TISP7250H3SL [TI]
Silicon Surge Protector, 250 V, 60 A, SILICON SURGE PROTECTOR, PLASTIC, SIP-3;型号: | TISP7250H3SL |
厂家: | TEXAS INSTRUMENTS |
描述: | Silicon Surge Protector, 250 V, 60 A, SILICON SURGE PROTECTOR, PLASTIC, SIP-3 |
文件: | 总15页 (文件大小:454K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
TELECOMMUNICATION SYSTEM 2x100 A 10/1000 OVERVOLTAGE PROTECTORS
G
Ion-Implanted Breakdown Region
- Precise DC and Dynamic Voltages
SL PACKAGE
(TOP VIEW)
V
V
(BO)
DRM
1
2
3
T
G
R
DEVICE
V
V
‘7070
‘7080
‘7095
‘7125
‘7135
‘7145
‘7165
‘7180
‘7200
‘7210
‘7220
‘7250
‘7290
‘7350
‘7400
58
65
75
70
80
95
MDXXAG
100
110
120
130
145
150
160
170
200
230
275
300
125
135
145
165
180
200
210
220
250
290
350
400
device symbol
R
T
SD7XAB
G
G
Rated for International Surge Wave Shapes
- Single and Simultaneous Impulses
Terminals T, R and G correspond to the
alternative line designators of A, B and C
I
TSP
A
WAVE SHAPE
STANDARD
2/10 µs
8/20 µs
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
500
350
250
10/160 µs
G
G
3-Pin Through-Hole Packaging
- Compatible with TO-220AB pin-out
- Low Height. . . . . . . . . . . . . . . . . . . . .8.3 mm
FCC Part 68
10/700 µs
200
ITU-T K.20/21
FCC Part 68
10/560 µs
130
100
10/1000 µs
GR-1089-CORE
..................UL Recognized Component
description
The TISP7xxxH3SL limits overvoltages between the telephone line Ring and Tip conductors and Ground.
Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or
conducted on to the telephone line.
Each terminal pair, T-G, R-G and T-R, has a symmetrical voltage-triggered bidirectional thyristor protection
characteristic. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the
breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state
causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar
holding current prevents d.c. latchup as the diverted current subsides..
HOW TO ORDER
DEVICE
PACKAGE
CARRIER
ORDER AS
TISP7xxxH3
SL (Single-in-Line)
Tube
TISP7xxxH3SL
Insert xxx value corresponding to protection voltages of 070, 080, 095, 125 etcetera.
Copyright © 2000 Texas Instruments Incorporated
PRODUCTION DATA information is current as of
publication date. Products conform to specifications
per the terms of Texas Instruments standard warranty.
Production processing does not necessary include
testing of all parameters.
Designed and manufactured by Power
Innovations, A Bourns Company, under
private label for Texas Instruments.
1
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
This TISP7xxxH3SL range consists of fifteen voltage variants to meet various maximum system voltage
levels (58 V to 300 V). They are guaranteed to voltage limit and withstand the listed international lightning
surges in both polarities. These high current protection devices are in a 3-pin single-in-line (SL) plastic
package and are supplied in tube pack. For alternative impulse rating, voltage and holding current values in
SL packaged protectors, consult the factory. For lower rated impulse currents in the SL package, the 45 A
10/1000 TISP7xxxF3SL series is available.
These monolithic protection devices are fabricated in ion-implanted planar structures to ensure precise and
matched breakover control and are virtually transparent to the system in normal operation
absolute maximum ratings, T = 25 °C (unless otherwise noted)
A
RATING
SYMBOL
VALUE
58
UNIT
‘7070
‘7080
‘7095
‘7125
‘7135
‘7145
‘7165
‘7180
‘7200
‘7210
‘7220
‘7250
‘7290
‘7350
‘7400
65
75
100
110
120
130
145
150
160
170
200
230
275
300
Repetitive peak off-state voltage, (see Note 1)
V
V
DRM
Non-repetitive peak on-state pulse current (see Notes 2, and 3)
2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape)
500
350
250
225
200
200
200
130
100
8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator)
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)
4/250 (ITU-T K.20/21, 10/700 voltage wave shape, dual)
0.2/310 (CNET I 31-24, 0.5/700 voltage wave shape)
5/310 (ITU-T K.20/21, 10/700 voltage wave shape, single)
5/320 µs (FCC Part 68, 9/720 µs voltage wave shape)
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)
10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape)
Non-repetitive peak on-state current (see Notes 2, 3 and 4)
20 ms (50 Hz) full sine wave
I
A
TSP
55
60
16.7 ms (60 Hz) full sine wave
I
A
TSM
1000 s 50 Hz/60 Hz a.c.
0.9
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A
Junction temperature
di /dt
400
A/µs
°C
T
T
-40 to +150
-65 to +150
J
Storage temperature range
T
°C
stg
NOTES: 1. Derate value at -0.13%/°C for temperatures below 25 °C.
2. Initially the TISP7xxxH3 must be in thermal equilibrium.
3. These non-repetitive rated currents are peak values of either polarity. The rated current values may be applied to any terminal
pair. Additionally, both R and T terminals may have their rated current values applied simultaneously (in this case the G terminal
return current will be the sum of the currents applied to the R and T terminals). The surge may be repeated after the TISP7xxxH3
returns to its initial conditions.
4. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring
track widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C
2
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
electrical characteristics for any terminal pair, T = 25 °C (unless otherwise noted)
A
PARAMETER
Repetitive peak off-
state current
TEST CONDITIONS
MIN
TYP
MAX
5
UNIT
T = 25 °C
A
I
V
= V
DRM
µA
DRM
D
T = 85 °C
A
10
‘7070
‘7080
‘7095
‘7125
‘7135
‘7145
‘7165
‘7180
‘7200
‘7210
‘7220
‘7250
‘7290
‘7350
‘7400
‘7070
‘7080
‘7095
‘7125
‘7135
‘7145
‘7165
‘7180
‘7200
‘7210
‘7220
‘7250
‘7290
‘7350
‘7400
70
80
95
125
135
145
165
180
200
210
220
250
290
350
400
78
V
Breakover voltage
dv/dt = 750 V/ms,
R
= 300 Ω
V
(BO)
SOURCE
88
103
134
144
154
174
189
210
220
231
261
302
362
414
0.8
5
dv/dt ≤ 1000 V/µs, Linear voltage ramp,
Maximum ramp value = 500 V
Impulse breakover
voltage
V
V
(BO)
di/dt = 20 A/µs, Linear current ramp,
Maximum ramp value = 10 A
I
Breakover current
On-state voltage
Holding current
dv/dt = 750 V/ms,
R
= 300 Ω
0.1
A
V
A
(BO)
SOURCE
V
I = 5 A, t = 100 µs
T
T
W
I
I = 5 A, di/dt = +/-30 mA/ms
0.15
5
0.6
H
T
Critical rate of rise of
off-state voltage
Off-state current
dv/dt
Linear voltage ramp, Maximum ramp value < 0.85V
kV/µs
µA
DRM
I
V
=
50 V
T = 85 °C
10
D
D
A
3
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
electrical characteristics for any terminal pair, T = 25 °C (unless otherwise noted) (continued)
A
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
170
90
UNIT
f = 1 MHz, V = 1 V rms, V = 0,
‘7070 thru ‘7095
‘7125 thru ‘7220
‘7250 thru ‘7400
‘7070 thru ‘7095
‘7125 thru ‘7220
‘7250 thru ‘7400
‘7070 thru ‘7095
‘7125 thru ‘7220
‘7250 thru ‘7400
‘7070 thru ‘7095
‘7125 thru ‘7220
‘7250 thru ‘7400
‘7125 thru ‘7220
‘7250 thru ‘7400
d
D
84
f = 1 MHz, V = 1 V rms, V = -1 V
150
79
d
D
67
f = 1 MHz, V = 1 V rms, V = -2 V
140
74
d
D
C
Off-state capacitance
pF
off
62
f = 1 MHz, V = 1 V rms, V = -50 V
73
d
D
35
28
f = 1 MHz, V = 1 V rms, V = -100 V
33
d
D
(see Note 5)
26
NOTE 5: To avoid possible voltage clipping, the ‘7125 is tested with V = -98 V.
D
thermal characteristics
PARAMETER
MIN
TYP
MAX
UNIT
TEST CONDITIONS
EIA/JESD51-3 PCB, I = I
,
TSM(1000)
T
RθJA
Junction to free air thermal resistance
50
°C/W
T = 25 °C, (see Note 6)
A
NOTE 6: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
4
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
+i
Quadrant I
Switching
ITSP
Characteristic
ITSM
IT
V(BO)
VT
I(BO)
IH
IDRM
ID
VDRM
VD
-v
+v
ID
VD
VDRM
IDRM
IH
I(BO)
VT
V(BO)
IT
ITSM
Quadrant III
ITSP
VD = 50 V and ID = 10 µA
used for reliability release
Switching
Characteristic
-i
PM4XAAC
Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR TERMINAL PAIRS
5
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
OFF-STATE CURRENT
NORMALISED BREAKOVER VOLTAGE
vs
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
TC7AAA
TC7AABA
1.10
1.05
1.00
0.95
10
1
'7125 THRU '7220
'7250 THRU '7400
VD = +50 V
VD = -50 V
0·1
'7070 THRU '7095
'7250 THRU '7400
0·01
0·001
0·0001
-25
0
25
50
75
100 125 150
0
25
50
75
100
125
150
TJ - Junction Temperature - °C
TJ - Junction Temperature - °C
Figure 2.
Figure 3.
NORMALISED HOLDING CURRENT
vs
NORMALISED BREAKOVER CURRENT
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
TC7AAC
TC7AADA
2.0
1.5
4.0
+ I(BO), - I(BO) '7070 THRU '7220
3.0
2.0
1.5
1.0
0.9
0.8
1.0
0.9
0.7
0.8
0.7
0.6
0.5
+ I(BO), - I(BO) '7250 THRU '7400
0.6
0.5
0.4
0.4
-25
-25
0
25
50
75
100 125 150
0
25
50
75
100 125 150
T - Junction Temperature - °C
J
TJ - Junction Temperature - °C
Figure 4.
Figure 5.
6
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
DIFFERENTIAL OFF-STATE CAPACITANCE
vs
NORMALISED CAPACITANCE
vs
RATED REPETITIVE PEAK OFF-STATE VOLTAGE
OFF-STATE VOLTAGE
TC7AAIA
80
1
0.9
75
70
65
TJ = 25°C
0.8
0.7
Vd = 1 Vrms
0.6
0.5
60
∆C = Coff(-2 V) - Coff(-50 V)
55
50
45
40
35
30
'7070 THRU '7095
0.4
0.3
'7125 THRU '7220
'7250 THRU '7400
0.2
50 60 70 80 100
150
200 250 300
400
1
2
3
5
10
20 30 50
100 150
VDRM - Repetitive Peak Off-State Voltage - V
VD - Off-state Voltage - V
Figure 6.
Figure 7.
7
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
RATING AND THERMAL INFORMATION
NON-REPETITIVE PEAK ON-STATE CURRENT
vs
CURRENT DURATION
TI7AB
30
VGEN = 600 V rms, 50/60 Hz
20
15
R
GEN = 1.4*VGEN/ITSM(t)
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB, TA = 25 °C
SIMULTANEOUS OPERATION
OF R AND T TERMINALS. G
TERMINAL CURRENT = 2xITSM(t)
10
9
8
7
6
5
4
3
2
1.5
1
0.9
0.8
0·1
1
10
100
1000
t - Current Duration - s
Figure 8.
IMPULSE RATING
VDRM DERATING FACTOR
vs
vs
AMBIENT TEMPERATURE
MINIMUM AMBIENT TEMPERATURE
TI7AACA
TC7HAA
1.00
0.99
0.98
0.97
0.96
0.95
0.94
0.93
700
600
TELCORDIA 2/10
500
IEC 1.2/50, 8/20
400
300
250
FCC 10/160
ITU-T 10/700
'7070 THRU '7095
200
150
120
FCC 10/560
TELCORDIA 10/1000
'7125 THRU '7220
'7250 THRU '7400
100
90
80
70
-40 -35 -30 -25 -20 -15 -10 -5
0
5
10 15 20 25
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80
TAMIN - Minimum Ambient Temperature - °C
TA - Ambient Temperature - °C
Figure 9.
Figure 10.
8
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
APPLICATIONS INFORMATION
deployment
These devices are three terminal overvoltage protectors. They limit the voltage between three points in the
circuit. Typically, this would be the two line conductors and protective ground (Figure 11).
Th3
Th1
Th2
Figure 11. MULTI-POINT PROTECTION
In Figure 11, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the
V
V
of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its
value.
(BO)
(BO)
Manufacturers are being increasingly required to design in protection coordination. This means that each
protector is operated at its design level and currents are diverted through the appropriate protector e.g. the
primary level current through the primary protector and lower levels of current may be diverted through the
secondary or inherent equipment protection. Without coordination, primary level currents could pass through
the equipment only designed to pass secondary level currents. To ensure coordination happens with fixed
voltage protectors, some resistance is normally used between the primary and secondary protection. The
values given in this data sheet apply to a 400 V (d.c. sparkover) gas discharge tube primary protector and the
appropriate test voltage when the equipment is tested with a primary protector.
impulse testing
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested
with various impulse wave forms. The table below shows some common values.
PEAK VOLTAGE
SETTING
V
VOLTAGE
WAVE FORM
µs
PEAK CURRENT
CURRENT
TISP7xxxH3
SERIES
COORDINATION
RESISTANCE
Ω (MIN.)
STANDARD
VALUE
A
WAVE FORM 25 °C RATING RESISTANCE
µs
A
500
Ω
2500
2/10
500
2/10
GR-1089-CORE
0
NA
1000
10/1000
10/160
100
10/1000
10/160
10/560
5/320 †
5/320 †
4/250
100
1500
200
250
800
10/560
100
130
FCC Part 68
(March 1998)
1000
9/720 †
(SINGLE)
(DUAL)
0.5/700
10/700
25
200
0
NA
1500
37.5
2 x 27
37.5
25
200
1500
2 x 225
200
I 31-24
1500
0.2/310
5/310
0
0
NA
NA
NA
4.5
6.0
1000
200
1500
(SINGLE)
(SINGLE)
(DUAL)
37.5
100
5/310
200
ITU-T K.20/K.21
4000
5/310
200
4000
2 x 72
4/250
2 x 225
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator
NA = Not Applicable, primary protection removed or not specified.
9
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
If the impulse generator current exceeds the protectors current rating then a series resistance can be used to
reduce the current to the protectors rated value and so prevent possible failure. The required value of series
resistance for a given waveform is given by the following calculations. First, the minimum total circuit
impedance is found by dividing the impulse generators peak voltage by the protectors rated current. The
impulse generators fictive impedance (generators peak voltage divided by peak short circuit current) is then
subtracted from the minimum total circuit impedance to give the required value of series resistance. In some
cases the equipment will require verification over a temperature range. By using the rated waveform values
from Figure 10, the appropriate series resistor value can be calculated for ambient temperatures in the range
of -40 °C to 85 °C.
a.c. power testing
The protector can withstand the G return currents applied for times not exceeding those shown in Figure 8.
Currents that exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC
(Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can
be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one
ampere. In some cases it may be necessary to add some extra series resistance to prevent the fuse opening
during impulse testing. The current versus time characteristic of the overcurrent protector must be below the
line shown in Figure 8. In some cases there may be a further time limit imposed by the test standard (e.g. UL
1459 wiring simulator failure).
capacitance
The protector characteristic off-state capacitance values are given for d.c. bias voltage, V , values of 0, -1 V,
D
-2 V and -50 V. Where possible values are also given for -100 V. Values for other voltages may be calculated
by multiplying the V = 0 capacitance value by the factor given in Figure 6. Up to 10 MHz the capacitance is
D
essentially independent of frequency. Above 10 MHz the effective capacitance is strongly dependent on
connection inductance. For example, a printed wiring (PW) trace of 10 cm could create a circuit resonance
with the device capacitance in the region of 50 MHz. In many applications, the typical conductor bias voltages
will be about -2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing
one protector at -2 V and the other at -50 V.
normal system voltage levels
The protector should not clip or limit the voltages that occur in normal system operation. For unusual
conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this
condition, about 10 V of clipping is normally possible without activating the ring trip circuit.
Figure 9 allows the calculation of the protector V
value at temperatures below 25 °C. The calculated value
DRM
should not be less than the maximum normal system voltages. The TISP3290H3, with a V
of 220 V, can
DRM
be used for the protection of ring generators producing 105 V rms of ring on a battery voltage of -58 V. The
peak ring voltage will be 58 + 1.414*105 = 206.5 V. However, this is the open circuit voltage and the
connection of the line and its equipment will reduce the peak voltage.
For the extreme case of an unconnected line, the temperature at which clipping begins can be calculated
using the data from Figure 9. To possibly clip, the V
value has to be 206.5 V. This is a reduction of the
DRM
220 V 25 °C V
value by a factor of 206.5/220 = 0.94. Figure 9 shows that a 0.94 reduction will occur at an
DRM
ambient temperature of -32 °C. In this example, the TISP3290H3 will allow normal equipment operation, even
on an open-circuit line, provided that the minimum expected ambient temperature does not fall below -32 °C.
JESD51 thermal measurement method
To standardise thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51
3
3
standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m (1 ft )
cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the
10
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller
than 27 mm on a side and the other for packages up to 48 mm. The thermal measurements used the smaller
76.2 mm x 114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal
conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority
of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than
indicated by the JESD51 values.
11
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
typical circuits
TIP
WIRE
F1a
R1a
Th3
Th1
PROTECTED
EQUIPMENT
E.G. LINE CARD
Th2
F1b
R1b
AI7XBK
RING
WIRE
TISP7xxxH3
Figure 12. PROTECTION MODULE
R1a
Th3
SIGNAL
Th1
Th2
R1b
AI7XBL
TISP7150H3
D.C.
Figure 13. ISDN PROTECTION
OVER-
SLIC
RING/TEST
TEST
RING
SLIC
CURRENT
PROTECTION
PROTECTION
RELAY
RELAY
RELAY
PROTECTION
TIP
WIRE
S3a
R1a
Th4
Th3
S1a
S2a
COORDIN-
ATION
Th1
Th2
SLIC
RESISTANCE
Th5
R1b
RING
WIRE
S3b
TISP7xxxH3
TISP6xxxx,
TISPPBLx,
S1b
S2b
½TISP6NTP2
VBAT
C1
220 nF
TEST
EQUIP-
MENT
RING
GENERATOR
AI7XBJ
Figure 14. LINE CARD RING/TEST PROTECTION
12
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
MECHANICAL DATA
device symbolization code
Devices will be coded as below.
SYMBOLIZATION
CODE
DEVICE
TISP7070H3SL
TISP7080H3SL
TISP7095H3SL
TISP7125H3SL
TISP7135H3SL
TISP7145H3SL
TISP7165H3SL
TISP7180H3SL
TISP7200H3SL
TISP7210H3SL
TISP7220H3SL
TISP7250H3SL
TISP7290H3SL
TISP7350H3SL
TISP7400H3SL
SP7070H3
SP7080H3
SP7095H3
SP7125H3
SP7135H3
SP7145H3
SP7165H3
SP7180H3
SP7200H3
SP7210H3
SP7220H3
SP7250H3
SP7290H3
SP7350H3
SP7400H3
13
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
MECHANICAL DATA
SL003
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic com-
pound. The compound will withstand soldering temperature with no deformation, and circuit performance charac-
teristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or
processing when used in soldered assembly.
SL003
9,75 (0.384)
9,25 (0.364)
3,40 (0.134)
3,20 (0.126)
Index
Notch
6,60 (0.260)
6,10 (0.240)
8,31 (0.327)
MAX
12,9 (0.492)
MAX
4,267 (0.168)
MIN
2
1
3
2,54 (0.100) Typical
(see Note A)
2 Places
0,356 (0.014)
0,203 (0.008)
1,854 (0.073)
MAX
0,711 (0.028)
0,559 (0.022)
3 Places
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
MDXXCEA
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
14
TISP7070H3SL THRU TISP7095H3SL, TISP7125H3SL THRU TISP7220H3SL
TISP7250H3SL THRU TISP7400H3SL
TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
MARCH 1999 - REVISED OCTOBER 2000
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or ser-
vice without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders,
that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems neces-
sary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those man-
dated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or
environmental damage (“Critical Applications”).
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE
FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such
applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be
directed to TI through a local SC sales office.
In order to minimize risks associated with the customer's applications, adequate design and operating safeguards should be
provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents
or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any
patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
Copyright © 2000, Texas Instruments Incorporated
15
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