TLV2460AQPWRG4 [TI]

OP-AMP, 1700uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, TSSOP-8;


型号：	TLV2460AQPWRG4
厂家：	TEXAS INSTRUMENTS
描述：	OP-AMP, 1700uV OFFSET-MAX, 5.2MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, TSSOP-8 放大器光电二极管
文件：	总73页 (文件大小：2366K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Device TLV2465A is Obsolete

ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢈ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢃ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢊ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢋ ꢌ

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TLV2460

DBV PACKAGE

(TOP VIEW)

Rail-to-Rail Output Swing

Gain Bandwidth Product . . . 6.4 MHz

80 mA Output Drive Capability

Supply Current . . . 500 µA/channel

Input Offset Voltage . . . 100 µV

Input Noise Voltage . . . 11 nV/√Hz

Slew Rate . . . 1.6 V/µs

DD+

OUT

GND

SHDN

IN−

IN+

Micropower Shutdown Mode

(TLV2460/3/5) . . . 0.3 µA/Channel

Universal Operational Amplifier EVM

Available in Q-Temp Automotive

HighRel Automotive Applications

Configuration Control/Print Support

Qualification to Automotive Standards

description

The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for

portable applications. The input common-mode voltage range extends beyond the supply rails for maximum

dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive

capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail

dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.

The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current,

providing good ac performance with low power consumption. Three members of the family offer a shutdown

terminal, which places the amplifier in an ultralow supply current mode (I

the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with

= 0.3 µA/ch). While in shutdown,

an input noise voltage of 11 nV/√Hz and input offset voltage of 100 µV.

This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first

rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for

high-density circuits. The family is specified over an expanded temperature range (T = −40°C to 125°C) for

use in industrial control and automotive systems, and over the military temperature range

(T = −55°C to 125°C) for use in military systems.

SELECTION GUIDE

GBW SLEW RATE

[MHz] [V/µs]

[V]

/ch

n, 1 kHz

DEVICE

SHUTDOWN

RAIL-RAIL

[µV]

150

360

250

[µA]

550

1000

600

[pA]

1300

[nV/√Hz]

[mA]

TLV246x(A)

TLV277x(A)

TLV247x(A)

TLV245x(A)

TLV225x(A)

TLV226x(A)

2.7−6

2.5−5.5

2.7−6

2.7−8

6.4

5.1

1.6

10.5

1.5

I/O

2.5

500

2.8

I/O

—

0.22

0.2

0.11

0.12

0.55

200

300

—

200

0.71

—

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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ꢑ ꢟ ꢪ ꢢ ꢡꢭ ꢨꢧ ꢥꢦ ꢧꢡ ꢣꢪ ꢬꢞ ꢤꢟ ꢥ ꢥꢡ ꢎꢏ ꢁꢓ ꢔꢖ ꢍ ꢓꢉꢳꢊ ꢉꢊꢇ ꢤ ꢬꢬ ꢪꢤ ꢢ ꢤ ꢣꢩ ꢥꢩꢢ ꢦ ꢤ ꢢ ꢩ ꢥꢩ ꢦꢥꢩ ꢭ

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ꢥ ꢩ ꢦ ꢥꢞ ꢟꢲ ꢡꢠ ꢤ ꢬ ꢬ ꢪꢤ ꢢ ꢤ ꢣ ꢩ ꢥ ꢩ ꢢ ꢦ ꢮ

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ꢨ

ꢨ ꢟꢬ ꢩꢦꢦ ꢡ ꢥꢯꢩ ꢢ ꢰꢞ ꢦꢩ ꢟ ꢡꢥꢩ ꢭꢮ ꢑ ꢟ ꢤꢬ ꢬ ꢡ ꢥꢯꢩ ꢢ ꢪꢢ ꢡ ꢭꢨꢧ ꢥꢦ ꢇ ꢪꢢ ꢡ ꢭꢨꢧ ꢥꢞꢡꢟ

ꢩ

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WWW.TI.COM

Device TLV2465A is Obsolete

ꢀ

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ꢀ

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS

PACKAGED DEVICES

max

†

SMALL OUTLINE

(D)

SOT-23

(DBV)

PLASTIC DIP

(P)

AT 25°C

2000 µV

1500 µV

SYMBOL

TLV2460CD

TLV2461CD

TLV2460CDBV

TLV2461CDBV

VAOC

VAPC

TLV2460CP

TLV2461CP

0°C to 70°C

TLV2460ID

TLV2461ID

TLV2460IDBV

TLV2461IDBV

VAOI

VAPI

TLV2460IP

TLV2461IP

−40°C to 125°C

TLV2460AID

TLV2461AID

—

TLV2460AIP

TLV2461AIP

†

‡

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).

Chip forms are tested at T = 25°C only.

TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS

PACKAGED DEVICES

max

SMALL

OUTLINE

(D)

SMALL

OUTLINE

(PW)

CERAMIC

FLATPACK

(U)

CERAMIC DIP

(JG)

CHIP CARRIER

(FK)

†

AT 25°C

TLV2460QD

TLV2461QD

TLV2460QPW

TLV2461QPW

—

2000 µV

1500 µV

2000 µV

1500 µV

−40°C to 125°C

TLV2460AQD

TLV2461AQD

TLV2460AQPW

TLV2461AQPW

—

TLV2460MJG

TLV2461MJG

TLV2460MU

TLV2461MU

TLV2460MFK

TLV2461MFK

−55°C to 125°C

—

TLV2460AMJG

TLV2461AMJG

TLV2460AMU

TLV2461AMU

TLV2460AMFK

TLV2461AMFK

†

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).

TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS

PACKAGED DEVICES

max

SMALL

OUTLINE

(D)

†

MSOP

(DGK)

MSOP

PLASTIC DIP

(N)

PLASTIC DIP

(P)

†

AT 25°C

SYMBOL

xxTIAAI

xxTIAAJ

SYMBOL

(DGS)

TLV2462CD

TLV2463CD

TLV2462CDGK

—

TLV2462CP

—

0°C to 70°C

2000 µV

1500 µV

TLV2463CDGS xxTIAAK

TLV2463CN

TLV2462ID

TLV2463ID

TLV2462IDGK

—

xxTIAAL

—

TLV2462IP

—

TLV2463IDGS

TLV2463IN

−40°C to

125°C

TLV2462AID

TLV2463AID

—

TLV2462AIP

—

TLV2463AIN

†

‡

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).

Chip forms are tested at T = 25°C only.

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS

PACKAGED DEVICES

max

SMALL

OUTLINE

(D)

SMALL

OUTLINE

(PW)

CERAMIC

DIP

CERAMIC

FLATPACK

(U)

CHIP CAR-

RIER

CERAMIC DIP

(JG)

†

AT 25°C

(J)

(FK)

TLV2462QD

TLV2463QD

TLV2462QPW

TLV2463QPW

—

2000 µV

1500 µV

2000 µV

1500 µV

−40°C to 125°C

TLV2462AQD

TLV2463AQD

TLV2462AQPW

TLV2463AQPW

—

TLV2462MJG

—

TLV2462MU

TLV2462MFK

TLV2463MFK

TLV2463MJ

−55°C to 125°C

—

TLV2462AMJG

—

TLV2462AMU

TLV2462AMFK

TLV2463AMFK

TLV2463AMJ

†

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).

TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS

PACKAGED DEVICES

max

SMALL OUTLINE

(D)

PLASTIC DIP

(N)

TSSOP

(PW)

AT 25°C

2000 µV

1500 µV

TLV2464CD

TLV2465CD

TLV2464CN

TLV2465CN

TLV2464CPW

TLV2465CPW

0°C to 70°C

TLV2464ID

TLV2465ID

TLV2464IN

TLV2465IN

TLV2464IPW

TLV2465IPW

−40°C to 125°C

TLV2464AID

TLV2465AID

TLV2464AIN

TLV2465AIN

TLV2464AIPW

TLV2465AIPW

†

‡

This package is available taped and reeled. To order this packaging option, add an R suffix to the part

number(e.g., TLV2464CDR).

Chip forms are tested at T = 25°C only.

TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS

PACKAGED DEVICES

SMALL

max

SMALL

OUTLINE

(D)

CERAMIC DIP

CHIP CARRIER

(FK)

†

AT 25°C

OUTLINE

(PW)

(J)

TLV2464QD

TLV2465QD

TLV2464QPW

TLV2465QPW

—

2000 µV

1500 µV

2000 µV

1500 µV

-40°C to 125°C

TLV2464AQD

TLV2465AQD

TLV2464AQPW

TLV2465AQPW

—

TLV2464MJ

TLV2465MJ

TLV2464MFK

TLV2465MFK

−55°C to 125°C

—

TLV2464AMJ

TLV2465AMJ

TLV2464AMFK

TLV2465AMFK

†

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number

(e.g., TLV2464QDR).

WWW.TI.COM

Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

(1)

TLV246x PACKAGE PINOUTS

TLV2460

DBV PACKAGE

(TOP VIEW)

TLV2460

D, P, JG, OR PW PACKAGE

(TOP VIEW)

TLV2461

DBV PACKAGE

(TOP VIEW)

DD+

OUT

GND

OUT

GND

SHDN

DD+

IN−

IN+

SHDN

IN−

OUT

GND

IN−

IN+

TLV2463

TLV2461

TLV2462

DGS PACKAGE

(TOP VIEW)

D, P, JG, OR PW PACKAGE

(TOP VIEW)

D, DGK, P, JG, OR PW PACKAGE

(TOP VIEW)

1OUT

1IN−

1IN+

GND

2OUT

2IN−

2IN+

IN−

1OUT

1IN−

1IN+

GND

2OUT

2IN−

2IN+

IN+

OUT

GND

1SHDN

2SHDN

TLV2463

D, N, J, OR PW PACKAGE

TLV2465

D, N, PWP, J, OR PW PACKAGE

TLV2464

D, N, PWP, J, OR PW PACKAGE

(TOP VIEW)

1OUT

1IN−

1IN+

GND

1OUT

1IN−

1IN+

4OUT

4IN−

1OUT

1IN−

1IN+

4OUT

4IN−

4IN+

GND

3IN+

3IN−

3OUT

2OUT

2IN−

2IN+

4IN+

GND

2IN+

2IN−

3IN+

2IN+

2IN−

1SHDN

2SHDN

3IN−

2OUT

3OUT

3/4SHDN

2OUT

1/2SHDN

NC − No internal connection

(1) SOT−23 may or may not be indicated

TYPICAL PIN 1 INDICATORS

Pin 1

Printed or

Molded Dot

Pin 1

Stripe

Bevel Edges

Molded ”U” Shape

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

(1)

TLV246x PACKAGE PINOUTS (continued)

TLV2461

U PACKAGE

(TOP VIEW)

TLV2462

U PACKAGE

(TOP VIEW)

TLV2460

U PACKAGE

(TOP VIEW)

IN−

IN+

GND

OUTPUT

1OUT

1IN−

1IN+

GND

2OUT

2IN−

2IN+

IN−

IN+

GND

SHDN

DD+

OUTPUT

TLV2460

FK PACKAGE

(TOP VIEW)

TLV2461

FK PACKAGE

(TOP VIEW)

TLV2462

FK PACKAGE

(TOP VIEW)

20 19

IN−

IN+

1IN+

2IN−

IN−

IN+

GND

2IN+

OUT

10 11 12 13

TLV2463

FK PACKAGE

(TOP VIEW)

TLV2465

FK PACKAGE

(TOP VIEW)

TLV2464

FK PACKAGE

(TOP VIEW)

20 19

1IN+

4IN+

1IN+

4IN+

1IN+

2IN−

GND

DD+

GND

2IN+

DD+

2IN+

2IN−

3IN+

3IN−

2IN+

3IN+

10 11 12 13

NC − No internal connection

(1) SOT−23 may or may not be indicated

WWW.TI.COM

Device TLV2465A is Obsolete

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ꢂ

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ꢌ

ꢃ

ꢒ

ꢁ

ꢄ

ꢅ

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ꢈ

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ꢇ

ꢑ

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ꢁ

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ꢀ

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ꢂ

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ꢄ

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ꢗ

ꢄ

ꢙ

ꢇ

ꢑ

ꢀ

ꢘ

ꢁ

ꢀ

ꢂ

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ꢃ

ꢘ

ꢄ

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ꢀ

ꢊ

ꢇ

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ꢁꢂ

ꢃ

ꢄ

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ꢌ

ꢁ

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ꢁ

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ꢌ

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage, V

Differential input voltage, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.2 V to V

+ 0.2 V

200 mA

175 mA

Input current, I (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total input current, I (into V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA

DD+

Total output current, I (out of GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA

Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table

Operating free-air temperature range, T : C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

I and Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C

M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C

Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values, except differential voltages, are with respect to GND.

DISSIPATION RATING TABLE FOR C and I SUFFIX

≤ 25°C T < 125°C

PACKAGE

POWER RATING

(°C/W)

D (8)

38.3

176

710 mW

142 mW

D (14)

D (16)

DBV (5)

DBV (6)

DGK

26.9

25.7

122.6

114.7

324.1

294.3

259.9

1022 mW

1090 mW

385 mW

425 mW

481 mW

204.4 mW

218 mW

77.1 mW

84.9 mW

96.2 mW

54.2

DGS

N (14, 16)

P (8)

54.1

257.7

485 mW

1600 mW

1200 mW

720 mW

774 mW

97 mW

320.5 mW

240.4 mW

144 mW

104

PW (14)

PW (16)

29.3

28.7

173.6

161.4

154.9 mW

NOTE: Thermal resistances are not production tested and are for informational

purposes only.

DISSIPATION RATING TABLE FOR Q and M SUFFIX

≤ 25°C

DERATING FACTOR

‡

= 70°C

= 85°C

T = 125°C

POWER RATING

PACKAGE

POWER RATING

ABOVE T = 25°C

POWER RATING

1375 mW

11.0 mW/°C

8.4 mW/°C

5.4 mW/°C

880 mW

715 mW

275 mW

1050 mW

672 mW

546 mW

210 mW

675 mW

432 mW

350 mW

135 mW

‡

This is the inverse of the traditional junction-to-ambient thermal resistance (RΘ ). Thermal resistances are not production tested and are for

informational purposes only.

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Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

recommended operating conditions

MIN

2.7

1.35

MAX

UNIT

Single supply

Split supply

Supply voltage, V

Common-mode input voltage range, V

ICR

C-suffix

Operating free-air temperature, T

I-suffix and Q-suffix

M-suffix

−40

−55

125

°C

‡

Shutdown on/off voltage level

0.7

‡

Relative to voltage on the GND terminal of the device.

electrical characteristics at specified free-air temperature, V

= 3 V (unless otherwise noted)

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

2000

2200

1500

1700

UNIT

25°C

Full range

25°C

500

= 3 V,

Input offset voltage

µV

= 1.5 V,

= 50 Ω

500

TLV246xA

TLV246xC

Full range

Temperature coefficient of input offset voltage

Input offset current

µV/°C

VIO

25°C

2.8

Full range

= 3 V,

TLV246xI/Q/M Full range

= 1.5 V,

= 50 Ω

25°C

4.4

TLV246xC

Full range

Input bias current

TLV246xI/Q/M Full range

25°C

Full range

25°C

2.9

2.7

0.1

0.3

= −2.5 mA

= −10 mA

= 1.5 V,

2.8

2.5

High-level output voltage

Full range

25°C

= 2.5 mA

= 10 mA

Full range

25°C

0.2

0.5

Low-level output voltage

= 1.5 V,

Full range

25°C

Sourcing

Sinking

Full range

25°C

Short-circuit output current

Output current

Full range

25°C

Measured 1 V from rail

= 10 kΩ,

25°C

105

Large-signal differential voltage

amplification

= 1 V

O(PP)

Full range

Ω

Differential input resistance

25°C

i(d)

†

Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix.

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Device TLV2465A is Obsolete

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ꢍ

ꢃ

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ꢃ

ꢌ

ꢚ

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ꢀ

ꢁ

ꢂ

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ꢃ

ꢄ

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ꢅ

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ꢚ

ꢉ

ꢌ

ꢛ

ꢇ

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ꢀ

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ꢀ

ꢁ

ꢂ

ꢔ

ꢑ

ꢃ

ꢄ

ꢘ

ꢒ

ꢅ

ꢀ

ꢗ

ꢄ

ꢙ

ꢇ

ꢑ

ꢀ

ꢘ

ꢁ

ꢀ

ꢂ

ꢔ

ꢃ

ꢘ

ꢄ

ꢅ

ꢀ

ꢊ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢋ

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ꢍ

ꢌ

ꢁ

ꢐ

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ꢁ

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ꢌ

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ꢔꢁ

ꢏ

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ꢛ

ꢜ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

electrical characteristics at specified free-air temperature, V

(continued)

= 3 V (unless otherwise noted)

†

PARAMETER

TEST CONDITIONS

f = 10 kHz

f = 100 kHz,

= 0 to 3 V,

MIN

TYP

MAX

UNIT

Common-mode input

capacitance

25°C

i(c)

Ω

Closed-loop output impedance

= 10

25°C

ICR

TLV246xC

Full range

CMRR

Common-mode rejection ratio

= 50 Ω

TLV246xI/Q/M Full range

25°C

Full range

25°C

= 2.7 V to 6 V,

= V

/2,

No load

Supply voltage rejection ratio

SVR

(∆V

/∆V )

= 3 V to 5 V,

= V

/2,

No load

Full range

25°C

0.5 0.575

Supply current (per channels)

= 1.5 V,

No load

Full range

25°C

0.9

0.3

2.5

Supply current in shutdown

(TLV2460, TLV2463, TLV2465)

SHDN < 0.7 V,

Per channel in shutdown

µA

DD(SHDN)

Full range

†

Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix.

operating characteristics at specified free-air temperature, V

= 3 V (unless otherwise noted)

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

25°C

0.9

1.6

= 0.8 V,

= 160 pF,

O(PP)

= 10 kΩ

Slew rate at unity gain

V/µs

Full

range

0.8

f = 100 Hz

f = 1 kHz

25°C

nV/√Hz

pA/√Hz

Equivalent input noise voltage

Equivalent input noise current

0.13

= 1

0.006%

0.02%

0.08%

7.6

Total harmonic distortion plus

noise

= 2 V,

= 10 kΩ, f = 1 kHz

O(PP)

= 10

= 100

THD + N

25°C

Both channels

Amplifier turnon time

= 1, R = 10 kΩ

µs

Channel 1 only,

Channel 2 on

(on)

7.65

333

328

Both channels

Channel 1 only,

Channel 2 on

(off)

Amplifier turnoff time

= 1, R = 10 kΩ

25°C

Channel 2 only,

Channel 1 on

329

5.2

= 10 kΩ,

Gain-bandwidth product

MHz

f = 10 kHz, C = 160 pF

= 2 V,

0.1%

1.47

1.78

1.77

1.98

(STEP)PP

= −1,

= 10 pF,

0.01%

0.1%

= 10 kΩ

Settling time

25°C

µs

= 2 V,

(STEP)PP

= −1, C = 56 pF,

0.01%

= 10 kΩ

Phase margin at unity gain

Gain margin

25°C

44°

= 10 kΩ,

= 160 pF

†

Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix.

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ

ꢔ

ꢕ

ꢖ

ꢌꢀ

ꢏ

ꢑ

ꢗ

ꢌ

ꢁ

ꢌ

ꢎ

ꢔ

ꢁ

ꢏ

ꢍ

ꢏ

ꢕ

ꢖ

ꢚ

ꢒ

ꢏ

ꢀ

ꢛ

ꢚ

ꢛ

ꢘ

ꢀ

ꢜ

ꢑ

ꢒ

ꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

electrical characteristics at specified free-air temperature, V

= 5 V (unless otherwise noted)

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

2000

2200

1500

1700

UNIT

25°C

Full range

25°C

500

= 5 V,

Input offset voltage

µV

500

= 2.5,

= 2.5 V,

= 50 Ω

TLV246xA

Full range

Temperature coefficient of input off-

set voltage

25°C

µV/°C

VIO

25°C

0.3

TLV246xC

Full range

Input offset current

Input bias current

= 5 V,

TLV246xI/Q/M Full range

= 2.5 V,

= 50 Ω

25°C

1.3

TLV246xC

Full range

TLV246xI/Q/M Full range

25°C

Full range

25°C

4.9

4.8

0.1

0.2

145

100

= −2.5 mA

= −10 mA

= 2.5 V,

4.8

4.7

High-level output voltage

Low-level output voltage

Full range

25°C

= 2.5 mA

= 10 mA

Full range

25°C

0.2

0.3

= 2.5 V,

Full range

25°C

Sourcing

Full range

25°C

Short-circuit output current

Output current

Sinking

Full range

25°C

Measured at 1 V from rail

25°C

109

Large-signal differential voltage

amplification

= 2.5 V,

= 1 V to 4 V

= 10 kΩ,

Full range

25°C

Differential input resistance

Ω

i(d)

Common-mode input capacitance

Closed-loop output impedance

f = 10 kHz

25°C

i(c)

f = 100 kHz,

= 10

25°C

= 0 V to 5 V,

= 50 Ω

ICR

TLV246xC

Full range

CMRR

Common-mode rejection ratio

TLV246xI/Q/M Full range

25°C

Full range

25°C

= 2.7 V to 6 V,

= V

/2,

µA

No load

Supply voltage rejection ratio

SVR

(∆V

/∆V )

= 3 V to 5 V,

= V

/2,

No load

Full range

25°C

0.55

0.65

Supply current (per channel)

= 2.5 V,

No load,

Full range

25°C

Supply current in shutdown

(TLV2460, TLV2463, TLV2465)

SHDN < 0.7 V, Per channels in

shutdown

DD(SHDN)

Full range

†

Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix.

WWW.TI.COM

Device TLV2465A is Obsolete

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ꢄ

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ꢖ

ꢃ

ꢌ

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ꢀ

ꢁ

ꢂ

ꢑ

ꢀ

ꢃ

ꢄ

ꢓ

ꢅ

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ꢚ

ꢉ

ꢌ

ꢛ

ꢇ

ꢏ

ꢘ

ꢀ

ꢁ

ꢀ

ꢁ

ꢂ

ꢔ

ꢑ

ꢃ

ꢄ

ꢘ

ꢒ

ꢅ

ꢀ

ꢗ

ꢄ

ꢙ

ꢇ

ꢑ

ꢀ

ꢘ

ꢁ

ꢀ

ꢂ

ꢔ

ꢃ

ꢘ

ꢄ

ꢅ

ꢀ

ꢊ

ꢇ

ꢀ

ꢁꢂ

ꢃ

ꢄ

ꢅ

ꢋ

ꢌ

ꢍ

ꢌ

ꢁ

ꢐ

ꢏ

ꢁ

ꢓ

ꢀ

ꢏ

ꢗ

ꢑ

ꢔ

ꢌ

ꢀ

ꢏ

ꢑ

ꢗ

ꢌ

ꢔ

ꢁ

ꢏ

ꢕ

ꢒ

ꢏ

ꢛ

ꢜ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

operating characteristics at specified free-air temperature, V

= 5 V (unless otherwise noted)

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

25°C

0.9

1.6

= 2 V,

= 160 pF,

O(PP)

= 10 kΩ

Slew rate at unity gain

V/µs

Full

range

0.8

f = 100 Hz

f = 1 kHz

25°C

nV/√Hz

pA/√Hz

Equivalent input noise voltage

Equivalent input noise current

f = 100 Hz

0.13

= 1

0.004%

0.01%

0.04%

7.6

= 4 V,

O(PP)

= 10 kΩ,

= 10

= 100

THD + N Total harmonic distortion plus noise

25°C

f = 10 kHz

Both channels

Channel 1 only,

Channel 2 on

7.65

Amplifier turnon time

= 1, R = 10 kΩ

25°C

µs

(on)

(off)

Channel 2 only,

Channel 1 on

7.25

333

328

Both channels

Channel 1 only,

Channel 2 on

Amplifier turnoff time

= 1, R = 10 kΩ

25°C

Channel 2 only,

Channel 1 on

329

f = 10 kHz,

= 160 pF

R = 10 kΩ,

Gain-bandwidth product

6.4

1.53

1.83

3.13

3.33

MHz

= 2 V,

(STEP)PP

0.1%

= −1,

= 10 pF,

= 10 kΩ

0.01%

0.1%

Settling time

25°C

µs

(STEP)PP

= −1,

= 56 pF,

= 10 kΩ

0.01%

Phase margin at unity gain

Gain margin

25°C

45°

= 10 kΩ,

C = 160 pF

†

Full range is 0°C to 70°C for the C suffix, −40°C to 125°C for the I and Q suffixes, and −55°C to 125°C for the M suffix.

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

Input offset voltage

Input bias current

Input offset current

vs Common-mode input voltage

vs Free-air temperature

1, 2

3, 4

5, 6

7, 8

9, 10

11, 12

vs Free-air temperature

vs High-level output current

vs Low-level output current

vs Frequency

High-level output voltage

Low-level output voltage

Peak-to-peak output voltage

Open-loop gain

O(PP)

vs Frequency

Phase

vs Frequency

Differential voltage amplification

Capacitive load

vs Load resistance

vs Frequency

Output impedance

15, 16

CMRR

Common-mode rejection ratio

Supply-voltage rejection ratio

vs Frequency

18, 19

SVR

vs Supply voltage

vs Free-air temperature

Supply current

Amplifier turnon characteristics

Amplifier turnoff characteristics

Supply current turnon

Supply current turnoff

Shutdown supply current

Slew rate

vs Free-air temperature

vs Supply voltage

vs Frequency

28, 29

30, 31

Equivalent input noise voltage

vs Common-mode input voltage

THD

Total harmonic distortion

vs Frequency

32, 33

34, 35

11, 12

THD+N

Total harmonic distortion plus noise

vs Peak-to-peak signal amplitude

vs Frequency

Phase margin

vs Load capacitance

vs Free-air temperature

vs Supply voltage

Gain bandwidth product

vs Free-air temperature

Large signal follower

Small signal follower

Inverting large signal

Inverting small signal

40, 41

42, 43

44, 45

46, 47

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Device TLV2465A is Obsolete

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ꢑ

ꢀ

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ꢁ

ꢂ

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ꢍ

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ꢖ

ꢃ

ꢌ

ꢚ

ꢇ

ꢀ

ꢁ

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ꢃ

ꢄ

ꢓ

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ꢀ

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

INPUT OFFSET VOLTAGE

COMMON-MODE INPUT VOLTAGE

INPUT OFFSET VOLTAGE

COMMON-MODE INPUT VOLTAGE

0.8

0.6

0.4

0.8

0.6

0.4

= 3 V

= 25°C

= 5 V

= 25°C

0.2

−0.2

−0.4

−0.6

−0.2

−0.4

−0.6

−0.8

−1

−0.8

−1

0.5

1.5

2.5

ICR

− Common-Mode Input Voltage − V

ICR

− Common-Mode Input Voltage − V

Figure 1

Figure 2

INPUT BIAS AND INPUT OFFSET CURRENT

FREE-AIR TEMPERATURE

4.5

= 3 V

V = 1.5 V

= 5 V

V = 2.5 V

3.5

2.5

1.5

0.5

−0.5

−1

−55 −35 −15

85 105 125

−55 −35 −15

85 105 125

− Free-Air Temperature − °C

Figure 3

Figure 4

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

= 3 V

= 5 V

4.5

2.5

= −55°C

T = −55°C

3.5

1.5

= 125°C

T = 125°C

2.5

= 85°C

= 25°C

1.5

= −40°C

T = −40°C

0.5

20 40 60 80 100 120 140 160 180 200

− High-Level Output Current − mA

Figure 5

Figure 6

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

4.5

= 3 V

= 5 V

2.5

= −40°C

3.5

1.5

= 25°C

= 85°C

= 25°C

= 85°C

2.5

= 125°C

1.5

0.5

= −55°C

0.5

= −55°C

100 120 140 160

− Low-Level Output Current − mA

Figure 7

Figure 8

WWW.TI.COM

Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

PEAK-TO-PEAK OUTPUT VOLTAGE

FREQUENCY

2.5

5.5

= 3 V

= −10

= 5 V

A = −10

THD = 1%

= 10 kΩ

THD = 1%

R = 10 kΩ

4.5

3.5

1.5

2.5

1.5

0.5

10k

100k

10M

10k

100k

10M

f − Frequency − Hz

Figure 9

Figure 10

OPEN-LOOP GAIN AND PHASE

FREQUENCY

100

40°

= 1.5 V

= 10 kΩ

= 0

20°

0°

= 25°C

−20°

−40°

−60°

−80°

−100°

Phase

−120°

−140°

−160°

−180°

−200°

−10

−20

100

10k

100k

10M

f − Frequency − Hz

Figure 11

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

OPEN-LOOP GAIN AND PHASE

FREQUENCY

100

40°

2.5 V

20°

0°

= 10 kΩ

= 0

= 25°C

−20°

−40°

−60°

−80°

−100°

Phase

−120°

−140°

−160°

−180°

−200°

−10

−20

100

10k

100k

10M

f − Frequency − Hz

Figure 12

DIFFERENTIAL VOLTAGE AMPLIFICATION

CAPACITIVE LOAD

LOAD RESISTANCE

180

160

140

120

100

10000

1000

100

= 25°C

Phase Margin < 30°

= 2.5 V

= 1.5 V

Phase Margin > 30°

= 5 V

Phase Margin = 30°

= 25°C

100

10k

100k

100

10k

− Load Resistance − Ω

R − Load Resistance − Ω

Figure 13

Figure 14

WWW.TI.COM

Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

OUTPUT IMPEDANCE

FREQUENCY

1000

100

1000

100

= 1.5 V

= 25°C

= 2.5 V

= 25°C

= 100

= 10

= 1

0.1

= 1

0.01

100

10k

100k

10M

100

10k

100k

10M

f − Frequency − Hz

Figure 15

Figure 16

COMMON-MODE REJECTION RATIO

FREQUENCY

= 5 V

= 2.5 V

= 3 V

= 1.5 V

100

10k

100k

10M

f − Frequency − Hz

Figure 17

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

SUPPLY-VOLTAGE REJECTION RATIO

FREQUENCY

110

100

SVR

1.5 V

2.5 V

= 25°C

−k

SVR

−k

SVR

−k

SVR

−k

SVR

100

10k

100k

10M

100

10k

100k

10M

f − Frequency − Hz

Figure 18

Figure 19

SUPPLY CURRENT

SUPPLY VOLTAGE

SUPPLY CURRENT

FREE-AIR TEMPERATURE

0.8

0.80

0.75

0.70

0.65

0.60

0.55

0.50

0.45

0.40

= 125°C

= 85°C

0.7

0.6

= 5 V

V = 2.5 V

0.5

0.40

0.30

= 3 V

V = 1.5 V

= 25°C

= −55°C

= −40°C

0.20

0.10

0.35

0.30

2.5

3.5

4.5

5.5

−55 −35 −15

85 105 125

− Supply Voltage − V

− Free-Air Temperature − °C

Figure 20

Figure 21

WWW.TI.COM

Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

AMPLIFIER WITH A SHUTDOWN PULSE

TURNOFF CHARACTERISTICS

TURNON CHARACTERISTICS

= 5 V

= 10 kΩ

= 1

Shutdown Pin

= 25°C

Amplifier Output

= 5 V

= 10 kΩ

= 1

= 25°C

−5

−3

−1

−5

−3

−1

t − Time − µs

Figure 22

Figure 23

SUPPLY CURRENT WITH A SHUTDOWN PULSE

TURNON CHARACTERISTICS

5.5

Shutdown Pin

0.8

4.5

3.5

2.5

1.5

0.6

0.4

Supply Current

0.2

= 5 V

V = 2.5 V

0.5

= 1

= 25°C

−0.2

−0.5

−0.4

−0.2

0.2

0.4

0.6

t − Time − µs

Figure 24

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

TURNOFF SUPPLY CURRENT

WITH A SHUTDOWN PULSE

5.5

4.5

= 5 V

V = 2.5 V

Shutdown Pin

Supply Current

= 1

= 25°C

0.8

0.6

0.4

3.5

2.5

0.2

1.5

0.5

−0.2

−0.5

0.6

−0.4

−0.2

0.2

0.4

t − Time − µs

Figure 25

SHUTDOWN SUPPLY CURRENT

SLEW RATE

SUPPLY VOLTAGE

FREE-AIR TEMPERATURE

2.5

1.8

1.75

1.7

1.65

1.6

= 5 V

V = 2.5 V

SR+

1.5

1.55

SR−

= 3 V

1.5

1.45

1.4

0.5

V = 1.5 V

= 2 V

= 160 pF

= 1

= 10 kΩ

= 25°C

O(PP)

−0.5

−1

1.35

1.3

−55 −35 −15

85 105 125

2.5

3.5

4.5

5.5

− Free-Air Temperature − °C

− Supply Voltage − V

Figure 26

Figure 27

WWW.TI.COM

Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

EQUIVALENT INPUT NOISE VOLTAGE

FREQUENCY

= 3 V

= 10

= 5 V

A = 10

V = 1.5 V

V = 2.5 V

= 25°C

T = 25°C

100

10k

100k

100

10k

100k

f − Frequency − Hz

Figure 28

Figure 29

EQUIVALENT INPUT NOISE VOLTAGE

COMMON-MODE INPUT VOLTAGE

EQUIVALENT INPUT NOISE VOLTAGE

COMMON-MODE INPUT VOLTAGE

= 3 V

= 10

= 5 V

A = 10

f = 1 kHz

= 25°C

0.5

1.5

2.5

ICR

− Common-Mode Input Voltage − V

ICR

− Common-Mode Input Voltage − V

Figure 30

Figure 31

WWW.TI.COM

Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

TOTAL HARMONIC DISTORTION

FREQUENCY

0.5

0.1

1.5 V

= 2 V

O(PP)

2.5 V

= 4 V

O(PP)

= 10 kΩ

R = 10 kΩ

= 100

= 10

= 1

0.1

= 100

= 10

= 1

0.010

0.001

0.010

0.001

100

10k

100k

100

10k

100k

f − Frequency − Hz

Figure 32

Figure 33

TOTAL HARMONIC DISTORTION PLUS NOISE

PEAK-TO-PEAK SIGNAL AMPLITUDE

= 250 Ω

= 3 V

= 1

= 250 Ω

TA = 25°C

= 2 kΩ

0.1

= 10 kΩ

0.010

0.001

0.010

0.001

= 100 kΩ

= 5 V

= 1

= 25°C

1.2 1.4 1.6 1.8

2.2 2.4 2.6 2.8

3.2

4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9

Peak-to-Peak Signal Amplitude − V

Figure 34

Figure 35

WWW.TI.COM

Device TLV2465A is Obsolete

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ꢏ

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ꢜ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

PHASE MARGIN

LOAD CAPACITANCE

PHASE MARGIN

FREE-AIR TEMPERATURE

2.5 V

= 10 kΩ

= 160 pF

= 25°C

= 10 kΩ

= 50 Ω

null

2.5 V

1.5 V

= 20 Ω

null

= 0 Ω

null

100

10k

100k

−55 −35 −15

85 105 125

− Load Capacitance − pF

− Free-Air Temperature − °C

Figure 36

Figure 37

GAIN BANDWIDTH PRODUCT

FREE-AIR TEMPERATURE

SUPPLY VOLTAGE

= 160 pF

= 10 kΩ

= 160 pF

4.75

f = 10 kHz

4.75

4.5

4.25

= 25°C

2.5 V

4.5

4.25

3.75

3.5

= 1.5 V

3.75

3.5

3.25

2.5

3.5

4.5

5.5

−55 −35 −15

85 105 125

− Supply Voltage − V

− Free-Air Temperature − °C

Figure 38

Figure 39

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Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

LARGE SIGNAL FOLLOWER

2.2

3.7

3.3

Input

1.8

1.6

1.4

1.2

2.9

2.5

2.1

Output

= 5 V

I(PP)

= 3 V

I(PP)

Input

= 2 V

V = 2.5 V

= 1 V

V = 1.5 V

= 10 kΩ

= 160 pF

= 1

Output

= 10 kΩ

= 160 pF

= 1

1.7

1.3

= 25°C

0.8

−2

10 12 14 16 18

−2

10 12 14 16 18

t − Time − µs

Figure 40

Figure 41

SMALL SIGNAL FOLLOWER

1.6

2.6

2.55

2.5

1.55

1.5

Input

Output

1.45

2.45

2.4

= 3 V

= 100 mV

= 5 V

= 100 mV

I(PP)

= 160 pF

= 1

= 25°C

= 160 pF

= 1

= 25°C

V = 1.5 V

V = 2.5 V

= 10 kΩ

R = 10 kΩ

1.4

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

t − Time − µs

Figure 42

Figure 43

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ꢅ

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ꢗ

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ꢀ

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ꢀ

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ꢄ

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ꢊ

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

TYPICAL CHARACTERISTICS

INVERTING LARGE SIGNAL

Input

2.3

Input

2.1

1.9

1.7

1.5

1.3

1.1

0.9

3.5

= 3 V

= 1 V

= 5 V

= 2 V

I(PP)

V = 1.5 V

V = 2.5 V

= 10 kΩ

= 160 pF

= −1

= 10 kΩ

= 160 pF

= −1

2.5

= 25°C

Output

1.5

0.7

0.5

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

t − Time − µs

Figure 44

Figure 45

INVERTING SMALL SIGNAL

1.6

1.55

1.5

2.6

Input

2.55

2.5

= 3 V

I(PP)

= 5 V

I(PP)

= 100 mV

V = 1.5 V

= 100 mV

V = 2.5 V

= 10 kΩ

= 160 pF

= −1

= 10 kΩ

= 160 pF

= −1

= 25°C

1.45

2.45

2.4

Output

1.4

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

−0.2

0.2 0.4 0.6 0.8

1.2 1.4 1.6 1.8

t − Time − µs

Figure 46

Figure 47

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ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

PARAMETER MEASUREMENT INFORMATION

null

Figure 48

APPLICATION INFORMATION

driving a capacitive load

When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the

device’s phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater

than 10 pF, it is recommended that a resistor be placed in series (R

) with the output of the amplifier, as

NULL

shown in Figure 49. A minimum value of 20 Ω should work well for most applications.

NULL

Input

Output

LOAD

Figure 49. Driving a Capacitive Load

offset voltage

The output offset voltage, (V ) is the sum of the input offset voltage (V ) and both input bias currents (I ) times

the corresponding gains. The following schematic and formula can be used to calculate the output offset

voltage:

IB−

−

IB+

+ V

1 ) ǒ Ǔ " I

ǒ Ǔ ǒ Ǔ

IB)

IB–

Figure 50. Output Offset Voltage Model

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ꢃ

ꢌ

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ꢒ

ꢅ

ꢀ

ꢗ

ꢄ

ꢙ

ꢇ

ꢑ

ꢀ

ꢘ

ꢁ

ꢀ

ꢂ

ꢔ

ꢃ

ꢘ

ꢄ

ꢅ

ꢀ

ꢊ

ꢇ

ꢀ

ꢁꢂ

ꢃ

ꢄ

ꢅ

ꢋ

ꢌ

ꢍ

ꢌ

ꢁ

ꢐ

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ꢁ

ꢓ

ꢀ

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ꢔ

ꢌ

ꢀ

ꢏ

ꢑ

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ꢌ

ꢔꢁ

ꢏ

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ꢏ

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ꢜ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

APPLICATION INFORMATION

general configurations

When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often

required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier

(see Figure 51).

−

–3dB

2pR1C1

1 )

1 ) sR1C1

Figure 51. Single-Pole Low-Pass Filter

If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this

task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth.

Failure to do this can result in phase shift of the amplifier.

R1 = R2 = R

C1 = C2 = C

Q = Peaking Factor

(Butterworth Q = 0.707)

–3dB

2pRC

2 −

)

(

Figure 52. 2-Pole Low-Pass Sallen-Key Filter

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Device TLV2465A is Obsolete

ꢍꢌꢎ ꢏꢁꢐ ꢑ ꢍ ꢁ ꢑꢒꢓꢔꢑ ꢒ ꢕꢖ ꢖꢌꢏ ꢁ ꢓꢀꢑ ꢓꢖꢌꢏ ꢁ ꢏꢗ ꢔꢘꢀꢙ ꢑ ꢘ ꢀꢔ ꢘꢀ

ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

APPLICATION INFORMATION

shutdown function

Three members of the TLV246x family (TLV2460/3/5) have a shutdown terminal for conserving battery life in

portable applications. When the shutdown terminal is tied low, the supply current is reduced to 0.3 µA/channel,

the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the

shutdown terminal can either be left floating or pulled high. When the shutdown terminal is left floating, care

should be taken to ensure that parasitic leakage current at the shutdown terminal does not inadvertently place

the operational amplifier into shutdown. The shutdown terminal threshold is always referenced to V /2.

Therefore, when operating the device with split supply voltages (e.g. 2.5 V), the shutdown terminal needs to

be pulled to V − (not GND) to disable the operational amplifier.

The amplifier’s output with a shutdown pulse is shown in Figures 22, 23, 24, and 25. The amplifier is powered

with a single 5-V supply and configured as a noninverting configuration with a gain of 5. The amplifier turnon

and turnoff times are measured from the 50% point of the shutdown pulse to the 50% point of the output

waveform. The times for the single, dual, and quad are listed in the data tables.

circuit layout considerations

To achieve the levels of high performance of the TLV246x, follow proper printed-circuit board design techniques.

A general set of guidelines is given in the following.

Ground planes − It is highly recommended that a ground plane be used on the board to provide all

components with a low inductive ground connection. However, in the areas of the amplifier inputs and

output, the ground plane can be removed to minimize the stray capacitance.

Proper power supply decoupling − Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic

capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers

depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal

of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply

terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less

effective. The designer should strive for distances of less than 0.1 inches between the device power

terminals and the ceramic capacitors.

Sockets − Sockets can be used but are not recommended. The additional lead inductance in the socket pins

will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board

is the best implementation.

Short trace runs/compact part placements − Optimum high performance is achieved when stray series

inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,

thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of

the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at

the input of the amplifier.

Surface-mount passive components − Using surface-mount passive components is recommended for high

performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of

surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small

size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray

inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be

kept as short as possible.

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Device TLV2465A is Obsolete

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SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

APPLICATION INFORMATION

general power dissipation considerations

For a given θ , the maximum power dissipation is shown in Figure 53 and is calculated by the following formula:

–T

MAX

ǒ Ǔ

Where:

= Maximum power dissipation of THS246x IC (watts)

= Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (°C)

MAX

= θ + θ

JC CA

= Thermal coefficient from junction to case

= Thermal coefficient from case to ambient air (°C/W)

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

= 150°C

PDIP Package

Low-K Test PCB

1.75

= 104°C/W

1.5

1.25

MSOP Package

Low-K Test PCB

SOIC Package

Low-K Test PCB

= 260°C/W

= 176°C/W

0.75

0.5

SOT-23 Package

Low-K Test PCB

0.25

= 324°C/W

−55−40 −25 −10

20 35 50 65 80 95 110 125

− Free-Air Temperature − °C

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 53. Maximum Power Dissipation vs Free-Air Temperature

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ꢑ ꢔꢕꢖ ꢌꢀ ꢏꢑ ꢗꢌꢁ ꢌꢎ ꢔꢁ ꢏꢍ ꢏꢕ ꢖꢚ ꢒ ꢏꢀ ꢛ ꢚꢛꢘ ꢀꢜ ꢑ ꢒꢗ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

APPLICATION INFORMATION

macromodel information

Macromodel information provided was derived using Microsim Parts Release 8, the model generation

software used with Microsim PSpice. The Boyle macromodel (see Note 2) and subcircuit in Figure 54 are

generated using the TLV246x typical electrical and operating characteristics at T = 25°C. Using this

information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most

cases):

Maximum positive output voltage swing

Maximum negative output voltage swing

Slew rate

Unity-gain frequency

Common-mode rejection ratio

Phase margin

Quiescent power dissipation

Input bias current

DC output resistance

AC output resistance

Short-circuit output current limit

Open-loop voltage amplification

NOTE 2: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Intergrated Circuit Operational Amplifiers”, IEEE

Journal of Solid-State Circuits, SC-9, 353 (1974).

EGND

−

RO2

DD+

−

VLIM

RSS

ISS

CSS

−

GCM

IN −

IN+

RO1

OUT

DLN

−

RD1

RD2

DLP

VLP

VLN

HLIM

−

GND

.SUBCKT TLV246X 1 2 3 4 5

RD1

RD2

R01

R02

2.8964E3

5.6000

2.46034E−12

10.0000E−12

CSS

443.21E−15

6.2000

8.9127

10.610E6

DC 0

DC .7836

DC .7436

DC 0

DC 117

RSS

DLP

DLN

VLIM

VLP

VLN

EGND

POLY (2) (3,0) (4,0) 0 .5 .5

POLY (5) VB VC VE VLP

+ VLN 0 21.600E6 −1E3 1E3 22E6 −22E6

12 345.26E−6

99 15.4226E−9

.MODEL DX D (IS=800.00E−18)

GCM

ISS

HLIM

.MODEL DY D (IS=800.00E−18 Rs = 1m Cjo=10p)

DC 18.850E−6

VLIM 1K

10 JX1

10 JX2

100.00E3

.MODEL JX1 NJF (IS=1.0000E−12 BETA=6.3239E−3

+ VTO=−1)

.MODEL JX2 NJF (IS=1.0000E−12 BETA=6.3239E−3

+ VTO=−1)

.ENDS

Figure 54. Boyle Macromodels and Subcircuit

PSpice and Parts are trademarks of MicroSim Corporation.

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ꢜ

SLOS220J − JULY 1998 − REVISED FEBRUARY 2004

macromodel information (continued)

.subckt TLV_246Y 1 2 3 4 5 6

8.9127

10.610E6

2.4603E−12

rss

rs1

rs2

rs3

rs4

10.000E−12

css

443.21E−15

6 4 s1x

6 4 s2x

dc 0

dc .7836

dc .7436

dc 0

dc 117

dlp

dln

egnd

poly(2) (3,0) (4,0) 0 .5 .5

poly(5) vb vc ve vlp vln 0

21.600E6 −1E3 1E3 22E6 −22E6

11 12 345.26E−6

10 99 15.422E−9

dc 18.850E−6

vlim 1K

10 jx1

10 jx2

gcm

iss

hlim

vlim

vlp

vln

.model dx D(Is=800.00E−18)

rd1

rd2

ro1

ro2

.model dy D(Is=800.00E−18 Rs=1m Cjo=10p)

.model jx1 NJF(Is=1.0000E−12 Beta=6.3239E−3 Vto=−1)

.model jx2 NJF(Is=1.0000E−12 Beta=6.3239E−3 Vto=−1)

.model s1x VSWITCH(Roff=1E8 Ron=1.0 Voff=2.5 Von=0.0)

.model s2x VSWITCH(Roff=1E8 Ron=1.0 Voff=0 Von=2.5)

.ends

100.00E3

2.8964E3

5.6000

6.2000

Figure 54. Boyle Macromodels and Subcircuit (Continued)

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PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

5962-0051201Q2A

ACTIVE

LCCC

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

0051201Q2A

TLV24

60MFKB

5962-0051201QHA

5962-0051201QPA

5962-0051202Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

-55 to 125

0051201QHA

TLV2460M

0051201QPA

TLV2460M

POST-PLATE

5962-

0051202Q2A

TLV24

60AMFKB

5962-0051202QHA

5962-0051202QPA

5962-0051203Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

-55 to 125

0051202QHA

TLV2460AM

0051202QPA

TLV2460AM

POST-PLATE

5962-

0051203Q2A

TLV24

61MFKB

5962-0051203QHA

5962-0051203QPA

5962-0051204Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

-55 to 125

0051203QHA

TLV2461M

0051203QPA

TLV2461M

POST-PLATE

5962-

0051204Q2A

TLV24

61AMFKB

5962-0051204QHA

5962-0051204QPA

5962-0051205Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

-55 to 125

0051204QHA

TLV2461AM

0051204QPA

TLV2461AM

POST-PLATE

5962-

0051205Q2A

TLV2462

MFKB

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

5962-0051205QHA

5962-0051205QPA

5962-0051206Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

0051205QHA

TLV2462M

ACTIVE

-55 to 125

0051205QPA

TLV2462M

POST-PLATE

-55 to 125

5962-

0051206Q2A

TLV2462A

MFKB

5962-0051206QHA

5962-0051206QPA

5962-0051207Q2A

ACTIVE

CFP

CDIP

LCCC

TBD

A42

N / A for Pkg Type

-55 to 125

0051206QHA

TLV2462AM

0051206QPA

TLV2462AM

POST-PLATE

5962-

0051207Q2A

TLV2463

MFKB

5962-0051207QCA

5962-0051208Q2A

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

5962-0051207QC

TLV2463MJB

LCCC

POST-PLATE

5962-

0051208Q2A

TLV2463

AMFKB

5962-0051208QCA

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

5962-0051208QC

TLV2463AMJB

TLV2460AIDR

TLV2460AIDRG4

TLV2460AIP

ACTIVE

SOIC

PDIP

LCCC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

-40 to 125

-55 to 125

2460AI

Green (RoHS

& no Sb/Br)

2460AI

Pb-Free

(RoHS)

TLV2460AI

TLV2460AIPE4

TLV2460AMFKB

Pb-Free

(RoHS)

TBD

5962-

0051202Q2A

TLV24

60AMFKB

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2460AMJGB

TLV2460AMUB

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

0051202QPA

TLV2460AM

ACTIVE

TBD

N / A for Pkg Type

-55 to 125

0051202QHA

TLV2460AM

TLV2460AQD

TLV2460AQDR

TLV2460AQDRG4

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

2500

150

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

V2460A

TLV2460AQPW

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

-40 to 125

V2460A

TLV2460AQPWG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2460AQPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

V2460A

TLV2460AQPWRG4

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2460CD

TLV2460CDBVR

TLV2460CDBVRG4

TLV2460CDBVT

TLV2460CDBVTG4

TLV2460CDG4

TLV2460CDR

ACTIVE

SOIC

SOT-23

SOIC

DBV

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

0 to 70

-40 to 125

2460C

VAOC

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

VAOC

Green (RoHS

& no Sb/Br)

VAOC

Green (RoHS

& no Sb/Br)

VAOC

Green (RoHS

& no Sb/Br)

2460C

TLV2460C

2460I

SOIC

2500

Green (RoHS

& no Sb/Br)

TLV2460CDRG4

TLV2460CP

SOIC

Green (RoHS

& no Sb/Br)

PDIP

Pb-Free

(RoHS)

TLV2460CPE4

TLV2460ID

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

SOIC

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2460IDBVR

TLV2460IDBVRG4

TLV2460IDBVT

TLV2460IDBVTG4

TLV2460IDG4

TLV2460IDR

ACTIVE

SOT-23

SOIC

DBV

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

VAOI

2460I

ACTIVE

DBV

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

SOIC

2500

Green (RoHS

& no Sb/Br)

TLV2460IDRG4

TLV2460IP

SOIC

Green (RoHS

& no Sb/Br)

PDIP

Pb-Free

(RoHS)

TLV2460I

TLV2460IPE4

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

TLV2460MFKB

LCCC

TBD

N / A for Pkg Type

5962-

0051201Q2A

TLV24

60MFKB

TLV2460MJG

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

TLV2460MJG

TLV2460MJGB

0051201QPA

TLV2460M

TLV2460MUB

ACTIVE

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

0051201QHA

TLV2460M

TLV2460QD

TLV2460QDR

TLV2460QPW

TLV2460QPWG4

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

TSSOP

Call TI

V2460Q

150

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2460QPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

-40 to 125

V2460Q

TLV2460QPWRG4

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2461AID

TLV2461AIDG4

TLV2461AIDR

TLV2461AIDRG4

TLV2461AIP

ACTIVE

SOIC

PDIP

LCCC

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

2461AI

ACTIVE

2500

Green (RoHS

& no Sb/Br)

2461AI

Green (RoHS

& no Sb/Br)

2461AI

Green (RoHS

& no Sb/Br)

2461AI

Pb-Free

(RoHS)

TLV2461AI

TLV2461AIPE4

TLV2461AMFKB

Pb-Free

(RoHS)

TBD

5962-

0051204Q2A

TLV24

61AMFKB

TLV2461AMJGB

TLV2461AMUB

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

-40 to 125

0051204QPA

TLV2461AM

0051204QHA

TLV2461AM

TLV2461AQD

OBSOLETE

ACTIVE

SOIC

Call TI

V2461A

TLV2461AQDG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2461AQDR

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

V2461A

TLV2461AQDRG4

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2461AQPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

V2461A

TLV2461AQPWRG4

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2461CD

TLV2461CDBVR

TLV2461CDBVRG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

2461C

VAPC

SOT-23

DBV

3000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2461CDBVT

TLV2461CDBVTG4

TLV2461CDG4

TLV2461CDR

TLV2461CDRG4

TLV2461CP

ACTIVE

SOT-23

SOIC

DBV

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

VAPC

ACTIVE

DBV

250

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

2461C

TLV2461C

2461I

SOIC

2500

Green (RoHS

& no Sb/Br)

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

PDIP

Pb-Free

(RoHS)

0 to 70

TLV2461CPE4

TLV2461ID

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

N / A for Pkg Type

-40 to 125

-55 to 125

TLV2461IDBVR

TLV2461IDBVRG4

TLV2461IDBVT

TLV2461IDBVTG4

TLV2461IDG4

TLV2461IDR

SOT-23

SOIC

DBV

3000

250

Green (RoHS

& no Sb/Br)

VAPI

Green (RoHS

& no Sb/Br)

VAPI

Green (RoHS

& no Sb/Br)

VAPI

Green (RoHS

& no Sb/Br)

VAPI

Green (RoHS

& no Sb/Br)

2461I

SOIC

2500

Green (RoHS

& no Sb/Br)

2461I

TLV2461IDRG4

TLV2461IP

SOIC

Green (RoHS

& no Sb/Br)

2461I

PDIP

Pb-Free

(RoHS)

TLV2461I

TLV2461IPE4

TLV2461MFKB

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

LCCC

TBD

N / A for Pkg Type

5962-

0051203Q2A

Addendum-Page 6

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV24

61MFKB

TLV2461MJGB

TLV2461MUB

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

-40 to 125

0051203QPA

TLV2461M

0051203QHA

TLV2461M

TLV2461QD

OBSOLETE

ACTIVE

SOIC

Call TI

V2461Q

TLV2461QDG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2461QDR

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

V2461Q

TLV2461QDRG4

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2461QPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

V2461Q

TLV2461QPWRG4

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2462AID

TLV2462AIDG4

TLV2462AIDR

TLV2462AIDRG4

TLV2462AIP

ACTIVE

SOIC

PDIP

LCCC

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

-40 to 125

-55 to 125

2462AI

Green (RoHS

& no Sb/Br)

2462AI

2500

Green (RoHS

& no Sb/Br)

2462AI

Green (RoHS

& no Sb/Br)

2462AI

Pb-Free

(RoHS)

TLV2462AI

TLV2462AIPE4

TLV2462AMFKB

Pb-Free

(RoHS)

TBD

5962-

0051206Q2A

TLV2462A

MFKB

TLV2462AMJG

TLV2462AMJGB

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

TLV2462AMJG

0051206QPA

TLV2462AM

TLV2462AMUB

ACTIVE

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

0051206QHA

TLV2462AM

Addendum-Page 7

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2462AQD

TLV2462AQDG4

TLV2462AQDRG4

TLV2462AQPWR

TLV2462AQPWRG4

TLV2462CD

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

-40 to 125

V2462A

ACTIVE

2500

2000

Green (RoHS

& no Sb/Br)

V2462A

2462C

AAI

SOIC

Green (RoHS

& no Sb/Br)

TSSOP

SOIC

Green (RoHS

& no Sb/Br)

-40 to 125

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

0 to 70

TLV2462CDG4

TLV2462CDGK

TLV2462CDGKG4

TLV2462CDGKR

TLV2462CDGKRG4

TLV2462CDR

SOIC

Green (RoHS

& no Sb/Br)

VSSOP

SOIC

DGK

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

AAI

2500

Green (RoHS

& no Sb/Br)

0 to 70

AAI

Green (RoHS

& no Sb/Br)

0 to 70

AAI

Green (RoHS

& no Sb/Br)

0 to 70

2462C

TLV2462CP

2462I

TLV2462CDRG4

TLV2462CP

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

PDIP

Pb-Free

(RoHS)

0 to 70

TLV2462CPE4

TLV2462ID

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

-40 to 125

TLV2462IDG4

SOIC

Green (RoHS

& no Sb/Br)

2462I

TLV2462IDGK

VSSOP

DGK

Green (RoHS

& no Sb/Br)

AAJ

Addendum-Page 8

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2462IDGKG4

TLV2462IDGKR

TLV2462IDGKRG4

TLV2462IDR

ACTIVE

VSSOP

SOIC

DGK

Green (RoHS

& no Sb/Br)

CU NIPDAU

POST-PLATE

Level-1-260C-UNLIM

N / A for Pkg Type

AAJ

ACTIVE

DGK

2500

Green (RoHS

& no Sb/Br)

AAJ

Green (RoHS

& no Sb/Br)

AAJ

Green (RoHS

& no Sb/Br)

2462I

TLV2462IDRG4

TLV2462IP

SOIC

Green (RoHS

& no Sb/Br)

PDIP

Pb-Free

(RoHS)

TLV2462IP

TLV2462IPE4

PDIP

Pb-Free

(RoHS)

TLV2462MFKB

LCCC

TBD

5962-

0051205Q2A

TLV2462

MFKB

TLV2462MJGB

TLV2462MUB

TLV2462QDG4

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

Level-1-260C-UNLIM

-55 to 125

0051205QPA

TLV2462M

0051205QHA

TLV2462M

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

V2462Q

TLV2462QDR

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

V2462Q

TLV2462QDRG4

2500

150

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2462QPWG4

TLV2462QPWR

TLV2462QPWRG4

TLV2463AIDR

ACTIVE

TSSOP

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

V2462Q

TLV2463AI

2000

2500

Green (RoHS

& no Sb/Br)

-40 to 125

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Addendum-Page 9

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2463AIDRG4

TLV2463AMFKB

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463AI

ACTIVE

LCCC

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

0051208Q2A

TLV2463

AMFKB

TLV2463AMJ

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

TLV2463AMJ

TLV2463AMJB

5962-0051208QC

TLV2463AMJB

TLV2463AQD

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

V2463AQ

TLV2463AQDG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463AQDR

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

V2463AQ

TLV2463AQDRG4

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463AQPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

2463AQ

TLV2463AQPWRG4

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463CD

TLV2463CDG4

TLV2463CDGS

TLV2463CDGSG4

TLV2463CDGSR

TLV2463CDGSRG4

TLV2463CDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TLV2463C

AAK

Green (RoHS

& no Sb/Br)

VSSOP

SOIC

DGS

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

AAK

2500

Green (RoHS

& no Sb/Br)

AAK

Green (RoHS

& no Sb/Br)

AAK

Green (RoHS

& no Sb/Br)

TLV2463C

TLV2463CDRG4

SOIC

Green (RoHS

& no Sb/Br)

Addendum-Page 10

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2463CN

TLV2463CNE4

TLV2463ID

ACTIVE

PDIP

Pb-Free

(RoHS)

CU NIPDAU

POST-PLATE

N / A for Pkg Type

Level-1-260C-UNLIM

N / A for Pkg Type

TLV2463CN

ACTIVE

Pb-Free

(RoHS)

0 to 70

TLV2463CN

TLV2463I

AAL

SOIC

Green (RoHS

& no Sb/Br)

-40 to 125

-55 to 125

TLV2463IDG4

TLV2463IDGS

TLV2463IDGSG4

TLV2463IDGSR

TLV2463IDGSRG4

TLV2463IN

SOIC

Green (RoHS

& no Sb/Br)

VSSOP

PDIP

DGS

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

AAL

2500

Green (RoHS

& no Sb/Br)

AAL

Green (RoHS

& no Sb/Br)

AAL

Pb-Free

(RoHS)

TLV2463IN

TLV2463INE4

TLV2463MFKB

PDIP

Pb-Free

(RoHS)

LCCC

TBD

5962-

0051207Q2A

TLV2463

MFKB

TLV2463MJB

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

-40 to 125

5962-0051207QC

TLV2463MJB

TLV2463QD

OBSOLETE

ACTIVE

SOIC

Call TI

V2463Q

TLV2463QDG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463QDR

OBSOLETE

ACTIVE

SOIC

TBD

Call TI

-40 to 125

V2463Q

TLV2463QDRG4

2500

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2463QPWR

OBSOLETE

ACTIVE

TSSOP

TBD

Call TI

V2463Q

TLV2463QPWRG4

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Addendum-Page 11

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2464AID

TLV2464AIDG4

TLV2464AIDR

TLV2464AIDRG4

TLV2464AIN

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

2464AI

ACTIVE

2500

Green (RoHS

& no Sb/Br)

2464AI

SOIC

Green (RoHS

& no Sb/Br)

2464AI

SOIC

Green (RoHS

& no Sb/Br)

2464AI

PDIP

Pb-Free

(RoHS)

TLV2464AIN

TY2464A

TLV2464C

TLV2464CN

TV2464

TLV2464AINE4

TLV2464AIPW

TLV2464AIPWG4

TLV2464AIPWR

TLV2464AIPWRG4

TLV2464CD

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

TSSOP

SOIC

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

N / A for Pkg Type

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

TLV2464CDG4

TLV2464CDR

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

SOIC

2500

Green (RoHS

& no Sb/Br)

0 to 70

TLV2464CDRG4

TLV2464CN

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

PDIP

Pb-Free

(RoHS)

0 to 70

TLV2464CNE4

TLV2464CPW

TLV2464CPWG4

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

0 to 70

TSSOP

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

TV2464

Addendum-Page 12

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2464CPWR

TLV2464CPWRG4

TLV2464ID

ACTIVE

TSSOP

SOIC

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

TV2464

ACTIVE

2000

Green (RoHS

& no Sb/Br)

0 to 70

TV2464

Green (RoHS

& no Sb/Br)

-40 to 125

TLV2464I

TLV2464IN

TY2464

TLV2464IDG4

TLV2464IDR

SOIC

Green (RoHS

& no Sb/Br)

SOIC

2500

Green (RoHS

& no Sb/Br)

TLV2464IDRG4

TLV2464IN

SOIC

Green (RoHS

& no Sb/Br)

PDIP

Pb-Free

(RoHS)

TLV2464INE4

TLV2464IPW

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

TSSOP

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

TLV2464IPWG4

TLV2464IPWR

TLV2464IPWRG4

Green (RoHS

& no Sb/Br)

TY2464

2000

Green (RoHS

& no Sb/Br)

TY2464

Green (RoHS

& no Sb/Br)

TY2464

TLV2465AIPWRG4

TLV2465CD

OBSOLETE

ACTIVE

TSSOP

SOIC

TBD

Call TI

-40 to 125

0 to 70

2465AI

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2465C

TLV2465CDG4

TLV2465CDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

TLV2465C

2465C

2500

2000

Green (RoHS

& no Sb/Br)

TLV2465CDRG4

TLV2465CPWR

SOIC

Green (RoHS

& no Sb/Br)

TSSOP

Green (RoHS

& no Sb/Br)

Addendum-Page 13

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TLV2465CPWRG4

TLV2465ID

ACTIVE

TSSOP

SOIC

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

2465C

ACTIVE

Green (RoHS

& no Sb/Br)

-40 to 125

TLV2465I

TLV2465IN

2465I

TLV2465IDG4

TLV2465IDR

SOIC

Green (RoHS

& no Sb/Br)

SOIC

2500

Green (RoHS

& no Sb/Br)

TLV2465IDRG4

TLV2465IN

SOIC

Green (RoHS

& no Sb/Br)

PDIP

Pb-Free

(RoHS)

TLV2465INE4

TLV2465IPW

PDIP

Pb-Free

(RoHS)

N / A for Pkg Type

TSSOP

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

TLV2465IPWG4

TLV2465IPWR

TLV2465IPWRG4

Green (RoHS

& no Sb/Br)

2465I

2000

Green (RoHS

& no Sb/Br)

2465I

Green (RoHS

& no Sb/Br)

2465I

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Addendum-Page 14

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TLV2460, TLV2460A, TLV2460AM, TLV2460M, TLV2461, TLV2461A, TLV2461AM, TLV2461M, TLV2462, TLV2462A, TLV2462AM,

TLV2462M, TLV2463, TLV2463A, TLV2463AM, TLV2463M, TLV2464A :

Catalog: TLV2460A, TLV2460, TLV2461A, TLV2461, TLV2462A, TLV2462, TLV2463A, TLV2463

•

Automotive: TLV2460-Q1, TLV2460A-Q1, TLV2460A-Q1, TLV2460-Q1, TLV2461-Q1, TLV2461A-Q1, TLV2461A-Q1, TLV2461-Q1, TLV2462-Q1, TLV2462A-Q1, TLV2462A-Q1,

TLV2462-Q1, TLV2463-Q1, TLV2463A-Q1, TLV2463A-Q1, TLV2463-Q1, TLV2464A-Q1

•

Enhanced Product: TLV2462A-EP, TLV2462A-EP, TLV2464A-EP

•

Military: TLV2460M, TLV2460AM, TLV2461M, TLV2461AM, TLV2462M, TLV2462AM, TLV2463M, TLV2463AM

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Enhanced Product - Supports Defense, Aerospace and Medical Applications

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 15

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Aug-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TLV2460AIDR

TLV2460CDBVR

TLV2460CDBVT

TLV2460CDR

SOIC

2500

3000

250

330.0

178.0

330.0

178.0

330.0

180.0

178.0

180.0

330.0

180.0

178.0

12.4

9.0

6.4

5.2

2.1

8.0

4.0

8.0

4.0

8.0

4.0

8.0

4.0

12.0

8.0

SOT-23

SOIC

DBV

3.23

6.4

3.17

5.2

1.37

2.1

9.0

8.0

2500

3000

250

12.4

9.0

12.0

8.0

TLV2460IDBVR

TLV2460IDBVT

TLV2460IDR

SOT-23

SOIC

DBV

3.23

6.4

3.17

5.2

1.37

2.1

9.0

8.0

2500

3000

250

12.4

9.0

12.0

8.0

TLV2460IDR

SOIC

6.4

5.2

2.1

TLV2461AIDR

TLV2461CDBVR

TLV2461CDBVT

TLV2461CDR

SOIC

6.4

5.2

2.1

SOIC

6.4

5.2

2.1

SOT-23

SOIC

DBV

3.15

3.23

3.15

6.4

3.2

1.4

9.0

3.17

3.2

1.37

1.4

8.0

9.0

8.0

250

9.0

8.0

2500

3000

12.4

9.0

5.2

2.1

12.0

8.0

TLV2461IDBVR

SOT-23

DBV

3.15

3.23

3.2

1.4

9.0

3.17

1.37

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Aug-2013

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TLV2461IDBVT

TLV2461IDR

SOT-23

SOIC

DBV

250

180.0

178.0

330.0

9.0

3.15

3.23

6.4

5.3

6.4

5.3

6.4

6.5

6.9

5.3

6.5

5.3

6.9

6.5

6.9

6.5

6.9

6.5

6.9

6.5

6.9

6.5

6.9

3.2

3.17

5.2

3.4

5.2

3.4

5.2

9.0

5.6

3.4

9.0

3.4

5.6

9.0

5.6

9.0

5.6

9.0

5.6

10.3

5.6

10.3

5.6

1.4

1.37

2.1

1.4

2.1

1.4

2.1

1.6

1.4

2.1

1.4

1.6

2.1

1.6

2.1

1.6

2.1

1.6

2.1

1.6

2.1

1.6

4.0

8.0

250

9.0

8.0

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

TLV2461IDR

SOIC

TLV2462AIDR

TLV2462CDGKR

TLV2462CDR

SOIC

VSSOP

SOIC

DGK

TLV2462IDGKR

TLV2462IDR

VSSOP

SOIC

DGK

TLV2463AIDR

TLV2463AQPWRG4

TLV2463CDGSR

TLV2463CDR

SOIC

TSSOP

VSSOP

SOIC

DGS

TLV2463IDGSR

TLV2463QPWRG4

TLV2464AIDR

TLV2464AIPWR

TLV2464CDR

VSSOP

TSSOP

SOIC

DGS

TSSOP

SOIC

TLV2464CPWR

TLV2464IDR

TSSOP

SOIC

TLV2464IPWR

TLV2465CDR

TSSOP

SOIC

TLV2465CPWR

TLV2465IDR

TSSOP

SOIC

TLV2465IPWR

TSSOP

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Aug-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TLV2460AIDR

TLV2460CDBVR

TLV2460CDBVT

TLV2460CDR

SOIC

2500

3000

250

367.0

340.5

180.0

340.5

180.0

367.0

340.5

367.0

182.0

180.0

182.0

340.5

182.0

180.0

182.0

180.0

367.0

338.1

180.0

338.1

180.0

367.0

338.1

367.0

182.0

180.0

182.0

338.1

182.0

180.0

182.0

180.0

35.0

20.6

18.0

20.6

18.0

35.0

20.6

35.0

20.0

18.0

20.0

20.6

20.0

18.0

20.0

18.0

SOT-23

SOIC

DBV

2500

3000

250

TLV2460IDBVR

TLV2460IDBVT

TLV2460IDR

SOT-23

SOIC

DBV

2500

3000

250

TLV2460IDR

SOIC

TLV2461AIDR

TLV2461CDBVR

TLV2461CDBVT

TLV2461CDR

SOIC

SOT-23

SOIC

DBV

250

2500

3000

250

TLV2461IDBVR

TLV2461IDBVT

SOT-23

DBV

250

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Aug-2013

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TLV2461IDR

SOIC

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

2500

2000

367.0

340.5

358.0

364.0

340.5

358.0

364.0

340.5

367.0

358.0

367.0

358.0

367.0

333.2

367.0

333.2

367.0

333.2

367.0

338.1

335.0

364.0

338.1

335.0

364.0

338.1

367.0

335.0

367.0

335.0

367.0

345.9

367.0

345.9

367.0

345.9

367.0

35.0

20.6

35.0

27.0

20.6

35.0

27.0

20.6

38.0

35.0

38.0

35.0

28.6

35.0

28.6

35.0

28.6

35.0

38.0

35.0

38.0

35.0

TLV2462AIDR

TLV2462CDGKR

TLV2462CDR

SOIC

VSSOP

SOIC

DGK

TLV2462IDGKR

TLV2462IDR

VSSOP

SOIC

DGK

TLV2463AIDR

TLV2463AQPWRG4

TLV2463CDGSR

TLV2463CDR

SOIC

TSSOP

VSSOP

SOIC

DGS

TLV2463IDGSR

TLV2463QPWRG4

TLV2464AIDR

TLV2464AIPWR

TLV2464CDR

VSSOP

TSSOP

SOIC

DGS

TSSOP

SOIC

TLV2464CPWR

TLV2464IDR

TSSOP

SOIC

TLV2464IPWR

TLV2465CDR

TSSOP

SOIC

TLV2465CPWR

TLV2465IDR

TSSOP

SOIC

TLV2465IPWR

TSSOP

Pack Materials-Page 4

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE

0.400 (10,16)

0.355 (9,00)

0.280 (7,11)

0.245 (6,22)

0.065 (1,65)

0.045 (1,14)

0.310 (7,87)

0.290 (7,37)

0.063 (1,60)

0.015 (0,38)

0.020 (0,51) MIN

0.200 (5,08) MAX

0.130 (3,30) MIN

Seating Plane

0.023 (0,58)

0.015 (0,38)

0°–15°

0.100 (2,54)

0.014 (0,36)

0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

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Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

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TLV2460AQPWRG4 [TI]

相关型号：

TLV2460AQPWRG4Q1

TLV2460AQPWRQ1

TLV2460CD

TLV2460CDBV

TLV2460CDBVR

TLV2460CDBVRG4

TLV2460CDBVT

TLV2460CDBVTG4

TLV2460CDG4

TLV2460CDR

TLV2460CDRG4

TLV2460CP