SN74LVC1G02DBV [TI]

SINGLE 2-INPUT POSITIVE-NOR GATE; 单路2输入正或非门
SN74LVC1G02DBV
型号: SN74LVC1G02DBV
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE 2-INPUT POSITIVE-NOR GATE
单路2输入正或非门

栅极 逻辑集成电路 光电二极管 输入元件
文件: 总16页 (文件大小:479K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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ꢋ ꢁꢈ ꢄ ꢌ ꢊ ꢍꢋꢁ ꢎꢏꢐ ꢎꢑ ꢀꢋ ꢐ ꢋꢅꢌ ꢍꢁ ꢑꢒ ꢈ ꢓꢐꢌ  
SCES213Q − APRIL 1999 − REVISED MAY 2005  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
D
D
D
D
Supports 5-V V  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
Inputs Accept Voltages to 5.5 V  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
Max t of 3.6 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
− 1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YEA, YEP, YZA,  
OR YZP PACKAGE  
(BOTTOM VIEW)  
DRL PACKAGE  
(TOP VIEW)  
1
2
3
5
A
B
V
Y
1
2
3
5
A
B
V
Y
CC  
CC  
3
2
1
4
Y
GND  
B
1
2
3
5
4
A
B
V
Y
CC  
5
4
GND  
V
A
CC  
4
GND  
GND  
See mechanical drawings for dimensions.  
description/ordering information  
This single 2-input positive-NOR gate is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G02 performs the Boolean function Y = A + B or Y = A B in positive logic.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G02YEAR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
SN74LVC1G02YZAR  
SN74LVC1G02YEPR  
SN74LVC1G02YZPR  
Reel of 3000  
_ _ _CB_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 4000  
SN74LVC1G02DBVR  
SN74LVC1G02DBVT  
SN74LVC1G02DCKR  
SN74LVC1G02DCKT  
SN74LVC1G02DRLR  
SOT (SOT-23) − DBV  
C02_  
SOT (SC-70) − DCK  
CB_  
CB_  
SOT (SOT-553) − DRL  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢐꢠ  
Copyright 2005, Texas Instruments Incorporated  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
1
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SCES213Q − APRIL 1999 − REVISED MAY 2005  
description/ordering information (continued)  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
A
B
X
H
L
H
X
L
L
L
H
logic diagram (positive logic)  
1
2
4
A
B
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
I
Voltage range applied to any output in the high-impedance or power-off state, V  
O
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V  
Voltage range applied to any output in the high or low state, V  
O
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
Continuous output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
IK  
I
Output clamp current, I  
OK  
O
O
Continuous current through V  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
CC  
Package thermal impedance, θ (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W  
JA  
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W  
DRL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142°C/W  
YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 154°C/W  
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The value of V is provided in the recommended operating conditions table.  
CC  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
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SCES213Q − APRIL 1999 − REVISED MAY 2005  
recommended operating conditions (see Note 4)  
MIN  
1.65  
MAX  
UNIT  
Operating  
Data retention only  
5.5  
V
Supply voltage  
V
CC  
IH  
1.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.65 × V  
1.7  
CC  
V
High-level input voltage  
V
V
2
= 4.5 V to 5.5 V  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
0.7 × V  
CC  
0.35 × V  
0.7  
CC  
V
IL  
Low-level input voltage  
0.8  
= 4.5 V to 5.5 V  
0.3 × V  
5.5  
CC  
V
V
Input voltage  
0
0
V
V
I
Output voltage  
V
CC  
−4  
O
V
V
= 1.65 V  
= 2.3 V  
CC  
−8  
CC  
−16  
−24  
−32  
4
I
High-level output current  
Low-level output current  
mA  
mA  
OH  
OL  
V
= 3 V  
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
= 1.65 V  
= 2.3 V  
8
16  
24  
32  
20  
10  
5
I
V
CC  
= 3 V  
V
CC  
V
CC  
V
CC  
V
CC  
= 4.5 V  
= 1.8 V 0.15 V, 2.5 V 0.2 V  
= 3.3 V 0.3 V  
t/v Input transition rise or fall rate  
ns/V  
= 5 V 0.5 V  
T
A
Operating free-air temperature  
−40  
85  
°C  
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
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SCES213Q − APRIL 1999 − REVISED MAY 2005  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
TYP  
PARAMETER  
TEST CONDITIONS  
V
MIN  
V −0.1  
CC  
MAX  
UNIT  
CC  
I
I
I
I
I
= −100 mA  
= −4 mA  
1.65 V to 5.5 V  
1.65 V  
OH  
OH  
OH  
OH  
OH  
1.2  
1.9  
2.4  
2.3  
= −8 mA  
2.3 V  
V
OH  
V
= −16 mA  
= −24 mA  
3 V  
4.5 V  
1.65 V to 5.5 V  
1.65 V  
3.8  
I
I
I
I
I
I
= −32 mA  
= 100 mA  
= 4 mA  
OH  
OL  
OL  
OL  
OL  
OL  
0.1  
0.45  
0.3  
= 8 mA  
2.3 V  
V
OL  
V
= 16 mA  
= 24 mA  
0.4  
3 V  
0.55  
4.5 V  
0 to 5.5 V  
0
0.55  
5
I
= 32 mA  
OL  
I
I
I
A or B inputs V = 5.5 V or GND  
mA  
mA  
mA  
mA  
pF  
I
I
V or V = 5.5 V  
10  
off  
I
O
V = 5.5 V or GND,  
I = 0  
O
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
10  
CC  
I
I  
CC  
One input at V  
CC  
− 0.6 V,  
Other inputs at V  
CC  
or GND  
500  
C
V = V  
or GND  
= 3.3 V, T = 25°C.  
4
i
I
CC  
All typical values are at V  
CC  
A
switching characteristics over recommended operating free-air temperature range, C = 15 pF  
L
(unless otherwise noted) (see Figure 1)  
V
= 1.8 V  
V
= 2.5 V  
0.2 V  
V
= 3.3 V  
0.3 V  
V
= 5 V  
CC  
0.15 V  
CC  
CC  
CC  
0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN MAX  
1.9 7.2  
MIN MAX  
0.8 4.4  
MIN MAX  
0.8 3.6  
MIN MAX  
0.8 3.4  
t
pd  
A or B  
ns  
Y
switching characteristics over recommended operating free-air temperature range, C = 30 pF or  
L
50 pF (unless otherwise noted) (see Figure 2)  
V
= 1.8 V  
V
= 2.5 V  
0.2 V  
V
= 3.3 V  
0.3 V  
V
= 5 V  
CC  
0.15 V  
CC  
CC  
CC  
0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN MAX  
MIN MAX  
MIN MAX  
MIN MAX  
t
pd  
A or B  
2.8  
8
1.2  
5.5  
1
4.5  
1
4
ns  
Y
operating characteristics, T = 25°C  
A
V
CC  
= 1.8 V  
V
CC  
= 2.5 V  
V
CC  
= 3.3 V  
V
= 5 V  
CC  
PARAMETER  
TEST CONDITIONS  
UNIT  
TYP  
23  
TYP  
23  
TYP  
TYP  
25  
C
Power dissipation capacitance  
f = 10 MHz  
23  
pF  
pd  
4
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SCES213Q − APRIL 1999 − REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
Open  
S1  
R
L
From Output  
Under Test  
TEST  
S1  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
L
t
V
R
PLZ PZL  
LOAD  
GND  
L
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
C
R
L
V
LOAD  
L
V
I
t /t  
r f  
1.8 V 0.15 V  
2.5 V 0.2 V  
3.3 V 0.3 V  
5 V 0.5 V  
V
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
2 × V  
CC  
15 pF  
15 pF  
15 pF  
15 pF  
1 MΩ  
1 MΩ  
1 MΩ  
1 MΩ  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
CC  
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
su  
h
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
V
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
+ V  
PLH  
PHL  
Output  
Waveform 1  
V
/2  
OH  
LOAD  
V
V
V
M
Output  
M
V
V
M
S1 at V  
(see Note B)  
V
LOAD  
OL  
V
OL  
V
OL  
t
PLH  
t
t
PZH  
PHZ  
− V  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
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SCES213Q − APRIL 1999 − REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
Open  
S1  
R
L
From Output  
Under Test  
TEST  
S1  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
L
t
V
R
PLZ PZL  
LOAD  
GND  
L
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
C
R
L
V
LOAD  
L
V
I
t /t  
r f  
1.8 V 0.15 V  
2.5 V 0.2 V  
3.3 V 0.3 V  
5 V 0.5 V  
V
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
2 × V  
CC  
30 pF  
30 pF  
50 pF  
50 pF  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
CC  
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
V
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
+ V  
PLH  
PHL  
Output  
Waveform 1  
V
/2  
OH  
LOAD  
V
V
V
M
Output  
M
V
V
M
S1 at V  
(see Note B)  
V
LOAD  
OL  
V
OL  
V
OL  
t
PLH  
t
t
PZH  
PHZ  
− V  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
SN74LVC1G02DBVR  
SN74LVC1G02DBVRG4  
SN74LVC1G02DBVT  
SN74LVC1G02DCKR  
SN74LVC1G02DCKRG4  
SN74LVC1G02DCKT  
SN74LVC1G02DCKTE4  
SN74LVC1G02DRLR  
SN74LVC1G02DRLRG4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SC70  
SC70  
SC70  
SC70  
SOP  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DRL  
DRL  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOP  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVC1G02YEAR  
SN74LVC1G02YEPR  
SN74LVC1G02YZAR  
ACTIVE  
ACTIVE  
ACTIVE  
WCSP  
WCSP  
WCSP  
YEA  
YEP  
YZA  
5
5
5
3000  
3000  
3000  
TBD  
TBD  
SNPB  
SNPB  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Pb-Free  
(RoHS)  
SNAGCU  
SN74LVC1G02YZPR  
ACTIVE  
WCSP  
YZP  
5
3000  
Pb-Free  
(RoHS)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Oct-2005  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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