs. Common-Mode, 3.3 V
图6-12. Bias Current vs. Common-Mode, 5 V
250
245
240
235
230
225
220
215
210
205
200
260
255
250
245
240
235
230
225
220
215
210
-40C
-40C
25C
85C
125C
25C
85C
125C
1.5
1.8
2.1
2.4
2.7
3
3.3
1.5
2
2.5
3
3.5
4
4.5
5
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
图6-13. Propagation Delay vs. Common-Mode, 3.3 V
图6-14. Propagation Delay vs. Common-Mode, 5 V
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6.7 Typical Characteristics (continued)
At TA = 25°C, VCC - VEE = 3.3 V to 5 V while VEE = GND = 0, VCM = 2.5 V, and input overdrive/underdrive = 50 mV, unless
otherwise noted.
250
245
240
235
230
225
220
215
210
205
200
250
245
240
235
230
225
220
215
210
205
200
-40C
25C
85C
125C
-40C
25C
85C
125C
10
20 30 40 50 70 100
200 300 500 7001,000
10
20 30 40 50 70 100
200 300 500 7001,000
Input Overdrive (mV)
Input Underdrive (mV)
图6-16. Propagation Delay vs. Underdrive, 3.3 V
265
图6-15. Propagation Delay vs. Overdrive, 3.3 V
265
260
255
250
245
240
235
230
225
220
215
210
-40C
-40C
25C
85C
125C
260
255
250
245
240
235
230
225
220
215
210
25C
85C
125C
10
20 30 40 50 70 100
200 300 500 7001,000
10
20 30 40 50 70 100
200 300 500 7001,000
Input Overdrive (mV)
Input Underdrive (mV)
图6-17. Propagation Delay vs. Overdrive, 5 V
图6-18. Propagation Delay vs. Underdrive, 5 V
0
-5
0
-5
-10
-15
-20
-25
-10
-15
-20
-25
-40C
-40C
25C
25C
85C
85C
125C Referred to 10mV VOD
125C Referred to 10mV VOD
10
20 30 40 50 70 100
200 300 500 7001,000
10
20 30 40 50 70 100
200 300 500 7001,000
Overdrive Voltage (mV)
Overdrive Voltage (mV)
图6-19. Dispersion vs. Overdrive, 3.3 V
图6-20. Dispersion vs. Overdrive, 5 V
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6.7 Typical Characteristics (continued)
At TA = 25°C, VCC - VEE = 3.3 V to 5 V while VEE = GND = 0, VCM = 2.5 V, and input overdrive/underdrive = 50 mV, unless
otherwise noted.
400
375
350
325
300
275
250
225
200
175
150
400
375
350
325
300
275
250
225
200
175
150
-40C
25C
85C
125C
-40C
25C
85C
125C
1.5
1.8
2.1
2.4
2.7
3
3.3
1.5
2
2.5
3
3.5
4
4.5
5
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
图6-21. Minimum Pulse Width vs. Common-Mode, 3.3 V
图6-22. Minimum Pulse Width vs. Common-Mode, 5 V
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7 Detailed Description
7.1 Overview
The TLV3801/TLV3811(C) are high-speed comparators with LVDS output. The fast response time of these
comparators make them well suited for applications that require narrow pulse width detection or high toggle
frequencies. The TLV3801 is available in the 8-pin DSG package while the TLV3811(C) is available in the 6-pin
BGA package.
7.2 Functional Block Diagram
VCC
VCC
VCC
OUT+
OUT-
OUT+
OUT-
IN+
IN-
IN+
IN-
+
–
+
LVDS
LVDS
–
TLV3811
TLV3801
GND
GND
VEE
7.3 Feature Description
The TLV3801/TLV3811(C) are single channel, high-speed comparators with a typical propagation delay of 225
ps and LVDS output. The minimum pulse width detection capability is 240 ps and the typical toggle frequency is
3 GHz (6 Gbps). These comparators are well suited for distance sensing for LIDAR and time-of-flight
applications as well as for high-speed test and measurement systems. The TLV3801 has two separate power
rails for the input and the output; this allows the input to be referenced from either single or split supply (VCC
and VEE) while the output is referenced from ground (VCC and GND). On the other hand, the TLV3811(C) has
one power rail for both inputs and outputs and can only be operated at a single supply.
7.4 Device Functional Modes
The TLV3801 has a single functional mode and is operational on the condition that both the input supply voltage
(VCC - VEE) is greater than or equal to 2.7 V and the output supply voltage (VCC - GND) is greater than or
equal to 2.4 V.
The TLV3811(C) has a single functional mode and is operational when the power supply voltage (VCC - GND) is
greater than or equal to 2.7 V.
7.4.1 Inputs
The TLV3801/TLV3811(C) feature an input stage, capable of operating between 1.5 V above VEE (GND for
TLV3811(C)) and 0.1 V above VCC, with an internal ESD protection circuit that includes two pairs of front-to-
back diodes between IN+ and IN- as well as two 50 Ω resistors, as shown in 图 7-1. This prevents damage to
the input stage by limiting the differential input voltage to be no more than twice the diode's forward-voltage drop
2 × VF (2 × 0.7 V).
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50 Ω
50 Ω
IN+
IN-
TO
INTERNAL
CIRCUITRY
图7-1. Input Stage Circuitry
When the differential input voltage exceeds 2 × VF, the input bias current increases at the input pins IN+ and IN-,
as shown in 方程式1.
Input Current = [(VIN+ - VIN-) - 2 × VF] / (2 × 50)
(1)
To avoid damaging the inputs when exceeding the recommended input voltage range, an external resistor
should be used to limit the current. The current should be limited to less than 10 mA.
7.4.2 LVDS Output
The TLV3801/TLV3811(C) outputs are LVDS compliant. When the input of the downstream device is terminated
with a 100 Ωresistor, the comparators provide a ±350 mV differential swing at an output common-mode voltage
of 1.25 V above GND. Fully differential outputs enable fast digital toggling and reduce EMI compared to single-
ended output standards.
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Capacitive Loads
Under reasonable capacitive loads, the device maintains specified propagation delay. However, excessive
capacitive loading under high switching frequencies may increase supply current, propagation delay, or induce
decreased slew rate.
8.1.2 Hysteresis
A comparator's high, open-loop gain creates a small band of input differential voltage where the comparator may
produce "chatter" which causes the output to toggle back and forth between a “logic high” and a “logic
low”. This can cause design challenges for inputs with slow rise and fall times or systems with excessive noise.
These challenges can be prevented by adding hysteresis to the comparator. However, hysteresis must be added
strategically when input signals are small since it can cuase signals to go undetected. As a result, TLV3811C is
optimized for detecting small, fast-switching inputs and has 0 mV of internal hysteresis. On the other hand, for
detecting larger input signals in the presense of noise, the TLV3811 has 1.1 mV of internal hysteresis and
TLV3801 has 2 mV.
Since the TLV3801/TLV3811(C) only have a minimal amount of internal hysteresis, external hysteresis can be
applied in the form of a positive feedback loop that adjusts the trip point of the comparator depending on its
current output state. See the Non-Inverting Comparator With Hysteresis section for more details.
8.2 Typical Application
8.2.1 Optical Receiver
The TLV3801/TLV3811(C) can be used in conjunction with a high performance amplifier such as the OPA858 to
create an optical receiver as shown in the 图 8-1. The photodiode operates in photoconductive mode: exposure
to light will cause a reverse current through the photodiode. A bias voltage is applied to the op amp's non-
inverting input to prevent saturation at the negative power supply. The OPA858 takes the current conducting
through the diode and translates it into a voltage for a high speed comparator to detect. The TLV3801/
TLV3811(C) will then output the proper LVDS signal according to the threshold set (VREF).
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CF
RF
VCC
VCC
-
VOUT
OPA858
+
OUT+
TLV3801
+
OUT-
-
100
VBIAS
VREF
图8-1. Optical Receiver
8.2.1.1 Design Requirements
表8-1. Design Parameters
PARAMETER
VALUE
VCC
+5 V
0 V
VEE
VOUT, SWING
100 mV
100 µA
159 MHz
IDIODE
fp
8.2.1.2 Detailed Design Procedure
Set VBIAS to be in the recommended common-mode voltage range of the OPA858. This is also the minimum
output voltage of the op amp VOUT, MIN as the op amp will attempt to settle at the voltage applied to the non-
inverting input.
The maximum output voltage of the op amp VOUT, MAX can be calculated from the desired output voltage swing
VOUT, SWING and VOUT, MIN, as shown in 方程式2.
VOUT, MAX = VOUT, SWING + VOUT, MIN
(2)
The gain resistor RF is determined by the desired VOUT, MAX and VOUT, MIN and the maximum current IDIODE
through the diode, as shown in 方程式2.
RF = (VOUT, MAX - VOUT, MIN) / IDIODE
(3)
The feedback capacitor, in combinaton with the gain resistor, forms a pole in the frequency response of the
amplifier. The feedback capacitor can be determined by the gain resistor and the desired pole frequency fp, as
shown in 方程式2.
CF = 1 / (2 × π× RF x fp)
(4)
Set VREF to be the switching threshold voltage between VOUT, MAX and VOUT, MIN
.
Select values for VBIAS and VREF. Plug in given values for VOUT, MAX, IDIODE, and fp. For the given example, VBIAS
= 1.5 V, VREF = 1.55 V, and RF, CF is solved as 1 kΩand 1 pF, respectively.
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For more information, please refer to the op amp tutorials for stability analysis on the transimpedance amplifier
Spice Stability Analysis and Op Amp Stability. See application note SBOA268A Transimpedance Amplifier
Circuit for more detailed procedures.
8.2.1.3 Application Performance Plots
图8-2.
8.2.2 Non-Inverting Comparator With Hysteresis
A way to implement external hysteresis to the TLV3801/TLV3811(C) is to add two resistors to the circuit: one in
series between the reference voltage and the inverting pin, and another from the inverting pin to one of the
differential output pins.
VCC
VIN
Q
Q
+
–
R1
+
–
VREF
R2
图8-3. Non-Inverting Comparator with Hysteresis Circuit
8.2.2.1 Design Requirements
表8-2. Design Parameters
PARAMETER
VALUE
VHYS
VREF
VT1
50 mV
2.5 V
2.34 V
2.29 V
VT2
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PARAMETER
表8-2. Design Parameters (continued)
VALUE
Q
Q
1.425 V
1.075 V
8.2.2.2 Detailed Design Procedure
First, create an equation for VT that covers both output voltages when the output is high or low.
VT1 = VREFR2 + QR1
R1+R2 R1+R2
(5)
(6)
VT2 = VREFR2 + QR1
R1+R2 R1+R2
The hysteresis voltage in this network is equal to the difference in the two threshold voltage equations.
VHYS = VT1-VT2
(7)
(8)
- VREFR2 - QR1
R1+R2 R1+R2
VHYS = VREFR2 + QR1
R1+R2 R1+R2
VHYS = (Q-Q)R1
R1+R2
(9)
VHYS = VODR1
R1+R2
(10)
Note that these equations do not take into account the effects of the internal hysteresis and offset voltage of the
comparator. Design parameters will need to be adjusted accordingly.
Select a value for R2. Plug in given values for VREF, VT1, VT2, Q, and Q, and solve for R1. For the given
example, R2 = 50 kΩ, and R1 is solved as = 8.33 kΩ.
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8.2.2.3 Application Performance Plots
图8-4. Hysteresis Curve for LVDS Comparator
8.2.3 Logic Clock Source to LVDS Transceiver
The 图 8-5 shows a logic clock source being terminated and driven with the TLV3801/TLV3811(C) across a
CAT6 Cable to receive an equivalent LVDS clock signal at the receiver end.
CLOCK SOURCE
OUT+
OUT-
+
TLV3801
+
RJ45 CAT6 CABLE RJ45
TLV3801
-
-
VREF
图8-5. LVDS Clock Transceiver
8.2.4 External Trigger Function for Oscilloscopes
图 8-6 is a typical configuration for creating an external trigger on oscilliscopes. The user adjusts the trigger
level, and a DAC converts this trigger level to a voltage the TLV3801/TLV3811(C) can use as a reference. The
input voltage from an oscilloscope channel is then compared to the trigger reference voltage, and the TLV3801/
TLV3811(C) sends an LVDS signal to a downstream FPGA to begin a capture. It is common to see bipolar inputs
in test and measurement systems such as oscilloscopes; therefore, the TLV3801 can be configured in split
supply so that the inputs are in the allowable input voltage range.
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VCC = +2.5V
External
Trigger
Amplifier/
Attenuation
Trigger Input
+
FPGA
TLV3801
GND
-
VEE = -2.5V
DAC
图8-6. External Trigger Function
8.3 Power Supply Recommendations
The TLV3801 has two seperate power rails: VCC - VEE for the input stage and VCC - GND for the output stage.
This allows for both single and split supply capabilities for the input stage with a seperate ground reference for
the LVDS output stage. Split supply operation allows users to apply both positive and negative (bipolar) voltages
to the input pins.
When operating from a single supply, the supply voltage range for both the input and output stage is 2.7 V to
5.25 V. When operating from split supply rails, the supply voltage range for the input stage (VCC - VEE) is 2.7 V
to 5.25 V, and the supply voltage range for the output stage (VCC - GND) is 2.4 V to 5.25 V. The output logic
level is independent of the VCC and VEE levels. The TLV3811(C) is specified for operation from 2.4 V to 5.25 V
and can only be operated from a single supply with both inputs and outputs referenced to GND.
Regardless of single supply or split supply operation, proper decoupling capacitors are required. It is
recommended to use a scheme of multiple, low-ESR ceramic capacitors from the supply pins to the ground
plane for optimum performance. A good combination would be 100 pF, 10 nF, and 1 uF with the lowest value
capacitor closest to the comparator.
8.4 Layout
8.4.1 Layout Guidelines
Comparators are very sensitive to input noise. For best results, adhere to the following layout guidelines.
1. Use a printed-circuit-board (PCB) with a good, unbroken, low-inductance ground plane. Proper grounding
(use of a ground plane) helps maintain specified device performance.
2. To minimize supply noise for single and split supply, place decoupling capacitor arrays as close as possible
to VCC
.
3. On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback
around the comparator. Keep inputs away from the output.
4. Solder the device directly to the PCB rather than using a socket.
5. For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes
some degradation to propagation delay when impedance is low. The topside ground plane runs between the
output and inputs.
6. Use a 100 Ωtermination resistor across the device's LVDS output.
7. Use higher performance substrate materials such as Rogers.
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8.4.2 Layout Example
VEE GND
IN-
OUT-
OUT+
IN+
VCC
C1
图8-7. TLV3801EVM Layout Example
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9 Device and Documentation Support
9.1 Device Support
9.1.1 Development Support
LIDAR Pulsed Time of Flight Reference Design
9.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
9.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
9.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
9.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
9.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLV3801DSGR
TLV3801DSGT
TLV3811CYBGR
TLV3811CYBGT
TLV3811YBGR
TLV3811YBGT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
WSON
DSBGA
DSBGA
DSBGA
DSBGA
DSG
DSG
YBG
YBG
YBG
YBG
8
8
6
6
6
6
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
3801
3801
02
Samples
Samples
Samples
Samples
Samples
Samples
SN
SNAGCU
SNAGCU
SNAGCU
SNAGCU
O2
LQ
LQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV3801 :
Automotive : TLV3801-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV3801DSGR
TLV3801DSGT
TLV3811CYBGR
TLV3811CYBGT
WSON
WSON
DSBGA
DSBGA
DSG
DSG
YBG
YBG
8
8
6
6
3000
250
180.0
179.0
180.0
180.0
8.4
8.4
8.4
8.4
2.2
2.2
2.2
2.2
1.2
1.2
0.6
0.6
4.0
4.0
2.0
2.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
3000
250
0.87
0.87
1.27
1.27
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Mar-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV3801DSGR
TLV3801DSGT
TLV3811CYBGR
TLV3811CYBGT
WSON
WSON
DSBGA
DSBGA
DSG
DSG
YBG
YBG
8
8
6
6
3000
250
213.0
213.0
182.0
182.0
191.0
191.0
182.0
182.0
35.0
35.0
20.0
20.0
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
YBG0006
DSBGA - 0.5 mm max height
SCALE 13.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.5 MAX
C
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
0.4
TYP
C
0.8
TYP
SYMM
D: Max = 1.248 mm, Min =1.188 mm
E: Max = 0.848 mm, Min =0.788 mm
B
0.4 TYP
A
0.27
0.23
C A B
1
2
6X
0.015
SYMM
4224328/A 05/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YBG0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.23)
1
2
A
(0.4) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 50X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224328/A 05/2018
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBG0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
6X ( 0.25)
2
1
A
(0.4) TYP
SYMM
B
C
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 50X
4224328/A 05/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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GENERIC PACKAGE VIEW
DSG 8
2 x 2, 0.5 mm pitch
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224783/A
www.ti.com
PACKAGE OUTLINE
DSG0008B
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
B
A
0.1 MIN
(0.05)
PIN 1 INDEX AREA
S
C
A
L
E
3
0
.
A
2.1
1.9
SECTION A-A
TYPICAL
0.3
0.2
0.4
0.2
ALTERNATIVE TERMINAL SHAPE
TYPICAL
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
EXPOSED
THERMAL PAD
(0.2) TYP
0.9 0.1
5
4
6X 0.5
A
A
2X
1.5
9
1.6 0.1
8
1
0.3
8X
0.2
0.4
0.2
PIN 1 ID
8X
0.1
0.05
C A B
C
4222124/E 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DSG0008B
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.9)
(
0.2) VIA
8X (0.5)
TYP
1
8
8X (0.25)
(0.55)
SYMM
9
(1.6)
6X (0.5)
5
4
SYMM
(1.9)
(R0.05) TYP
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222124/E 05/2020
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DSG0008B
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.5)
METAL
8
SYMM
1
8X (0.25)
(0.45)
SYMM
9
(0.7)
6X (0.5)
5
4
(R0.05) TYP
(0.9)
(1.9)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4222124/E 05/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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