SN74HCT240NE4 [TI]
Octal Buffers And Line Drivers With 3-State Outputs 20-PDIP -40 to 85;型号: | SN74HCT240NE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | Octal Buffers And Line Drivers With 3-State Outputs 20-PDIP -40 to 85 驱动 光电二极管 逻辑集成电路 |
文件: | 总16页 (文件大小:606K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢉ
ꢀ
ꢁ
ꢊ
ꢃ
ꢋ ꢅꢆꢌꢍ ꢎꢏꢐ ꢐ ꢑꢒꢀ ꢌꢁꢓ ꢍ ꢔꢁꢑ ꢓ ꢒꢔ ꢕ ꢑꢒ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢀ
ꢀ
ꢖ
ꢔ
ꢆ
ꢄ
ꢗ
ꢘ
ꢀ
ꢆ
ꢌ
ꢆ
ꢑ
ꢋ
ꢏ
ꢆ
ꢙ
ꢏ
ꢆ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
SN54HCT240 . . . J OR W PACKAGE
SN74HCT240 . . . DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current Outputs Drive Up To 15
LSTTL Loads
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 12 ns
pd
6-mA Output Drive at 5 V
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1
2
3
4
5
6
7
8
9
20
V
CC
CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
description/ordering information
GND 10
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The ’HCT240 devices are organized
as two 4-bit buffers/drivers with separate
output-enable (OE) inputs. When OE is low, the
device passes inverted data from the A inputs to
the Y outputs. When OE is high, the outputs are
in the high-impedance state.
SN54HCT240 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
17
16
15
14
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT240N
SN74HCT240N
SN74HCT240DW
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PW
SN74HCT240PWR
SN74HCT240PWT
SNJ54HCT240J
SOIC − DW
SOP − NS
HCT240
HCT240
−40°C to 85°C
TSSOP − PW
HT240
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT240J
SNJ54HCT240W
SNJ54HCT240W
SNJ54HCT240FK
−55°C to 125°C
SNJ54HCT240FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢙ
ꢙ
ꢒ
ꢋ
ꢩ
ꢓ
ꢤ
ꢠ
ꢏ
ꢅ
ꢢ
ꢆ
ꢣ
ꢭ
ꢔ
ꢝ
ꢋ
ꢛ
ꢞ
ꢁ
ꢜ
ꢓ
ꢌ
ꢆ
ꢌ
ꢚ
ꢛ
ꢥ
ꢤ
ꢜ
ꢝ
ꢣ
ꢣ
ꢞ
ꢟ
ꢠ
ꢠ
ꢛ
ꢡ
ꢡ
ꢚ
ꢚ
ꢦ
ꢝ
ꢝ
ꢞ
ꢛ
ꢛ
ꢝ
ꢚ
ꢢ
ꢢ
ꢦ
ꢢ
ꢣ
ꢤ
ꢞ
ꢞ
ꢥ
ꢥ
ꢛ
ꢡ
ꢠ
ꢟ
ꢢ
ꢢ
ꢢ
ꢛ
ꢝ
ꢜ
ꢦ
ꢤ
ꢧ
ꢢ
ꢢ
ꢨ
ꢚ
ꢣ
ꢠ
ꢢ
ꢡ
ꢚ
ꢡ
ꢮ
ꢝ
ꢞ
ꢛ
ꢤ
ꢩ
ꢠ
ꢛ
ꢩ
ꢡ
ꢡ
ꢥ
ꢢ
ꢥ
ꢪ
Copyright 2003, Texas Instruments Incorporated
ꢋ ꢛ ꢦ ꢞ ꢝꢩ ꢤꢣ ꢡꢢ ꢣꢝ ꢟꢦ ꢨꢚ ꢠꢛ ꢡ ꢡꢝ ꢰꢔ ꢍꢘ ꢙꢒ ꢐ ꢘꢗꢱꢂ ꢗꢂꢉ ꢠꢨꢨ ꢦꢠ ꢞ ꢠ ꢟꢥ ꢡꢥꢞ ꢢ ꢠ ꢞ ꢥ ꢡꢥ ꢢꢡꢥ ꢩ
ꢞ
ꢝ
ꢣ
ꢡ
ꢝ
ꢞ
ꢟ
ꢡ
ꢝ
ꢢ
ꢦ
ꢚ
ꢜ
ꢚ
ꢣ
ꢥ
ꢞ
ꢡ
ꢫ
ꢡ
ꢥ
ꢞ
ꢝ
ꢜ
ꢆ
ꢥ
ꢬ
ꢠ
ꢔ
ꢛ
ꢟ
ꢥ
ꢢ
ꢡ
ꢠ
ꢛ
ꢩ
ꢞ
ꢩ
ꢠ
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ
ꢞ
ꢠ
ꢛ
ꢡ
ꢮ
ꢪ
ꢙ
ꢞ
ꢝ
ꢩ
ꢡ
ꢚ
ꢝ
ꢣ
ꢥ
ꢢ
ꢚ
ꢛ
ꢯ
ꢩ
ꢝ
ꢥ
ꢝ
ꢡ
ꢛ
ꢥ
ꢣ
ꢥ
ꢢ
ꢠ
ꢞ
ꢚ
ꢨ
ꢚ
ꢛ
ꢣ
ꢨ
ꢤ
ꢤ ꢛꢨ ꢥꢢꢢ ꢝ ꢡꢫꢥ ꢞ ꢭꢚ ꢢꢥ ꢛ ꢝꢡꢥ ꢩꢪ ꢋ ꢛ ꢠꢨ ꢨ ꢝ ꢡꢫꢥ ꢞ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢢ ꢉ ꢦꢞ ꢝ ꢩꢤꢣ ꢡꢚꢝ ꢛ
ꢡ
ꢦ
ꢞ
ꢝ
ꢣ
ꢥ
ꢢ
ꢢ
ꢚ
ꢛ
ꢯ
ꢩ
ꢝ
ꢥ
ꢢ
ꢛ
ꢝ
ꢡ
ꢛ
ꢥ
ꢣ
ꢥ
ꢢ
ꢢ
ꢠ
ꢞ
ꢚ
ꢨ
ꢮ
ꢚ
ꢛ
ꢣ
ꢨ
ꢤ
ꢩ
ꢥ
ꢡ
ꢥ
ꢢ
ꢚ
ꢛ
ꢯ
ꢝ
ꢜ
ꢠ
ꢨ
ꢨ
ꢦ
ꢠ
ꢞ
ꢠ
ꢟ
ꢥ
ꢡ
ꢥ
ꢞ
ꢢ
ꢪ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢈꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢈ
ꢋꢅ ꢆꢌ ꢍ ꢎ ꢏ ꢐꢐ ꢑꢒ ꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋꢏꢆ ꢙꢏ ꢆꢀ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
L
H
Z
H
X
logic diagram (positive logic)
1
19
1OE
2OE
18
2
9
7
11
13
1Y1
1Y2
1Y3
1Y4
1A1
2Y1
2Y2
2A1
2A2
2A3
2A4
16
14
12
4
1A2
5
3
6
15
17
1A3
2Y3
2Y4
8
1A4
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢉ
ꢀ
ꢁ
ꢊ
ꢃ
ꢋ ꢅꢆꢌꢍ ꢎꢏꢐ ꢐ ꢑꢒꢀ ꢌꢁꢓ ꢍ ꢔꢁꢑ ꢓ ꢒꢔ ꢕ ꢑꢒ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢀ
ꢀ
ꢖ ꢔꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋ ꢏꢆ ꢙꢏ ꢆ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT240
SN74HCT240
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
∆t/∆v
Input transition rise/fall time
Operating free-air temperature
500
125
500
85
ns
°C
T
A
−55
−40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT240 SN74HCT240
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −6 mA
= 20 µA
= 6 mA
4.4 4.499
OH
OH
OL
OL
V
V = V or V
IH
4.5 V
4.5 V
OH
OL
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
0.5
8
0.1
0.4
0.1
0.33
1000
5
V
V = V or V
V
I
IH
IL
I
I
I
V = V
I
or 0
5.5 V
5.5 V
5.5 V
1000
10
nA
µA
µA
I
CC
V
O
= V
or 0,
or 0,
V = V or V
0.01
OZ
CC
CC
I
IH
= 0
IL
V = V
CC
I
O
160
80
I
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
13
SN54HCT240 SN74HCT240
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
25
MIN
MAX
37
MIN
MAX
32
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
t
t
t
A
Y
Y
Y
Y
pd
en
dis
t
12
23
33
29
21
35
53
44
ns
OE
OE
19
32
48
40
19
35
53
44
ns
18
32
48
40
8
12
18
15
ns
7
11
16
14
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢈꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢈ
ꢋꢅ ꢆꢌ ꢍ ꢎ ꢏ ꢐꢐ ꢑꢒ ꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋꢏꢆ ꢙꢏ ꢆꢀ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
20
SN54HCT240 SN74HCT240
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
42
MIN
MAX
63
MIN
MAX
53
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
pd
t
en
t
t
A
Y
Y
Y
19
38
56
48
25
52
79
65
ns
OE
22
47
71
59
17
42
63
53
ns
14
38
57
48
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
40
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢉ
ꢀ
ꢁ
ꢊ
ꢃ
ꢋ ꢅꢆꢌꢍ ꢎꢏꢐ ꢐ ꢑꢒꢀ ꢌꢁꢓ ꢍ ꢔꢁꢑ ꢓ ꢒꢔ ꢕ ꢑꢒ
ꢄ
ꢅ
ꢆ
ꢇ
ꢃ
ꢈ
ꢀ
ꢀ
ꢖ ꢔꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋ ꢏꢆ ꢙꢏ ꢆ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
S1
S2
L
L
50 pF
or
150 pF
t
Open
Closed
Closed
Open
S1
S2
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
t
t
t
L
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
Input
3 V
2.7 V
2.7 V
1.3 V
0.3 V
1.3 V
0.3 V
0 V
t
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
Output
Control
(Low-Level
Enabling)
3 V
0 V
3 V
0 V
Input
1.3 V
1.3 V
1.3 V
1.3 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
V
OH
≈V
CC
In-Phase
Output
Output
Waveform 1
(See Note B)
90%
t
1.3 V
10%
1.3 V
10%
1.3 V
10%
OL
V
OL
OH
t
r
f
f
t
t
t
t
PHL
90%
PLH
PZH
PHZ
Out-of-
Phase
Output
V
V
OH
V
Output
Waveform 2
(See Note B)
90%
t
90%
1.3 V
10%
1.3 V
10%
1.3 V
≈0 V
OL
t
r
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CDIP
SOIC
Drawing
85505012A
8550501RA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
20
20
20
20
1
1
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/65753BRA
SN54HCT240J
SN74HCT240DW
J
J
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT240DWE4
SN74HCT240DWG4
SN74HCT240DWR
SN74HCT240DWRE4
SN74HCT240DWRG4
SN74HCT240N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT240NE4
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT240NSR
SN74HCT240NSRE4
SN74HCT240NSRG4
SN74HCT240PW
SO
NS
NS
NS
PW
PW
PW
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT240PWE4
SN74HCT240PWG4
SN74HCT240PWR
SN74HCT240PWRE4
SN74HCT240PWRG4
SN74HCT240PWT
SN74HCT240PWTE4
SN74HCT240PWTG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HCT240FK
SNJ54HCT240J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
20
1
1
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PWR
SOIC
SO
DW
NS
20
20
20
2000
2000
2000
330.0
330.0
330.0
24.4
24.4
16.4
10.8
8.2
13.0
13.0
7.1
2.7
2.5
1.6
12.0
12.0
8.0
24.0
24.0
16.0
Q1
Q1
Q1
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PWR
SOIC
SO
DW
NS
20
20
20
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
41.0
41.0
33.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明