SN74LVTH125IPWREP [TI]
3.3-V ABT QUADRUPLE BUS BUFFER WITH 3-STATE OUTPUTS;
| 型号： | SN74LVTH125IPWREP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V ABT QUADRUPLE BUS BUFFER WITH 3-STATE OUTPUTS 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总9页 (文件大小：431K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊꢋ ꢌꢍ
ꢎ ꢏꢎ ꢋꢅ ꢐꢑꢆ ꢒ ꢓꢐꢔꢕ ꢓꢍꢄ ꢌ ꢑꢓꢀ ꢑ ꢓꢖ ꢖꢌ ꢕ
ꢗ ꢘꢆ ꢇ ꢎ ꢋꢀꢆꢐꢆ ꢌ ꢙ ꢓꢆ ꢍ ꢓꢆꢀ
SCBS765 − NOVEMBER 2003
D
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D
D
I
and Power-Up 3-State Support Hot
off
Insertion
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Enhanced Diminishing Manufacturing
Sources (DMS) Support
D
D
D
Enhanced Product-Change Notification
D
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
†
Qualification Pedigree
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V V
)
CC
D
D
Supports Unregulated Battery Operation
Down to 2.7 V
PW PACKAGE
(TOP VIEW)
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
1
2
3
4
5
6
7
14
13
12
11
10
9
= 3.3 V, T = 25°C
1OE
1A
1Y
2OE
2A
2Y
V
CC
4OE
CC
A
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
4A
4Y
3OE
3A
3Y
8
GND
description/ordering information
This bus buffer is designed specifically for low-voltage (3.3-V) V
a TTL interface to a 5-V system environment.
operation, but with the capability to provide
CC
The SN74LVTH125 features independent line drivers with 3-state outputs. Each output is in the high-impedance
state when the associated output-enable (OE) input is high.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
When V
is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
CC
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V
the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup resistor;
CC
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry
off
off
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
T
A
PACKAGE
−40°C to 85°C
TSSOP − PW Tape and reel
SN74LVTH125IPWREP
LH125EP
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢍ
ꢍ
ꢕ
ꢙ
ꢪ
ꢔ
ꢥ
ꢓ
ꢚ
ꢣ
ꢆ
ꢤ
ꢘ
ꢞ
ꢙ
ꢜ
ꢁ
ꢝ
ꢔ
ꢐ
ꢆ
ꢐ
ꢛ
ꢜ
ꢦ
ꢝ
ꢞ
ꢤ
ꢟ
ꢠ
ꢡ
ꢡ
ꢢ
ꢢ
ꢛ
ꢛ
ꢞ
ꢞ
ꢜ
ꢜ
ꢛ
ꢣ
ꢣ
ꢧ
ꢤ
ꢥ
ꢟ
ꢟ
ꢦ
ꢦ
ꢜ
ꢢ
ꢡ
ꢠ
ꢣ
ꢣ
ꢞ
ꢝ
ꢧ
ꢆꢦ
ꢥ
ꢨ
ꢣ
ꢩ
ꢛ
ꢤ
ꢡ
ꢣ
ꢢ
ꢛ
ꢢ
ꢞ
ꢟ
ꢜ
ꢥ
ꢪ
ꢡ
ꢜ
ꢢ
ꢢ
ꢦ
ꢣ
ꢏ
Copyright 2003, Texas Instruments Incorporated
ꢟ
ꢞ
ꢤ
ꢢ
ꢞ
ꢟ
ꢠ
ꢢ
ꢞ
ꢣ
ꢧ
ꢛ
ꢝ
ꢛ
ꢤ
ꢦ
ꢟ
ꢢ
ꢫ
ꢢ
ꢦ
ꢟ
ꢞ
ꢝ
ꢬ
ꢡ
ꢘ
ꢜ
ꢠ
ꢦ
ꢣ
ꢢ
ꢡ
ꢜ
ꢪ
ꢡ
ꢟ
ꢪ
ꢭ
ꢡ
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢯ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢏ
ꢟ
ꢟ
ꢡ
ꢜ
ꢢ
ꢮ
ꢏ
ꢍ
ꢟ
ꢞ
ꢪ
ꢥ
ꢤ
ꢢ
ꢛ
ꢞ
ꢜ
ꢧ
ꢟ
ꢞ
ꢤ
ꢦ
ꢣ
ꢣ
ꢛ
ꢜ
ꢯ
ꢪ
ꢞ
ꢦ
ꢣ
ꢜ
ꢞ
ꢢ
ꢜ
ꢦ
ꢤ
ꢦ
ꢣ
ꢣ
ꢡ
ꢟ
ꢛ
ꢩ
ꢮ
ꢛ
ꢜ
ꢤ
ꢩ
ꢥ
ꢪ
ꢦ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢋꢌꢍ
ꢎꢏ ꢎꢋꢅ ꢐ ꢑꢆ ꢒꢓ ꢐ ꢔꢕ ꢓꢍ ꢄꢌ ꢑꢓ ꢀ ꢑꢓ ꢖꢖ ꢌꢕ
ꢗꢘ ꢆ ꢇ ꢎ ꢋꢀꢆꢐꢆ ꢌ ꢙꢓꢆ ꢍ ꢓꢆꢀ
SCBS765 − NOVEMBER 2003
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
H
L
H
X
Z
logic diagram (positive logic)
1
10
1OE
3OE
3A
2
3
9
8
1A
1Y
2Y
3Y
4Y
4
13
12
2OE
4OE
4A
5
6
11
2A
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊꢋ ꢌꢍ
ꢎ ꢏꢎ ꢋꢅ ꢐꢑꢆ ꢒ ꢓꢐꢔꢕ ꢓꢍꢄ ꢌ ꢑꢓꢀ ꢑ ꢓꢖ ꢖꢌ ꢕ
ꢗ ꢘꢆ ꢇ ꢎ ꢋꢀꢆꢐꢆ ꢌ ꢙ ꢓꢆ ꢍ ꢓꢆꢀ
SCBS765 − NOVEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Voltage range applied to any output in the high-impedance
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
O
CC
Current into any output in the low state, I
Current into any output in the high state, I (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
O
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK
OK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
O
Package thermal impedance, θ (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
JA
stg
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and V > V
.
CC
O
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4)
MIN
2.7
2
MAX
UNIT
V
V
V
V
V
Supply voltage
3.6
CC
High-level input voltage
Low-level input voltage
Input voltage
V
IH
0.8
5.5
−32
64
V
IL
V
I
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Power-up ramp rate
mA
mA
ns/V
µs/V
°C
OH
OL
∆t/∆v
∆t/∆V
Outputs enabled
10
200
−40
CC
T
A
Operating free-air temperature
85
NOTE 4: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢋꢌꢍ
ꢎꢏ ꢎꢋꢅ ꢐ ꢑꢆ ꢒꢓ ꢐ ꢔꢕ ꢓꢍ ꢄꢌ ꢑꢓ ꢀ ꢑꢓ ꢖꢖ ꢌꢕ
ꢗꢘ ꢆ ꢇ ꢎ ꢋꢀꢆꢐꢆ ꢌ ꢙꢓꢆ ꢍ ꢓꢆꢀ
SCBS765 − NOVEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
TYP
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
V
V
V
V
= 2.7 V,
I = −18 mA
−1.2
V
IK
CC
CC
CC
CC
I
= 2.7 V to 3.6 V,
= 2.7 V,
I
I
I
I
I
I
I
I
= −100 µA
= −8 mA
= −32 mA
= 100 µA
= 24 mA
= 16 mA
= 32 mA
= 64 mA
V
−0.2
OH
OH
OH
OL
OL
OL
OL
OL
CC
2.4
2
V
OH
V
V
= 3 V,
0.2
0.5
0.4
0.5
0.55
10
V
= 2.7 V
CC
CC
V
OL
V
= 3 V
V
V
= 0 or 3.6 V,
= 3.6 V,
V = 5.5 V
I
CC
Control
inputs
V = V
or GND
1
CC
I
CC
I
I
µA
V = V
1
−5
I
CC
Data inputs
V
V
= 3.6 V
= 0,
CC
V = 0
I
I
I
V or V = 0 to 4.5 V
I
100
µA
µA
off
CC
O
V = 0.8 V
I
75
V
CC
= 3 V
V = 2 V
I
−75
Data inputs
I(hold)
‡
V
CC
V
CC
V
CC
V
CC
= 3.6 V ,
V = 0 to 3.6 V
500
5
I
I
I
I
= 3.6 V,
= 3.6 V,
V
= 3 V
µA
µA
µA
OZH
O
O
V
= 0.5 V
−5
50
OZL
= 0 to 1.5 V, V = 0.5 V to 3 V, OE = don’t care
O
OZPU
V
= 1.5 V to 0, V = 0.5 V to 3 V, OE = don’t care
O
50
0.19
7
µA
I
CC
OZPD
Outputs high
Outputs low
0.12
4.5
I
V
= 3.6 V, I = 0, V = V
CC
or GND
mA
CC
§
CC
CC
O
I
Outputs disabled
0.12
0.19
0.2
V
= 3 V to 3.6 V, One input at V
CC
− 0.6 V, Other inputs at V
or GND
mA
pF
pF
∆I
CC
CC
C
C
V = 3 V or 0
I
4
i
V
O
= 3 V or 0
6.5
o
†
‡
§
All typical values are at V
= 3.3 V, T = 25°C.
A
CC
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
or GND.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
V
= 3.3 V
CC
0.3 V
V
= 2.7 V
CC
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
†
MIN TYP
MAX
3.5
3.9
4
MIN
MAX
4.5
4.9
5.5
5.4
5.7
4
t
t
t
t
t
t
1
2
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
ns
ns
ns
1
1
2.1
2
OE
OE
1.1
1.5
1.3
2.1
2.3
2.8
4
4.5
4.5
†
4
All typical values are at V
CC
= 3.3 V, T = 25°C.
A
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊꢋ ꢌꢍ
ꢎ ꢏꢎ ꢋꢅ ꢐꢑꢆ ꢒ ꢓꢐꢔꢕ ꢓꢍꢄ ꢌ ꢑꢓꢀ ꢑ ꢓꢖ ꢖꢌ ꢕ
ꢗ ꢘꢆ ꢇ ꢎ ꢋꢀꢆꢐꢆ ꢌ ꢙ ꢓꢆ ꢍ ꢓꢆꢀ
SCBS765 − NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6 V
TEST
S1
Open
GND
S1
500 Ω
From Output
Under Test
t
/t
Open
6 V
PLH PHL
/t
t
PLZ PZL
/t
C
= 50 pF
L
t
GND
PHZ PZH
500 Ω
(see Note A)
2.7 V
0 V
LOAD CIRCUIT
Timing Input
Data Input
1.5 V
t
w
t
t
h
su
2.7 V
2.7 V
0 V
1.5 V
1.5 V
Input
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
0 V
2.7 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
0 V
V
t
t
PLZ
PZL
t
t
t
PHL
PLH
Output
Waveform 1
S1 at 6 V
3 V
OH
1.5 V
1.5 V
1.5 V
t
1.5 V
Output
V
V
+ 0.3 V
OL
V
OL
(see Note B)
V
OL
t
t
PZH
PHZ
PHL
PLH
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
− 0.3 V
OH
1.5 V
1.5 V
Output
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74LVTH125IPWREP
V62/04671-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
PW
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH125-EP :
Catalog: SN74LVTH125
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LVTH125IPWREP TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
SN74LVTH125IPWREP
2000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明