SN74LVTH646-EP [TI]

3.3-V ABT OCTAL BUS TRANSVEIVER AND REGISTER WITH 3-STATE OUTPUTS; 3.3 -V ABT八路总线TRANSVEIVER并用3态输出寄存器
SN74LVTH646-EP
型号: SN74LVTH646-EP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3.3-V ABT OCTAL BUS TRANSVEIVER AND REGISTER WITH 3-STATE OUTPUTS
3.3 -V ABT八路总线TRANSVEIVER并用3态输出寄存器

输出元件
文件: 总12页 (文件大小:328K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢃ ꢈꢉ ꢊꢋ  
ꢌ ꢍꢌ ꢉꢅ ꢎꢏꢆ ꢐ ꢑꢆꢎꢄ ꢏꢒꢀ ꢆ ꢓꢎꢁꢀ ꢑꢊꢔ ꢅꢊꢓ ꢎꢁꢕ ꢓ ꢊꢖ ꢔ ꢀ ꢆꢊ ꢓ  
ꢗ ꢔꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐ ꢒꢆ ꢋ ꢒꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
D
D
D
D
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
D
D
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
Enhanced Product-Change Notification  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
Qualification Pedigree  
Supports Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
PW PACKAGE  
(TOP VIEW)  
3.3-V V  
)
CC  
D
D
D
Supports Unregulated Battery Operation  
Down to 2.7 V  
CLKAB  
SAB  
DIR  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
GND  
V
CC  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
CLKBA  
SBA  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
2
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
3
= 3.3 V, T = 25°C  
A
4
I
and Power-Up 3-State Support Hot  
off  
5
Insertion  
6
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
7
8
9
10  
11  
12  
B8  
description/ordering information  
This bus transceiver and register is designed specifically for low-voltage (3.3-V) V  
capability to provide a TTL interface to a 5-V system environment.  
operation, but with the  
CC  
The SN74LVTH646 consists of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for  
multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B  
bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input.  
Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’LVTH646.  
Output-enable (OE) and direction-control (DIR) inputs are provided to control the transceiver functions. In the  
transceiver mode, data present at the high-impedance port can be stored in either register or in both.  
The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. The  
direction control (DIR) determines which bus receives data when OE is low. In the isolation mode (OE high),  
A data can be stored in one register and/or B data can be stored in the other register.  
When an output function is disabled, the input function is still enabled and can be used to store and transmit  
data. Only one of the two buses, A or B, can be driven at a time.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
−40°C to 85°C  
TSSOP − PW Tape and reel  
SN74LVTH646IPWREP  
LH646EP  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢆꢣ  
Copyright 2004, Texas Instruments Incorporated  
ꢟ ꢣ ꢠ ꢟꢘ ꢙꢬ ꢛꢚ ꢞ ꢦꢦ ꢤꢞ ꢜ ꢞ ꢝ ꢣ ꢟ ꢣ ꢜ ꢠ ꢍ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢃ ꢈꢉꢊꢋ  
ꢌꢍ ꢌꢉꢅ ꢎ ꢏ ꢆ ꢐꢑ ꢆꢎꢄ ꢏꢒ ꢀ ꢆꢓ ꢎꢁ ꢀꢑ ꢊꢔ ꢅ ꢊ ꢓ ꢎꢁꢕ ꢓꢊ ꢖꢔ ꢀꢆ ꢊꢓ  
ꢗꢔ ꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐꢒꢆ ꢋꢒ ꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
description/ordering information (continued)  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup  
or pulldown resistors with the bus-hold circuitry is not recommended.  
When V  
is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup resistor;  
CC  
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
FUNCTION TABLE  
INPUTS  
DATA I/Os  
OPERATION OR FUNCTION  
OE  
X
X
H
H
L
DIR  
X
CLKAB  
CLKBA  
SAB  
X
SBA  
X
A1−A8  
Input  
B1−B8  
X
Unspecified  
Store A, B unspecified  
X
X
X
X
Unspecified  
Input  
Input  
Store B, A unspecified  
X
H or L  
X
H or L  
X
X
X
Input  
Store A and B data  
Isolation, hold storage  
Real-time B data to A bus  
Stored B data to A bus  
Real-time A data to B bus  
Stored A data to B bus  
X
X
X
Input disabled  
Output  
Input disabled  
Input  
L
X
L
L
L
X
H or L  
X
X
H
Output  
Input  
L
H
H
X
L
X
Input  
Output  
L
H or L  
X
H
X
Input  
Output  
The data-output functions can be enabled or disabled by various signals at OE and DIR. Data-input functions always are enabled; i.e., data at  
the bus terminals is stored on every low-to-high transition of the clock inputs.  
2
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ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢃ ꢈꢉ ꢊꢋ  
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ꢗ ꢔꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐ ꢒꢆ ꢋ ꢒꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
21  
OE  
L
3
1
23  
2
22  
21  
3
1
23  
CLKAB CLKBA SAB  
L
2
22  
SBA  
X
DIR CLKAB CLKBA SAB  
SBA  
L
DIR  
H
OE  
L
L
X
X
X
X
X
REAL-TIME TRANSFER  
BUS B TO BUS A  
REAL-TIME TRANSFER  
BUS A TO BUS B  
21  
3
1
23  
2
22  
21  
OE  
L
3
DIR  
L
1
23  
2
22  
SBA  
H
DIR CLKAB CLKBA SAB  
SBA  
X
CLKAB CLKBA SAB  
OE  
X
X
X
X
X
X
X
X
X
X
H or L  
X
X
H
X
H
X
X
L
H
H or L  
X
STORAGE FROM  
A, B, OR A AND B  
TRANSFER STORED DATA  
TO A AND/OR B  
Figure 1. Bus-Management Functions  
3
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ꢗꢔ ꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐꢒꢆ ꢋꢒ ꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
logic diagram (positive logic)  
21  
OE  
3
DIR  
23  
CLKBA  
22  
SBA  
1
CLKAB  
2
SAB  
One of Eight Channels  
1D  
C1  
4
A1  
20  
B1  
1D  
C1  
To Seven Other Channels  
4
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ꢗ ꢔꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐ ꢒꢆ ꢋ ꢒꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Current into any output in the low state, I  
Current into any output in the high state, I (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
O
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Package thermal impedance, θ (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W  
JA  
stg  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. This current flows only when the output is in the high state and V > V  
.
CC  
O
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 4)  
MIN  
2.7  
2
MAX  
UNIT  
V
V
V
V
V
Supply voltage  
3.6  
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
V
IH  
0.8  
5.5  
−32  
64  
V
IL  
V
I
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Power-up ramp rate  
mA  
mA  
ns/V  
µs/V  
°C  
OH  
OL  
t/v  
t/V  
Outputs enabled  
10  
200  
−40  
CC  
T
A
Operating free-air temperature  
85  
NOTE 4: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
5
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ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢃ ꢈꢉꢊꢋ  
ꢌꢍ ꢌꢉꢅ ꢎ ꢏ ꢆ ꢐꢑ ꢆꢎꢄ ꢏꢒ ꢀ ꢆꢓ ꢎꢁ ꢀꢑ ꢊꢔ ꢅ ꢊ ꢓ ꢎꢁꢕ ꢓꢊ ꢖꢔ ꢀꢆ ꢊꢓ  
ꢗꢔ ꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐꢒꢆ ꢋꢒ ꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
V
V
V
V
V
= 2.7 V,  
I = −18 mA  
−1.2  
V
IK  
CC  
CC  
CC  
CC  
I
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
= −100 µA  
= −8 mA  
= −32 mA  
= 100 µA  
= 24 mA  
= 16 mA  
= 32 mA  
= 64 mA  
V
−0.2  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
2.4  
V
OH  
V
V
= 3 V,  
2
0.2  
0.5  
0.4  
0.5  
0.55  
1
V
= 2.7 V  
CC  
CC  
V
OL  
V
= 3 V  
V
V
= 3.6 V,  
V = V or GND  
I CC  
CC  
Control inputs  
= 0 or 3.6 V,  
V = 5.5 V  
I
10  
CC  
V = 5.5 V  
I
20  
I
I
µA  
V = V  
1
V
CC  
= 3.6 V  
A or B ports  
I
CC  
V = 0  
I
−5  
I
I
V
V
= 0,  
V or V = 0 to 4.5 V  
100  
µA  
µA  
off  
CC  
I
O
V = 0.8 V  
I
75  
= 3 V  
CC  
V = 2 V  
I
−75  
A or B ports  
I(hold)  
§
V
V
V
= 3.6 V ,  
V = 0 to 3.6 V  
500  
100  
CC  
CC  
CC  
I
= 0 to 1.5 V, V = 0.5 V to 3 V, OE = don’t care  
O
µA  
µA  
I
I
OZPU  
= 1.5 V to 0, V = 0.5 V to 3 V, OE = don’t care  
O
100  
0.19  
5
OZPD  
Outputs high  
Outputs low  
I
V
V
= 3.6 V, I = 0, V = V  
CC  
or GND  
mA  
CC  
CC  
O
I
Outputs disabled  
0.19  
0.2  
I  
= 3 V to 3.6 V, One input at V  
CC  
− 0.6 V, Other inputs at V  
or GND  
CC  
mA  
pF  
pF  
CC  
CC  
C
C
V = 3 V or 0  
4
9
i
I
V
O
= 3 V or 0  
io  
§
All typical values are at V  
CC  
= 3.3 V, T = 25°C.  
A
Unused terminals at V  
or GND  
CC  
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V or GND.  
CC  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 2)  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN MAX  
150  
MIN  
MAX  
f
t
Clock frequency  
150  
MHz  
ns  
clock  
Pulse duration, CLK high or low  
3.3  
1.2  
1.6  
0.8  
3.3  
1.5  
2.2  
0.8  
w
Data high  
Data low  
t
t
Setup time, A or B before CLKABor CLKBA↑  
Hold time, A or B after CLKABor CLKBA↑  
ns  
ns  
su  
h
6
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ꢗ ꢔꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐ ꢒꢆ ꢋ ꢒꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 2)  
V
= 3.3 V  
CC  
0.3 V  
V
= 2.7 V  
MAX  
CC  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN TYP  
MAX  
MIN  
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
150  
150  
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PZH  
PZL  
PHZ  
PLZ  
1.8  
1.8  
1.3  
1.3  
1.5  
1.5  
1.1  
1.1  
2.3  
2.3  
1.3  
1.3  
1.5  
1.5  
3.1  
3.1  
2.3  
2.4  
3
4.7  
4.7  
3.5  
3.5  
4.9  
4.9  
5.2  
5.2  
5.5  
5.5  
5.2  
5.2  
5.6  
5.6  
5.6  
5.6  
4.1  
4.1  
6
CLKBA or CLKAB  
A or B  
A or B  
B or A  
A or B  
A or B  
A or B  
A or B  
A or B  
ns  
ns  
ns  
ns  
ns  
ns  
SBA or SAB  
3.3  
3.1  
3.4  
3.9  
4
6
6.5  
6.5  
6.1  
5.9  
6.6  
6.6  
6.7  
6.3  
OE  
OE  
3.4  
3.6  
3.2  
3.8  
DIR  
DIR  
All typical values are at V  
CC  
= 3.3 V, T = 25°C.  
A
These parameters are measured with the internal output state of the storage register opposite that of the bus input.  
7
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ꢌꢍ ꢌꢉꢅ ꢎ ꢏ ꢆ ꢐꢑ ꢆꢎꢄ ꢏꢒ ꢀ ꢆꢓ ꢎꢁ ꢀꢑ ꢊꢔ ꢅ ꢊ ꢓ ꢎꢁꢕ ꢓꢊ ꢖꢔ ꢀꢆ ꢊꢓ  
ꢗꢔ ꢆ ꢇ ꢌ ꢉꢀꢆꢎꢆ ꢊ ꢐꢒꢆ ꢋꢒ ꢆꢀ  
SCBS775A − NOVEMBER 2003 − REVISED APRIL 2004  
PARAMETER MEASUREMENT INFORMATION  
6 V  
S1  
TEST  
/t  
S1  
Open  
GND  
500 Ω  
From Output  
Under Test  
t
Open  
6 V  
PLH PHL  
t
/t  
PLZ PZL  
C
= 50 pF  
L
t
/t  
GND  
500 Ω  
PHZ PZH  
(see Note A)  
2.7 V  
0 V  
LOAD CIRCUIT  
1.5 V  
Timing Input  
Data Input  
t
w
t
t
h
su  
2.7 V  
0 V  
2.7 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
0 V  
V
t
t
PLZ  
t
t
t
PZL  
PLH  
PHL  
Output  
Waveform 1  
S1 at 6 V  
3 V  
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
V
+ 0.3 V  
OL  
V
OL  
(see Note B)  
V
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
SN74LVTH646IPWREP  
V62/04680-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
PW  
24  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
PW  
24  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74LVTH646-EP :  
Catalog: SN74LVTH646  
Military: SN54LVTH646  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jul-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
SN74LVTH646IPWREP TSSOP  
PW  
24  
2000  
330.0  
16.4  
6.95  
8.3  
1.6  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jul-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 24  
SPQ  
Length (mm) Width (mm) Height (mm)  
346.0 346.0 33.0  
SN74LVTH646IPWREP  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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