TAS6584-Q1 [TI]
具有电流检测功能的汽车类 45V、10A 数字输入、四通道 D 类音频放大器;
| 型号： | TAS6584-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有电流检测功能的汽车类 45V、10A 数字输入、四通道 D 类音频放大器 放大器 音频放大器 |
| 文件： | 总13页 (文件大小：1428K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAS6584-Q1
ZHCSPF0A –JANUARY 2022 –REVISED MARCH 2022
TAS6584-Q1 - 具有电流感测和实时负载诊断功能的45V、10A 数字输入4 通道
汽车D 类音频放大器
– 输出短路保护
– 直流失调电压，欠压和过压
– 可配置过热警告和单个通道关断
1 特性
• 符合面向汽车应用的AEC-Q100 标准
– I2C 温度和电源电压读数
– 温度等级1：–40°C 至+125°C，TA
• 常规运行
• 可轻松满足CISPR25-L5 EMC 规范要求
– 高级展频
– 4.5V 至45V 电源电压，50V 负载突降
– 支持1.8V 和3.3V I/O
– I2C 控制，具有8 个地址选项
– 14.4V 时的空闲功率损耗低于2W，最大
VBAT+PVDD 关断损耗低于8 uA
• 集成DSP 处理
2 应用
• 汽车外部放大器
• 汽车音响主机
3 说明
– H 类电源电压控制
– 热监控和折返
– 削波探测、PVDD 监控和折返
• 通过I2S/TDM 按通道进行输出电流感测
TAS6584-Q1 是一款四通道、数字输入、高压、D 类
音频放大器，支持高达 45V 的电源电压。结合高达
10A 的输出电流，该器件可在高阻抗和低阻抗负载下
提供最大输出功率和高保真音频。该器件在 118W
（45V、8Ω、1% THD、BTL）和 215W（45V、4Ω、
1% THD、BTL）下提供四个通道。
– 无需外部电路
• 实时负载诊断
– 播放音频时监控输出条件
– 开路负载、短路负载、电源短路、接地短路检测
• 直流和交流备用负载诊断
• 音频输入
TAS6584-Q1 集成了直流和交流负载诊断功能，可在
启用输出级之前确定所连接负载的状态。在音频播放期
间，可通过适用于每个通道的输出电流感测功能来监控
状态，并通过 TDM 以最小的延迟将测量结果报告给主
机处理器。该器件在播放音频时使用独立于主机和音频
输入运行的实时负载诊断功能来监控输出负载状况。
– 2-4 通道I2S 或4-16 通道TDM 输入
– 输入采样率：44.1 kHz、48 kHz、96 kHz、192
kHz
– 辅助低延迟路径，在48 kHz 时信号延迟减少
70% 以上
• 音频输出
为了优化系统效率，TAS6584-Q1 中集成的 DSP 支持
H 类包络跟踪控制，无需开发复杂的跟踪软件，而且无
需外部微控制器即可实现本地升压控制。
– 4 通道桥接式负载(BTL)，可配置2 通道并联
BTL (PBTL)
TAS6584-Q1 器件为每个通道提供一个额外的低延迟
信号路径，在48kHz 下提供最高快 70% 的信号处理速
度，从而支持时间敏感型有源噪声消除 (ANC) 和道路
噪声消除(RNC) 应用。
– 384 kHz 至2.1 MHz 可配置输出开关频率
– 高达10A 的通道输出电流
– 400VA 峰值BTL 输出功率
– 118W（45V、8Ω、1% THD、BTL）
– 215W（45V、4Ω、1% THD、BTL）
• 音频性能
该器件采用带外露散热焊盘的64 引脚QFP 封装。
器件信息
封装(1)
封装尺寸（标称值）
器件型号
TAS6584-Q1
– THD+N 0.03%（8Ω、1W、1kHz）
– 111 dB 的信噪比(SNR)
HTQFP (64)
14.00mm x 14.00mm
– 37 µV (14.4V)、80 µV (45V) 输出噪声
• 保护
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLOSE94
TAS6584-Q1
ZHCSPF0A –JANUARY 2022 –REVISED MARCH 2022
www.ti.com.cn
4.5-45V
PVDD / VBAT
1.8V / 3.3V
DVDD
CH1
CH3
I2C
CH2
CH4
SoC /
DSP
TAS6584-Q1
I2S /
TDM
简图
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Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 3
5 Device and Documentation Support..............................4
5.1 Documentation Support.............................................. 4
5.2 接收文档更新通知....................................................... 4
5.3 支持资源......................................................................4
5.4 Trademarks.................................................................4
5.5 Electrostatic Discharge Caution..................................4
5.6 术语表......................................................................... 4
6 Mechanical, Packaging, and Orderable Information....4
6.1 Tape and Reel Information..........................................5
6.2 Mechanical Data......................................................... 6
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (January 2022) to Revision A (March 2022)
Page
• 将器件状态从预告信息更改为量产数据.............................................................................................................1
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5 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
5.1 Documentation Support
5.1.1 Related Documentation
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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6.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
PTAS6584QDKQQ1
HTQFP
PHD
64
1000
330.0
24.4
17.0
17.0
1.5
20.0
24.0
Q2
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
PHD 64
SPQ
Length (mm) Width (mm)
350.0 350.0
Height (mm)
PTAS6584QPHDRQ1
HTQFP
1000
43.0
6.2 Mechanical Data
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PACKAGE OUTLINE
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PHD0064B
14.05
13.95
NOTE 3
B
PIN 1 ID
8.00
6.68
64
49
48
1
THERMAL PAD
4
14.05
13.95
NOTE 3
16.15
15.85
TYP
8.00
6.68
16
33
32
17
0.40
0.30
A
64 X
0.2
60 X 0.8
4 X 12
C
A
B
SEE DETAIL A
(0.127) TYP
C
1.2 MAX
SEATING PLANE
17
32
16
33
0.25
GAGE PLANE
1.05
0.95
0°-7°
0.15
0.05
0.75
0.45
0.1 C
DETAIL A
TYPICAL
1
48
49
64
4224850/A 05/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 per side.
4. See technical brief. PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
(www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004) for information regarding recommended board layout.
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EXAMPLE BOARD LAYOUT
HTQFP - 1.2 mm max height
PHD0064B
PLASTIC QUAD FLATPACK
SYMM
49
64
64 X (1.5)
1
48
64 X (0.55)
60 X (0.8)
SYMM
(15.4)
33
16
(R0.05) TYP
32
17
(15.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED
METAL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4224850/A 05/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
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EXAMPLE STENCIL DESIGN
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PHD0064B
SYMM
49
64
64 X (1.5)
1
48
64 X (0.55)
60 X (0.8)
SYMM
(15.4)
33
16
(R0.05) TYP
32
17
(15.4)
SOLDER PASTE EXAMPLE
SCALE: 6X
4224850/A 05/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TAS6584QPHDRQ1
ACTIVE
HTQFP
PHD
64
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TAS6584
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TAS6584QPHDRQ1
HTQFP
PHD
64
1000
330.0
24.4
17.0
17.0
1.5
20.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTQFP PHD 64
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TAS6584QPHDRQ1
1000
Pack Materials-Page 2
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