TLV320AIC12CDBTR [TI]

LOW-POWER, HIGHLY-INTEGRATED, PROGRAMMABLE 16-Bit, 26-KSPS MONO CODEC; 低功耗,高集成,可编程的16位, 26 - KSPS单声道编解码器
TLV320AIC12CDBTR
型号: TLV320AIC12CDBTR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-POWER, HIGHLY-INTEGRATED, PROGRAMMABLE 16-Bit, 26-KSPS MONO CODEC
低功耗,高集成,可编程的16位, 26 - KSPS单声道编解码器

解码器 编解码器 电信集成电路 电信电路 光电二极管
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
LOW-POWER, HIGHLY-INTEGRATED, PROGRAMMABLE  
16-Bit, 26-KSPS MONO CODEC  
FEATURES  
Analog and Digital Sidetone  
Mono 16-Bit Oversampling Sigma-Delta A/D  
Converter  
Antialiasing Filter (AAF)  
Programmable Input and Output Gain  
Control (PGA)  
Mono 16-Bit Oversampling Sigma-Delta D/A  
Converter  
Microphone/Handset/Headset Amplifiers  
Support Maximum Master Clock of 100 MHz to  
Allow the DSP Output Clock to be Used as a  
Master Clock  
AIC12K has an 8-Speaker Driver  
Power Management With  
Hardware/Software Power-Down Modes  
30 µW  
Selectable FIR/IIR Filter With Bypassing  
Option  
Separate Software Control for ADC and DAC  
Power Down  
Programmable Sampling Rate up to:  
Max 26 Ksps With On-Chip IIR/FIR Filter  
Max 104 Ksps With IIR/FIR Bypassed  
Fully Compatible With Common TMS320™  
DSP Family and Microcontroller Power  
Supplies  
On-Chip FIR Produced 84-dB SNR for ADC  
and 92-dB SNR for DAC  
1.65 V - 1.95 V Digital Core Power  
1.1 V - 3.6 V Digital I/O  
Smart Time Division Multiplexed  
(SMARTDM™) Serial Port  
2.7 V - 3.6 V Analog  
Glueless 4-Wire Interface to DSP  
Power Dissipation (PD)  
Automatic Cascade Detection (ACD)  
Self-Generates Master/Slave Device  
Addresses  
11.2 mW at 3.3 V in Standard Operation  
17.8 mW at 3.3 V With Headphone Drivers  
Internal Reference Voltage (Vref  
)
Programming Mode to Allow On-the-Fly  
Reconfiguration  
2s Complement Data Format  
Test Modes Which Include Digital Loopback  
and Analog Loopback  
Continuous Data Transfer Mode to  
Minimize Bit Clock Speed  
Support Different Sampling Rate for Each  
Device  
APPLICATIONS  
Digital Still Cameras  
Wireless Accessories  
Hands-Free Car Kits  
VOIP  
Turbo Mode to Maximize Bit Clock for  
Faster Data Transfer and Allow Multiple  
Serial Devices to Share the Same Bus  
Allows up to 16 Devices to be Connected  
to a Single Serial Port  
Cable Modem  
Host Port  
2-Wire Interface  
Selectable I2C or S2C  
Differential and Single-Ended Analog  
Input/Output  
Built-In Analog Functions:  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SMARTDM, TMS320C5000, TMS320C6000 are trademarks of Texas Instruments.  
TMS320 is a trademark of Texas Instrument.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2001–2007, Texas Instruments Incorporated  
TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
DESCRIPTION  
The TLV320AIC1x is a true low-cost, low-power, high-integrated, high-performance, mono voice codec. It  
features one 16-bit analog-to-digital (A/D) channel and one 16-bit digital-to-analog (D/A) channel.  
The TLV320AIC1x provides high-resolution signal conversion from digital-to-analog (D/A) and from  
analog-to-digital (A/D) using oversampling sigma-delta technology with programmable sampling rate.  
The TLV320AIC1x implements the smart time division multiplexed serial port (SMARTDM™). The SMARTDM  
port is a synchronous 4-wire serial port in TDM format for glue-free interface to TI DSPs (i.e. TMS320C5000™,  
TMS320C6000™) and microcontrollers. The SMARTDM supports both continuous data transfer mode and  
on-the-fly reconfiguration programming mode. The TLV320AIC1x can be gluelessly cascaded to any  
SMARTDM-based device to form multichannel codec and up to 16 TLV320AIC1x codecs can be cascaded to a  
single serial port.  
The TLV320AIC1x also provides a flexible host port. The host port interface is a two-wire serial interface that  
can be programmed to be either an industrial standard I2C or a simple S2C (start-stop communication protocol).  
The TLV320AIC1x also integrates all of the critical functions needed for most voice-band applications including  
MIC preamplifier, handset amplifier, headset amplifier, antialiasing filter (AAF), input/output programmable gain  
amplifier (PGA), and selectable low-pass IIR/FIR filters. The AIC12K also includes an 8-speaker driver.  
The TLV320AIC1x implements an extensive power management; including device power-down, independent  
software control for turning off ADC, DAC, operational-amplifiers, and IIR/FIR filter (bypass) to maximize system  
power conservation. The TLV320AIC1x consumes only 11.2 mW at 3.3 V.  
The TLV320AIC1x low power operation from 2.7 V to 3.6 V power supplies, along with extensive power  
management, make it ideal for portable applications including wireless accessories, hands free car kits, VOIP,  
cable modem, and speech processing. Its low group delay characteristic makes it suitable for single or  
multichannel active control applications.  
The TLV320AIC1x is characterized for commercial operation from 0°C to 70°C and industrial operation from  
-40°C to 85°C. The TLV320AIC1xk is characterized for industrial operation from -40°C to 85°C.  
ORDERING INFORMATION  
OPERATING  
TEMPERATURE  
RANGE, TA  
PACKAGE  
DESIGNATOR  
ORDERING  
NUMBER  
TRANSPORT MEDIA,  
QUANTITY  
(1)  
PRODUCT  
PACKAGE  
TLV320AIC1xCDBT  
TLV320AIC1xCDBTR  
TLV320AIC1xIDBT  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
TLV320AIC1xC  
TLV320AIC1xI  
TLV320AIC12K  
TLV320AIC14K  
TSSOP-30  
TSSOP-30  
QFN-32  
DBT  
DBT  
RHB  
RHB  
0°C to 70°C  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
TLV320AIC1xIDBTR  
TLV320AIC12KIRHBT  
TLV320AIC12KIRHBR  
TLV320AIC14KIRHBT  
TLV320AIC14KIRHBR  
QFN-32  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
2
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
AIC12/13/12K DBT PACKAGE  
(TOP VIEW)  
AIC14/15/14K DBT PACKAGE  
(TOP VIEW)  
1
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
1
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
IOVSS  
IOVDD  
FSD  
FS  
DOUT  
DIN  
DVSS  
DVDD  
SCLK  
SDA  
IOVSS  
IOVDD  
FSD  
FS  
DOUT  
DIN  
DVSS  
DVDD  
SCLK  
SDA  
2
2
3
3
4
4
5
5
SCL  
SCL  
6
6
MCLK  
RESET  
INP1  
INM1  
BIAS  
INM2  
INP2  
MICIN  
AVDD  
AVSS  
MCLK  
RESET  
INP1  
INM1  
BIAS  
INM2  
INP2  
MICIN  
AVDD  
AVSS  
7
7
M/S  
M/S  
8
8
PWRDN  
OUTM1  
OUTP1  
DRVDD  
DRVSS  
OUTP2  
OUTMV  
OUTP3  
PWRDN  
OUTM1  
OUTP1  
DRVDD  
DRVSS  
NC  
9
9
10  
11  
12  
13  
14  
15  
10  
11  
12  
13  
14  
15  
NC  
NC  
AIC12K RHB PACKAGE  
(TOP VIEW)  
AIC14K RHB PACKAGE  
(TOP VIEW)  
24 23 22 21 20 19 18 17  
24 23 22 21 20 19 18 17  
N/C  
INM2  
N/C  
25  
16  
15  
14  
N/C  
INM2  
N/C  
25  
16  
15  
14  
DRVDD  
26  
27  
28  
29  
30  
31  
31  
DRVDD  
26  
27  
28  
29  
30  
31  
31  
BIAS  
INM1  
OUTP1  
OUTM1  
BIAS  
INM1  
OUTP1  
OUTM1  
13  
12  
13  
12  
INP1  
RESET  
MCLK  
SCL  
PWRDN  
M/S  
INP1  
RESET  
MCLK  
SCL  
PWRDN  
M/S  
11  
10  
9
11  
10  
9
DIN  
DIN  
DOUT  
DOUT  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
NOTE: For the RHB package, connect the device thermal pad to DRVDD.  
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Terminal Functions  
TERMINAL  
NAME  
AIC12/13/12K AIC14/15/14K  
AIC12K  
RHB  
NO.  
AIC14K  
RHB  
NO.  
I/O DESCRIPTION  
DBT  
NO.  
DBT  
NO.  
IOVSS  
IOVDD  
1
2
1
2
5
6
5
6
I
I
Digital I/O ground  
Digital I/O power supply  
Frame sync delayed output. The FSD output synchronizes a slave  
device to the frame sync of the master device. FSD is applied to the  
slave FS input and is the same duration as the master FS signal. This  
pin must be pulled low if AIC1x is a stand-alone slave. It must be  
pulled high if the AIC1x is a stand-alone master or the last slave in the  
cascade.  
FSD  
3
3
7
7
O
Frame sync. When FS goes low, DIN begins receiving data bits and  
FS  
4
5
4
5
8
9
8
9
I/O DOUT begins transmitting data bits. In master mode, FS is internally  
generated. In slave mode, FS is externally generated.  
Data output. DOUT transmits the ADC output bits and registers data,  
DOUT  
O
and is synchronized to SCLK and FS. Data is sent out at the rising  
edge of SCLK. Outside data/control frame, DOUT is put in 3-state.  
Data input. DIN receives the DAC input data and register data from the  
external DSP (digital signal processor) and is synchronized to SCLK  
and FS. Data is latched at the falling edge of SCLK.  
DIN  
M/S  
6
7
6
7
10  
11  
10  
11  
I
I
Master/slave select input. When M/S is high, the device is the master,  
and when low it is a slave.  
Power down. When PWRDN is pulled low, the device goes into a  
power-down mode, the serial interface is disabled, and most of the  
high-speed clocks are disabled. However, all the register values are  
sustained and the device resumes full-power operation without  
reinitialization when PWRDN is pulled high again. PWRDN resets the  
counters only and preserves the programmed register contents.  
PWRDN  
8
8
12  
12  
I
Inverting output of the DAC. OUTM1 is functionally identical with and  
complementary to OUTP1. This differential output can drive a  
maximum load of 600 . This output can also be used alone for  
single-ended operation.  
OUTM1  
OUTP1  
9
9
13  
14  
13  
14  
O
O
Noninverting output of the DAC. This differential output can drive a  
maximum load of 600 . This output can also be used alone for  
single-ended operation.  
10  
10  
DRVDD  
DRVSS  
11  
12  
11  
12  
15  
17  
15  
17  
I
I
Analog power supply for the 16-drivers OUTP2 and OUTP3  
Analog ground for the 16-drivers OUTP2 and OUTP3  
Analog output number 2 from the 16-driver. This output can drive a  
maximum load of 16 , and also can be configured as either  
single-ended output or differential output by the control register 6.  
OUTP2  
OUTMV  
OUTP3  
13  
14  
15  
18  
19  
20  
O
O
O
Programmable virtual ground for the output of OUTP2 and OUTP3  
(see the Register Map).  
Analog output number 3 from the 16-driver. This output can drive a  
maximum load of 16 , and also be configured as either single-ended  
output or differential output by the control register 6.  
AVSS  
AVDD  
MICIN  
INP2  
16  
17  
18  
19  
20  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
21  
22  
23  
24  
25  
I
I
I
I
I
Analog ground  
Analog power supply  
MIC preamplifier input. It must be connected to AVSS if not used.  
Noninverting analog input 2. It must be connected to AVSS if not used.  
Inverting analog input 2. It must be connected to AVSS if not used.  
INM2  
Bias output voltage is software selectable between 1.35 V and 2.35 V.  
Its output current is 5 mA.  
BIAS  
21  
21  
27  
27  
O
INM1  
INP1  
22  
23  
22  
23  
28  
29  
28  
29  
I
I
Inverting analog input 1. It must be connected to AVSS if not used.  
Noninverting analog input 1. It must be connected to AVSS if not used.  
Hardware reset. The reset function is provided to initialize all of the  
internal registers to their default values. The serial port is configured to  
the default state accordingly.  
RESET  
MCLK  
24  
25  
24  
25  
30  
31  
30  
31  
I
I
Master clock. MCLK derives the internal clocks of the sigma-delta  
analog interface circuit.  
Programmable host port (I2C or S2C) clock input.  
Programmable host port (I2C or S2C) data line.  
SCL  
SDA  
26  
27  
26  
27  
32  
1
32  
1
I
I/O  
4
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Terminal Functions (continued)  
TERMINAL  
AIC12/13/12K AIC14/15/14K  
NAME  
AIC12K  
RHB  
NO.  
AIC14K  
RHB  
NO.  
I/O DESCRIPTION  
DBT  
NO.  
DBT  
NO.  
Shift clock. SCLK signal clocks serial data into DIN and out of DOUT  
during the frame-sync interval. When configured as an output (M/S  
high), SCLK is generated internally by multiplying the frame-sync signal  
I/O frequency by 16 and the number of codecs in cascade in standard and  
continuous mode. When configured as an input (M/S low), SCLK is  
generated externally and must be synchronous with the master clock  
and frame sync.  
SCLK  
28  
28  
2
2
DVDD  
DVSS  
29  
30  
29  
30  
3
4
3
4
I
I
Digital power supply  
Digital ground  
16, 18, 19, 20,  
26  
NC  
13, 14, 15  
16, 26  
No connection  
Electrical Characteristics  
AIC12, AIC13, AIC14, AIC15, AIC12K, AIC14K: Over Recommended Operating Free-Air Temperature Range  
AVDD = 3.3 V, DVDD = 1.8 V, IOVDD = 3.3 V (Unless Otherwise Noted)  
Absolute Maximum Ratings  
Over Operating Free-Air Temperature Range (Unless Otherwise Noted)(1)  
UNITS  
VCC  
Supply voltage range:  
DVDD(2)  
-0.3 V to 2.25 V  
-0.3 V to 4 V  
(2)  
AVDD, DRVDD, IOVDD  
VO  
VI  
Output voltage range, all digital output signals  
Input voltage range, all digital input signals  
Operating free-air temperature range  
Junction temperature  
-0.3 V to IOVDD + 0.3 V  
-0.3 V to IOVDD + 0.3 V  
-40°C to 85°C  
105°C  
TA  
TJ  
Tstg  
Storage temperature range  
-65°C to 150°C  
(TJmax - TA ) / θJA  
44°C/W  
Power dissipation  
θJA  
Thermal impedance  
Case temperature for 10 seconds: Package  
260°C  
AIC12, AIC13, AIC14, AIC15, AIC12k and AIC14k all  
pins  
CDM  
HBM  
500 V  
2 kV  
AIC12, AIC13, AIC14, AIC15, AIC12k and AIC14k all  
pins except for the following:  
ESD Characteristics  
DVDD, SDA  
DOUT  
HBM  
HBM  
1.3 kV  
1.9 kV  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to VSS  
.
5
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Recommended Operating Conditions  
MIN  
NOM  
MAX  
MIN  
NOM  
AIC12K/14K  
3.3  
MAX  
UNIT  
AIC12/13/14/15  
Supply voltage for analog, AVDD  
2.7  
3.3  
3.6  
3.6  
1.95  
3.6  
2
2.7  
2.7  
3.6  
3.6  
1.95  
3.6  
2
V
Supply voltage for analog output driver, DRVDD  
2.7  
1.65  
1.1  
VSS  
Supply voltage for digital core, DVDD  
1.8  
3.3  
1.65  
1.1  
1.8  
3.3  
V
V
V
Supply voltage for digital I/O, IOVDD  
VI(analog)  
Analog single-ended peak-to-peak input voltage  
Between OUTP1 and  
OUTM1 (differential)  
600  
16  
16  
32  
32  
600  
16  
16  
32  
32  
Between OUTP2 and  
OUTMV (single-ended)  
Between OUTP3 and  
Output load resistance,  
RL  
OUTMV (single-ended)  
Between OUTP2 and  
OUTMV (differential)  
Between OUTP3 and  
OUTMV (differential)  
CL  
Analog output load capacitance  
Digital output capacitance  
Master clock  
20  
20  
20  
20  
pF  
pF  
100  
26  
100  
26  
MHz  
kHz  
°C  
ADC or DAC conversion rate  
Operating free-air temperature  
TA  
-40  
85  
-40  
85  
6
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Digital Inputs and Outputs  
Fs = 8 kHz, Outputs Not Loaded  
PARAMETER(1)  
High-level output voltage, DOUT  
MIN  
TYP  
MAX  
UNIT  
V
VOH  
VOL  
IIH  
0.8 IOVDD  
Low-level output voltage, DOUT  
High-level input current, any digital input  
Low-level input current, any digital input  
Input capacitance  
0.1 IOVDD  
V
0.5  
0.5  
3
µA  
µA  
pF  
pF  
IIL  
CI  
Co  
Output capacitance  
5
(1) For VIH (Input high level), when IOVDD < 1.6 V, minimum VIH is 1.1V.  
ADC Path Filter  
(1)(2)  
Fs = 8 KHz  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
MIN  
TYP  
IIR FILTER  
MAX  
UNIT  
FIR FILTER  
0 Hz to 30 Hz  
300 Hz to 3 Hz  
3.3 Hz  
-0.5  
0.2  
0.25  
0.3  
-3  
-0.5  
-0.5  
-1.5  
0.2  
-0.5  
-0.5  
0.25  
0.3  
-3  
Filter gain relative to gain  
at 1020 Hz  
dB  
3.6 KHz  
4 kHz  
-35  
-74  
-20  
-60  
4.4 KHz  
(1) The filter gain outside of the passband is measured with respect to the gain at 1020 Hz. The analog input test signal is a sine wave with  
0 dB = 4 VI(PP) as the reference level for the analog input signal. The pass band is 0 to 3600 Hz for an 8-KHz sample rate. This pass  
band scales linearly with the sample rate.  
(2) The filter characteristics are specified by design and are not tested in production.  
7
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TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
ADC DYNAMIC PERFORMANCE  
(1)  
Fs = 8 KHz  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12K/14K  
VI = -1 dB  
VI = -9 dB  
VI = -40 dB  
VI = -1 dB  
VI = -9 dB  
VI = -40 dB  
VI = -1 dB  
VI = -9 dB  
VI = -40 dB  
82  
88  
82  
46  
90  
88  
67  
87  
79  
48  
75  
88  
82  
SNR  
THD  
Signal-to-noise ratio  
78  
84  
82  
75  
90  
88  
Total harmonic distortion  
dB  
79  
73  
87  
79  
Signal-to-harmonic  
distortion + noise  
THD+N  
(1) The test condition is a differential 1020-Hz input signal with an 8-KHz conversion rate. Input and output common mode is 1.35 V.  
ADC CHANNEL CHARACTERISTICS  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12K/14K  
Preamplifier gain = 6  
dB  
VI(pp)  
Single-ended input level  
2
2
V
VIO  
IB  
Input offset voltage  
Input bias current  
Common-mode voltage  
Dynamic range  
MICIN, INPx, INMx  
MICIN, INPx, INMx  
±10  
±10  
mV  
µA  
V
34  
34  
1.35  
85  
1.35  
85  
VI = -1 dB  
dB  
dB  
dB  
dB  
mV  
Mute attenuation  
PGA = MUTE  
80  
80  
Intrachannel isolation  
Gain error  
87  
87  
EG  
VI = -1 dB at 1020 Hz  
0.6  
±10  
0.6  
±10  
EO(ADC)  
ADC converter offset error  
Common-mode rejection  
ratio at INMx and INPx  
CMRR  
VI = -1 dB at 1020 Hz  
50  
50  
dB  
Idle channel noise  
Input resistance  
Input capacitance  
V(INP,INM,MICIN) = 0 V  
50  
30  
100  
50  
30  
µVrms  
kΩ  
pF  
RI  
CI  
TA = 25°C  
TA = 25°C  
IIR  
2
2
5/fs  
17/fs  
5/fs  
17/fs  
S
Channel delay  
FIR  
S
8
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
DAC Path Filter  
(1)(2)  
Fs = 8 KHz  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX UNIT  
FIR FILTER  
IIR FILTER  
0 Hz to 30 Hz  
300 Hz to 3 Hz  
3.3 Hz  
-0.5  
0.2  
0.25  
0.3  
-3  
-0.5  
0.2  
0.35  
0.3  
-3  
-0.25  
-0.35  
-0.25  
-0.75  
Filter gain relative to gain  
at 1020 Hz  
dB  
3.6 KHz  
4 kHz  
-40  
-74  
-20  
-60  
4.4 KHz  
(1) The filter gain outside of the passband is measured with respect to the gain at 1020 Hz. The input signal is the digital equivalent of a  
sine wave (digital full scale = 0 dB). The nominal differential DAC channel output with this input condition = 4 VI(PP). The pass band is 0  
to 3600 Hz for an 8-KHz sample rate. This pass band scales linearly with the sample rate.  
(2) The filter characteristics are specified by design and are not tested in production.  
DAC DYNAMIC PERFORMANCE  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12k/14k  
DAC Line Output (OUTP1, OUTM1)(1)  
VI = 0 dB  
VI = -9 dB  
VI = -40 dB  
VI = 0 dB  
VI = -9 dB  
VI = -40 dB  
VI = 0 dB  
VI = -9 dB  
80  
92  
83  
51  
85  
83  
62  
82  
77  
44  
75  
70  
92  
83  
SNR  
THD  
Signal-to-noise ratio  
75  
78  
74  
85  
83  
Total harmonic  
distortion  
dB  
75  
70  
82  
77  
Signal-to-total harmonic  
distortion + noise  
THD+N  
VI = -40 dB  
(1) (2)  
DAC Headphone Output (OUTP2, OUTP3)  
VI = 0 dB  
VI = -9 dB  
VI = 0 dB  
VI = -9 dB  
VI = 0 dB  
VI = -9 dB  
78  
71  
78  
73  
75  
69  
89  
81  
82  
80  
80  
78  
89  
81  
82  
80  
80  
78  
SNR  
THD  
Signal-to-noise ratio  
dB  
dB  
dB  
Total harmonic  
distortion  
Signal-to-total harmonic  
distortion + noise  
THD+N  
(1) (3)  
DAC Speaker Output (OUTP2, OUTMV)  
SNR  
THD  
Signal-to-noise ratio  
VI = 0 dB  
VI = 0 dB  
91  
80  
dB  
dB  
Total harmonic  
distortion  
(1) The test condition is the digital equivalent of a 1020 Hz input signal with an 8-kHz conversion rate. The test is measured at output of  
application schematic low-pass filter. The test is conducted in 16-bit mode.  
(2) The DAC headphone output spec between OUTP2, OUTP3, and OUTMV is valid only for the AIC12/13 and the AIC12K  
(3) The DAC speaker output spec between OUTP2, OUTP3, and OUTMV is valid only for the AIC12K.  
9
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
DAC Channel Characteristics  
PARAMETER  
Dynamic range  
TEST CONDITIONS  
VI = 0 dB at 1020 Hz  
MIN  
TYP  
92  
MAX  
UNIT  
dB  
Interchannel isolation  
120  
0.5  
1.35  
80  
dB  
EG  
Gain error, 0 dB  
VO = 0 dB at 1020 Hz  
dB  
Common mode voltage  
V
(1)  
Idle channel narrow band noise  
Output offset voltage at OUT (differential)  
Analog output voltage, (3.3 V)  
0 kHz-4 kHz  
125(2)  
2.35  
µVrms  
mV  
V
VOO  
VO  
DIN = All zeros  
OUTP  
10  
0.35  
600 load at 3.3 V between  
OUTP1 and OUTM1  
6.7  
16 load at 3.3 V between  
single-ended OUTP2/OUTMV and  
OUTP3/OUTMV(3)  
62.5  
P(O)  
Maximum output power  
mW  
16 load at 3.3 V between  
differential OUTP2/OUTP3 and  
OUTMV(4)  
125  
190  
8 load at 3.3 V between  
differential OUTP2/OUTP3 and  
OUTMV(4)  
IIR  
5/fs  
Channel delay  
s
FIR  
18/fs  
(1) The conversion rate is 8 kHz.  
(2) The Max value is valid only for the AIC12/13/14/15.  
(3) The specification for maximum power output for single ended load between OUTP2/OUTMV and OUTP3/OUTMV is valid only for the  
AIC12/13 and AIC12K.  
(4) The specification for maximum power output for differential load between OUTP2/OUTP3 and OUTMV is valid only for the AIC12/13 and  
AIC12K.  
BIAS Amplifier Characteristics  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12K/14K  
VO Output voltage  
Integrated noise  
Offset voltage  
2.2  
2.35  
20  
2.4  
2.35  
20  
V
µV  
300 Hz-13 kHz  
10  
10  
mV  
mA  
MHz  
dB  
Current drive  
10  
10  
Unity gain bandwidth  
DC gain  
1
1
140  
120  
OUTMV Amplifier Characteristics  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12K/14K  
VO Output voltage  
Integrated noise  
Offset voltage  
1.3  
1.35  
20  
1.4  
1.35  
20  
V
µV  
300 Hz-13 kHz  
10  
10  
mV  
mA  
MHz  
dB  
Current drive  
62.5  
1
62.5  
1
Unity gain bandwidth  
DC gain  
120  
120  
10  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Power-Supply Rejection(1)  
PARAMETER  
TEST CONDITIONS  
Differential  
MIN  
TYP  
75  
MAX UNIT  
AVDD  
DVDD  
Supply-voltage rejection ratio, analog supply (fj = 0 to fs/2) at 1 kHz  
dB  
Single-ended  
50  
DAC channel  
Supply-voltage rejection ratio, DAC channel  
ADC channel  
95  
fj = 0 kHz to 30 kHz  
dB  
86  
(1) Power supply rejection measurements are made with both the ADC and DAC channels idle and a 200 mV peak-to-peak signal applied  
to the appropriate supply.  
Power Supply  
PARAMETER  
Power dissipation(1)  
Total current(1)  
TEST CONDITIONS  
MIN  
TYP  
MAX MIN  
TYP  
MAX  
UNIT  
AIC12/13/14/15  
AIC12K/14K  
All sections on  
Without 16-drivers  
All sections on  
Without 16-drivers  
Power down  
ADC  
17.8  
11.2  
5.4  
3.4  
0.01  
2
23.1  
16.5  
7
17.8  
11.2  
5.4  
3.4  
0.01  
2
PD  
mW  
mA  
mA  
I(total)  
5
DAC  
1
1
analog  
IDD  
Supply current  
Ref  
0.4  
2
0.4  
2
mA  
mA  
16-drivers  
digital(2) Coarse sampling  
1
1
IDD Analog  
1.4  
1
1.4  
1
IDD  
Supply current, PLL  
IDD Digital  
(1) Excludes digital  
(2) All section ON except the PLL condition.  
11  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Functional Block Diagram AIC12/13/12k  
s2d  
MICIN  
Preamplifier  
24, 12, 6, 0 dB  
INP2  
INM2  
Decimation Filter  
SMARTDM  
Serial  
Port  
M/S  
Sigma-  
Delta  
ADC  
FIR Filter  
IIR Filter  
Anti-  
Aliasing  
Filter  
Sinc  
Filter  
PGA  
MUX  
INP1  
INM1  
- 42 dB to 20 dB  
Step Size = 1 dB  
DOUT  
DIN  
Digital Loopback  
w/ Sidetone Control  
and Mute  
-3 dB to -21 dB  
FS  
SCLK  
FSD  
Analog  
Loopback  
Interpolation Filter  
Sigma-  
Delta  
DAC  
FIR Filter  
IIR Filter  
Low Pass  
Filter  
Sinc  
Filter  
OUTP1  
(600 Driver)  
OUTM1  
PGA  
- 42 dB to 20 dB  
Step Size = 1 dB  
OUTP2  
(16 Driver)  
d2s  
d2s  
V
ref  
SCL  
SDA  
OUTP3  
(16 Driver)  
Host Port  
OUTMV  
Div  
16xMxNxP  
Internal Clock Circuit  
MCLK  
BIAS  
1.35 V/2.35 V @ 5 mA max  
12  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Functional Block Diagram AIC14/15/14k  
2
MICIN  
s d  
Preamplifier  
24, 12, 6, 0 dB  
INP2  
INM2  
Decimation Filter  
SMARTDM  
Serial  
M/S  
Sigma-  
Delta  
ADC  
FIR Filter  
IIR Filter  
Anti-  
Sinc  
Filter  
Port  
Aliasing  
PGA  
MUX  
Filter  
INP1  
INM1  
− 42 dB to 20 dB  
Step Size = 1 dB  
DOUT  
DIN  
Digital Loopback  
w/ Sidetone Control  
and Mute  
−3 dB to −21 dB  
FS  
SCLK  
FSD  
Analog  
Loopback  
Interpolation Filter  
Sigma-  
Delta  
DAC  
FIR Filter  
IIR Filter  
Low-Pass  
Filter  
Sinc  
Filter  
OUTP1  
(600 Driver)  
OUTM1  
PGA  
− 42 dB to 20 dB  
Step Size = 1 dB  
V
ref  
SCL  
SDA  
Host Port  
BIAS  
1.35 V/2.35 V @ 5 mA max  
Div  
16xMxNxP  
Internal Clock Circuit  
MCLK  
13  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Definitions and Terminology  
Term  
Definition  
Data Transfer  
Interval  
The time during which data is transferred from DOUT and to DIN. The interval  
is 16 shift clocks and the data transfer is initiated by the falling edge of the FS  
signal in standard and continuous mode.  
Signal Data  
Frame Sync  
This refers to the input signal and all of the converted representations through  
the ADC channel and the signal through the DAC channel to the analog output.  
This is contrasted with the purely digital software control data.  
Frame sync refers only to the falling edge of the signal FS that initiates the data  
transfer interval  
Frame Sync and Sampling  
Period  
Frame sync and sampling period is the time between falling edges of  
successive FS signals.  
fs  
The sampling frequency  
ADC Channel  
ADC channel refers to all signal processing circuits between the analog input  
and the digital conversion result at DOUT.  
DAC channel  
DAC channel refers to all signal processing circuits between the digital data  
word applied to DIN and the differential output analog signal available at OUTP  
and OUTM.  
Dxx  
DSxx  
PGA  
IIR  
Bit position in the primary data word (xx is the bit number)  
Bit position in the secondary data word (xx is the bit number)  
Programmable gain amplifier  
Infinite impulse response  
FIR  
Finite impulse response  
14  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Timing Requirements  
t
wH  
2.4 V  
2.4 V  
MCLK  
t
wL  
t
su1  
t
h1  
2.4 V  
RESET  
Figure 1. Hardware Reset Timing  
SCLK  
t
d1  
t
d2  
t
d1  
t
d2  
FS  
FSD  
t
d3  
t
en  
t
dis  
DOUT  
DIN  
D15  
t
su2  
t
h2  
D15  
Figure 2. Serial Communication Timing  
TEST CONDITIONS  
MIN  
5
TYP  
MAX  
UNIT  
twH  
twL  
Pulse duration, MCLK high  
Pulse duration, MCLK low  
5
Setup time, RESET, before MCLK high  
(see Figure 1)  
tsu1  
3
2
th1  
td1  
td2  
td3  
ten  
tdis  
tsu2  
th2  
Hold time, RESET, after MCLK high (see Figure 1)  
Delay time, SCLKto FS/FSD↓  
Delay time, SCLKto FS/FSD↑  
Delay time, SCLKto DOUT  
CL = 20 pF  
5
5
ns  
15  
15  
15  
Enable time, SCLKto DOUT  
Disable time, SCLKto DOUT  
Setup time, DIN, before SCLK↓  
Hold time, DIN, after SCLK↓  
10  
10  
15  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
SDA  
t
SU;OAT  
t
r
t
BUF  
t
f
t
t
f
t
t
r
LOW  
HD;STA  
SCL  
t
t
t
SU;STO  
HD;STA  
SU;STA  
t
t
HIGH  
HD;DAT  
Figure 3. I2C / S2C Timing  
TEST CONDITIONS  
MIN  
0
MAX  
UNIT  
kHz  
ns  
tSCL  
SCL clock frequency  
900  
tHD;STA  
Hold time (repeated START condition. After this  
period, the first clock pulse is generated.  
100  
tLOW  
tHIGH  
tSU;STA  
tHD;DAT  
tSU;DAT  
tr  
Low period of the SCL clock  
560  
560  
100  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
High period of the SCL clock  
Set-up time for a repeated START condition  
Data hold time  
CL = 20 pF  
Data set-up time  
50  
Rise time of both SDA and SCL signals  
Fall time of both SDA and SCL signals  
Set-up time for STOP condition  
Bus free time between a STOP and START condition  
300  
100  
tf  
tSU;STO  
tBUF  
100  
500  
Parameter Measurement Information  
0
Sampling Rate at 8 kHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
f - Frequency - Hz  
Figure 4. FFT—ADC Channel (-1 dB Input)  
16  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Parameter Measurement Information (continued)  
0
Sampling Rate at 8 kHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
0
0
0
500  
500  
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
4000  
4000  
f - Frequency - Hz  
Figure 5. FFT—ADC Channel (-9 dB Input)  
0
Sampling Rate at 8 kHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
1000  
1500  
2000  
2500  
3000  
3500  
f - Frequency - Hz  
Figure 6. FFT—DAC Channel (0 dB Input)  
0
Sampling Rate at 8 kHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
1000  
1500  
2000  
2500  
3000  
3500  
f - Frequency - Hz  
Figure 7. FFT—DAC Channel (-9 dB Input)  
17  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Parameter Measurement Information (continued)  
0
-20  
ADC at 8 kHz  
Fs = 32 kHz  
-40  
-60  
-80  
-100  
-120  
-140  
0
2000  
4000  
6000  
8000  
10000  
12000  
14000  
16000  
f - Frequency - Hz  
Figure 8. FFT—ADC Channel in FIR/IIR Bypass Mode (-1 dB Input)  
0
DAC at 8 kHz  
Fs = 32 kHz  
-20  
-40  
-60  
-80  
-100  
-120  
-140  
0
2000  
4000  
6000  
8000  
10000  
12000  
14000  
16000  
f - Frequency - Hz  
Figure 9. FFT—DAC Channel in FIR/IIR Bypass Mode (0 dB Input)  
18  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
TYPICAL CHARACTERISTICS  
ADC FILTER GAIN  
vs  
FREQUENCY RESPONSE (FIR)  
ADC FILTER GAIN  
vs  
FREQUENCY RESPONSE (IIR)  
5
0
5
0
−5  
−10  
−15  
−20  
−5  
−10  
−15  
−20  
−25  
−25  
−30  
−35  
−40  
−45  
−30  
0
500 1000 1500 2000 2500 3000 3500 4000  
f − Frequency − Hz  
0
500 1000 1500 2000 2500 3000 3500 4000  
f − Frequency − Hz  
Figure 10.  
Figure 11.  
ADC IIR FILTER GROUP DELAY  
DAC IIR FILTER GROUP DELAY  
vs  
vs  
FREQUENCY  
FREQUENCY RESPONSE  
9
8
9
8
7
6
5
4
7
6
5
4
3
2
3
2
1
1
0
0
0
500 1000 1500 2000 2500 3000 3500 4000  
f - Frequency - Hz  
0
500 1000 1500 2000 2500 3000 3500 4000  
f - Frequency - Hz  
Figure 12.  
Figure 13.  
19  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
TYPICAL CHARACTERISTICS (continued)  
ADC FILTER GAIN  
vs  
FREQUENCY (FIR/IIR BYPASS)  
DAC FILTER GAIN  
vs  
FREQUENCY (FIR/IIR BYPASS)  
4
2
4
2
0
-2  
-4  
-6  
0
-2  
-4  
-6  
-8  
-8  
-10  
-10  
-12  
-14  
-12  
-14  
0
2000 4000 6000 8000 10 k 12 k 14 k 16 k  
f - Frequency - Hz  
0
2000 4000 6000 8000 10 k 12 k 14 k 16 k  
f - Frequency - Hz  
Figure 14.  
Figure 15.  
DAC IIR  
vs  
FREQUENCY RESPONSE  
DAC FIR  
vs  
FREQUENCY RESPONSE  
20  
20  
OSR = 512  
OSR = 128  
0
−20  
0
−20  
−40  
−40  
−60  
−60  
−80  
−80  
−100  
−100  
−120  
−120  
−140  
0
1000 2000 3000 4000 5000 6000 7000 8000  
f − Frequency − Hz  
0
1000 2000 3000 4000 5000 6000 7000 8000  
f − Frequency − Hz  
Figure 16.  
Figure 17.  
20  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
TYPICAL CHARACTERISTICS (continued)  
DAC FIR  
vs  
FREQUENCY RESPONSE  
DAC FIR  
vs  
FREQUENCY RESPONSE  
20  
0
20  
0
OSR = 128  
OSR = 256  
−20  
−40  
−20  
−40  
−60  
−60  
−80  
−80  
−100  
−100  
−120  
−140  
−120  
−140  
0
0
1000 2000 3000 4000 5000 6000 7000 8000  
f − Frequency − Hz  
1000 2000 3000 4000 5000 6000 7000 8000  
f − Frequency − Hz  
Figure 18.  
Figure 19.  
Functional Description  
Operating Frequencies (see Notes)  
The sampling frequency is the frequency of the frame sync (FS) signal whose falling edge starts digital-data  
transfer for both ADC and DAC. The sampling frequency is derived from the master clock (MCLK) input by the  
following equations:  
Coarse sampling frequency (default):  
The coarse sampling is selected by programming P = 8 in the control register 4, which is the default  
configuration of AIC1x on power-up or reset.  
FS = Sampling (conversion) frequency = MCLK ÷ (16 × M × N × 8)  
Fine sampling frequency (see step 5):  
FS = Sampling (conversion) frequency = MCLK ÷ (16 × M × N × P)  
NOTES:  
1. Use control register 4 to set the following values of M, N, and P  
2. M = 1, 2, . . . , 128  
3. N = 1, 2,..., 16  
4. P = 1, 2, ..., 8  
5. The fine sampling rate needs an on-chip Phase Lock Loop (frequency multiplier) to generate  
internal clocks. The PLL requires the relationship between MCLK and P to meet the following  
condition:  
10 MHz (MCLK ÷ P) 25 MHz. The output of the PLL is only used to generate internal clocks  
that are needed by the data converters. Other clocks such as the serial interface clocks in master  
mode are not generated from the PLL output. The clock generation scheme is as shown in  
Figure 20.  
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Functional Description (continued)  
X 8  
(DLL)  
Digital  
128 FS  
MCLK  
1/(MN)  
1/P  
en_dll  
*
SCLK  
FS  
(no_dev x mode) / (MNP)  
1 / (16 x mode x no_dev)  
*
SCLK may not be an uniform clock depending upon values of devnum, mode, and MNP  
When P = 8, DLL(PLL) is enabled  
M = 1 - 128  
N = 1 - 16  
P = 1- 8  
devnum = number of devices in cascade  
mode = 1 (for continious data tranfer mode)  
mode = 2 (for programming mode)  
Figure 20. AIC1x Clock Tree Architecture  
6. Both equation of FS require that the following conditions be met:  
(M × N × P) (devnum × mode) if the FIR/IIR filter is not bypassed.  
[Integer (M ÷ 4) × N × P] (devnum × mode) if the FIR/IIR filter is bypassed.  
Where:  
devnum is the number of codec channels connecting in cascade mode.  
mode is equal to 1 for continuous data transfer mode and 2 for programming mode.  
7. If the DAC OSR is set to 512, then M needs to be a multiple of 4. If the DAC OSR is set to 256,  
then M needs to be a multiple of 2. M can take any value between 1 and 128 if the OSR is set to  
128.  
EXAMPLE:  
The MCLK that comes from the DSP 'C5402 CLKOUT equals to 20.48 MHz, and the conversion rate  
of 8 kHz is desired. First, set P = 1 to satisfy condition step 5 above so that (MCLK ÷ P) = 20.48 MHz  
÷ 1 = 20.48 MHz. Next, pick M = 10 and N = 16 to satisfy step 6 above and derive 8 kHz for FS.  
20.48 MHz  
FS +  
+ 8 kHz  
(16   10   16   1)  
Internal Architecture  
Analog Low-Pass Filter  
The built-in analog low-pass filter is a two-pole filter that has a 20-dB attenuation at 1 MHz.  
Sigma-Delta ADC  
The analog-to-digital converter is a sigma-delta modulator with 128-x oversampling. The ADC provides  
high-resolution, low-noise performance using oversampling techniques. Due to the oversampling employed, only  
single pole R-C filters are required on the analog inputs.  
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Functional Description (continued)  
Decimation Filter  
The decimation filters are either FIR filters or IIR filters selected by bit D5 of the control register 1. The FIR filter  
provides linear-phase output with 17/fs group delay, whereas the IIR filter generates nonlinear phase output with  
negligible group delay. The decimation filters reduce the digital data rate to the sampling rate. This is  
accomplished by decimating with a ratio of 1:128. The output of the decimation filter is a 16-bit 2s-complement  
data word clocking at the sample rate selected. The BW of the filter is (0.45 × FS) and scales linearly with the  
sample rate.  
Sigma-Delta DAC  
The digital-to-analog converter is a sigma-delta modulator with 128/256/512-x oversampling. The DAC provides  
high-resolution, low-noise performance using oversampling techniques. The oversampling ratio in DAC is  
programmable to 256/512 using bits D4-D3 of control register 3, the default being 128. Oversampling ratio of  
512 can be used when FS is a maximum of 8 Ksps and an oversampling ratio of 256 can be used when FS is a  
maximum of a 16 Ksps. M should be a multiple of 2 for an oversampling ratio of 256 and 4 for oversampling  
ratio of 512.  
Interpolation Filter  
The interpolation filters are either FIR filters or IIR filters selected by bit D5 of the control register 1. The FIR filter  
provides linear-phase output with 18/fs group delay, whereas the IIR filter generates nonlinear phase output with  
negligible group delay. The interpolation filter resamples the digital data at a rate of 128/256/512 times the  
incoming sample rate, based on the oversampling rate of DAC. The high-speed data output from the  
interpolation filter is then used in the sigma-delta DAC. The BW of the filter is (0.45 × FS) and scales linearly  
with the sample rate.  
Analog/Digital Loopback  
The analog and digital loopbacks provide a means of testing the data ADC/DAC channels and can be used for  
in-circuit system level tests. The analog loopback always has the priority to route the DAC low pass filter output  
into the analog input where it is then converted by the ADC to a digital word. The digital loopback routes the  
ADC output to the DAC input on the device. Analog loopback is enabled by writing a 1 to bit D2 in the control  
register 1. Digital loopback is enabled by writing a 1 to bit D1 in control register 1.  
Side-Tone Loopback  
The side-tone digital loopback attenuates the ADC output and mixes it with the input of the DAC. The level of the  
side tone is set by DSTG, bits D5-D3 of the control register 5C.  
ADC PGA  
TLV320AIC1x has a built-in PGA for controlling the signal levels at ADC outputs. ADC PGA gain setting can be  
selected by writing into bits D5-D0 of register 5A. The PGA range of the ADC channel is 20 dB to -42 dB in  
steps of 1 dB and mute. To avoid sudden jumps in signal levels with PGA changes, the gains are applied  
internally with zero-crossovers.  
DAC PGA  
TLV320AIC1x has a built-in PGA for controlling the analog output signal levels in DAC channel. DAC PGA gain  
setting can selected by writing into bits D5-D0 of register 5B. The PGA range of the DAC channel is 20 dB to -42  
dB in steps of 1 dB, and mute. To avoid sudden pop-sounds with power-up/down and gain changes the  
power-up/down and gain changes for DAC channel are applied internally with zero-crossovers.  
Analog Input/Output  
The TLV320AIC1x has three programmable analog inputs and three programmable analog outputs. Bits D2-D1  
of control register 6 select the analog input source from MICIN, INP1/M1, or INP2/M2. All analog I/O are either  
single-ended or differential. All analog input signals are self-biased to 1.35 V. The three analog outputs are  
configured by bits D7, D6, D5, and D4-D3 of control register 6.  
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Functional Description (continued)  
MIC Input  
TLV320AIC1x supports single ended microphone input. This can be used by connecting the external single  
ended source through ac coupling to the MICIN pin. This channel is selected by writing 01 or 10 into bits D2-D1  
in control register 6. The single ended input is supported in two modes.  
Writing 01 into bits D2-D1 chooses self biased MICIN mode. In this mode, the device internally self-biases the  
input at 1.35V. For best noise performance, the user should bias the microphone circuit using the BIAS voltage  
generated by the device as shown in Figure 21.  
Writing 10 into bits D2-D1 chooses pseudo-differential MICIN mode. In this mode, the single ended input is  
connected through ac-coupling to MICIN and the bias voltage used to generate the signal is also ac coupled to  
INM1 as shown in Figure 22. For best noise performance, the MICIN and INM1 lines must be routed in similar  
fashion from the microphone to the device for noise cancellation.  
For high quality performance, the single ended signal is converted internally into differential signal before being  
converted. To improve the dynamic range with different types of microphones, the device supports a preamplifier  
with gain settings of 0/6/12/24 dB. This can be chosen by writing into bits D1-D0 of control register 5C.  
0.1 µF  
10 kΩ  
0.1 µF  
Electret  
Microphone  
BIAS  
INM1  
BIAS  
10 kΩ  
0.1 µF  
Electret  
Microphone  
MICIN  
MICIN  
TLV320AIC12  
TLV320AIC12  
(a) Single Ended  
(b) Pseudo -Differential (High Quality)  
Figure 21. Microphone Interface  
INP and INM Input  
To produce common-mode rejection of unwanted signal performance, the analog signal is processed  
differentially until it is converted to digital data. The signal applied to the terminals INM1/2 and INP1/2 are  
differential to preserve device specifications (see Figure 22). The signal source driving analog inputs (INP1/2  
and INM1/2) should have low source impedance for lowest noise performance and accuracy. To obtain  
maximum dynamic range, the signal should be ac-coupled to the input terminal.  
INP1 or INP2  
V
(INP)  
1.35 V  
INM1 or INM2  
V
(INM)  
TLV320AIC12  
Figure 22. INP and INM Internal Self-Biased Circuit  
Single-Ended Analog Input  
The two differential inputs of (INP1/M1 and INP2/M2) can be configured to work as single-ended inputs by  
connecting INP to the analog input and INM to ground (see Figure 23).  
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Functional Description (continued)  
C
INP1 or INP2  
INM1 or INM2  
Analog Input  
C
Figure 23. Single-Ended Input  
Analog Output  
The OUTP and OUTM are differential output from the DAC channel. The OUTP1 and OUTM1 can drive a load  
of 600-directly and be either differential or single-ended (see Figure 24). The OUTP2 and OUTP3 are output  
from two audio amplifiers to drive low-voltage speakers like those in the handset and headset. They can drive a  
load of 16-directly and be configured as either differential output or single-ended output as by bit D7 of the  
control register 6 (see Figure 25). If OUTP2 and OUTP3 are differential output, the OUTMV pin becomes the  
common inverting output. Both OUTP2 and OUTP3 can be used simultaneously if each differential load RL >  
32. This is because OUTMV amplifier can drive a maximum load of 16 only (only one driver used) or a  
parallel combination of two 32-loads (both drivers used). If both OUTP2 and OUTP3 are used simultaneously,  
they are muted at the same time if MUTE is selected.  
Otherwise, the OUTMV pin is configured as the virtual ground for single-ended output and equal to the common  
mode voltage at 1.35 V.  
C
OUTP1  
OUTP1  
RL  
RL  
OUTM1  
OUTM1  
Differential Output OUTP/OUTM  
Single-Ended Output OUTP/OUTM  
Figure 24. OUTP1/OUTM1 Output  
OUTP2  
RL  
OUTMV  
RL  
OUTP3  
Figure 25. Single-Ended/Differential Connection of OUTP2/OUTP3 Output  
Analog Output Configuration  
SPEAKER DRIVER CONFIGURATION  
NO. OF SPEAKER DRIVERS ON  
MIN LOAD  
16-Ω  
Single-ended  
Single-ended  
Differential  
1
2
1
32-Ω  
16-Ω  
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Functional Description (continued)  
Analog Output Configuration (continued)  
SPEAKER DRIVER CONFIGURATION  
Differential  
NO. OF SPEAKER DRIVERS ON  
MIN LOAD  
2
32-Ω  
IIR/FIR Control  
Overflow Flags  
The decimation IIR/FIR filter sets an overflow flag (bit D7) of control register 1 indicating that the input analog  
signal has exceeded the range of internal decimation filter calculations. The interpolation IIR/FIR filter sets an  
overflow flag (bit D4) of control register 1 indicating that the digital input has exceeded the range of internal  
interpolation filter calculations. When the IIR/FIR overflow flag is set in the register, it remains set until the user  
reads the register. Reading this value resets the overflow flag. These flags need to be reset after power-up by  
reading the register. If FIR/IIR overflow occurs, the input signal is attenuated by either the PGA or some other  
method.  
IIR/FIR Bypass Mode  
An option is provided to bypass IIR/FIR filter sections of the decimation filter and the interpolation filter. This  
mode is selected through bit D6 of control register 2 and effectively increases the frequency of the FS signal to  
four times normal output rate of the IIR/FIR-filter. For example, for a normal sampling rate of 8 Ksps (i.e., FS =  
8 kHz) with IIR/FIR, if the IIR/FIR is bypassed, the frequency of FS is readjusted to 4×8 kHz = 32 kHz. The sinc  
filters of the two paths can not be bypassed. A maximum of eight devices in cascade can be supported in the  
IIR/FIR bypassed mode.  
In this mode , the ADC channel outputs data which has been decimated only until 4Fs. Similarly DAC channel  
input needs to be preinterpolated to 4Fs before being given to the device. This mode allows users the flexibility  
to implement their own filter in DSP for decimation and interpolation. M should be a multiple of 4 during IIR/FIR  
Bypass mode. The frequency responses of the IIR/FIR bypass modes are shown in Figure 14 and Figure 15.  
System Reset and Power Management  
Software and Hardware Reset  
The TLV320AIC1x resets internal counters and registers in response to either of two events:  
A low-going reset pulse is applied to terminal RESET  
A 1 is written to the programmable software reset bits (D5 of control register 3)  
NOTE: The TLV320AIC1x requires a power-up reset applied to the RESET pin before normal operation is  
started.  
Either event resets the control registers and clears all sequential circuits in the device. The H/W RESET (active  
low) signal is at least 6 master clock periods long. As soon as the RESET input is applied, the TLV320AIC1x  
enters the initialization cycle that lasts for 132 MCLKs, during which the serial port of the DSP must be tristated.  
The initialization sequence performed by the 'AIC1x is known as auto cascade detection (ACD). ACD is a  
mechanism that allows a device to know its address in a cascade chain. Up to 16 'AIC1x devices can be  
cascaded together. The master device is the first device on the chain (i.e. the FS of the master is connected to  
the FS of the DSP). During ACD, each device gets to know the number of devices in the chain as well as its  
relative position in the chain. This is done on hardware reset. Therefore, after power up, a hardware reset must  
be done. ACD requires 132 MCLKs after reset to complete operation. The number of MCLKs is independent of  
the number of devices in the chain. Adjacent devices in the chain have their FS and FSD pins connected to  
each other. The master device FS is connected to the FS pin of the DSP. The FSD pin on the last device in the  
chain is pulled high. The master device has the highest address (i.e. 0, the next device in the chain has an  
address of 1, followed by 2 etc.).  
During the first 64 MCLKs, FS is configured as an output and FSD as an input. During the next 64 MCLKs, FS is  
configured as an input and FSD as an output. The master device always has FS configured as an output and  
the last slave in the cascade (i.e. channel with address 0) always has FSD configured as an input.  
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To calculate the channel address, during the first 64 MCLKs, the device counts the number of clocks between  
ACD starting (reset) and the FSD going high. During the next 64 MCLKs, the device counts the number of  
clocks till FS is pulled low. The sum total of the counts in the first phase and the second phase is the number of  
devices in the channel.  
For a cascaded system, the rise time of H/W RESET needs to be less than the MCLK period and should satisfy  
setup time requirement of 2 ns with respect to MCLK rise-edge. In stand-alone-slave mode SCLK must be  
running during RESET. If more than one codec is cascaded, RESET must be synchronized to MCLK.  
Additionally, all devices must see the same edge of MCLK within a window of 0.5 ns The reset signal need not  
be synchronized with MCLK when the codec is in stand-alone master or slave configuration.  
Power Management  
Most of the device (all except the digital interface) enters the power-down mode when D7 and D6, in control  
register 3, are set to 1. When the PWRDN pin is low, the entire device is powered down. In either case, register  
contents are preserved.  
The amount of power drawn during software power down is higher than during a hardware power down because  
of the current required to keep the digital interface active. Additional differences between software and hardware  
power-down modes are detailed in the following paragraphs.  
Software Power-Down  
Data bits D7 and D6 of control register 3 are used by TLV320AIC1x to turn on or off the software power-down  
mode, which takes effect in the next frame FS. The ADC and DAC can be powered down individually. In the  
software power-down, the digital interface circuit is still active while the internal ADC and DAC channel and  
differential outputs OUTPx and OUTMx are disabled, and DOUT is put in 3-state in the data frame only. Register  
data in the control frame is still accepted via DIN, but data in the data frame is ignored. The device returns to  
normal operation when D7 and D6 of control register 3 are reset.  
Hardware Power-Down  
The TLV320AIC1x requires the PWRDN signal to be synchronized with MCLK. When PWRDN is held low, the  
device enters hardware power-down mode. In this state, the internal clock control circuit and the differential  
outputs are disabled. All other digital I/Os are disabled and DIN cannot accept any data input. The device can  
only be returned to normal operation by holding PWRDN high. Getting out of the power-down mode (i.e. bringing  
PWRDN from low to high state) requires that the low-to-high transition of PWRDN be synchronous to the rising  
edge of MCLK. If there is no need for the hardware power-down mode feature of the device, the PWRDN pin  
must be tied high.  
Host Port Interface  
The host port uses a 2-wire serial interface (SCL, SDA) to program the AIC1x's six control registers and  
selectable protocol between S2C mode and I2C mode. The S2C is a write-only mode and the I2C is a read-write  
mode selected by setting the bits D1 and D0 of control register 2 to 00 or 01. If the host interface is not needed  
the two pins of SCL and SDA can be programmed to become general-purpose I/Os by setting the bits D1 and  
D0 of control register 2 to 10 or 11. If selected to be used as I/O pins, the SDA and SCL pins become output  
and input pins respectively, determined by D1 and D0.  
Both S2C and I2C require a SMARTDM device address to communicate with the AIC1x. One of SMARTDMs  
advanced features is the automatic cascade detection (ACD) that enables SMARTDM to automatically detect  
the total number of codecs in the serial connection and use this information to assign each codec a distinct  
SMARTDM device address. Table 1 lists device addresses assigned to each codec in the cascade by the  
SMARTDM. The master always has the highest position in the cascade. For example, if there is a total of 8  
codecs in the cascade (i.e., one master and 7 slaves), then the device addresses in row 8 are used in which the  
master is codec 7 with a device address of 0111.  
Table 1. SMARTDM Device Addresses  
TOTAL  
CODEC POSITION IN CASCADE  
CODECS  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
0
1
0000  
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Table 1. SMARTDM Device Addresses (continued)  
TOTAL  
CODEC POSITION IN CASCADE  
CODECS  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
0
2
3
0001 0000  
0010 0001 0000  
0011 0010 0001 0000  
0100 0011 0010 0001 0000  
0101 0100 0011 0010 0001 0000  
0110 0101 0100 0011 0010 0001 0000  
0111 0110 0101 0100 0011 0010 0001 0000  
1000 0111 0110 0101 0100 0011 0010 0001 0000  
1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1011 1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1100 1011 1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1101 1100 1011 1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1110 1101 1100 1011 1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
1111 1110 1101 1100 1011 1010 1001 1000 0111 0110 0101 0100 0011 0010 0001 0000  
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
S2C (Start-Stop Communication)  
The S2C is a write-only interface selected by programming bits D1-D0 of control register 2 to 01. The SDA input  
is normally in a high state, pulled low (START bit) to start the communication, and pulled high (STOP bit) after  
the transmission of the LSB. SCLK and FS must be active during register programming. Figure 26 shows the  
timing diagram of S2C. The S2C also supports a broadcast mode in which the same register of all devices in  
cascade is programmed in a single write. To use S2Cs broadcast mode, execute the following steps:  
1. Write 111 1000 1111 1111 after the start bit to enable the broadcast mode.  
2. Write data to program control register as specified in Figure 26 with bits D14-D11 = XXXX (don't care).  
3. Write 111 1000 0000 0000 after the start bit to disable the broadcast mode.  
SCL  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
SDA  
SMARTDM Device  
Address  
Register  
Address  
Register Content  
Start Bit = 0  
Stop Bit = 1  
(see Table 1)  
Figure 26. S2C Programming  
I2C  
Each I2C read-from or write-to 'AIC1xs control register is given by index register address.  
Read/write sequence always starts with the first byte as I2C address followed by 0. During the second byte,  
default/broadcast mode is set and the index register address is initialized. For write operation control register,  
data to be written is given from the third byte onwards. For read operation, stop-start is performed after the  
second byte. Now the first byte is I2C address followed by 1. From the second byte onwards, control register  
data appears.  
Each time read/write is performed, the index register address is incremented so that next read/write is  
performed on the next control register.  
During the first write cycle and all write cycles in the broadcast, only the device with address 0000 issues  
ACK to the I2C.  
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2
I C Write Sequence  
SCL  
SDA  
A4  
A1  
A6 A5  
A3 A2  
A0  
B7 B6 B5 B4 B3 R2 R1 R0  
D7 D6 D5 D4 D3 D2 D1 D0  
D6 D5 D4 D3 D2 D1 D0  
ACK  
ACK  
ACK  
ACK  
0
D7  
I2C I2C I2C  
4
6
5
Start Bit = 0  
SMARTDM Device  
Address  
Index Register Address  
(Index)  
11111 = Broadcast Mode  
Control Register Data for Write  
(Index+1)  
00000 = Default  
Control Register Data for Write  
(Index)  
(see Table 1)  
Programmable I2C Device Address  
Set by Control Register 2  
Figure 27. I2C Write Sequence  
2
I C Read Sequence  
SCL  
ACK  
A6  
A5  
A4  
A3  
A2  
A0  
0
B7  
B6  
B5  
B4  
B3  
R2  
R1  
R0  
ACK  
A1  
SDA  
I2C I2C I2C  
Start Bit = 0  
Stop Bit = 1  
xxxxx = Don't Care  
6
5
4
Index Register Address  
(Index)  
SMARTDM Device Address  
(see Table 1)  
Programmable 12C Device Address  
Set by Control Register 2  
SCL  
ACK  
ACK  
A6  
A5  
A2  
A0  
1
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
A4  
A3  
A1  
ACK  
SDA  
I2C I2C I2C  
4
6
5
Start Bit = 0  
Control Register Data  
(Index)  
Control Register Data  
(Index+1)  
SMARTDM Device Address  
(see Table 1)  
Programmable 12C Device Address  
Set by Control Register 2  
Figure 28. I2C Read Sequence  
Each AIC has an index register address. To perform a write operation, make the LSB of the first byte as 0 (write)  
(see Figure 29). During the second byte, the index register address is initialized and mode (broadcast/default) is  
set. From the third byte onwards, write data to the control register (given by index register) and increment the  
index register until stop or repeated start occurs. For operation, make the LSB of the first byte as 1 (read). From  
the second byte onwards, AIC starts transmitting data from the control register (given by the index register) and  
increments the index register. For setting the index register perform operation the same as write case for 2  
bytes, and then give a stop or repeated start.  
S/Sr -> Start/Repeated Start.  
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Write Mode  
Default/Broadcast  
(00000/11111)  
Increment Index Reg. Address  
8 Bit  
7 Bit  
1 Bit  
R/W  
8 Bit  
8 Bit  
2
S/Sr I C Device Address (3 Bit)+  
Mode (5 Bit) + Index Reg  
Address  
Ack  
Ack Control Reg. Data  
(Write)  
Ack  
Control Reg. Data  
(Write)  
Dtdmsp Device Address (+)  
= 0  
(3 Bit)  
To the Address Given  
by Index Reg. Address  
To the Address Given  
by Index Reg. Address  
Read Mode  
Increment Index Reg. Address  
8 Bit  
Increment Index Reg. Address  
7 Bit  
1 Bit  
R/W  
8 Bit  
2
S/Sr I C Device Address (3 Bit)+  
Control Reg. Data  
(Read)  
Ack  
Ack Control Reg. Data  
(Read)  
Ack  
Dtdmsp Device Address (+)  
= 1  
From the Address Given  
by Index Reg. Address  
From the Address Given  
by Index Reg. Address  
For Initializing Index Reg Address  
Stop  
7 Bit  
1 Bit  
R/W  
8 Bit  
2
S/Sr I C Device Address (3 Bit)+  
Mode (5 Bit) + Index Reg.  
Ack  
Ack  
Address  
(3 Bit)  
Dtdmsp Device Address (+)  
= 0  
Figure 29. Index Register Addresses  
Smart Time Division Multiplexed Serial Port (SMARTDM)  
The Smart time division multiplexed serial port (SMARTDM) uses the 4 wires of DOUT, DIN, SCLK, and FS to  
transfer data into and out of the AIC1x. The TLV320AIC1x's SMARTDM supports three serial interface  
configurations (see Table 2): stand-alone master, stand-alone slave, and master-slave cascade, employing a  
time division multiplexed (TDM) scheme (a cascade of only-slaves is not supported). The SMARTDM allows for  
a serial connection of up to 16 codecs to a single serial port. Data communication in the three serial interface  
configurations can be carried out in either standard operation (Default) or turbo operation. Each operation has  
two modes; programming mode (default mode) and continuous data transfer mode. To switch from the  
programming mode to the continuous data transfer mode, set bit D6 of control register 1 to 1, which is reset  
automatically after switching back to programming mode. The TLV320AIC1x can be switched back from the  
continuous data transfer mode to the programming mode by setting the LSB of the data on DIN to 1, only if the  
data format is (15+1), as selected by bit 0 of control register 1. The SMARTDM automatically adjusts the number  
of time slots per frame sync (FS) to match the number of codecs in the serial interface so that no time slot is  
wasted. Both the programming mode and the continuous data transfer mode of the TLV320AIC1x are  
compatible with the TLV320AIC10. The TLV320AIC1x provides primary/secondary communication and  
continuous data transfer with improvements and eliminates the requirements for hardware and software requests  
for secondary communication as seen in other devices. The TLV320AIC1x continuous data transfer mode now  
supports both master/slave stand alone and cascade.  
Table 2. Serial Interface Configurations  
M/S PIN  
FSD PIN  
MASTER  
TLV320AIC1x CONNECTIONS  
COMMENTS  
MASTER  
SLAVE  
NA  
SLAVE  
NA  
Stand-alone master  
Stand-alone slave  
High  
NA  
Pull high  
NA  
Low  
Pull-low  
Connect to the next slave's FS  
(see Figure 32)  
Master-slave cascade  
Slave-slave cascade  
High  
NA  
Low  
NA  
Last slave's FSD pin is pulled high  
Not supported  
NA  
NA  
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Digital Interface  
Clock Source (MCLK, SCLK)  
MCLK is the external master clock input. The clock circuit generates and distributes necessary clocks throughout  
the device. SCLK is the bit clock used to receive and transmit data synchronously. When the device is in the  
master mode, SCLK and FS are output and derived from MCLK in order to provide clocking the serial  
communications between the device and a digital signal processor (DSP). When in the slave mode, SCLK and  
FS are inputs. In the non-turbo mode (TURBO = 0), SCLK frequency is defined by:  
SCLK = (16 × FS × #Devices × mode)  
Where:  
FS is the frame-sync frequency. #Device is the number of the device in cascade. Mode is equal to 1 for  
continuous data transfer mode and 2 for programming mode.  
In turbo mode, see the Turbo Mode Operation section of this data sheet.  
Serial Data Out (DOUT)  
DOUT is placed in the high-impedance state after transmission of the LSB is completed. In data frame, the data  
word is the ADC conversion result. In the control frame, the data is the register read results when requested by  
the read/write (R/W) bit. If a register read is not requested, the low eight bits of the secondary word are all  
zeroes. Valid data on DOUT is taken from the high-impedance state by the falling edge of frame-sync (FS). The  
first bit transmitted on the falling edge of FS is the MSB of valid data.  
Serial Data In (DIN)  
The data format of DIN is the same as that of DOUT, in which MSB is received first on the falling edge of FS. In  
a data frame, the data word is the input digital signal to the DAC channel. If (15+1)-bit data format is used, the  
LSB (D0) is set to 1 to switch from the continuous data transfer mode to the programming mode. In a control  
frame, the data is the control and configuration data that sets the device for a particular function as described in  
the Control Register Programming section.  
Frame-Sync FS  
The frame-sync signal (FS) indicates the device is ready to send and receive data. The FS is an output if the  
M/S pin is connected to HI (master mode), and an input if the M/S pin is connected to LO (slave mode).  
The start of valid data is synchronized on the falling edge of the FS signal. In nonturbo mode, the FS signal  
must be present every (16 SCLK × mode). However, in turbo mode, the number of SCLK per FS cycle can vary.  
The frequency of FS is defined as the sampling rate of the TLV320AIC1x and derived from the master clock,  
MCLK, as follows (see Operating Frequencies section for details):  
FS = MCLK ÷ (16 × P × N × M)  
0
1
14  
15  
16  
SCLK  
16 SCLKs  
FS  
DIN/DOUT  
(16 Bit)  
D15  
MSB  
D14  
D1  
D0  
LSB  
D15  
Figure 30. Timing Diagram of FS  
Cascade Mode and Frame-Sync Delayed (FSD)  
In cascade mode, the DSP should be in slave mode, it receives all frame-sync pulses from the master though  
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the master's FS. The master FSD is output to the first slave and the first slave's FSD is output to the second  
slave device and so on. When the codecs are configured in cascade mode, MCLK must be connected in star  
configuration to ensure that MCLK can propagate simultaneously to all the codecs in the chain in less then 2 ps.  
Figure 32 shows the cascade of 4 TLV320AIC1xs in which the closest one to DSP is the master and the rest are  
slaves. The FSD output of each device is input to the FS terminal of the succeeding device. Figure 30 shows the  
FSD timing sequence in the cascade.  
Stand-Alone Slave  
In the stand-alone slave connection, the FS and SCLK are input in which they need to be synchronized to each  
other and programmed according to the Operating Frequencies section of this data sheet. The FS and SCLK  
input are not required to synchronize to the MCLK input but must remain active at all times to assure continuous  
sampling in the data converter. FS is output for initial 132 MCLK and it is kept low. DSP needs to keep FS low or  
high-impedance state for this period to avoid contention on FS.  
In addition, SCLK must be running at all times when the device is put into reset when in slave mode.  
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Asynchronous Sampling (Codecs in cascade are sampled at different sampling frequency)  
The 'AIC1x SMARTDM supports a different sampling frequency between the codecs in cascade connecting to a  
single serial port. All codecs are required to have a common frame synch frequency. The FS signal is calculated  
using step 1. The desired sampling frequencies of the individual codecs are then calculated using bits D2-D0 of  
control register 3 as shown in step 2 and step 3.  
1. FS = MCLK ÷ (16 × M × N × P)  
2. FS = n1 × fs1 (n1 = 1,2, 8 defined in the control register 3 of CODEC1)  
3. FS = n2 × fs2 (n2 = 1,2, 8 defined in the control register 3 of CODEC2)  
The DSP should transfer data at the common FS rate used by the serial interface. The task of decimating and  
interpolating the data suitably for each codec is left to the DSP.  
0
1
13  
14  
15  
SCLK  
FS  
16 SCLKs  
FSD  
(Output)  
DIN/DOUT  
(16 Bit)  
D15  
MSB  
D14  
D2  
D1  
LSB  
D0  
Figure 31. Timing Diagram for FSD Output  
100 MHz Max  
CLKOUT  
DX  
DR  
Master  
MCLK  
Slave 2  
MCLK  
Slave 1  
MCLK  
Slave 0  
MCLK  
FSX  
FSR  
DIN  
DOUT  
FSD  
DIN  
DIN  
DIN  
IOVDD  
1 k  
FS  
DOUT  
FS  
DOUT  
FS  
DOUT  
FS  
FSD  
M/S  
FSD  
M/S  
FSD  
M/S  
CLKX  
CLKR  
IOVDD  
M/S  
SCLK  
SCLK  
SCLK  
SCLK  
TMS320C5x  
Figure 32. Cascade Connection (To DSP Interface)  
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Master FS  
Master  
Slave2  
Slave1  
Slave0  
Master  
Slave2  
DIN/DOUT  
Master FSD,  
Slave 2 FS  
Slave 2 FSD,  
Slave 1 FS  
Slave 1 FSD,  
Slave 0 FS  
Slave 0 FSD,  
(see Note)  
A. NOTE: Slave 0 FSD should be pulled high for stand-alone-master or cascade configuration. FSD must be pulled low  
for stand-alone-slave configuration.  
Figure 33. Master-Slave Frame-Sync Timing in Continuous Data Transfer Mode  
Programming Mode  
In the programming mode, the FS signal starts the input/output data stream. Each period of FS contains two  
frames as shown in Figure 34 and Figure 35: data frame and control frame. The data frame contains data  
transmitted from the ADC or to the DAC. The control frame contains data to program the AIC1xs control  
registers. The SMARTDM automatically sets the number of time slots per frame equal to 2 times the number of  
AIC1x codecs in the interface. Each time slot contains 16-bit data. The SCLK is used to perform data transfer for  
the serial interface between the AIC1x codecs and the DSP. The frequency of SCLK varies depending on the  
selected mode of serial interface. In the stand alone-mode, there are 32 SCLKs (or two time slots) per sampling  
period. In the master-slave cascade mode, the number of SLCKs equals 32 x (Number of codecs in the  
cascade). The digital output data from the ADC is taken from DOUT. The digital input data for the DAC is  
applied to DIN. The synchronization clock for the serial communication data and the frame-sync is taken from  
SCLK. The frame-sync signal that starts the ADC and DAC data transfer interval is taken from FS. The  
SMARTDM also provides a turbo mode, in which the FS's frequency is always the device's sampling frequency,  
but SCLK is running at a much higher speed. Thus, there are more than 32 SCLKs per sampling period, in  
which the data frame and control frame occupy only the first 32 SCLKs from the falling edge of the frame-sync  
FS (see the Digital Interface Section for more details).  
Slot Number 0  
Slot Number 1  
SCLK  
FS  
DIN  
16-Bit DAC Data  
16-Bit ADC Data  
Register Data Write  
Register Data Read  
DOUT  
Figure 34. Standard Operation/Programming Mode: Stand-Alone Timing  
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Slot  
Number  
0
1
2
2n-3 2n-2 2n-1  
SCLK  
FS  
16 SCLKs Per Slot  
DIN/  
DOUT  
Master Slave Slave  
n-2 n-3  
Slave Slave  
Slave Master Slave Slave  
n-2 n-3  
Slave Slave Slave  
2
1
0
2
1
0
Data Frame  
NOTE: n is the total number of AIC12s in the cascade  
Control Frame  
(Register R/W)  
Figure 35. Standard Operation/Programming Mode: Master-Slave Cascade Timing  
Continuous Data Transfer Mode  
The continuous data transfer mode, selected by setting bit D6 of the control register 1 to 1, contains conversion  
data only. In continuous data transfer mode, the control frame is eliminated and the period of FS signal contains  
only the data frame in which the 16-bit data is transferred contiguously, with no inactivity between bits. The  
control frame can be reactivated by setting the LSB of DIN data to 1 if the data is in the 15+1 format. To return  
the programming mode in the 16-bit DAC data format mode, write 0 in bit D6 of control register 1 using I2C or  
S2C, or do a hardware reset to come out of continuous data transfer mode. If continuous data transfer mode is  
used with the turbo mode, the codec should first be set in turbo mode before it is switched from the default  
programming mode to the continuous data transfer mode.  
Slot Number 0  
Slot Number 0  
SCLK  
FS  
Data Frame  
Data Frame  
DIN  
(Sample 3)  
(Sample 3)  
16-Bit DAC Data (Sample 2)  
16-Bit DAC Data (Sample 1)  
16-Bit ADC Data (Sample 2)  
DOUT  
16-Bit ADC Data (Sample 1)  
Figure 36. Standard Operation/Continuous Data Transfer Mode: Stand-Alone Timing  
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Slot  
Number  
0
1
2
n-3  
n-2  
n-1  
0
1
2
n-3  
n-2  
n-1  
SCLK  
16 SCLKs Per Time Slot  
FS  
DIN/  
DOUT  
Master Slave Slave  
n-2 n-3  
Slave Slave Slave Master Slave Slave  
n-2 n-3  
Slave Slave Slave  
2
1
0
2
1
0
Data Frame / Sample 1  
NOTE: n is the total number of AIC12s in the cascade  
Data Frame / Sample 2  
Figure 37. Standard Operation/Continuous Data Transfer Mode: Master-Slave Cascade Timing  
Turbo Operation (SCLK)  
Setting TURBO = 1 (bit D7) in control register 2 enables the turbo mode that requires the following condition to  
be met:  
For master with SCLK as output, M × N > #Devices × mode  
Where:  
M, N, and P are clock divider values defined in the control register 4. #Device is the number of the device in  
cascade. Mode is equal to 1 for continuous data transfer mode and 2 for programming mode.  
For slave, SCLK is the input with max allowable speed of 25 MHz (no condition is required).  
The number of SCLKs per FS can be (16 × mode).  
The turbo operation is useful for applications that require more bandwidth for multitasking processing per  
sampling period. In the turbo mode (see Figure 38), the FSs frequency is always the device's sampling  
frequency but the SCLK is running at much higher speed than that described in Section 3.6.1. The output SCLK  
frequency is equal to (MCLK/P) in master mode and up to a maximum speed of 25 MHz for both master and  
slave AIC1x. The data/control frame is still 16-SCLK long and the FS is one-SCLK pulse. If the 'AIC1x is in slave  
mode, and the device is not set to turbo mode, only the first FS is used to synchronize the data transfer. The  
'AIC1x ignores all subsequent FS signals and utilizes an internally generated FS. However, if the 'AIC1x is set to  
turbo mode while in slave mode, then the data transfer synchronizes on every FS signal. Therefore, it is  
recommended that if the 'AIC1x is set to slave mode, then turbo mode is used. Also note that in turbo mode, it is  
recommended that SCLK be a multiple of 32 x FS  
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TURBO PROGRAMMING MODE  
Stand-Alone Case:  
••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••  
Turbo SCLK  
One SCLK  
Sampling Period  
FS  
Data Frame Control Frame  
Data Frame Control Frame  
Hi-Z  
...  
...  
...  
...  
15 14  
1
0
15 14  
1
0
15 14  
1
0
15 14  
1 0  
DIN / DOUT  
Cascade Case (Master + 4 Slaves):  
Turbo SCLK  
••••••••••••••••••••••••••••••••••••••••••••••••••••••••••  
Sampling Period  
FS  
Control Frame  
Data Frame  
Control Frame  
Data Frame  
Hi-Z  
DIN / DOUT  
TURBO CONTINUOUS DATA TRANSFER MODE  
Stand-Alone Case:  
•••••••••••••••••••••••••••••••••••••••••••••••••••••  
Turbo SCLK  
One SCLK  
Sampling Period  
Hi-Z  
FS  
Data Frame  
Data Frame  
Hi-Z  
...  
...  
1
0
15 14  
1 0  
DIN / DOUT  
15 14  
Cascade Case (Master + 4 Slaves):  
•••••••••••••••••••••••••••••••••••••••••••••••••  
Turbo SCLK  
FS  
Sampling Period  
Data Frame  
Data Frame  
Hi-Z  
Hi-Z  
DIN / DOUT  
Figure 38. Turbo Programming Mode (SCLK Is Not Drawn To Scale)  
Control Register Programming  
The TLV320AIC1x contains six control registers that are used to program available modes of operation. All  
register programming occurs during the control frame through DIN. New configuration takes effect after a delay  
of one frame sync FS except the software reset, which happens after 6 MCLKs from the falling edge of the next  
frame sync FS. The TLV320AIC1x is defaulted to the programming mode upon power up. Set bit 6 in control  
register 1 to switch to continuous data transfer mode. If the 15+1 data format of DIN has been selected, the LSB  
of the DIN to 1 to switch from continuous data transfer mode to programming set mode. Otherwise, either the  
device needs to be reset or the host port writes 0 to bit D6 of control register 1 during the continuous data  
transfer mode to switch back to the programming mode.  
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Data Frame Format  
DIN  
(15+1) Bit Mode  
D0  
D15 - D1  
(Continuous Data Transfer Mode Only)  
Control Frame  
Request  
A/D and D/A Data  
DOUT  
(16 Bit A/D Data)  
D15 - D0  
DIN  
16 Bit Mode  
D15 - D0  
A/D and D/A Data  
DOUT  
16 Bit Mode  
D15 - D0  
Figure 39. Data Frame Format  
Control Frame Format (Programming Mode)  
During the control frame, the DSP sends 16-bit words to the SMARTDM through DIN to read or write control  
registers shown in Table 4. The upper byte (Bits D15-D8) of the 16-bit control-frame word defines the read/write  
command. Bits D15-D13 define the control register address with register content occupied the lower byte D7-D0.  
Bit D12 is set to 0 for a write or to 1 for a read. Bit D11 in the write command is used to perform the broadcast  
mode. During a register write, the register content is located in the lower byte of DIN. During a register read, the  
register content is output in the lower byte of DOUT in the same control frame, whereas the lower byte of DIN is  
ignored.  
Broadcast Register Write  
Broadcast operation is very useful for a cascading system of SMARTDM DSP codecs in which all register  
programming can be completed in one control frame. During the control frame and in any register-write time slot,  
if the broadcast bit (D11) is set to 1, the register content of that time slot is written into the specified register of  
all devices in cascade (see Figure 40). This reduces the DSP's overhead of doing multiple writes to program  
same data into cascaded devices.  
Data to be Written Into Register  
D7 - D0  
DIN (Write) D15 D14 D13  
Register  
0
D11  
1
1
1
R/W Broadcast  
Don’t care  
D7 - D0  
Address  
DIN (Read) D15 D14 D13  
1
1
1
1
0
0
Register  
Address  
SMARTDM Device  
Address  
Register Content  
D7 - D0  
DOUT (Read) D15 D14 D13 D12 D11 D10 D9  
Figure 40. Control Frame Data Format  
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Master FS  
Data Frame  
Control Frame  
Slave0 Master Slave2 Slave1 Slave0 Master Slave2 Slave1 Slave0 Master Slave2 Slave1 Slave0  
DIN  
Time Slot  
Reg Addr (D15-D13) 001(1) 010(2) 100(4) 110(6)  
Write  
Command  
R/W (D12)  
Broadcast (D11)  
D10-D8  
0
1
0
1
0
1
0
1
111  
111  
111  
111  
A. NOTE: In this example, the broadcast operation (D11 = 1) is used to program the four control registers of Reg.1,  
Reg.2, Reg.4, and Reg.6 in all 4 DSP codecs (Master, Slave2, Slave1, and Slave0) shown in Figure 33. These  
registers are programmed during the same frame.  
Figure 41. Control Frame Data Format  
Register Map  
Bits D15 through D13 represent the control register address that is written with data carried in D7 through D0.  
Bit D12 determines a read or a write cycle to the addressed register. When D12 = 0, a write cycle is selected.  
When D12 = 1, a read cycle is selected. Bit D11 controls the broadcast mode as described above, in which the  
broadcast mode is enabled if D11 is set to 1. Always write 1s to the bits D10 through D8.  
Table 3 shows the register map.  
Table 3. Register Map  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Register Address  
RW  
BC  
1
1
1
Control Register Content  
Table 4. Register Addresses  
REGISTER NO.  
D15  
D14  
0
D13  
0
REGISTER NAME  
0
1
2
3
4
5
6
0
0
0
0
1
1
1
No operation  
control 1  
control 2  
control 3  
control 4  
control 5  
control 6  
0
1
1
0
1
1
0
0
0
1
1
0
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Control Register Content Description  
Control Register 1(1)  
D7  
ADOVF  
R
D6  
CX  
D5  
IIR  
D4  
DAOVF  
R
D3  
D2  
D1  
D0  
DAC16  
R/W  
BIASV  
R/W  
ALB  
R/W  
DLB  
R/W  
R/W  
R/W  
(1) NOTE: R = Read, W = Write  
Control Register 1 Bit Summary  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7  
ADOVF  
0
ADC over flow. This bit indicates whether the ADC is overflow.  
ADOVF = 0 No overflow.  
ADOVF = 1 A/D is overflow.  
D6  
CX  
0
Continuous data transfer mode. This bit selects between programming mode and continuous data transfer  
mode.  
CX = 0 Programming mode.  
CX = 1 Continuous data transfer mode.  
D5  
D4  
D3  
D2  
D1  
D0  
IIR  
0
0
0
0
0
0
IIR Filter. This bit selects between FIR and IIR for decimation/interpolation low-pass filter.  
IIR = 0 FIR filter is selected.  
IIR = 1 IIR filter is selected.  
DAOVF  
BIASV  
ALB  
DAC over flow. This bit indicates whether the DAC is overflow  
DAOVF = 0 No overflow.  
DAOVF = 1 DAC is overflow  
Bias voltage. This bit selects the output voltage for BIAS pin  
BIASV = 0 BIAS pin = 2.35 V  
BIASV = 1 BIAS pin = 1.35 V  
Analog loop back  
DLB = 0 Analog loopback disabled  
DLB = 1 Analog loopback enabled  
DLB  
Digital loop back  
DLB = 0 Digital loopback disabled  
DLB = 1 Digital loopback enabled  
DAC16  
DAC 16-bit data format. This bit applies to the continuous data transfer mode only to enable the 16-bit data  
format for DAC input.  
DAC16 = 0 DAC input data length is 15 bits. Writing a 1 to the LSB of the DAC input to switch from  
continuous data transfer mode to programming mode.  
DAC16 = 1 DAC input data length is 16 bit.  
Control Register 2(1)  
D7  
TURBO  
R/W  
D6  
D5  
I2C6  
D4  
I2C5  
D3  
I2C4  
D2  
D1  
D0  
DIFBP  
R/W  
GPO  
R/W  
HPC  
R/W  
R/W  
R/W  
R/W  
R/W  
(1) NOTE: R = Read, W = Write  
Control Register 2 Bit Summary  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7  
TURBO  
0
Turbo mode. This bit is used to set the SCLK rate.  
TURBO = 0 SCLK = (16 × FS × #Device × mode)  
TURBO = 1 SCLK = MCLK/P (P is determined in register 4) (MCLK/P is valid only for master mode)  
D6  
DIFBP  
I2Cx  
0
Decimation/interpolation filter bypass. This bit is used to bypass both decimation and interpolation filters.  
DIFBP = 0 Decimation/interpolation filters are operated.  
DIFBP = 1 Decimation/interpolation filters are bypassed.  
I2C device address. These three bits are programmable to define three MSBs of the I2C device address  
(reset value is 100). These three bits are combined with the 4-bit SMARTDM device address to form 7-bit  
I2C device address.  
D5-D3  
100  
40  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Control Register 2 Bit Summary (continued)  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D2  
GPO  
HPC  
0
General-purpose output  
Host port control bits.  
D1-D0  
00  
Write the following values into D1-D0 to select the appropriate configuration for two pins SDA and SCL. The  
SDA pin is set to be equal to D2 if D1-D0 = 10.  
D1-D0  
0 0 SDA and SCL pins are used for I2C interface  
0 1 SDA and SCL pins are used for S2C interface  
1 0 SDA pin = D2, input going into SCL pin is output to DOUT  
1 1 SDA pin = Control frame flag.  
Control Register 3(1)  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
PWDN  
R/W  
SWRS  
R/W  
OSR-option  
R/W  
ASRF  
R/W  
(1) NOTE: R = Read, W = Write  
Control Register 3 Bit Summary  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7-D6  
PWDN  
00  
Power Down,  
PWDN = 00 No power down  
PWDN = 01 Power-down A/D  
PWDN = 10 Power-down D/A  
PWDN = 11 Software power down the entire device  
D5  
SWRS  
0
Software Reset. Set this bit to 1 to reset the device.  
D4-D3  
OSR  
00  
OSR option.  
option  
D4 - D3 = X1 OSR for DAC Channel is 512 ( Max Fs = 8 Ksps)  
D4 - D3 = 10 OSR for DAC Channel is 256 ( Max Fs = 16 Ksps)  
D4 - D3 = 00 OSR for DAC Channel is 128 (Max Fs = 26 Ksps)  
D2-D0  
ASRF  
001  
Asynchronous Sampling Rate Factor. These three bits define the ratio n between FS frequency and the  
desired sampling frequency Fs (Applied only if different sampling rate between CODEC1 and CODEC2 is  
desired)  
ASRF = 001 n = FS/Fs = 1  
ASRF = 010 n = FS/Fs = 2  
ASRF = 011 n = FS/Fs = 3  
ASRF = 100 n = FS/Fs = 4  
ASRF = 101 n = FS/Fs = 5  
ASRF = 110 n = FS/Fs = 6  
ASRF = 111 n = FS/Fs = 7  
ASRF = 000 n = FS/Fs = 8  
Control Register 4(1)  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
FSDIV  
R/W  
MNP  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
(1) NOTE: R = Read, W = Write  
Control Register 4 Bit Summary  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7  
FSDIV  
0
Frame sync division factor  
FSDIV = 0 To write value of P to bits D2-D0 and value of N to bits D6-D3  
FSDIV = 1 To write value of M to bits D6-D0  
41  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Control Register 4 Bit Summary (continued)  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D6-D0 MNP(1)(2)  
Divider values of M, N, and P to be used in junction with the FSDIV bit for calculation of FS frequency  
(3)(4)  
according to the formula FS = MCLK / (16 x M x N x P)  
M = 1,2,,128 Determined by D6-D0 with FSDIV = 1  
D7-D0 = 10000000 M = 128  
D7-D0 = 10000001 M = 1  
to  
D7-D0 = 11111111 M = 127  
N = 1,2,,16 Determined by D6-D3 with FSDIV = 0  
D7-D0 = 00000xxx N = 16  
D7-D0 = 00001xxx N = 1  
to  
D7-D0 = 01111xxx N = 15  
P = 1,2,,8 Determined by D2-D0 with FSDIV = 0  
D7-D0 = 0xxxx000 P = 8  
D7-D0 = 0xxxx001 P = 1  
to  
D7-D0 = 0xxxx111 P = 7  
(1) It takes 2 sampling periods to update new values of M, N, and P.  
(2) In register read operation, first read receives N and P values and second read receives M value.  
(3) M(default) = 16, N(default) = 6, P(default) = 8  
(4) If P = 8, the device enters the coarse sampling mode as described in operating frequencies section.  
Control Register 5A(5)  
D7  
0
D6  
0
D5  
D4  
D3  
D2  
D1  
D0  
ADGAIN  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
(5) NOTE: R = Read, W = Write  
Control Register 5A Bit Summary(1)(2)  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7-D6  
Control  
Register 5A  
00  
ADC programmable gain amplifier  
A/D converter gain (see Table 5)  
D5-D0  
ADGAIN  
101010  
(1) In register read operation, first read receives ADC gain value, second read receives DAC gain value, third read receives register 5C  
contents, and fourth read receives register 5D contents.  
(2) PGA default value = 101010b (0dB) for both ADC and DAC.  
Table 5. A/D PGA Gain  
D7  
0
0
0
0
0
0
0
0
0
0
0
0
0
D6  
0
0
0
0
0
0
0
0
0
0
0
0
0
D5  
1
1
1
1
1
1
1
1
1
1
1
1
1
D4  
1
1
1
1
1
1
1
1
1
1
1
1
1
D3  
1
1
1
1
1
1
1
1
0
0
0
0
0
D2  
1
1
1
1
0
0
0
0
1
1
1
1
0
D1  
1
1
0
0
1
1
0
0
1
1
0
0
1
D0  
1
0
1
0
1
0
1
0
1
0
1
0
1
DESCRIPTION  
ADC input PGA gain = MUTE  
ADC input PGA gain = 20 dB  
ADC input PGA gain = 19 dB  
ADC input PGA gain = 18 dB  
ADC input PGA gain = 17 dB  
ADC input PGA gain = 16 dB  
ADC input PGA gain = 15 dB  
ADC input PGA gain = 14 dB  
ADC input PGA gain = 13 dB  
ADC input PGA gain = 12 dB  
ADC input PGA gain = 11 dB  
ADC input PGA gain = 10 dB  
ADC input PGA gain = 9 dB  
42  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Table 5. A/D PGA Gain (continued)  
D7  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D6  
D5  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D4  
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
D3  
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
D2  
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D1  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
D0  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
DESCRIPTION  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ADC input PGA gain = 8 dB  
ADC input PGA gain = 7 dB  
ADC input PGA gain = 6 dB  
ADC input PGA gain = 5 dB  
ADC input PGA gain = 4 dB  
ADC input PGA gain = 3 dB  
ADC input PGA gain = 2 dB  
ADC input PGA gain = 1 dB  
ADC input PGA gain = 0 dB  
ADC input PGA gain = -1 dB  
ADC input PGA gain = -2 dB  
ADC input PGA gain = -3 dB  
ADC input PGA gain = -4 dB  
ADC input PGA gain = -5 dB  
ADC input PGA gain = -6 dB  
ADC input PGA gain = -7 dB  
ADC input PGA gain = -8 dB  
ADC input PGA gain = -9 dB  
ADC input PGA gain = -10 dB  
ADC input PGA gain = -11 dB  
ADC input PGA gain = -12 dB  
ADC input PGA gain = -13 dB  
ADC input PGA gain = -14 dB  
ADC input PGA gain = -15 dB  
ADC input PGA gain = -16 dB  
ADC input PGA gain = -17 dB  
ADC input PGA gain = -18 dB  
ADC input PGA gain = -19 dB  
ADC input PGA gain = -20 dB  
ADC input PGA gain = -21 dB  
ADC input PGA gain = -22 dB  
ADC input PGA gain = -23dB  
ADC input PGA gain = -24 dB  
ADC input PGA gain = -25 dB  
ADC input PGA gain = -26 dB  
ADC input PGA gain = -27 dB  
ADC input PGA gain = -28 dB  
ADC input PGA gain = -29 dB  
ADC input PGA gain = -30 dB  
ADC input PGA gain = -31 dB  
ADC input PGA gain = -32 dB  
ADC input PGA gain = -33 dB  
ADC input PGA gain = -34 dB  
ADC input PGA gain = -35 dB  
ADC input PGA gain = -36 dB  
ADC input PGA gain = -37 dB  
ADC input PGA gain = -38 dB  
43  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Table 5. A/D PGA Gain (continued)  
D7  
0
D6  
0
D5  
0
D4  
0
D3  
0
D2  
0
D1  
1
D0  
1
DESCRIPTION  
ADC input PGA gain = -39 dB  
ADC input PGA gain = -40 dB  
ADC input PGA gain = -41 dB  
ADC input PGA gain = -42 dB  
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
Control Register 5B(1)  
D7  
0
D6  
1
D5  
D4  
D3  
D2  
D1  
D0  
DAGAIN  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
(1) NOTE: R = Read, W = Write  
Control Register 5B Bit Summary(1)(2)  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7-D6  
Control  
NA  
Register 5B  
D5-D0  
DAGAIN  
101010  
D/A converter gain (see Table 6)  
(1) In register read operation, first read receives ADC gain value, second read receives DAC gain value, third receives register 5C and  
fourth receives register 5D.  
(2) PGA default value = 101010b (0dB) for both ADC and DAC.  
Table 6. D/A PGA Gain  
D7  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D6  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D5  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D4  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
D3  
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
D2  
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
D1  
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
D0  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
DESCRIPTION  
DAC input PGA gain = MUTE  
DAC input PGA gain = 20 dB  
DAC input PGA gain = 19 dB  
DAC input PGA gain = 18 dB  
DAC input PGA gain = 17 dB  
DAC input PGA gain = 16 dB  
DAC input PGA gain = 15 dB  
DAC input PGA gain = 14 dB  
DAC input PGA gain = 13 dB  
DAC input PGA gain = 12 dB  
DAC input PGA gain = 11 dB  
DAC input PGA gain = 10 dB  
DAC input PGA gain = 9 dB  
DAC input PGA gain = 8 dB  
DAC input PGA gain = 7 dB  
DAC input PGA gain = 6 dB  
DAC input PGA gain = 5 dB  
DAC input PGA gain = 4 dB  
DAC input PGA gain = 3 dB  
DAC input PGA gain = 2 dB  
DAC input PGA gain = 1 dB  
DAC input PGA gain = 0 dB  
DAC input PGA gain = -1 dB  
DAC input PGA gain = -2 dB  
DAC input PGA gain = -3 dB  
44  
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SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Table 6. D/A PGA Gain (continued)  
D7  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D6  
D5  
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D4  
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D3  
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
D2  
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
D1  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
D0  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
DESCRIPTION  
DAC input PGA gain = -4 dB  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DAC input PGA gain = -5 dB  
DAC input PGA gain = -6 dB  
DAC input PGA gain = -7 dB  
DAC input PGA gain = -8 dB  
DAC input PGA gain = -9 dB  
DAC input PGA gain = -10 dB  
DAC input PGA gain = -11 dB  
DAC input PGA gain = -12 dB  
DAC input PGA gain = -13 dB  
DAC input PGA gain = -14 dB  
DAC input PGA gain = -15 dB  
DAC input PGA gain = -16 dB  
DAC input PGA gain = -17 dB  
DAC input PGA gain = -18 dB  
DAC input PGA gain = -19 dB  
DAC input PGA gain = -20 dB  
DAC input PGA gain = -21 dB  
DAC input PGA gain = -22 dB  
DAC input PGA gain = -23dB  
DAC input PGA gain = -24 dB  
DAC input PGA gain = -25 dB  
DAC input PGA gain = -26 dB  
DAC input PGA gain = -27 dB  
DAC input PGA gain = -28 dB  
DAC input PGA gain = -29 dB  
DAC input PGA gain = -30 dB  
DAC input PGA gain = -31 dB  
DAC input PGA gain = -32 dB  
DAC input PGA gain = -33 dB  
DAC input PGA gain = -34 dB  
DAC input PGA gain = -35 dB  
DAC input PGA gain = -36 dB  
DAC input PGA gain = -37 dB  
DAC input PGA gain = -38 dB  
DAC input PGA gain = -39 dB  
DAC input PGA gain = -40 dB  
DAC input PGA gain = -41 dB  
DAC input PGA gain = -42 dB  
45  
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TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Control Register 5C(1)  
D7  
1
D6  
0
D5  
D4  
D3  
D2  
Reserved  
R
D1  
D0  
DSTG  
R/W  
INBG  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
(1) NOTE: R = Read, W = Write  
Digital Sidetone Gain  
D5  
1
D4  
1
D3  
1
DSTG  
Digital sidetone gain = Mute (Default)  
Digital sidetone gain = -21 dB  
Digital sidetone gain = -18 dB  
Digital sidetone gain = -15 dB  
Digital sidetone gain = -12 dB  
Digital sidetone gain = -9 dB  
Digital sidetone gain = -6 dB  
Digital sidetone gain = -3 dB  
1
1
0
1
0
1
1
0
0
0
1
1
0
1
0
0
0
1
0
0
0
Input Buffer Gain  
D1  
D0  
1
INBG  
1
1
0
0
Input buffer gain = 24 dB  
Input buffer gain = 12 dB  
Input buffer gain = 6 dB  
0
1
0
Input buffer gain = 0 dB (Default)  
Control Register 5D(1)  
D7  
1
D6  
1
D5  
D4  
D3  
D2  
D1  
D0  
Reserved  
Chip Version-ID  
R/W  
R/W  
R
R
R
R
R
R
(1) NOTE: R = Read, W = Write  
46  
Submit Documentation Feedback  
TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Control Register 6  
D7  
D6  
MUTE2  
R/W  
D5  
MUTE3  
R/W  
D4  
D3  
D2  
D1  
D0  
Reserved  
R/W  
PSDO  
R/W  
ODRCT  
AINSEL  
R/W  
R/W  
R/W  
R/W  
Control Register 6 Bit Summary  
RESET  
VALUE  
BIT  
NAME  
FUNCTION  
D7  
PSDO  
0
Programmable single-ended/differential output. This bit configures the two pins of OUTP2 and OUTP3 as  
single-ended or differential output. If the OUTP2 and OUTP3 are single-ended, the OUTMV is the virtual  
ground. If the OUTP2 and OUTP3 are differential, the OUTMV is the common inverting output.  
PSDO = 0 OUTP2 and OUTP3 are two differential output (1)  
PSDO = 1 OUTP2 and OUTP3 are two single-ended output (2)  
NOTE:  
(1) The OUTP2 and OUTP3 pins are the noninverting output with common inverting output. The OUTMV is  
their common inverting output  
(2) The virtual ground pin OUTMV and the common mode of OUTP2 and OUTP3 are the same at 1.35 V.  
D6  
D5  
MUTE2  
MUTE3  
0
0
Analog Output2 mute control. This bit sets MUTE for OUTP2  
MUTE2 = 0 OUTP2 is not MUTE  
MUTE2 = 1 OUTP2 is MUTE  
Analog Output2 mute control. This bit sets MUTE for OUTP3  
MUTE3 = 0 OUTP3 is not MUTE  
MUTE3 = 1 OUTP3 is MUTE  
D4-D3 ODRCT  
00  
Analog driver control. These two bits enable/disable the analog output drivers for the analog output pins of  
OUTP2 and OUTP3  
ODRCT =00 OUTP3 = OFF, OUTP2 = OFF  
ODRCT =01 OUTP3 = OFF, OUTP2 = ON  
ODRCT =10 OUTP3 = ON, OUTP2 = OFF  
ODRCT =11 OUTP3 = ON, OUTP2 = ON  
D2-D1 AINSEL  
00  
Analog input select. These bits select the analog input for the ADC  
AINSEL = 00 The analog input is INP/M1  
AINSEL = 01 The analog input is MICIN self-biased at 1.35 V  
AINSEL =10 The analog input is MICIN with external common mode  
AINSEL = 11 The analog input is INP/M2  
NOTE: For AINSEL = 10, the external common mode is connected to INM1 via an ac-coupled capacitor.  
D0  
Reserved  
47  
Submit Documentation Feedback  
TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
IOVDD IOVDD  
1 k  
TLV320AIC12  
1 kΩ  
Microphone  
BIAS  
M/S  
TLV320C5X  
FSK  
FSD  
FS  
MICIN  
INP1  
0.1 µF  
0.1 µF  
FSR  
DX  
DIN  
INM1  
DR  
DOUT  
0.1 µF  
0.1 µF  
CLKR  
INP2  
SCLK  
CLKX  
INM2  
From DSP or  
Other Clock Source  
MCLK  
0.1 µF  
OUTP1  
OUTM1  
From DSP  
From DSP  
RESET  
IOVDD  
1 kΩ  
600 Ω  
PWRDN  
SDA  
OUTP2  
OUTMV  
2
I C Master  
2
S C  
SCL  
OUTP3  
AVDD  
DVDD  
DVSS  
To 1.8 V Digital Supply  
To Digital GND  
0.01 µF  
0.01 µF  
0.1 µF  
0.1 µF  
1 µF  
3.3 V Analog Supply  
0.1 µF  
Analog GND  
AVSS  
To 3.3 V Digital Supply  
To Digital GND  
IOVDD  
IOVSS  
3.3 V Analog Supply  
1 µF  
DRVDD  
DRVSS  
0.1 µF  
Analog GND  
Figure 42. Single-Ended Microphone Input (Internal Common Mode)  
48  
Submit Documentation Feedback  
TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
IOVDD IOVDD  
1 k  
TLV320AIC12  
1 kΩ  
Microphone  
BIAS  
M/S  
TLV320C5X  
FSK  
FSD  
FS  
MICIN  
INP1  
0.1 µF  
0.1 µF  
FSR  
DX  
DIN  
INM1  
INP2  
INM2  
DR  
DOUT  
0.1 µF  
0.1 µF  
0.1 µF  
CLKR  
SCLK  
CLKX  
From DSP or  
Other Clock Source  
MCLK  
OUTP1  
OUTM1  
From DSP  
RESET  
IOVDD  
1 kΩ  
600 Ω  
1 µF  
1 µF  
From DSP  
From DSP  
PWRDN  
SDA  
600 Ω  
OUTP2  
OUTMV  
SCL  
DVDD  
DVSS  
To 1.8 V Digital Supply  
To Digital GND  
OUTP3  
AVDD  
0.01 µF  
0.01 µF  
0.1 µF  
0.1 µF  
1 µF  
3.3 V Analog Supply  
0.1 µF  
0.1 µF  
Analog GND  
AVSS  
To 3.3 V Digital Supply  
To Digital GND  
IOVDD  
IOVSS  
3.3 V Analog Supply  
1 µF  
DRVDD  
DRVSS  
Analog GND  
Figure 43. Pseudo-Differential Microphone Input (External Common Mode)  
49  
Submit Documentation Feedback  
TLV320AIC12, TLV320AIC13  
TLV320AIC14, TLV320AIC15  
TLV320AIC12K, TLV320AIC14K  
www.ti.com  
SLWS115EOCTOBER 2001REVISED JANUARY 2007  
Layout and Grounding Guidelines for TLV320AIC1x  
TLV320AIC1x has an in-built analog antialias filter, which provides rejection to external noise at high frequencies  
that may couple into the device. Digital filters with high out-of-band attenuation also reject the external noise. If  
the differential inputs are used for the ADC channel, then the noise in the common-mode signal is also rejected  
by the high CMRR of TLV320AIC1x. Using external common-mode for microphone inputs also helps rejecting  
the external noise. However to extract the best performance from TLV320AIC1x, care must be taken in board  
design and layout to avoid coupling of external noise into the device.  
TLV320AIC1x supports clock frequencies as high as 100 MHz. To avoid coupling of fast switching digital signals  
to analog signals, the digital and analog sections should be separated on the board. In TLV320AIC1x the digital  
and analog pins are kept separated to aid such a board layout. A separate analog ground plane should be used  
for the analog section of the board. The analog and digital ground planes should be shorted at only one place as  
close to TLV320AIC1x as possible. No digital trace should run under TLV320AIC1x to avoid coupling of external  
digital noise into the device. It is suggested to have the analog ground plane running below the TLV320AIC1x.  
The power-supplies should be decoupled close to the supply pins, preferably, with a 0.1 µF-ceramic capacitor  
and a 10-µF tantalum capacitor following. The ground pin should be connected to the ground plane as close as  
possible to the TLV320AIC1x, so as to minimize any inductance in the path. Since the MCLK is expected to be a  
high frequency signal, it is advisable to shield it with digital ground. For best performance of ADC in differential  
input mode, the differential signals should be routed close to each other in similar fashion, so that the noise  
coupling on both the signals is same and can be rejected by the device.  
Extra care has to be taken for the speaker driver outputs, as any trace resistance can cause a reduction in the  
maximum swing that can be seen at the speaker.  
For devices in the RHB package, connect the device thermal pad to DRVSS.  
50  
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
TLV32012KIDBTRG4  
TLV32014KIDBTRG4  
TLV320AIC12CDBT  
TLV320AIC12CDBTG4  
TLV320AIC12CDBTR  
TLV320AIC12CDBTRG4  
TLV320AIC12IDBT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DBT  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
32  
32  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
QFN  
QFN  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
SM8  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
RHB  
RHB  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC12IDBTG4  
TLV320AIC12IDBTR  
TLV320AIC12IDBTRG4  
TLV320AIC12KIDBT  
TLV320AIC12KIDBTG4  
TLV320AIC12KIDBTR  
TLV320AIC12KIRHBR  
TLV320AIC12KIRHBT  
TLV320AIC13CDBT  
TLV320AIC13CDBTG4  
TLV320AIC13CDBTR  
TLV320AIC13CDBTRG4  
TLV320AIC13IDBT  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC13IDBTG4  
TLV320AIC13IDBTR  
TLV320AIC13IDBTRG4  
TLV320AIC14CDBT  
TLV320AIC14CDBTG4  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
Orderable Device  
TLV320AIC14CDBTR  
TLV320AIC14CDBTRG4  
TLV320AIC14IDBT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DBT  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
48  
48  
48  
48  
48  
48  
48  
48  
48  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
SM8  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
DBT  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC14IDBTG4  
TLV320AIC14IDBTR  
TLV320AIC14IDBTRG4  
TLV320AIC14KIDBT  
TLV320AIC14KIDBTG4  
TLV320AIC14KIDBTR  
TLV320AIC15CDBT  
TLV320AIC15CDBTG4  
TLV320AIC15CDBTR  
TLV320AIC15CDBTRG4  
TLV320AIC15IDBT  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC15IDBTG4  
TLV320AIC15IDBTR  
TLV320AIC15IDBTRG4  
TLV320AIC20CPFB  
TLV320AIC20CPFBG4  
TLV320AIC20CPFBR  
TLV320AIC20CPFBRG4  
TLV320AIC20IPFB  
SM8  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SM8  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC20IPFBG4  
TLV320AIC20IPFBR  
TLV320AIC20IPFBRG4  
TLV320AIC21CPFB  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
Orderable Device  
TLV320AIC21CPFBG4  
TLV320AIC21CPFBR  
TLV320AIC21CPFBRG4  
TLV320AIC21IPFB  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TQFP  
PFB  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
32  
32  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
QFN  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
RHB  
RHB  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC21IPFBG4  
TLV320AIC21IPFBR  
TLV320AIC21IPFBRG4  
TLV320AIC24CPFB  
TLV320AIC24CPFBG4  
TLV320AIC24CPFBR  
TLV320AIC24CPFBRG4  
TLV320AIC24IPFB  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC24IPFBG4  
TLV320AIC24IPFBR  
TLV320AIC24IPFBRG4  
TLV320AIC25CPFB  
TLV320AIC25CPFBG4  
TLV320AIC25CPFBR  
TLV320AIC25CPFBRG4  
TLV320AIC25IPFB  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLV320AIC25IPFBG4  
TLV320AIC25IPFBR  
TLV320AIC25IPFBRG4  
TLVAIC12KIRHBRG4  
TLVAIC12KIRHBTG4  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
QFN  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
Device  
Package Pins  
Site  
MLA  
MLA  
Reel  
Diameter Width  
(mm)  
Reel  
A0 (mm)  
5.3  
B0 (mm)  
5.3  
K0 (mm)  
1.5  
P1  
W
Pin1  
(mm) (mm) Quadrant  
(mm)  
TLV320AIC12KIRHBR  
TLV320AIC12KIRHBT  
RHB  
RHB  
32  
32  
330  
12  
8
8
12 PKGORN  
T2TR-MS  
P
180  
12  
5.3  
5.3  
1.5  
12 PKGORN  
T2TR-MS  
P
TLV320AIC20CPFBR  
TLV320AIC20IPFBR  
TLV320AIC21CPFBR  
TLV320AIC21IPFBR  
TLV320AIC24CPFBR  
TLV320AIC24IPFBR  
TLV320AIC25CPFBR  
TLV320AIC25IPFBR  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
48  
48  
48  
48  
48  
48  
48  
48  
TAI  
TAI  
TAI  
TAI  
TAI  
TAI  
TAI  
TAI  
330  
330  
330  
330  
330  
330  
330  
330  
16  
16  
16  
16  
16  
16  
16  
16  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
9.6  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
12  
12  
12  
12  
12  
12  
12  
12  
16  
16  
16  
16  
16  
16  
16  
16  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
TLV320AIC12KIRHBR  
TLV320AIC12KIRHBT  
TLV320AIC20CPFBR  
TLV320AIC20IPFBR  
TLV320AIC21CPFBR  
TLV320AIC21IPFBR  
TLV320AIC24CPFBR  
TLV320AIC24IPFBR  
RHB  
RHB  
PFB  
PFB  
PFB  
PFB  
PFB  
PFB  
32  
32  
48  
48  
48  
48  
48  
48  
MLA  
MLA  
TAI  
TAI  
TAI  
TAI  
TAI  
TAI  
346.0  
190.0  
341.0  
341.0  
341.0  
341.0  
341.0  
341.0  
346.0  
212.7  
159.0  
159.0  
159.0  
159.0  
159.0  
159.0  
29.0  
31.75  
123.5  
123.5  
123.5  
123.5  
123.5  
123.5  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-May-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
TLV320AIC25CPFBR  
TLV320AIC25IPFBR  
PFB  
PFB  
48  
48  
TAI  
TAI  
341.0  
341.0  
159.0  
159.0  
123.5  
123.5  
Pack Materials-Page 3  
MECHANICAL DATA  
MTQF019A – JANUARY 1995 – REVISED JANUARY 1998  
PFB (S-PQFP-G48)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
0,50  
M
0,08  
36  
25  
37  
24  
48  
13  
0,13 NOM  
1
12  
5,50 TYP  
7,20  
SQ  
Gage Plane  
6,80  
9,20  
SQ  
8,80  
0,25  
0,05 MIN  
0°7°  
1,05  
0,95  
0,75  
0,45  
Seating Plane  
0,08  
1,20 MAX  
4073176/B 10/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
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DSP  
Applications  
Audio  
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dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
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Military  
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Copyright © 2007, Texas Instruments Incorporated  

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