SN74LS10DRE4 [TI]

Triple 3-input positive-NAND gates 14-SOIC 0 to 70;
SN74LS10DRE4
型号: SN74LS10DRE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Triple 3-input positive-NAND gates 14-SOIC 0 to 70

栅 光电二极管 逻辑集成电路 触发器
文件: 总19页 (文件大小:951K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN5410, SN54LS10, SN54S10,  
SN7410, SN74LS10, SN74S10  
TRIPLE 3-INPUT POSITIVE-NAND GATES  
SDLS035A – DECEMBER 1983 – REVISED APRIL 2003  
Copyright © 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5410, SN54LS10, SN54S10,  
SN7410, SN74LS10, SN74S10  
TRIPLE 3-INPUT POSITIVE-NAND GATES  
SDLS035A – DECEMBER 1983 – REVISED APRIL 2003  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5410, SN7410,  
TRIPLE 3-INPUT POSITIVE-NAND GATES  
SDLS035 – DECEMBER 1983 – REVISED MARCH 1988  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54LS10, SN74LS10,  
TRIPLE 3-INPUT POSITIVE-NAND GATES  
SDLS035 – DECEMBER 1983 – REVISED MARCH 1988  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54S10, SN74S10,  
TRIPLE 3-INPUT POSITIVE-NAND GATES  
SDLS035 – DECEMBER 1983 – REVISED MARCH 1988  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
JM38510/00103BCA  
JM38510/00103BDA  
JM38510/07005BCA  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CFP  
J
W
J
14  
14  
14  
TBD  
TBD  
TBD  
Call TI  
Call TI  
A42  
Call TI  
Call TI  
-55 to 125  
-55 to 125  
-55 to 125  
CDIP  
1
1
N / A for Pkg Type  
JM38510/  
07005BCA  
JM38510/07005BDA  
JM38510/30005B2A  
JM38510/30005BCA  
JM38510/30005BDA  
JM38510/30005SCA  
JM38510/30005SDA  
M38510/07005BCA  
M38510/07005BDA  
M38510/30005B2A  
M38510/30005BCA  
M38510/30005BDA  
M38510/30005SCA  
M38510/30005SDA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CFP  
LCCC  
CDIP  
CFP  
W
FK  
J
14  
20  
14  
14  
14  
14  
14  
14  
20  
14  
14  
14  
14  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
POST-PLATE  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
JM38510/  
07005BDA  
1
JM38510/  
30005B2A  
1
JM38510/  
30005BCA  
W
J
1
A42  
JM38510/  
30005BDA  
CDIP  
CFP  
25  
25  
1
A42  
JM38510/  
30005SCA  
W
J
A42  
JM38510/  
30005SDA  
CDIP  
CFP  
A42  
JM38510/  
07005BCA  
W
FK  
J
1
A42  
JM38510/  
07005BDA  
LCCC  
CDIP  
CFP  
1
POST-PLATE  
A42  
JM38510/  
30005B2A  
1
JM38510/  
30005BCA  
W
J
1
A42  
JM38510/  
30005BDA  
CDIP  
CFP  
25  
25  
A42  
JM38510/  
30005SCA  
W
A42  
JM38510/  
30005SDA  
SN5410J  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
TBD  
TBD  
Call TI  
A42  
Call TI  
-55 to 125  
-55 to 125  
SN54LS10J  
1
N / A for Pkg Type  
SN54LS10J  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN54S10J  
SN7410N  
ACTIVE  
CDIP  
PDIP  
J
14  
14  
1
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
0 to 70  
SN54S10J  
NRND  
N
25  
50  
Pb-Free  
(RoHS)  
CU NIPDAU  
SN7410N  
LS10  
SN7410N3  
SN7410NE4  
SN74LS10D  
OBSOLETE  
NRND  
PDIP  
PDIP  
SOIC  
N
N
D
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
SN74LS10DE4  
SN74LS10DG4  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
TBD  
Call TI  
Call TI  
0 to 70  
0 to 70  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
LS10  
SN74LS10DR  
SN74LS10DRE4  
SN74LS10DRG4  
SN74LS10N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
PDIP  
D
D
D
N
14  
14  
14  
14  
2500  
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
LS10  
Green (RoHS  
& no Sb/Br)  
LS10  
Green (RoHS  
& no Sb/Br)  
LS10  
Pb-Free  
(RoHS)  
SN74LS10N  
SN74LS10N3  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
SN74LS10NE4  
SN74LS10NSR  
ACTIVE  
SO  
NS  
14  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
0 to 70  
74LS10  
SN74LS10NSRE4  
SN74LS10NSRG4  
SN74S10N  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
N
14  
14  
14  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
TBD  
PDIP  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74S10N  
SN74S10N3  
SNJ5410J  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
CDIP  
CFP  
N
J
14  
14  
14  
14  
20  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
SNJ5410W  
W
Call TI  
Call TI  
SNJ5410WA  
SNJ54LS10FK  
CFP  
WA  
FK  
Call TI  
Call TI  
LCCC  
1
POST-PLATE  
N / A for Pkg Type  
SNJ54LS  
10FK  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SNJ54LS10J  
SNJ54LS10W  
SNJ54S10FK  
ACTIVE  
CDIP  
CFP  
J
14  
14  
20  
1
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
-55 to 125  
SNJ54LS10J  
ACTIVE  
ACTIVE  
W
1
1
SNJ54LS10W  
LCCC  
FK  
POST-PLATE  
SNJ54S  
10FK  
SNJ54S10J  
SNJ54S10W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
SNJ54S10J  
W
SNJ54S10W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN5410, SN54LS10, SN54LS10-SP, SN54S10, SN7410, SN74LS10, SN74S10 :  
Catalog: SN7410, SN74LS10, SN54LS10, SN74S10  
Military: SN5410, SN54LS10, SN54S10  
Space: SN54LS10-SP  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LS10DR  
SOIC  
SO  
D
14  
14  
2500  
2000  
330.0  
330.0  
16.4  
16.4  
6.5  
8.2  
9.0  
2.1  
2.5  
8.0  
16.0  
16.0  
Q1  
Q1  
SN74LS10NSR  
NS  
10.5  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LS10DR  
SOIC  
SO  
D
14  
14  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
SN74LS10NSR  
NS  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2014, Texas Instruments Incorporated  

相关型号:

SN74LS10DRG4

3 通道、3 输入、4.75V 至 5.25V 双极与非门 | D | 14 | 0 to 70
TI

SN74LS10FN

IC LS SERIES, TRIPLE 3-INPUT NAND GATE, PQCC20, Gate
TI

SN74LS10FN3

NAND Gate
ROCHESTER

SN74LS10J

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
MOTOROLA

SN74LS10J

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14
TI

SN74LS10J-00

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14
TI

SN74LS10J-00

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, PACKAGE-14
ROCHESTER

SN74LS10J4

NAND Gate
ROCHESTER

SN74LS10J4

IC,LOGIC GATE,3 3-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC
TI

SN74LS10JD

NAND Gate, LS Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14
MOTOROLA

SN74LS10JDS

LS SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
MOTOROLA

SN74LS10JP4

IC,LOGIC GATE,3 3-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC
TI