TLC5958RTQT [TI]
具有预充电 FET、LED 开路检测功能和 48k 位存储器的 48 通道、16 位 ES-PWM LED 驱动器 | RTQ | 56 | -40 to 85;
| 型号： | TLC5958RTQT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有预充电 FET、LED 开路检测功能和 48k 位存储器的 48 通道、16 位 ES-PWM LED 驱动器 | RTQ | 56 | -40 to 85 驱动 接口集成电路 存储 驱动器 |
| 文件： | 总31页 (文件大小：1876K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TLC5958
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
TLC5958 具有预充电场效应晶体管 (FET)、LED 开路检测功能和显示数据
存储器
且支持 32 路多路复用的 48 通道 16 位 ES-PWM LED 驱动器
1 特性
•
工作温度范围：-40°C 至 +85°C
1
•
•
48 通道恒流灌电流输出
2 应用范围
具有最大亮度控制 (BC)/最大颜色亮度控制 (CC) 数
据的灌电流：
•
•
•
采用多路复用系统的 LED视频显示屏
采用多路复用系统的 LED 信号板
高刷新率、高密度的 LED 面板
–
–
5VCC 时为 25mA
3.3VCC 时为 20mA
•
•
全局亮度控制 (BC)：3 位（8 步长）
3 说明
每个颜色组的颜色亮度控制 (CC)：
9 位（512 步长），三组
TLC5958 是一款 48 通道恒流灌电流驱动器，适用于
占空比为 1 至 32 的多路复用系统。 每个通道都具有
单独可调的 65536 步长脉宽调制 (PWM) 灰度 (GS)。
•
使用多路复用增强型光谱 (ES) PWM 进行灰度
(GS) 控制：16 位
•
•
•
•
支持 32 路多路复用的 48K 位灰度数据存储器
LED 电源电压高达 10V
Vcc = 3.0V 至 5.5V
采用 48K 位显示存储器以提升视觉刷新率，同时降低
GS 数据写入频率。
输出通道分为三组，每组含 16 个通道。 各组都具有
512 步长颜色亮度控制 (CC) 功能。 全部 48 通道的最
大电流值可通过 8 步长全局亮度控制 (BC) 功能设置。
CC 和 BC 可用于调节 LED 驱动器之间的亮度偏差。
可通过一个串行接口端口访问 GS、CC 和 BC 数据。
恒流精度
–
–
通道之间 = ±1%（典型值），±3%（最大值）
器件之间 = ±1%（典型值），±2%（最大值）
•
•
•
•
•
•
•
•
数据传输速率：25MHz
灰度时钟频率：33MHz
LED 开路检测 (LOD)
如需应用手册：《使用 TLC5958 构建高密度、高刷新
率多路复用 LED 面板》，请通过电子邮件发送请求。
热关断 (TSD)
IREF 电阻器短路保护 (ISP)
可快速恢复的节能模式 (PSM)
延迟开关可防止浪涌电流
预充电 FET 可避免重影现象
器件信息(1)
封装
部件号
TLC5958
封装尺寸（标称值）
VQFN (56)
8.00mm x 8.00mm
(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。
4 典型应用电路（多个菊花链 TLC5958）
VLED
SW
COM
n
COM
n
VLED
SW
COM
1
COM
1
VLED
SW
COM
0
COM
0
X
48
X 48
OUTR0
OUTB15
SOUT
OUTR0
OUTB15
SOUT
DATA
SCLK
LAT
SIN
SIN
TLC5958
IC1
VCC
TLC5958
ICn
VCC
SCLK
LAT
SCLK
LAT
VCC
VCC
Controller
GCLK
GCLK
IREF
GCLK
IREF
Thermal
Pad
Thermal
Pad
FLAGS
READ
IREFGND
IREFGND
GND
GND
GND
GND
3
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLVSCE7
TLC5958
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
目录
Diagrams.................................................................. 11
9.2 Timing Diagrams..................................................... 13
10 Detailed Description ........................................... 14
10.1 Overview ............................................................... 14
10.2 Functional Block Diagram ..................................... 15
10.3 Device Functional Modes...................................... 16
11 Application and Implementation........................ 20
12 Power Supply Recommendations ..................... 20
13 Layout................................................................... 20
13.1 Layout Guidelines ................................................. 20
13.2 Layout Example .................................................... 20
14 器件和文档支持 ..................................................... 21
14.1 商标....................................................................... 21
14.2 静电放电警告......................................................... 21
14.3 术语表 ................................................................... 21
15 机械封装和可订购信息 .......................................... 21
1
2
3
4
5
6
7
8
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
典型应用电路（多个菊花链 TLC5958） .................. 1
修订历史记录 ........................................................... 2
说明（继续） ........................................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
8.1 Absolute Maximum Ratings ...................................... 5
8.2 Handling Ratings ...................................................... 5
8.3 Recommended Operating Conditions....................... 5
8.4 Thermal Information ................................................. 6
8.5 Electrical Characteristics........................................... 7
8.6 Typical Characteristics.............................................. 9
Parameter Measurement Information ................ 11
9.1 Pin Equivalent Input and Output Schematic
9
5 修订历史记录
Changes from Original (May 2014) to Revision A
Page
•
已删除 已删除产品预览条 - 设置为生产数据；通改................................................................................................................ 1
2
版权 © 2014, Texas Instruments Incorporated
TLC5958
www.ti.com.cn
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
6 说明（继续）
TLC5958 有一个错误标志：LED 开路检测 (LOD)，可通过串行接口端口读取。 TLC5958 还具有节电模式，可在全
部输出关闭后将总流耗设为 0.8mA（典型值）。
7 Pin Configuration and Functions
56 Pin
RTQ
（TOP VIEW）
56 55 54 53 52 51 50 49 48 47 46 45 44 43
SOUT
IREF
OUTR14
OUTG14
OUTB14
OUTR15
OUTG15
OUTB15
OUTR0
OUTG0
OUTB0
1
2
3
4
5
6
7
42
41
40
39
38
OUTB9
OUTG9
OUTR9
OUTB8
OUTG8
OUTR8
OUTB7
OUTG7
OUTR7
OUTB6
OUTG6
OUTR6
GCLK
37
36
Thermal
PAD
(Solder side)
(GND terminal)
35
34
33
32
31
30
29
8
9
10
11
12
13
14
OUTR1
OUTG1
OUTB1
OUTR2
15 16 17 18
27 28
19 20 21 22 23 24 25 26
Pin Functions
PIN
I/O
DESCRIPTION
NAME
GCLK
GND
NO.
Grayscale(GS) pulse width modulation (PWM) reference clock control for OUTXn.
Each GCLK rising edge increase the GS counter by1 for PWM control.
29
I
ThermalPad
–
Power ground. The thermal pad must be soldered to GND on PCB.
Maximum constant-current value setting. The OUTR0 to OUTB15 maximum constant output
current are set to the desired values by connecting an external resistor between IREF and
IREFGND. See equation 1 for more detail. The external resistor should be placed close to
the device.
IREF
1
–
Analog ground. Dedicated ground pin for the external IREF resistor. This pin should be
connected to analog ground trace which is connected to power ground near the common
GND point of board.
IREFGND
LAT
56
27
–
I
The LAT falling edge latches the data from the common shift register into the GS data
memory or Function control(FC) register FC1 or FC2.
8, 11, 14, 17,
20, 23, 30,
33, 36, 39,
44, 47, 50,
53 ,2, 5
Constant current output for RED LED. Multiple outputs can be tied together to increase the
constant current capability. Different voltages can be applied to each output. These outputs
are turned on-off by GCLK signal and the data in GS data memory.
OUTR0-R15
O
Copyright © 2014, Texas Instruments Incorporated
3
TLC5958
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
9, 12, 15, 18,
21, 24, 31,
34, 37, 40,
45, 48, 51,
54, 3, 6
Constant current output for GREEN LED. Multiple outputs can be tied together to increase
the constant current capability. Different voltages can be applied to each output. These
outputs are turned on-off by GCLK signal and the data in GS data memory.
OUTG0-G15
O
O
10, 13, 16,
19, 22, 25,
32, 35, 38,
41, 46, 49,
52, 55, 4, 7
Constant current output for BLUE LED. Multiple outputs can be tied together to increase the
constant current capability. Different voltages can be applied to each output. These outputs
are turned on-off by GCLK signal and the data in GS data memory.
OUTB0-B15
Serial data shift clock. Data present on SIN are shifted to the 48-bit common shift register
LSB with the SCLK rising edge. Data in the shift register are shifted towards the MSB at
each SCLK rising edge. The common shift register MSB appears on SOUT.
SCLK
SIN
28
I
I
Serial data input of the 48-bit common shift register. When SIN is high level, the LSB is set
to '1' for only one SCLK input rising edge. If two SCLK rising edges are input while SIN is
high, then the 48-bit shift register LSB and LSB+1 are set to '1'. When SIN is low, the LSB is
set to '0' at the SCLK input rising edge.
26
Serial data output of the 48-bit common shift register. SOUT is connected to the MSB of the
register.
SOUT
VCC
42
43
O
–
Power-supply voltage.
4
Copyright © 2014, Texas Instruments Incorporated
TLC5958
www.ti.com.cn
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
PARAMETER
MIN
MAX
6.0
UNIT
V
(2)
VCC
IOUT
Supply voltage
Output current (dc)
Input voltage
VCC
0.3
OUTx0 to OUTx15, x=R, G, B
SIN, SCLK, LAT, GCLK, IREF
SOUT
30
mA
V
(2)
VIN
–0.3
–0.3
–0.3
VCC+0.3
VCC+0.3
11
(2)
VOUT
Output voltage
V
OUTx0 to OUTx15, x=R, G, B
TJ(MAX)
Operating junction temperature
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to device ground terminal.
8.2 Handling Ratings
MIN
–55
0
MAX
150
UNIT
Tstg
Storage temperature range
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
4000
pins(2)
Electrostatic
discharge
(1)
V(ESD)
V
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins(3)
0
1000
(1) Electrostatic discharge (ESD) measures device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
At TA = –40°C to +85°C, unless otherwise noted
MIN
NOM
MAX UNIT
DC CHARACTERISTICS, VCC=3V to 5.5V
VCC
VO
Supply voltage
3
5.5
V
V
Voltage applied to output
High level input voltage
Low level input voltage
High level output current
Low level output current
OUTx0 to OUTx15, x=R, G, B
SIN,SCLK,LAT,GCLK
SIN,SCLK,LAT,GCLK
SOUT
10
VCC
VIH
VIL
IOH
IOL
0.7×VCC
GND
V
0.3×VCC
-2
V
mA
mA
SOUT
2
OUTx0 to OUTx15, x=R, G, B,
3V ≤ VCC ≤ 3.6V
20
25
IOLC
Constant output sink current
mA
OUTx0 to OUTx15, x=R, G, B,
4V < VCC ≤ 5.5V
TA
TJ
Operating free air temperature
Operation junction temperature
–40
-40
85
°C
°C
125
Copyright © 2014, Texas Instruments Incorporated
5
TLC5958
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
MAX UNIT
Recommended Operating Conditions (continued)
At TA = –40°C to +85°C, unless otherwise noted
MIN
NOM
AC CHARACTERISTICS, VCC=3V to 5.5V(1)
FCLK(SCLK)
FCLK(GCLK)
tWH0
Data shift clock frequency
SCLK
25
33
MHz
MHz
Grayscale control clock frequency GCLK
SCLK
10
10
15
10
2
tWL0
SCLK
Pulse duration
GCLK
ns
tWH1
tWL1
GCLK
tSU0
SIN - SCLK↑
tSU1
LAT↑ - SCLK↑
LAT↓ - SCLK↑
3
5
ns
tSU2
LAT↓ - SCLK↑, for READSID, READFC1,
and READFC2
50
Setup time
tSU3
tSU4
LAT↓ (Vsync command) - GCLK↑
2500
The last LAT↓ for no all ‘0’ data latching to
resume normal mode – GCLK↑,
PSAVE_ENA bit = ‘1b’
50
µS
ns
tSU5
tH0
The last GCLK↑ - the 1st GCLK↑ of next line
SCLK↑ - SIN
20
2
tH1
Hold time
SCLK↑ - LAT↑
2
ns
tH2
SCLK↑ - LAT↓
13
(1) Specified by design
8.4 Thermal Information
TLC5958
RTQ
56 PINS
27.4
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
13.6
5.5
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
5.5
RθJC(bot)
0.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
Copyright © 2014, Texas Instruments Incorporated
TLC5958
www.ti.com.cn
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
8.5 Electrical Characteristics
At VCC= 3.0V to 5.5V and TA= –40°C to 85°C, VLED=5.0V, Typical values are at VCC= 3.3V, TA= 25°C (unless otherwise
noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VCC
0.4
UNIT
VOH
High
Low
IOH = -2mA at SOUT
IOL= 2 mA at SOUT
LODVTH = 00b
LODVTH = 01b
LODVTH = 10b
LODVTH = 11b
VCC–0.4
V
Output voltage
VOL
V
VLOD0
VLOD1
VLOD2
VLOD3
VIREF
IIN
0.06
0.2
0.11
0.25
0.16
0.3
LED open detection threshold
V
0.34
0.44
1.19
–1
0.39
0.44
0.54
1.228
1
0.49
Reference voltage output
Input current (SIN, SCLK)
RIREF = 6.2 kΩꢀ(1mA target), BC=0h, CCR/G/B=81h
1.209
V
VIN = VCC or GND
µA
SIN/SCLK/LAT/GSCLK=GND, GSn=0000h, BC=0h,
CCR/G/B=81h, VOUTn = Vcc, RIREF=OPEN
5.5
7
7
ICC0
ICC1
SIN/SCLK/LAT/GSCK=GND, GSn=0000h, BC=4h,
CCR/G/B=137h,VOUTn=Vcc, RIREF=7.5kΩ (Io=10mA target)
9
SIN/SCLK/LAT=GND, GCLK=33MHz, TSU5 = 200nS,
8+8 mode, GSn=FFFFh, BC=4h, CCR/G/B=137h,
VOUTn=Vcc-1V when channel on, VOUTn=Vcc
when channel off. RIREF=7.5kΩ (Io=10mA target)
25
31
ICC2
Supply current (Vcc)
mA
SIN/SCLK/LAT=GND, GCLK=33MHz, TSU5=200nS,
8+8 mode, GSn=FFFFh, BC=7h, CCR/G/B=1F5h,
VOUTn=Vcc-2.5V when channel on, VOUTn=Vcc
when channel off. RIREF=7.5kΩ (Io=25mA target)
28
33
ICC3
ICC4
In power save mode
0.9
1.5
All OUTn=on, BC=0h, CCR/G/B=81h, VOUTn=VOUTfix=1V,
RIREF=6.2kΩ(1mA target), TA = +25°C, at same color
grouped output of OUTR0-15, OUTG0-15 and OUTB0-15
±1%
±3%
Constant current error
(OUTx0-15, x=R/G/B)
Channel-to-
channel(1)
ΔIOLC0
All OUTn=on, BC=0h, CCR/G/B=81h, VOUTn=VOUTfix=1V,
RIREF=6.2kΩ(1mA target), TA =+25°C, at same color
grouped output of OUTR0-15, OUTG0-15 and OUTB0-15
±1%
±2%
Constant current error
(OUTx0-15, x=R/G/B)
Device-to-
device(2)
ΔIOLC1
VCC=3.0 to 5.5V, All OUTn=on, BC=0h, CCR/G/B=81h,
VOUTn=VOUTfix=1V, RIREF=6.2kΩꢀ(1mA target)
ΔIOLC2
ΔIOLC3
Line regulation(3)
Load regulation(4)
±1
±1
±1.5
±1.5
%/V
%/V
All OUTn=on, BC=0h, CCR/G/B=81h, VOUTn=1 to 3V,
VOUTfix=1V, RIREF=6.2kΩꢀ(1mA target)
(1) The deviation of each outputs in same color group (OUTR0~15 or OUTG0~15 or OUTB0~15) from the average of same color group
constant current. The deviation is calculated by the formula. (X=R or G or B, n=0~15)
é
ê
ê
ê
ù
ú
IOUTXn
D %
( )
=
-1 ´100
ú
(IOUTX0 + IOUTX1+ ¼+ IOUTX14 + IOUTX15)
16
ú
ê
ë
ú
û
spacer
(2) The deviation of the average of constant-current in each color group from the ideal constant-current value. (X = R or G or B) :
é (IOUTX0 + IOUTX1 + ¼ + IOUTX15)
ù
ú
ú
ú
- (Ideal Output Current)
ê
16
D %
( )
=
´100
ê
Ideal Output Current
ê
ê
ë
ú
û
Ideal current is calculated by the following equation:
é
ê
ù
ú
V
IREF
(W)
Ideal Output mA = Gain ´
´ CCR or CCG, CCB /511d, VIREF = 1.209V Typ ,
(
)
(
)
(
)
R
ê
ë
ú
û
IREF
Refer to Table 1 for the Gain at chosen BC.
spacer
(3) Line regulation is calculated by the following equation. (X=R or G or B, n=0~15):
é
ù
(IOUTXn at VCC = 5.5V) – IOUTXn at VCC = 3.0V
(
)
100
D %V
(
=
´
ê
ú
)
IOUTXn at VCC = 3.0V
5.5V – 3V
(
)
ê
ú
ë
û
spacer
(4) Load regulation is calculated by the following equation. (X=R or G or B, n=0~15):
é
ù
(IOUTXn at VOUTXn = 3V) – IOUTXn at VOUTXn = 1V
(
)
100
D %V
(
=
´
ê
ú
)
IOUTXn at VOUTXn = 1V
3V – 1V
(
)
ê
ú
ë
û
spacer
Copyright © 2014, Texas Instruments Incorporated
7
TLC5958
ZHCSCU5A –MAY 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
Electrical Characteristics (continued)
At VCC= 3.0V to 5.5V and TA= –40°C to 85°C, VLED=5.0V, Typical values are at VCC= 3.3V, TA= 25°C (unless otherwise
noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
All OUTn=on, BC=7h, CCR/G/B=1F7h, VOUTn=VOUTfix=1V,
RIREF=7.5kΩ(25mA target), TA =+25°C, at same color
grouped output of OUTR0-15, OUTG0-15 & OUTB0-15
Channel-to-
channel(1)
Constant current error
(OUTx0-15, x=R/G/B)
ΔIOLC4
±1%
±3%
All OUTn=on, BC=7h, CCR/G/B=1F7h, VOUTn=VOUTfix=1V,
RIREF=7.5kΩ(25mA target), TA = +25°C, at same color
grouped output of OUTR0-15, OUTG0-15 and OUTB0-15
Device-to-
device(2)
Constant current error
(OUTx0-15, x=R/G/B)
ΔIOLC5
±1%
±2%
±1.5
VCC=3.0 to 5.5V, All OUTn=on, BC=7h, CCR/G/B=1F7h,
VOUTn=VOUTfix=1V, RIREF=7.5Kohmꢀ(25mA target)
ΔIOLC6
ΔIOLC7
Line regulation(3)
Load regulation(4)
±1
±1
%/V
%/V
All OUTn=on, BC=7h, CCR/G/B=1F7h, VOUTn=1 to 3V,
VOUTfix=1V, RIREF=7.5kΩꢀ(25mA target)
±1.5
180
TTSD
Thermal shutdown threshold(5)
Thermal shutdown hysterisis
160
170
10
°C
°C
V
THYS
VISP(in)
IREF resistor short protection threshold
0.135
0.19
IREF resistor short-protection release
threshold
V
VISP(out)
0.325
0.375
RPDWN
RPUP
Pull-down resistor
Pull-up resistor
LAT
250
250
500
500
750
750
kΩ
kΩ
V
GCLK
All OUTn=on, BC=4h, CCR/G/B=137h, Riref=7.5kΩ.
(Io=10mA target)
0.32
0.35
(5)
Vknee
Knee voltage (OUTX 0~15), X=R/G/B
(5) Specified by design.
8
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8.6 Typical Characteristics
VCC= 3.3V and TA= 25°C, unless otherwise noted.
35
35
30
25
20
15
10
5
1 mA
1 mA
5 mA
10 mA
20 mA
25 mA
5 mA
30
25
20
15
10
5
10 mA
20 mA
0
0
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
1.5
2.0
Output Voltage (V)
Output Voltage (V)
C001
C002
VCC = 5V
CCR/G/B=1FFh,
BC=0
VCC = 3.3V
CCR/G/B=1FFh,
BC=0
Figure 1. Output Current vs Output Voltage
Figure 2. Output Current vs Output Voltage
12
10
8
3
2
1
6
0
4
±1
±2
±3
VCC = 3.3 V Min
T
T
T
= ±40C
A
V=3.3 V Max
CC
2
= 25C
A
V
= 5 V Min
CC
= 85C
V
= 5 V Max
A
CC
0
0.0
0.2
0.4
0.6
0.8
1.0
0
5
10
15
20
25
30
Output Voltage (V)
Output Current (mA)
C003
C004
VCC = 5V
Temperature
Changing
CCR/G/B=1FFh,
BC=0
VOUTXn = 0.8V
CCR/G/B=1FFh,
BC=0
Figure 3. Output Current vs Output Voltage
Figure 4. Constant Current Error (CH-to-CH) vs Output
Current
3
2
30
1 mA
5 mA
25
10 mA
1
20
20 mA
25 mA
15
0
±1
±2
±3
10
5
1 mA Min
1 mA Max
25 mA Min
25 mA Max
0
0
20
40
60
80
±40
±20
0
128
256
384
512
Ambient Temperature (C)
Color Control Data (Decimal)
C005
C006
VCC = 5V
VOUTXn = 0.8V
CCR/G/B = 1FFh,
BC = 0
VCC = 5V
VOUTXn = 0.8V
BC = 7
Figure 5. Constant-Current Error (CH-to-CH) vs Temperature
Figure 6. Color Control (CC) vs Output Current
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Typical Characteristics (continued)
VCC= 3.3V and TA= 25°C, unless otherwise noted.
30
35
30
25
20
15
10
5
1 mA
5 mA
25
10 mA
20
20 mA
25 mA
15
10
5
VCC=3.3V
VCC=5V
0
0
0
1
2
3
4
5
6
7
8
0
5
10
15
20
25
30
Brightness Control Data (Decimal)
Output Current (mA)
C007
C008
VCC = 5V
VOUTXn = 0.8V
CCR/G/B = 1FFh
VOUTXn = 0.8V
GCLK = 33MHz,
GSXn = FFFFh
CCR/G/B=1FFh,
BC=0
Figure 8. Supply Current (Icc) vs Output Current
Figure 7. Brightness Control (BC) vs Output Current
30
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
20
15
10
V
V
V
= 3 V
V
= 3 V
CC
CC
5
0
= 4 V
V
= 4 V
CC
CC
= 5.5 V
V
= 5.5 V
CC
CC
0
20
40
60
80
100
120
0
20
40
60
80
100
120
±40
±20
±40
±20
Ambient Temperature (C)
Ambient Temperature (C)
C009
C010
VOUTXn = 0.8V
CCR/G/B = 137h,
BC = 4, GCLK =
33MHz
GSXn = FFFFh,
RIREF = 7.5kΩ
(10mA target)
VOUTXn = 0.8V
CCR/G/B = 137h,
BC=4
GCLK=GND,
GSXn=0h
Figure 9. Supply Current (Icc) vs Temperature
Figure 10. Supply Current in Power Save Mode (Icc)
vs Temperature
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9 Parameter Measurement Information
9.1 Pin Equivalent Input and Output Schematic Diagrams
VCC
VCC
LAT
INPUT
GND
GND
Figure 11. SIN, SCLK
Figure 12. LAT
VCC
VCC
GCLK
OUTPUT
GND
GND
Figure 13. GCLK
Figure 14. SOUT
(1) X=R or G or B, n=0~15
OUTXn(1)
GND
Figure 15. OUTR0/G0/B0 Through OUTR15/G15/B15
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Pin Equivalent Input and Output Schematic Diagrams (continued)
9.1.1 Test Circuits
(1) CL includes measurement probe and jig capacitance.
(2) X=R or G or B, n=0~15
(1) CL includes measurement probe and jig capacitance.
RL
VCC
VCC
VLED
VCC
VCC
OUTXn(2)
GND
SOUT
CL(1)
CL(1)
GND
Figure 16. Rise Time and Fall Time Test Circuit for Figure 17. Rise Time and Fall Time Test Circuit for
OUTXn
SOUT
(1) X=R or G or B, n=0~15
V
OUTR0
CC
V
CC
OUTXn(1)
OUTB15
VOUTXn(1)
GND
VOUTfix
Figure 18. Constant Current Test Circuit for OUTXn
12
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9.2 Timing Diagrams
tWH0, WL0, WH1,tWL1,tWH2
t
t
INPUT
50%
GND
tWH
tWL
tSU0, SU1, SU2, SU3, SU4,tH0,tH1,tH2
t
t
t
t
CLOCK
INPUT(1)
50%
GND
tH
tSU
VCC
DATA/CONTROL
INPUT(1)
50%
GND
tSU5
GCLK(2)
1
2
3
255 256 257
1
2
255 256 257
TSU
(1) Input pulse rise and fall time is 1~3ns
(2) 8 + 8 mode (SEL_PWM=0)
Figure 19. Timing Diagrams
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10 Detailed Description
10.1 Overview
The TLC5958 is a 48 channels constant-current sink driver for multiplexing system with 1 to 32 duty ratio. Each
channel has an individually-adjustable, 65536-step, pulse width modulation (PWM) grayscale (GS).
48K bit display memory is implemented to increase the visual refresh rate and to decrease the GS data writing
frequency.
The TLC5958 support output current range from 1mA to 25mA, channel-to-channel accuracy is 3% max, device-
to-device accuracy is 2% max in all current range. Besides, it implement Low Gray Scale Enhancement
(LGSE™) technology to improve the display quality at low grayscale condition. These features make TLC5958
more suitable for high-density multiplexing application.
The output channels are grouped into three groups, each group has 16 channels. Each group has a 512-step
color brightness control (CC) function. The maximum current value of all 48 channels can be set by 8-step global
brightness control (BC) function. CC and BC can be used to adjust the brightness deviation between LED
drivers. GS, CC, and BC data are accessible via a serial interface port.
The TLC5958 has one error flag: LED open detection (LOD), which can be read via a serial interface port.
Besides, The TLC5958 also have Thermal shut down(TSD) and Iref resistor short protection(ISP), which make
sure a higher system reliability. The TLC5958 also has a power-save mode that sets the total current
consumption to 0.8mA (typ) when all outputs are off.
14
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10.2 Functional Block Diagram
OUTG0
OUTB0
OUTR1
OUTB15
OUTG15
OUTR0
VCC
VCC
LED Open Detection (LOD)
48
30
IREF
Reference
current
control
48CH Constant Current Sink
3bit BC and 27bit CC
Detection
Voltage
IREFGND
48
1
Programmable Group delay
2
48
GS Counter
Line read counter and
Sub-period counter
ES-PWM Decoder and
timing control for 48CH
Vsync
48
BANK_SEL
Line address
for read
Vsync
48kbit SRAM
BANK A
16bit x48CH
x 32Line
BANK B
16bit x48CH
x 32Line
48
Address
decoder and
writing control
WRTGS
Vsync
44bit FC1 register
17bit FC2 register
WRTFC
LAT
Command
Decoder
SCLK
43
LSB
MSB
READFC1/2
48bit Common shift register
SOUT
SIN
READSID
0
47
48
Power
save
control
To all
analog
circuit
48bit LOD data
Thermal
Pad
GND
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10.3 Device Functional Modes
After power on, all OUTXn of the TLC5958 are turned off. All the internal counters and function control registers
(FC1/FC2) are initialized. The following list is a brief summary of the sequence to operate the TLC5958, to give
users a general idea how the device works. After that, the function block related to each step is detailed in the
following sections.
1. According to required LED current, choose BC & CC code, select the current programming resistor RIREF.
2. Send WRTFC command to set FC1/2 register value if the default value need be changed.
3. Write GS data of all lines (max 32 lines) into one of the two memory BANKs.
4. Send Vsync command, the BANK with the GS data written just now will be displayed.
5. Input GCLK continuously, 257GCLK (or 513GCLK) as a segment. Between the interval of two segments,
supply voltage should be switched from one line to next line accordingly.
6. During the same period of step 5, GS data for next frame should be written into another BANK.
7. When the time of one frame ends, Vsync command should be input to swap the purpose of the two BANKs.
Repeat step 5 through 7.
10.3.1 Brightness Control (BC) Function
The TLC5958 is able to adjust the output current of all constant-current outputs simultaneously. This function is
called global brightness control (BC). The global BC for all outputs is programmed with a 3-bit word, thus all
output currents can be adjusted in 8 steps from 12.9% to 100% for a given current-programming resistor, RIREF
(See Table 2).
BC data can be set via the serial interface. When the BC data changes, the output current also changes
immediately. When the device is powered on, the BC data in the function control (FC) register FC1 is set to 4h
as the initial value.
10.3.2 Color Brightness Control (CC) Function
The TLC5958 is able to adjust the output current of each of the three color groups OUTR0-OUTR15, OUTG0-
OUTG15, and OUTB0-OUTB15 separately. This function is called color brightness control (CC). For each color,
it has 9-bit data latch CCR,CCG, or CCB in FC1 register . Thus, all color group output currents can be adjusted
in 512 steps from 0% to 100% of the maximum output current, IOLCMax. (See the next section for more detail
about IOLCMax). The CC data are entered via the serial interface. When the CC data change, the output current
also changes immediately.
When the IC is powered on, the CC data are set to ‘100h’. Equation 1 calculates the actual output current.
Iout(mA) = IOLCMax(mA) × ( CCR/511d or CCG/511d or CCB/511d)
(1)
Where:
IOLCMax = the maximum channel current for each channel, determined by BC data and RIREF (See Equation 2)
CCR/G/B = the color brightness control value for each color group in the FC1 register (000h to 1FFh)
Table 1 shows the CC data versus the constant-current against IOLCMax
.
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Device Functional Modes (continued)
Table 1. CC Data vs Current Ratio and Set Current Value
RATIO OF OUTPUT
CURRENT
CC DATA (CCR or CCG or CCB)
OUTPUT CURRENT (mA, RIREF = 7.41 kΩ)
TO IolcMax(%, typical)
BC = 7h
(IolcMax =25mA)
BC = 0h
(IolcMax=3.2mA)
BINARY
DECIMAL
HEX
0 0000 0000
0 0000 0001
0 0000 0010
---
0
1
00
01
02
---
0
0
0
0.2
0.4
---
0.05
0.10
---
0.006
0.013
---
2
---
1 0000 0000
(Default)
256
(Default)
100
(Default)
50.1
12.52
1.621
---
---
---
---
---
---
1 1111 1101
1 1111 1110
1 1111 1111
509
510
511
1FD
1FE
1FF
99.6
99.8
100.0
24.90
24.95
25
3.222
3.229
3.235
10.3.3 Select RIREF For a Given BC
The maximum output current per channel, IOLCMax, is determined by resistor RIREF, placed between the IREF and
IREFGND pins, and the BC code in FC1 register. The voltage on IREF is typically 1.209V. RIREF can be
calculated by Equation 2.
Riref(kΩ) = Viref(V) / IOLCMax(mA) × Gain
(2)
Where:
VIREF = the internal reference voltage on IREF (1.209V, typical)
IOLCMax is the largest current for each output at CCR/G/B=1FFh.
Gain = the current gain at a selected BC code (See Table 2 )
Table 2. Current Gain Versus BC Code
BC DATA
RATIO OF
GAIN
GAIN / GAIN_MAX (AT MAX
BC)
BINARY
HEX
000 (recommend)
0 (recommend
20.4
40.3
12.9%
25.6%
52.4%
12.9%
64.7%
73.3%
91.7%
100%
001
010
1
2
59.7
011
3
82.4
100 (default)
101
4 (default)
101.8
115.4
144.3
157.4
5
6
7
110
111
NOTE: Recommend using a smaller BC code for better performance. For noise immunity purposes, suggest RIREF < 60 kΩ
10.3.4 Choosing BC/CC For a Different Application
BC is mainly used for global brightness adjustment between day and night. Suggested BC is 4h, which is in the
middle of the range, thus, one can change brightness up and down flexibly.
CC can be used to fine tune the brightness in 512 steps, this is suitable for white balance adjustment between
RGB color group. To get a pure white color, the general requirement for the luminous intensity ratio of R, G, B
LED is 3:6:1. Depending on the characteristics of the LED (Electro-Optical conversion efficiency), the current
ratio of R, G, B LED will be much different from this ratio. Usually, the Red LED needs the largest current. One
can choose 511d (the max value) CC code for the color group that needs the largest initial current, then choose
proper CC code for the other two color groups according to the current ratio requirement of the LED used.
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10.3.4.1 Example 1: Red LED Current is 20mA, Green LED Needs 12mA, Blue LED needs 8mA
1. Red LED needs the largest current, so choose 511d for CCR
2. 511 x 12mA / 20mA = 306.6, thus choose 307d for CCG. With same method, choose 204d for CCB.
3. According to the required red LED current, choose 7h for BC.
4. According to Equation 2, RIREF = 1.209V/20mA x 157.4 = 9.5 kΩ
In this example, we choose 7h for BC, instead of using the default 4h. This is because the Red LED current is
20mA, approaching the upper limit of current range. To prevent the constant output current from exceeding the
upper limit in case a larger BC code is input accidently, we choose the maximum BC code here.
10.3.4.2 Example 2: Red LED Current is 5mA, Green LED Needs 2mA, Blue LED Needs 1mA.
1. Red LED needs the largest current, so choose 511d for CCR.
2. 511 x 2mA / 5mA = 204.4, thus choose 204d for CCG. With same method, choose 102d for CCB.
3. According to the required blue LED current, choose 0h for BC.
4. According to Equation 2, RIREF = 1.209V / 5mA x 20.4 = 4.93 kΩ
In this example, we choose 0h for BC, instead of using the default 4h. This is because the Blue LED current is
1mA, is approaching the lower limit of current range. To prevent the constant output current from exceeding the
lower limit in case a lower BC code is input accidently, we choose the minimum BC code here. In general, if LED
current is in the middle of the range (i.e, 10mA), one can just use the default 4h as BC code.
10.3.5 LED Open Detection (LOD)
The LOD function detects faults caused by an open circuit in any LED string; or, a short from OUTXn to ground
with low impedance. It does this by comparing the OUTXn voltage to the LOD detection threshold voltage level
set by LODVLT in the FC1 register. If the OUTXn voltage is lower than the programmed voltage, the
corresponding output LOD bit will be set to '1' to indicate a open LED. Otherwise, the output of that LOD bit is '0'.
LOD data output by the detection circuit are valid only during the ‘on’ period of that OUTXn output channel. The
LOD data are always ‘0’ for outputs that are turned off.
10.3.6 Power Save Mode (PSM)
The power-save mode (PSM) is enabled by setting PSAVE_ENA (bit5 of FC2 register) to ‘1’. When power on,
this bit default is ‘0’.
When this function is enabled, if the GS data received for next frame is all ‘0’, IC will enter power save mode at
the moment Vsync command input.
When the IC is in power-save mode, it resumes normal mode when it detects non-zero GS data input. In power-
save mode all analog circuits such as constant current output and the LOD circuit are not operational; the device
total current consumption, Icc, is below 1mA.
10.3.7 Internal Pre-Charge FET
The internal pre-charge FET can prevent ghosting of multiplexed LED modules. One cause of this phenomenon
is the charging current for parasitic capacitance of the OUTXn through the LED when the supply voltage switches
from one common line to the next common line.
To prevent this unwanted charging current, TLC5958 uses an internal FET to pull OUTXn up to VCC –1.4V
during the common line switching period. Thus, no charging current flows through LED and ghosting is
eliminated.
10.3.8 Thermal Shutdown (TSD)
The thermal shutdown (TSD) function turns off all IC constant-current outputs when the junction temperature (TJ)
exceeds 170°C (typ). It resumes normal operation when TJ falls below 160°C (typ).
18
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10.3.9 IREF Resistor Short Protection (ISP)
The Iref resistor short protection (ISP) function prevents unwanted large currents from flowing though the
constant-current output when the Iref resistor is shorted accidently. The TLC5958 turns off all output channels
when the Iref pin voltage is lower than 0.19V (typ). When the Iref pin voltage goes higher than 0.325V (typ), the
TLC5958 resumes normal operation.
10.3.10 Noise Reduction
Large surge currents may flow through the IC and the board on which the device is mounted if all 48 LED
channels turned on simultaneously at the 1st GCLK rising edge. This large surge current could induce
detrimental noise and electromagnetic interference (EMI) into other circuits.
The TLC5958 separates the LED channels into 12 groups. Each group turns on sequentially with some delay
between one group and the next group. By this operation, a soft-start feature provides for minimal inrush current.
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11 Application and Implementation
Send request via email for Application Note: Build High Density, High Refresh Rate, Multiplexing LED Panel with
TLC5958
12 Power Supply Recommendations
The VCC power supply voltage should be decoupled by placing a 0.1 µF ceramic capacitor close to VCC pin and
GND plane. Depending on panel size, several electrolytic capacitors must be placed on board equally distributed
to get a well regulated LED supply voltage (VLED). VLED voltage ripple should be less than 5% of its nominal
value. Furthermore, the VLED should be set to the voltage calculated by equation:
VLED > Vf + 0.4V (10mA constant current example)
(3)
Where: Vf = maximum forward voltage of LED
13 Layout
13.1 Layout Guidelines
1. Place the decoupling capacitor near the VCC pin and GND plane.
2. Place the current programming resistor Riref close to IREF pin and IREFGND pin.
3. Route the GND pattern as widely as possible for large GND currents. Maximum GND current is
approximately 1.2A
4. Routing between the LED cathode side and the device OUTXn pin should be as short and straight as
possible to reduce wire inductance.
5. The PowerPAD™ must be connected to GND plane because the pad is used as power ground pin internally,
there will be large current flow through this pad when all channels turn on. Furthermore, this pad should be
connected to a heat sink layer by thermal via to reduce device temperature. One suggested thermal via
pattern is shown as below. For more information about suggested thermal via pattern and via size, see "
PowerPAD Thermally Enhanced Package", SLMA002G.
13.2 Layout Example
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14 器件和文档支持
14.1 商标
LGSE, PowerPAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
14.2 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
14.3 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
15 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
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Copyright © 2014, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLC5958RTQR
TLC5958RTQT
ACTIVE
ACTIVE
QFN
QFN
RTQ
RTQ
56
56
2000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
TLC5958
TLC5958
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC5958RTQR
TLC5958RTQT
QFN
QFN
RTQ
RTQ
56
56
2000
250
330.0
180.0
16.4
16.4
8.3
8.3
8.3
8.3
1.1
1.1
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLC5958RTQR
TLC5958RTQT
QFN
QFN
RTQ
RTQ
56
56
2000
250
367.0
210.0
367.0
185.0
38.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RTQ 56
8 x 8, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224653/A
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
RTQ0056G
PLASTIC QUAD FLATPACK-NO LEAD
8.15
7.85
A
B
8.15
7.85
PIN 1 INDEX AREA
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
5.6±0.1
(0.2) TYP
15
28
52X 0.5
14
29
57
4X
6.5
SYMM
5.6±0.1
1
42
0.30
0.18
56X
PIN 1 ID
(OPTIONAL)
43
56
0.1
C A B
C
0.5
0.3
56X
SYMM
0.05
4225369 / A 10/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RTQ0056G
PLASTIC QUAD FLATPACK-NO LEAD
(0.78)
(5.6)
8X (1.33)
6X (1.22)
43
56X (0.6)
56
1
42
56X (0.24)
6X (1.22)
8X (1.33)
52X (0.5)
SYMM
(7.8)
(5.6)
57
(R0.05)
TYP
14
29
(Ø0.2) TYP
VIA
15
28
SYMM
LAND PATTERN EXAMPLE
SCALE: 10X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225369 / A 10/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their
locations shown on this view. it is recommended thar vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RTQ0056G
PLASTIC QUAD FLATPACK-NO LEAD
(7.8)
8X (0.665)
8X (1.33)
43
56X (0.6)
56
56X (0.24)
1
42
57
8X (1.33)
52X (0.5)
SYMM
(7.8)
8X (0.665)
(R0.05) TYP
16X
(
1.13)
14
29
METAL
TYP
15
28
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
66% PRINTED COVERAGE BY AREA
SCALE: 10X
4225369 / A 10/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations..
www.ti.com
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Copyright © 2020 德州仪器半导体技术（上海）有限公司
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