SNJ54AHC126WR [TI]
AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14;
| 型号： | SNJ54AHC126WR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14 驱动 CD 输出元件 逻辑集成电路 |
| 文件： | 总23页 (文件大小：1204K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
SN54AHC126 . . . J OR W PACKAGE
SN74AHC126 . . . D, DB, DGV, N, NS, OR PW PACKAGE
(TOP VIEW)
Operating Range 2-V to 5.5-V V
CC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
1
2
3
4
5
6
7
14
13
12
11
10
9
1OE
1A
1Y
2OE
2A
2Y
V
CC
4OE
description/ordering information
4A
4Y
3OE
3A
3Y
The ’AHC126 devices are quadruple bus buffer
gates featuring independent line drivers with
3-state outputs. Each output is disabled when the
associated output-enable (OE) input is low. When
OE is high, the respective gate passes the data
from the A input to its Y output.
8
GND
To ensure the high-impedance state during power
up or power down, OE should be tied to GND
through a pulldown resistor; the minimum value of
the resistor is determined by the current-sourcing
capability of the driver.
SN54AHC126 . . . FK PACKAGE
(TOP VIEW)
3
2
1 20 19
18 4A
1Y
NC
4
5
6
7
8
17
16
15
14
NC
4Y
2OE
NC
NC
3OE
2A
9 10 11 12 13
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube
SN74AHC126N
SN74AHC126N
Tube
SN74AHC126D
AHC126
Tape and reel
Tape and reel
Tape and reel
Tube
SN74AHC126DR
SN74AHC126NSR
SN74AHC126DBR
SN74AHC126PW
SN74AHC126PWR
SN74AHC126DGVR
SNJ54AHC126J
SNJ54AHC126W
SNJ54AHC126FK
SOP – NS
AHC126
HA126
–40°C to 85°C
SSOP – DB
TSSOP – PW
HA126
Tape and reel
Tape and reel
Tube
TVSOP – DGV
CDIP – J
HA126
SNJ54AHC126J
–55°C to 125°C
CFP – W
Tube
SNJ54AHC126W
SNJ54AHC126FK
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
H
L
H
H
L
H
L
X
Z
logic diagram (positive logic)
1
10
1OE
3OE
3A
2
3
6
9
8
1A
1Y
2Y
3Y
4Y
4
13
12
2OE
4OE
4A
5
11
2A
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, and W packages.
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
IK
I
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 3)
SN54AHC126 SN74AHC126
UNIT
MIN
MAX
MIN
MAX
V
V
Supply voltage
2
5.5
2
5.5
V
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
1.5
2.1
3.85
1.5
2.1
3.85
High-level input voltage
= 3 V
IH
= 5.5 V
= 2 V
0.5
0.9
0.5
0.9
V
IL
Low-level input voltage
= 3 V
V
= 5.5 V
1.65
5.5
1.65
5.5
V
V
Input voltage
0
0
0
0
V
V
I
Output voltage
V
V
CC
O
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
–50
–4
–8
50
4
–50
–4
–8
50
4
A
I
High-level output current
Low-level output current
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
= 2 V
OH
OL
mA
A
I
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
mA
8
8
100
20
125
100
20
85
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
T
–55
–40
°C
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
2
SN54AHC126 SN74AHC126
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
1.9
MAX
MIN
1.9
MAX
MIN
1.9
MAX
2 V
3 V
I
= –50
A
2.9
3
2.9
2.9
OH
4.5 V
3 V
4.4
4.5
4.4
4.4
V
V
OH
OL
2.58
3.94
2.48
3.8
2.48
3.8
I
I
= –4 mA
OH
4.5 V
2 V
= –8 mA
OH
0.1
0.1
0.1
0.1
0.1
0.5
0.5
±1*
±2.5
40
0.1
0.1
I
= 50
A
3 V
OL
4.5 V
3 V
0.1
0.1
V
V
0.36
0.36
±0.1
±0.25
4
0.44
0.44
±1
I
I
= 4 mA
= 8 mA
OL
4.5 V
0 V to 5.5 V
5.5 V
5.5 V
5 V
OL
I
I
I
V = 5.5 V or GND
A
A
I
I
V
= V or GND
CC
±2.5
40
OZ
CC
O
V = V
or GND,
or GND
I = 0
O
A
I
CC
CC
C
V = V
4
10
10
pF
i
I
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V
CC
= 0 V.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
5.6*
5.6*
5.4*
5.4*
7*
SN54AHC126 SN74AHC126
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
ns
MIN
MAX
8*
MIN
1*
MAX
9.5*
9.5*
9.5*
9.5*
MIN
1
MAX
9.5
9.5
9.5
9.5
11.5
11.5
13
t
t
t
t
t
t
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
Y
Y
Y
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
L
L
L
L
L
8*
1*
1
8*
1*
1
ns
OE
OE
A
8*
1*
1
9.7*
9.7*
11.5
11.5
11.5
11.5
13.2
13.2
1* 11.5*
1* 11.5*
1
ns
7*
1
8.1
1
1
1
1
1
1
13
13
13
13
15
15
1
ns
8.1
1
13
7.9
1
13
ns
OE
OE
7.9
1
13
9.5
1
15
C
C
= 50 pF
= 50 pF
ns
ns
L
L
9.5
1
15
t
1.5**
1.5
sk(o)
On products compliant to MIL-PRF-38535, this parameter is not production tested.
On products compliant to MIL-PRF-38535, this parameter does not apply.
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
3.8*
3.8*
3.6*
3.6*
4.6*
4.6*
5.3
SN54AHC126 SN74AHC126
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
ns
MIN
MAX
5.5*
5.5*
5.1*
5.1*
6.8*
6.8*
7.5
MIN
1*
1*
1*
1*
1*
1*
1
MAX
6.5*
6.5*
6*
MIN
1
MAX
6.5
6.5
6
t
t
t
t
t
t
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
Y
Y
Y
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
L
L
L
L
L
1
1
ns
OE
OE
A
6*
1
6
8*
1
8
ns
8*
1
8
8.5
8.5
8
1
8.5
8.5
8
ns
5.3
7.5
1
1
5.1
7.1
1
1
ns
OE
OE
5.1
7.1
1
8
1
8
6.1
8.8
1
10
10
1
10
10
C
C
= 50 pF
= 50 pF
ns
ns
L
L
6.1
8.8
1
1
t
1**
1
sk(o)
On products compliant to MIL-PRF-38535, this parameter is not production tested.
On products compliant to MIL-PRF-38535, this parameter does not apply.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74AHC126
UNIT
PARAMETER
MIN
MAX
V
V
V
V
V
Quiet output, maximum dynamic V
0.8
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
–0.8
OL
4.4
3.5
OH
1.5
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
14
pF
pd
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC126, SN74AHC126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS257L – DECEMBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
Open
PLH PHL
/t
C
C
L
t
V
CC
L
PLZ PZL
/t
(see Note A)
(see Note A)
GND
PHZ PZH
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
V
CC
50% V
CC
Timing Input
0 V
t
w
t
h
t
su
V
CC
V
CC
50% V
50% V
CC
Input
CC
50% V
50% V
CC
Data Input
CC
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
50% V
50% V
50% V
50% V
t
Input
CC
CC
CC
CC
0 V
0 V
t
PZL
t
t
t
PLZ
PLH
PHL
Output
Waveform 1
V
OH
≈V
CC
In-Phase
Output
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
V
OL
+ 0.3 V
CC
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
V
OH
OH
Out-of-Phase
Output
V
OH
– 0.3 V
50% V
50% V
50% V
CC
CC
CC
V
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-9686201Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9686201Q2A
SNJ54AHC
126FK
5962-9686201QCA
5962-9686201QDA
SN74AHC126D
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-40 to 85
5962-9686201QC
A
SNJ54AHC126J
W
D
5962-9686201QD
A
SNJ54AHC126W
SOIC
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
AHC126
SN74AHC126DBLE
SN74AHC126DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HA126
SN74AHC126DBRE4
SN74AHC126DBRG4
SN74AHC126DE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
DB
DB
D
14
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HA126
Green (RoHS
& no Sb/Br)
HA126
Green (RoHS
& no Sb/Br)
AHC126
AHC126
HA126
SN74AHC126DG4
SOIC
D
50
Green (RoHS
& no Sb/Br)
SN74AHC126DGVR
SN74AHC126DGVRE4
SN74AHC126DGVRG4
SN74AHC126DR
TVSOP
TVSOP
TVSOP
SOIC
DGV
DGV
DGV
D
2000
2000
2000
2500
2500
2500
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
HA126
Green (RoHS
& no Sb/Br)
HA126
Green (RoHS
& no Sb/Br)
AHC126
AHC126
AHC126
SN74AHC126DRE4
SN74AHC126DRG4
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74AHC126N
SN74AHC126NE4
SN74AHC126NSR
SN74AHC126NSRE4
SN74AHC126NSRG4
SN74AHC126PW
ACTIVE
PDIP
PDIP
SO
N
14
14
14
14
14
14
14
14
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
SN74AHC126N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
N
25
2000
2000
2000
90
Pb-Free
(RoHS)
N / A for Pkg Type
SN74AHC126N
AHC126
AHC126
AHC126
HA126
NS
NS
NS
PW
PW
PW
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
SN74AHC126PWE4
SN74AHC126PWG4
90
Green (RoHS
& no Sb/Br)
HA126
90
Green (RoHS
& no Sb/Br)
HA126
SN74AHC126PWLE
SN74AHC126PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HA126
HA126
HA126
SN74AHC126PWRE4
SN74AHC126PWRG4
SNJ54AHC126FK
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
LCCC
PW
PW
FK
14
14
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-55 to 125
Green (RoHS
& no Sb/Br)
TBD
5962-
9686201Q2A
SNJ54AHC
126FK
SNJ54AHC126J
SNJ54AHC126W
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9686201QC
A
SNJ54AHC126J
W
5962-9686201QD
A
SNJ54AHC126W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AHC126, SN74AHC126 :
Catalog: SN74AHC126
•
Military: SN54AHC126
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHC126DBR
SN74AHC126DGVR
SN74AHC126DR
SSOP
TVSOP
SOIC
DB
DGV
D
14
14
14
14
14
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
12.4
16.4
16.4
12.4
8.2
6.8
6.5
8.2
6.9
6.6
4.0
2.5
1.6
2.1
2.5
1.6
12.0
8.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
9.0
8.0
SN74AHC126NSR
SN74AHC126PWR
SO
NS
10.5
5.6
12.0
8.0
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHC126DBR
SN74AHC126DGVR
SN74AHC126DR
SSOP
TVSOP
SOIC
DB
DGV
D
14
14
14
14
14
2000
2000
2500
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
35.0
38.0
38.0
35.0
SN74AHC126NSR
SN74AHC126PWR
SO
NS
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
SNJ54AHC139FKR
AHC/VHC/H/U/V SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
TI
SNJ54AHC139WR
AHC/VHC/H/U/V SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, DFP-16
TI
©2020 ICPDF网 联系我们和版权申明