SN74LVTH241PWG4 [TI]

3.3-V ABT Octal Buffers/Drivers With 3-State Outputs 20-TSSOP -40 to 85;
SN74LVTH241PWG4
型号: SN74LVTH241PWG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3.3-V ABT Octal Buffers/Drivers With 3-State Outputs 20-TSSOP -40 to 85

驱动 信息通信管理 光电二极管 输出元件 逻辑集成电路
文件: 总15页 (文件大小:621K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢌ ꢍꢌ ꢎꢅ ꢏꢐꢆ ꢑ ꢒꢆꢏꢄ ꢐꢓꢔ ꢔ ꢕꢖꢀ ꢗ ꢘꢖ ꢙ ꢅꢕ ꢖ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
SN54LVTH241 . . . J OR W PACKAGE  
SN74LVTH241 . . . DB, DW, NS, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
D
Support Mixed-Mode Signal Operation (5-V  
Input and Output Voltages With 3.3-V V  
)
CC  
Support Unregulated Battery Operation  
Down to 2.7 V  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
A
I
and Power-Up 3-State Support Hot  
off  
Insertion  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
13 2A2  
12 1Y4  
D
D
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
11  
2A1  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
SN54LVTH241 . . . FK PACKAGE  
(TOP VIEW)  
description/ordering information  
3
2 1 20 19  
18  
These octal buffers/drivers are designed  
1A2  
2Y3  
1A3  
2Y2  
1A4  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
4
5
6
7
8
specifically for low-voltage (3.3-V) V  
operation,  
17  
16  
15  
14  
CC  
with the capability to provide a TTL interface to a  
5-V system environment.  
The ’LVTH241 devices are organized as two 4-bit  
line drivers with separate output-enable (1OE,  
2OE) inputs. When 1OE is low or 2OE is high, the  
devices pass noninverted data from the A inputs  
to the Y outputs. When 1OE is high or 2OE is low,  
the outputs are in the high-impedance state.  
9 10 11 12 13  
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors  
with the bus-hold circuitry is not recommended.  
ORDERING INFORMATION  
ORDERABLE  
T
PACKAGE  
TOP-SIDE MARKING  
A
PART NUMBER  
SN74LVTH241DW  
SN74LVTH241DWR  
SN74LVTH241NSR  
SN74LVTH241DBR  
SN74LVTH241PW  
SN74LVTH241PWR  
SNJ54LVTH241J  
Tube  
SOIC − DW  
LVTH241  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
SOP − NS  
LVTH241  
LXH241  
−40°C to 85°C  
SSOP − DB  
TSSOP − PW  
LXH241  
Tape and reel  
Tube  
CDIP − J  
CFP − W  
LCCC − FK  
SNJ54LVTH241J  
SNJ54LVTH241W  
SNJ54LVTH241FK  
Tube  
SNJ54LVTH241W  
SNJ54LVTH241FK  
−55°C to 125°C  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
ꢓ ꢁ ꢄꢕꢀꢀ ꢑ ꢆꢇ ꢕꢖꢚ ꢙꢀ ꢕ ꢁ ꢑꢆꢕꢘ ꢜꢝ ꢞꢟ ꢠꢡꢢ ꢣꢤꢥ ꢦꢜ ꢢꢡ ꢦꢜꢧ ꢞꢦꢟ ꢛꢖ ꢑ ꢘ ꢓ ꢒꢆ ꢙꢑ ꢁ  
ꢪꢧ ꢩ ꢧ ꢤ ꢥ ꢜ ꢥ ꢩ ꢟ ꢍ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢃꢄꢅ  
ꢉꢊ  
ꢄꢅ  
ꢕꢖ  
ꢕꢖ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
description/ordering information (continued)  
When V  
is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
through a pullup resistor  
CC  
and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by  
the current-sinking/current-sourcing capability of the driver.  
These devices are fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
FUNCTION TABLES  
INPUTS  
OUTPUT  
1Y  
1OE  
1A  
H
L
L
H
L
L
H
X
Z
INPUTS  
OUTPUT  
2Y  
2OE  
H
2A  
H
H
L
H
L
L
X
Z
logic diagram (positive logic)  
1
19  
1OE  
2OE  
2A1  
2
18  
11  
13  
15  
17  
9
7
5
3
1Y1  
1Y2  
1Y3  
1Y4  
2Y1  
2Y2  
2Y3  
2Y4  
1A1  
4
16  
14  
12  
1A2  
2A2  
2A3  
2A4  
6
1A3  
8
1A4  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢌ ꢍꢌ ꢎꢅ ꢏꢐꢆ ꢑ ꢒꢆꢏꢄ ꢐꢓꢔ ꢔ ꢕꢖꢀꢗ ꢘ ꢖꢙ ꢅ ꢕꢖ  
ꢚ ꢙꢆ ꢇ ꢌ ꢎꢀꢆꢏꢆ ꢕ ꢑ ꢓꢆ ꢛꢓ ꢆ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Current into any output in the low state, I : SN54LVTH241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA  
O
SN74LVTH241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Current into any output in the high state, I (see Note 2): SN54LVTH241 . . . . . . . . . . . . . . . . . . . . . . . 48 mA  
O
SN74LVTH241 . . . . . . . . . . . . . . . . . . . . . . . 64 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Package thermal impedance, θ (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. This current flows only when the output is in the high state and V > V  
.
CC  
O
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 4)  
SN54LVTH241 SN74LVTH241  
UNIT  
MIN  
2.7  
2
MAX  
MIN  
2.7  
2
MAX  
V
V
V
V
Supply voltage  
3.6  
3.6  
V
V
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
IH  
0.8  
5.5  
−24  
48  
0.8  
5.5  
−32  
64  
V
IL  
V
I
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Power-up ramp rate  
mA  
mA  
ns/V  
µs/V  
°C  
OH  
OL  
t/v  
t/V  
Outputs enabled  
10  
10  
200  
−55  
200  
−40  
CC  
T
A
Operating free-air temperature  
125  
85  
NOTE 4: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
CC  
ꢠꢥ ꢟ ꢞ ꢰꢦ ꢪꢝ ꢧ ꢟ ꢥ ꢡꢨ ꢠꢥ ꢱ ꢥ ꢬꢡ ꢪꢤꢥ ꢦꢜꢍ ꢒ ꢝꢧ ꢩꢧ ꢢꢜ ꢥꢩ ꢞꢟ ꢜꢞ ꢢ ꢠꢧ ꢜꢧ ꢧꢦ ꢠ ꢡꢜ ꢝꢥꢩ  
ꢢ ꢝꢧ ꢦ ꢰꢥ ꢡꢩ ꢠꢞ ꢟ ꢢ ꢡꢦ ꢜꢞ ꢦꢣꢥ ꢜ ꢝꢥ ꢟ ꢥ ꢪꢩ ꢡꢠ ꢣꢢꢜ ꢟ ꢮ ꢞꢜꢝ ꢡꢣꢜ ꢦꢡꢜ ꢞꢢꢥ ꢍ  
ꢥꢟ  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢃꢄꢅ  
ꢆꢏ  
ꢕꢖ  
ꢀꢗ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54LVTH241  
SN74LVTH241  
PARAMETER  
TEST CONDITIONS  
I = −18 mA  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
V
V
V
V
= 2.7 V,  
−1.2  
−1.2  
V
IK  
CC  
CC  
CC  
I
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
I
I
= −100 µA  
= −8 mA  
= −24 mA  
= −32 mA  
= 100 µA  
= 24 mA  
= 16 mA  
= 32 mA  
= 48 mA  
= 64 mA  
V
−0.2  
CC  
2.4  
V
−0.2  
CC  
2.4  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
OL  
V
V
OH  
2
V
= 3 V  
CC  
CC  
2
0.2  
0.5  
0.2  
0.5  
0.4  
0.5  
V
= 2.7 V  
0.4  
V
OL  
0.5  
V
CC  
= 3 V  
0.55  
0.55  
10  
1
V
V
= 0 or 3.6 V,  
= 3.6 V,  
V = 5.5 V  
10  
1
CC  
I
Control inputs  
V = V  
or GND  
CC  
I
CC  
I
I
I
µA  
µA  
µA  
I
V = V  
1
1
I
CC  
Data inputs  
V
V
= 3.6 V  
= 0,  
CC  
V = 0  
I
−5  
−5  
100  
V or V = 0 to 4.5 V  
I
off  
CC  
O
V = 0.8 V  
I
75  
75  
V
CC  
V
CC  
= 3 V  
V = 2 V  
I
−75  
−75  
Data inputs  
I(hold)  
500  
−750  
= 3.6 V ,  
V = 0 to 3.6 V  
I
I
I
V
V
V
= 3.6 V,  
= 3.6 V,  
V
V
= 3 V  
5
5
µA  
µA  
OZH  
CC  
CC  
CC  
O
= 0.5 V  
−5  
−5  
OZL  
O
= 0 to 1.5 V, V = 0.5 V to 3 V,  
O
100  
100  
100  
100  
µA  
µA  
I
OZPU  
OZPD  
OE/OE = don’t care  
V
= 1.5 V to 0, V = 0.5 V to 3 V,  
CC  
OE/OE = don’t care  
O
I
Outputs high  
Outputs low  
0.19  
5
0.19  
5
V
I
= 3.6 V,  
CC  
= 0,  
I
mA  
mA  
O
CC  
V = V  
I
or GND  
CC  
Outputs disabled  
0.19  
0.19  
V
= 3 V to 3.6 V, One input at V − 0.6 V,  
CC  
CC  
Other inputs at V  
§
0.2  
0.2  
I  
CC  
or GND  
CC  
C
C
V = 3 V or 0  
3
7
3
7
pF  
pF  
i
I
V
O
= 3 V or 0  
o
§
On products compliant to MIL-PRF-38535, this parameter is not production tested.  
All typical values are at V = 3.3 V, T = 25°C.  
CC  
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V or GND.  
A
CC  
ꢠ ꢥ ꢟ ꢞ ꢰ ꢦ ꢪꢝ ꢧ ꢟ ꢥ ꢡꢨ ꢠꢥ ꢱ ꢥ ꢬ ꢡꢪ ꢤꢥ ꢦ ꢜꢍ ꢒ ꢝꢧ ꢩꢧ ꢢꢜ ꢥꢩ ꢞꢟ ꢜꢞ ꢢ ꢠꢧ ꢜꢧ ꢧꢦ ꢠ ꢡꢜ ꢝꢥꢩ  
ꢢ ꢝ ꢧ ꢦ ꢰꢥ ꢡꢩ ꢠꢞ ꢟ ꢢ ꢡꢦ ꢜꢞ ꢦꢣ ꢥ ꢜ ꢝꢥ ꢟ ꢥ ꢪꢩ ꢡ ꢠꢣꢢ ꢜꢟ ꢮ ꢞꢜꢝ ꢡꢣꢜ ꢦꢡꢜ ꢞꢢꢥ ꢍ  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢌ ꢍꢌ ꢎꢅ ꢏꢐꢆ ꢑ ꢒꢆꢏꢄ ꢐꢓꢔ ꢔ ꢕꢖꢀꢗ ꢘ ꢖꢙ ꢅ ꢕꢖ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature range, C = 50 pF (unless otherwise noted) (see Figure 1)  
L
SN54LVTH241  
SN74LVTH241  
= 3.3 V  
V
= 3.3 V  
V
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
0.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
V
= 2.7 V  
PARAMETER  
UNIT  
CC  
MIN  
MAX  
3.7  
3.5  
4.6  
4.6  
4.7  
5
MIN  
MAX  
4
MIN TYP  
MAX  
3.5  
3.4  
4.5  
4.4  
4.5  
4.7  
MIN  
MAX  
3.9  
3.6  
5.4  
5
t
t
t
t
t
t
1
1.2  
1
1.1  
1.3  
1.1  
1.4  
1.6  
1.8  
2.3  
2.2  
2.7  
2.9  
2.8  
3
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
ns  
ns  
ns  
3.7  
5.5  
5.1  
5.5  
5.5  
OE or OE  
OE or OE  
1.3  
1.5  
1.7  
5.3  
5.2  
All typical values are at V  
CC  
= 3.3 V, T = 25°C.  
A
ꢠꢥ ꢟ ꢞ ꢰꢦ ꢪꢝ ꢧ ꢟ ꢥ ꢡꢨ ꢠꢥ ꢱ ꢥ ꢬꢡ ꢪꢤꢥ ꢦꢜꢍ ꢒ ꢝꢧ ꢩꢧ ꢢꢜ ꢥꢩ ꢞꢟ ꢜꢞ ꢢ ꢠꢧ ꢜꢧ ꢧꢦ ꢠ ꢡꢜ ꢝꢥꢩ  
ꢢ ꢝꢧ ꢦ ꢰꢥ ꢡꢩ ꢠꢞ ꢟ ꢢ ꢡꢦ ꢜꢞ ꢦꢣꢥ ꢜ ꢝꢥ ꢟ ꢥ ꢪꢩ ꢡꢠ ꢣꢢꢜ ꢟ ꢮ ꢞꢜꢝ ꢡꢣꢜ ꢦꢡꢜ ꢞꢢꢥ ꢍ  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢃꢄꢅ  
ꢄꢅ  
ꢈꢃ  
ꢐꢆ  
ꢆꢏ  
ꢕꢖ  
ꢀꢗ  
ꢕꢖ  
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003  
PARAMETER MEASUREMENT INFORMATION  
6 V  
TEST  
/t  
S1  
S1  
Open  
GND  
500 Ω  
From Output  
Under Test  
t
Open  
6 V  
PLH PHL  
t
/t  
PLZ PZL  
C
= 50 pF  
L
t
/t  
GND  
500 Ω  
PHZ PZH  
(see Note A)  
2.7 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
2.7 V  
0 V  
2.7 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
PLZ  
PZL  
t
t
t
PHL  
PLH  
Output  
Waveform 1  
S1 at 6 V  
3 V  
V
V
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
t
Output  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
t
PZH  
PHZ  
PHL  
PLH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
SN74LVTH241DBR  
SN74LVTH241DW  
SN74LVTH241DWR  
SN74LVTH241DWRG4  
SN74LVTH241PW  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SSOP  
SOIC  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
LXH241  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DW  
DW  
DW  
PW  
PW  
PW  
PW  
25  
2000  
2000  
70  
Green (RoHS  
& no Sb/Br)  
LVTH241  
LVTH241  
LVTH241  
LXH241  
LXH241  
LXH241  
LXH241  
SOIC  
Green (RoHS  
& no Sb/Br)  
SOIC  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
SN74LVTH241PWE4  
SN74LVTH241PWG4  
SN74LVTH241PWR  
70  
Green (RoHS  
& no Sb/Br)  
70  
Green (RoHS  
& no Sb/Br)  
2000  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74LVTH241 :  
Enhanced Product: SN74LVTH241-EP  
NOTE: Qualified Version Definitions:  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LVTH241DBR  
SN74LVTH241DWR  
SN74LVTH241PWR  
SSOP  
SOIC  
DB  
DW  
PW  
20  
20  
20  
2000  
2000  
2000  
330.0  
330.0  
330.0  
16.4  
24.4  
16.4  
8.2  
7.5  
13.0  
7.1  
2.5  
2.7  
1.6  
12.0  
12.0  
8.0  
16.0  
24.0  
16.0  
Q1  
Q1  
Q1  
10.8  
6.95  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVTH241DBR  
SN74LVTH241DWR  
SN74LVTH241PWR  
SSOP  
SOIC  
DB  
DW  
PW  
20  
20  
20  
2000  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
45.0  
38.0  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
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