TLE2037AQDRQ1 [TI]
EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION POERATIONAL AMPLIFIERS; EXCALIBUR低噪声高速精密POERATIONAL放大器
| 型号： | TLE2037AQDRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION POERATIONAL AMPLIFIERS |
| 文件： | 总29页 (文件大小：526K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢂ ꢌꢍ ꢋꢁꢎ ꢏ ꢐꢑ ꢁꢒ ꢓꢆꢔꢒ ꢎ ꢕꢂ ꢖꢎ ꢗꢖ ꢆꢕꢘꢂ ꢂꢙ ꢘꢑ ꢂꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
D
Qualification in Accordance With
AEC-Q100
D
Available in Standard-Pinout Small-Outline
Package
†
D
Qualified for Automotive Applications
D
D
Output Features Saturation Recovery
Circuitry
D
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
Macromodels and Statistical information
D
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D PACKAGE
(TOP VIEW)
OFFSET N1
IN −
OFFSET N2
1
2
3
4
8
7
6
5
Outstanding Combination of DC Precision
and AC Performance:
V
CC +
IN +
OUT
NC
Unity-Gain Bandwidth . . . 15 MHz Typ
V
CC −
V
. . . . 3.3 nV/√Hz at f = 10 Hz Typ,
2.5 nV/√Hz at f = 1 kHz Typ
. . . . 25 µV Max
n
V
A
IO
. . . 45 V/µV Typ With R = 2 kΩ,
VD
L
19 V/µV Typ With R = 600 Ω
L
†
Contact factory for details. Q100 qualification data available on
request.
description
The TLE20x7 and TLE20x7A contain innovative circuit design expertise and high-quality process control
techniques to produce a level of ac performance and dc precision previously unavailable in single operational
amplifiers. Manufactured using Texas Instruments state-of-the-art Excalibur process, these devices allow
upgrades to systems that use lower-precision devices.
In the area of dc precision, the TLE20x7 and TLE20x7A offer maximum offset voltages of 100 µV and 25 µV,
respectively, common-mode rejection ratio of 131 dB (typ), supply voltage rejection ratio of 144 dB (typ), and
dc gain of 45 V/µV (typ).
The ac performance of the TLE2027 and TLE2037 is highlighted by a typical unity-gain bandwidth specification
of 15 MHz, 55° of phase margin, and noise voltage specifications of 3.3 nV/√Hz and 2.5 nV/√Hz at frequencies
of 10 Hz and 1 kHz, respectively. The TLE2037 and TLE2037A have been decompensated for faster slew rate
(−7.5 V/µs, typical) and wider bandwidth (50 MHz). To ensure stability, the TLE2037 and TLE2037A should be
operated with a closed-loop gain of 5 or greater.
ORDERING INFORMATION
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
‡
PACKAGE
T
A
AT 25°C
TLE2027AQDRQ1
TLE2037AQDRQ1
TLE2027QDRQ1
TLE2037QDRQ1
2027AQ
25 µV
SOIC (D)
SOIC (D)
Tape and reel
Tape and reel
2037AQ
2027Q1
2037Q1
−40°C to 125°C
100 µV
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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ꢥ ꢤ ꢣ ꢞꢬ ꢣ ꢡꢬ ꢰ ꢣ ꢡꢡ ꢣ ꢞ ꢤꢱꢭ ꢘꢡ ꢠ ꢬꢧꢦ ꢤꢝꢠꢞ ꢩꢡ ꢠꢦ ꢨꢥ ꢥꢝ ꢞꢲ ꢬꢠꢨ ꢥ ꢞꢠꢤ ꢞꢨ ꢦꢨ ꢥꢥ ꢣꢡ ꢝꢫ ꢱ ꢝꢞꢦ ꢫꢧꢬ ꢨ
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Copyright 2006 Texas Instruments Incorporated
1
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
description (continued)
Both the TLE20x7 and TLE20x7A are available in a wide variety of packages, including the industry-standard
8-pin small-outline version for high-density system applications. The Q-suffix devices are characterized for
operation from −40°C to 125°C.
symbol
OFFSET N1
IN +
+
−
OUT
IN −
OFFSET N2
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SGLS202A − OCTOBER 2003 − REVISED OCTOBER 2006
•
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −19 V
CC+
CC−
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 V
Input voltage range, V (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ID
V
I
CC
Input current, I (each Input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA
I
Output current, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
O
Total current into V
Total current out of V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
CC+
CC−
Duration of short-circuit current at (or below) 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142°C
Operating free-air temperature range, T : Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
J
A
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
stg
JA
Package thermal impedance, θ (D Package) (0 LFPM) (see Note 4) . . . . . . . . . . . . . . . . . . . . . . 101°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D package . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between V
and V .
CC +
CC −
2. Differential voltages are at IN+ with respect to IN−. Excessive current flows if a differential input voltage in excess of approximately
1.2 V is applied between the inputs, unless some limiting resistance is used.
3. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum
dissipation rating is not exceeded.
4. The thermal impedance is calculated in accordance with JESD 51−7.
recommended operating conditions
MIN
4
MAX
19
UNIT
Supply voltage, V
CC
V
T
= 25°C
−11
11
A
Common-mode input voltage, V
IC
V
‡
T
A
= Full range
−10.2
−40
10.2
125
Operating free-air temperature, T
°C
A
‡
Full range is −40°C to 125°C for Q-suffix devices.
4
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ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TLE20x7-Q1 electrical characteristics at specified free-air temperature, V
otherwise noted)
= 15 V (unless
CC
TLE20x7-Q1
TLE20x7A-Q1
†
PARAMETER
TEST CONDITIONS
UNIT
T
A
MIN
TYP
MAX
100
MIN
TYP
MAX
25°C
20
10
25
V
IO
Input offset voltage
µV
Full range
200
105
Temperature coefficient of
input offset voltage
α
Full range
0.4
1
1
0.2
1
1
µV/°C
µV/mo
VIO
Input offset voltage
long-term drift (see Note 4)
25°C
0.006
6
0.006
6
V
IC
= 0,
R = 50 Ω
S
25°C
Full range
25°C
90
150
90
90
150
90
I
I
Input offset current
Input bias current
nA
nA
IO
15
15
IB
Full range
150
150
−11
to
−13
to
−11
to
−13
to
25°C
11
13
11
13
Common-mode input
voltage range
V
R
R
= 50 Ω
V
ICR
S
L
−10.3
to
10.3
−10.4
to
10.4
Full range
25°C
Full range
25°C
10.5
10
12.9
13.2
−13
10.5
10
12.9
13.2
−13
= 600 Ω
= 2 kΩ
Maximum positive peak
output voltage swing
V
V
V
V
OM +
12
12
R
L
L
L
Full range
25°C
11
11
−10.5
−10
−10.5
−10
R
R
= 600 Ω
= 2 kΩ
Full range
25°C
Maximum negative peak
output voltage swing
OM −
−12 −13.5
−11
−12 −13.5
−11
Full range
25°C
V
V
=
=
11 V, R = 2 kΩ
5
2.5
3.5
1.8
2
45
10
3.5
8
45
O
L
10 V, R = 2 kΩ
Full range
25°C
O
L
Large-signal differential
voltage amplification
38
38
A
V/µV
VD
V
V
=
=
10 V, R = 1 kΩ
L
O
Full range
2.2
5
10 V, R = 600 Ω
25°C
25°C
19
8
19
8
O
L
Input capacitance
pF
Ci
Open-loop output
impedance
z
I
O
= 0
25°C
50
50
o
Ω
25°C
100
96
131
117
113
131
Common-mode rejection
ratio
V
R
= V
ICR
= 50 Ω
min,
IC
S
CMRR
dB
Full range
V
R
=
4 V to 18 V,
CC
S
25°C
94
90
144
3.8
110
105
144
3.8
= 50 Ω
Supply-voltage rejection
k
dB
SVR
ratio (∆V
CC
/∆V
IO
)
V
R
=
4 V to 18 V,
CC
Full range
= 50 Ω
S
25°C
5.3
5.6
5.3
5.6
I
Supply current
V
= 0,
No load
mA
CC
O
Full range
†
Full range is −40°C to 125°C.
NOTE 4: Typical values are based on the input offset voltage shift observed through 168 hours of operating life test at T = 150°C extrapolated
A
to T = 25°C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
A
5
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TLE20x7-Q1 operating characteristics at specified free-air temperature, V
(unless otherwise specified)
= 15 V, T = 25°C
A
CC
TLE20x7-Q1
TLE20x7A-Q1
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
R
C
= 2 kΩ,
= 100 pF,
TLE2027
TLE2037
1.7
2.8
1.7
6
2.8
L
L
6
1
7.5
7.5
See Figure 1
SR
Slew rate at unity gain
V/µs
R
C
= 2 kΩ,
= 100 pF,
= −55°C to 125°C,
L
L
TLE2027
TLE2037
1
T
A
4.4
4.4
See Figure 1
R
R
= 20 Ω,
= 20 Ω,
f = 10 Hz
f = 1 kHz
3.3
2.5
8
3.3
2.5
4.5
3.8
Equivalent input noise
voltage (see Figure 2)
S
S
nV/√Hz
V
V
n
4.5
Peak-to-peak equivalent
input noise voltage
f = 0.1 Hz to 10 Hz
50
250
50
130
nV
N(PP)
f = 10 Hz
f = 1 kHz
10
10
Equivalent input noise
current
pA/√Hz
I
n
0.8
0.8
V
= +10 V,
= 1,
O
A
TLE2027
TLE2037
<0.002
<0.002
<0.002
VD
See Note 5
THD
Total harmonic distortion
%
V
= +10 V,
= 5,
O
A
<0.002
VD
See Note 5
TLE2027
TLE2037
TLE2027
TLE2037
TLE2027
TLE2037
7
13
50
30
80
55
50
9
13
50
30
80
55
50
Unity-gain bandwidth
(see Figure 3)
R
C
= 2 kΩ,
= 100 pF
L
L
B
B
φ
MHz
kHz
°
1
35
35
Maximum output-swing
bandwidth
R
= 2 kΩ
OM
m
L
Phase margin at unity
gain (see Figure 3)
R
C
= 2 kΩ,
= 100 pF
L
L
NOTE 5: Measured distortion of the source used in the analysis was 0.002%.
6
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION
2 kΩ
R
f
15 V
15 V
−
−
+
V
O
V
O
R
I
+
V
I
R
= 2 kΩ
− 15 V
L
C
=
− 15 V
L
20 Ω
20 Ω
100 pF
(see Note A)
NOTE A: C includes fixture capacitance.
L
Figure 1. Slew-Rate Test Circuit
Figure 2. Noise-Voltage Test Circuit
R
f
10 kΩ
15 V
15 V
100 Ω
−
+
−
+
V
I
V
O
R
I
V
O
V
I
C
=
2 kΩ
L
− 15 V
−15 V
2 kΩ
C
=
100 pF
(see Note A)
L
100 pF
(see Note A)
NOTE A: C includes fixture capacitance.
NOTES: A.
B. For the TLE2037 and TLE2037A,
must be ≥ 5.
C includes fixture capacitance.
L
L
A
VD
Figure 3. Unity-Gain Bandwidth and
Phase-Margin Test Circuit (TLE2027 Only)
Figure 4. Small-Signal Pulse-
Response Test Circuit
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
typical values
Typical values presented in this data sheet represent the median (50% point) of device parametric performance.
initial estimates of parameter distributions
In the ongoing program of improving data sheets and supplying more information to our customers, Texas
Instruments has added an estimate of not only the typical values, but also the spread around these values.
These are in the form of distribution bars that show the 95% (upper) points and the 5% (lower) points from the
characterization of the initial wafer lots of this new device type (see Figure 5). The distribution bars are shown
at the points where data was actually collected. The 95% and 5% points are used instead of 3 sigma, since
some of the distributions are not true Gaussian distributions.
The number of units tested and the number of different wafer lots used are on all of the graphs where distribution
bars are shown. As noted in Figure 5, there were a total of 835 units from two wafer lots. In this case, there is
a good estimate for the within-lot variability and a possibly poor estimate of the lot-to-lot variability. This is always
the case on newly released products, since there can only be data available from a few wafer lots.
The distribution bars are not intended to replace the minimum and maximum limits in the electrical tables. Each
distribution bar represents 90% of the total units tested at a specific temperature. While 10% of the units tested
fell outside any given distribution bar, this should not be interpreted to mean that the same individual devices
fell outside every distribution bar.
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
5
95% point on the distribution bar
(5% of the devices fell above this point.)
V
V
= 15 V
CC
= 0
O
No Load
4.5
4
90% of the devices were within the upper
and lower points on the distribution bar.
Sample Size = 835 Units
From 2 Water Lots
5% point on the distribution bar
(5% of the devices fell below this point.)
3.5
3
2.5
− 75 − 50 − 25
0
25 50 75 100 125 150
T
A
− Free-Air Temperature − °C
Figure 5. Sample Graph With Distribution Bars
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ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
6, 7
V
IO
Input offset voltage
Distribution
Input offset voltage change
Input offset current
vs Time after power on
vs Free-air temperature
8, 9
∆V
IO
I
IO
10
vs Free-air temperature
vs Common-mode input voltage
11
12
I
Input bias current
IB
I
I
Input current
vs Differential input voltage
vs Frequency
13
V
Maximum peak-to-peak output voltage
14, 15
O(PP)
Maximum (positive/negative) peak output
voltage
vs Load resistance
vs Free-air temperature
16, 17
18, 19
V
OM
vs Supply voltage
vs Load resistance
vs Frequency
20
21
22 − 25
26
A
VD
Large-signal differential voltage amplification
vs Free-air temperature
z
Output impedance
vs Frequency
vs Frequency
vs Frequency
27
28
29
o
CMRR
Common-mode rejection ratio
Supply-voltage rejection ratio
k
SVR
vs Supply voltage
vs Elapsed time
vs Free-air temperature
30, 31
32, 33
34, 35
I
Short-circuit output current
OS
vs Supply voltage
vs Free-air temperature
36
37
I
Supply current
CC
Small signal
Large signal
38, 40
39, 41
Voltage-follower pulse response
V
B
Equivalent input noise voltage
Noise voltage (referred to input)
vs Frequency
42
43
n
Over 10-second interval
vs Supply voltage
vs Load capacitance
44
45
Unity-gain bandwidth
1
vs Supply voltage
vs Load capacitance
46
47
Gain bandwidth product
Slew rate
SR
vs Free-air temperature
48, 49
vs Supply voltage
vs Load capacitance
vs Free-air temperature
50, 51
52, 53
54, 55
Phase margin
Phase shift
φ
m
vs Frequency
22 − 25
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
DISTRIBUTION
INPUT OFFSET VOLTAGE
INPUT OFFSET VOLTAGE CHANGE
16
14
12
10
8
vs
1568 Amplifiers Tested From 2 Wafer Lots
TIME AFTER POWER ON
V = +15 V
CC
T = 25°C
12
10
8
A
D Package
6
6
4
4
50 Amplifiers Tested From 2 Wafer Lots
2
V
T
=
15 V
2
CC
= 25°C
A
D Package
0
− 120 − 90 − 60 − 30
0
30
60
90
120
0
0
10 20
30
40
50
60
V
IO
− Input Offset Voltage − µV
t − Time After Power On − s
Figure 6
Figure 7
†
INPUT OFFSET CURRENT
vs
INPUT OFFSET VOLTAGE CHANGE
vs
FREE-AIR TEMPERATURE
TIME AFTER POWER ON
6
5
4
3
2
1
0
30
25
20
15
10
5
V
V
= 15 V
CC
= 0
IC
Sample Size = 833 Units
From 2 Wafer Lots
50 Amplifiers Tested From 2 Wafer Lots
V
T
A
=
15 V
CC
= 25°C
P Package
0
0
20 40 60 80 100 120 140 160 180
t − Time After Power On − s
Figure 8
− 75 − 50 − 25
0
25 50 75 100 125 150
T
A
− Free-Air Temperature − °C
Figure 9
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
10
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ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
†
INPUT BIAS CURRENT
INPUT BIAS CURRENT
vs
COMMON-MODE INPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
60
50
40
35
30
25
20
15
10
5
V
T
= 15 V
V
V
= 15 V
CC
CC
= 0
= 25°C
A
IC
Sample Size = 836 Units
From 2 Wafer Lots
40
30
20
10
0
−10
−20
0
−75 −50 −25
0
25 50 75 100 125 150
−12
− 8
− 4
0
4
8
12
T
A
− Free-Air Temperature − °C
V
IC
− Common-Mode Input Voltage − V
Figure 10
Figure 11
TLE2027
MAXIMUM PEAK-TO-PEAK
†
OUTPUT VOLTAGE
INPUT CURRENT
vs
DIFFERENTIAL INPUT VOLTAGE
vs
FREQUENCY
30
25
20
15
10
5
1
0.8
V
R
=
15 V
CC
L
= 2 kΩ
V
V
T
= 15 V
CC
= 0
IC
= 25°C
0.6
A
0.4
0.2
0
T
= 125°C
A
− 0.2
− 0.4
− 0.6
− 0.8
− 1
T
A
= − 55°C
0
− 1.8
− 1.2
− 0.6
0
0.6
1.2 1.8
10 k
100 k
1 M
10 M
V
ID
− Differential Input Voltage − V
f − Frequency − Hz
Figure 12
Figure 13
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
11
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ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2037
MAXIMUM PEAK-TO-PEAK
†
MAXIMUM POSITIVE PEAK
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
FREQUENCY
LOAD RESISTANCE
30
25
20
15
10
5
14
12
10
8
V
=
15 V
CC
R
= 2 kΩ
L
T
A
= 125°C
6
4
T
A
= − 55°C
V
= 15 V
2
0
CC
= 25°C
T
A
0
10 k
100 k
1 M
10 M
100 M
100
1 k
10 k
f − Frequency − Hz
R
− Load Resistance − Ω
L
Figure 14
Figure 15
MAXIMUM POSITIVE PEAK
MAXIMUM NEGATIVE PEAK
OUTPUT VOLTAGE
vs
†
OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
LOAD RESISTANCE
13.5
13.4
13.3
13.2
13.1
− 14
− 12
− 10
− 8
V
R
=
15 V
CC
L
= 2 kΩ
Sample Size = 832 Units
From 2 Wafer Lots
− 6
− 4
13
V
= 15 V
CC
= 25°C
− 2
0
T
A
12.9
− 75 − 50 − 25
0
25 50 75 100 125 150
100
1 k
10 k
R
− Load Resistance − Ω
T
A
− Free-Air Temperature − °C
L
Figure 16
Figure 17
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
12
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ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
LARGE-SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
MAXIMUM NEGATIVE PEAK
†
OUTPUT VOLTAGE
SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE
50
40
30
20
10
0
T
A
= 25°C
− 13
− 13.2
− 13.4
− 13.6
V
CC
=
15 V
R
R
= 2 kΩ
= 1 kΩ
L
L
R
= 2 kΩ
L
Sample Size = 831 Units
From 2 Wafer Lots
R
= 600 Ω
L
− 13.8
− 14
0
4
8
12
16
20
− 75 − 50 − 25
0
25 50 75 100 125 150
V
CC
− Supply Voltage − V
T
A
− Free-Air Temperature − °C
Figure 18
Figure 19
LARGE-SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
LOAD RESISTANCE
50
40
30
20
10
0
V
= 15 V
CC
T
A
= 25°C
100
200
400
1 k
2 k
4 k
10 k
R
− Load Resistance − Ω
L
Figure 20
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
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ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE SHIFT
vs
FREQUENCY
160
140
120
100
80
75°
Phase Shift
100°
125°
150°
175°
200°
225°
250°
275°
A
VD
60
40
V
= 15 V
= 2 kΩ
= 100 pF
= 25°C
CC
L
L
R
C
T
20
A
0
0.1
100
100 k
100 M
f − Frequency − Hz
Figure 21
TLE2037
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE SHIFT
vs
FREQUENCY
75°
160
100°
125°
150°
175°
200°
225°
250°
275°
140
120
100
80
Phase Shift
A
VD
60
V
=
15 V
40
CC
R
C
= 2 kΩ
= 100 pF
L
L
20
T
A
= 25°C
0
0.1
100
100 k
100 M
f − Frequency − MHz
Figure 22
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ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE SHIFT
vs
FREQUENCY
6
3
100°
125°
150°
175°
200°
225°
250°
275°
300°
0
− 3
− 6
− 9
− 12
− 15
− 18
A
VD
Phase Shift
V
= 15 V
= 2 kΩ
= 100 pF
= 25°C
CC
L
L
R
C
T
A
10
20
40
70
100
f − Frequency − MHz
Figure 23
TLE2037
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE SHIFT
vs
FREQUENCY
30
100
125
150
175
200
225
250
275
300
°
°
°
°
°
°
°
°
°
25
20
15
10
5
A
Phase Shift
VD
V
=
15 V
0
CC
R
C
T
A
= 2 kΩ
= 100 pF
= 25°C
L
L
− 5
−10
1
2
4
10
20
40
100
f − Frequency − MHz
Figure 24
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ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
LARGE-SIGNAL DIFFERENTIAL
†
VOLTAGE AMPLIFICATION
OUTPUT IMPEDANCE
vs
vs
FREE-AIR TEMPERATURE
FREQUENCY
60
50
40
30
100
10
V
= 15 V
CC
V
=
15 V
CC
= 25°C
T
A
R
= 2 kΩ
= 1 kΩ
L
A
= 100
VD
See Note A
1
R
L
A
VD
= 10
−10
−100
−75 −50 −25
0
25 50 75 100 125 150
10
100
1 k
f − Frequency − Hz
NOTE A: For this curve, the TLE2027 is A
10 k 100 k 1 M 10 M 100 M
T
A
− Free-Air Temperature − °C
= 1 and the
VD
TLE2037 is A
VD
= 5.
Figure 25
Figure 26
COMMON-MODE REJECTION RATIO
SUPPLY-VOLTAGE REJECTION RATIO
vs
vs
FREQUENCY
FREQUENCY
140
120
100
80
140
120
100
80
V
=
15 V
CC
V
T
=
15 V
CC
T
A
= 25°C
= 25°C
A
k
SVR−
60
60
k
SVR+
40
40
20
20
0
0
10
10
100
1 k
10 k 100 k 1 M 10 M 100 M
100
1 k
10 k 100 k 1 M 10 M 100 M
f − Frequency − Hz
f − Frequency − Hz
Figure 27
Figure 28
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
16
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ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢋꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢊꢅ ꢋꢆ ꢇ ꢈ
ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
SHORT-CIRCUIT OUTPUT CURRENT
SHORT-CIRCUIT OUTPUT CURRENT
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
44
42
40
38
36
34
32
30
−42
−40
−38
−36
−34
−32
−30
V
V
T
= −100 mV
= 0
= 25°C
V
V
T
= 100 mV
= 0
= 25°C
ID
O
A
ID
O
A
P Package
P Package
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
V
− Supply Voltage − V
V
− Supply Voltage − V
CC
CC
Figure 29
Figure 30
SHORT-CIRCUIT OUTPUT CURRENT
SHORT-CIRCUIT OUTPUT CURRENT
vs
vs
ELAPSED TIME
ELAPSED TIME
− 45
44
42
40
38
36
34
V
= 15 V
V
CC
= 15 V
CC
V
V
T
= 100 mV
V
V
T
= 100 mV
= 0
= 25°C
ID
O
A
ID
O
A
= 0
− 43
− 41
− 39
− 37
− 35
= 25°C
P Package
P Package
0
30
60
90
120
150
180
0
30
60
90
120
150
180
t − Elapsed Time − s
t − Elapsed Time − s
Figure 31
Figure 32
17
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ꢀ ꢁ ꢂꢃ ꢄ ꢃ ꢅ ꢆꢇꢈꢉ ꢀ ꢁ ꢂ ꢃ ꢄ ꢊꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢃꢅ ꢋ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢋꢆꢇ ꢈ
ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
†
†
SHORT-CIRCUIT OUTPUT CURRENT
SHORT-CIRCUIT OUTPUT CURRENT
vs
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
− 48
− 44
− 40
− 36
− 32
− 28
− 24
46
42
38
34
30
26
V
V
V
=
15 V
V
= 15 V
CC
CC
= 100 mV
V
ID
V
O
= −100 mV
= 0
ID
O
= 0
P Package
P Package
− 75 − 50 − 25
0
25 50 75 100 125 150
− 75 − 50 − 25
0
25 50 75 100 125 150
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
Figure 33
Figure 34
†
†
SUPPLY CURRENT
SUPPLY CURRENT
vs
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
6
5
4
3
2
1
0
5
4.5
4
V
V
= 15 V
CC
= 0
V
= 0
O
O
No Load
No Load
Sample Size = 836 Units
From 2 Wafer Lots
T
= 125°C
A
T
A
= 25°C
T
A
= − 55°C
3.5
3
2.5
0
2
4
6
8
10 12 14 16 18 20
− 75 − 50 − 25
0
25 50 75 100 125 150
T
A
− Free-Air Temperature − °C
V
− Supply Voltage − V
CC
Figure 35
Figure 36
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
18
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ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢋꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢊꢅ ꢋꢆ ꢇ ꢈ
ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
TLE2027
VOLTAGE-FOLLOWER
SMALL-SIGNAL
VOLTAGE-FOLLOWER
LARGE-SIGNAL
PULSE RESPONSE
PULSE RESPONSE
100
50
15
10
V
=
15 V
V
=
15 V
CC
L
L
CC
L
L
R
C
T
= 2 kΩ
= 100 pF
= 25°C
R
C
T
= 2 kΩ
= 100 pF
= 25°C
A
A
See Figure 4
See Figure 1
5
0
0
− 5
− 10
− 15
− 50
− 100
0
200
400
600 800
1000
0
5
10
15
20
25
t − Time − ns
t − Time − µs
Figure 37
Figure 38
TLE2037
VOLTAGE-FOLLOWER
LARGE-SIGNAL
PULSE RESPONSE
TLE2037
VOLTAGE-FOLLOWER
SMALL-SIGNAL
PULSE RESPONSE
100
15
10
5
V
=
15 V
CC
A
R
C
= 5
= 2 kΩ
= 100 pF
= 25°C
VD
L
L
50
0
T
A
See Figure 1
0
V
CC
=
15 V
− 5
A
R
= 5
= 2 kΩ
VD
L
− 50
− 100
C
= 100 pF
= 25°C
L
− 10
− 15
T
A
See Figure 4
0
100
200
300
400
0
2
4
6
8
10
t − Time − µs
t − Time − ns
Figure 39
Figure 40
19
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ꢀ ꢁ ꢂꢃ ꢄ ꢃ ꢅ ꢆꢇꢈꢉ ꢀ ꢁ ꢂ ꢃ ꢄ ꢊꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢃꢅ ꢋ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢋꢆꢇ ꢈ
ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
NOISE VOLTAGE
(REFERRED TO INPUT)
OVER A 10-SECOND INTERVAL
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
10
8
50
40
V
=
15 V
CC
V
=
15 V
CC
R
= 20 Ω
= 25°C
S
f = 0.1 to 10 Hz
T
A
T
A
= 25°C
See Figure 2
30
Sample Size = 100 Units
From 2 Wafer Lots
20
6
10
0
4
− 10
− 20
− 30
− 40
− 50
2
0
1
10
100
1 k
10 k
100 k
0
2
4
6
8
10
f − Frequency − Hz
t − Time − s
Figure 41
Figure 42
TLE2027
UNITY-GAIN BANDWIDTH
vs
TLE2037
GAIN-BANDWIDTH PRODUCT
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
20
18
16
14
12
10
52
51
50
R
C
T
= 2 kΩ
= 100 pF
= 25°C
L
L
A
f = 100 kHz
R
C
= 2 kΩ
= 100 pF
L
L
See Figure 3
T
A
= 25°C
49
48
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20 22
| V
CC
| − Supply Voltage − V
V
− Supply Voltage − V
CC
Figure 43
Figure 44
20
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ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
UNITY-GAIN BANDWIDTH
vs
LOAD CAPACITANCE
TLE2037
GAIN-BANDWIDTH PRODUCT
vs
LOAD CAPACITANCE
16
12
8
52
51
50
49
48
V
= 15 V
CC
L
V
R
=
15 V
= 2 kΩ
L
R
T
= 2 kΩ
= 25°C
CC
A
See Figure 3
T
A
= 25°C
4
0
100
1000
10000
100
1000
10000
C
− Load Capacitance − pF
C
− Load Capacitance − pF
L
L
Figure 45
TLE2027
Figure 46
†
TLE2037
SLEW RATE
SLEW RATE
†
vs
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
3
2.8
2.6
2.4
2.2
2
10
9
V
=
= 5
= 2 kΩ
= 100 pF
15 V
CC
A
R
C
VD
L
L
See Figure 1
8
7
V
=
= 1
= 2 kΩ
= 100 pF
15 V
CC
A
R
C
VD
6
L
L
See Figure 1
5
− 75 − 50 − 25
0
25
50
75 100 125 150
− 75 − 50 − 25
0
25 50 75 100 125 150
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
Figure 47
Figure 48
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
21
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ꢀ ꢁ ꢂꢃ ꢄ ꢃ ꢅ ꢆꢇꢈꢉ ꢀ ꢁ ꢂ ꢃ ꢄ ꢊꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢃꢅ ꢋ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢋꢆꢇ ꢈ
ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
PHASE MARGIN
vs
TLE2037
PHASE MARGIN
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
58°
56°
54°
52°
50°
48°
46°
44°
42°
52°
R
C
T
= 2 kΩ
= 100 pF
= 25°C
L
L
A
A
R
C
= 5
VD
L
L
= 2 kΩ
= 100 pF
= 25°C
50°
48°
See Figure 3
T
A
46°
44°
42°
40°
38°
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20 22
| V
CC
| − Supply Voltage − V
V
− Supply Voltage − V
CC
Figure 49
Figure 50
TLE2027
PHASE MARGIN
vs
TLE2037
PHASE MARGIN
vs
LOAD CAPACITANCE
LOAD CAPACITANCE
60°
50°
60°
50°
40°
30°
20°
V
= 15 V
CC
L
V
=
15 V
CC
R
T
= 2 kΩ
= 25°C
R
T
A
= 2 kΩ
= 25°C
L
A
See Figure 3
40°
30°
20°
10°
10°
0°
0°
100
1000
10000
100
1000
C
− Load Capacitance − pF
C
− Load Capacitance − pF
L
L
Figure 51
Figure 52
22
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ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢋꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢊꢅ ꢋꢆ ꢇ ꢈ
ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
TLE2027
PHASE MARGIN
vs
†
TLE2037
PHASE MARGIN
vs
†
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
65°
60°
55°
50°
45°
40°
35°
55°
V
= 15 V
V
CC
=
= 5
15 V
CC
L
R
T
= 2 kΩ
= 25°C
A
R
C
VD
L
L
= 2 kΩ
= 100 pF
A
53°
51°
See Figure 3
49°
47°
45°
− 75 − 50 − 25
0
25 50 75 100 125 150
− 75 − 50 − 25
0
25
50
75 100 125 150
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
Figure 53
Figure 54
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
23
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ꢀ ꢁ ꢂꢃ ꢄ ꢃ ꢅ ꢆꢇꢈꢉ ꢀ ꢁ ꢂ ꢃ ꢄ ꢊꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢃꢅ ꢋ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢋꢆꢇ ꢈ
ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
APPLICATION INFORMATION
input offset voltage nulling
The TLE2027 and TLE2037 series offers external null pins that can be used to further reduce the input offset
voltage. The circuits of Figure 55 can be connected as shown if the feature is desired. If external nulling is not
needed, the null pins may be left disconnected.
1 kΩ
V
CC +
10 kΩ
4.7 kΩ
V
CC +
4.7 kΩ
IN −
IN +
−
+
IN −
−
OUT
OUT
IN +
+
V
V
CC −
CC −
(b) ADJUSTMENT WITH IMPROVED SENSITIVITY
(a) STANDARD ADJUSTMENT
Figure 55. Input Offset Voltage Nulling Circuits
voltage-follower applications
The TLE2027 circuitry includes input-protection diodes to limit the voltage across the input transistors; however,
no provision is made in the circuit to limit the current if these diodes are forward biased. This condition can occur
when the device is operated in the voltage-follower configuration and driven with a fast, large-signal pulse. It
is recommended that a feedback resistor be used to limit the current to a maximum of 1 mA to prevent
degradation of the device. Also, this feedback resistor forms a pole with the input capacitance of the device.
For feedback resistor values greater than 10 kΩ, this pole degrades the amplifier phase margin. This problem
can be alleviated by adding a capacitor (20 pF to 50 pF) in parallel with the feedback resistor (see Figure 56).
C
= 20 to 50 pF
F
I ≤ 1 mA
F
R
F
V
CC
−
V
O
V
I
+
V
CC−
Figure 56. Voltage Follower
24
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢆꢇꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢃ ꢅ ꢋꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢊꢅ ꢋꢆ ꢇ ꢈ
ꢂꢌ ꢍꢋꢁ ꢎꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎꢕ ꢂ ꢖꢎ ꢗ ꢖꢆ ꢕꢘ ꢂ ꢂꢙ
ꢘꢑꢂ ꢍꢎꢕ ꢎꢒ ꢔ ꢒ ꢘꢂꢑ ꢋꢀ ꢎꢒ ꢔꢋꢁ ꢋꢚ ꢘ ꢁꢎ ꢛꢎ ꢂꢑ ꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice. The Boyle macromodel (see Note 6) and subcircuit in Figure 57, Figure 58, and
Figure 59 were generated using the TLE20x7 typical electrical and operating characteristics at 25°C. Using this
information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most
cases):
• Maximum positive output voltage swing
• Maximum negative output voltage swing
• Slew rate
• Gain-bandwidth product
• Common-mode rejection ratio
• Phase margin
• Quiescent power dissipation
• Input bias current
• DC output resistance
• AC output resistance
• Open-loop voltage amplification
• Short-circuit output current limit
NOTE 6: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers”, IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
99
+
3
dln
91
V
egnd
CC +
9
92
fb
rc1
11
rc2
12
−
c1
+
ro2 90
hlim
rp
+
−
+ dip
vb
1
vip
IN +
IN −
vin
+
−
−
−
−
+
vc
53
Q1
Q2
r2
C2
6
7
2
dp
13
+
14
ree
re2
cee
vlim
ga
gcm
dc
re1
−
8
10
ro1
lee
de
54
V
CC −
5
−
+
4
ve
OUT
Figure 57. Boyle Macromodel
PSpice and Parts are trademarks of MicroSim Corporation.
25
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄ ꢃ ꢅ ꢆꢇꢈꢉ ꢀ ꢁ ꢂ ꢃ ꢄ ꢊꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢃꢅ ꢋ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊ ꢅ ꢋꢆꢇ ꢈ
ꢂ ꢌꢍꢋ ꢁ ꢎ ꢏꢐ ꢑ ꢁ ꢒꢓꢆꢔꢒ ꢎ ꢕ ꢂ ꢖꢎ ꢗ ꢖꢆꢕ ꢘꢂ ꢂ ꢙ
ꢘ ꢑꢂꢍ ꢎ ꢕꢎ ꢒꢔ ꢒꢘꢂ ꢑꢋꢀꢎ ꢒ ꢔꢋ ꢁ ꢋꢚ ꢘꢁ ꢎ ꢛꢎ ꢂꢑꢕ
ꢜ
SGLS202A − OCTOBER 2003 – REVISED OCTOBER 2006
APPLICATION INFORMATION
macromodel information (continued)
q2
12
6
1
9
14 qx
100.0E3
530.5
530.5
−393.2
−393.2
3.571E6
25
.subckt TLE2027 1 2 3 4 5
*
r2
rc1
rc2
re1
re2
ree
ro1
ro2
rp
3
11
12
10
10
99
5
c1
11
6
12
7
4.003E-12
3
c2
20.00E-12
13
14
10
8
dc
5
53
5
dz
de
54
90
92
4
dz
dlp
dln
dp
91
90
3
dz
dx
7
99
4
25
dz
3
8.013E3
egnd
99
0
poly(2) (3,0)
vb
9
0
dc
0
(4,0) 0 5 .5
vc
3
53
4
dc 2.400
dc 2.100
fb
7
99
poly(5) vb vc
ve
54
7
ve vlp vln 0 954.8E6 −1E9 1E9 1E9
−1E9
vlim
vlp
vln
8
dc
0
91
0
0
dc 40
dc 40
ga
6
0
11 12
92
2.062E-3
gcm
.modeldx D(Is=800.0E-18)
.modelqx NPN(Is=800.0E-18
Bf=7.000E3)
0
6
10 99
531.3E-12
iee
10
90
11
4
0
2
dc 56.01E-6
vlim 1K
13 qx
.ends
hlim
q1
Figure 58. TLE2027 Macromodel Subcircuit
.subckt TLE2037 1 2 3 4 5
*
q2
r2
12
6
1
9
14 qz
100.0E3
471.5
471.5
A448
c1
11
6
12
7
4.003E−12
rc1
rc2
re1
re2
ree
ro1
ro2
rp
3
11
12
10
10
99
5
c2
7.500E−12
3
dc
5
53
5
dz
13
14
10
8
de
54
90
92
4
dz
A448
dlp
dln
dp
91
90
3
dz
3.555E6
25
25
8.013E3
dc 0
dx
dz
7
99
4
egnd
99
0
poly(2) (3,0)
3
(4,0)
0
.5 .5
vb
9
0
fb
7
99
poly(5) vb vc
vc
3
53
4
dc 2.400
dc 2.100
ve vip vln 0 923.4E6 A800E6
800E6 800E6 A800E6
ve
54
7
vlim
vlp
vln
.model
.model
8
dc
0
ga
6
0
0
6
4
0
2
11 12 2.121E−3
10 99 597.7E−12
dc 56.26E−6
vlim 1K
91
0
0
dc 40
dc 40
gcm
iee
hlim
q1
92
10
90
11
dxD(Is=800.0E−18)
qxNPN(Is=800.0E−18
13 qx
Bf=7.031E3)
.ends
Figure 59. TLE2037 Macromodel Subcircuit
26
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Oct-2007
PACKAGING INFORMATION
Orderable Device
TLE2037AQDRG4Q1
TLE2037AQDRQ1
TLE2037QDRG4Q1
TLE2037QDRQ1
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
D
D
D
2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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