SN74HC259N-10 [TI]
HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP16;
| 型号： | SN74HC259N-10 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP16 光电二极管 输出元件 逻辑集成电路 触发器 |
| 文件： | 总22页 (文件大小：1179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢂꢇ
ꢊ ꢋꢌꢍ ꢎ ꢏꢐꢐ ꢑꢒꢀꢀ ꢏꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄ ꢒꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
SN54HC259 . . . J OR W PACKAGE
SN74HC259 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Wide Operating Voltage Range of 2 V to 6 V
High-Current Inverting Outputs Drive Up To
10 LSTTL Loads
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 14 ns
pd
4-mA Output Drive at 5 V
CC
S0
S1
S2
Q0
Q1
Q2
Q3
GND
1
2
3
4
5
6
7
8
16
V
CC
15 CLR
14
13
12
11
10
9
G
D
Q7
Q6
Q5
Q4
Low Input Current of 1 µA Max
8-Bit Parallel-Out Storage Register
Performs Serial-to-Parallel Conversion With
Storage
D
D
D
D
D
Asynchronous Parallel Clear
Active-High Decoder
SN54HC259 . . . FK PACKAGE
(TOP VIEW)
Enable Input Simplifies Expansion
Expandable for n-Bit Applications
Four Distinct Functional Modes
3
2
1
20 19
18
S2
Q0
NC
Q1
Q2
G
4
5
6
7
8
description/ordering information
17
16
15
14
D
NC
Q7
Q6
These 8-bit addressable latches are designed for
general-purpose storage applications in digital
systems. Specific uses include working registers,
serial-holding registers, and active-high decoders
or demultiplexers. They are multifunctional
devices capable of storing single-line data in eight
addressable latches and being a 1-of-8 decoder
or demultiplexer with active-high outputs.
9 10 11 12 13
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC259N
SN74HC259N
SN74HC259D
SN74HC259DR
SN74HC259DT
SN74HC259NSR
SN74HC259PWR
SN74HC259PWT
SNJ54HC259J
SNJ54HC259W
SNJ54HC259FK
HC259
−40°C to 85°C
SOP − NS
HC259
HC259
TSSOP − PW
CDIP − J
CFP − W
LCCC − FK
SNJ54HC259J
SNJ54HC259W
SNJ54HC259FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢕ ꢘ ꢣ ꢛ ꢚꢦ ꢡꢠ ꢞꢟ ꢠꢚ ꢜꢣ ꢥꢗ ꢝꢘ ꢞ ꢞꢚ ꢭꢍ ꢓꢋ ꢔꢑ ꢮ ꢋꢯꢊꢂ ꢯꢂꢈ ꢝꢥꢥ ꢣꢝ ꢛ ꢝ ꢜꢢ ꢞꢢꢛ ꢟ ꢝ ꢛ ꢢ ꢞꢢ ꢟꢞꢢ ꢦ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢊꢋ ꢌꢍ ꢎ ꢏ ꢐ ꢐꢑ ꢒꢀ ꢀꢏ ꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄꢒ ꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
Four distinct modes of operation are selectable by controlling the clear (CLR) and enable (G) inputs. In the
addressable-latch mode, data at the data-in terminal is written into the addressed latch. The addressed latch
follows the data input, with all unaddressed latches remaining in their previous states. In the memory mode, all
latches remain in their previous states and are unaffected by the data or address inputs. To eliminate the
possibility of entering erroneous data in the latches, G should be held high (inactive) while the address lines
are changing. In the 1-of-8 decoding or demultiplexing mode, the addressed output follows the level of the
D input with all other outputs low. In the clear mode, all outputs are low and unaffected by the address and data
inputs.
Function Tables
FUNCTION
OUTPUT OF
ADDRESSED
LATCH
EACH
OTHER
OUTPUT
INPUTS
FUNCTION
CLR
G
L
H
H
L
D
Q
Q
Addressable latch
Memory
iO
iO
H
L
Q
iO
D
L
8-line demultiplexer
Clear
L
H
L
L
LATCH SELECTION
SELECT INPUTS
LATCH
ADDRESSED
S2
S1
L
S0
L
L
L
H
L
0
1
2
3
4
5
6
7
L
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢊ ꢋꢌꢍ ꢎ ꢏꢐꢐ ꢑꢒꢀꢀ ꢏꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄ ꢒꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
logic diagram
D
4
1
S0
C
R
Q
Q
Q
Q
Q
Q
Q0
Q1
Q2
Q3
Q4
Q5
D
C
5
6
R
D
C
2
3
S1
S2
R
D
C
7
R
D
C
9
R
D
C
10
R
14
13
15
G
D
D
C
11
12
Q
Q
Q6
Q7
R
D
C
R
CLR
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
3
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ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢊꢋ ꢌꢍ ꢎ ꢏ ꢐ ꢐꢑ ꢒꢀ ꢀꢏ ꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄꢒ ꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
logic diagram, each internal latch (positive logic)
C
D
C
TG
C
Q
C
C
C
TG
C
R
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC259
MIN NOM
SN74HC259
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢊ ꢋꢌꢍ ꢎ ꢏꢐꢐ ꢑꢒꢀꢀ ꢏꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄ ꢒꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC259
SN74HC259
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −4 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −5.2 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
I
IH
IL
I
I
= 4 mA
4.5 V
6 V
0.4
0.33
0.33
1000
80
OL
= 5.2 mA
0.4
OL
I
I
V = V
I
or 0
6 V
1000
160
10
nA
µA
pF
I
CC
V = V
I
or 0,
I
O
= 0
6 V
CC
CC
C
2 V to 6 V
3
10
10
i
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
T
= 25°C
SN54HC259
SN74HC259
A
V
UNIT
CC
MIN
80
16
14
80
16
14
75
15
13
5
MAX
MIN
120
24
20
120
24
20
115
23
20
5
MAX
MIN
100
20
17
100
20
17
95
19
16
5
MAX
2 V
4.5 V
6 V
CLR low
G low
t
w
Pulse duration
ns
2 V
4.5 V
6 V
2 V
4.5 V
6 V
t
t
Setup time, data or address before G↑
Hold time, data or address after G↑
ns
ns
su
2 V
4.5 V
6 V
5
5
5
h
5
5
5
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢊꢋ ꢌꢍ ꢎ ꢏ ꢐ ꢐꢑ ꢒꢀ ꢀꢏ ꢌꢓ ꢒ ꢓꢏꢎꢅ ꢄꢒ ꢀ
SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
60
18
14
56
17
13
74
21
17
66
20
16
28
8
SN54HC259
SN74HC259
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
150
30
MIN
MAX
225
45
MIN
MAX
190
38
2 V
4.5 V
6 V
t
t
t
CLR
Data
Any Q
Any Q
Any Q
Any Q
Any
ns
PHL
pd
t
26
38
32
2 V
130
26
195
39
165
33
4.5 V
6 V
22
33
28
2 V
200
40
300
60
250
50
4.5 V
6 V
Address
G
ns
ns
34
51
43
2 V
170
34
255
51
215
43
4.5 V
6 V
29
43
37
2 V
75
110
22
95
4.5 V
6 V
15
19
6
13
19
16
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per latch
No load
33
pF
pd
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS134E − DECEMBER 1982 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
High-Level
Pulse
50%
50%
50%
From Output
Under Test
Test
Point
0 V
t
w
C
= 50 pF
L
V
CC
(see Note A)
Low-Level
Pulse
50%
0 V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
V
CC
Input
50%
50%
0 V
V
t
t
PLH
PHL
90%
V
CC
OH
In-Phase
Output
Reference
Input
90%
t
50%
50%
10%
50%
10%
V
OL
0 V
V
t
r
f
f
t
t
h
su
t
t
PLH
PHL
90%
V
CC
OH
OL
Data
Input
90%
90%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
50%
10%
50%
10%
0 V
V
t
t
t
r
r
f
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
85519012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85519012A
SNJ54HC
259FK
8551901EA
8551901FA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
J
16
16
16
16
1
1
1
1
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
8551901EA
SNJ54HC259J
8551901FA
SNJ54HC259W
JM38510/65402BEA
M38510/65402BEA
CDIP
CDIP
JM38510/
65402BEA
J
JM38510/
65402BEA
SN54HC259J
SN74HC259D
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC259J
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC259
SN74HC259DE4
SN74HC259DG4
SN74HC259DR
SN74HC259DRE4
SN74HC259DRG4
SN74HC259DT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
D
D
N
N
16
16
16
16
16
16
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HC259
Green (RoHS
& no Sb/Br)
HC259
2500
2500
2500
250
250
250
25
Green (RoHS
& no Sb/Br)
HC259
Green (RoHS
& no Sb/Br)
HC259
Green (RoHS
& no Sb/Br)
HC259
Green (RoHS
& no Sb/Br)
HC259
SN74HC259DTE4
SN74HC259DTG4
SN74HC259N
Green (RoHS
& no Sb/Br)
HC259
Green (RoHS
& no Sb/Br)
HC259
Pb-Free
(RoHS)
SN74HC259N
SN74HC259N
SN74HC259NE4
25
Pb-Free
(RoHS)
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC259NSR
SN74HC259NSRE4
SN74HC259NSRG4
ACTIVE
SO
SO
SO
NS
16
16
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
HC259
ACTIVE
ACTIVE
NS
NS
2000
2000
Green (RoHS
& no Sb/Br)
-40 to 85
HC259
HC259
Green (RoHS
& no Sb/Br)
-40 to 85
SN74HC259PWLE
SN74HC259PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC259
HC259
HC259
HC259
HC259
HC259
SN74HC259PWRE4
SN74HC259PWRG4
SN74HC259PWT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
PW
PW
PW
PW
FK
16
16
16
16
16
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC259PWTE4
SN74HC259PWTG4
SNJ54HC259FK
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
85519012A
SNJ54HC
259FK
SNJ54HC259J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8551901EA
SNJ54HC259J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC259, SN74HC259 :
Catalog: SN74HC259
•
Military: SN54HC259
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC259DR
SN74HC259DRG4
SN74HC259NSR
SN74HC259PWR
SN74HC259PWT
SOIC
SOIC
D
16
16
16
16
16
2500
2500
2000
2000
250
330.0
330.0
330.0
330.0
330.0
16.8
16.4
16.4
12.4
12.4
6.5
6.5
8.2
6.9
6.9
10.3
10.3
10.5
5.6
2.1
2.1
2.5
1.6
1.6
8.0
8.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
D
SO
NS
PW
PW
12.0
8.0
TSSOP
TSSOP
5.6
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC259DR
SN74HC259DRG4
SN74HC259NSR
SN74HC259PWR
SN74HC259PWT
SOIC
SOIC
D
16
16
16
16
16
2500
2500
2000
2000
250
364.0
333.2
367.0
367.0
367.0
364.0
345.9
367.0
367.0
367.0
27.0
28.6
38.0
35.0
35.0
D
SO
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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