TLV3691IDCKR [TI]
小型毫微功耗单路比较器 | DCK | 5 | -40 to 125;
| 型号： | TLV3691IDCKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 小型毫微功耗单路比较器 | DCK | 5 | -40 to 125 放大器 光电二极管 比较器 |
| 文件： | 总32页 (文件大小：3657K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
TLV3691 0.9V 至 6.5V、毫微功耗比较器
1 特性
3 说明
1
•
•
低静态电流：75nA
宽电源：
此 TLV3691提供宽电源电压范围、低至 150nA（最大
值）的静态电流和轨到轨输入。所有这些 具有 搭配行
业标准的超小型封装，使得这款器件成为便携式电子和
工业系统中 低压和低功耗 应用的理想选择。
–
–
0.9V 至 6.5V
±0.45V 至 ±3.25V
•
微型封装：双列扁平无脚封装 (DFN)-6 (1mm ×
1mm)，5 引脚 SC70
单通道、低功耗、宽电源和温度范围使得这款器件能够
灵活处理从消费类到工业类的几乎全部应用。
TLV3691 采用 SC70-5 和 1mm × 1mm DFN-6 封装。
这款器件可在 -40°C 至 125°C 的扩展工业温度范围内
运行。
•
•
•
•
•
输入共模范围扩展至两个电源轨以上 100mV
响应时间：24µs
低输入偏移电压：±3mV
推挽输出
器件信息(1)
工业温度范围：
-40°C 至 125°C
器件型号
TLV3691
封装
SC70 (5)
X2SON (6)
封装尺寸（标称值）
1.25mm × 2.00mm
1.00mm x 1.00mm
2 应用
•
•
•
•
•
过压和欠压检测
(1) 要了解所有可用封装，请参见数据表末尾的可订购产品附录。
窗口比较器
过流检测
零交叉检测
系统监控：
–
–
–
–
智能电话
平板电脑
工业传感器
便携式医疗设备
毫微功耗运行
160
140
120
100
80
125°C
-40°C
60
25°C
40
20
VS = 0.9 V
1.5
0
0.5
2.5
3.5
4.5
5.5
6.5
Supply Voltage (V)
C001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBOS694
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 12
Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application ................................................. 16
Power Supply Recommendations...................... 18
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
6.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
8
9
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 器件和文档支持 ..................................................... 20
11.1 器件支持................................................................ 20
11.2 文档支持................................................................ 20
11.3 社区资源................................................................ 20
11.4 商标....................................................................... 20
11.5 静电放电警告......................................................... 20
11.6 Glossary................................................................ 21
12 机械、封装和可订购信息....................................... 21
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Original (December 2013) to Revision A
Page
•
已添加 ESD 额定值表，特性 描述 部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文
档支持部分以及机械、封装和可订购信息部分........................................................................................................................ 1
2
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
5 Pin Configuration and Functions
DCK Package
5-Pin SC70
Top View
DPF Package
6-Pin X2SON
Top View
IN+
GND
IN-
1
2
3
5
VCC
IN+
GND
IN-
1
2
3
6
5
4
VCC
NC
4
OUT
OUT
Pin Functions
PIN
I/O
DESCRIPTION
NAME
GND
IN+
X2SON
SC70
2
1
3
5
4
6
2
1
—
I
Ground
Noninverting input
Inverting input
IN–
3
I
NC
—
4
—
O
I
No internal connection
Output (push-pull)
Positive power supply
OUT
VCC
5
Copyright © 2013–2015, Texas Instruments Incorporated
3
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
7
UNIT
V
Supply voltage
Voltage(2)
Signal input terminals
Current(2)
Output short circuit(3)
(V–) – 0.5
(V+) + 0.5
±10
V
mA
mA
Continuous
Operating, TA
–55
150
150
150
Temperature
Junction, TJ
Storage, Tstg
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, one comparator per package.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-
C101, all pins(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
0.9
NOM
MAX
6.5
UNIT
V
Power supply voltage
Ambient Temperature, TA
–40
125
°C
6.4 Thermal Information
TLV3691
THERMAL METRIC(1)
DCK (SC70)
5 PINS
297.4
109.3
74.4
DPF (X2SON)
UNIT
6 PINS
252.4
93.9
192.8
3
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJCtop
RθJB
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
3
ψJB
73.6
203.8
N/A
RθJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
6.5 Electrical Characteristics
At TA = 25°C, VS = 0.9 V to 6.5 V, VCM = VS/2 and CL = 15 pF, unless otherwise noted.
PARAMETER
OFFSET VOLTAGE
TEST CONDITIONS
MIN
TYP
±3
MAX
UNIT
TA = 25°C
±15
±22
mV
mV
VOS
Input offset voltage
TA = –40°C to 125°C
VHYS
Hysteresis
17
mV
dVOS/dT
PSRR
Input offset voltage drift
Power-supply rejection ratio
TA = –40°C to 125°C
TA = –40°C to 125°C
±70
µV/°C
µV/V
2000
INPUT VOLTAGE RANGE
VCM Common-mode voltage range
Hysteresis
INPUT BIAS CURRENT
TA = –40°C to 125°C
(V–) – 0.1
(V+) + 0.1
V
±17
30
8
mV
TA = 25°C
100
20
pA
nA
pA
IB
Input bias current
TA = –40°C to 125°C
IOS
Input offset current
CLOAD
OUTPUT
Capacitive load drive
See Typical Characteristics
IO = 2.5 mA, input overdrive ≥ 50 mV,
VS = 6.5 V
155
6
165
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
IO = 2.5 mA, input overdrive ≥ 50 mV,
VS = 6.5 V, TA = –40°C to 125°C
220
10
IO ≤ 100 µA, input overdrive ≥ 50 mV,
VS = 6.5 V
VOH
Voltage output swing from upper rail
IO ≤ 100 µA, input overdrive ≥ 50 mV,
20
VS = 6.5 V, TA = –40°C to 125°C
IO ≤ 100 µA, input overdrive ≥ 50 mV,
70
155
6
75
VS = 0.9 V
IO ≤ 100 µA, input overdrive ≥ 50 mV,
80
VS = 0.9 V, TA = –40°C to 125°C
IO = 2.5 mA, input overdrive ≥ 50 mV,
VS = 6.5 V
165
220
10
IO = 2.5 mA, input overdrive ≥ 50 mV,
VS = 6.5 V, TA = –40°C to 125°C
IO ≤ 100 µA, input overdrive ≥ 50 mV,
VS = 6.5 V
VOL
Voltage output swing from lower rail
IO ≤ 100 µA, input overdrive ≥ 50 mV,
20
VS = 6.5 V, TA = –40°C to 125°C
IO ≤ 100 µA, input overdrive ≥ 50 mV,
35
40
VS = 0.9 V
IO ≤ 100 µA, input overdrive ≥ 50 mV,
45
VS = 0.9 V, TA = –40°C to 125°C
Short circuit sink current
VS = 6.5 V, see Typical Characteristics
VS = 6.5 V, see Typical Characteristics
42
35
mA
mA
ISC
Short circuit source current
Copyright © 2013–2015, Texas Instruments Incorporated
5
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
Electrical Characteristics (continued)
At TA = 25°C, VS = 0.9 V to 6.5 V, VCM = VS/2 and CL = 15 pF, unless otherwise noted.
PARAMETER
POWER SUPPLY
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VS
Specified voltage range
0.9
6.5
150
200
V
TA = 25°C
TA = –40°C to 125°C
75
nA
nA
IQ
Quiescent current (per channel)
TEMPERATURE RANGE
Specified range
–40
–55
–65
125
150
150
°C
°C
°C
Operating range
Storage range
6.6 Switching Characteristics
At TA = 25°C, VS = 0.9 V to 6.5 V, VCM = VS/2 and CL = 15 pF, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VS = 6.5 V, Input overdrive = 50 mV
VS = 0.9 V, Input overdrive = 50 mV
VS = 6.5 V, Input overdrive = 100 mV
VS = 0.9 V, Input overdrive = 100 mV
VS = 6.5 V, Input overdrive = 50 mV
VS = 0.9 V, Input overdrive = 50 mV
VS = 6.5 V, Input overdrive = 100 mV
VS = 0.9 V, Input overdrive = 100 mV
32
45
24
35
32
40
24
28
tPHL
High-to-low
Low-to-high
Propagation delay time
µs
tPLH
tR
tF
Rise time
Fall time
Input overdrive = 100 mV
Input overdrive = 100 mV
ns
330
6
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
6.7 Typical Characteristics
At TA = 25°C, VS = 0.9 V to 6.5 V, and input overdrive = 100 mV, unless otherwise noted.
160
140
120
100
80
10
9
+ Bias Current (6.5 V)
125°C
8
7
œ Bias Current (6.5 V)
6
5
-40°C
4
60
3
25°C
2
40
1
20
0
VS = 0.9 V
1.5
0
-1
0.5
2.5
3.5
4.5
5.5
6.5
œ50
œ25
0
25
50
75
100
125
Supply Voltage (V)
Temperature (°C)
C001
C006
Figure 1. Quiescent Current vs Supply Voltage
Figure 2. Input Bias Current vs Temperature
1
0.8
0.6
0.4
0.2
0
4
3
VOH
VOH
-40°C
-40°C
125°C
-40°C
25°C
25°C
2
125°C
125°C
1
125°C
125°C
-40°C
0
-0.2
-0.4
-0.6
-0.8
-1
125°C
œ1
œ2
œ3
œ4
-40°C
-40°C
VOL
VS = ±0.45 V
VS = ±3.25V
40
VOL
0
0.1
0.2
0.3
0
10
20
30
50
IOUT (mA)
IOUT (mA)
C011
C011
VS = 0.9 V
VS = 6.5 V
Figure 3. Output Voltage vs Output Current
Figure 4. Output Voltage vs Output Current
1000
800
60
40
VS = 0.9 V
Sourcing
VS = 6.5 V
Sourcing
600
400
20
200
0
0
œ200
œ400
œ600
œ800
œ1000
œ20
œ40
œ60
Sinking
100
Sinking
100
œ50
œ25
0
25
50
75
125
œ50
œ25
0
25
50
75
125
Temperature (°C)
Temperature (°C)
C005
C003
VS = 0.9 V
Figure 5. Short Circuit Current vs Temperature
VS = 6.5 V
Figure 6. Short Circuit Current vs Temperature
Copyright © 2013–2015, Texas Instruments Incorporated
7
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
Typical Characteristics (continued)
At TA = 25°C, VS = 0.9 V to 6.5 V, and input overdrive = 100 mV, unless otherwise noted.
140
120
100
80
140
120
100
80
Propagation Delay H-L
Propagation Delay L-H
Propagation Delay H-L
Propagation Delay L-H
VOD = 50 mV
VOD = 50 mV
60
60
40
40
20
20
VS = 0.9 V
300
VS = 6.5 V
800 1000
0
0
0
100
200
Input Overdrive (mV)
400
0
200
400
600
Input Overdrive (mV)
C009
C008
VS = 0.9 V
VS = 6.5 V
Figure 7. Propagation Delay vs Input Overdrive
Figure 8. Propagation Delay vs Input Overdrive
1m
100ꢀ
10ꢀ
1m
100ꢀ
10ꢀ
0.9-V Supply, Overdrive = 50 mV
0.9-V Supply, Overdrive = 100 mV
6.5-V Supply, Overdrive = 50 mV
6.5-V Supply, Overdrive = 100 mV
0.9-V Supply, Overdrive = 50 mV
0.9-V Supply, Overdrive = 100 mV
6.5-V Supply, Overdrive = 50 mV
6.5-V Supply, Overdrive = 100 mV
10p
100p
1n
10n
100n
10p
100p
1n
10n
100n
Output Capacitive Load (F)
Output Capacitive Load (F)
C017
C018
Figure 9. Propagation Delay (TPLH) vs Capacitive Load
Figure 10. Propagation Delay (TPHL) vs Capacitive Load
Overdrive = 50 mV
Input Voltage
Overdrive = 50 mV
Output Voltage
tPLH = 45 ꢀs
tPLH = 40 ꢀs
Input Voltage
Output Voltage
VS = 0.9 V, CL = 20 pF
Time (6 ꢀs/div)
VS = 0.9 V, CL = 20 pF
Time (6 ꢀs/div)
C023
C024
VS = 0.9 V
Overdrive = 50 mV
VS = 0.9 V
Overdrive = 50 mV
Figure 11. Propagation Delay (TPLH
)
Figure 12. Propagation Delay (TPHL
)
8
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
Typical Characteristics (continued)
At TA = 25°C, VS = 0.9 V to 6.5 V, and input overdrive = 100 mV, unless otherwise noted.
Overdrive = 50 mV
Overdrive = 50 mV
Output Voltage
Input Voltage
tPLH = 32 ꢀs
tPLH = 32 ꢀs
Input Voltage
Output Voltage
VS = 6.5 V, CL = 20 pF
VS = 6.5 V, CL = 20 pF
Time (4 ꢀs/div)
Time (4 ꢀs/div)
C013
C025
C015
C014
C026
C016
VS = 6.5 V
Overdrive = 50 mV
VS = 6.5 V
Overdrive = 50 mV
Figure 13. Propagation Delay (TPLH
Overdrive = 100 mV
)
Figure 14. Propagation Delay (TPHL
)
Overdrive = 100 mV
Output Voltage
Input Voltage
tPLH = 35 ꢀs
tPLH = 28 ꢀs
Input Voltage
Output Voltage
VS = 0.9 V, CL = 20 pF
Time (4 ꢀs/div)
VS = 0.9 V, CL = 20 pF
Time (6 ꢀs/div)
VS = 0.9 V,
Overdrive = 100 mV
VS = 0.9 V
Overdrive = 100 mV
Figure 15. Propagation Delay (TPLH
)
Figure 16. Propagation Delay (TPHL)
Overdrive = 100 mV
Input Voltage
Overdrive = 100 mV
Output Voltage
tPLH = 24 ꢀs
tPLH = 24 ꢀs
Input Voltage
Output Voltage
VS = 6.5 V, CL = 20 pF
Time (4 ꢀs/div)
VS = 6.5 V, CL = 20 pF
Time (4 ꢀs/div)
VS = 6.5 V
Overdrive = 100 mV
VS = 6.5 V
Overdrive = 100 mV
Figure 17. Propagation Delay (TPLH
)
Figure 18. Propagation Delay (TPHL)
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TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
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Typical Characteristics (continued)
At TA = 25°C, VS = 0.9 V to 6.5 V, and input overdrive = 100 mV, unless otherwise noted.
40
VS Voltage
35
30
25
20
15
10
5
tPHL
tTURN-ON = 200 ꢀs
tPLH
VS = 6.5 V
-25
VOD = 100 mV
100
VS = 6.5 V
VOUT Voltage
0
Time (40 ꢀs/div)
-50
0
25
50
75
125
Temperature (°C)
C010
C029
Figure 19. Propagation Delay vs Temperature
Figure 20. Start-Up Time
45
40
35
30
25
20
15
10
5
45
40
35
30
25
20
15
10
5
Distribution Taken From 1000 Comparators
VS = 0.9 V
Distribution Taken From 1000 Comparators
VS = 6.5 V
0
0
Offset Voltage (mV)
Offset Voltage (mV)
C020
C019
VS = 0.9 V
VS = 6.5 V
Figure 21. Offset Voltage Production Distribution
Figure 22. Offset Voltage Production Distribution
15
15
8 Typical Units Shown
VS = 0.9 V
8 Typical Units Shown
VS = 6.5 V
12
9
12
9
6
6
3
3
0
0
œ3
œ6
œ9
œ12
œ15
œ3
œ6
œ9
œ12
œ15
-0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Common-Mode Voltage (V)
1
-1
0
1
2
3
4
5
6
7
Common-Mode Voltage (V)
C028
C027
VS = 0.9 V
Figure 23. Offset Voltage vs Common-Mode Voltage
VS = 6.5 V
Figure 24. Offset Voltage vs Common-Mode Voltage
10
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
Typical Characteristics (continued)
At TA = 25°C, VS = 0.9 V to 6.5 V, and input overdrive = 100 mV, unless otherwise noted.
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
Distribution Taken From 1000 Comparators
VS = 0.9 V
Distribution Taken From 1000 Comparators
VS = 6.5 V
0
0
Hysteresis Voltage (mV)
Hysteresis Voltage (mV)
C021
C022
VS = 0.9 V
Figure 25. Hysteresis Production Distribution
VS = 6.5 V
Figure 26. Hysteresis Production Distribution
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TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
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7 Detailed Description
7.1 Overview
The TLV3691 is a nano-power comparator with push-pull output. Operating from 0.9 V to 6.5 V and consuming a
maximum quiescent current of only 200 nA over the temperature range from –40°C to 125°C, the TLV3691 is
ideally suited for portable and industrial applications. The TLV3691 is available in the 5-pin SC70 and 6-pin DFN
packages.
7.2 Functional Block Diagram
VCC
IN+
IN-
+
OUT
œ
Bias
Power-on-reset
GND
7.3 Feature Description
The TLV3691 features a nano-power comparator capable of operating at low voltages. The TLV3691 features a
rail-to-rail input stage capable of operating up to 100 mV beyond each power supply rail. The TLV3691 also
features a push-pull output stage with internal hysteresis.
7.4 Device Functional Modes
The TLV3691 has a single functional mode and is operational when the power supply voltage is greater than
0.9 V. The maximum power supply voltage for the TLV3691 is 6.5 V.
7.4.1 Nano-Power
The TLV3691 features nano-power operation. With a maximum of 150 nA of operating current at 25°C, the
TLV3691 is ideally suited for portable and battery powered applications. With a maximum of 200 nA of operating
current over the temperature range from -40°C to 125°C, the TLV3691 is also ideally suited for industrial
applications and is a must have in every designer's toolbox.
7.4.2 Rail-to-Rail Inputs
The TLV3691 features an input stage capable of operating up to –100 mV beyond ground and 100 mV beyond
the positive supply voltage, allowing for ease of use and flexible design options. Internal hysteresis of 17 mV
(typical) allows for operation in noisy environments without the need for additional external components.
7.4.3 Push-Pull Output
The TLV3691 features a push-pull output, eliminating the need for an external pullup resistor and allows for
nano-power operation across all operating conditions.
12
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLV3691 comparators feature rail-to-rail inputs and outputs on supply voltages as low as 0.9 V. The push-
pull output stage is optimal for reduced power budget applications and features no shoot-through current. Low
minimum supply voltages, common-mode input range beyond supply rails, and a typical supply current of 75 nA
make the TLV3691 an excellent candidate for battery-operated and portable, handheld designs.
8.1.1 Comparator Inputs
The TLV3691 is a rail-to-rail input comparator, with an input common-mode range that exceeds the supply rails
by 100 mV for both positive and negative supplies. The device is designed to prevent phase inversion when the
input pins exceed the supply voltage. Figure 27 shows the device response when input voltages exceed the
supply, resulting in no phase inversion.
Output Voltage
Input Voltage
Time (2 ms/div)
C030
Figure 27. No Phase Inversion: Comparator Response to Input Voltage (Propagation Delay Included)
8.1.2 External Hysteresis
The device hysteresis transfer curve is shown in Figure 28. This curve is a function of three components: VTH
,
VOS, and VHYST
.
•
•
VTH is the actual set voltage or threshold trip voltage.
VOS is the internal offset voltage between VIN+ and VIN–. This voltage is added to VTH to form the actual trip
point at which the comparator must respond to change output states.
•
VHYST is the internal hysteresis (or trip window) that is designed to reduce comparator sensitivity to noise
(17 mV for the TLV3691).
Copyright © 2013–2015, Texas Instruments Incorporated
13
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
Application Information (continued)
VTH + VOS - (VHYST / 2)
VTH + VOS
VTH + VOS + (VHYST / 2)
Figure 28. Hysteresis Transfer Curve
8.1.2.1 Inverting Comparator With Hysteresis
The inverting comparator with hysteresis requires a three-resistor network that is referenced to the comparator
supply voltage (VCC), as shown in Figure 29. When VIN at the inverting input is less than VA, the output voltage is
high (for simplicity, assume VO switches as high as VCC). The three network resistors can be represented as R1
|| R3 in series with R2. Equation 1 defines the high-to-low trip voltage (VA1).
R2
VA1 = VCC
´
(R1 || R3) + R2
(1)
When VIN is greater than VA, the output voltage is low, very close to ground. In this case, the three network
resistors can be presented as R2 || R3 in series with R1. Use Equation 2 to define the low to high trip voltage
(VA2).
R2 || R3
VA2 = VCC
´
R1 + (R2 || R3)
(2)
(3)
Equation 3 defines the total hysteresis provided by the network.
DVA = VA1 - VA2
14
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
Application Information (continued)
+VCC
+5 V
R1
1 MW
VIN
5 V
0 V
RLOAD
VA
VO
100 kW
VA2
1.67 V
VA1
3.33 V
R3
1 MW
VIN
R2
1 MW
VO High
+VCC
VO Low
+VCC
R1
VA1
R2
R3
R1
VA2
R2
R3
Figure 29. TLV3691 in an Inverting Configuration With Hysteresis
8.1.2.2 Noninverting Comparator With Hysteresis
A noninverting comparator with hysteresis requires a two-resistor network, as shown in Figure 30, and a voltage
reference (VREF) at the inverting input. When VIN is low, the output is also low. For the output to switch from low
to high, VIN must rise to VIN1. Use Equation 4 to calculate VIN1
VREF
.
VIN1 = R1 ´
+ VREF
R2
(4)
When VIN is high, the output is also high. For the comparator to switch back to a low state, VIN must drop to VIN2
such that VA is equal to VREF. Use Equation 5 to calculate VIN2
VREF (R1 + R2) - VCC ´ R1
.
VIN2
=
R2
(5)
(6)
The hysteresis of this circuit is the difference between VIN1 and VIN2, as shown in Equation 6.
R1
DVIN = VCC
´
R2
Copyright © 2013–2015, Texas Instruments Incorporated
15
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
Application Information (continued)
+VCC
+5 V
VREF
VO
+2.5 V
VA
VIN
RLOAD
R1
330 kW
R2
1 MW
VO High
+VCC
VO Low
VIN1
5 V
0 V
R2
R1
VA = VREF
R2
VO
VA = VREF
R1
VIN2
VIN1
1.675 V 3.325 V
VIN
VIN2
Figure 30. TLV3691 in a Noninverting Configuration With Hysteresis
8.1.3 Capacitive Loads
Under reasonable capacitive loads, the device maintains specified propagation delay (see Typical
Characteristics). However, excessive capacitive loading under high switching frequencies may increase supply
current, propagation delay, or induce decreased slew rate.
8.1.4 Setting the Reference Voltage
Using a stable reference when setting the transition point for the device is important. The REF3312, as shown in
Figure 31, provides a 1.25-V reference voltage with low drift and only 3.9 μA of quiescent current.
VCC
REF3312
VCC
GND
+
TLV3691
OUT
_
GND
VIN
Figure 31. Reference Voltage for the TLV3691
8.2 Typical Application
8.2.1 Window Comparator
Window comparators are commonly used to detect undervoltage and overvoltage conditions. Figure 32 illustrates
a simple window comparator circuit.
16
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
Typical Application (continued)
VIN
VTH+
VTH-
V+
VTH+
+
TLV3691
_
V-
AND
VOUT
VOUT
VIN
V+
+
TLV3691
_
VTH-
V-
Figure 32. Window Comparator
8.2.1.1 Design Requirements
•
•
•
•
•
Alert when an input signal is less than 1.25 V
Alert when an input signal is greater than 3.3 V
Alert signal is active low
Operate from 5-V power supply
Consume less than 1 µA over the temperature range from –40°C to 125°C
8.2.1.2 Detailed Design Procedure
Configure the circuit as shown in Figure 32. Connect V+ to a 5-V power supply. Connect V- to ground. Connect
VTH- to a 1.25-V voltage source; this can be a low power voltage reference such as REF3312. Connect VTH+ to a
3.3-V voltage source; this can be a low power voltage reference such as REF3333. Apply an input voltage at VIN.
VOUT will be low when VIN is less than 1.25 V or greater than 3.3 V. VOUT will be high when VIN is in the range of
1.25 V to 3.3 V.
8.2.1.3 Application Curve
5
VOUT
VIN
VTH+
VTH-
4
3
2
1
0
0
1
2
3
4
5
VIN (V)
Figure 33. Window Comparator Results
8.2.2 Overvoltage and Undervoltage Detection
The TLV3691 can be easily configured as and overvoltage and undervoltage detection circuit. Figure 34
illustrates an overvoltage and undervoltage detection circuit. This circuit can be configured to detect the validity
of a bus voltage source. The outputs of the TLV3691 will transition low when the bus voltage is out of range.
•
A bus voltage overvoltage condition is indicated when VOV is low. VOV will transition low according to
Equation 7.
Copyright © 2013–2015, Texas Instruments Incorporated
17
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
Typical Application (continued)
≈
∆
«
’
÷
◊
RA
VBUS
x
> V
TH
RA +RB +RC
(7)
•
A bus voltage undervoltage condition is indicated when VUV is low. VUV will transition low according to
Equation 8.
≈
∆
«
’
÷
◊
RA +RB
RA +RB +RC
VBUS
x
< V
TH
(8)
•
VOV and VUV will both be high when the bus voltage is within the desired range determined by Equation 7 and
Equation 8.
RC
TLV3691
+
VUV
œ
VTH
+
VBUS
RB
œ
REF33xx
+
VOV
œ
TLV3691
RA
Figure 34. Overvoltage and Undervoltage Detection
9 Power Supply Recommendations
The TLV3691 is specified for operation from 0.9 V to 6.5 V. Many specifications apply from –40°C to 125°C.
Parameters capable of exhibiting significant variance regarding the operating voltage or temperature are
presented in the Typical Characteristics.
18
Copyright © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
10 Layout
10.1 Layout Guidelines
Comparators are very sensitive to input noise. For best results, adhere to the following layout guidelines.
1. Use a printed-circuit-board (PCB) with a good, unbroken, low-inductance ground plane. Proper grounding
(use of a ground plane) helps maintain specified device performance.
2. To minimize supply noise, place a decoupling capacitor (0.1-μF ceramic, surface-mount capacitor) as close
as possible to VCC
.
3. On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback
around the comparator. Keep inputs away from the output.
4. Solder the device directly to the PCB rather than using a socket.
5. For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some
degradation to propagation delay when impedance is low. The topside ground plane runs between the output
and inputs.
6. The ground pin ground trace runs under the device up to the bypass capacitor, shielding the inputs from the
outputs.
10.2 Layout Example
V+
Run the input traces
as far away from
the supply lines
as possible
GND
IN+
VCC
OUT
VIN+
To reduce oscillations in the
transition region from very
slow moving input signals, use
a low-ESR, ceramic capacitor
< 1000 pF
GND
Use low-ESR, ceramic
bypass capacitor. Place
close to device to reduce
parasitic errors
GND
INœ
VIN-
VOUT
Ground (GND) plane on another layer
Figure 35. TLV3691 Layout Example
版权 © 2013–2015, Texas Instruments Incorporated
19
TLV3691
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
www.ti.com.cn
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 TINA-TI™（免费软件下载）
TINA™是一款简单、功能强大且易于使用的电路仿真程序，此程序基于 SPICE 引擎。TINA-TI 是 TINA 软件的一
款免费全功能版本，除了一系列无源和有源模型外，此版本软件还预先载入了一个宏模型库。TINA-TI 提供所有传
统的 SPICE 直流、瞬态和频域分析，以及其他设计功能。
TINA-TI 可从 Analog eLab Design Center（模拟电子实验室设计中心）免费下载，它提供全面的后续处理能力，
使得用户能够以多种方式形成结果。虚拟仪器提供选择输入波形和探测电路节点、电压和波形的功能，从而创建一
个动态的快速入门工具。
注
这些文件需要安装 TINA 软件（由 DesignSoft™提供）或者 TINA-TI 软件。请从 TINA-TI 文
件夹 中下载免费的 TINA-TI 软件。
11.1.1.2 TI 高精度设计
OPAx188（或类似运算放大器）采用多种
TI
高精度设计。如需获取相关内容，请访问
http://www.ti.com.cn/ww/analog/precision-designs/。TI 高精度设计是由 TI 公司高精度模拟 应用 专家创建的模拟
解决方案，提供了许多实用电路的工作原理、组件选择、仿真、完整印刷电路板 (PCB) 电路原理图和布局布线、物
料清单以及性能测量结果。
11.2 文档支持
11.2.1 相关文档ꢀ
相关文档如下：
•
•
•
《电路板布局布线技巧》，SLOA089。
《适用于所有人的运算放大器》，SLOD006。
《无铅组件涂层的保存期评估》，SZZA046。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
TINA-TI is a trademark of Texas Instruments, Inc and DesignSoft, Inc.
TINA, DesignSoft are trademarks of DesignSoft, Inc.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
20
版权 © 2013–2015, Texas Instruments Incorporated
TLV3691
www.ti.com.cn
ZHCSBY0A –DECEMBER 2013–REVISED NOVEMBER 2015
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2013–2015, Texas Instruments Incorporated
21
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLV3691IDCKR
TLV3691IDCKT
TLV3691IDPFR
TLV3691IDPFT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SC70
SC70
DCK
DCK
DPF
DPF
5
5
6
6
3000 RoHS & Green
250 RoHS & Green
5000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
SIV
SIV
EW
EW
NIPDAU
NIPDAU
NIPDAU
X2SON
X2SON
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV3691IDCKR
TLV3691IDCKT
TLV3691IDPFR
TLV3691IDPFT
SC70
SC70
DCK
DCK
DPF
DPF
5
5
6
6
3000
250
178.0
178.0
180.0
180.0
9.0
8.4
9.5
9.5
2.4
2.4
2.5
2.5
1.2
1.2
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q2
Q2
X2SON
X2SON
5000
250
1.16
1.16
1.16
1.16
0.63
0.63
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV3691IDCKR
TLV3691IDCKT
TLV3691IDPFR
TLV3691IDPFT
SC70
SC70
DCK
DCK
DPF
DPF
5
5
6
6
3000
250
190.0
190.0
184.0
184.0
190.0
190.0
184.0
184.0
30.0
30.0
19.0
19.0
X2SON
X2SON
5000
250
Pack Materials-Page 2
PACKAGE OUTLINE
DPF0006A
X2SON - 0.4 mm max height
S
C
A
L
E
1
0
.
0
0
0
PLASTIC SMALL OUTLINE - NO LEAD
1.05
0.95
B
A
1.05
0.95
PIN 1 INDEX AREA
0.4 MAX
C
SEATING PLANE
0.05 C
(0.12) TYP
SYMM
0.05
0.00
3
4
SYMM
2X
0.7
4X
0.35
6
1
0.22
0.12
6X
(0.075)
PIN 1 ID
0.2
0.1
0.1
C A B
C
6X
0.05
4220595/A 03/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-287, variation X2AAF.
www.ti.com
EXAMPLE BOARD LAYOUT
DPF0006A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.35)
6X (0.17)
(R0.05) TYP
6
1
SYMM
4X (0.35)
4
3
SYMM
(1.05)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:40X
0.07 MIN
ALL AROUND
EXPOSED METAL
0.07 MAX
ALL AROUND
EXPOSED METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220595/A 03/2020
NOTES: (continued)
4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DPF0006A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.35)
6X (0.17)
(R0.05) TYP
6
1
SYMM
4X (0.35)
4
3
SYMM
(1.05)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4220595/A 03/2020
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
DCK0005A
SOT - 1.1 max height
S
C
A
L
E
5
.
6
0
0
SMALL OUTLINE TRANSISTOR
C
2.4
1.8
0.1 C
1.4
1.1
B
1.1 MAX
A
PIN 1
INDEX AREA
1
2
5
NOTE 4
(0.15)
(0.1)
2X 0.65
1.3
2.15
1.85
1.3
4
3
0.33
5X
0.23
0.1
0.0
(0.9)
TYP
0.1
C A B
0.15
0.22
0.08
GAGE PLANE
TYP
0.46
0.26
8
0
TYP
TYP
SEATING PLANE
4214834/C 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-203.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DCK0005A
SOT - 1.1 max height
SMALL OUTLINE TRANSISTOR
PKG
5X (0.95)
1
5
5X (0.4)
SYMM
(1.3)
2
3
2X (0.65)
4
(R0.05) TYP
(2.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:18X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214834/C 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DCK0005A
SOT - 1.1 max height
SMALL OUTLINE TRANSISTOR
PKG
5X (0.95)
1
5
5X (0.4)
SYMM
(1.3)
2
3
2X(0.65)
4
(R0.05) TYP
(2.2)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:18X
4214834/C 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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重要声明和免责声明
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