TLV1391_V01 [TI]
SINGLE DIFFERENTIAL COMPARATORS;
| 型号： | TLV1391_V01 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SINGLE DIFFERENTIAL COMPARATORS |
| 文件： | 总14页 (文件大小：897K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
DBV PACKAGE
(TOP VIEW)
D
D
Low-Voltage and Single-Supply Operation
= 2 V to 7 V
V
CC
Common-Mode Voltage Range Includes
Ground
1
IN−
VCC−/GND
IN+
VCC+
OUT
5
4
2
3
D
Fast Response Time . . . 0.7 µs Typ
Low Supply Current . . . 80 µA Typ and
150 µA Max
D
D
Fully Specified at 3-V and 5-V Supply
Voltages
description/ordering informaton
The TLV1391 is a differential comparator built using a Texas Instruments low-voltage, high-speed bipolar
process. These devices have been developed specifically for low-voltage, single-supply applications. Their
enhanced performance makes them excellent replacements for the LM393 in the improved 3-V and 5-V system
designs.
The TLV1391, with its typical supply current of only 80 µA, is ideal for low-power systems. Response time also
has been improved to 0.7 µs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
Reel of 3000
TLV1391CDBVR
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVT
−0°C to 70°C
−40°C to 85°C
SOT-23-5 (DBV)
Y3D_
Reel of 250
Reel of 3000
Reel of 250
SOT-23-5 (DBV)
Y3E_
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
symbol (each comparator)
IN+
IN−
OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
equivalent schematic
V
CC
IN+
IN−
GND
OUT
COMPONENT COUNT
Transistors
Resistors
Diodes
26
1
4
Epi-FET
1
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
ID
Input voltage range, V (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
I
CC
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
O
Output current, I (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
O
Duration of short-circuit current to GND (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θ (see Note 4 and 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
JA
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network GND.
2. Differential voltages are at the noninverting input with respect to the inverting input.
3. Short circuits from the outputs to V can cause excessive heating and eventual destruction of the chip.
CC
4. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can impact reliability.
D
J
A
JA
J
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
2
MAX
7
UNIT
V
T
Supply voltage
V
CC
TLV1391C
TLV1391I
0
70
Operating free-air temperature
°C
A
−40
85
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
electrical characteristics, VCC = 3 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
T
A
25°C
1.5
5
9
V
IO
Input offset voltage
V
O
= 1.4 V,
V
IC
= V (min)
mV
ICR
Full range
0 to
−1.5
0 to
−1.2
25°C
V
CC
V
CC
V
V
Common-mode input voltage range
V
ICR
0 to
Full range
V
−2
CC
Low-level output voltage
Input offset current
V
V
= −1 V,
= 1.4 V
I
= 500 µA
Full range
25°C
120
5
300
50
mV
nA
OL
ID
OL
I
I
IO
O
Full range
25°C
150
−40
0.1
−250
−400
Input bias current
V
O
= 1.4 V
nA
IB
Full range
25°C
V
ID
V
ID
V
ID
= 1 V,
= 1 V,
= −1 V,
V
= 3 V
OH
I
I
High-level output current
Low-level output current
nA
OH
V
= 5 V
Full range
25°C
100
OH
OL
V
= 1.5 V
500
µA
OL
25°C
80
80
125
150
125
150
I
High-level supply current
Low-level supply current
V
= V
µA
µA
CC(H)
CC(L)
O
O
OH
Full range
25°C
I
V
= V
OL
Full range
switching characteristics, VCC = 3 V, CL = 15 pF†, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
0.7
UNIT
100-mV input step with 5-mV overdrive,
R = 5.1 kΩ
L
Response time
µs
†
C includes the probe and jig capacitance.
L
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
electrical characteristics, VCC = 5 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
T
A
25°C
1.5
5
9
V
IO
Input offset voltage
V
O
= 1.4 V,
V
IC
= V (min)
mV
ICR
Full range
0 to
−1.5
0 to
−1.2
25°C
V
CC
V
CC
V
V
Common-mode input voltage range
V
ICR
0 to
Full range
V
−2
CC
Low-level output voltage
Input offset current
V
V
= −1 V,
= 1.4 V
I
= 500 µA
Full range
25°C
120
5
300
50
mV
nA
OL
ID
OL
I
I
IO
O
Full range
25°C
150
−40
0.1
−250
−400
Input bias current
V
O
= 1.4 V
nA
IB
Full range
25°C
V
ID
V
ID
V
ID
= 1 V,
= 1 V,
= −1 V,
V
= 3 V
OH
I
I
High-level output current
Low-level output current
nA
OH
V
= 5 V
Full range
25°C
100
OH
OL
V
= 1.5 V
600
µA
OL
25°C
100
100
150
175
150
175
I
High-level supply current
Low-level supply current
V
= V
µA
µA
CC(H)
CC(L)
O
O
OH
Full range
25°C
I
V
= V
OL
Full range
switching characteristics, VCC = 5 V, CL = 15 pF†, TA = 25°C
PARAMETER
TEST CONDITIONS
100-mV input step with 5-mV overdrive,
TTL-level input step,
TYP
UNIT
R = 5.1 kΩ
0.65
0.18
L
Response time
µs
R = 5.1 kΩ
L
†
C includes the probe and jig capacitance.
L
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
TYPICAL CHARACTERISTICS
LOW-TO HIGH-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
4.5
4.5
3
1.5
0
3
40 mV
20 mV
10 mV
5 mV
40 mV
20 mV
10 mV
5 mV
1.5
2 mV
2 mV
0
100
0
100
0
V
T
= 3 V
= 25° C
CC
V
T
= 3 V
= 25° C
CC
A
A
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
Low-to High-Level Output Response Time − µs
High-to Low-Level Output Response Time − µs
Figure 1
Figure 2
LOW-TO HIGH-LEVEL OUTPUT
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
RESPONSE FOR VARIOUS INPUT OVERDRIVES
7.5
7.5
5
2.5
0
5
2.5
0
40 mV
20 mV
10 mV
5 mV
40 mV
20 mV
10 mV
5 mV
2 mV
2 mV
100
0
100
0
V
T
A
= 5 V
= 25° C
CC
V
T
A
= 5 V
CC
= 25° C
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
Low-to High-Level Output Response Time − µs
High-to Low-Level Output Response Time − µs
Figure 3
Figure 4
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
3000
3000
250
(1)
(2)
(3)
(4/5)
(6)
TLV1391CDBVR
TLV1391CDBVRG4
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
Green (RoHS
& no Sb/Br)
NIPDAU | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
(Y3D6, Y3DG)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU | SN
NIPDAU
Y3DG
DBV
Green (RoHS
& no Sb/Br)
0 to 70
(Y3DB, Y3DG)
(Y3E6, Y3EB, Y3EJ)
Y3EB
DBV
3000
250
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
DBV
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV1391CDBVR
TLV1391CDBVRG4
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVR
TLV1391IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
3000
3000
250
178.0
178.0
178.0
180.0
178.0
180.0
9.0
9.0
9.0
8.4
9.0
8.4
3.23
3.23
3.23
3.23
3.3
3.17
3.17
3.17
3.17
3.2
1.37
1.37
1.37
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
3000
3000
250
3.2
3.2
1.4
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV1391CDBVR
TLV1391CDBVRG4
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVR
TLV1391IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
3000
3000
250
180.0
180.0
180.0
202.0
180.0
203.0
180.0
180.0
180.0
201.0
180.0
203.0
18.0
18.0
18.0
28.0
18.0
35.0
3000
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
2X 0.95
1.9
3.05
2.75
1.9
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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