TL084BCDE4 [TI]
JFET-INPUT OPERATIONAL AMPLIFIERS; JFET输入运算放大器型号: | TL084BCDE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | JFET-INPUT OPERATIONAL AMPLIFIERS |
文件: | 总37页 (文件大小:863K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢂ ꢃ ꢄ ꢆꢅ ꢀ ꢁꢂ ꢃ ꢄ ꢇꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢆꢅ ꢀꢁ ꢂꢃ ꢈꢇ
ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
D
D
D
D
D
Low Power Consumption
D
D
D
D
High Input Impedance . . . JFET-Input Stage
Latch-Up-Free Operation
Wide Common-Mode and Differential
Voltage Ranges
High Slew Rate . . . 13 V/µs Typ
Common-Mode Input Voltage Range
Low Input Bias and Offset Currents
Output Short-Circuit Protection
Includes V
CC+
Low Total Harmonic
Distortion . . . 0.003% Typ
description/ordering information
The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously
developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates
well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature
high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset
adjustment and external compensation options are available within the TL08x family.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized
for operation from −40°C to 85°C. The Q-suffix devices are characterized for operation from −40°C to 125°C.
The M-suffix devices are characterized for operation over the full military temperature range of −55°C to 125°C.
ORDERING INFORMATION
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
†
PACKAGE
T
J
AT 255C
Tube of 50
TL081CP
TL081CP
PDIP (P)
PDIP (N)
Tube of 50
TL082CP
TL082CP
TL084CN
Tube of 25
TL084CN
Tube of 75
TL081CD
TL081C
TL082C
TL084C
Reel of 2500
Tube of 75
TL081CDR
TL082CD
SOIC (D)
Reel of 2500
Tube of 50
TL082CDR
TL084CD
0°C to 70°C
15 mV
Reel of 2500
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 150
Reel of 2000
Tube of 90
TL084CDR
TL081CPSR
TL082CPSR
TL084CNSR
TL082CPW
TL082CPWR
TL084CPW
TL084CPWR
T081
T082
TL084
SOP (PS)
SOP (NS)
T082
T084
TSSOP (PW)
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
ꢒ ꢙ ꢤ ꢜ ꢛꢧ ꢢꢡ ꢟꢠ ꢡꢛ ꢝꢤ ꢦꢘ ꢞꢙ ꢟ ꢟꢛ ꢔꢎ ꢁꢍ ꢐꢓ ꢋ ꢍꢮꢃꢯ ꢮꢯꢅ ꢞꢦꢦ ꢤꢞ ꢜ ꢞ ꢝꢣ ꢟꢣꢜ ꢠ ꢞ ꢜ ꢣ ꢟꢣ ꢠꢟꢣ ꢧ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
†
PACKAGE
T
J
AT 255C
Tube of 50
Tube of 50
Tube of 25
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
Tube of 50
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 50
Tube of 50
Tube of 25
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
Tube of 50
Reel of 2500
Tube of 50
Tube of 50
Tube of 25
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
Tube of 50
Reel of 2500
Reel of 2000
Tube of 50
Reel of 2500
Tube of 25
Reel of 55
TL081ACP
TL082ACP
TL084ACN
TL081ACD
TL081ACDR
TL082ACD
TL082ACDR
TL084ACD
TL084ACDR
TL082ACPSR
TL084ACNSR
TL081BCP
TL082BCP
TL084BCN
TL081BCD
TL081BCDR
TL082BCD
TL082BCDR
TL084BCD
TL084BCDR
TL081IP
TL081ACP
PDIP (P)
PDIP (N)
TL082ACP
TL084ACN
081AC
6 mV
SOIC (D)
082AC
TL084AC
SOP (PS)
SOP (NS)
T082A
0°C to 70°C
TL084A
TL081BCP
TL082BCP
TL084BCN
PDIP (P)
PDIP (N)
081BC
3 mV
SOIC (D)
082BC
TL084BC
TL081IP
TL082IP
TL081IN
PDIP (P)
PDIP (N)
TL082IP
TL084IN
TL081ID
TL081I
TL082I
TL081IDR
TL082ID
−40°C to 85°C
6 mV
SOIC (D)
TL082IDR
TL084ID
TL084I
Z082
TL084IDR
TL082IPWR
TL084QD
TSSOP (PW)
SOIC (D)
−40°C to 125°C
−55°C to 125°C
9 mV
9 mV
6 mV
TL084QD
TL084QDR
TL084MJ
CDIP (J)
TL084MJ
TL084FK
LCCC (FK)
CDIP (JG)
LCCC (FK)
TL084FK
Tube of 50
Tube of 55
TL082MJG
TL082MFK
TL082MJG
TL082MFK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
TL084, TL084A, TL084B
D, J, N, NS, OR PW PACKAGE
(TOP VIEW)
TL081, TL081A, TL081B
D, P, OR PS PACKAGE
(TOP VIEW)
TL082, TL082A, TL082B
D, JG, P, PS, OR PW PACKAGE
(TOP VIEW)
OFFSET N1
IN−
NC
V
OUT
1OUT
1IN−
1IN+
V
CC+
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
1
2
3
4
5
6
7
14
13
12
11
10
9
4OUT
4IN−
4IN+
2OUT
2IN−
2IN+
CC+
IN+
V
OFFSET N2
V
CC−
CC−
V
V
CC+
CC−
2IN+
2IN−
2OUT
3IN+
3IN−
3OUT
NC − No internal connection
8
TL084M . . . FK PACKAGE
(TOP VIEW)
TL082M . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
3
2
1
20 19
18
NC
NC
1IN−
NC
4IN+
NC
1IN+
4
5
6
7
8
4
5
6
7
8
2OUT
NC
NC
17
16
15
14
17
16
15
14
V
−
V
CC
CC+
NC
2IN−
NC
1IN+
NC
NC
3IN+
2IN+
9 10 11 12 13
9 10 11 12 13
NC − No internal connection
NC − No internal connection
symbols
TL081
TL082 (EACH AMPLIFIER)
TL084 (EACH AMPLIFIER)
OFFSET N1
+
−
IN+
IN−
+
IN+
IN−
OUT
OUT
−
OFFSET N2
3
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
schematic (each amplifier)
V
CC+
IN+
IN−
64 Ω
OUT
128 Ω
64 Ω
C1
1080 Ω
1080 Ω
V
CC−
OFFSET N1
OFFSET N2
TL081 Only
Component values shown are nominal.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
TL08_C
TL08_AC
TL08_BC
TL08_I
TL084Q
TL08_M
UNIT
Supply voltage, V
(see Note 1)
− (see Note 1)
18
−18
18
−18
18
−18
18
−18
V
V
V
V
CC+
Supply voltage V
CC
Differential input voltage, V (see Note 2)
ID
30
30
30
30
Input voltage, V (see Notes 1 and 3)
I
15
15
15
15
Duration of output short circuit (see Note 4)
Continuous total power dissipation
Unlimited
Unlimited
Unlimited
Unlimited
See Dissipation Rating Table
Operating free-air temperature range, T
0 to 70
97
− 40 to 85 − 40 to 125 − 55 to 125
°C
A
D package (8-pin)
D package (14-pin)
N package (14-pin)
NS package (14-pin)
P package (8-pin)
PS package (8-pin)
PW package (8-pin)
PW package (14-pin)
97
86
76
86
76
80
Package thermal impedance, θ
(see Notes 5 and 6)
JA
°C/W
85
85
95
95
149
113
150
113
Operating virtual junction temperature
Case temperature for 60 seconds, T
150
150
150
260
°C
°C
FK package
C
Lead temperature 1,6 mm (1/16 inch) from case
for 60 seconds
J or JG package
300
°C
Storage temperature range, T
stg
− 65 to 150 − 65 to 150 − 65 to 150 − 65 to 150
°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between V
2. Differential voltages are at IN+ with respect to IN−.
and V .
CC−
CC+
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the
dissipation rating is not exceeded.
5. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
JA
J
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
6. The package thermal impedance is calculated in accordance with JESD 51-7.
DISSIPATION RATING TABLE
T
≤ 25°C
DERATING
FACTOR
DERATE
ABOVE T
T
= 70°C
T
= 85°C
T = 125°C
A
A
A
A
PACKAGE
POWER RATING
POWER RATING POWER RATING POWER RATING
A
D (14 pin)
680 mW
7.6 mW/°C
11.0 mW/°C
11.0 mW/°C
8.4 mW/°C
60°C
88°C
88°C
69°C
604 mW
680 mW
680 mW
672 mW
490 mW
680 mW
680 mW
546 mW
186 mW
273 mW
273 mW
210 mW
FK
J
680 mW
680 mW
JG
680 mW
5
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SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
6
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
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ꢋ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
electrical characteristics, V
= 15 V (unless otherwise noted)
CC
TL081M, TL082M
TL084Q, TL084M
†
T
A
PARAMETER
UNIT
TEST CONDITIONS
MIN
TYP MAX
MIN
TYP MAX
25°C
3
6
9
3
9
V
Input offset voltage
V
V
= 0,
= 0
R
R
= 50 Ω
= 50 Ω
mV
IO
O
O
S
S
Full range
15
Temperature
coefficient of input
offset voltage
α
VIO
Full range
18
5
18
5
µV/°C
25°C
125°C
25°C
100
20
100
20
pA
nA
pA
nA
‡
Input offset current
I
I
V
V
= 0
= 0
IO
O
30
200
50
30
200
50
‡
Input bias current
IB
O
125°C
−12
to
15
− 12
to
15
Common-mode input
voltage range
V
V
25°C
11
11
V
V
ICR
R
R
R
= 10 kΩ
≥ 10 kΩ
≥ 2 kΩ
25°C
12
12
10
13.5
12
12
10
13.5
L
L
L
Maximum peak
output voltage swing
OM
Full range
12
12
Large-signal
differential voltage
amplification
V
=
=
10 V,
10 V,
R
R
≥ 2 kΩ
≥ 2 kΩ
25°C
25
15
200
25
15
200
O
O
L
L
A
VD
V/mV
V
Full range
B
Unity-gain bandwidth
Input resistance
25°C
25°C
3
3
MHz
1
12
12
r
10
10
Ω
i
Common-mode
rejection ratio
V
V
= V
ICR
min,
R
IC
O
CMRR
25°C
80
80
86
86
80
80
86
86
dB
= 0,
= 50 Ω
S
Supply-voltage
rejection ratio
V
V
=
15 V to 9 V,
= 50 Ω
CC
O
k
25°C
dB
SVR
= 0,
R
S
(∆V
/∆V )
CC
IO
Supply current
(per amplifier)
I
V
= 0,
No load
25°C
25°C
1.4
2.8
1.4
2.8
mA
dB
CC
O
V
/V
Crosstalk attenuation
A
VD
= 100
120
120
O1 O2
†
‡
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in
Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.
operating characteristics, V
= 15 V, T = 25°C (unless otherwise noted)
A
CC
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
∗
V = 10 V,
I
R
R
= 2 kΩ,
= 2 kΩ,
C
C
= 100 pF, See Figure 1
= 100 pF,
8
13
L
L
L
L
SR
Slew rate at unity gain
V/µs
V = 10 V,
I
∗
5
See Figure 1
T
A
= − 55°C to 125°C,
t
Rise time
0.05
20
18
4
µs
%
r
V = 20 mV,
R
= 2 kΩ,
C
= 100 pF, See Figure 1
I
L
L
Overshoot factor
f = 1 kHz
nV/√Hz
µV
Equivalent input noise
voltage
V
R
R
= 20 Ω
= 20 Ω,
n
S
S
f = 10 Hz to 10 kHz
f = 1 kHz
Equivalent input noise
current
I
n
0.01
pA/√Hz
V rms = 6 V,
I
A
VD
= 1,
R
≤ 1 kΩ,
R ≥ 2 kΩ,
L
S
THD Total harmonic distortion
0.003
%
f = 1 kHz
∗On products compliant to MIL-PRF-38535, this parameter is not production tested.
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
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ꢅ
ꢀ
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ꢂ
ꢃꢄ
ꢆ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢄꢇ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈꢆ
ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢇ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉꢇ
ꢊ
ꢋ
ꢌ
ꢀꢍ
ꢎ
ꢏ
ꢐ
ꢑ
ꢀ
ꢒ
ꢐ
ꢌ
ꢓ
ꢆꢀ
ꢎ
ꢒ
ꢏ
ꢆ
ꢁ
ꢆ
ꢔ
ꢐꢁ
ꢎ
ꢋ
ꢎ
ꢌ
ꢓ
ꢕ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
operating characteristics, V
= 15 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
MIN
TYP
13
MAX
UNIT
V/µs
µs
SR
Slew rate at unity gain
Rise time
V = 10 V,
R
= 2 kΩ,
C
= 100 pF, See Figure 1
8
I
L
L
L
L
t
r
0.05
20
V = 20 mV,
I
R
= 2 kΩ,
C
= 100 pF, See Figure 1
Overshoot factor
%
f = 1 kHz
18
nV/√Hz
µV
V
Equivalent input noise voltage
Equivalent input noise current
R
R
= 20 Ω
= 20 Ω,
n
S
f = 10 Hz to 10 kHz
f = 1 kHz
4
I
n
0.01
pA/√Hz
S
V rms = 6 V,
I
A
VD
= 1,
R
≤ 1 kΩ,
R ≥ 2 kΩ,
L
S
THD Total harmonic distortion
0.003
%
f = 1 kHz
PARAMETER MEASUREMENT INFORMATION
10 kΩ
−
+
1 kΩ
OUT
−
+
V
I
V
I
OUT
= 100 pF
C
= 100 pF
R
= 2 kΩ
L
L
C
R
L
L
Figure 1
Figure 2
100 kΩ
TL081
−
IN−
IN+
C2
OUT
+
N2
C1 500 pF
N1
−
100 kΩ
IN−
N1
OUT
+
1.5 kΩ
CC−
V
Figure 3
Figure 4
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁꢂ
ꢃ
ꢄ
ꢅ
ꢀ
ꢁꢂ ꢃ ꢄ ꢆꢅ ꢀ ꢁꢂ ꢃ ꢄ ꢇꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢈꢇ
ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
ꢊ
ꢋ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Frequency
5, 6, 7
vs Free-air temperature
vs Load resistance
vs Supply voltage
8
9
10
V
OM
Maximum peak output voltage
vs Free-air temperature
vs Frequency
11
12
Large-signal differential voltage amplification
A
VD
Differential voltage amplification
Total power dissipation
vs Frequency with feed-forward compensation
vs Free-air temperature
13
14
P
D
vs Free-air temperature
vs Supply voltage
15
16
I
I
Supply current
CC
Input bias current
vs Free-air temperature
vs Time
17
18
19
20
21
22
IB
Large-signal pulse response
Output voltage
V
vs Elapsed time
vs Free-air temperature
vs Frequency
O
CMRR
Common-mode rejection ratio
Equivalent input noise voltage
Total harmonic distortion
V
n
THD
vs Frequency
MAXIMUM PEAK OUTPUT VOLTAGE
MAXIMUM PEAK OUTPUT VOLTAGE
vs
vs
FREQUENCY
FREQUENCY
15
12.5
10
15
R
= 10 kΩ
= 25°C
V
=
15 V
L
CC
CC
R
= 2 kΩ
= 25°C
L
T
A
T
A
See Figure 2
V
=
=
15 V
10 V
CC
See Figure 2
12.5
10
V
=
=
10 V
5 V
V
CC
CC
7.5
5
7.5
5
V
CC
V
=
5 V
2.5
0
2.5
0
10 M
100
1 k
10 k
100 k
1 M
100
1 k
10 k
100 k
1 M
10 M
f − Frequency − Hz
f − Frequency − Hz
Figure 5
Figure 6
9
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ꢂ
ꢃ
ꢄꢇ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈ
ꢆ
ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢇ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉꢇ
ꢊ
ꢋ
ꢌ
ꢀꢍ
ꢎ
ꢏ
ꢐ
ꢑ
ꢀ
ꢒ
ꢐ
ꢌ
ꢓ
ꢆꢀ
ꢎ
ꢒ
ꢏ
ꢆ
ꢁ
ꢆ
ꢔ
ꢐ
ꢁ
ꢎ
ꢋ
ꢎ
ꢌ
ꢓ
ꢕ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
MAXIMUM PEAK OUTPUT VOLTAGE
MAXIMUM PEAK OUTPUT VOLTAGE
vs
vs
FREQUENCY
FREE-AIR TEMPERATURE
15
12.5
10
15
12.5
10
R
= 10 kW
L
V
=
15 V
CC
L
R = 2 kΩ
See Figure 2
T
A
= 25°C
R
= 2 kW
L
T
A
= −55°C
7.5
5
7.5
5
T
A
= 125°C
2.5
0
2.5
V
=
15 V
CC
See Figure 2
0
10 k
40 k 100 k
400 k 1 M
4 M 10 M
− 75 − 50 − 25
0
25
50
75 100 125
f − Frequency − Hz
T
A
− Free-Air Temperature − °C
Figure 7
Figure 8
MAXIMUM PEAK OUTPUT VOLTAGE
MAXIMUM PEAK OUTPUT VOLTAGE
vs
vs
SUPPLY VOLTAGE
LOAD RESISTANCE
15
15
R
T
= 10 kΩ
= 25°C
V
T
= 15 V
L
A
CC
= 25°C
A
12.5
12.5
10
See Figure 2
10
7.5
5
7.5
5
2.5
0
2.5
0
2
4
6
8
10
12
14
16
0
0.1
0.2
0.4 0.7
1
2
4
7
10
|V
CC
| − Supply Voltage − V
R
− Load Resistance − kΩ
L
Figure 9
Figure 10
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
10
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ꢀ
ꢁꢂ
ꢃ
ꢄ
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ꢀ
ꢁꢂ ꢃ ꢄ ꢆꢅ ꢀ ꢁꢂ ꢃ ꢄ ꢇꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢈꢇ
ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
ꢊ
ꢋ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREE-AIR TEMPERATURE
1000
700
400
200
100
70
40
20
10
7
4
2
1
V
V
=
15 V
10 V
= 2 kΩ
CC
=
O
R
L
−75 −50 −25
0
25
50
75 100 125
T
A
− Free-Air Temperature − °C
Figure 11
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY
6
5
10
V
CC
= 5 V to 15 V
R
T
= 10 kΩ
= 25°C
L
A
10
4
10
10
0°
Differential Voltage
Amplification
(left scale)
3
45°
2
10
90°
Phase Shift
(right scale)
1
10
135°
180°
1
1
10
100
1 k
10 k 100 k
1 M 10 M
f − Frequency − Hz
Figure 12
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
11
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ꢂ
ꢃ
ꢄꢇ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈꢆ
ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢇ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉꢇ
ꢊ
ꢋ
ꢌ
ꢀ
ꢍ
ꢎ
ꢏ
ꢐ
ꢑ
ꢀ
ꢒ
ꢐ
ꢌ
ꢓ
ꢆꢀ
ꢎ
ꢒ
ꢏ
ꢆ
ꢁ
ꢆ
ꢔ
ꢐꢁ
ꢎ
ꢋ
ꢎ
ꢌ
ꢓ
ꢕ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
DIFFERENTIAL VOLTAGE AMPLIFICATION
TOTAL POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
vs
FREQUENCY WITH FEED-FORWARD COMPENSATION
6
250
225
200
175
150
125
100
75
10
V
= 15 V
CC
V
= 15 V
CC
C2 = 3 pF
= 25°C
No Signal
No Load
5
10
10
T
A
See Figure 3
4
TL084, TL085
3
10
10
TL082, TL083
2
TL081
50
25
0
10
1
−75 −50 −25
0
25
50
75 100 125
100
1 k
10 k
100 k
1 M
10 M
T
A
− Free-Air Temperature − °C
f − Frequency With Feed-Forward Compensation − Hz
Figure 13
Figure 14
SUPPLY CURRENT PER AMPLIFIER
SUPPLY CURRENT
vs
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.0
V
= 15 V
CC
T
= 25°C
A
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
No Signal
No Load
No Signal
No Load
−75 −50 −25
0
25
50
75 100 125
0
2
4
6
8
10
12
14
16
T
A
− Free-Air Temperature − °C
|V
CC
| − Supply Voltage − V
Figure 15
Figure 16
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
12
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ꢁ
ꢂ
ꢃ
ꢄ
ꢇ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈ
ꢇ
ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
ꢊ
ꢋ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
INPUT BIAS CURRENT
vs
VOLTAGE-FOLLOWER
FREE-AIR TEMPERATURE
LARGE-SIGNAL PULSE RESPONSE
6
4
100
10
V
R
C
= 15 V
CC
L
L
V
=
15 V
CC
= 2 kΩ
= 100 pF
= 25°C
T
A
Output
2
0
1
− 2
− 4
− 6
Input
0.1
0.01
− 50 − 25
0
25
50
75
100
125
0
0.5
1
1.5
2
2.5
3
3.5
T
A
− Free-Air Temperature − °C
t − Time − µs
Figure 17
Figure 18
OUTPUT VOLTAGE
vs
COMMON-MODE REJECTION RATIO
vs
ELAPSED TIME
FREE-AIR TEMPERATURE
28
89
V
CC
=
15 V
R
= 10 kΩ
L
24
20
16
12
8
88
87
86
85
84
83
V
R
C
= 15 V
CC
L
L
= 2 kΩ
= 100 pF
= 25°C
T
A
See Figure 1
4
0
− 4
0
0.2
0.4
0.6
0.8
1.0
1.2
− 75 − 50 − 25
0
25
50
75
100 125
t − Elapsed Time − µs
T
A
− Free-Air Temperature − °C
Figure 19
Figure 20
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
13
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ꢂ
ꢃ
ꢄ
ꢇ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈ
ꢇ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃꢉ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉꢇ
ꢊ
ꢋ
ꢌ
ꢀꢍ
ꢎ
ꢏ
ꢐ
ꢑ
ꢀ
ꢒ
ꢐ
ꢌ
ꢓ
ꢆꢀ
ꢎ
ꢒ
ꢏ
ꢆ
ꢁ
ꢆ
ꢔ
ꢐ
ꢁ
ꢎ
ꢋ
ꢎ
ꢌꢓ
ꢕ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
EQUIVALENT INPUT NOISE VOLTAGE
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
FREQUENCY
50
40
30
20
10
0
1
V
A
=
= 10
= 20 Ω
= 25°C
15 V
V
=
= 1
15 V
CC
VD
CC
A
VD
I(RMS)
0.4
R
V
= 6 V
S
T
A
T
A
= 25°C
0.1
0.04
0.01
0.004
0.001
10
400
1 k
4 k 10 k
40 k 100 k
10
40 100
400 1 k
4 k 10 k
40 k 100 k
f − Frequency − Hz
f − Frequency − Hz
Figure 21
Figure 22
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
APPLICATION INFORMATION
R
= 100 kΩ
F
V
−
CC+
15 V
−
TL081
R1
C3
R2
3.3 kΩ
Output
+
Input
Output
TL081
+
V
CC−
C
= 3.3 µF
1 kΩ
F
−15 V
3.3 kΩ
R1 = R2 = 2(R3) = 1.5 MΩ
R3
C1
C2
C3
C1 = C2 =
= 110 pF
= 1 kHz
9.1 kΩ
2
1
1
f =
f
=
o
2π R
C
F
F
2π R1 C1
Figure 23
Figure 24
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁꢂ
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ꢀ
ꢁꢂ ꢃ ꢄ ꢆꢅ ꢀ ꢁꢂ ꢃ ꢄ ꢇꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢈꢇ
ꢀ ꢁꢂ ꢃ ꢉ ꢅ ꢀ ꢁꢂ ꢃ ꢉ ꢆ ꢅ ꢀꢁ ꢂꢃ ꢉꢇ
ꢌꢀꢍꢎ ꢏꢐꢑꢀ ꢒ ꢐꢌꢓ ꢆꢀ ꢎꢒ ꢏꢆꢁ ꢆꢔ ꢐ ꢁꢎ ꢋꢎ ꢌꢓ ꢕ
ꢊ
ꢋ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
V
CC+
1 MΩ
−
TL084
+
Output A
V
CC+
+
1 µF
TL084
V
CC+
−
Input
−
TL084
+
Output B
Output C
100 kΩ
100 µF
100 kΩ
V
CC+
100 kΩ
100 kΩ
V
CC+
−
TL084
+
Figure 25. Audio-Distribution Amplifier
6 sin ωt
1N4148
− 15 V
18 kΩ
(see Note A)
18 pF
1 kΩ
18 pF
V
CC+
−
V
CC+
88.4 kΩ
1/2
−
TL082
1/2
+
6 cos ωt
TL082
88.4 kΩ
+
V
CC−
18 pF
1 kΩ
V
CC−
15 V
1N4148
18 kΩ
(see Note A)
88.4 kΩ
NOTE A: These resistor values may be adjusted for a symmetrical output.
Figure 26. 100-KHz Quadrature Oscillator
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃꢄ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃꢄ
ꢆ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢄꢇ
ꢅ
ꢀꢁ
ꢂ
ꢃ
ꢈꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢈꢆ
ꢅ ꢀ ꢁꢂ ꢃ ꢈ ꢇ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉ
ꢆ
ꢅ
ꢀ
ꢁ
ꢂ
ꢃ
ꢉꢇ
ꢊ
ꢋ
ꢌ
ꢀꢍ
ꢎ
ꢏ
ꢐ
ꢑ
ꢀ
ꢒ
ꢐ
ꢌ
ꢓ
ꢆꢀ
ꢎ
ꢒ
ꢏ
ꢆ
ꢁ
ꢆ
ꢔ
ꢐꢁ
ꢎ
ꢋꢎ
ꢌꢓ
ꢕ
SLOS081G − FEBRUARY 1977 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
16 kΩ
16 kΩ
220 pF
220 pF
43 kΩ
30 kΩ
43 kΩ
30 kΩ
V
V
CC+
CC+
43 kΩ
Input
220 pF
220 pF
V
V
CC+
CC+
−
−
43 kΩ
43 kΩ
43 kΩ
−
1/4
−
1/4
TL084
1/4
TL084
Output
B
1/4
TL084
+
+
TL084
+
+
1.5 kΩ
1.5 kΩ
V
CC−
V
CC−
V
CC−
V
CC−
Output A
Output A
Output B
2 kHz/div
Second-Order Bandpass Filter
= 100 kHz, Q = 30, GAIN = 4
2 kHz/div
Cascaded Bandpass Filter
f = 100 kHz, Q = 69, GAIN = 16
o
f
o
Figure 27. Positive-Feedback Bandpass Filter
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
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Products
Amplifiers
Data Converters
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Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
LCCC
CDIP
SOIC
Drawing
5962-9851501Q2A
5962-9851501QPA
5962-9851503Q2A
5962-9851503QCA
TL081ACD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
JG
FK
J
20
8
1
1
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
20
14
8
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081ACDE4
TL081ACDG4
TL081ACDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081ACDRE4
TL081ACDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081ACJG
TL081ACP
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081ACPE4
TL081BCD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
P
D
D
D
D
D
D
P
P
D
D
D
D
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081BCDE4
TL081BCDG4
TL081BCDR
TL081BCDRE4
TL081BCDRG4
TL081BCP
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081BCPE4
TL081CD
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081CDE4
TL081CDG4
TL081CDR
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081CDRE4
TL081CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
TL081CP
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
P
8
8
8
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081CPE4
PDIP
SO
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081CPSR
TL081CPSRE4
PS
PS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081CPWLE
TL081ID
OBSOLETE TSSOP
PW
D
8
8
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081IDE4
TL081IDG4
TL081IDR
D
D
D
D
D
P
P
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL081IDRE4
TL081IDRG4
TL081IP
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081IPE4
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL081MFKB
TL081MJG
TL081MJGB
TL082ACD
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
LCCC
CDIP
CDIP
SOIC
FK
JG
JG
D
20
8
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082ACDE4
TL082ACDG4
TL082ACDR
TL082ACDRE4
TL082ACDRG4
TL082ACP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
D
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL082ACPE4
TL082ACPSR
TL082ACPSRE4
TL082BCD
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082BCDE4
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
TL082BCDG4
TL082BCDR
TL082BCDRE4
TL082BCDRG4
TL082BCP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
P
P
D
D
D
D
D
D
8
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL082BCPE4
TL082CD
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CDE4
TL082CDG4
TL082CDR
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CDRE4
TL082CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CJG
TL082CP
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL082CPE4
TL082CPSR
TL082CPSRG4
TL082CPW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CPWE4
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CPWLE
TL082CPWR
OBSOLETE TSSOP
PW
PW
8
8
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082CPWRE4
TL082CPWRG4
TL082ID
PW
PW
D
8
8
8
8
8
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082IDE4
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082IDG4
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
TL082IDR
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082IDRE4
TL082IDRG4
SOIC
SOIC
D
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082IJG
TL082IP
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL082IPE4
TL082IPWR
TL082IPWRE4
ACTIVE
ACTIVE
ACTIVE
PDIP
P
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL082MFK
TL082MFKB
TL082MJG
TL082MJGB
TL084ACD
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
SOIC
FK
FK
JG
JG
D
20
20
8
TBD
TBD
TBD
TBD
Call TI
Call TI
1
1
1
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
8
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084ACDE4
TL084ACDG4
TL084ACDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084ACDRE4
TL084ACDRG4
TL084ACN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL084ACNE4
TL084ACNSR
TL084ACNSRE4
TL084BCD
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084BCDE4
TL084BCDG4
TL084BCDR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084BCDRE4
TL084BCDRG4
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
TL084BCN
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
N
14
14
14
14
14
14
14
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL084BCNE4
TL084CD
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
N
D
D
D
D
D
D
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CDE4
TL084CDG4
TL084CDR
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CDRE4
TL084CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CJ
TL084CN
OBSOLETE
ACTIVE
CDIP
PDIP
J
14
14
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL084CNE4
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL084CNSLE
TL084CNSR
OBSOLETE
ACTIVE
SO
SO
NS
NS
14
14
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CNSRG4
TL084CPW
ACTIVE
ACTIVE
ACTIVE
SO
NS
PW
PW
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CPWE4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CPWLE
TL084CPWR
OBSOLETE TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084CPWRE4
TL084ID
PW
D
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084IDE4
TL084IDG4
TL084IDR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084IDRE4
TL084IDRG4
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL084IJ
TL084IN
OBSOLETE
ACTIVE
CDIP
PDIP
J
14
14
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL084INE4
ACTIVE
PDIP
N
14
Pb-Free
CU NIPDAU N / A for Pkg Type
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
(RoHS)
TL084MFK
TL084MFKB
TL084MJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
SOIC
SOIC
FK
FK
J
20
20
14
14
14
14
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
1
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
TL084MJB
TL084QD
J
1
D
50
2500
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-1-220C-UNLIM
TL084QDR
D
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
3-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
330
(mm)
12
12
12
16
12
12
12
16
12
12
12
16
12
12
12
12
16
0
TL081ACDR
TL081BCDR
TL081CDR
TL081CPSR
TL081IDR
D
D
8
8
FMX
FMX
FMX
MLA
FMX
FMX
MLA
MLA
FMX
FMX
MLA
MLA
MLA
FMX
MLA
MLA
MLA
FMX
MLA
FMX
FMX
MLA
MLA
FMX
6.4
6.4
6.4
8.2
6.4
6.4
6.4
8.2
6.4
6.4
6.4
8.2
7.0
6.4
6.4
7.0
6.5
6.5
8.2
6.5
6.5
8.2
7.0
6.5
5.2
5.2
5.2
6.6
5.2
5.2
5.2
6.6
5.2
5.2
5.2
6.6
3.6
5.2
5.2
3.6
9.0
9.0
10.5
9.0
9.0
10.5
5.6
9.0
2.1
2.1
2.1
2.5
2.1
2.1
2.1
2.5
2.1
2.1
2.1
2.5
1.6
2.1
2.1
1.6
2.1
2.1
2.5
2.1
2.1
2.5
1.6
2.1
8
8
12
12
12
16
12
12
12
16
12
12
12
16
12
12
12
12
16
16
16
16
16
16
12
16
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
D
8
8
PS
D
8
12
8
8
TL082ACDR
TL082ACDR
TL082ACPSR
TL082BCDR
TL082CDR
TL082CDR
TL082CPSR
TL082CPWR
TL082IDR
D
8
8
D
8
8
PS
D
8
12
8
8
D
8
8
D
8
8
PS
PW
D
8
12
8
8
8
8
TL082IDR
D
8
8
TL082IPWR
TL084ACDR
TL084ACDR
TL084ACNSR
TL084BCDR
TL084CDR
TL084CNSR
TL084CPWR
TL084IDR
PW
D
8
8
14
14
14
14
14
14
14
14
8
D
8
NS
D
16
0
12
8
D
0
8
NS
PW
D
16
12
0
12
8
8
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-May-2007
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TL081ACDR
TL081BCDR
TL081CDR
TL081CPSR
TL081IDR
D
D
8
8
FMX
FMX
FMX
MLA
FMX
FMX
MLA
MLA
FMX
FMX
MLA
MLA
MLA
FMX
MLA
MLA
MLA
FMX
MLA
FMX
FMX
MLA
MLA
FMX
338.1
338.1
338.1
333.2
338.1
338.1
338.1
333.2
338.1
338.1
338.1
333.2
338.1
338.1
338.1
338.1
333.2
333.2
333.2
333.2
333.2
333.2
338.1
333.2
340.5
340.5
340.5
333.2
340.5
340.5
340.5
333.2
340.5
340.5
340.5
333.2
340.5
340.5
340.5
340.5
333.2
333.2
333.2
333.2
333.2
333.2
340.5
333.2
20.64
20.64
20.64
28.58
20.64
20.64
20.64
28.58
20.64
20.64
20.64
28.58
20.64
20.64
20.64
20.64
28.58
28.58
28.58
28.58
28.58
28.58
20.64
28.58
D
8
PS
D
8
8
TL082ACDR
TL082ACDR
TL082ACPSR
TL082BCDR
TL082CDR
TL082CDR
TL082CPSR
TL082CPWR
TL082IDR
D
8
D
8
PS
D
8
8
D
8
D
8
PS
PW
D
8
8
8
TL082IDR
D
8
TL082IPWR
TL084ACDR
TL084ACDR
TL084ACNSR
TL084BCDR
TL084CDR
TL084CNSR
TL084CPWR
TL084IDR
PW
D
8
14
14
14
14
14
14
14
14
D
NS
D
D
NS
PW
D
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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www.ti.com/video
www.ti.com/wireless
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